(kicad_pcb (version 20171130) (host pcbnew "(5.1.12)-1")
  (general
    (thickness 1.6)
    (drawings 26)
    (tracks 870)
    (zones 0)
    (modules 46)
    (nets 56)
  )
  (page USLetter)
  (layers
    (0 F.Cu signal)
    (31 B.Cu signal)
    (32 B.Adhes user)
    (33 F.Adhes user)
    (34 B.Paste user)
    (35 F.Paste user)
    (36 B.SilkS user)
    (37 F.SilkS user)
    (38 B.Mask user)
    (39 F.Mask user)
    (40 Dwgs.User user hide)
    (41 Cmts.User user hide)
    (42 Eco1.User user)
    (43 Eco2.User user)
    (44 Edge.Cuts user)
    (45 Margin user)
    (46 B.CrtYd user)
    (47 F.CrtYd user)
    (48 B.Fab user hide)
    (49 F.Fab user hide)
  )
  (setup
    (last_trace_width 0.1524)
    (user_trace_width 0.1524)
    (user_trace_width 0.254)
    (user_trace_width 0.381)
    (user_trace_width 0.508)
    (user_trace_width 0.762)
    (user_trace_width 1.016)
    (user_trace_width 2.032)
    (trace_clearance 0.1524)
    (zone_clearance 0.508)
    (zone_45_only no)
    (trace_min 0.1524)
    (via_size 0.508)
    (via_drill 0.254)
    (via_min_size 0.508)
    (via_min_drill 0.254)
    (user_via 1.016 0.508)
    (uvia_size 0.3)
    (uvia_drill 0.1)
    (uvias_allowed no)
    (uvia_min_size 0.2)
    (uvia_min_drill 0.1)
    (edge_width 0.05)
    (segment_width 0.2)
    (pcb_text_width 0.3)
    (pcb_text_size 1.5 1.5)
    (mod_edge_width 0.12)
    (mod_text_size 1 1)
    (mod_text_width 0.15)
    (pad_size 1.524 1.524)
    (pad_drill 0.762)
    (pad_to_mask_clearance 0.0508)
    (solder_mask_min_width 0.101)
    (aux_axis_origin 0 0)
    (visible_elements 7FFFFFFF)
    (pcbplotparams
      (layerselection 0x010fc_ffffffff)
      (usegerberextensions false)
      (usegerberattributes true)
      (usegerberadvancedattributes true)
      (creategerberjobfile true)
      (excludeedgelayer true)
      (linewidth 0.100000)
      (plotframeref false)
      (viasonmask false)
      (mode 1)
      (useauxorigin false)
      (hpglpennumber 1)
      (hpglpenspeed 20)
      (hpglpendiameter 15.000000)
      (psnegative false)
      (psa4output false)
      (plotreference true)
      (plotvalue true)
      (plotinvisibletext false)
      (padsonsilk false)
      (subtractmaskfromsilk false)
      (outputformat 1)
      (mirror false)
      (drillshape 1)
      (scaleselection 1)
      (outputdirectory ""))
  )
  (net 0 "")
  (net 1 "Net-(U1-Pad29)")
  (net 2 "Net-(U1-Pad37)")
  (net 3 "Net-(U1-Pad39)")
  (net 4 "Net-(J1-Pad8)")
  (net 5 "Net-(J1-Pad7)")
  (net 6 "Net-(J1-Pad6)")
  (net 7 GND)
  (net 8 +3V3)
  (net 9 RESET)
  (net 10 TFT_CS)
  (net 11 TFT_SCK)
  (net 12 TFT_SDI)
  (net 13 TFT_RESET)
  (net 14 TFT_DC)
  (net 15 TFT_SDO)
  (net 16 TP_IRQ)
  (net 17 TP_CS)
  (net 18 TP_OUT)
  (net 19 TP_DIN)
  (net 20 TP_CLK)
  (net 21 BUTTON1)
  (net 22 STROBE1)
  (net 23 BUTTON2)
  (net 24 BUTTON3)
  (net 25 BUTTON4)
  (net 26 STROBE2)
  (net 27 BUTTON5)
  (net 28 SWCLK)
  (net 29 SWDIO)
  (net 30 "Net-(LS1-Pad2)")
  (net 31 "Net-(LS1-Pad1)")
  (net 32 VCC)
  (net 33 +1V8)
  (net 34 "Net-(U3-Pad4)")
  (net 35 "Net-(J2-Pad4)")
  (net 36 "Net-(J2-Pad3)")
  (net 37 "Net-(J2-Pad2)")
  (net 38 "Net-(R1-Pad1)")
  (net 39 "Net-(TP1-Pad1)")
  (net 40 "Net-(TP2-Pad1)")
  (net 41 SDA)
  (net 42 SCL)
  (net 43 MCLK)
  (net 44 BCK)
  (net 45 DACDAT)
  (net 46 LRCK)
  (net 47 "Net-(D1-Pad1)")
  (net 48 "Net-(D2-Pad1)")
  (net 49 "Net-(R4-Pad2)")
  (net 50 "Net-(J2-Pad6)")
  (net 51 /USB_VBUS)
  (net 52 /VREF)
  (net 53 /VBAT_CHARGE)
  (net 54 ADC_VREF)
  (net 55 VOL)
  (net_class Default "This is the default net class."
    (clearance 0.1524)
    (trace_width 0.1524)
    (via_dia 0.508)
    (via_drill 0.254)
    (uvia_dia 0.3)
    (uvia_drill 0.1)
    (add_net +1V8)
    (add_net +3V3)
    (add_net /USB_VBUS)
    (add_net /VBAT_CHARGE)
    (add_net /VREF)
    (add_net ADC_VREF)
    (add_net BCK)
    (add_net BUTTON1)
    (add_net BUTTON2)
    (add_net BUTTON3)
    (add_net BUTTON4)
    (add_net BUTTON5)
    (add_net DACDAT)
    (add_net GND)
    (add_net LRCK)
    (add_net MCLK)
    (add_net "Net-(D1-Pad1)")
    (add_net "Net-(D2-Pad1)")
    (add_net "Net-(J1-Pad6)")
    (add_net "Net-(J1-Pad7)")
    (add_net "Net-(J1-Pad8)")
    (add_net "Net-(J2-Pad2)")
    (add_net "Net-(J2-Pad3)")
    (add_net "Net-(J2-Pad4)")
    (add_net "Net-(J2-Pad6)")
    (add_net "Net-(LS1-Pad1)")
    (add_net "Net-(LS1-Pad2)")
    (add_net "Net-(R1-Pad1)")
    (add_net "Net-(R4-Pad2)")
    (add_net "Net-(TP1-Pad1)")
    (add_net "Net-(TP2-Pad1)")
    (add_net "Net-(U1-Pad29)")
    (add_net "Net-(U1-Pad37)")
    (add_net "Net-(U1-Pad39)")
    (add_net "Net-(U3-Pad4)")
    (add_net RESET)
    (add_net SCL)
    (add_net SDA)
    (add_net STROBE1)
    (add_net STROBE2)
    (add_net SWCLK)
    (add_net SWDIO)
    (add_net TFT_CS)
    (add_net TFT_DC)
    (add_net TFT_RESET)
    (add_net TFT_SCK)
    (add_net TFT_SDI)
    (add_net TFT_SDO)
    (add_net TP_CLK)
    (add_net TP_CS)
    (add_net TP_DIN)
    (add_net TP_IRQ)
    (add_net TP_OUT)
    (add_net VCC)
    (add_net VOL)
  )
  (module Connector_JST:JST_PH_B2B-PH-K_1x02_P2.00mm_Vertical (layer F.Cu) (tedit 5B7745C2)
    (at 78.74 104.775 90)
    (descr "JST PH series connector, B2B-PH-K (http://www.jst-mfg.com/product/pdf/eng/ePH.pdf), generated with kicad-footprint-generator")
    (tags "connector JST PH side entry")
    (fp_text reference LS1 (at 1 -2.9 90) (layer F.SilkS))
    (fp_text value Speaker (at 1 4 90) (layer F.Fab))
    (fp_text user %R (at 1 1.5 90) (layer F.Fab))
    (pad 2 thru_hole oval (at 2 0 90) (size 1.2 1.75) (drill 0.75) (layers *.Cu *.Mask)
      (net 30 "Net-(LS1-Pad2)"))
    (pad 1 thru_hole roundrect (at 0 0 90) (size 1.2 1.75) (drill 0.75) (layers *.Cu *.Mask) (roundrect_rratio 0.208333)
      (net 31 "Net-(LS1-Pad1)"))
    (model ${KISYS3DMOD}/Connector_JST.3dshapes/JST_PH_B2B-PH-K_1x02_P2.00mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder (layer B.Cu) (tedit 5F68FEEF)
    (at 72.644 50.673 90)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C13 (at 2.413 0 180) (layer B.SilkS))
    (fp_text value 4.7uF (at 0 -1.68 90) (layer B.Fab))
    (fp_text user %R (at 0 0 90) (layer B.Fab))
    (pad 2 smd roundrect (at 1.0375 0 90) (size 1.175 1.45) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.212766)
      (net 7 GND))
    (pad 1 smd roundrect (at -1.0375 0 90) (size 1.175 1.45) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.212766)
      (net 53 /VBAT_CHARGE))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Connector_JST:JST_PH_B2B-PH-K_1x02_P2.00mm_Vertical (layer F.Cu) (tedit 5B7745C2)
    (at 80.264 56.261 90)
    (descr "JST PH series connector, B2B-PH-K (http://www.jst-mfg.com/product/pdf/eng/ePH.pdf), generated with kicad-footprint-generator")
    (tags "connector JST PH side entry")
    (fp_text reference J3 (at 4.953 0.508 180) (layer F.SilkS))
    (fp_text value Battery (at 1 4 90) (layer F.Fab))
    (fp_text user %R (at 1 1.5 90) (layer F.Fab))
    (pad 2 thru_hole oval (at 2 0 90) (size 1.2 1.75) (drill 0.75) (layers *.Cu *.Mask)
      (net 7 GND))
    (pad 1 thru_hole roundrect (at 0 0 90) (size 1.2 1.75) (drill 0.75) (layers *.Cu *.Mask) (roundrect_rratio 0.208333)
      (net 53 /VBAT_CHARGE))
    (model ${KISYS3DMOD}/Connector_JST.3dshapes/JST_PH_B2B-PH-K_1x02_P2.00mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module JennToo_Custom:Potentiometer_Generic_3 (layer F.Cu) (tedit 61B635E0)
    (at 28.956 105.918 180)
    (fp_text reference RV1 (at 0 10.5) (layer F.SilkS))
    (fp_text value 10k (at 0 -13.97) (layer F.Fab))
    (pad 1 thru_hole circle (at -4 8 180) (size 1.524 1.524) (drill 0.8) (layers *.Cu *.Mask)
      (net 54 ADC_VREF))
    (pad "" thru_hole circle (at 5 -2.5 180) (size 2.2 2.2) (drill 1.2) (layers *.Cu *.Mask))
    (pad "" thru_hole circle (at -5 -2.5 180) (size 2.2 2.2) (drill 1.2) (layers *.Cu *.Mask))
    (pad 3 thru_hole circle (at 4 8 180) (size 1.524 1.524) (drill 0.8) (layers *.Cu *.Mask)
      (net 7 GND))
    (pad 2 thru_hole circle (at 0 8 180) (size 1.524 1.524) (drill 0.8) (layers *.Cu *.Mask)
      (net 55 VOL))
  )
  (module MountingHole:MountingHole_3.2mm_M3 locked (layer F.Cu) (tedit 56D1B4CB)
    (at 42.164 106.172)
    (descr "Mounting Hole 3.2mm, no annular, M3")
    (tags "mounting hole 3.2mm no annular m3")
    (attr virtual)
    (fp_text reference REF** (at 0 -4.2) (layer F.SilkS) hide)
    (fp_text value MountingHole_3.2mm_M3 (at 0 4.2) (layer F.Fab))
    (fp_text user %R (at 0.3 0) (layer F.Fab))
    (pad 1 np_thru_hole circle (at 0 0) (size 3.2 3.2) (drill 3.2) (layers *.Cu *.Mask))
  )
  (module MountingHole:MountingHole_3.2mm_M3 locked (layer F.Cu) (tedit 56D1B4CB)
    (at 19.558 48.006)
    (descr "Mounting Hole 3.2mm, no annular, M3")
    (tags "mounting hole 3.2mm no annular m3")
    (attr virtual)
    (fp_text reference REF** (at 0 -4.2) (layer F.SilkS) hide)
    (fp_text value MountingHole_3.2mm_M3 (at 0 4.2) (layer F.Fab))
    (fp_text user %R (at 0.3 0) (layer F.Fab))
    (pad 1 np_thru_hole circle (at 0 0) (size 3.2 3.2) (drill 3.2) (layers *.Cu *.Mask))
  )
  (module MountingHole:MountingHole_3.2mm_M3 locked (layer F.Cu) (tedit 56D1B4CB)
    (at 82.042 48.006)
    (descr "Mounting Hole 3.2mm, no annular, M3")
    (tags "mounting hole 3.2mm no annular m3")
    (attr virtual)
    (fp_text reference REF** (at 0 -4.2) (layer F.SilkS) hide)
    (fp_text value MountingHole_3.2mm_M3 (at 0 4.2) (layer F.Fab))
    (fp_text user %R (at 0.3 0) (layer F.Fab))
    (pad 1 np_thru_hole circle (at 0 0) (size 3.2 3.2) (drill 3.2) (layers *.Cu *.Mask))
  )
  (module MCU_RaspberryPi_and_Boards:RPi_Pico_SMD_only (layer B.Cu) (tedit 61B410C4)
    (at 50.8 74.93 90)
    (descr "Through hole straight pin header, 2x20, 2.54mm pitch, double rows")
    (tags "Through hole pin header THT 2x20 2.54mm double row")
    (fp_text reference U1 (at 0 0 270) (layer B.SilkS))
    (fp_text value Pico (at 0 -2.159 270) (layer B.Fab))
    (fp_text user %R (at 0 0 90) (layer B.Fab))
    (fp_text user GP1 (at -12.9 21.6 225) (layer B.SilkS))
    (fp_text user GP2 (at -12.9 16.51 225) (layer B.SilkS))
    (fp_text user GP0 (at -12.8 24.13 225) (layer B.SilkS))
    (fp_text user GP3 (at -12.8 13.97 225) (layer B.SilkS))
    (fp_text user GP4 (at -12.8 11.43 225) (layer B.SilkS))
    (fp_text user GP5 (at -12.8 8.89 225) (layer B.SilkS))
    (fp_text user GP6 (at -12.8 3.81 225) (layer B.SilkS))
    (fp_text user GP7 (at -12.7 1.3 225) (layer B.SilkS))
    (fp_text user GP8 (at -12.8 -1.27 225) (layer B.SilkS))
    (fp_text user GP9 (at -12.8 -3.81 225) (layer B.SilkS))
    (fp_text user GP10 (at -13.054 -8.89 225) (layer B.SilkS))
    (fp_text user GP11 (at -13.2 -11.43 225) (layer B.SilkS))
    (fp_text user GP12 (at -13.2 -13.97 225) (layer B.SilkS))
    (fp_text user GP13 (at -13.054 -16.51 225) (layer B.SilkS))
    (fp_text user GP14 (at -13.1 -21.59 225) (layer B.SilkS))
    (fp_text user GP15 (at -13.054 -24.13 225) (layer B.SilkS))
    (fp_text user GP16 (at 13.054 -24.13 225) (layer B.SilkS))
    (fp_text user GP17 (at 13.054 -21.59 225) (layer B.SilkS))
    (fp_text user GP18 (at 13.054 -16.51 225) (layer B.SilkS))
    (fp_text user GP19 (at 13.054 -13.97 225) (layer B.SilkS))
    (fp_text user GP20 (at 13.054 -11.43 225) (layer B.SilkS))
    (fp_text user GP21 (at 13.054 -8.9 225) (layer B.SilkS))
    (fp_text user GP22 (at 13.054 -3.81 225) (layer B.SilkS))
    (fp_text user RUN (at 13 -1.27 225) (layer B.SilkS))
    (fp_text user GP26 (at 13.054 1.27 225) (layer B.SilkS))
    (fp_text user GP27 (at 13.054 3.8 225) (layer B.SilkS))
    (fp_text user GP28 (at 13.054 9.144 225) (layer B.SilkS))
    (fp_text user ADC_VREF (at 14 12.5 225) (layer B.SilkS))
    (fp_text user 3V3 (at 12.9 13.9 225) (layer B.SilkS))
    (fp_text user GND (at -12.8 19.05 225) (layer B.SilkS))
    (fp_text user GND (at -12.8 6.35 225) (layer B.SilkS))
    (fp_text user GND (at -12.8 -6.35 225) (layer B.SilkS))
    (fp_text user GND (at -12.8 -19.05 225) (layer B.SilkS))
    (fp_text user GND (at 12.8 -19.05 225) (layer B.SilkS))
    (fp_text user GND (at 12.8 -6.35 225) (layer B.SilkS))
    (fp_text user GND (at 12.8 19.05 225) (layer B.SilkS))
    (fp_text user AGND (at 13.054 6.35 225) (layer B.SilkS))
    (fp_text user SWCLK (at -5.7 -26.2 270) (layer B.SilkS))
    (fp_text user SWDIO (at 5.6 -26.2 270) (layer B.SilkS))
    (fp_text user "Copper Keepouts shown on Dwgs layer" (at 0.1 30.2 270) (layer Cmts.User))
    (pad 1 smd rect (at -8.89 24.13 90) (size 3.5 1.7) (drill (offset -0.9 0)) (layers B.Cu B.Mask)
      (net 21 BUTTON1))
    (pad 2 smd rect (at -8.89 21.59 90) (size 3.5 1.7) (drill (offset -0.9 0)) (layers B.Cu B.Mask)
      (net 23 BUTTON2))
    (pad 3 smd rect (at -8.89 19.05 90) (size 3.5 1.7) (drill (offset -0.9 0)) (layers B.Cu B.Mask)
      (net 7 GND))
    (pad 4 smd rect (at -8.89 16.51 90) (size 3.5 1.7) (drill (offset -0.9 0)) (layers B.Cu B.Mask)
      (net 24 BUTTON3))
    (pad 5 smd rect (at -8.89 13.97 90) (size 3.5 1.7) (drill (offset -0.9 0)) (layers B.Cu B.Mask)
      (net 25 BUTTON4))
    (pad 6 smd rect (at -8.89 11.43 90) (size 3.5 1.7) (drill (offset -0.9 0)) (layers B.Cu B.Mask)
      (net 27 BUTTON5))
    (pad 7 smd rect (at -8.89 8.89 90) (size 3.5 1.7) (drill (offset -0.9 0)) (layers B.Cu B.Mask)
      (net 16 TP_IRQ))
    (pad 8 smd rect (at -8.89 6.35 90) (size 3.5 1.7) (drill (offset -0.9 0)) (layers B.Cu B.Mask)
      (net 7 GND))
    (pad 9 smd rect (at -8.89 3.81 90) (size 3.5 1.7) (drill (offset -0.9 0)) (layers B.Cu B.Mask)
      (net 43 MCLK))
    (pad 10 smd rect (at -8.89 1.27 90) (size 3.5 1.7) (drill (offset -0.9 0)) (layers B.Cu B.Mask)
      (net 44 BCK))
    (pad 11 smd rect (at -8.89 -1.27 90) (size 3.5 1.7) (drill (offset -0.9 0)) (layers B.Cu B.Mask)
      (net 45 DACDAT))
    (pad 12 smd rect (at -8.89 -3.81 90) (size 3.5 1.7) (drill (offset -0.9 0)) (layers B.Cu B.Mask)
      (net 46 LRCK))
    (pad 13 smd rect (at -8.89 -6.35 90) (size 3.5 1.7) (drill (offset -0.9 0)) (layers B.Cu B.Mask)
      (net 7 GND))
    (pad 14 smd rect (at -8.89 -8.89 90) (size 3.5 1.7) (drill (offset -0.9 0)) (layers B.Cu B.Mask)
      (net 20 TP_CLK))
    (pad 15 smd rect (at -8.89 -11.43 90) (size 3.5 1.7) (drill (offset -0.9 0)) (layers B.Cu B.Mask)
      (net 19 TP_DIN))
    (pad 16 smd rect (at -8.89 -13.97 90) (size 3.5 1.7) (drill (offset -0.9 0)) (layers B.Cu B.Mask)
      (net 18 TP_OUT))
    (pad 17 smd rect (at -8.89 -16.51 90) (size 3.5 1.7) (drill (offset -0.9 0)) (layers B.Cu B.Mask)
      (net 17 TP_CS))
    (pad 18 smd rect (at -8.89 -19.05 90) (size 3.5 1.7) (drill (offset -0.9 0)) (layers B.Cu B.Mask)
      (net 7 GND))
    (pad 19 smd rect (at -8.89 -21.59 90) (size 3.5 1.7) (drill (offset -0.9 0)) (layers B.Cu B.Mask)
      (net 22 STROBE1))
    (pad 20 smd rect (at -8.89 -24.13 90) (size 3.5 1.7) (drill (offset -0.9 0)) (layers B.Cu B.Mask)
      (net 26 STROBE2))
    (pad 40 smd rect (at 8.89 24.13 90) (size 3.5 1.7) (drill (offset 0.9 0)) (layers B.Cu B.Mask)
      (net 32 VCC))
    (pad 39 smd rect (at 8.89 21.59 90) (size 3.5 1.7) (drill (offset 0.9 0)) (layers B.Cu B.Mask)
      (net 3 "Net-(U1-Pad39)"))
    (pad 38 smd rect (at 8.89 19.05 90) (size 3.5 1.7) (drill (offset 0.9 0)) (layers B.Cu B.Mask)
      (net 7 GND))
    (pad 37 smd rect (at 8.89 16.51 90) (size 3.5 1.7) (drill (offset 0.9 0)) (layers B.Cu B.Mask)
      (net 2 "Net-(U1-Pad37)"))
    (pad 36 smd rect (at 8.89 13.97 90) (size 3.5 1.7) (drill (offset 0.9 0)) (layers B.Cu B.Mask)
      (net 8 +3V3))
    (pad 35 smd rect (at 8.89 11.43 90) (size 3.5 1.7) (drill (offset 0.9 0)) (layers B.Cu B.Mask)
      (net 54 ADC_VREF))
    (pad 34 smd rect (at 8.89 8.89 90) (size 3.5 1.7) (drill (offset 0.9 0)) (layers B.Cu B.Mask)
      (net 55 VOL))
    (pad 33 smd rect (at 8.89 6.35 90) (size 3.5 1.7) (drill (offset 0.9 0)) (layers B.Cu B.Mask)
      (net 7 GND))
    (pad 32 smd rect (at 8.89 3.81 90) (size 3.5 1.7) (drill (offset 0.9 0)) (layers B.Cu B.Mask)
      (net 42 SCL))
    (pad 31 smd rect (at 8.89 1.27 90) (size 3.5 1.7) (drill (offset 0.9 0)) (layers B.Cu B.Mask)
      (net 41 SDA))
    (pad 30 smd rect (at 8.89 -1.27 90) (size 3.5 1.7) (drill (offset 0.9 0)) (layers B.Cu B.Mask)
      (net 9 RESET))
    (pad 29 smd rect (at 8.89 -3.81 90) (size 3.5 1.7) (drill (offset 0.9 0)) (layers B.Cu B.Mask)
      (net 1 "Net-(U1-Pad29)"))
    (pad 28 smd rect (at 8.89 -6.35 90) (size 3.5 1.7) (drill (offset 0.9 0)) (layers B.Cu B.Mask)
      (net 7 GND))
    (pad 27 smd rect (at 8.89 -8.89 90) (size 3.5 1.7) (drill (offset 0.9 0)) (layers B.Cu B.Mask)
      (net 14 TFT_DC))
    (pad 26 smd rect (at 8.89 -11.43 90) (size 3.5 1.7) (drill (offset 0.9 0)) (layers B.Cu B.Mask)
      (net 13 TFT_RESET))
    (pad 25 smd rect (at 8.89 -13.97 90) (size 3.5 1.7) (drill (offset 0.9 0)) (layers B.Cu B.Mask)
      (net 12 TFT_SDI))
    (pad 24 smd rect (at 8.89 -16.51 90) (size 3.5 1.7) (drill (offset 0.9 0)) (layers B.Cu B.Mask)
      (net 11 TFT_SCK))
    (pad 23 smd rect (at 8.89 -19.05 90) (size 3.5 1.7) (drill (offset 0.9 0)) (layers B.Cu B.Mask)
      (net 7 GND))
    (pad 22 smd rect (at 8.89 -21.59 90) (size 3.5 1.7) (drill (offset 0.9 0)) (layers B.Cu B.Mask)
      (net 10 TFT_CS))
    (pad 21 smd rect (at 8.89 -24.13 90) (size 3.5 1.7) (drill (offset 0.9 0)) (layers B.Cu B.Mask)
      (net 15 TFT_SDO))
    (pad 41 smd rect (at -2.54 -23.9) (size 3.5 1.7) (drill (offset -0.9 0)) (layers B.Cu B.Mask)
      (net 28 SWCLK))
    (pad 42 smd rect (at 0 -23.9) (size 3.5 1.7) (drill (offset -0.9 0)) (layers B.Cu B.Mask)
      (net 7 GND))
    (pad 43 smd rect (at 2.54 -23.9) (size 3.5 1.7) (drill (offset -0.9 0)) (layers B.Cu B.Mask)
      (net 29 SWDIO))
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder (layer B.Cu) (tedit 5F68FEEE)
    (at 76.47 59.69)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R5 (at 0 -1.524 180) (layer B.SilkS))
    (fp_text value 1k (at 0 -1.65 180) (layer B.Fab))
    (fp_text user %R (at 0 0 180) (layer B.Fab))
    (pad 2 smd roundrect (at 1 0) (size 1.2 1.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.208333)
      (net 48 "Net-(D2-Pad1)"))
    (pad 1 smd roundrect (at -1 0) (size 1.2 1.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.208333)
      (net 7 GND))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder (layer B.Cu) (tedit 5F68FEEE)
    (at 67.04 52.07)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R4 (at 0.016 -1.524 180) (layer B.SilkS))
    (fp_text value 1k (at 0 -1.65 180) (layer B.Fab))
    (fp_text user %R (at 0 0 180) (layer B.Fab))
    (pad 2 smd roundrect (at 1 0) (size 1.2 1.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.208333)
      (net 49 "Net-(R4-Pad2)"))
    (pad 1 smd roundrect (at -1 0) (size 1.2 1.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.208333)
      (net 47 "Net-(D1-Pad1)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Connector_PinHeader_2.54mm:PinHeader_1x02_P2.54mm_Vertical (layer F.Cu) (tedit 59FED5CC)
    (at 80.01 61.849)
    (descr "Through hole straight pin header, 1x02, 2.54mm pitch, single row")
    (tags "Through hole pin header THT 1x02 2.54mm single row")
    (fp_text reference D2 (at -0.127 4.826) (layer F.SilkS))
    (fp_text value Power (at 0 4.87) (layer F.Fab))
    (fp_text user %R (at 0 1.27 90) (layer F.Fab))
    (pad 2 thru_hole oval (at 0 2.54) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 32 VCC))
    (pad 1 thru_hole rect (at 0 0) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 48 "Net-(D2-Pad1)"))
    (model ${KISYS3DMOD}/Connector_PinHeader_2.54mm.3dshapes/PinHeader_1x02_P2.54mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Connector_PinHeader_2.54mm:PinHeader_1x02_P2.54mm_Vertical (layer F.Cu) (tedit 59FED5CC)
    (at 66.04 58.42 90)
    (descr "Through hole straight pin header, 1x02, 2.54mm pitch, single row")
    (tags "Through hole pin header THT 1x02 2.54mm single row")
    (fp_text reference D1 (at 0 4.699 90) (layer F.SilkS))
    (fp_text value Charge (at 0 4.87 90) (layer F.Fab))
    (fp_text user %R (at 0 1.27) (layer F.Fab))
    (pad 2 thru_hole oval (at 0 2.54 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 51 /USB_VBUS))
    (pad 1 thru_hole rect (at 0 0 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 47 "Net-(D1-Pad1)"))
    (model ${KISYS3DMOD}/Connector_PinHeader_2.54mm.3dshapes/PinHeader_1x02_P2.54mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Connector_PinHeader_2.54mm:PinHeader_1x02_P2.54mm_Vertical (layer F.Cu) (tedit 59FED5CC)
    (at 75.057 56.007 180)
    (descr "Through hole straight pin header, 1x02, 2.54mm pitch, single row")
    (tags "Through hole pin header THT 1x02 2.54mm single row")
    (fp_text reference SW11 (at -0.127 4.699) (layer F.SilkS))
    (fp_text value Power (at 0 4.87) (layer F.Fab))
    (fp_text user %R (at 0 1.27 90) (layer F.Fab))
    (pad 2 thru_hole oval (at 0 2.54 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 32 VCC))
    (pad 1 thru_hole rect (at 0 0 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 53 /VBAT_CHARGE))
    (model ${KISYS3DMOD}/Connector_PinHeader_2.54mm.3dshapes/PinHeader_1x02_P2.54mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder (layer B.Cu) (tedit 5F68FEEE)
    (at 59.166 90.678 180)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R3 (at -0.016 -1.778) (layer B.SilkS))
    (fp_text value 4.7k (at 0 -1.65) (layer B.Fab))
    (fp_text user %R (at 0 0) (layer B.Fab))
    (pad 2 smd roundrect (at 1 0 180) (size 1.2 1.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.208333)
      (net 42 SCL))
    (pad 1 smd roundrect (at -1 0 180) (size 1.2 1.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.208333)
      (net 8 +3V3))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder (layer B.Cu) (tedit 5F68FEEE)
    (at 66.548 89.916 180)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R2 (at 0 -1.778) (layer B.SilkS))
    (fp_text value 4.7k (at 0 -1.65) (layer B.Fab))
    (fp_text user %R (at 0 0) (layer B.Fab))
    (pad 2 smd roundrect (at 1 0 180) (size 1.2 1.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.208333)
      (net 41 SDA))
    (pad 1 smd roundrect (at -1 0 180) (size 1.2 1.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.208333)
      (net 8 +3V3))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module TestPoint:TestPoint_Pad_1.5x1.5mm (layer B.Cu) (tedit 5A0F774F)
    (at 76.2 91.44)
    (descr "SMD rectangular pad as test Point, square 1.5mm side length")
    (tags "test point SMD pad rectangle square")
    (attr virtual)
    (fp_text reference TP2 (at 0 1.648) (layer B.SilkS))
    (fp_text value SPK_LP (at 0 -1.75) (layer B.Fab))
    (fp_text user %R (at 0 1.65) (layer B.Fab))
    (pad 1 smd rect (at 0 0) (size 1.5 1.5) (layers B.Cu B.Mask)
      (net 40 "Net-(TP2-Pad1)"))
  )
  (module TestPoint:TestPoint_Pad_1.5x1.5mm (layer B.Cu) (tedit 5A0F774F)
    (at 78.74 91.44)
    (descr "SMD rectangular pad as test Point, square 1.5mm side length")
    (tags "test point SMD pad rectangle square")
    (attr virtual)
    (fp_text reference TP1 (at 0 1.648) (layer B.SilkS))
    (fp_text value SPK_LN (at 0 -1.75) (layer B.Fab))
    (fp_text user %R (at 0 1.65) (layer B.Fab))
    (pad 1 smd rect (at 0 0) (size 1.5 1.5) (layers B.Cu B.Mask)
      (net 39 "Net-(TP1-Pad1)"))
  )
  (module Package_TO_SOT_SMD:SOT-23-5 (layer B.Cu) (tedit 5A02FF57)
    (at 71.12 54.61 270)
    (descr "5-pin SOT23 package")
    (tags SOT-23-5)
    (attr smd)
    (fp_text reference U5 (at -2.54 0 180) (layer B.SilkS))
    (fp_text value MCP73831-2-OT (at 0 -2.9 90) (layer B.Fab))
    (fp_text user %R (at 0 0 180) (layer B.Fab))
    (pad 5 smd rect (at 1.1 0.95 270) (size 1.06 0.65) (layers B.Cu B.Paste B.Mask)
      (net 38 "Net-(R1-Pad1)"))
    (pad 4 smd rect (at 1.1 -0.95 270) (size 1.06 0.65) (layers B.Cu B.Paste B.Mask)
      (net 51 /USB_VBUS))
    (pad 3 smd rect (at -1.1 -0.95 270) (size 1.06 0.65) (layers B.Cu B.Paste B.Mask)
      (net 53 /VBAT_CHARGE))
    (pad 2 smd rect (at -1.1 0 270) (size 1.06 0.65) (layers B.Cu B.Paste B.Mask)
      (net 7 GND))
    (pad 1 smd rect (at -1.1 0.95 270) (size 1.06 0.65) (layers B.Cu B.Paste B.Mask)
      (net 49 "Net-(R4-Pad2)"))
    (model ${KISYS3DMOD}/Package_TO_SOT_SMD.3dshapes/SOT-23-5.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder (layer B.Cu) (tedit 5F68FEEE)
    (at 67.04 54.61 180)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R1 (at -0.016 -1.524) (layer B.SilkS))
    (fp_text value 2k (at 0 -1.65) (layer B.Fab))
    (fp_text user %R (at 0 0) (layer B.Fab))
    (pad 2 smd roundrect (at 1 0 180) (size 1.2 1.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.208333)
      (net 7 GND))
    (pad 1 smd roundrect (at -1 0 180) (size 1.2 1.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.208333)
      (net 38 "Net-(R1-Pad1)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module JennToo_Custom:Molex-513-87-0578-0 (layer F.Cu) (tedit 61B01184)
    (at 50.8 108.585 90)
    (fp_text reference J2 (at 4.15 -0.2 90) (layer F.SilkS))
    (fp_text value USB_B_Mini (at 4.953 6.858 180) (layer F.SilkS) hide)
    (pad 6 thru_hole roundrect (at -0.05 3.65 90) (size 2.2 1.65) (drill oval 1.4 0.65) (layers B.Cu B.Mask) (roundrect_rratio 0.5)
      (net 50 "Net-(J2-Pad6)"))
    (pad 6 thru_hole roundrect (at -0.05 -3.65 90) (size 2.2 1.65) (drill oval 1.4 0.65) (layers B.Cu B.Mask) (roundrect_rratio 0.5)
      (net 50 "Net-(J2-Pad6)"))
    (pad 6 thru_hole roundrect (at 2.85 -3.65 90) (size 2.2 1.65) (drill oval 1.4 0.65) (layers B.Cu B.Mask) (roundrect_rratio 0.5)
      (net 50 "Net-(J2-Pad6)"))
    (pad 6 thru_hole roundrect (at 2.85 3.65 90) (size 2.2 1.65) (drill oval 1.4 0.65) (layers B.Cu B.Mask) (roundrect_rratio 0.5)
      (net 50 "Net-(J2-Pad6)"))
    (pad 1 smd rect (at 2.849999 -1.6 90) (size 1.6 0.5) (layers F.Cu F.Paste F.Mask)
      (net 51 /USB_VBUS))
    (pad 2 smd rect (at 2.849999 -0.8 90) (size 1.6 0.5) (layers F.Cu F.Paste F.Mask)
      (net 37 "Net-(J2-Pad2)"))
    (pad 3 smd rect (at 2.849999 0 90) (size 1.6 0.5) (layers F.Cu F.Paste F.Mask)
      (net 36 "Net-(J2-Pad3)"))
    (pad 4 smd rect (at 2.849999 0.8 90) (size 1.6 0.5) (layers F.Cu F.Paste F.Mask)
      (net 35 "Net-(J2-Pad4)"))
    (pad 5 smd rect (at 2.849999 1.6 90) (size 1.6 0.5) (layers F.Cu F.Paste F.Mask)
      (net 7 GND))
    (model eec.models/Molex_-_513-87-0578.step
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder (layer B.Cu) (tedit 5F68FEEF)
    (at 71.755 60.3035 270)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C12 (at -1.5025 1.651 90) (layer B.SilkS))
    (fp_text value 4.7uF (at 0 -1.68 90) (layer B.Fab))
    (fp_text user %R (at 0 0 90) (layer B.Fab))
    (pad 2 smd roundrect (at 1.0375 0 270) (size 1.175 1.45) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.212766)
      (net 7 GND))
    (pad 1 smd roundrect (at -1.0375 0 270) (size 1.175 1.45) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.212766)
      (net 51 /USB_VBUS))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder (layer B.Cu) (tedit 5F68FEEF)
    (at 71.12 93.98 180)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C11 (at 0 -1.524) (layer B.SilkS))
    (fp_text value 0.1uF (at 0 -1.68) (layer B.Fab))
    (fp_text user %R (at 0 0) (layer B.Fab))
    (pad 2 smd roundrect (at 1.0375 0 180) (size 1.175 1.45) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.212766)
      (net 7 GND))
    (pad 1 smd roundrect (at -1.0375 0 180) (size 1.175 1.45) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.212766)
      (net 32 VCC))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder (layer B.Cu) (tedit 5F68FEEF)
    (at 71.12 91.44 180)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C10 (at 0 1.68) (layer B.SilkS))
    (fp_text value 4.7uF (at 0 -1.68) (layer B.Fab))
    (fp_text user %R (at 0 0) (layer B.Fab))
    (pad 2 smd roundrect (at 1.0375 0 180) (size 1.175 1.45) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.212766)
      (net 7 GND))
    (pad 1 smd roundrect (at -1.0375 0 180) (size 1.175 1.45) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.212766)
      (net 32 VCC))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder (layer B.Cu) (tedit 5F68FEEF)
    (at 76.2 98.0225 90)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C9 (at 2.7725 0 90) (layer B.SilkS))
    (fp_text value 0.1uF (at 0 -1.68 90) (layer B.Fab))
    (fp_text user %R (at 0 0 90) (layer B.Fab))
    (pad 2 smd roundrect (at 1.0375 0 90) (size 1.175 1.45) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.212766)
      (net 7 GND))
    (pad 1 smd roundrect (at -1.0375 0 90) (size 1.175 1.45) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.212766)
      (net 32 VCC))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder (layer B.Cu) (tedit 5F68FEEF)
    (at 64.77 97.79)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C8 (at -2.794 0) (layer B.SilkS))
    (fp_text value 0.1uF (at 0 -1.68) (layer B.Fab))
    (fp_text user %R (at 0 0) (layer B.Fab))
    (pad 2 smd roundrect (at 1.0375 0) (size 1.175 1.45) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.212766)
      (net 8 +3V3))
    (pad 1 smd roundrect (at -1.0375 0) (size 1.175 1.45) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.212766)
      (net 7 GND))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder (layer B.Cu) (tedit 5F68FEEF)
    (at 78.74 98.044 90)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C7 (at 2.794 0 90) (layer B.SilkS))
    (fp_text value 4.7uF (at 0 -1.68 90) (layer B.Fab))
    (fp_text user %R (at 0 0 90) (layer B.Fab))
    (pad 2 smd roundrect (at 1.0375 0 90) (size 1.175 1.45) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.212766)
      (net 7 GND))
    (pad 1 smd roundrect (at -1.0375 0 90) (size 1.175 1.45) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.212766)
      (net 32 VCC))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder (layer B.Cu) (tedit 5F68FEEF)
    (at 67.31 104.14 90)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C6 (at -2.794 0 90) (layer B.SilkS))
    (fp_text value 0.1uF (at 0 -1.68 90) (layer B.Fab))
    (fp_text user %R (at 0 0 90) (layer B.Fab))
    (pad 2 smd roundrect (at 1.0375 0 90) (size 1.175 1.45) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.212766)
      (net 33 +1V8))
    (pad 1 smd roundrect (at -1.0375 0 90) (size 1.175 1.45) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.212766)
      (net 7 GND))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder (layer B.Cu) (tedit 5F68FEEF)
    (at 69.85 104.14 90)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C5 (at -2.794 0 90) (layer B.SilkS))
    (fp_text value 4.7uF (at 0 -1.68 90) (layer B.Fab))
    (fp_text user %R (at 0 0 90) (layer B.Fab))
    (pad 2 smd roundrect (at 1.0375 0 90) (size 1.175 1.45) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.212766)
      (net 52 /VREF))
    (pad 1 smd roundrect (at -1.0375 0 90) (size 1.175 1.45) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.212766)
      (net 7 GND))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder (layer B.Cu) (tedit 5F68FEEF)
    (at 72.39 104.14 270)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C4 (at 2.794 0 90) (layer B.SilkS))
    (fp_text value 0.1uF (at 0 -1.68 90) (layer B.Fab))
    (fp_text user %R (at 0 0 90) (layer B.Fab))
    (pad 2 smd roundrect (at 1.0375 0 270) (size 1.175 1.45) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.212766)
      (net 7 GND))
    (pad 1 smd roundrect (at -1.0375 0 270) (size 1.175 1.45) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.212766)
      (net 32 VCC))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder (layer B.Cu) (tedit 5F68FEEF)
    (at 74.93 104.14 270)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C3 (at 2.794 0 90) (layer B.SilkS))
    (fp_text value 4.7uF (at 0 -1.68 90) (layer B.Fab))
    (fp_text user %R (at 0 0 90) (layer B.Fab))
    (pad 2 smd roundrect (at 1.0375 0 270) (size 1.175 1.45) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.212766)
      (net 7 GND))
    (pad 1 smd roundrect (at -1.0375 0 270) (size 1.175 1.45) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.212766)
      (net 32 VCC))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Package_SO:TSOP-5_1.65x3.05mm_P0.95mm (layer B.Cu) (tedit 5ADEEF59)
    (at 63.5 104.14 90)
    (descr "TSOP-5 package (comparable to TSOT-23), https://www.vishay.com/docs/71200/71200.pdf")
    (tags "Jedec MO-193C TSOP-5L")
    (attr smd)
    (fp_text reference U3 (at 0 -2.54 90) (layer B.SilkS))
    (fp_text value NCP115 (at 0 -2.5 90) (layer B.Fab))
    (fp_text user %R (at 0 0 180) (layer B.Fab))
    (pad 5 smd rect (at 1.16 0.95 90) (size 0.7 0.51) (layers B.Cu B.Paste B.Mask)
      (net 33 +1V8))
    (pad 4 smd rect (at 1.16 -0.95 90) (size 0.7 0.51) (layers B.Cu B.Paste B.Mask)
      (net 34 "Net-(U3-Pad4)"))
    (pad 3 smd rect (at -1.16 -0.95 90) (size 0.7 0.51) (layers B.Cu B.Paste B.Mask)
      (net 32 VCC))
    (pad 2 smd rect (at -1.16 0 90) (size 0.7 0.51) (layers B.Cu B.Paste B.Mask)
      (net 7 GND))
    (pad 1 smd rect (at -1.16 0.95 90) (size 0.7 0.51) (layers B.Cu B.Paste B.Mask)
      (net 32 VCC))
    (model ${KISYS3DMOD}/Package_SO.3dshapes/TSOP-5_1.65x3.05mm_P0.95mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder (layer B.Cu) (tedit 5F68FEEF)
    (at 64.008 100.838 180)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C2 (at 2.794 0) (layer B.SilkS))
    (fp_text value 1uF (at 0 -1.68) (layer B.Fab))
    (fp_text user %R (at 0 0) (layer B.Fab))
    (pad 2 smd roundrect (at 1.0375 0 180) (size 1.175 1.45) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.212766)
      (net 7 GND))
    (pad 1 smd roundrect (at -1.0375 0 180) (size 1.175 1.45) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.212766)
      (net 33 +1V8))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder (layer B.Cu) (tedit 5F68FEEF)
    (at 63.5 107.95 180)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C1 (at 2.794 0 180) (layer B.SilkS))
    (fp_text value 1uF (at 0 -1.68 180) (layer B.Fab))
    (fp_text user %R (at 0 0 180) (layer B.Fab))
    (pad 2 smd roundrect (at 1.0375 0 180) (size 1.175 1.45) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.212766)
      (net 7 GND))
    (pad 1 smd roundrect (at -1.0375 0 180) (size 1.175 1.45) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.212766)
      (net 32 VCC))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module JennToo_Custom:QFN-20-1EP_4x4mm_P0.5mm_EP2x2mm_ThermalVias (layer B.Cu) (tedit 61AFEC4E)
    (at 71.12 99.06 90)
    (descr "QFN, 20 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=274), generated with kicad-footprint-generator ipc_noLead_generator.py")
    (tags "QFN NoLead")
    (attr smd)
    (fp_text reference U4 (at 0 3.3 90) (layer B.SilkS))
    (fp_text value NAU8325YG (at 0 -3.3 90) (layer B.Fab))
    (fp_text user %R (at 0 0 90) (layer B.Fab))
    (pad 21 smd rect (at 0 0 90) (size 2 2) (layers F.Cu)
      (net 7 GND))
    (pad 21 thru_hole circle (at 0.75 -0.75 90) (size 0.5 0.5) (drill 0.2) (layers *.Cu)
      (net 7 GND))
    (pad 21 thru_hole circle (at -0.75 -0.75 90) (size 0.5 0.5) (drill 0.2) (layers *.Cu)
      (net 7 GND))
    (pad 21 thru_hole circle (at 0.75 0.75 90) (size 0.5 0.5) (drill 0.2) (layers *.Cu)
      (net 7 GND))
    (pad 21 thru_hole circle (at -0.75 0.75 90) (size 0.5 0.5) (drill 0.2) (layers *.Cu)
      (net 7 GND))
    (pad 21 smd rect (at 0 0 90) (size 2 2) (layers B.Cu B.Mask)
      (net 7 GND))
    (pad 20 smd roundrect (at -1 1.9375 90) (size 0.25 0.825) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 7 GND))
    (pad 19 smd roundrect (at -0.5 1.9375 90) (size 0.25 0.825) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 30 "Net-(LS1-Pad2)"))
    (pad 18 smd roundrect (at 0 1.9375 90) (size 0.25 0.825) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 32 VCC))
    (pad 17 smd roundrect (at 0.5 1.9375 90) (size 0.25 0.825) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 39 "Net-(TP1-Pad1)"))
    (pad 16 smd roundrect (at 1 1.9375 90) (size 0.25 0.825) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 7 GND))
    (pad 15 smd roundrect (at 1.9375 1 90) (size 0.825 0.25) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 40 "Net-(TP2-Pad1)"))
    (pad 14 smd roundrect (at 1.9375 0.5 90) (size 0.825 0.25) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 32 VCC))
    (pad 13 smd roundrect (at 1.9375 0 90) (size 0.825 0.25) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 7 GND))
    (pad 12 smd roundrect (at 1.9375 -0.5 90) (size 0.825 0.25) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 41 SDA))
    (pad 11 smd roundrect (at 1.9375 -1 90) (size 0.825 0.25) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 42 SCL))
    (pad 10 smd roundrect (at 1 -1.9375 90) (size 0.25 0.825) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 43 MCLK))
    (pad 9 smd roundrect (at 0.5 -1.9375 90) (size 0.25 0.825) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 8 +3V3))
    (pad 8 smd roundrect (at 0 -1.9375 90) (size 0.25 0.825) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 44 BCK))
    (pad 7 smd roundrect (at -0.5 -1.9375 90) (size 0.25 0.825) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 45 DACDAT))
    (pad 6 smd roundrect (at -1 -1.9375 90) (size 0.25 0.825) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 46 LRCK))
    (pad 5 smd roundrect (at -1.9375 -1 90) (size 0.825 0.25) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 33 +1V8))
    (pad 4 smd roundrect (at -1.9375 -0.5 90) (size 0.825 0.25) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 52 /VREF))
    (pad 3 smd roundrect (at -1.9375 0 90) (size 0.825 0.25) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 7 GND))
    (pad 2 smd roundrect (at -1.9375 0.5 90) (size 0.825 0.25) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 32 VCC))
    (pad 1 smd roundrect (at -1.9375 1 90) (size 0.825 0.25) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 31 "Net-(LS1-Pad1)"))
    (model ${KISYS3DMOD}/Package_DFN_QFN.3dshapes/QFN-20-1EP_4x4mm_P0.5mm_EP2.5x2.5mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Button_Switch_SMD:SW_SPST_TL3305A (layer F.Cu) (tedit 5ABC3A97)
    (at 41.91 99.06)
    (descr https://www.e-switch.com/system/asset/product_line/data_sheet/213/TL3305.pdf)
    (tags "TL3305 Series Tact Switch")
    (attr smd)
    (fp_text reference SW10 (at 0 -3.2) (layer F.SilkS))
    (fp_text value Btn_Start (at 0 3.2) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd rect (at -3.6 1.5) (size 1.6 1.4) (layers F.Cu F.Paste F.Mask)
      (net 26 STROBE2))
    (pad 2 smd rect (at 3.6 1.5) (size 1.6 1.4) (layers F.Cu F.Paste F.Mask)
      (net 26 STROBE2))
    (pad 1 smd rect (at -3.6 -1.5) (size 1.6 1.4) (layers F.Cu F.Paste F.Mask)
      (net 27 BUTTON5))
    (pad 1 smd rect (at 3.6 -1.5) (size 1.6 1.4) (layers F.Cu F.Paste F.Mask)
      (net 27 BUTTON5))
    (model ${KISYS3DMOD}/Button_Switch_SMD.3dshapes/SW_SPST_TL3305A.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Button_Switch_SMD:SW_SPST_TL3305A (layer F.Cu) (tedit 5ABC3A97)
    (at 59.69 99.06)
    (descr https://www.e-switch.com/system/asset/product_line/data_sheet/213/TL3305.pdf)
    (tags "TL3305 Series Tact Switch")
    (attr smd)
    (fp_text reference SW9 (at 0 -3.2) (layer F.SilkS))
    (fp_text value Btn_Select (at 0 3.2) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd rect (at -3.6 1.5) (size 1.6 1.4) (layers F.Cu F.Paste F.Mask)
      (net 22 STROBE1))
    (pad 2 smd rect (at 3.6 1.5) (size 1.6 1.4) (layers F.Cu F.Paste F.Mask)
      (net 22 STROBE1))
    (pad 1 smd rect (at -3.6 -1.5) (size 1.6 1.4) (layers F.Cu F.Paste F.Mask)
      (net 27 BUTTON5))
    (pad 1 smd rect (at 3.6 -1.5) (size 1.6 1.4) (layers F.Cu F.Paste F.Mask)
      (net 27 BUTTON5))
    (model ${KISYS3DMOD}/Button_Switch_SMD.3dshapes/SW_SPST_TL3305A.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Button_Switch_SMD:SW_SPST_TL3305A (layer F.Cu) (tedit 5ABC3A97)
    (at 40.64 74.93)
    (descr https://www.e-switch.com/system/asset/product_line/data_sheet/213/TL3305.pdf)
    (tags "TL3305 Series Tact Switch")
    (attr smd)
    (fp_text reference SW8 (at 0 -3.2) (layer F.SilkS))
    (fp_text value Btn_Right (at 0 3.2) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd rect (at -3.6 1.5) (size 1.6 1.4) (layers F.Cu F.Paste F.Mask)
      (net 26 STROBE2))
    (pad 2 smd rect (at 3.6 1.5) (size 1.6 1.4) (layers F.Cu F.Paste F.Mask)
      (net 26 STROBE2))
    (pad 1 smd rect (at -3.6 -1.5) (size 1.6 1.4) (layers F.Cu F.Paste F.Mask)
      (net 25 BUTTON4))
    (pad 1 smd rect (at 3.6 -1.5) (size 1.6 1.4) (layers F.Cu F.Paste F.Mask)
      (net 25 BUTTON4))
    (model ${KISYS3DMOD}/Button_Switch_SMD.3dshapes/SW_SPST_TL3305A.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Button_Switch_SMD:SW_SPST_TL3305A (layer F.Cu) (tedit 5ABC3A97)
    (at 22.86 74.93)
    (descr https://www.e-switch.com/system/asset/product_line/data_sheet/213/TL3305.pdf)
    (tags "TL3305 Series Tact Switch")
    (attr smd)
    (fp_text reference SW7 (at 0 -3.2) (layer F.SilkS))
    (fp_text value Btn_Left (at 0 3.2) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd rect (at -3.6 1.5) (size 1.6 1.4) (layers F.Cu F.Paste F.Mask)
      (net 26 STROBE2))
    (pad 2 smd rect (at 3.6 1.5) (size 1.6 1.4) (layers F.Cu F.Paste F.Mask)
      (net 26 STROBE2))
    (pad 1 smd rect (at -3.6 -1.5) (size 1.6 1.4) (layers F.Cu F.Paste F.Mask)
      (net 24 BUTTON3))
    (pad 1 smd rect (at 3.6 -1.5) (size 1.6 1.4) (layers F.Cu F.Paste F.Mask)
      (net 24 BUTTON3))
    (model ${KISYS3DMOD}/Button_Switch_SMD.3dshapes/SW_SPST_TL3305A.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Button_Switch_SMD:SW_SPST_TL3305A (layer F.Cu) (tedit 5ABC3A97)
    (at 31.75 83.82)
    (descr https://www.e-switch.com/system/asset/product_line/data_sheet/213/TL3305.pdf)
    (tags "TL3305 Series Tact Switch")
    (attr smd)
    (fp_text reference SW6 (at 0 -3.2) (layer F.SilkS))
    (fp_text value Btn_Down (at 0 3.2) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd rect (at -3.6 1.5) (size 1.6 1.4) (layers F.Cu F.Paste F.Mask)
      (net 26 STROBE2))
    (pad 2 smd rect (at 3.6 1.5) (size 1.6 1.4) (layers F.Cu F.Paste F.Mask)
      (net 26 STROBE2))
    (pad 1 smd rect (at -3.6 -1.5) (size 1.6 1.4) (layers F.Cu F.Paste F.Mask)
      (net 23 BUTTON2))
    (pad 1 smd rect (at 3.6 -1.5) (size 1.6 1.4) (layers F.Cu F.Paste F.Mask)
      (net 23 BUTTON2))
    (model ${KISYS3DMOD}/Button_Switch_SMD.3dshapes/SW_SPST_TL3305A.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Button_Switch_SMD:SW_SPST_TL3305A (layer F.Cu) (tedit 5ABC3A97)
    (at 31.75 66.04)
    (descr https://www.e-switch.com/system/asset/product_line/data_sheet/213/TL3305.pdf)
    (tags "TL3305 Series Tact Switch")
    (attr smd)
    (fp_text reference SW5 (at 0 -3.2) (layer F.SilkS))
    (fp_text value Btn_Up (at 0 3.2) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd rect (at -3.6 1.5) (size 1.6 1.4) (layers F.Cu F.Paste F.Mask)
      (net 26 STROBE2))
    (pad 2 smd rect (at 3.6 1.5) (size 1.6 1.4) (layers F.Cu F.Paste F.Mask)
      (net 26 STROBE2))
    (pad 1 smd rect (at -3.6 -1.5) (size 1.6 1.4) (layers F.Cu F.Paste F.Mask)
      (net 21 BUTTON1))
    (pad 1 smd rect (at 3.6 -1.5) (size 1.6 1.4) (layers F.Cu F.Paste F.Mask)
      (net 21 BUTTON1))
    (model ${KISYS3DMOD}/Button_Switch_SMD.3dshapes/SW_SPST_TL3305A.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Button_Switch_SMD:SW_SPST_TL3305A (layer F.Cu) (tedit 5ABC3A97)
    (at 69.85 83.82)
    (descr https://www.e-switch.com/system/asset/product_line/data_sheet/213/TL3305.pdf)
    (tags "TL3305 Series Tact Switch")
    (attr smd)
    (fp_text reference SW4 (at 0 -3.2) (layer F.SilkS))
    (fp_text value Btn_Y (at 0 3.2) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd rect (at -3.6 1.5) (size 1.6 1.4) (layers F.Cu F.Paste F.Mask)
      (net 22 STROBE1))
    (pad 2 smd rect (at 3.6 1.5) (size 1.6 1.4) (layers F.Cu F.Paste F.Mask)
      (net 22 STROBE1))
    (pad 1 smd rect (at -3.6 -1.5) (size 1.6 1.4) (layers F.Cu F.Paste F.Mask)
      (net 25 BUTTON4))
    (pad 1 smd rect (at 3.6 -1.5) (size 1.6 1.4) (layers F.Cu F.Paste F.Mask)
      (net 25 BUTTON4))
    (model ${KISYS3DMOD}/Button_Switch_SMD.3dshapes/SW_SPST_TL3305A.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Button_Switch_SMD:SW_SPST_TL3305A (layer F.Cu) (tedit 5ABC3A97)
    (at 60.96 74.93)
    (descr https://www.e-switch.com/system/asset/product_line/data_sheet/213/TL3305.pdf)
    (tags "TL3305 Series Tact Switch")
    (attr smd)
    (fp_text reference SW3 (at 0 -3.2) (layer F.SilkS))
    (fp_text value Btn_X (at 0 3.2) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd rect (at -3.6 1.5) (size 1.6 1.4) (layers F.Cu F.Paste F.Mask)
      (net 22 STROBE1))
    (pad 2 smd rect (at 3.6 1.5) (size 1.6 1.4) (layers F.Cu F.Paste F.Mask)
      (net 22 STROBE1))
    (pad 1 smd rect (at -3.6 -1.5) (size 1.6 1.4) (layers F.Cu F.Paste F.Mask)
      (net 24 BUTTON3))
    (pad 1 smd rect (at 3.6 -1.5) (size 1.6 1.4) (layers F.Cu F.Paste F.Mask)
      (net 24 BUTTON3))
    (model ${KISYS3DMOD}/Button_Switch_SMD.3dshapes/SW_SPST_TL3305A.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Button_Switch_SMD:SW_SPST_TL3305A (layer F.Cu) (tedit 5ABC3A97)
    (at 78.74 74.93)
    (descr https://www.e-switch.com/system/asset/product_line/data_sheet/213/TL3305.pdf)
    (tags "TL3305 Series Tact Switch")
    (attr smd)
    (fp_text reference SW2 (at 0 -3.2) (layer F.SilkS))
    (fp_text value Btn_B (at 0 3.2) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd rect (at -3.6 1.5) (size 1.6 1.4) (layers F.Cu F.Paste F.Mask)
      (net 22 STROBE1))
    (pad 2 smd rect (at 3.6 1.5) (size 1.6 1.4) (layers F.Cu F.Paste F.Mask)
      (net 22 STROBE1))
    (pad 1 smd rect (at -3.6 -1.5) (size 1.6 1.4) (layers F.Cu F.Paste F.Mask)
      (net 23 BUTTON2))
    (pad 1 smd rect (at 3.6 -1.5) (size 1.6 1.4) (layers F.Cu F.Paste F.Mask)
      (net 23 BUTTON2))
    (model ${KISYS3DMOD}/Button_Switch_SMD.3dshapes/SW_SPST_TL3305A.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Button_Switch_SMD:SW_SPST_TL3305A (layer F.Cu) (tedit 5ABC3A97)
    (at 69.85 66.04)
    (descr https://www.e-switch.com/system/asset/product_line/data_sheet/213/TL3305.pdf)
    (tags "TL3305 Series Tact Switch")
    (attr smd)
    (fp_text reference SW1 (at 0 -3.2) (layer F.SilkS))
    (fp_text value Btn_A (at 0 3.2) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd rect (at -3.6 1.5) (size 1.6 1.4) (layers F.Cu F.Paste F.Mask)
      (net 22 STROBE1))
    (pad 2 smd rect (at 3.6 1.5) (size 1.6 1.4) (layers F.Cu F.Paste F.Mask)
      (net 22 STROBE1))
    (pad 1 smd rect (at -3.6 -1.5) (size 1.6 1.4) (layers F.Cu F.Paste F.Mask)
      (net 21 BUTTON1))
    (pad 1 smd rect (at 3.6 -1.5) (size 1.6 1.4) (layers F.Cu F.Paste F.Mask)
      (net 21 BUTTON1))
    (model ${KISYS3DMOD}/Button_Switch_SMD.3dshapes/SW_SPST_TL3305A.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Connector_PinHeader_2.54mm:PinHeader_1x14_P2.54mm_Vertical (layer F.Cu) (tedit 59FED5CC)
    (at 34.29 48.26 90)
    (descr "Through hole straight pin header, 1x14, 2.54mm pitch, single row")
    (tags "Through hole pin header THT 1x14 2.54mm single row")
    (fp_text reference U2 (at 0 -2.33 90) (layer F.SilkS))
    (fp_text value HILETGO_3.5INCH_SPI_TFT (at -3.81 7.62 180) (layer F.Fab))
    (fp_text user %R (at 0 16.51) (layer F.Fab))
    (pad 14 thru_hole oval (at 0 33.02 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 16 TP_IRQ))
    (pad 13 thru_hole oval (at 0 30.48 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 18 TP_OUT))
    (pad 12 thru_hole oval (at 0 27.94 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 19 TP_DIN))
    (pad 11 thru_hole oval (at 0 25.4 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 17 TP_CS))
    (pad 10 thru_hole oval (at 0 22.86 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 20 TP_CLK))
    (pad 9 thru_hole oval (at 0 20.32 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 15 TFT_SDO))
    (pad 8 thru_hole oval (at 0 17.78 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 8 +3V3))
    (pad 7 thru_hole oval (at 0 15.24 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 11 TFT_SCK))
    (pad 6 thru_hole oval (at 0 12.7 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 12 TFT_SDI))
    (pad 5 thru_hole oval (at 0 10.16 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 14 TFT_DC))
    (pad 4 thru_hole oval (at 0 7.62 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 13 TFT_RESET))
    (pad 3 thru_hole oval (at 0 5.08 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 10 TFT_CS))
    (pad 2 thru_hole oval (at 0 2.54 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 7 GND))
    (pad 1 thru_hole rect (at 0 0 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 32 VCC))
    (model ${KISYS3DMOD}/Connector_PinHeader_2.54mm.3dshapes/PinHeader_1x14_P2.54mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Connector_PinHeader_1.27mm:PinHeader_2x05_P1.27mm_Vertical_SMD (layer F.Cu) (tedit 59FED6E3)
    (at 25.908 54.864 180)
    (descr "surface-mounted straight pin header, 2x05, 1.27mm pitch, double rows")
    (tags "Surface mounted pin header SMD 2x05 1.27mm double row")
    (attr smd)
    (fp_text reference J1 (at 0 -4.235) (layer F.SilkS))
    (fp_text value Conn_ARM_JTAG_SWD_10 (at 0 4.235) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 10 smd rect (at 1.95 2.54 180) (size 2.4 0.74) (layers F.Cu F.Paste F.Mask)
      (net 9 RESET))
    (pad 9 smd rect (at -1.95 2.54 180) (size 2.4 0.74) (layers F.Cu F.Paste F.Mask)
      (net 7 GND))
    (pad 8 smd rect (at 1.95 1.27 180) (size 2.4 0.74) (layers F.Cu F.Paste F.Mask)
      (net 4 "Net-(J1-Pad8)"))
    (pad 7 smd rect (at -1.95 1.27 180) (size 2.4 0.74) (layers F.Cu F.Paste F.Mask)
      (net 5 "Net-(J1-Pad7)"))
    (pad 6 smd rect (at 1.95 0 180) (size 2.4 0.74) (layers F.Cu F.Paste F.Mask)
      (net 6 "Net-(J1-Pad6)"))
    (pad 5 smd rect (at -1.95 0 180) (size 2.4 0.74) (layers F.Cu F.Paste F.Mask)
      (net 7 GND))
    (pad 4 smd rect (at 1.95 -1.27 180) (size 2.4 0.74) (layers F.Cu F.Paste F.Mask)
      (net 28 SWCLK))
    (pad 3 smd rect (at -1.95 -1.27 180) (size 2.4 0.74) (layers F.Cu F.Paste F.Mask)
      (net 7 GND))
    (pad 2 smd rect (at 1.95 -2.54 180) (size 2.4 0.74) (layers F.Cu F.Paste F.Mask)
      (net 29 SWDIO))
    (pad 1 smd rect (at -1.95 -2.54 180) (size 2.4 0.74) (layers F.Cu F.Paste F.Mask)
      (net 8 +3V3))
    (model ${KISYS3DMOD}/Connector_PinHeader_1.27mm.3dshapes/PinHeader_2x05_P1.27mm_Vertical_SMD.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (gr_text "By Jennifer Wilcox" (at 69.596 94.488) (layer F.SilkS))
  (gr_text "Revision 1" (at 65.659 103.251) (layer F.SilkS))
  (gr_text "Notendo Game Girl" (at 62.484 92.837) (layer F.SilkS))
  (gr_arc (start 21.59 106.045) (end 17.145 106.045) (angle -90) (layer Edge.Cuts) (width 0.0254))
  (gr_arc (start 80.01 106.045) (end 80.01 110.49) (angle -90) (layer Edge.Cuts) (width 0.0254))
  (gr_line (start 17.145 45.72) (end 17.145 106.045) (layer Edge.Cuts) (width 0.0254))
  (gr_line (start 84.455 45.72) (end 84.455 106.045) (layer Edge.Cuts) (width 0.0254))
  (gr_line (start 80.01 110.49) (end 21.59 110.49) (layer Edge.Cuts) (width 0.0254))
  (gr_line (start 17.145 45.72) (end 84.455 45.72) (layer Edge.Cuts) (width 0.0254))
  (zone (net 7) (net_name GND) (layer F.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.508))
    (min_thickness 0.254)
    (fill yes (arc_segments 32) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 83.82 106.045) (xy 82.55 108.585) (xy 81.28 109.855) (xy 20.955 109.855) (xy 17.78 106.68)
        (xy 17.78 46.355) (xy 83.82 46.355)
      )
    )
  )
  (zone (net 7) (net_name GND) (layer B.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.508))
    (min_thickness 0.254)
    (fill yes (arc_segments 32) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 83.82 106.045) (xy 82.55 108.585) (xy 81.28 109.855) (xy 20.955 109.855) (xy 17.78 106.68)
        (xy 17.78 46.355) (xy 83.82 46.355)
      )
    )
  )
)
