(kicad_pcb (version 20171130) (host pcbnew 5.0.1)
  (general
    (thickness 1.6)
    (drawings 4)
    (tracks 100)
    (zones 0)
    (modules 16)
    (nets 21)
  )
  (page A4)
  (layers
    (0 F.Cu signal)
    (31 B.Cu signal)
    (32 B.Adhes user)
    (33 F.Adhes user)
    (34 B.Paste user)
    (35 F.Paste user)
    (36 B.SilkS user)
    (37 F.SilkS user)
    (38 B.Mask user)
    (39 F.Mask user)
    (40 Dwgs.User user)
    (41 Cmts.User user)
    (42 Eco1.User user)
    (43 Eco2.User user)
    (44 Edge.Cuts user)
    (45 Margin user)
    (46 B.CrtYd user)
    (47 F.CrtYd user)
    (48 B.Fab user)
    (49 F.Fab user)
  )
  (setup
    (last_trace_width 0.25)
    (trace_clearance 0.2)
    (zone_clearance 0.508)
    (zone_45_only no)
    (trace_min 0.2)
    (segment_width 0.2)
    (edge_width 0.15)
    (via_size 0.6)
    (via_drill 0.4)
    (via_min_size 0.4)
    (via_min_drill 0.3)
    (uvia_size 0.3)
    (uvia_drill 0.1)
    (uvias_allowed no)
    (uvia_min_size 0.2)
    (uvia_min_drill 0.1)
    (pcb_text_width 0.3)
    (pcb_text_size 1.5 1.5)
    (mod_edge_width 0.15)
    (mod_text_size 1 1)
    (mod_text_width 0.15)
    (pad_size 1.524 1.524)
    (pad_drill 0.762)
    (pad_to_mask_clearance 0.2)
    (solder_mask_min_width 0.25)
    (aux_axis_origin 0 0)
    (visible_elements FFFFFF7F)
    (pcbplotparams
      (layerselection 0x00030_80000001)
      (usegerberextensions false)
      (usegerberattributes false)
      (usegerberadvancedattributes false)
      (creategerberjobfile false)
      (excludeedgelayer true)
      (linewidth 0.100000)
      (plotframeref false)
      (viasonmask false)
      (mode 1)
      (useauxorigin false)
      (hpglpennumber 1)
      (hpglpenspeed 20)
      (hpglpendiameter 15.000000)
      (psnegative false)
      (psa4output false)
      (plotreference true)
      (plotvalue true)
      (plotinvisibletext false)
      (padsonsilk false)
      (subtractmaskfromsilk false)
      (outputformat 1)
      (mirror false)
      (drillshape 1)
      (scaleselection 1)
      (outputdirectory ""))
  )
  (net 0 "")
  (net 1 "Net-(C1-Pad1)")
  (net 2 GND)
  (net 3 "Net-(C2-Pad1)")
  (net 4 "Net-(C3-Pad1)")
  (net 5 "Net-(C4-Pad1)")
  (net 6 /IN_A1)
  (net 7 /IN_A2)
  (net 8 /IN_B1)
  (net 9 /IN_B2)
  (net 10 VCC)
  (net 11 "Net-(RV1-Pad2)")
  (net 12 "Net-(RV1-Pad3)")
  (net 13 "Net-(RV2-Pad2)")
  (net 14 "Net-(RV2-Pad3)")
  (net 15 "Net-(SW1-Pad5)")
  (net 16 "Net-(SW1-Pad2)")
  (net 17 "Net-(J3-Pad1)")
  (net 18 "Net-(J3-Pad2)")
  (net 19 "Net-(J3-Pad4)")
  (net 20 "Net-(J3-Pad3)")
  (net_class Default "This is the default net class."
    (clearance 0.2)
    (trace_width 0.25)
    (via_dia 0.6)
    (via_drill 0.4)
    (uvia_dia 0.3)
    (uvia_drill 0.1)
    (add_net /IN_A1)
    (add_net /IN_A2)
    (add_net /IN_B1)
    (add_net /IN_B2)
    (add_net GND)
    (add_net "Net-(C1-Pad1)")
    (add_net "Net-(C2-Pad1)")
    (add_net "Net-(C3-Pad1)")
    (add_net "Net-(C4-Pad1)")
    (add_net "Net-(J3-Pad1)")
    (add_net "Net-(J3-Pad2)")
    (add_net "Net-(J3-Pad3)")
    (add_net "Net-(J3-Pad4)")
    (add_net "Net-(RV1-Pad2)")
    (add_net "Net-(RV1-Pad3)")
    (add_net "Net-(RV2-Pad2)")
    (add_net "Net-(RV2-Pad3)")
    (add_net "Net-(SW1-Pad2)")
    (add_net "Net-(SW1-Pad5)")
    (add_net VCC)
  )
  (module Capacitors_SMD:C_0805_HandSoldering (layer F.Cu) (tedit 58AA84A8)
    (at 161 82 90)
    (descr "Capacitor SMD 0805, hand soldering")
    (tags "capacitor 0805")
    (attr smd)
    (fp_text reference C1 (at 0 1.75 90) (layer F.SilkS))
    (fp_text value 22nF (at 0 1.75 90) (layer F.Fab))
    (fp_text user %R (at 0 -1.75 90) (layer F.Fab))
    (pad 1 smd rect (at -1.25 0 90) (size 1.5 1.25) (layers F.Cu F.Paste F.Mask)
      (net 1 "Net-(C1-Pad1)"))
    (pad 2 smd rect (at 1.25 0 90) (size 1.5 1.25) (layers F.Cu F.Paste F.Mask)
      (net 2 GND))
    (model Capacitors_SMD.3dshapes/C_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_SMD:C_0805_HandSoldering (layer F.Cu) (tedit 58AA84A8)
    (at 161 87 270)
    (descr "Capacitor SMD 0805, hand soldering")
    (tags "capacitor 0805")
    (attr smd)
    (fp_text reference C2 (at 0 -1.75 270) (layer F.SilkS))
    (fp_text value 22nF (at 0 1.75 270) (layer F.Fab))
    (fp_text user %R (at 0 -1.75 270) (layer F.Fab))
    (pad 2 smd rect (at 1.25 0 270) (size 1.5 1.25) (layers F.Cu F.Paste F.Mask)
      (net 2 GND))
    (pad 1 smd rect (at -1.25 0 270) (size 1.5 1.25) (layers F.Cu F.Paste F.Mask)
      (net 3 "Net-(C2-Pad1)"))
    (model Capacitors_SMD.3dshapes/C_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_SMD:C_0805_HandSoldering (layer F.Cu) (tedit 58AA84A8)
    (at 161 92 90)
    (descr "Capacitor SMD 0805, hand soldering")
    (tags "capacitor 0805")
    (attr smd)
    (fp_text reference C3 (at 0 1.75 90) (layer F.SilkS))
    (fp_text value 22nF (at 0 1.75 90) (layer F.Fab))
    (fp_text user %R (at 0 -1.75 90) (layer F.Fab))
    (pad 2 smd rect (at 1.25 0 90) (size 1.5 1.25) (layers F.Cu F.Paste F.Mask)
      (net 2 GND))
    (pad 1 smd rect (at -1.25 0 90) (size 1.5 1.25) (layers F.Cu F.Paste F.Mask)
      (net 4 "Net-(C3-Pad1)"))
    (model Capacitors_SMD.3dshapes/C_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_SMD:C_0805_HandSoldering (layer F.Cu) (tedit 58AA84A8)
    (at 161 97 270)
    (descr "Capacitor SMD 0805, hand soldering")
    (tags "capacitor 0805")
    (attr smd)
    (fp_text reference C4 (at 0 -1.75 270) (layer F.SilkS))
    (fp_text value 22nF (at 0 1.75 270) (layer F.Fab))
    (fp_text user %R (at 0 -1.75 270) (layer F.Fab))
    (pad 1 smd rect (at -1.25 0 270) (size 1.5 1.25) (layers F.Cu F.Paste F.Mask)
      (net 5 "Net-(C4-Pad1)"))
    (pad 2 smd rect (at 1.25 0 270) (size 1.5 1.25) (layers F.Cu F.Paste F.Mask)
      (net 2 GND))
    (model Capacitors_SMD.3dshapes/C_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Pin_Headers:Pin_Header_Straight_1x02_Pitch2.54mm (layer F.Cu) (tedit 59650532)
    (at 172.5 83 90)
    (descr "Through hole straight pin header, 1x02, 2.54mm pitch, single row")
    (tags "Through hole pin header THT 1x02 2.54mm single row")
    (fp_text reference J1 (at 2.25 3.25 180) (layer F.SilkS))
    (fp_text value Conn_01x02 (at 0 4.87 90) (layer F.Fab))
    (fp_text user %R (at 0 1.27 180) (layer F.Fab))
    (pad 2 thru_hole oval (at 0 2.54 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 2 GND))
    (pad 1 thru_hole rect (at 0 0 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 10 VCC))
    (model ${KISYS3DMOD}/Pin_Headers.3dshapes/Pin_Header_Straight_1x02_Pitch2.54mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Pin_Headers:Pin_Header_Straight_2x04_Pitch2.54mm (layer F.Cu) (tedit 59650532)
    (at 172.5 86.96)
    (descr "Through hole straight pin header, 2x04, 2.54mm pitch, double rows")
    (tags "Through hole pin header THT 2x04 2.54mm double row")
    (fp_text reference J2 (at 3 -1.96) (layer F.SilkS))
    (fp_text value Conn_02x04 (at 1.27 9.95) (layer F.Fab))
    (fp_text user %R (at 1.27 3.81 90) (layer F.Fab))
    (pad 8 thru_hole oval (at 2.54 7.62) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 2 GND))
    (pad 7 thru_hole oval (at 0 7.62) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 9 /IN_B2))
    (pad 6 thru_hole oval (at 2.54 5.08) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 2 GND))
    (pad 5 thru_hole oval (at 0 5.08) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 8 /IN_B1))
    (pad 4 thru_hole oval (at 2.54 2.54) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 2 GND))
    (pad 3 thru_hole oval (at 0 2.54) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 7 /IN_A2))
    (pad 2 thru_hole oval (at 2.54 0) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 2 GND))
    (pad 1 thru_hole rect (at 0 0) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 6 /IN_A1))
    (model ${KISYS3DMOD}/Pin_Headers.3dshapes/Pin_Header_Straight_2x04_Pitch2.54mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Pin_Headers:Pin_Header_Straight_1x04_Pitch2.54mm (layer F.Cu) (tedit 59650532)
    (at 153 85.5)
    (descr "Through hole straight pin header, 1x04, 2.54mm pitch, single row")
    (tags "Through hole pin header THT 1x04 2.54mm single row")
    (fp_text reference J3 (at 0 -2.33) (layer F.SilkS))
    (fp_text value Conn_01x04 (at 0 9.95) (layer F.Fab))
    (fp_text user %R (at 0 3.81 90) (layer F.Fab))
    (pad 4 thru_hole oval (at 0 7.62) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 19 "Net-(J3-Pad4)"))
    (pad 3 thru_hole oval (at 0 5.08) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 20 "Net-(J3-Pad3)"))
    (pad 2 thru_hole oval (at 0 2.54) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 18 "Net-(J3-Pad2)"))
    (pad 1 thru_hole rect (at 0 0) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 17 "Net-(J3-Pad1)"))
    (model ${KISYS3DMOD}/Pin_Headers.3dshapes/Pin_Header_Straight_1x04_Pitch2.54mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistors_SMD:R_0805_HandSoldering (layer F.Cu) (tedit 58E0A804)
    (at 165.5 85)
    (descr "Resistor SMD 0805, hand soldering")
    (tags "resistor 0805")
    (attr smd)
    (fp_text reference R1 (at 1.5 1.5) (layer F.SilkS))
    (fp_text value 22K (at 0 1.75) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd rect (at 1.35 0) (size 1.5 1.3) (layers F.Cu F.Paste F.Mask)
      (net 6 /IN_A1))
    (pad 1 smd rect (at -1.35 0) (size 1.5 1.3) (layers F.Cu F.Paste F.Mask)
      (net 1 "Net-(C1-Pad1)"))
    (model ${KISYS3DMOD}/Resistors_SMD.3dshapes/R_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistors_SMD:R_0805_HandSoldering (layer F.Cu) (tedit 58E0A804)
    (at 165.5 88)
    (descr "Resistor SMD 0805, hand soldering")
    (tags "resistor 0805")
    (attr smd)
    (fp_text reference R2 (at 1.5 1.5) (layer F.SilkS))
    (fp_text value 22K (at 0 1.75) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 1 smd rect (at -1.35 0) (size 1.5 1.3) (layers F.Cu F.Paste F.Mask)
      (net 3 "Net-(C2-Pad1)"))
    (pad 2 smd rect (at 1.35 0) (size 1.5 1.3) (layers F.Cu F.Paste F.Mask)
      (net 7 /IN_A2))
    (model ${KISYS3DMOD}/Resistors_SMD.3dshapes/R_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistors_SMD:R_0805_HandSoldering (layer F.Cu) (tedit 58E0A804)
    (at 165.5 91)
    (descr "Resistor SMD 0805, hand soldering")
    (tags "resistor 0805")
    (attr smd)
    (fp_text reference R3 (at 1.5 1.5) (layer F.SilkS))
    (fp_text value 22K (at 0 1.75) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd rect (at 1.35 0) (size 1.5 1.3) (layers F.Cu F.Paste F.Mask)
      (net 8 /IN_B1))
    (pad 1 smd rect (at -1.35 0) (size 1.5 1.3) (layers F.Cu F.Paste F.Mask)
      (net 4 "Net-(C3-Pad1)"))
    (model ${KISYS3DMOD}/Resistors_SMD.3dshapes/R_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistors_SMD:R_0805_HandSoldering (layer F.Cu) (tedit 58E0A804)
    (at 165.5 94)
    (descr "Resistor SMD 0805, hand soldering")
    (tags "resistor 0805")
    (attr smd)
    (fp_text reference R4 (at 1.5 1.75) (layer F.SilkS))
    (fp_text value 22K (at 0 1.75 180) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 1 smd rect (at -1.35 0) (size 1.5 1.3) (layers F.Cu F.Paste F.Mask)
      (net 5 "Net-(C4-Pad1)"))
    (pad 2 smd rect (at 1.35 0) (size 1.5 1.3) (layers F.Cu F.Paste F.Mask)
      (net 9 /IN_B2))
    (model ${KISYS3DMOD}/Resistors_SMD.3dshapes/R_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module TRIM_MODEL_23:TRIM_Model_23 (layer F.Cu) (tedit 5CAD1C67)
    (at 157 86 90)
    (fp_text reference RV1 (at -1 2.25 90) (layer F.SilkS))
    (fp_text value 50K (at 0 -3.81 90) (layer F.Fab))
    (pad 1 smd rect (at -2 0 90) (size 2 2) (layers F.Cu F.Paste F.Mask)
      (net 2 GND))
    (pad 2 smd rect (at 2 -1.15 90) (size 2 1.3) (layers F.Cu F.Paste F.Mask)
      (net 11 "Net-(RV1-Pad2)"))
    (pad 3 smd rect (at 2 1.15 90) (size 2 1.3) (layers F.Cu F.Paste F.Mask)
      (net 12 "Net-(RV1-Pad3)"))
  )
  (module TRIM_MODEL_23:TRIM_Model_23 (layer F.Cu) (tedit 5CAD1C67)
    (at 157 93 270)
    (fp_text reference RV2 (at -0.75 -2.25 270) (layer F.SilkS))
    (fp_text value 50K (at 0 -3.81 270) (layer F.Fab))
    (pad 3 smd rect (at 2 1.15 270) (size 2 1.3) (layers F.Cu F.Paste F.Mask)
      (net 14 "Net-(RV2-Pad3)"))
    (pad 2 smd rect (at 2 -1.15 270) (size 2 1.3) (layers F.Cu F.Paste F.Mask)
      (net 13 "Net-(RV2-Pad2)"))
    (pad 1 smd rect (at -2 0 270) (size 2 2) (layers F.Cu F.Paste F.Mask)
      (net 2 GND))
  )
  (module CS-4-22YB:CS-4-22YB (layer B.Cu) (tedit 5CAD25B3)
    (at 168 89.5 180)
    (fp_text reference SW1 (at 0 -5 180) (layer B.SilkS))
    (fp_text value SW_DPDT_x2 (at 0 5 180) (layer B.Fab))
    (pad 6 smd rect (at 1.3 -3.25 180) (size 0.6 1.5) (layers B.Cu B.Paste B.Mask)
      (net 10 VCC))
    (pad 5 smd rect (at 0 -3.25 180) (size 0.6 1.5) (layers B.Cu B.Paste B.Mask)
      (net 15 "Net-(SW1-Pad5)"))
    (pad 4 smd rect (at -1.3 -3.25 180) (size 0.6 1.5) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (pad 3 smd rect (at 1.3 3.25 180) (size 0.6 1.5) (layers B.Cu B.Paste B.Mask)
      (net 10 VCC))
    (pad 2 smd rect (at 0 3.25 180) (size 0.6 1.5) (layers B.Cu B.Paste B.Mask)
      (net 16 "Net-(SW1-Pad2)"))
    (pad 1 smd rect (at -1.3 3.25 180) (size 0.6 1.5) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
  )
  (module Housings_SOIC:SOIC-8_3.9x4.9mm_Pitch1.27mm (layer B.Cu) (tedit 58CD0CDA)
    (at 161 85 180)
    (descr "8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [SOIC] (see Microchip Packaging Specification 00000049BS.pdf)")
    (tags "SOIC 1.27")
    (attr smd)
    (fp_text reference U1 (at 0 3.5 180) (layer B.SilkS))
    (fp_text value NCV1124 (at 0 -3.5 180) (layer B.Fab))
    (fp_text user %R (at 0 0 180) (layer B.Fab))
    (pad 8 smd rect (at 2.7 1.905 180) (size 1.55 0.6) (layers B.Cu B.Paste B.Mask)
      (net 10 VCC))
    (pad 7 smd rect (at 2.7 0.635 180) (size 1.55 0.6) (layers B.Cu B.Paste B.Mask)
      (net 17 "Net-(J3-Pad1)"))
    (pad 6 smd rect (at 2.7 -0.635 180) (size 1.55 0.6) (layers B.Cu B.Paste B.Mask)
      (net 18 "Net-(J3-Pad2)"))
    (pad 5 smd rect (at 2.7 -1.905 180) (size 1.55 0.6) (layers B.Cu B.Paste B.Mask)
      (net 16 "Net-(SW1-Pad2)"))
    (pad 4 smd rect (at -2.7 -1.905 180) (size 1.55 0.6) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (pad 3 smd rect (at -2.7 -0.635 180) (size 1.55 0.6) (layers B.Cu B.Paste B.Mask)
      (net 3 "Net-(C2-Pad1)"))
    (pad 2 smd rect (at -2.7 0.635 180) (size 1.55 0.6) (layers B.Cu B.Paste B.Mask)
      (net 1 "Net-(C1-Pad1)"))
    (pad 1 smd rect (at -2.7 1.905 180) (size 1.55 0.6) (layers B.Cu B.Paste B.Mask)
      (net 11 "Net-(RV1-Pad2)"))
    (model ${KISYS3DMOD}/Housings_SOIC.3dshapes/SOIC-8_3.9x4.9mm_Pitch1.27mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Housings_SOIC:SOIC-8_3.9x4.9mm_Pitch1.27mm (layer B.Cu) (tedit 58CD0CDA)
    (at 161 94 180)
    (descr "8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [SOIC] (see Microchip Packaging Specification 00000049BS.pdf)")
    (tags "SOIC 1.27")
    (attr smd)
    (fp_text reference U2 (at 0 3.5 180) (layer B.SilkS))
    (fp_text value NCV1124 (at 0 -3.5 180) (layer B.Fab))
    (fp_text user %R (at 0 0 180) (layer B.Fab))
    (pad 1 smd rect (at -2.7 1.905 180) (size 1.55 0.6) (layers B.Cu B.Paste B.Mask)
      (net 13 "Net-(RV2-Pad2)"))
    (pad 2 smd rect (at -2.7 0.635 180) (size 1.55 0.6) (layers B.Cu B.Paste B.Mask)
      (net 4 "Net-(C3-Pad1)"))
    (pad 3 smd rect (at -2.7 -0.635 180) (size 1.55 0.6) (layers B.Cu B.Paste B.Mask)
      (net 5 "Net-(C4-Pad1)"))
    (pad 4 smd rect (at -2.7 -1.905 180) (size 1.55 0.6) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (pad 5 smd rect (at 2.7 -1.905 180) (size 1.55 0.6) (layers B.Cu B.Paste B.Mask)
      (net 15 "Net-(SW1-Pad5)"))
    (pad 6 smd rect (at 2.7 -0.635 180) (size 1.55 0.6) (layers B.Cu B.Paste B.Mask)
      (net 19 "Net-(J3-Pad4)"))
    (pad 7 smd rect (at 2.7 0.635 180) (size 1.55 0.6) (layers B.Cu B.Paste B.Mask)
      (net 20 "Net-(J3-Pad3)"))
    (pad 8 smd rect (at 2.7 1.905 180) (size 1.55 0.6) (layers B.Cu B.Paste B.Mask)
      (net 10 VCC))
    (model ${KISYS3DMOD}/Housings_SOIC.3dshapes/SOIC-8_3.9x4.9mm_Pitch1.27mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
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