GND
3V3
GND
TXD
RXD
RST
MODE
BM70 Breakout v1
David Arthur, 2020
P2_0 MODE
Low Test mode
High APP mode
BM70BLE01FC2
BM70BLE01FC2
BM70BLE01FC2
<b>Pin Headers,Terminal blocks, D-Sub, Backplane, FFC/FPC, Socket
<b>PIN HEADER</b>
>NAME
>VALUE
PIN HEADER
<b>CHIPLED</b><p>
Source: http://www.osram.convergy.de/ ... LG_R971.pdf
>NAME
>VALUE
<b>CHIPLED</b><p>
Source: http://www.osram.convergy.de/ ... LG_R971.pdf
<b>EAGLE Design Rules</b>
<p>
Die Standard-Design-Rules sind so gewählt, dass sie für
die meisten Anwendungen passen. Sollte ihre Platine
besondere Anforderungen haben, treffen Sie die erforderlichen
Einstellungen hier und speichern die Design Rules unter
einem neuen Namen ab.
<b>EAGLE Design Rules</b>
<p>
The default Design Rules have been set to cover
a wide range of applications. Your particular design
may have different requirements, so please make the
necessary adjustments and save your customized
design rules under a new name.
Since Version 6.2.2 text objects can contain more than one line,
which will not be processed correctly with this version.
Since Version 8.2, EAGLE supports online libraries. The ids
of those online libraries will not be understood (or retained)
with this version.
Since Version 8.3, EAGLE supports URNs for individual library
assets (packages, symbols, and devices). The URNs of those assets
will not be understood (or retained) with this version.
Since Version 8.3, EAGLE supports the association of 3D packages
with devices in libraries, schematics, and board files. Those 3D
packages will not be understood (or retained) with this version.