(kicad_pcb (version 20171130) (host pcbnew "(5.1.4)-1")
  (general
    (thickness 1.6)
    (drawings 45)
    (tracks 416)
    (zones 0)
    (modules 25)
    (nets 40)
  )
  (page A4)
  (layers
    (0 F.Cu signal)
    (31 B.Cu signal)
    (32 B.Adhes user hide)
    (33 F.Adhes user hide)
    (34 B.Paste user hide)
    (35 F.Paste user hide)
    (36 B.SilkS user)
    (37 F.SilkS user hide)
    (38 B.Mask user hide)
    (39 F.Mask user)
    (40 Dwgs.User user hide)
    (41 Cmts.User user hide)
    (42 Eco1.User user hide)
    (43 Eco2.User user)
    (44 Edge.Cuts user)
    (45 Margin user hide)
    (46 B.CrtYd user hide)
    (47 F.CrtYd user hide)
    (48 B.Fab user)
    (49 F.Fab user)
  )
  (setup
    (last_trace_width 0.1524)
    (trace_clearance 0.1524)
    (zone_clearance 0.2)
    (zone_45_only no)
    (trace_min 0.1524)
    (via_size 0.381)
    (via_drill 0.254)
    (via_min_size 0.381)
    (via_min_drill 0.254)
    (uvia_size 0.3)
    (uvia_drill 0.254)
    (uvias_allowed no)
    (uvia_min_size 0.2)
    (uvia_min_drill 0.1)
    (edge_width 0.05)
    (segment_width 0.2)
    (pcb_text_width 0.3)
    (pcb_text_size 1.5 1.5)
    (mod_edge_width 0.12)
    (mod_text_size 1 1)
    (mod_text_width 0.15)
    (pad_size 1.05 0.95)
    (pad_drill 0)
    (pad_to_mask_clearance 0.051)
    (solder_mask_min_width 0.25)
    (aux_axis_origin 0 0)
    (grid_origin 123.952 95.631)
    (visible_elements 7FFFFFFF)
    (pcbplotparams
      (layerselection 0x010fc_ffffffff)
      (usegerberextensions false)
      (usegerberattributes false)
      (usegerberadvancedattributes false)
      (creategerberjobfile false)
      (excludeedgelayer true)
      (linewidth 0.100000)
      (plotframeref false)
      (viasonmask false)
      (mode 1)
      (useauxorigin false)
      (hpglpennumber 1)
      (hpglpenspeed 20)
      (hpglpendiameter 15.000000)
      (psnegative false)
      (psa4output false)
      (plotreference true)
      (plotvalue true)
      (plotinvisibletext false)
      (padsonsilk false)
      (subtractmaskfromsilk false)
      (outputformat 1)
      (mirror false)
      (drillshape 1)
      (scaleselection 1)
      (outputdirectory ""))
  )
  (net 0 "")
  (net 1 GND)
  (net 2 P3.3)
  (net 3 /VDDCORE)
  (net 4 /SAML_RESET)
  (net 5 VBUS)
  (net 6 PA01)
  (net 7 PA00)
  (net 8 "Net-(D1-Pad2)")
  (net 9 "Net-(D2-Pad2)")
  (net 10 PA07)
  (net 11 PA11)
  (net 12 VEN)
  (net 13 PA10)
  (net 14 PA03)
  (net 15 PA06)
  (net 16 PA09)
  (net 17 PA05)
  (net 18 PA04)
  (net 19 PA08)
  (net 20 PA02)
  (net 21 PA14)
  (net 22 PA15)
  (net 23 PA16)
  (net 24 PA17)
  (net 25 PA18)
  (net 26 PA19)
  (net 27 PA22)
  (net 28 PA23)
  (net 29 PS24)
  (net 30 PA25)
  (net 31 PA27)
  (net 32 SWCLK)
  (net 33 SWDIO)
  (net 34 ~RESET)
  (net 35 /VDOUT)
  (net 36 "Net-(U3-Pad4)")
  (net 37 "Net-(J1-Pad8)")
  (net 38 "Net-(J1-Pad7)")
  (net 39 SWO)
  (net_class Default "This is the default net class."
    (clearance 0.1524)
    (trace_width 0.1524)
    (via_dia 0.381)
    (via_drill 0.254)
    (uvia_dia 0.3)
    (uvia_drill 0.254)
    (add_net /SAML_RESET)
    (add_net /VDOUT)
    (add_net "Net-(D1-Pad2)")
    (add_net "Net-(D2-Pad2)")
    (add_net "Net-(J1-Pad7)")
    (add_net "Net-(J1-Pad8)")
    (add_net "Net-(U3-Pad4)")
    (add_net PA00)
    (add_net PA01)
    (add_net PA02)
    (add_net PA03)
    (add_net PA04)
    (add_net PA05)
    (add_net PA06)
    (add_net PA07)
    (add_net PA08)
    (add_net PA09)
    (add_net PA10)
    (add_net PA11)
    (add_net PA14)
    (add_net PA15)
    (add_net PA16)
    (add_net PA17)
    (add_net PA18)
    (add_net PA19)
    (add_net PA22)
    (add_net PA23)
    (add_net PA25)
    (add_net PA27)
    (add_net PS24)
    (add_net SWCLK)
    (add_net SWDIO)
    (add_net SWO)
    (add_net VEN)
    (add_net ~RESET)
  )
  (net_class Power ""
    (clearance 0.2)
    (trace_width 0.4)
    (via_dia 0.381)
    (via_drill 0.254)
    (uvia_dia 0.3)
    (uvia_drill 0.254)
    (add_net GND)
    (add_net P3.3)
    (add_net VBUS)
  )
  (net_class VDDCORE ""
    (clearance 0.1524)
    (trace_width 0.2)
    (via_dia 0.381)
    (via_drill 0.254)
    (uvia_dia 0.3)
    (uvia_drill 0.254)
    (add_net /VDDCORE)
  )
  (module TestPoint:TestPoint_Pad_D1.0mm (layer B.Cu) (tedit 5A0F774F)
    (at 132.842 104.521)
    (descr "SMD pad as test Point, diameter 1.0mm")
    (tags "test point SMD pad")
    (attr virtual)
    (fp_text reference TP2 (at 0 1.448) (layer Cmts.User))
    (fp_text value RESET (at 0 -1.55) (layer B.Fab))
    (fp_text user %R (at 0 1.45) (layer B.Fab))
    (pad 1 smd circle (at 0 0) (size 1 1) (layers B.Cu B.Mask)
      (net 4 /SAML_RESET))
  )
  (module Package_QFP:TQFP-32_7x7mm_P0.8mm (layer F.Cu) (tedit 5A02F146)
    (at 130.048 98.171 270)
    (descr "32-Lead Plastic Thin Quad Flatpack (PT) - 7x7x1.0 mm Body, 2.00 mm [TQFP] (see Microchip Packaging Specification 00000049BS.pdf)")
    (tags "QFP 0.8")
    (attr smd)
    (fp_text reference U1 (at 0 -6.05 90) (layer Cmts.User))
    (fp_text value ATSAML10E16A-AUT (at 0 6.05 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 32 smd rect (at -2.8 -4.25) (size 1.6 0.55) (layers F.Cu F.Paste F.Mask)
      (net 33 SWDIO))
    (pad 31 smd rect (at -2 -4.25) (size 1.6 0.55) (layers F.Cu F.Paste F.Mask)
      (net 32 SWCLK))
    (pad 30 smd rect (at -1.2 -4.25) (size 1.6 0.55) (layers F.Cu F.Paste F.Mask)
      (net 2 P3.3))
    (pad 29 smd rect (at -0.4 -4.25) (size 1.6 0.55) (layers F.Cu F.Paste F.Mask)
      (net 35 /VDOUT))
    (pad 28 smd rect (at 0.4 -4.25) (size 1.6 0.55) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 27 smd rect (at 1.2 -4.25) (size 1.6 0.55) (layers F.Cu F.Paste F.Mask)
      (net 3 /VDDCORE))
    (pad 26 smd rect (at 2 -4.25) (size 1.6 0.55) (layers F.Cu F.Paste F.Mask)
      (net 4 /SAML_RESET))
    (pad 25 smd rect (at 2.8 -4.25) (size 1.6 0.55) (layers F.Cu F.Paste F.Mask)
      (net 31 PA27))
    (pad 24 smd rect (at 4.25 -2.8 270) (size 1.6 0.55) (layers F.Cu F.Paste F.Mask)
      (net 30 PA25))
    (pad 23 smd rect (at 4.25 -2 270) (size 1.6 0.55) (layers F.Cu F.Paste F.Mask)
      (net 29 PS24))
    (pad 22 smd rect (at 4.25 -1.2 270) (size 1.6 0.55) (layers F.Cu F.Paste F.Mask)
      (net 28 PA23))
    (pad 21 smd rect (at 4.25 -0.4 270) (size 1.6 0.55) (layers F.Cu F.Paste F.Mask)
      (net 27 PA22))
    (pad 20 smd rect (at 4.25 0.4 270) (size 1.6 0.55) (layers F.Cu F.Paste F.Mask)
      (net 26 PA19))
    (pad 19 smd rect (at 4.25 1.2 270) (size 1.6 0.55) (layers F.Cu F.Paste F.Mask)
      (net 25 PA18))
    (pad 18 smd rect (at 4.25 2 270) (size 1.6 0.55) (layers F.Cu F.Paste F.Mask)
      (net 24 PA17))
    (pad 17 smd rect (at 4.25 2.8 270) (size 1.6 0.55) (layers F.Cu F.Paste F.Mask)
      (net 23 PA16))
    (pad 16 smd rect (at 2.8 4.25) (size 1.6 0.55) (layers F.Cu F.Paste F.Mask)
      (net 22 PA15))
    (pad 15 smd rect (at 2 4.25) (size 1.6 0.55) (layers F.Cu F.Paste F.Mask)
      (net 21 PA14))
    (pad 14 smd rect (at 1.2 4.25) (size 1.6 0.55) (layers F.Cu F.Paste F.Mask)
      (net 11 PA11))
    (pad 13 smd rect (at 0.4 4.25) (size 1.6 0.55) (layers F.Cu F.Paste F.Mask)
      (net 13 PA10))
    (pad 12 smd rect (at -0.4 4.25) (size 1.6 0.55) (layers F.Cu F.Paste F.Mask)
      (net 16 PA09))
    (pad 11 smd rect (at -1.2 4.25) (size 1.6 0.55) (layers F.Cu F.Paste F.Mask)
      (net 19 PA08))
    (pad 10 smd rect (at -2 4.25) (size 1.6 0.55) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 9 smd rect (at -2.8 4.25) (size 1.6 0.55) (layers F.Cu F.Paste F.Mask)
      (net 2 P3.3))
    (pad 8 smd rect (at -4.25 2.8 270) (size 1.6 0.55) (layers F.Cu F.Paste F.Mask)
      (net 10 PA07))
    (pad 7 smd rect (at -4.25 2 270) (size 1.6 0.55) (layers F.Cu F.Paste F.Mask)
      (net 15 PA06))
    (pad 6 smd rect (at -4.25 1.2 270) (size 1.6 0.55) (layers F.Cu F.Paste F.Mask)
      (net 17 PA05))
    (pad 5 smd rect (at -4.25 0.4 270) (size 1.6 0.55) (layers F.Cu F.Paste F.Mask)
      (net 18 PA04))
    (pad 4 smd rect (at -4.25 -0.4 270) (size 1.6 0.55) (layers F.Cu F.Paste F.Mask)
      (net 14 PA03))
    (pad 3 smd rect (at -4.25 -1.2 270) (size 1.6 0.55) (layers F.Cu F.Paste F.Mask)
      (net 20 PA02))
    (pad 2 smd rect (at -4.25 -2 270) (size 1.6 0.55) (layers F.Cu F.Paste F.Mask)
      (net 6 PA01))
    (pad 1 smd rect (at -4.25 -2.8 270) (size 1.6 0.55) (layers F.Cu F.Paste F.Mask)
      (net 7 PA00))
    (model ${KISYS3DMOD}/Package_QFP.3dshapes/TQFP-32_7x7mm_P0.8mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 133.7056 106.426)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C7 (at 0 -1.43) (layer Cmts.User))
    (fp_text value 100n (at 0 1.43) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd roundrect (at 0.875 0) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 1 GND))
    (pad 1 smd roundrect (at -0.875 0) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 3 /VDDCORE))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Button_Switch_SMD:SW_Push_1P1T_NO_CK_KMR2 (layer F.Cu) (tedit 5A02FC95)
    (at 134.112 78.994 90)
    (descr "CK components KMR2 tactile switch http://www.ckswitches.com/media/1479/kmr2.pdf")
    (tags "tactile switch kmr2")
    (attr smd)
    (fp_text reference SW1 (at 0 -2.45 90) (layer Cmts.User))
    (fp_text value RESET (at 0 2.55 90) (layer F.Fab))
    (fp_text user %R (at 0 -2.45 90) (layer F.Fab))
    (pad 2 smd rect (at 2.05 0.8 90) (size 0.9 1) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 1 smd rect (at 2.05 -0.8 90) (size 0.9 1) (layers F.Cu F.Paste F.Mask)
      (net 34 ~RESET))
    (pad 2 smd rect (at -2.05 0.8 90) (size 0.9 1) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 1 smd rect (at -2.05 -0.8 90) (size 0.9 1) (layers F.Cu F.Paste F.Mask)
      (net 34 ~RESET))
    (model ${KISYS3DMOD}/Button_Switch_SMD.3dshapes/SW_Push_1P1T_NO_CK_KMR2.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Button_Switch_SMD:SW_Push_1P1T_NO_CK_KMR2 (layer F.Cu) (tedit 5A02FC95)
    (at 125.73 78.994 90)
    (descr "CK components KMR2 tactile switch http://www.ckswitches.com/media/1479/kmr2.pdf")
    (tags "tactile switch kmr2")
    (attr smd)
    (fp_text reference SW2 (at 0 -2.45 90) (layer Cmts.User))
    (fp_text value PA01 (at 0 2.55 90) (layer F.Fab))
    (fp_text user %R (at 0 -2.45 90) (layer F.Fab))
    (pad 2 smd rect (at 2.05 0.8 90) (size 0.9 1) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 1 smd rect (at 2.05 -0.8 90) (size 0.9 1) (layers F.Cu F.Paste F.Mask)
      (net 6 PA01))
    (pad 2 smd rect (at -2.05 0.8 90) (size 0.9 1) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 1 smd rect (at -2.05 -0.8 90) (size 0.9 1) (layers F.Cu F.Paste F.Mask)
      (net 6 PA01))
    (model ${KISYS3DMOD}/Button_Switch_SMD.3dshapes/SW_Push_1P1T_NO_CK_KMR2.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5B36C52B)
    (at 125.095 85.598 90)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C9 (at 0 -1.65 90) (layer Cmts.User))
    (fp_text value 10u (at 0 1.65 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0 90) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 5 VBUS))
    (pad 1 smd roundrect (at -1.025 0 90) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 1 GND))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 125.984 91.694)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C1 (at 0 -1.43) (layer Cmts.User))
    (fp_text value 100n (at 0 1.43) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd roundrect (at 0.875 0) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 2 P3.3))
    (pad 1 smd roundrect (at -0.875 0) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 1 GND))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 133.858 91.694)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C2 (at 0 -1.43) (layer Cmts.User))
    (fp_text value 100n (at 0 1.43) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd roundrect (at 0.875 0) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 2 P3.3))
    (pad 1 smd roundrect (at -0.875 0) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 1 GND))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5B36C52B)
    (at 129.921 87.757)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C3 (at 0 1.664) (layer Cmts.User))
    (fp_text value 10u (at 0 1.65) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 2 P3.3))
    (pad 1 smd roundrect (at -1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 1 GND))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5B36C52B)
    (at 133.5024 104.521 180)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C6 (at 0 -1.65) (layer Cmts.User))
    (fp_text value 1u (at 0 1.65) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 3 /VDDCORE))
    (pad 1 smd roundrect (at -1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 1 GND))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 127.216802 105.320197 90)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C8 (at 0 -1.43 90) (layer Cmts.User))
    (fp_text value 100n (at 0 1.43 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd roundrect (at 0.875 0 90) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 4 /SAML_RESET))
    (pad 1 smd roundrect (at -0.875 0 90) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 1 GND))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 125.73 82.804)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C10 (at 0 -1.43) (layer Cmts.User))
    (fp_text value 100n (at 0 1.43) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd roundrect (at 0.875 0) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 1 GND))
    (pad 1 smd roundrect (at -0.875 0) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 6 PA01))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module LED_SMD:LED_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B4B45C9)
    (at 128.524 80.899 90)
    (descr "LED SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "LED handsolder")
    (attr smd)
    (fp_text reference D1 (at 0 -1.226 90) (layer Cmts.User))
    (fp_text value PA00 (at 0 1.43 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd roundrect (at 0.875 0 90) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 8 "Net-(D1-Pad2)"))
    (pad 1 smd roundrect (at -0.875 0 90) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 7 PA00))
    (model ${KISYS3DMOD}/LED_SMD.3dshapes/LED_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module LED_SMD:LED_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B4B45C9)
    (at 131.318 80.899 90)
    (descr "LED SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "LED handsolder")
    (attr smd)
    (fp_text reference D2 (at 0 -1.43 90) (layer Cmts.User))
    (fp_text value POWER (at 0 1.43 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd roundrect (at 0.875 0 90) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 9 "Net-(D2-Pad2)"))
    (pad 1 smd roundrect (at -0.875 0 90) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 1 GND))
    (model ${KISYS3DMOD}/LED_SMD.3dshapes/LED_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module kawaii_2019:Header_1x16_P2.54mm_Castellated (layer F.Cu) (tedit 5D5A8F06)
    (at 122.301 96.774 180)
    (fp_text reference J2 (at 0 -21.59) (layer Cmts.User))
    (fp_text value Conn_01x16_Male (at 0 -22.86) (layer F.Fab))
    (pad 13 smd oval (at 0.947436 -11.430462 180) (size 3.93 2) (layers B.Cu B.Mask)
      (net 16 PA09))
    (pad 12 smd oval (at 0.947436 -8.890462 180) (size 3.93 2) (layers B.Cu B.Mask)
      (net 19 PA08))
    (pad 11 smd oval (at 0.947436 -6.350462 180) (size 3.93 2) (layers B.Cu B.Mask)
      (net 10 PA07))
    (pad 10 smd oval (at 0.947436 -3.810462 180) (size 3.93 2) (layers B.Cu B.Mask)
      (net 15 PA06))
    (pad 2 smd oval (at 0.947436 16.509538 180) (size 3.93 2) (layers B.Cu B.Mask)
      (net 2 P3.3))
    (pad 15 smd oval (at 0.947436 -16.510462 180) (size 3.93 2) (layers B.Cu B.Mask)
      (net 11 PA11))
    (pad 4 smd oval (at 0.947436 11.429538 180) (size 3.93 2) (layers B.Cu B.Mask)
      (net 7 PA00))
    (pad 16 smd oval (at 0.947436 -19.050462 180) (size 3.93 2) (layers B.Cu B.Mask)
      (net 1 GND))
    (pad 8 smd oval (at 0.947436 1.269538 180) (size 3.93 2) (layers B.Cu B.Mask)
      (net 18 PA04))
    (pad 7 smd oval (at 0.947436 3.809538 180) (size 3.93 2) (layers B.Cu B.Mask)
      (net 14 PA03))
    (pad 3 smd oval (at 0.947436 13.969538 180) (size 3.93 2) (layers B.Cu B.Mask)
      (net 12 VEN))
    (pad 6 smd oval (at 0.947436 6.349538 180) (size 3.93 2) (layers B.Cu B.Mask)
      (net 20 PA02))
    (pad 9 smd oval (at 0.947436 -1.270462 180) (size 3.93 2) (layers B.Cu B.Mask)
      (net 17 PA05))
    (pad 1 smd oval (at 0.947436 19.049538 180) (size 3.93 2) (layers B.Cu B.Mask)
      (net 5 VBUS))
    (pad 5 smd oval (at 0.947436 8.889538 180) (size 3.93 2) (layers B.Cu B.Mask)
      (net 6 PA01))
    (pad 14 smd oval (at 0.947436 -13.970462 180) (size 3.93 2) (layers B.Cu B.Mask)
      (net 13 PA10))
    (pad 4 smd oval (at 0.954882 11.43 180) (size 3.93 2) (layers F.Cu F.Mask)
      (net 7 PA00))
    (pad 16 smd oval (at 0.954882 -19.05 180) (size 3.93 2) (layers F.Cu F.Mask)
      (net 1 GND))
    (pad 12 smd oval (at 0.954882 -8.89 180) (size 3.93 2) (layers F.Cu F.Mask)
      (net 19 PA08))
    (pad 11 smd oval (at 0.954882 -6.35 180) (size 3.93 2) (layers F.Cu F.Mask)
      (net 10 PA07))
    (pad 13 smd oval (at 0.954882 -11.43 180) (size 3.93 2) (layers F.Cu F.Mask)
      (net 16 PA09))
    (pad 3 smd oval (at 0.954882 13.97 180) (size 3.93 2) (layers F.Cu F.Mask)
      (net 12 VEN))
    (pad 2 smd oval (at 0.954882 16.51 180) (size 3.93 2) (layers F.Cu F.Mask)
      (net 2 P3.3))
    (pad 14 smd oval (at 0.954882 -13.97 180) (size 3.93 2) (layers F.Cu F.Mask)
      (net 13 PA10))
    (pad 9 smd oval (at 0.954882 -1.27 180) (size 3.93 2) (layers F.Cu F.Mask)
      (net 17 PA05))
    (pad 8 smd oval (at 0.954882 1.27 180) (size 3.93 2) (layers F.Cu F.Mask)
      (net 18 PA04))
    (pad 5 smd oval (at 0.954882 8.89 180) (size 3.93 2) (layers F.Cu F.Mask)
      (net 6 PA01))
    (pad 15 smd oval (at 0.954882 -16.51 180) (size 3.93 2) (layers F.Cu F.Mask)
      (net 11 PA11))
    (pad 10 smd oval (at 0.954882 -3.81 180) (size 3.93 2) (layers F.Cu F.Mask)
      (net 15 PA06))
    (pad 7 smd oval (at 0.954882 3.81 180) (size 3.93 2) (layers F.Cu F.Mask)
      (net 14 PA03))
    (pad 6 smd oval (at 0.954882 6.35 180) (size 3.93 2) (layers F.Cu F.Mask)
      (net 20 PA02))
    (pad 3 thru_hole circle (at 1.905 13.97 180) (size 2 2) (drill 1.5) (layers *.Cu *.Mask)
      (net 12 VEN))
    (pad 14 thru_hole circle (at 1.905 -13.97 180) (size 2 2) (drill 1.5) (layers *.Cu *.Mask)
      (net 13 PA10))
    (pad 7 thru_hole circle (at 1.905 3.81 180) (size 2 2) (drill 1.5) (layers *.Cu *.Mask)
      (net 14 PA03))
    (pad 10 thru_hole circle (at 1.905 -3.81 180) (size 2 2) (drill 1.5) (layers *.Cu *.Mask)
      (net 15 PA06))
    (pad 13 thru_hole circle (at 1.905 -11.43 180) (size 2 2) (drill 1.5) (layers *.Cu *.Mask)
      (net 16 PA09))
    (pad 1 thru_hole circle (at 1.905 19.05 180) (size 2 2) (drill 1.5) (layers *.Cu *.Mask)
      (net 5 VBUS))
    (pad 9 thru_hole circle (at 1.905 -1.27 180) (size 2 2) (drill 1.5) (layers *.Cu *.Mask)
      (net 17 PA05))
    (pad 5 thru_hole circle (at 1.905 8.89 180) (size 2 2) (drill 1.5) (layers *.Cu *.Mask)
      (net 6 PA01))
    (pad 6 thru_hole circle (at 1.905 6.35 180) (size 2 2) (drill 1.5) (layers *.Cu *.Mask)
      (net 20 PA02))
    (pad 11 thru_hole circle (at 1.905 -6.35 180) (size 2 2) (drill 1.5) (layers *.Cu *.Mask)
      (net 10 PA07))
    (pad 16 thru_hole circle (at 1.905 -19.05 180) (size 2 2) (drill 1.5) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 4 thru_hole circle (at 1.905 11.43 180) (size 2 2) (drill 1.5) (layers *.Cu *.Mask)
      (net 7 PA00))
    (pad 8 thru_hole circle (at 1.905 1.27 180) (size 2 2) (drill 1.5) (layers *.Cu *.Mask)
      (net 18 PA04))
    (pad 15 thru_hole circle (at 1.905 -16.51 180) (size 2 2) (drill 1.5) (layers *.Cu *.Mask)
      (net 11 PA11))
    (pad 2 thru_hole circle (at 1.905 16.51 180) (size 2 2) (drill 1.5) (layers *.Cu *.Mask)
      (net 2 P3.3))
    (pad 12 thru_hole circle (at 1.905 -8.89 180) (size 2 2) (drill 1.5) (layers *.Cu *.Mask)
      (net 19 PA08))
    (pad 1 thru_hole circle (at 0 19.05 180) (size 2 2) (drill 1) (layers *.Cu *.Mask)
      (net 5 VBUS))
    (pad 2 thru_hole circle (at 0 16.51 180) (size 2 2) (drill 1) (layers *.Cu *.Mask)
      (net 2 P3.3))
    (pad 9 thru_hole circle (at 0 -1.27 180) (size 2 2) (drill 1) (layers *.Cu *.Mask)
      (net 17 PA05))
    (pad 8 thru_hole circle (at 0 1.27 180) (size 2 2) (drill 1) (layers *.Cu *.Mask)
      (net 18 PA04))
    (pad 7 thru_hole circle (at 0 3.81 180) (size 2 2) (drill 1) (layers *.Cu *.Mask)
      (net 14 PA03))
    (pad 5 thru_hole circle (at 0 8.89 180) (size 2 2) (drill 1) (layers *.Cu *.Mask)
      (net 6 PA01))
    (pad 6 thru_hole circle (at 0 6.35 180) (size 2 2) (drill 1) (layers *.Cu *.Mask)
      (net 20 PA02))
    (pad 4 thru_hole circle (at 0 11.43 180) (size 2 2) (drill 1) (layers *.Cu *.Mask)
      (net 7 PA00))
    (pad 3 thru_hole circle (at 0 13.97 180) (size 2 2) (drill 1) (layers *.Cu *.Mask)
      (net 12 VEN))
    (pad 16 thru_hole circle (at 0 -19.05 180) (size 2 2) (drill 1) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 15 thru_hole circle (at 0 -16.51 180) (size 2 2) (drill 1) (layers *.Cu *.Mask)
      (net 11 PA11))
    (pad 14 thru_hole circle (at 0 -13.97 180) (size 2 2) (drill 1) (layers *.Cu *.Mask)
      (net 13 PA10))
    (pad 13 thru_hole circle (at 0 -11.43 180) (size 2 2) (drill 1) (layers *.Cu *.Mask)
      (net 16 PA09))
    (pad 12 thru_hole circle (at 0 -8.89 180) (size 2 2) (drill 1) (layers *.Cu *.Mask)
      (net 19 PA08))
    (pad 11 thru_hole circle (at 0 -6.35 180) (size 2 2) (drill 1) (layers *.Cu *.Mask)
      (net 10 PA07))
    (pad 10 thru_hole circle (at 0 -3.81 180) (size 2 2) (drill 1) (layers *.Cu *.Mask)
      (net 15 PA06))
    (pad 1 smd oval (at 0.96 19.05 180) (size 3.93 2) (layers F.Cu F.Mask)
      (net 5 VBUS))
  )
  (module kawaii_2019:Header_1x16_P2.54mm_Castellated (layer B.Cu) (tedit 5D5A8F06)
    (at 137.541 96.774)
    (fp_text reference J3 (at 0 21.59) (layer Cmts.User))
    (fp_text value Conn_01x16_Male (at 0 22.86) (layer B.Fab))
    (pad 13 smd oval (at 0.947436 11.430462) (size 3.93 2) (layers F.Cu F.Mask)
      (net 32 SWCLK))
    (pad 12 smd oval (at 0.947436 8.890462) (size 3.93 2) (layers F.Cu F.Mask)
      (net 31 PA27))
    (pad 11 smd oval (at 0.947436 6.350462) (size 3.93 2) (layers F.Cu F.Mask)
      (net 30 PA25))
    (pad 10 smd oval (at 0.947436 3.810462) (size 3.93 2) (layers F.Cu F.Mask)
      (net 29 PS24))
    (pad 2 smd oval (at 0.947436 -16.509538) (size 3.93 2) (layers F.Cu F.Mask)
      (net 21 PA14))
    (pad 15 smd oval (at 0.947436 16.510462) (size 3.93 2) (layers F.Cu F.Mask)
      (net 34 ~RESET))
    (pad 4 smd oval (at 0.947436 -11.429538) (size 3.93 2) (layers F.Cu F.Mask)
      (net 23 PA16))
    (pad 16 smd oval (at 0.947436 19.050462) (size 3.93 2) (layers F.Cu F.Mask)
      (net 1 GND))
    (pad 8 smd oval (at 0.947436 -1.269538) (size 3.93 2) (layers F.Cu F.Mask)
      (net 27 PA22))
    (pad 7 smd oval (at 0.947436 -3.809538) (size 3.93 2) (layers F.Cu F.Mask)
      (net 26 PA19))
    (pad 3 smd oval (at 0.947436 -13.969538) (size 3.93 2) (layers F.Cu F.Mask)
      (net 22 PA15))
    (pad 6 smd oval (at 0.947436 -6.349538) (size 3.93 2) (layers F.Cu F.Mask)
      (net 25 PA18))
    (pad 9 smd oval (at 0.947436 1.270462) (size 3.93 2) (layers F.Cu F.Mask)
      (net 28 PA23))
    (pad 1 smd oval (at 0.947436 -19.049538) (size 3.93 2) (layers F.Cu F.Mask)
      (net 2 P3.3))
    (pad 5 smd oval (at 0.947436 -8.889538) (size 3.93 2) (layers F.Cu F.Mask)
      (net 24 PA17))
    (pad 14 smd oval (at 0.947436 13.970462) (size 3.93 2) (layers F.Cu F.Mask)
      (net 33 SWDIO))
    (pad 4 smd oval (at 0.954882 -11.43) (size 3.93 2) (layers B.Cu B.Mask)
      (net 23 PA16))
    (pad 16 smd oval (at 0.954882 19.05) (size 3.93 2) (layers B.Cu B.Mask)
      (net 1 GND))
    (pad 12 smd oval (at 0.954882 8.89) (size 3.93 2) (layers B.Cu B.Mask)
      (net 31 PA27))
    (pad 11 smd oval (at 0.954882 6.35) (size 3.93 2) (layers B.Cu B.Mask)
      (net 30 PA25))
    (pad 13 smd oval (at 0.954882 11.43) (size 3.93 2) (layers B.Cu B.Mask)
      (net 32 SWCLK))
    (pad 3 smd oval (at 0.954882 -13.97) (size 3.93 2) (layers B.Cu B.Mask)
      (net 22 PA15))
    (pad 2 smd oval (at 0.954882 -16.51) (size 3.93 2) (layers B.Cu B.Mask)
      (net 21 PA14))
    (pad 14 smd oval (at 0.954882 13.97) (size 3.93 2) (layers B.Cu B.Mask)
      (net 33 SWDIO))
    (pad 9 smd oval (at 0.954882 1.27) (size 3.93 2) (layers B.Cu B.Mask)
      (net 28 PA23))
    (pad 8 smd oval (at 0.954882 -1.27) (size 3.93 2) (layers B.Cu B.Mask)
      (net 27 PA22))
    (pad 5 smd oval (at 0.954882 -8.89) (size 3.93 2) (layers B.Cu B.Mask)
      (net 24 PA17))
    (pad 15 smd oval (at 0.954882 16.51) (size 3.93 2) (layers B.Cu B.Mask)
      (net 34 ~RESET))
    (pad 10 smd oval (at 0.954882 3.81) (size 3.93 2) (layers B.Cu B.Mask)
      (net 29 PS24))
    (pad 7 smd oval (at 0.954882 -3.81) (size 3.93 2) (layers B.Cu B.Mask)
      (net 26 PA19))
    (pad 6 smd oval (at 0.954882 -6.35) (size 3.93 2) (layers B.Cu B.Mask)
      (net 25 PA18))
    (pad 3 thru_hole circle (at 1.905 -13.97) (size 2 2) (drill 1.5) (layers *.Cu *.Mask)
      (net 22 PA15))
    (pad 14 thru_hole circle (at 1.905 13.97) (size 2 2) (drill 1.5) (layers *.Cu *.Mask)
      (net 33 SWDIO))
    (pad 7 thru_hole circle (at 1.905 -3.81) (size 2 2) (drill 1.5) (layers *.Cu *.Mask)
      (net 26 PA19))
    (pad 10 thru_hole circle (at 1.905 3.81) (size 2 2) (drill 1.5) (layers *.Cu *.Mask)
      (net 29 PS24))
    (pad 13 thru_hole circle (at 1.905 11.43) (size 2 2) (drill 1.5) (layers *.Cu *.Mask)
      (net 32 SWCLK))
    (pad 1 thru_hole circle (at 1.905 -19.05) (size 2 2) (drill 1.5) (layers *.Cu *.Mask)
      (net 2 P3.3))
    (pad 9 thru_hole circle (at 1.905 1.27) (size 2 2) (drill 1.5) (layers *.Cu *.Mask)
      (net 28 PA23))
    (pad 5 thru_hole circle (at 1.905 -8.89) (size 2 2) (drill 1.5) (layers *.Cu *.Mask)
      (net 24 PA17))
    (pad 6 thru_hole circle (at 1.905 -6.35) (size 2 2) (drill 1.5) (layers *.Cu *.Mask)
      (net 25 PA18))
    (pad 11 thru_hole circle (at 1.905 6.35) (size 2 2) (drill 1.5) (layers *.Cu *.Mask)
      (net 30 PA25))
    (pad 16 thru_hole circle (at 1.905 19.05) (size 2 2) (drill 1.5) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 4 thru_hole circle (at 1.905 -11.43) (size 2 2) (drill 1.5) (layers *.Cu *.Mask)
      (net 23 PA16))
    (pad 8 thru_hole circle (at 1.905 -1.27) (size 2 2) (drill 1.5) (layers *.Cu *.Mask)
      (net 27 PA22))
    (pad 15 thru_hole circle (at 1.905 16.51) (size 2 2) (drill 1.5) (layers *.Cu *.Mask)
      (net 34 ~RESET))
    (pad 2 thru_hole circle (at 1.905 -16.51) (size 2 2) (drill 1.5) (layers *.Cu *.Mask)
      (net 21 PA14))
    (pad 12 thru_hole circle (at 1.905 8.89) (size 2 2) (drill 1.5) (layers *.Cu *.Mask)
      (net 31 PA27))
    (pad 1 thru_hole circle (at 0 -19.05) (size 2 2) (drill 1) (layers *.Cu *.Mask)
      (net 2 P3.3))
    (pad 2 thru_hole circle (at 0 -16.51) (size 2 2) (drill 1) (layers *.Cu *.Mask)
      (net 21 PA14))
    (pad 9 thru_hole circle (at 0 1.27) (size 2 2) (drill 1) (layers *.Cu *.Mask)
      (net 28 PA23))
    (pad 8 thru_hole circle (at 0 -1.27) (size 2 2) (drill 1) (layers *.Cu *.Mask)
      (net 27 PA22))
    (pad 7 thru_hole circle (at 0 -3.81) (size 2 2) (drill 1) (layers *.Cu *.Mask)
      (net 26 PA19))
    (pad 5 thru_hole circle (at 0 -8.89) (size 2 2) (drill 1) (layers *.Cu *.Mask)
      (net 24 PA17))
    (pad 6 thru_hole circle (at 0 -6.35) (size 2 2) (drill 1) (layers *.Cu *.Mask)
      (net 25 PA18))
    (pad 4 thru_hole circle (at 0 -11.43) (size 2 2) (drill 1) (layers *.Cu *.Mask)
      (net 23 PA16))
    (pad 3 thru_hole circle (at 0 -13.97) (size 2 2) (drill 1) (layers *.Cu *.Mask)
      (net 22 PA15))
    (pad 16 thru_hole circle (at 0 19.05) (size 2 2) (drill 1) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 15 thru_hole circle (at 0 16.51) (size 2 2) (drill 1) (layers *.Cu *.Mask)
      (net 34 ~RESET))
    (pad 14 thru_hole circle (at 0 13.97) (size 2 2) (drill 1) (layers *.Cu *.Mask)
      (net 33 SWDIO))
    (pad 13 thru_hole circle (at 0 11.43) (size 2 2) (drill 1) (layers *.Cu *.Mask)
      (net 32 SWCLK))
    (pad 12 thru_hole circle (at 0 8.89) (size 2 2) (drill 1) (layers *.Cu *.Mask)
      (net 31 PA27))
    (pad 11 thru_hole circle (at 0 6.35) (size 2 2) (drill 1) (layers *.Cu *.Mask)
      (net 30 PA25))
    (pad 10 thru_hole circle (at 0 3.81) (size 2 2) (drill 1) (layers *.Cu *.Mask)
      (net 29 PS24))
    (pad 1 smd oval (at 0.96 -19.05) (size 3.93 2) (layers B.Cu B.Mask)
      (net 2 P3.3))
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBD)
    (at 125.476 105.320197 270)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R1 (at 0 -1.43 90) (layer Cmts.User))
    (fp_text value 330 (at 0 1.43 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd roundrect (at 0.875 0 270) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 34 ~RESET))
    (pad 1 smd roundrect (at -0.875 0 270) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 4 /SAML_RESET))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBD)
    (at 128.524 77.089 90)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R2 (at 0 -1.43 90) (layer Cmts.User))
    (fp_text value 330 (at 0 1.43 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd roundrect (at 0.875 0 90) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 2 P3.3))
    (pad 1 smd roundrect (at -0.875 0 90) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 8 "Net-(D1-Pad2)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBD)
    (at 126.873 85.598 270)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R3 (at 0 -1.43) (layer Cmts.User))
    (fp_text value 10K (at 0 1.43 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd roundrect (at 0.875 0 270) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 12 VEN))
    (pad 1 smd roundrect (at -0.875 0 270) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 5 VBUS))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBD)
    (at 131.318 77.089 90)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R4 (at 0 -1.43 90) (layer Cmts.User))
    (fp_text value 330 (at 0 1.43 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd roundrect (at 0.875 0 90) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 2 P3.3))
    (pad 1 smd roundrect (at -0.875 0 90) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 9 "Net-(D2-Pad2)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBD)
    (at 125.984 88.519)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R5 (at 0 -1.43) (layer Cmts.User))
    (fp_text value NP (at 0 1.43) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd roundrect (at 0.875 0) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 12 VEN))
    (pad 1 smd roundrect (at -0.875 0) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 1 GND))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBD)
    (at 133.858 90.043)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R6 (at 0 -1.43) (layer Cmts.User))
    (fp_text value 10K (at 0 1.43) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd roundrect (at 0.875 0) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 2 P3.3))
    (pad 1 smd roundrect (at -0.875 0) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 6 PA01))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module TestPoint:TestPoint_Pad_D1.0mm (layer F.Cu) (tedit 5A0F774F)
    (at 132.969 83.82)
    (descr "SMD pad as test Point, diameter 1.0mm")
    (tags "test point SMD pad")
    (attr virtual)
    (fp_text reference TP4 (at 0.079 -1.399) (layer Cmts.User))
    (fp_text value VOUT (at 0 1.55) (layer F.Fab))
    (fp_text user %R (at 0 -1.45) (layer F.Fab))
    (pad 1 smd circle (at 0 0) (size 1 1) (layers F.Cu F.Mask)
      (net 2 P3.3))
  )
  (module Package_TO_SOT_SMD:SOT-23-5 (layer F.Cu) (tedit 5A02FF57)
    (at 129.921 84.836)
    (descr "5-pin SOT23 package")
    (tags SOT-23-5)
    (attr smd)
    (fp_text reference U3 (at 0 -2.9) (layer Cmts.User))
    (fp_text value NPC4625HSN33 (at 0 2.9) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 5 smd rect (at 1.1 -0.95) (size 1.06 0.65) (layers F.Cu F.Paste F.Mask)
      (net 2 P3.3))
    (pad 4 smd rect (at 1.1 0.95) (size 1.06 0.65) (layers F.Cu F.Paste F.Mask)
      (net 36 "Net-(U3-Pad4)"))
    (pad 3 smd rect (at -1.1 0.95) (size 1.06 0.65) (layers F.Cu F.Paste F.Mask)
      (net 12 VEN))
    (pad 2 smd rect (at -1.1 0) (size 1.06 0.65) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 1 smd rect (at -1.1 -0.95) (size 1.06 0.65) (layers F.Cu F.Paste F.Mask)
      (net 5 VBUS))
    (model ${KISYS3DMOD}/Package_TO_SOT_SMD.3dshapes/SOT-23-5.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module kawaii_2019:FTSH-105-01-L-DV-K (layer F.Cu) (tedit 56889B32)
    (at 130.048 113.919)
    (fp_text reference J1 (at 0 -4.3) (layer F.Fab))
    (fp_text value SWD (at 0 4.4) (layer F.Fab))
    (pad 1 smd rect (at -2.54 2.035) (size 0.74 2.79) (layers F.Cu F.Paste F.Mask)
      (net 2 P3.3))
    (pad 2 smd rect (at -2.54 -2.035) (size 0.74 2.79) (layers F.Cu F.Paste F.Mask)
      (net 33 SWDIO))
    (pad 3 smd rect (at -1.27 2.035) (size 0.74 2.79) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 4 smd rect (at -1.27 -2.035) (size 0.74 2.79) (layers F.Cu F.Paste F.Mask)
      (net 32 SWCLK))
    (pad 5 smd rect (at 0 2.035) (size 0.74 2.79) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 6 smd rect (at 0 -2.035) (size 0.74 2.79) (layers F.Cu F.Paste F.Mask)
      (net 39 SWO))
    (pad 7 smd rect (at 1.27 2.035) (size 0.74 2.79) (layers F.Cu F.Paste F.Mask)
      (net 38 "Net-(J1-Pad7)"))
    (pad 8 smd rect (at 1.27 -2.035) (size 0.74 2.79) (layers F.Cu F.Paste F.Mask)
      (net 37 "Net-(J1-Pad8)"))
    (pad 9 smd rect (at 2.54 2.035) (size 0.74 2.79) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 10 smd rect (at 2.54 -2.035) (size 0.74 2.79) (layers F.Cu F.Paste F.Mask)
      (net 34 ~RESET))
  )
  (gr_text <3 (at 132.842 108.331 90) (layer B.SilkS))
  (gr_text "@TequinDragon\n@JJJollyjim" (at 132.08 82.931 90) (layer B.SilkS))
  (gr_text "Dev Board" (at 126.238 105.537 90) (layer B.SilkS))
  (gr_text ATSAML10E16A (at 126.238 91.313 90) (layer B.SilkS))
  (gr_text GND (at 135.89 115.951 90) (layer F.SilkS))
  (gr_text RST (at 135.89 113.411 90) (layer F.SilkS))
  (gr_text SWD (at 135.89 110.871 90) (layer F.SilkS))
  (gr_text SWC (at 135.89 108.331 90) (layer F.SilkS))
  (gr_text A27 (at 135.89 105.791 90) (layer F.SilkS))
  (gr_text A25 (at 135.89 103.251 90) (layer F.SilkS))
  (gr_text A24 (at 135.89 100.711 90) (layer F.SilkS))
  (gr_text A23 (at 135.89 98.171 90) (layer F.SilkS))
  (gr_text A22 (at 135.89 95.631 90) (layer F.SilkS))
  (gr_text A19 (at 135.89 93.091 90) (layer F.SilkS))
  (gr_text A18 (at 135.89 90.551 90) (layer F.SilkS))
  (gr_text A17 (at 135.89 88.011 90) (layer F.SilkS))
  (gr_text A16 (at 135.89 85.471 90) (layer F.SilkS))
  (gr_text A15 (at 135.89 82.931 90) (layer F.SilkS))
  (gr_text A14 (at 135.89 80.391 90) (layer F.SilkS))
  (gr_text 3.3V (at 135.89 77.851 90) (layer F.SilkS))
  (gr_text A03 (at 123.952 93.091 270) (layer F.SilkS))
  (gr_text A02 (at 123.952 90.551 270) (layer F.SilkS))
  (gr_text VBUS (at 123.952 77.851 270) (layer F.SilkS))
  (gr_text 3.3V (at 123.952 80.391 270) (layer F.SilkS))
  (gr_text VEN (at 123.952 82.931 270) (layer F.SilkS))
  (gr_text A00 (at 123.952 85.471 270) (layer F.SilkS))
  (gr_text A01 (at 123.952 88.011 270) (layer F.SilkS))
  (gr_text GND (at 123.952 115.951 270) (layer F.SilkS))
  (gr_text A11 (at 123.952 113.411 270) (layer F.SilkS))
  (gr_text A10 (at 123.952 110.871 270) (layer F.SilkS))
  (gr_text A09 (at 123.952 108.331 270) (layer F.SilkS))
  (gr_text A08 (at 123.952 105.791 270) (layer F.SilkS))
  (gr_text A07 (at 123.952 103.251 270) (layer F.SilkS))
  (gr_text A06 (at 123.952 100.711 270) (layer F.SilkS))
  (gr_text A05 (at 123.952 98.171 270) (layer F.SilkS))
  (gr_text A04 (at 123.952 95.631 270) (layer F.SilkS))
  (gr_line (start 121.666 118.491) (end 120.396 117.094001) (layer Edge.Cuts) (width 0.05))
  (gr_line (start 139.446 117.094) (end 138.049 118.491) (layer Edge.Cuts) (width 0.05))
  (gr_line (start 138.049 118.491) (end 121.666 118.491) (layer Edge.Cuts) (width 0.05))
  (gr_line (start 138.176 75.057) (end 139.446 76.454) (layer Edge.Cuts) (width 0.05))
  (gr_line (start 121.793 75.057) (end 138.176 75.057) (layer Edge.Cuts) (width 0.05))
  (gr_line (start 120.396 76.454) (end 121.793 75.057) (layer Edge.Cuts) (width 0.05))
  (dimension 15.24 (width 0.15) (layer Dwgs.User)
    (gr_text "0.6000 in" (at 129.7686 121.2896) (layer Dwgs.User))
    (feature1 (pts (xy 137.3886 96.6216) (xy 137.3886 120.576021)))
    (feature2 (pts (xy 122.1486 96.6216) (xy 122.1486 120.576021)))
    (crossbar (pts (xy 122.1486 119.9896) (xy 137.3886 119.9896)))
    (arrow1a (pts (xy 137.3886 119.9896) (xy 136.262096 120.576021)))
    (arrow1b (pts (xy 137.3886 119.9896) (xy 136.262096 119.403179)))
    (arrow2a (pts (xy 122.1486 119.9896) (xy 123.275104 120.576021)))
    (arrow2b (pts (xy 122.1486 119.9896) (xy 123.275104 119.403179)))
  )
  (gr_line (start 139.446 117.094) (end 139.446 76.454) (layer Edge.Cuts) (width 0.05))
  (gr_line (start 120.396 76.454) (end 120.396 117.094) (layer Edge.Cuts) (width 0.05))
  (zone (net 1) (net_name GND) (layer F.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.2))
    (min_thickness 0.254)
    (fill yes (arc_segments 32) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 120.396 76.454) (xy 121.793 75.057) (xy 138.176 75.057) (xy 139.446 76.454) (xy 139.446 117.094)
        (xy 138.049 118.491) (xy 121.666 118.491) (xy 120.396 117.094)
      )
    )
  )
  (zone (net 1) (net_name GND) (layer B.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.508))
    (min_thickness 0.254)
    (fill yes (arc_segments 32) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 120.366084 76.454) (xy 121.763084 75.057) (xy 138.146084 75.057) (xy 139.416084 76.454) (xy 139.416084 117.094)
        (xy 138.019084 118.491) (xy 121.636084 118.491) (xy 120.366084 117.094)
      )
    )
  )
)
