(kicad_pcb (version 20221018) (generator pcbnew)
  (general
    (thickness 1.5422)
  )
  (paper "A4")
  (layers
    (0 "F.Cu" signal)
    (1 "In1.Cu" power)
    (2 "In2.Cu" power)
    (31 "B.Cu" signal)
    (32 "B.Adhes" user "B.Adhesive")
    (33 "F.Adhes" user "F.Adhesive")
    (34 "B.Paste" user)
    (35 "F.Paste" user)
    (36 "B.SilkS" user "B.Silkscreen")
    (37 "F.SilkS" user "F.Silkscreen")
    (38 "B.Mask" user)
    (39 "F.Mask" user)
    (40 "Dwgs.User" user "User.Drawings")
    (41 "Cmts.User" user "User.Comments")
    (42 "Eco1.User" user "User.Eco1")
    (43 "Eco2.User" user "User.Eco2")
    (44 "Edge.Cuts" user)
    (45 "Margin" user)
    (46 "B.CrtYd" user "B.Courtyard")
    (47 "F.CrtYd" user "F.Courtyard")
    (48 "B.Fab" user)
    (49 "F.Fab" user)
    (50 "User.1" user)
    (51 "User.2" user)
    (52 "User.3" user)
    (53 "User.4" user)
    (54 "User.5" user)
    (55 "User.6" user)
    (56 "User.7" user)
    (57 "User.8" user)
    (58 "User.9" user)
  )
  (setup
    (stackup
      (layer "F.SilkS" (type "Top Silk Screen"))
      (layer "F.Paste" (type "Top Solder Paste"))
      (layer "F.Mask" (type "Top Solder Mask") (thickness 0.0152))
      (layer "F.Cu" (type "copper") (thickness 0.0432))
      (layer "dielectric 1" (type "prepreg") (thickness 0.1999) (material "FR4") (epsilon_r 3.61) (loss_tangent 0.02))
      (layer "In1.Cu" (type "copper") (thickness 0.0175))
      (layer "dielectric 2" (type "core") (thickness 0.9906) (material "FR4") (epsilon_r 4.5) (loss_tangent 0.02))
      (layer "In2.Cu" (type "copper") (thickness 0.0175))
      (layer "dielectric 3" (type "prepreg") (thickness 0.1999) (material "FR4") (epsilon_r 3.61) (loss_tangent 0.02))
      (layer "B.Cu" (type "copper") (thickness 0.0432))
      (layer "B.Mask" (type "Bottom Solder Mask") (thickness 0.0152))
      (layer "B.Paste" (type "Bottom Solder Paste"))
      (layer "B.SilkS" (type "Bottom Silk Screen"))
      (copper_finish "None")
      (dielectric_constraints yes)
    )
    (pad_to_mask_clearance 0)
    (pcbplotparams
      (layerselection 0x00010fc_ffffffff)
      (plot_on_all_layers_selection 0x0000000_00000000)
      (disableapertmacros false)
      (usegerberextensions false)
      (usegerberattributes true)
      (usegerberadvancedattributes true)
      (creategerberjobfile true)
      (dashed_line_dash_ratio 12.000000)
      (dashed_line_gap_ratio 3.000000)
      (svgprecision 4)
      (plotframeref false)
      (viasonmask false)
      (mode 1)
      (useauxorigin false)
      (hpglpennumber 1)
      (hpglpenspeed 20)
      (hpglpendiameter 15.000000)
      (dxfpolygonmode true)
      (dxfimperialunits true)
      (dxfusepcbnewfont true)
      (psnegative false)
      (psa4output false)
      (plotreference true)
      (plotvalue true)
      (plotinvisibletext false)
      (sketchpadsonfab false)
      (subtractmaskfromsilk false)
      (outputformat 1)
      (mirror false)
      (drillshape 1)
      (scaleselection 1)
      (outputdirectory "")
    )
  )
  (net 0 "")
  (net 1 "GNDD")
  (net 2 "/RD_CLK_P")
  (net 3 "/DATA_OUT_1_P")
  (net 4 "/DATA_OUT_0_P")
  (net 5 "/ASIC_SR0_P")
  (net 6 "/WORD_CLK_0_P")
  (net 7 "GNDA")
  (net 8 "/HS_Vdiff_n")
  (net 9 "/VDD1")
  (net 10 "/VDD2")
  (net 11 "/ASIC_GR")
  (net 12 "/SACI_CMD_P")
  (net 13 "/SACI_CLK_P")
  (net 14 "/ASIC0_SACI_SEL")
  (net 15 "/ADC_MON_VIN_P")
  (net 16 "/ASIC_SampClkEn_P")
  (net 17 "/VDD2_Sense")
  (net 18 "/SACI_RESP_P")
  (net 19 "/ASIC_PULSE")
  (net 20 "/ADC_MON_VCOM")
  (net 21 "/VDD1_Sense")
  (net 22 "unconnected-(J1-SHIELD-PadSH1)")
  (net 23 "unconnected-(J1-SHIELD__1-PadSH2)")
  (net 24 "/WORD_CLK_0_N")
  (net 25 "/RD_CLK_N")
  (net 26 "/DATA_OUT_1_N")
  (net 27 "/DATA_OUT_0_N")
  (net 28 "/ASIC_SR0_N")
  (net 29 "/ASIC_SampClkEn_N")
  (net 30 "/SACI_RESP_N")
  (net 31 "/SACI_CMD_N")
  (net 32 "/SACI_CLK_N")
  (net 33 "/ADC_MON_VIN_N")
  (footprint "MountingHole:MountingHole_3mm" (layer "F.Cu")
    (at 85.8266 116.1796)
    (descr "Mounting Hole 3mm, no annular")
    (tags "mounting hole 3mm no annular")
    (property "Sheetfile" "fuzz button test board v2.kicad_sch")
    (property "Sheetname" "")
    (property "ki_description" "Mounting Hole without connection")
    (property "ki_keywords" "mounting hole")
    (attr exclude_from_pos_files)
    (fp_text reference "H2" (at 0 -4) (layer "F.SilkS"))
    (fp_text value "MountingHole" (at 0 4) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab"))
    (pad "" np_thru_hole circle (at 0 0) (size 3 3) (drill 3) (layers "*.Cu" "*.Mask"))
  )
  (footprint "MountingHole:MountingHole_3mm" (layer "F.Cu")
    (at 162.8394 46.5836)
    (descr "Mounting Hole 3mm, no annular")
    (tags "mounting hole 3mm no annular")
    (property "Sheetfile" "fuzz button test board v2.kicad_sch")
    (property "Sheetname" "")
    (property "ki_description" "Mounting Hole without connection")
    (property "ki_keywords" "mounting hole")
    (attr exclude_from_pos_files)
    (fp_text reference "H1" (at 0 -4) (layer "F.SilkS"))
    (fp_text value "MountingHole" (at 0 4) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab"))
    (pad "" np_thru_hole circle (at 0 0) (size 3 3) (drill 3) (layers "*.Cu" "*.Mask"))
  )
  (footprint "MountingHole:MountingHole_3mm" (layer "F.Cu")
    (at 85.5218 45.6438)
    (descr "Mounting Hole 3mm, no annular")
    (tags "mounting hole 3mm no annular")
    (property "Sheetfile" "fuzz button test board v2.kicad_sch")
    (property "Sheetname" "")
    (property "ki_description" "Mounting Hole without connection")
    (property "ki_keywords" "mounting hole")
    (attr exclude_from_pos_files)
    (fp_text reference "H3" (at 0 -4) (layer "F.SilkS"))
    (fp_text value "MountingHole" (at 0 4) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab"))
    (pad "" np_thru_hole circle (at 0 0) (size 3 3) (drill 3) (layers "*.Cu" "*.Mask"))
  )
  (footprint "Custom footprints:AMPHENOL_D50P24A4GV00LF" (layer "F.Cu")
    (at 100.5888 83.1502 -90)
    (property "MANUFACTURER" "Amphenol")
    (property "MAXIMUM_PACKAGE_HEIGHT" "12.3mm")
    (property "PARTREV" "D")
    (property "STANDARD" "Manufacturer Recommendations")
    (property "Sheetfile" "fuzz button test board v2.kicad_sch")
    (property "Sheetname" "")
    (attr through_hole)
    (fp_text reference "J1" (at -29.94 -9.221 90) (layer "F.SilkS"))
    (fp_text value "D50P24A4GV00LF" (at -18.21 9.25 90) (layer "F.Fab"))
    (pad "1" thru_hole rect (at -22.08 -2.84 270) (size 1.408 1.408) (drill 0.9) (layers "*.Cu" "*.Mask")
      (net 1 "GNDD") (pinfunction "1") (pintype "passive") (solder_mask_margin 0.102))
    (pad "2" thru_hole circle (at -19.32 -2.84 270) (size 1.408 1.408) (drill 0.9) (layers "*.Cu" "*.Mask")
      (net 2 "/RD_CLK_P") (pinfunction "2") (pintype "passive") (solder_mask_margin 0.102))
    (pad "3" thru_hole circle (at -16.56 -2.84 270) (size 1.408 1.408) (drill 0.9) (layers "*.Cu" "*.Mask")
      (net 1 "GNDD") (pinfunction "3") (pintype "passive") (solder_mask_margin 0.102))
    (pad "4" thru_hole circle (at -13.8 -2.84 270) (size 1.408 1.408) (drill 0.9) (layers "*.Cu" "*.Mask")
      (net 3 "/DATA_OUT_1_P") (pinfunction "4") (pintype "passive") (solder_mask_margin 0.102))
    (pad "5" thru_hole circle (at -11.04 -2.84 270) (size 1.408 1.408) (drill 0.9) (layers "*.Cu" "*.Mask")
      (net 1 "GNDD") (pinfunction "5") (pintype "passive") (solder_mask_margin 0.102))
    (pad "6" thru_hole circle (at -8.28 -2.84 270) (size 1.408 1.408) (drill 0.9) (layers "*.Cu" "*.Mask")
      (net 4 "/DATA_OUT_0_P") (pinfunction "6") (pintype "passive") (solder_mask_margin 0.102))
    (pad "7" thru_hole circle (at -5.52 -2.84 270) (size 1.408 1.408) (drill 0.9) (layers "*.Cu" "*.Mask")
      (net 1 "GNDD") (pinfunction "7") (pintype "passive") (solder_mask_margin 0.102))
    (pad "8" thru_hole circle (at -2.76 -2.84 270) (size 1.408 1.408) (drill 0.9) (layers "*.Cu" "*.Mask")
      (net 5 "/ASIC_SR0_P") (pinfunction "8") (pintype "passive") (solder_mask_margin 0.102))
    (pad "9" thru_hole circle (at 0 -2.84 270) (size 1.408 1.408) (drill 0.9) (layers "*.Cu" "*.Mask")
      (net 1 "GNDD") (pinfunction "9") (pintype "passive") (solder_mask_margin 0.102))
    (pad "10" thru_hole circle (at 2.76 -2.84 270) (size 1.408 1.408) (drill 0.9) (layers "*.Cu" "*.Mask")
      (net 24 "/WORD_CLK_0_N") (pinfunction "10") (pintype "passive") (solder_mask_margin 0.102))
    (pad "11" thru_hole circle (at 5.52 -2.84 270) (size 1.408 1.408) (drill 0.9) (layers "*.Cu" "*.Mask")
      (net 6 "/WORD_CLK_0_P") (pinfunction "11") (pintype "passive") (solder_mask_margin 0.102))
    (pad "12" thru_hole circle (at 8.28 -2.84 270) (size 1.408 1.408) (drill 0.9) (layers "*.Cu" "*.Mask")
      (net 1 "GNDD") (pinfunction "12") (pintype "passive") (solder_mask_margin 0.102))
    (pad "13" thru_hole circle (at 11.04 -2.84 270) (size 1.408 1.408) (drill 0.9) (layers "*.Cu" "*.Mask")
      (net 7 "GNDA") (pinfunction "13") (pintype "passive") (solder_mask_margin 0.102))
    (pad "14" thru_hole circle (at 13.8 -2.84 270) (size 1.408 1.408) (drill 0.9) (layers "*.Cu" "*.Mask")
      (net 8 "/HS_Vdiff_n") (pinfunction "14") (pintype "passive") (solder_mask_margin 0.102))
    (pad "15" thru_hole circle (at 16.56 -2.84 270) (size 1.408 1.408) (drill 0.9) (layers "*.Cu" "*.Mask")
      (net 9 "/VDD1") (pinfunction "15") (pintype "passive") (solder_mask_margin 0.102))
    (pad "16" thru_hole circle (at 19.32 -2.84 270) (size 1.408 1.408) (drill 0.9) (layers "*.Cu" "*.Mask")
      (net 9 "/VDD1") (pinfunction "16") (pintype "passive") (solder_mask_margin 0.102))
    (pad "17" thru_hole circle (at 22.08 -2.84 270) (size 1.408 1.408) (drill 0.9) (layers "*.Cu" "*.Mask")
      (net 7 "GNDA") (pinfunction "17") (pintype "passive") (solder_mask_margin 0.102))
    (pad "18" thru_hole circle (at -20.7 0 270) (size 1.408 1.408) (drill 0.9) (layers "*.Cu" "*.Mask")
      (net 10 "/VDD2") (pinfunction "18") (pintype "passive") (solder_mask_margin 0.102))
    (pad "19" thru_hole circle (at -17.94 0 270) (size 1.408 1.408) (drill 0.9) (layers "*.Cu" "*.Mask")
      (net 25 "/RD_CLK_N") (pinfunction "19") (pintype "passive") (solder_mask_margin 0.102))
    (pad "20" thru_hole circle (at -15.18 0 270) (size 1.408 1.408) (drill 0.9) (layers "*.Cu" "*.Mask")
      (net 1 "GNDD") (pinfunction "20") (pintype "passive") (solder_mask_margin 0.102))
    (pad "21" thru_hole circle (at -12.42 0 270) (size 1.408 1.408) (drill 0.9) (layers "*.Cu" "*.Mask")
      (net 26 "/DATA_OUT_1_N") (pinfunction "21") (pintype "passive") (solder_mask_margin 0.102))
    (pad "22" thru_hole circle (at -9.66 0 270) (size 1.408 1.408) (drill 0.9) (layers "*.Cu" "*.Mask")
      (net 1 "GNDD") (pinfunction "22") (pintype "passive") (solder_mask_margin 0.102))
    (pad "23" thru_hole circle (at -6.9 0 270) (size 1.408 1.408) (drill 0.9) (layers "*.Cu" "*.Mask")
      (net 27 "/DATA_OUT_0_N") (pinfunction "23") (pintype "passive") (solder_mask_margin 0.102))
    (pad "24" thru_hole circle (at -4.14 0 270) (size 1.408 1.408) (drill 0.9) (layers "*.Cu" "*.Mask")
      (net 11 "/ASIC_GR") (pinfunction "24") (pintype "passive") (solder_mask_margin 0.102))
    (pad "25" thru_hole circle (at -1.38 0 270) (size 1.408 1.408) (drill 0.9) (layers "*.Cu" "*.Mask")
      (net 28 "/ASIC_SR0_N") (pinfunction "25") (pintype "passive") (solder_mask_margin 0.102))
    (pad "26" thru_hole circle (at 1.38 0 270) (size 1.408 1.408) (drill 0.9) (layers "*.Cu" "*.Mask")
      (net 1 "GNDD") (pinfunction "26") (pintype "passive") (solder_mask_margin 0.102))
    (pad "27" thru_hole circle (at 4.14 0 270) (size 1.408 1.408) (drill 0.9) (layers "*.Cu" "*.Mask")
      (net 12 "/SACI_CMD_P") (pinfunction "27") (pintype "passive") (solder_mask_margin 0.102))
    (pad "28" thru_hole circle (at 6.9 0 270) (size 1.408 1.408) (drill 0.9) (layers "*.Cu" "*.Mask")
      (net 1 "GNDD") (pinfunction "28") (pintype "passive") (solder_mask_margin 0.102))
    (pad "29" thru_hole circle (at 9.66 0 270) (size 1.408 1.408) (drill 0.9) (layers "*.Cu" "*.Mask")
      (net 13 "/SACI_CLK_P") (pinfunction "29") (pintype "passive") (solder_mask_margin 0.102))
    (pad "30" thru_hole circle (at 12.42 0 270) (size 1.408 1.408) (drill 0.9) (layers "*.Cu" "*.Mask")
      (net 14 "/ASIC0_SACI_SEL") (pinfunction "30") (pintype "passive") (solder_mask_margin 0.102))
    (pad "31" thru_hole circle (at 15.18 0 270) (size 1.408 1.408) (drill 0.9) (layers "*.Cu" "*.Mask")
      (net 7 "GNDA") (pinfunction "31") (pintype "passive") (solder_mask_margin 0.102))
    (pad "32" thru_hole circle (at 17.94 0 270) (size 1.408 1.408) (drill 0.9) (layers "*.Cu" "*.Mask")
      (net 15 "/ADC_MON_VIN_P") (pinfunction "32") (pintype "passive") (solder_mask_margin 0.102))
    (pad "33" thru_hole circle (at 20.7 0 270) (size 1.408 1.408) (drill 0.9) (layers "*.Cu" "*.Mask")
      (net 7 "GNDA") (pinfunction "33") (pintype "passive") (solder_mask_margin 0.102))
    (pad "34" thru_hole circle (at -22.08 2.84 270) (size 1.408 1.408) (drill 0.9) (layers "*.Cu" "*.Mask")
      (net 10 "/VDD2") (pinfunction "34") (pintype "passive") (solder_mask_margin 0.102))
    (pad "35" thru_hole circle (at -19.32 2.84 270) (size 1.408 1.408) (drill 0.9) (layers "*.Cu" "*.Mask")
      (net 16 "/ASIC_SampClkEn_P") (pinfunction "35") (pintype "passive") (solder_mask_margin 0.102))
    (pad "36" thru_hole circle (at -16.56 2.84 270) (size 1.408 1.408) (drill 0.9) (layers "*.Cu" "*.Mask")
      (net 29 "/ASIC_SampClkEn_N") (pinfunction "36") (pintype "passive") (solder_mask_margin 0.102))
    (pad "37" thru_hole circle (at -13.8 2.84 270) (size 1.408 1.408) (drill 0.9) (layers "*.Cu" "*.Mask")
      (net 17 "/VDD2_Sense") (pinfunction "37") (pintype "passive") (solder_mask_margin 0.102))
    (pad "38" thru_hole circle (at -11.04 2.84 270) (size 1.408 1.408) (drill 0.9) (layers "*.Cu" "*.Mask")
      (net 1 "GNDD") (pinfunction "38") (pintype "passive") (solder_mask_margin 0.102))
    (pad "39" thru_hole circle (at -8.28 2.84 270) (size 1.408 1.408) (drill 0.9) (layers "*.Cu" "*.Mask")
      (net 18 "/SACI_RESP_P") (pinfunction "39") (pintype "passive") (solder_mask_margin 0.102))
    (pad "40" thru_hole circle (at -5.52 2.84 270) (size 1.408 1.408) (drill 0.9) (layers "*.Cu" "*.Mask")
      (net 30 "/SACI_RESP_N") (pinfunction "40") (pintype "passive") (solder_mask_margin 0.102))
    (pad "41" thru_hole circle (at -2.76 2.84 270) (size 1.408 1.408) (drill 0.9) (layers "*.Cu" "*.Mask")
      (net 1 "GNDD") (pinfunction "41") (pintype "passive") (solder_mask_margin 0.102))
    (pad "42" thru_hole circle (at 0 2.84 270) (size 1.408 1.408) (drill 0.9) (layers "*.Cu" "*.Mask")
      (net 1 "GNDD") (pinfunction "42") (pintype "passive") (solder_mask_margin 0.102))
    (pad "43" thru_hole circle (at 2.76 2.84 270) (size 1.408 1.408) (drill 0.9) (layers "*.Cu" "*.Mask")
      (net 19 "/ASIC_PULSE") (pinfunction "43") (pintype "passive") (solder_mask_margin 0.102))
    (pad "44" thru_hole circle (at 5.52 2.84 270) (size 1.408 1.408) (drill 0.9) (layers "*.Cu" "*.Mask")
      (net 31 "/SACI_CMD_N") (pinfunction "44") (pintype "passive") (solder_mask_margin 0.102))
    (pad "45" thru_hole circle (at 8.28 2.84 270) (size 1.408 1.408) (drill 0.9) (layers "*.Cu" "*.Mask")
      (net 1 "GNDD") (pinfunction "45") (pintype "passive") (solder_mask_margin 0.102))
    (pad "46" thru_hole circle (at 11.04 2.84 270) (size 1.408 1.408) (drill 0.9) (layers "*.Cu" "*.Mask")
      (net 32 "/SACI_CLK_N") (pinfunction "46") (pintype "passive") (solder_mask_margin 0.102))
    (pad "47" thru_hole circle (at 13.8 2.84 270) (size 1.408 1.408) (drill 0.9) (layers "*.Cu" "*.Mask")
      (net 1 "GNDD") (pinfunction "47") (pintype "passive") (solder_mask_margin 0.102))
    (pad "48" thru_hole circle (at 16.56 2.84 270) (size 1.408 1.408) (drill 0.9) (layers "*.Cu" "*.Mask")
      (net 20 "/ADC_MON_VCOM") (pinfunction "48") (pintype "passive") (solder_mask_margin 0.102))
    (pad "49" thru_hole circle (at 19.32 2.84 270) (size 1.408 1.408) (drill 0.9) (layers "*.Cu" "*.Mask")
      (net 33 "/ADC_MON_VIN_N") (pinfunction "49") (pintype "passive") (solder_mask_margin 0.102))
    (pad "50" thru_hole circle (at 22.08 2.84 270) (size 1.408 1.408) (drill 0.9) (layers "*.Cu" "*.Mask")
      (net 21 "/VDD1_Sense") (pinfunction "50") (pintype "passive") (solder_mask_margin 0.102))
    (pad "SH1" thru_hole circle (at -30.555 0 270) (size 4.216 4.216) (drill 3.2) (layers "*.Cu" "*.Mask")
      (net 22 "unconnected-(J1-SHIELD-PadSH1)") (pinfunction "SHIELD") (pintype "passive") (solder_mask_margin 0.102))
    (pad "SH2" thru_hole circle (at 30.555 0 270) (size 4.216 4.216) (drill 3.2) (layers "*.Cu" "*.Mask")
      (net 23 "unconnected-(J1-SHIELD__1-PadSH2)") (pinfunction "SHIELD__1") (pintype "passive") (solder_mask_margin 0.102))
  )
  (footprint "Custom footprints:CRYO fuzz button footprint mounting holes" (layer "B.Cu")
    (at 208.1022 66.6242)
    (property "Sheetfile" "fuzz button test board v2.kicad_sch")
    (property "Sheetname" "")
    (attr smd)
    (fp_text reference "U1" (at 0.2794 -12.4714 180 unlocked) (layer "B.SilkS"))
    (fp_text value "~" (at 0.03 -13.88 180 unlocked) (layer "B.Fab"))
    (fp_text user "1" (at -1.76 -2.74 180 unlocked) (layer "B.SilkS"))
    (fp_text user "50" (at 0.77 32.21 180 unlocked) (layer "B.SilkS"))
    (fp_text user "${REFERENCE}" (at 0.3302 -14.097 180 unlocked) (layer "B.Fab"))
    (pad "" np_thru_hole circle (at 0 -7.62) (size 3.2 3.2) (drill 2.9464) (layers "F&B.Cu" "*.Mask"))
    (pad "" np_thru_hole circle (at 0 38.1) (size 3.2 3.2) (drill 2.9464) (layers "F&B.Cu" "*.Mask"))
    (pad "1" smd circle (at -1.27 0) (size 0.75 0.75) (layers "B.Cu" "B.Paste" "B.Mask")
      (net 10 "/VDD2") (pinfunction "1") (pintype "passive"))
    (pad "2" smd circle (at -1.27 1.27) (size 0.75 0.75) (layers "B.Cu" "B.Paste" "B.Mask")
      (net 17 "/VDD2_Sense") (pinfunction "2") (pintype "passive"))
    (pad "3" smd circle (at -1.27 2.54) (size 0.75 0.75) (layers "B.Cu" "B.Paste" "B.Mask")
      (net 1 "GNDD") (pinfunction "3") (pintype "passive"))
    (pad "4" smd circle (at -1.27 3.81) (size 0.75 0.75) (layers "B.Cu" "B.Paste" "B.Mask")
      (net 16 "/ASIC_SampClkEn_P") (pinfunction "4") (pintype "passive"))
    (pad "5" smd circle (at -1.27 5.08) (size 0.75 0.75) (layers "B.Cu" "B.Paste" "B.Mask")
      (net 29 "/ASIC_SampClkEn_N") (pinfunction "5") (pintype "passive"))
    (pad "6" smd circle (at -1.27 6.35) (size 0.75 0.75) (layers "B.Cu" "B.Paste" "B.Mask")
      (net 1 "GNDD") (pinfunction "6") (pintype "passive"))
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