(kicad_pcb (version 20171130) (host pcbnew "(5.1.5-0-10_14)")
  (general
    (thickness 1.6)
    (drawings 13)
    (tracks 155)
    (zones 0)
    (modules 12)
    (nets 19)
  )
  (page A4)
  (layers
    (0 F.Cu signal)
    (31 B.Cu signal)
    (32 B.Adhes user)
    (33 F.Adhes user)
    (34 B.Paste user)
    (35 F.Paste user)
    (36 B.SilkS user)
    (37 F.SilkS user)
    (38 B.Mask user)
    (39 F.Mask user)
    (40 Dwgs.User user)
    (41 Cmts.User user)
    (42 Eco1.User user)
    (43 Eco2.User user)
    (44 Edge.Cuts user)
    (45 Margin user)
    (46 B.CrtYd user)
    (47 F.CrtYd user)
    (48 B.Fab user)
    (49 F.Fab user)
  )
  (setup
    (last_trace_width 0.2032)
    (user_trace_width 0.1524)
    (user_trace_width 0.2032)
    (user_trace_width 0.3048)
    (user_trace_width 0.4572)
    (trace_clearance 0.2032)
    (zone_clearance 0.1524)
    (zone_45_only no)
    (trace_min 0.1524)
    (via_size 0.3302)
    (via_drill 0.254)
    (via_min_size 0.3302)
    (via_min_drill 0.254)
    (user_via 0.3302 0.254)
    (uvia_size 0.3)
    (uvia_drill 0.1)
    (uvias_allowed no)
    (uvia_min_size 0.2)
    (uvia_min_drill 0.1)
    (edge_width 0.05)
    (segment_width 0.2)
    (pcb_text_width 0.3)
    (pcb_text_size 1.5 1.5)
    (mod_edge_width 0.12)
    (mod_text_size 1 1)
    (mod_text_width 0.15)
    (pad_size 1.3 1.5)
    (pad_drill 0)
    (pad_to_mask_clearance 0.051)
    (solder_mask_min_width 0.25)
    (aux_axis_origin 0 0)
    (visible_elements FFFFFF7F)
    (pcbplotparams
      (layerselection 0x010fc_ffffffff)
      (usegerberextensions false)
      (usegerberattributes false)
      (usegerberadvancedattributes false)
      (creategerberjobfile false)
      (excludeedgelayer true)
      (linewidth 0.100000)
      (plotframeref false)
      (viasonmask false)
      (mode 1)
      (useauxorigin false)
      (hpglpennumber 1)
      (hpglpenspeed 20)
      (hpglpendiameter 15.000000)
      (psnegative false)
      (psa4output false)
      (plotreference true)
      (plotvalue true)
      (plotinvisibletext false)
      (padsonsilk false)
      (subtractmaskfromsilk false)
      (outputformat 1)
      (mirror false)
      (drillshape 1)
      (scaleselection 1)
      (outputdirectory ""))
  )
  (net 0 "")
  (net 1 GND)
  (net 2 /VUSB)
  (net 3 /VBUS)
  (net 4 "Net-(F1-Pad1)")
  (net 5 /27)
  (net 6 /D+)
  (net 7 /D-)
  (net 8 "Net-(JP1-Pad3)")
  (net 9 /EN)
  (net 10 /3V3)
  (net 11 /DAT2)
  (net 12 /DAT3)
  (net 13 /CMD)
  (net 14 /CLK)
  (net 15 /DAT0)
  (net 16 /DAT1)
  (net 17 /29)
  (net 18 "Net-(J4-Pad10)")
  (net_class Default "This is the default net class."
    (clearance 0.2032)
    (trace_width 0.2032)
    (via_dia 0.3302)
    (via_drill 0.254)
    (uvia_dia 0.3)
    (uvia_drill 0.1)
    (add_net /27)
    (add_net /29)
    (add_net /3V3)
    (add_net /CLK)
    (add_net /CMD)
    (add_net /D+)
    (add_net /D-)
    (add_net /DAT0)
    (add_net /DAT1)
    (add_net /DAT2)
    (add_net /DAT3)
    (add_net /EN)
    (add_net /VBUS)
    (add_net /VUSB)
    (add_net GND)
    (add_net "Net-(F1-Pad1)")
    (add_net "Net-(J4-Pad10)")
    (add_net "Net-(JP1-Pad3)")
  )
  (module Jumper:SolderJumper-2_P1.3mm_Bridged_RoundedPad1.0x1.5mm (layer B.Cu) (tedit 5C745284)
    (at 136.9568 119.126)
    (descr "SMD Solder Jumper, 1x1.5mm, rounded Pads, 0.3mm gap, bridged with 1 copper strip")
    (tags "solder jumper open")
    (attr virtual)
    (fp_text reference JP2 (at 0 1.8) (layer B.SilkS) hide)
    (fp_text value "Card Detect/29" (at 0 -1.9) (layer B.Fab))
    (pad 1 smd custom (at -0.65 0) (size 1 0.5) (layers B.Cu B.Mask)
      (net 17 /29) (zone_connect 2)
      (options (clearance outline) (anchor rect))
      (primitives
        (gr_circle (center 0 -0.25) (end 0.5 -0.25) (width 0))
        (gr_circle (center 0 0.25) (end 0.5 0.25) (width 0))
        (gr_poly (pts
           (xy 0 0.75) (xy 0.5 0.75) (xy 0.5 -0.75) (xy 0 -0.75)) (width 0))
      ))
    (pad 2 smd custom (at 0.65 0) (size 1 0.5) (layers B.Cu B.Mask)
      (net 18 "Net-(J4-Pad10)") (zone_connect 2)
      (options (clearance outline) (anchor rect))
      (primitives
        (gr_circle (center 0 -0.25) (end 0.5 -0.25) (width 0))
        (gr_circle (center 0 0.25) (end 0.5 0.25) (width 0))
        (gr_poly (pts
           (xy 0 0.75) (xy -0.5 0.75) (xy -0.5 -0.75) (xy 0 -0.75)) (width 0))
      ))
  )
  (module Connector_Card:microSD_HC_Hirose_DM3D-SF (layer B.Cu) (tedit 5DE41BFA)
    (at 142.24 106.68)
    (descr "Micro SD, SMD, right-angle, push-pull (https://media.digikey.com/PDF/Data%20Sheets/Hirose%20PDFs/DM3D-SF.pdf)")
    (tags "Micro SD")
    (attr smd)
    (fp_text reference J4 (at -0.0254 -2.667) (layer B.SilkS))
    (fp_text value Micro_SD_Card_Det_Hirose_DM3AT (at -0.025 -6.975) (layer B.Fab))
    (fp_text user KEEPOUT (at -0.275 0.525) (layer Cmts.User))
    (fp_text user %R (at -0.025 -1.475) (layer B.Fab))
    (fp_text user KEEPOUT (at -0.275 0.525) (layer Cmts.User))
    (pad 10 smd rect (at 5.575 5.45) (size 1 1.55) (layers B.Cu B.Paste B.Mask)
      (net 18 "Net-(J4-Pad10)"))
    (pad 11 smd rect (at 5.625 -5.225) (size 1.5 1.5) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (pad 1 smd rect (at 3.175 -5.35) (size 0.7 1.75) (layers B.Cu B.Paste B.Mask)
      (net 11 /DAT2))
    (pad 2 smd rect (at 2.075 -5.35) (size 0.7 1.75) (layers B.Cu B.Paste B.Mask)
      (net 12 /DAT3))
    (pad 3 smd rect (at 0.975 -5.35) (size 0.7 1.75) (layers B.Cu B.Paste B.Mask)
      (net 13 /CMD))
    (pad 4 smd rect (at -0.125 -5.35) (size 0.7 1.75) (layers B.Cu B.Paste B.Mask)
      (net 10 /3V3))
    (pad 5 smd rect (at -1.225 -5.35) (size 0.7 1.75) (layers B.Cu B.Paste B.Mask)
      (net 14 /CLK))
    (pad 6 smd rect (at -2.325 -5.35) (size 0.7 1.75) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (pad 7 smd rect (at -3.425 -5.35) (size 0.7 1.75) (layers B.Cu B.Paste B.Mask)
      (net 15 /DAT0))
    (pad 11 smd rect (at 5.975 3.025) (size 0.8 1.4) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (pad 9 smd rect (at -5.65 3.875) (size 1.45 1) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (pad 11 smd rect (at -5.975 2.375) (size 0.8 1.5) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (pad 11 smd rect (at -5.9282 -5.225) (size 1.3 1.5) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (pad 8 smd rect (at -4.525 -5.35) (size 0.7 1.75) (layers B.Cu B.Paste B.Mask)
      (net 16 /DAT1))
    (model ${KISYS3DMOD}/Connector_Card.3dshapes/microSD_HC_Hirose_DM3D-SF.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module USB_A_Receptacle_SMD_Wuerth_629104190121:USB_A_Receptacle_SMD_Wuerth_629104190121_Narrow (layer F.Cu) (tedit 5DE410E1)
    (at 142.2146 107.3404 180)
    (fp_text reference J2 (at -5.461 -20.8026) (layer F.SilkS) hide)
    (fp_text value USB_A (at -0.3 -2.5) (layer F.Fab))
    (pad "" np_thru_hole circle (at 2.45 2.7 180) (size 1.5 1.5) (drill 1.5) (layers *.Cu *.Mask))
    (pad "" np_thru_hole circle (at -2.45 2.7 180) (size 1.5 1.5) (drill 1.5) (layers *.Cu *.Mask))
    (pad 5 smd rect (at 7.1625 7.846 180) (size 2.992001 2.508) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 5 smd rect (at 7.1625 2 180) (size 2.992001 2.508) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 5 smd rect (at -7.1625 7.846 180) (size 2.992001 2.508) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 5 smd rect (at -7.1625 2 180) (size 2.992001 2.508) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 4 smd rect (at 3.5 0 180) (size 1.25 2) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 3 smd rect (at 1 0 180) (size 1.25 2) (layers F.Cu F.Paste F.Mask)
      (net 6 /D+))
    (pad 2 smd rect (at -1 0 180) (size 1.25 2) (layers F.Cu F.Paste F.Mask)
      (net 7 /D-))
    (pad 1 smd rect (at -3.5 0 180) (size 1.25 2) (layers F.Cu F.Paste F.Mask)
      (net 3 /VBUS))
  )
  (module Connector_PinSocket_2.54mm:PinSocket_1x09_P2.54mm_Vertical (layer F.Cu) (tedit 5A19A431)
    (at 132.08 99.06)
    (descr "Through hole straight socket strip, 1x09, 2.54mm pitch, single row (from Kicad 4.0.7), script generated")
    (tags "Through hole socket strip THT 1x09 2.54mm single row")
    (fp_text reference J3 (at 0 -2.77) (layer F.SilkS) hide)
    (fp_text value Conn_01x09 (at 0 23.09) (layer F.Fab))
    (fp_text user %R (at 0 10.16 90) (layer F.Fab))
    (pad 9 thru_hole oval (at 0 20.32) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 17 /29))
    (pad 8 thru_hole oval (at 0 17.78) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 11 /DAT2))
    (pad 7 thru_hole oval (at 0 15.24) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 12 /DAT3))
    (pad 6 thru_hole oval (at 0 12.7) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 13 /CMD))
    (pad 5 thru_hole oval (at 0 10.16) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 10 /3V3))
    (pad 4 thru_hole oval (at 0 7.62) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 14 /CLK))
    (pad 3 thru_hole oval (at 0 5.08) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 2 thru_hole oval (at 0 2.54) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 15 /DAT0))
    (pad 1 thru_hole rect (at 0 0) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 16 /DAT1))
    (model ${KISYS3DMOD}/Connector_PinSocket_2.54mm.3dshapes/PinSocket_1x09_P2.54mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer B.Cu) (tedit 5B36C52B)
    (at 137.16 116.078 180)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C3 (at 0 1.65) (layer B.SilkS))
    (fp_text value 0.1u (at 0 -1.65) (layer B.Fab))
    (fp_text user %R (at 0 0) (layer B.Fab))
    (pad 2 smd roundrect (at 1.025 0 180) (size 1.15 1.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.217391)
      (net 10 /3V3))
    (pad 1 smd roundrect (at -1.025 0 180) (size 1.15 1.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.217391)
      (net 1 GND))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Jumper:SolderJumper-3_P1.3mm_Bridged12_RoundedPad1.0x1.5mm (layer F.Cu) (tedit 5C745321)
    (at 142.494 115.316)
    (descr "SMD Solder 3-pad Jumper, 1x1.5mm rounded Pads, 0.3mm gap, pads 1-2 bridged with 1 copper strip")
    (tags "solder jumper open")
    (attr virtual)
    (fp_text reference JP1 (at 0.1016 4.2418) (layer F.SilkS) hide)
    (fp_text value "Power Enable/27" (at 0 1.9) (layer F.Fab))
    (pad 1 smd custom (at -1.3 0) (size 1 0.5) (layers F.Cu F.Mask)
      (net 5 /27) (zone_connect 2)
      (options (clearance outline) (anchor rect))
      (primitives
        (gr_circle (center 0 0.25) (end 0.5 0.25) (width 0))
        (gr_circle (center 0 -0.25) (end 0.5 -0.25) (width 0))
        (gr_poly (pts
           (xy 0.55 -0.75) (xy 0 -0.75) (xy 0 0.75) (xy 0.55 0.75)) (width 0))
      ))
    (pad 2 smd rect (at 0 0) (size 1 1.5) (layers F.Cu F.Mask)
      (net 9 /EN))
    (pad 3 smd custom (at 1.3 0) (size 1 0.5) (layers F.Cu F.Mask)
      (net 8 "Net-(JP1-Pad3)") (zone_connect 2)
      (options (clearance outline) (anchor rect))
      (primitives
        (gr_circle (center 0 0.25) (end 0.5 0.25) (width 0))
        (gr_circle (center 0 -0.25) (end 0.5 -0.25) (width 0))
        (gr_poly (pts
           (xy -0.55 -0.75) (xy 0 -0.75) (xy 0 0.75) (xy -0.55 0.75)) (width 0))
      ))
  )
  (module Capacitor_SMD:C_1206_3216Metric_Pad1.42x1.75mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 147.32 109.982)
    (descr "Capacitor SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C2 (at 0.1016 -1.6764) (layer F.SilkS))
    (fp_text value 100u (at 0 1.82) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd roundrect (at 1.4875 0) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 1 GND))
    (pad 1 smd roundrect (at -1.4875 0) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 3 /VBUS))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_1206_3216Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5B36C52B)
    (at 146.812 112.522)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C1 (at 2.6924 -0.1778 180) (layer F.SilkS))
    (fp_text value 2u2 (at 0 1.65) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 1 GND))
    (pad 1 smd roundrect (at -1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 2 /VUSB))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Inductor_SMD:L_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5B36C52B)
    (at 146.812 115.57 180)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "inductor handsolder")
    (attr smd)
    (fp_text reference F1 (at 0.0254 1.5494 180) (layer F.SilkS))
    (fp_text value 500mA (at -3.9116 0.381) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 2 /VUSB))
    (pad 1 smd roundrect (at -1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 4 "Net-(F1-Pad1)"))
    (model ${KISYS3DMOD}/Inductor_SMD.3dshapes/L_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Package_TO_SOT_SMD:SOT-23-6 (layer F.Cu) (tedit 5A02FF57)
    (at 142.24 111.506 90)
    (descr "6-pin SOT-23 package")
    (tags SOT-23-6)
    (attr smd)
    (fp_text reference U1 (at -0.3556 -2.3622 90) (layer F.SilkS))
    (fp_text value TPD3S014 (at 0 2.9 90) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 5 smd rect (at 1.1 0 90) (size 1.06 0.65) (layers F.Cu F.Paste F.Mask)
      (net 7 /D-))
    (pad 6 smd rect (at 1.1 -0.95 90) (size 1.06 0.65) (layers F.Cu F.Paste F.Mask)
      (net 6 /D+))
    (pad 4 smd rect (at 1.1 0.95 90) (size 1.06 0.65) (layers F.Cu F.Paste F.Mask)
      (net 3 /VBUS))
    (pad 3 smd rect (at -1.1 0.95 90) (size 1.06 0.65) (layers F.Cu F.Paste F.Mask)
      (net 8 "Net-(JP1-Pad3)"))
    (pad 2 smd rect (at -1.1 0 90) (size 1.06 0.65) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 1 smd rect (at -1.1 -0.95 90) (size 1.06 0.65) (layers F.Cu F.Paste F.Mask)
      (net 9 /EN))
    (model ${KISYS3DMOD}/Package_TO_SOT_SMD.3dshapes/SOT-23-6.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Inductor_SMD:L_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5B36C52B)
    (at 146.812 118.618 180)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "inductor handsolder")
    (attr smd)
    (fp_text reference L1 (at 0 1.4478) (layer F.SilkS))
    (fp_text value "ferrite 150" (at 0 1.65) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 8 "Net-(JP1-Pad3)"))
    (pad 1 smd roundrect (at -1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 4 "Net-(F1-Pad1)"))
    (model ${KISYS3DMOD}/Inductor_SMD.3dshapes/L_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Connector_PinHeader_2.54mm:PinHeader_1x06_P2.54mm_Vertical (layer F.Cu) (tedit 5DE1609F)
    (at 152.4 99.06)
    (descr "Through hole straight pin header, 1x06, 2.54mm pitch, single row")
    (tags "Through hole pin header THT 1x06 2.54mm single row")
    (fp_text reference J1 (at 0 -2.33) (layer F.SilkS) hide)
    (fp_text value Conn_01x06 (at 0 15.03) (layer F.Fab))
    (fp_text user %R (at 0 6.35 90) (layer F.Fab))
    (pad 6 thru_hole oval (at 0 12.7) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 5 /27))
    (pad 5 thru_hole oval (at 0 10.16) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 4 thru_hole oval (at 0 7.62) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 3 thru_hole oval (at 0 5.08) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 6 /D+))
    (pad 2 thru_hole oval (at 0 2.54) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 7 /D-))
    (pad 1 thru_hole circle (at 0 0) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 2 /VUSB))
    (model ${KISYS3DMOD}/Connector_PinHeader_2.54mm.3dshapes/PinHeader_1x06_P2.54mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (gr_text + (at 144.8054 113.3602) (layer F.SilkS))
  (gr_text + (at 144.6784 111.0234) (layer F.SilkS))
  (gr_text 29 (at 134.4168 119.2276) (layer B.SilkS))
  (gr_text "SD CD" (at 140.9192 119.2784) (layer B.SilkS))
  (gr_line (start 130.81 120.65) (end 130.81 97.79) (layer Edge.Cuts) (width 0.05))
  (gr_line (start 149.86 120.65) (end 130.81 120.65) (layer Edge.Cuts) (width 0.05))
  (gr_line (start 149.86 113.03) (end 149.86 120.65) (layer Edge.Cuts) (width 0.05))
  (gr_line (start 153.67 113.03) (end 149.86 113.03) (layer Edge.Cuts) (width 0.05))
  (gr_line (start 153.67 97.79) (end 153.67 113.03) (layer Edge.Cuts) (width 0.05))
  (gr_line (start 130.81 97.79) (end 153.67 97.79) (layer Edge.Cuts) (width 0.05))
  (gr_text "Power EN\n27 or On" (at 141.9606 118.11) (layer F.SilkS))
  (gr_text "Teensy 4.0\nUSB/SD Breakout\n2019-12-1" (at 135.89 120.2944 90) (layer F.SilkS))
  (zone (net 1) (net_name GND) (layer B.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.1524))
    (min_thickness 0.1524)
    (fill yes (arc_segments 32) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 154.94 121.92) (xy 129.54 121.92) (xy 129.54 96.52) (xy 154.94 96.52)
      )
    )
  )
  (zone (net 1) (net_name GND) (layer F.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.1524))
    (min_thickness 0.1524)
    (fill yes (arc_segments 32) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 154.94 121.92) (xy 129.54 121.92) (xy 129.54 96.52) (xy 154.94 96.52)
      )
    )
  )
)
