(kicad_pcb (version 20221018) (generator pcbnew)
  (general
    (thickness 1.6)
  )
  (paper "A4")
  (layers
    (0 "F.Cu" signal)
    (31 "B.Cu" signal)
    (32 "B.Adhes" user "B.Adhesive")
    (33 "F.Adhes" user "F.Adhesive")
    (34 "B.Paste" user)
    (35 "F.Paste" user)
    (36 "B.SilkS" user "B.Silkscreen")
    (37 "F.SilkS" user "F.Silkscreen")
    (38 "B.Mask" user)
    (39 "F.Mask" user)
    (40 "Dwgs.User" user "User.Drawings")
    (41 "Cmts.User" user "User.Comments")
    (42 "Eco1.User" user "User.Eco1")
    (43 "Eco2.User" user "User.Eco2")
    (44 "Edge.Cuts" user)
    (45 "Margin" user)
    (46 "B.CrtYd" user "B.Courtyard")
    (47 "F.CrtYd" user "F.Courtyard")
    (48 "B.Fab" user)
    (49 "F.Fab" user)
    (50 "User.1" user)
    (51 "User.2" user)
    (52 "User.3" user)
    (53 "User.4" user)
    (54 "User.5" user)
    (55 "User.6" user)
    (56 "User.7" user)
    (57 "User.8" user)
    (58 "User.9" user)
  )
  (setup
    (pad_to_mask_clearance 0)
    (pcbplotparams
      (layerselection 0x00010fc_ffffffff)
      (plot_on_all_layers_selection 0x0000000_00000000)
      (disableapertmacros false)
      (usegerberextensions false)
      (usegerberattributes true)
      (usegerberadvancedattributes true)
      (creategerberjobfile true)
      (dashed_line_dash_ratio 12.000000)
      (dashed_line_gap_ratio 3.000000)
      (svgprecision 4)
      (plotframeref false)
      (viasonmask false)
      (mode 1)
      (useauxorigin false)
      (hpglpennumber 1)
      (hpglpenspeed 20)
      (hpglpendiameter 15.000000)
      (dxfpolygonmode true)
      (dxfimperialunits true)
      (dxfusepcbnewfont true)
      (psnegative false)
      (psa4output false)
      (plotreference true)
      (plotvalue true)
      (plotinvisibletext false)
      (sketchpadsonfab false)
      (subtractmaskfromsilk false)
      (outputformat 1)
      (mirror false)
      (drillshape 0)
      (scaleselection 1)
      (outputdirectory "D:/KiCad/E-Suvivability SG Round Boards/")
    )
  )
  (net 0 "")
  (footprint "TestPoint:TestPoint_THTPad_D1.0mm_Drill0.5mm" (layer "F.Cu")
    (at 125.73 138.43)
    (descr "THT pad as test Point, diameter 1.0mm, hole diameter 0.5mm")
    (tags "test point THT pad")
    (attr exclude_from_pos_files exclude_from_bom)
    (fp_text reference "REF**" (at 0 -1.448) (layer "F.SilkS") hide)
    (fp_text value "TestPoint_THTPad_D1.0mm_Drill0.5mm" (at 0 1.55) (layer "F.Fab"))
    (pad "1" thru_hole circle (at 0 0) (size 1 1) (drill 0.5) (layers "*.Cu" "F.Mask"))
  )
  (footprint "TestPoint:TestPoint_THTPad_D1.5mm_Drill0.7mm" (layer "F.Cu")
    (at 137.16 132.08)
    (descr "THT pad as test Point, diameter 1.5mm, hole diameter 0.7mm")
    (tags "test point THT pad")
    (attr exclude_from_pos_files exclude_from_bom)
    (fp_text reference "B3" (at 0 -1.648) (layer "F.SilkS"))
    (fp_text value "TestPoint_THTPad_D1.5mm_Drill0.7mm" (at 0 1.75) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 -1.648) (layer "B.SilkS"))
    (fp_text user "${REFERENCE}" (at 0 -1.65) (layer "F.Fab"))
    (pad "1" thru_hole circle (at 0 0) (size 1.651 1.5) (drill 0.7874) (layers "*.Cu" "*.Mask"))
  )
  (footprint "MountingHole:MountingHole_2.1mm" (layer "F.Cu")
    (at 142.9512 136.2075)
    (descr "Mounting Hole 2.1mm, no annular")
    (tags "mounting hole 2.1mm no annular")
    (attr exclude_from_pos_files exclude_from_bom)
    (fp_text reference "REF**" (at 0 -3.2) (layer "F.SilkS") hide)
    (fp_text value "MountingHole_2.1mm" (at 0 3.2) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab"))
    (pad "" np_thru_hole circle (at 0 0) (size 2.2606 2.2606) (drill 2.2606) (layers "F&B.Cu" "*.Mask"))
  )
  (footprint "TestPoint:TestPoint_THTPad_D1.5mm_Drill0.7mm" (layer "F.Cu")
    (at 119.38 121.92)
    (descr "THT pad as test Point, diameter 1.5mm, hole diameter 0.7mm")
    (tags "test point THT pad")
    (attr exclude_from_pos_files exclude_from_bom)
    (fp_text reference "T1" (at 0 -1.648) (layer "B.SilkS"))
    (fp_text value "TestPoint_THTPad_D1.5mm_Drill0.7mm" (at 0 1.75) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 -1.648) (layer "F.SilkS"))
    (fp_text user "${REFERENCE}" (at 0 -1.65) (layer "F.Fab"))
    (pad "1" thru_hole circle (at 0 0) (size 1.651 1.5) (drill 0.7874) (layers "*.Cu" "*.Mask"))
  )
  (footprint "TestPoint:TestPoint_THTPad_D1.5mm_Drill0.7mm" (layer "F.Cu")
    (at 116.84 132.08)
    (descr "THT pad as test Point, diameter 1.5mm, hole diameter 0.7mm")
    (tags "test point THT pad")
    (attr exclude_from_pos_files exclude_from_bom)
    (fp_text reference "T3" (at 0 -1.648) (layer "F.SilkS"))
    (fp_text value "TestPoint_THTPad_D1.5mm_Drill0.7mm" (at 0 1.75) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 -1.648) (layer "B.SilkS"))
    (fp_text user "${REFERENCE}" (at 0 -1.65) (layer "F.Fab"))
    (pad "1" thru_hole circle (at 0 0) (size 1.651 1.5) (drill 0.7874) (layers "*.Cu" "*.Mask"))
  )
  (footprint "TestPoint:TestPoint_THTPad_D1.0mm_Drill0.5mm" (layer "F.Cu")
    (at 129.54 139.7)
    (descr "THT pad as test Point, diameter 1.0mm, hole diameter 0.5mm")
    (tags "test point THT pad")
    (attr exclude_from_pos_files exclude_from_bom)
    (fp_text reference "REF**" (at 0 -1.448) (layer "F.SilkS") hide)
    (fp_text value "TestPoint_THTPad_D1.0mm_Drill0.5mm" (at 0 1.55) (layer "F.Fab"))
    (pad "1" thru_hole circle (at 0 0) (size 1 1) (drill 0.5) (layers "*.Cu" "F.Mask"))
  )
  (footprint "TestPoint:TestPoint_THTPad_D1.5mm_Drill0.7mm" (layer "F.Cu")
    (at 118.11 127)
    (descr "THT pad as test Point, diameter 1.5mm, hole diameter 0.7mm")
    (tags "test point THT pad")
    (attr exclude_from_pos_files exclude_from_bom)
    (fp_text reference "T2" (at 0 -1.648) (layer "B.SilkS"))
    (fp_text value "TestPoint_THTPad_D1.5mm_Drill0.7mm" (at 0 1.75) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 -1.648) (layer "F.SilkS"))
    (fp_text user "${REFERENCE}" (at 0 -1.65) (layer "F.Fab"))
    (pad "1" thru_hole circle (at 0 0) (size 1.651 1.5) (drill 0.7874) (layers "*.Cu" "*.Mask"))
  )
  (footprint "TestPoint:TestPoint_THTPad_D1.5mm_Drill0.7mm" (layer "F.Cu")
    (at 134.62 121.92)
    (descr "THT pad as test Point, diameter 1.5mm, hole diameter 0.7mm")
    (tags "test point THT pad")
    (attr exclude_from_pos_files exclude_from_bom)
    (fp_text reference "B1" (at 0 -1.648) (layer "F.SilkS"))
    (fp_text value "TestPoint_THTPad_D1.5mm_Drill0.7mm" (at 0 1.75) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 -1.648) (layer "B.SilkS"))
    (fp_text user "${REFERENCE}" (at 0 -1.65) (layer "F.Fab"))
    (pad "1" thru_hole circle (at 0 0) (size 1.651 1.5) (drill 0.7874) (layers "*.Cu" "*.Mask"))
  )
  (footprint "Connector_Wire:SolderWirePad_1x01_SMD_1x2mm" (layer "F.Cu")
    (at 123.19 138.43)
    (descr "Wire Pad, Square, SMD Pad,  1mm x 2mm,")
    (tags "MesurementPoint Square SMDPad 1mmx2mm ")
    (attr exclude_from_pos_files exclude_from_bom)
    (fp_text reference "T1" (at 0 2.54) (layer "F.SilkS"))
    (fp_text value "SolderWirePad_1x01_SMD_1x2mm" (at 0 2.54) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 2.54) (layer "F.Fab"))
    (pad "1" smd roundrect (at 0 0) (size 1 2) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25))
  )
  (footprint "Connector_Wire:SolderWirePad_1x01_SMD_1x2mm" (layer "F.Cu")
    (at 127 139.7)
    (descr "Wire Pad, Square, SMD Pad,  1mm x 2mm,")
    (tags "MesurementPoint Square SMDPad 1mmx2mm ")
    (attr exclude_from_pos_files exclude_from_bom)
    (fp_text reference "T2" (at 0 2.54) (layer "F.SilkS"))
    (fp_text value "SolderWirePad_1x01_SMD_1x2mm" (at 0 2.54) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 2.54) (layer "F.Fab"))
    (pad "1" smd roundrect (at 0 0) (size 1 2) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25))
  )
  (footprint "MountingHole:MountingHole_2.1mm" (layer "F.Cu")
    (at 127 108.585)
    (descr "Mounting Hole 2.1mm, no annular")
    (tags "mounting hole 2.1mm no annular")
    (attr exclude_from_pos_files exclude_from_bom)
    (fp_text reference "REF**" (at 0 -3.2) (layer "F.SilkS"))
    (fp_text value "MountingHole_2.1mm" (at 0 3.2) (layer "F.Fab"))
    (pad "" np_thru_hole circle (at 0 0) (size 2.2606 2.2606) (drill 2.2606) (layers "F&B.Cu" "*.Mask"))
  )
  (footprint "MountingHole:MountingHole_2.1mm" (layer "F.Cu")
    (at 111.05134 136.2075)
    (descr "Mounting Hole 2.1mm, no annular")
    (tags "mounting hole 2.1mm no annular")
    (attr exclude_from_pos_files exclude_from_bom)
    (fp_text reference "REF**" (at 0 -3.2) (layer "F.SilkS") hide)
    (fp_text value "MountingHole_2.1mm" (at 0 3.2) (layer "F.Fab"))
    (pad "" np_thru_hole circle (at 0 0) (size 2.2606 2.2606) (drill 2.2606) (layers "F&B.Cu" "*.Mask"))
  )
  (footprint "Connector_Wire:SolderWirePad_1x01_SMD_1x2mm" (layer "F.Cu")
    (at 130.81 140.97)
    (descr "Wire Pad, Square, SMD Pad,  1mm x 2mm,")
    (tags "MesurementPoint Square SMDPad 1mmx2mm ")
    (attr exclude_from_pos_files exclude_from_bom)
    (fp_text reference "T3" (at 0 2.54) (layer "F.SilkS"))
    (fp_text value "SolderWirePad_1x01_SMD_1x2mm" (at 0 2.54) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 2.54) (layer "F.Fab"))
    (pad "1" smd roundrect (at 0 0) (size 1 2) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25))
  )
  (footprint "TestPoint:TestPoint_THTPad_D1.0mm_Drill0.5mm" (layer "F.Cu")
    (at 121.92 137.16)
    (descr "THT pad as test Point, diameter 1.0mm, hole diameter 0.5mm")
    (tags "test point THT pad")
    (attr exclude_from_pos_files exclude_from_bom)
    (fp_text reference "REF**" (at 0 -1.448) (layer "F.SilkS") hide)
    (fp_text value "TestPoint_THTPad_D1.0mm_Drill0.5mm" (at 0 1.55) (layer "F.Fab"))
    (pad "1" thru_hole circle (at 0 0) (size 1 1) (drill 0.5) (layers "*.Cu" "F.Mask"))
  )
  (footprint "TestPoint:TestPoint_THTPad_D1.5mm_Drill0.7mm" (layer "F.Cu")
    (at 135.89 127)
    (descr "THT pad as test Point, diameter 1.5mm, hole diameter 0.7mm")
    (tags "test point THT pad")
    (attr exclude_from_pos_files exclude_from_bom)
    (fp_text reference "B2" (at 0 -1.648) (layer "F.SilkS"))
    (fp_text value "TestPoint_THTPad_D1.5mm_Drill0.7mm" (at 0 1.75) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 -1.648) (layer "B.SilkS"))
    (fp_text user "${REFERENCE}" (at 0 -1.65) (layer "F.Fab"))
    (pad "1" thru_hole circle (at 0 0) (size 1.651 1.5) (drill 0.7874) (layers "*.Cu" "*.Mask"))
  )
  (footprint "TestPoint:TestPoint_THTPad_D1.0mm_Drill0.5mm" (layer "B.Cu")
    (at 124.46 139.7 180)
    (descr "THT pad as test Point, diameter 1.0mm, hole diameter 0.5mm")
    (tags "test point THT pad")
    (attr exclude_from_pos_files exclude_from_bom)
    (fp_text reference "REF**" (at 0 1.448) (layer "B.SilkS") hide)
    (fp_text value "TestPoint_THTPad_D1.0mm_Drill0.5mm" (at 0 -1.55) (layer "B.Fab"))
    (pad "1" thru_hole circle (at 0 0 180) (size 1 1) (drill 0.5) (layers "*.Cu" "B.Mask"))
  )
  (footprint "TestPoint:TestPoint_THTPad_D1.0mm_Drill0.5mm" (layer "B.Cu")
    (at 132.08 137.16 180)
    (descr "THT pad as test Point, diameter 1.0mm, hole diameter 0.5mm")
    (tags "test point THT pad")
    (attr exclude_from_pos_files exclude_from_bom)
    (fp_text reference "REF**" (at 0 1.448) (layer "B.SilkS") hide)
    (fp_text value "TestPoint_THTPad_D1.0mm_Drill0.5mm" (at 0 -1.55) (layer "B.Fab"))
    (pad "1" thru_hole circle (at 0 0 180) (size 1 1) (drill 0.5) (layers "*.Cu" "B.Mask"))
  )
  (footprint "Connector_Wire:SolderWirePad_1x01_SMD_1x2mm" (layer "B.Cu")
    (at 123.19 140.97 180)
    (descr "Wire Pad, Square, SMD Pad,  1mm x 2mm,")
    (tags "MesurementPoint Square SMDPad 1mmx2mm ")
    (attr exclude_from_pos_files exclude_from_bom)
    (fp_text reference "B3" (at 0 -2.54) (layer "B.SilkS"))
    (fp_text value "SolderWirePad_1x01_SMD_1x2mm" (at 0 -2.54) (layer "B.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0) (layer "B.Fab"))
    (pad "1" smd roundrect (at 0 0 180) (size 1 2) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25))
  )
  (footprint "TestPoint:TestPoint_THTPad_D1.0mm_Drill0.5mm" (layer "B.Cu")
    (at 128.27 138.43 180)
    (descr "THT pad as test Point, diameter 1.0mm, hole diameter 0.5mm")
    (tags "test point THT pad")
    (attr exclude_from_pos_files exclude_from_bom)
    (fp_text reference "REF**" (at 0 1.448) (layer "B.SilkS") hide)
    (fp_text value "TestPoint_THTPad_D1.0mm_Drill0.5mm" (at 0 -1.55) (layer "B.Fab"))
    (pad "1" thru_hole circle (at 0 0 180) (size 1 1) (drill 0.5) (layers "*.Cu" "B.Mask"))
  )
  (footprint "Connector_Wire:SolderWirePad_1x01_SMD_1x2mm" (layer "B.Cu")
    (at 127 139.7 180)
    (descr "Wire Pad, Square, SMD Pad,  1mm x 2mm,")
    (tags "MesurementPoint Square SMDPad 1mmx2mm ")
    (attr exclude_from_pos_files exclude_from_bom)
    (fp_text reference "B2" (at 0 -2.54) (layer "B.SilkS"))
    (fp_text value "SolderWirePad_1x01_SMD_1x2mm" (at 0 -2.54) (layer "B.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0) (layer "B.Fab"))
    (pad "1" smd roundrect (at 0 0 180) (size 1 2) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25))
  )
  (footprint "Connector_Wire:SolderWirePad_1x01_SMD_1x2mm" (layer "B.Cu")
    (at 130.81 138.43 180)
    (descr "Wire Pad, Square, SMD Pad,  1mm x 2mm,")
    (tags "MesurementPoint Square SMDPad 1mmx2mm ")
    (attr exclude_from_pos_files exclude_from_bom)
    (fp_text reference "B1" (at 0 -2.54) (layer "B.SilkS"))
    (fp_text value "SolderWirePad_1x01_SMD_1x2mm" (at 0 -2.54) (layer "B.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0) (layer "B.Fab"))
    (pad "1" smd roundrect (at 0 0 180) (size 1 2) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25))
  )
  (gr_circle (center 127 127) (end 147.6375 127)
    (fill none) (layer "Edge.Cuts"))
  (gr_text "E-SURVIVABILITY SG BOARD\nDESIGNER J SCHEPP\nFAB OSH PARK" (at 127 114.3) (layer "B.SilkS"))
)
