(kicad_pcb (version 20171130) (host pcbnew "(5.1.4)-1")
  (general
    (thickness 1.6)
    (drawings 27)
    (tracks 755)
    (zones 0)
    (modules 13)
    (nets 46)
  )
  (page A4)
  (layers
    (0 F.Cu signal)
    (31 B.Cu signal)
    (32 B.Adhes user)
    (33 F.Adhes user)
    (34 B.Paste user)
    (35 F.Paste user)
    (36 B.SilkS user)
    (37 F.SilkS user)
    (38 B.Mask user)
    (39 F.Mask user)
    (40 Dwgs.User user)
    (41 Cmts.User user)
    (42 Eco1.User user)
    (43 Eco2.User user)
    (44 Edge.Cuts user)
    (45 Margin user)
    (46 B.CrtYd user hide)
    (47 F.CrtYd user hide)
    (48 B.Fab user hide)
    (49 F.Fab user hide)
  )
  (setup
    (last_trace_width 0.25)
    (user_trace_width 0.2)
    (user_trace_width 0.5)
    (user_trace_width 1)
    (trace_clearance 0.2)
    (zone_clearance 0.3)
    (zone_45_only no)
    (trace_min 0.2)
    (via_size 0.8)
    (via_drill 0.4)
    (via_min_size 0.4)
    (via_min_drill 0.3)
    (uvia_size 0.3)
    (uvia_drill 0.1)
    (uvias_allowed no)
    (uvia_min_size 0.2)
    (uvia_min_drill 0.1)
    (edge_width 0.05)
    (segment_width 0.2)
    (pcb_text_width 0.3)
    (pcb_text_size 1.5 1.5)
    (mod_edge_width 0.12)
    (mod_text_size 1 1)
    (mod_text_width 0.15)
    (pad_size 1.524 1.524)
    (pad_drill 0.762)
    (pad_to_mask_clearance 0.051)
    (solder_mask_min_width 0.25)
    (aux_axis_origin 0 0)
    (visible_elements 7FFFFFFF)
    (pcbplotparams
      (layerselection 0x010fc_ffffffff)
      (usegerberextensions false)
      (usegerberattributes false)
      (usegerberadvancedattributes false)
      (creategerberjobfile false)
      (excludeedgelayer true)
      (linewidth 0.100000)
      (plotframeref false)
      (viasonmask false)
      (mode 1)
      (useauxorigin false)
      (hpglpennumber 1)
      (hpglpenspeed 20)
      (hpglpendiameter 15.000000)
      (psnegative false)
      (psa4output false)
      (plotreference true)
      (plotvalue true)
      (plotinvisibletext false)
      (padsonsilk false)
      (subtractmaskfromsilk false)
      (outputformat 1)
      (mirror false)
      (drillshape 0)
      (scaleselection 1)
      (outputdirectory "gerbers/"))
  )
  (net 0 "")
  (net 1 "Net-(J1-Pad40)")
  (net 2 XWE)
  (net 3 "XRAS(1)")
  (net 4 "XRAS(0)")
  (net 5 XCASU)
  (net 6 XCASL)
  (net 7 XOE)
  (net 8 "Net-(J1-Pad33)")
  (net 9 EN)
  (net 10 /8)
  (net 11 /7)
  (net 12 /6)
  (net 13 /5)
  (net 14 /4)
  (net 15 /3)
  (net 16 /2)
  (net 17 /1)
  (net 18 /0)
  (net 19 GND)
  (net 20 /15)
  (net 21 /14)
  (net 22 /13)
  (net 23 /12)
  (net 24 /11)
  (net 25 /10)
  (net 26 /9)
  (net 27 +5V)
  (net 28 "Net-(U1-Pad11)")
  (net 29 "Net-(U1-Pad12)")
  (net 30 "Net-(U1-Pad15)")
  (net 31 "Net-(U1-Pad30)")
  (net 32 "Net-(U2-Pad11)")
  (net 33 "Net-(U2-Pad12)")
  (net 34 "Net-(U2-Pad15)")
  (net 35 "Net-(U2-Pad30)")
  (net 36 /D8)
  (net 37 /D7)
  (net 38 /D6)
  (net 39 /D5)
  (net 40 /D4)
  (net 41 /D3)
  (net 42 /D2)
  (net 43 /D1)
  (net 44 /D0)
  (net 45 "Net-(R1-Pad2)")
  (net_class Default "This is the default net class."
    (clearance 0.2)
    (trace_width 0.25)
    (via_dia 0.8)
    (via_drill 0.4)
    (uvia_dia 0.3)
    (uvia_drill 0.1)
    (add_net +5V)
    (add_net /0)
    (add_net /1)
    (add_net /10)
    (add_net /11)
    (add_net /12)
    (add_net /13)
    (add_net /14)
    (add_net /15)
    (add_net /2)
    (add_net /3)
    (add_net /4)
    (add_net /5)
    (add_net /6)
    (add_net /7)
    (add_net /8)
    (add_net /9)
    (add_net /D0)
    (add_net /D1)
    (add_net /D2)
    (add_net /D3)
    (add_net /D4)
    (add_net /D5)
    (add_net /D6)
    (add_net /D7)
    (add_net /D8)
    (add_net EN)
    (add_net GND)
    (add_net "Net-(J1-Pad33)")
    (add_net "Net-(J1-Pad40)")
    (add_net "Net-(R1-Pad2)")
    (add_net "Net-(U1-Pad11)")
    (add_net "Net-(U1-Pad12)")
    (add_net "Net-(U1-Pad15)")
    (add_net "Net-(U1-Pad30)")
    (add_net "Net-(U2-Pad11)")
    (add_net "Net-(U2-Pad12)")
    (add_net "Net-(U2-Pad15)")
    (add_net "Net-(U2-Pad30)")
    (add_net XCASL)
    (add_net XCASU)
    (add_net XOE)
    (add_net "XRAS(0)")
    (add_net "XRAS(1)")
    (add_net XWE)
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5B36C52B)
    (at 103.3 36.95 90)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R1 (at 0 -1.65 90) (layer F.Fab) hide)
    (fp_text value 10K (at 0 1.65 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0 90) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 45 "Net-(R1-Pad2)"))
    (pad 1 smd roundrect (at -1.025 0 90) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 27 +5V))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Button_Switch_THT:SW_CuK_JS202011AQN_DPDT_Angled (layer F.Cu) (tedit 5A02FE31)
    (at 98.5 37.75 180)
    (descr "CuK sub miniature slide switch, JS series, DPDT, right angle, http://www.ckswitches.com/media/1422/js.pdf")
    (tags "switch DPDT")
    (fp_text reference SW1 (at 2.45 -2) (layer F.Fab) hide)
    (fp_text value <ENABLE (at 2.45 -1.85) (layer F.SilkS))
    (fp_text user %R (at 2.5 1.75) (layer F.Fab))
    (pad 6 thru_hole circle (at 5 3.3 180) (size 1.4 1.4) (drill 0.9) (layers *.Cu *.Mask)
      (net 19 GND))
    (pad 5 thru_hole circle (at 2.5 3.3 180) (size 1.4 1.4) (drill 0.9) (layers *.Cu *.Mask)
      (net 9 EN))
    (pad 4 thru_hole circle (at 0 3.3 180) (size 1.4 1.4) (drill 0.9) (layers *.Cu *.Mask)
      (net 45 "Net-(R1-Pad2)"))
    (pad 3 thru_hole circle (at 5 0 180) (size 1.4 1.4) (drill 0.9) (layers *.Cu *.Mask)
      (net 19 GND))
    (pad 2 thru_hole circle (at 2.5 0 180) (size 1.4 1.4) (drill 0.9) (layers *.Cu *.Mask)
      (net 9 EN))
    (pad 1 thru_hole rect (at 0 0 180) (size 1.4 1.4) (drill 0.9) (layers *.Cu *.Mask)
      (net 45 "Net-(R1-Pad2)"))
    (model ${KISYS3DMOD}/Button_Switch_THT.3dshapes/SW_CuK_JS202011AQN_DPDT_Angled.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Connector_PinHeader_2.54mm:PinHeader_2x20_P2.54mm_Horizontal (layer F.Cu) (tedit 5DF8F6A2)
    (at 80.75 83.25 180)
    (descr "Through hole angled pin header, 2x20, 2.54mm pitch, 6mm pin length, double rows")
    (tags "Through hole angled pin header THT 2x20 2.54mm double row")
    (fp_text reference J1 (at 5.655 -2.27 180) (layer F.Fab) hide)
    (fp_text value "A500 MEM EXP" (at 5.655 50.53 180) (layer F.Fab))
    (fp_text user %R (at 5.31 24.13 270) (layer F.Fab))
    (pad 1 thru_hole rect (at 0 0 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 27 +5V))
    (pad 2 thru_hole oval (at 2.54 0 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 27 +5V))
    (pad 3 thru_hole oval (at 0 2.54 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 19 GND))
    (pad 4 thru_hole oval (at 2.54 2.54 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 19 GND))
    (pad 5 thru_hole oval (at 0 5.08 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 18 /0))
    (pad 6 thru_hole oval (at 2.54 5.08 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 17 /1))
    (pad 7 thru_hole oval (at 0 7.62 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 16 /2))
    (pad 8 thru_hole oval (at 2.54 7.62 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 15 /3))
    (pad 9 thru_hole oval (at 0 10.16 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 14 /4))
    (pad 10 thru_hole oval (at 2.54 10.16 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 13 /5))
    (pad 11 thru_hole oval (at 0 12.7 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 12 /6))
    (pad 12 thru_hole oval (at 2.54 12.7 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 11 /7))
    (pad 13 thru_hole oval (at 0 15.24 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 10 /8))
    (pad 14 thru_hole oval (at 2.54 15.24 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 26 /9))
    (pad 15 thru_hole oval (at 0 17.78 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 25 /10))
    (pad 16 thru_hole oval (at 2.54 17.78 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 24 /11))
    (pad 17 thru_hole oval (at 0 20.32 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 23 /12))
    (pad 18 thru_hole oval (at 2.54 20.32 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 22 /13))
    (pad 19 thru_hole oval (at 0 22.86 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 21 /14))
    (pad 20 thru_hole oval (at 2.54 22.86 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 20 /15))
    (pad 21 thru_hole oval (at 0 25.4 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 19 GND))
    (pad 22 thru_hole oval (at 2.54 25.4 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 19 GND))
    (pad 23 thru_hole oval (at 0 27.94 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 44 /D0))
    (pad 24 thru_hole oval (at 2.54 27.94 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 43 /D1))
    (pad 25 thru_hole oval (at 0 30.48 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 42 /D2))
    (pad 26 thru_hole oval (at 2.54 30.48 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 41 /D3))
    (pad 27 thru_hole oval (at 0 33.02 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 40 /D4))
    (pad 28 thru_hole oval (at 2.54 33.02 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 39 /D5))
    (pad 29 thru_hole oval (at 0 35.56 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 38 /D6))
    (pad 30 thru_hole oval (at 2.54 35.56 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 37 /D7))
    (pad 31 thru_hole oval (at 0 38.1 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 36 /D8))
    (pad 32 thru_hole oval (at 2.54 38.1 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 9 EN))
    (pad 33 thru_hole oval (at 0 40.64 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 8 "Net-(J1-Pad33)"))
    (pad 34 thru_hole oval (at 2.54 40.64 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 7 XOE))
    (pad 35 thru_hole oval (at 0 43.18 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 6 XCASL))
    (pad 36 thru_hole oval (at 2.54 43.18 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 5 XCASU))
    (pad 37 thru_hole oval (at 0 45.72 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 4 "XRAS(0)"))
    (pad 38 thru_hole oval (at 2.54 45.72 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 3 "XRAS(1)"))
    (pad 39 thru_hole oval (at 0 48.26 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 2 XWE))
    (pad 40 thru_hole oval (at 2.54 48.26 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 1 "Net-(J1-Pad40)"))
    (model ${KISYS3DMOD}/Connector_PinSocket_2.54mm.3dshapes/PinSocket_2x20_P2.54mm_Horizontal.wrl
      (offset (xyz 0 -48.25 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 180))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5B36C52B)
    (at 84 82.225 90)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C7 (at 0 -1.65 90) (layer F.Fab) hide)
    (fp_text value 10uF (at 0 1.65 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 1 smd roundrect (at -1.025 0 90) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 27 +5V))
    (pad 2 smd roundrect (at 1.025 0 90) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 19 GND))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Symbol:OSHW-Logo_5.7x6mm_Copper (layer F.Cu) (tedit 5DF8F3AE)
    (at 105.25 80.5)
    (descr "Open Source Hardware Logo")
    (tags "Logo OSHW")
    (attr virtual)
    (fp_text reference REF** (at 0 0) (layer F.SilkS) hide)
    (fp_text value OSHW-Logo_5.7x6mm_Copper (at 0.75 0) (layer F.Fab) hide)
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 87.85 60.6 180)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C6 (at 0 -1.43 180) (layer F.Fab) hide)
    (fp_text value 100nF (at 0 1.43 180) (layer F.Fab))
    (fp_text user %R (at 0 0 180) (layer F.Fab))
    (pad 2 smd roundrect (at 0.875 0 180) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 19 GND))
    (pad 1 smd roundrect (at -0.875 0 180) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 27 +5V))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 106.3 40.55)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C5 (at 0 -1.43) (layer F.Fab) hide)
    (fp_text value 100nF (at 0 1.43) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd roundrect (at 0.875 0) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 19 GND))
    (pad 1 smd roundrect (at -0.875 0) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 27 +5V))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 102.375 40.55)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C4 (at 0 -1.43) (layer F.Fab) hide)
    (fp_text value 100nF (at 0 1.43) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 1 smd roundrect (at -0.875 0) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 27 +5V))
    (pad 2 smd roundrect (at 0.875 0) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 19 GND))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 87.9 40.6 180)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C3 (at -0.273811 -1.43) (layer F.Fab) hide)
    (fp_text value 100nF (at 0 1.43) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd roundrect (at 0.875 0 180) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 19 GND))
    (pad 1 smd roundrect (at -0.875 0 180) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 27 +5V))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 106.3 60.55)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C2 (at 0 -1.43) (layer F.Fab) hide)
    (fp_text value 100nF (at 0 1.43) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd roundrect (at 0.875 0) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 19 GND))
    (pad 1 smd roundrect (at -0.875 0) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 27 +5V))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 102.3 60.55)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C1 (at 0 -1.43) (layer F.Fab) hide)
    (fp_text value 100nF (at 0 1.43) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd roundrect (at 0.875 0) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 19 GND))
    (pad 1 smd roundrect (at -0.875 0) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 27 +5V))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module a500plus-chipram-expansion:TSOP-II-40 (layer F.Cu) (tedit 5DE01282)
    (at 97 48.5 270)
    (descr "TSOP-II, 44 Pin (http://www.issi.com/WW/pdf/61-64C5128AL.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py")
    (tags "TSOP-II SO")
    (attr smd)
    (fp_text reference U2 (at 0 -10.16 270) (layer F.Fab) hide)
    (fp_text value "XRAS(1) 512KB" (at 0 10.16 270) (layer F.SilkS))
    (fp_text user %R (at 0 0 270) (layer F.Fab))
    (pad 40 smd roundrect (at 5.5875 -8.4 270) (size 1.525 0.55) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 19 GND))
    (pad 39 smd roundrect (at 5.5875 -7.6 270) (size 1.525 0.55) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 20 /15))
    (pad 38 smd roundrect (at 5.5875 -6.8 270) (size 1.525 0.55) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 21 /14))
    (pad 37 smd roundrect (at 5.5875 -6 270) (size 1.525 0.55) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 22 /13))
    (pad 36 smd roundrect (at 5.5875 -5.2 270) (size 1.525 0.55) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 23 /12))
    (pad 35 smd roundrect (at 5.5875 -4.4 270) (size 1.525 0.55) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 19 GND))
    (pad 34 smd roundrect (at 5.5875 -3.6 270) (size 1.525 0.55) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 24 /11))
    (pad 33 smd roundrect (at 5.5875 -2.8 270) (size 1.525 0.55) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 25 /10))
    (pad 32 smd roundrect (at 5.5875 -2 270) (size 1.525 0.55) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 26 /9))
    (pad 31 smd roundrect (at 5.5875 -1.2 270) (size 1.525 0.55) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 10 /8))
    (pad 30 smd roundrect (at 5.5875 1.2 270) (size 1.525 0.55) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 35 "Net-(U2-Pad30)"))
    (pad 29 smd roundrect (at 5.5875 2 270) (size 1.525 0.55) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 6 XCASL))
    (pad 28 smd roundrect (at 5.5875 2.8 270) (size 1.525 0.55) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 5 XCASU))
    (pad 27 smd roundrect (at 5.5875 3.6 270) (size 1.525 0.55) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 7 XOE))
    (pad 26 smd roundrect (at 5.5875 4.4 270) (size 1.525 0.55) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 36 /D8))
    (pad 25 smd roundrect (at 5.5875 5.2 270) (size 1.525 0.55) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 37 /D7))
    (pad 24 smd roundrect (at 5.5875 6 270) (size 1.525 0.55) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 38 /D6))
    (pad 23 smd roundrect (at 5.5875 6.8 270) (size 1.525 0.55) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 39 /D5))
    (pad 22 smd roundrect (at 5.5875 7.6 270) (size 1.525 0.55) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 40 /D4))
    (pad 21 smd roundrect (at 5.5875 8.4 270) (size 1.525 0.55) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 19 GND))
    (pad 20 smd roundrect (at -5.5875 8.4 270) (size 1.525 0.55) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 27 +5V))
    (pad 19 smd roundrect (at -5.5875 7.6 270) (size 1.525 0.55) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 41 /D3))
    (pad 18 smd roundrect (at -5.5875 6.8 270) (size 1.525 0.55) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 42 /D2))
    (pad 17 smd roundrect (at -5.5875 6 270) (size 1.525 0.55) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 43 /D1))
    (pad 16 smd roundrect (at -5.5875 5.2 270) (size 1.525 0.55) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 44 /D0))
    (pad 15 smd roundrect (at -5.5875 4.4 270) (size 1.525 0.55) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 34 "Net-(U2-Pad15)"))
    (pad 14 smd roundrect (at -5.5875 3.6 270) (size 1.525 0.55) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 3 "XRAS(1)"))
    (pad 13 smd roundrect (at -5.5875 2.8 270) (size 1.525 0.55) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 2 XWE))
    (pad 12 smd roundrect (at -5.5875 2 270) (size 1.525 0.55) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 33 "Net-(U2-Pad12)"))
    (pad 11 smd roundrect (at -5.5875 1.2 270) (size 1.525 0.55) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 32 "Net-(U2-Pad11)"))
    (pad 10 smd roundrect (at -5.5875 -1.2 270) (size 1.525 0.55) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 11 /7))
    (pad 9 smd roundrect (at -5.5875 -2 270) (size 1.525 0.55) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 12 /6))
    (pad 8 smd roundrect (at -5.5875 -2.8 270) (size 1.525 0.55) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 13 /5))
    (pad 7 smd roundrect (at -5.5875 -3.6 270) (size 1.525 0.55) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 14 /4))
    (pad 6 smd roundrect (at -5.5875 -4.4 270) (size 1.525 0.55) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 27 +5V))
    (pad 5 smd roundrect (at -5.5875 -5.2 270) (size 1.525 0.55) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 15 /3))
    (pad 4 smd roundrect (at -5.5875 -6 270) (size 1.525 0.55) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 16 /2))
    (pad 3 smd roundrect (at -5.5875 -6.8 270) (size 1.525 0.55) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 17 /1))
    (pad 2 smd roundrect (at -5.5875 -7.6 270) (size 1.525 0.55) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 18 /0))
    (pad 1 smd roundrect (at -5.5875 -8.4 270) (size 1.525 0.55) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 27 +5V))
    (model ${KISYS3DMOD}/Package_SO.3dshapes/TSOP-II-44_10.16x18.41mm_P0.8mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module a500plus-chipram-expansion:TSOP-II-40 (layer F.Cu) (tedit 5DE01282)
    (at 97 68.5 270)
    (descr "TSOP-II, 44 Pin (http://www.issi.com/WW/pdf/61-64C5128AL.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py")
    (tags "TSOP-II SO")
    (attr smd)
    (fp_text reference U1 (at 0 -10.16 90) (layer F.Fab) hide)
    (fp_text value "XRAS(0) 512KB" (at 0 10.16 90) (layer F.SilkS))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 40 smd roundrect (at 5.5875 -8.4 270) (size 1.525 0.55) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 19 GND))
    (pad 39 smd roundrect (at 5.5875 -7.6 270) (size 1.525 0.55) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 20 /15))
    (pad 38 smd roundrect (at 5.5875 -6.8 270) (size 1.525 0.55) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 21 /14))
    (pad 37 smd roundrect (at 5.5875 -6 270) (size 1.525 0.55) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 22 /13))
    (pad 36 smd roundrect (at 5.5875 -5.2 270) (size 1.525 0.55) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 23 /12))
    (pad 35 smd roundrect (at 5.5875 -4.4 270) (size 1.525 0.55) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 19 GND))
    (pad 34 smd roundrect (at 5.5875 -3.6 270) (size 1.525 0.55) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 24 /11))
    (pad 33 smd roundrect (at 5.5875 -2.8 270) (size 1.525 0.55) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 25 /10))
    (pad 32 smd roundrect (at 5.5875 -2 270) (size 1.525 0.55) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 26 /9))
    (pad 31 smd roundrect (at 5.5875 -1.2 270) (size 1.525 0.55) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 10 /8))
    (pad 30 smd roundrect (at 5.5875 1.2 270) (size 1.525 0.55) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 31 "Net-(U1-Pad30)"))
    (pad 29 smd roundrect (at 5.5875 2 270) (size 1.525 0.55) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 6 XCASL))
    (pad 28 smd roundrect (at 5.5875 2.8 270) (size 1.525 0.55) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 5 XCASU))
    (pad 27 smd roundrect (at 5.5875 3.6 270) (size 1.525 0.55) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 7 XOE))
    (pad 26 smd roundrect (at 5.5875 4.4 270) (size 1.525 0.55) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 36 /D8))
    (pad 25 smd roundrect (at 5.5875 5.2 270) (size 1.525 0.55) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 37 /D7))
    (pad 24 smd roundrect (at 5.5875 6 270) (size 1.525 0.55) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 38 /D6))
    (pad 23 smd roundrect (at 5.5875 6.8 270) (size 1.525 0.55) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 39 /D5))
    (pad 22 smd roundrect (at 5.5875 7.6 270) (size 1.525 0.55) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 40 /D4))
    (pad 21 smd roundrect (at 5.5875 8.4 270) (size 1.525 0.55) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 19 GND))
    (pad 20 smd roundrect (at -5.5875 8.4 270) (size 1.525 0.55) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 27 +5V))
    (pad 19 smd roundrect (at -5.5875 7.6 270) (size 1.525 0.55) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 41 /D3))
    (pad 18 smd roundrect (at -5.5875 6.8 270) (size 1.525 0.55) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 42 /D2))
    (pad 17 smd roundrect (at -5.5875 6 270) (size 1.525 0.55) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 43 /D1))
    (pad 16 smd roundrect (at -5.5875 5.2 270) (size 1.525 0.55) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 44 /D0))
    (pad 15 smd roundrect (at -5.5875 4.4 270) (size 1.525 0.55) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 30 "Net-(U1-Pad15)"))
    (pad 14 smd roundrect (at -5.5875 3.6 270) (size 1.525 0.55) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 4 "XRAS(0)"))
    (pad 13 smd roundrect (at -5.5875 2.8 270) (size 1.525 0.55) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 2 XWE))
    (pad 12 smd roundrect (at -5.5875 2 270) (size 1.525 0.55) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 29 "Net-(U1-Pad12)"))
    (pad 11 smd roundrect (at -5.5875 1.2 270) (size 1.525 0.55) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 28 "Net-(U1-Pad11)"))
    (pad 10 smd roundrect (at -5.5875 -1.2 270) (size 1.525 0.55) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 11 /7))
    (pad 9 smd roundrect (at -5.5875 -2 270) (size 1.525 0.55) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 12 /6))
    (pad 8 smd roundrect (at -5.5875 -2.8 270) (size 1.525 0.55) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 13 /5))
    (pad 7 smd roundrect (at -5.5875 -3.6 270) (size 1.525 0.55) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 14 /4))
    (pad 6 smd roundrect (at -5.5875 -4.4 270) (size 1.525 0.55) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 27 +5V))
    (pad 5 smd roundrect (at -5.5875 -5.2 270) (size 1.525 0.55) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 15 /3))
    (pad 4 smd roundrect (at -5.5875 -6 270) (size 1.525 0.55) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 16 /2))
    (pad 3 smd roundrect (at -5.5875 -6.8 270) (size 1.525 0.55) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 17 /1))
    (pad 2 smd roundrect (at -5.5875 -7.6 270) (size 1.525 0.55) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 18 /0))
    (pad 1 smd roundrect (at -5.5875 -8.4 270) (size 1.525 0.55) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 27 +5V))
    (model ${KISYS3DMOD}/Package_SO.3dshapes/TSOP-II-44_10.16x18.41mm_P0.8mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (gr_text 1 (at 82.75 84) (layer F.SilkS))
  (gr_text "THIS SIDE DOWN" (at 74.5 59.2 90) (layer B.SilkS))
  (gr_text https://github.com/blark/a500plus-chipram-expansion (at 71.5 59 90) (layer B.SilkS))
  (gr_text "2x20 2.54mm CONNECTOR THIS SIDE" (at 72 49.6 90) (layer F.SilkS))
  (dimension 51.75 (width 0.12) (layer F.SilkS)
    (gr_text "51.750 mm" (at 59.73 59.125 270) (layer F.SilkS))
    (feature1 (pts (xy 63.75 85) (xy 60.413579 85)))
    (feature2 (pts (xy 63.75 33.25) (xy 60.413579 33.25)))
    (crossbar (pts (xy 61 33.25) (xy 61 85)))
    (arrow1a (pts (xy 61 85) (xy 60.413579 83.873496)))
    (arrow1b (pts (xy 61 85) (xy 61.586421 83.873496)))
    (arrow2a (pts (xy 61 33.25) (xy 60.413579 34.376504)))
    (arrow2b (pts (xy 61 33.25) (xy 61.586421 34.376504)))
  )
  (dimension 41.25 (width 0.12) (layer F.SilkS)
    (gr_text "41.250 mm" (at 89.375 23.98) (layer F.SilkS))
    (feature1 (pts (xy 110 27) (xy 110 24.663579)))
    (feature2 (pts (xy 68.75 27) (xy 68.75 24.663579)))
    (crossbar (pts (xy 68.75 25.25) (xy 110 25.25)))
    (arrow1a (pts (xy 110 25.25) (xy 108.873496 25.836421)))
    (arrow1b (pts (xy 110 25.25) (xy 108.873496 24.663579)))
    (arrow2a (pts (xy 68.75 25.25) (xy 69.876504 25.836421)))
    (arrow2b (pts (xy 68.75 25.25) (xy 69.876504 24.663579)))
  )
  (gr_text "Archer v2.0\n@markbaseggio" (at 72 70.8 90) (layer F.SilkS))
  (gr_text "MB Chip RAM\nExpansion" (at 90 79.5) (layer F.SilkS))
  (gr_line (start 107 85) (end 68.75 85) (layer Edge.Cuts) (width 0.05))
  (gr_line (start 110 36.25) (end 110 82) (layer Edge.Cuts) (width 0.05))
  (gr_line (start 107 33.25) (end 68.75 33.25) (layer Edge.Cuts) (width 0.05))
  (gr_arc (start 107 36.25) (end 110 36.25) (angle -90) (layer Edge.Cuts) (width 0.05))
  (gr_arc (start 107 82) (end 107 85) (angle -90) (layer Edge.Cuts) (width 0.05))
  (gr_line (start 68.75 85) (end 68.75 33.25) (layer Edge.Cuts) (width 0.05))
  (zone (net 19) (net_name GND) (layer B.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.3))
    (min_thickness 0.254)
    (fill yes (arc_segments 32) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 66 31) (xy 113 31) (xy 113 88) (xy 66 88)
      )
    )
  )
)
