(kicad_pcb
	(version 20240108)
	(generator "pcbnew")
	(generator_version "8.0")
	(general
		(thickness 1.6)
		(legacy_teardrops no)
	)
	(paper "A4")
	(layers
		(0 "F.Cu" signal)
		(31 "B.Cu" signal)
		(32 "B.Adhes" user "B.Adhesive")
		(33 "F.Adhes" user "F.Adhesive")
		(34 "B.Paste" user)
		(35 "F.Paste" user)
		(36 "B.SilkS" user "B.Silkscreen")
		(37 "F.SilkS" user "F.Silkscreen")
		(38 "B.Mask" user)
		(39 "F.Mask" user)
		(40 "Dwgs.User" user "User.Drawings")
		(41 "Cmts.User" user "User.Comments")
		(42 "Eco1.User" user "User.Eco1")
		(43 "Eco2.User" user "User.Eco2")
		(44 "Edge.Cuts" user)
		(45 "Margin" user)
		(46 "B.CrtYd" user "B.Courtyard")
		(47 "F.CrtYd" user "F.Courtyard")
		(48 "B.Fab" user)
		(49 "F.Fab" user)
		(50 "User.1" user)
		(51 "User.2" user)
		(52 "User.3" user)
		(53 "User.4" user)
		(54 "User.5" user)
		(55 "User.6" user)
		(56 "User.7" user)
		(57 "User.8" user)
		(58 "User.9" user)
	)
	(setup
		(stackup
			(layer "F.SilkS"
				(type "Top Silk Screen")
			)
			(layer "F.Paste"
				(type "Top Solder Paste")
			)
			(layer "F.Mask"
				(type "Top Solder Mask")
				(thickness 0.01)
			)
			(layer "F.Cu"
				(type "copper")
				(thickness 0.035)
			)
			(layer "dielectric 1"
				(type "core")
				(thickness 1.51)
				(material "FR4")
				(epsilon_r 4.5)
				(loss_tangent 0.02)
			)
			(layer "B.Cu"
				(type "copper")
				(thickness 0.035)
			)
			(layer "B.Mask"
				(type "Bottom Solder Mask")
				(thickness 0.01)
			)
			(layer "B.Paste"
				(type "Bottom Solder Paste")
			)
			(layer "B.SilkS"
				(type "Bottom Silk Screen")
			)
			(copper_finish "None")
			(dielectric_constraints no)
		)
		(pad_to_mask_clearance 0)
		(allow_soldermask_bridges_in_footprints no)
		(grid_origin 152.4 114.3)
		(pcbplotparams
			(layerselection 0x00010fc_ffffffff)
			(plot_on_all_layers_selection 0x0000000_00000000)
			(disableapertmacros no)
			(usegerberextensions no)
			(usegerberattributes yes)
			(usegerberadvancedattributes yes)
			(creategerberjobfile yes)
			(dashed_line_dash_ratio 12.000000)
			(dashed_line_gap_ratio 3.000000)
			(svgprecision 4)
			(plotframeref no)
			(viasonmask no)
			(mode 1)
			(useauxorigin no)
			(hpglpennumber 1)
			(hpglpenspeed 20)
			(hpglpendiameter 15.000000)
			(pdf_front_fp_property_popups yes)
			(pdf_back_fp_property_popups yes)
			(dxfpolygonmode yes)
			(dxfimperialunits yes)
			(dxfusepcbnewfont yes)
			(psnegative no)
			(psa4output no)
			(plotreference yes)
			(plotvalue yes)
			(plotfptext yes)
			(plotinvisibletext no)
			(sketchpadsonfab no)
			(subtractmaskfromsilk no)
			(outputformat 1)
			(mirror no)
			(drillshape 1)
			(scaleselection 1)
			(outputdirectory "")
		)
	)
	(net 0 "")
	(net 1 "GND")
	(net 2 "VBUS")
	(net 3 "VBAT")
	(net 4 "/MOSI")
	(net 5 "/SCK")
	(net 6 "/A5")
	(net 7 "/A0")
	(net 8 "/A4")
	(net 9 "/A3")
	(net 10 "/TX")
	(net 11 "/A1")
	(net 12 "/TXD0")
	(net 13 "/RX")
	(net 14 "/A2")
	(net 15 "/MISO")
	(net 16 "/RESET")
	(net 17 "/D9")
	(net 18 "/D12")
	(net 19 "/D5")
	(net 20 "/D6")
	(net 21 "/D11")
	(net 22 "/SCL")
	(net 23 "/D13")
	(net 24 "/EN")
	(net 25 "/D10")
	(net 26 "/SDA")
	(net 27 "Net-(U1-IN-)")
	(net 28 "Net-(U1-IN+)")
	(net 29 "unconnected-(U1-NC-Pad4)")
	(net 30 "VCC")
	(net 31 "Net-(RB1-Pad1)")
	(net 32 "Net-(RA1-Pad2)")
	(net 33 "Net-(U2-IN+)")
	(net 34 "Net-(U2-IN-)")
	(net 35 "Net-(RA2-Pad2)")
	(net 36 "Net-(RB3-Pad1)")
	(net 37 "unconnected-(U2-NC-Pad4)")
	(net 38 "Net-(U3-IN+)")
	(net 39 "Net-(U3-IN-)")
	(net 40 "Net-(RA3-Pad2)")
	(net 41 "Net-(RB5-Pad1)")
	(net 42 "unconnected-(U3-NC-Pad4)")
	(net 43 "Net-(U4-IN+)")
	(net 44 "Net-(U4-IN-)")
	(net 45 "Net-(U5-IN+)")
	(net 46 "Net-(U5-IN-)")
	(net 47 "Net-(RA4-Pad2)")
	(net 48 "Net-(RA5-Pad2)")
	(net 49 "Net-(RA6-Pad2)")
	(net 50 "Net-(RB7-Pad1)")
	(net 51 "Net-(RB9-Pad1)")
	(net 52 "Net-(RB11-Pad1)")
	(net 53 "unconnected-(U4-NC-Pad4)")
	(net 54 "unconnected-(U5-NC-Pad4)")
	(net 55 "Net-(U0-IN+)")
	(net 56 "Net-(U0-IN-)")
	(net 57 "unconnected-(U0-NC-Pad4)")
	(footprint "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder"
		(layer "F.Cu")
		(at 170.6375 114.65 90)
		(descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
		(tags "capacitor handsolder")
		(property "Reference" "C17"
			(at 3.1 0.0125 90)
			(layer "F.SilkS")
		)
		(property "Value" "47nF"
			(at 0 1.43 90)
			(layer "F.Fab")
		)
		(property "Footprint" "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder"
			(at 0 0 90)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Datasheet" ""
			(at 0 0 90)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Description" ""
			(at 0 0 90)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(sheetname "thermocouple-channel5")
		(sheetfile "thermocouple-channel.kicad_sch")
		(attr smd)
		(fp_text user "${REFERENCE}"
			(at 0 0 90)
			(layer "F.Fab")
		)
		(pad "1" smd roundrect
			(at -0.8625 0 90)
			(size 1.075 0.95)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(roundrect_rratio 0.25)
			(net 46 "Net-(U5-IN-)")
			(pinfunction "1")
			(pintype "passive")
		)
		(pad "2" smd roundrect
			(at 0.8625 0 90)
			(size 1.075 0.95)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(roundrect_rratio 0.25)
			(net 1 "GND")
			(pinfunction "2")
			(pintype "passive")
		)
		(model "${KICAD8_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl"
			(offset
				(xyz 0 0 0)
			)
			(scale
				(xyz 1 1 1)
			)
			(rotate
				(xyz 0 0 0)
			)
		)
	)
	(footprint "adafruit:MSOP8_0.65MM"
		(layer "F.Cu")
		(at 150.7 117.975 -90)
		(descr "Source: http://www.intersil.com/data/fn/fn7833.pdf")
		(property "Reference" "U2"
			(at 3.175 -1.4375 0)
			(layer "F.SilkS")
		)
		(property "Value" "AD849X"
			(at 2.282 0.726 90)
			(layer "F.Fab")
		)
		(property "Footprint" "adafruit:MSOP8_0.65MM"
			(at 0 0 -90)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Datasheet" ""
			(at 0 0 -90)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Description" ""
			(at 0 0 -90)
			(layer "F.Fab")
			(hide yes)
		)
		(sheetname "thermocouple-channel2")
		(sheetfile "thermocouple-channel.kicad_sch")
		(pad "1" smd rect
			(at -0.975 2.2)
			(size 1.4 0.4)
			(layers "F.Cu" "F.Paste")
			(net 34 "Net-(U2-IN-)")
			(pinfunction "IN-")
			(pintype "input")
			(solder_mask_margin 0.1016)
			(thermal_bridge_angle 0)
		)
		(pad "2" smd rect
			(at -0.325 2.2)
			(size 1.4 0.4)
			(layers "F.Cu" "F.Paste")
			(net 1 "GND")
			(pinfunction "REF")
			(pintype "input")
			(solder_mask_margin 0.1016)
			(thermal_bridge_angle 0)
		)
		(pad "3" smd rect
			(at 0.325 2.2)
			(size 1.4 0.4)
			(layers "F.Cu" "F.Paste")
			(net 1 "GND")
			(pinfunction "VS-")
			(pintype "power_in")
			(solder_mask_margin 0.1016)
			(thermal_bridge_angle 0)
		)
		(pad "4" smd rect
			(at 0.975 2.2)
			(size 1.4 0.4)
			(layers "F.Cu" "F.Paste")
			(net 37 "unconnected-(U2-NC-Pad4)")
			(pinfunction "NC")
			(pintype "no_connect")
			(solder_mask_margin 0.1016)
			(thermal_bridge_angle 0)
		)
		(pad "5" smd rect
			(at 0.975 -2.2)
			(size 1.4 0.4)
			(layers "F.Cu" "F.Paste")
			(net 14 "/A2")
			(pinfunction "SENSE")
			(pintype "bidirectional")
			(solder_mask_margin 0.1016)
			(thermal_bridge_angle 0)
		)
		(pad "6" smd rect
			(at 0.325 -2.2)
			(size 1.4 0.4)
			(layers "F.Cu" "F.Paste")
			(net 14 "/A2")
			(pinfunction "OUT")
			(pintype "output")
			(solder_mask_margin 0.1016)
			(thermal_bridge_angle 0)
		)
		(pad "7" smd rect
			(at -0.325 -2.2)
			(size 1.4 0.4)
			(layers "F.Cu" "F.Paste")
			(net 30 "VCC")
			(pinfunction "VS+")
			(pintype "power_in")
			(solder_mask_margin 0.1016)
			(thermal_bridge_angle 0)
		)
		(pad "8" smd rect
			(at -0.975 -2.2)
			(size 1.4 0.4)
			(layers "F.Cu" "F.Paste")
			(net 33 "Net-(U2-IN+)")
			(pinfunction "IN+")
			(pintype "input")
			(solder_mask_margin 0.1016)
			(thermal_bridge_angle 0)
		)
	)
	(footprint "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder"
		(layer "F.Cu")
		(at 173.2 115.55 180)
		(descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
		(tags "capacitor handsolder")
		(property "Reference" "CA6"
			(at 0 1.5 0)
			(layer "F.SilkS")
			(hide yes)
		)
		(property "Value" "470nF"
			(at 0 1.43 0)
			(layer "F.Fab")
		)
		(property "Footprint" "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder"
			(at 0 0 180)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Datasheet" ""
			(at 0 0 180)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Description" ""
			(at 0 0 180)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(sheetname "thermocouple-channel5")
		(sheetfile "thermocouple-channel.kicad_sch")
		(attr smd)
		(fp_text user "${REFERENCE}"
			(at 0 0 0)
			(layer "F.Fab")
		)
		(pad "1" smd roundrect
			(at -0.8625 0 180)
			(size 1.075 0.95)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(roundrect_rratio 0.25)
			(net 45 "Net-(U5-IN+)")
			(pinfunction "1")
			(pintype "passive")
		)
		(pad "2" smd roundrect
			(at 0.8625 0 180)
			(size 1.075 0.95)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(roundrect_rratio 0.25)
			(net 46 "Net-(U5-IN-)")
			(pinfunction "2")
			(pintype "passive")
		)
		(model "${KICAD8_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl"
			(offset
				(xyz 0 0 0)
			)
			(scale
				(xyz 1 1 1)
			)
			(rotate
				(xyz 0 0 0)
			)
		)
	)
	(footprint "Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder"
		(layer "F.Cu")
		(at 159.1375 112.96 -90)
		(descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
		(tags "resistor handsolder")
		(property "Reference" "RB7"
			(at -3.06 0 90)
			(layer "F.SilkS")
		)
		(property "Value" "100"
			(at 0 1.43 90)
			(layer "F.Fab")
		)
		(property "Footprint" "Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder"
			(at 0 0 -90)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Datasheet" ""
			(at 0 0 -90)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Description" ""
			(at 0 0 -90)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(sheetname "thermocouple-channel3")
		(sheetfile "thermocouple-channel.kicad_sch")
		(attr smd)
		(fp_text user "${REFERENCE}"
			(at 0 0 90)
			(layer "F.Fab")
		)
		(pad "1" smd roundrect
			(at -0.9125 0 270)
			(size 0.975 0.95)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(roundrect_rratio 0.25)
			(net 50 "Net-(RB7-Pad1)")
			(pinfunction "1")
			(pintype "passive")
		)
		(pad "2" smd roundrect
			(at 0.9125 0 270)
			(size 0.975 0.95)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(roundrect_rratio 0.25)
			(net 38 "Net-(U3-IN+)")
			(pinfunction "2")
			(pintype "passive")
		)
		(model "${KICAD8_3DMODEL_DIR}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl"
			(offset
				(xyz 0 0 0)
			)
			(scale
				(xyz 1 1 1)
			)
			(rotate
				(xyz 0 0 0)
			)
		)
	)
	(footprint "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder"
		(layer "F.Cu")
		(at 135.7 115.55 180)
		(descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
		(tags "capacitor handsolder")
		(property "Reference" "CA1"
			(at 0 1.5 0)
			(layer "F.SilkS")
			(hide yes)
		)
		(property "Value" "470nF"
			(at 0 1.43 0)
			(layer "F.Fab")
		)
		(property "Footprint" "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder"
			(at 0 0 180)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Datasheet" ""
			(at 0 0 180)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Description" ""
			(at 0 0 180)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(sheetname "thermocouple-channel0")
		(sheetfile "thermocouple-channel.kicad_sch")
		(attr smd)
		(fp_text user "${REFERENCE}"
			(at 0 0 0)
			(layer "F.Fab")
		)
		(pad "1" smd roundrect
			(at -0.8625 0 180)
			(size 1.075 0.95)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(roundrect_rratio 0.25)
			(net 55 "Net-(U0-IN+)")
			(pinfunction "1")
			(pintype "passive")
		)
		(pad "2" smd roundrect
			(at 0.8625 0 180)
			(size 1.075 0.95)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(roundrect_rratio 0.25)
			(net 56 "Net-(U0-IN-)")
			(pinfunction "2")
			(pintype "passive")
		)
		(model "${KICAD8_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl"
			(offset
				(xyz 0 0 0)
			)
			(scale
				(xyz 1 1 1)
			)
			(rotate
				(xyz 0 0 0)
			)
		)
	)
	(footprint "Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder"
		(layer "F.Cu")
		(at 149.8875 112.96 -90)
		(descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
		(tags "resistor handsolder")
		(property "Reference" "RB6"
			(at -3.06 -0.25 90)
			(layer "F.SilkS")
		)
		(property "Value" "100"
			(at 0 1.43 90)
			(layer "F.Fab")
		)
		(property "Footprint" "Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder"
			(at 0 0 -90)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Datasheet" ""
			(at 0 0 -90)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Description" ""
			(at 0 0 -90)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(sheetname "thermocouple-channel2")
		(sheetfile "thermocouple-channel.kicad_sch")
		(attr smd)
		(fp_text user "${REFERENCE}"
			(at 0 0 90)
			(layer "F.Fab")
		)
		(pad "1" smd roundrect
			(at -0.9125 0 270)
			(size 0.975 0.95)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(roundrect_rratio 0.25)
			(net 40 "Net-(RA3-Pad2)")
			(pinfunction "1")
			(pintype "passive")
		)
		(pad "2" smd roundrect
			(at 0.9125 0 270)
			(size 0.975 0.95)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(roundrect_rratio 0.25)
			(net 34 "Net-(U2-IN-)")
			(pinfunction "2")
			(pintype "passive")
		)
		(model "${KICAD8_3DMODEL_DIR}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl"
			(offset
				(xyz 0 0 0)
			)
			(scale
				(xyz 1 1 1)
			)
			(rotate
				(xyz 0 0 0)
			)
		)
	)
	(footprint "kicad-mza:TestPoint_THTPad_1mm-round"
		(layer "F.Cu")
		(at 158.1375 120.65)
		(descr "THT rectangular pad as test Point, square 2.0mm_Drill1.0mm  side length, hole diameter 1.0mm")
		(tags "test point THT pad rectangle square")
		(property "Reference" "V3"
			(at -2 0 0)
			(layer "F.SilkS")
		)
		(property "Value" "~"
			(at 0 -2 360)
			(layer "F.Fab")
		)
		(property "Footprint" "kicad-mza:TestPoint_THTPad_1mm-round"
			(at 0 0 0)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Datasheet" ""
			(at 0 0 0)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Description" "test point"
			(at 0 0 0)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(property ki_fp_filters "Pin* Test*")
		(sheetname "thermocouple-channel3")
		(sheetfile "thermocouple-channel.kicad_sch")
		(attr exclude_from_pos_files)
		(fp_text user "${REFERENCE}"
			(at 0 -1.998 360)
			(layer "F.SilkS")
			(hide yes)
		)
		(pad "1" thru_hole circle
			(at 0 0)
			(size 2 2)
			(drill 1)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 9 "/A3")
			(pinfunction "1")
			(pintype "passive")
		)
	)
	(footprint "adafruit:MSOP8_0.65MM"
		(layer "F.Cu")
		(at 135.7 117.975 -90)
		(descr "Source: http://www.intersil.com/data/fn/fn7833.pdf")
		(property "Reference" "U0"
			(at 3.175 -1.4375 0)
			(layer "F.SilkS")
		)
		(property "Value" "AD849X"
			(at 2.282 0.726 90)
			(layer "F.Fab")
		)
		(property "Footprint" "adafruit:MSOP8_0.65MM"
			(at 0 0 90)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Datasheet" ""
			(at 0 0 90)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Description" ""
			(at 0 0 90)
			(layer "F.Fab")
			(hide yes)
		)
		(sheetname "thermocouple-channel0")
		(sheetfile "thermocouple-channel.kicad_sch")
		(pad "1" smd rect
			(at -0.975 2.2)
			(size 1.4 0.4)
			(layers "F.Cu" "F.Paste")
			(net 56 "Net-(U0-IN-)")
			(pinfunction "IN-")
			(pintype "input")
			(solder_mask_margin 0.1016)
			(thermal_bridge_angle 0)
		)
		(pad "2" smd rect
			(at -0.325 2.2)
			(size 1.4 0.4)
			(layers "F.Cu" "F.Paste")
			(net 1 "GND")
			(pinfunction "REF")
			(pintype "input")
			(solder_mask_margin 0.1016)
			(thermal_bridge_angle 0)
		)
		(pad "3" smd rect
			(at 0.325 2.2)
			(size 1.4 0.4)
			(layers "F.Cu" "F.Paste")
			(net 1 "GND")
			(pinfunction "VS-")
			(pintype "power_in")
			(solder_mask_margin 0.1016)
			(thermal_bridge_angle 0)
		)
		(pad "4" smd rect
			(at 0.975 2.2)
			(size 1.4 0.4)
			(layers "F.Cu" "F.Paste")
			(net 57 "unconnected-(U0-NC-Pad4)")
			(pinfunction "NC")
			(pintype "no_connect")
			(solder_mask_margin 0.1016)
			(thermal_bridge_angle 0)
		)
		(pad "5" smd rect
			(at 0.975 -2.2)
			(size 1.4 0.4)
			(layers "F.Cu" "F.Paste")
			(net 7 "/A0")
			(pinfunction "SENSE")
			(pintype "bidirectional")
			(solder_mask_margin 0.1016)
			(thermal_bridge_angle 0)
		)
		(pad "6" smd rect
			(at 0.325 -2.2)
			(size 1.4 0.4)
			(layers "F.Cu" "F.Paste")
			(net 7 "/A0")
			(pinfunction "OUT")
			(pintype "output")
			(solder_mask_margin 0.1016)
			(thermal_bridge_angle 0)
		)
		(pad "7" smd rect
			(at -0.325 -2.2)
			(size 1.4 0.4)
			(layers "F.Cu" "F.Paste")
			(net 30 "VCC")
			(pinfunction "VS+")
			(pintype "power_in")
			(solder_mask_margin 0.1016)
			(thermal_bridge_angle 0)
		)
		(pad "8" smd rect
			(at -0.975 -2.2)
			(size 1.4 0.4)
			(layers "F.Cu" "F.Paste")
			(net 55 "Net-(U0-IN+)")
			(pinfunction "IN+")
			(pintype "input")
			(solder_mask_margin 0.1016)
			(thermal_bridge_angle 0)
		)
	)
	(footprint "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder"
		(layer "F.Cu")
		(at 158.2 115.55 180)
		(descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
		(tags "capacitor handsolder")
		(property "Reference" "CA4"
			(at 0 1.5 0)
			(layer "F.SilkS")
			(hide yes)
		)
		(property "Value" "470nF"
			(at 0 1.43 0)
			(layer "F.Fab")
		)
		(property "Footprint" "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder"
			(at 0 0 180)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Datasheet" ""
			(at 0 0 180)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Description" ""
			(at 0 0 180)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(sheetname "thermocouple-channel3")
		(sheetfile "thermocouple-channel.kicad_sch")
		(attr smd)
		(fp_text user "${REFERENCE}"
			(at 0 0 0)
			(layer "F.Fab")
		)
		(pad "1" smd roundrect
			(at -0.8625 0 180)
			(size 1.075 0.95)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(roundrect_rratio 0.25)
			(net 38 "Net-(U3-IN+)")
			(pinfunction "1")
			(pintype "passive")
		)
		(pad "2" smd roundrect
			(at 0.8625 0 180)
			(size 1.075 0.95)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(roundrect_rratio 0.25)
			(net 39 "Net-(U3-IN-)")
			(pinfunction "2")
			(pintype "passive")
		)
		(model "${KICAD8_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl"
			(offset
				(xyz 0 0 0)
			)
			(scale
				(xyz 1 1 1)
			)
			(rotate
				(xyz 0 0 0)
			)
		)
	)
	(footprint "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder"
		(layer "F.Cu")
		(at 160.8875 114.65 -90)
		(descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
		(tags "capacitor handsolder")
		(property "Reference" "C10"
			(at -3.1 -0.0125 90)
			(layer "F.SilkS")
		)
		(property "Value" "47nF"
			(at 0 1.43 90)
			(layer "F.Fab")
		)
		(property "Footprint" "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder"
			(at 0 0 -90)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Datasheet" ""
			(at 0 0 -90)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Description" ""
			(at 0 0 -90)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(sheetname "thermocouple-channel3")
		(sheetfile "thermocouple-channel.kicad_sch")
		(attr smd)
		(fp_text user "${REFERENCE}"
			(at 0 0 90)
			(layer "F.Fab")
		)
		(pad "1" smd roundrect
			(at -0.8625 0 270)
			(size 1.075 0.95)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(roundrect_rratio 0.25)
			(net 1 "GND")
			(pinfunction "1")
			(pintype "passive")
		)
		(pad "2" smd roundrect
			(at 0.8625 0 270)
			(size 1.075 0.95)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(roundrect_rratio 0.25)
			(net 38 "Net-(U3-IN+)")
			(pinfunction "2")
			(pintype "passive")
		)
		(model "${KICAD8_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl"
			(offset
				(xyz 0 0 0)
			)
			(scale
				(xyz 1 1 1)
			)
			(rotate
				(xyz 0 0 0)
			)
		)
	)
	(footprint "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder"
		(layer "F.Cu")
		(at 165.7 115.55 180)
		(descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
		(tags "capacitor handsolder")
		(property "Reference" "CA5"
			(at 0 1.5 0)
			(layer "F.SilkS")
			(hide yes)
		)
		(property "Value" "470nF"
			(at 0 1.43 0)
			(layer "F.Fab")
		)
		(property "Footprint" "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder"
			(at 0 0 180)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Datasheet" ""
			(at 0 0 180)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Description" ""
			(at 0 0 180)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(sheetname "thermocouple-channel4")
		(sheetfile "thermocouple-channel.kicad_sch")
		(attr smd)
		(fp_text user "${REFERENCE}"
			(at 0 0 0)
			(layer "F.Fab")
		)
		(pad "1" smd roundrect
			(at -0.8625 0 180)
			(size 1.075 0.95)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(roundrect_rratio 0.25)
			(net 43 "Net-(U4-IN+)")
			(pinfunction "1")
			(pintype "passive")
		)
		(pad "2" smd roundrect
			(at 0.8625 0 180)
			(size 1.075 0.95)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(roundrect_rratio 0.25)
			(net 44 "Net-(U4-IN-)")
			(pinfunction "2")
			(pintype "passive")
		)
		(model "${KICAD8_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl"
			(offset
				(xyz 0 0 0)
			)
			(scale
				(xyz 1 1 1)
			)
			(rotate
				(xyz 0 0 0)
			)
		)
	)
	(footprint "adafruit:MSOP8_0.65MM"
		(layer "F.Cu")
		(at 165.7 117.975 -90)
		(descr "Source: http://www.intersil.com/data/fn/fn7833.pdf")
		(property "Reference" "U4"
			(at 3.175 -1.4375 0)
			(layer "F.SilkS")
		)
		(property "Value" "AD849X"
			(at 2.282 0.726 90)
			(layer "F.Fab")
		)
		(property "Footprint" "adafruit:MSOP8_0.65MM"
			(at 0 0 90)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Datasheet" ""
			(at 0 0 90)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Description" ""
			(at 0 0 90)
			(layer "F.Fab")
			(hide yes)
		)
		(sheetname "thermocouple-channel4")
		(sheetfile "thermocouple-channel.kicad_sch")
		(pad "1" smd rect
			(at -0.975 2.2)
			(size 1.4 0.4)
			(layers "F.Cu" "F.Paste")
			(net 44 "Net-(U4-IN-)")
			(pinfunction "IN-")
			(pintype "input")
			(solder_mask_margin 0.1016)
			(thermal_bridge_angle 0)
		)
		(pad "2" smd rect
			(at -0.325 2.2)
			(size 1.4 0.4)
			(layers "F.Cu" "F.Paste")
			(net 1 "GND")
			(pinfunction "REF")
			(pintype "input")
			(solder_mask_margin 0.1016)
			(thermal_bridge_angle 0)
		)
		(pad "3" smd rect
			(at 0.325 2.2)
			(size 1.4 0.4)
			(layers "F.Cu" "F.Paste")
			(net 1 "GND")
			(pinfunction "VS-")
			(pintype "power_in")
			(solder_mask_margin 0.1016)
			(thermal_bridge_angle 0)
		)
		(pad "4" smd rect
			(at 0.975 2.2)
			(size 1.4 0.4)
			(layers "F.Cu" "F.Paste")
			(net 53 "unconnected-(U4-NC-Pad4)")
			(pinfunction "NC")
			(pintype "no_connect")
			(solder_mask_margin 0.1016)
			(thermal_bridge_angle 0)
		)
		(pad "5" smd rect
			(at 0.975 -2.2)
			(size 1.4 0.4)
			(layers "F.Cu" "F.Paste")
			(net 8 "/A4")
			(pinfunction "SENSE")
			(pintype "bidirectional")
			(solder_mask_margin 0.1016)
			(thermal_bridge_angle 0)
		)
		(pad "6" smd rect
			(at 0.325 -2.2)
			(size 1.4 0.4)
			(layers "F.Cu" "F.Paste")
			(net 8 "/A4")
			(pinfunction "OUT")
			(pintype "output")
			(solder_mask_margin 0.1016)
			(thermal_bridge_angle 0)
		)
		(pad "7" smd rect
			(at -0.325 -2.2)
			(size 1.4 0.4)
			(layers "F.Cu" "F.Paste")
			(net 30 "VCC")
			(pinfunction "VS+")
			(pintype "power_in")
			(solder_mask_margin 0.1016)
			(thermal_bridge_angle 0)
		)
		(pad "8" smd rect
			(at -0.975 -2.2)
			(size 1.4 0.4)
			(layers "F.Cu" "F.Paste")
			(net 43 "Net-(U4-IN+)")
			(pinfunction "IN+")
			(pintype "input")
			(solder_mask_margin 0.1016)
			(thermal_bridge_angle 0)
		)
	)
	(footprint "MountingHole:MountingHole_2.5mm_Pad"
		(layer "F.Cu")
		(at 129.54 105.41 -90)
		(descr "Mounting Hole 2.5mm")
		(tags "mounting hole 2.5mm")
		(property "Reference" "U$31"
			(at 0 -3.5 -90)
			(layer "F.SilkS")
			(hide yes)
		)
		(property "Value" "MOUNTINGHOLE2.5"
			(at 0 3.5 -90)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Footprint" "MountingHole:MountingHole_2.5mm_Pad"
			(at 0 0 -90)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Datasheet" ""
			(at 0 0 -90)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Description" "Mounting Hole with connection"
			(at 0 0 -90)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(property ki_fp_filters "MountingHole*Pad*")
		(sheetname "Root")
		(sheetfile "thermocouple-feather.revA.kicad_sch")
		(attr exclude_from_pos_files exclude_from_bom)
		(fp_text user "${REFERENCE}"
			(at 0 0 -90)
			(layer "F.Fab")
		)
		(pad "1" thru_hole circle
			(at 0 0 270)
			(size 5 5)
			(drill 2.5)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 1 "GND")
			(pinfunction "1")
			(pintype "input")
		)
	)
	(footprint "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder"
		(layer "F.Cu")
		(at 150.7 115.55 180)
		(descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
		(tags "capacitor handsolder")
		(property "Reference" "CA3"
			(at 0 1.5 0)
			(layer "F.SilkS")
			(hide yes)
		)
		(property "Value" "470nF"
			(at 0 1.43 0)
			(layer "F.Fab")
		)
		(property "Footprint" "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder"
			(at 0 0 180)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Datasheet" ""
			(at 0 0 180)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Description" ""
			(at 0 0 180)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(sheetname "thermocouple-channel2")
		(sheetfile "thermocouple-channel.kicad_sch")
		(attr smd)
		(fp_text user "${REFERENCE}"
			(at 0 0 0)
			(layer "F.Fab")
		)
		(pad "1" smd roundrect
			(at -0.8625 0 180)
			(size 1.075 0.95)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(roundrect_rratio 0.25)
			(net 33 "Net-(U2-IN+)")
			(pinfunction "1")
			(pintype "passive")
		)
		(pad "2" smd roundrect
			(at 0.8625 0 180)
			(size 1.075 0.95)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(roundrect_rratio 0.25)
			(net 34 "Net-(U2-IN-)")
			(pinfunction "2")
			(pintype "passive")
		)
		(model "${KICAD8_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl"
			(offset
				(xyz 0 0 0)
			)
			(scale
				(xyz 1 1 1)
			)
			(rotate
				(xyz 0 0 0)
			)
		)
	)
	(footprint "Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder"
		(layer "F.Cu")
		(at 164.8875 112.96 -90)
		(descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
		(tags "resistor handsolder")
		(property "Reference" "RB10"
			(at -3.66 -0.25 90)
			(layer "F.SilkS")
		)
		(property "Value" "100"
			(at 0 1.43 90)
			(layer "F.Fab")
		)
		(property "Footprint" "Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder"
			(at 0 0 -90)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Datasheet" ""
			(at 0 0 -90)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Description" ""
			(at 0 0 -90)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(sheetname "thermocouple-channel4")
		(sheetfile "thermocouple-channel.kicad_sch")
		(attr smd)
		(fp_text user "${REFERENCE}"
			(at 0 0 90)
			(layer "F.Fab")
		)
		(pad "1" smd roundrect
			(at -0.9125 0 270)
			(size 0.975 0.95)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(roundrect_rratio 0.25)
			(net 48 "Net-(RA5-Pad2)")
			(pinfunction "1")
			(pintype "passive")
		)
		(pad "2" smd roundrect
			(at 0.9125 0 270)
			(size 0.975 0.95)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(roundrect_rratio 0.25)
			(net 44 "Net-(U4-IN-)")
			(pinfunction "2")
			(pintype "passive")
		)
		(model "${KICAD8_3DMODEL_DIR}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl"
			(offset
				(xyz 0 0 0)
			)
			(scale
				(xyz 1 1 1)
			)
			(rotate
				(xyz 0 0 0)
			)
		)
	)
	(footprint "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder"
		(layer "F.Cu")
		(at 145.8875 114.65 -90)
		(descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
		(tags "capacitor handsolder")
		(property "Reference" "C4"
			(at -2.6 -0.0125 90)
			(layer "F.SilkS")
		)
		(property "Value" "47nF"
			(at 0 1.43 90)
			(layer "F.Fab")
		)
		(property "Footprint" "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder"
			(at 0 0 -90)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Datasheet" ""
			(at 0 0 -90)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Description" ""
			(at 0 0 -90)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(sheetname "thermocouple-channel1")
		(sheetfile "thermocouple-channel.kicad_sch")
		(attr smd)
		(fp_text user "${REFERENCE}"
			(at 0 0 90)
			(layer "F.Fab")
		)
		(pad "1" smd roundrect
			(at -0.8625 0 270)
			(size 1.075 0.95)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(roundrect_rratio 0.25)
			(net 1 "GND")
			(pinfunction "1")
			(pintype "passive")
		)
		(pad "2" smd roundrect
			(at 0.8625 0 270)
			(size 1.075 0.95)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(roundrect_rratio 0.25)
			(net 28 "Net-(U1-IN+)")
			(pinfunction "2")
			(pintype "passive")
		)
		(model "${KICAD8_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl"
			(offset
				(xyz 0 0 0)
			)
			(scale
				(xyz 1 1 1)
			)
			(rotate
				(xyz 0 0 0)
			)
		)
	)
	(footprint "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder"
		(layer "F.Cu")
		(at 133.1375 114.65 90)
		(descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
		(tags "capacitor handsolder")
		(property "Reference" "C2"
			(at 2.6 0.0125 90)
			(layer "F.SilkS")
		)
		(property "Value" "47nF"
			(at 0 1.43 90)
			(layer "F.Fab")
		)
		(property "Footprint" "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder"
			(at 0 0 90)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Datasheet" ""
			(at 0 0 90)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Description" ""
			(at 0 0 90)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(sheetname "thermocouple-channel0")
		(sheetfile "thermocouple-channel.kicad_sch")
		(attr smd)
		(fp_text user "${REFERENCE}"
			(at 0 0 90)
			(layer "F.Fab")
		)
		(pad "1" smd roundrect
			(at -0.8625 0 90)
			(size 1.075 0.95)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(roundrect_rratio 0.25)
			(net 56 "Net-(U0-IN-)")
			(pinfunction "1")
			(pintype "passive")
		)
		(pad "2" smd roundrect
			(at 0.8625 0 90)
			(size 1.075 0.95)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(roundrect_rratio 0.25)
			(net 1 "GND")
			(pinfunction "2")
			(pintype "passive")
		)
		(model "${KICAD8_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl"
			(offset
				(xyz 0 0 0)
			)
			(scale
				(xyz 1 1 1)
			)
			(rotate
				(xyz 0 0 0)
			)
		)
	)
	(footprint "Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder"
		(layer "F.Cu")
		(at 174.1375 112.96 -90)
		(descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
		(tags "resistor handsolder")
		(property "Reference" "RB11"
			(at -3.66 0 90)
			(layer "F.SilkS")
		)
		(property "Value" "100"
			(at 0 1.43 90)
			(layer "F.Fab")
		)
		(property "Footprint" "Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder"
			(at 0 0 -90)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Datasheet" ""
			(at 0 0 -90)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Description" ""
			(at 0 0 -90)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(sheetname "thermocouple-channel5")
		(sheetfile "thermocouple-channel.kicad_sch")
		(attr smd)
		(fp_text user "${REFERENCE}"
			(at 0 0 90)
			(layer "F.Fab")
		)
		(pad "1" smd roundrect
			(at -0.9125 0 270)
			(size 0.975 0.95)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(roundrect_rratio 0.25)
			(net 52 "Net-(RB11-Pad1)")
			(pinfunction "1")
			(pintype "passive")
		)
		(pad "2" smd roundrect
			(at 0.9125 0 270)
			(size 0.975 0.95)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(roundrect_rratio 0.25)
			(net 45 "Net-(U5-IN+)")
			(pinfunction "2")
			(pintype "passive")
		)
		(model "${KICAD8_3DMODEL_DIR}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl"
			(offset
				(xyz 0 0 0)
			)
			(scale
				(xyz 1 1 1)
			)
			(rotate
				(xyz 0 0 0)
			)
		)
	)
	(footprint "adafruit:MSOP8_0.65MM"
		(layer "F.Cu")
		(at 158.2 117.975 -90)
		(descr "Source: http://www.intersil.com/data/fn/fn7833.pdf")
		(property "Reference" "U3"
			(at 3.175 -1.4375 0)
			(layer "F.SilkS")
		)
		(property "Value" "AD849X"
			(at 2.282 0.726 90)
			(layer "F.Fab")
		)
		(property "Footprint" "adafruit:MSOP8_0.65MM"
			(at 0 0 90)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Datasheet" ""
			(at 0 0 90)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Description" ""
			(at 0 0 90)
			(layer "F.Fab")
			(hide yes)
		)
		(sheetname "thermocouple-channel3")
		(sheetfile "thermocouple-channel.kicad_sch")
		(pad "1" smd rect
			(at -0.975 2.2)
			(size 1.4 0.4)
			(layers "F.Cu" "F.Paste")
			(net 39 "Net-(U3-IN-)")
			(pinfunction "IN-")
			(pintype "input")
			(solder_mask_margin 0.1016)
			(thermal_bridge_angle 0)
		)
		(pad "2" smd rect
			(at -0.325 2.2)
			(size 1.4 0.4)
			(layers "F.Cu" "F.Paste")
			(net 1 "GND")
			(pinfunction "REF")
			(pintype "input")
			(solder_mask_margin 0.1016)
			(thermal_bridge_angle 0)
		)
		(pad "3" smd rect
			(at 0.325 2.2)
			(size 1.4 0.4)
			(layers "F.Cu" "F.Paste")
			(net 1 "GND")
			(pinfunction "VS-")
			(pintype "power_in")
			(solder_mask_margin 0.1016)
			(thermal_bridge_angle 0)
		)
		(pad "4" smd rect
			(at 0.975 2.2)
			(size 1.4 0.4)
			(layers "F.Cu" "F.Paste")
			(net 42 "unconnected-(U3-NC-Pad4)")
			(pinfunction "NC")
			(pintype "no_connect")
			(solder_mask_margin 0.1016)
			(thermal_bridge_angle 0)
		)
		(pad "5" smd rect
			(at 0.975 -2.2)
			(size 1.4 0.4)
			(layers "F.Cu" "F.Paste")
			(net 9 "/A3")
			(pinfunction "SENSE")
			(pintype "bidirectional")
			(solder_mask_margin 0.1016)
			(thermal_bridge_angle 0)
		)
		(pad "6" smd rect
			(at 0.325 -2.2)
			(size 1.4 0.4)
			(layers "F.Cu" "F.Paste")
			(net 9 "/A3")
			(pinfunction "OUT")
			(pintype "output")
			(solder_mask_margin 0.1016)
			(thermal_bridge_angle 0)
		)
		(pad "7" smd rect
			(at -0.325 -2.2)
			(size 1.4 0.4)
			(layers "F.Cu" "F.Paste")
			(net 30 "VCC")
			(pinfunction "VS+")
			(pintype "power_in")
			(solder_mask_margin 0.1016)
			(thermal_bridge_angle 0)
		)
		(pad "8" smd rect
			(at -0.975 -2.2)
			(size 1.4 0.4)
			(layers "F.Cu" "F.Paste")
			(net 38 "Net-(U3-IN+)")
			(pinfunction "IN+")
			(pintype "input")
			(solder_mask_margin 0.1016)
			(thermal_bridge_angle 0)
		)
	)
	(footprint "adafruit:MSOP8_0.65MM"
		(layer "F.Cu")
		(at 173.2 117.975 -90)
		(descr "Source: http://www.intersil.com/data/fn/fn7833.pdf")
		(property "Reference" "U5"
			(at 3.175 -1.4375 0)
			(layer "F.SilkS")
		)
		(property "Value" "AD849X"
			(at 2.282 0.726 90)
			(layer "F.Fab")
		)
		(property "Footprint" "adafruit:MSOP8_0.65MM"
			(at 0 0 90)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Datasheet" ""
			(at 0 0 90)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Description" ""
			(at 0 0 90)
			(layer "F.Fab")
			(hide yes)
		)
		(sheetname "thermocouple-channel5")
		(sheetfile "thermocouple-channel.kicad_sch")
		(pad "1" smd rect
			(at -0.975 2.2)
			(size 1.4 0.4)
			(layers "F.Cu" "F.Paste")
			(net 46 "Net-(U5-IN-)")
			(pinfunction "IN-")
			(pintype "input")
			(solder_mask_margin 0.1016)
			(thermal_bridge_angle 0)
		)
		(pad "2" smd rect
			(at -0.325 2.2)
			(size 1.4 0.4)
			(layers "F.Cu" "F.Paste")
			(net 1 "GND")
			(pinfunction "REF")
			(pintype "input")
			(solder_mask_margin 0.1016)
			(thermal_bridge_angle 0)
		)
		(pad "3" smd rect
			(at 0.325 2.2)
			(size 1.4 0.4)
			(layers "F.Cu" "F.Paste")
			(net 1 "GND")
			(pinfunction "VS-")
			(pintype "power_in")
			(solder_mask_margin 0.1016)
			(thermal_bridge_angle 0)
		)
		(pad "4" smd rect
			(at 0.975 2.2)
			(size 1.4 0.4)
			(layers "F.Cu" "F.Paste")
			(net 54 "unconnected-(U5-NC-Pad4)")
			(pinfunction "NC")
			(pintype "no_connect")
			(solder_mask_margin 0.1016)
			(thermal_bridge_angle 0)
		)
		(pad "5" smd rect
			(at 0.975 -2.2)
			(size 1.4 0.4)
			(layers "F.Cu" "F.Paste")
			(net 6 "/A5")
			(pinfunction "SENSE")
			(pintype "bidirectional")
			(solder_mask_margin 0.1016)
			(thermal_bridge_angle 0)
		)
		(pad "6" smd rect
			(at 0.325 -2.2)
			(size 1.4 0.4)
			(layers "F.Cu" "F.Paste")
			(net 6 "/A5")
			(pinfunction "OUT")
			(pintype "output")
			(solder_mask_margin 0.1016)
			(thermal_bridge_angle 0)
		)
		(pad "7" smd rect
			(at -0.325 -2.2)
			(size 1.4 0.4)
			(layers "F.Cu" "F.Paste")
			(net 30 "VCC")
			(pinfunction "VS+")
			(pintype "power_in")
			(solder_mask_margin 0.1016)
			(thermal_bridge_angle 0)
		)
		(pad "8" smd rect
			(at -0.975 -2.2)
			(size 1.4 0.4)
			(layers "F.Cu" "F.Paste")
			(net 45 "Net-(U5-IN+)")
			(pinfunction "IN+")
			(pintype "input")
			(solder_mask_margin 0.1016)
			(thermal_bridge_angle 0)
		)
	)
	(footprint "Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder"
		(layer "F.Cu")
		(at 151.6375 112.96 -90)
		(descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
		(tags "resistor handsolder")
		(property "Reference" "RB5"
			(at -3.06 0 90)
			(layer "F.SilkS")
		)
		(property "Value" "100"
			(at 0 1.43 90)
			(layer "F.Fab")
		)
		(property "Footprint" "Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder"
			(at 0 0 -90)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Datasheet" ""
			(at 0 0 -90)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Description" ""
			(at 0 0 -90)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(sheetname "thermocouple-channel2")
		(sheetfile "thermocouple-channel.kicad_sch")
		(attr smd)
		(fp_text user "${REFERENCE}"
			(at 0 0 90)
			(layer "F.Fab")
		)
		(pad "1" smd roundrect
			(at -0.9125 0 270)
			(size 0.975 0.95)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(roundrect_rratio 0.25)
			(net 41 "Net-(RB5-Pad1)")
			(pinfunction "1")
			(pintype "passive")
		)
		(pad "2" smd roundrect
			(at 0.9125 0 270)
			(size 0.975 0.95)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(roundrect_rratio 0.25)
			(net 33 "Net-(U2-IN+)")
			(pinfunction "2")
			(pintype "passive")
		)
		(model "${KICAD8_3DMODEL_DIR}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl"
			(offset
				(xyz 0 0 0)
			)
			(scale
				(xyz 1 1 1)
			)
			(rotate
				(xyz 0 0 0)
			)
		)
	)
	(footprint "Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder"
		(layer "F.Cu")
		(at 166.6375 112.96 -90)
		(descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
		(tags "resistor handsolder")
		(property "Reference" "RB9"
			(at -3.06 0 90)
			(layer "F.SilkS")
		)
		(property "Value" "100"
			(at 0 1.43 90)
			(layer "F.Fab")
		)
		(property "Footprint" "Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder"
			(at 0 0 -90)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Datasheet" ""
			(at 0 0 -90)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Description" ""
			(at 0 0 -90)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(sheetname "thermocouple-channel4")
		(sheetfile "thermocouple-channel.kicad_sch")
		(attr smd)
		(fp_text user "${REFERENCE}"
			(at 0 0 90)
			(layer "F.Fab")
		)
		(pad "1" smd roundrect
			(at -0.9125 0 270)
			(size 0.975 0.95)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(roundrect_rratio 0.25)
			(net 51 "Net-(RB9-Pad1)")
			(pinfunction "1")
			(pintype "passive")
		)
		(pad "2" smd roundrect
			(at 0.9125 0 270)
			(size 0.975 0.95)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(roundrect_rratio 0.25)
			(net 43 "Net-(U4-IN+)")
			(pinfunction "2")
			(pintype "passive")
		)
		(model "${KICAD8_3DMODEL_DIR}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl"
			(offset
				(xyz 0 0 0)
			)
			(scale
				(xyz 1 1 1)
			)
			(rotate
				(xyz 0 0 0)
			)
		)
	)
	(footprint "MountingHole:MountingHole_2.5mm_Pad"
		(layer "F.Cu")
		(at 129.54 123.19 -90)
		(descr "Mounting Hole 2.5mm")
		(tags "mounting hole 2.5mm")
		(property "Reference" "U$32"
			(at 0 -3.5 -90)
			(layer "F.SilkS")
			(hide yes)
		)
		(property "Value" "MOUNTINGHOLE2.5"
			(at 0 3.5 -90)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Footprint" "MountingHole:MountingHole_2.5mm_Pad"
			(at 0 0 -90)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Datasheet" ""
			(at 0 0 -90)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Description" "Mounting Hole with connection"
			(at 0 0 -90)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(property ki_fp_filters "MountingHole*Pad*")
		(sheetname "Root")
		(sheetfile "thermocouple-feather.revA.kicad_sch")
		(attr exclude_from_pos_files exclude_from_bom)
		(fp_text user "${REFERENCE}"
			(at 0 0 -90)
			(layer "F.Fab")
		)
		(pad "1" thru_hole circle
			(at 0 0 270)
			(size 5 5)
			(drill 2.5)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 1 "GND")
			(pinfunction "1")
			(pintype "input")
		)
	)
	(footprint "kicad-mza:TestPoint_THTPad_1mm-round"
		(layer "F.Cu")
		(at 173.1375 120.65)
		(descr "THT rectangular pad as test Point, square 2.0mm_Drill1.0mm  side length, hole diameter 1.0mm")
		(tags "test point THT pad rectangle square")
		(property "Reference" "V5"
			(at -2 0 0)
			(layer "F.SilkS")
		)
		(property "Value" "~"
			(at 0 -2 360)
			(layer "F.Fab")
		)
		(property "Footprint" "kicad-mza:TestPoint_THTPad_1mm-round"
			(at 0 0 0)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Datasheet" ""
			(at 0 0 0)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Description" "test point"
			(at 0 0 0)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(property ki_fp_filters "Pin* Test*")
		(sheetname "thermocouple-channel5")
		(sheetfile "thermocouple-channel.kicad_sch")
		(attr exclude_from_pos_files)
		(fp_text user "${REFERENCE}"
			(at 0 -1.998 360)
			(layer "F.SilkS")
			(hide yes)
		)
		(pad "1" thru_hole circle
			(at 0 0)
			(size 2 2)
			(drill 1)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 6 "/A5")
			(pinfunction "1")
			(pintype "passive")
		)
	)
	(footprint "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder"
		(layer "F.Cu")
		(at 140.6375 114.65 90)
		(descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
		(tags "capacitor handsolder")
		(property "Reference" "C5"
			(at 2.6 0.0125 90)
			(layer "F.SilkS")
		)
		(property "Value" "47nF"
			(at 0 1.43 90)
			(layer "F.Fab")
		)
		(property "Footprint" "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder"
			(at 0 0 90)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Datasheet" ""
			(at 0 0 90)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Description" ""
			(at 0 0 90)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(sheetname "thermocouple-channel1")
		(sheetfile "thermocouple-channel.kicad_sch")
		(attr smd)
		(fp_text user "${REFERENCE}"
			(at 0 0 90)
			(layer "F.Fab")
		)
		(pad "1" smd roundrect
			(at -0.8625 0 90)
			(size 1.075 0.95)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(roundrect_rratio 0.25)
			(net 27 "Net-(U1-IN-)")
			(pinfunction "1")
			(pintype "passive")
		)
		(pad "2" smd roundrect
			(at 0.8625 0 90)
			(size 1.075 0.95)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(roundrect_rratio 0.25)
			(net 1 "GND")
			(pinfunction "2")
			(pintype "passive")
		)
		(model "${KICAD8_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl"
			(offset
				(xyz 0 0 0)
			)
			(scale
				(xyz 1 1 1)
			)
			(rotate
				(xyz 0 0 0)
			)
		)
	)
	(footprint "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder"
		(layer "F.Cu")
		(at 148.1375 114.65 90)
		(descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
		(tags "capacitor handsolder")
		(property "Reference" "C8"
			(at 2.6 0.0125 90)
			(layer "F.SilkS")
		)
		(property "Value" "47nF"
			(at 0 1.43 90)
			(layer "F.Fab")
		)
		(property "Footprint" "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder"
			(at 0 0 90)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Datasheet" ""
			(at 0 0 90)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Description" ""
			(at 0 0 90)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(sheetname "thermocouple-channel2")
		(sheetfile "thermocouple-channel.kicad_sch")
		(attr smd)
		(fp_text user "${REFERENCE}"
			(at 0 0 90)
			(layer "F.Fab")
		)
		(pad "1" smd roundrect
			(at -0.8625 0 90)
			(size 1.075 0.95)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(roundrect_rratio 0.25)
			(net 34 "Net-(U2-IN-)")
			(pinfunction "1")
			(pintype "passive")
		)
		(pad "2" smd roundrect
			(at 0.8625 0 90)
			(size 1.075 0.95)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(roundrect_rratio 0.25)
			(net 1 "GND")
			(pinfunction "2")
			(pintype "passive")
		)
		(model "${KICAD8_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl"
			(offset
				(xyz 0 0 0)
			)
			(scale
				(xyz 1 1 1)
			)
			(rotate
				(xyz 0 0 0)
			)
		)
	)
	(footprint "Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder"
		(layer "F.Cu")
		(at 136.6375 112.96 -90)
		(descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
		(tags "resistor handsolder")
		(property "Reference" "RB1"
			(at -3.06 0 90)
			(layer "F.SilkS")
		)
		(property "Value" "100"
			(at 0 1.43 90)
			(layer "F.Fab")
		)
		(property "Footprint" "Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder"
			(at 0 0 -90)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Datasheet" ""
			(at 0 0 -90)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Description" ""
			(at 0 0 -90)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(sheetname "thermocouple-channel0")
		(sheetfile "thermocouple-channel.kicad_sch")
		(attr smd)
		(fp_text user "${REFERENCE}"
			(at 0 0 90)
			(layer "F.Fab")
		)
		(pad "1" smd roundrect
			(at -0.9125 0 270)
			(size 0.975 0.95)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(roundrect_rratio 0.25)
			(net 31 "Net-(RB1-Pad1)")
			(pinfunction "1")
			(pintype "passive")
		)
		(pad "2" smd roundrect
			(at 0.9125 0 270)
			(size 0.975 0.95)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(roundrect_rratio 0.25)
			(net 55 "Net-(U0-IN+)")
			(pinfunction "2")
			(pintype "passive")
		)
		(model "${KICAD8_3DMODEL_DIR}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl"
			(offset
				(xyz 0 0 0)
			)
			(scale
				(xyz 1 1 1)
			)
			(rotate
				(xyz 0 0 0)
			)
		)
	)
	(footprint "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder"
		(layer "F.Cu")
		(at 138.3875 114.65 -90)
		(descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
		(tags "capacitor handsolder")
		(property "Reference" "C1"
			(at -2.6 -0.0125 90)
			(layer "F.SilkS")
		)
		(property "Value" "47nF"
			(at 0 1.43 90)
			(layer "F.Fab")
		)
		(property "Footprint" "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder"
			(at 0 0 -90)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Datasheet" ""
			(at 0 0 -90)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Description" ""
			(at 0 0 -90)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(sheetname "thermocouple-channel0")
		(sheetfile "thermocouple-channel.kicad_sch")
		(attr smd)
		(fp_text user "${REFERENCE}"
			(at 0 0 90)
			(layer "F.Fab")
		)
		(pad "1" smd roundrect
			(at -0.8625 0 270)
			(size 1.075 0.95)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(roundrect_rratio 0.25)
			(net 1 "GND")
			(pinfunction "1")
			(pintype "passive")
		)
		(pad "2" smd roundrect
			(at 0.8625 0 270)
			(size 1.075 0.95)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(roundrect_rratio 0.25)
			(net 55 "Net-(U0-IN+)")
			(pinfunction "2")
			(pintype "passive")
		)
		(model "${KICAD8_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl"
			(offset
				(xyz 0 0 0)
			)
			(scale
				(xyz 1 1 1)
			)
			(rotate
				(xyz 0 0 0)
			)
		)
	)
	(footprint "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder"
		(layer "F.Cu")
		(at 168.3875 114.65 -90)
		(descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
		(tags "capacitor handsolder")
		(property "Reference" "C13"
			(at -3.1 -0.0125 90)
			(layer "F.SilkS")
		)
		(property "Value" "47nF"
			(at 0 1.43 90)
			(layer "F.Fab")
		)
		(property "Footprint" "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder"
			(at 0 0 -90)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Datasheet" ""
			(at 0 0 -90)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Description" ""
			(at 0 0 -90)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(sheetname "thermocouple-channel4")
		(sheetfile "thermocouple-channel.kicad_sch")
		(attr smd)
		(fp_text user "${REFERENCE}"
			(at 0 0 90)
			(layer "F.Fab")
		)
		(pad "1" smd roundrect
			(at -0.8625 0 270)
			(size 1.075 0.95)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(roundrect_rratio 0.25)
			(net 1 "GND")
			(pinfunction "1")
			(pintype "passive")
		)
		(pad "2" smd roundrect
			(at 0.8625 0 270)
			(size 1.075 0.95)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(roundrect_rratio 0.25)
			(net 43 "Net-(U4-IN+)")
			(pinfunction "2")
			(pintype "passive")
		)
		(model "${KICAD8_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl"
			(offset
				(xyz 0 0 0)
			)
			(scale
				(xyz 1 1 1)
			)
			(rotate
				(xyz 0 0 0)
			)
		)
	)
	(footprint "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder"
		(layer "F.Cu")
		(at 155.6375 114.65 90)
		(descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
		(tags "capacitor handsolder")
		(property "Reference" "C11"
			(at 3.1 0.0125 90)
			(layer "F.SilkS")
		)
		(property "Value" "47nF"
			(at 0 1.43 90)
			(layer "F.Fab")
		)
		(property "Footprint" "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder"
			(at 0 0 90)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Datasheet" ""
			(at 0 0 90)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Description" ""
			(at 0 0 90)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(sheetname "thermocouple-channel3")
		(sheetfile "thermocouple-channel.kicad_sch")
		(attr smd)
		(fp_text user "${REFERENCE}"
			(at 0 0 90)
			(layer "F.Fab")
		)
		(pad "1" smd roundrect
			(at -0.8625 0 90)
			(size 1.075 0.95)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(roundrect_rratio 0.25)
			(net 39 "Net-(U3-IN-)")
			(pinfunction "1")
			(pintype "passive")
		)
		(pad "2" smd roundrect
			(at 0.8625 0 90)
			(size 1.075 0.95)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(roundrect_rratio 0.25)
			(net 1 "GND")
			(pinfunction "2")
			(pintype "passive")
		)
		(model "${KICAD8_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl"
			(offset
				(xyz 0 0 0)
			)
			(scale
				(xyz 1 1 1)
			)
			(rotate
				(xyz 0 0 0)
			)
		)
	)
	(footprint "Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder"
		(layer "F.Cu")
		(at 157.3875 112.96 -90)
		(descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
		(tags "resistor handsolder")
		(property "Reference" "RB8"
			(at -3.06 -0.25 90)
			(layer "F.SilkS")
		)
		(property "Value" "100"
			(at 0 1.43 90)
			(layer "F.Fab")
		)
		(property "Footprint" "Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder"
			(at 0 0 -90)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Datasheet" ""
			(at 0 0 -90)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Description" ""
			(at 0 0 -90)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(sheetname "thermocouple-channel3")
		(sheetfile "thermocouple-channel.kicad_sch")
		(attr smd)
		(fp_text user "${REFERENCE}"
			(at 0 0 90)
			(layer "F.Fab")
		)
		(pad "1" smd roundrect
			(at -0.9125 0 270)
			(size 0.975 0.95)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(roundrect_rratio 0.25)
			(net 47 "Net-(RA4-Pad2)")
			(pinfunction "1")
			(pintype "passive")
		)
		(pad "2" smd roundrect
			(at 0.9125 0 270)
			(size 0.975 0.95)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(roundrect_rratio 0.25)
			(net 39 "Net-(U3-IN-)")
			(pinfunction "2")
			(pintype "passive")
		)
		(model "${KICAD8_3DMODEL_DIR}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl"
			(offset
				(xyz 0 0 0)
			)
			(scale
				(xyz 1 1 1)
			)
			(rotate
				(xyz 0 0 0)
			)
		)
	)
	(footprint "kicad-mza:TestPoint_THTPad_1mm-round"
		(layer "F.Cu")
		(at 150.6375 120.65)
		(descr "THT rectangular pad as test Point, square 2.0mm_Drill1.0mm  side length, hole diameter 1.0mm")
		(tags "test point THT pad rectangle square")
		(property "Reference" "V2"
			(at -2 0 0)
			(layer "F.SilkS")
		)
		(property "Value" "~"
			(at 0 -2 360)
			(layer "F.Fab")
		)
		(property "Footprint" "kicad-mza:TestPoint_THTPad_1mm-round"
			(at 0 0 0)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Datasheet" ""
			(at 0 0 0)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Description" "test point"
			(at 0 0 0)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(property ki_fp_filters "Pin* Test*")
		(sheetname "thermocouple-channel2")
		(sheetfile "thermocouple-channel.kicad_sch")
		(attr exclude_from_pos_files)
		(fp_text user "${REFERENCE}"
			(at 0 -1.998 360)
			(layer "F.SilkS")
			(hide yes)
		)
		(pad "1" thru_hole circle
			(at 0 0)
			(size 2 2)
			(drill 1)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 14 "/A2")
			(pinfunction "1")
			(pintype "passive")
		)
	)
	(footprint "kicad-mza:TestPoint_THTPad_1mm-round"
		(layer "F.Cu")
		(at 135.6375 120.65)
		(descr "THT rectangular pad as test Point, square 2.0mm_Drill1.0mm  side length, hole diameter 1.0mm")
		(tags "test point THT pad rectangle square")
		(property "Reference" "V0"
			(at -2.1375 -0.25 360)
			(layer "F.SilkS")
		)
		(property "Value" "~"
			(at -2 0 0)
			(layer "F.SilkS")
			(hide yes)
		)
		(property "Footprint" "kicad-mza:TestPoint_THTPad_1mm-round"
			(at 0 0 0)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Datasheet" ""
			(at 0 0 0)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Description" "test point"
			(at 0 0 0)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(property ki_fp_filters "Pin* Test*")
		(sheetname "thermocouple-channel0")
		(sheetfile "thermocouple-channel.kicad_sch")
		(attr exclude_from_pos_files)
		(fp_text user "${REFERENCE}"
			(at 0 -2 360)
			(layer "F.Fab")
		)
		(pad "1" thru_hole circle
			(at 0 0)
			(size 2 2)
			(drill 1)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 7 "/A0")
			(pinfunction "1")
			(pintype "passive")
		)
	)
	(footprint "Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder"
		(layer "F.Cu")
		(at 142.3875 112.96 -90)
		(descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
		(tags "resistor handsolder")
		(property "Reference" "RB4"
			(at -3.06 -0.25 90)
			(layer "F.SilkS")
		)
		(property "Value" "100"
			(at 0 1.43 90)
			(layer "F.Fab")
		)
		(property "Footprint" "Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder"
			(at 0 0 -90)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Datasheet" ""
			(at 0 0 -90)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Description" ""
			(at 0 0 -90)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(sheetname "thermocouple-channel1")
		(sheetfile "thermocouple-channel.kicad_sch")
		(attr smd)
		(fp_text user "${REFERENCE}"
			(at 0 0 90)
			(layer "F.Fab")
		)
		(pad "1" smd roundrect
			(at -0.9125 0 270)
			(size 0.975 0.95)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(roundrect_rratio 0.25)
			(net 35 "Net-(RA2-Pad2)")
			(pinfunction "1")
			(pintype "passive")
		)
		(pad "2" smd roundrect
			(at 0.9125 0 270)
			(size 0.975 0.95)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(roundrect_rratio 0.25)
			(net 27 "Net-(U1-IN-)")
			(pinfunction "2")
			(pintype "passive")
		)
		(model "${KICAD8_3DMODEL_DIR}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl"
			(offset
				(xyz 0 0 0)
			)
			(scale
				(xyz 1 1 1)
			)
			(rotate
				(xyz 0 0 0)
			)
		)
	)
	(footprint "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder"
		(layer "F.Cu")
		(at 153.3875 114.65 -90)
		(descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
		(tags "capacitor handsolder")
		(property "Reference" "C7"
			(at -2.6 -0.0125 90)
			(layer "F.SilkS")
		)
		(property "Value" "47nF"
			(at 0 1.43 90)
			(layer "F.Fab")
		)
		(property "Footprint" "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder"
			(at 0 0 -90)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Datasheet" ""
			(at 0 0 -90)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Description" ""
			(at 0 0 -90)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(sheetname "thermocouple-channel2")
		(sheetfile "thermocouple-channel.kicad_sch")
		(attr smd)
		(fp_text user "${REFERENCE}"
			(at 0 0 90)
			(layer "F.Fab")
		)
		(pad "1" smd roundrect
			(at -0.8625 0 270)
			(size 1.075 0.95)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(roundrect_rratio 0.25)
			(net 1 "GND")
			(pinfunction "1")
			(pintype "passive")
		)
		(pad "2" smd roundrect
			(at 0.8625 0 270)
			(size 1.075 0.95)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(roundrect_rratio 0.25)
			(net 33 "Net-(U2-IN+)")
			(pinfunction "2")
			(pintype "passive")
		)
		(model "${KICAD8_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl"
			(offset
				(xyz 0 0 0)
			)
			(scale
				(xyz 1 1 1)
			)
			(rotate
				(xyz 0 0 0)
			)
		)
	)
	(footprint "Adafruit ESP32-S3 8MB No PSRAM:1X16_ROUND"
		(layer "F.Cu")
		(at 152.4 124.46 180)
		(descr "PIN HEADER")
		(property "Reference" "JP1"
			(at -10.4989 -4.7114 0)
			(layer "F.SilkS")
			(hide yes)
		)
		(property "Value" "HEADER-1X16ROUND"
			(at -1.4989 -2.5864 0)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Footprint" "Adafruit ESP32-S3 8MB No PSRAM:1X16_ROUND"
			(at 0 0 180)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Datasheet" ""
			(at 0 0 180)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Description" ""
			(at 0 0 180)
			(layer "F.Fab")
			(hide yes)
		)
		(sheetname "Root")
		(sheetfile "thermocouple-feather.revA.kicad_sch")
		(pad "1" thru_hole circle
			(at -19.05 0 270)
			(size 1.6764 1.6764)
			(drill 1)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 12 "/TXD0")
			(pinfunction "1")
			(pintype "passive")
			(solder_mask_margin 0.0508)
			(thermal_bridge_angle 0)
		)
		(pad "2" thru_hole circle
			(at -16.51 0 270)
			(size 1.6764 1.6764)
			(drill 1)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 10 "/TX")
			(pinfunction "2")
			(pintype "passive")
			(solder_mask_margin 0.0508)
			(thermal_bridge_angle 0)
		)
		(pad "3" thru_hole circle
			(at -13.97 0 270)
			(size 1.6764 1.6764)
			(drill 1)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 13 "/RX")
			(pinfunction "3")
			(pintype "passive")
			(solder_mask_margin 0.0508)
			(thermal_bridge_angle 0)
		)
		(pad "4" thru_hole circle
			(at -11.43 0 270)
			(size 1.6764 1.6764)
			(drill 1)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 15 "/MISO")
			(pinfunction "4")
			(pintype "passive")
			(solder_mask_margin 0.0508)
			(thermal_bridge_angle 0)
		)
		(pad "5" thru_hole circle
			(at -8.89 0 270)
			(size 1.6764 1.6764)
			(drill 1)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 4 "/MOSI")
			(pinfunction "5")
			(pintype "passive")
			(solder_mask_margin 0.0508)
			(thermal_bridge_angle 0)
		)
		(pad "6" thru_hole circle
			(at -6.35 0 270)
			(size 1.6764 1.6764)
			(drill 1)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 5 "/SCK")
			(pinfunction "6")
			(pintype "passive")
			(solder_mask_margin 0.0508)
			(thermal_bridge_angle 0)
		)
		(pad "7" thru_hole circle
			(at -3.81 0 270)
			(size 1.6764 1.6764)
			(drill 1)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 6 "/A5")
			(pinfunction "7")
			(pintype "passive")
			(solder_mask_margin 0.0508)
			(thermal_bridge_angle 0)
		)
		(pad "8" thru_hole circle
			(at -1.27 0 270)
			(size 1.6764 1.6764)
			(drill 1)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 8 "/A4")
			(pinfunction "8")
			(pintype "passive")
			(solder_mask_margin 0.0508)
			(thermal_bridge_angle 0)
		)
		(pad "9" thru_hole circle
			(at 1.27 0 270)
			(size 1.6764 1.6764)
			(drill 1)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 9 "/A3")
			(pinfunction "9")
			(pintype "passive")
			(solder_mask_margin 0.0508)
			(thermal_bridge_angle 0)
		)
		(pad "10" thru_hole circle
			(at 3.81 0 270)
			(size 1.6764 1.6764)
			(drill 1)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 14 "/A2")
			(pinfunction "10")
			(pintype "passive")
			(solder_mask_margin 0.0508)
			(thermal_bridge_angle 0)
		)
		(pad "11" thru_hole circle
			(at 6.35 0 270)
			(size 1.6764 1.6764)
			(drill 1)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 11 "/A1")
			(pinfunction "11")
			(pintype "passive")
			(solder_mask_margin 0.0508)
			(thermal_bridge_angle 0)
		)
		(pad "12" thru_hole circle
			(at 8.89 0 270)
			(size 1.6764 1.6764)
			(drill 1)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 7 "/A0")
			(pinfunction "12")
			(pintype "passive")
			(solder_mask_margin 0.0508)
			(thermal_bridge_angle 0)
		)
		(pad "13" thru_hole circle
			(at 11.43 0 270)
			(size 1.6764 1.6764)
			(drill 1)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 1 "GND")
			(pinfunction "13")
			(pintype "passive")
			(solder_mask_margin 0.0508)
			(thermal_bridge_angle 0)
		)
		(pad "14" thru_hole circle
			(at 13.97 0 270)
			(size 1.6764 1.6764)
			(drill 1)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 30 "VCC")
			(pinfunction "14")
			(pintype "passive")
			(solder_mask_margin 0.0508)
			(thermal_bridge_angle 0)
		)
		(pad "15" thru_hole circle
			(at 16.51 0 270)
			(size 1.6764 1.6764)
			(drill 1)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 30 "VCC")
			(pinfunction "15")
			(pintype "passive")
			(solder_mask_margin 0.0508)
			(thermal_bridge_angle 0)
		)
		(pad "16" thru_hole circle
			(at 19.05 0 270)
			(size 1.6764 1.6764)
			(drill 1)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 16 "/RESET")
			(pinfunction "16")
			(pintype "passive")
			(solder_mask_margin 0.0508)
			(thermal_bridge_angle 0)
		)
	)
	(footprint "Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder"
		(layer "F.Cu")
		(at 134.8875 112.96 -90)
		(descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
		(tags "resistor handsolder")
		(property "Reference" "RB2"
			(at -3.06 -0.25 90)
			(layer "F.SilkS")
		)
		(property "Value" "100"
			(at 0 1.43 90)
			(layer "F.Fab")
		)
		(property "Footprint" "Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder"
			(at 0 0 -90)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Datasheet" ""
			(at 0 0 -90)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Description" ""
			(at 0 0 -90)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(sheetname "thermocouple-channel0")
		(sheetfile "thermocouple-channel.kicad_sch")
		(attr smd)
		(fp_text user "${REFERENCE}"
			(at 0 0 90)
			(layer "F.Fab")
		)
		(pad "1" smd roundrect
			(at -0.9125 0 270)
			(size 0.975 0.95)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(roundrect_rratio 0.25)
			(net 32 "Net-(RA1-Pad2)")
			(pinfunction "1")
			(pintype "passive")
		)
		(pad "2" smd roundrect
			(at 0.9125 0 270)
			(size 0.975 0.95)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(roundrect_rratio 0.25)
			(net 56 "Net-(U0-IN-)")
			(pinfunction "2")
			(pintype "passive")
		)
		(model "${KICAD8_3DMODEL_DIR}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl"
			(offset
				(xyz 0 0 0)
			)
			(scale
				(xyz 1 1 1)
			)
			(rotate
				(xyz 0 0 0)
			)
		)
	)
	(footprint "kicad-mza:TestPoint_THTPad_1mm-round"
		(layer "F.Cu")
		(at 143.1375 120.65)
		(descr "THT rectangular pad as test Point, square 2.0mm_Drill1.0mm  side length, hole diameter 1.0mm")
		(tags "test point THT pad rectangle square")
		(property "Reference" "V1"
			(at -2 0 0)
			(layer "F.SilkS")
		)
		(property "Value" "~"
			(at 0 -2 360)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Footprint" "kicad-mza:TestPoint_THTPad_1mm-round"
			(at 0 0 0)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Datasheet" ""
			(at 0 0 0)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Description" "test point"
			(at 0 0 0)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(property ki_fp_filters "Pin* Test*")
		(sheetname "thermocouple-channel1")
		(sheetfile "thermocouple-channel.kicad_sch")
		(attr exclude_from_pos_files)
		(fp_text user "${REFERENCE}"
			(at 0 -1.998 360)
			(layer "F.SilkS")
			(hide yes)
		)
		(pad "1" thru_hole circle
			(at 0 0)
			(size 2 2)
			(drill 1)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 11 "/A1")
			(pinfunction "1")
			(pintype "passive")
		)
	)
	(footprint "adafruit:MSOP8_0.65MM"
		(layer "F.Cu")
		(at 143.2 117.975 -90)
		(descr "Source: http://www.intersil.com/data/fn/fn7833.pdf")
		(property "Reference" "U1"
			(at 3.175 -1.4375 0)
			(layer "F.SilkS")
		)
		(property "Value" "AD849X"
			(at 2.282 0.726 90)
			(layer "F.Fab")
		)
		(property "Footprint" "adafruit:MSOP8_0.65MM"
			(at 0 0 -90)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Datasheet" ""
			(at 0 0 -90)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Description" ""
			(at 0 0 -90)
			(layer "F.Fab")
			(hide yes)
		)
		(sheetname "thermocouple-channel1")
		(sheetfile "thermocouple-channel.kicad_sch")
		(pad "1" smd rect
			(at -0.975 2.2)
			(size 1.4 0.4)
			(layers "F.Cu" "F.Paste")
			(net 27 "Net-(U1-IN-)")
			(pinfunction "IN-")
			(pintype "input")
			(solder_mask_margin 0.1016)
			(thermal_bridge_angle 0)
		)
		(pad "2" smd rect
			(at -0.325 2.2)
			(size 1.4 0.4)
			(layers "F.Cu" "F.Paste")
			(net 1 "GND")
			(pinfunction "REF")
			(pintype "input")
			(solder_mask_margin 0.1016)
			(thermal_bridge_angle 0)
		)
		(pad "3" smd rect
			(at 0.325 2.2)
			(size 1.4 0.4)
			(layers "F.Cu" "F.Paste")
			(net 1 "GND")
			(pinfunction "VS-")
			(pintype "power_in")
			(solder_mask_margin 0.1016)
			(thermal_bridge_angle 0)
		)
		(pad "4" smd rect
			(at 0.975 2.2)
			(size 1.4 0.4)
			(layers "F.Cu" "F.Paste")
			(net 29 "unconnected-(U1-NC-Pad4)")
			(pinfunction "NC")
			(pintype "no_connect")
			(solder_mask_margin 0.1016)
			(thermal_bridge_angle 0)
		)
		(pad "5" smd rect
			(at 0.975 -2.2)
			(size 1.4 0.4)
			(layers "F.Cu" "F.Paste")
			(net 11 "/A1")
			(pinfunction "SENSE")
			(pintype "bidirectional")
			(solder_mask_margin 0.1016)
			(thermal_bridge_angle 0)
		)
		(pad "6" smd rect
			(at 0.325 -2.2)
			(size 1.4 0.4)
			(layers "F.Cu" "F.Paste")
			(net 11 "/A1")
			(pinfunction "OUT")
			(pintype "output")
			(solder_mask_margin 0.1016)
			(thermal_bridge_angle 0)
		)
		(pad "7" smd rect
			(at -0.325 -2.2)
			(size 1.4 0.4)
			(layers "F.Cu" "F.Paste")
			(net 30 "VCC")
			(pinfunction "VS+")
			(pintype "power_in")
			(solder_mask_margin 0.1016)
			(thermal_bridge_angle 0)
		)
		(pad "8" smd rect
			(at -0.975 -2.2)
			(size 1.4 0.4)
			(layers "F.Cu" "F.Paste")
			(net 28 "Net-(U1-IN+)")
			(pinfunction "IN+")
			(pintype "input")
			(solder_mask_margin 0.1016)
			(thermal_bridge_angle 0)
		)
	)
	(footprint "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder"
		(layer "F.Cu")
		(at 163.1375 114.65 90)
		(descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
		(tags "capacitor handsolder")
		(property "Reference" "C14"
			(at 3.1 0.0125 90)
			(layer "F.SilkS")
		)
		(property "Value" "47nF"
			(at 0 1.43 90)
			(layer "F.Fab")
		)
		(property "Footprint" "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder"
			(at 0 0 90)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Datasheet" ""
			(at 0 0 90)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Description" ""
			(at 0 0 90)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(sheetname "thermocouple-channel4")
		(sheetfile "thermocouple-channel.kicad_sch")
		(attr smd)
		(fp_text user "${REFERENCE}"
			(at 0 0 90)
			(layer "F.Fab")
		)
		(pad "1" smd roundrect
			(at -0.8625 0 90)
			(size 1.075 0.95)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(roundrect_rratio 0.25)
			(net 44 "Net-(U4-IN-)")
			(pinfunction "1")
			(pintype "passive")
		)
		(pad "2" smd roundrect
			(at 0.8625 0 90)
			(size 1.075 0.95)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(roundrect_rratio 0.25)
			(net 1 "GND")
			(pinfunction "2")
			(pintype "passive")
		)
		(model "${KICAD8_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl"
			(offset
				(xyz 0 0 0)
			)
			(scale
				(xyz 1 1 1)
			)
			(rotate
				(xyz 0 0 0)
			)
		)
	)
	(footprint "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder"
		(layer "F.Cu")
		(at 175.8875 114.65 -90)
		(descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
		(tags "capacitor handsolder")
		(property "Reference" "C16"
			(at -3.1 -0.0125 90)
			(layer "F.SilkS")
		)
		(property "Value" "47nF"
			(at 0 1.43 90)
			(layer "F.Fab")
		)
		(property "Footprint" "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder"
			(at 0 0 -90)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Datasheet" ""
			(at 0 0 -90)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Description" ""
			(at 0 0 -90)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(sheetname "thermocouple-channel5")
		(sheetfile "thermocouple-channel.kicad_sch")
		(attr smd)
		(fp_text user "${REFERENCE}"
			(at 0 0 90)
			(layer "F.Fab")
		)
		(pad "1" smd roundrect
			(at -0.8625 0 270)
			(size 1.075 0.95)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(roundrect_rratio 0.25)
			(net 1 "GND")
			(pinfunction "1")
			(pintype "passive")
		)
		(pad "2" smd roundrect
			(at 0.8625 0 270)
			(size 1.075 0.95)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(roundrect_rratio 0.25)
			(net 45 "Net-(U5-IN+)")
			(pinfunction "2")
			(pintype "passive")
		)
		(model "${KICAD8_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl"
			(offset
				(xyz 0 0 0)
			)
			(scale
				(xyz 1 1 1)
			)
			(rotate
				(xyz 0 0 0)
			)
		)
	)
	(footprint "Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder"
		(layer "F.Cu")
		(at 144.1375 112.96 -90)
		(descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
		(tags "resistor handsolder")
		(property "Reference" "RB3"
			(at -3.06 0 90)
			(layer "F.SilkS")
		)
		(property "Value" "100"
			(at 0 1.43 90)
			(layer "F.Fab")
		)
		(property "Footprint" "Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder"
			(at 0 0 -90)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Datasheet" ""
			(at 0 0 -90)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Description" ""
			(at 0 0 -90)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(sheetname "thermocouple-channel1")
		(sheetfile "thermocouple-channel.kicad_sch")
		(attr smd)
		(fp_text user "${REFERENCE}"
			(at 0 0 90)
			(layer "F.Fab")
		)
		(pad "1" smd roundrect
			(at -0.9125 0 270)
			(size 0.975 0.95)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(roundrect_rratio 0.25)
			(net 36 "Net-(RB3-Pad1)")
			(pinfunction "1")
			(pintype "passive")
		)
		(pad "2" smd roundrect
			(at 0.9125 0 270)
			(size 0.975 0.95)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(roundrect_rratio 0.25)
			(net 28 "Net-(U1-IN+)")
			(pinfunction "2")
			(pintype "passive")
		)
		(model "${KICAD8_3DMODEL_DIR}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl"
			(offset
				(xyz 0 0 0)
			)
			(scale
				(xyz 1 1 1)
			)
			(rotate
				(xyz 0 0 0)
			)
		)
	)
	(footprint "Adafruit ESP32-S3 8MB No PSRAM:1X12_ROUND"
		(layer "F.Cu")
		(at 157.48 104.14)
		(property "Reference" "JP3"
			(at -0.5811 -3.4686 0)
			(layer "F.SilkS")
			(hide yes)
		)
		(property "Value" "HEADER-1X12"
			(at -3.5811 -3.0936 0)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Footprint" "Adafruit ESP32-S3 8MB No PSRAM:1X12_ROUND"
			(at 0 0 0)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Datasheet" ""
			(at 0 0 0)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Description" ""
			(at 0 0 0)
			(layer "F.Fab")
			(hide yes)
		)
		(sheetname "Root")
		(sheetfile "thermocouple-feather.revA.kicad_sch")
		(pad "1" thru_hole circle
			(at -13.97 0 90)
			(size 1.6764 1.6764)
			(drill 1)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 3 "VBAT")
			(pinfunction "1")
			(pintype "passive")
			(solder_mask_margin 0.0508)
			(thermal_bridge_angle 0)
		)
		(pad "2" thru_hole circle
			(at -11.43 0 90)
			(size 1.6764 1.6764)
			(drill 1)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 24 "/EN")
			(pinfunction "2")
			(pintype "passive")
			(solder_mask_margin 0.0508)
			(thermal_bridge_angle 0)
		)
		(pad "3" thru_hole circle
			(at -8.89 0 90)
			(size 1.6764 1.6764)
			(drill 1)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 2 "VBUS")
			(pinfunction "3")
			(pintype "passive")
			(solder_mask_margin 0.0508)
			(thermal_bridge_angle 0)
		)
		(pad "4" thru_hole circle
			(at -6.35 0 90)
			(size 1.6764 1.6764)
			(drill 1)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 23 "/D13")
			(pinfunction "4")
			(pintype "passive")
			(solder_mask_margin 0.0508)
			(thermal_bridge_angle 0)
		)
		(pad "5" thru_hole circle
			(at -3.81 0 90)
			(size 1.6764 1.6764)
			(drill 1)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 18 "/D12")
			(pinfunction "5")
			(pintype "passive")
			(solder_mask_margin 0.0508)
			(thermal_bridge_angle 0)
		)
		(pad "6" thru_hole circle
			(at -1.27 0 90)
			(size 1.6764 1.6764)
			(drill 1)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 21 "/D11")
			(pinfunction "6")
			(pintype "passive")
			(solder_mask_margin 0.0508)
			(thermal_bridge_angle 0)
		)
		(pad "7" thru_hole circle
			(at 1.27 0 90)
			(size 1.6764 1.6764)
			(drill 1)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 25 "/D10")
			(pinfunction "7")
			(pintype "passive")
			(solder_mask_margin 0.0508)
			(thermal_bridge_angle 0)
		)
		(pad "8" thru_hole circle
			(at 3.81 0 90)
			(size 1.6764 1.6764)
			(drill 1)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 17 "/D9")
			(pinfunction "8")
			(pintype "passive")
			(solder_mask_margin 0.0508)
			(thermal_bridge_angle 0)
		)
		(pad "9" thru_hole circle
			(at 6.35 0 90)
			(size 1.6764 1.6764)
			(drill 1)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 20 "/D6")
			(pinfunction "9")
			(pintype "passive")
			(solder_mask_margin 0.0508)
			(thermal_bridge_angle 0)
		)
		(pad "10" thru_hole circle
			(at 8.89 0 90)
			(size 1.6764 1.6764)
			(drill 1)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 19 "/D5")
			(pinfunction "10")
			(pintype "passive")
			(solder_mask_margin 0.0508)
			(thermal_bridge_angle 0)
		)
		(pad "11" thru_hole circle
			(at 11.43 0 90)
			(size 1.6764 1.6764)
			(drill 1)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 22 "/SCL")
			(pinfunction "11")
			(pintype "passive")
			(solder_mask_margin 0.0508)
			(thermal_bridge_angle 0)
		)
		(pad "12" thru_hole circle
			(at 13.97 0 90)
			(size 1.6764 1.6764)
			(drill 1)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 26 "/SDA")
			(pinfunction "12")
			(pintype "passive")
			(solder_mask_margin 0.0508)
			(thermal_bridge_angle 0)
		)
	)
	(footprint "kicad-mza:TestPoint_THTPad_2mm-round"
		(layer "F.Cu")
		(at 129.4 117.8)
		(descr "THT rectangular pad as test Point, square 2.0mm_Drill1.0mm  side length, hole diameter 1.0mm")
		(tags "test point THT pad rectangle square")
		(property "Reference" "GND1"
			(at 0 -1.998 0)
			(layer "F.SilkS")
			(hide yes)
		)
		(property "Value" "GND"
			(at 0 2.05 0)
			(layer "F.Fab")
		)
		(property "Footprint" "kicad-mza:TestPoint_THTPad_2mm-round"
			(at 0 0 0)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Datasheet" ""
			(at 0 0 0)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Description" "test point"
			(at 0 0 0)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(property ki_fp_filters "Pin* Test*")
		(sheetname "Root")
		(sheetfile "thermocouple-feather.revA.kicad_sch")
		(attr exclude_from_pos_files)
		(fp_text user "${REFERENCE}"
			(at 0 -2 0)
			(layer "F.Fab")
		)
		(pad "1" thru_hole circle
			(at 0 0)
			(size 3.5 3.5)
			(drill 2)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 1 "GND")
			(pinfunction "1")
			(pintype "passive")
		)
	)
	(footprint "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder"
		(layer "F.Cu")
		(at 143.2 115.55 180)
		(descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
		(tags "capacitor handsolder")
		(property "Reference" "CA2"
			(at 0 1.5 0)
			(layer "F.SilkS")
			(hide yes)
		)
		(property "Value" "470nF"
			(at 0 1.43 0)
			(layer "F.Fab")
		)
		(property "Footprint" "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder"
			(at 0 0 180)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Datasheet" ""
			(at 0 0 180)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Description" ""
			(at 0 0 180)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(sheetname "thermocouple-channel1")
		(sheetfile "thermocouple-channel.kicad_sch")
		(attr smd)
		(fp_text user "${REFERENCE}"
			(at 0 0 0)
			(layer "F.Fab")
		)
		(pad "1" smd roundrect
			(at -0.8625 0 180)
			(size 1.075 0.95)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(roundrect_rratio 0.25)
			(net 28 "Net-(U1-IN+)")
			(pinfunction "1")
			(pintype "passive")
		)
		(pad "2" smd roundrect
			(at 0.8625 0 180)
			(size 1.075 0.95)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(roundrect_rratio 0.25)
			(net 27 "Net-(U1-IN-)")
			(pinfunction "2")
			(pintype "passive")
		)
		(model "${KICAD8_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl"
			(offset
				(xyz 0 0 0)
			)
			(scale
				(xyz 1 1 1)
			)
			(rotate
				(xyz 0 0 0)
			)
		)
	)
	(footprint "Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder"
		(layer "F.Cu")
		(at 172.3875 112.96 -90)
		(descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
		(tags "resistor handsolder")
		(property "Reference" "RB12"
			(at -3.66 -0.25 90)
			(layer "F.SilkS")
		)
		(property "Value" "100"
			(at 0 1.43 90)
			(layer "F.Fab")
		)
		(property "Footprint" "Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder"
			(at 0 0 -90)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Datasheet" ""
			(at 0 0 -90)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Description" ""
			(at 0 0 -90)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(sheetname "thermocouple-channel5")
		(sheetfile "thermocouple-channel.kicad_sch")
		(attr smd)
		(fp_text user "${REFERENCE}"
			(at 0 0 90)
			(layer "F.Fab")
		)
		(pad "1" smd roundrect
			(at -0.9125 0 270)
			(size 0.975 0.95)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(roundrect_rratio 0.25)
			(net 49 "Net-(RA6-Pad2)")
			(pinfunction "1")
			(pintype "passive")
		)
		(pad "2" smd roundrect
			(at 0.9125 0 270)
			(size 0.975 0.95)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(roundrect_rratio 0.25)
			(net 46 "Net-(U5-IN-)")
			(pinfunction "2")
			(pintype "passive")
		)
		(model "${KICAD8_3DMODEL_DIR}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl"
			(offset
				(xyz 0 0 0)
			)
			(scale
				(xyz 1 1 1)
			)
			(rotate
				(xyz 0 0 0)
			)
		)
	)
	(footprint "kicad-mza:TestPoint_THTPad_1mm-round"
		(layer "F.Cu")
		(at 165.6375 120.65)
		(descr "THT rectangular pad as test Point, square 2.0mm_Drill1.0mm  side length, hole diameter 1.0mm")
		(tags "test point THT pad rectangle square")
		(property "Reference" "V4"
			(at -2 0 0)
			(layer "F.SilkS")
		)
		(property "Value" "~"
			(at 0 -2 360)
			(layer "F.Fab")
		)
		(property "Footprint" "kicad-mza:TestPoint_THTPad_1mm-round"
			(at 0 0 0)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Datasheet" ""
			(at 0 0 0)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Description" "test point"
			(at 0 0 0)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(property ki_fp_filters "Pin* Test*")
		(sheetname "thermocouple-channel4")
		(sheetfile "thermocouple-channel.kicad_sch")
		(attr exclude_from_pos_files)
		(fp_text user "${REFERENCE}"
			(at 0 -1.998 360)
			(layer "F.SilkS")
			(hide yes)
		)
		(pad "1" thru_hole circle
			(at 0 0)
			(size 2 2)
			(drill 1)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 8 "/A4")
			(pinfunction "1")
			(pintype "passive")
		)
	)
	(footprint "adafruit:TERMBLOCK_1X2-3.5MM"
		(layer "B.Cu")
		(at 150.9 109.8 180)
		(property "Reference" "X3"
			(at 3.2625 -5.75 90)
			(layer "B.SilkS")
		)
		(property "Value" "TERMBLOCK_1X2"
			(at -3.048 -3.048 0)
			(layer "B.Fab")
			(hide yes)
		)
		(property "Footprint" "adafruit:TERMBLOCK_1X2-3.5MM"
			(at 0 0 0)
			(layer "B.Fab")
			(hide yes)
		)
		(property "Datasheet" ""
			(at 0 0 0)
			(layer "B.Fab")
			(hide yes)
		)
		(property "Description" ""
			(at 0 0 0)
			(layer "B.Fab")
			(hide yes)
		)
		(sheetname "thermocouple-channel2")
		(sheetfile "thermocouple-channel.kicad_sch")
		(pad "1" thru_hole circle
			(at 1.8 0 180)
			(size 2.1844 2.1844)
			(drill 1)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 40 "Net-(RA3-Pad2)")
			(pinfunction "1")
			(pintype "passive")
			(solder_mask_margin 0.1016)
			(thermal_bridge_angle 0)
		)
		(pad "2" thru_hole circle
			(at -1.7 0 180)
			(size 2.1844 2.1844)
			(drill 1)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 41 "Net-(RB5-Pad1)")
			(pinfunction "2")
			(pintype "passive")
			(solder_mask_margin 0.1016)
			(thermal_bridge_angle 0)
		)
	)
	(footprint "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder"
		(layer "B.Cu")
		(at 173.0875 118.3)
		(descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
		(tags "capacitor handsolder")
		(property "Reference" "C18"
			(at 2.0625 1.25 0)
			(layer "B.SilkS")
		)
		(property "Value" "47nF"
			(at 0 -1.43 0)
			(layer "B.Fab")
		)
		(property "Footprint" "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder"
			(at 0 0 180)
			(unlocked yes)
			(layer "B.Fab")
			(hide yes)
		)
		(property "Datasheet" ""
			(at 0 0 180)
			(unlocked yes)
			(layer "B.Fab")
			(hide yes)
		)
		(property "Description" ""
			(at 0 0 180)
			(unlocked yes)
			(layer "B.Fab")
			(hide yes)
		)
		(sheetname "thermocouple-channel5")
		(sheetfile "thermocouple-channel.kicad_sch")
		(attr smd)
		(fp_text user "${REFERENCE}"
			(at 0 0 0)
			(layer "B.Fab")
		)
		(pad "1" smd roundrect
			(at -0.8625 0)
			(size 1.075 0.95)
			(layers "B.Cu" "B.Paste" "B.Mask")
			(roundrect_rratio 0.25)
			(net 1 "GND")
			(pinfunction "1")
			(pintype "passive")
		)
		(pad "2" smd roundrect
			(at 0.8625 0)
			(size 1.075 0.95)
			(layers "B.Cu" "B.Paste" "B.Mask")
			(roundrect_rratio 0.25)
			(net 30 "VCC")
			(pinfunction "2")
			(pintype "passive")
		)
		(model "${KICAD8_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl"
			(offset
				(xyz 0 0 0)
			)
			(scale
				(xyz 1 1 1)
			)
			(rotate
				(xyz 0 0 0)
			)
		)
	)
	(footprint "Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder"
		(layer "B.Cu")
		(at 134.9 115.3 90)
		(descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
		(tags "resistor handsolder")
		(property "Reference" "RA1"
			(at 0 1.43 90)
			(layer "B.SilkS")
		)
		(property "Value" "1M"
			(at 0 -1.43 90)
			(layer "B.Fab")
		)
		(property "Footprint" "Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder"
			(at 0 0 -90)
			(unlocked yes)
			(layer "B.Fab")
			(hide yes)
		)
		(property "Datasheet" ""
			(at 0 0 -90)
			(unlocked yes)
			(layer "B.Fab")
			(hide yes)
		)
		(property "Description" ""
			(at 0 0 -90)
			(unlocked yes)
			(layer "B.Fab")
			(hide yes)
		)
		(sheetname "thermocouple-channel0")
		(sheetfile "thermocouple-channel.kicad_sch")
		(attr smd)
		(fp_text user "${REFERENCE}"
			(at 0 0 90)
			(layer "B.Fab")
		)
		(pad "1" smd roundrect
			(at -0.9125 0 90)
			(size 0.975 0.95)
			(layers "B.Cu" "B.Paste" "B.Mask")
			(roundrect_rratio 0.25)
			(net 1 "GND")
			(pinfunction "1")
			(pintype "passive")
		)
		(pad "2" smd roundrect
			(at 0.9125 0 90)
			(size 0.975 0.95)
			(layers "B.Cu" "B.Paste" "B.Mask")
			(roundrect_rratio 0.25)
			(net 32 "Net-(RA1-Pad2)")
			(pinfunction "2")
			(pintype "passive")
		)
		(model "${KICAD8_3DMODEL_DIR}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl"
			(offset
				(xyz 0 0 0)
			)
			(scale
				(xyz 1 1 1)
			)
			(rotate
				(xyz 0 0 0)
			)
		)
	)
	(footprint "adafruit:TERMBLOCK_1X2-3.5MM"
		(layer "B.Cu")
		(at 135.9 109.8 180)
		(property "Reference" "X1"
			(at 3.2625 -5.75 90)
			(layer "B.SilkS")
		)
		(property "Value" "TERMBLOCK_1X2"
			(at -3.048 -3.048 0)
			(layer "B.Fab")
			(hide yes)
		)
		(property "Footprint" "adafruit:TERMBLOCK_1X2-3.5MM"
			(at 0 0 0)
			(layer "B.Fab")
			(hide yes)
		)
		(property "Datasheet" ""
			(at 0 0 0)
			(layer "B.Fab")
			(hide yes)
		)
		(property "Description" ""
			(at 0 0 0)
			(layer "B.Fab")
			(hide yes)
		)
		(sheetname "thermocouple-channel0")
		(sheetfile "thermocouple-channel.kicad_sch")
		(pad "1" thru_hole circle
			(at 1.8 0 180)
			(size 2.1844 2.1844)
			(drill 1)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 32 "Net-(RA1-Pad2)")
			(pinfunction "1")
			(pintype "passive")
			(solder_mask_margin 0.1016)
			(thermal_bridge_angle 0)
		)
		(pad "2" thru_hole circle
			(at -1.7 0 180)
			(size 2.1844 2.1844)
			(drill 1)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 31 "Net-(RB1-Pad1)")
			(pinfunction "2")
			(pintype "passive")
			(solder_mask_margin 0.1016)
			(thermal_bridge_angle 0)
		)
	)
	(footprint "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder"
		(layer "B.Cu")
		(at 143.0875 118.3)
		(descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
		(tags "capacitor handsolder")
		(property "Reference" "C6"
			(at 2.0625 1.25 0)
			(layer "B.SilkS")
		)
		(property "Value" "47nF"
			(at 0 -1.43 0)
			(layer "B.Fab")
		)
		(property "Footprint" "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder"
			(at 0 0 180)
			(unlocked yes)
			(layer "B.Fab")
			(hide yes)
		)
		(property "Datasheet" ""
			(at 0 0 180)
			(unlocked yes)
			(layer "B.Fab")
			(hide yes)
		)
		(property "Description" ""
			(at 0 0 180)
			(unlocked yes)
			(layer "B.Fab")
			(hide yes)
		)
		(sheetname "thermocouple-channel1")
		(sheetfile "thermocouple-channel.kicad_sch")
		(attr smd)
		(fp_text user "${REFERENCE}"
			(at 0 0 0)
			(layer "B.Fab")
		)
		(pad "1" smd roundrect
			(at -0.8625 0)
			(size 1.075 0.95)
			(layers "B.Cu" "B.Paste" "B.Mask")
			(roundrect_rratio 0.25)
			(net 1 "GND")
			(pinfunction "1")
			(pintype "passive")
		)
		(pad "2" smd roundrect
			(at 0.8625 0)
			(size 1.075 0.95)
			(layers "B.Cu" "B.Paste" "B.Mask")
			(roundrect_rratio 0.25)
			(net 30 "VCC")
			(pinfunction "2")
			(pintype "passive")
		)
		(model "${KICAD8_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl"
			(offset
				(xyz 0 0 0)
			)
			(scale
				(xyz 1 1 1)
			)
			(rotate
				(xyz 0 0 0)
			)
		)
	)
	(footprint "adafruit:TERMBLOCK_1X2-3.5MM"
		(layer "B.Cu")
		(at 143.4 109.8 180)
		(property "Reference" "X2"
			(at 3.2625 -5.75 90)
			(layer "B.SilkS")
		)
		(property "Value" "TERMBLOCK_1X2"
			(at -3.048 -3.048 0)
			(layer "B.Fab")
			(hide yes)
		)
		(property "Footprint" "adafruit:TERMBLOCK_1X2-3.5MM"
			(at 0 0 0)
			(layer "B.Fab")
			(hide yes)
		)
		(property "Datasheet" ""
			(at 0 0 0)
			(layer "B.Fab")
			(hide yes)
		)
		(property "Description" ""
			(at 0 0 0)
			(layer "B.Fab")
			(hide yes)
		)
		(sheetname "thermocouple-channel1")
		(sheetfile "thermocouple-channel.kicad_sch")
		(pad "1" thru_hole circle
			(at 1.8 0 180)
			(size 2.1844 2.1844)
			(drill 1)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 35 "Net-(RA2-Pad2)")
			(pinfunction "1")
			(pintype "passive")
			(solder_mask_margin 0.1016)
			(thermal_bridge_angle 0)
		)
		(pad "2" thru_hole circle
			(at -1.7 0 180)
			(size 2.1844 2.1844)
			(drill 1)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 36 "Net-(RB3-Pad1)")
			(pinfunction "2")
			(pintype "passive")
			(solder_mask_margin 0.1016)
			(thermal_bridge_angle 0)
		)
	)
	(footprint "Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder"
		(layer "B.Cu")
		(at 172.4 115.3 90)
		(descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
		(tags "resistor handsolder")
		(property "Reference" "RA6"
			(at 0 1.43 90)
			(layer "B.SilkS")
		)
		(property "Value" "1M"
			(at 0 -1.43 90)
			(layer "B.Fab")
		)
		(property "Footprint" "Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder"
			(at 0 0 -90)
			(unlocked yes)
			(layer "B.Fab")
			(hide yes)
		)
		(property "Datasheet" ""
			(at 0 0 -90)
			(unlocked yes)
			(layer "B.Fab")
			(hide yes)
		)
		(property "Description" ""
			(at 0 0 -90)
			(unlocked yes)
			(layer "B.Fab")
			(hide yes)
		)
		(sheetname "thermocouple-channel5")
		(sheetfile "thermocouple-channel.kicad_sch")
		(attr smd)
		(fp_text user "${REFERENCE}"
			(at 0 0 90)
			(layer "B.Fab")
		)
		(pad "1" smd roundrect
			(at -0.9125 0 90)
			(size 0.975 0.95)
			(layers "B.Cu" "B.Paste" "B.Mask")
			(roundrect_rratio 0.25)
			(net 1 "GND")
			(pinfunction "1")
			(pintype "passive")
		)
		(pad "2" smd roundrect
			(at 0.9125 0 90)
			(size 0.975 0.95)
			(layers "B.Cu" "B.Paste" "B.Mask")
			(roundrect_rratio 0.25)
			(net 49 "Net-(RA6-Pad2)")
			(pinfunction "2")
			(pintype "passive")
		)
		(model "${KICAD8_3DMODEL_DIR}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl"
			(offset
				(xyz 0 0 0)
			)
			(scale
				(xyz 1 1 1)
			)
			(rotate
				(xyz 0 0 0)
			)
		)
	)
	(footprint "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder"
		(layer "B.Cu")
		(at 135.5875 118.3)
		(descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
		(tags "capacitor handsolder")
		(property "Reference" "C3"
			(at 2.0625 1.25 0)
			(layer "B.SilkS")
		)
		(property "Value" "47nF"
			(at 0 -1.43 0)
			(layer "B.Fab")
		)
		(property "Footprint" "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder"
			(at 0 0 180)
			(unlocked yes)
			(layer "B.Fab")
			(hide yes)
		)
		(property "Datasheet" ""
			(at 0 0 180)
			(unlocked yes)
			(layer "B.Fab")
			(hide yes)
		)
		(property "Description" ""
			(at 0 0 180)
			(unlocked yes)
			(layer "B.Fab")
			(hide yes)
		)
		(sheetname "thermocouple-channel0")
		(sheetfile "thermocouple-channel.kicad_sch")
		(attr smd)
		(fp_text user "${REFERENCE}"
			(at 0 0 0)
			(layer "B.Fab")
		)
		(pad "1" smd roundrect
			(at -0.8625 0)
			(size 1.075 0.95)
			(layers "B.Cu" "B.Paste" "B.Mask")
			(roundrect_rratio 0.25)
			(net 1 "GND")
			(pinfunction "1")
			(pintype "passive")
		)
		(pad "2" smd roundrect
			(at 0.8625 0)
			(size 1.075 0.95)
			(layers "B.Cu" "B.Paste" "B.Mask")
			(roundrect_rratio 0.25)
			(net 30 "VCC")
			(pinfunction "2")
			(pintype "passive")
		)
		(model "${KICAD8_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl"
			(offset
				(xyz 0 0 0)
			)
			(scale
				(xyz 1 1 1)
			)
			(rotate
				(xyz 0 0 0)
			)
		)
	)
	(footprint "Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder"
		(layer "B.Cu")
		(at 149.9 115.3 90)
		(descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
		(tags "resistor handsolder")
		(property "Reference" "RA3"
			(at 0 1.43 90)
			(layer "B.SilkS")
		)
		(property "Value" "1M"
			(at 0 -1.43 90)
			(layer "B.Fab")
		)
		(property "Footprint" "Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder"
			(at 0 0 -90)
			(unlocked yes)
			(layer "B.Fab")
			(hide yes)
		)
		(property "Datasheet" ""
			(at 0 0 -90)
			(unlocked yes)
			(layer "B.Fab")
			(hide yes)
		)
		(property "Description" ""
			(at 0 0 -90)
			(unlocked yes)
			(layer "B.Fab")
			(hide yes)
		)
		(sheetname "thermocouple-channel2")
		(sheetfile "thermocouple-channel.kicad_sch")
		(attr smd)
		(fp_text user "${REFERENCE}"
			(at 0 0 90)
			(layer "B.Fab")
		)
		(pad "1" smd roundrect
			(at -0.9125 0 90)
			(size 0.975 0.95)
			(layers "B.Cu" "B.Paste" "B.Mask")
			(roundrect_rratio 0.25)
			(net 1 "GND")
			(pinfunction "1")
			(pintype "passive")
		)
		(pad "2" smd roundrect
			(at 0.9125 0 90)
			(size 0.975 0.95)
			(layers "B.Cu" "B.Paste" "B.Mask")
			(roundrect_rratio 0.25)
			(net 40 "Net-(RA3-Pad2)")
			(pinfunction "2")
			(pintype "passive")
		)
		(model "${KICAD8_3DMODEL_DIR}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl"
			(offset
				(xyz 0 0 0)
			)
			(scale
				(xyz 1 1 1)
			)
			(rotate
				(xyz 0 0 0)
			)
		)
	)
	(footprint "Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder"
		(layer "B.Cu")
		(at 157.4 115.3 90)
		(descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
		(tags "resistor handsolder")
		(property "Reference" "RA4"
			(at 0 1.43 90)
			(layer "B.SilkS")
		)
		(property "Value" "1M"
			(at 0 -1.43 90)
			(layer "B.Fab")
		)
		(property "Footprint" "Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder"
			(at 0 0 -90)
			(unlocked yes)
			(layer "B.Fab")
			(hide yes)
		)
		(property "Datasheet" ""
			(at 0 0 -90)
			(unlocked yes)
			(layer "B.Fab")
			(hide yes)
		)
		(property "Description" ""
			(at 0 0 -90)
			(unlocked yes)
			(layer "B.Fab")
			(hide yes)
		)
		(sheetname "thermocouple-channel3")
		(sheetfile "thermocouple-channel.kicad_sch")
		(attr smd)
		(fp_text user "${REFERENCE}"
			(at 0 0 90)
			(layer "B.Fab")
		)
		(pad "1" smd roundrect
			(at -0.9125 0 90)
			(size 0.975 0.95)
			(layers "B.Cu" "B.Paste" "B.Mask")
			(roundrect_rratio 0.25)
			(net 1 "GND")
			(pinfunction "1")
			(pintype "passive")
		)
		(pad "2" smd roundrect
			(at 0.9125 0 90)
			(size 0.975 0.95)
			(layers "B.Cu" "B.Paste" "B.Mask")
			(roundrect_rratio 0.25)
			(net 47 "Net-(RA4-Pad2)")
			(pinfunction "2")
			(pintype "passive")
		)
		(model "${KICAD8_3DMODEL_DIR}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl"
			(offset
				(xyz 0 0 0)
			)
			(scale
				(xyz 1 1 1)
			)
			(rotate
				(xyz 0 0 0)
			)
		)
	)
	(footprint "Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder"
		(layer "B.Cu")
		(at 142.4 115.3 90)
		(descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
		(tags "resistor handsolder")
		(property "Reference" "RA2"
			(at 0 1.43 90)
			(layer "B.SilkS")
		)
		(property "Value" "1M"
			(at 0 -1.43 90)
			(layer "B.Fab")
		)
		(property "Footprint" "Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder"
			(at 0 0 -90)
			(unlocked yes)
			(layer "B.Fab")
			(hide yes)
		)
		(property "Datasheet" ""
			(at 0 0 -90)
			(unlocked yes)
			(layer "B.Fab")
			(hide yes)
		)
		(property "Description" ""
			(at 0 0 -90)
			(unlocked yes)
			(layer "B.Fab")
			(hide yes)
		)
		(sheetname "thermocouple-channel1")
		(sheetfile "thermocouple-channel.kicad_sch")
		(attr smd)
		(fp_text user "${REFERENCE}"
			(at 0 0 90)
			(layer "B.Fab")
		)
		(pad "1" smd roundrect
			(at -0.9125 0 90)
			(size 0.975 0.95)
			(layers "B.Cu" "B.Paste" "B.Mask")
			(roundrect_rratio 0.25)
			(net 1 "GND")
			(pinfunction "1")
			(pintype "passive")
		)
		(pad "2" smd roundrect
			(at 0.9125 0 90)
			(size 0.975 0.95)
			(layers "B.Cu" "B.Paste" "B.Mask")
			(roundrect_rratio 0.25)
			(net 35 "Net-(RA2-Pad2)")
			(pinfunction "2")
			(pintype "passive")
		)
		(model "${KICAD8_3DMODEL_DIR}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl"
			(offset
				(xyz 0 0 0)
			)
			(scale
				(xyz 1 1 1)
			)
			(rotate
				(xyz 0 0 0)
			)
		)
	)
	(footprint "adafruit:TERMBLOCK_1X2-3.5MM"
		(layer "B.Cu")
		(at 158.4 109.8 180)
		(property "Reference" "X4"
			(at 3.2625 -5.75 90)
			(layer "B.SilkS")
		)
		(property "Value" "TERMBLOCK_1X2"
			(at -3.048 -3.048 0)
			(layer "B.Fab")
			(hide yes)
		)
		(property "Footprint" "adafruit:TERMBLOCK_1X2-3.5MM"
			(at 0 0 0)
			(layer "B.Fab")
			(hide yes)
		)
		(property "Datasheet" ""
			(at 0 0 0)
			(layer "B.Fab")
			(hide yes)
		)
		(property "Description" ""
			(at 0 0 0)
			(layer "B.Fab")
			(hide yes)
		)
		(sheetname "thermocouple-channel3")
		(sheetfile "thermocouple-channel.kicad_sch")
		(pad "1" thru_hole circle
			(at 1.8 0 180)
			(size 2.1844 2.1844)
			(drill 1)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 47 "Net-(RA4-Pad2)")
			(pinfunction "1")
			(pintype "passive")
			(solder_mask_margin 0.1016)
			(thermal_bridge_angle 0)
		)
		(pad "2" thru_hole circle
			(at -1.7 0 180)
			(size 2.1844 2.1844)
			(drill 1)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 50 "Net-(RB7-Pad1)")
			(pinfunction "2")
			(pintype "passive")
			(solder_mask_margin 0.1016)
			(thermal_bridge_angle 0)
		)
	)
	(footprint "adafruit:TERMBLOCK_1X2-3.5MM"
		(layer "B.Cu")
		(at 173.4 109.8 180)
		(property "Reference" "X6"
			(at 3.2625 -5.75 90)
			(layer "B.SilkS")
		)
		(property "Value" "TERMBLOCK_1X2"
			(at -3.048 -3.048 0)
			(layer "B.Fab")
			(hide yes)
		)
		(property "Footprint" "adafruit:TERMBLOCK_1X2-3.5MM"
			(at 0 0 0)
			(layer "B.Fab")
			(hide yes)
		)
		(property "Datasheet" ""
			(at 0 0 0)
			(layer "B.Fab")
			(hide yes)
		)
		(property "Description" ""
			(at 0 0 0)
			(layer "B.Fab")
			(hide yes)
		)
		(sheetname "thermocouple-channel5")
		(sheetfile "thermocouple-channel.kicad_sch")
		(pad "1" thru_hole circle
			(at 1.8 0 180)
			(size 2.1844 2.1844)
			(drill 1)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 49 "Net-(RA6-Pad2)")
			(pinfunction "1")
			(pintype "passive")
			(solder_mask_margin 0.1016)
			(thermal_bridge_angle 0)
		)
		(pad "2" thru_hole circle
			(at -1.7 0 180)
			(size 2.1844 2.1844)
			(drill 1)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 52 "Net-(RB11-Pad1)")
			(pinfunction "2")
			(pintype "passive")
			(solder_mask_margin 0.1016)
			(thermal_bridge_angle 0)
		)
	)
	(footprint "Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder"
		(layer "B.Cu")
		(at 164.9 115.3 90)
		(descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
		(tags "resistor handsolder")
		(property "Reference" "RA5"
			(at 0 1.43 90)
			(layer "B.SilkS")
		)
		(property "Value" "1M"
			(at 0 -1.43 90)
			(layer "B.Fab")
		)
		(property "Footprint" "Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder"
			(at 0 0 -90)
			(unlocked yes)
			(layer "B.Fab")
			(hide yes)
		)
		(property "Datasheet" ""
			(at 0 0 -90)
			(unlocked yes)
			(layer "B.Fab")
			(hide yes)
		)
		(property "Description" ""
			(at 0 0 -90)
			(unlocked yes)
			(layer "B.Fab")
			(hide yes)
		)
		(sheetname "thermocouple-channel4")
		(sheetfile "thermocouple-channel.kicad_sch")
		(attr smd)
		(fp_text user "${REFERENCE}"
			(at 0 0 90)
			(layer "B.Fab")
		)
		(pad "1" smd roundrect
			(at -0.9125 0 90)
			(size 0.975 0.95)
			(layers "B.Cu" "B.Paste" "B.Mask")
			(roundrect_rratio 0.25)
			(net 1 "GND")
			(pinfunction "1")
			(pintype "passive")
		)
		(pad "2" smd roundrect
			(at 0.9125 0 90)
			(size 0.975 0.95)
			(layers "B.Cu" "B.Paste" "B.Mask")
			(roundrect_rratio 0.25)
			(net 48 "Net-(RA5-Pad2)")
			(pinfunction "2")
			(pintype "passive")
		)
		(model "${KICAD8_3DMODEL_DIR}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl"
			(offset
				(xyz 0 0 0)
			)
			(scale
				(xyz 1 1 1)
			)
			(rotate
				(xyz 0 0 0)
			)
		)
	)
	(footprint "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder"
		(layer "B.Cu")
		(at 150.5875 118.3)
		(descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
		(tags "capacitor handsolder")
		(property "Reference" "C9"
			(at 2.0625 1.25 0)
			(layer "B.SilkS")
		)
		(property "Value" "47nF"
			(at 0 -1.43 0)
			(layer "B.Fab")
		)
		(property "Footprint" "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder"
			(at 0 0 180)
			(unlocked yes)
			(layer "B.Fab")
			(hide yes)
		)
		(property "Datasheet" ""
			(at 0 0 180)
			(unlocked yes)
			(layer "B.Fab")
			(hide yes)
		)
		(property "Description" ""
			(at 0 0 180)
			(unlocked yes)
			(layer "B.Fab")
			(hide yes)
		)
		(sheetname "thermocouple-channel2")
		(sheetfile "thermocouple-channel.kicad_sch")
		(attr smd)
		(fp_text user "${REFERENCE}"
			(at 0 0 0)
			(layer "B.Fab")
		)
		(pad "1" smd roundrect
			(at -0.8625 0)
			(size 1.075 0.95)
			(layers "B.Cu" "B.Paste" "B.Mask")
			(roundrect_rratio 0.25)
			(net 1 "GND")
			(pinfunction "1")
			(pintype "passive")
		)
		(pad "2" smd roundrect
			(at 0.8625 0)
			(size 1.075 0.95)
			(layers "B.Cu" "B.Paste" "B.Mask")
			(roundrect_rratio 0.25)
			(net 30 "VCC")
			(pinfunction "2")
			(pintype "passive")
		)
		(model "${KICAD8_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl"
			(offset
				(xyz 0 0 0)
			)
			(scale
				(xyz 1 1 1)
			)
			(rotate
				(xyz 0 0 0)
			)
		)
	)
	(footprint "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder"
		(layer "B.Cu")
		(at 165.5875 118.3)
		(descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
		(tags "capacitor handsolder")
		(property "Reference" "C15"
			(at 2.0625 1.25 0)
			(layer "B.SilkS")
		)
		(property "Value" "47nF"
			(at 0 -1.43 0)
			(layer "B.Fab")
		)
		(property "Footprint" "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder"
			(at 0 0 180)
			(unlocked yes)
			(layer "B.Fab")
			(hide yes)
		)
		(property "Datasheet" ""
			(at 0 0 180)
			(unlocked yes)
			(layer "B.Fab")
			(hide yes)
		)
		(property "Description" ""
			(at 0 0 180)
			(unlocked yes)
			(layer "B.Fab")
			(hide yes)
		)
		(sheetname "thermocouple-channel4")
		(sheetfile "thermocouple-channel.kicad_sch")
		(attr smd)
		(fp_text user "${REFERENCE}"
			(at 0 0 0)
			(layer "B.Fab")
		)
		(pad "1" smd roundrect
			(at -0.8625 0)
			(size 1.075 0.95)
			(layers "B.Cu" "B.Paste" "B.Mask")
			(roundrect_rratio 0.25)
			(net 1 "GND")
			(pinfunction "1")
			(pintype "passive")
		)
		(pad "2" smd roundrect
			(at 0.8625 0)
			(size 1.075 0.95)
			(layers "B.Cu" "B.Paste" "B.Mask")
			(roundrect_rratio 0.25)
			(net 30 "VCC")
			(pinfunction "2")
			(pintype "passive")
		)
		(model "${KICAD8_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl"
			(offset
				(xyz 0 0 0)
			)
			(scale
				(xyz 1 1 1)
			)
			(rotate
				(xyz 0 0 0)
			)
		)
	)
	(footprint "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder"
		(layer "B.Cu")
		(at 158.0875 118.3)
		(descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
		(tags "capacitor handsolder")
		(property "Reference" "C12"
			(at 2.0625 1.25 0)
			(layer "B.SilkS")
		)
		(property "Value" "47nF"
			(at 0 -1.43 0)
			(layer "B.Fab")
		)
		(property "Footprint" "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder"
			(at 0 0 180)
			(unlocked yes)
			(layer "B.Fab")
			(hide yes)
		)
		(property "Datasheet" ""
			(at 0 0 180)
			(unlocked yes)
			(layer "B.Fab")
			(hide yes)
		)
		(property "Description" ""
			(at 0 0 180)
			(unlocked yes)
			(layer "B.Fab")
			(hide yes)
		)
		(sheetname "thermocouple-channel3")
		(sheetfile "thermocouple-channel.kicad_sch")
		(attr smd)
		(fp_text user "${REFERENCE}"
			(at 0 0 0)
			(layer "B.Fab")
		)
		(pad "1" smd roundrect
			(at -0.8625 0)
			(size 1.075 0.95)
			(layers "B.Cu" "B.Paste" "B.Mask")
			(roundrect_rratio 0.25)
			(net 1 "GND")
			(pinfunction "1")
			(pintype "passive")
		)
		(pad "2" smd roundrect
			(at 0.8625 0)
			(size 1.075 0.95)
			(layers "B.Cu" "B.Paste" "B.Mask")
			(roundrect_rratio 0.25)
			(net 30 "VCC")
			(pinfunction "2")
			(pintype "passive")
		)
		(model "${KICAD8_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl"
			(offset
				(xyz 0 0 0)
			)
			(scale
				(xyz 1 1 1)
			)
			(rotate
				(xyz 0 0 0)
			)
		)
	)
	(footprint "adafruit:TERMBLOCK_1X2-3.5MM"
		(layer "B.Cu")
		(at 165.9 109.8 180)
		(property "Reference" "X5"
			(at 3.2625 -5.75 90)
			(layer "B.SilkS")
		)
		(property "Value" "TERMBLOCK_1X2"
			(at -3.048 -3.048 0)
			(layer "B.Fab")
			(hide yes)
		)
		(property "Footprint" "adafruit:TERMBLOCK_1X2-3.5MM"
			(at 0 0 0)
			(layer "B.Fab")
			(hide yes)
		)
		(property "Datasheet" ""
			(at 0 0 0)
			(layer "B.Fab")
			(hide yes)
		)
		(property "Description" ""
			(at 0 0 0)
			(layer "B.Fab")
			(hide yes)
		)
		(sheetname "thermocouple-channel4")
		(sheetfile "thermocouple-channel.kicad_sch")
		(pad "1" thru_hole circle
			(at 1.8 0 180)
			(size 2.1844 2.1844)
			(drill 1)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 48 "Net-(RA5-Pad2)")
			(pinfunction "1")
			(pintype "passive")
			(solder_mask_margin 0.1016)
			(thermal_bridge_angle 0)
		)
		(pad "2" thru_hole circle
			(at -1.7 0 180)
			(size 2.1844 2.1844)
			(drill 1)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 51 "Net-(RB9-Pad1)")
			(pinfunction "2")
			(pintype "passive")
			(solder_mask_margin 0.1016)
			(thermal_bridge_angle 0)
		)
	)
	(gr_arc
		(start 129.54 125.73)
		(mid 127.743949 124.986051)
		(end 127 123.19)
		(layer "Edge.Cuts")
	)
	(gr_line
		(start 175.26 102.87)
		(end 129.54 102.87)
		(layer "Edge.Cuts")
	)
	(gr_line
		(start 127 105.41)
		(end 127 123.19)
		(layer "Edge.Cuts")
	)
	(gr_arc
		(start 177.8 123.19)
		(mid 177.056051 124.986051)
		(end 175.26 125.73)
		(layer "Edge.Cuts")
	)
	(gr_line
		(start 177.8 123.19)
		(end 177.8 105.41)
		(layer "Edge.Cuts")
	)
	(gr_arc
		(start 175.26 102.87)
		(mid 177.056051 103.613949)
		(end 177.8 105.41)
		(layer "Edge.Cuts")
	)
	(gr_arc
		(start 127 105.41)
		(mid 127.743949 103.613949)
		(end 129.54 102.87)
		(layer "Edge.Cuts")
	)
	(gr_line
		(start 129.54 125.73)
		(end 175.26 125.73)
		(layer "Edge.Cuts")
	)
	(gr_text "TX"
		(at 168.8989 122.780721 0)
		(layer "B.SilkS")
	)
	(gr_text "9"
		(at 161.29 105.8 0)
		(layer "B.SilkS")
	)
	(gr_text "10"
		(at 158.75 105.8 0)
		(layer "B.SilkS")
	)
	(gr_text "USB"
		(at 148.6489 105.8 0)
		(layer "B.SilkS")
	)
	(gr_text "A4"
		(at 153.65 122.8 0)
		(layer "B.SilkS")
	)
	(gr_text "BAT"
		(at 143.3989 105.8 0)
		(layer "B.SilkS")
	)
	(gr_text "A1"
		(at 146.1489 122.8 0)
		(layer "B.SilkS")
	)
	(gr_text "RX"
		(at 166.3989 122.739597 0)
		(layer "B.SilkS")
	)
	(gr_text "A2"
		(at 148.6489 122.8 0)
		(layer "B.SilkS")
	)
	(gr_text "MO"
		(at 161.3989 122.8 0)
		(layer "B.SilkS")
	)
	(gr_text "5"
		(at 166.3989 105.8 0)
		(layer "B.SilkS")
	)
	(gr_text "12"
		(at 153.6489 105.8 0)
		(layer "B.SilkS")
	)
	(gr_text "DB"
		(at 172.3989 122.8 0)
		(layer "B.SilkS")
	)
	(gr_text "3V"
		(at 135.89 122.8 0)
		(layer "B.SilkS")
	)
	(gr_text "RST"
		(at 133.3989 122.8 0)
		(layer "B.SilkS")
	)
	(gr_text "13"
		(at 151.1489 105.8 0)
		(layer "B.SilkS")
	)
	(gr_text "6"
		(at 163.83 105.8 0)
		(layer "B.SilkS")
	)
	(gr_text "MI"
		(at 163.7034 122.8 0)
		(layer "B.SilkS")
	)
	(gr_text "A5"
		(at 156.1489 122.8 0)
		(layer "B.SilkS")
	)
	(gr_text "11"
		(at 156.1489 105.8 0)
		(layer "B.SilkS")
	)
	(gr_text "SDA"
		(at 171.7 105.8 0)
		(layer "B.SilkS")
	)
	(gr_text "3V"
		(at 138.3989 122.8 0)
		(layer "B.SilkS")
	)
	(gr_text "SCK"
		(at 158.6489 122.8 0)
		(layer "B.SilkS")
	)
	(gr_text "A3"
		(at 151.1489 122.8 0)
		(layer "B.SilkS")
	)
	(gr_text "A0"
		(at 143.6489 122.8 0)
		(layer "B.SilkS")
	)
	(gr_text "GND"
		(at 140.8989 122.8 0)
		(layer "B.SilkS")
	)
	(gr_text "EN"
		(at 146.05 105.8 0)
		(layer "B.SilkS")
	)
	(gr_text "SCL"
		(at 168.8989 105.8 0)
		(layer "B.SilkS")
	)
	(gr_text "A0"
		(at 143.6489 122.8 0)
		(layer "F.SilkS")
	)
	(gr_text "A5"
		(at 156.1489 122.8 0)
		(layer "F.SilkS")
	)
	(gr_text "MI"
		(at 163.83 122.8 0)
		(layer "F.SilkS")
	)
	(gr_text "mza"
		(at 135.7 105.8 0)
		(layer "F.SilkS")
	)
	(gr_text "6"
		(at 163.83 105.8 0)
		(layer "F.SilkS")
	)
	(gr_text "5"
		(at 166.37 105.8 0)
		(layer "F.SilkS")
	)
	(gr_text "A2"
		(at 148.6489 122.8 0)
		(layer "F.SilkS")
	)
	(gr_text "GND"
		(at 140.8989 122.8 0)
		(layer "F.SilkS")
	)
	(gr_text "DB"
		(at 171.5135 122.8 0)
		(layer "F.SilkS")
	)
	(gr_text "thermocouple feather rev0"
		(at 132.9 107.6 0)
		(layer "F.SilkS")
	)
	(gr_text "2024-07-13"
		(at 132.1 104.4 0)
		(layer "F.SilkS")
	)
	(gr_text "11"
		(at 156.241429 105.8 0)
		(layer "F.SilkS")
	)
	(gr_text "A3"
		(at 151.1489 122.8 0)
		(layer "F.SilkS")
	)
	(gr_text "SDA"
		(at 171.6489 105.8 0)
		(layer "F.SilkS")
	)
	(gr_text "12"
		(at 153.701429 105.8 0)
		(layer "F.SilkS")
	)
	(gr_text "RST"
		(at 133.3989 122.8 0)
		(layer "F.SilkS")
	)
	(gr_text "BAT"
		(at 143.3989 105.8 0)
		(layer "F.SilkS")
	)
	(gr_text "TX"
		(at 168.783 122.8 0)
		(layer "F.SilkS")
	)
	(gr_text "3V"
		(at 138.3989 122.8 0)
		(layer "F.SilkS")
	)
	(gr_text "USB"
		(at 148.621429 105.7365 0)
		(layer "F.SilkS")
	)
	(gr_text "RX"
		(at 166.37 122.8 0)
		(layer "F.SilkS")
	)
	(gr_text "MO"
		(at 161.29 122.8 0)
		(layer "F.SilkS")
	)
	(gr_text "EN"
		(at 146.1489 105.8 0)
		(layer "F.SilkS")
	)
	(gr_text "10"
		(at 158.781429 105.8 0)
		(layer "F.SilkS")
	)
	(gr_text "SCK"
		(at 158.75 122.8 0)
		(layer "F.SilkS")
	)
	(gr_text "A4"
		(at 153.65 122.8 0)
		(layer "F.SilkS")
	)
	(gr_text "9"
		(at 161.29 105.8 0)
		(layer "F.SilkS")
	)
	(gr_text "13"
		(at 151.161429 105.8 0)
		(layer "F.SilkS")
	)
	(gr_text "3V"
		(at 135.8989 122.8 0)
		(layer "F.SilkS")
	)
	(gr_text "SCL"
		(at 168.8989 105.8 0)
		(layer "F.SilkS")
	)
	(gr_text "A1"
		(at 146.177 122.8 0)
		(layer "F.SilkS")
	)
	(zone
		(net 1)
		(net_name "GND")
		(layers "F&B.Cu")
		(hatch edge 0.5)
		(connect_pads
			(clearance 0.1524)
		)
		(min_thickness 0.1524)
		(filled_areas_thickness no)
		(fill yes
			(thermal_gap 0.1524)
			(thermal_bridge_width 0.1524)
		)
		(polygon
			(pts
				(xy 124.15 101.3) (xy 179.65 101.3) (xy 179.65 127.05) (xy 124.15 127.05)
			)
		)
	)
)
