(kicad_pcb (version 20171130) (host pcbnew 5.0.1)
  (general
    (thickness 1.6)
    (drawings 15)
    (tracks 245)
    (zones 0)
    (modules 28)
    (nets 17)
  )
  (page A4)
  (layers
    (0 F.Cu signal)
    (31 B.Cu signal)
    (32 B.Adhes user)
    (33 F.Adhes user)
    (34 B.Paste user)
    (35 F.Paste user)
    (36 B.SilkS user)
    (37 F.SilkS user)
    (38 B.Mask user)
    (39 F.Mask user)
    (40 Dwgs.User user)
    (41 Cmts.User user)
    (42 Eco1.User user)
    (43 Eco2.User user)
    (44 Edge.Cuts user)
    (45 Margin user)
    (46 B.CrtYd user)
    (47 F.CrtYd user)
    (48 B.Fab user hide)
    (49 F.Fab user hide)
  )
  (setup
    (last_trace_width 0.508)
    (user_trace_width 0.1524)
    (user_trace_width 0.2032)
    (user_trace_width 0.3048)
    (user_trace_width 0.508)
    (user_trace_width 0.762)
    (trace_clearance 0.1524)
    (zone_clearance 0.508)
    (zone_45_only no)
    (trace_min 0.1524)
    (segment_width 0.2)
    (edge_width 0.15)
    (via_size 0.6858)
    (via_drill 0.3302)
    (via_min_size 0.508)
    (via_min_drill 0.254)
    (user_via 0.6858 0.3302)
    (user_via 0.889 0.381)
    (uvia_size 0.6858)
    (uvia_drill 0.3302)
    (uvias_allowed no)
    (uvia_min_size 0.2)
    (uvia_min_drill 0.1)
    (pcb_text_width 0.3)
    (pcb_text_size 1.5 1.5)
    (mod_edge_width 0.15)
    (mod_text_size 1 1)
    (mod_text_width 0.15)
    (pad_size 1.524 1.524)
    (pad_drill 0.762)
    (pad_to_mask_clearance 0.2)
    (solder_mask_min_width 0.25)
    (aux_axis_origin 0 0)
    (grid_origin 136.5 113)
    (visible_elements 7FFFFFFF)
    (pcbplotparams
      (layerselection 0x010fc_ffffffff)
      (usegerberextensions false)
      (usegerberattributes false)
      (usegerberadvancedattributes false)
      (creategerberjobfile false)
      (excludeedgelayer true)
      (linewidth 0.100000)
      (plotframeref false)
      (viasonmask false)
      (mode 1)
      (useauxorigin false)
      (hpglpennumber 1)
      (hpglpenspeed 20)
      (hpglpendiameter 15.000000)
      (psnegative false)
      (psa4output false)
      (plotreference true)
      (plotvalue true)
      (plotinvisibletext false)
      (padsonsilk false)
      (subtractmaskfromsilk false)
      (outputformat 1)
      (mirror false)
      (drillshape 1)
      (scaleselection 1)
      (outputdirectory ""))
  )
  (net 0 "")
  (net 1 "Net-(J2-Pad4)")
  (net 2 "Net-(J2-Pad3)")
  (net 3 "Net-(U1-Pad2)")
  (net 4 "Net-(U2-Pad2)")
  (net 5 "Net-(Q1-Pad4)")
  (net 6 "Net-(Q2-Pad4)")
  (net 7 "Net-(C1-Pad1)")
  (net 8 /glitch_out)
  (net 9 /+3v3)
  (net 10 /+12v0)
  (net 11 /v_glitch)
  (net 12 GND)
  (net 13 "Net-(R3-Pad2)")
  (net 14 /trigger_s)
  (net 15 /trigger_v)
  (net 16 "Net-(R4-Pad2)")
  (net_class Default "This is the default net class."
    (clearance 0.1524)
    (trace_width 0.1524)
    (via_dia 0.6858)
    (via_drill 0.3302)
    (uvia_dia 0.6858)
    (uvia_drill 0.3302)
    (add_net /+12v0)
    (add_net /+3v3)
    (add_net /glitch_out)
    (add_net /trigger_s)
    (add_net /trigger_v)
    (add_net /v_glitch)
    (add_net GND)
    (add_net "Net-(C1-Pad1)")
    (add_net "Net-(J2-Pad3)")
    (add_net "Net-(J2-Pad4)")
    (add_net "Net-(Q1-Pad4)")
    (add_net "Net-(Q2-Pad4)")
    (add_net "Net-(R3-Pad2)")
    (add_net "Net-(R4-Pad2)")
    (add_net "Net-(U1-Pad2)")
    (add_net "Net-(U2-Pad2)")
  )
  (module custom-old:keystone-5019-tp (layer F.Cu) (tedit 5C27A21E)
    (at 178.325 114.65)
    (fp_text reference TP2 (at 0 -2.09) (layer F.SilkS) hide)
    (fp_text value TestPoint (at -0.275 -9.025) (layer F.Fab))
    (pad 1 smd rect (at 0 0) (size 3.8 2.03) (layers F.Cu F.Paste F.Mask)
      (net 8 /glitch_out))
  )
  (module Resistor_SMD:R_0603_1608Metric (layer F.Cu) (tedit 5C27A20F)
    (at 159.16 114.0725 270)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags resistor)
    (attr smd)
    (fp_text reference R4 (at 0.4675 1.4 90) (layer F.SilkS) hide)
    (fp_text value 100 (at 0 1.43 270) (layer F.Fab))
    (fp_text user %R (at 0 0 270) (layer F.Fab))
    (pad 2 smd roundrect (at 0.7875 0 270) (size 0.875 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 16 "Net-(R4-Pad2)"))
    (pad 1 smd roundrect (at -0.7875 0 270) (size 0.875 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 6 "Net-(Q2-Pad4)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric (layer F.Cu) (tedit 5C27A204)
    (at 143.95 94.325 90)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags resistor)
    (attr smd)
    (fp_text reference R1 (at 0 -1.43 90) (layer F.SilkS) hide)
    (fp_text value 47k (at 0 1.43 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 1 smd roundrect (at -0.7875 0 90) (size 0.875 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 15 /trigger_v))
    (pad 2 smd roundrect (at 0.7875 0 90) (size 0.875 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 12 GND))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric (layer F.Cu) (tedit 5C27A217)
    (at 155.72 107.03)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags resistor)
    (attr smd)
    (fp_text reference R2 (at -0.69 -1.32 180) (layer F.SilkS) hide)
    (fp_text value 47k (at 0 1.43) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd roundrect (at 0.7875 0) (size 0.875 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 12 GND))
    (pad 1 smd roundrect (at -0.7875 0) (size 0.875 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 14 /trigger_s))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric (layer F.Cu) (tedit 5C27A213)
    (at 159.24 104.81 270)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags resistor)
    (attr smd)
    (fp_text reference R3 (at 0.17 1.35 90) (layer F.SilkS) hide)
    (fp_text value 100 (at 0 1.43 270) (layer F.Fab))
    (fp_text user %R (at 0 0 270) (layer F.Fab))
    (pad 1 smd roundrect (at -0.7875 0 270) (size 0.875 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 5 "Net-(Q1-Pad4)"))
    (pad 2 smd roundrect (at 0.7875 0 270) (size 0.875 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 13 "Net-(R3-Pad2)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Pin_Headers:Pin_Header_Angled_1x05_Pitch2.54mm (layer F.Cu) (tedit 59650532)
    (at 147.025 94.175 90)
    (descr "Through hole angled pin header, 1x05, 2.54mm pitch, 6mm pin length, single row")
    (tags "Through hole angled pin header THT 1x05 2.54mm single row")
    (fp_text reference J1 (at 4.385 -2.27 90) (layer F.SilkS))
    (fp_text value Conn_01x05 (at 4.385 12.43 90) (layer F.Fab))
    (fp_text user %R (at 2.77 5.08 180) (layer F.Fab))
    (pad 5 thru_hole oval (at 0 10.16 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 11 /v_glitch))
    (pad 4 thru_hole oval (at 0 7.62 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 12 GND))
    (pad 3 thru_hole oval (at 0 5.08 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 12 GND))
    (pad 2 thru_hole oval (at 0 2.54 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 10 /+12v0))
    (pad 1 thru_hole rect (at 0 0 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 12 GND))
    (model ${KISYS3DMOD}/Pin_Headers.3dshapes/Pin_Header_Angled_1x05_Pitch2.54mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_SMD:C_0603 (layer F.Cu) (tedit 59958EE7)
    (at 164.525 96.35 90)
    (descr "Capacitor SMD 0603, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0603")
    (attr smd)
    (fp_text reference C9 (at 2.35 0.035 90) (layer F.SilkS))
    (fp_text value 1u (at 0 1.5 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd rect (at 0.75 0 90) (size 0.8 0.75) (layers F.Cu F.Paste F.Mask)
      (net 12 GND))
    (pad 1 smd rect (at -0.75 0 90) (size 0.8 0.75) (layers F.Cu F.Paste F.Mask)
      (net 11 /v_glitch))
    (model Capacitors_SMD.3dshapes/C_0603.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_SMD:C_0603 (layer F.Cu) (tedit 59958EE7)
    (at 161.5 96.35 90)
    (descr "Capacitor SMD 0603, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0603")
    (attr smd)
    (fp_text reference C10 (at 2.825 0 90) (layer F.SilkS))
    (fp_text value 0.1u (at 0 1.5 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 1 smd rect (at -0.75 0 90) (size 0.8 0.75) (layers F.Cu F.Paste F.Mask)
      (net 11 /v_glitch))
    (pad 2 smd rect (at 0.75 0 90) (size 0.8 0.75) (layers F.Cu F.Paste F.Mask)
      (net 12 GND))
    (model Capacitors_SMD.3dshapes/C_0603.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_SMD:C_0603 (layer F.Cu) (tedit 59958EE7)
    (at 163 96.35 90)
    (descr "Capacitor SMD 0603, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0603")
    (attr smd)
    (fp_text reference C11 (at 2.825 0.025 90) (layer F.SilkS))
    (fp_text value 10n (at 0 1.5 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd rect (at 0.75 0 90) (size 0.8 0.75) (layers F.Cu F.Paste F.Mask)
      (net 12 GND))
    (pad 1 smd rect (at -0.75 0 90) (size 0.8 0.75) (layers F.Cu F.Paste F.Mask)
      (net 11 /v_glitch))
    (model Capacitors_SMD.3dshapes/C_0603.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_SMD:C_0603 (layer F.Cu) (tedit 59958EE7)
    (at 160 96.35 90)
    (descr "Capacitor SMD 0603, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0603")
    (attr smd)
    (fp_text reference C12 (at 2.825 0 90) (layer F.SilkS))
    (fp_text value 47p (at 0 1.5 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 1 smd rect (at -0.75 0 90) (size 0.8 0.75) (layers F.Cu F.Paste F.Mask)
      (net 11 /v_glitch))
    (pad 2 smd rect (at 0.75 0 90) (size 0.8 0.75) (layers F.Cu F.Paste F.Mask)
      (net 12 GND))
    (model Capacitors_SMD.3dshapes/C_0603.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_SMD:C_0603 (layer F.Cu) (tedit 59958EE7)
    (at 150.625 111.45 90)
    (descr "Capacitor SMD 0603, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0603")
    (attr smd)
    (fp_text reference C7 (at -2.375 0.025 90) (layer F.SilkS))
    (fp_text value 10n (at 0 1.5 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd rect (at 0.75 0 90) (size 0.8 0.75) (layers F.Cu F.Paste F.Mask)
      (net 12 GND))
    (pad 1 smd rect (at -0.75 0 90) (size 0.8 0.75) (layers F.Cu F.Paste F.Mask)
      (net 10 /+12v0))
    (model Capacitors_SMD.3dshapes/C_0603.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_SMD:C_0603 (layer F.Cu) (tedit 59958EE7)
    (at 152.05 101.825 90)
    (descr "Capacitor SMD 0603, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0603")
    (attr smd)
    (fp_text reference C6 (at -2.375 -0.025 90) (layer F.SilkS))
    (fp_text value 0.1u (at 0 1.5 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 1 smd rect (at -0.75 0 90) (size 0.8 0.75) (layers F.Cu F.Paste F.Mask)
      (net 10 /+12v0))
    (pad 2 smd rect (at 0.75 0 90) (size 0.8 0.75) (layers F.Cu F.Paste F.Mask)
      (net 12 GND))
    (model Capacitors_SMD.3dshapes/C_0603.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_SMD:C_0603 (layer F.Cu) (tedit 59958EE7)
    (at 152.05 111.45 90)
    (descr "Capacitor SMD 0603, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0603")
    (attr smd)
    (fp_text reference C5 (at -2.4 0.075 90) (layer F.SilkS))
    (fp_text value 0.1u (at 0 1.5 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd rect (at 0.75 0 90) (size 0.8 0.75) (layers F.Cu F.Paste F.Mask)
      (net 12 GND))
    (pad 1 smd rect (at -0.75 0 90) (size 0.8 0.75) (layers F.Cu F.Paste F.Mask)
      (net 10 /+12v0))
    (model Capacitors_SMD.3dshapes/C_0603.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_SMD:C_0603 (layer F.Cu) (tedit 59958EE7)
    (at 153.5 101.825 90)
    (descr "Capacitor SMD 0603, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0603")
    (attr smd)
    (fp_text reference C4 (at -2.325 0.05 90) (layer F.SilkS))
    (fp_text value 1u (at 0 1.5 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 1 smd rect (at -0.75 0 90) (size 0.8 0.75) (layers F.Cu F.Paste F.Mask)
      (net 10 /+12v0))
    (pad 2 smd rect (at 0.75 0 90) (size 0.8 0.75) (layers F.Cu F.Paste F.Mask)
      (net 12 GND))
    (model Capacitors_SMD.3dshapes/C_0603.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_SMD:C_0603 (layer F.Cu) (tedit 59958EE7)
    (at 153.475 111.45 90)
    (descr "Capacitor SMD 0603, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0603")
    (attr smd)
    (fp_text reference C3 (at -2.325 0.225 90) (layer F.SilkS))
    (fp_text value 1u (at 0 1.5 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd rect (at 0.75 0 90) (size 0.8 0.75) (layers F.Cu F.Paste F.Mask)
      (net 12 GND))
    (pad 1 smd rect (at -0.75 0 90) (size 0.8 0.75) (layers F.Cu F.Paste F.Mask)
      (net 10 /+12v0))
    (model Capacitors_SMD.3dshapes/C_0603.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_SMD:C_0603 (layer F.Cu) (tedit 59958EE7)
    (at 150.625 101.825 90)
    (descr "Capacitor SMD 0603, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0603")
    (attr smd)
    (fp_text reference C8 (at -2.4 0 90) (layer F.SilkS))
    (fp_text value 10n (at 0 1.5 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 1 smd rect (at -0.75 0 90) (size 0.8 0.75) (layers F.Cu F.Paste F.Mask)
      (net 10 /+12v0))
    (pad 2 smd rect (at 0.75 0 90) (size 0.8 0.75) (layers F.Cu F.Paste F.Mask)
      (net 12 GND))
    (model Capacitors_SMD.3dshapes/C_0603.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Custom:keystone-5019-tp (layer F.Cu) (tedit 5B8A5C26)
    (at 166.975 111.425 270)
    (fp_text reference TP3 (at 0 -2.09 270) (layer F.SilkS) hide)
    (fp_text value TestPoint (at -0.275 -9.025 270) (layer F.Fab))
    (pad 1 smd rect (at 0 0 270) (size 3.8 2.03) (layers F.Cu F.Paste F.Mask)
      (net 6 "Net-(Q2-Pad4)"))
  )
  (module Custom:keystone-5019-tp (layer F.Cu) (tedit 5B8A5C21)
    (at 167.075 102.175 270)
    (fp_text reference TP4 (at 0 -2.09 270) (layer F.SilkS) hide)
    (fp_text value TestPoint (at -0.275 -9.025 270) (layer F.Fab))
    (pad 1 smd rect (at 0 0 270) (size 3.8 2.03) (layers F.Cu F.Paste F.Mask)
      (net 5 "Net-(Q1-Pad4)"))
  )
  (module Custom:keystone-5019-tp (layer F.Cu) (tedit 5B8A5C23)
    (at 167.075 97.375 270)
    (fp_text reference TP5 (at 0 -2.09 270) (layer F.SilkS) hide)
    (fp_text value TestPoint (at -0.275 -9.025 270) (layer F.Fab))
    (pad 1 smd rect (at 0 0 270) (size 3.8 2.03) (layers F.Cu F.Paste F.Mask)
      (net 11 /v_glitch))
  )
  (module Capacitors_SMD:C_0603 (layer F.Cu) (tedit 59958EE7)
    (at 169.63 113.01 270)
    (descr "Capacitor SMD 0603, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0603")
    (attr smd)
    (fp_text reference C2 (at 2.39 0.03 90) (layer F.SilkS))
    (fp_text value 47p (at 0 1.5 270) (layer F.Fab))
    (fp_text user %R (at 0 0 270) (layer F.Fab))
    (pad 2 smd rect (at 0.75 0 270) (size 0.8 0.75) (layers F.Cu F.Paste F.Mask)
      (net 12 GND))
    (pad 1 smd rect (at -0.75 0 270) (size 0.8 0.75) (layers F.Cu F.Paste F.Mask)
      (net 7 "Net-(C1-Pad1)"))
    (model Capacitors_SMD.3dshapes/C_0603.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_SMD:C_0603 (layer F.Cu) (tedit 59958EE7)
    (at 171.62 113.01 270)
    (descr "Capacitor SMD 0603, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0603")
    (attr smd)
    (fp_text reference C1 (at 2.34 0.045 270) (layer F.SilkS))
    (fp_text value 10n (at 0 1.5 270) (layer F.Fab))
    (fp_text user %R (at 0 0 270) (layer F.Fab))
    (pad 1 smd rect (at -0.75 0 270) (size 0.8 0.75) (layers F.Cu F.Paste F.Mask)
      (net 7 "Net-(C1-Pad1)"))
    (pad 2 smd rect (at 0.75 0 270) (size 0.8 0.75) (layers F.Cu F.Paste F.Mask)
      (net 12 GND))
    (model Capacitors_SMD.3dshapes/C_0603.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Pin_Headers:Pin_Header_Straight_1x02_Pitch2.54mm (layer F.Cu) (tedit 5B8A5CAC)
    (at 177.5 110.4 90)
    (descr "Through hole straight pin header, 1x02, 2.54mm pitch, single row")
    (tags "Through hole pin header THT 1x02 2.54mm single row")
    (fp_text reference J4 (at 2.55 1.2 180) (layer F.SilkS) hide)
    (fp_text value Conn_01x02 (at 0 4.87 90) (layer F.Fab))
    (fp_text user %R (at 0 1.27 180) (layer F.Fab))
    (pad 1 thru_hole rect (at 0 0 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 8 /glitch_out))
    (pad 2 thru_hole oval (at 0 2.54 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 12 GND))
    (model ${KISYS3DMOD}/Pin_Headers.3dshapes/Pin_Header_Straight_1x02_Pitch2.54mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Pin_Headers:Pin_Header_Straight_1x02_Pitch2.54mm (layer F.Cu) (tedit 5B8A5CAF)
    (at 172.76 108.74 270)
    (descr "Through hole straight pin header, 1x02, 2.54mm pitch, single row")
    (tags "Through hole pin header THT 1x02 2.54mm single row")
    (fp_text reference J3 (at -2.515 1.085) (layer F.SilkS) hide)
    (fp_text value Conn_01x02 (at 0 4.87 270) (layer F.Fab))
    (fp_text user %R (at 0 1.27) (layer F.Fab))
    (pad 2 thru_hole oval (at 0 2.54 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 7 "Net-(C1-Pad1)"))
    (pad 1 thru_hole rect (at 0 0 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 8 /glitch_out))
    (model ${KISYS3DMOD}/Pin_Headers.3dshapes/Pin_Header_Straight_1x02_Pitch2.54mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Housings_SOIC:SOIC-8_3.9x4.9mm_Pitch1.27mm (layer F.Cu) (tedit 58CD0CDA)
    (at 162.89 111.49 90)
    (descr "8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [SOIC] (see Microchip Packaging Specification 00000049BS.pdf)")
    (tags "SOIC 1.27")
    (attr smd)
    (fp_text reference Q2 (at 0 -3.5 90) (layer F.SilkS))
    (fp_text value IRF7807 (at 0 3.5 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 1 smd rect (at -2.7 -1.905 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 12 GND))
    (pad 2 smd rect (at -2.7 -0.635 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 12 GND))
    (pad 3 smd rect (at -2.7 0.635 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 12 GND))
    (pad 4 smd rect (at -2.7 1.905 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 6 "Net-(Q2-Pad4)"))
    (pad 5 smd rect (at 2.7 1.905 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 7 "Net-(C1-Pad1)"))
    (pad 6 smd rect (at 2.7 0.635 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 7 "Net-(C1-Pad1)"))
    (pad 7 smd rect (at 2.7 -0.635 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 7 "Net-(C1-Pad1)"))
    (pad 8 smd rect (at 2.7 -1.905 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 7 "Net-(C1-Pad1)"))
    (model ${KISYS3DMOD}/Housings_SOIC.3dshapes/SOIC-8_3.9x4.9mm_Pitch1.27mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Housings_SOIC:SOIC-8_3.9x4.9mm_Pitch1.27mm (layer F.Cu) (tedit 58CD0CDA)
    (at 162.88 102.18 90)
    (descr "8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [SOIC] (see Microchip Packaging Specification 00000049BS.pdf)")
    (tags "SOIC 1.27")
    (attr smd)
    (fp_text reference Q1 (at 0 -3.5 90) (layer F.SilkS))
    (fp_text value IRF7807 (at 0 3.5 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 8 smd rect (at 2.7 -1.905 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 11 /v_glitch))
    (pad 7 smd rect (at 2.7 -0.635 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 11 /v_glitch))
    (pad 6 smd rect (at 2.7 0.635 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 11 /v_glitch))
    (pad 5 smd rect (at 2.7 1.905 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 11 /v_glitch))
    (pad 4 smd rect (at -2.7 1.905 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 5 "Net-(Q1-Pad4)"))
    (pad 3 smd rect (at -2.7 0.635 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 7 "Net-(C1-Pad1)"))
    (pad 2 smd rect (at -2.7 -0.635 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 7 "Net-(C1-Pad1)"))
    (pad 1 smd rect (at -2.7 -1.905 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 7 "Net-(C1-Pad1)"))
    (model ${KISYS3DMOD}/Housings_SOIC.3dshapes/SOIC-8_3.9x4.9mm_Pitch1.27mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Housings_SON:WSON-6-1EP_3x3mm_Pitch0.95mm (layer F.Cu) (tedit 59DE6E28)
    (at 156.2 111.475 90)
    (descr "WSON6 3*3 MM, 0.95 PITCH; http://www.ti.com/lit/ds/symlink/lmr62421.pdf")
    (tags "WSON6 0.95")
    (attr smd)
    (fp_text reference U2 (at -2.725 -0.025 180) (layer F.SilkS))
    (fp_text value LM5134 (at 0 2.575 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 1 smd rect (at -1.34 -0.95 90) (size 0.63 0.45) (layers F.Cu F.Paste F.Mask)
      (net 10 /+12v0))
    (pad 2 smd rect (at -1.34 0 90) (size 0.63 0.45) (layers F.Cu F.Paste F.Mask)
      (net 4 "Net-(U2-Pad2)"))
    (pad 3 smd rect (at -1.34 0.95 90) (size 0.63 0.45) (layers F.Cu F.Paste F.Mask)
      (net 16 "Net-(R4-Pad2)"))
    (pad 4 smd rect (at 1.34 0.95 90) (size 0.63 0.45) (layers F.Cu F.Paste F.Mask)
      (net 12 GND))
    (pad 5 smd rect (at 1.34 0 90) (size 0.63 0.45) (layers F.Cu F.Paste F.Mask)
      (net 12 GND))
    (pad 6 smd rect (at 1.34 -0.95 90) (size 0.63 0.45) (layers F.Cu F.Paste F.Mask)
      (net 14 /trigger_s))
    (pad 7 smd rect (at 0.4 0.525 90) (size 0.8 1.05) (layers F.Cu F.Paste F.Mask)
      (net 12 GND) (solder_paste_margin_ratio -0.2))
    (pad 7 smd rect (at 0.4 -0.525 90) (size 0.8 1.05) (layers F.Cu F.Paste F.Mask)
      (net 12 GND) (solder_paste_margin_ratio -0.2))
    (pad 7 smd rect (at -0.4 0.525 90) (size 0.8 1.05) (layers F.Cu F.Paste F.Mask)
      (net 12 GND) (solder_paste_margin_ratio -0.2))
    (pad 7 smd rect (at -0.4 -0.525 90) (size 0.8 1.05) (layers F.Cu F.Paste F.Mask)
      (net 12 GND) (solder_paste_margin_ratio -0.2))
    (model ${KIPRJMOD}/STL/DBV6.stp
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Housings_SON:WSON-6-1EP_3x3mm_Pitch0.95mm (layer F.Cu) (tedit 59DE6E28)
    (at 156.39 101.94 90)
    (descr "WSON6 3*3 MM, 0.95 PITCH; http://www.ti.com/lit/ds/symlink/lmr62421.pdf")
    (tags "WSON6 0.95")
    (attr smd)
    (fp_text reference U1 (at -2.61 0.035 180) (layer F.SilkS))
    (fp_text value LM5134 (at 0 2.575 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 7 smd rect (at -0.4 -0.525 90) (size 0.8 1.05) (layers F.Cu F.Paste F.Mask)
      (net 12 GND) (solder_paste_margin_ratio -0.2))
    (pad 7 smd rect (at -0.4 0.525 90) (size 0.8 1.05) (layers F.Cu F.Paste F.Mask)
      (net 12 GND) (solder_paste_margin_ratio -0.2))
    (pad 7 smd rect (at 0.4 -0.525 90) (size 0.8 1.05) (layers F.Cu F.Paste F.Mask)
      (net 12 GND) (solder_paste_margin_ratio -0.2))
    (pad 7 smd rect (at 0.4 0.525 90) (size 0.8 1.05) (layers F.Cu F.Paste F.Mask)
      (net 12 GND) (solder_paste_margin_ratio -0.2))
    (pad 6 smd rect (at 1.34 -0.95 90) (size 0.63 0.45) (layers F.Cu F.Paste F.Mask)
      (net 10 /+12v0))
    (pad 5 smd rect (at 1.34 0 90) (size 0.63 0.45) (layers F.Cu F.Paste F.Mask)
      (net 15 /trigger_v))
    (pad 4 smd rect (at 1.34 0.95 90) (size 0.63 0.45) (layers F.Cu F.Paste F.Mask)
      (net 12 GND))
    (pad 3 smd rect (at -1.34 0.95 90) (size 0.63 0.45) (layers F.Cu F.Paste F.Mask)
      (net 13 "Net-(R3-Pad2)"))
    (pad 2 smd rect (at -1.34 0 90) (size 0.63 0.45) (layers F.Cu F.Paste F.Mask)
      (net 3 "Net-(U1-Pad2)"))
    (pad 1 smd rect (at -1.34 -0.95 90) (size 0.63 0.45) (layers F.Cu F.Paste F.Mask)
      (net 10 /+12v0))
    (model ${KIPRJMOD}/STL/DBV6.stp
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Pin_Headers:Pin_Header_Angled_1x06_Pitch2.54mm (layer F.Cu) (tedit 59650532)
    (at 145.025 111.275 180)
    (descr "Through hole angled pin header, 1x06, 2.54mm pitch, 6mm pin length, single row")
    (tags "Through hole angled pin header THT 1x06 2.54mm single row")
    (fp_text reference J2 (at 4.385 -2.27 180) (layer F.SilkS))
    (fp_text value Conn_01x06 (at 4.385 14.97 180) (layer F.Fab))
    (fp_text user %R (at 2.77 6.35 270) (layer F.Fab))
    (pad 6 thru_hole oval (at 0 12.7 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 15 /trigger_v))
    (pad 5 thru_hole oval (at 0 10.16 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 14 /trigger_s))
    (pad 4 thru_hole oval (at 0 7.62 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 1 "Net-(J2-Pad4)"))
    (pad 3 thru_hole oval (at 0 5.08 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 2 "Net-(J2-Pad3)"))
    (pad 2 thru_hole oval (at 0 2.54 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 12 GND))
    (pad 1 thru_hole rect (at 0 0 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 9 /+3v3))
    (model ${KISYS3DMOD}/Pin_Headers.3dshapes/Pin_Header_Angled_1x06_Pitch2.54mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (gr_text "bootrom pls" (at 147.73 104.3 90) (layer F.SilkS))
  (gr_text CORE (at 174.925 112.75 90) (layer F.SilkS))
  (gr_text CAP (at 169.75 97.25 90) (layer F.SilkS))
  (gr_text TRIG (at 151.875 108.875) (layer F.SilkS))
  (gr_text core (at 157.275 97.725 270) (layer F.SilkS))
  (gr_text +12V (at 149.425 97.725 270) (layer F.SilkS))
  (gr_line (start 172.6 104.3) (end 173.7 105.575) (layer Edge.Cuts) (width 0.15))
  (gr_line (start 172.6 93.975) (end 172.6 104.3) (layer Edge.Cuts) (width 0.15))
  (gr_line (start 170.6 91.975) (end 172.6 93.975) (layer Edge.Cuts) (width 0.15))
  (gr_line (start 173.7 105.575) (end 180.425 105.575) (layer Edge.Cuts) (width 0.15))
  (gr_line (start 182.9 108.025) (end 180.425 105.575) (layer Edge.Cuts) (width 0.15))
  (gr_line (start 182.9 116.575) (end 182.9 108.025) (layer Edge.Cuts) (width 0.15))
  (gr_line (start 141.7 91.975) (end 170.6 91.975) (layer Edge.Cuts) (width 0.15))
  (gr_line (start 141.7 116.575) (end 141.7 91.975) (layer Edge.Cuts) (width 0.15))
  (gr_line (start 141.7 116.575) (end 182.9 116.575) (layer Edge.Cuts) (width 0.15))
  (zone (net 12) (net_name GND) (layer F.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.508))
    (min_thickness 0.254)
    (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 141.725 116.55) (xy 182.825 116.55) (xy 182.825 108.05) (xy 180.4 105.65) (xy 173.675 105.65)
        (xy 172.525 104.325) (xy 172.525 94) (xy 170.575 92.05) (xy 141.775 92.05)
      )
    )
  )
  (zone (net 12) (net_name GND) (layer B.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.508))
    (min_thickness 0.254)
    (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 141.725 116.55) (xy 182.825 116.55) (xy 182.825 108.05) (xy 180.4 105.65) (xy 173.675 105.65)
        (xy 172.525 104.325) (xy 172.525 94) (xy 170.575 92.05) (xy 141.775 92.05)
      )
    )
  )
)
