(kicad_pcb (version 20171130) (host pcbnew "(5.1.9)-1")
  (general
    (thickness 1.6)
    (drawings 181)
    (tracks 646)
    (zones 0)
    (modules 45)
    (nets 87)
  )
  (page USLetter)
  (title_block
    (title "BDB002: DEC Professional 3XX RAM Daughterboard")
    (date 2021-04-21)
    (rev "Revision A")
    (company "Bjoren Davis")
    (comment 1 "RAM daughterboard.")
    (comment 2 "it can be swich-selected to emulate any possible configuration of")
    (comment 3 "personal computers.  It is designed with modern components and")
    (comment 4 "This is a design for a RAM board for the DEC Professional 325/350/380")
  )
  (layers
    (0 F.Cu signal)
    (1 In1.Cu power)
    (2 In2.Cu power)
    (31 B.Cu signal)
    (32 B.Adhes user)
    (33 F.Adhes user)
    (34 B.Paste user)
    (35 F.Paste user)
    (36 B.SilkS user)
    (37 F.SilkS user)
    (38 B.Mask user)
    (39 F.Mask user)
    (40 Dwgs.User user)
    (41 Cmts.User user)
    (42 Eco1.User user)
    (43 Eco2.User user)
    (44 Edge.Cuts user)
    (45 Margin user)
    (46 B.CrtYd user)
    (47 F.CrtYd user)
    (48 B.Fab user)
    (49 F.Fab user)
  )
  (setup
    (last_trace_width 0.1524)
    (trace_clearance 0.19812)
    (zone_clearance 0.508)
    (zone_45_only no)
    (trace_min 0.1524)
    (via_size 0.8)
    (via_drill 0.4)
    (via_min_size 0.4)
    (via_min_drill 0.3)
    (uvia_size 0.3)
    (uvia_drill 0.1)
    (uvias_allowed no)
    (uvia_min_size 0.2)
    (uvia_min_drill 0.1)
    (edge_width 0.05)
    (segment_width 0.2)
    (pcb_text_width 0.3)
    (pcb_text_size 1.5 1.5)
    (mod_edge_width 0.12)
    (mod_text_size 1 1)
    (mod_text_width 0.15)
    (pad_size 1.524 1.524)
    (pad_drill 1.524)
    (pad_to_mask_clearance 0.0508)
    (aux_axis_origin 0 0)
    (grid_origin 76.2 76.2)
    (visible_elements 7FFFFF7F)
    (pcbplotparams
      (layerselection 0x010fc_ffffffff)
      (usegerberextensions false)
      (usegerberattributes true)
      (usegerberadvancedattributes true)
      (creategerberjobfile true)
      (excludeedgelayer true)
      (linewidth 0.100000)
      (plotframeref false)
      (viasonmask false)
      (mode 1)
      (useauxorigin false)
      (hpglpennumber 1)
      (hpglpenspeed 20)
      (hpglpendiameter 15.000000)
      (psnegative false)
      (psa4output false)
      (plotreference true)
      (plotvalue true)
      (plotinvisibletext false)
      (padsonsilk false)
      (subtractmaskfromsilk false)
      (outputformat 1)
      (mirror false)
      (drillshape 0)
      (scaleselection 1)
      (outputdirectory "../fab/"))
  )
  (net 0 "")
  (net 1 GND)
  (net 2 +5V)
  (net 3 /D03)
  (net 4 /D04)
  (net 5 /D02)
  (net 6 /D05)
  (net 7 /D01)
  (net 8 /D06)
  (net 9 /D00)
  (net 10 /D07)
  (net 11 /D08)
  (net 12 /D15)
  (net 13 /D09)
  (net 14 /D14)
  (net 15 /D10)
  (net 16 /D13)
  (net 17 /D11)
  (net 18 /D12)
  (net 19 /~RASD1)
  (net 20 /~RASD2)
  (net 21 /~MUXA1)
  (net 22 /~MUXA2)
  (net 23 /~MUXA0)
  (net 24 /~MUXA4)
  (net 25 /~MUXA7)
  (net 26 /~MUXA3)
  (net 27 /~MUXA6)
  (net 28 /~MUXA5)
  (net 29 /~MUXA8)
  (net 30 /MWLB)
  (net 31 /~RASD0)
  (net 32 /~NBD0)
  (net 33 /CAS)
  (net 34 /~P256KD)
  (net 35 /MWHB)
  (net 36 /~NBD1)
  (net 37 /~RASD3)
  (net 38 /TDO)
  (net 39 /TCK)
  (net 40 /TMS)
  (net 41 /TDI)
  (net 42 /SRAM_A16)
  (net 43 /~SRAM_OE)
  (net 44 /~SRAM_CE)
  (net 45 /SRAM_A1)
  (net 46 /SRAM_A2)
  (net 47 /SRAM_A3)
  (net 48 /SRAM_A4)
  (net 49 /SRAM_A5)
  (net 50 /SRAM_A6)
  (net 51 /SRAM_A7)
  (net 52 /SRAM_A17)
  (net 53 /SRAM_A18)
  (net 54 /~SRAM_BLE)
  (net 55 /~SRAM_BHE)
  (net 56 /~SRAM_WE)
  (net 57 /SRAM_A19)
  (net 58 /SRAM_A8)
  (net 59 /SRAM_A9)
  (net 60 /SRAM_A10)
  (net 61 /SRAM_A11)
  (net 62 /SRAM_A12)
  (net 63 /SRAM_A13)
  (net 64 /SRAM_A14)
  (net 65 /SRAM_A0)
  (net 66 /SRAM_A15)
  (net 67 /DBG00)
  (net 68 /DBG01)
  (net 69 /DBG02)
  (net 70 /DBG03)
  (net 71 /DBG04)
  (net 72 /DBG05)
  (net 73 /DBG06)
  (net 74 /DBG07)
  (net 75 /~OPSW0)
  (net 76 /~OPSW2)
  (net 77 /~OPSW1)
  (net 78 /DBG08)
  (net 79 /DBG09)
  (net 80 /DBG10)
  (net 81 /DBG11)
  (net 82 /DBG12)
  (net 83 /DBG13)
  (net 84 /DBG14)
  (net 85 /DBG15)
  (net 86 /DBG16)
  (net_class Default "This is the default net class."
    (clearance 0.19812)
    (trace_width 0.1524)
    (via_dia 0.8)
    (via_drill 0.4)
    (uvia_dia 0.3)
    (uvia_drill 0.1)
    (add_net /CAS)
    (add_net /D00)
    (add_net /D01)
    (add_net /D02)
    (add_net /D03)
    (add_net /D04)
    (add_net /D05)
    (add_net /D06)
    (add_net /D07)
    (add_net /D08)
    (add_net /D09)
    (add_net /D10)
    (add_net /D11)
    (add_net /D12)
    (add_net /D13)
    (add_net /D14)
    (add_net /D15)
    (add_net /DBG00)
    (add_net /DBG01)
    (add_net /DBG02)
    (add_net /DBG03)
    (add_net /DBG04)
    (add_net /DBG05)
    (add_net /DBG06)
    (add_net /DBG07)
    (add_net /DBG08)
    (add_net /DBG09)
    (add_net /DBG10)
    (add_net /DBG11)
    (add_net /DBG12)
    (add_net /DBG13)
    (add_net /DBG14)
    (add_net /DBG15)
    (add_net /DBG16)
    (add_net /MWHB)
    (add_net /MWLB)
    (add_net /SRAM_A0)
    (add_net /SRAM_A1)
    (add_net /SRAM_A10)
    (add_net /SRAM_A11)
    (add_net /SRAM_A12)
    (add_net /SRAM_A13)
    (add_net /SRAM_A14)
    (add_net /SRAM_A15)
    (add_net /SRAM_A16)
    (add_net /SRAM_A17)
    (add_net /SRAM_A18)
    (add_net /SRAM_A19)
    (add_net /SRAM_A2)
    (add_net /SRAM_A3)
    (add_net /SRAM_A4)
    (add_net /SRAM_A5)
    (add_net /SRAM_A6)
    (add_net /SRAM_A7)
    (add_net /SRAM_A8)
    (add_net /SRAM_A9)
    (add_net /TCK)
    (add_net /TDI)
    (add_net /TDO)
    (add_net /TMS)
    (add_net /~MUXA0)
    (add_net /~MUXA1)
    (add_net /~MUXA2)
    (add_net /~MUXA3)
    (add_net /~MUXA4)
    (add_net /~MUXA5)
    (add_net /~MUXA6)
    (add_net /~MUXA7)
    (add_net /~MUXA8)
    (add_net /~NBD0)
    (add_net /~NBD1)
    (add_net /~OPSW0)
    (add_net /~OPSW1)
    (add_net /~OPSW2)
    (add_net /~P256KD)
    (add_net /~RASD0)
    (add_net /~RASD1)
    (add_net /~RASD2)
    (add_net /~RASD3)
    (add_net /~SRAM_BHE)
    (add_net /~SRAM_BLE)
    (add_net /~SRAM_CE)
    (add_net /~SRAM_OE)
    (add_net /~SRAM_WE)
  )
  (net_class PowerTrace ""
    (clearance 0.19812)
    (trace_width 0.254)
    (via_dia 0.8)
    (via_drill 0.4)
    (uvia_dia 0.3)
    (uvia_drill 0.1)
    (add_net +5V)
    (add_net GND)
  )
  (module bdb002:MountingHole_OctagonalOutline (layer F.Cu) (tedit 608767D5)
    (at 203.2 81.28)
    (fp_text reference REF** (at 0 0.5) (layer F.SilkS) hide)
    (fp_text value MountingHole_SquareOutline (at 0 -0.5) (layer F.Fab))
    (pad "" np_thru_hole circle (at 0 0) (size 3.81 3.81) (drill 3.81) (layers *.Cu *.Mask)
      (solder_mask_margin 0.508))
  )
  (module bdb002:MountingHole_SquareOutline (layer F.Cu) (tedit 608767B7)
    (at 203.2 152.4)
    (fp_text reference REF** (at 0 0.5) (layer F.SilkS) hide)
    (fp_text value MountingHole_SquareOutline (at 0 -0.5) (layer F.Fab))
    (pad "" np_thru_hole circle (at 0 0) (size 3.81 3.81) (drill 3.81) (layers *.Cu *.Mask)
      (solder_mask_margin 0.508))
  )
  (module bdb002:MountingHole_SquareOutline (layer F.Cu) (tedit 608767B7)
    (at 81.28 152.4)
    (fp_text reference REF** (at 0 0.5) (layer F.SilkS) hide)
    (fp_text value MountingHole_SquareOutline (at 0 -0.5) (layer F.Fab))
    (pad "" np_thru_hole circle (at 0 0) (size 3.81 3.81) (drill 3.81) (layers *.Cu *.Mask)
      (solder_mask_margin 0.508))
  )
  (module bdb002:MountingHole_SquareClippedOutline (layer F.Cu) (tedit 608767C8)
    (at 81.28 81.28)
    (fp_text reference REF** (at 0 0.5) (layer F.SilkS) hide)
    (fp_text value MountingHole_SquareClippedOutline (at 0 -0.5) (layer F.Fab))
    (pad "" np_thru_hole circle (at 0 0) (size 3.81 3.81) (drill 3.81) (layers *.Cu *.Mask)
      (solder_mask_margin 0.508))
  )
  (module Fiducial:Fiducial_1mm_Mask3mm (layer B.Cu) (tedit 5C18D119)
    (at 88.5 79)
    (descr "Circular Fiducial, 1mm bare copper, 3mm soldermask opening (recommended)")
    (tags fiducial)
    (attr smd)
    (fp_text reference REF** (at 0 2.54) (layer B.SilkS) hide)
    (fp_text value Fiducial_1mm_Mask3mm (at 0 -2.286) (layer B.Fab))
    (fp_text user %R (at 0 0) (layer B.Fab))
    (pad "" smd circle (at 0 0) (size 1 1) (layers B.Cu B.Mask)
      (solder_mask_margin 1) (clearance 1))
  )
  (module Fiducial:Fiducial_1mm_Mask3mm (layer B.Cu) (tedit 5C18D119)
    (at 88.5 154.68)
    (descr "Circular Fiducial, 1mm bare copper, 3mm soldermask opening (recommended)")
    (tags fiducial)
    (attr smd)
    (fp_text reference REF** (at 0 2.54) (layer B.SilkS) hide)
    (fp_text value Fiducial_1mm_Mask3mm (at 0 -2.286) (layer B.Fab))
    (fp_text user %R (at 0 0) (layer B.Fab))
    (pad "" smd circle (at 0 0) (size 1 1) (layers B.Cu B.Mask)
      (solder_mask_margin 1) (clearance 1))
  )
  (module Fiducial:Fiducial_1mm_Mask3mm (layer B.Cu) (tedit 5C18D119)
    (at 195.98 154.68)
    (descr "Circular Fiducial, 1mm bare copper, 3mm soldermask opening (recommended)")
    (tags fiducial)
    (attr smd)
    (fp_text reference REF** (at 0 2.54) (layer B.SilkS) hide)
    (fp_text value Fiducial_1mm_Mask3mm (at 0 -2.286) (layer B.Fab))
    (fp_text user %R (at 0 0) (layer B.Fab))
    (pad "" smd circle (at 0 0) (size 1 1) (layers B.Cu B.Mask)
      (solder_mask_margin 1) (clearance 1))
  )
  (module Fiducial:Fiducial_1mm_Mask3mm (layer B.Cu) (tedit 5C18D119)
    (at 195.98 79)
    (descr "Circular Fiducial, 1mm bare copper, 3mm soldermask opening (recommended)")
    (tags fiducial)
    (attr smd)
    (fp_text reference REF** (at 0 2.54) (layer B.SilkS) hide)
    (fp_text value Fiducial_1mm_Mask3mm (at 0 -2.286) (layer B.Fab))
    (fp_text user %R (at 0 0) (layer B.Fab))
    (pad "" smd circle (at 0 0) (size 1 1) (layers B.Cu B.Mask)
      (solder_mask_margin 1) (clearance 1))
  )
  (module Fiducial:Fiducial_1mm_Mask3mm (layer F.Cu) (tedit 5C18D119)
    (at 195.98 154.68)
    (descr "Circular Fiducial, 1mm bare copper, 3mm soldermask opening (recommended)")
    (tags fiducial)
    (attr smd)
    (fp_text reference REF** (at 0 -2.54) (layer F.SilkS) hide)
    (fp_text value Fiducial_1mm_Mask3mm (at 0 2.286) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad "" smd circle (at 0 0) (size 1 1) (layers F.Cu F.Mask)
      (solder_mask_margin 1) (clearance 1))
  )
  (module Fiducial:Fiducial_1mm_Mask3mm (layer F.Cu) (tedit 5C18D119)
    (at 88.5 154.68)
    (descr "Circular Fiducial, 1mm bare copper, 3mm soldermask opening (recommended)")
    (tags fiducial)
    (attr smd)
    (fp_text reference REF** (at 0 -2.54) (layer F.SilkS) hide)
    (fp_text value Fiducial_1mm_Mask3mm (at 0 2.286) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad "" smd circle (at 0 0) (size 1 1) (layers F.Cu F.Mask)
      (solder_mask_margin 1) (clearance 1))
  )
  (module Fiducial:Fiducial_1mm_Mask3mm (layer F.Cu) (tedit 5C18D119)
    (at 88.5 79)
    (descr "Circular Fiducial, 1mm bare copper, 3mm soldermask opening (recommended)")
    (tags fiducial)
    (attr smd)
    (fp_text reference REF** (at 0 -2.54) (layer F.SilkS) hide)
    (fp_text value Fiducial_1mm_Mask3mm (at 0 2.286) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad "" smd circle (at 0 0) (size 1 1) (layers F.Cu F.Mask)
      (solder_mask_margin 1) (clearance 1))
  )
  (module Fiducial:Fiducial_1mm_Mask3mm (layer F.Cu) (tedit 5C18D119)
    (at 195.98 79)
    (descr "Circular Fiducial, 1mm bare copper, 3mm soldermask opening (recommended)")
    (tags fiducial)
    (attr smd)
    (fp_text reference REF** (at 0 -2.54) (layer F.SilkS) hide)
    (fp_text value Fiducial_1mm_Mask3mm (at 0 2.286) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad "" smd circle (at 0 0) (size 1 1) (layers F.Cu F.Mask)
      (solder_mask_margin 1) (clearance 1))
  )
  (module bdb002:BoardID_4Layer (layer F.Cu) (tedit 608392C6)
    (at 204.597 114.046 90)
    (fp_text reference REF** (at -0.2032 -2.7258 90) (layer F.SilkS) hide)
    (fp_text value BoardID_4Layer (at -0.2032 -3.7258 90) (layer F.Fab) hide)
    (fp_text user 4 (at 2.8448 0.1016 90) (layer B.Cu))
    (fp_text user 1 (at -2.8448 0.0762 90) (layer F.Cu))
  )
  (module bdb002:GroundSymbol_Silkscreen (layer F.Cu) (tedit 60834174)
    (at 115.5192 138.1506)
    (fp_text reference REF** (at 0.1778 -3.302) (layer F.SilkS) hide)
    (fp_text value GroundSymbol_Silkscreen (at 0.4318 -2.2606) (layer F.Fab) hide)
  )
  (module bdb002:GroundSymbol_Silkscreen (layer F.Cu) (tedit 60834174)
    (at 102.7684 140.6906)
    (fp_text reference REF** (at 0.1778 -3.302) (layer F.SilkS) hide)
    (fp_text value GroundSymbol_Silkscreen (at 0.4318 -2.2606) (layer F.Fab) hide)
  )
  (module bdb002:GroundSymbol_Silkscreen (layer F.Cu) (tedit 60834174)
    (at 90.8812 143.2306)
    (fp_text reference REF** (at 0.1778 -3.302) (layer F.SilkS) hide)
    (fp_text value GroundSymbol_Silkscreen (at 0.4318 -2.2606) (layer F.Fab) hide)
  )
  (module bdb002:TQFP-100_14x14mm_P0.5mm_Atmel (layer F.Cu) (tedit 6081F2C0)
    (at 144.1 116.1 270)
    (descr "TQFP, 100 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/100L_TQFP_14x14_PF_C04-0110B.pdf)")
    (tags "TQFP QFP")
    (attr smd)
    (fp_text reference E2 (at -9.6 0.8 180) (layer F.SilkS))
    (fp_text value ATF1504AS-10AU100_prog_BDB002_E2 (at 0 9.35 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 100 smd roundrect (at -6 -7.7 270) (size 0.3 1.5) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 67 /DBG00))
    (pad 99 smd roundrect (at -5.5 -7.7 270) (size 0.3 1.5) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 68 /DBG01))
    (pad 98 smd roundrect (at -5 -7.7 270) (size 0.3 1.5) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 69 /DBG02))
    (pad 97 smd roundrect (at -4.5 -7.7 270) (size 0.3 1.5) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 70 /DBG03))
    (pad 96 smd roundrect (at -4 -7.7 270) (size 0.3 1.5) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 71 /DBG04))
    (pad 95 smd roundrect (at -3.5 -7.7 270) (size 0.3 1.5) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 1 GND))
    (pad 94 smd roundrect (at -3 -7.7 270) (size 0.3 1.5) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 72 /DBG05))
    (pad 93 smd roundrect (at -2.5 -7.7 270) (size 0.3 1.5) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 73 /DBG06))
    (pad 92 smd roundrect (at -2 -7.7 270) (size 0.3 1.5) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 74 /DBG07))
    (pad 91 smd roundrect (at -1.5 -7.7 270) (size 0.3 1.5) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 2 +5V))
    (pad 90 smd roundrect (at -1 -7.7 270) (size 0.3 1.5) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 75 /~OPSW0))
    (pad 89 smd roundrect (at -0.5 -7.7 270) (size 0.3 1.5) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 76 /~OPSW2))
    (pad 88 smd roundrect (at 0 -7.7 270) (size 0.3 1.5) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 77 /~OPSW1))
    (pad 87 smd roundrect (at 0.5 -7.7 270) (size 0.3 1.5) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 78 /DBG08))
    (pad 86 smd roundrect (at 1 -7.7 270) (size 0.3 1.5) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 1 GND))
    (pad 85 smd roundrect (at 1.5 -7.7 270) (size 0.3 1.5) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 79 /DBG09))
    (pad 84 smd roundrect (at 2 -7.7 270) (size 0.3 1.5) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 80 /DBG10))
    (pad 83 smd roundrect (at 2.5 -7.7 270) (size 0.3 1.5) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 81 /DBG11))
    (pad 82 smd roundrect (at 3 -7.7 270) (size 0.3 1.5) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 2 +5V))
    (pad 81 smd roundrect (at 3.5 -7.7 270) (size 0.3 1.5) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 82 /DBG12))
    (pad 80 smd roundrect (at 4 -7.7 270) (size 0.3 1.5) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 83 /DBG13))
    (pad 79 smd roundrect (at 4.5 -7.7 270) (size 0.3 1.5) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 84 /DBG14))
    (pad 78 smd roundrect (at 5 -7.7 270) (size 0.3 1.5) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
    (pad 77 smd roundrect (at 5.5 -7.7 270) (size 0.3 1.5) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
    (pad 75 smd roundrect (at 7.7 -6 270) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 86 /DBG16))
    (pad 74 smd roundrect (at 7.7 -5.5 270) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 1 GND))
    (pad 73 smd roundrect (at 7.7 -5 270) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 38 /TDO))
    (pad 72 smd roundrect (at 7.7 -4.5 270) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
    (pad 71 smd roundrect (at 7.7 -4 270) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 37 /~RASD3))
    (pad 70 smd roundrect (at 7.7 -3.5 270) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
    (pad 69 smd roundrect (at 7.7 -3 270) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 36 /~NBD1))
    (pad 68 smd roundrect (at 7.7 -2.5 270) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 35 /MWHB))
    (pad 67 smd roundrect (at 7.7 -2 270) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 34 /~P256KD))
    (pad 66 smd roundrect (at 7.7 -1.5 270) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 2 +5V))
    (pad 65 smd roundrect (at 7.7 -1 270) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 33 /CAS))
    (pad 64 smd roundrect (at 7.7 -0.5 270) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 32 /~NBD0))
    (pad 63 smd roundrect (at 7.7 0 270) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 31 /~RASD0))
    (pad 62 smd roundrect (at 7.7 0.5 270) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 39 /TCK))
    (pad 61 smd roundrect (at 7.7 1 270) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 30 /MWLB))
    (pad 60 smd roundrect (at 7.7 1.5 270) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 29 /~MUXA8))
    (pad 59 smd roundrect (at 7.7 2 270) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 1 GND))
    (pad 58 smd roundrect (at 7.7 2.5 270) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 28 /~MUXA5))
    (pad 57 smd roundrect (at 7.7 3 270) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 27 /~MUXA6))
    (pad 56 smd roundrect (at 7.7 3.5 270) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 42 /SRAM_A16))
    (pad 55 smd roundrect (at 7.7 4 270) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
    (pad 54 smd roundrect (at 7.7 4.5 270) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 66 /SRAM_A15))
    (pad 53 smd roundrect (at 7.7 5 270) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
    (pad 52 smd roundrect (at 7.7 5.5 270) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 64 /SRAM_A14))
    (pad 50 smd roundrect (at 6 7.7 270) (size 0.3 1.5) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
    (pad 49 smd roundrect (at 5.5 7.7 270) (size 0.3 1.5) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
    (pad 48 smd roundrect (at 5 7.7 270) (size 0.3 1.5) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 63 /SRAM_A13))
    (pad 47 smd roundrect (at 4.5 7.7 270) (size 0.3 1.5) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 62 /SRAM_A12))
    (pad 46 smd roundrect (at 4 7.7 270) (size 0.3 1.5) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 61 /SRAM_A11))
    (pad 45 smd roundrect (at 3.5 7.7 270) (size 0.3 1.5) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 60 /SRAM_A10))
    (pad 44 smd roundrect (at 3 7.7 270) (size 0.3 1.5) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 59 /SRAM_A9))
    (pad 43 smd roundrect (at 2.5 7.7 270) (size 0.3 1.5) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 1 GND))
    (pad 42 smd roundrect (at 2 7.7 270) (size 0.3 1.5) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 58 /SRAM_A8))
    (pad 41 smd roundrect (at 1.5 7.7 270) (size 0.3 1.5) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 57 /SRAM_A19))
    (pad 40 smd roundrect (at 1 7.7 270) (size 0.3 1.5) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 56 /~SRAM_WE))
    (pad 39 smd roundrect (at 0.5 7.7 270) (size 0.3 1.5) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 2 +5V))
    (pad 38 smd roundrect (at 0 7.7 270) (size 0.3 1.5) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 1 GND))
    (pad 37 smd roundrect (at -0.5 7.7 270) (size 0.3 1.5) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 55 /~SRAM_BHE))
    (pad 36 smd roundrect (at -1 7.7 270) (size 0.3 1.5) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 54 /~SRAM_BLE))
    (pad 35 smd roundrect (at -1.5 7.7 270) (size 0.3 1.5) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 53 /SRAM_A18))
    (pad 34 smd roundrect (at -2 7.7 270) (size 0.3 1.5) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 2 +5V))
    (pad 33 smd roundrect (at -2.5 7.7 270) (size 0.3 1.5) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 52 /SRAM_A17))
    (pad 32 smd roundrect (at -3 7.7 270) (size 0.3 1.5) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 51 /SRAM_A7))
    (pad 31 smd roundrect (at -3.5 7.7 270) (size 0.3 1.5) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 50 /SRAM_A6))
    (pad 30 smd roundrect (at -4 7.7 270) (size 0.3 1.5) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 49 /SRAM_A5))
    (pad 29 smd roundrect (at -4.5 7.7 270) (size 0.3 1.5) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 48 /SRAM_A4))
    (pad 28 smd roundrect (at -5 7.7 270) (size 0.3 1.5) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
    (pad 27 smd roundrect (at -5.5 7.7 270) (size 0.3 1.5) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
    (pad 25 smd roundrect (at -7.7 6 270) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 47 /SRAM_A3))
    (pad 24 smd roundrect (at -7.7 5.5 270) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
    (pad 23 smd roundrect (at -7.7 5 270) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 46 /SRAM_A2))
    (pad 22 smd roundrect (at -7.7 4.5 270) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
    (pad 21 smd roundrect (at -7.7 4 270) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 45 /SRAM_A1))
    (pad 20 smd roundrect (at -7.7 3.5 270) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 65 /SRAM_A0))
    (pad 19 smd roundrect (at -7.7 3 270) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 44 /~SRAM_CE))
    (pad 18 smd roundrect (at -7.7 2.5 270) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 2 +5V))
    (pad 17 smd roundrect (at -7.7 2 270) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 43 /~SRAM_OE))
    (pad 16 smd roundrect (at -7.7 1.5 270) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 26 /~MUXA3))
    (pad 15 smd roundrect (at -7.7 1 270) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 40 /TMS))
    (pad 14 smd roundrect (at -7.7 0.5 270) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 25 /~MUXA7))
    (pad 13 smd roundrect (at -7.7 0 270) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 24 /~MUXA4))
    (pad 12 smd roundrect (at -7.7 -0.5 270) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 23 /~MUXA0))
    (pad 11 smd roundrect (at -7.7 -1 270) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 1 GND))
    (pad 10 smd roundrect (at -7.7 -1.5 270) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 22 /~MUXA2))
    (pad 9 smd roundrect (at -7.7 -2 270) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 21 /~MUXA1))
    (pad 8 smd roundrect (at -7.7 -2.5 270) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 20 /~RASD2))
    (pad 7 smd roundrect (at -7.7 -3 270) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
    (pad 6 smd roundrect (at -7.7 -3.5 270) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 19 /~RASD1))
    (pad 5 smd roundrect (at -7.7 -4 270) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
    (pad 4 smd roundrect (at -7.7 -4.5 270) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 41 /TDI))
    (pad 3 smd roundrect (at -7.7 -5 270) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 2 +5V))
    (pad 2 smd roundrect (at -7.7 -5.5 270) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
    (pad 76 smd roundrect (at 6 -7.7 270) (size 0.3 1.5) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 85 /DBG15))
    (pad 51 smd roundrect (at 7.7 6 270) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 2 +5V))
    (pad 26 smd roundrect (at -6 7.7 270) (size 0.3 1.5) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 1 GND))
    (pad 1 smd roundrect (at -7.7 -6 270) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
    (model ${KISYS3DMOD}/Package_QFP.3dshapes/TQFP-100_14x14mm_P0.5mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module bdb002:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder (layer F.Cu) (tedit 5F68FEEF)
    (at 96.275 115.8 180)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C3 (at 0.025 1.675) (layer F.SilkS))
    (fp_text value "0.1 μF" (at 0 1.68) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd roundrect (at 1.0375 0 180) (size 1.175 1.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.2127659574468085)
      (net 1 GND))
    (pad 1 smd roundrect (at -1.0375 0 180) (size 1.175 1.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.2127659574468085)
      (net 2 +5V))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module bdb002:PinHeader_1x01_P2.54mm_Vertical (layer F.Cu) (tedit 59FED5CC)
    (at 120.1 102.92)
    (descr "Through hole straight pin header, 1x01, 2.54mm pitch, single row")
    (tags "Through hole pin header THT 1x01 2.54mm single row")
    (fp_text reference TP5 (at 0 -2.33) (layer F.SilkS))
    (fp_text value TestPoint (at 0 2.33) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 1 thru_hole rect (at 0 0) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 44 /~SRAM_CE))
    (model ${KISYS3DMOD}/Connector_PinHeader_2.54mm.3dshapes/PinHeader_1x01_P2.54mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module bdb002:PinHeader_1x01_P2.54mm_Vertical (layer F.Cu) (tedit 59FED5CC)
    (at 126.77 123.14)
    (descr "Through hole straight pin header, 1x01, 2.54mm pitch, single row")
    (tags "Through hole pin header THT 1x01 2.54mm single row")
    (fp_text reference TP4 (at 0 -2.33) (layer F.SilkS))
    (fp_text value TestPoint (at 0 2.33) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 1 thru_hole rect (at 0 0) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 56 /~SRAM_WE))
    (model ${KISYS3DMOD}/Connector_PinHeader_2.54mm.3dshapes/PinHeader_1x01_P2.54mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module bdb002:PinHeader_1x01_P2.54mm_Vertical (layer F.Cu) (tedit 59FED5CC)
    (at 107.33 102.28)
    (descr "Through hole straight pin header, 1x01, 2.54mm pitch, single row")
    (tags "Through hole pin header THT 1x01 2.54mm single row")
    (fp_text reference TP3 (at 0 -2.33) (layer F.SilkS))
    (fp_text value TestPoint (at 0 2.33) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 1 thru_hole rect (at 0 0) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 43 /~SRAM_OE))
    (model ${KISYS3DMOD}/Connector_PinHeader_2.54mm.3dshapes/PinHeader_1x01_P2.54mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module bdb002:PinHeader_1x01_P2.54mm_Vertical (layer F.Cu) (tedit 59FED5CC)
    (at 131.02 123.14)
    (descr "Through hole straight pin header, 1x01, 2.54mm pitch, single row")
    (tags "Through hole pin header THT 1x01 2.54mm single row")
    (fp_text reference TP2 (at 0 -2.33) (layer F.SilkS))
    (fp_text value TestPoint (at 0 2.33) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 1 thru_hole rect (at 0 0) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 55 /~SRAM_BHE))
    (model ${KISYS3DMOD}/Connector_PinHeader_2.54mm.3dshapes/PinHeader_1x01_P2.54mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module bdb002:PinHeader_1x01_P2.54mm_Vertical (layer F.Cu) (tedit 59FED5CC)
    (at 130.13 108.18)
    (descr "Through hole straight pin header, 1x01, 2.54mm pitch, single row")
    (tags "Through hole pin header THT 1x01 2.54mm single row")
    (fp_text reference TP1 (at 0 -2.33) (layer F.SilkS))
    (fp_text value TestPoint (at 0 2.33) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 1 thru_hole rect (at 0 0) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 54 /~SRAM_BLE))
    (model ${KISYS3DMOD}/Connector_PinHeader_2.54mm.3dshapes/PinHeader_1x01_P2.54mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module bdb002:PinHeader_2x02_P2.54mm_Vertical (layer F.Cu) (tedit 59FED5CC)
    (at 105.41 138.43)
    (descr "Through hole straight pin header, 2x02, 2.54mm pitch, double rows")
    (tags "Through hole pin header THT 2x02 2.54mm double row")
    (fp_text reference J5 (at -1.0795 -2.3876) (layer F.SilkS))
    (fp_text value Conn_02x02_Odd_Even (at 1.27 4.87) (layer F.Fab))
    (fp_text user %R (at 1.27 1.27 90) (layer F.Fab))
    (pad 4 thru_hole oval (at 2.54 2.54) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask))
    (pad 3 thru_hole oval (at 0 2.54) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 2 thru_hole oval (at 2.54 0) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 34 /~P256KD))
    (pad 1 thru_hole rect (at 0 0) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 34 /~P256KD))
    (model ${KISYS3DMOD}/Connector_PinHeader_2.54mm.3dshapes/PinHeader_2x02_P2.54mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module bdb002:PinHeader_2x02_P2.54mm_Vertical (layer F.Cu) (tedit 59FED5CC)
    (at 118.11 135.89)
    (descr "Through hole straight pin header, 2x02, 2.54mm pitch, double rows")
    (tags "Through hole pin header THT 2x02 2.54mm double row")
    (fp_text reference J6 (at -1.3716 -2.4892) (layer F.SilkS))
    (fp_text value Conn_02x02_Odd_Even (at 1.27 4.87) (layer F.Fab))
    (fp_text user %R (at 1.27 1.27 90) (layer F.Fab))
    (pad 4 thru_hole oval (at 2.54 2.54) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask))
    (pad 3 thru_hole oval (at 0 2.54) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 2 thru_hole oval (at 2.54 0) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 32 /~NBD0))
    (pad 1 thru_hole rect (at 0 0) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 32 /~NBD0))
    (model ${KISYS3DMOD}/Connector_PinHeader_2.54mm.3dshapes/PinHeader_2x02_P2.54mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module bdb002:PinHeader_2x02_P2.54mm_Vertical (layer F.Cu) (tedit 59FED5CC)
    (at 93.472 140.97)
    (descr "Through hole straight pin header, 2x02, 2.54mm pitch, double rows")
    (tags "Through hole pin header THT 2x02 2.54mm double row")
    (fp_text reference J4 (at -1.2954 -2.3622) (layer F.SilkS))
    (fp_text value Conn_02x02_Odd_Even (at 1.27 4.87) (layer F.Fab))
    (fp_text user %R (at 1.27 1.27 90) (layer F.Fab))
    (pad 4 thru_hole oval (at 2.54 2.54) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask))
    (pad 3 thru_hole oval (at 0 2.54) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 2 thru_hole oval (at 2.54 0) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 36 /~NBD1))
    (pad 1 thru_hole rect (at 0 0) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 36 /~NBD1))
    (model ${KISYS3DMOD}/Connector_PinHeader_2.54mm.3dshapes/PinHeader_2x02_P2.54mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module bdb002:IDC-Header_2x05_P2.54mm_Vertical (layer F.Cu) (tedit 5EAC9A07)
    (at 174.752 81.28 270)
    (descr "Through hole IDC box header, 2x05, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0")
    (tags "Through hole vertical IDC box header THT 2x05 2.54mm double row")
    (fp_text reference J2 (at 1.2954 18.25752 180) (layer F.SilkS))
    (fp_text value Conn_02x05_Odd_Even (at 1.27 16.26 90) (layer F.Fab))
    (fp_text user %R (at 1.27 5.08) (layer F.Fab))
    (pad 1 thru_hole roundrect (at 0 0 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask) (roundrect_rratio 0.1470588235294118)
      (net 39 /TCK))
    (pad 3 thru_hole circle (at 0 2.54 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 38 /TDO))
    (pad 5 thru_hole circle (at 0 5.08 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 40 /TMS))
    (pad 7 thru_hole circle (at 0 7.62 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask))
    (pad 9 thru_hole circle (at 0 10.16 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 41 /TDI))
    (pad 2 thru_hole circle (at 2.54 0 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 4 thru_hole circle (at 2.54 2.54 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 2 +5V))
    (pad 6 thru_hole circle (at 2.54 5.08 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask))
    (pad 8 thru_hole circle (at 2.54 7.62 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask))
    (pad 10 thru_hole circle (at 2.54 10.16 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 1 GND))
    (model ${KISYS3DMOD}/Connector_IDC.3dshapes/IDC-Header_2x05_P2.54mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module bdb002:PinSocket_2x24_P2.54mm_Vertical_TopMount (layer F.Cu) (tedit 608226B6)
    (at 83.82 86.36)
    (descr "Through hole straight socket strip, 2x24, 2.54mm pitch, double cols (from Kicad 4.0.7), script generated, for top mounting (pins flipped)")
    (tags "Through hole socket strip THT 2x24 2.54mm double row")
    (fp_text reference J1 (at 1.27 -2.77) (layer F.SilkS))
    (fp_text value Conn_02x24_Odd_Even (at 2.27 61.19) (layer F.Fab))
    (fp_text user %R (at 1.27 29.21 90) (layer F.Fab))
    (pad 48 thru_hole oval (at 2.54 58.42) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask))
    (pad 47 thru_hole oval (at 0 58.42) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 37 /~RASD3))
    (pad 46 thru_hole oval (at 2.54 55.88) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask))
    (pad 45 thru_hole oval (at 0 55.88) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 36 /~NBD1))
    (pad 44 thru_hole oval (at 2.54 53.34) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 35 /MWHB))
    (pad 43 thru_hole oval (at 0 53.34) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 34 /~P256KD))
    (pad 42 thru_hole oval (at 2.54 50.8) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 33 /CAS))
    (pad 41 thru_hole oval (at 0 50.8) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 32 /~NBD0))
    (pad 40 thru_hole oval (at 2.54 48.26) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 31 /~RASD0))
    (pad 39 thru_hole oval (at 0 48.26) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 38 thru_hole oval (at 2.54 45.72) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 30 /MWLB))
    (pad 37 thru_hole oval (at 0 45.72) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 36 thru_hole oval (at 2.54 43.18) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 29 /~MUXA8))
    (pad 35 thru_hole oval (at 0 43.18) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 34 thru_hole oval (at 2.54 40.64) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 28 /~MUXA5))
    (pad 33 thru_hole oval (at 0 40.64) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 18 /D12))
    (pad 32 thru_hole oval (at 2.54 38.1) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 27 /~MUXA6))
    (pad 31 thru_hole oval (at 0 38.1) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 17 /D11))
    (pad 30 thru_hole oval (at 2.54 35.56) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 16 /D13))
    (pad 29 thru_hole oval (at 0 35.56) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 15 /D10))
    (pad 28 thru_hole oval (at 2.54 33.02) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 14 /D14))
    (pad 27 thru_hole oval (at 0 33.02) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 13 /D09))
    (pad 26 thru_hole oval (at 2.54 30.48) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 12 /D15))
    (pad 25 thru_hole oval (at 0 30.48) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 11 /D08))
    (pad 24 thru_hole oval (at 2.54 27.94) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 10 /D07))
    (pad 23 thru_hole oval (at 0 27.94) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 9 /D00))
    (pad 22 thru_hole oval (at 2.54 25.4) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 8 /D06))
    (pad 21 thru_hole oval (at 0 25.4) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 7 /D01))
    (pad 20 thru_hole oval (at 2.54 22.86) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 6 /D05))
    (pad 19 thru_hole oval (at 0 22.86) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 5 /D02))
    (pad 18 thru_hole oval (at 2.54 20.32) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 4 /D04))
    (pad 17 thru_hole oval (at 0 20.32) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 3 /D03))
    (pad 16 thru_hole oval (at 2.54 17.78) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 26 /~MUXA3))
    (pad 15 thru_hole oval (at 0 17.78) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 14 thru_hole oval (at 2.54 15.24) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 25 /~MUXA7))
    (pad 13 thru_hole oval (at 0 15.24) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 12 thru_hole oval (at 2.54 12.7) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 24 /~MUXA4))
    (pad 11 thru_hole oval (at 0 12.7) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 10 thru_hole oval (at 2.54 10.16) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 23 /~MUXA0))
    (pad 9 thru_hole oval (at 0 10.16) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 8 thru_hole oval (at 2.54 7.62) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 22 /~MUXA2))
    (pad 7 thru_hole oval (at 0 7.62) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 2 +5V))
    (pad 6 thru_hole oval (at 2.54 5.08) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 21 /~MUXA1))
    (pad 5 thru_hole oval (at 0 5.08) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 2 +5V))
    (pad 4 thru_hole oval (at 2.54 2.54) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 20 /~RASD2))
    (pad 3 thru_hole oval (at 0 2.54) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask))
    (pad 2 thru_hole oval (at 2.54 0) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 1 thru_hole rect (at 0 0) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 19 /~RASD1))
    (model ${KISYS3DMOD}/Connector_PinSocket_2.54mm.3dshapes/PinSocket_2x24_P2.54mm_Vertical.wrl
      (offset (xyz 2.54 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module bdb002:Grayhill_94HAB08T (layer F.Cu) (tedit 6082246E)
    (at 149.098 146.812)
    (descr "Grayhill 94HAB08T 8 Position Coded Switch, through-hole, https://www.grayhill.com/productattributesdipswitches/94HAB08T")
    (tags "rotary switch ")
    (fp_text reference SW1 (at 3.81 -2.36) (layer F.SilkS))
    (fp_text value "94HAB08T 8 Position Coded Switch" (at 3.81 7.44) (layer F.Fab))
    (fp_text user %R (at 3.81 2.54) (layer F.Fab))
    (pad 1 thru_hole rect (at 0 0) (size 2.1 1.9) (drill 0.9652) (layers *.Cu *.Mask)
      (net 75 /~OPSW0))
    (pad 8 thru_hole circle (at 7.62 0) (size 2.1 2.1) (drill 0.9652) (layers *.Cu *.Mask))
    (pad C thru_hole circle (at 0 2.54) (size 2.1 2.1) (drill 0.9652) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad C thru_hole circle (at 7.62 2.54) (size 2.1 2.1) (drill 0.9652) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 4 thru_hole circle (at 0 5.08) (size 2.1 2.1) (drill 0.9652) (layers *.Cu *.Mask)
      (net 76 /~OPSW2))
    (pad 2 thru_hole circle (at 7.62 5.08) (size 2.1 2.1) (drill 0.9652) (layers *.Cu *.Mask)
      (net 77 /~OPSW1))
    (model Grayhill_94HAB08T.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module bdb002:TSOP-I-48_18.4x12mm_P0.5mm_Cypress (layer F.Cu) (tedit 6081F224)
    (at 110.2 115.85 180)
    (descr "TSOP I, 32 pins, 18.4x8mm body (Cypress)")
    (tags "TSOP I 32")
    (attr smd)
    (fp_text reference E1 (at 0.2434 7.7222) (layer F.SilkS))
    (fp_text value CY62167G-45ZXI (at 0 7) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 48 smd roundrect (at 9.75 -5.75 180) (size 1.1 0.25) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.3)
      (net 42 /SRAM_A16))
    (pad 47 smd roundrect (at 9.75 -5.25 180) (size 1.1 0.25) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.3)
      (net 2 +5V))
    (pad 46 smd roundrect (at 9.75 -4.75 180) (size 1.1 0.25) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.3)
      (net 1 GND))
    (pad 45 smd roundrect (at 9.75 -4.25 180) (size 1.1 0.25) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.3)
      (net 18 /D12))
    (pad 44 smd roundrect (at 9.75 -3.75 180) (size 1.1 0.25) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.3)
      (net 9 /D00))
    (pad 43 smd roundrect (at 9.75 -3.25 180) (size 1.1 0.25) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.3)
      (net 17 /D11))
    (pad 42 smd roundrect (at 9.75 -2.75 180) (size 1.1 0.25) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.3)
      (net 10 /D07))
    (pad 41 smd roundrect (at 9.75 -2.25 180) (size 1.1 0.25) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.3)
      (net 15 /D10))
    (pad 40 smd roundrect (at 9.75 -1.75 180) (size 1.1 0.25) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.3)
      (net 7 /D01))
    (pad 39 smd roundrect (at 9.75 -1.25 180) (size 1.1 0.25) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.3)
      (net 16 /D13))
    (pad 38 smd roundrect (at 9.75 -0.75 180) (size 1.1 0.25) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.3)
      (net 8 /D06))
    (pad 37 smd roundrect (at 9.75 -0.25 180) (size 1.1 0.25) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.3)
      (net 2 +5V))
    (pad 36 smd roundrect (at 9.75 0.25 180) (size 1.1 0.25) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.3)
      (net 14 /D14))
    (pad 35 smd roundrect (at 9.75 0.75 180) (size 1.1 0.25) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.3)
      (net 6 /D05))
    (pad 34 smd roundrect (at 9.75 1.25 180) (size 1.1 0.25) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.3)
      (net 13 /D09))
    (pad 33 smd roundrect (at 9.75 1.75 180) (size 1.1 0.25) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.3)
      (net 5 /D02))
    (pad 32 smd roundrect (at 9.75 2.25 180) (size 1.1 0.25) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.3)
      (net 12 /D15))
    (pad 31 smd roundrect (at 9.75 2.75 180) (size 1.1 0.25) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.3)
      (net 4 /D04))
    (pad 30 smd roundrect (at 9.75 3.25 180) (size 1.1 0.25) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.3)
      (net 11 /D08))
    (pad 29 smd roundrect (at 9.75 3.75 180) (size 1.1 0.25) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.3)
      (net 3 /D03))
    (pad 28 smd roundrect (at 9.75 4.25 180) (size 1.1 0.25) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.3)
      (net 43 /~SRAM_OE))
    (pad 27 smd roundrect (at 9.75 4.75 180) (size 1.1 0.25) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.3)
      (net 1 GND))
    (pad 26 smd roundrect (at 9.75 5.25 180) (size 1.1 0.25) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.3)
      (net 44 /~SRAM_CE))
    (pad 24 smd roundrect (at -9.75 5.75 180) (size 1.1 0.25) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.3)
      (net 45 /SRAM_A1))
    (pad 23 smd roundrect (at -9.75 5.25 180) (size 1.1 0.25) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.3)
      (net 46 /SRAM_A2))
    (pad 22 smd roundrect (at -9.75 4.75 180) (size 1.1 0.25) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.3)
      (net 47 /SRAM_A3))
    (pad 21 smd roundrect (at -9.75 4.25 180) (size 1.1 0.25) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.3)
      (net 48 /SRAM_A4))
    (pad 20 smd roundrect (at -9.75 3.75 180) (size 1.1 0.25) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.3)
      (net 49 /SRAM_A5))
    (pad 19 smd roundrect (at -9.75 3.25 180) (size 1.1 0.25) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.3)
      (net 50 /SRAM_A6))
    (pad 18 smd roundrect (at -9.75 2.75 180) (size 1.1 0.25) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.3)
      (net 51 /SRAM_A7))
    (pad 17 smd roundrect (at -9.75 2.25 180) (size 1.1 0.25) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.3)
      (net 52 /SRAM_A17))
    (pad 16 smd roundrect (at -9.75 1.75 180) (size 1.1 0.25) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.3)
      (net 53 /SRAM_A18))
    (pad 15 smd roundrect (at -9.75 1.25 180) (size 1.1 0.25) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.3)
      (net 54 /~SRAM_BLE))
    (pad 14 smd roundrect (at -9.75 0.75 180) (size 1.1 0.25) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.3)
      (net 55 /~SRAM_BHE))
    (pad 13 smd roundrect (at -9.75 0.25 180) (size 1.1 0.25) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.3))
    (pad 12 smd roundrect (at -9.75 -0.25 180) (size 1.1 0.25) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.3)
      (net 2 +5V))
    (pad 11 smd roundrect (at -9.75 -0.75 180) (size 1.1 0.25) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.3)
      (net 56 /~SRAM_WE))
    (pad 10 smd roundrect (at -9.75 -1.25 180) (size 1.1 0.25) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.3))
    (pad 9 smd roundrect (at -9.75 -1.75 180) (size 1.1 0.25) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.3)
      (net 57 /SRAM_A19))
    (pad 8 smd roundrect (at -9.75 -2.25 180) (size 1.1 0.25) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.3)
      (net 58 /SRAM_A8))
    (pad 7 smd roundrect (at -9.75 -2.75 180) (size 1.1 0.25) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.3)
      (net 59 /SRAM_A9))
    (pad 6 smd roundrect (at -9.75 -3.25 180) (size 1.1 0.25) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.3)
      (net 60 /SRAM_A10))
    (pad 5 smd roundrect (at -9.75 -3.75 180) (size 1.1 0.25) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.3)
      (net 61 /SRAM_A11))
    (pad 4 smd roundrect (at -9.75 -4.25 180) (size 1.1 0.25) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.3)
      (net 62 /SRAM_A12))
    (pad 3 smd roundrect (at -9.75 -4.75 180) (size 1.1 0.25) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.3)
      (net 63 /SRAM_A13))
    (pad 2 smd roundrect (at -9.75 -5.25 180) (size 1.1 0.25) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.3)
      (net 64 /SRAM_A14))
    (pad 25 smd roundrect (at 9.75 5.75 180) (size 1.1 0.25) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.3)
      (net 65 /SRAM_A0))
    (pad 1 smd roundrect (at -9.75 -5.75 180) (size 1.1 0.25) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.3)
      (net 66 /SRAM_A15))
    (model ${KISYS3DMOD}/Package_SO.3dshapes/TSOP-I-48_18.4x12mm_P0.5mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module bdb002:R_1206_3216Metric_Pad1.30x1.75mm_HandSolder (layer F.Cu) (tedit 5F68FEEE)
    (at 142.748 151.892)
    (descr "Resistor SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R3 (at 0 -1.82) (layer F.SilkS))
    (fp_text value "20 kΩ" (at 0 1.82) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd roundrect (at 1.55 0) (size 1.3 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.1923076923076923)
      (net 76 /~OPSW2))
    (pad 1 smd roundrect (at -1.55 0) (size 1.3 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.1923076923076923)
      (net 2 +5V))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_1206_3216Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module bdb002:R_1206_3216Metric_Pad1.30x1.75mm_HandSolder (layer F.Cu) (tedit 5F68FEEE)
    (at 156.1465 139.6365)
    (descr "Resistor SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R2 (at 0 -1.82) (layer F.SilkS))
    (fp_text value "20 kΩ" (at 0 1.82) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd roundrect (at 1.55 0) (size 1.3 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.1923076923076923)
      (net 77 /~OPSW1))
    (pad 1 smd roundrect (at -1.55 0) (size 1.3 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.1923076923076923)
      (net 2 +5V))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_1206_3216Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module bdb002:R_1206_3216Metric_Pad1.30x1.75mm_HandSolder (layer F.Cu) (tedit 5F68FEEE)
    (at 142.6972 146.812)
    (descr "Resistor SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R1 (at 0 -1.82) (layer F.SilkS))
    (fp_text value "20 kΩ" (at 0 1.82) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd roundrect (at 1.55 0) (size 1.3 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.1923076923076923)
      (net 75 /~OPSW0))
    (pad 1 smd roundrect (at -1.55 0) (size 1.3 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.1923076923076923)
      (net 2 +5V))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_1206_3216Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module bdb002:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder (layer F.Cu) (tedit 5F68FEEF)
    (at 145.8468 129.1844 270)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C9 (at -2.4384 0.1016 180) (layer F.SilkS))
    (fp_text value "0.1 μF" (at 0 1.68 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd roundrect (at 1.0375 0 270) (size 1.175 1.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.2127659574468085)
      (net 1 GND))
    (pad 1 smd roundrect (at -1.0375 0 270) (size 1.175 1.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.2127659574468085)
      (net 2 +5V))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module bdb002:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder (layer F.Cu) (tedit 5F68FEEF)
    (at 140.9446 103.3272 90)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C8 (at 2.5272 -0.0446 180) (layer F.SilkS))
    (fp_text value "0.1 μF" (at 0 1.68 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd roundrect (at 1.0375 0 90) (size 1.175 1.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.2127659574468085)
      (net 1 GND))
    (pad 1 smd roundrect (at -1.0375 0 90) (size 1.175 1.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.2127659574468085)
      (net 2 +5V))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module bdb002:C_1206_3216Metric_Pad1.33x1.80mm_HandSolder (layer F.Cu) (tedit 5F68FEEF)
    (at 95.3516 148.7932)
    (descr "Capacitor SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C2 (at 0 -1.85) (layer F.SilkS))
    (fp_text value "47 μF" (at 0 1.85) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd roundrect (at 1.5625 0) (size 1.325 1.8) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.1886784905660377)
      (net 1 GND))
    (pad 1 smd roundrect (at -1.5625 0) (size 1.325 1.8) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.1886784905660377)
      (net 2 +5V))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_1206_3216Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module bdb002:C_1206_3216Metric_Pad1.33x1.80mm_HandSolder (layer F.Cu) (tedit 5F68FEEF)
    (at 94.1963 82.3976)
    (descr "Capacitor SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C1 (at 0 -1.85) (layer F.SilkS))
    (fp_text value "47 μF" (at 0 1.85) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd roundrect (at 1.5625 0) (size 1.325 1.8) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.1886784905660377)
      (net 1 GND))
    (pad 1 smd roundrect (at -1.5625 0) (size 1.325 1.8) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.1886784905660377)
      (net 2 +5V))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_1206_3216Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module bdb002:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder (layer F.Cu) (tedit 5F68FEEF)
    (at 158.3 113.525 90)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C12 (at 2.4762 0.0182 180) (layer F.SilkS))
    (fp_text value "0.1 μF" (at 0 1.68 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd roundrect (at 1.0375 0 90) (size 1.175 1.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.2127659574468085)
      (net 1 GND))
    (pad 1 smd roundrect (at -1.0375 0 90) (size 1.175 1.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.2127659574468085)
      (net 2 +5V))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module bdb002:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder (layer F.Cu) (tedit 5F68FEEF)
    (at 157.15 120.15 270)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C11 (at -2.5226 0.0256 180) (layer F.SilkS))
    (fp_text value "0.1 μF" (at 0 1.68 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd roundrect (at 1.0375 0 270) (size 1.175 1.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.2127659574468085)
      (net 1 GND))
    (pad 1 smd roundrect (at -1.0375 0 270) (size 1.175 1.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.2127659574468085)
      (net 2 +5V))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module bdb002:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder (layer F.Cu) (tedit 5F68FEEF)
    (at 125.5268 116.332)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C4 (at 0 1.4986) (layer F.SilkS))
    (fp_text value "0.1 μF" (at 0 1.68) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd roundrect (at 1.0375 0) (size 1.175 1.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.2127659574468085)
      (net 1 GND))
    (pad 1 smd roundrect (at -1.0375 0) (size 1.175 1.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.2127659574468085)
      (net 2 +5V))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module bdb002:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder (layer F.Cu) (tedit 5F68FEEF)
    (at 151.9682 104.8258 90)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C10 (at 2.5908 0.0254 180) (layer F.SilkS))
    (fp_text value "0.1 μF" (at 0 1.68 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd roundrect (at 1.0375 0 90) (size 1.175 1.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.2127659574468085)
      (net 1 GND))
    (pad 1 smd roundrect (at -1.0375 0 90) (size 1.175 1.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.2127659574468085)
      (net 2 +5V))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module bdb002:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder (layer F.Cu) (tedit 5F68FEEF)
    (at 134.85 125.75 180)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C7 (at 0.0776 1.5948) (layer F.SilkS))
    (fp_text value "0.1 μF" (at 0 1.68) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd roundrect (at 1.0375 0 180) (size 1.175 1.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.2127659574468085)
      (net 1 GND))
    (pad 1 smd roundrect (at -1.0375 0 180) (size 1.175 1.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.2127659574468085)
      (net 2 +5V))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module bdb002:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder (layer F.Cu) (tedit 5F68FEEF)
    (at 130.4036 116.332 180)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C6 (at 0 -1.68) (layer F.SilkS))
    (fp_text value "0.1 μF" (at 0 1.68) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd roundrect (at 1.0375 0 180) (size 1.175 1.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.2127659574468085)
      (net 1 GND))
    (pad 1 smd roundrect (at -1.0375 0 180) (size 1.175 1.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.2127659574468085)
      (net 2 +5V))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module bdb002:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder (layer F.Cu) (tedit 5F68FEEF)
    (at 129.7 112.9 180)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C5 (at 0.0076 1.5464) (layer F.SilkS))
    (fp_text value "0.1 μF" (at 0 1.68) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd roundrect (at 1.0375 0 180) (size 1.175 1.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.2127659574468085)
      (net 1 GND))
    (pad 1 smd roundrect (at -1.0375 0 180) (size 1.175 1.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.2127659574468085)
      (net 2 +5V))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module bdb002:PinHeader_2x17_P2.54mm_Vertical (layer F.Cu) (tedit 59FED5CC)
    (at 188.341 89.916)
    (descr "Through hole straight pin header, 2x17, 2.54mm pitch, double rows")
    (tags "Through hole pin header THT 2x17 2.54mm double row")
    (fp_text reference J3 (at -0.0508 -2.6924) (layer F.SilkS))
    (fp_text value Conn_02x17_Odd_Even (at 1.27 42.97) (layer F.Fab))
    (fp_text user %R (at 1.27 20.32 180) (layer F.Fab))
    (pad 34 thru_hole oval (at 2.54 40.64) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 33 thru_hole oval (at 0 40.64) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 86 /DBG16))
    (pad 32 thru_hole oval (at 2.54 38.1) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 31 thru_hole oval (at 0 38.1) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 85 /DBG15))
    (pad 30 thru_hole oval (at 2.54 35.56) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 29 thru_hole oval (at 0 35.56) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 84 /DBG14))
    (pad 28 thru_hole oval (at 2.54 33.02) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 27 thru_hole oval (at 0 33.02) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 83 /DBG13))
    (pad 26 thru_hole oval (at 2.54 30.48) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 25 thru_hole oval (at 0 30.48) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 82 /DBG12))
    (pad 24 thru_hole oval (at 2.54 27.94) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 23 thru_hole oval (at 0 27.94) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 81 /DBG11))
    (pad 22 thru_hole oval (at 2.54 25.4) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 21 thru_hole oval (at 0 25.4) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 80 /DBG10))
    (pad 20 thru_hole oval (at 2.54 22.86) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 19 thru_hole oval (at 0 22.86) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 79 /DBG09))
    (pad 18 thru_hole oval (at 2.54 20.32) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 17 thru_hole oval (at 0 20.32) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 78 /DBG08))
    (pad 16 thru_hole oval (at 2.54 17.78) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 15 thru_hole oval (at 0 17.78) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 74 /DBG07))
    (pad 14 thru_hole oval (at 2.54 15.24) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 13 thru_hole oval (at 0 15.24) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 73 /DBG06))
    (pad 12 thru_hole oval (at 2.54 12.7) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 11 thru_hole oval (at 0 12.7) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 72 /DBG05))
    (pad 10 thru_hole oval (at 2.54 10.16) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 9 thru_hole oval (at 0 10.16) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 71 /DBG04))
    (pad 8 thru_hole oval (at 2.54 7.62) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 7 thru_hole oval (at 0 7.62) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 70 /DBG03))
    (pad 6 thru_hole oval (at 2.54 5.08) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 5 thru_hole oval (at 0 5.08) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 69 /DBG02))
    (pad 4 thru_hole oval (at 2.54 2.54) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 3 thru_hole oval (at 0 2.54) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 68 /DBG01))
    (pad 2 thru_hole oval (at 2.54 0) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 1 thru_hole rect (at 0 0) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 67 /DBG00))
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  (gr_text 3 (at 82.5246 88.9508 180) (layer B.SilkS))
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