(kicad_pcb (version 20221018) (generator pcbnew)
  (general
    (thickness 1.6)
  )
  (paper "A4")
  (layers
    (0 "F.Cu" signal)
    (1 "In1.Cu" signal)
    (2 "In2.Cu" signal)
    (31 "B.Cu" signal)
    (32 "B.Adhes" user "B.Adhesive")
    (33 "F.Adhes" user "F.Adhesive")
    (34 "B.Paste" user)
    (35 "F.Paste" user)
    (36 "B.SilkS" user "B.Silkscreen")
    (37 "F.SilkS" user "F.Silkscreen")
    (38 "B.Mask" user)
    (39 "F.Mask" user)
    (40 "Dwgs.User" user "User.Drawings")
    (41 "Cmts.User" user "User.Comments")
    (42 "Eco1.User" user "User.Eco1")
    (43 "Eco2.User" user "User.Eco2")
    (44 "Edge.Cuts" user)
    (45 "Margin" user)
    (46 "B.CrtYd" user "B.Courtyard")
    (47 "F.CrtYd" user "F.Courtyard")
    (48 "B.Fab" user)
    (49 "F.Fab" user)
    (50 "User.1" user)
    (51 "User.2" user)
    (52 "User.3" user)
    (53 "User.4" user)
    (54 "User.5" user)
    (55 "User.6" user)
    (56 "User.7" user)
    (57 "User.8" user)
    (58 "User.9" user)
  )
  (setup
    (pad_to_mask_clearance 0)
    (pcbplotparams
      (layerselection 0x00010fc_ffffffff)
      (plot_on_all_layers_selection 0x0000000_00000000)
      (disableapertmacros false)
      (usegerberextensions false)
      (usegerberattributes true)
      (usegerberadvancedattributes true)
      (creategerberjobfile true)
      (dashed_line_dash_ratio 12.000000)
      (dashed_line_gap_ratio 3.000000)
      (svgprecision 4)
      (plotframeref false)
      (viasonmask false)
      (mode 1)
      (useauxorigin false)
      (hpglpennumber 1)
      (hpglpenspeed 20)
      (hpglpendiameter 15.000000)
      (dxfpolygonmode true)
      (dxfimperialunits true)
      (dxfusepcbnewfont true)
      (psnegative false)
      (psa4output false)
      (plotreference true)
      (plotvalue true)
      (plotinvisibletext false)
      (sketchpadsonfab false)
      (subtractmaskfromsilk false)
      (outputformat 1)
      (mirror false)
      (drillshape 1)
      (scaleselection 1)
      (outputdirectory "")
    )
  )
  (net 0 "")
  (net 1 "GND")
  (net 2 "+3.3V")
  (net 3 "Net-(J1-Pad2)")
  (net 4 "+5V")
  (net 5 "LED_CLOCK")
  (net 6 "LED_DATA")
  (net 7 "Net-(J1-Pad3)")
  (net 8 "TXD")
  (net 9 "RXD")
  (net 10 "GPIO23")
  (net 11 "SDA")
  (net 12 "SCL")
  (net 13 "Net-(U2-SW)")
  (net 14 "DOWN")
  (net 15 "UP")
  (net 16 "LEFT")
  (net 17 "RIGHT")
  (net 18 "CENTER")
  (net 19 "TDO")
  (net 20 "TDI")
  (net 21 "TCK")
  (net 22 "TMS")
  (net 23 "Net-(LED1-PadC)")
  (net 24 "GPIO27")
  (net 25 "GPIO25")
  (net 26 "GPIO26")
  (net 27 "Net-(U3-A)")
  (net 28 "Net-(U4-A)")
  (net 29 "GPIO5")
  (net 30 "GPIO18")
  (net 31 "GPIO19")
  (net 32 "Net-(U$2-EN)")
  (net 33 "Net-(U$2-IO0)")
  (net 34 "unconnected-(U$2-SENSOR_VP-Pad4)")
  (net 35 "unconnected-(U$2-SENSOR_VN-Pad5)")
  (net 36 "unconnected-(U$2-SD2-Pad17)")
  (net 37 "unconnected-(U$2-SD3-Pad18)")
  (net 38 "unconnected-(U$2-CMD-Pad19)")
  (net 39 "unconnected-(U$2-CLK-Pad20)")
  (net 40 "unconnected-(U$2-SD0-Pad21)")
  (net 41 "unconnected-(U$2-SD1-Pad22)")
  (net 42 "unconnected-(U$2-IO2-Pad24)")
  (net 43 "unconnected-(U$2-NC-Pad32)")
  (net 44 "unconnected-(U1-D--Pad2)")
  (net 45 "unconnected-(U1-D+-Pad3)")
  (net 46 "unconnected-(U1-ID-Pad4)")
  (footprint "controller:SCREWTERMINAL-3.5MM-4" (layer "F.Cu")
    (at 157.55985 119.1261)
    (descr "<h3>Screw Terminal  3.5mm Pitch -4 Pin PTH</h3>\n<p>Specifications:\n<ul><li>Pin count: 4</li>\n<li>Pin pitch: 3.5mm/138mil</li>\n</ul></p>\n<p><a href=”https://www.sparkfun.com/datasheets/Prototyping/Screw-Terminal-3.5mm.pdf”>Datasheet referenced for footprint</a></p>\n<p>Example device(s):\n<ul><li>CONN_04</li>\n</ul></p>")
    (property "Sheetfile" "LED.kicad_sch")
    (property "Sheetname" "LED")
    (fp_text reference "J1" (at 0.9525 -2.0955) (layer "F.SilkS") hide)
    (fp_text value "CONN_04SCREW" (at 0 2.286) (layer "F.Fab"))
    (pad "1" thru_hole rect (at 0 0) (size 2.032 2.032) (drill 1.2) (layers "*.Cu" "*.Mask")
      (net 4 "+5V") (pinfunction "1") (pintype "passive") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "2" thru_hole circle (at 3.5 0) (size 2.032 2.032) (drill 1.2) (layers "*.Cu" "*.Mask")
      (net 3 "Net-(J1-Pad2)") (pinfunction "2") (pintype "passive") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "3" thru_hole circle (at 7 0) (size 2.032 2.032) (drill 1.2) (layers "*.Cu" "*.Mask")
      (net 7 "Net-(J1-Pad3)") (pinfunction "3") (pintype "passive") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "4" thru_hole circle (at 10.5 0) (size 2.032 2.032) (drill 1.2) (layers "*.Cu" "*.Mask")
      (net 1 "GND") (pinfunction "4") (pintype "passive") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
  )
  (footprint "controller:R0805" (layer "F.Cu")
    (at 133.42985 110.8711 -90)
    (descr "<b>RESISTOR</b><p>")
    (property "Sheetfile" "Power.kicad_sch")
    (property "Sheetname" "Power")
    (fp_text reference "R6" (at -0.635 -1.27 90) (layer "F.SilkS"))
    (fp_text value "1k" (at -0.635 2.54 90) (layer "F.Fab") hide)
    (pad "1" smd rect (at -0.95 0 270) (size 1.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 1 "GND") (pinfunction "1") (pintype "passive") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "2" smd rect (at 0.95 0 270) (size 1.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 23 "Net-(LED1-PadC)") (pinfunction "2") (pintype "passive") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
  )
  (footprint "controller:1X04" (layer "F.Cu")
    (at 164.22735 113.0936)
    (descr "<b>PIN HEADER</b>")
    (property "Sheetfile" "LED.kicad_sch")
    (property "Sheetname" "LED")
    (fp_text reference "JP1" (at -5.1562 -1.8288) (layer "F.SilkS") hide)
    (fp_text value "PINHD-1X4" (at -5.08 3.175) (layer "F.Fab"))
    (pad "1" thru_hole oval (at -3.81 0 90) (size 3.048 1.524) (drill 1.016) (layers "*.Cu" "*.Mask")
      (net 4 "+5V") (pinfunction "1") (pintype "passive") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "2" thru_hole oval (at -1.27 0 90) (size 3.048 1.524) (drill 1.016) (layers "*.Cu" "*.Mask")
      (net 3 "Net-(J1-Pad2)") (pinfunction "2") (pintype "passive") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "3" thru_hole oval (at 1.27 0 90) (size 3.048 1.524) (drill 1.016) (layers "*.Cu" "*.Mask")
      (net 7 "Net-(J1-Pad3)") (pinfunction "3") (pintype "passive") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "4" thru_hole oval (at 3.81 0 90) (size 3.048 1.524) (drill 1.016) (layers "*.Cu" "*.Mask")
      (net 1 "GND") (pinfunction "4") (pintype "passive") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
  )
  (footprint "controller:MF05A-M" (layer "F.Cu")
    (at 136.92235 103.8861)
    (property "Sheetfile" "Power.kicad_sch")
    (property "Sheetname" "Power")
    (fp_text reference "U2" (at -2.8575 2.0066 90) (layer "F.SilkS"))
    (fp_text value "LM3671MF-3.3/NOPBMF05A-M" (at 0 0) (layer "F.Fab") hide)
    (fp_text user "*" (at -1.1684 -0.4826) (layer "F.Fab"))
    (pad "1" smd rect (at -1.2692 -0.9525) (size 1.558796 0.608) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 4 "+5V") (pinfunction "VIN") (pintype "input") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "2" smd rect (at -1.2692 0) (size 1.558796 0.608) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 1 "GND") (pinfunction "GND") (pintype "passive") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "3" smd rect (at -1.2692 0.9525) (size 1.558796 0.608) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 4 "+5V") (pinfunction "EN") (pintype "passive") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "4" smd rect (at 1.2692 0.9525) (size 1.558796 0.608) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "+3.3V") (pinfunction "FB") (pintype "passive") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "5" smd rect (at 1.2692 -0.9525) (size 1.558796 0.608) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 13 "Net-(U2-SW)") (pinfunction "SW") (pintype "output") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
  )
  (footprint "MountingHole:MountingHole_3.5mm" (layer "F.Cu")
    (at 166.116 90.932)
    (descr "Mounting Hole 3.5mm, no annular")
    (tags "mounting hole 3.5mm no annular")
    (property "Sheetfile" "Extension_Headers.kicad_sch")
    (property "Sheetname" "Extension Headers")
    (property "ki_description" "Mounting Hole without connection")
    (property "ki_keywords" "mounting hole")
    (attr exclude_from_pos_files)
    (fp_text reference "H2" (at 0 -4.5) (layer "F.SilkS") hide)
    (fp_text value "MountingHole" (at 0 4.5) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab"))
    (pad "" np_thru_hole circle (at 0 0) (size 3.5 3.5) (drill 3.5) (layers "*.Cu" "*.Mask"))
  )
  (footprint "controller:TACTILE_SWITCH_SMD_4.6X2.8MM" (layer "F.Cu")
    (at 128.98485 97.8536 90)
    (descr "<h3>Momentary Switch (Pushbutton) - SPST - SMD, 4.6 x 2.8mm</h3>\n<p>Normally-open (NO) SPST momentary switches (buttons, pushbuttons).</p>\n<p><a href=\"http://www.ck-components.com/media/1479/kmr2.pdf\">Datasheet</a></p>")
    (property "Sheetfile" "ESP.kicad_sch")
    (property "Sheetname" "ESP")
    (fp_text reference "S2" (at 0 -1.524 90) (layer "F.SilkS") hide)
    (fp_text value "MOMENTARY-SWITCH-SPST-2-SMD-4.6X2.8MM" (at 0 1.524 90) (layer "F.Fab"))
    (pad "1" smd rect (at -2.05 0.8 90) (size 0.9 1) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 33 "Net-(U$2-IO0)") (pinfunction "1") (pintype "passive") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "2" smd rect (at 2.05 0.8 90) (size 0.9 1) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 33 "Net-(U$2-IO0)") (pinfunction "2") (pintype "passive") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "3" smd rect (at 2.05 -0.8 90) (size 0.9 1) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 1 "GND") (pinfunction "3") (pintype "passive") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "4" smd rect (at -2.05 -0.8 90) (size 0.9 1) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 1 "GND") (pinfunction "4") (pintype "passive") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
  )
  (footprint "controller:TACTILE_SWITCH_SMD_4.6X2.8MM" (layer "F.Cu")
    (at 128.98485 90.2336 -90)
    (descr "<h3>Momentary Switch (Pushbutton) - SPST - SMD, 4.6 x 2.8mm</h3>\n<p>Normally-open (NO) SPST momentary switches (buttons, pushbuttons).</p>\n<p><a href=\"http://www.ck-components.com/media/1479/kmr2.pdf\">Datasheet</a></p>")
    (property "Sheetfile" "ESP.kicad_sch")
    (property "Sheetname" "ESP")
    (fp_text reference "S3" (at 0 -1.524 90) (layer "F.SilkS") hide)
    (fp_text value "MOMENTARY-SWITCH-SPST-2-SMD-4.6X2.8MM" (at 0 1.524 90) (layer "F.Fab"))
    (pad "1" smd rect (at -2.05 0.8 270) (size 0.9 1) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 1 "GND") (pinfunction "1") (pintype "passive") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "2" smd rect (at 2.05 0.8 270) (size 0.9 1) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 1 "GND") (pinfunction "2") (pintype "passive") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "3" smd rect (at 2.05 -0.8 270) (size 0.9 1) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 32 "Net-(U$2-EN)") (pinfunction "3") (pintype "passive") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "4" smd rect (at -2.05 -0.8 270) (size 0.9 1) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 32 "Net-(U$2-EN)") (pinfunction "4") (pintype "passive") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
  )
  (footprint "controller:CHIPLED_0805" (layer "F.Cu")
    (at 129.30235 113.7286 -90)
    (descr "<b>CHIPLED</b><p>\nSource: http://www.osram.convergy.de/ ... LG_R971.pdf")
    (property "Sheetfile" "Power.kicad_sch")
    (property "Sheetname" "Power")
    (fp_text reference "LED1" (at -1.27 1.27) (layer "F.SilkS") hide)
    (fp_text value "Power" (at 2.54 1.27) (layer "F.Fab") hide)
    (pad "A" smd rect (at 0 1.05 270) (size 1.2 1.2) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "+3.3V") (pinfunction "A") (pintype "passive") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "C" smd rect (at 0 -1.05 270) (size 1.2 1.2) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 23 "Net-(LED1-PadC)") (pinfunction "C") (pintype "passive") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
  )
  (footprint "controller:R0805" (layer "F.Cu")
    (at 160.2586 95.47235 90)
    (descr "<b>RESISTOR</b><p>")
    (property "Sheetfile" "UI.kicad_sch")
    (property "Sheetname" "UI")
    (fp_text reference "R4" (at 3.175 0.635) (layer "F.SilkS"))
    (fp_text value "10k" (at -0.635 2.54 90) (layer "F.Fab") hide)
    (pad "1" smd rect (at -0.95 0 90) (size 1.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 18 "CENTER") (pinfunction "1") (pintype "passive") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "2" smd rect (at 0.95 0 90) (size 1.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "+3.3V") (pinfunction "2") (pintype "passive") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
  )
  (footprint "controller:JOYSTICK_MINI" (layer "F.Cu")
    (at 164.86235 100.7111 -45)
    (descr "<h3>Small Tactile Joystick w/ Select Switch</h3>\n<p>A 5-way tactile switch allows for a joystick-like interface in a very small package.</p>\n<p><a href=\"http://www.sparkfun.com/datasheets/Components/Buttons/SF303GJ26-3.pdf\">Datasheet</a></p>")
    (property "Sheetfile" "UI.kicad_sch")
    (property "Sheetname" "UI")
    (fp_text reference "S1" (at -3.302001 -3.174999) (layer "F.SilkS") hide)
    (fp_text value "JOYSTICK_MINI" (at 3.301996 3.047999) (layer "F.Fab"))
    (fp_text user "UP" (at -2.9 -1.9) (layer "F.SilkS"))
    (fp_text user "UP" (at -2.9 -1.9) (layer "F.Fab"))
    (pad "" smd rect (at 0 -4.13 315) (size 1.9 2) (layers "F.Cu" "F.Paste" "F.Mask")
      (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "" np_thru_hole circle (at 0 -1.9 315) (size 0.75 0.75) (drill 0.762) (layers "F&B.Cu" "*.Mask"))
    (pad "" np_thru_hole circle (at 0 1.9 315) (size 1.05 1.05) (drill 1.05) (layers "F&B.Cu" "*.Mask"))
    (pad "" smd rect (at 0 4.13 315) (size 1.9 2) (layers "F.Cu" "F.Paste" "F.Mask")
      (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "A" smd rect (at -3.325 -1.4 315) (size 1.85 1.1) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 14 "DOWN") (pinfunction "UP") (pintype "bidirectional") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "B" smd rect (at 3.325 -1.4 315) (size 1.85 1.1) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 17 "RIGHT") (pinfunction "RIGHT") (pintype "bidirectional") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "C" smd rect (at -3.325 1.4 315) (size 1.85 1.1) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 16 "LEFT") (pinfunction "LEFT") (pintype "bidirectional") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "CTR" smd rect (at -3.325 0 315) (size 1.85 1.1) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 18 "CENTER") (pinfunction "CENT") (pintype "bidirectional") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "D" smd rect (at 3.325 1.4 315) (size 1.85 1.1) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 15 "UP") (pinfunction "DOWN") (pintype "bidirectional") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "GND" smd rect (at 3.325 0 315) (size 1.85 1.1) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 1 "GND") (pinfunction "GND") (pintype "bidirectional") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
  )
  (footprint "controller:C0805" (layer "F.Cu")
    (at 141.04985 103.8861 -90)
    (descr "<b>CAPACITOR</b><p>")
    (property "Sheetfile" "Power.kicad_sch")
    (property "Sheetname" "Power")
    (fp_text reference "L1" (at 0.6349 -1.82515 -90) (layer "F.SilkS"))
    (fp_text value "2.2uH" (at -1.27 2.54 -90) (layer "F.Fab"))
    (pad "1" smd rect (at -0.95 0 270) (size 1.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 13 "Net-(U2-SW)") (pinfunction "1") (pintype "passive") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "2" smd rect (at 0.95 0 270) (size 1.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "+3.3V") (pinfunction "2") (pintype "passive") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
  )
  (footprint "controller:2012-4N-CONCAVE" (layer "F.Cu")
    (at 157.87735 104.2036)
    (property "Sheetfile" "UI.kicad_sch")
    (property "Sheetname" "UI")
    (fp_text reference "R5" (at -0.7775 -2.4) (layer "F.SilkS"))
    (fp_text value "10k" (at 0.0575 -2.315) (layer "F.Fab") hide)
    (pad "P$1" smd rect (at -1.905 -1.397 90) (size 1.27 0.65) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 15 "UP") (pinfunction "1") (pintype "passive") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "P$2" smd rect (at -0.635 -1.397 90) (size 1.27 0.65) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 17 "RIGHT") (pinfunction "2") (pintype "passive") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "P$3" smd rect (at 0.635 -1.397 90) (size 1.27 0.65) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 16 "LEFT") (pinfunction "3") (pintype "passive") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "P$4" smd rect (at 1.905 -1.397 90) (size 1.27 0.65) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 14 "DOWN") (pinfunction "4") (pintype "passive") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "P$5" smd rect (at 1.905 1.397 90) (size 1.27 0.65) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "+3.3V") (pinfunction "5") (pintype "passive") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "P$6" smd rect (at 0.635 1.397 90) (size 1.27 0.65) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "+3.3V") (pinfunction "6") (pintype "passive") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "P$7" smd rect (at -0.635 1.397 90) (size 1.27 0.65) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "+3.3V") (pinfunction "7") (pintype "passive") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "P$8" smd rect (at -1.905 1.397 90) (size 1.27 0.65) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "+3.3V") (pinfunction "8") (pintype "passive") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
  )
  (footprint "controller:C0805" (layer "F.Cu")
    (at 137.23985 107.0611 180)
    (descr "<b>CAPACITOR</b><p>")
    (property "Sheetfile" "Power.kicad_sch")
    (property "Sheetname" "Power")
    (fp_text reference "C2" (at -0.9525 -1.27) (layer "F.SilkS"))
    (fp_text value "10uF" (at -1.27 2.54) (layer "F.Fab") hide)
    (pad "1" smd rect (at -0.95 0 180) (size 1.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "+3.3V") (pinfunction "1") (pintype "passive") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "2" smd rect (at 0.95 0 180) (size 1.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 1 "GND") (pinfunction "2") (pintype "passive") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
  )
  (footprint "controller:2X08" (layer "F.Cu")
    (at 144.85985 118.8086 180)
    (descr "<b>PIN HEADER</b>")
    (property "Sheetfile" "Extension_Headers.kicad_sch")
    (property "Sheetname" "Extension Headers")
    (fp_text reference "JP2" (at -6.35 -3.175) (layer "F.SilkS") hide)
    (fp_text value "PINHD-2X8" (at -10.16 4.445) (layer "F.Fab"))
    (pad "1" thru_hole roundrect (at -8.89 1.27 180) (size 1.524 1.524) (drill 1.016) (layers "*.Cu" "*.Mask") (roundrect_rratio 0.25)
      (chamfer_ratio 0.2928932188) (chamfer top_left top_right bottom_left bottom_right)
      (net 2 "+3.3V") (pinfunction "1") (pintype "passive") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "2" thru_hole roundrect (at -8.89 -1.27 180) (size 1.524 1.524) (drill 1.016) (layers "*.Cu" "*.Mask") (roundrect_rratio 0.25)
      (chamfer_ratio 0.2928932188) (chamfer top_left top_right bottom_left bottom_right)
      (net 1 "GND") (pinfunction "2") (pintype "passive") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "3" thru_hole roundrect (at -6.35 1.27 180) (size 1.524 1.524) (drill 1.016) (layers "*.Cu" "*.Mask") (roundrect_rratio 0.25)
      (chamfer_ratio 0.2928932188) (chamfer top_left top_right bottom_left bottom_right)
      (net 10 "GPIO23") (pinfunction "3") (pintype "passive") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "4" thru_hole roundrect (at -6.35 -1.27 180) (size 1.524 1.524) (drill 1.016) (layers "*.Cu" "*.Mask") (roundrect_rratio 0.25)
      (chamfer_ratio 0.2928932188) (chamfer top_left top_right bottom_left bottom_right)
      (net 31 "GPIO19") (pinfunction "4") (pintype "passive") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "5" thru_hole roundrect (at -3.81 1.27 180) (size 1.524 1.524) (drill 1.016) (layers "*.Cu" "*.Mask") (roundrect_rratio 0.25)
      (chamfer_ratio 0.2928932188) (chamfer top_left top_right bottom_left bottom_right)
      (net 30 "GPIO18") (pinfunction "5") (pintype "passive") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "6" thru_hole roundrect (at -3.81 -1.27 180) (size 1.524 1.524) (drill 1.016) (layers "*.Cu" "*.Mask") (roundrect_rratio 0.25)
      (chamfer_ratio 0.2928932188) (chamfer top_left top_right bottom_left bottom_right)
      (net 29 "GPIO5") (pinfunction "6") (pintype "passive") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "7" thru_hole roundrect (at -1.27 1.27 180) (size 1.524 1.524) (drill 1.016) (layers "*.Cu" "*.Mask") (roundrect_rratio 0.25)
      (chamfer_ratio 0.2928932188) (chamfer top_left top_right bottom_left bottom_right)
      (net 25 "GPIO25") (pinfunction "7") (pintype "passive") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "8" thru_hole roundrect (at -1.27 -1.27 180) (size 1.524 1.524) (drill 1.016) (layers "*.Cu" "*.Mask") (roundrect_rratio 0.25)
      (chamfer_ratio 0.2928932188) (chamfer top_left top_right bottom_left bottom_right)
      (net 24 "GPIO27") (pinfunction "8") (pintype "passive") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "9" thru_hole roundrect (at 1.27 1.27 180) (size 1.524 1.524) (drill 1.016) (layers "*.Cu" "*.Mask") (roundrect_rratio 0.25)
      (chamfer_ratio 0.2928932188) (chamfer top_left top_right bottom_left bottom_right)
      (net 26 "GPIO26") (pinfunction "9") (pintype "passive") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "10" thru_hole roundrect (at 1.27 -1.27 180) (size 1.524 1.524) (drill 1.016) (layers "*.Cu" "*.Mask") (roundrect_rratio 0.25)
      (chamfer_ratio 0.2928932188) (chamfer top_left top_right bottom_left bottom_right)
      (net 8 "TXD") (pinfunction "10") (pintype "passive") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "11" thru_hole roundrect (at 3.81 1.27 180) (size 1.524 1.524) (drill 1.016) (layers "*.Cu" "*.Mask") (roundrect_rratio 0.25)
      (chamfer_ratio 0.2928932188) (chamfer top_left top_right bottom_left bottom_right)
      (net 1 "GND") (pinfunction "11") (pintype "passive") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "12" thru_hole roundrect (at 3.81 -1.27 180) (size 1.524 1.524) (drill 1.016) (layers "*.Cu" "*.Mask") (roundrect_rratio 0.25)
      (chamfer_ratio 0.2928932188) (chamfer top_left top_right bottom_left bottom_right)
      (net 9 "RXD") (pinfunction "12") (pintype "passive") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "13" thru_hole roundrect (at 6.35 1.27 180) (size 1.524 1.524) (drill 1.016) (layers "*.Cu" "*.Mask") (roundrect_rratio 0.25)
      (chamfer_ratio 0.2928932188) (chamfer top_left top_right bottom_left bottom_right)
      (net 21 "TCK") (pinfunction "13") (pintype "passive") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "14" thru_hole roundrect (at 6.35 -1.27 180) (size 1.524 1.524) (drill 1.016) (layers "*.Cu" "*.Mask") (roundrect_rratio 0.25)
      (chamfer_ratio 0.2928932188) (chamfer top_left top_right bottom_left bottom_right)
      (net 19 "TDO") (pinfunction "14") (pintype "passive") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "15" thru_hole roundrect (at 8.89 1.27 180) (size 1.524 1.524) (drill 1.016) (layers "*.Cu" "*.Mask") (roundrect_rratio 0.25)
      (chamfer_ratio 0.2928932188) (chamfer top_left top_right bottom_left bottom_right)
      (net 22 "TMS") (pinfunction "15") (pintype "passive") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "16" thru_hole roundrect (at 8.89 -1.27 180) (size 1.524 1.524) (drill 1.016) (layers "*.Cu" "*.Mask") (roundrect_rratio 0.25)
      (chamfer_ratio 0.2928932188) (chamfer top_left top_right bottom_left bottom_right)
      (net 20 "TDI") (pinfunction "16") (pintype "passive") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
  )
  (footprint "controller:C0805" (layer "F.Cu")
    (at 136.60485 100.7111)
    (descr "<b>CAPACITOR</b><p>")
    (property "Sheetfile" "Power.kicad_sch")
    (property "Sheetname" "Power")
    (fp_text reference "C1" (at 0.635 -1.905) (layer "F.SilkS"))
    (fp_text value "4.7uF" (at -1.27 2.54) (layer "F.Fab") hide)
    (pad "1" smd rect (at -0.95 0) (size 1.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 4 "+5V") (pinfunction "1") (pintype "passive") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "2" smd rect (at 0.95 0) (size 1.3 1.5) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 1 "GND") (pinfunction "2") (pintype "passive") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
  )
  (footprint "controller:SSD1306-OLED" (layer "F.Cu")
    (at 144.85985 114.6811)
    (property "Sheetfile" "UI.kicad_sch")
    (property "Sheetname" "UI")
    (fp_text reference "U$5" (at -1.27 1.5875) (layer "F.SilkS") hide)
    (fp_text value "SSD1306-OLED" (at -6.35 -3.81) (layer "F.Fab") hide)
    (pad "1" thru_hole circle (at -3.81 -2.032) (size 1.7272 1.7272) (drill 1.016) (layers "*.Cu" "*.Mask")
      (net 11 "SDA") (pinfunction "SDA") (pintype "passive") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "2" thru_hole circle (at -1.27 -2.032) (size 1.7272 1.7272) (drill 1.016) (layers "*.Cu" "*.Mask")
      (net 12 "SCL") (pinfunction "SCL") (pintype "passive") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "3" thru_hole circle (at 1.27 -2.032) (size 1.7272 1.7272) (drill 1.016) (layers "*.Cu" "*.Mask")
      (net 1 "GND") (pinfunction "GND") (pintype "power_in") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "4" thru_hole circle (at 3.81 -2.032) (size 1.7272 1.7272) (drill 1.016) (layers "*.Cu" "*.Mask")
      (net 2 "+3.3V") (pinfunction "VCC") (pintype "power_in") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
  )
  (footprint "MountingHole:MountingHole_3.5mm" (layer "F.Cu")
    (at 130.81 119.126)
    (descr "Mounting Hole 3.5mm, no annular")
    (tags "mounting hole 3.5mm no annular")
    (property "Sheetfile" "Extension_Headers.kicad_sch")
    (property "Sheetname" "Extension Headers")
    (property "ki_description" "Mounting Hole without connection")
    (property "ki_keywords" "mounting hole")
    (attr exclude_from_pos_files)
    (fp_text reference "H1" (at 0 -4.5) (layer "F.SilkS") hide)
    (fp_text value "MountingHole" (at 0 4.5) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab"))
    (pad "" np_thru_hole circle (at 0 0) (size 3.5 3.5) (drill 3.5) (layers "*.Cu" "*.Mask"))
  )
  (footprint "controller:10118194-MICRO-USB" (layer "F.Cu")
    (at 128.34985 107.3786 -90)
    (descr "Surface mount micro USB connector")
    (property "Sheetfile" "Power.kicad_sch")
    (property "Sheetname" "Power")
    (fp_text reference "U1" (at -4 -3.8 90) (layer "F.SilkS") hide)
    (fp_text value "10118194-MICRO-USB" (at -3.8 3.9 90) (layer "F.Fab") hide)
    (pad "1" smd rect (at -1.3 -2.7 90) (size 0.4 1.35) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 4 "+5V") (pinfunction "5V") (pintype "bidirectional") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "2" smd rect (at -0.65 -2.7 90) (size 0.4 1.35) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 44 "unconnected-(U1-D--Pad2)") (pinfunction "D-") (pintype "bidirectional+no_connect") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "3" smd rect (at 0 -2.7 90) (size 0.4 1.35) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 45 "unconnected-(U1-D+-Pad3)") (pinfunction "D+") (pintype "bidirectional+no_connect") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "4" smd rect (at 0.65 -2.7 90) (size 0.4 1.35) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 46 "unconnected-(U1-ID-Pad4)") (pinfunction "ID") (pintype "bidirectional+no_connect") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "5" smd rect (at 1.3 -2.7 90) (size 0.4 1.35) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 1 "GND") (pinfunction "GND$1") (pintype "bidirectional") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "M1" thru_hole circle (at -2.5 -2.7 270) (size 1.35 1.35) (drill 0.85) (layers "*.Cu" "*.Mask")
      (net 1 "GND") (pinfunction "GND$2") (pintype "passive") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "M2" thru_hole circle (at 2.5 -2.7 270) (size 1.35 1.35) (drill 0.85) (layers "*.Cu" "*.Mask")
      (net 1 "GND") (pinfunction "GND$3") (pintype "passive") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "M3" thru_hole rect (at -3.5 0 270) (size 1.55 1.55) (drill 1.15) (layers "*.Cu" "*.Mask")
      (net 1 "GND") (pinfunction "GND$4") (pintype "passive") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "M4" thru_hole rect (at 3.5 0 270) (size 1.55 1.55) (drill 1.15) (layers "*.Cu" "*.Mask")
      (net 1 "GND") (pinfunction "GND$5") (pintype "passive") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
  )
  (footprint "controller:DBV6-M" (layer "B.Cu")
    (at 155.33735 114.0461 180)
    (property "Sheetfile" "LED.kicad_sch")
    (property "Sheetname" "LED")
    (fp_text reference "U3" (at 1.4859 1.905) (layer "B.SilkS"))
    (fp_text value "SN74LVC1T45DBVRDBV6-M" (at 0 0) (layer "B.Fab") hide)
    (fp_text user "*" (at -1.0668 0.1778) (layer "B.Fab"))
    (pad "1" smd rect (at -1.1684 0.95 180) (size 1.778 0.6096) (layers "B.Cu" "B.Paste" "B.Mask")
      (net 4 "+5V") (pinfunction "VCCA") (pintype "power_in") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "2" smd rect (at -1.1684 0 180) (size 1.778 0.6096) (layers "B.Cu" "B.Paste" "B.Mask")
      (net 1 "GND") (pinfunction "GND") (pintype "power_in") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "3" smd rect (at -1.1684 -0.95 180) (size 1.778 0.6096) (layers "B.Cu" "B.Paste" "B.Mask")
      (net 27 "Net-(U3-A)") (pinfunction "A") (pintype "input") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "4" smd rect (at 1.1684 -0.95 180) (size 1.778 0.6096) (layers "B.Cu" "B.Paste" "B.Mask")
      (net 6 "LED_DATA") (pinfunction "B") (pintype "input") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "5" smd rect (at 1.1684 0 180) (size 1.778 0.6096) (layers "B.Cu" "B.Paste" "B.Mask")
      (net 1 "GND") (pinfunction "DIR") (pintype "input") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "6" smd rect (at 1.1684 0.95 180) (size 1.778 0.6096) (layers "B.Cu" "B.Paste" "B.Mask")
      (net 2 "+3.3V") (pinfunction "VCCB") (pintype "power_in") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
  )
  (footprint "controller:C0805" (layer "B.Cu")
    (at 159.512 89.601 90)
    (descr "<b>CAPACITOR</b><p>")
    (property "Sheetfile" "ESP.kicad_sch")
    (property "Sheetname" "ESP")
    (fp_text reference "C3" (at -2.728 -0.508) (layer "B.SilkS"))
    (fp_text value "1uF" (at -1.27 -2.54 90) (layer "B.Fab"))
    (pad "1" smd rect (at -0.95 0 90) (size 1.3 1.5) (layers "B.Cu" "B.Paste" "B.Mask")
      (net 32 "Net-(U$2-EN)") (pinfunction "1") (pintype "passive") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "2" smd rect (at 0.95 0 90) (size 1.3 1.5) (layers "B.Cu" "B.Paste" "B.Mask")
      (net 1 "GND") (pinfunction "2") (pintype "passive") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
  )
  (footprint "controller:R0805" (layer "B.Cu")
    (at 166.177 109.855)
    (descr "<b>RESISTOR</b><p>")
    (property "Sheetfile" "LED.kicad_sch")
    (property "Sheetname" "LED")
    (property "ki_description" "Resistor, US symbol")
    (property "ki_keywords" "R res resistor")
    (fp_text reference "R1" (at 1.717 0.381) (layer "B.SilkS"))
    (fp_text value "220" (at -0.635 -2.54) (layer "B.Fab"))
    (pad "1" smd rect (at -0.95 0) (size 1.3 1.5) (layers "B.Cu" "B.Paste" "B.Mask")
      (net 27 "Net-(U3-A)") (pintype "passive") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "2" smd rect (at 0.95 0) (size 1.3 1.5) (layers "B.Cu" "B.Paste" "B.Mask")
      (net 7 "Net-(J1-Pad3)") (pintype "passive") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
  )
  (footprint "controller:SJ_2" (layer "B.Cu")
    (at 163.59235 116.5861 180)
    (descr "<b>Solder jumper</b>")
    (property "Sheetfile" "LED.kicad_sch")
    (property "Sheetname" "LED")
    (fp_text reference "SJ1" (at -2.413 1.27) (layer "B.SilkS") hide)
    (fp_text value "LED Type" (at 0.05865 -0.15875) (layer "B.Fab"))
    (pad "1" smd rect (at -1.524 0 180) (size 1.1684 1.6002) (layers "B.Cu" "B.Paste" "B.Mask")
      (net 7 "Net-(J1-Pad3)") (pinfunction "1") (pintype "passive") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "2" smd rect (at 0 0 180) (size 1.1684 1.6002) (layers "B.Cu" "B.Paste" "B.Mask")
      (net 7 "Net-(J1-Pad3)") (pinfunction "2") (pintype "passive") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "3" smd rect (at 1.524 0 180) (size 1.1684 1.6002) (layers "B.Cu" "B.Paste" "B.Mask")
      (net 1 "GND") (pinfunction "3") (pintype "passive") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
  )
  (footprint "controller:SJ" (layer "B.Cu")
    (at 161.2111 109.44235)
    (descr "<b>Solder jumper</b>")
    (property "Sheetfile" "LED.kicad_sch")
    (property "Sheetname" "LED")
    (property "ki_description" "Solder Jumper, 2-pole, closed/bridged")
    (property "ki_keywords" "solder jumper SPST")
    (fp_text reference "SJ3" (at -1.651 1.143) (layer "B.SilkS") hide)
    (fp_text value "SJ" (at 0.4001 0) (layer "B.Fab"))
    (pad "1" smd rect (at -0.762 0) (size 1.1684 1.6002) (layers "B.Cu" "B.Paste" "B.Mask")
      (net 4 "+5V") (pinfunction "A") (pintype "passive") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "2" smd rect (at 0.762 0) (size 1.1684 1.6002) (layers "B.Cu" "B.Paste" "B.Mask")
      (net 4 "+5V") (pinfunction "B") (pintype "passive") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
  )
  (footprint "controller:R0805" (layer "B.Cu")
    (at 132.6361 97.37735 90)
    (descr "<b>RESISTOR</b><p>")
    (property "Sheetfile" "ESP.kicad_sch")
    (property "Sheetname" "ESP")
    (fp_text reference "R7" (at 2.2225 0.635 180) (layer "B.SilkS"))
    (fp_text value "10k" (at -0.635 -2.54 90) (layer "B.Fab") hide)
    (pad "1" smd rect (at -0.95 0 90) (size 1.3 1.5) (layers "B.Cu" "B.Paste" "B.Mask")
      (net 33 "Net-(U$2-IO0)") (pinfunction "1") (pintype "passive") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "2" smd rect (at 0.95 0 90) (size 1.3 1.5) (layers "B.Cu" "B.Paste" "B.Mask")
      (net 2 "+3.3V") (pinfunction "2") (pintype "passive") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
  )
  (footprint "controller:DBV6-M" (layer "B.Cu")
    (at 155.33735 108.9661 180)
    (property "Sheetfile" "LED.kicad_sch")
    (property "Sheetname" "LED")
    (fp_text reference "U4" (at 1.4859 1.905) (layer "B.SilkS"))
    (fp_text value "SN74LVC1T45DBVRDBV6-M" (at 0 0) (layer "B.Fab") hide)
    (fp_text user "*" (at -1.0668 0.1778) (layer "B.Fab"))
    (pad "1" smd rect (at -1.1684 0.95 180) (size 1.778 0.6096) (layers "B.Cu" "B.Paste" "B.Mask")
      (net 4 "+5V") (pinfunction "VCCA") (pintype "power_in") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "2" smd rect (at -1.1684 0 180) (size 1.778 0.6096) (layers "B.Cu" "B.Paste" "B.Mask")
      (net 1 "GND") (pinfunction "GND") (pintype "power_in") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "3" smd rect (at -1.1684 -0.95 180) (size 1.778 0.6096) (layers "B.Cu" "B.Paste" "B.Mask")
      (net 28 "Net-(U4-A)") (pinfunction "A") (pintype "input") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "4" smd rect (at 1.1684 -0.95 180) (size 1.778 0.6096) (layers "B.Cu" "B.Paste" "B.Mask")
      (net 5 "LED_CLOCK") (pinfunction "B") (pintype "input") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "5" smd rect (at 1.1684 0 180) (size 1.778 0.6096) (layers "B.Cu" "B.Paste" "B.Mask")
      (net 1 "GND") (pinfunction "DIR") (pintype "input") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "6" smd rect (at 1.1684 0.95 180) (size 1.778 0.6096) (layers "B.Cu" "B.Paste" "B.Mask")
      (net 2 "+3.3V") (pinfunction "VCCB") (pintype "power_in") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
  )
  (footprint "controller:SJ" (layer "B.Cu")
    (at 129.30235 114.3636 180)
    (descr "<b>Solder jumper</b>")
    (property "Sheetfile" "Power.kicad_sch")
    (property "Sheetname" "Power")
    (property "ki_description" "Solder Jumper, 2-pole, closed/bridged")
    (property "ki_keywords" "solder jumper SPST")
    (fp_text reference "SJ2" (at -1.651 1.143) (layer "B.SilkS") hide)
    (fp_text value "SJ" (at 0.4001 0) (layer "B.Fab"))
    (pad "1" smd rect (at -0.762 0 180) (size 1.1684 1.6002) (layers "B.Cu" "B.Paste" "B.Mask")
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      (net 2 "+3.3V") (pinfunction "B") (pintype "passive") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
  )
  (footprint "controller:ESP32-WROOM-32D" (layer "B.Cu")
    (at 144.85985 88.0111 180)
    (descr "ESP32-WROOM-32D")
    (property "Sheetfile" "ESP.kicad_sch")
    (property "Sheetname" "ESP")
    (fp_text reference "U$2" (at -3.175 8.255) (layer "F.SilkS") hide)
    (fp_text value "ESP32-WROOM-32D" (at -9.2075 -20.6375) (layer "B.SilkS") hide)
    (fp_text user "No Copper" (at -3.81 3.81) (layer "B.Fab"))
    (pad "1" smd rect (at -8.5 0 180) (size 2 0.9) (layers "B.Cu" "B.Paste" "B.Mask")
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    (pad "4" smd rect (at -8.5 -3.81 180) (size 2 0.9) (layers "B.Cu" "B.Paste" "B.Mask")
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    (pad "7" smd rect (at -8.5 -7.62 180) (size 2 0.9) (layers "B.Cu" "B.Paste" "B.Mask")
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    (pad "8" smd rect (at -8.5 -8.89 180) (size 2 0.9) (layers "B.Cu" "B.Paste" "B.Mask")
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    (pad "9" smd rect (at -8.5 -10.16 180) (size 2 0.9) (layers "B.Cu" "B.Paste" "B.Mask")
      (net 6 "LED_DATA") (pinfunction "IO33") (pintype "passive") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "10" smd rect (at -8.5 -11.43 180) (size 2 0.9) (layers "B.Cu" "B.Paste" "B.Mask")
      (net 25 "GPIO25") (pinfunction "IO25") (pintype "passive") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "11" smd rect (at -8.5 -12.7 180) (size 2 0.9) (layers "B.Cu" "B.Paste" "B.Mask")
      (net 26 "GPIO26") (pinfunction "IO26") (pintype "passive") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "12" smd rect (at -8.5 -13.97 180) (size 2 0.9) (layers "B.Cu" "B.Paste" "B.Mask")
      (net 24 "GPIO27") (pinfunction "IO27") (pintype "bidirectional") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "13" smd rect (at -8.5 -15.24 180) (size 2 0.9) (layers "B.Cu" "B.Paste" "B.Mask")
      (net 22 "TMS") (pinfunction "IO14") (pintype "bidirectional") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "14" smd rect (at -8.5 -16.51 180) (size 2 0.9) (layers "B.Cu" "B.Paste" "B.Mask")
      (net 20 "TDI") (pinfunction "IO12") (pintype "bidirectional") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "15" smd rect (at -5.715 -17.51 90) (size 2 0.9) (layers "B.Cu" "B.Paste" "B.Mask")
      (net 1 "GND") (pinfunction "GND@3") (pintype "passive") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "16" smd rect (at -4.445 -17.51 90) (size 2 0.9) (layers "B.Cu" "B.Paste" "B.Mask")
      (net 21 "TCK") (pinfunction "IO13") (pintype "passive") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "17" smd rect (at -3.175 -17.51 90) (size 2 0.9) (layers "B.Cu" "B.Paste" "B.Mask")
      (net 36 "unconnected-(U$2-SD2-Pad17)") (pinfunction "SD2") (pintype "no_connect") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "18" smd rect (at -1.905 -17.51 90) (size 2 0.9) (layers "B.Cu" "B.Paste" "B.Mask")
      (net 37 "unconnected-(U$2-SD3-Pad18)") (pinfunction "SD3") (pintype "no_connect") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "19" smd rect (at -0.635 -17.51 90) (size 2 0.9) (layers "B.Cu" "B.Paste" "B.Mask")
      (net 38 "unconnected-(U$2-CMD-Pad19)") (pinfunction "CMD") (pintype "no_connect") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "20" smd rect (at 0.635 -17.51 90) (size 2 0.9) (layers "B.Cu" "B.Paste" "B.Mask")
      (net 39 "unconnected-(U$2-CLK-Pad20)") (pinfunction "CLK") (pintype "no_connect") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "21" smd rect (at 1.905 -17.51 90) (size 2 0.9) (layers "B.Cu" "B.Paste" "B.Mask")
      (net 40 "unconnected-(U$2-SD0-Pad21)") (pinfunction "SD0") (pintype "no_connect") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "22" smd rect (at 3.175 -17.51 90) (size 2 0.9) (layers "B.Cu" "B.Paste" "B.Mask")
      (net 41 "unconnected-(U$2-SD1-Pad22)") (pinfunction "SD1") (pintype "no_connect") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "23" smd rect (at 4.445 -17.51 90) (size 2 0.9) (layers "B.Cu" "B.Paste" "B.Mask")
      (net 19 "TDO") (pinfunction "IO15") (pintype "passive") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "24" smd rect (at 5.715 -17.51 90) (size 2 0.9) (layers "B.Cu" "B.Paste" "B.Mask")
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    (pad "25" smd rect (at 8.5 -16.51) (size 2 0.9) (layers "B.Cu" "B.Paste" "B.Mask")
      (net 33 "Net-(U$2-IO0)") (pinfunction "IO0") (pintype "bidirectional") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "26" smd rect (at 8.5 -15.24) (size 2 0.9) (layers "B.Cu" "B.Paste" "B.Mask")
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    (pad "27" smd rect (at 8.5 -13.97) (size 2 0.9) (layers "B.Cu" "B.Paste" "B.Mask")
      (net 15 "UP") (pinfunction "IO16") (pintype "bidirectional") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "28" smd rect (at 8.5 -12.7) (size 2 0.9) (layers "B.Cu" "B.Paste" "B.Mask")
      (net 14 "DOWN") (pinfunction "IO17") (pintype "passive") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "29" smd rect (at 8.5 -11.43) (size 2 0.9) (layers "B.Cu" "B.Paste" "B.Mask")
      (net 29 "GPIO5") (pinfunction "IO5") (pintype "passive") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "30" smd rect (at 8.5 -10.16) (size 2 0.9) (layers "B.Cu" "B.Paste" "B.Mask")
      (net 30 "GPIO18") (pinfunction "IO18") (pintype "passive") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "31" smd rect (at 8.5 -8.89) (size 2 0.9) (layers "B.Cu" "B.Paste" "B.Mask")
      (net 31 "GPIO19") (pinfunction "IO19") (pintype "passive") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "32" smd rect (at 8.5 -7.62) (size 2 0.9) (layers "B.Cu" "B.Paste" "B.Mask")
      (net 43 "unconnected-(U$2-NC-Pad32)") (pinfunction "NC") (pintype "no_connect") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "33" smd rect (at 8.5 -6.35) (size 2 0.9) (layers "B.Cu" "B.Paste" "B.Mask")
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    (pad "34" smd rect (at 8.5 -5.08) (size 2 0.9) (layers "B.Cu" "B.Paste" "B.Mask")
      (net 9 "RXD") (pinfunction "RXD0") (pintype "passive") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "35" smd rect (at 8.5 -3.81) (size 2 0.9) (layers "B.Cu" "B.Paste" "B.Mask")
      (net 8 "TXD") (pinfunction "TXD0") (pintype "passive") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "36" smd rect (at 8.5 -2.54) (size 2 0.9) (layers "B.Cu" "B.Paste" "B.Mask")
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    (pad "37" smd rect (at 8.5 -1.27) (size 2 0.9) (layers "B.Cu" "B.Paste" "B.Mask")
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