(kicad_pcb (version 20171130) (host pcbnew "(5.1.2-1)-1")
  (general
    (thickness 1.6)
    (drawings 201)
    (tracks 2296)
    (zones 0)
    (modules 257)
    (nets 208)
  )
  (page USLedger)
  (title_block
    (date 2019-12-29)
  )
  (layers
    (0 F.Cu signal)
    (31 B.Cu signal)
    (32 B.Adhes user hide)
    (33 F.Adhes user hide)
    (34 B.Paste user)
    (35 F.Paste user)
    (36 B.SilkS user)
    (37 F.SilkS user)
    (38 B.Mask user hide)
    (39 F.Mask user hide)
    (40 Dwgs.User user)
    (41 Cmts.User user)
    (42 Eco1.User user)
    (43 Eco2.User user)
    (44 Edge.Cuts user)
    (45 Margin user)
    (46 B.CrtYd user)
    (47 F.CrtYd user)
    (48 B.Fab user)
    (49 F.Fab user)
  )
  (setup
    (last_trace_width 0.2032)
    (trace_clearance 0.1778)
    (zone_clearance 0.2032)
    (zone_45_only no)
    (trace_min 0.1778)
    (via_size 0.6604)
    (via_drill 0.4064)
    (via_min_size 0.4064)
    (via_min_drill 0.3556)
    (uvia_size 0.3)
    (uvia_drill 0.1)
    (uvias_allowed no)
    (uvia_min_size 0.2)
    (uvia_min_drill 0.1)
    (edge_width 0.05)
    (segment_width 0.2)
    (pcb_text_width 0.3)
    (pcb_text_size 1.5 1.5)
    (mod_edge_width 0.12)
    (mod_text_size 0.5 0.5)
    (mod_text_width 0.07)
    (pad_size 2.2 2.2)
    (pad_drill 2.2)
    (pad_to_mask_clearance 0.0254)
    (solder_mask_min_width 0.0254)
    (aux_axis_origin 0 0)
    (visible_elements FEFDBF7F)
    (pcbplotparams
      (layerselection 0x010fc_ffffffff)
      (usegerberextensions false)
      (usegerberattributes false)
      (usegerberadvancedattributes false)
      (creategerberjobfile false)
      (excludeedgelayer true)
      (linewidth 0.100000)
      (plotframeref false)
      (viasonmask false)
      (mode 1)
      (useauxorigin false)
      (hpglpennumber 1)
      (hpglpenspeed 20)
      (hpglpendiameter 15.000000)
      (psnegative false)
      (psa4output false)
      (plotreference true)
      (plotvalue true)
      (plotinvisibletext false)
      (padsonsilk false)
      (subtractmaskfromsilk false)
      (outputformat 4)
      (mirror false)
      (drillshape 0)
      (scaleselection 1)
      (outputdirectory ""))
  )
  (net 0 "")
  (net 1 GND)
  (net 2 MISOSD)
  (net 3 +3V3)
  (net 4 PA12-MISO)
  (net 5 NET-MISO)
  (net 6 MOSISD)
  (net 7 SCKSD)
  (net 8 ~RESET~)
  (net 9 +3.3VA)
  (net 10 /3REG)
  (net 11 +3.3VP)
  (net 12 GNDA)
  (net 13 "Net-(CN22-Pad2)")
  (net 14 "Net-(CNQ1-Pad1)")
  (net 15 "Net-(CNQ2-Pad1)")
  (net 16 "Net-(CNRD1-Pad1)")
  (net 17 GNDPWR)
  (net 18 "Net-(CNRX+1-Pad1)")
  (net 19 "Net-(CNRX+1-Pad2)")
  (net 20 "Net-(CNRX-1-Pad1)")
  (net 21 "Net-(CNRX-1-Pad2)")
  (net 22 "Net-(CNTCT1-Pad2)")
  (net 23 "Net-(CPCC1-Pad2)")
  (net 24 "Net-(CPCC1-Pad1)")
  (net 25 /PV3)
  (net 26 "Net-(CPFIL1-Pad1)")
  (net 27 GNDREF)
  (net 28 /VPORTP)
  (net 29 /VPORTN)
  (net 30 /PVCC)
  (net 31 /RUN)
  (net 32 "Net-(H1-Pad1)")
  (net 33 "Net-(H2-Pad1)")
  (net 34 "Net-(H3-Pad1)")
  (net 35 "Net-(H4-Pad1)")
  (net 36 /NN)
  (net 37 /PP)
  (net 38 /PLUS)
  (net 39 "Net-(L_DEF1-Pad1)")
  (net 40 "Net-(L_PWR1-Pad1)")
  (net 41 "Net-(L_SD1-Pad1)")
  (net 42 /NGATE)
  (net 43 /RCLASS)
  (net 44 /SENSE)
  (net 45 NETRST)
  (net 46 "Net-(RN1-Pad1)")
  (net 47 "Net-(RN2-Pad1)")
  (net 48 "Net-(RN3-Pad1)")
  (net 49 "Net-(RN4-Pad1)")
  (net 50 "Net-(RN5-Pad1)")
  (net 51 "Net-(RNEXR1-Pad2)")
  (net 52 "Net-(RNLACT1-Pad2)")
  (net 53 "Net-(RNLDUP1-Pad2)")
  (net 54 "Net-(RNLNK1-Pad2)")
  (net 55 "Net-(RNLSPEED1-Pad2)")
  (net 56 "Net-(RNSPD1-Pad1)")
  (net 57 /SEN)
  (net 58 PB11-SCK)
  (net 59 PB10-MOSI)
  (net 60 "Net-(CTSW1-Pad2)")
  (net 61 "Net-(CTSW1-Pad1)")
  (net 62 "Net-(CUFG1-Pad1)")
  (net 63 "Net-(RNDMPR-1-Pad2)")
  (net 64 "Net-(RNDMPT-1-Pad2)")
  (net 65 "Net-(PA1133-coil1-Pad4)")
  (net 66 "Net-(PA1133-coil1-Pad2)")
  (net 67 "Net-(PA1133-coil1-Pad1)")
  (net 68 PA23-SCL)
  (net 69 PA22-SDA)
  (net 70 "Net-(PS2911-Pad1)")
  (net 71 TFT-MISO)
  (net 72 "Net-(BUZZER1-Pad2)")
  (net 73 /FB)
  (net 74 "Net-(FUSE1-Pad2)")
  (net 75 "Net-(RNAUTO1-Pad1)")
  (net 76 "Net-(RNDUP1-Pad1)")
  (net 77 "Net-(RNINT1-Pad1)")
  (net 78 "Net-(J_USB1-Pad4)")
  (net 79 "Net-(CV1-Pad1)")
  (net 80 "Net-(J_RJ45-Pad14)")
  (net 81 "Net-(J_RJ45-Pad5)")
  (net 82 "Net-(J_RJ45-Pad6)")
  (net 83 "Net-(J_RJ45-Pad12)")
  (net 84 "Net-(JP_SWD1-Pad10)")
  (net 85 "Net-(JP_SWD1-Pad9)")
  (net 86 "Net-(JP_SWD1-Pad8)")
  (net 87 "Net-(JP_SWD1-Pad7)")
  (net 88 "Net-(JP_SWD1-Pad6)")
  (net 89 "Net-(U_DS3231-Pad4)")
  (net 90 "Net-(U_DS3231-Pad1)")
  (net 91 "Net-(U_LTC4267-1-Pad11)")
  (net 92 "Net-(U_LTC4267-1-Pad6)")
  (net 93 "Net-(U_W5500-Pad47)")
  (net 94 "Net-(U_W5500-Pad46)")
  (net 95 "Net-(U_W5500-Pad18)")
  (net 96 "Net-(U_W5500-Pad13)")
  (net 97 "Net-(U_W5500-Pad12)")
  (net 98 "Net-(U_W5500-Pad7)")
  (net 99 "Net-(CQ1-Pad1)")
  (net 100 "Net-(CQ2-Pad2)")
  (net 101 "Net-(CTI1-Pad2)")
  (net 102 "Net-(RCLK1-Pad1)")
  (net 103 "Net-(RTREN1-Pad2)")
  (net 104 "Net-(CVDD1-Pad2)")
  (net 105 "Net-(CN20-Pad2)")
  (net 106 "Net-(RN6-Pad2)")
  (net 107 "Net-(RNDMPR+1-Pad2)")
  (net 108 "Net-(RNDMPT+1-Pad2)")
  (net 109 "Net-(L_NDUP1-Pad1)")
  (net 110 "Net-(L_NSPD1-Pad1)")
  (net 111 "Net-(L_PLED1-Pad2)")
  (net 112 "Net-(L_RX1-Pad1)")
  (net 113 "Net-(L_TX1-Pad1)")
  (net 114 "Net-(RID1-Pad2)")
  (net 115 "Net-(RID2-Pad1)")
  (net 116 "Net-(D_PBAS1-Pad1)")
  (net 117 "Net-(D_PDS1040-Pad2)")
  (net 118 "Net-(L_PLED1-Pad1)")
  (net 119 "Net-(Battery-Cell1-Pad1)")
  (net 120 "Net-(RLED1-Pad1)")
  (net 121 +3V0)
  (net 122 "Net-(L_PWR1-Pad2)")
  (net 123 "Net-(RVBUZ2-Pad1)")
  (net 124 "Net-(RVBUZ2-Pad2)")
  (net 125 ADSGD)
  (net 126 ADSVV)
  (net 127 AIN1)
  (net 128 AIN2)
  (net 129 AIN3)
  (net 130 "Net-(MPOE1-Pad1)")
  (net 131 "Net-(MPOE2-Pad1)")
  (net 132 "Net-(RBUZV1-Pad2)")
  (net 133 "Net-(RADALR1-Pad2)")
  (net 134 PWR_JACK)
  (net 135 PWR_USB)
  (net 136 PWR_BAT)
  (net 137 "Net-(RRX1-Pad1)")
  (net 138 GP0)
  (net 139 GP7)
  (net 140 GP6)
  (net 141 GP5)
  (net 142 GP4)
  (net 143 GP1)
  (net 144 GP2)
  (net 145 GP3)
  (net 146 "Net-(U_MCP23008-Pad7)")
  (net 147 "Net-(U_MCP23008-Pad10)")
  (net 148 "Net-(U_MCP23008-Pad11)")
  (net 149 "Net-(L_NEO_PIXEL1-Pad2)")
  (net 150 "Net-(L_NEO_PIXEL1-Pad4)")
  (net 151 "Net-(JP_PCELL1-Pad1)")
  (net 152 "Net-(JP_TMP36-Pad2)")
  (net 153 "Net-(RADDR1-Pad2)")
  (net 154 ANI0-TMP36)
  (net 155 FLCS)
  (net 156 FLSCK)
  (net 157 FLMOSI)
  (net 158 FLMISO)
  (net 159 "Net-(SP_N_HARDRESET_1-Pad2)")
  (net 160 "Net-(SP_N_SOFTRESET_1-Pad2)")
  (net 161 MCP47-V1)
  (net 162 MCP47-V0)
  (net 163 MCP47-A0)
  (net 164 MCP47-A1)
  (net 165 "Net-(RMCP23A0-Pad1)")
  (net 166 "Net-(SP_MCP_INT7-Pad2)")
  (net 167 "Net-(JP_RA8875-Pad4)")
  (net 168 "Net-(JP_RA8875-Pad3)")
  (net 169 PA03-D42-AREF)
  (net 170 PA05-D18-A4-SDINT)
  (net 171 PA14-D2-SDCS)
  (net 172 PA25-D29-USBD+)
  (net 173 PA24-D28-USBD-)
  (net 174 PA08-D4-NMI)
  (net 175 PA09-D3-NETINT)
  (net 176 PA18-D10-RX2-TFT)
  (net 177 PA16-D11-TX2-TFT)
  (net 178 PA10-D1-TX1)
  (net 179 PA11-D0-RX1)
  (net 180 PA02-D14-A0)
  (net 181 PA20-D6-TFT_CS)
  (net 182 PA21-D7-TFT_RESET)
  (net 183 PA19-D12-TFT_INT3)
  (net 184 PA30-D44-SWDCLK)
  (net 185 PA31-D45-SWDIO)
  (net 186 PA04-D17-A3-BUZ)
  (net 187 PA15-D5-NETCS)
  (net 188 PA06-D8-NETRES)
  (net 189 PA17-D13-DEFLED)
  (net 190 PA27-D26-LTX)
  (net 191 PA13-D38-FLCS)
  (net 192 PB23-D31-FLSCLK)
  (net 193 PB22-D30-FLSI)
  (net 194 PB03-D25-LRX-FLSO)
  (net 195 PA28-D27-USBENA)
  (net 196 PB02-D19-A5-PC)
  (net 197 PB09-D16-A2-TFT_WAIT)
  (net 198 "Net-(JP_PMONITOR1-Pad1)")
  (net 199 "Net-(J_Micro_SD1-Pad1)")
  (net 200 "Net-(J_Micro_SD1-Pad8)")
  (net 201 PB08-D15-A1-RTCINT-TFT)
  (net 202 PA07-D9-I2S-MCPINT-TFT)
  (net 203 TFT-WAIT)
  (net 204 TFT-12)
  (net 205 TFT-13)
  (net 206 TFT-14)
  (net 207 TFT-15)
  (net_class Default "This is the default net class."
    (clearance 0.1778)
    (trace_width 0.2032)
    (via_dia 0.6604)
    (via_drill 0.4064)
    (uvia_dia 0.3)
    (uvia_drill 0.1)
    (diff_pair_width 0.2032)
    (diff_pair_gap 0.25)
    (add_net +3.3VA)
    (add_net +3.3VP)
    (add_net +3V0)
    (add_net +3V3)
    (add_net /3REG)
    (add_net /FB)
    (add_net /NGATE)
    (add_net /NN)
    (add_net /PLUS)
    (add_net /PP)
    (add_net /PV3)
    (add_net /PVCC)
    (add_net /RCLASS)
    (add_net /RUN)
    (add_net /SEN)
    (add_net /SENSE)
    (add_net /VPORTN)
    (add_net /VPORTP)
    (add_net ADSGD)
    (add_net ADSVV)
    (add_net AIN1)
    (add_net AIN2)
    (add_net AIN3)
    (add_net ANI0-TMP36)
    (add_net FLCS)
    (add_net FLMISO)
    (add_net FLMOSI)
    (add_net FLSCK)
    (add_net GND)
    (add_net GNDA)
    (add_net GNDPWR)
    (add_net GNDREF)
    (add_net GP0)
    (add_net GP1)
    (add_net GP2)
    (add_net GP3)
    (add_net GP4)
    (add_net GP5)
    (add_net GP6)
    (add_net GP7)
    (add_net MCP47-A0)
    (add_net MCP47-A1)
    (add_net MCP47-V0)
    (add_net MCP47-V1)
    (add_net MISOSD)
    (add_net MOSISD)
    (add_net NET-MISO)
    (add_net NETRST)
    (add_net "Net-(BUZZER1-Pad2)")
    (add_net "Net-(Battery-Cell1-Pad1)")
    (add_net "Net-(CN20-Pad2)")
    (add_net "Net-(CN22-Pad2)")
    (add_net "Net-(CNQ1-Pad1)")
    (add_net "Net-(CNQ2-Pad1)")
    (add_net "Net-(CNRD1-Pad1)")
    (add_net "Net-(CNRX+1-Pad1)")
    (add_net "Net-(CNRX+1-Pad2)")
    (add_net "Net-(CNRX-1-Pad1)")
    (add_net "Net-(CNRX-1-Pad2)")
    (add_net "Net-(CNTCT1-Pad2)")
    (add_net "Net-(CPCC1-Pad1)")
    (add_net "Net-(CPCC1-Pad2)")
    (add_net "Net-(CPFIL1-Pad1)")
    (add_net "Net-(CQ1-Pad1)")
    (add_net "Net-(CQ2-Pad2)")
    (add_net "Net-(CTI1-Pad2)")
    (add_net "Net-(CTSW1-Pad1)")
    (add_net "Net-(CTSW1-Pad2)")
    (add_net "Net-(CUFG1-Pad1)")
    (add_net "Net-(CV1-Pad1)")
    (add_net "Net-(CVDD1-Pad2)")
    (add_net "Net-(D_PBAS1-Pad1)")
    (add_net "Net-(D_PDS1040-Pad2)")
    (add_net "Net-(FUSE1-Pad2)")
    (add_net "Net-(H1-Pad1)")
    (add_net "Net-(H2-Pad1)")
    (add_net "Net-(H3-Pad1)")
    (add_net "Net-(H4-Pad1)")
    (add_net "Net-(JP_PCELL1-Pad1)")
    (add_net "Net-(JP_PMONITOR1-Pad1)")
    (add_net "Net-(JP_RA8875-Pad3)")
    (add_net "Net-(JP_RA8875-Pad4)")
    (add_net "Net-(JP_SWD1-Pad10)")
    (add_net "Net-(JP_SWD1-Pad6)")
    (add_net "Net-(JP_SWD1-Pad7)")
    (add_net "Net-(JP_SWD1-Pad8)")
    (add_net "Net-(JP_SWD1-Pad9)")
    (add_net "Net-(JP_TMP36-Pad2)")
    (add_net "Net-(J_Micro_SD1-Pad1)")
    (add_net "Net-(J_Micro_SD1-Pad8)")
    (add_net "Net-(J_RJ45-Pad12)")
    (add_net "Net-(J_RJ45-Pad14)")
    (add_net "Net-(J_RJ45-Pad5)")
    (add_net "Net-(J_RJ45-Pad6)")
    (add_net "Net-(J_USB1-Pad4)")
    (add_net "Net-(L_DEF1-Pad1)")
    (add_net "Net-(L_NDUP1-Pad1)")
    (add_net "Net-(L_NEO_PIXEL1-Pad2)")
    (add_net "Net-(L_NEO_PIXEL1-Pad4)")
    (add_net "Net-(L_NSPD1-Pad1)")
    (add_net "Net-(L_PLED1-Pad1)")
    (add_net "Net-(L_PLED1-Pad2)")
    (add_net "Net-(L_PWR1-Pad1)")
    (add_net "Net-(L_PWR1-Pad2)")
    (add_net "Net-(L_RX1-Pad1)")
    (add_net "Net-(L_SD1-Pad1)")
    (add_net "Net-(L_TX1-Pad1)")
    (add_net "Net-(MPOE1-Pad1)")
    (add_net "Net-(MPOE2-Pad1)")
    (add_net "Net-(PA1133-coil1-Pad1)")
    (add_net "Net-(PA1133-coil1-Pad2)")
    (add_net "Net-(PA1133-coil1-Pad4)")
    (add_net "Net-(PS2911-Pad1)")
    (add_net "Net-(RADALR1-Pad2)")
    (add_net "Net-(RADDR1-Pad2)")
    (add_net "Net-(RBUZV1-Pad2)")
    (add_net "Net-(RCLK1-Pad1)")
    (add_net "Net-(RID1-Pad2)")
    (add_net "Net-(RID2-Pad1)")
    (add_net "Net-(RLED1-Pad1)")
    (add_net "Net-(RMCP23A0-Pad1)")
    (add_net "Net-(RN1-Pad1)")
    (add_net "Net-(RN2-Pad1)")
    (add_net "Net-(RN3-Pad1)")
    (add_net "Net-(RN4-Pad1)")
    (add_net "Net-(RN5-Pad1)")
    (add_net "Net-(RN6-Pad2)")
    (add_net "Net-(RNAUTO1-Pad1)")
    (add_net "Net-(RNDMPR+1-Pad2)")
    (add_net "Net-(RNDMPR-1-Pad2)")
    (add_net "Net-(RNDMPT+1-Pad2)")
    (add_net "Net-(RNDMPT-1-Pad2)")
    (add_net "Net-(RNDUP1-Pad1)")
    (add_net "Net-(RNEXR1-Pad2)")
    (add_net "Net-(RNINT1-Pad1)")
    (add_net "Net-(RNLACT1-Pad2)")
    (add_net "Net-(RNLDUP1-Pad2)")
    (add_net "Net-(RNLNK1-Pad2)")
    (add_net "Net-(RNLSPEED1-Pad2)")
    (add_net "Net-(RNSPD1-Pad1)")
    (add_net "Net-(RRX1-Pad1)")
    (add_net "Net-(RTREN1-Pad2)")
    (add_net "Net-(RVBUZ2-Pad1)")
    (add_net "Net-(RVBUZ2-Pad2)")
    (add_net "Net-(SP_MCP_INT7-Pad2)")
    (add_net "Net-(SP_N_HARDRESET_1-Pad2)")
    (add_net "Net-(SP_N_SOFTRESET_1-Pad2)")
    (add_net "Net-(U_DS3231-Pad1)")
    (add_net "Net-(U_DS3231-Pad4)")
    (add_net "Net-(U_LTC4267-1-Pad11)")
    (add_net "Net-(U_LTC4267-1-Pad6)")
    (add_net "Net-(U_MCP23008-Pad10)")
    (add_net "Net-(U_MCP23008-Pad11)")
    (add_net "Net-(U_MCP23008-Pad7)")
    (add_net "Net-(U_W5500-Pad12)")
    (add_net "Net-(U_W5500-Pad13)")
    (add_net "Net-(U_W5500-Pad18)")
    (add_net "Net-(U_W5500-Pad46)")
    (add_net "Net-(U_W5500-Pad47)")
    (add_net "Net-(U_W5500-Pad7)")
    (add_net PA02-D14-A0)
    (add_net PA03-D42-AREF)
    (add_net PA04-D17-A3-BUZ)
    (add_net PA05-D18-A4-SDINT)
    (add_net PA06-D8-NETRES)
    (add_net PA07-D9-I2S-MCPINT-TFT)
    (add_net PA08-D4-NMI)
    (add_net PA09-D3-NETINT)
    (add_net PA10-D1-TX1)
    (add_net PA11-D0-RX1)
    (add_net PA12-MISO)
    (add_net PA13-D38-FLCS)
    (add_net PA14-D2-SDCS)
    (add_net PA15-D5-NETCS)
    (add_net PA16-D11-TX2-TFT)
    (add_net PA17-D13-DEFLED)
    (add_net PA18-D10-RX2-TFT)
    (add_net PA19-D12-TFT_INT3)
    (add_net PA20-D6-TFT_CS)
    (add_net PA21-D7-TFT_RESET)
    (add_net PA22-SDA)
    (add_net PA23-SCL)
    (add_net PA24-D28-USBD-)
    (add_net PA25-D29-USBD+)
    (add_net PA27-D26-LTX)
    (add_net PA28-D27-USBENA)
    (add_net PA30-D44-SWDCLK)
    (add_net PA31-D45-SWDIO)
    (add_net PB02-D19-A5-PC)
    (add_net PB03-D25-LRX-FLSO)
    (add_net PB08-D15-A1-RTCINT-TFT)
    (add_net PB09-D16-A2-TFT_WAIT)
    (add_net PB10-MOSI)
    (add_net PB11-SCK)
    (add_net PB22-D30-FLSI)
    (add_net PB23-D31-FLSCLK)
    (add_net PWR_BAT)
    (add_net PWR_JACK)
    (add_net PWR_USB)
    (add_net SCKSD)
    (add_net TFT-12)
    (add_net TFT-13)
    (add_net TFT-14)
    (add_net TFT-15)
    (add_net TFT-MISO)
    (add_net TFT-WAIT)
    (add_net ~RESET~)
  )
  (module Jumper:SolderJumper-2_P1.3mm_Open_Pad1.0x1.5mm (layer B.Cu) (tedit 5DC4ACA6)
    (at 30.56128 43.42638)
    (descr "SMD Solder Jumper, 1x1.5mm Pads, 0.3mm gap, open")
    (tags "solder jumper open")
    (attr virtual)
    (fp_text reference SP_RTC_INT8 (at 0.11684 -1.51892) (layer B.SilkS))
    (fp_text value S_RTCINT (at 0 -1.5 180) (layer B.Fab) hide)
    (pad 1 smd rect (at -0.65 0) (size 1 1.5) (layers B.Cu B.Mask)
      (net 102 "Net-(RCLK1-Pad1)"))
    (pad 2 smd rect (at 0.65 0) (size 1 1.5) (layers B.Cu B.Mask)
      (net 201 PB08-D15-A1-RTCINT-TFT))
  )
  (module MountingHole:MountingHole_2.2mm_M2 locked (layer F.Cu) (tedit 5E8630A0)
    (at 57.15 43.307)
    (descr "Mounting Hole 2.2mm, no annular, M2")
    (tags "mounting hole 2.2mm no annular m2")
    (attr virtual)
    (fp_text reference HRA8875-1 (at 0.28702 -1.99644) (layer F.SilkS) hide)
    (fp_text value MountingHole (at -0.22606 1.9812) (layer F.Fab) hide)
    (fp_text user %R (at 2.8321 1.19634) (layer F.Fab) hide)
    (pad 1 np_thru_hole circle (at 0 0) (size 2.2 2.2) (drill 2.2) (layers *.Cu *.Mask))
  )
  (module MountingHole:MountingHole_2.2mm_M2 locked (layer F.Cu) (tedit 5E8630A0)
    (at 13.97 43.307)
    (descr "Mounting Hole 2.2mm, no annular, M2")
    (tags "mounting hole 2.2mm no annular m2")
    (attr virtual)
    (fp_text reference HRA8875-2 (at 0.28702 -1.99644) (layer F.SilkS) hide)
    (fp_text value MountingHole (at -0.22606 1.9812) (layer F.Fab) hide)
    (fp_text user %R (at 2.8321 1.19634) (layer F.Fab) hide)
    (pad 1 np_thru_hole circle (at 0 0) (size 2.2 2.2) (drill 2.2) (layers *.Cu *.Mask))
  )
  (module MountingHole:MountingHole_2.2mm_M2 locked (layer F.Cu) (tedit 5E8630A0)
    (at 57.15 78.867)
    (descr "Mounting Hole 2.2mm, no annular, M2")
    (tags "mounting hole 2.2mm no annular m2")
    (attr virtual)
    (fp_text reference HRA8875-3 (at 0.28702 -1.99644) (layer F.SilkS) hide)
    (fp_text value MountingHole (at -0.22606 1.9812) (layer F.Fab) hide)
    (fp_text user %R (at 2.8321 1.19634) (layer F.Fab) hide)
    (pad 1 np_thru_hole circle (at 0 0) (size 2.2 2.2) (drill 2.2) (layers *.Cu *.Mask))
  )
  (module MountingHole:MountingHole_2.2mm_M2 locked (layer F.Cu) (tedit 5E8630A0)
    (at 13.97 78.867)
    (descr "Mounting Hole 2.2mm, no annular, M2")
    (tags "mounting hole 2.2mm no annular m2")
    (attr virtual)
    (fp_text reference HRA8875-4 (at 0.28702 -1.99644) (layer F.SilkS) hide)
    (fp_text value MountingHole (at -0.22606 1.9812) (layer F.Fab) hide)
    (fp_text user %R (at 2.8321 1.19634) (layer F.Fab) hide)
    (pad 1 np_thru_hole circle (at 0 0) (size 2.2 2.2) (drill 2.2) (layers *.Cu *.Mask))
  )
  (module Diode_SMD:D_Powermite2_AK (layer F.Cu) (tedit 5E855548)
    (at 132.77088 74.24674 90)
    (descr "Microsemi Powermite 2 SMD power package (https://www.microsemi.com/packaging-information/partpackage/details?pid=5341)")
    (tags PowerMite2)
    (attr smd)
    (fp_text reference D_PDS1040 (at -4.4196 -0.0889) (layer F.SilkS))
    (fp_text value PDS1040-13 (at 0.4572 3.0988 90) (layer F.Fab) hide)
    (fp_text user %R (at -0.3 -1 90) (layer F.Fab) hide)
    (pad 1 smd rect (at -0.9144 0 90) (size 5.08 4.700001) (layers F.Cu F.Paste F.Mask)
      (net 25 /PV3))
    (pad 2 smd rect (at 3.0988 0 90) (size 1.016 3.556) (layers F.Cu F.Paste F.Mask)
      (net 117 "Net-(D_PDS1040-Pad2)"))
    (model ${KISYS3DMOD}/Diode_SMD.3dshapes/D_Powermite2_AK.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Diode_SMD:D_SMA (layer F.Cu) (tedit 5E855250)
    (at 125.57252 34.8234 180)
    (descr "Diode SMA (DO-214AC)")
    (tags "Diode SMA (DO-214AC)")
    (attr smd)
    (fp_text reference D_SMAJ58A1 (at -0.20066 -2.24028 180) (layer F.SilkS))
    (fp_text value SMAJ58A-13-F (at 0 2.6) (layer F.Fab) hide)
    (fp_text user %R (at 0 -2.5) (layer F.Fab) hide)
    (pad 2 smd rect (at 2 0 180) (size 2.5 1.8) (layers F.Cu F.Paste F.Mask)
      (net 29 /VPORTN))
    (pad 1 smd rect (at -2 0 180) (size 2.5 1.8) (layers F.Cu F.Paste F.Mask)
      (net 38 /PLUS))
    (model ${KISYS3DMOD}/Diode_SMD.3dshapes/D_SMA.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Package_TO_SOT_SMD:SOT-23_Handsoldering (layer F.Cu) (tedit 5E730EBD)
    (at 121.98858 68.0339 270)
    (descr "SOT-23, Handsoldering")
    (tags SOT-23)
    (attr smd)
    (fp_text reference U_TLV431 (at -0.0762 2.17932 90) (layer F.SilkS))
    (fp_text value TLV431 (at 0.04318 2.19456 90) (layer F.Fab) hide)
    (fp_text user %R (at 0 0) (layer F.Fab) hide)
    (pad 3 smd rect (at 1.5 0 270) (size 1.9 0.8) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 2 smd rect (at -1.5 0.95 270) (size 1.9 0.8) (layers F.Cu F.Paste F.Mask)
      (net 24 "Net-(CPCC1-Pad1)"))
    (pad 1 smd rect (at -1.5 -0.95 270) (size 1.9 0.8) (layers F.Cu F.Paste F.Mask)
      (net 23 "Net-(CPCC1-Pad2)"))
    (model ${KISYS3DMOD}/Package_TO_SOT_SMD.3dshapes/SOT-23.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Package_SO:TSOP-6_1.65x3.05mm_P0.95mm (layer F.Cu) (tedit 5E730C87)
    (at 128.41478 53.67782 180)
    (descr "TSOP-6 package (comparable to TSOT-23), https://www.vishay.com/docs/71200/71200.pdf")
    (tags "Jedec MO-193C TSOP-6L")
    (attr smd)
    (fp_text reference U_Si3440 (at 0.16002 -2.35712) (layer F.SilkS))
    (fp_text value Si3440 (at 0 2.5) (layer F.Fab) hide)
    (pad 6 smd rect (at 1.27 -0.95 180) (size 1.651 0.508) (layers F.Cu F.Paste F.Mask)
      (net 65 "Net-(PA1133-coil1-Pad4)"))
    (pad 5 smd rect (at 1.27 0 180) (size 1.651 0.508) (layers F.Cu F.Paste F.Mask)
      (net 65 "Net-(PA1133-coil1-Pad4)"))
    (pad 4 smd rect (at 1.27 0.95 180) (size 1.651 0.508) (layers F.Cu F.Paste F.Mask)
      (net 57 /SEN))
    (pad 3 smd rect (at -1.27 0.95 180) (size 1.651 0.508) (layers F.Cu F.Paste F.Mask)
      (net 42 /NGATE))
    (pad 2 smd rect (at -1.27 0 180) (size 1.651 0.508) (layers F.Cu F.Paste F.Mask)
      (net 65 "Net-(PA1133-coil1-Pad4)"))
    (pad 1 smd rect (at -1.27 -0.95 180) (size 1.651 0.508) (layers F.Cu F.Paste F.Mask)
      (net 65 "Net-(PA1133-coil1-Pad4)"))
    (model ${KISYS3DMOD}/Package_SO.3dshapes/TSOP-6_1.65x3.05mm_P0.95mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Package_SO:TSSOP-16_4.4x5mm_P0.65mm (layer F.Cu) (tedit 5E23F423)
    (at 126.81966 45.57776 90)
    (descr "16-Lead Plastic Thin Shrink Small Outline (ST)-4.4 mm Body [TSSOP] (see Microchip Packaging Specification 00000049BS.pdf)")
    (tags "SSOP 0.65")
    (attr smd)
    (fp_text reference U_LTC4267-1 (at -5.08254 0.01778) (layer F.SilkS))
    (fp_text value LTC4267IGN-1#PBF (at 1.2192 3.3782 90) (layer F.Fab) hide)
    (pad 16 smd rect (at 2.95 -2.2225 90) (size 1.5 0.4191) (layers F.Cu F.Paste F.Mask)
      (net 27 GNDREF))
    (pad 15 smd rect (at 2.95 -1.5875 90) (size 1.5 0.4191) (layers F.Cu F.Paste F.Mask)
      (net 27 GNDREF))
    (pad 14 smd rect (at 2.95 -0.9525 90) (size 1.5 0.4191) (layers F.Cu F.Paste F.Mask)
      (net 44 /SENSE))
    (pad 13 smd rect (at 2.95 -0.3175 90) (size 1.5 0.4191) (layers F.Cu F.Paste F.Mask)
      (net 28 /VPORTP))
    (pad 12 smd rect (at 2.95 0.3175 90) (size 1.5 0.4191) (layers F.Cu F.Paste F.Mask)
      (net 29 /VPORTN))
    (pad 11 smd rect (at 2.95 0.9525 90) (size 1.5 0.4191) (layers F.Cu F.Paste F.Mask)
      (net 91 "Net-(U_LTC4267-1-Pad11)"))
    (pad 10 smd rect (at 2.95 1.5875 90) (size 1.5 0.4191) (layers F.Cu F.Paste F.Mask)
      (net 27 GNDREF))
    (pad 9 smd rect (at 2.95 2.2225 90) (size 1.5 0.4191) (layers F.Cu F.Paste F.Mask)
      (net 27 GNDREF))
    (pad 8 smd rect (at -2.95 2.2225 90) (size 1.5 0.4191) (layers F.Cu F.Paste F.Mask)
      (net 27 GNDREF))
    (pad 7 smd rect (at -2.95 1.5875 90) (size 1.5 0.4191) (layers F.Cu F.Paste F.Mask)
      (net 29 /VPORTN))
    (pad 6 smd rect (at -2.95 0.9525 90) (size 1.5 0.4191) (layers F.Cu F.Paste F.Mask)
      (net 92 "Net-(U_LTC4267-1-Pad6)"))
    (pad 5 smd rect (at -2.95 0.3175 90) (size 1.5 0.4191) (layers F.Cu F.Paste F.Mask)
      (net 43 /RCLASS))
    (pad 4 smd rect (at -2.95 -0.3175 90) (size 1.5 0.4191) (layers F.Cu F.Paste F.Mask)
      (net 30 /PVCC))
    (pad 3 smd rect (at -2.95 -0.9525 90) (size 1.5 0.4191) (layers F.Cu F.Paste F.Mask)
      (net 42 /NGATE))
    (pad 2 smd rect (at -2.95 -1.5875 90) (size 1.5 0.4191) (layers F.Cu F.Paste F.Mask)
      (net 31 /RUN))
    (pad 1 smd rect (at -2.95 -2.2225 90) (size 1.5 0.4191) (layers F.Cu F.Paste F.Mask)
      (net 27 GNDREF))
    (model ${KISYS3DMOD}/Package_SO.3dshapes/TSSOP-16_4.4x5mm_P0.65mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Package_SO:SSOP-20_5.3x7.2mm_P0.65mm (layer F.Cu) (tedit 5E646F3A)
    (at 77.95006 45.00118 90)
    (descr "20-Lead Plastic Shrink Small Outline (SS)-5.30 mm Body [SSOP] (see Microchip Packaging Specification 00000049BS.pdf)")
    (tags "SSOP 0.65")
    (attr smd)
    (fp_text reference U_MCP23008 (at -0.46482 -4.67106 90) (layer F.SilkS))
    (fp_text value MCP23008 (at 0 4.75 90) (layer F.Fab) hide)
    (fp_text user %R (at 0 0 90) (layer F.Fab) hide)
    (pad 20 smd rect (at 3.6 -2.925 90) (size 1.75 0.42) (layers F.Cu F.Paste F.Mask)
      (net 3 +3V3))
    (pad 19 smd rect (at 3.6 -2.275 90) (size 1.75 0.42) (layers F.Cu F.Paste F.Mask)
      (net 139 GP7))
    (pad 18 smd rect (at 3.6 -1.625 90) (size 1.75 0.42) (layers F.Cu F.Paste F.Mask)
      (net 140 GP6))
    (pad 17 smd rect (at 3.6 -0.975 90) (size 1.75 0.42) (layers F.Cu F.Paste F.Mask)
      (net 141 GP5))
    (pad 16 smd rect (at 3.6 -0.325 90) (size 1.75 0.42) (layers F.Cu F.Paste F.Mask)
      (net 142 GP4))
    (pad 15 smd rect (at 3.6 0.325 90) (size 1.75 0.42) (layers F.Cu F.Paste F.Mask)
      (net 145 GP3))
    (pad 14 smd rect (at 3.6 0.975 90) (size 1.75 0.42) (layers F.Cu F.Paste F.Mask)
      (net 144 GP2))
    (pad 13 smd rect (at 3.6 1.625 90) (size 1.75 0.42) (layers F.Cu F.Paste F.Mask)
      (net 143 GP1))
    (pad 12 smd rect (at 3.6 2.275 90) (size 1.75 0.42) (layers F.Cu F.Paste F.Mask)
      (net 138 GP0))
    (pad 11 smd rect (at 3.6 2.925 90) (size 1.75 0.42) (layers F.Cu F.Paste F.Mask)
      (net 148 "Net-(U_MCP23008-Pad11)"))
    (pad 10 smd rect (at -3.6 2.925 90) (size 1.75 0.42) (layers F.Cu F.Paste F.Mask)
      (net 147 "Net-(U_MCP23008-Pad10)"))
    (pad 9 smd rect (at -3.6 2.275 90) (size 1.75 0.42) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 8 smd rect (at -3.6 1.625 90) (size 1.75 0.42) (layers F.Cu F.Paste F.Mask)
      (net 166 "Net-(SP_MCP_INT7-Pad2)"))
    (pad 7 smd rect (at -3.6 0.975 90) (size 1.75 0.42) (layers F.Cu F.Paste F.Mask)
      (net 146 "Net-(U_MCP23008-Pad7)"))
    (pad 6 smd rect (at -3.6 0.325 90) (size 1.75 0.42) (layers F.Cu F.Paste F.Mask)
      (net 8 ~RESET~))
    (pad 5 smd rect (at -3.6 -0.325 90) (size 1.75 0.42) (layers F.Cu F.Paste F.Mask)
      (net 165 "Net-(RMCP23A0-Pad1)"))
    (pad 4 smd rect (at -3.6 -0.975 90) (size 1.75 0.42) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 3 smd rect (at -3.6 -1.625 90) (size 1.75 0.42) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 2 smd rect (at -3.6 -2.275 90) (size 1.75 0.42) (layers F.Cu F.Paste F.Mask)
      (net 69 PA22-SDA))
    (pad 1 smd rect (at -3.6 -2.925 90) (size 1.75 0.42) (layers F.Cu F.Paste F.Mask)
      (net 68 PA23-SCL))
    (model ${KISYS3DMOD}/Package_SO.3dshapes/SSOP-20_5.3x7.2mm_P0.65mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Package_TO_SOT_SMD:SOT-23-6_Handsoldering (layer F.Cu) (tedit 5E646E8D)
    (at 22.41296 23.39212 270)
    (descr "6-pin SOT-23 package, Handsoldering")
    (tags "SOT-23-6 Handsoldering")
    (attr smd)
    (fp_text reference U_RT6222 (at -2.98322 0.1016 180) (layer F.SilkS))
    (fp_text value RT6222C-1 (at -0.0762 2.0447 90) (layer F.Fab) hide)
    (pad 5 smd rect (at 1.35 0 270) (size 1.56 0.6) (layers F.Cu F.Paste F.Mask)
      (net 101 "Net-(CTI1-Pad2)"))
    (pad 6 smd rect (at 1.35 -0.95 270) (size 1.56 0.6) (layers F.Cu F.Paste F.Mask)
      (net 60 "Net-(CTSW1-Pad2)"))
    (pad 4 smd rect (at 1.35 0.95 270) (size 1.56 0.6) (layers F.Cu F.Paste F.Mask)
      (net 103 "Net-(RTREN1-Pad2)"))
    (pad 3 smd rect (at -1.35 0.95 270) (size 1.56 0.6) (layers F.Cu F.Paste F.Mask)
      (net 73 /FB))
    (pad 2 smd rect (at -1.35 0 270) (size 1.56 0.6) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 1 smd rect (at -1.35 -0.95 270) (size 1.56 0.6) (layers F.Cu F.Paste F.Mask)
      (net 61 "Net-(CTSW1-Pad1)"))
    (model ${KISYS3DMOD}/Package_TO_SOT_SMD.3dshapes/SOT-23-6.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Package_TO_SOT_SMD:SOT-23-6_Handsoldering (layer F.Cu) (tedit 5E646E8D)
    (at 97.82302 68.98132)
    (descr "6-pin SOT-23 package, Handsoldering")
    (tags "SOT-23-6 Handsoldering")
    (attr smd)
    (fp_text reference U_74LVC2G7NRES1 (at -0.1524 -2.27584) (layer F.SilkS))
    (fp_text value SN74LVC2G07DBVR (at -0.0762 2.0447) (layer F.Fab) hide)
    (pad 5 smd rect (at 1.35 0) (size 1.56 0.6) (layers F.Cu F.Paste F.Mask)
      (net 3 +3V3))
    (pad 6 smd rect (at 1.35 -0.95) (size 1.56 0.6) (layers F.Cu F.Paste F.Mask)
      (net 160 "Net-(SP_N_SOFTRESET_1-Pad2)"))
    (pad 4 smd rect (at 1.35 0.95) (size 1.56 0.6) (layers F.Cu F.Paste F.Mask)
      (net 159 "Net-(SP_N_HARDRESET_1-Pad2)"))
    (pad 3 smd rect (at -1.35 0.95) (size 1.56 0.6) (layers F.Cu F.Paste F.Mask)
      (net 8 ~RESET~))
    (pad 2 smd rect (at -1.35 0) (size 1.56 0.6) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 1 smd rect (at -1.35 -0.95) (size 1.56 0.6) (layers F.Cu F.Paste F.Mask)
      (net 188 PA06-D8-NETRES))
    (model ${KISYS3DMOD}/Package_TO_SOT_SMD.3dshapes/SOT-23-6.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module LED_SMD:LED_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5DF893BD)
    (at 2.794 40.132 180)
    (descr "LED SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "LED handsolder")
    (attr smd)
    (fp_text reference L_RX1 (at -0.17272 -1.5621) (layer F.SilkS))
    (fp_text value Green (at 0.0889 1.4986) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 3 +3V3))
    (pad 1 smd roundrect (at -1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 112 "Net-(L_RX1-Pad1)"))
    (model ${KISYS3DMOD}/LED_SMD.3dshapes/LED_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Connector_USB:USB_Micro-B_Molex-105017-0001 (layer F.Cu) (tedit 5E5704E3)
    (at 0.0889 31.2039 270)
    (descr http://www.molex.com/pdm_docs/sd/1050170001_sd.pdf)
    (tags "Micro-USB SMD Typ-B")
    (attr smd)
    (fp_text reference J_USB1 (at 0.05 -6 90) (layer F.SilkS))
    (fp_text value USB_B_Micro (at 0.1524 0.4064 90) (layer F.Fab) hide)
    (pad 6 smd rect (at -2.85 -1.4125 270) (size 1.2 1.9) (layers F.Cu F.Mask)
      (net 62 "Net-(CUFG1-Pad1)"))
    (pad 6 smd rect (at 2.95 -1.4125 270) (size 1.2 1.9) (layers F.Cu F.Mask)
      (net 62 "Net-(CUFG1-Pad1)"))
    (pad 6 thru_hole circle (at 3.55 -1.4125 270) (size 1.4 1.4) (drill 1.1) (layers *.Cu *.Mask)
      (net 62 "Net-(CUFG1-Pad1)"))
    (pad 6 thru_hole circle (at -3.5 -1.4125 90) (size 1.4 1.4) (drill 1.1) (layers *.Cu *.Mask)
      (net 62 "Net-(CUFG1-Pad1)"))
    (pad 6 smd rect (at -0.95 -1.4125 270) (size 1.5 1.9) (layers F.Cu F.Paste F.Mask)
      (net 62 "Net-(CUFG1-Pad1)"))
    (pad 6 thru_hole circle (at 2.55 -4.1125 270) (size 1.196 1.196) (drill 0.9) (layers *.Cu *.Mask)
      (net 62 "Net-(CUFG1-Pad1)"))
    (pad 3 smd rect (at 0.05 -4.2 270) (size 0.4 2) (layers F.Cu F.Paste F.Mask)
      (net 172 PA25-D29-USBD+))
    (pad 4 smd rect (at 0.7 -4.2 270) (size 0.4 2) (layers F.Cu F.Paste F.Mask)
      (net 78 "Net-(J_USB1-Pad4)"))
    (pad 5 smd rect (at 1.35 -4.2 270) (size 0.4 2) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 1 smd rect (at -1.25 -4.2 270) (size 0.4 2) (layers F.Cu F.Paste F.Mask)
      (net 74 "Net-(FUSE1-Pad2)"))
    (pad 2 smd rect (at -0.6 -4.2 270) (size 0.4 2) (layers F.Cu F.Paste F.Mask)
      (net 173 PA24-D28-USBD-))
    (pad 6 thru_hole circle (at -2.45 -4.1125 270) (size 1.196 1.196) (drill 0.9) (layers *.Cu *.Mask)
      (net 62 "Net-(CUFG1-Pad1)"))
    (pad 6 smd rect (at 1.05 -1.4125 270) (size 1.5 1.9) (layers F.Cu F.Paste F.Mask)
      (net 62 "Net-(CUFG1-Pad1)"))
    (model ${KISYS3DMOD}/Connector_USB.3dshapes/USB_Micro-B_Molex-105017-0001.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Package_SO:TSSOP-10_3x3mm_P0.5mm (layer F.Cu) (tedit 5E49D326)
    (at 78.80096 20.89404 270)
    (descr "TSSOP10: plastic thin shrink small outline package; 10 leads; body width 3 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot552-1_po.pdf)")
    (tags "SSOP 0.5")
    (attr smd)
    (fp_text reference U_ADS1115 (at -3.42138 -0.3556) (layer F.SilkS))
    (fp_text value ADS1115IDGS (at 0.02286 2.14884 90) (layer F.Fab) hide)
    (fp_text user %R (at 0.00762 2.97942 90) (layer F.Fab) hide)
    (pad 10 smd rect (at 2.15 -1 270) (size 1.1 0.25) (layers F.Cu F.Paste F.Mask)
      (net 68 PA23-SCL))
    (pad 9 smd rect (at 2.15 -0.5 270) (size 1.1 0.25) (layers F.Cu F.Paste F.Mask)
      (net 69 PA22-SDA))
    (pad 8 smd rect (at 2.15 0 270) (size 1.1 0.25) (layers F.Cu F.Paste F.Mask)
      (net 126 ADSVV))
    (pad 7 smd rect (at 2.15 0.5 270) (size 1.1 0.25) (layers F.Cu F.Paste F.Mask)
      (net 129 AIN3))
    (pad 6 smd rect (at 2.15 1 270) (size 1.1 0.25) (layers F.Cu F.Paste F.Mask)
      (net 128 AIN2))
    (pad 5 smd rect (at -2.15 1 270) (size 1.1 0.25) (layers F.Cu F.Paste F.Mask)
      (net 127 AIN1))
    (pad 4 smd rect (at -2.15 0.5 270) (size 1.1 0.25) (layers F.Cu F.Paste F.Mask)
      (net 154 ANI0-TMP36))
    (pad 3 smd rect (at -2.15 0 270) (size 1.1 0.25) (layers F.Cu F.Paste F.Mask)
      (net 125 ADSGD))
    (pad 2 smd rect (at -2.15 -0.5 270) (size 1.1 0.25) (layers F.Cu F.Paste F.Mask)
      (net 133 "Net-(RADALR1-Pad2)"))
    (pad 1 smd rect (at -2.15 -1 270) (size 1.1 0.25) (layers F.Cu F.Paste F.Mask)
      (net 153 "Net-(RADDR1-Pad2)"))
    (model ${KISYS3DMOD}/Package_SO.3dshapes/TSSOP-10_3x3mm_P0.5mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Buzzer_Beeper:Buzzer_12x9.5RM7.6 (layer F.Cu) (tedit 5E49AD8B)
    (at 79.96174 58.2549 270)
    (descr "Generic Buzzer, D12mm height 9.5mm with RM7.6mm")
    (tags buzzer)
    (fp_text reference BUZZER1 (at 3.71348 0.07874 180) (layer F.SilkS))
    (fp_text value "3V 12mm" (at 3.8 7.4 90) (layer F.Fab) hide)
    (fp_text user + (at 0.0254 1.905 90) (layer B.SilkS))
    (fp_text user %R (at 3.8 -4 90) (layer F.Fab) hide)
    (fp_text user + (at -2.01422 -3.94716 90) (layer F.SilkS))
    (fp_text user + (at -1.5748 -0.0889 90) (layer F.Fab))
    (pad 2 thru_hole circle (at 7.6 0 270) (size 2 2) (drill 1) (layers *.Cu *.Mask)
      (net 72 "Net-(BUZZER1-Pad2)"))
    (pad 1 thru_hole rect (at 0 0 270) (size 2 2) (drill 1) (layers *.Cu *.Mask)
      (net 3 +3V3))
    (model ${KISYS3DMOD}/Buzzer_Beeper.3dshapes/Buzzer_12x9.5RM7.6.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module LED_SMD:LED_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5DF893BD)
    (at 70.104 78.994 180)
    (descr "LED SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "LED handsolder")
    (attr smd)
    (fp_text reference L_PWR1 (at -0.08636 -1.95326) (layer F.SilkS))
    (fp_text value Yellow (at 0.0889 1.4986) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 122 "Net-(L_PWR1-Pad2)"))
    (pad 1 smd roundrect (at -1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 40 "Net-(L_PWR1-Pad1)"))
    (model ${KISYS3DMOD}/LED_SMD.3dshapes/LED_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Potentiometer_THT:Potentiometer_Bourns_3386C_Horizontal (layer F.Cu) (tedit 5E2565C8)
    (at 76.2 78.486 90)
    (descr "Potentiometer, horizontal, Bourns 3386C, https://www.bourns.com/pdfs/3386.pdf")
    (tags "Potentiometer horizontal Bourns 3386C")
    (fp_text reference RVBUZ2 (at 0.06858 8.10514 270) (layer F.SilkS))
    (fp_text value "200 ohm TRIMMER " (at 0 8.555 90) (layer F.Fab) hide)
    (fp_text user %R (at 0.09906 10.03808 90) (layer F.Fab) hide)
    (pad 1 thru_hole circle (at 0 0 90) (size 1.44 1.44) (drill 0.8) (layers *.Cu *.Mask)
      (net 123 "Net-(RVBUZ2-Pad1)"))
    (pad 2 thru_hole circle (at 0 2.54 90) (size 1.44 1.44) (drill 0.8) (layers *.Cu *.Mask)
      (net 124 "Net-(RVBUZ2-Pad2)"))
    (pad 3 thru_hole circle (at 0 5.08 90) (size 1.44 1.44) (drill 0.8) (layers *.Cu *.Mask)
      (net 132 "Net-(RBUZV1-Pad2)"))
    (model ${KISYS3DMOD}/Potentiometer_THT.3dshapes/Potentiometer_Bourns_3386C_Horizontal.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Crystal:Crystal_SMD_EuroQuartz_MJ-4Pin_5.0x3.2mm (layer F.Cu) (tedit 5E241043)
    (at 104.3559 62.14364)
    (descr "SMD Crystal EuroQuartz MJ series http://cdn-reichelt.de/documents/datenblatt/B400/MJ.pdf, 5.0x3.2mm^2 package")
    (tags "SMD SMT crystal")
    (attr smd)
    (fp_text reference QN1 (at 0.1 -2.6) (layer F.SilkS))
    (fp_text value "25.00 MHz 18pf" (at -0.0254 2.9337) (layer F.Fab) hide)
    (fp_text user %R (at 0 0) (layer F.Fab) hide)
    (pad 4 smd rect (at -1.85 -1.15) (size 1.9 1.1) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 3 smd rect (at 1.85 -1.15) (size 1.9 1.1) (layers F.Cu F.Paste F.Mask)
      (net 15 "Net-(CNQ2-Pad1)"))
    (pad 2 smd rect (at 1.85 1.15) (size 1.9 1.1) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 1 smd rect (at -1.85 1.15) (size 1.9 1.1) (layers F.Cu F.Paste F.Mask)
      (net 14 "Net-(CNQ1-Pad1)"))
    (model ${KISYS3DMOD}/Crystal.3dshapes/Crystal_SMD_EuroQuartz_MJ-4Pin_5.0x3.2mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module MountingHole:MountingHole_3.2mm_M3_Pad locked (layer F.Cu) (tedit 5DC7B2E9)
    (at 140.97 77.47)
    (descr "Mounting Hole 3.2mm, M3")
    (tags "mounting hole 3.2mm m3")
    (attr virtual)
    (fp_text reference MPOE1 (at 2.60858 3.79222) (layer F.SilkS) hide)
    (fp_text value MPOE1 (at 0 4.5) (layer F.Fab) hide)
    (fp_text user %R (at -5.3975 3.1877) (layer F.Fab) hide)
    (pad 1 thru_hole circle (at 0 0) (size 5.842 5.842) (drill 3.200001) (layers *.Cu *.Mask)
      (net 130 "Net-(MPOE1-Pad1)"))
  )
  (module MountingHole:MountingHole_3.2mm_M3_Pad locked (layer F.Cu) (tedit 5DC7B2E9)
    (at 140.97 29.718)
    (descr "Mounting Hole 3.2mm, M3")
    (tags "mounting hole 3.2mm m3")
    (attr virtual)
    (fp_text reference MPOE2 (at 2.81432 -3.60172) (layer F.SilkS) hide)
    (fp_text value MPOE2 (at 0 4.5) (layer F.Fab) hide)
    (fp_text user %R (at -5.3975 3.1877) (layer F.Fab) hide)
    (pad 1 thru_hole circle (at 0 0) (size 5.842 5.842) (drill 3.200001) (layers *.Cu *.Mask)
      (net 131 "Net-(MPOE2-Pad1)"))
  )
  (module MountingHole:MountingHole_3.2mm_M3_Pad locked (layer F.Cu) (tedit 5DC7B2E9)
    (at 89.662 77.47)
    (descr "Mounting Hole 3.2mm, M3")
    (tags "mounting hole 3.2mm m3")
    (attr virtual)
    (fp_text reference H4 (at 2.98704 3.00482) (layer F.SilkS) hide)
    (fp_text value MO4 (at 0 4.5) (layer F.Fab) hide)
    (fp_text user %R (at -5.3975 3.1877) (layer F.Fab) hide)
    (pad 1 thru_hole circle (at 0 0) (size 5.842 5.842) (drill 3.200001) (layers *.Cu *.Mask)
      (net 35 "Net-(H4-Pad1)"))
  )
  (module MountingHole:MountingHole_3.2mm_M3_Pad locked (layer F.Cu) (tedit 5DC7B2E9)
    (at 5.08 77.47)
    (descr "Mounting Hole 3.2mm, M3")
    (tags "mounting hole 3.2mm m3")
    (attr virtual)
    (fp_text reference H1 (at -3.53314 3.59918) (layer F.SilkS) hide)
    (fp_text value MO1 (at 0 4.5) (layer F.Fab) hide)
    (fp_text user %R (at -5.3975 3.1877) (layer F.Fab) hide)
    (pad 1 thru_hole circle (at 0 0) (size 5.842 5.842) (drill 3.200001) (layers *.Cu *.Mask)
      (net 32 "Net-(H1-Pad1)"))
  )
  (module MountingHole:MountingHole_3.2mm_M3_Pad locked (layer F.Cu) (tedit 5DC7B2E9)
    (at 89.662 5.08)
    (descr "Mounting Hole 3.2mm, M3")
    (tags "mounting hole 3.2mm m3")
    (attr virtual)
    (fp_text reference H3 (at 2.44094 -3.60172) (layer F.SilkS) hide)
    (fp_text value MO3 (at 0 4.5) (layer F.Fab) hide)
    (fp_text user %R (at -5.3975 3.1877) (layer F.Fab) hide)
    (pad 1 thru_hole circle (at 0 0) (size 5.842 5.842) (drill 3.200001) (layers *.Cu *.Mask)
      (net 34 "Net-(H3-Pad1)"))
  )
  (module MountingHole:MountingHole_3.2mm_M3_Pad locked (layer F.Cu) (tedit 5DC7B2E9)
    (at 5.08 5.08)
    (descr "Mounting Hole 3.2mm, M3")
    (tags "mounting hole 3.2mm m3")
    (attr virtual)
    (fp_text reference H2 (at -3.75158 -1.96342) (layer F.SilkS) hide)
    (fp_text value MO2 (at 0 4.5) (layer F.Fab) hide)
    (fp_text user %R (at -5.3975 3.1877) (layer F.Fab) hide)
    (pad 1 thru_hole circle (at 0 0) (size 5.842 5.842) (drill 3.200001) (layers *.Cu *.Mask)
      (net 33 "Net-(H2-Pad1)"))
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5DE87405)
    (at 122.5423 71.83628 180)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RPOE1 (at -3.42646 -0.09906) (layer F.SilkS))
    (fp_text value "60.4K 1%" (at 0.0127 1.5367) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 1 GND))
    (pad 1 smd roundrect (at -1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 23 "Net-(CPCC1-Pad2)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Package_TO_SOT_SMD:SOT-323_SC-70_Handsoldering (layer F.Cu) (tedit 5DE87E59)
    (at 54.62778 62.27826)
    (descr "SOT-323, SC-70 Handsoldering")
    (tags "SOT-323 SC-70 Handsoldering")
    (attr smd)
    (fp_text reference U_2N7002-LED1 (at -0.0127 -1.86182) (layer F.SilkS))
    (fp_text value 2N7002PW.115 (at 0 2.05) (layer F.Fab) hide)
    (fp_text user %R (at 0 0 90) (layer F.Fab) hide)
    (pad 3 smd rect (at 1.33 0 270) (size 0.45 1.5) (layers F.Cu F.Paste F.Mask)
      (net 120 "Net-(RLED1-Pad1)"))
    (pad 2 smd rect (at -1.33 0.65 270) (size 0.45 1.5) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 1 smd rect (at -1.33 -0.65 270) (size 0.45 1.5) (layers F.Cu F.Paste F.Mask)
      (net 189 PA17-D13-DEFLED))
    (model ${KISYS3DMOD}/Package_TO_SOT_SMD.3dshapes/SOT-323_SC-70.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Package_TO_SOT_SMD:SOT-323_SC-70_Handsoldering (layer F.Cu) (tedit 5DE87E59)
    (at 69.44868 60.3123)
    (descr "SOT-323, SC-70 Handsoldering")
    (tags "SOT-323 SC-70 Handsoldering")
    (attr smd)
    (fp_text reference U_2N7002-BUZ1 (at 1.14808 -1.73482) (layer F.SilkS))
    (fp_text value 2N7002PW.115 (at 0 2.05) (layer F.Fab) hide)
    (fp_text user %R (at 0 0 -270) (layer F.Fab) hide)
    (pad 3 smd rect (at 1.33 0 270) (size 0.45 1.5) (layers F.Cu F.Paste F.Mask)
      (net 124 "Net-(RVBUZ2-Pad2)"))
    (pad 2 smd rect (at -1.33 0.65 270) (size 0.45 1.5) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 1 smd rect (at -1.33 -0.65 270) (size 0.45 1.5) (layers F.Cu F.Paste F.Mask)
      (net 186 PA04-D17-A3-BUZ))
    (model ${KISYS3DMOD}/Package_TO_SOT_SMD.3dshapes/SOT-323_SC-70.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Package_TO_SOT_SMD:SOT-23-5_HandSoldering (layer F.Cu) (tedit 5E23FD13)
    (at 68.60794 52.72532 180)
    (descr "5-pin SOT23 package")
    (tags "SOT-23-5 hand-soldering")
    (attr smd)
    (fp_text reference U_74LVC1G1-NCS1 (at 0.2032 2.10058) (layer F.SilkS))
    (fp_text value SN74LVC1G125DBVR (at 0 2.9) (layer F.Fab) hide)
    (fp_text user %R (at 0 0 90) (layer F.Fab) hide)
    (pad 5 smd rect (at 1.35 -0.95 180) (size 1.56 0.65) (layers F.Cu F.Paste F.Mask)
      (net 3 +3V3))
    (pad 4 smd rect (at 1.35 0.95 180) (size 1.56 0.65) (layers F.Cu F.Paste F.Mask)
      (net 4 PA12-MISO))
    (pad 3 smd rect (at -1.35 0.95 180) (size 1.56 0.6) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 2 smd rect (at -1.35 0 180) (size 1.56 0.6) (layers F.Cu F.Paste F.Mask)
      (net 5 NET-MISO))
    (pad 1 smd rect (at -1.35 -0.95 180) (size 1.56 0.6) (layers F.Cu F.Paste F.Mask)
      (net 187 PA15-D5-NETCS))
    (model ${KISYS3DMOD}/Package_TO_SOT_SMD.3dshapes/SOT-23-5.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Package_TO_SOT_SMD:SOT-23-5_HandSoldering (layer F.Cu) (tedit 5E23FD13)
    (at 25.4 67.53098 180)
    (descr "5-pin SOT23 package")
    (tags "SOT-23-5 hand-soldering")
    (attr smd)
    (fp_text reference U_74LVC1G1-LMOSI1 (at 0.2921 -2.16662) (layer F.SilkS))
    (fp_text value SN74LVC1G125DBVR (at 0 2.9) (layer F.Fab) hide)
    (fp_text user %R (at 0 0 90) (layer F.Fab) hide)
    (pad 5 smd rect (at 1.35 -0.95 180) (size 1.56 0.65) (layers F.Cu F.Paste F.Mask)
      (net 3 +3V3))
    (pad 4 smd rect (at 1.35 0.95 180) (size 1.56 0.65) (layers F.Cu F.Paste F.Mask)
      (net 6 MOSISD))
    (pad 3 smd rect (at -1.35 0.95 180) (size 1.56 0.6) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 2 smd rect (at -1.35 0 180) (size 1.56 0.6) (layers F.Cu F.Paste F.Mask)
      (net 59 PB10-MOSI))
    (pad 1 smd rect (at -1.35 -0.95 180) (size 1.56 0.6) (layers F.Cu F.Paste F.Mask)
      (net 171 PA14-D2-SDCS))
    (model ${KISYS3DMOD}/Package_TO_SOT_SMD.3dshapes/SOT-23-5.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Package_TO_SOT_SMD:SOT-23-5_HandSoldering (layer F.Cu) (tedit 5E23FD13)
    (at 21.51126 61.68136)
    (descr "5-pin SOT23 package")
    (tags "SOT-23-5 hand-soldering")
    (attr smd)
    (fp_text reference U_74LVC1G1-LSCK1 (at 1.99136 -2.1844) (layer F.SilkS))
    (fp_text value SN74LVC1G125DBVR (at 0 2.9) (layer F.Fab) hide)
    (fp_text user %R (at 0 0 90) (layer F.Fab) hide)
    (pad 5 smd rect (at 1.35 -0.95) (size 1.56 0.65) (layers F.Cu F.Paste F.Mask)
      (net 3 +3V3))
    (pad 4 smd rect (at 1.35 0.95) (size 1.56 0.65) (layers F.Cu F.Paste F.Mask)
      (net 7 SCKSD))
    (pad 3 smd rect (at -1.35 0.95) (size 1.56 0.6) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 2 smd rect (at -1.35 0) (size 1.56 0.6) (layers F.Cu F.Paste F.Mask)
      (net 58 PB11-SCK))
    (pad 1 smd rect (at -1.35 -0.95) (size 1.56 0.6) (layers F.Cu F.Paste F.Mask)
      (net 171 PA14-D2-SDCS))
    (model ${KISYS3DMOD}/Package_TO_SOT_SMD.3dshapes/SOT-23-5.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Package_TO_SOT_SMD:SOT-23-5_HandSoldering (layer F.Cu) (tedit 5E23FD13)
    (at 50.84572 71.14032 90)
    (descr "5-pin SOT23 package")
    (tags "SOT-23-5 hand-soldering")
    (attr smd)
    (fp_text reference U_74LVC1G1-TFT1 (at 2.80924 0.40386 180) (layer F.SilkS))
    (fp_text value SN74LVC1G125DBVR (at 0 2.9 90) (layer F.Fab) hide)
    (fp_text user %R (at 0 0) (layer F.Fab) hide)
    (pad 5 smd rect (at 1.35 -0.95 90) (size 1.56 0.65) (layers F.Cu F.Paste F.Mask)
      (net 3 +3V3))
    (pad 4 smd rect (at 1.35 0.95 90) (size 1.56 0.65) (layers F.Cu F.Paste F.Mask)
      (net 4 PA12-MISO))
    (pad 3 smd rect (at -1.35 0.95 90) (size 1.56 0.6) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 2 smd rect (at -1.35 0 90) (size 1.56 0.6) (layers F.Cu F.Paste F.Mask)
      (net 71 TFT-MISO))
    (pad 1 smd rect (at -1.35 -0.95 90) (size 1.56 0.6) (layers F.Cu F.Paste F.Mask)
      (net 181 PA20-D6-TFT_CS))
    (model ${KISYS3DMOD}/Package_TO_SOT_SMD.3dshapes/SOT-23-5.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5DE8741E)
    (at 64.63284 32.90062 135)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference CA1 (at 0.0127 -1.4351 135) (layer F.SilkS))
    (fp_text value 0.1uf (at -0.0127 1.5367 135) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.025 0 135) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 169 PA03-D42-AREF))
    (pad 1 smd roundrect (at -1.025 0 135) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 1 GND))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5DE8741E)
    (at 67.34556 35.687 135)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference CA2 (at 0.0127 -1.4351 135) (layer F.SilkS))
    (fp_text value 4.7uf (at -0.0127 1.5367 135) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.025 0 135) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 169 PA03-D42-AREF))
    (pad 1 smd roundrect (at -1.025 0 135) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 1 GND))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5DE8741E)
    (at 35.94862 36.1823)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference CCLK1 (at 0.4572 -1.51384) (layer F.SilkS))
    (fp_text value 1uf (at -0.0127 1.5367) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 1 GND))
    (pad 1 smd roundrect (at -1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 3 +3V3))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5DE8741E)
    (at 52.10302 30.98546 45)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference CVDD1 (at 0.0127 -1.4351 45) (layer F.SilkS))
    (fp_text value 1uf (at -0.0127 1.5367 45) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.025 0 45) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 104 "Net-(CVDD1-Pad2)"))
    (pad 1 smd roundrect (at -1.025 0 45) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 1 GND))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5DE8741E)
    (at 53.52796 32.47136 225)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference CF48 (at 0.0127 -1.4351 45) (layer F.SilkS))
    (fp_text value 0.1uf (at -0.0127 1.5367 45) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.025 0 225) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 1 GND))
    (pad 1 smd roundrect (at -1.025 0 225) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 9 +3.3VA))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5DE8741E)
    (at 65.52692 19.64436 45)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference CF21 (at 0.0127 -1.4351 45) (layer F.SilkS))
    (fp_text value 0.1uf (at -0.0127 1.5367 45) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.025 0 45) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 1 GND))
    (pad 1 smd roundrect (at -1.025 0 45) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 9 +3.3VA))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5DE8741E)
    (at 49.8729 22.84222 180)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference CF34 (at 0.0127 -1.4351) (layer F.SilkS))
    (fp_text value 0.1uf (at -0.0127 1.5367) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 1 GND))
    (pad 1 smd roundrect (at -1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 9 +3.3VA))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5DE8741E)
    (at 18.92046 17.13992 90)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference CTFF1 (at 0.0127 -1.4351 90) (layer F.SilkS))
    (fp_text value "12pf 50V" (at -0.0127 1.5367 90) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.025 0 90) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 10 /3REG))
    (pad 1 smd roundrect (at -1.025 0 90) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 73 /FB))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_1206_3216Metric_Pad1.42x1.75mm_HandSolder (layer F.Cu) (tedit 5DE874A3)
    (at 10.46988 24.5618)
    (descr "Capacitor SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference CUFG1 (at 0.35052 -1.57988) (layer F.SilkS))
    (fp_text value "4.7pf 1K" (at 0 1.82) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.4875 0) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 1 GND))
    (pad 1 smd roundrect (at -1.4875 0) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 62 "Net-(CUFG1-Pad1)"))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_1206_3216Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_1210_3225Metric_Pad1.42x2.65mm_HandSolder (layer F.Cu) (tedit 5DE873F3)
    (at 18.7452 29.96946 90)
    (descr "Capacitor SMD 1210 (3225 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference CTI1 (at -3.0353 0.08128 180) (layer F.SilkS))
    (fp_text value "0.1uf 50V" (at 0 2.28 90) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.4875 0 90) (size 1.425 2.65) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 101 "Net-(CTI1-Pad2)"))
    (pad 1 smd roundrect (at -1.4875 0 90) (size 1.425 2.65) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 1 GND))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_1210_3225Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_1210_3225Metric_Pad1.42x2.65mm_HandSolder (layer F.Cu) (tedit 5DE873F3)
    (at 22.4409 28.82646 270)
    (descr "Capacitor SMD 1210 (3225 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference CTI2 (at 3.01498 0.05334 180) (layer F.SilkS))
    (fp_text value "10uf 50V" (at 0 2.28 90) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.4875 0 270) (size 1.425 2.65) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 1 GND))
    (pad 1 smd roundrect (at -1.4875 0 270) (size 1.425 2.65) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 101 "Net-(CTI1-Pad2)"))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_1210_3225Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5DE8741E)
    (at 55.7403 72.28078 270)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference CU125 (at 0.0127 -1.4351 90) (layer F.SilkS))
    (fp_text value 0.1uf (at -0.0127 1.5367 90) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 1 GND))
    (pad 1 smd roundrect (at -1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 3 +3V3))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5DE8741E)
    (at 105.10774 44.58208 270)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference CN4 (at 2.4511 -0.07366 180) (layer F.SilkS))
    (fp_text value 0.1uf (at -0.0127 1.5367 90) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 11 +3.3VP))
    (pad 1 smd roundrect (at -1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 12 GNDA))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5DE8741E)
    (at 101.11486 44.46016 270)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference CN8 (at 2.33934 -0.25146 180) (layer F.SilkS))
    (fp_text value 0.1uf (at -0.0127 1.5367 90) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 11 +3.3VP))
    (pad 1 smd roundrect (at -1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 12 GNDA))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5DE8741E)
    (at 98.78822 44.63288 270)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference CN11 (at 2.4384 0.1143 180) (layer F.SilkS))
    (fp_text value 0.1uf (at -0.0127 1.5367 90) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 11 +3.3VP))
    (pad 1 smd roundrect (at -1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 12 GNDA))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5DE8741E)
    (at 94.21876 47.81296)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference CN15 (at -3.15976 0.07366) (layer F.SilkS))
    (fp_text value 0.1uf (at -0.0127 1.5367) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 11 +3.3VP))
    (pad 1 smd roundrect (at -1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 12 GNDA))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5DE8741E)
    (at 94.19844 49.93132)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference CN17 (at -3.10896 0.05334) (layer F.SilkS))
    (fp_text value 0.1uf (at -0.0127 1.5367) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 11 +3.3VP))
    (pad 1 smd roundrect (at -1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 12 GNDA))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5DE8741E)
    (at 94.21876 52.06746)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference CN20 (at -3.61188 0.04826) (layer F.SilkS))
    (fp_text value 10uf (at -0.0127 1.5367) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 105 "Net-(CN20-Pad2)"))
    (pad 1 smd roundrect (at -1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 12 GNDA))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5DE8741E)
    (at 94.21114 54.08168)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference CN21 (at -3.08102 0.01778) (layer F.SilkS))
    (fp_text value 0.1uf (at -0.0127 1.5367) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 11 +3.3VP))
    (pad 1 smd roundrect (at -1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 12 GNDA))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5DE8741E)
    (at 94.22384 56.09844)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference CN22 (at -3.59156 0.02286) (layer F.SilkS))
    (fp_text value 22nf (at -0.0127 1.5367) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 13 "Net-(CN22-Pad2)"))
    (pad 1 smd roundrect (at -1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 12 GNDA))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5DE8741E)
    (at 67.64782 55.62092)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference CNMISO1 (at 0.0127 1.45796) (layer F.SilkS))
    (fp_text value 0.1uf (at -0.0127 1.5367) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 1 GND))
    (pad 1 smd roundrect (at -1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 3 +3V3))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5DE8741E)
    (at 102.83698 69.59854 270)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference CNOR1 (at 0.04318 -1.46558 90) (layer F.SilkS))
    (fp_text value 0.1uf (at -0.0127 1.5367 90) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 1 GND))
    (pad 1 smd roundrect (at -1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 3 +3V3))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5DE8741E)
    (at 99.72548 62.15634 90)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference CNQ1 (at 0.0127 -1.4351 90) (layer F.SilkS))
    (fp_text value 27pf (at -0.0127 1.5367 90) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.025 0 90) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 1 GND))
    (pad 1 smd roundrect (at -1.025 0 90) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 14 "Net-(CNQ1-Pad1)"))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5DE8741E)
    (at 108.77296 62.03442 270)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference CNQ2 (at 0.0127 -1.4351 90) (layer F.SilkS))
    (fp_text value 27pf (at -0.0127 1.5367 90) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 1 GND))
    (pad 1 smd roundrect (at -1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 15 "Net-(CNQ2-Pad1)"))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5DE8741E)
    (at 97.1169 30.1244 180)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference CNRD1 (at 0.0127 -1.4351) (layer F.SilkS))
    (fp_text value "10nf 100V" (at -0.0127 1.5367) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 1 GND))
    (pad 1 smd roundrect (at -1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 16 "Net-(CNRD1-Pad1)"))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_1806_4516Metric_Pad1.57x1.80mm_HandSolder (layer F.Cu) (tedit 5DE87E31)
    (at 109.34954 25.0698 270)
    (descr "Capacitor SMD 1806 (4516 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://www.modelithics.com/models/Vendor/MuRata/BLM41P.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference CNRJ1 (at 0.1 -1.75 90) (layer F.SilkS))
    (fp_text value "1nf 2KV" (at 0 1.85 90) (layer F.Fab) hide)
    (fp_text user %R (at 0 0 90) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 2.0875 0 270) (size 1.575 1.8) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.15873)
      (net 1 GND))
    (pad 1 smd roundrect (at -2.0875 0 270) (size 1.575 1.8) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.15873)
      (net 17 GNDPWR))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_1806_4516Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5DE8741E)
    (at 100.51034 26.7208 90)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference CNRX+1 (at 0.0127 -1.4351 90) (layer F.SilkS))
    (fp_text value "6.8nf 100V" (at -0.0127 1.5367 90) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.025 0 90) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 19 "Net-(CNRX+1-Pad2)"))
    (pad 1 smd roundrect (at -1.025 0 90) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 18 "Net-(CNRX+1-Pad1)"))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5DE8741E)
    (at 102.69474 26.8478 270)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference CNRX-1 (at 0.0127 -1.4351 90) (layer F.SilkS))
    (fp_text value "6.8nf 100V" (at -0.0127 1.5367 90) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 21 "Net-(CNRX-1-Pad2)"))
    (pad 1 smd roundrect (at -1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 20 "Net-(CNRX-1-Pad1)"))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5DE8741E)
    (at 96.14408 27.11958)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference CNTCT1 (at 0.0127 -1.4351) (layer F.SilkS))
    (fp_text value "22nf 100V" (at -0.0127 1.5367) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 22 "Net-(CNTCT1-Pad2)"))
    (pad 1 smd roundrect (at -1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 1 GND))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5DE8741E)
    (at 95.34398 62.9666 270)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference CNV28B1 (at -0.23876 1.43002 90) (layer F.SilkS))
    (fp_text value 0.1uf (at -0.0127 1.5367 90) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 1 GND))
    (pad 1 smd roundrect (at -1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 3 +3V3))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_1210_3225Metric_Pad1.42x2.65mm_HandSolder (layer F.Cu) (tedit 5DE873F3)
    (at 26.85034 27.94762 180)
    (descr "Capacitor SMD 1210 (3225 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference CTO1 (at 0.06604 -2.1717) (layer F.SilkS))
    (fp_text value 22uf (at 0 2.28) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.4875 0 180) (size 1.425 2.65) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 1 GND))
    (pad 1 smd roundrect (at -1.4875 0 180) (size 1.425 2.65) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 10 /3REG))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_1210_3225Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_1210_3225Metric_Pad1.42x2.65mm_HandSolder (layer F.Cu) (tedit 5DE873F3)
    (at 28.67406 17.28978)
    (descr "Capacitor SMD 1210 (3225 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference CTO2 (at -0.11938 -2.10566) (layer F.SilkS))
    (fp_text value 22uf (at 0 2.28) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.4875 0) (size 1.425 2.65) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 1 GND))
    (pad 1 smd roundrect (at -1.4875 0) (size 1.425 2.65) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 10 /3REG))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_1210_3225Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5DE8741E)
    (at 121.95302 63.70066)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference CPCC1 (at -2.52984 -0.07874 90) (layer F.SilkS))
    (fp_text value 22nf (at -0.0127 1.5367) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 23 "Net-(CPCC1-Pad2)"))
    (pad 1 smd roundrect (at -1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 24 "Net-(CPCC1-Pad1)"))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:CP_Elec_6.3x7.7 (layer F.Cu) (tedit 5DC67CCD)
    (at 113.4618 76.7842 90)
    (descr "SMD capacitor, aluminum electrolytic, Nichicon, 6.3x7.7mm")
    (tags "capacitor electrolytic")
    (attr smd)
    (fp_text reference CPCOS-CON1 (at 0.40386 -4.15798 90) (layer F.SilkS))
    (fp_text value "330uf 6.3V" (at 0 4.35 90) (layer F.Fab) hide)
    (fp_text user %R (at 0 0 90) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 2.7 0 90) (size 3.5 1.6) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.15625)
      (net 1 GND))
    (pad 1 smd roundrect (at -2.7 0 90) (size 3.5 1.6) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.15625)
      (net 25 /PV3))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/CP_Elec_6.3x7.7.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5DE8741E)
    (at 141.84122 69.7738)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference CPFIL1 (at 0.0127 -1.4351) (layer F.SilkS))
    (fp_text value "470pf 50V" (at -0.0127 1.5367) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 25 /PV3))
    (pad 1 smd roundrect (at -1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 26 "Net-(CPFIL1-Pad1)"))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_1812_4532Metric_Pad1.30x3.40mm_HandSolder (layer F.Cu) (tedit 5DE8745A)
    (at 142.18412 53.3781 180)
    (descr "Capacitor SMD 1812 (4532 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://www.nikhef.nl/pub/departments/mt/projects/detectorR_D/dtddice/ERJ2G.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference CPISO1 (at 3.72618 0.35052 90) (layer F.SilkS))
    (fp_text value "22nf 250V" (at 0 2.65) (layer F.Fab) hide)
    (fp_text user %R (at 0 0) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 2.225 0 180) (size 1.3 3.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.192308)
      (net 27 GNDREF))
    (pad 1 smd roundrect (at -2.225 0 180) (size 1.3 3.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.192308)
      (net 1 GND))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_1812_4532Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_1210_3225Metric_Pad1.42x2.65mm_HandSolder (layer F.Cu) (tedit 5DE873F3)
    (at 133.51764 53.60924)
    (descr "Capacitor SMD 1210 (3225 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference CPLDA1 (at 0.05 -2.05) (layer F.SilkS))
    (fp_text value "1uf 100V" (at 0 2.28) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.4875 0) (size 1.425 2.65) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 28 /VPORTP))
    (pad 1 smd roundrect (at -1.4875 0) (size 1.425 2.65) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 27 GNDREF))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_1210_3225Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:CP_Elec_8x10 (layer F.Cu) (tedit 5DC67C62)
    (at 141.478 43.942 90)
    (descr "SMD capacitor, aluminum electrolytic, Nichicon, 8.0x10mm")
    (tags "capacitor electrolytic")
    (attr smd)
    (fp_text reference CPLDB1 (at 0.26162 -4.90728 90) (layer F.SilkS))
    (fp_text value "4.7uf 100V" (at 0 5.2 90) (layer F.Fab) hide)
    (fp_text user %R (at 0 0 90) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 3.25 0 90) (size 3.5 2.5) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.1)
      (net 27 GNDREF))
    (pad 1 smd roundrect (at -3.25 0 90) (size 3.5 2.5) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.1)
      (net 28 /VPORTP))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/CP_Elec_8x10.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_1206_3216Metric_Pad1.42x1.75mm_HandSolder (layer F.Cu) (tedit 5DE874A3)
    (at 124.587 39.80688)
    (descr "Capacitor SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference CPOE1 (at -3.10642 0.12446 90) (layer F.SilkS))
    (fp_text value "0.1uf 100V" (at 0 1.82) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.4875 0) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 28 /VPORTP))
    (pad 1 smd roundrect (at -1.4875 0) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 29 /VPORTN))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_1206_3216Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_1210_3225Metric_Pad1.42x2.65mm_HandSolder (layer F.Cu) (tedit 5DE873F3)
    (at 123.698 76.2 90)
    (descr "Capacitor SMD 1210 (3225 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference CPOUT1 (at -3.10134 0.0127 180) (layer F.SilkS))
    (fp_text value "100uf 10V " (at 0 2.28 90) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.4875 0 90) (size 1.425 2.65) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 1 GND))
    (pad 1 smd roundrect (at -1.4875 0 90) (size 1.425 2.65) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 25 /PV3))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_1210_3225Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_1210_3225Metric_Pad1.42x2.65mm_HandSolder (layer F.Cu) (tedit 5DE873F3)
    (at 127.254 76.2 90)
    (descr "Capacitor SMD 1210 (3225 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference CPOUT2 (at -3.10134 0.22606 180) (layer F.SilkS))
    (fp_text value "100uf 10V " (at 0 2.28 90) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.4875 0 90) (size 1.425 2.65) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 1 GND))
    (pad 1 smd roundrect (at -1.4875 0 90) (size 1.425 2.65) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 25 /PV3))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_1210_3225Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_1210_3225Metric_Pad1.42x2.65mm_HandSolder (layer F.Cu) (tedit 5DE873F3)
    (at 120.142 76.2 90)
    (descr "Capacitor SMD 1210 (3225 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference CPOUT3 (at -3.1623 -0.16764 180) (layer F.SilkS))
    (fp_text value "100uf 10V " (at 0 2.28 90) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.4875 0 90) (size 1.425 2.65) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 1 GND))
    (pad 1 smd roundrect (at -1.4875 0 90) (size 1.425 2.65) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 25 /PV3))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_1210_3225Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_Tantalum_SMD:CP_EIA-6032-15_Kemet-U_Pad2.25x2.35mm_HandSolder (layer F.Cu) (tedit 5DF89350)
    (at 132.03174 45.9359 90)
    (descr "Tantalum Capacitor SMD Kemet-U (6032-15 Metric), IPC_7351 nominal, (Body size from: http://www.kemet.com/Lists/ProductCatalog/Attachments/253/KEM_TC101_STD.pdf), generated with kicad-footprint-generator")
    (tags "capacitor tantalum")
    (attr smd)
    (fp_text reference CPVCC1 (at 1.18872 2.28092 90) (layer F.SilkS))
    (fp_text value "4.7uf 50V TANT" (at 0 2.55 90) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 2.55 0 90) (size 2.25 2.35) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.111111)
      (net 27 GNDREF))
    (pad 1 smd roundrect (at -2.55 0 90) (size 2.25 2.35) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.111111)
      (net 30 /PVCC))
    (model ${KISYS3DMOD}/Capacitor_Tantalum_SMD.3dshapes/CP_EIA-6032-15_Kemet-U.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5DE8741E)
    (at 62.68212 37.15004 180)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference CQ1 (at 0.0127 -1.4351) (layer F.SilkS))
    (fp_text value 20pf (at -0.0127 1.5367) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 1 GND))
    (pad 1 smd roundrect (at -1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 99 "Net-(CQ1-Pad1)"))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5DE8741E)
    (at 58.70194 37.18052 180)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference CQ2 (at 0.0127 -1.4351) (layer F.SilkS))
    (fp_text value 20pf (at -0.0127 1.5367) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 100 "Net-(CQ2-Pad2)"))
    (pad 1 smd roundrect (at -1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 1 GND))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5DE8741E)
    (at 10.07618 48.8823)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference CRST1 (at 0.0127 -1.4351) (layer F.SilkS))
    (fp_text value 0.1uf (at -0.0127 1.5367) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 1 GND))
    (pad 1 smd roundrect (at -1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 8 ~RESET~))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5DE8741E)
    (at 25.02154 55.79872 270)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference CSDI1 (at -0.0254 -1.56464 90) (layer F.SilkS))
    (fp_text value 0.1uf (at -0.0127 1.5367 90) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 1 GND))
    (pad 1 smd roundrect (at -1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 3 +3V3))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5DE8741E)
    (at 20.701 66.802 270)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference CSDO1 (at -0.54356 -1.67132 90) (layer F.SilkS))
    (fp_text value 0.1uf (at -0.0127 1.5367 90) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 3 +3V3))
    (pad 1 smd roundrect (at -1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 1 GND))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5DE8741E)
    (at 25.5397 62.26048 270)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference CSDS1 (at 0.00762 -1.651 90) (layer F.SilkS))
    (fp_text value 0.1uf (at -0.0127 1.5367 90) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 1 GND))
    (pad 1 smd roundrect (at -1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 3 +3V3))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5DE8741E)
    (at 23.47214 17.9197 90)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference CTSW1 (at 2.2606 0.31242 180) (layer F.SilkS))
    (fp_text value "0.1uf 50V" (at -0.0127 1.5367 90) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.025 0 90) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 60 "Net-(CTSW1-Pad2)"))
    (pad 1 smd roundrect (at -1.025 0 90) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 61 "Net-(CTSW1-Pad1)"))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5DE8741E)
    (at 66.33718 30.861 315)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference CV1 (at 0.19577 -1.456598 135) (layer F.SilkS))
    (fp_text value 0.1uf (at -0.0127 1.5367 135) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.025 0 315) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 1 GND))
    (pad 1 smd roundrect (at -1.025 0 315) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 79 "Net-(CV1-Pad1)"))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5DE8741E)
    (at 69.32168 33.74136 315)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference CV2 (at 0.0127 -1.4351 135) (layer F.SilkS))
    (fp_text value 10uf (at -0.0127 1.5367 135) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.025 0 315) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 1 GND))
    (pad 1 smd roundrect (at -1.025 0 315) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 79 "Net-(CV1-Pad1)"))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Diode_SMD:D_SOD-123F (layer F.Cu) (tedit 5DF893D5)
    (at 15.1511 23.5331 90)
    (descr D_SOD-123F)
    (tags D_SOD-123F)
    (attr smd)
    (fp_text reference D_JAC1 (at 2.77368 -0.07366 180) (layer F.SilkS))
    (fp_text value MBR230LSFT1G (at -2.95 0.05) (layer F.Fab) hide)
    (pad 2 smd rect (at 1.4 0 90) (size 1.1 1.1) (layers F.Cu F.Paste F.Mask)
      (net 134 PWR_JACK))
    (pad 1 smd rect (at -1.4 0 90) (size 1.1 1.1) (layers F.Cu F.Paste F.Mask)
      (net 101 "Net-(CTI1-Pad2)"))
    (model ${KISYS3DMOD}/Diode_SMD.3dshapes/D_SOD-123F.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Diode_SMD:D_SOD-123F (layer F.Cu) (tedit 5DF893D5)
    (at 15.20698 30.07614 90)
    (descr D_SOD-123F)
    (tags D_SOD-123F)
    (attr smd)
    (fp_text reference D_USB1 (at 2.84988 -0.01778 180) (layer F.SilkS))
    (fp_text value MBR230LSFT1G (at -2.95 0.05) (layer F.Fab) hide)
    (pad 2 smd rect (at 1.4 0 90) (size 1.1 1.1) (layers F.Cu F.Paste F.Mask)
      (net 135 PWR_USB))
    (pad 1 smd rect (at -1.4 0 90) (size 1.1 1.1) (layers F.Cu F.Paste F.Mask)
      (net 101 "Net-(CTI1-Pad2)"))
    (model ${KISYS3DMOD}/Diode_SMD.3dshapes/D_SOD-123F.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Diode_SMD:D_SOD-523 (layer F.Cu) (tedit 5DF8931B)
    (at 121.45772 48.49622 90)
    (descr "http://www.diodes.com/datasheets/ap02001.pdf p.144")
    (tags "Diode SOD523")
    (attr smd)
    (fp_text reference D_PBAS1 (at -0.14986 -1.20142 90) (layer F.SilkS))
    (fp_text value BAS516.135 (at -0.0254 1.1938 90) (layer F.Fab))
    (pad 1 smd rect (at -0.7 0 270) (size 0.6 0.7) (layers F.Cu F.Paste F.Mask)
      (net 116 "Net-(D_PBAS1-Pad1)"))
    (pad 2 smd rect (at 0.7 0 270) (size 0.6 0.7) (layers F.Cu F.Paste F.Mask)
      (net 31 /RUN))
    (model ${KISYS3DMOD}/Diode_SMD.3dshapes/D_SOD-523.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5DE87405)
    (at 67.93992 25.11044 270)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference F_VDD1 (at -0.40386 -1.63068 90) (layer F.SilkS))
    (fp_text value "220 ohm Ferrite" (at 0.0127 1.5367 90) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 79 "Net-(CV1-Pad1)"))
    (pad 1 smd roundrect (at -1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 9 +3.3VA))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5DE87405)
    (at 94.09684 35.94724 90)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference F_NBG1 (at 0.15 -1.4 90) (layer F.SilkS))
    (fp_text value "42 ohm Ferrite" (at 0.0127 1.5367 90) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0 90) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 1 GND))
    (pad 1 smd roundrect (at -1.025 0 90) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 12 GNDA))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5DE87405)
    (at 96.93148 37.33292 90)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference F_NBV1 (at -0.50546 1.49606 90) (layer F.SilkS))
    (fp_text value "120 ohm Ferrite" (at 0.0127 1.5367 90) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0 90) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 3 +3V3))
    (pad 1 smd roundrect (at -1.025 0 90) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 11 +3.3VP))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5DE87405)
    (at 95.1357 72.73544 180)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference F_PB1 (at 0.12446 1.39954) (layer F.SilkS))
    (fp_text value "120 ohm Ferrite" (at 0.0127 1.5367) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 121 +3V0))
    (pad 1 smd roundrect (at -1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 25 /PV3))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Connector_BarrelJack:BarrelJack_CUI_PJ-102AH_Horizontal (layer F.Cu) (tedit 5DE87F7E)
    (at 15.0114 5.715 180)
    (descr "Thin-pin DC Barrel Jack, https://cdn-shop.adafruit.com/datasheets/21mmdcjackDatasheet.pdf")
    (tags "Power Jack")
    (fp_text reference J_PWR_JACK1 (at -5.207 2.6162 270) (layer F.SilkS))
    (fp_text value Barrel_Jack (at -5 2.25 90) (layer F.Fab) hide)
    (pad 1 thru_hole circle (at 2.159 -0.5334 180) (size 2.032 2.032) (drill 1.2192) (layers *.Cu *.Mask)
      (net 134 PWR_JACK))
    (pad 3 thru_hole circle (at 4.699 -0.5334 180) (size 2.032 2.032) (drill 1.1938) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 2 thru_hole circle (at 0 2.4384 180) (size 2.032 2.032) (drill 1.1938) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 1 thru_hole circle (at 0 -3.5306 180) (size 2.032 2.032) (drill 1.2192) (layers *.Cu *.Mask)
      (net 134 PWR_JACK))
    (model ${KISYS3DMOD}/Connector_BarrelJack.3dshapes/BarrelJack_CUI_PJ-102AH_Horizontal.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module LED_SMD:LED_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5DF893BD)
    (at 63.5 78.994 180)
    (descr "LED SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "LED handsolder")
    (attr smd)
    (fp_text reference L_DEF1 (at -0.06604 -1.70434) (layer F.SilkS))
    (fp_text value Blue (at 0.0889 1.4986) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 3 +3V3))
    (pad 1 smd roundrect (at -1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 39 "Net-(L_DEF1-Pad1)"))
    (model ${KISYS3DMOD}/LED_SMD.3dshapes/LED_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module LED_SMD:LED_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5DF893BD)
    (at 2.31648 71.68896 180)
    (descr "LED SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "LED handsolder")
    (attr smd)
    (fp_text reference L_SD1 (at -0.10922 1.60528) (layer F.SilkS))
    (fp_text value Green (at 0.0889 1.4986) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 3 +3V3))
    (pad 1 smd roundrect (at -1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 41 "Net-(L_SD1-Pad1)"))
    (model ${KISYS3DMOD}/LED_SMD.3dshapes/LED_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module LED_SMD:LED_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5DF893BD)
    (at 2.794 37.846 180)
    (descr "LED SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "LED handsolder")
    (attr smd)
    (fp_text reference L_TX1 (at -0.19558 1.651) (layer F.SilkS))
    (fp_text value Red (at 0.0889 1.4986) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 3 +3V3))
    (pad 1 smd roundrect (at -1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 113 "Net-(L_TX1-Pad1)"))
    (model ${KISYS3DMOD}/LED_SMD.3dshapes/LED_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module LED_SMD:LED_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5DF893BD)
    (at 94.19082 11.17092 90)
    (descr "LED SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "LED handsolder")
    (attr smd)
    (fp_text reference L_NDUP1 (at 0.01016 1.83896 90) (layer F.SilkS))
    (fp_text value Red (at 0.0889 1.4986 90) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0 90) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 3 +3V3))
    (pad 1 smd roundrect (at -1.025 0 90) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 109 "Net-(L_NDUP1-Pad1)"))
    (model ${KISYS3DMOD}/LED_SMD.3dshapes/LED_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module LED_SMD:LED_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5DF893BD)
    (at 91.32316 11.15568 90)
    (descr "LED SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "LED handsolder")
    (attr smd)
    (fp_text reference L_NSPD1 (at -0.06096 -1.76022 90) (layer F.SilkS))
    (fp_text value Green (at 0.0889 1.4986 90) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0 90) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 3 +3V3))
    (pad 1 smd roundrect (at -1.025 0 90) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 110 "Net-(L_NSPD1-Pad1)"))
    (model ${KISYS3DMOD}/LED_SMD.3dshapes/LED_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module LED_SMD:LED_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5DF893BD)
    (at 97.028 78.994 180)
    (descr "LED SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "LED handsolder")
    (attr smd)
    (fp_text reference L_PLED1 (at 0.00254 -1.74498) (layer F.SilkS))
    (fp_text value Green (at 0.0889 1.4986) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 111 "Net-(L_PLED1-Pad2)"))
    (pad 1 smd roundrect (at -1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 118 "Net-(L_PLED1-Pad1)"))
    (model ${KISYS3DMOD}/LED_SMD.3dshapes/LED_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Package_TO_SOT_SMD:SOT-143 (layer F.Cu) (tedit 5E1681F2)
    (at 9.96442 33.21558 180)
    (descr SOT-143)
    (tags SOT-143)
    (attr smd)
    (fp_text reference U_PRTR5 (at 0.47244 -2.16154) (layer F.SilkS))
    (fp_text value PRTR5V0U2X (at -0.1 2.05) (layer F.Fab) hide)
    (pad 4 smd rect (at 1.1 -0.95 90) (size 1 1.4) (layers F.Cu F.Paste F.Mask)
      (net 135 PWR_USB))
    (pad 3 smd rect (at 1.1 0.95 90) (size 1 1.4) (layers F.Cu F.Paste F.Mask)
      (net 173 PA24-D28-USBD-))
    (pad 2 smd rect (at -1.1 0.95 90) (size 1 1.4) (layers F.Cu F.Paste F.Mask)
      (net 172 PA25-D29-USBD+))
    (pad 1 smd rect (at -1.1 -0.77 90) (size 1.2 1.4) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (model ${KISYS3DMOD}/Package_TO_SOT_SMD.3dshapes/SOT-143.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5DE87405)
    (at 21.08962 17.09674 90)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RTBUCK1 (at 2.40284 0.127 180) (layer F.SilkS))
    (fp_text value "115K 1%" (at 0.0127 1.5367 90) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0 90) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 10 /3REG))
    (pad 1 smd roundrect (at -1.025 0 90) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 73 /FB))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5DE87405)
    (at 19.05508 21.34108 90)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RTBUCK2 (at 0.24638 -1.39192 90) (layer F.SilkS))
    (fp_text value "25.5K 1%" (at 0.0127 1.5367 90) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0 90) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 73 /FB))
    (pad 1 smd roundrect (at -1.025 0 90) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 1 GND))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5DE87405)
    (at 65.68694 60.70854 90)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RBUZG1 (at 0.1016 -1.54178 90) (layer F.SilkS))
    (fp_text value 10k (at 0.0127 1.5367 90) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0 90) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 186 PA04-D17-A3-BUZ))
    (pad 1 smd roundrect (at -1.025 0 90) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 1 GND))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5DE87405)
    (at 30.99562 36.29152)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RCLK1 (at -0.381 -1.43002) (layer F.SilkS))
    (fp_text value 10K (at 0.0127 1.5367) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 3 +3V3))
    (pad 1 smd roundrect (at -1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 102 "Net-(RCLK1-Pad1)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5DE87405)
    (at 18.9992 25.30348 90)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RTREN1 (at -0.2032 -1.37414 90) (layer F.SilkS))
    (fp_text value "100K 1%" (at 0.0127 1.5367 90) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0 90) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 103 "Net-(RTREN1-Pad2)"))
    (pad 1 smd roundrect (at -1.025 0 90) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 101 "Net-(CTI1-Pad2)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5DE87405)
    (at 5.94106 23.90902)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RUFG1 (at 0.22606 1.4605) (layer F.SilkS))
    (fp_text value 1Meg (at 0.0127 1.5367) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 62 "Net-(CUFG1-Pad1)"))
    (pad 1 smd roundrect (at -1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 1 GND))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5DE87405)
    (at 14.33576 37.00272 270)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RID1 (at -0.01016 1.40716 90) (layer F.SilkS))
    (fp_text value 100K (at 0.0127 1.5367 90) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 114 "Net-(RID1-Pad2)"))
    (pad 1 smd roundrect (at -1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 3 +3V3))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5DE87405)
    (at 16.4338 36.9824 270)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RID2 (at -0.10668 -1.45288 90) (layer F.SilkS))
    (fp_text value 330 (at 0.0127 1.5367 90) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 114 "Net-(RID1-Pad2)"))
    (pad 1 smd roundrect (at -1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 115 "Net-(RID2-Pad1)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5DE87405)
    (at 47.13986 71.06158 90)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RLCS1 (at 0.15 -1.4 90) (layer F.SilkS))
    (fp_text value 10K (at 0.0127 1.5367 90) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0 90) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 3 +3V3))
    (pad 1 smd roundrect (at -1.025 0 90) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 181 PA20-D6-TFT_CS))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5DE87405)
    (at 54.79542 65.39738)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RLED1 (at 0.09906 1.46812) (layer F.SilkS))
    (fp_text value 330 (at 0.0127 1.5367) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 39 "Net-(L_DEF1-Pad1)"))
    (pad 1 smd roundrect (at -1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 120 "Net-(RLED1-Pad1)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5DE87405)
    (at 114.75974 50.09388)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RN1 (at -2.83718 0.08382) (layer F.SilkS))
    (fp_text value 10K (at 0.0127 1.5367) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 1 GND))
    (pad 1 smd roundrect (at -1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 46 "Net-(RN1-Pad1)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5DE87405)
    (at 114.75974 52.19954)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RN2 (at -2.9337 0.0508) (layer F.SilkS))
    (fp_text value 10K (at 0.0127 1.5367) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 1 GND))
    (pad 1 smd roundrect (at -1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 47 "Net-(RN2-Pad1)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5DE87405)
    (at 114.78514 54.25948)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RN3 (at -2.91084 0.04064) (layer F.SilkS))
    (fp_text value 10K (at 0.0127 1.5367) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 1 GND))
    (pad 1 smd roundrect (at -1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 48 "Net-(RN3-Pad1)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5DE87405)
    (at 114.78514 56.33974)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RN4 (at -2.91084 0.15494) (layer F.SilkS))
    (fp_text value 10K (at 0.0127 1.5367) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 1 GND))
    (pad 1 smd roundrect (at -1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 49 "Net-(RN4-Pad1)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5DE87405)
    (at 114.80292 58.41238)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RN5 (at -2.90576 0.0127) (layer F.SilkS))
    (fp_text value 10K (at 0.0127 1.5367) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 1 GND))
    (pad 1 smd roundrect (at -1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 50 "Net-(RN5-Pad1)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5DE87405)
    (at 94.27972 58.58256)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RN6 (at -2.9464 -0.02032) (layer F.SilkS))
    (fp_text value 10K (at 0.0127 1.5367) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 106 "Net-(RN6-Pad2)"))
    (pad 1 smd roundrect (at -1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 1 GND))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5DE87405)
    (at 114.61242 47.50054)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RNAUTO1 (at 0.15 -1.4) (layer F.SilkS))
    (fp_text value 10K (at 0.0127 1.5367) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 3 +3V3))
    (pad 1 smd roundrect (at -1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 75 "Net-(RNAUTO1-Pad1)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5DE87405)
    (at 72.34682 56.02478 270)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RNCS1 (at 0.14986 -1.48082 90) (layer F.SilkS))
    (fp_text value 10K (at 0.0127 1.5367 90) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 3 +3V3))
    (pad 1 smd roundrect (at -1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 187 PA15-D5-NETCS))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5DE87405)
    (at 102.17658 39.7764 270)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RNDMPR+1 (at -0.49784 1.52146 90) (layer F.SilkS))
    (fp_text value "33 1%" (at 0.0127 1.5367 90) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 107 "Net-(RNDMPR+1-Pad2)"))
    (pad 1 smd roundrect (at -1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 18 "Net-(CNRX+1-Pad1)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5DE87405)
    (at 104.3178 39.751 270)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RNDMPR-1 (at -0.59436 -1.45034 90) (layer F.SilkS))
    (fp_text value "33 1%" (at 0.0127 1.5367 90) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 63 "Net-(RNDMPR-1-Pad2)"))
    (pad 1 smd roundrect (at -1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 21 "Net-(CNRX-1-Pad2)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5DE87405)
    (at 107.45216 41.21912 270)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RNDMPT+1 (at -4.47294 -0.14732 90) (layer F.SilkS))
    (fp_text value "33 1%" (at 0.0127 1.5367 90) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 108 "Net-(RNDMPT+1-Pad2)"))
    (pad 1 smd roundrect (at -1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 81 "Net-(J_RJ45-Pad5)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5DE87405)
    (at 109.57052 41.23436 270)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RNDMPT-1 (at -4.53644 0.01778 90) (layer F.SilkS))
    (fp_text value "33 1%" (at 0.0127 1.5367 90) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 64 "Net-(RNDMPT-1-Pad2)"))
    (pad 1 smd roundrect (at -1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 82 "Net-(J_RJ45-Pad6)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5DE87405)
    (at 114.55654 41.8592)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RNDUP1 (at 0.15 -1.4) (layer F.SilkS))
    (fp_text value 10K (at 0.0127 1.5367) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 3 +3V3))
    (pad 1 smd roundrect (at -1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 76 "Net-(RNDUP1-Pad1)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5DE87405)
    (at 94.19082 45.20184)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RNEXR1 (at 0.15 -1.4) (layer F.SilkS))
    (fp_text value "12.4K 1%" (at 0.0127 1.5367) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 51 "Net-(RNEXR1-Pad2)"))
    (pad 1 smd roundrect (at -1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 12 GNDA))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5DE87405)
    (at 115.02644 64.23152)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RNINT1 (at -0.07112 1.55194) (layer F.SilkS))
    (fp_text value 10K (at 0.0127 1.5367) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 3 +3V3))
    (pad 1 smd roundrect (at -1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 77 "Net-(RNINT1-Pad1)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5DE87405)
    (at 113.92154 34.23412 270)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RNLACT1 (at -4.05384 -0.05588 90) (layer F.SilkS))
    (fp_text value 820 (at 0.0127 1.5367 90) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 52 "Net-(RNLACT1-Pad2)"))
    (pad 1 smd roundrect (at -1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 83 "Net-(J_RJ45-Pad12)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5DE87405)
    (at 92.6973 21.57222 270)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RNLDUP1 (at 4.1021 -0.05334 90) (layer F.SilkS))
    (fp_text value 820 (at 0.0127 1.5367 90) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 53 "Net-(RNLDUP1-Pad2)"))
    (pad 1 smd roundrect (at -1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 109 "Net-(L_NDUP1-Pad1)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5DE87405)
    (at 116.18468 34.2519 270)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RNLNK1 (at -3.88366 0.01524 90) (layer F.SilkS))
    (fp_text value 820 (at 0.0127 1.5367 90) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 54 "Net-(RNLNK1-Pad2)"))
    (pad 1 smd roundrect (at -1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 80 "Net-(J_RJ45-Pad14)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5DE87405)
    (at 90.39606 21.57222 270)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RNLSPEED1 (at 4.53136 0.02032 90) (layer F.SilkS))
    (fp_text value 820 (at 0.0127 1.5367 90) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 55 "Net-(RNLSPEED1-Pad2)"))
    (pad 1 smd roundrect (at -1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 110 "Net-(L_NSPD1-Pad1)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5DE87405)
    (at 104.65308 65.4431 180)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RNQ1 (at 0.15 -1.4) (layer F.SilkS))
    (fp_text value 1Meg (at 0.0127 1.5367) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 14 "Net-(CNQ1-Pad1)"))
    (pad 1 smd roundrect (at -1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 15 "Net-(CNQ2-Pad1)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5DE87405)
    (at 104.267 35.19932)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RNRDN1 (at 0.15 -1.4) (layer F.SilkS))
    (fp_text value "49.9 1%" (at 0.0127 1.5367) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 16 "Net-(CNRD1-Pad1)"))
    (pad 1 smd roundrect (at -1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 21 "Net-(CNRX-1-Pad2)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5DE87405)
    (at 100.33762 35.07486)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RNRDP1 (at 0.15 -1.4) (layer F.SilkS))
    (fp_text value "49.9 1%" (at 0.0127 1.5367) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 18 "Net-(CNRX+1-Pad1)"))
    (pad 1 smd roundrect (at -1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 16 "Net-(CNRD1-Pad1)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5DE87405)
    (at 91.64066 68.53936 270)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RNRES1 (at 0.07112 1.50876 90) (layer F.SilkS))
    (fp_text value 10K (at 0.0127 1.5367 90) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 188 PA06-D8-NETRES))
    (pad 1 smd roundrect (at -1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 3 +3V3))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5DE87405)
    (at 114.95278 61.99886)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RNRESET1 (at 0.3556 -1.44018) (layer F.SilkS))
    (fp_text value 10K (at 0.0127 1.5367) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 3 +3V3))
    (pad 1 smd roundrect (at -1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 45 NETRST))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5DE87405)
    (at 114.57686 44.67098)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RNSPD1 (at 0.15 -1.4) (layer F.SilkS))
    (fp_text value 10K (at 0.0127 1.5367) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 3 +3V3))
    (pad 1 smd roundrect (at -1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 56 "Net-(RNSPD1-Pad1)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5DE87405)
    (at 96.21012 23.53056)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RNTCT1 (at 0.15 -1.4) (layer F.SilkS))
    (fp_text value "10 1%" (at 0.0127 1.5367) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 22 "Net-(CNTCT1-Pad2)"))
    (pad 1 smd roundrect (at -1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 3 +3V3))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5DE87405)
    (at 109.85246 31.55442)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RNTXN1 (at 0.15 -1.4) (layer F.SilkS))
    (fp_text value "49.9 1%" (at 0.0127 1.5367) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 3 +3V3))
    (pad 1 smd roundrect (at -1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 82 "Net-(J_RJ45-Pad6)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5DE87405)
    (at 105.9434 31.60268)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RNTXP1 (at 0.15 -1.4) (layer F.SilkS))
    (fp_text value "49.9 1%" (at 0.0127 1.5367) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 81 "Net-(J_RJ45-Pad5)"))
    (pad 1 smd roundrect (at -1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 3 +3V3))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5DE87405)
    (at 125.44298 66.77406 270)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RPOE2 (at 0.08382 -1.56972 90) (layer F.SilkS))
    (fp_text value "100K 1%" (at 0.0127 1.5367 90) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 23 "Net-(CPCC1-Pad2)"))
    (pad 1 smd roundrect (at -1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 25 /PV3))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5DE87405)
    (at 129.17424 40.31234)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RPCLA1 (at 0.15 -1.4) (layer F.SilkS))
    (fp_text value "124 0.1%" (at 0.0127 1.5367) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 43 /RCLASS))
    (pad 1 smd roundrect (at -1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 29 /VPORTN))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5DE87405)
    (at 137.541 69.8373)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RPFIL1 (at 0.15 -1.4) (layer F.SilkS))
    (fp_text value "10 OHM" (at 0.0127 1.5367) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 26 "Net-(CPFIL1-Pad1)"))
    (pad 1 smd roundrect (at -1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 117 "Net-(D_PDS1040-Pad2)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5DE87405)
    (at 125.44298 62.43574 270)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RPLIM1 (at 0.1143 -1.52146 90) (layer F.SilkS))
    (fp_text value "470 0.1%" (at 0.0127 1.5367 90) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 25 /PV3))
    (pad 1 smd roundrect (at -1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 70 "Net-(PS2911-Pad1)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_1206_3216Metric_Pad1.42x1.75mm_HandSolder (layer F.Cu) (tedit 5D9A98D3)
    (at 134.03834 38.99154 180)
    (descr "Resistor SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RPOE4 (at 0.05334 1.6764) (layer F.SilkS))
    (fp_text value "10 OHM 1%" (at 0 1.82) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.4875 0 180) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 28 /VPORTP))
    (pad 1 smd roundrect (at -1.4875 0 180) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 38 /PLUS))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_1206_3216Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5DE87405)
    (at 135.69188 48.90008 270)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RPOR1 (at 0.7493 -1.49098 90) (layer F.SilkS))
    (fp_text value "10K 1%" (at 0.0127 1.5367 90) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 30 /PVCC))
    (pad 1 smd roundrect (at -1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 28 /VPORTP))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5DE87405)
    (at 102.47884 74.7395 180)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RPLED1 (at 0.02286 1.43764) (layer F.SilkS))
    (fp_text value 330 (at 0.0127 1.5367) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 111 "Net-(L_PLED1-Pad2)"))
    (pad 1 smd roundrect (at -1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 25 /PV3))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5DE87405)
    (at 121.91492 52.92344 270)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RPPVC1 (at 0.03048 1.55956 90) (layer F.SilkS))
    (fp_text value "6.8K 1%" (at 0.0127 1.5367 90) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 116 "Net-(D_PBAS1-Pad1)"))
    (pad 1 smd roundrect (at -1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 30 /PVCC))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5DE87405)
    (at 121.793 44.3865 90)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RPRSL1 (at 0.09906 -1.58496 90) (layer F.SilkS))
    (fp_text value "10K 1%" (at 0.0127 1.5367 90) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0 90) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 44 /SENSE))
    (pad 1 smd roundrect (at -1.025 0 90) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 57 /SEN))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_1206_3216Metric_Pad1.42x1.75mm_HandSolder (layer F.Cu) (tedit 5D9A98D3)
    (at 124.73432 53.86324 90)
    (descr "Resistor SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RPSEN1 (at -3.14198 0.15748 180) (layer F.SilkS))
    (fp_text value "0.1 OHM 1%" (at 0 1.82 90) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.4875 0 90) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 57 /SEN))
    (pad 1 smd roundrect (at -1.4875 0 90) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 27 GNDREF))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_1206_3216Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5DE87405)
    (at 72.18172 71.13778 270)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RPWR1 (at -0.09906 -1.5367 90) (layer F.SilkS))
    (fp_text value 330 (at 0.0127 1.5367 90) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 40 "Net-(L_PWR1-Pad1)"))
    (pad 1 smd roundrect (at -1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 1 GND))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5DE87405)
    (at 15.51432 47.84344 180)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RRST1 (at -0.02794 1.39954) (layer F.SilkS))
    (fp_text value 10K (at 0.0127 1.5367) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 8 ~RESET~))
    (pad 1 smd roundrect (at -1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 3 +3V3))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5DE87405)
    (at 18.71218 42.7101 180)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RRX1 (at 0.02794 -1.4986) (layer F.SilkS))
    (fp_text value 820 (at 0.0127 1.5367) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 112 "Net-(L_RX1-Pad1)"))
    (pad 1 smd roundrect (at -1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 137 "Net-(RRX1-Pad1)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5DE87405)
    (at 47.93742 15.07236 270)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RSCL1 (at 0.17272 -1.53924 90) (layer F.SilkS))
    (fp_text value 10K (at 0.0127 1.5367 90) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 3 +3V3))
    (pad 1 smd roundrect (at -1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 68 PA23-SCL))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5DE87405)
    (at 51.62804 15.10792 270)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RSDA1 (at 0.17272 -1.48844 90) (layer F.SilkS))
    (fp_text value 10K (at 0.0127 1.5367 90) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 69 PA22-SDA))
    (pad 1 smd roundrect (at -1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 3 +3V3))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5DE87405)
    (at 16.41348 71.92264 180)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RSDET1 (at 0.00762 -1.6002) (layer F.SilkS))
    (fp_text value 10K (at 0.0127 1.5367) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 3 +3V3))
    (pad 1 smd roundrect (at -1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 170 PA05-D18-A4-SDINT))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5DE87405)
    (at 21.74102 51.8033)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RSDCS1 (at 0.15 -1.4) (layer F.SilkS))
    (fp_text value 10K (at 0.0127 1.5367) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 3 +3V3))
    (pad 1 smd roundrect (at -1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 171 PA14-D2-SDCS))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5DE87405)
    (at 9.45642 51.4604 180)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RSDD1 (at 0.00254 -1.59766) (layer F.SilkS))
    (fp_text value 10K (at 0.0127 1.5367) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 200 "Net-(J_Micro_SD1-Pad8)"))
    (pad 1 smd roundrect (at -1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 3 +3V3))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5DE87405)
    (at 11.8872 71.4121 180)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RSDD2 (at 0.08382 -1.57226) (layer F.SilkS))
    (fp_text value 10K (at 0.0127 1.5367) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 3 +3V3))
    (pad 1 smd roundrect (at -1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 199 "Net-(J_Micro_SD1-Pad1)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5DE87405)
    (at 7.68096 71.4121 180)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RSDLED1 (at 0.23622 -1.62052) (layer F.SilkS))
    (fp_text value 1K (at 0.0127 1.5367) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 41 "Net-(L_SD1-Pad1)"))
    (pad 1 smd roundrect (at -1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 171 PA14-D2-SDCS))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5DE87405)
    (at 41.10482 39.60368)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RSWCLK1 (at -0.20574 -1.45288) (layer F.SilkS))
    (fp_text value 1K (at 0.0127 1.5367) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 184 PA30-D44-SWDCLK))
    (pad 1 smd roundrect (at -1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 9 +3.3VA))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5DE87405)
    (at 50.029 40.52316 180)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RSWDRST1 (at -0.07874 1.59766) (layer F.SilkS))
    (fp_text value "39 1%" (at 0.0127 1.5367) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 8 ~RESET~))
    (pad 1 smd roundrect (at -1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 84 "Net-(JP_SWD1-Pad10)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5DE87405)
    (at 50.75682 63.68542 90)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RTR1 (at -0.03048 -1.51384 90) (layer F.SilkS))
    (fp_text value 820 (at 0.0127 1.5367 90) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0 90) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 189 PA17-D13-DEFLED))
    (pad 1 smd roundrect (at -1.025 0 90) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 1 GND))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5DE87405)
    (at 18.669 40.45458 180)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RTX1 (at -0.09652 1.41732) (layer F.SilkS))
    (fp_text value 820 (at 0.0127 1.5367) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 113 "Net-(L_TX1-Pad1)"))
    (pad 1 smd roundrect (at -1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 190 PA27-D26-LTX))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Package_QFP:TQFP-48_7x7mm_P0.5mm (layer F.Cu) (tedit 5DC67DCD)
    (at 103.5177 52.92852 270)
    (descr "48 LEAD TQFP 7x7mm (see MICREL TQFP7x7-48LD-PL-1.pdf)")
    (tags "QFP 0.5")
    (attr smd)
    (fp_text reference U_W5500 (at 0 -5.8 90) (layer F.SilkS))
    (fp_text value W5500 (at 0 5.8 90) (layer F.Fab) hide)
    (pad 48 smd rect (at -2.75 -4.35) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 12 GNDA))
    (pad 47 smd rect (at -2.25 -4.35) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 93 "Net-(U_W5500-Pad47)"))
    (pad 46 smd rect (at -1.75 -4.35) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 94 "Net-(U_W5500-Pad46)"))
    (pad 45 smd rect (at -1.25 -4.35) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 76 "Net-(RNDUP1-Pad1)"))
    (pad 44 smd rect (at -0.75 -4.35) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 56 "Net-(RNSPD1-Pad1)"))
    (pad 43 smd rect (at -0.25 -4.35) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 75 "Net-(RNAUTO1-Pad1)"))
    (pad 42 smd rect (at 0.25 -4.35) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 46 "Net-(RN1-Pad1)"))
    (pad 41 smd rect (at 0.75 -4.35) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 47 "Net-(RN2-Pad1)"))
    (pad 40 smd rect (at 1.25 -4.35) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 48 "Net-(RN3-Pad1)"))
    (pad 39 smd rect (at 1.75 -4.35) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 49 "Net-(RN4-Pad1)"))
    (pad 38 smd rect (at 2.25 -4.35) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 50 "Net-(RN5-Pad1)"))
    (pad 37 smd rect (at 2.75 -4.35) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 45 NETRST))
    (pad 36 smd rect (at 4.35 -2.75 270) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 77 "Net-(RNINT1-Pad1)"))
    (pad 35 smd rect (at 4.35 -2.25 270) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 59 PB10-MOSI))
    (pad 34 smd rect (at 4.35 -1.75 270) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 5 NET-MISO))
    (pad 33 smd rect (at 4.35 -1.25 270) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 58 PB11-SCK))
    (pad 32 smd rect (at 4.35 -0.75 270) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 187 PA15-D5-NETCS))
    (pad 31 smd rect (at 4.35 -0.25 270) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 15 "Net-(CNQ2-Pad1)"))
    (pad 30 smd rect (at 4.35 0.25 270) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 14 "Net-(CNQ1-Pad1)"))
    (pad 29 smd rect (at 4.35 0.75 270) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 28 smd rect (at 4.35 1.25 270) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 3 +3V3))
    (pad 27 smd rect (at 4.35 1.75 270) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 52 "Net-(RNLACT1-Pad2)"))
    (pad 26 smd rect (at 4.35 2.25 270) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 53 "Net-(RNLDUP1-Pad2)"))
    (pad 25 smd rect (at 4.35 2.75 270) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 54 "Net-(RNLNK1-Pad2)"))
    (pad 24 smd rect (at 2.75 4.35) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 55 "Net-(RNLSPEED1-Pad2)"))
    (pad 23 smd rect (at 2.25 4.35) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 106 "Net-(RN6-Pad2)"))
    (pad 22 smd rect (at 1.75 4.35) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 13 "Net-(CN22-Pad2)"))
    (pad 21 smd rect (at 1.25 4.35) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 11 +3.3VP))
    (pad 20 smd rect (at 0.75 4.35) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 105 "Net-(CN20-Pad2)"))
    (pad 19 smd rect (at 0.25 4.35) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 12 GNDA))
    (pad 18 smd rect (at -0.25 4.35) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 95 "Net-(U_W5500-Pad18)"))
    (pad 17 smd rect (at -0.75 4.35) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 11 +3.3VP))
    (pad 16 smd rect (at -1.25 4.35) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 12 GNDA))
    (pad 15 smd rect (at -1.75 4.35) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 11 +3.3VP))
    (pad 14 smd rect (at -2.25 4.35) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 12 GNDA))
    (pad 13 smd rect (at -2.75 4.35) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 96 "Net-(U_W5500-Pad13)"))
    (pad 12 smd rect (at -4.35 2.75 270) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 97 "Net-(U_W5500-Pad12)"))
    (pad 11 smd rect (at -4.35 2.25 270) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 11 +3.3VP))
    (pad 10 smd rect (at -4.35 1.75 270) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 51 "Net-(RNEXR1-Pad2)"))
    (pad 9 smd rect (at -4.35 1.25 270) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 12 GNDA))
    (pad 8 smd rect (at -4.35 0.75 270) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 11 +3.3VP))
    (pad 7 smd rect (at -4.35 0.25 270) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 98 "Net-(U_W5500-Pad7)"))
    (pad 6 smd rect (at -4.35 -0.25 270) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 107 "Net-(RNDMPR+1-Pad2)"))
    (pad 5 smd rect (at -4.35 -0.75 270) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 63 "Net-(RNDMPR-1-Pad2)"))
    (pad 4 smd rect (at -4.35 -1.25 270) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 11 +3.3VP))
    (pad 3 smd rect (at -4.35 -1.75 270) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 12 GNDA))
    (pad 2 smd rect (at -4.35 -2.25 270) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 108 "Net-(RNDMPT+1-Pad2)"))
    (pad 1 smd rect (at -4.35 -2.75 270) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 64 "Net-(RNDMPT-1-Pad2)"))
    (model ${KISYS3DMOD}/Package_QFP.3dshapes/TQFP-48_7x7mm_P0.5mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Crystal:Crystal_SMD_MicroCrystal_CC7V-T1A-2Pin_3.2x1.5mm (layer F.Cu) (tedit 5DE87E8E)
    (at 60.58408 34.35858)
    (descr "SMD Crystal MicroCrystal CC7V-T1A/CM7V-T1A series http://www.microcrystal.com/images/_Product-Documentation/01_TF_ceramic_Packages/01_Datasheet/CC1V-T1A.pdf, 3.2x1.5mm^2 package")
    (tags "SMD SMT crystal")
    (attr smd)
    (fp_text reference Q32 (at 0 -1.75) (layer F.SilkS))
    (fp_text value "32.768KHz 12.5pf" (at 0 1.95) (layer F.Fab) hide)
    (pad 2 smd rect (at 1.25 0) (size 1 1.8) (layers F.Cu F.Paste F.Mask)
      (net 99 "Net-(CQ1-Pad1)"))
    (pad 1 smd rect (at -1.25 0) (size 1 1.8) (layers F.Cu F.Paste F.Mask)
      (net 100 "Net-(CQ2-Pad2)"))
    (model ${KISYS3DMOD}/Crystal.3dshapes/Crystal_SMD_MicroCrystal_CC7V-T1A-2Pin_3.2x1.5mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Jumper:SolderJumper-2_P1.3mm_Open_Pad1.0x1.5mm (layer B.Cu) (tedit 5DC4ACA6)
    (at 115.96624 47.31258)
    (descr "SMD Solder Jumper, 1x1.5mm Pads, 0.3mm gap, open")
    (tags "solder jumper open")
    (attr virtual)
    (fp_text reference SP_AUTO1 (at 0.05588 -1.58242) (layer B.SilkS))
    (fp_text value S_AUTO (at 0 -1.5) (layer B.Fab) hide)
    (pad 1 smd rect (at -0.65 0) (size 1 1.5) (layers B.Cu B.Mask)
      (net 75 "Net-(RNAUTO1-Pad1)"))
    (pad 2 smd rect (at 0.65 0) (size 1 1.5) (layers B.Cu B.Mask)
      (net 1 GND))
  )
  (module Jumper:SolderJumper-2_P1.3mm_Open_Pad1.0x1.5mm (layer B.Cu) (tedit 5DC4ACA6)
    (at 116.05514 40.19296)
    (descr "SMD Solder Jumper, 1x1.5mm Pads, 0.3mm gap, open")
    (tags "solder jumper open")
    (attr virtual)
    (fp_text reference SP_DUPLEX1 (at 0.03556 -1.57226) (layer B.SilkS))
    (fp_text value S_DUPLEX (at 0 -1.5) (layer B.Fab) hide)
    (pad 1 smd rect (at -0.65 0) (size 1 1.5) (layers B.Cu B.Mask)
      (net 76 "Net-(RNDUP1-Pad1)"))
    (pad 2 smd rect (at 0.65 0) (size 1 1.5) (layers B.Cu B.Mask)
      (net 1 GND))
  )
  (module Jumper:SolderJumper-2_P1.3mm_Open_Pad1.0x1.5mm (layer B.Cu) (tedit 5DC4ACA6)
    (at 48.2346 50.67554)
    (descr "SMD Solder Jumper, 1x1.5mm Pads, 0.3mm gap, open")
    (tags "solder jumper open")
    (attr virtual)
    (fp_text reference SP_GSWD1 (at 0.02286 -1.46304) (layer B.SilkS))
    (fp_text value S_SWD (at 0 -1.5) (layer B.Fab) hide)
    (pad 1 smd rect (at -0.65 0) (size 1 1.5) (layers B.Cu B.Mask)
      (net 1 GND))
    (pad 2 smd rect (at 0.65 0) (size 1 1.5) (layers B.Cu B.Mask)
      (net 85 "Net-(JP_SWD1-Pad9)"))
  )
  (module Jumper:SolderJumper-2_P1.3mm_Open_Pad1.0x1.5mm (layer B.Cu) (tedit 5DC4ACA6)
    (at 12.49934 74.60488)
    (descr "SMD Solder Jumper, 1x1.5mm Pads, 0.3mm gap, open")
    (tags "solder jumper open")
    (attr virtual)
    (fp_text reference SP_H1 (at 0.04826 -1.6637) (layer B.SilkS))
    (fp_text value S_H1 (at 0 -1.5) (layer B.Fab) hide)
    (pad 1 smd rect (at -0.65 0) (size 1 1.5) (layers B.Cu B.Mask)
      (net 32 "Net-(H1-Pad1)"))
    (pad 2 smd rect (at 0.65 0) (size 1 1.5) (layers B.Cu B.Mask)
      (net 1 GND))
  )
  (module Jumper:SolderJumper-2_P1.3mm_Open_Pad1.0x1.5mm (layer B.Cu) (tedit 5DC4ACA6)
    (at 3.63728 11.75004)
    (descr "SMD Solder Jumper, 1x1.5mm Pads, 0.3mm gap, open")
    (tags "solder jumper open")
    (attr virtual)
    (fp_text reference SP_H2 (at 0.0889 -1.57988) (layer B.SilkS))
    (fp_text value S_H2 (at 0 -1.5) (layer B.Fab) hide)
    (pad 1 smd rect (at -0.65 0) (size 1 1.5) (layers B.Cu B.Mask)
      (net 33 "Net-(H2-Pad1)"))
    (pad 2 smd rect (at 0.65 0) (size 1 1.5) (layers B.Cu B.Mask)
      (net 1 GND))
  )
  (module Jumper:SolderJumper-2_P1.3mm_Open_Pad1.0x1.5mm (layer B.Cu) (tedit 5DC4ACA6)
    (at 20.77212 36.87572 180)
    (descr "SMD Solder Jumper, 1x1.5mm Pads, 0.3mm gap, open")
    (tags "solder jumper open")
    (attr virtual)
    (fp_text reference SP_PA28 (at -0.11708 1.68656) (layer B.SilkS))
    (fp_text value S_PA28* (at 0 -1.5) (layer B.Fab) hide)
    (pad 1 smd rect (at -0.65 0 180) (size 1 1.5) (layers B.Cu B.Mask)
      (net 195 PA28-D27-USBENA))
    (pad 2 smd rect (at 0.65 0 180) (size 1 1.5) (layers B.Cu B.Mask)
      (net 115 "Net-(RID2-Pad1)"))
  )
  (module Jumper:SolderJumper-2_P1.3mm_Open_Pad1.0x1.5mm (layer B.Cu) (tedit 5DC4ACA6)
    (at 101.092 4.318 180)
    (descr "SMD Solder Jumper, 1x1.5mm Pads, 0.3mm gap, open")
    (tags "solder jumper open")
    (attr virtual)
    (fp_text reference SP_POEN1 (at 0.0127 1.63068) (layer B.SilkS))
    (fp_text value S_POEN (at 0 -1.5) (layer B.Fab) hide)
    (pad 1 smd rect (at -0.65 0 180) (size 1 1.5) (layers B.Cu B.Mask)
      (net 36 /NN))
    (pad 2 smd rect (at 0.65 0 180) (size 1 1.5) (layers B.Cu B.Mask)
      (net 29 /VPORTN))
  )
  (module Jumper:SolderJumper-2_P1.3mm_Open_Pad1.0x1.5mm (layer B.Cu) (tedit 5DC4ACA6)
    (at 95.758 4.318)
    (descr "SMD Solder Jumper, 1x1.5mm Pads, 0.3mm gap, open")
    (tags "solder jumper open")
    (attr virtual)
    (fp_text reference SP_POEP1 (at -0.06096 -1.6256) (layer B.SilkS))
    (fp_text value S_POEP (at 0 -1.5) (layer B.Fab) hide)
    (pad 1 smd rect (at -0.65 0) (size 1 1.5) (layers B.Cu B.Mask)
      (net 37 /PP))
    (pad 2 smd rect (at 0.65 0) (size 1 1.5) (layers B.Cu B.Mask)
      (net 38 /PLUS))
  )
  (module Jumper:SolderJumper-2_P1.3mm_Open_Pad1.0x1.5mm (layer B.Cu) (tedit 5DC4ACA6)
    (at 116.03736 43.77944)
    (descr "SMD Solder Jumper, 1x1.5mm Pads, 0.3mm gap, open")
    (tags "solder jumper open")
    (attr virtual)
    (fp_text reference SP_SPEED1 (at 0.17018 -1.58242) (layer B.SilkS))
    (fp_text value S_SPEED (at 0 -1.5) (layer B.Fab) hide)
    (pad 1 smd rect (at -0.65 0) (size 1 1.5) (layers B.Cu B.Mask)
      (net 56 "Net-(RNSPD1-Pad1)"))
    (pad 2 smd rect (at 0.65 0) (size 1 1.5) (layers B.Cu B.Mask)
      (net 1 GND))
  )
  (module Jumper:SolderJumper-2_P1.3mm_Open_Pad1.0x1.5mm (layer B.Cu) (tedit 5DC4ACA6)
    (at 8.68426 37.2745 180)
    (descr "SMD Solder Jumper, 1x1.5mm Pads, 0.3mm gap, open")
    (tags "solder jumper open")
    (attr virtual)
    (fp_text reference SP_UID1 (at -0.03302 1.66624) (layer B.SilkS))
    (fp_text value S_UID (at 0 -1.5) (layer B.Fab) hide)
    (pad 1 smd rect (at -0.65 0 180) (size 1 1.5) (layers B.Cu B.Mask)
      (net 114 "Net-(RID1-Pad2)"))
    (pad 2 smd rect (at 0.65 0 180) (size 1 1.5) (layers B.Cu B.Mask)
      (net 78 "Net-(J_USB1-Pad4)"))
  )
  (module Capacitor_Tantalum_SMD:CP_EIA-3216-18_Kemet-A_Pad1.58x1.35mm_HandSolder (layer F.Cu) (tedit 5DE8753E)
    (at 91.65844 63.27394 270)
    (descr "Tantalum Capacitor SMD Kemet-A (3216-18 Metric), IPC_7351 nominal, (Body size from: http://www.kemet.com/Lists/ProductCatalog/Attachments/253/KEM_TC101_STD.pdf), generated with kicad-footprint-generator")
    (tags "capacitor tantalum")
    (attr smd)
    (fp_text reference CNV28A1 (at -0.19304 1.58242 90) (layer F.SilkS))
    (fp_text value "10uf TANT" (at 0 1.75 90) (layer F.Fab) hide)
    (fp_text user %R (at 0 0 90) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.4375 0 270) (size 1.575 1.35) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.185185)
      (net 1 GND))
    (pad 1 smd roundrect (at -1.4375 0 270) (size 1.575 1.35) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.185185)
      (net 3 +3V3))
    (model ${KISYS3DMOD}/Capacitor_Tantalum_SMD.3dshapes/CP_EIA-3216-18_Kemet-A.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_Tantalum_SMD:CP_EIA-3216-18_Kemet-A_Pad1.58x1.35mm_HandSolder (layer F.Cu) (tedit 5DE8753E)
    (at 94.98584 41.0972 180)
    (descr "Tantalum Capacitor SMD Kemet-A (3216-18 Metric), IPC_7351 nominal, (Body size from: http://www.kemet.com/Lists/ProductCatalog/Attachments/253/KEM_TC101_STD.pdf), generated with kicad-footprint-generator")
    (tags "capacitor tantalum")
    (attr smd)
    (fp_text reference CNW6 (at 1.1557 1.50622) (layer F.SilkS))
    (fp_text value "10uf TANT" (at 0 1.75) (layer F.Fab) hide)
    (fp_text user %R (at 0 0) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.4375 0 180) (size 1.575 1.35) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.185185)
      (net 12 GNDA))
    (pad 1 smd roundrect (at -1.4375 0 180) (size 1.575 1.35) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.185185)
      (net 11 +3.3VP))
    (model ${KISYS3DMOD}/Capacitor_Tantalum_SMD.3dshapes/CP_EIA-3216-18_Kemet-A.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_Tantalum_SMD:CP_EIA-3216-18_Kemet-A_Pad1.58x1.35mm_HandSolder (layer F.Cu) (tedit 5DE8753E)
    (at 15.43304 52.00396)
    (descr "Tantalum Capacitor SMD Kemet-A (3216-18 Metric), IPC_7351 nominal, (Body size from: http://www.kemet.com/Lists/ProductCatalog/Attachments/253/KEM_TC101_STD.pdf), generated with kicad-footprint-generator")
    (tags "capacitor tantalum")
    (attr smd)
    (fp_text reference CSD1 (at 0.06858 -1.44018) (layer F.SilkS))
    (fp_text value "10uf TANT" (at 0 1.75) (layer F.Fab) hide)
    (fp_text user %R (at 0 0) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.4375 0) (size 1.575 1.35) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.185185)
      (net 1 GND))
    (pad 1 smd roundrect (at -1.4375 0) (size 1.575 1.35) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.185185)
      (net 3 +3V3))
    (model ${KISYS3DMOD}/Capacitor_Tantalum_SMD.3dshapes/CP_EIA-3216-18_Kemet-A.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_Tantalum_SMD:CP_EIA-3216-18_Kemet-A_Pad1.58x1.35mm_HandSolder (layer F.Cu) (tedit 5DE8753E)
    (at 22.45868 72.04202)
    (descr "Tantalum Capacitor SMD Kemet-A (3216-18 Metric), IPC_7351 nominal, (Body size from: http://www.kemet.com/Lists/ProductCatalog/Attachments/253/KEM_TC101_STD.pdf), generated with kicad-footprint-generator")
    (tags "capacitor tantalum")
    (attr smd)
    (fp_text reference CSDET1 (at 0.09652 1.5113) (layer F.SilkS))
    (fp_text value "10uf TANT" (at 0 1.75) (layer F.Fab) hide)
    (fp_text user %R (at 0 0) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.4375 0) (size 1.575 1.35) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.185185)
      (net 1 GND))
    (pad 1 smd roundrect (at -1.4375 0) (size 1.575 1.35) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.185185)
      (net 170 PA05-D18-A4-SDINT))
    (model ${KISYS3DMOD}/Capacitor_Tantalum_SMD.3dshapes/CP_EIA-3216-18_Kemet-A.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5DE87405)
    (at 44.7421 67.45732)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RLRES1 (at 0.04064 -1.48844) (layer F.SilkS))
    (fp_text value 10K (at 0.0127 1.5367) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 3 +3V3))
    (pad 1 smd roundrect (at -1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 182 PA21-D7-TFT_RESET))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Jumper:SolderJumper-2_P1.3mm_Open_Pad1.0x1.5mm (layer B.Cu) (tedit 5DC4ACA6)
    (at 52.90566 58.55716 180)
    (descr "SMD Solder Jumper, 1x1.5mm Pads, 0.3mm gap, open")
    (tags "solder jumper open")
    (attr virtual)
    (fp_text reference SP_NEO1 (at 0.06604 1.67386) (layer B.SilkS))
    (fp_text value S_NEO (at 0 -1.5) (layer B.Fab) hide)
    (pad 1 smd rect (at -0.65 0 180) (size 1 1.5) (layers B.Cu B.Mask)
      (net 150 "Net-(L_NEO_PIXEL1-Pad4)"))
    (pad 2 smd rect (at 0.65 0 180) (size 1 1.5) (layers B.Cu B.Mask)
      (net 184 PA30-D44-SWDCLK))
  )
  (module Jumper:SolderJumper-2_P1.3mm_Open_Pad1.0x1.5mm (layer B.Cu) (tedit 5DC4ACA6)
    (at 66.08572 35.30854)
    (descr "SMD Solder Jumper, 1x1.5mm Pads, 0.3mm gap, open")
    (tags "solder jumper open")
    (attr virtual)
    (fp_text reference SP_AREF1 (at -0.04064 -1.56972 180) (layer B.SilkS))
    (fp_text value S_AREF (at 0 -1.5) (layer B.Fab) hide)
    (pad 1 smd rect (at -0.65 0) (size 1 1.5) (layers B.Cu B.Mask)
      (net 169 PA03-D42-AREF))
    (pad 2 smd rect (at 0.65 0) (size 1 1.5) (layers B.Cu B.Mask)
      (net 3 +3V3))
  )
  (module Connector_PinHeader_2.54mm:PinHeader_1x02_P2.54mm_Vertical (layer F.Cu) (tedit 5DE9DDEC)
    (at 8.86714 45.17898 180)
    (descr "Through hole straight pin header, 1x02, 2.54mm pitch, single row")
    (tags "Through hole pin header THT 1x02 2.54mm single row")
    (fp_text reference JP_RST1 (at -0.02794 4.40436) (layer F.SilkS))
    (fp_text value Conn_01x02 (at 0 4.3815) (layer F.Fab))
    (pad 2 thru_hole oval (at 0 2.54 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 1 thru_hole rect (at 0 0 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 8 ~RESET~))
    (model ${KISYS3DMOD}/Connector_PinHeader_2.54mm.3dshapes/PinHeader_1x02_P2.54mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Jumper:SolderJumper-2_P1.3mm_Open_Pad1.0x1.5mm (layer B.Cu) (tedit 5DC4ACA6)
    (at 88.63584 11.21918)
    (descr "SMD Solder Jumper, 1x1.5mm Pads, 0.3mm gap, open")
    (tags "solder jumper open")
    (attr virtual)
    (fp_text reference SP_H3 (at 0.0023 -1.69672) (layer B.SilkS))
    (fp_text value S_H3 (at 0 -1.5) (layer B.Fab) hide)
    (pad 1 smd rect (at -0.65 0) (size 1 1.5) (layers B.Cu B.Mask)
      (net 34 "Net-(H3-Pad1)"))
    (pad 2 smd rect (at 0.65 0) (size 1 1.5) (layers B.Cu B.Mask)
      (net 1 GND))
  )
  (module Jumper:SolderJumper-2_P1.3mm_Open_Pad1.0x1.5mm (layer B.Cu) (tedit 5DC4ACA6)
    (at 102.28072 77.7494)
    (descr "SMD Solder Jumper, 1x1.5mm Pads, 0.3mm gap, open")
    (tags "solder jumper open")
    (attr virtual)
    (fp_text reference SP_H4 (at -0.04826 -1.54432) (layer B.SilkS))
    (fp_text value S_H4 (at 0 -1.5) (layer B.Fab) hide)
    (pad 1 smd rect (at -0.65 0) (size 1 1.5) (layers B.Cu B.Mask)
      (net 35 "Net-(H4-Pad1)"))
    (pad 2 smd rect (at 0.65 0) (size 1 1.5) (layers B.Cu B.Mask)
      (net 1 GND))
  )
  (module Package_SO:SO-8_5.3x6.2mm_P1.27mm (layer F.Cu) (tedit 5DF7180D)
    (at 37.338 17.272)
    (descr "8-Lead Plastic Small Outline, 5.3x6.2mm Body (http://www.ti.com.cn/cn/lit/ds/symlink/tl7705a.pdf)")
    (tags "SOIC 1.27")
    (attr smd)
    (fp_text reference U_FLASH1 (at -0.22352 -3.8989) (layer F.SilkS))
    (fp_text value GD25Q16C (at 0.1905 3.7211) (layer F.Fab) hide)
    (fp_text user %R (at 0 0) (layer F.Fab) hide)
    (pad 8 smd rect (at 3.7 -1.905) (size 1.75 0.55) (layers F.Cu F.Paste F.Mask)
      (net 3 +3V3))
    (pad 7 smd rect (at 3.7 -0.635) (size 1.75 0.55) (layers F.Cu F.Paste F.Mask)
      (net 3 +3V3))
    (pad 6 smd rect (at 3.7 0.635) (size 1.75 0.55) (layers F.Cu F.Paste F.Mask)
      (net 156 FLSCK))
    (pad 5 smd rect (at 3.7 1.905) (size 1.75 0.55) (layers F.Cu F.Paste F.Mask)
      (net 157 FLMOSI))
    (pad 4 smd rect (at -3.7 1.905) (size 1.75 0.55) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 3 smd rect (at -3.7 0.635) (size 1.75 0.55) (layers F.Cu F.Paste F.Mask)
      (net 3 +3V3))
    (pad 2 smd rect (at -3.7 -0.635) (size 1.75 0.55) (layers F.Cu F.Paste F.Mask)
      (net 158 FLMISO))
    (pad 1 smd rect (at -3.7 -1.905) (size 1.75 0.55) (layers F.Cu F.Paste F.Mask)
      (net 155 FLCS))
    (model ${KISYS3DMOD}/Package_SO.3dshapes/SO-8_5.3x6.2mm_P1.27mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5DE8741E)
    (at 37.5285 21.72208 180)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference CFL1 (at 0.03048 -1.55702) (layer F.SilkS))
    (fp_text value 0.1uf (at -0.0127 1.5367) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 1 GND))
    (pad 1 smd roundrect (at -1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 3 +3V3))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Connector_PinHeader_2.54mm:PinHeader_1x02_P2.54mm_Vertical (layer F.Cu) (tedit 5DE9DDEC)
    (at 7.9248 11.9888 90)
    (descr "Through hole straight pin header, 1x02, 2.54mm pitch, single row")
    (tags "Through hole pin header THT 1x02 2.54mm single row")
    (fp_text reference JP_PMONITOR1 (at 1.8542 0.8128) (layer F.SilkS))
    (fp_text value Conn_01x02 (at 1.8669 0.635) (layer F.Fab) hide)
    (pad 2 thru_hole oval (at 0 2.54 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 3 +3V3))
    (pad 1 thru_hole rect (at 0 0 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 198 "Net-(JP_PMONITOR1-Pad1)"))
    (model ${KISYS3DMOD}/Connector_PinHeader_2.54mm.3dshapes/PinHeader_1x02_P2.54mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Jumper:SolderJumper-2_P1.3mm_Open_Pad1.0x1.5mm (layer B.Cu) (tedit 5DC4ACA6)
    (at 96.9391 74.8665 180)
    (descr "SMD Solder Jumper, 1x1.5mm Pads, 0.3mm gap, open")
    (tags "solder jumper open")
    (attr virtual)
    (fp_text reference SP_POELED1 (at 0.03556 1.74498) (layer B.SilkS))
    (fp_text value S_ENBUZ (at 0 -1.5) (layer B.Fab) hide)
    (pad 1 smd rect (at -0.65 0 180) (size 1 1.5) (layers B.Cu B.Mask)
      (net 118 "Net-(L_PLED1-Pad1)"))
    (pad 2 smd rect (at 0.65 0 180) (size 1 1.5) (layers B.Cu B.Mask)
      (net 1 GND))
  )
  (module Connector_PinSocket_2.54mm:PinSocket_2x02_P2.54mm_Vertical locked (layer B.Cu) (tedit 5E0D0D14)
    (at 52.07 7.62 270)
    (descr "Through hole straight socket strip, 2x02, 2.54mm pitch, double cols (from Kicad 4.0.7), script generated")
    (tags "Through hole socket strip THT 2x02 2.54mm double row")
    (fp_text reference JP_I2C1 (at -6.39064 -0.99568 180) (layer B.SilkS))
    (fp_text value Conn_02x02_Odd_Even (at -1.20904 -4.81076 90) (layer B.Fab) hide)
    (fp_text user %R (at -1.27 -1.27 180) (layer B.Fab) hide)
    (pad 4 thru_hole oval (at -2.54 -2.54 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 3 thru_hole oval (at 0 -2.54 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 3 +3V3))
    (pad 2 thru_hole oval (at -2.54 0 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 68 PA23-SCL))
    (pad 1 thru_hole rect (at 0 0 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 69 PA22-SDA))
    (model ${KISYS3DMOD}/Connector_PinSocket_2.54mm.3dshapes/PinSocket_2x02_P2.54mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5DE87405)
    (at 44.45762 14.21384)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RFLCS1 (at 0.42164 1.50368) (layer F.SilkS))
    (fp_text value 100K (at 0.0127 1.5367) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 3 +3V3))
    (pad 1 smd roundrect (at -1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 155 FLCS))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Jumper:SolderJumper-3_P1.3mm_Open_Pad1.0x1.5mm (layer B.Cu) (tedit 5DC6F7FA)
    (at 36.99002 21.4249 180)
    (descr "SMD Solder 3-pad Jumper, 1x1.5mm Pads, 0.3mm gap, open")
    (tags "solder jumper open")
    (attr virtual)
    (fp_text reference SP_FL_SO1 (at -0.02286 1.74498) (layer B.SilkS))
    (fp_text value S_FL_SO (at 0.0508 -2.1463) (layer B.Fab) hide)
    (pad 1 smd rect (at -1.3 0 180) (size 1 1.5) (layers B.Cu B.Mask)
      (net 4 PA12-MISO))
    (pad 2 smd rect (at 0 0 180) (size 1 1.5) (layers B.Cu B.Mask)
      (net 158 FLMISO))
    (pad 3 smd rect (at 1.3 0 180) (size 1 1.5) (layers B.Cu B.Mask)
      (net 194 PB03-D25-LRX-FLSO))
  )
  (module Jumper:SolderJumper-2_P1.3mm_Open_Pad1.0x1.5mm (layer B.Cu) (tedit 5DC4ACA6)
    (at 73.025 69.9897)
    (descr "SMD Solder Jumper, 1x1.5mm Pads, 0.3mm gap, open")
    (tags "solder jumper open")
    (attr virtual)
    (fp_text reference SP_PWRLED1 (at 0.05842 -1.56464) (layer B.SilkS))
    (fp_text value S_PWRLED (at 0 -1.5) (layer B.Fab) hide)
    (pad 1 smd rect (at -0.65 0) (size 1 1.5) (layers B.Cu B.Mask)
      (net 122 "Net-(L_PWR1-Pad2)"))
    (pad 2 smd rect (at 0.65 0) (size 1 1.5) (layers B.Cu B.Mask)
      (net 3 +3V3))
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5DE8741E)
    (at 83.1596 20.574 270)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference CADS1 (at 0.0127 -1.4351 90) (layer F.SilkS))
    (fp_text value 0.1uf (at -0.0127 1.5367 90) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 126 ADSVV))
    (pad 1 smd roundrect (at -1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 125 ADSGD))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5DE8741E)
    (at 74.60488 14.9733 90)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference CPREADS1 (at 0.06096 -1.48844 90) (layer F.SilkS))
    (fp_text value 1uf (at -0.0127 1.5367 90) (layer F.Fab) hide)
    (pad 1 smd roundrect (at -1.025 0 90) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 3 +3V3))
    (pad 2 smd roundrect (at 1.025 0 90) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 1 GND))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5DE87405)
    (at 80.81772 14.48054 90)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference F_GADS1 (at 0.15 -1.4 90) (layer F.SilkS))
    (fp_text value "120 ohm Ferrite" (at 0.0127 1.5367 90) (layer F.Fab))
    (pad 1 smd roundrect (at -1.025 0 90) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 125 ADSGD))
    (pad 2 smd roundrect (at 1.025 0 90) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 1 GND))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5DE87405)
    (at 74.60488 21.26488 270)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference F_VADS1 (at -0.05588 1.5113 90) (layer F.SilkS))
    (fp_text value "120 ohm Ferrite" (at 0.0127 1.5367 90) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 126 ADSVV))
    (pad 1 smd roundrect (at -1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 3 +3V3))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5DE87405)
    (at 82.65668 23.85314 180)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RADDR1 (at -3.84302 -0.00508) (layer F.SilkS))
    (fp_text value 10K (at 0.0127 1.5367) (layer F.Fab))
    (pad 1 smd roundrect (at -1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 1 GND))
    (pad 2 smd roundrect (at 1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 153 "Net-(RADDR1-Pad2)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5DE87405)
    (at 83.03514 14.59992 270)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RADALR1 (at -0.02032 -1.56972 90) (layer F.SilkS))
    (fp_text value 10K (at 0.0127 1.5367 90) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 133 "Net-(RADALR1-Pad2)"))
    (pad 1 smd roundrect (at -1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 126 ADSVV))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Jumper:SolderJumper-3_P1.3mm_Open_Pad1.0x1.5mm (layer B.Cu) (tedit 5DC6F7FA)
    (at 37.44976 13.68806 180)
    (descr "SMD Solder 3-pad Jumper, 1x1.5mm Pads, 0.3mm gap, open")
    (tags "solder jumper open")
    (attr virtual)
    (fp_text reference SP_FL_SCLK1 (at 0.0254 1.81864) (layer B.SilkS))
    (fp_text value S_FL_CLK (at 0.0508 -2.1463) (layer B.Fab) hide)
    (pad 3 smd rect (at 1.3 0 180) (size 1 1.5) (layers B.Cu B.Mask)
      (net 192 PB23-D31-FLSCLK))
    (pad 2 smd rect (at 0 0 180) (size 1 1.5) (layers B.Cu B.Mask)
      (net 156 FLSCK))
    (pad 1 smd rect (at -1.3 0 180) (size 1 1.5) (layers B.Cu B.Mask)
      (net 58 PB11-SCK))
  )
  (module Jumper:SolderJumper-3_P1.3mm_Open_Pad1.0x1.5mm (layer B.Cu) (tedit 5DC6F7FA)
    (at 45.16374 18.72234 180)
    (descr "SMD Solder 3-pad Jumper, 1x1.5mm Pads, 0.3mm gap, open")
    (tags "solder jumper open")
    (attr virtual)
    (fp_text reference SP_FL_SI1 (at -0.03302 1.75768) (layer B.SilkS))
    (fp_text value S_FL_SI (at 0.0508 -2.1463) (layer B.Fab) hide)
    (pad 1 smd rect (at -1.3 0 180) (size 1 1.5) (layers B.Cu B.Mask)
      (net 59 PB10-MOSI))
    (pad 2 smd rect (at 0 0 180) (size 1 1.5) (layers B.Cu B.Mask)
      (net 157 FLMOSI))
    (pad 3 smd rect (at 1.3 0 180) (size 1 1.5) (layers B.Cu B.Mask)
      (net 193 PB22-D30-FLSI))
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5DE87405)
    (at 75.55992 71.04126 270)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RBUZV1 (at 0.15 -1.4 90) (layer F.SilkS))
    (fp_text value 22 (at 0.0127 1.5367 90) (layer F.Fab))
    (pad 1 smd roundrect (at -1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 72 "Net-(BUZZER1-Pad2)"))
    (pad 2 smd roundrect (at 1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 132 "Net-(RBUZV1-Pad2)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Package_TO_SOT_SMD:SOT-23-5_HandSoldering (layer F.Cu) (tedit 5E23FD13)
    (at 20.65782 55.59806)
    (descr "5-pin SOT23 package")
    (tags "SOT-23-5 hand-soldering")
    (attr smd)
    (fp_text reference U_74LVC1G1-LMISO1 (at 1.46812 -2.16154) (layer F.SilkS))
    (fp_text value SN74LVC1G125DBVR (at 0 2.9) (layer F.Fab) hide)
    (fp_text user %R (at 0 0 90) (layer F.Fab) hide)
    (pad 1 smd rect (at -1.35 -0.95) (size 1.56 0.6) (layers F.Cu F.Paste F.Mask)
      (net 171 PA14-D2-SDCS))
    (pad 2 smd rect (at -1.35 0) (size 1.56 0.6) (layers F.Cu F.Paste F.Mask)
      (net 2 MISOSD))
    (pad 3 smd rect (at -1.35 0.95) (size 1.56 0.6) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 4 smd rect (at 1.35 0.95) (size 1.56 0.65) (layers F.Cu F.Paste F.Mask)
      (net 4 PA12-MISO))
    (pad 5 smd rect (at 1.35 -0.95) (size 1.56 0.65) (layers F.Cu F.Paste F.Mask)
      (net 3 +3V3))
    (model ${KISYS3DMOD}/Package_TO_SOT_SMD.3dshapes/SOT-23-5.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Diode_SMD:D_SOD-123F (layer F.Cu) (tedit 5DF893D5)
    (at 15.113 17.02816 90)
    (descr D_SOD-123F)
    (tags D_SOD-123F)
    (attr smd)
    (fp_text reference D_BAT1 (at 2.794 -0.09906 180) (layer F.SilkS))
    (fp_text value MBR230LSFT1G (at -2.95 0.05) (layer F.Fab) hide)
    (pad 1 smd rect (at -1.4 0 90) (size 1.1 1.1) (layers F.Cu F.Paste F.Mask)
      (net 101 "Net-(CTI1-Pad2)"))
    (pad 2 smd rect (at 1.4 0 90) (size 1.1 1.1) (layers F.Cu F.Paste F.Mask)
      (net 136 PWR_BAT))
    (model ${KISYS3DMOD}/Diode_SMD.3dshapes/D_SOD-123F.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Jumper:SolderJumper-3_P1.3mm_Open_Pad1.0x1.5mm (layer B.Cu) (tedit 5DC6F7FA)
    (at 38.28034 30.56382)
    (descr "SMD Solder 3-pad Jumper, 1x1.5mm Pads, 0.3mm gap, open")
    (tags "solder jumper open")
    (attr virtual)
    (fp_text reference SP_RXLED1 (at -0.00254 -1.8034) (layer B.SilkS))
    (fp_text value S_RXLED (at 0.0508 -2.1463) (layer B.Fab) hide)
    (pad 3 smd rect (at 1.3 0) (size 1 1.5) (layers B.Cu B.Mask)
      (net 194 PB03-D25-LRX-FLSO))
    (pad 2 smd rect (at 0 0) (size 1 1.5) (layers B.Cu B.Mask)
      (net 137 "Net-(RRX1-Pad1)"))
    (pad 1 smd rect (at -1.3 0) (size 1 1.5) (layers B.Cu B.Mask)
      (net 185 PA31-D45-SWDIO))
  )
  (module Jumper:SolderJumper-2_P1.3mm_Open_Pad1.0x1.5mm (layer B.Cu) (tedit 5DC4ACA6)
    (at 85.08746 57.08142 180)
    (descr "SMD Solder Jumper, 1x1.5mm Pads, 0.3mm gap, open")
    (tags "solder jumper open")
    (attr virtual)
    (fp_text reference SP_NET_INT9 (at -0.00508 1.60274) (layer B.SilkS))
    (fp_text value S_NETINT (at 0 -1.5) (layer B.Fab) hide)
    (pad 2 smd rect (at 0.65 0 180) (size 1 1.5) (layers B.Cu B.Mask)
      (net 175 PA09-D3-NETINT))
    (pad 1 smd rect (at -0.65 0 180) (size 1 1.5) (layers B.Cu B.Mask)
      (net 77 "Net-(RNINT1-Pad1)"))
  )
  (module Connector_PinHeader_2.54mm:PinHeader_2x08_P2.54mm_Vertical locked (layer F.Cu) (tedit 5DFFCFC3)
    (at 29.21 7.62 90)
    (descr "Through hole straight pin header, 2x08, 2.54mm pitch, double rows")
    (tags "Through hole pin header THT 2x08 2.54mm double row")
    (fp_text reference JP_EXT1 (at 2.17932 -1.94056 90) (layer F.SilkS))
    (fp_text value Conn_02x08_Odd_Even (at 4.6355 8.3439) (layer F.Fab) hide)
    (fp_text user %R (at 1.3081 8.9281) (layer F.Fab) hide)
    (pad 16 thru_hole oval (at 2.54 17.78 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 68 PA23-SCL))
    (pad 15 thru_hole oval (at 0 17.78 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 69 PA22-SDA))
    (pad 14 thru_hole oval (at 2.54 15.24 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 174 PA08-D4-NMI))
    (pad 13 thru_hole oval (at 0 15.24 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 175 PA09-D3-NETINT))
    (pad 12 thru_hole oval (at 2.54 12.7 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 201 PB08-D15-A1-RTCINT-TFT))
    (pad 11 thru_hole oval (at 0 12.7 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 8 ~RESET~))
    (pad 10 thru_hole oval (at 2.54 10.16 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 58 PB11-SCK))
    (pad 9 thru_hole oval (at 0 10.16 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 59 PB10-MOSI))
    (pad 8 thru_hole oval (at 2.54 7.62 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 3 +3V3))
    (pad 7 thru_hole oval (at 0 7.62 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 4 PA12-MISO))
    (pad 6 thru_hole oval (at 2.54 5.08 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 134 PWR_JACK))
    (pad 5 thru_hole oval (at 0 5.08 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 134 PWR_JACK))
    (pad 4 thru_hole oval (at 2.54 2.54 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 136 PWR_BAT))
    (pad 3 thru_hole oval (at 0 2.54 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 136 PWR_BAT))
    (pad 2 thru_hole oval (at 2.54 0 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 1 thru_hole rect (at 0 0 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 1 GND))
    (model ${KISYS3DMOD}/Connector_PinHeader_2.54mm.3dshapes/PinHeader_2x08_P2.54mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Connector_PinHeader_2.54mm:PinHeader_1x02_P2.54mm_Vertical (layer F.Cu) (tedit 5DE9DDEC)
    (at 68.95084 65.20434 90)
    (descr "Through hole straight pin header, 1x02, 2.54mm pitch, single row")
    (tags "Through hole pin header THT 1x02 2.54mm single row")
    (fp_text reference JP_PCELL1 (at 1.95326 1.2319 180) (layer F.SilkS))
    (fp_text value Conn_01x02 (at 1.8669 0.635) (layer F.Fab) hide)
    (pad 1 thru_hole rect (at 0 0 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 151 "Net-(JP_PCELL1-Pad1)"))
    (pad 2 thru_hole oval (at 0 2.54 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 3 +3V3))
    (model ${KISYS3DMOD}/Connector_PinHeader_2.54mm.3dshapes/PinHeader_1x02_P2.54mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5DE87405)
    (at 64.51854 65.278 270)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RPH1 (at -0.16764 1.4986 90) (layer F.SilkS))
    (fp_text value 10K (at 0.0127 1.5367 90) (layer F.Fab))
    (pad 1 smd roundrect (at -1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 1 GND))
    (pad 2 smd roundrect (at 1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 151 "Net-(JP_PCELL1-Pad1)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Jumper:SolderJumper-2_P1.3mm_Open_Pad1.0x1.5mm (layer B.Cu) (tedit 5DC4ACA6)
    (at 64.8716 62.12332)
    (descr "SMD Solder Jumper, 1x1.5mm Pads, 0.3mm gap, open")
    (tags "solder jumper open")
    (attr virtual)
    (fp_text reference SP_PCELL1 (at -0.09398 -1.65608) (layer B.SilkS))
    (fp_text value S_PCELL (at 0 -1.5) (layer B.Fab) hide)
    (pad 2 smd rect (at 0.65 0) (size 1 1.5) (layers B.Cu B.Mask)
      (net 151 "Net-(JP_PCELL1-Pad1)"))
    (pad 1 smd rect (at -0.65 0) (size 1 1.5) (layers B.Cu B.Mask)
      (net 196 PB02-D19-A5-PC))
  )
  (module Jumper:SolderJumper-2_P1.3mm_Open_Pad1.0x1.5mm (layer B.Cu) (tedit 5DC4ACA6)
    (at 43.90136 12.68476 180)
    (descr "SMD Solder Jumper, 1x1.5mm Pads, 0.3mm gap, open")
    (tags "solder jumper open")
    (attr virtual)
    (fp_text reference SP_FL_CS1 (at -0.08636 1.6383 180) (layer B.SilkS))
    (fp_text value S_FL_CS (at 0 -1.5 180) (layer B.Fab) hide)
    (pad 2 smd rect (at 0.65 0 180) (size 1 1.5) (layers B.Cu B.Mask)
      (net 155 FLCS))
    (pad 1 smd rect (at -0.65 0 180) (size 1 1.5) (layers B.Cu B.Mask)
      (net 191 PA13-D38-FLCS))
  )
  (module Jumper:SolderJumper-2_P1.3mm_Open_Pad1.0x1.5mm (layer B.Cu) (tedit 5DC4ACA6)
    (at 36.79444 72.56272)
    (descr "SMD Solder Jumper, 1x1.5mm Pads, 0.3mm gap, open")
    (tags "solder jumper open")
    (attr virtual)
    (fp_text reference SP_TFT_WAIT1 (at 0.12446 -1.64846) (layer B.SilkS))
    (fp_text value S_TFT_WAIT (at 0 -1.5) (layer B.Fab) hide)
    (pad 2 smd rect (at 0.65 0) (size 1 1.5) (layers B.Cu B.Mask)
      (net 203 TFT-WAIT))
    (pad 1 smd rect (at -0.65 0) (size 1 1.5) (layers B.Cu B.Mask)
      (net 197 PB09-D16-A2-TFT_WAIT))
  )
  (module Fuse:Fuse_1812_4532Metric_Pad1.30x3.40mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 9.95172 27.87142 180)
    (descr "Fuse SMD 1812 (4532 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://www.nikhef.nl/pub/departments/mt/projects/detectorR_D/dtddice/ERJ2G.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference FUSE1 (at 0.01016 -2.37744) (layer F.SilkS))
    (fp_text value MF-MSMF050-2 (at 0 2.65) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab) hide)
    (pad 1 smd roundrect (at -2.225 0 180) (size 1.3 3.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.192308)
      (net 135 PWR_USB))
    (pad 2 smd roundrect (at 2.225 0 180) (size 1.3 3.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.192308)
      (net 74 "Net-(FUSE1-Pad2)"))
    (model ${KISYS3DMOD}/Fuse.3dshapes/Fuse_1812_4532Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5DE8741E)
    (at 70.95744 44.03852 270)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference CMCP1 (at -0.04064 1.4097 90) (layer F.SilkS))
    (fp_text value 0.1uf (at -0.0127 1.5367 90) (layer F.Fab) hide)
    (pad 1 smd roundrect (at -1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 3 +3V3))
    (pad 2 smd roundrect (at 1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 1 GND))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5DE87405)
    (at 82.84718 50.97272)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RMCP23A0 (at -0.04826 1.5494) (layer F.SilkS))
    (fp_text value 10K (at 0.0127 1.5367) (layer F.Fab))
    (pad 1 smd roundrect (at -1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 165 "Net-(RMCP23A0-Pad1)"))
    (pad 2 smd roundrect (at 1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 1 GND))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Jumper:SolderJumper-2_P1.3mm_Open_Pad1.0x1.5mm (layer B.Cu) (tedit 5DC4ACA6)
    (at 77.36332 50.23612)
    (descr "SMD Solder Jumper, 1x1.5mm Pads, 0.3mm gap, open")
    (tags "solder jumper open")
    (attr virtual)
    (fp_text reference SP_MCP23A0 (at 0.08128 -1.5621) (layer B.SilkS))
    (fp_text value S_MCPA (at 0 -1.5) (layer B.Fab) hide)
    (pad 2 smd rect (at 0.65 0) (size 1 1.5) (layers B.Cu B.Mask)
      (net 165 "Net-(RMCP23A0-Pad1)"))
    (pad 1 smd rect (at -0.65 0) (size 1 1.5) (layers B.Cu B.Mask)
      (net 3 +3V3))
  )
  (module Jumper:SolderJumper-2_P1.3mm_Open_Pad1.0x1.5mm (layer B.Cu) (tedit 5DC4ACA6)
    (at 71.88962 45.96384)
    (descr "SMD Solder Jumper, 1x1.5mm Pads, 0.3mm gap, open")
    (tags "solder jumper open")
    (attr virtual)
    (fp_text reference SP_MCP_INT7 (at 0.11684 -1.59004) (layer B.SilkS))
    (fp_text value S_MCPINT (at 0 -1.5) (layer B.Fab) hide)
    (pad 2 smd rect (at 0.65 0) (size 1 1.5) (layers B.Cu B.Mask)
      (net 166 "Net-(SP_MCP_INT7-Pad2)"))
    (pad 1 smd rect (at -0.65 0) (size 1 1.5) (layers B.Cu B.Mask)
      (net 202 PA07-D9-I2S-MCPINT-TFT))
  )
  (module Jumper:SolderJumper-2_P1.3mm_Open_Pad1.0x1.5mm (layer B.Cu) (tedit 5DC4ACA6)
    (at 114.554 66.548 270)
    (descr "SMD Solder Jumper, 1x1.5mm Pads, 0.3mm gap, open")
    (tags "solder jumper open")
    (attr virtual)
    (fp_text reference SP_N_HARDRESET_1 (at 1.3208 -2.2098 90) (layer B.SilkS))
    (fp_text value S_N_HARDRESET (at 0 -1.5 90) (layer B.Fab) hide)
    (pad 1 smd rect (at -0.65 0 270) (size 1 1.5) (layers B.Cu B.Mask)
      (net 45 NETRST))
    (pad 2 smd rect (at 0.65 0 270) (size 1 1.5) (layers B.Cu B.Mask)
      (net 159 "Net-(SP_N_HARDRESET_1-Pad2)"))
  )
  (module Jumper:SolderJumper-2_P1.3mm_Open_Pad1.0x1.5mm (layer B.Cu) (tedit 5DC4ACA6)
    (at 112.014 66.548 270)
    (descr "SMD Solder Jumper, 1x1.5mm Pads, 0.3mm gap, open")
    (tags "solder jumper open")
    (attr virtual)
    (fp_text reference SP_N_SOFTRESET_1 (at 1.44272 2.08026 90) (layer B.SilkS))
    (fp_text value S_N_SOFTRESET (at 0 -1.5 90) (layer B.Fab) hide)
    (pad 2 smd rect (at 0.65 0 270) (size 1 1.5) (layers B.Cu B.Mask)
      (net 160 "Net-(SP_N_SOFTRESET_1-Pad2)"))
    (pad 1 smd rect (at -0.65 0 270) (size 1 1.5) (layers B.Cu B.Mask)
      (net 45 NETRST))
  )
  (module Jumper:SolderJumper-2_P1.3mm_Open_Pad1.0x1.5mm (layer B.Cu) (tedit 5DC4ACA6)
    (at 70.66534 13.37056)
    (descr "SMD Solder Jumper, 1x1.5mm Pads, 0.3mm gap, open")
    (tags "solder jumper open")
    (attr virtual)
    (fp_text reference SP_TFT13_PA16 (at -0.06604 -1.53162) (layer B.SilkS))
    (fp_text value S_TFT13 (at 0 -1.5) (layer B.Fab) hide)
    (pad 2 smd rect (at 0.65 0) (size 1 1.5) (layers B.Cu B.Mask)
      (net 205 TFT-13))
    (pad 1 smd rect (at -0.65 0) (size 1 1.5) (layers B.Cu B.Mask)
      (net 177 PA16-D11-TX2-TFT))
  )
  (module Jumper:SolderJumper-2_P1.3mm_Open_Pad1.0x1.5mm (layer B.Cu) (tedit 5DC4ACA6)
    (at 70.57136 16.80464)
    (descr "SMD Solder Jumper, 1x1.5mm Pads, 0.3mm gap, open")
    (tags "solder jumper open")
    (attr virtual)
    (fp_text reference SP_TFT12_PA18 (at 0.1143 -1.58242) (layer B.SilkS))
    (fp_text value S_TFT12 (at 0 -1.5) (layer B.Fab) hide)
    (pad 1 smd rect (at -0.65 0) (size 1 1.5) (layers B.Cu B.Mask)
      (net 176 PA18-D10-RX2-TFT))
    (pad 2 smd rect (at 0.65 0) (size 1 1.5) (layers B.Cu B.Mask)
      (net 204 TFT-12))
  )
  (module Connector_PinHeader_2.54mm:PinHeader_2x10_P2.54mm_Vertical locked (layer F.Cu) (tedit 5DFFC81D)
    (at 59.69 7.62 90)
    (descr "Through hole straight pin header, 2x10, 2.54mm pitch, double rows")
    (tags "Through hole pin header THT 2x10 2.54mm double row")
    (fp_text reference JP_EXT2 (at 2.18186 -2.05232 90) (layer F.SilkS))
    (fp_text value Conn_02x10_Odd_Even (at 4.7117 11.4046) (layer F.Fab) hide)
    (fp_text user %R (at 1.27 11.43) (layer F.Fab) hide)
    (pad 1 thru_hole rect (at 0 0 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 3 +3V3))
    (pad 2 thru_hole oval (at 2.54 0 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 3 thru_hole oval (at 0 2.54 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 176 PA18-D10-RX2-TFT))
    (pad 4 thru_hole oval (at 2.54 2.54 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 177 PA16-D11-TX2-TFT))
    (pad 5 thru_hole oval (at 0 5.08 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 178 PA10-D1-TX1))
    (pad 6 thru_hole oval (at 2.54 5.08 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 179 PA11-D0-RX1))
    (pad 7 thru_hole oval (at 0 7.62 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 180 PA02-D14-A0))
    (pad 8 thru_hole oval (at 2.54 7.62 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 202 PA07-D9-I2S-MCPINT-TFT))
    (pad 9 thru_hole oval (at 0 10.16 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 162 MCP47-V0))
    (pad 10 thru_hole oval (at 2.54 10.16 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 161 MCP47-V1))
    (pad 11 thru_hole oval (at 0 12.7 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 141 GP5))
    (pad 12 thru_hole oval (at 2.54 12.7 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 142 GP4))
    (pad 13 thru_hole oval (at 0 15.24 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 145 GP3))
    (pad 14 thru_hole oval (at 2.54 15.24 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 144 GP2))
    (pad 15 thru_hole oval (at 0 17.78 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 143 GP1))
    (pad 16 thru_hole oval (at 2.54 17.78 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 138 GP0))
    (pad 17 thru_hole oval (at 0 20.32 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 129 AIN3))
    (pad 18 thru_hole oval (at 2.54 20.32 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 128 AIN2))
    (pad 19 thru_hole oval (at 0 22.86 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 127 AIN1))
    (pad 20 thru_hole oval (at 2.54 22.86 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 154 ANI0-TMP36))
    (model ${KISYS3DMOD}/Connector_PinHeader_2.54mm.3dshapes/PinHeader_2x10_P2.54mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5DE87405)
    (at 85.4075 42.53484 90)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RGP6 (at -0.127 -1.42748 90) (layer F.SilkS))
    (fp_text value 10K (at 0.0127 1.5367 90) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0 90) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 1 GND))
    (pad 1 smd roundrect (at -1.025 0 90) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 140 GP6))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5DE87405)
    (at 85.51672 47.28972 90)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RGP7 (at 0.27686 -1.45034 90) (layer F.SilkS))
    (fp_text value 10K (at 0.0127 1.5367 90) (layer F.Fab))
    (pad 1 smd roundrect (at -1.025 0 90) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 139 GP7))
    (pad 2 smd roundrect (at 1.025 0 90) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 1 GND))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Connector_PinHeader_2.54mm:PinHeader_1x03_P2.54mm_Vertical (layer F.Cu) (tedit 5DE9DDB8)
    (at 79.502 70.96506 90)
    (descr "Through hole straight pin header, 1x03, 2.54mm pitch, single row")
    (tags "Through hole pin header THT 1x03 2.54mm single row")
    (fp_text reference JP_TMP36 (at 1.97104 2.32918 180) (layer F.SilkS))
    (fp_text value Conn_01x03 (at 2.2098 2.1336) (layer F.Fab) hide)
    (pad 1 thru_hole rect (at 0 0 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 3 +3V3))
    (pad 2 thru_hole oval (at 0 2.54 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 152 "Net-(JP_TMP36-Pad2)"))
    (pad 3 thru_hole oval (at 0 5.08 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 1 GND))
    (model ${KISYS3DMOD}/Connector_PinHeader_2.54mm.3dshapes/PinHeader_1x03_P2.54mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Jumper:SolderJumper-2_P1.3mm_Open_Pad1.0x1.5mm (layer B.Cu) (tedit 5DC4ACA6)
    (at 82.33156 14.50848)
    (descr "SMD Solder Jumper, 1x1.5mm Pads, 0.3mm gap, open")
    (tags "solder jumper open")
    (attr virtual)
    (fp_text reference SP_TMP36 (at 0.030979 -1.524821) (layer B.SilkS))
    (fp_text value SolderJumper_2_Open (at 0 -1.5) (layer B.Fab) hide)
    (pad 2 smd rect (at 0.65 0) (size 1 1.5) (layers B.Cu B.Mask)
      (net 152 "Net-(JP_TMP36-Pad2)"))
    (pad 1 smd rect (at -0.65 0) (size 1 1.5) (layers B.Cu B.Mask)
      (net 154 ANI0-TMP36))
  )
  (module Jumper:SolderJumper-2_P1.3mm_Open_Pad1.0x1.5mm (layer B.Cu) (tedit 5DC4ACA6)
    (at 81.24444 21.1709)
    (descr "SMD Solder Jumper, 1x1.5mm Pads, 0.3mm gap, open")
    (tags "solder jumper open")
    (attr virtual)
    (fp_text reference SP_ADSADDR1 (at 0.10922 -1.51892) (layer B.SilkS))
    (fp_text value S_ADSADDR (at 0 -1.5) (layer B.Fab) hide)
    (pad 2 smd rect (at 0.65 0) (size 1 1.5) (layers B.Cu B.Mask)
      (net 3 +3V3))
    (pad 1 smd rect (at -0.65 0) (size 1 1.5) (layers B.Cu B.Mask)
      (net 153 "Net-(RADDR1-Pad2)"))
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5DE8741E)
    (at 77.23886 37.57422 270)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference CMCP47-0 (at -0.2032 1.41478 270) (layer F.SilkS))
    (fp_text value 0.1uf (at -0.0127 1.5367 90) (layer F.Fab) hide)
    (pad 1 smd roundrect (at -1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 1 GND))
    (pad 2 smd roundrect (at 1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 3 +3V3))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5DE8741E)
    (at 77.07884 31.03372 270)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference CMCP47-1 (at -0.40894 1.47574 270) (layer F.SilkS))
    (fp_text value 0.1uf (at -0.0127 1.5367 90) (layer F.Fab) hide)
    (pad 1 smd roundrect (at -1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 1 GND))
    (pad 2 smd roundrect (at 1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 3 +3V3))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5DE87405)
    (at 85.16366 33.66008 90)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RMCP47-1 (at 0.61976 1.4478 270) (layer F.SilkS))
    (fp_text value 10K (at 0.0127 1.5367 90) (layer F.Fab))
    (pad 1 smd roundrect (at -1.025 0 90) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 1 GND))
    (pad 2 smd roundrect (at 1.025 0 90) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 164 MCP47-A1))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_Tantalum_SMD:CP_EIA-3216-18_Kemet-A_Pad1.58x1.35mm_HandSolder (layer F.Cu) (tedit 5DE8753E)
    (at 73.58634 37.75456 90)
    (descr "Tantalum Capacitor SMD Kemet-A (3216-18 Metric), IPC_7351 nominal, (Body size from: http://www.kemet.com/Lists/ProductCatalog/Attachments/253/KEM_TC101_STD.pdf), generated with kicad-footprint-generator")
    (tags "capacitor tantalum")
    (attr smd)
    (fp_text reference CATOD0 (at 0 -1.52908 90) (layer F.SilkS))
    (fp_text value "10uf TANT" (at 0 1.75 90) (layer F.Fab) hide)
    (fp_text user %R (at 0 0 90) (layer F.Fab) hide)
    (pad 1 smd roundrect (at -1.4375 0 90) (size 1.575 1.35) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.185185)
      (net 3 +3V3))
    (pad 2 smd roundrect (at 1.4375 0 90) (size 1.575 1.35) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.185185)
      (net 1 GND))
    (model ${KISYS3DMOD}/Capacitor_Tantalum_SMD.3dshapes/CP_EIA-3216-18_Kemet-A.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_Tantalum_SMD:CP_EIA-3216-18_Kemet-A_Pad1.58x1.35mm_HandSolder (layer F.Cu) (tedit 5DE8753E)
    (at 73.75906 31.68396 90)
    (descr "Tantalum Capacitor SMD Kemet-A (3216-18 Metric), IPC_7351 nominal, (Body size from: http://www.kemet.com/Lists/ProductCatalog/Attachments/253/KEM_TC101_STD.pdf), generated with kicad-footprint-generator")
    (tags "capacitor tantalum")
    (attr smd)
    (fp_text reference CATOD1 (at 0.12192 -1.47066 90) (layer F.SilkS))
    (fp_text value "10uf TANT" (at 0 1.75 90) (layer F.Fab) hide)
    (fp_text user %R (at 0 0 90) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.4375 0 90) (size 1.575 1.35) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.185185)
      (net 1 GND))
    (pad 1 smd roundrect (at -1.4375 0 90) (size 1.575 1.35) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.185185)
      (net 3 +3V3))
    (model ${KISYS3DMOD}/Capacitor_Tantalum_SMD.3dshapes/CP_EIA-3216-18_Kemet-A.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Jumper:SolderJumper-2_P1.3mm_Open_Pad1.0x1.5mm (layer B.Cu) (tedit 5DC4ACA6)
    (at 81.8134 42.49166 180)
    (descr "SMD Solder Jumper, 1x1.5mm Pads, 0.3mm gap, open")
    (tags "solder jumper open")
    (attr virtual)
    (fp_text reference SP_GP6 (at 0 1.5) (layer B.SilkS))
    (fp_text value S_GP6 (at 0 -1.5) (layer B.Fab) hide)
    (pad 2 smd rect (at 0.65 0 180) (size 1 1.5) (layers B.Cu B.Mask)
      (net 3 +3V3))
    (pad 1 smd rect (at -0.65 0 180) (size 1 1.5) (layers B.Cu B.Mask)
      (net 140 GP6))
  )
  (module Jumper:SolderJumper-2_P1.3mm_Open_Pad1.0x1.5mm (layer B.Cu) (tedit 5DC4ACA6)
    (at 82.296 46.482 180)
    (descr "SMD Solder Jumper, 1x1.5mm Pads, 0.3mm gap, open")
    (tags "solder jumper open")
    (attr virtual)
    (fp_text reference SP_GP7 (at 0 1.5) (layer B.SilkS))
    (fp_text value S_GP7 (at 0 -1.5) (layer B.Fab) hide)
    (pad 1 smd rect (at -0.65 0 180) (size 1 1.5) (layers B.Cu B.Mask)
      (net 139 GP7))
    (pad 2 smd rect (at 0.65 0 180) (size 1 1.5) (layers B.Cu B.Mask)
      (net 3 +3V3))
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5DE87405)
    (at 82.48396 38.3794)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RMCP47-0 (at -0.0635 1.44526) (layer F.SilkS))
    (fp_text value 10K (at 0.0127 1.5367) (layer F.Fab))
    (pad 1 smd roundrect (at -1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 1 GND))
    (pad 2 smd roundrect (at 1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 163 MCP47-A0))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Jumper:SolderJumper-2_P1.3mm_Open_Pad1.0x1.5mm (layer B.Cu) (tedit 5DC4ACA6)
    (at 81.8134 36.07816)
    (descr "SMD Solder Jumper, 1x1.5mm Pads, 0.3mm gap, open")
    (tags "solder jumper open")
    (attr virtual)
    (fp_text reference SP_MCP47-0 (at -0.2286 -1.52146) (layer B.SilkS))
    (fp_text value S_MCP47-0 (at 0 -1.5) (layer B.Fab) hide)
    (pad 1 smd rect (at -0.65 0) (size 1 1.5) (layers B.Cu B.Mask)
      (net 3 +3V3))
    (pad 2 smd rect (at 0.65 0) (size 1 1.5) (layers B.Cu B.Mask)
      (net 163 MCP47-A0))
  )
  (module Jumper:SolderJumper-2_P1.3mm_Open_Pad1.0x1.5mm (layer B.Cu) (tedit 5DC4ACA6)
    (at 79.30134 30.02788)
    (descr "SMD Solder Jumper, 1x1.5mm Pads, 0.3mm gap, open")
    (tags "solder jumper open")
    (attr virtual)
    (fp_text reference SP_MCP47-1 (at -0.10922 -1.48336) (layer B.SilkS))
    (fp_text value S_MCP47-1 (at 0 -1.5) (layer B.Fab) hide)
    (pad 2 smd rect (at 0.65 0) (size 1 1.5) (layers B.Cu B.Mask)
      (net 164 MCP47-A1))
    (pad 1 smd rect (at -0.65 0) (size 1 1.5) (layers B.Cu B.Mask)
      (net 3 +3V3))
  )
  (module Connector_PinSocket_2.54mm:PinSocket_2x03_P2.54mm_Vertical locked (layer B.Cu) (tedit 5A19A425)
    (at 24.13 10.16)
    (descr "Through hole straight socket strip, 2x03, 2.54mm pitch, double cols (from Kicad 4.0.7), script generated")
    (tags "Through hole socket strip THT 2x03 2.54mm double row")
    (fp_text reference JP_BAT1 (at -1.17094 -8.8011) (layer B.SilkS))
    (fp_text value Conn_02x03_Odd_Even (at -1.27 -7.85) (layer B.Fab))
    (fp_text user %R (at -1.27 -2.54 -90) (layer B.Fab))
    (pad 1 thru_hole rect (at 0 0) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 134 PWR_JACK))
    (pad 2 thru_hole oval (at -2.54 0) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 134 PWR_JACK))
    (pad 3 thru_hole oval (at 0 -2.54) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 136 PWR_BAT))
    (pad 4 thru_hole oval (at -2.54 -2.54) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 136 PWR_BAT))
    (pad 5 thru_hole oval (at 0 -5.08) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 6 thru_hole oval (at -2.54 -5.08) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 1 GND))
    (model ${KISYS3DMOD}/Connector_PinSocket_2.54mm.3dshapes/PinSocket_2x03_P2.54mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Connector_PinSocket_2.54mm:PinSocket_1x15_P2.54mm_Vertical (layer F.Cu) (tedit 5A19A41D)
    (at 17.78 79.502 90)
    (descr "Through hole straight socket strip, 1x15, 2.54mm pitch, single row (from Kicad 4.0.7), script generated")
    (tags "Through hole socket strip THT 1x15 2.54mm single row")
    (fp_text reference JP_RA8875 (at -1.83642 6.52526 180) (layer F.SilkS))
    (fp_text value Conn_01x15 (at 0 38.33 90) (layer F.Fab))
    (fp_text user %R (at 0 17.78) (layer F.Fab))
    (pad 1 thru_hole rect (at 0 0 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 3 +3V3))
    (pad 2 thru_hole oval (at 0 2.54 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 3 thru_hole oval (at 0 5.08 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 168 "Net-(JP_RA8875-Pad3)"))
    (pad 4 thru_hole oval (at 0 7.62 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 167 "Net-(JP_RA8875-Pad4)"))
    (pad 5 thru_hole oval (at 0 10.16 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 58 PB11-SCK))
    (pad 6 thru_hole oval (at 0 12.7 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 71 TFT-MISO))
    (pad 7 thru_hole oval (at 0 15.24 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 59 PB10-MOSI))
    (pad 8 thru_hole oval (at 0 17.78 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 181 PA20-D6-TFT_CS))
    (pad 9 thru_hole oval (at 0 20.32 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 182 PA21-D7-TFT_RESET))
    (pad 10 thru_hole oval (at 0 22.86 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 203 TFT-WAIT))
    (pad 11 thru_hole oval (at 0 25.4 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 183 PA19-D12-TFT_INT3))
    (pad 12 thru_hole oval (at 0 27.94 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 204 TFT-12))
    (pad 13 thru_hole oval (at 0 30.48 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 205 TFT-13))
    (pad 14 thru_hole oval (at 0 33.02 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 206 TFT-14))
    (pad 15 thru_hole oval (at 0 35.56 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 207 TFT-15))
    (model ${KISYS3DMOD}/Connector_PinSocket_2.54mm.3dshapes/PinSocket_1x15_P2.54mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Package_TO_SOT_SMD:SOT-23-6_Handsoldering (layer F.Cu) (tedit 5E646E8D)
    (at 80.6196 35.7632)
    (descr "6-pin SOT-23 package, Handsoldering")
    (tags "SOT-23-6 Handsoldering")
    (attr smd)
    (fp_text reference U_MCP4725-0 (at -0.7112 -1.96342) (layer F.SilkS))
    (fp_text value MCP4725A0T-E_CH (at -0.0762 2.0447) (layer F.Fab) hide)
    (pad 5 smd rect (at 1.35 0) (size 1.56 0.6) (layers F.Cu F.Paste F.Mask)
      (net 68 PA23-SCL))
    (pad 6 smd rect (at 1.35 -0.95) (size 1.56 0.6) (layers F.Cu F.Paste F.Mask)
      (net 163 MCP47-A0))
    (pad 4 smd rect (at 1.35 0.95) (size 1.56 0.6) (layers F.Cu F.Paste F.Mask)
      (net 69 PA22-SDA))
    (pad 3 smd rect (at -1.35 0.95) (size 1.56 0.6) (layers F.Cu F.Paste F.Mask)
      (net 3 +3V3))
    (pad 2 smd rect (at -1.35 0) (size 1.56 0.6) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 1 smd rect (at -1.35 -0.95) (size 1.56 0.6) (layers F.Cu F.Paste F.Mask)
      (net 162 MCP47-V0))
    (model ${KISYS3DMOD}/Package_TO_SOT_SMD.3dshapes/SOT-23-6.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Package_TO_SOT_SMD:SOT-23-6_Handsoldering (layer F.Cu) (tedit 5E646E8D)
    (at 80.6704 30.861)
    (descr "6-pin SOT-23 package, Handsoldering")
    (tags "SOT-23-6 Handsoldering")
    (attr smd)
    (fp_text reference U_MCP4725-1 (at -0.71628 -2.0955) (layer F.SilkS))
    (fp_text value MCP4725A0T-E_CH (at -0.0762 2.0447) (layer F.Fab) hide)
    (pad 1 smd rect (at -1.35 -0.95) (size 1.56 0.6) (layers F.Cu F.Paste F.Mask)
      (net 161 MCP47-V1))
    (pad 2 smd rect (at -1.35 0) (size 1.56 0.6) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 3 smd rect (at -1.35 0.95) (size 1.56 0.6) (layers F.Cu F.Paste F.Mask)
      (net 3 +3V3))
    (pad 4 smd rect (at 1.35 0.95) (size 1.56 0.6) (layers F.Cu F.Paste F.Mask)
      (net 69 PA22-SDA))
    (pad 6 smd rect (at 1.35 -0.95) (size 1.56 0.6) (layers F.Cu F.Paste F.Mask)
      (net 164 MCP47-A1))
    (pad 5 smd rect (at 1.35 0) (size 1.56 0.6) (layers F.Cu F.Paste F.Mask)
      (net 68 PA23-SCL))
    (model ${KISYS3DMOD}/Package_TO_SOT_SMD.3dshapes/SOT-23-6.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Package_SO:SOIC-16W_7.5x10.3mm_P1.27mm (layer F.Cu) (tedit 5E49D2AE)
    (at 28.3972 43.6118 270)
    (descr "SOIC, 16 Pin (JEDEC MS-013AA, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/soic_wide-rw/rw_16.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py")
    (tags "SOIC SO")
    (attr smd)
    (fp_text reference U_DS3231 (at -0.04064 -6.01218 90) (layer F.SilkS))
    (fp_text value DS3231M (at 0 6.1 90) (layer F.Fab) hide)
    (fp_text user %R (at 0 0 90) (layer F.Fab) hide)
    (pad 1 smd roundrect (at -4.65 -4.445 270) (size 2.05 0.6) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 90 "Net-(U_DS3231-Pad1)"))
    (pad 2 smd roundrect (at -4.65 -3.175 270) (size 2.05 0.6) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 3 +3V3))
    (pad 3 smd roundrect (at -4.65 -1.905 270) (size 2.05 0.6) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 102 "Net-(RCLK1-Pad1)"))
    (pad 4 smd roundrect (at -4.65 -0.635 270) (size 2.05 0.6) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 89 "Net-(U_DS3231-Pad4)"))
    (pad 5 smd roundrect (at -4.65 0.635 270) (size 2.05 0.6) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 1 GND))
    (pad 6 smd roundrect (at -4.65 1.905 270) (size 2.05 0.6) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 1 GND))
    (pad 7 smd roundrect (at -4.65 3.175 270) (size 2.05 0.6) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 1 GND))
    (pad 8 smd roundrect (at -4.65 4.445 270) (size 2.05 0.6) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 1 GND))
    (pad 9 smd roundrect (at 4.65 4.445 270) (size 2.05 0.6) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 1 GND))
    (pad 10 smd roundrect (at 4.65 3.175 270) (size 2.05 0.6) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 1 GND))
    (pad 11 smd roundrect (at 4.65 1.905 270) (size 2.05 0.6) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 1 GND))
    (pad 12 smd roundrect (at 4.65 0.635 270) (size 2.05 0.6) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 1 GND))
    (pad 13 smd roundrect (at 4.65 -0.635 270) (size 2.05 0.6) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 1 GND))
    (pad 14 smd roundrect (at 4.65 -1.905 270) (size 2.05 0.6) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 119 "Net-(Battery-Cell1-Pad1)"))
    (pad 15 smd roundrect (at 4.65 -3.175 270) (size 2.05 0.6) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 69 PA22-SDA))
    (pad 16 smd roundrect (at 4.65 -4.445 270) (size 2.05 0.6) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 68 PA23-SCL))
    (model ${KISYS3DMOD}/Package_SO.3dshapes/SOIC-16W_7.5x10.3mm_P1.27mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Package_QFP:TQFP-48_7x7mm_P0.5mm (layer F.Cu) (tedit 5DC67DCD)
    (at 59.3344 24.9428 135)
    (descr "48 LEAD TQFP 7x7mm (see MICREL TQFP7x7-48LD-PL-1.pdf)")
    (tags "QFP 0.5")
    (attr smd)
    (fp_text reference U_ATSAMD21G18A1 (at 0 -5.8 135) (layer F.SilkS))
    (fp_text value ATSAMD21G18A-AUT (at 0 5.8 135) (layer F.Fab) hide)
    (pad 1 smd rect (at -4.35 -2.75 135) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 100 "Net-(CQ2-Pad2)"))
    (pad 2 smd rect (at -4.35 -2.25 135) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 99 "Net-(CQ1-Pad1)"))
    (pad 3 smd rect (at -4.35 -1.75 135) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 180 PA02-D14-A0))
    (pad 4 smd rect (at -4.35 -1.25 135) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 169 PA03-D42-AREF))
    (pad 5 smd rect (at -4.35 -0.75 135) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 6 smd rect (at -4.35 -0.25 135) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 79 "Net-(CV1-Pad1)"))
    (pad 7 smd rect (at -4.35 0.25 135) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 201 PB08-D15-A1-RTCINT-TFT))
    (pad 8 smd rect (at -4.35 0.75 135) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 197 PB09-D16-A2-TFT_WAIT))
    (pad 9 smd rect (at -4.35 1.25 135) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 186 PA04-D17-A3-BUZ))
    (pad 10 smd rect (at -4.35 1.75 135) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 170 PA05-D18-A4-SDINT))
    (pad 11 smd rect (at -4.35 2.25 135) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 188 PA06-D8-NETRES))
    (pad 12 smd rect (at -4.35 2.75 135) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 202 PA07-D9-I2S-MCPINT-TFT))
    (pad 13 smd rect (at -2.75 4.35 225) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 174 PA08-D4-NMI))
    (pad 14 smd rect (at -2.25 4.35 225) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 175 PA09-D3-NETINT))
    (pad 15 smd rect (at -1.75 4.35 225) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 178 PA10-D1-TX1))
    (pad 16 smd rect (at -1.25 4.35 225) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 179 PA11-D0-RX1))
    (pad 17 smd rect (at -0.75 4.35 225) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 9 +3.3VA))
    (pad 18 smd rect (at -0.25 4.35 225) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 19 smd rect (at 0.25 4.35 225) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 59 PB10-MOSI))
    (pad 20 smd rect (at 0.75 4.35 225) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 58 PB11-SCK))
    (pad 21 smd rect (at 1.25 4.35 225) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 4 PA12-MISO))
    (pad 22 smd rect (at 1.75 4.35 225) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 191 PA13-D38-FLCS))
    (pad 23 smd rect (at 2.25 4.35 225) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 171 PA14-D2-SDCS))
    (pad 24 smd rect (at 2.75 4.35 225) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 187 PA15-D5-NETCS))
    (pad 25 smd rect (at 4.35 2.75 135) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 177 PA16-D11-TX2-TFT))
    (pad 26 smd rect (at 4.35 2.25 135) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 189 PA17-D13-DEFLED))
    (pad 27 smd rect (at 4.35 1.75 135) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 176 PA18-D10-RX2-TFT))
    (pad 28 smd rect (at 4.35 1.25 135) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 183 PA19-D12-TFT_INT3))
    (pad 29 smd rect (at 4.35 0.75 135) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 181 PA20-D6-TFT_CS))
    (pad 30 smd rect (at 4.35 0.25 135) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 182 PA21-D7-TFT_RESET))
    (pad 31 smd rect (at 4.35 -0.25 135) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 69 PA22-SDA))
    (pad 32 smd rect (at 4.35 -0.75 135) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 68 PA23-SCL))
    (pad 33 smd rect (at 4.35 -1.25 135) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 173 PA24-D28-USBD-))
    (pad 34 smd rect (at 4.35 -1.75 135) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 172 PA25-D29-USBD+))
    (pad 35 smd rect (at 4.35 -2.25 135) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 36 smd rect (at 4.35 -2.75 135) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 9 +3.3VA))
    (pad 37 smd rect (at 2.75 -4.35 225) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 193 PB22-D30-FLSI))
    (pad 38 smd rect (at 2.25 -4.35 225) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 192 PB23-D31-FLSCLK))
    (pad 39 smd rect (at 1.75 -4.35 225) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 190 PA27-D26-LTX))
    (pad 40 smd rect (at 1.25 -4.35 225) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 8 ~RESET~))
    (pad 41 smd rect (at 0.75 -4.35 225) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 195 PA28-D27-USBENA))
    (pad 42 smd rect (at 0.25 -4.35 225) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 43 smd rect (at -0.25 -4.35 225) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 104 "Net-(CVDD1-Pad2)"))
    (pad 44 smd rect (at -0.75 -4.35 225) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 9 +3.3VA))
    (pad 45 smd rect (at -1.25 -4.35 225) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 184 PA30-D44-SWDCLK))
    (pad 46 smd rect (at -1.75 -4.35 225) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 185 PA31-D45-SWDIO))
    (pad 47 smd rect (at -2.25 -4.35 225) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 196 PB02-D19-A5-PC))
    (pad 48 smd rect (at -2.75 -4.35 225) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 194 PB03-D25-LRX-FLSO))
    (model ${KISYS3DMOD}/Package_QFP.3dshapes/TQFP-48_7x7mm_P0.5mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module LED_SMD:LED_WS2812B_PLCC4_5.0x5.0mm_P3.2mm (layer F.Cu) (tedit 5DF88E44)
    (at 66.72072 71.22668)
    (descr https://cdn-shop.adafruit.com/datasheets/WS2812B.pdf)
    (tags "LED RGB NeoPixel")
    (attr smd)
    (fp_text reference L_NEO_PIXEL1 (at -0.0127 -3.0607) (layer F.SilkS))
    (fp_text value WS2812B-5050 (at 0.0127 3.2639) (layer F.Fab) hide)
    (fp_text user 1 (at -3.6957 -1.8796) (layer F.SilkS))
    (fp_text user %R (at 0 0) (layer F.Fab) hide)
    (pad 3 smd rect (at 2.45 1.6) (size 1.5 1) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 4 smd rect (at 2.45 -1.6) (size 1.5 1) (layers F.Cu F.Paste F.Mask)
      (net 150 "Net-(L_NEO_PIXEL1-Pad4)"))
    (pad 2 smd rect (at -2.45 1.6) (size 1.5 1) (layers F.Cu F.Paste F.Mask)
      (net 149 "Net-(L_NEO_PIXEL1-Pad2)"))
    (pad 1 smd rect (at -2.45 -1.6) (size 1.5 1) (layers F.Cu F.Paste F.Mask)
      (net 3 +3V3))
    (model ${KISYS3DMOD}/LED_SMD.3dshapes/LED_WS2812B_PLCC4_5.0x5.0mm_P3.2mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Connector_PinHeader_1.27mm:PinHeader_2x05_P1.27mm_Vertical (layer F.Cu) (tedit 5D3CA221)
    (at 45.20438 45.24756 90)
    (descr "Through hole straight pin header, 2x05, 1.27mm pitch, double rows")
    (tags "Through hole pin header THT 2x05 1.27mm double row")
    (fp_text reference JP_SWD1 (at 0.4 -4.45 90) (layer F.SilkS))
    (fp_text value Conn_ARM_JTAG_SWD_10 (at -0.05 9.65 90) (layer F.Fab))
    (pad 1 thru_hole rect (at 0 0 90) (size 1 1) (drill 0.65) (layers *.Cu *.Mask)
      (net 9 +3.3VA))
    (pad 2 thru_hole oval (at 1.27 0 90) (size 1 1) (drill 0.65) (layers *.Cu *.Mask)
      (net 185 PA31-D45-SWDIO))
    (pad 3 thru_hole oval (at 0 1.27 90) (size 1 1) (drill 0.65) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 4 thru_hole oval (at 1.27 1.27 90) (size 1 1) (drill 0.65) (layers *.Cu *.Mask)
      (net 184 PA30-D44-SWDCLK))
    (pad 5 thru_hole oval (at 0 2.54 90) (size 1 1) (drill 0.65) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 6 thru_hole oval (at 1.27 2.54 90) (size 1 1) (drill 0.65) (layers *.Cu *.Mask)
      (net 88 "Net-(JP_SWD1-Pad6)"))
    (pad 7 thru_hole oval (at 0 3.81 90) (size 1 1) (drill 0.65) (layers *.Cu *.Mask)
      (net 87 "Net-(JP_SWD1-Pad7)"))
    (pad 8 thru_hole oval (at 1.27 3.81 90) (size 1 1) (drill 0.65) (layers *.Cu *.Mask)
      (net 86 "Net-(JP_SWD1-Pad8)"))
    (pad 9 thru_hole oval (at 0 5.08 90) (size 1 1) (drill 0.65) (layers *.Cu *.Mask)
      (net 85 "Net-(JP_SWD1-Pad9)"))
    (pad 10 thru_hole oval (at 1.27 5.08 90) (size 1 1) (drill 0.65) (layers *.Cu *.Mask)
      (net 84 "Net-(JP_SWD1-Pad10)"))
    (model ${KISYS3DMOD}/Connector_PinHeader_1.27mm.3dshapes/PinHeader_2x05_P1.27mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Jumper:SolderJumper-3_P1.3mm_Open_Pad1.0x1.5mm (layer B.Cu) (tedit 5DC6F7FA)
    (at 65.03162 44.99356)
    (descr "SMD Solder 3-pad Jumper, 1x1.5mm Pads, 0.3mm gap, open")
    (tags "solder jumper open")
    (attr virtual)
    (fp_text reference TFT14 (at 0 1.8) (layer B.SilkS))
    (fp_text value TFT (at 0.0508 -2.1463) (layer B.Fab) hide)
    (pad 1 smd rect (at -1.3 0) (size 1 1.5) (layers B.Cu B.Mask)
      (net 201 PB08-D15-A1-RTCINT-TFT))
    (pad 2 smd rect (at 0 0) (size 1 1.5) (layers B.Cu B.Mask)
      (net 206 TFT-14))
    (pad 3 smd rect (at 1.3 0) (size 1 1.5) (layers B.Cu B.Mask)
      (net 69 PA22-SDA))
  )
  (module Jumper:SolderJumper-3_P1.3mm_Open_Pad1.0x1.5mm (layer B.Cu) (tedit 5DC6F7FA)
    (at 65.07686 48.7045)
    (descr "SMD Solder 3-pad Jumper, 1x1.5mm Pads, 0.3mm gap, open")
    (tags "solder jumper open")
    (attr virtual)
    (fp_text reference TFT15 (at 0 1.8) (layer B.SilkS))
    (fp_text value TFT (at 0.0508 -2.1463) (layer B.Fab) hide)
    (pad 3 smd rect (at 1.3 0) (size 1 1.5) (layers B.Cu B.Mask)
      (net 68 PA23-SCL))
    (pad 2 smd rect (at 0 0) (size 1 1.5) (layers B.Cu B.Mask)
      (net 207 TFT-15))
    (pad 1 smd rect (at -1.3 0) (size 1 1.5) (layers B.Cu B.Mask)
      (net 202 PA07-D9-I2S-MCPINT-TFT))
  )
  (module TestPoint:TestPoint_THTPad_D1.5mm_Drill0.7mm (layer F.Cu) (tedit 5A0F774F)
    (at 61.0997 40.6527 180)
    (descr "THT pad as test Point, diameter 1.5mm, hole diameter 0.7mm")
    (tags "test point THT pad")
    (attr virtual)
    (fp_text reference AREF1 (at 0 -1.648) (layer F.SilkS))
    (fp_text value PA03-AREF (at 0 1.75) (layer F.Fab))
    (fp_text user %R (at 0 -1.65) (layer F.Fab))
    (pad 1 thru_hole circle (at 0 0 180) (size 1.5 1.5) (drill 0.7) (layers *.Cu *.Mask)
      (net 169 PA03-D42-AREF))
  )
  (module TestPoint:TestPoint_THTPad_D1.5mm_Drill0.7mm (layer F.Cu) (tedit 5A0F774F)
    (at 54.94528 39.46144)
    (descr "THT pad as test Point, diameter 1.5mm, hole diameter 0.7mm")
    (tags "test point THT pad")
    (attr virtual)
    (fp_text reference NMI1 (at 0.02286 -1.53924) (layer F.SilkS))
    (fp_text value PA08-NMI (at 0 1.75) (layer F.Fab))
    (fp_text user %R (at 0 -1.65) (layer F.Fab))
    (pad 1 thru_hole circle (at 0 0) (size 1.5 1.5) (drill 0.7) (layers *.Cu *.Mask)
      (net 174 PA08-D4-NMI))
  )
  (module MiniNetPad:PA1133 (layer F.Cu) (tedit 5E241120)
    (at 136.31418 61.47054 270)
    (fp_text reference PA1133-coil1 (at 5.38988 -0.06096) (layer F.SilkS))
    (fp_text value PA1133NLT (at -5.5118 -1.905) (layer F.Fab))
    (pad 1 smd rect (at 3.75 6.6 270) (size 1.27 2.54) (layers F.Cu F.Paste F.Mask)
      (net 67 "Net-(PA1133-coil1-Pad1)"))
    (pad 2 smd rect (at 1.25 6.6 270) (size 1.27 2.54) (layers F.Cu F.Paste F.Mask)
      (net 66 "Net-(PA1133-coil1-Pad2)"))
    (pad 3 smd rect (at -1.25 6.6 270) (size 1.27 2.54) (layers F.Cu F.Paste F.Mask)
      (net 28 /VPORTP))
    (pad 4 smd rect (at -3.75 6.6 270) (size 1.27 2.54) (layers F.Cu F.Paste F.Mask)
      (net 65 "Net-(PA1133-coil1-Pad4)"))
    (pad 8 smd rect (at 3.75 -6.6 270) (size 1.27 2.54) (layers F.Cu F.Paste F.Mask)
      (net 117 "Net-(D_PDS1040-Pad2)"))
    (pad 7 smd rect (at 1.25 -6.6 270) (size 1.27 2.54) (layers F.Cu F.Paste F.Mask)
      (net 117 "Net-(D_PDS1040-Pad2)"))
    (pad 6 smd rect (at -1.25 -6.6 270) (size 1.27 2.54) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 5 smd rect (at -3.75 -6.6 270) (size 1.27 2.54) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
  )
  (module MiniNetPad:PS2911 (layer F.Cu) (tedit 5E24117A)
    (at 121.5136 59.17692)
    (fp_text reference PS2911 (at 1.8034 0.64008 90) (layer F.SilkS))
    (fp_text value PS2911-1-F3-AX (at 0.6096 3.6068) (layer F.Fab) hide)
    (pad 4 smd rect (at -0.64 -2.35) (size 0.8 1) (layers F.Cu F.Paste F.Mask)
      (net 116 "Net-(D_PBAS1-Pad1)"))
    (pad 3 smd rect (at 0.64 -2.35) (size 0.8 1) (layers F.Cu F.Paste F.Mask)
      (net 27 GNDREF))
    (pad 1 smd rect (at -0.64 2.35) (size 0.8 1) (layers F.Cu F.Paste F.Mask)
      (net 70 "Net-(PS2911-Pad1)"))
    (pad 2 smd rect (at 0.54 2.35) (size 0.8 1) (layers F.Cu F.Paste F.Mask)
      (net 24 "Net-(CPCC1-Pad1)"))
  )
  (module MiniNetPad:Battery_CR1220 (layer F.Cu) (tedit 5E1684E0)
    (at 35.81146 61.6585 90)
    (descr "CR1220 battery")
    (tags "battery CR1220 coin cell")
    (attr virtual)
    (fp_text reference Battery-Cell1 (at 0.0254 8.1661 90) (layer F.SilkS))
    (fp_text value CR1220_Cell (at -1.6129 0.0762) (layer F.Fab) hide)
    (fp_text user + (at 8.4455 -2.53746 90) (layer F.SilkS))
    (fp_text user - (at -8.22706 -2.40284 90) (layer F.SilkS))
    (pad 2 smd rect (at -8.18 0 90) (size 3.66 2.6) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 1 smd rect (at 8.18 0 90) (size 3.66 2.6) (layers F.Cu F.Paste F.Mask)
      (net 119 "Net-(Battery-Cell1-Pad1)"))
    (pad 3 thru_hole circle (at -3.5 0 90) (size 1.18 1.18) (drill 1.06) (layers *.Cu *.Mask))
    (pad 3 thru_hole circle (at 4 0 90) (size 1.5748 1.5748) (drill 1.4478) (layers *.Cu *.Mask))
    (model ${KISYS3DMOD}/Battery.3dshapes/Battery_CR1225.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module MiniNetPad:RJ45_Wuerth_7499211121A_Horizontal (layer F.Cu) (tedit 5DC67AA1)
    (at 108.46054 12.63396 270)
    (descr "10/100Base-TX RJ45 ethernet magnetic transformer connector horizontal https://katalog.we-online.de/pbs/datasheet/7499010121A.pdf")
    (tags "RJ45 ethernet magnetic")
    (fp_text reference J_RJ45 (at -8.9 8.6) (layer F.SilkS))
    (fp_text value Wuerth_7499211121A (at 9.8 4.65) (layer F.Fab) hide)
    (fp_text user %R (at 0.05 0.05 180) (layer F.Fab) hide)
    (pad 12 thru_hole circle (at 4.09 -4.08 90) (size 1.2 1.2) (drill 0.7) (layers *.Cu *.Mask)
      (net 83 "Net-(J_RJ45-Pad12)"))
    (pad 9 thru_hole circle (at -4.445 8.89 90) (size 1.2 1.2) (drill 0.7) (layers *.Cu *.Mask)
      (net 37 /PP))
    (pad 11 thru_hole circle (at 6.661 -4.08 90) (size 1.2 1.2) (drill 0.7) (layers *.Cu *.Mask)
      (net 3 +3V3))
    (pad 10 thru_hole circle (at -5.715 6.35 90) (size 1.2 1.2) (drill 0.7) (layers *.Cu *.Mask)
      (net 36 /NN))
    (pad 16 thru_hole circle (at 7.745 3.05 90) (size 2.4 2.4) (drill 1.6) (layers *.Cu *.Mask)
      (net 17 GNDPWR))
    (pad 15 thru_hole circle (at -7.745 3.05 90) (size 2.4 2.4) (drill 1.6) (layers *.Cu *.Mask)
      (net 17 GNDPWR))
    (pad "" np_thru_hole circle (at 5.715 0 90) (size 3.250001 3.250001) (drill 3.250001) (layers *.Cu *.Mask))
    (pad "" np_thru_hole circle (at -5.715 0 90) (size 3.250001 3.250001) (drill 3.250001) (layers *.Cu *.Mask))
    (pad 8 thru_hole circle (at -3.175 6.35 90) (size 1.2 1.2) (drill 0.7) (layers *.Cu *.Mask))
    (pad 7 thru_hole circle (at -1.905 8.89 90) (size 1.2 1.2) (drill 0.7) (layers *.Cu *.Mask))
    (pad 6 thru_hole circle (at -0.635 6.35 90) (size 1.2 1.2) (drill 0.7) (layers *.Cu *.Mask)
      (net 82 "Net-(J_RJ45-Pad6)"))
    (pad 5 thru_hole circle (at 0.635 8.89 90) (size 1.2 1.2) (drill 0.7) (layers *.Cu *.Mask)
      (net 81 "Net-(J_RJ45-Pad5)"))
    (pad 4 thru_hole circle (at 1.905 6.35 90) (size 1.2 1.2) (drill 0.7) (layers *.Cu *.Mask)
      (net 22 "Net-(CNTCT1-Pad2)"))
    (pad 3 thru_hole circle (at 3.175 8.89 90) (size 1.2 1.2) (drill 0.7) (layers *.Cu *.Mask)
      (net 16 "Net-(CNRD1-Pad1)"))
    (pad 2 thru_hole circle (at 4.445 6.35 90) (size 1.2 1.2) (drill 0.7) (layers *.Cu *.Mask)
      (net 20 "Net-(CNRX-1-Pad1)"))
    (pad 1 thru_hole roundrect (at 5.715 8.89 90) (size 1.2 1.6) (drill 0.7) (layers *.Cu *.Mask) (roundrect_rratio 0.155)
      (net 19 "Net-(CNRX+1-Pad2)"))
    (pad 13 thru_hole circle (at -4.09 -4.08) (size 1.2 1.2) (drill 0.7) (layers *.Cu *.Mask)
      (net 3 +3V3))
    (pad 14 thru_hole circle (at -6.661 -4.08) (size 1.2 1.2) (drill 0.7) (layers *.Cu *.Mask)
      (net 80 "Net-(J_RJ45-Pad14)"))
    (model ${KISYS3DMOD}/Connector_RJ.3dshapes/RJ45_Wuerth_7499010121A_Horizontal.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module MiniNetPad:MicroSD (layer F.Cu) (tedit 5E5700CD)
    (at 0.3556 68.55206 90)
    (attr smd)
    (fp_text reference J_Micro_SD1 (at 6.3881 17.32534 90) (layer F.SilkS))
    (fp_text value Micro_SD_Card_Det (at 6.8707 12.1031 90) (layer F.SilkS) hide)
    (fp_text user %R (at 7.3729 10.44672 90) (layer F.Fab) hide)
    (fp_text user SWG (at 12.83462 11.04392) (layer F.SilkS))
    (fp_text user SWD (at 6.56082 14.04874 90) (layer F.SilkS))
    (pad 1 smd rect (at 4.45 3.8 90) (size 0.65 2.2) (layers F.Cu F.Paste F.Mask)
      (net 199 "Net-(J_Micro_SD1-Pad1)"))
    (pad 2 smd rect (at 5.55 3.8 90) (size 0.65 2.2) (layers F.Cu F.Paste F.Mask)
      (net 171 PA14-D2-SDCS))
    (pad 3 smd rect (at 6.65 3.8 90) (size 0.65 2.2) (layers F.Cu F.Paste F.Mask)
      (net 6 MOSISD))
    (pad 4 smd rect (at 7.75 3.8 90) (size 0.65 2.2) (layers F.Cu F.Paste F.Mask)
      (net 3 +3V3))
    (pad 5 smd rect (at 8.85 3.8 90) (size 0.65 2.2) (layers F.Cu F.Paste F.Mask)
      (net 7 SCKSD))
    (pad 6 smd rect (at 9.95 3.8 90) (size 0.65 2.2) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 7 smd rect (at 11.05 3.8 90) (size 0.65 2.2) (layers F.Cu F.Paste F.Mask)
      (net 2 MISOSD))
    (pad 8 smd rect (at 12.15 3.8 90) (size 0.65 2.2) (layers F.Cu F.Paste F.Mask)
      (net 200 "Net-(J_Micro_SD1-Pad8)"))
    (pad 11 smd rect (at 4.00558 15.51432 90) (size 1.8 1.524) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 11 smd rect (at 13.55 15.325 90) (size 1.5 1.15) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 11 smd rect (at 13.6 1 90) (size 1.4 1.9) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 11 smd rect (at 0.7 1 90) (size 1.4 1.9) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 9 smd rect (at 13.99032 10.9982 90) (size 1.143 1.4224) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 10 smd rect (at 6.5532 15.50162 90) (size 1.5 1.524) (layers F.Cu F.Paste F.Mask)
      (net 170 PA05-D18-A4-SDINT))
  )
  (module MiniNetPad:pad1007-2518 (layer F.Cu) (tedit 5DC67BD8)
    (at 84.4423 26.38806 180)
    (fp_text reference IND1 (at 0.2794 -1.8796) (layer F.SilkS))
    (fp_text value "10uH " (at 0.0508 1.9685) (layer F.Fab) hide)
    (pad 1 smd rect (at -1 0 180) (size 0.8 2) (layers F.Cu F.Paste F.Mask)
      (net 3 +3V3))
    (pad 2 smd rect (at 1 0 180) (size 0.8 2) (layers F.Cu F.Paste F.Mask)
      (net 9 +3.3VA))
  )
  (module MiniNetPad:COIL_VLCF5024 (layer F.Cu) (tedit 5DE95018)
    (at 27.82316 22.93874)
    (descr "Shielded Power Inductor SMD")
    (tags inductor)
    (attr smd)
    (fp_text reference LT1 (at 3.42392 -0.12446 90) (layer F.SilkS))
    (fp_text value 1.8mH (at 0 3.5814) (layer F.Fab) hide)
    (fp_text user %R (at -0.0254 0.0508) (layer F.Fab) hide)
    (pad 2 smd custom (at 2.15 0) (size 1.055 3.4) (layers F.Cu F.Paste F.Mask)
      (net 10 /3REG) (zone_connect 2)
      (options (clearance outline) (anchor rect))
      (primitives
        (gr_poly (pts
           (xy -1.4675 -1.7) (xy -0.8927 -0.8699) (xy -0.8927 0.8191) (xy -1.4675 1.7) (xy -1.4675 2.755)
           (xy -0.5275 2.755) (xy 0.5275 1.7) (xy 0.5275 -1.7) (xy -0.5275 -2.755) (xy -1.4675 -2.755)
) (width 0))
      ))
    (pad 1 smd custom (at -2.15 0) (size 1.055 3.4) (layers F.Cu F.Paste F.Mask)
      (net 60 "Net-(CTSW1-Pad2)") (zone_connect 2)
      (options (clearance outline) (anchor rect))
      (primitives
        (gr_poly (pts
           (xy 1.4675 -1.7) (xy 0.9562 -0.8191) (xy 0.9562 0.8699) (xy 1.4675 1.7) (xy 1.4675 2.755)
           (xy 0.5275 2.755) (xy -0.5275 1.7) (xy -0.5275 -1.7) (xy 0.5275 -2.755) (xy 1.4675 -2.755)
) (width 0))
      ))
    (model ${KISYS3DMOD}/Inductor_SMD.3dshapes/L_Coilcraft_LPS5030.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module MiniNetPad:SPDT-612-500ASSP1M2QE (layer F.Cu) (tedit 5E3DE942)
    (at 10.20572 18.19148)
    (descr "SPDT .100 switch")
    (tags SPDT)
    (fp_text reference SW_PWR1 (at 1.9431 -0.0635 90) (layer F.SilkS))
    (fp_text value SW_SPDT (at -7.1247 0.0127 90) (layer F.Fab) hide)
    (pad 1 thru_hole circle (at 0 -2.54) (size 1.8 1.8) (drill 1.1) (layers *.Cu *.Mask)
      (net 121 +3V0))
    (pad 2 thru_hole circle (at 0 0) (size 1.8 1.8) (drill 1.1) (layers *.Cu *.Mask)
      (net 198 "Net-(JP_PMONITOR1-Pad1)"))
    (pad 3 thru_hole circle (at 0 2.54) (size 1.8 1.8) (drill 1.1) (layers *.Cu *.Mask)
      (net 10 /3REG))
    (pad 4 thru_hole circle (at -5.08 -2.54) (size 1.8 1.8) (drill 1.1) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 4 thru_hole circle (at -5.08 2.54) (size 1.8 1.8) (drill 1.1) (layers *.Cu *.Mask)
      (net 1 GND))
  )
  (module MiniNetPad:Switch_Tactile_B3F (layer F.Cu) (tedit 5DC67A52)
    (at 3.45186 47.53356 270)
    (attr smd)
    (fp_text reference SW_RESET1 (at 0.13208 -3.48996 90) (layer F.SilkS))
    (fp_text value SW_B3F-3100 (at 0.1016 3.45948 90) (layer F.Fab) hide)
    (fp_text user %R (at 0.16256 -0.21336 90) (layer F.Fab) hide)
    (pad 1 thru_hole circle (at -2.25 1.25 180) (size 1.6 1.6) (drill 1.2) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 3 thru_hole circle (at -3.5 -1.25 180) (size 2.4 2.4) (drill 1.8) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 4 thru_hole circle (at 3.5 -1.25 180) (size 2.4 2.4) (drill 1.8) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 2 thru_hole circle (at 2.25 1.25 180) (size 1.6 1.6) (drill 1.2) (layers *.Cu *.Mask)
      (net 8 ~RESET~))
  )
  (gr_text N/C (at 25.4 76.835 90) (layer F.SilkS))
  (gr_text N/C (at 22.987 76.835 90) (layer F.SilkS))
  (gr_text PCELL (at 70.09638 63.35776) (layer B.SilkS))
  (gr_text "(c) Copyright S. Cooper 2020\nLicensed under CERN OHL v.1.2 " (at 41.2242 32.97936) (layer F.SilkS))
  (gr_text SDA (at 67.78498 44.97324 90) (layer B.SilkS))
  (gr_text "D15\nPB08" (at 61.78042 45.0977 90) (layer B.SilkS))
  (gr_text "D9\nPA07" (at 61.75756 48.72736 90) (layer B.SilkS))
  (gr_text SCL (at 67.79768 48.76546 90) (layer B.SilkS))
  (gr_text "(c) Copyright S. Cooper 2020\n\nLicensed under CERN OHL v.1.2 \n\nPlease see the CERN OHL v.1.2 for applicable conditions\nhttp://ohwr.org/cernohl" (at 35.84194 64.2874) (layer B.SilkS))
  (gr_text "Net CS\nPA15 D5" (at 111.13262 69.07276) (layer F.SilkS))
  (gr_text D44 (at 66.294 74.295) (layer F.SilkS))
  (gr_text A5 (at 69.977 67.183) (layer F.SilkS))
  (gr_text ANI0 (at 82.169 74.041 90) (layer F.SilkS))
  (gr_text ANI0 (at 81.9785 72.7583) (layer B.SilkS))
  (gr_text "Micro SD\n~CS~  PA14 D2\nDetect PA05 D18" (at 4.30022 60.77966 90) (layer B.SilkS))
  (gr_text "Network ~CS~\nPA15 D5" (at 113.157 56.769) (layer B.SilkS))
  (gr_text ~RESET (at 10.922 43.93184 90) (layer B.SilkS))
  (gr_text PMON (at 9.28878 10.08634) (layer B.SilkS))
  (gr_text TMP36 (at 82.10804 69.25564) (layer B.SilkS))
  (gr_text AREF (at 61.08446 39.18712) (layer B.SilkS))
  (gr_text "PoE diodes are\nin the RJ45 Socket" (at 128.397 26.9748) (layer F.SilkS))
  (gr_text MicroSD (at 2.6035 73.52538) (layer F.SilkS))
  (gr_text D44 (at 52.81168 60.20054) (layer B.SilkS))
  (gr_text D27 (at 20.78228 38.62832) (layer B.SilkS))
  (gr_text + (at 72.83704 66.10096) (layer F.SilkS))
  (gr_text +3 (at 79.37754 73.0631) (layer F.SilkS))
  (gr_text G (at 84.81822 73.1774) (layer F.SilkS))
  (gr_text JACK (at 19.304 11.176 90) (layer B.SilkS))
  (gr_text JACK (at 26.543 11.049 90) (layer B.SilkS))
  (gr_text NMI (at 54.991 38.05682) (layer B.SilkS))
  (gr_text * (at 77.25664 30.44952) (layer B.SilkS))
  (gr_text BAT+ (at 26.416 7.5184 90) (layer B.SilkS))
  (gr_text "EXTERNAL 2" (at 70.71868 2.4511) (layer B.SilkS))
  (gr_text "EXTERNAL 1" (at 38.16604 2.40538) (layer B.SilkS))
  (gr_text "Network Hardware reset\nvia Hardware reset button" (at 120.23598 67.28714 90) (layer B.SilkS))
  (gr_text "Network Hardware\nreset via software" (at 106.20248 67.06362 90) (layer B.SilkS))
  (gr_text "Unit Code" (at 82.59064 39.11092) (layer B.SilkS))
  (gr_text "———————————— TFT JACK ————————————" (at 35.67938 81.31048) (layer B.SilkS))
  (gr_text ANI0 (at 82.31378 16.17726) (layer B.SilkS))
  (gr_text * (at 80.30464 15.0749) (layer B.SilkS))
  (gr_text "To TFT Jack" (at 70.866 10.2362) (layer B.SilkS))
  (gr_text "Not used\nwith RA8875" (at 70.8152 19.431) (layer B.SilkS))
  (gr_text "PA07\nD9" (at 71.92264 48.27016) (layer B.SilkS))
  (gr_text ANI3 (at 80.0354 10.48258 90) (layer F.SilkS))
  (gr_text ANI1 (at 82.53984 10.4267 90) (layer F.SilkS))
  (gr_text ANI2 (at 80.01508 2.04216 90) (layer F.SilkS))
  (gr_text ANI0 (at 82.55508 2.0193 90) (layer F.SilkS))
  (gr_text "PA16 D11" (at 48.2854 78.0034 90) (layer F.SilkS))
  (gr_text "PA18 D10" (at 45.8724 78.0034 90) (layer F.SilkS))
  (gr_text "PA16\nD11" (at 62.25794 3.67538 90) (layer F.SilkS))
  (gr_text 3V (at 59.92368 10.01268 90) (layer F.SilkS))
  (gr_text "SDA or\nPB08 D15" (at 50.7746 78.13548 90) (layer F.SilkS))
  (gr_text "SCL or\nPA07-D9" (at 53.41112 78.02626 90) (layer F.SilkS))
  (gr_text "Default\nLED" (at 63.73622 76.53274) (layer F.SilkS))
  (gr_text "CPU\nPower" (at 70.08368 76.36256) (layer F.SilkS))
  (gr_text "Network Reset" (at 113.284 62.484) (layer B.SilkS))
  (gr_text GND (at 26.416 3.937 90) (layer B.SilkS))
  (gr_text "To TFT Jack" (at 64.643 42.672) (layer B.SilkS))
  (gr_text "3.3V to W5500" (at 87.75446 35.1536 90) (layer B.SilkS))
  (gr_text AtoD1 (at 69.93382 10.7823 90) (layer F.SilkS))
  (gr_text GP4 (at 72.37984 2.45872 90) (layer F.SilkS))
  (gr_text GP5 (at 72.44588 10.287 90) (layer F.SilkS))
  (gr_text AtoD2 (at 69.68998 1.76784 90) (layer F.SilkS))
  (gr_text GP3 (at 75.17638 10.36828 90) (layer F.SilkS))
  (gr_text GP1 (at 77.74432 10.30224 90) (layer F.SilkS))
  (gr_text GP2 (at 74.90206 2.4384 90) (layer F.SilkS))
  (gr_text GP0 (at 77.45222 2.4384 90) (layer F.SilkS))
  (gr_text "PA08\nD4" (at 44.54144 3.70586 90) (layer F.SilkS))
  (gr_text "PB09\nD16" (at 36.8808 75.01382) (layer B.SilkS))
  (gr_text "PB09 D16 WAIT" (at 40.70604 77.98816 90) (layer F.SilkS))
  (gr_text VJAC (at 34.5059 1.99136 90) (layer F.SilkS))
  (gr_text VBAT (at 31.89732 2.00914 90) (layer F.SilkS))
  (gr_text * (at 41.0972 31.55188) (layer B.SilkS))
  (gr_text "PB03\nD25" (at 40.36822 33.44164 90) (layer B.SilkS))
  (gr_text "SWDIO\nD45" (at 36.91128 33.36036 90) (layer B.SilkS))
  (gr_text PB10 (at 46.54804 21.60778 90) (layer B.SilkS))
  (gr_text PB11 (at 38.85184 16.55826 90) (layer B.SilkS))
  (gr_text "3.3V SRC\nSwitch" (at 7.76478 18.16862 90) (layer B.SilkS))
  (gr_text "Remote\nBattery\nMonitor" (at 53.4416 11.8364) (layer B.SilkS))
  (gr_text * (at 94.7928 75.41768) (layer B.SilkS))
  (gr_text PB23 (at 36.1188 16.1544 90) (layer B.SilkS))
  (gr_text PB22 (at 43.90136 21.19376 90) (layer B.SilkS))
  (gr_text "FLASH\nHardware\nPins" (at 44.18076 26.0604) (layer B.SilkS))
  (gr_text * (at 99.06762 4.79298) (layer B.SilkS))
  (gr_text * (at 93.83268 4.76504) (layer B.SilkS))
  (gr_text "PB08\nD15" (at 30.59938 45.78096) (layer B.SilkS))
  (gr_text 3.3V (at 66.15684 36.98748) (layer B.SilkS))
  (gr_text "PB02\nA5" (at 64.90208 64.6303) (layer B.SilkS))
  (gr_text * (at 71.02602 70.49516) (layer B.SilkS))
  (gr_text "3V Cell\nCR1220" (at 40.64 52.197) (layer F.SilkS))
  (gr_text "3.3V\nSource\nSwitch" (at 2.40792 18.25752 270) (layer F.SilkS))
  (gr_text PB03 (at 35.60572 23.9268 90) (layer B.SilkS))
  (gr_text PA12 (at 38.31082 24.26716 90) (layer B.SilkS))
  (gr_text "PA13\nD38" (at 43.92422 14.92504) (layer B.SilkS))
  (gr_text "PA09\nD3" (at 85.08746 59.39028) (layer B.SilkS))
  (gr_text "Remote\nBattery\nPack" (at 22.86 13.843) (layer B.SilkS))
  (gr_text 3V (at 56.88076 7.874 90) (layer B.SilkS))
  (gr_text SCL (at 49.784 4.572 90) (layer B.SilkS))
  (gr_text SDA (at 49.784 7.62 90) (layer B.SilkS))
  (gr_text GND (at 56.896 4.572 90) (layer B.SilkS))
  (gr_text BAT+ (at 19.431 7.493 90) (layer B.SilkS))
  (gr_text GND (at 19.431 3.937 90) (layer B.SilkS))
  (gr_text "Not used\nwith RA8875" (at 64.94018 52.7177) (layer B.SilkS))
  (gr_text * (at 18.81632 37.34816) (layer B.SilkS))
  (gr_text "25 May 2020" (at 104.14 39.51224) (layer B.SilkS))
  (gr_text "JACK\nBAT" (at 2.08026 25.12314) (layer F.SilkS))
  (gr_text "MiniNetPad Ver 0.01a" (at 104.87152 34.86404) (layer B.SilkS))
  (gr_text "Buzzer Vol" (at 78.6511 76.43368) (layer B.SilkS))
  (gr_text SWD (at 47.88662 42.47642) (layer B.SilkS))
  (gr_text "25 May 2020" (at 40.07612 30.75178) (layer F.SilkS))
  (gr_text "MiniNetPad\nVer 0.01a" (at 40.513 28.1178) (layer F.SilkS))
  (gr_text "BUZZER\nPA04\nD17" (at 79.9719 61.91758) (layer B.SilkS))
  (gr_text "BUZZER\nPA04 D17" (at 80.01 54.737) (layer F.SilkS))
  (gr_text 3V (at 17.8435 77.17536 90) (layer F.SilkS))
  (gr_text GND (at 20.46224 76.8604 90) (layer F.SilkS))
  (gr_text "PA20 D6\nLCS" (at 35.6108 78.14056 90) (layer F.SilkS))
  (gr_text "PA12 MISO" (at 30.62732 74.9046 90) (layer F.SilkS))
  (gr_text "PA19 D12 LINT" (at 43.3959 78.03896 90) (layer F.SilkS))
  (gr_text "PA21 D7 LRES" (at 38.12794 78.11516 90) (layer F.SilkS))
  (gr_text "PB11 SCK" (at 28.18638 75.06716 90) (layer F.SilkS))
  (gr_text "PB10 MOSI" (at 33.13938 74.89952 90) (layer F.SilkS))
  (gr_line (start 117.602 0) (end 117.602 24.638) (layer Edge.Cuts) (width 0.05))
  (gr_line (start 117.602 24.638) (end 146.05 24.638) (layer Edge.Cuts) (width 0.05))
  (gr_text "RJ45 10/100 Socket\nwith PoE Diodes" (at 107.40898 2.032) (layer F.SilkS))
  (gr_text "Input: Active PoE ~~48V\nOutput: 3.3V at Appr 600ma" (at 128.651 31.23184) (layer F.SilkS))
  (gr_text RJ45 (at 108.45292 12.62634) (layer B.SilkS))
  (gr_text ~RESET (at 3.62966 47.6377) (layer B.SilkS))
  (gr_text USB (at 2.58064 31.2928) (layer B.SilkS))
  (gr_text V+ (at 14.0462 7.6708) (layer B.SilkS))
  (gr_text GND (at 10.3124 3.6322 90) (layer B.SilkS))
  (gr_text GND (at 14.986 1.524) (layer B.SilkS))
  (gr_text ~RESET (at 114.63274 70.23862 90) (layer B.SilkS))
  (gr_text "PA06\nD8" (at 112.01146 69.65696 90) (layer B.SilkS))
  (gr_text "Buzzer Vol" (at 78.68412 81.788) (layer F.SilkS))
  (gr_text DUPLEX (at 94.3356 16.49476 90) (layer F.SilkS))
  (gr_text SPEED (at 91.3638 16.01978 90) (layer F.SilkS))
  (gr_text "6 - 16 VDC" (at 5.1816 1.1684) (layer F.SilkS))
  (gr_text PoE (at 1.72974 12.18946) (layer F.SilkS))
  (gr_text "PoE\nPower" (at 97.20072 76.54544) (layer F.SilkS))
  (gr_text "PA18\nD10" (at 62.28842 9.1059 90) (layer F.SilkS))
  (gr_text "PA11\nD0" (at 64.84366 3.67538 90) (layer F.SilkS))
  (gr_text "PA10\nD1" (at 64.82842 9.13638 90) (layer F.SilkS))
  (gr_text VBAT (at 31.88208 10.6426 90) (layer F.SilkS))
  (gr_text GND (at 29.3751 2.22758 90) (layer F.SilkS))
  (gr_text GND (at 29.33954 10.40638 90) (layer F.SilkS))
  (gr_text VJAC (at 34.45764 10.62482 90) (layer F.SilkS))
  (gr_text 3V (at 36.86048 2.70256 90) (layer F.SilkS))
  (gr_text "PB08\nD15" (at 42.11066 3.69062 90) (layer F.SilkS))
  (gr_text "PA07\nD9" (at 67.36588 3.66014 90) (layer F.SilkS))
  (gr_text "PA09\nD3" (at 44.71162 9.13638 90) (layer F.SilkS))
  (gr_text "PB11\nSCK" (at 39.40302 3.61442 90) (layer F.SilkS))
  (gr_text "PA12\nMISO" (at 36.85794 10.50798 90) (layer F.SilkS))
  (gr_text "PB10\nMOSI" (at 39.48938 10.51052 90) (layer F.SilkS))
  (gr_text GND (at 59.63666 2.1717 90) (layer F.SilkS))
  (gr_text SCL (at 47.00524 2.29616 90) (layer F.SilkS))
  (gr_text "PA02\nD14" (at 67.5513 9.0297 90) (layer F.SilkS))
  (gr_text ~RESET (at 42.15892 11.02614 90) (layer F.SilkS))
  (gr_text SDA (at 47.14748 10.49274 90) (layer F.SilkS))
  (gr_line (start 0 82.55) (end 0 0) (layer Edge.Cuts) (width 0.05))
  (gr_line (start 146.05 82.55) (end 0 82.55) (layer Edge.Cuts) (width 0.05))
  (gr_line (start 146.05 24.638) (end 146.05 82.55) (layer Edge.Cuts) (width 0.05))
  (gr_line (start 0 0) (end 117.602 0) (layer Edge.Cuts) (width 0.05))
  (zone (net 27) (net_name GNDREF) (layer B.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.2032))
    (min_thickness 0.2286)
    (fill yes (arc_segments 32) (thermal_gap 0.254) (thermal_bridge_width 0.254))
    (polygon
      (pts
        (xy 146.569827 33.133824) (xy 146.838628 68.546966) (xy 119.835972 68.399674) (xy 119.402706 33.020822)
      )
    )
  )
  (zone (net 27) (net_name GNDREF) (layer F.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.2032))
    (min_thickness 0.2286)
    (fill yes (arc_segments 32) (thermal_gap 0.254) (thermal_bridge_width 0.254))
    (polygon
      (pts
        (xy 146.681508 33.15716) (xy 146.811524 68.5419) (xy 119.746236 68.48094) (xy 119.574945 33.14446)
      )
    )
  )
  (zone (net 0) (net_name "") (layer F.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.2032))
    (min_thickness 0.254)
    (keepout (tracks not_allowed) (vias not_allowed) (copperpour not_allowed))
    (fill (arc_segments 32) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 14.63683 59.761835) (xy 16.622713 59.741753) (xy 16.640334 61.048424) (xy 14.654451 61.055806)
      )
    )
  )
  (zone (net 0) (net_name "") (layer F.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.2032))
    (min_thickness 0.254)
    (keepout (tracks not_allowed) (vias not_allowed) (copperpour not_allowed))
    (fill (arc_segments 32) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 14.835688 63.015111) (xy 16.391523 63.010371) (xy 16.406947 63.451401) (xy 14.841672 63.441329)
      )
    )
  )
  (zone (net 0) (net_name "") (layer F.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.2032))
    (min_thickness 0.254)
    (keepout (tracks not_allowed) (vias not_allowed) (copperpour not_allowed))
    (fill (arc_segments 32) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 12.293759 53.869749) (xy 14.818837 53.851017) (xy 14.849634 57.308274) (xy 12.308681 57.326371)
      )
    )
  )
  (zone (net 0) (net_name "") (layer F.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.2032))
    (min_thickness 0.254)
    (keepout (tracks not_allowed) (vias not_allowed) (copperpour not_allowed))
    (fill (arc_segments 32) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 9.25068 53.85308) (xy 10.305892 53.854192) (xy 10.298589 55.482649) (xy 9.23544 55.48376)
      )
    )
  )
  (zone (net 0) (net_name "") (layer F.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.2032))
    (min_thickness 0.254)
    (keepout (tracks not_allowed) (vias not_allowed) (copperpour not_allowed))
    (fill (arc_segments 32) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 16.714022 63.48408) (xy 16.717169 62.159039) (xy 17.090232 62.148562) (xy 17.08772 63.469158)
      )
    )
  )
  (zone (net 0) (net_name "") (layer F.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.2032))
    (min_thickness 0.254)
    (keepout (tracks not_allowed) (vias not_allowed) (copperpour not_allowed))
    (fill (arc_segments 32) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 14.622145 61.690885) (xy 14.62024 61.07938) (xy 14.81836 61.0743) (xy 14.826615 61.692155)
      )
    )
  )
  (zone (net 0) (net_name "") (layer F.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.2032))
    (min_thickness 0.254)
    (keepout (tracks not_allowed) (vias not_allowed) (copperpour not_allowed))
    (fill (arc_segments 32) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 2.709676 28.985345) (xy 3.044034 28.970294) (xy 3.02514 33.53816) (xy 2.682845 33.555434)
      )
    )
  )
  (zone (net 0) (net_name "") (layer F.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.2032))
    (min_thickness 0.254)
    (keepout (tracks not_allowed) (vias not_allowed) (copperpour not_allowed))
    (fill (arc_segments 32) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 14.596745 63.428245) (xy 14.59992 62.6872) (xy 14.79804 62.68212) (xy 14.801215 63.429515)
      )
    )
  )
  (zone (net 1) (net_name GND) (layer F.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.2032))
    (min_thickness 0.254)
    (fill yes (arc_segments 32) (thermal_gap 0.381) (thermal_bridge_width 0.381))
    (polygon
      (pts
        (xy 118.17477 -1.00584) (xy 118.655465 72.250935) (xy 88.064975 72.153145) (xy 87.7697 -0.84709)
      )
    )
  )
  (zone (net 1) (net_name GND) (layer B.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.2032))
    (min_thickness 0.254)
    (fill yes (arc_segments 32) (thermal_gap 0.381) (thermal_bridge_width 0.381))
    (polygon
      (pts
        (xy 118.03126 -0.61976) (xy 118.75643 72.158225) (xy 88.15705 72.057895) (xy 87.68588 -0.48895)
      )
    )
  )
  (zone (net 1) (net_name GND) (layer F.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.2032))
    (min_thickness 0.254)
    (fill yes (arc_segments 32) (thermal_gap 0.381) (thermal_bridge_width 0.381))
    (polygon
      (pts
        (xy -1.016 -1.016) (xy 86.86546 -1.1557) (xy 86.86546 83.1723) (xy -1.016 83.312)
      )
    )
  )
  (zone (net 1) (net_name GND) (layer B.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.2032))
    (min_thickness 0.254)
    (fill yes (arc_segments 32) (thermal_gap 0.381) (thermal_bridge_width 0.381))
    (polygon
      (pts
        (xy -0.95758 -1.17094) (xy 86.96706 -1.07188) (xy 86.96706 83.25612) (xy -0.95758 83.15706)
      )
    )
  )
  (zone (net 0) (net_name "") (layer B.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.2032))
    (min_thickness 0.254)
    (keepout (tracks allowed) (vias allowed) (copperpour not_allowed))
    (fill (arc_segments 32) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 88.82761 32.73298) (xy 91.41079 32.74822) (xy 91.411425 37.24656) (xy 88.826975 37.22624)
      )
    )
  )
  (zone (net 0) (net_name "") (layer B.Mask) (hatch edge 0.508)
    (connect_pads (clearance 0.2032))
    (min_thickness 0.254)
    (fill yes (arc_segments 32) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 88.824027 32.810977) (xy 91.395777 32.799547) (xy 91.401175 37.17057) (xy 88.81863 37.162315)
      )
    )
  )
)
