(kicad_pcb (version 4) (host pcbnew 4.0.4-stable)
  (general
    (links 20)
    (no_connects 0)
    (area 142.926999 98.603999 154.253001 106.755001)
    (thickness 1.6)
    (drawings 10)
    (tracks 52)
    (zones 0)
    (modules 11)
    (nets 5)
  )
  (page A4)
  (layers
    (0 F.Cu signal)
    (31 B.Cu signal)
    (32 B.Adhes user hide)
    (33 F.Adhes user hide)
    (34 B.Paste user)
    (35 F.Paste user)
    (36 B.SilkS user)
    (37 F.SilkS user)
    (38 B.Mask user)
    (39 F.Mask user)
    (40 Dwgs.User user hide)
    (41 Cmts.User user hide)
    (42 Eco1.User user hide)
    (43 Eco2.User user hide)
    (44 Edge.Cuts user)
    (45 Margin user hide)
    (46 B.CrtYd user hide)
    (47 F.CrtYd user hide)
    (48 B.Fab user hide)
    (49 F.Fab user hide)
  )
  (setup
    (last_trace_width 0.381)
    (trace_clearance 0.1524)
    (zone_clearance 0.2)
    (zone_45_only yes)
    (trace_min 0.1524)
    (segment_width 0.2)
    (edge_width 0.15)
    (via_size 0.508)
    (via_drill 0.254)
    (via_min_size 0.508)
    (via_min_drill 0.254)
    (uvia_size 0.3)
    (uvia_drill 0.1)
    (uvias_allowed no)
    (uvia_min_size 0.2)
    (uvia_min_drill 0.1)
    (pcb_text_width 0.3)
    (pcb_text_size 1.5 1.5)
    (mod_edge_width 0.15)
    (mod_text_size 1 1)
    (mod_text_width 0.15)
    (pad_size 0.508 0.508)
    (pad_drill 0.254)
    (pad_to_mask_clearance 0.2)
    (aux_axis_origin 0 0)
    (visible_elements 7FFDFFFF)
    (pcbplotparams
      (layerselection 0x00030_80000001)
      (usegerberextensions false)
      (excludeedgelayer true)
      (linewidth 0.100000)
      (plotframeref false)
      (viasonmask false)
      (mode 1)
      (useauxorigin false)
      (hpglpennumber 1)
      (hpglpenspeed 20)
      (hpglpendiameter 15)
      (hpglpenoverlay 2)
      (psnegative false)
      (psa4output false)
      (plotreference true)
      (plotvalue true)
      (plotinvisibletext false)
      (padsonsilk false)
      (subtractmaskfromsilk false)
      (outputformat 1)
      (mirror false)
      (drillshape 1)
      (scaleselection 1)
      (outputdirectory ""))
  )
  (net 0 "")
  (net 1 /VIN)
  (net 2 /GND)
  (net 3 /+5V)
  (net 4 /Enable)
  (net_class Default "This is the default net class."
    (clearance 0.1524)
    (trace_width 0.381)
    (via_dia 0.508)
    (via_drill 0.254)
    (uvia_dia 0.3)
    (uvia_drill 0.1)
    (add_net /+5V)
    (add_net /Enable)
    (add_net /GND)
    (add_net /VIN)
  )
  (module "Custom Footprint:VIA-10mil" (layer F.Cu) (tedit 59361220)
    (at 153.162 106.045)
    (fp_text reference REF** (at 0 1.016) (layer F.SilkS) hide)
    (fp_text value "" (at 0 -1.016) (layer F.Fab) hide)
    (pad 1 thru_hole circle (at 0 0) (size 0.508 0.508) (drill 0.254) (layers *.Cu)
      (net 2 /GND))
  )
  (module "Custom Footprint:VIA-10mil" (layer F.Cu) (tedit 59361225)
    (at 151.384 106.045)
    (fp_text reference REF** (at 0 1.016) (layer F.SilkS) hide)
    (fp_text value "" (at 0 -1.016) (layer F.Fab) hide)
    (pad 1 thru_hole circle (at 0 0) (size 0.508 0.508) (drill 0.254) (layers *.Cu)
      (net 2 /GND))
  )
  (module "Custom Footprint:VIA-10mil" (layer F.Cu) (tedit 59361230)
    (at 144.399 99.695)
    (fp_text reference REF** (at 0 1.016) (layer F.SilkS) hide)
    (fp_text value "" (at 0 -1.016) (layer F.Fab) hide)
    (pad 1 thru_hole circle (at 0 0) (size 0.508 0.508) (drill 0.254) (layers *.Cu)
      (net 2 /GND))
  )
  (module "Custom Footprint:VIA-10mil" (layer F.Cu) (tedit 5936122B)
    (at 144.653 106.045)
    (fp_text reference REF** (at 0 1.016) (layer F.SilkS) hide)
    (fp_text value "" (at 0 -1.016) (layer F.Fab) hide)
    (pad 1 thru_hole circle (at 0 0) (size 0.508 0.508) (drill 0.254) (layers *.Cu)
      (net 2 /GND))
  )
  (module "Custom Footprint:VIA-10mil" (layer F.Cu) (tedit 59361235)
    (at 152.781 99.568)
    (fp_text reference REF** (at 0 1.016) (layer F.SilkS) hide)
    (fp_text value "" (at 0 -1.016) (layer F.Fab) hide)
    (pad 1 thru_hole circle (at 0 0) (size 0.508 0.508) (drill 0.254) (layers *.Cu)
      (net 2 /GND))
  )
  (module "Custom Footprint:VIA-10mil" (layer F.Cu) (tedit 59361239)
    (at 151.638 99.568)
    (fp_text reference REF** (at 0 1.016) (layer F.SilkS) hide)
    (fp_text value "" (at 0 -1.016) (layer F.Fab) hide)
    (pad 1 thru_hole circle (at 0 0) (size 0.508 0.508) (drill 0.254) (layers *.Cu)
      (net 2 /GND))
  )
  (module Socket_Strips:Socket_Strip_Straight_1x02_Pitch2.54mm (layer F.Cu) (tedit 59360843)
    (at 152.4 101.6)
    (descr "Through hole straight socket strip, 1x02, 2.54mm pitch, single row")
    (tags "Through hole socket strip THT 1x02 2.54mm single row")
    (fp_text reference "" (at 0 -2.33) (layer F.SilkS))
    (fp_text value "" (at 0 4.87) (layer F.Fab))
    (fp_text user %R (at 0 -2.33) (layer F.Fab))
    (pad 1 thru_hole rect (at 0 0) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 3 /+5V))
    (pad 2 thru_hole oval (at 0 2.54) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 4 /Enable))
    (model ${KISYS3DMOD}/Socket_Strips.3dshapes/Socket_Strip_Straight_1x02_Pitch2.54mm.wrl
      (at (xyz 0 -0.05 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 270))
    )
  )
  (module Capacitors_SMD:C_1206 (layer F.Cu) (tedit 59360809)
    (at 148.463 99.822 180)
    (descr "Capacitor SMD 1206, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 1206")
    (attr smd)
    (fp_text reference C1 (at 0 0 180) (layer F.SilkS))
    (fp_text value "" (at 0 0 180) (layer F.Fab))
    (fp_text user %R (at 0 0 180) (layer F.Fab))
    (pad 1 smd rect (at -1.5 0 180) (size 1 1.6) (layers F.Cu F.Paste F.Mask)
      (net 1 /VIN))
    (pad 2 smd rect (at 1.5 0 180) (size 1 1.6) (layers F.Cu F.Paste F.Mask)
      (net 2 /GND))
    (model Capacitors_SMD.3dshapes/C_1206.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_SMD:C_1206 (layer F.Cu) (tedit 5936084F)
    (at 148.463 105.537 180)
    (descr "Capacitor SMD 1206, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 1206")
    (attr smd)
    (fp_text reference C2 (at 0 0 180) (layer F.SilkS))
    (fp_text value "" (at 0 2 180) (layer F.Fab))
    (fp_text user %R (at 0 -1.75 180) (layer F.Fab))
    (pad 1 smd rect (at -1.5 0 180) (size 1 1.6) (layers F.Cu F.Paste F.Mask)
      (net 3 /+5V))
    (pad 2 smd rect (at 1.5 0 180) (size 1 1.6) (layers F.Cu F.Paste F.Mask)
      (net 2 /GND))
    (model Capacitors_SMD.3dshapes/C_1206.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Housings_DFN_QFN:DFN-6-1EP_3x3mm_Pitch0.95mm (layer F.Cu) (tedit 59361243)
    (at 148.463 102.87)
    (descr "DFN6 3*3 MM, 0.95 PITCH; CASE 506AH-01 (see ON Semiconductor 506AH.PDF)")
    (tags "DFN 0.95")
    (attr smd)
    (fp_text reference "" (at 0 -2.575) (layer F.SilkS))
    (fp_text value LP3869x (at 0.127 -3.175 180) (layer B.SilkS))
    (pad 1 smd rect (at -1.34 -0.95) (size 0.63 0.45) (layers F.Cu F.Paste F.Mask)
      (net 1 /VIN))
    (pad 2 smd rect (at -1.34 0) (size 0.63 0.45) (layers F.Cu F.Paste F.Mask)
      (net 2 /GND))
    (pad 3 smd rect (at -1.34 0.95) (size 0.63 0.45) (layers F.Cu F.Paste F.Mask)
      (net 4 /Enable))
    (pad 4 smd rect (at 1.34 0.95) (size 0.63 0.45) (layers F.Cu F.Paste F.Mask)
      (net 3 /+5V))
    (pad 5 smd rect (at 1.34 0) (size 0.63 0.45) (layers F.Cu F.Paste F.Mask)
      (net 3 /+5V))
    (pad 6 smd rect (at 1.34 -0.95) (size 0.63 0.45) (layers F.Cu F.Paste F.Mask)
      (net 1 /VIN))
    (pad 7 smd rect (at 0.425 0.65) (size 0.85 1.3) (layers F.Cu F.Paste F.Mask)
      (net 2 /GND) (solder_paste_margin_ratio -0.2))
    (pad 7 smd rect (at 0.425 -0.65) (size 0.85 1.3) (layers F.Cu F.Paste F.Mask)
      (net 2 /GND) (solder_paste_margin_ratio -0.2))
    (pad 7 smd rect (at -0.425 0.65) (size 0.85 1.3) (layers F.Cu F.Paste F.Mask)
      (net 2 /GND) (solder_paste_margin_ratio -0.2))
    (pad 7 smd rect (at -0.425 -0.65) (size 0.85 1.3) (layers F.Cu F.Paste F.Mask)
      (net 2 /GND) (solder_paste_margin_ratio -0.2))
    (model Housings_DFN_QFN.3dshapes/DFN-6-1EP_3x3mm_Pitch0.95mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Socket_Strips:Socket_Strip_Straight_1x02_Pitch2.54mm (layer F.Cu) (tedit 59360840)
    (at 144.78 104.14 180)
    (descr "Through hole straight socket strip, 1x02, 2.54mm pitch, single row")
    (tags "Through hole socket strip THT 1x02 2.54mm single row")
    (fp_text reference "" (at 0 -2.33 180) (layer F.SilkS))
    (fp_text value "" (at 0 4.87 180) (layer F.Fab))
    (fp_text user %R (at 0 -2.33 180) (layer F.Fab))
    (pad 1 thru_hole rect (at 0 0 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 2 /GND))
    (pad 2 thru_hole oval (at 0 2.54 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 1 /VIN))
    (model ${KISYS3DMOD}/Socket_Strips.3dshapes/Socket_Strip_Straight_1x02_Pitch2.54mm.wrl
      (at (xyz 0 -0.05 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 270))
    )
  )
  (gr_text EN (at 150.114 104.902) (layer B.SilkS))
  (gr_text +Out (at 149.86 102.108) (layer B.SilkS))
  (gr_text GND (at 147.32 103.632) (layer B.SilkS))
  (gr_text "VIN\n" (at 147.193 100.838) (layer B.SilkS))
  (gr_text . (at 146.431 101.346) (layer F.SilkS))
  (gr_line (start 143.002 98.679) (end 143.129 98.679) (angle 90) (layer Edge.Cuts) (width 0.15))
  (gr_line (start 143.002 106.68) (end 143.002 98.679) (angle 90) (layer Edge.Cuts) (width 0.15))
  (gr_line (start 154.178 106.68) (end 143.002 106.68) (angle 90) (layer Edge.Cuts) (width 0.15))
  (gr_line (start 154.178 98.679) (end 154.178 106.68) (angle 90) (layer Edge.Cuts) (width 0.15))
  (gr_line (start 143.129 98.679) (end 154.178 98.679) (angle 90) (layer Edge.Cuts) (width 0.15))
  (zone (net 0) (net_name "") (layer B.Cu) (hatch edge 0.508)
    (connect_pads yes (clearance 0.1524))
    (min_thickness 0.1524)
    (keepout (tracks allowed) (vias allowed) (copperpour not_allowed))
    (fill (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 144.145 103.505) (xy 145.415 103.505) (xy 145.415 104.775) (xy 144.145 104.775)
      )
    )
  )
  (zone (net 0) (net_name "") (layer F.Cu) (hatch edge 0.508)
    (connect_pads yes (clearance 0.1524))
    (min_thickness 0.1524)
    (keepout (tracks allowed) (vias allowed) (copperpour not_allowed))
    (fill (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 145.415 104.775) (xy 144.145 104.775) (xy 144.145 103.505) (xy 145.415 103.505)
      )
    )
  )
  (zone (net 2) (net_name /GND) (layer B.Cu) (hatch edge 0.508)
    (connect_pads yes (clearance 0.2))
    (min_thickness 0.1524)
    (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508) (smoothing chamfer))
    (polygon
      (pts
        (xy 154.051 98.806) (xy 154.051 106.553) (xy 143.129 106.553) (xy 143.129 98.806)
      )
    )
  )
  (zone (net 2) (net_name /GND) (layer F.Cu) (hatch edge 0.508)
    (connect_pads yes (clearance 0.2))
    (min_thickness 0.1524)
    (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508) (smoothing chamfer))
    (polygon
      (pts
        (xy 154.051 98.806) (xy 154.051 106.553) (xy 143.129 106.553) (xy 143.129 98.806)
      )
    )
  )
)
