(kicad_pcb (version 20171130) (host pcbnew "(5.1.5-0-10_14)")
  (general
    (thickness 1.6)
    (drawings 23)
    (tracks 790)
    (zones 0)
    (modules 36)
    (nets 50)
  )
  (page A4)
  (layers
    (0 F.Cu signal)
    (31 B.Cu signal)
    (32 B.Adhes user)
    (33 F.Adhes user)
    (34 B.Paste user)
    (35 F.Paste user)
    (36 B.SilkS user)
    (37 F.SilkS user)
    (38 B.Mask user)
    (39 F.Mask user)
    (40 Dwgs.User user)
    (41 Cmts.User user)
    (42 Eco1.User user)
    (43 Eco2.User user)
    (44 Edge.Cuts user)
    (45 Margin user)
    (46 B.CrtYd user)
    (47 F.CrtYd user)
    (48 B.Fab user hide)
    (49 F.Fab user)
  )
  (setup
    (last_trace_width 0.2032)
    (user_trace_width 0.1524)
    (user_trace_width 0.2032)
    (user_trace_width 0.3048)
    (user_trace_width 0.4572)
    (trace_clearance 0.2032)
    (zone_clearance 0.2032)
    (zone_45_only no)
    (trace_min 0.1524)
    (via_size 0.508)
    (via_drill 0.254)
    (via_min_size 0.508)
    (via_min_drill 0.254)
    (user_via 0.508 0.254)
    (uvia_size 0.508)
    (uvia_drill 0.254)
    (uvias_allowed no)
    (uvia_min_size 0.508)
    (uvia_min_drill 0.254)
    (edge_width 0.05)
    (segment_width 0.2)
    (pcb_text_width 0.3)
    (pcb_text_size 1.5 1.5)
    (mod_edge_width 0.12)
    (mod_text_size 1 1)
    (mod_text_width 0.15)
    (pad_size 1.7 1.7)
    (pad_drill 1)
    (pad_to_mask_clearance 0.0508)
    (solder_mask_min_width 0.1016)
    (aux_axis_origin 0 0)
    (visible_elements FFFFFF7F)
    (pcbplotparams
      (layerselection 0x010fc_ffffffff)
      (usegerberextensions false)
      (usegerberattributes false)
      (usegerberadvancedattributes false)
      (creategerberjobfile false)
      (excludeedgelayer true)
      (linewidth 0.100000)
      (plotframeref false)
      (viasonmask false)
      (mode 1)
      (useauxorigin false)
      (hpglpennumber 1)
      (hpglpenspeed 20)
      (hpglpendiameter 15.000000)
      (psnegative false)
      (psa4output false)
      (plotreference true)
      (plotvalue true)
      (plotinvisibletext false)
      (padsonsilk false)
      (subtractmaskfromsilk false)
      (outputformat 1)
      (mirror false)
      (drillshape 1)
      (scaleselection 1)
      (outputdirectory ""))
  )
  (net 0 "")
  (net 1 GND)
  (net 2 /VUSB)
  (net 3 /VBUS)
  (net 4 "Net-(F1-Pad1)")
  (net 5 /27)
  (net 6 /D+)
  (net 7 /D-)
  (net 8 /EN)
  (net 9 /DAT2)
  (net 10 /DAT3)
  (net 11 /CMD)
  (net 12 /CLK)
  (net 13 /DAT0)
  (net 14 /DAT1)
  (net 15 /29)
  (net 16 +3V3)
  (net 17 /28_EN)
  (net 18 "Net-(D1-Pad1)")
  (net 19 /VBAT)
  (net 20 /PROGRAM)
  (net 21 /3V3_Teensy)
  (net 22 /24_TX6)
  (net 23 /26_IO0)
  (net 24 /25_RX6)
  (net 25 "Net-(JP3-Pad3)")
  (net 26 /IO22)
  (net 27 /24)
  (net 28 /28)
  (net 29 /26)
  (net 30 /25)
  (net 31 /IO32_ESP_BUSY)
  (net 32 /IO14_MOSI)
  (net 33 /IO5_CS)
  (net 34 /IO23_MISO)
  (net 35 /IO18_SCK)
  (net 36 /IO25_RED)
  (net 37 /IO26_GREEN)
  (net 38 /IO27_BLUE)
  (net 39 /IO16)
  (net 40 /IO15)
  (net 41 /IO13)
  (net 42 /IO12)
  (net 43 /IO4)
  (net 44 /IO2)
  (net 45 "Net-(D2-Pad1)")
  (net 46 "Net-(D2-Pad2)")
  (net 47 "Net-(D2-Pad3)")
  (net 48 /SD_DET)
  (net 49 /3V3_SD)
  (net_class Default "This is the default net class."
    (clearance 0.2032)
    (trace_width 0.2032)
    (via_dia 0.508)
    (via_drill 0.254)
    (uvia_dia 0.508)
    (uvia_drill 0.254)
    (add_net +3V3)
    (add_net /24)
    (add_net /24_TX6)
    (add_net /25)
    (add_net /25_RX6)
    (add_net /26)
    (add_net /26_IO0)
    (add_net /27)
    (add_net /28)
    (add_net /28_EN)
    (add_net /29)
    (add_net /3V3_SD)
    (add_net /3V3_Teensy)
    (add_net /CLK)
    (add_net /CMD)
    (add_net /D+)
    (add_net /D-)
    (add_net /DAT0)
    (add_net /DAT1)
    (add_net /DAT2)
    (add_net /DAT3)
    (add_net /EN)
    (add_net /IO12)
    (add_net /IO13)
    (add_net /IO14_MOSI)
    (add_net /IO15)
    (add_net /IO16)
    (add_net /IO18_SCK)
    (add_net /IO2)
    (add_net /IO22)
    (add_net /IO23_MISO)
    (add_net /IO25_RED)
    (add_net /IO26_GREEN)
    (add_net /IO27_BLUE)
    (add_net /IO32_ESP_BUSY)
    (add_net /IO4)
    (add_net /IO5_CS)
    (add_net /PROGRAM)
    (add_net /SD_DET)
    (add_net /VBAT)
    (add_net /VBUS)
    (add_net /VUSB)
    (add_net GND)
    (add_net "Net-(D1-Pad1)")
    (add_net "Net-(D2-Pad1)")
    (add_net "Net-(D2-Pad2)")
    (add_net "Net-(D2-Pad3)")
    (add_net "Net-(F1-Pad1)")
    (add_net "Net-(JP3-Pad3)")
  )
  (module RF_Module:ESP32-WROOM-32 (layer F.Cu) (tedit 5B5B4654)
    (at 140.716 143.891 180)
    (descr "Single 2.4 GHz Wi-Fi and Bluetooth combo chip https://www.espressif.com/sites/default/files/documentation/esp32-wroom-32_datasheet_en.pdf")
    (tags "Single 2.4 GHz Wi-Fi and Bluetooth combo  chip")
    (attr smd)
    (fp_text reference U3 (at 3.175 0.0635 180) (layer F.SilkS))
    (fp_text value ESP32-WROOM-32D (at 0 11.5) (layer F.Fab))
    (fp_text user "5 mm" (at 7.8 -19.075 90) (layer Cmts.User))
    (fp_text user "5 mm" (at -11.2 -14.375) (layer Cmts.User))
    (fp_text user "5 mm" (at 11.8 -14.375) (layer Cmts.User))
    (fp_text user Antenna (at 0 -13) (layer Cmts.User))
    (fp_text user "KEEP-OUT ZONE" (at 0 -19) (layer Cmts.User))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 38 smd rect (at 8.5 -8.255 180) (size 2 0.9) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 37 smd rect (at 8.5 -6.985 180) (size 2 0.9) (layers F.Cu F.Paste F.Mask)
      (net 34 /IO23_MISO))
    (pad 36 smd rect (at 8.5 -5.715 180) (size 2 0.9) (layers F.Cu F.Paste F.Mask)
      (net 26 /IO22))
    (pad 35 smd rect (at 8.5 -4.445 180) (size 2 0.9) (layers F.Cu F.Paste F.Mask)
      (net 24 /25_RX6))
    (pad 34 smd rect (at 8.5 -3.175 180) (size 2 0.9) (layers F.Cu F.Paste F.Mask)
      (net 22 /24_TX6))
    (pad 33 smd rect (at 8.5 -1.905 180) (size 2 0.9) (layers F.Cu F.Paste F.Mask))
    (pad 32 smd rect (at 8.5 -0.635 180) (size 2 0.9) (layers F.Cu F.Paste F.Mask))
    (pad 31 smd rect (at 8.5 0.635 180) (size 2 0.9) (layers F.Cu F.Paste F.Mask))
    (pad 30 smd rect (at 8.5 1.905 180) (size 2 0.9) (layers F.Cu F.Paste F.Mask)
      (net 35 /IO18_SCK))
    (pad 29 smd rect (at 8.5 3.175 180) (size 2 0.9) (layers F.Cu F.Paste F.Mask)
      (net 33 /IO5_CS))
    (pad 28 smd rect (at 8.5 4.445 180) (size 2 0.9) (layers F.Cu F.Paste F.Mask))
    (pad 27 smd rect (at 8.5 5.715 180) (size 2 0.9) (layers F.Cu F.Paste F.Mask)
      (net 39 /IO16))
    (pad 26 smd rect (at 8.5 6.985 180) (size 2 0.9) (layers F.Cu F.Paste F.Mask)
      (net 43 /IO4))
    (pad 25 smd rect (at 8.5 8.255 180) (size 2 0.9) (layers F.Cu F.Paste F.Mask)
      (net 23 /26_IO0))
    (pad 24 smd rect (at 5.715 9.255 270) (size 2 0.9) (layers F.Cu F.Paste F.Mask)
      (net 44 /IO2))
    (pad 23 smd rect (at 4.445 9.255 270) (size 2 0.9) (layers F.Cu F.Paste F.Mask)
      (net 40 /IO15))
    (pad 22 smd rect (at 3.175 9.255 270) (size 2 0.9) (layers F.Cu F.Paste F.Mask))
    (pad 21 smd rect (at 1.905 9.255 270) (size 2 0.9) (layers F.Cu F.Paste F.Mask))
    (pad 20 smd rect (at 0.635 9.255 270) (size 2 0.9) (layers F.Cu F.Paste F.Mask))
    (pad 19 smd rect (at -0.635 9.255 270) (size 2 0.9) (layers F.Cu F.Paste F.Mask))
    (pad 18 smd rect (at -1.905 9.255 270) (size 2 0.9) (layers F.Cu F.Paste F.Mask))
    (pad 17 smd rect (at -3.175 9.255 270) (size 2 0.9) (layers F.Cu F.Paste F.Mask))
    (pad 16 smd rect (at -4.445 9.255 270) (size 2 0.9) (layers F.Cu F.Paste F.Mask)
      (net 41 /IO13))
    (pad 15 smd rect (at -5.715 9.255 270) (size 2 0.9) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 14 smd rect (at -8.5 8.255 180) (size 2 0.9) (layers F.Cu F.Paste F.Mask)
      (net 42 /IO12))
    (pad 13 smd rect (at -8.5 6.985 180) (size 2 0.9) (layers F.Cu F.Paste F.Mask)
      (net 32 /IO14_MOSI))
    (pad 12 smd rect (at -8.5 5.715 180) (size 2 0.9) (layers F.Cu F.Paste F.Mask)
      (net 38 /IO27_BLUE))
    (pad 11 smd rect (at -8.5 4.445 180) (size 2 0.9) (layers F.Cu F.Paste F.Mask)
      (net 37 /IO26_GREEN))
    (pad 10 smd rect (at -8.5 3.175 180) (size 2 0.9) (layers F.Cu F.Paste F.Mask)
      (net 36 /IO25_RED))
    (pad 9 smd rect (at -8.5 1.905 180) (size 2 0.9) (layers F.Cu F.Paste F.Mask))
    (pad 8 smd rect (at -8.5 0.635 180) (size 2 0.9) (layers F.Cu F.Paste F.Mask)
      (net 31 /IO32_ESP_BUSY))
    (pad 7 smd rect (at -8.5 -0.635 180) (size 2 0.9) (layers F.Cu F.Paste F.Mask))
    (pad 6 smd rect (at -8.5 -1.905 180) (size 2 0.9) (layers F.Cu F.Paste F.Mask))
    (pad 5 smd rect (at -8.5 -3.175 180) (size 2 0.9) (layers F.Cu F.Paste F.Mask))
    (pad 4 smd rect (at -8.5 -4.445 180) (size 2 0.9) (layers F.Cu F.Paste F.Mask))
    (pad 3 smd rect (at -8.5 -5.715 180) (size 2 0.9) (layers F.Cu F.Paste F.Mask)
      (net 17 /28_EN))
    (pad 2 smd rect (at -8.5 -6.985 180) (size 2 0.9) (layers F.Cu F.Paste F.Mask)
      (net 16 +3V3))
    (pad 1 smd rect (at -8.5 -8.255 180) (size 2 0.9) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 39 smd rect (at -1 -0.755 180) (size 5 5) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (model ${KISYS3DMOD}/RF_Module.3dshapes/ESP32-WROOM-32.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Jumper:SolderJumper-2_P1.3mm_Open_RoundedPad1.0x1.5mm (layer B.Cu) (tedit 5B391E66)
    (at 144.033 120.904 180)
    (descr "SMD Solder Jumper, 1x1.5mm, rounded Pads, 0.3mm gap, open")
    (tags "solder jumper open")
    (attr virtual)
    (fp_text reference JP1 (at -0.9375 -1.9685) (layer B.SilkS))
    (fp_text value "Teensy 3.3" (at 0 -1.9) (layer B.Fab))
    (pad 2 smd custom (at 0.65 0 180) (size 1 0.5) (layers B.Cu B.Mask)
      (net 16 +3V3) (zone_connect 2)
      (options (clearance outline) (anchor rect))
      (primitives
        (gr_circle (center 0 -0.25) (end 0.5 -0.25) (width 0))
        (gr_circle (center 0 0.25) (end 0.5 0.25) (width 0))
        (gr_poly (pts
           (xy 0 0.75) (xy -0.5 0.75) (xy -0.5 -0.75) (xy 0 -0.75)) (width 0))
      ))
    (pad 1 smd custom (at -0.65 0 180) (size 1 0.5) (layers B.Cu B.Mask)
      (net 21 /3V3_Teensy) (zone_connect 2)
      (options (clearance outline) (anchor rect))
      (primitives
        (gr_circle (center 0 -0.25) (end 0.5 -0.25) (width 0))
        (gr_circle (center 0 0.25) (end 0.5 0.25) (width 0))
        (gr_poly (pts
           (xy 0 0.75) (xy 0.5 0.75) (xy 0.5 -0.75) (xy 0 -0.75)) (width 0))
      ))
  )
  (module Connector_PinHeader_2.54mm:PinHeader_1x04_P2.54mm_Vertical (layer B.Cu) (tedit 5E6466F1)
    (at 134.62 124.46 180)
    (descr "Through hole straight pin header, 1x04, 2.54mm pitch, single row")
    (tags "Through hole pin header THT 1x04 2.54mm single row")
    (fp_text reference J6 (at -2.032 -0.0635) (layer B.SilkS))
    (fp_text value Conn_01x04 (at 0 -9.95) (layer B.Fab))
    (fp_text user %R (at 0 -3.81 270) (layer B.Fab))
    (pad 4 thru_hole oval (at 0 -7.62 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 34 /IO23_MISO))
    (pad 3 thru_hole oval (at 0 -5.08 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 32 /IO14_MOSI))
    (pad 2 thru_hole oval (at 0 -2.54 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 33 /IO5_CS))
    (pad 1 thru_hole rect (at 0 0 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 31 /IO32_ESP_BUSY))
    (model ${KISYS3DMOD}/Connector_PinHeader_2.54mm.3dshapes/PinHeader_1x04_P2.54mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Connector_PinHeader_2.54mm:PinHeader_1x08_P2.54mm_Vertical (layer B.Cu) (tedit 59FED5CC)
    (at 152.4 134.62 180)
    (descr "Through hole straight pin header, 1x08, 2.54mm pitch, single row")
    (tags "Through hole pin header THT 1x08 2.54mm single row")
    (fp_text reference J5 (at 2.032 0.0635) (layer B.SilkS))
    (fp_text value Conn_01x08 (at 0 -20.11) (layer B.Fab))
    (fp_text user %R (at 0 -8.89 270) (layer B.Fab))
    (pad 8 thru_hole oval (at 0 -17.78 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 39 /IO16))
    (pad 7 thru_hole oval (at 0 -15.24 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 40 /IO15))
    (pad 6 thru_hole oval (at 0 -12.7 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 41 /IO13))
    (pad 5 thru_hole oval (at 0 -10.16 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 42 /IO12))
    (pad 4 thru_hole oval (at 0 -7.62 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 43 /IO4))
    (pad 3 thru_hole oval (at 0 -5.08 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 44 /IO2))
    (pad 2 thru_hole oval (at 0 -2.54 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 16 +3V3))
    (pad 1 thru_hole rect (at 0 0 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 1 GND))
    (model ${KISYS3DMOD}/Connector_PinHeader_2.54mm.3dshapes/PinHeader_1x08_P2.54mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_Tantalum_SMD:CP_EIA-2012-12_Kemet-R_Pad1.30x1.05mm_HandSolder (layer B.Cu) (tedit 5B301BBE)
    (at 145.628 149.606 180)
    (descr "Tantalum Capacitor SMD Kemet-R (2012-12 Metric), IPC_7351 nominal, (Body size from: https://www.vishay.com/docs/40182/tmch.pdf), generated with kicad-footprint-generator")
    (tags "capacitor tantalum")
    (attr smd)
    (fp_text reference C2 (at -3.216 0) (layer B.SilkS))
    (fp_text value 22u/10v (at 0 -1.58) (layer B.Fab))
    (fp_text user %R (at 0 0) (layer B.Fab))
    (pad 2 smd roundrect (at 0.975 0 180) (size 1.3 1.05) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.238095)
      (net 1 GND))
    (pad 1 smd roundrect (at -0.975 0 180) (size 1.3 1.05) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.238095)
      (net 16 +3V3))
    (model ${KISYS3DMOD}/Capacitor_Tantalum_SMD.3dshapes/CP_EIA-2012-12_Kemet-R.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer B.Cu) (tedit 5B36C52B)
    (at 146.939 135.636 270)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R9 (at 2.667 -0.762 180) (layer B.SilkS))
    (fp_text value 1k (at 0 -1.65 270) (layer B.Fab))
    (fp_text user %R (at 0 0 270) (layer B.Fab))
    (pad 2 smd roundrect (at 1.025 0 270) (size 1.15 1.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.217391)
      (net 38 /IO27_BLUE))
    (pad 1 smd roundrect (at -1.025 0 270) (size 1.15 1.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.217391)
      (net 47 "Net-(D2-Pad3)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer B.Cu) (tedit 5B36C52B)
    (at 145.034 135.645 270)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R8 (at 2.658 -0.254) (layer B.SilkS))
    (fp_text value 1k (at 0 -1.65 270) (layer B.Fab))
    (fp_text user %R (at 0 0 270) (layer B.Fab))
    (pad 2 smd roundrect (at 1.025 0 270) (size 1.15 1.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.217391)
      (net 37 /IO26_GREEN))
    (pad 1 smd roundrect (at -1.025 0 270) (size 1.15 1.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.217391)
      (net 46 "Net-(D2-Pad2)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer B.Cu) (tedit 5B36C52B)
    (at 143.129 135.636 270)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R7 (at 2.667 0.381) (layer B.SilkS))
    (fp_text value 1k (at 0 -1.65 270) (layer B.Fab))
    (fp_text user %R (at 0 0 270) (layer B.Fab))
    (pad 2 smd roundrect (at 1.025 0 270) (size 1.15 1.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.217391)
      (net 36 /IO25_RED))
    (pad 1 smd roundrect (at -1.025 0 270) (size 1.15 1.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.217391)
      (net 45 "Net-(D2-Pad1)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Connector_PinHeader_2.54mm:PinHeader_1x01_P2.54mm_Vertical (layer B.Cu) (tedit 59FED5CC)
    (at 149.86 132.08)
    (descr "Through hole straight pin header, 1x01, 2.54mm pitch, single row")
    (tags "Through hole pin header THT 1x01 2.54mm single row")
    (fp_text reference J7 (at 0 -1.8415) (layer B.SilkS))
    (fp_text value Conn_01x01 (at 0 -2.33) (layer B.Fab))
    (fp_text user %R (at 0 0 -90) (layer B.Fab))
    (pad 1 thru_hole rect (at 0 0) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 35 /IO18_SCK))
    (model ${KISYS3DMOD}/Connector_PinHeader_2.54mm.3dshapes/PinHeader_1x01_P2.54mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module LED_SMD:LED_Avago_PLCC6_3x2.8mm (layer F.Cu) (tedit 5B211B3C)
    (at 146.442 130.732 90)
    (descr https://docs.broadcom.com/docs/AV02-3793EN)
    (tags "LED Avago PLCC-6 ASMT-YTB7-0AA02")
    (attr smd)
    (fp_text reference D2 (at 3.351 -0.011) (layer F.SilkS))
    (fp_text value LED_RGB (at 0 2.5 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 1 smd rect (at -1.475 -0.9 90) (size 1.6 0.5) (layers F.Cu F.Paste F.Mask)
      (net 45 "Net-(D2-Pad1)"))
    (pad 2 smd rect (at -1.475 0 90) (size 1.6 0.5) (layers F.Cu F.Paste F.Mask)
      (net 46 "Net-(D2-Pad2)"))
    (pad 3 smd rect (at -1.475 0.9 90) (size 1.6 0.5) (layers F.Cu F.Paste F.Mask)
      (net 47 "Net-(D2-Pad3)"))
    (pad 4 smd rect (at 1.475 0.9 90) (size 1.6 0.5) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 5 smd rect (at 1.475 0 90) (size 1.6 0.5) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 6 smd rect (at 1.475 -0.9 90) (size 1.6 0.5) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (model ${KISYS3DMOD}/LED_SMD.3dshapes/LED_Avago_PLCC6_3x2.8mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer B.Cu) (tedit 5B36C52B)
    (at 148.454 120.269)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R6 (at 0.898 1.778) (layer B.SilkS))
    (fp_text value 0R (at 0 -1.65) (layer B.Fab))
    (fp_text user %R (at 0 0) (layer B.Fab))
    (pad 2 smd roundrect (at 1.025 0) (size 1.15 1.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.217391)
      (net 28 /28))
    (pad 1 smd roundrect (at -1.025 0) (size 1.15 1.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.217391)
      (net 17 /28_EN))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer B.Cu) (tedit 5B36C52B)
    (at 148.454 118.364)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R5 (at -2.93 0.127) (layer B.SilkS))
    (fp_text value 0R (at 0 -1.65) (layer B.Fab))
    (fp_text user %R (at 0 0) (layer B.Fab))
    (pad 2 smd roundrect (at 1.025 0) (size 1.15 1.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.217391)
      (net 29 /26))
    (pad 1 smd roundrect (at -1.025 0) (size 1.15 1.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.217391)
      (net 23 /26_IO0))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Button_Switch_SMD:SW_SPST_PTS810 (layer F.Cu) (tedit 5B0610A8)
    (at 139.446 131.445 180)
    (descr "C&K Components, PTS 810 Series, Microminiature SMT Top Actuated, http://www.ckswitches.com/media/1476/pts810.pdf")
    (tags "SPST Button Switch")
    (attr smd)
    (fp_text reference SW2 (at 0.3175 2.6035) (layer F.SilkS))
    (fp_text value PROGRAM (at 0 2.6) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd rect (at 2.075 1.075 180) (size 1.05 0.65) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 2 smd rect (at -2.075 1.075 180) (size 1.05 0.65) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 1 smd rect (at 2.075 -1.075 180) (size 1.05 0.65) (layers F.Cu F.Paste F.Mask)
      (net 20 /PROGRAM))
    (pad 1 smd rect (at -2.075 -1.075 180) (size 1.05 0.65) (layers F.Cu F.Paste F.Mask)
      (net 20 /PROGRAM))
    (model ${KISYS3DMOD}/Button_Switch_SMD.3dshapes/SW_SPST_PTS810.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module BatteryHolder_MPD_BC501SM:BatteryHolder_MPD_BC501SM (layer F.Cu) (tedit 5D7989F0)
    (at 143.129 119.38 90)
    (fp_text reference BT1 (at -1.651 0 180) (layer F.SilkS))
    (fp_text value Battery_Cell (at 0.254 7.9756 90) (layer F.Fab))
    (fp_text user + (at 9.5 -2.1 90) (layer F.SilkS))
    (fp_text user - (at -8.3 -2.1 90) (layer F.SilkS))
    (pad "" thru_hole circle (at 4 0 90) (size 1.3 1.3) (drill 1.3) (layers *.Cu *.Mask))
    (pad "" thru_hole circle (at -3.5 0 90) (size 1 1) (drill 1) (layers *.Cu *.Mask))
    (pad 1 smd rect (at 8.23 0 90) (size 3.54 2.6) (layers F.Cu F.Paste F.Mask)
      (net 19 /VBAT))
    (pad 2 smd rect (at -7.57 0 90) (size 3.66 2.6) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
  )
  (module Package_TO_SOT_SMD:SOT-23-5 (layer B.Cu) (tedit 5A02FF57)
    (at 145.88 146.878)
    (descr "5-pin SOT23 package")
    (tags SOT-23-5)
    (attr smd)
    (fp_text reference U2 (at 3.091 -0.066) (layer B.SilkS))
    (fp_text value TLV75733PDBVR (at 0 -2.9) (layer B.Fab))
    (fp_text user %R (at 0 0 270) (layer B.Fab))
    (pad 5 smd rect (at 1.1 0.95) (size 1.06 0.65) (layers B.Cu B.Paste B.Mask)
      (net 16 +3V3))
    (pad 4 smd rect (at 1.1 -0.95) (size 1.06 0.65) (layers B.Cu B.Paste B.Mask))
    (pad 3 smd rect (at -1.1 -0.95) (size 1.06 0.65) (layers B.Cu B.Paste B.Mask)
      (net 2 /VUSB))
    (pad 2 smd rect (at -1.1 0) (size 1.06 0.65) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (pad 1 smd rect (at -1.1 0.95) (size 1.06 0.65) (layers B.Cu B.Paste B.Mask)
      (net 2 /VUSB))
    (model ${KISYS3DMOD}/Package_TO_SOT_SMD.3dshapes/SOT-23-5.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer B.Cu) (tedit 5B36C52B)
    (at 141.224 135.627 90)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R4 (at -2.676 -0.762 180) (layer B.SilkS))
    (fp_text value 2k (at 0 -1.65 90) (layer B.Fab))
    (fp_text user %R (at 0 0 90) (layer B.Fab))
    (pad 2 smd roundrect (at 1.025 0 90) (size 1.15 1.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.217391)
      (net 18 "Net-(D1-Pad1)"))
    (pad 1 smd roundrect (at -1.025 0 90) (size 1.15 1.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.217391)
      (net 26 /IO22))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer B.Cu) (tedit 5B36C52B)
    (at 135.509 147.066)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R3 (at 0.127 -1.651) (layer B.SilkS))
    (fp_text value 0R (at 0 -1.65) (layer B.Fab))
    (fp_text user %R (at 0 0) (layer B.Fab))
    (pad 2 smd roundrect (at 1.025 0) (size 1.15 1.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.217391)
      (net 27 /24))
    (pad 1 smd roundrect (at -1.025 0) (size 1.15 1.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.217391)
      (net 22 /24_TX6))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer B.Cu) (tedit 5B36C52B)
    (at 135.518 148.971)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R2 (at 0 1.65) (layer B.SilkS))
    (fp_text value 0R (at 0 -1.65) (layer B.Fab))
    (fp_text user %R (at 0 0) (layer B.Fab))
    (pad 2 smd roundrect (at 1.025 0) (size 1.15 1.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.217391)
      (net 30 /25))
    (pad 1 smd roundrect (at -1.025 0) (size 1.15 1.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.217391)
      (net 24 /25_RX6))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer B.Cu) (tedit 5B36C52B)
    (at 141.723 145.034 180)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R1 (at 2.912 0) (layer B.SilkS))
    (fp_text value 10k (at 0 -1.65) (layer B.Fab))
    (fp_text user %R (at 0 0) (layer B.Fab))
    (pad 2 smd roundrect (at 1.025 0 180) (size 1.15 1.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.217391)
      (net 16 +3V3))
    (pad 1 smd roundrect (at -1.025 0 180) (size 1.15 1.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.217391)
      (net 17 /28_EN))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Connector_PinHeader_2.54mm:PinHeader_1x14_P2.54mm_Vertical (layer B.Cu) (tedit 5E626EC0)
    (at 152.4 99.06 180)
    (descr "Through hole straight pin header, 1x14, 2.54mm pitch, single row")
    (tags "Through hole pin header THT 1x14 2.54mm single row")
    (fp_text reference J3 (at 2.159 0.0635) (layer B.SilkS))
    (fp_text value Conn_01x14 (at 0 -35.35) (layer B.Fab))
    (fp_text user %R (at 0 -16.51 270) (layer B.Fab))
    (pad 14 thru_hole oval (at 0 -33.02 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask))
    (pad 13 thru_hole oval (at 0 -30.48 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 20 /PROGRAM))
    (pad 12 thru_hole oval (at 0 -27.94 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 11 thru_hole oval (at 0 -25.4 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 21 /3V3_Teensy))
    (pad 10 thru_hole oval (at 0 -22.86 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 27 /24))
    (pad 9 thru_hole oval (at 0 -20.32 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 28 /28))
    (pad 8 thru_hole oval (at 0 -17.78 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 29 /26))
    (pad 7 thru_hole oval (at 0 -15.24 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 30 /25))
    (pad 6 thru_hole oval (at 0 -12.7 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 5 /27))
    (pad 5 thru_hole oval (at 0 -10.16 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 4 thru_hole oval (at 0 -7.62 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 3 thru_hole oval (at 0 -5.08 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 6 /D+))
    (pad 2 thru_hole oval (at 0 -2.54 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 7 /D-))
    (pad 1 thru_hole circle (at 0 0 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 2 /VUSB))
    (model ${KISYS3DMOD}/Connector_PinHeader_2.54mm.3dshapes/PinHeader_1x14_P2.54mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Connector_PinHeader_2.54mm:PinHeader_1x14_P2.54mm_Vertical (layer B.Cu) (tedit 59FED5CC)
    (at 132.08 99.06 180)
    (descr "Through hole straight pin header, 1x14, 2.54mm pitch, single row")
    (tags "Through hole pin header THT 1x14 2.54mm single row")
    (fp_text reference J1 (at -2.032 -0.0635) (layer B.SilkS))
    (fp_text value Conn_01x14 (at 0 -35.35) (layer B.Fab))
    (fp_text user %R (at 0 -16.51 270) (layer B.Fab))
    (pad 14 thru_hole oval (at 0 -33.02 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 19 /VBAT))
    (pad 13 thru_hole oval (at 0 -30.48 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask))
    (pad 12 thru_hole oval (at 0 -27.94 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask))
    (pad 11 thru_hole oval (at 0 -25.4 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask))
    (pad 10 thru_hole oval (at 0 -22.86 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask))
    (pad 9 thru_hole oval (at 0 -20.32 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 15 /29))
    (pad 8 thru_hole oval (at 0 -17.78 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 9 /DAT2))
    (pad 7 thru_hole oval (at 0 -15.24 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 10 /DAT3))
    (pad 6 thru_hole oval (at 0 -12.7 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 11 /CMD))
    (pad 5 thru_hole oval (at 0 -10.16 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 49 /3V3_SD))
    (pad 4 thru_hole oval (at 0 -7.62 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 12 /CLK))
    (pad 3 thru_hole oval (at 0 -5.08 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 2 thru_hole oval (at 0 -2.54 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 13 /DAT0))
    (pad 1 thru_hole rect (at 0 0 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 14 /DAT1))
    (model ${KISYS3DMOD}/Connector_PinHeader_2.54mm.3dshapes/PinHeader_1x14_P2.54mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module LED_SMD:LED_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5B4B45C9)
    (at 143.51 131.309 90)
    (descr "LED SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "LED handsolder")
    (attr smd)
    (fp_text reference D1 (at 4.182 -3.8735 180) (layer F.SilkS))
    (fp_text value LED (at 0 1.65 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0 90) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 16 +3V3))
    (pad 1 smd roundrect (at -1.025 0 90) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 18 "Net-(D1-Pad1)"))
    (model ${KISYS3DMOD}/LED_SMD.3dshapes/LED_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer B.Cu) (tedit 5B36C52B)
    (at 141.732 147.066 180)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C8 (at 2.785 0.127) (layer B.SilkS))
    (fp_text value 1u (at 0 -1.65) (layer B.Fab))
    (fp_text user %R (at 0 0) (layer B.Fab))
    (pad 2 smd roundrect (at 1.025 0 180) (size 1.15 1.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.217391)
      (net 1 GND))
    (pad 1 smd roundrect (at -1.025 0 180) (size 1.15 1.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.217391)
      (net 17 /28_EN))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer B.Cu) (tedit 5B36C52B)
    (at 142.621 149.869 90)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C5 (at 0.009 -1.905 180) (layer B.SilkS))
    (fp_text value 1u (at 0 -1.65 90) (layer B.Fab))
    (fp_text user %R (at 0 0 90) (layer B.Fab))
    (pad 2 smd roundrect (at 1.025 0 90) (size 1.15 1.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.217391)
      (net 1 GND))
    (pad 1 smd roundrect (at -1.025 0 90) (size 1.15 1.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.217391)
      (net 16 +3V3))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer B.Cu) (tedit 5B36C52B)
    (at 145.805 144.018)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C4 (at 0.118 -1.651) (layer B.SilkS))
    (fp_text value 1u (at 0 -1.65) (layer B.Fab))
    (fp_text user %R (at 0 0) (layer B.Fab))
    (pad 2 smd roundrect (at 1.025 0) (size 1.15 1.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.217391)
      (net 1 GND))
    (pad 1 smd roundrect (at -1.025 0) (size 1.15 1.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.217391)
      (net 2 /VUSB))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer B.Cu) (tedit 5B36C52B)
    (at 145.669 151.765 180)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C1 (at -3.048 0) (layer B.SilkS))
    (fp_text value 0.1u/50v (at 0 -1.65) (layer B.Fab))
    (fp_text user %R (at 0 0) (layer B.Fab))
    (pad 2 smd roundrect (at 1.025 0 180) (size 1.15 1.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.217391)
      (net 1 GND))
    (pad 1 smd roundrect (at -1.025 0 180) (size 1.15 1.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.217391)
      (net 16 +3V3))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Jumper:SolderJumper-2_P1.3mm_Bridged_RoundedPad1.0x1.5mm (layer B.Cu) (tedit 5C745284)
    (at 135.636 120.904)
    (descr "SMD Solder Jumper, 1x1.5mm, rounded Pads, 0.3mm gap, bridged with 1 copper strip")
    (tags "solder jumper open")
    (attr virtual)
    (fp_text reference JP2 (at 0 1.8) (layer B.SilkS))
    (fp_text value "Card Detect/29" (at 0 -1.9) (layer B.Fab))
    (pad 1 smd custom (at -0.65 0) (size 1 0.5) (layers B.Cu B.Mask)
      (net 15 /29) (zone_connect 2)
      (options (clearance outline) (anchor rect))
      (primitives
        (gr_circle (center 0 -0.25) (end 0.5 -0.25) (width 0))
        (gr_circle (center 0 0.25) (end 0.5 0.25) (width 0))
        (gr_poly (pts
           (xy 0 0.75) (xy 0.5 0.75) (xy 0.5 -0.75) (xy 0 -0.75)) (width 0))
      ))
    (pad 2 smd custom (at 0.65 0) (size 1 0.5) (layers B.Cu B.Mask)
      (net 48 /SD_DET) (zone_connect 2)
      (options (clearance outline) (anchor rect))
      (primitives
        (gr_circle (center 0 -0.25) (end 0.5 -0.25) (width 0))
        (gr_circle (center 0 0.25) (end 0.5 0.25) (width 0))
        (gr_poly (pts
           (xy 0 0.75) (xy -0.5 0.75) (xy -0.5 -0.75) (xy 0 -0.75)) (width 0))
      ))
  )
  (module Connector_Card:microSD_HC_Hirose_DM3D-SF (layer B.Cu) (tedit 5DE41BFA)
    (at 142.24 106.68)
    (descr "Micro SD, SMD, right-angle, push-pull (https://media.digikey.com/PDF/Data%20Sheets/Hirose%20PDFs/DM3D-SF.pdf)")
    (tags "Micro SD")
    (attr smd)
    (fp_text reference J4 (at -0.0254 -2.667) (layer B.SilkS))
    (fp_text value Micro_SD_Card_Det_Hirose_DM3AT (at -0.025 -6.975) (layer B.Fab))
    (fp_text user KEEPOUT (at -0.275 0.525) (layer Cmts.User))
    (fp_text user %R (at -0.025 -1.475) (layer B.Fab))
    (fp_text user KEEPOUT (at -0.275 0.525) (layer Cmts.User))
    (pad 10 smd rect (at 5.575 5.45) (size 1 1.55) (layers B.Cu B.Paste B.Mask)
      (net 48 /SD_DET))
    (pad 11 smd rect (at 5.625 -5.225) (size 1.5 1.5) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (pad 1 smd rect (at 3.175 -5.35) (size 0.7 1.75) (layers B.Cu B.Paste B.Mask)
      (net 9 /DAT2))
    (pad 2 smd rect (at 2.075 -5.35) (size 0.7 1.75) (layers B.Cu B.Paste B.Mask)
      (net 10 /DAT3))
    (pad 3 smd rect (at 0.975 -5.35) (size 0.7 1.75) (layers B.Cu B.Paste B.Mask)
      (net 11 /CMD))
    (pad 4 smd rect (at -0.125 -5.35) (size 0.7 1.75) (layers B.Cu B.Paste B.Mask)
      (net 49 /3V3_SD))
    (pad 5 smd rect (at -1.225 -5.35) (size 0.7 1.75) (layers B.Cu B.Paste B.Mask)
      (net 12 /CLK))
    (pad 6 smd rect (at -2.325 -5.35) (size 0.7 1.75) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (pad 7 smd rect (at -3.425 -5.35) (size 0.7 1.75) (layers B.Cu B.Paste B.Mask)
      (net 13 /DAT0))
    (pad 11 smd rect (at 5.975 3.025) (size 0.8 1.4) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (pad 9 smd rect (at -5.65 3.875) (size 1.45 1) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (pad 11 smd rect (at -5.975 2.375) (size 0.8 1.5) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (pad 11 smd rect (at -5.9282 -5.225) (size 1.3 1.5) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (pad 8 smd rect (at -4.525 -5.35) (size 0.7 1.75) (layers B.Cu B.Paste B.Mask)
      (net 14 /DAT1))
    (model ${KISYS3DMOD}/Connector_Card.3dshapes/microSD_HC_Hirose_DM3D-SF.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module USB_A_Receptacle_SMD_Wuerth_629104190121:USB_A_Receptacle_SMD_Wuerth_629104190121_Narrow (layer F.Cu) (tedit 5DE410E1)
    (at 142.2146 107.3404 180)
    (fp_text reference J2 (at -5.461 -20.8026) (layer F.SilkS) hide)
    (fp_text value USB_A (at 6.3246 12.2174) (layer F.Fab))
    (pad "" np_thru_hole circle (at 2.45 2.7 180) (size 1.5 1.5) (drill 1.5) (layers *.Cu *.Mask))
    (pad "" np_thru_hole circle (at -2.45 2.7 180) (size 1.5 1.5) (drill 1.5) (layers *.Cu *.Mask))
    (pad 5 smd rect (at 7.1625 7.846 180) (size 2.992001 2.508) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 5 smd rect (at 7.1625 2 180) (size 2.992001 2.508) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 5 smd rect (at -7.1625 7.846 180) (size 2.992001 2.508) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 5 smd rect (at -7.1625 2 180) (size 2.992001 2.508) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 4 smd rect (at 3.5 0 180) (size 1.25 2) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 3 smd rect (at 1 0 180) (size 1.25 2) (layers F.Cu F.Paste F.Mask)
      (net 6 /D+))
    (pad 2 smd rect (at -1 0 180) (size 1.25 2) (layers F.Cu F.Paste F.Mask)
      (net 7 /D-))
    (pad 1 smd rect (at -3.5 0 180) (size 1.25 2) (layers F.Cu F.Paste F.Mask)
      (net 3 /VBUS))
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5B36C52B)
    (at 134.366 109.093 270)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C3 (at 2.9845 0 270) (layer F.SilkS))
    (fp_text value 10u (at 0 1.65 270) (layer F.Fab))
    (fp_text user %R (at 0 0 270) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 49 /3V3_SD))
    (pad 1 smd roundrect (at -1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 1 GND))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Jumper:SolderJumper-3_P1.3mm_Bridged12_RoundedPad1.0x1.5mm (layer B.Cu) (tedit 5C745321)
    (at 139.67 120.904 180)
    (descr "SMD Solder 3-pad Jumper, 1x1.5mm rounded Pads, 0.3mm gap, pads 1-2 bridged with 1 copper strip")
    (tags "solder jumper open")
    (attr virtual)
    (fp_text reference JP3 (at 0.478 -1.905 180) (layer B.SilkS))
    (fp_text value "Power Enable/27" (at 0 -1.9 180) (layer B.Fab))
    (pad 1 smd custom (at -1.3 0 180) (size 1 0.5) (layers B.Cu B.Mask)
      (net 5 /27) (zone_connect 2)
      (options (clearance outline) (anchor rect))
      (primitives
        (gr_circle (center 0 -0.25) (end 0.5 -0.25) (width 0))
        (gr_circle (center 0 0.25) (end 0.5 0.25) (width 0))
        (gr_poly (pts
           (xy 0.55 0.75) (xy 0 0.75) (xy 0 -0.75) (xy 0.55 -0.75)) (width 0))
      ))
    (pad 2 smd rect (at 0 0 180) (size 1 1.5) (layers B.Cu B.Mask)
      (net 8 /EN))
    (pad 3 smd custom (at 1.3 0 180) (size 1 0.5) (layers B.Cu B.Mask)
      (net 25 "Net-(JP3-Pad3)") (zone_connect 2)
      (options (clearance outline) (anchor rect))
      (primitives
        (gr_circle (center 0 -0.25) (end 0.5 -0.25) (width 0))
        (gr_circle (center 0 0.25) (end 0.5 0.25) (width 0))
        (gr_poly (pts
           (xy -0.55 0.75) (xy 0 0.75) (xy 0 -0.75) (xy -0.55 -0.75)) (width 0))
      ))
  )
  (module Capacitor_SMD:C_1206_3216Metric_Pad1.42x1.75mm_HandSolder (layer B.Cu) (tedit 5B301BBE)
    (at 137.287 115.951 270)
    (descr "Capacitor SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C7 (at -0.0365 2.032 180) (layer B.SilkS))
    (fp_text value 100u (at 0 -1.82 90) (layer B.Fab))
    (fp_text user %R (at 0 0 90) (layer B.Fab))
    (pad 2 smd roundrect (at 1.4875 0 270) (size 1.425 1.75) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.175439)
      (net 1 GND))
    (pad 1 smd roundrect (at -1.4875 0 270) (size 1.425 1.75) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.175439)
      (net 3 /VBUS))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_1206_3216Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer B.Cu) (tedit 5B36C52B)
    (at 148.454 114.427 180)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C6 (at 2.6924 0.1778 180) (layer B.SilkS))
    (fp_text value 2u2 (at 0 -1.65) (layer B.Fab))
    (fp_text user %R (at 0 0) (layer B.Fab))
    (pad 2 smd roundrect (at 1.025 0 180) (size 1.15 1.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.217391)
      (net 1 GND))
    (pad 1 smd roundrect (at -1.025 0 180) (size 1.15 1.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.217391)
      (net 2 /VUSB))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Inductor_SMD:L_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer B.Cu) (tedit 5B36C52B)
    (at 148.472 116.459)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "inductor handsolder")
    (attr smd)
    (fp_text reference F1 (at -2.803 0.127 180) (layer B.SilkS))
    (fp_text value 500mA (at -6.477 12.954) (layer B.Fab))
    (fp_text user %R (at 0 0) (layer B.Fab))
    (pad 2 smd roundrect (at 1.025 0) (size 1.15 1.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.217391)
      (net 2 /VUSB))
    (pad 1 smd roundrect (at -1.025 0) (size 1.15 1.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.217391)
      (net 4 "Net-(F1-Pad1)"))
    (model ${KISYS3DMOD}/Inductor_SMD.3dshapes/L_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Package_TO_SOT_SMD:SOT-23-6 (layer B.Cu) (tedit 5A02FF57)
    (at 140.335 115.4 90)
    (descr "6-pin SOT-23 package")
    (tags SOT-23-6)
    (attr smd)
    (fp_text reference U1 (at 1.481 2.794) (layer B.SilkS))
    (fp_text value TPD3S014 (at 0 -2.9 270) (layer B.Fab))
    (fp_text user %R (at 0 0) (layer B.Fab))
    (pad 5 smd rect (at 1.1 0 90) (size 1.06 0.65) (layers B.Cu B.Paste B.Mask)
      (net 6 /D+))
    (pad 6 smd rect (at 1.1 0.95 90) (size 1.06 0.65) (layers B.Cu B.Paste B.Mask)
      (net 7 /D-))
    (pad 4 smd rect (at 1.1 -0.95 90) (size 1.06 0.65) (layers B.Cu B.Paste B.Mask)
      (net 3 /VBUS))
    (pad 3 smd rect (at -1.1 -0.95 90) (size 1.06 0.65) (layers B.Cu B.Paste B.Mask)
      (net 25 "Net-(JP3-Pad3)"))
    (pad 2 smd rect (at -1.1 0 90) (size 1.06 0.65) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (pad 1 smd rect (at -1.1 0.95 90) (size 1.06 0.65) (layers B.Cu B.Paste B.Mask)
      (net 8 /EN))
    (model ${KISYS3DMOD}/Package_TO_SOT_SMD.3dshapes/SOT-23-6.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Inductor_SMD:L_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer B.Cu) (tedit 5B36C52B)
    (at 140.471 118.364 180)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "inductor handsolder")
    (attr smd)
    (fp_text reference L1 (at -2.658 0.127) (layer B.SilkS))
    (fp_text value "ferrite 150" (at 0 -1.65) (layer B.Fab))
    (fp_text user %R (at 0 0) (layer B.Fab))
    (pad 2 smd roundrect (at 1.025 0 180) (size 1.15 1.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.217391)
      (net 25 "Net-(JP3-Pad3)"))
    (pad 1 smd roundrect (at -1.025 0 180) (size 1.15 1.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.217391)
      (net 4 "Net-(F1-Pad1)"))
    (model ${KISYS3DMOD}/Inductor_SMD.3dshapes/L_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (gr_text "IO16  IO15  IO13  IO12  IO4    IO2  3v3    GND" (at 150.876 143.383 90) (layer F.SilkS))
  (gr_text + (at 144.8054 113.3602) (layer F.SilkS))
  (gr_text + (at 144.6784 111.0234) (layer F.SilkS))
  (gr_line (start 130.81 153.67) (end 130.81 97.79) (layer Edge.Cuts) (width 0.05))
  (gr_line (start 153.67 153.67) (end 130.81 153.67) (layer Edge.Cuts) (width 0.05))
  (gr_line (start 153.67 113.03) (end 153.67 153.67) (layer Edge.Cuts) (width 0.05))
  (gr_line (start 153.67 97.79) (end 153.67 113.03) (layer Edge.Cuts) (width 0.05))
  (gr_line (start 130.81 97.79) (end 153.67 97.79) (layer Edge.Cuts) (width 0.05))
  (gr_text "Teensy 4.0 \nUSB/SD/ESP32\nBreakout v1.0" (at 142.24 129.413) (layer B.SilkS))
  (zone (net 1) (net_name GND) (layer B.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.2032))
    (min_thickness 0.2032)
    (fill yes (arc_segments 32) (thermal_gap 0.2032) (thermal_bridge_width 0.4572))
    (polygon
      (pts
        (xy 155.067 154.94) (xy 129.667 154.94) (xy 129.54 96.52) (xy 154.94 96.52)
      )
    )
  )
  (zone (net 1) (net_name GND) (layer F.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.2032))
    (min_thickness 0.2032)
    (fill yes (arc_segments 32) (thermal_gap 0.2032) (thermal_bridge_width 0.4572))
    (polygon
      (pts
        (xy 154.94 153.162) (xy 129.54 153.162) (xy 129.54 96.52) (xy 154.94 96.52)
      )
    )
  )
)
