(kicad_pcb (version 20170123) (host pcbnew "(2017-08-02 revision 9760937)-master")
  (general
    (thickness 1.6)
    (drawings 37)
    (tracks 496)
    (zones 0)
    (modules 28)
    (nets 48)
  )
  (page A4)
  (title_block
    (title LoFive)
    (rev 0)
    (company "QWERTY Embedded Design, LLC")
  )
  (layers
    (0 F.Cu signal)
    (1 In1.Cu power)
    (2 In2.Cu power)
    (31 B.Cu signal)
    (32 B.Adhes user)
    (33 F.Adhes user)
    (34 B.Paste user)
    (35 F.Paste user)
    (36 B.SilkS user)
    (37 F.SilkS user)
    (38 B.Mask user)
    (39 F.Mask user)
    (40 Dwgs.User user)
    (41 Cmts.User user)
    (42 Eco1.User user)
    (43 Eco2.User user)
    (44 Edge.Cuts user)
    (45 Margin user)
    (46 B.CrtYd user)
    (47 F.CrtYd user)
    (48 B.Fab user hide)
    (49 F.Fab user hide)
  )
  (setup
    (last_trace_width 0.1524)
    (user_trace_width 0.508)
    (user_trace_width 1.016)
    (trace_clearance 0.1524)
    (zone_clearance 0.1524)
    (zone_45_only no)
    (trace_min 0.1524)
    (segment_width 0.2)
    (edge_width 0.15)
    (via_size 0.508)
    (via_drill 0.3302)
    (via_min_size 0.4)
    (via_min_drill 0.3)
    (uvia_size 0.3)
    (uvia_drill 0.1)
    (uvias_allowed no)
    (uvia_min_size 0.2)
    (uvia_min_drill 0.1)
    (pcb_text_width 0.3)
    (pcb_text_size 1.5 1.5)
    (mod_edge_width 0.15)
    (mod_text_size 0.75 0.75)
    (mod_text_width 0.125)
    (pad_size 1.7272 1.7272)
    (pad_drill 1.016)
    (pad_to_mask_clearance 0.05)
    (aux_axis_origin 0 0)
    (visible_elements FFFFFF7F)
    (pcbplotparams
      (layerselection 0x00030_ffffffff)
      (usegerberextensions false)
      (excludeedgelayer true)
      (linewidth 0.100000)
      (plotframeref false)
      (viasonmask false)
      (mode 1)
      (useauxorigin false)
      (hpglpennumber 1)
      (hpglpenspeed 20)
      (hpglpendiameter 15)
      (psnegative false)
      (psa4output false)
      (plotreference true)
      (plotvalue true)
      (plotinvisibletext false)
      (padsonsilk false)
      (subtractmaskfromsilk false)
      (outputformat 1)
      (mirror false)
      (drillshape 1)
      (scaleselection 1)
      (outputdirectory ""))
  )
  (net 0 "")
  (net 1 "Net-(U1-Pad1)")
  (net 2 "Net-(U1-Pad2)")
  (net 3 "Net-(U1-Pad3)")
  (net 4 "Net-(U1-Pad4)")
  (net 5 "Net-(U1-Pad5)")
  (net 6 "Net-(C1-Pad1)")
  (net 7 "Net-(C2-Pad1)")
  (net 8 "Net-(U1-Pad17)")
  (net 9 "Net-(U1-Pad20)")
  (net 10 "Net-(U1-Pad21)")
  (net 11 "Net-(U1-Pad22)")
  (net 12 "Net-(U1-Pad48)")
  (net 13 GND)
  (net 14 "Net-(C11-Pad1)")
  (net 15 +1V8)
  (net 16 "Net-(C11-Pad2)")
  (net 17 +3V3)
  (net 18 GPIO_0/PWM0.0)
  (net 19 GPIO_1/PWM0.1)
  (net 20 GPIO_2/SPI1.SS0/PWM0.2)
  (net 21 GPIO_3/SPI1.MOSI/PWM0.3)
  (net 22 GPIO_4/SPI1.MISO)
  (net 23 GPIO_5/SPI1.SCK)
  (net 24 GPIO_9/SPI1.SS2)
  (net 25 GPIO_10/SPI1.SS3/PWM2.0)
  (net 26 GPIO_11/PWM2.1)
  (net 27 GPIO_12/PWM2.2)
  (net 28 GPIO_13/PWM2.3)
  (net 29 GPIO_16/UART0.RX)
  (net 30 GPIO_17/UART0.TX)
  (net 31 GPIO_18)
  (net 32 GPIO_23/PWM1.1)
  (net 33 GPIO_23/PWM1.0)
  (net 34 GPIO_23/PWM1.2)
  (net 35 GPIO_22/PWM1.3)
  (net 36 GPIO_23)
  (net 37 +5V)
  (net 38 "Net-(U4-Pad4)")
  (net 39 "Net-(U3-Pad4)")
  (net 40 JTAG_TCK)
  (net 41 JTAG_TDO)
  (net 42 JTAG_TMS)
  (net 43 JTAG_TDI)
  (net 44 "Net-(C16-Pad1)")
  (net 45 "Net-(R3-Pad1)")
  (net 46 JTAG_TRST_N)
  (net 47 "Net-(U5-Pad1)")
  (net_class Default "This is the default net class."
    (clearance 0.1524)
    (trace_width 0.1524)
    (via_dia 0.508)
    (via_drill 0.3302)
    (uvia_dia 0.3)
    (uvia_drill 0.1)
    (add_net +1V8)
    (add_net +3V3)
    (add_net +5V)
    (add_net GND)
    (add_net GPIO_0/PWM0.0)
    (add_net GPIO_1/PWM0.1)
    (add_net GPIO_10/SPI1.SS3/PWM2.0)
    (add_net GPIO_11/PWM2.1)
    (add_net GPIO_12/PWM2.2)
    (add_net GPIO_13/PWM2.3)
    (add_net GPIO_16/UART0.RX)
    (add_net GPIO_17/UART0.TX)
    (add_net GPIO_18)
    (add_net GPIO_2/SPI1.SS0/PWM0.2)
    (add_net GPIO_22/PWM1.3)
    (add_net GPIO_23)
    (add_net GPIO_23/PWM1.0)
    (add_net GPIO_23/PWM1.1)
    (add_net GPIO_23/PWM1.2)
    (add_net GPIO_3/SPI1.MOSI/PWM0.3)
    (add_net GPIO_4/SPI1.MISO)
    (add_net GPIO_5/SPI1.SCK)
    (add_net GPIO_9/SPI1.SS2)
    (add_net JTAG_TCK)
    (add_net JTAG_TDI)
    (add_net JTAG_TDO)
    (add_net JTAG_TMS)
    (add_net JTAG_TRST_N)
    (add_net "Net-(C1-Pad1)")
    (add_net "Net-(C11-Pad1)")
    (add_net "Net-(C11-Pad2)")
    (add_net "Net-(C16-Pad1)")
    (add_net "Net-(C2-Pad1)")
    (add_net "Net-(R3-Pad1)")
    (add_net "Net-(U1-Pad1)")
    (add_net "Net-(U1-Pad17)")
    (add_net "Net-(U1-Pad20)")
    (add_net "Net-(U1-Pad21)")
    (add_net "Net-(U1-Pad22)")
    (add_net "Net-(U3-Pad4)")
    (add_net "Net-(U4-Pad4)")
  )
  (net_class QSPI ""
    (clearance 0.1524)
    (trace_width 0.1524)
    (via_dia 0.508)
    (via_drill 0.3302)
    (uvia_dia 0.3)
    (uvia_drill 0.1)
    (add_net "Net-(U1-Pad2)")
    (add_net "Net-(U1-Pad3)")
    (add_net "Net-(U1-Pad4)")
    (add_net "Net-(U1-Pad48)")
    (add_net "Net-(U1-Pad5)")
    (add_net "Net-(U5-Pad1)")
  )
  (module Capacitors_SMD:C_0402 (layer F.Cu) (tedit 5415D599)
    (at 125.23216 122.53468 270)
    (descr "Capacitor SMD 0402, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0402")
    (attr smd)
    (fp_text reference C3 (at 1.48336 -0.02286) (layer F.SilkS))
    (fp_text value 10uF (at 0 1.7 270) (layer F.Fab))
    (pad 1 smd rect (at -0.55 0 270) (size 0.6 0.5) (layers F.Cu F.Paste F.Mask)
      (net 15 +1V8))
    (pad 2 smd rect (at 0.55 0 270) (size 0.6 0.5) (layers F.Cu F.Paste F.Mask)
      (net 13 GND))
    (model Capacitors_SMD.3dshapes/C_0402.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Buttons_Switches_SMD:SW_SPST_EVQP2 (layer F.Cu) (tedit 55DB41D2)
    (at 133.35 120.523 90)
    (descr "Light Touch Switch")
    (attr smd)
    (fp_text reference SW1 (at -1.04394 -3.0734) (layer F.SilkS))
    (fp_text value SW_Push (at 0 0 90) (layer F.Fab))
    (pad 1 smd rect (at 2.575 -1 90) (size 1.45 0.7) (layers F.Cu F.Paste F.Mask)
      (net 13 GND))
    (pad 1 smd rect (at -2.575 -1 90) (size 1.45 0.7) (layers F.Cu F.Paste F.Mask)
      (net 13 GND))
    (pad 2 smd rect (at -2.575 1 90) (size 1.45 0.7) (layers F.Cu F.Paste F.Mask)
      (net 44 "Net-(C16-Pad1)"))
    (pad 2 smd rect (at 2.575 1 90) (size 1.45 0.7) (layers F.Cu F.Paste F.Mask)
      (net 44 "Net-(C16-Pad1)"))
  )
  (module Capacitors_SMD:C_0402 (layer F.Cu) (tedit 5415D599)
    (at 134.112 112.903 180)
    (descr "Capacitor SMD 0402, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0402")
    (attr smd)
    (fp_text reference C15 (at 2.2352 0 180) (layer F.SilkS))
    (fp_text value 0.1uF (at 0 1.7 180) (layer F.Fab))
    (pad 2 smd rect (at 0.55 0 180) (size 0.6 0.5) (layers F.Cu F.Paste F.Mask)
      (net 13 GND))
    (pad 1 smd rect (at -0.55 0 180) (size 0.6 0.5) (layers F.Cu F.Paste F.Mask)
      (net 15 +1V8))
    (model Capacitors_SMD.3dshapes/C_0402.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_SMD:C_0402 (layer F.Cu) (tedit 5415D599)
    (at 136.017 119.846 270)
    (descr "Capacitor SMD 0402, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0402")
    (attr smd)
    (fp_text reference C16 (at 2.074 0 270) (layer F.SilkS))
    (fp_text value 10nF (at 0 1.7 270) (layer F.Fab))
    (pad 1 smd rect (at -0.55 0 270) (size 0.6 0.5) (layers F.Cu F.Paste F.Mask)
      (net 44 "Net-(C16-Pad1)"))
    (pad 2 smd rect (at 0.55 0 270) (size 0.6 0.5) (layers F.Cu F.Paste F.Mask)
      (net 13 GND))
    (model Capacitors_SMD.3dshapes/C_0402.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Housings_SOT-23_SOT-143_TSOT-6:SOT-23-5 (layer F.Cu) (tedit 55360473)
    (at 133.3168 115.3566)
    (descr "5-pin SOT23 package")
    (tags SOT-23-5)
    (attr smd)
    (fp_text reference U5 (at -2.2528 0.061 90) (layer F.SilkS))
    (fp_text value SN74LVC1G07 (at -0.05 2.35) (layer F.Fab))
    (pad 1 smd rect (at -1.1 -0.95) (size 1.06 0.65) (layers F.Cu F.Paste F.Mask)
      (net 47 "Net-(U5-Pad1)"))
    (pad 2 smd rect (at -1.1 0) (size 1.06 0.65) (layers F.Cu F.Paste F.Mask)
      (net 46 JTAG_TRST_N))
    (pad 3 smd rect (at -1.1 0.95) (size 1.06 0.65) (layers F.Cu F.Paste F.Mask)
      (net 13 GND))
    (pad 4 smd rect (at 1.1 0.95) (size 1.06 0.65) (layers F.Cu F.Paste F.Mask)
      (net 44 "Net-(C16-Pad1)"))
    (pad 5 smd rect (at 1.1 -0.95) (size 1.06 0.65) (layers F.Cu F.Paste F.Mask)
      (net 15 +1V8))
    (model Housings_SOT-23_SOT-143_TSOT-6.3dshapes/SOT-23-5.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.11 0.11 0.11))
      (rotate (xyz 0 0 90))
    )
  )
  (module Resistors_SMD:R_0402 (layer F.Cu) (tedit 5415CBB8)
    (at 123.69546 122.55246 270)
    (descr "Resistor SMD 0402, reflow soldering, Vishay (see dcrcw.pdf)")
    (tags "resistor 0402")
    (attr smd)
    (fp_text reference R3 (at 0.10668 1.14046 90) (layer F.SilkS))
    (fp_text value 100K (at 0 1.8 270) (layer F.Fab))
    (pad 1 smd rect (at -0.45 0 270) (size 0.4 0.6) (layers F.Cu F.Paste F.Mask)
      (net 45 "Net-(R3-Pad1)"))
    (pad 2 smd rect (at 0.45 0 270) (size 0.4 0.6) (layers F.Cu F.Paste F.Mask)
      (net 15 +1V8))
    (model Resistors_SMD.3dshapes/R_0402.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistors_SMD:R_0402 (layer F.Cu) (tedit 5415CBB8)
    (at 136.017 117.475 90)
    (descr "Resistor SMD 0402, reflow soldering, Vishay (see dcrcw.pdf)")
    (tags "resistor 0402")
    (attr smd)
    (fp_text reference R2 (at 1.524 0 90) (layer F.SilkS))
    (fp_text value 100K (at 0 1.8 90) (layer F.Fab))
    (pad 1 smd rect (at -0.45 0 90) (size 0.4 0.6) (layers F.Cu F.Paste F.Mask)
      (net 44 "Net-(C16-Pad1)"))
    (pad 2 smd rect (at 0.45 0 90) (size 0.4 0.6) (layers F.Cu F.Paste F.Mask)
      (net 15 +1V8))
    (model Resistors_SMD.3dshapes/R_0402.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_SMD:C_0402 (layer F.Cu) (tedit 5415D599)
    (at 106.807 120.396 270)
    (descr "Capacitor SMD 0402, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0402")
    (attr smd)
    (fp_text reference C14 (at -2.159 0 270) (layer F.SilkS))
    (fp_text value 10uF (at 0 1.7 270) (layer F.Fab))
    (pad 2 smd rect (at 0.55 0 270) (size 0.6 0.5) (layers F.Cu F.Paste F.Mask)
      (net 13 GND))
    (pad 1 smd rect (at -0.55 0 270) (size 0.6 0.5) (layers F.Cu F.Paste F.Mask)
      (net 15 +1V8))
    (model Capacitors_SMD.3dshapes/C_0402.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_SMD:C_0402 (layer F.Cu) (tedit 5415D599)
    (at 106.807 115.697 270)
    (descr "Capacitor SMD 0402, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0402")
    (attr smd)
    (fp_text reference C13 (at -2.159 0 270) (layer F.SilkS))
    (fp_text value 10uF (at 0 1.7 270) (layer F.Fab))
    (pad 1 smd rect (at -0.55 0 270) (size 0.6 0.5) (layers F.Cu F.Paste F.Mask)
      (net 17 +3V3))
    (pad 2 smd rect (at 0.55 0 270) (size 0.6 0.5) (layers F.Cu F.Paste F.Mask)
      (net 13 GND))
    (model Capacitors_SMD.3dshapes/C_0402.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Housings_SOT-23_SOT-143_TSOT-6:SOT-23-5 (layer F.Cu) (tedit 55360473)
    (at 104.14 115.697)
    (descr "5-pin SOT23 package")
    (tags SOT-23-5)
    (attr smd)
    (fp_text reference U3 (at -1.27 -2.032 180) (layer F.SilkS))
    (fp_text value SPX3819 (at -0.05 2.35) (layer F.Fab))
    (pad 5 smd rect (at 1.1 -0.95) (size 1.06 0.65) (layers F.Cu F.Paste F.Mask)
      (net 17 +3V3))
    (pad 4 smd rect (at 1.1 0.95) (size 1.06 0.65) (layers F.Cu F.Paste F.Mask)
      (net 39 "Net-(U3-Pad4)"))
    (pad 3 smd rect (at -1.1 0.95) (size 1.06 0.65) (layers F.Cu F.Paste F.Mask)
      (net 37 +5V))
    (pad 2 smd rect (at -1.1 0) (size 1.06 0.65) (layers F.Cu F.Paste F.Mask)
      (net 13 GND))
    (pad 1 smd rect (at -1.1 -0.95) (size 1.06 0.65) (layers F.Cu F.Paste F.Mask)
      (net 37 +5V))
    (model Housings_SOT-23_SOT-143_TSOT-6.3dshapes/SOT-23-5.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.11 0.11 0.11))
      (rotate (xyz 0 0 90))
    )
  )
  (module Housings_SOT-23_SOT-143_TSOT-6:SOT-23-5 (layer F.Cu) (tedit 55360473)
    (at 104.14 120.523)
    (descr "5-pin SOT23 package")
    (tags SOT-23-5)
    (attr smd)
    (fp_text reference U4 (at -1.27 -2.032 180) (layer F.SilkS))
    (fp_text value SPX3819 (at -0.05 2.35) (layer F.Fab))
    (pad 1 smd rect (at -1.1 -0.95) (size 1.06 0.65) (layers F.Cu F.Paste F.Mask)
      (net 37 +5V))
    (pad 2 smd rect (at -1.1 0) (size 1.06 0.65) (layers F.Cu F.Paste F.Mask)
      (net 13 GND))
    (pad 3 smd rect (at -1.1 0.95) (size 1.06 0.65) (layers F.Cu F.Paste F.Mask)
      (net 37 +5V))
    (pad 4 smd rect (at 1.1 0.95) (size 1.06 0.65) (layers F.Cu F.Paste F.Mask)
      (net 38 "Net-(U4-Pad4)"))
    (pad 5 smd rect (at 1.1 -0.95) (size 1.06 0.65) (layers F.Cu F.Paste F.Mask)
      (net 15 +1V8))
    (model Housings_SOT-23_SOT-143_TSOT-6.3dshapes/SOT-23-5.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.11 0.11 0.11))
      (rotate (xyz 0 0 90))
    )
  )
  (module Capacitors_SMD:C_0402 (layer F.Cu) (tedit 5415D599)
    (at 109.85406 113.08558)
    (descr "Capacitor SMD 0402, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0402")
    (attr smd)
    (fp_text reference C12 (at 2.07866 0.07396) (layer F.SilkS))
    (fp_text value 0.1uF (at 0 1.7) (layer F.Fab))
    (pad 1 smd rect (at -0.55 0) (size 0.6 0.5) (layers F.Cu F.Paste F.Mask)
      (net 17 +3V3))
    (pad 2 smd rect (at 0.55 0) (size 0.6 0.5) (layers F.Cu F.Paste F.Mask)
      (net 13 GND))
    (model Capacitors_SMD.3dshapes/C_0402.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Housings_SOIC:SOIJ-8_5.3x5.3mm_Pitch1.27mm (layer F.Cu) (tedit 54130A77)
    (at 110.871 118.77266 90)
    (descr "8-Lead Plastic Small Outline (SM) - Medium, 5.28 mm Body [SOIC] (see Microchip Packaging Specification 00000049BS.pdf)")
    (tags "SOIC 1.27")
    (attr smd)
    (fp_text reference U2 (at -3.70868 -3.49504 180) (layer F.SilkS))
    (fp_text value IS25LP128 (at 0 3.68 90) (layer F.Fab))
    (pad 1 smd rect (at -3.65 -1.905 90) (size 1.7 0.65) (layers F.Cu F.Paste F.Mask)
      (net 5 "Net-(U1-Pad5)"))
    (pad 2 smd rect (at -3.65 -0.635 90) (size 1.7 0.65) (layers F.Cu F.Paste F.Mask)
      (net 3 "Net-(U1-Pad3)"))
    (pad 3 smd rect (at -3.65 0.635 90) (size 1.7 0.65) (layers F.Cu F.Paste F.Mask)
      (net 2 "Net-(U1-Pad2)"))
    (pad 4 smd rect (at -3.65 1.905 90) (size 1.7 0.65) (layers F.Cu F.Paste F.Mask)
      (net 13 GND))
    (pad 5 smd rect (at 3.65 1.905 90) (size 1.7 0.65) (layers F.Cu F.Paste F.Mask)
      (net 4 "Net-(U1-Pad4)"))
    (pad 6 smd rect (at 3.65 0.635 90) (size 1.7 0.65) (layers F.Cu F.Paste F.Mask)
      (net 12 "Net-(U1-Pad48)"))
    (pad 7 smd rect (at 3.65 -0.635 90) (size 1.7 0.65) (layers F.Cu F.Paste F.Mask)
      (net 1 "Net-(U1-Pad1)"))
    (pad 8 smd rect (at 3.65 -1.905 90) (size 1.7 0.65) (layers F.Cu F.Paste F.Mask)
      (net 17 +3V3))
    (model Housings_SOIC.3dshapes/SOIJ-8_5.3x5.3mm_Pitch1.27mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_SMD:C_0402 (layer F.Cu) (tedit 5415D599)
    (at 118.2751 118.59514 270)
    (descr "Capacitor SMD 0402, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0402")
    (attr smd)
    (fp_text reference C11 (at -2.1 -0.03 270) (layer F.SilkS))
    (fp_text value 0.1uF (at 0 1.7 270) (layer F.Fab))
    (pad 1 smd rect (at -0.55 0 270) (size 0.6 0.5) (layers F.Cu F.Paste F.Mask)
      (net 14 "Net-(C11-Pad1)"))
    (pad 2 smd rect (at 0.55 0 270) (size 0.6 0.5) (layers F.Cu F.Paste F.Mask)
      (net 16 "Net-(C11-Pad2)"))
    (model Capacitors_SMD.3dshapes/C_0402.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_SMD:C_0402 (layer F.Cu) (tedit 5415D599)
    (at 126.619 122.53468 270)
    (descr "Capacitor SMD 0402, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0402")
    (attr smd)
    (fp_text reference C10 (at 0.19304 -1.20904 90) (layer F.SilkS))
    (fp_text value 0.1uF (at 0 1.7 270) (layer F.Fab))
    (pad 2 smd rect (at 0.55 0 270) (size 0.6 0.5) (layers F.Cu F.Paste F.Mask)
      (net 13 GND))
    (pad 1 smd rect (at -0.55 0 270) (size 0.6 0.5) (layers F.Cu F.Paste F.Mask)
      (net 15 +1V8))
    (model Capacitors_SMD.3dshapes/C_0402.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_SMD:C_0402 (layer F.Cu) (tedit 5415D599)
    (at 129.61376 117.07956)
    (descr "Capacitor SMD 0402, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0402")
    (attr smd)
    (fp_text reference C9 (at -0.06868 -1.08792) (layer F.SilkS))
    (fp_text value 0.1uF (at 0 1.7) (layer F.Fab))
    (pad 1 smd rect (at -0.55 0) (size 0.6 0.5) (layers F.Cu F.Paste F.Mask)
      (net 17 +3V3))
    (pad 2 smd rect (at 0.55 0) (size 0.6 0.5) (layers F.Cu F.Paste F.Mask)
      (net 13 GND))
    (model Capacitors_SMD.3dshapes/C_0402.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_SMD:C_0402 (layer F.Cu) (tedit 5415D599)
    (at 119.54002 118.59514 270)
    (descr "Capacitor SMD 0402, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0402")
    (attr smd)
    (fp_text reference C8 (at -1.76 -0.04 270) (layer F.SilkS))
    (fp_text value 0.1uF (at 0 1.7 270) (layer F.Fab))
    (pad 2 smd rect (at 0.55 0 270) (size 0.6 0.5) (layers F.Cu F.Paste F.Mask)
      (net 16 "Net-(C11-Pad2)"))
    (pad 1 smd rect (at -0.55 0 270) (size 0.6 0.5) (layers F.Cu F.Paste F.Mask)
      (net 14 "Net-(C11-Pad1)"))
    (model Capacitors_SMD.3dshapes/C_0402.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_SMD:C_0402 (layer F.Cu) (tedit 5415D599)
    (at 129.61376 118.33956)
    (descr "Capacitor SMD 0402, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0402")
    (attr smd)
    (fp_text reference C7 (at -0.01788 1.09378) (layer F.SilkS))
    (fp_text value 0.1uF (at 0 1.7) (layer F.Fab))
    (pad 1 smd rect (at -0.55 0) (size 0.6 0.5) (layers F.Cu F.Paste F.Mask)
      (net 15 +1V8))
    (pad 2 smd rect (at 0.55 0) (size 0.6 0.5) (layers F.Cu F.Paste F.Mask)
      (net 13 GND))
    (model Capacitors_SMD.3dshapes/C_0402.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_SMD:C_0402 (layer F.Cu) (tedit 5415D599)
    (at 119.46382 115.07724 180)
    (descr "Capacitor SMD 0402, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0402")
    (attr smd)
    (fp_text reference C6 (at 1.66116 0.03302 180) (layer F.SilkS))
    (fp_text value 0.1uF (at 0 1.7 180) (layer F.Fab))
    (pad 2 smd rect (at 0.55 0 180) (size 0.6 0.5) (layers F.Cu F.Paste F.Mask)
      (net 13 GND))
    (pad 1 smd rect (at -0.55 0 180) (size 0.6 0.5) (layers F.Cu F.Paste F.Mask)
      (net 17 +3V3))
    (model Capacitors_SMD.3dshapes/C_0402.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_SMD:C_0402 (layer F.Cu) (tedit 5415D599)
    (at 119.46382 113.8301 180)
    (descr "Capacitor SMD 0402, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0402")
    (attr smd)
    (fp_text reference C5 (at 1.69164 -0.03556 180) (layer F.SilkS))
    (fp_text value 0.1uF (at 0 1.7 180) (layer F.Fab))
    (pad 1 smd rect (at -0.55 0 180) (size 0.6 0.5) (layers F.Cu F.Paste F.Mask)
      (net 15 +1V8))
    (pad 2 smd rect (at 0.55 0 180) (size 0.6 0.5) (layers F.Cu F.Paste F.Mask)
      (net 13 GND))
    (model Capacitors_SMD.3dshapes/C_0402.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_SMD:C_0402 (layer F.Cu) (tedit 5415D599)
    (at 119.32666 120.84812 180)
    (descr "Capacitor SMD 0402, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0402")
    (attr smd)
    (fp_text reference C4 (at 0 -1.08712 180) (layer F.SilkS))
    (fp_text value 10uF (at 0 1.7 180) (layer F.Fab))
    (pad 2 smd rect (at 0.55 0 180) (size 0.6 0.5) (layers F.Cu F.Paste F.Mask)
      (net 13 GND))
    (pad 1 smd rect (at -0.55 0 180) (size 0.6 0.5) (layers F.Cu F.Paste F.Mask)
      (net 17 +3V3))
    (model Capacitors_SMD.3dshapes/C_0402.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistors_SMD:R_0402 (layer F.Cu) (tedit 5415CBB8)
    (at 116.8908 118.618 270)
    (descr "Resistor SMD 0402, reflow soldering, Vishay (see dcrcw.pdf)")
    (tags "resistor 0402")
    (attr smd)
    (fp_text reference R1 (at -1.69272 0 270) (layer F.SilkS))
    (fp_text value 100 (at 0 1.8 270) (layer F.Fab))
    (pad 1 smd rect (at -0.45 0 270) (size 0.4 0.6) (layers F.Cu F.Paste F.Mask)
      (net 14 "Net-(C11-Pad1)"))
    (pad 2 smd rect (at 0.45 0 270) (size 0.4 0.6) (layers F.Cu F.Paste F.Mask)
      (net 15 +1V8))
    (model Resistors_SMD.3dshapes/R_0402.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Crystals_Oscillators_SMD:crystal_FA238-TSX3225 (layer F.Cu) (tedit 0)
    (at 116.38788 121.77014 270)
    (descr "crystal Epson Toyocom FA-238 and TSX-3225 series")
    (fp_text reference Y1 (at 2.40538 -0.08636) (layer F.SilkS))
    (fp_text value 16MHz (at 0.24638 0.09144 270) (layer F.Fab))
    (pad 1 smd rect (at -1.1 0.8 270) (size 1.4 1.2) (layers F.Cu F.Paste F.Mask)
      (net 6 "Net-(C1-Pad1)"))
    (pad 3 smd rect (at 1.1 0.8 270) (size 1.4 1.2) (layers F.Cu F.Paste F.Mask)
      (net 13 GND))
    (pad 3 smd rect (at -1.1 -0.8 270) (size 1.4 1.2) (layers F.Cu F.Paste F.Mask)
      (net 13 GND))
    (pad 2 smd rect (at 1.1 -0.8 270) (size 1.4 1.2) (layers F.Cu F.Paste F.Mask)
      (net 7 "Net-(C2-Pad1)"))
    (model Crystals_Oscillators_SMD.3dshapes/crystal_FA238-TSX3225.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.24 0.24 0.24))
      (rotate (xyz 0 0 0))
    )
  )
  (module Pin_Headers:Pin_Header_Straight_1x14 (layer B.Cu) (tedit 5982AFD5)
    (at 102.87 110.49 270)
    (descr "Through hole pin header")
    (tags "pin header")
    (fp_text reference J2 (at 0 2.54 270) (layer B.SilkS) hide)
    (fp_text value CONN_01X14 (at 0 3.1 270) (layer B.Fab))
    (pad 14 thru_hole oval (at 0 -33.02 270) (size 1.7272 1.7272) (drill 1.016) (layers *.Cu *.Mask B.SilkS)
      (net 24 GPIO_9/SPI1.SS2))
    (pad 13 thru_hole oval (at 0 -30.48 270) (size 1.7272 1.7272) (drill 1.016) (layers *.Cu *.Mask B.SilkS)
      (net 25 GPIO_10/SPI1.SS3/PWM2.0))
    (pad 12 thru_hole oval (at 0 -27.94 270) (size 1.7272 1.7272) (drill 1.016) (layers *.Cu *.Mask B.SilkS)
      (net 26 GPIO_11/PWM2.1))
    (pad 11 thru_hole oval (at 0 -25.4 270) (size 1.7272 1.7272) (drill 1.016) (layers *.Cu *.Mask B.SilkS)
      (net 27 GPIO_12/PWM2.2))
    (pad 10 thru_hole oval (at 0 -22.86 270) (size 1.7272 1.7272) (drill 1.016) (layers *.Cu *.Mask B.SilkS)
      (net 28 GPIO_13/PWM2.3))
    (pad 9 thru_hole oval (at 0 -20.32 270) (size 1.7272 1.7272) (drill 1.016) (layers *.Cu *.Mask B.SilkS)
      (net 29 GPIO_16/UART0.RX))
    (pad 8 thru_hole oval (at 0 -17.78 270) (size 1.7272 1.7272) (drill 1.016) (layers *.Cu *.Mask B.SilkS)
      (net 30 GPIO_17/UART0.TX))
    (pad 7 thru_hole oval (at 0 -15.24 270) (size 1.7272 1.7272) (drill 1.016) (layers *.Cu *.Mask B.SilkS)
      (net 31 GPIO_18))
    (pad 6 thru_hole oval (at 0 -12.7 270) (size 1.7272 1.7272) (drill 1.016) (layers *.Cu *.Mask B.SilkS)
      (net 32 GPIO_23/PWM1.1))
    (pad 5 thru_hole oval (at 0 -10.16 270) (size 1.7272 1.7272) (drill 1.016) (layers *.Cu *.Mask B.SilkS)
      (net 33 GPIO_23/PWM1.0))
    (pad 4 thru_hole oval (at 0 -7.62 270) (size 1.7272 1.7272) (drill 1.016) (layers *.Cu *.Mask B.SilkS)
      (net 34 GPIO_23/PWM1.2))
    (pad 3 thru_hole oval (at 0 -5.08 270) (size 1.7272 1.7272) (drill 1.016) (layers *.Cu *.Mask B.SilkS)
      (net 35 GPIO_22/PWM1.3))
    (pad 2 thru_hole oval (at 0 -2.54 270) (size 1.7272 1.7272) (drill 1.016) (layers *.Cu *.Mask B.SilkS)
      (net 36 GPIO_23))
    (pad 1 thru_hole rect (at 0 0 270) (size 1.7272 1.7272) (drill 1.016) (layers *.Cu *.Mask B.SilkS)
      (net 13 GND))
    (model Pin_Headers.3dshapes/Pin_Header_Straight_1x14.wrl
      (at (xyz 0 -0.65 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 90))
    )
  )
  (module Pin_Headers:Pin_Header_Straight_1x14 (layer B.Cu) (tedit 5982AFD1)
    (at 102.87 125.73 270)
    (descr "Through hole pin header")
    (tags "pin header")
    (fp_text reference J1 (at 0 2.54 270) (layer B.SilkS) hide)
    (fp_text value CONN_01X14 (at 0 3.1 270) (layer B.Fab))
    (pad 1 thru_hole rect (at 0 0 270) (size 1.7272 1.7272) (drill 1.016) (layers *.Cu *.Mask B.SilkS)
      (net 37 +5V))
    (pad 2 thru_hole oval (at 0 -2.54 270) (size 1.7272 1.7272) (drill 1.016) (layers *.Cu *.Mask B.SilkS)
      (net 13 GND))
    (pad 3 thru_hole oval (at 0 -5.08 270) (size 1.7272 1.7272) (drill 1.016) (layers *.Cu *.Mask B.SilkS)
      (net 17 +3V3))
    (pad 4 thru_hole oval (at 0 -7.62 270) (size 1.7272 1.7272) (drill 1.016) (layers *.Cu *.Mask B.SilkS)
      (net 46 JTAG_TRST_N))
    (pad 5 thru_hole oval (at 0 -10.16 270) (size 1.7272 1.7272) (drill 1.016) (layers *.Cu *.Mask B.SilkS)
      (net 40 JTAG_TCK))
    (pad 6 thru_hole oval (at 0 -12.7 270) (size 1.7272 1.7272) (drill 1.016) (layers *.Cu *.Mask B.SilkS)
      (net 41 JTAG_TDO))
    (pad 7 thru_hole oval (at 0 -15.24 270) (size 1.7272 1.7272) (drill 1.016) (layers *.Cu *.Mask B.SilkS)
      (net 42 JTAG_TMS))
    (pad 8 thru_hole oval (at 0 -17.78 270) (size 1.7272 1.7272) (drill 1.016) (layers *.Cu *.Mask B.SilkS)
      (net 43 JTAG_TDI))
    (pad 9 thru_hole oval (at 0 -20.32 270) (size 1.7272 1.7272) (drill 1.016) (layers *.Cu *.Mask B.SilkS)
      (net 18 GPIO_0/PWM0.0))
    (pad 10 thru_hole oval (at 0 -22.86 270) (size 1.7272 1.7272) (drill 1.016) (layers *.Cu *.Mask B.SilkS)
      (net 19 GPIO_1/PWM0.1))
    (pad 11 thru_hole oval (at 0 -25.4 270) (size 1.7272 1.7272) (drill 1.016) (layers *.Cu *.Mask B.SilkS)
      (net 20 GPIO_2/SPI1.SS0/PWM0.2))
    (pad 12 thru_hole oval (at 0 -27.94 270) (size 1.7272 1.7272) (drill 1.016) (layers *.Cu *.Mask B.SilkS)
      (net 21 GPIO_3/SPI1.MOSI/PWM0.3))
    (pad 13 thru_hole oval (at 0 -30.48 270) (size 1.7272 1.7272) (drill 1.016) (layers *.Cu *.Mask B.SilkS)
      (net 22 GPIO_4/SPI1.MISO))
    (pad 14 thru_hole oval (at 0 -33.02 270) (size 1.7272 1.7272) (drill 1.016) (layers *.Cu *.Mask B.SilkS)
      (net 23 GPIO_5/SPI1.SCK))
    (model Pin_Headers.3dshapes/Pin_Header_Straight_1x14.wrl
      (at (xyz 0 -0.65 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 90))
    )
  )
  (module Capacitors_SMD:C_0402 (layer F.Cu) (tedit 5415D599)
    (at 119.33868 123.03192)
    (descr "Capacitor SMD 0402, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0402")
    (attr smd)
    (fp_text reference C2 (at 0.04386 1.12328) (layer F.SilkS))
    (fp_text value 12pF (at 0 -0.07874) (layer F.Fab))
    (pad 2 smd rect (at 0.55 0) (size 0.6 0.5) (layers F.Cu F.Paste F.Mask)
      (net 13 GND))
    (pad 1 smd rect (at -0.55 0) (size 0.6 0.5) (layers F.Cu F.Paste F.Mask)
      (net 7 "Net-(C2-Pad1)"))
    (model Capacitors_SMD.3dshapes/C_0402.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_SMD:C_0402 (layer F.Cu) (tedit 5415D599)
    (at 115.54714 118.60022 90)
    (descr "Capacitor SMD 0402, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0402")
    (attr smd)
    (fp_text reference C1 (at 1.71 0.07 90) (layer F.SilkS))
    (fp_text value 12pF (at 0.12192 0.06096 90) (layer F.Fab))
    (pad 1 smd rect (at -0.55 0 90) (size 0.6 0.5) (layers F.Cu F.Paste F.Mask)
      (net 6 "Net-(C1-Pad1)"))
    (pad 2 smd rect (at 0.55 0 90) (size 0.6 0.5) (layers F.Cu F.Paste F.Mask)
      (net 13 GND))
    (model Capacitors_SMD.3dshapes/C_0402.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Housings_DFN_QFN:UQFN-48-1EP_6x6mm_Pitch0.4mm (layer F.Cu) (tedit 54130A77)
    (at 124.29998 117.93474)
    (descr "48-Lead Plastic Ultra Thin Quad Flat, No Lead Package (MV) - 6x6x0.5 mm Body [UQFN]; (see Microchip Packaging Specification 00000049BS.pdf)")
    (tags "QFN 0.4")
    (attr smd)
    (fp_text reference U1 (at -2.07264 -4.10718) (layer F.SilkS))
    (fp_text value E310-G000 (at 0 4.4) (layer F.Fab))
    (pad 1 smd rect (at -3 -2.2) (size 0.8 0.2) (layers F.Cu F.Paste F.Mask)
      (net 1 "Net-(U1-Pad1)"))
    (pad 2 smd rect (at -3 -1.8) (size 0.8 0.2) (layers F.Cu F.Paste F.Mask)
      (net 2 "Net-(U1-Pad2)"))
    (pad 3 smd rect (at -3 -1.4) (size 0.8 0.2) (layers F.Cu F.Paste F.Mask)
      (net 3 "Net-(U1-Pad3)"))
    (pad 4 smd rect (at -3 -1) (size 0.8 0.2) (layers F.Cu F.Paste F.Mask)
      (net 4 "Net-(U1-Pad4)"))
    (pad 5 smd rect (at -3 -0.6) (size 0.8 0.2) (layers F.Cu F.Paste F.Mask)
      (net 5 "Net-(U1-Pad5)"))
    (pad 6 smd rect (at -3 -0.2) (size 0.8 0.2) (layers F.Cu F.Paste F.Mask)
      (net 15 +1V8))
    (pad 7 smd rect (at -3 0.2) (size 0.8 0.2) (layers F.Cu F.Paste F.Mask)
      (net 14 "Net-(C11-Pad1)"))
    (pad 8 smd rect (at -3 0.6) (size 0.8 0.2) (layers F.Cu F.Paste F.Mask)
      (net 16 "Net-(C11-Pad2)"))
    (pad 9 smd rect (at -3 1) (size 0.8 0.2) (layers F.Cu F.Paste F.Mask)
      (net 6 "Net-(C1-Pad1)"))
    (pad 10 smd rect (at -3 1.4) (size 0.8 0.2) (layers F.Cu F.Paste F.Mask)
      (net 7 "Net-(C2-Pad1)"))
    (pad 11 smd rect (at -3 1.8) (size 0.8 0.2) (layers F.Cu F.Paste F.Mask)
      (net 17 +3V3))
    (pad 12 smd rect (at -3 2.2) (size 0.8 0.2) (layers F.Cu F.Paste F.Mask)
      (net 17 +3V3))
    (pad 13 smd rect (at -2.2 3 90) (size 0.8 0.2) (layers F.Cu F.Paste F.Mask)
      (net 40 JTAG_TCK))
    (pad 14 smd rect (at -1.8 3 90) (size 0.8 0.2) (layers F.Cu F.Paste F.Mask)
      (net 41 JTAG_TDO))
    (pad 15 smd rect (at -1.4 3 90) (size 0.8 0.2) (layers F.Cu F.Paste F.Mask)
      (net 42 JTAG_TMS))
    (pad 16 smd rect (at -1 3 90) (size 0.8 0.2) (layers F.Cu F.Paste F.Mask)
      (net 43 JTAG_TDI))
    (pad 17 smd rect (at -0.6 3 90) (size 0.8 0.2) (layers F.Cu F.Paste F.Mask)
      (net 8 "Net-(U1-Pad17)"))
    (pad 18 smd rect (at -0.2 3 90) (size 0.8 0.2) (layers F.Cu F.Paste F.Mask)
      (net 45 "Net-(R3-Pad1)"))
    (pad 19 smd rect (at 0.2 3 90) (size 0.8 0.2) (layers F.Cu F.Paste F.Mask)
      (net 15 +1V8))
    (pad 20 smd rect (at 0.6 3 90) (size 0.8 0.2) (layers F.Cu F.Paste F.Mask)
      (net 9 "Net-(U1-Pad20)"))
    (pad 21 smd rect (at 1 3 90) (size 0.8 0.2) (layers F.Cu F.Paste F.Mask)
      (net 10 "Net-(U1-Pad21)"))
    (pad 22 smd rect (at 1.4 3 90) (size 0.8 0.2) (layers F.Cu F.Paste F.Mask)
      (net 11 "Net-(U1-Pad22)"))
    (pad 23 smd rect (at 1.8 3 90) (size 0.8 0.2) (layers F.Cu F.Paste F.Mask)
      (net 15 +1V8))
    (pad 24 smd rect (at 2.2 3 90) (size 0.8 0.2) (layers F.Cu F.Paste F.Mask)
      (net 44 "Net-(C16-Pad1)"))
    (pad 25 smd rect (at 3 2.2) (size 0.8 0.2) (layers F.Cu F.Paste F.Mask)
      (net 18 GPIO_0/PWM0.0))
    (pad 26 smd rect (at 3 1.8) (size 0.8 0.2) (layers F.Cu F.Paste F.Mask)
      (net 19 GPIO_1/PWM0.1))
    (pad 27 smd rect (at 3 1.4) (size 0.8 0.2) (layers F.Cu F.Paste F.Mask)
      (net 20 GPIO_2/SPI1.SS0/PWM0.2))
    (pad 28 smd rect (at 3 1) (size 0.8 0.2) (layers F.Cu F.Paste F.Mask)
      (net 21 GPIO_3/SPI1.MOSI/PWM0.3))
    (pad 29 smd rect (at 3 0.6) (size 0.8 0.2) (layers F.Cu F.Paste F.Mask)
      (net 22 GPIO_4/SPI1.MISO))
    (pad 30 smd rect (at 3 0.2) (size 0.8 0.2) (layers F.Cu F.Paste F.Mask)
      (net 15 +1V8))
    (pad 31 smd rect (at 3 -0.2) (size 0.8 0.2) (layers F.Cu F.Paste F.Mask)
      (net 23 GPIO_5/SPI1.SCK))
    (pad 32 smd rect (at 3 -0.6) (size 0.8 0.2) (layers F.Cu F.Paste F.Mask)
      (net 17 +3V3))
    (pad 33 smd rect (at 3 -1) (size 0.8 0.2) (layers F.Cu F.Paste F.Mask)
      (net 24 GPIO_9/SPI1.SS2))
    (pad 34 smd rect (at 3 -1.4) (size 0.8 0.2) (layers F.Cu F.Paste F.Mask)
      (net 25 GPIO_10/SPI1.SS3/PWM2.0))
    (pad 35 smd rect (at 3 -1.8) (size 0.8 0.2) (layers F.Cu F.Paste F.Mask)
      (net 26 GPIO_11/PWM2.1))
    (pad 36 smd rect (at 3 -2.2) (size 0.8 0.2) (layers F.Cu F.Paste F.Mask)
      (net 27 GPIO_12/PWM2.2))
    (pad 37 smd rect (at 2.2 -3 90) (size 0.8 0.2) (layers F.Cu F.Paste F.Mask)
      (net 28 GPIO_13/PWM2.3))
    (pad 38 smd rect (at 1.8 -3 90) (size 0.8 0.2) (layers F.Cu F.Paste F.Mask)
      (net 29 GPIO_16/UART0.RX))
    (pad 39 smd rect (at 1.4 -3 90) (size 0.8 0.2) (layers F.Cu F.Paste F.Mask)
      (net 30 GPIO_17/UART0.TX))
    (pad 40 smd rect (at 1 -3 90) (size 0.8 0.2) (layers F.Cu F.Paste F.Mask)
      (net 31 GPIO_18))
    (pad 41 smd rect (at 0.6 -3 90) (size 0.8 0.2) (layers F.Cu F.Paste F.Mask)
      (net 32 GPIO_23/PWM1.1))
    (pad 42 smd rect (at 0.2 -3 90) (size 0.8 0.2) (layers F.Cu F.Paste F.Mask)
      (net 33 GPIO_23/PWM1.0))
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      (net 35 GPIO_22/PWM1.3))
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      (net 36 GPIO_23))
    (pad 46 smd rect (at -1.4 -3 90) (size 0.8 0.2) (layers F.Cu F.Paste F.Mask)
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    (model Housings_DFN_QFN.3dshapes/UQFN-48-1EP_6x6mm_Pitch0.4mm.wrl
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      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (gr_text R0-2017 (at 111.4552 123.96724) (layer F.SilkS))
  (gr_text m_w (at 135.8646 113.46434 90) (layer F.SilkS))
  (gr_text LoFive (at 105.1179 123.66752) (layer F.SilkS))
  (gr_text SPI1.SS2 (at 135.89 112.395 90) (layer B.SilkS))
  (gr_text SPI1.SS3 (at 133.35 112.395 90) (layer B.SilkS))
  (gr_text PWM2.1 (at 130.81 112.395 90) (layer B.SilkS))
  (gr_text PWM2.2 (at 128.27 112.395 90) (layer B.SilkS))
  (gr_text PWM2.3 (at 125.73 112.395 90) (layer B.SilkS))
  (gr_text UART0.RX (at 123.19 112.395 90) (layer B.SilkS))
  (gr_text UART0.TX (at 120.65 112.395 90) (layer B.SilkS))
  (gr_text GPIO_18 (at 118.11 112.395 90) (layer B.SilkS))
  (gr_text PWM1.1 (at 115.57 112.395 90) (layer B.SilkS))
  (gr_text PWM1.0 (at 113.03 112.395 90) (layer B.SilkS))
  (gr_text PWM1.2 (at 110.49 112.395 90) (layer B.SilkS))
  (gr_text PWM1.3 (at 107.95 112.395 90) (layer B.SilkS))
  (gr_text GPIO_23 (at 105.41 112.395 90) (layer B.SilkS))
  (gr_text GND (at 102.87 112.395 90) (layer B.SilkS))
  (gr_text SPI1.SCK (at 135.89 123.825 90) (layer B.SilkS))
  (gr_text SPI1.MISO (at 133.35 123.825 90) (layer B.SilkS))
  (gr_text SPI1.MOSI (at 130.81 123.825 90) (layer B.SilkS))
  (gr_text SPI1.SS0 (at 128.27 123.825 90) (layer B.SilkS))
  (gr_text PWM0.1 (at 125.73 123.825 90) (layer B.SilkS))
  (gr_text PWM0.0 (at 123.19 123.825 90) (layer B.SilkS))
  (gr_text TDI (at 120.65 123.825 90) (layer B.SilkS))
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  (gr_text TDO (at 115.57 123.825 90) (layer B.SilkS))
  (gr_text TCK (at 113.03 123.825 90) (layer B.SilkS))
  (gr_text TRSTN (at 110.49 123.825 90) (layer B.SilkS))
  (gr_text +3.3Vout (at 107.95 123.825 90) (layer B.SilkS))
  (gr_text GND (at 105.41 123.825 90) (layer B.SilkS))
  (gr_text +5Vin (at 102.87 123.825 90) (layer B.SilkS))
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