(kicad_pcb (version 20211014) (generator pcbnew)
  (general
    (thickness 1.6)
  )
  (paper "A4")
  (layers
    (0 "F.Cu" signal)
    (31 "B.Cu" signal)
    (32 "B.Adhes" user "B.Adhesive")
    (33 "F.Adhes" user "F.Adhesive")
    (34 "B.Paste" user)
    (35 "F.Paste" user)
    (36 "B.SilkS" user "B.Silkscreen")
    (37 "F.SilkS" user "F.Silkscreen")
    (38 "B.Mask" user)
    (39 "F.Mask" user)
    (40 "Dwgs.User" user "User.Drawings")
    (41 "Cmts.User" user "User.Comments")
    (42 "Eco1.User" user "User.Eco1")
    (43 "Eco2.User" user "User.Eco2")
    (44 "Edge.Cuts" user)
    (45 "Margin" user)
    (46 "B.CrtYd" user "B.Courtyard")
    (47 "F.CrtYd" user "F.Courtyard")
    (48 "B.Fab" user)
    (49 "F.Fab" user)
    (50 "User.1" user "Nutzer.1")
    (51 "User.2" user "Nutzer.2")
    (52 "User.3" user "Nutzer.3")
    (53 "User.4" user "Nutzer.4")
    (54 "User.5" user "Nutzer.5")
    (55 "User.6" user "Nutzer.6")
    (56 "User.7" user "Nutzer.7")
    (57 "User.8" user "Nutzer.8")
    (58 "User.9" user "Nutzer.9")
  )
  (setup
    (stackup
      (layer "F.SilkS" (type "Top Silk Screen"))
      (layer "F.Paste" (type "Top Solder Paste"))
      (layer "F.Mask" (type "Top Solder Mask") (thickness 0.01))
      (layer "F.Cu" (type "copper") (thickness 0.035))
      (layer "dielectric 1" (type "core") (thickness 1.51) (material "FR4") (epsilon_r 4.5) (loss_tangent 0.02))
      (layer "B.Cu" (type "copper") (thickness 0.035))
      (layer "B.Mask" (type "Bottom Solder Mask") (thickness 0.01))
      (layer "B.Paste" (type "Bottom Solder Paste"))
      (layer "B.SilkS" (type "Bottom Silk Screen"))
      (copper_finish "None")
      (dielectric_constraints no)
    )
    (pad_to_mask_clearance 0)
    (pcbplotparams
      (layerselection 0x00010fc_ffffffff)
      (disableapertmacros false)
      (usegerberextensions false)
      (usegerberattributes true)
      (usegerberadvancedattributes true)
      (creategerberjobfile true)
      (svguseinch false)
      (svgprecision 6)
      (excludeedgelayer true)
      (plotframeref false)
      (viasonmask false)
      (mode 1)
      (useauxorigin false)
      (hpglpennumber 1)
      (hpglpenspeed 20)
      (hpglpendiameter 15.000000)
      (dxfpolygonmode true)
      (dxfimperialunits true)
      (dxfusepcbnewfont true)
      (psnegative false)
      (psa4output false)
      (plotreference true)
      (plotvalue true)
      (plotinvisibletext false)
      (sketchpadsonfab false)
      (subtractmaskfromsilk false)
      (outputformat 1)
      (mirror false)
      (drillshape 0)
      (scaleselection 1)
      (outputdirectory "gerbers/")
    )
  )
  (net 0 "")
  (net 1 "/EN")
  (net 2 "/OUT")
  (net 3 "/R_{ext}")
  (net 4 "GND")
  (footprint "Package_TO_SOT_SMD:SOT-23-6" (layer "F.Cu")
    (tedit 5F6F9B37)
    (at 153.8025 71.12)
    (descr "SOT, 6 Pin (https://www.jedec.org/sites/default/files/docs/Mo-178c.PDF variant AB), generated with kicad-footprint-generator ipc_gullwing_generator.py")
    (tags "SOT TO_SOT_SMD")
    (property "Reference" "U1")
    (property "Sheetfile" "BCR42xUW6_Breakout.kicad_sch")
    (property "Sheetname" "")
    (property "Value" "BCR42XUW6")
    (attr smd)
    (fp_text reference "U1" (at -1.6565 -2.159) (layer "F.SilkS"))
    (fp_text value "BCR42XUW6" (at 0 2.4) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab"))
    (pad "1" smd roundrect (at -1.1375 -0.95) (size 1.325 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 1 "/EN") (pinfunction "EN") (pintype "passive"))
    (pad "2" smd roundrect (at -1.1375 0) (size 1.325 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 2 "/OUT") (pinfunction "OUT") (pintype "passive"))
    (pad "3" smd roundrect (at -1.1375 0.95) (size 1.325 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 2 "/OUT") (pinfunction "OUT") (pintype "bidirectional"))
    (pad "4" smd roundrect (at 1.1375 0.95) (size 1.325 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 4 "GND") (pinfunction "GND") (pintype "power_in"))
    (pad "5" smd roundrect (at 1.1375 0) (size 1.325 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 2 "/OUT") (pinfunction "OUT") (pintype "bidirectional"))
    (pad "6" smd roundrect (at 1.1375 -0.95) (size 1.325 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 3 "/R_{ext}") (pinfunction "R_{ext}") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Package_TO_SOT_SMD.3dshapes/SOT-23-6.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Connector_PinHeader_2.54mm:PinHeader_1x03_P2.54mm_Vertical" (layer "B.Cu")
    (tedit 59FED5CC)
    (at 147.32 68.58 180)
    (descr "Through hole straight pin header, 1x03, 2.54mm pitch, single row")
    (tags "Through hole pin header THT 1x03 2.54mm single row")
    (property "Sheetfile" "BCR42xUW6_Breakout.kicad_sch")
    (property "Sheetname" "")
    (attr through_hole)
    (fp_text reference "J1" (at 2.794 1.27) (layer "B.SilkS") hide)
    (fp_text value "Conn_01x03_Male" (at 0 -7.41) (layer "B.Fab"))
    (fp_text user "${REFERENCE}" (at 0 -2.54 90) (layer "B.Fab"))
    (pad "1" thru_hole rect (at 0 0 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 1 "/EN") (pinfunction "Pin_1") (pintype "passive"))
    (pad "2" thru_hole oval (at 0 -2.54 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 2 "/OUT") (pinfunction "Pin_2") (pintype "passive"))
    (pad "3" thru_hole oval (at 0 -5.08 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 2 "/OUT") (pinfunction "Pin_3") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Connector_PinHeader_2.54mm.3dshapes/PinHeader_1x03_P2.54mm_Vertical.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "mech:MyBasic_rounded_50_1" (layer "B.Cu")
    (tedit 0)
    (at 153.8025 71.12 180)
    (property "Reference" "Lg?")
    (property "Sheetfile" "BCR42xUW6_Breakout.kicad_sch")
    (property "Sheetname" "")
    (property "Value" "logo")
    (attr through_hole)
    (fp_text reference "Lg1" (at 0 0) (layer "B.SilkS") hide)
    (fp_text value "logo" (at 0.75 0) (layer "B.SilkS") hide)
  )
  (footprint "Connector_PinHeader_2.54mm:PinHeader_1x03_P2.54mm_Vertical" (layer "B.Cu")
    (tedit 59FED5CC)
    (at 160.02 68.58 180)
    (descr "Through hole straight pin header, 1x03, 2.54mm pitch, single row")
    (tags "Through hole pin header THT 1x03 2.54mm single row")
    (property "Sheetfile" "BCR42xUW6_Breakout.kicad_sch")
    (property "Sheetname" "")
    (attr through_hole)
    (fp_text reference "J2" (at -2.667 1.397) (layer "B.SilkS") hide)
    (fp_text value "Conn_01x03_Male" (at 0 -7.41) (layer "B.Fab"))
    (fp_text user "${REFERENCE}" (at 0 -2.54 90) (layer "B.Fab"))
    (pad "1" thru_hole rect (at 0 0 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 3 "/R_{ext}") (pinfunction "Pin_1") (pintype "passive"))
    (pad "2" thru_hole oval (at 0 -2.54 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 2 "/OUT") (pinfunction "Pin_2") (pintype "passive"))
    (pad "3" thru_hole oval (at 0 -5.08 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 4 "GND") (pinfunction "Pin_3") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Connector_PinHeader_2.54mm.3dshapes/PinHeader_1x03_P2.54mm_Vertical.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (gr_rect (start 144.78 66.04) (end 162.56 76.2) (layer "Edge.Cuts") (width 0.1) (fill none))
  (gr_text "BCR42xUW6 Breakout\nRev 1" (at 153.797 74.549) (layer "B.SilkS"))
  (gr_text "1.EN" (at 148.59 68.453) (layer "F.SilkS"))
  (gr_text "5.OUT" (at 158.75 71.12) (layer "F.SilkS"))
  (gr_text "5.R_{ext}" (at 158.75 68.58) (layer "F.SilkS"))
  (gr_text "2.OUT" (at 148.59 71.12) (layer "F.SilkS"))
  (gr_text "4.GND" (at 158.75 73.66) (layer "F.SilkS"))
  (gr_text "3.OUT" (at 148.717 73.66) (layer "F.SilkS"))
  (gr_text "BCR42xUW6" (at 153.797 75.184) (layer "F.SilkS"))
  (zone (net 2) (net_name "/OUT") (layer "F.Cu") (hatch edge 0.508)
    (connect_pads (clearance 0.508))
    (min_thickness 0.254) (filled_areas_thickness no)
    (fill yes (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 162.56 76.2)
        (xy 144.78 76.2)
        (xy 144.78 66.04)
        (xy 162.56 66.04)
      )
    )
  )
)
