(kicad_pcb (version 4) (host pcbnew 4.0.7-e2-6376~58~ubuntu16.04.1)
  (general
    (links 41)
    (no_connects 1)
    (area 120.924999 85.924999 139.075001 115.075001)
    (thickness 1.6)
    (drawings 6)
    (tracks 427)
    (zones 0)
    (modules 11)
    (nets 9)
  )
  (page A4)
  (layers
    (0 F.Cu signal)
    (1 In1.Cu signal hide)
    (2 In2.Cu signal hide)
    (31 B.Cu signal hide)
    (33 F.Adhes user)
    (35 F.Paste user)
    (37 F.SilkS user)
    (39 F.Mask user)
    (40 Dwgs.User user)
    (41 Cmts.User user)
    (42 Eco1.User user)
    (43 Eco2.User user)
    (44 Edge.Cuts user)
    (45 Margin user)
    (47 F.CrtYd user)
    (49 F.Fab user hide)
  )
  (setup
    (last_trace_width 0.4)
    (user_trace_width 0.2)
    (user_trace_width 0.25)
    (user_trace_width 0.4)
    (user_trace_width 0.5)
    (user_trace_width 0.7)
    (user_trace_width 1)
    (user_trace_width 1.5)
    (trace_clearance 0.2)
    (zone_clearance 0.5)
    (zone_45_only no)
    (trace_min 0.2)
    (segment_width 0.2)
    (edge_width 0.15)
    (via_size 0.7)
    (via_drill 0.35)
    (via_min_size 0.4)
    (via_min_drill 0.3)
    (user_via 0.85 0.5)
    (user_via 2 1.5)
    (uvia_size 0.3)
    (uvia_drill 0.1)
    (uvias_allowed no)
    (uvia_min_size 0.2)
    (uvia_min_drill 0.1)
    (pcb_text_width 0.3)
    (pcb_text_size 1.5 1.5)
    (mod_edge_width 0.15)
    (mod_text_size 1 1)
    (mod_text_width 0.15)
    (pad_size 1.524 1.524)
    (pad_drill 0.762)
    (pad_to_mask_clearance 0.2)
    (aux_axis_origin 0 0)
    (visible_elements FFFEFF7F)
    (pcbplotparams
      (layerselection 0x00030_80000001)
      (usegerberextensions false)
      (excludeedgelayer true)
      (linewidth 0.100000)
      (plotframeref false)
      (viasonmask false)
      (mode 1)
      (useauxorigin false)
      (hpglpennumber 1)
      (hpglpenspeed 20)
      (hpglpendiameter 15)
      (hpglpenoverlay 2)
      (psnegative false)
      (psa4output false)
      (plotreference true)
      (plotvalue true)
      (plotinvisibletext false)
      (padsonsilk false)
      (subtractmaskfromsilk false)
      (outputformat 1)
      (mirror false)
      (drillshape 1)
      (scaleselection 1)
      (outputdirectory ""))
  )
  (net 0 "")
  (net 1 "Net-(C1-Pad1)")
  (net 2 GND)
  (net 3 "Net-(C4-Pad1)")
  (net 4 "Net-(C5-Pad1)")
  (net 5 "Net-(C6-Pad2)")
  (net 6 "Net-(C6-Pad1)")
  (net 7 "Net-(U2-Pad5)")
  (net 8 "Net-(C3-Pad2)")
  (net_class Default "This is the default net class."
    (clearance 0.2)
    (trace_width 0.25)
    (via_dia 0.7)
    (via_drill 0.35)
    (uvia_dia 0.3)
    (uvia_drill 0.1)
    (add_net GND)
    (add_net "Net-(C1-Pad1)")
    (add_net "Net-(C3-Pad2)")
    (add_net "Net-(C4-Pad1)")
    (add_net "Net-(C5-Pad1)")
    (add_net "Net-(C6-Pad1)")
    (add_net "Net-(C6-Pad2)")
    (add_net "Net-(U2-Pad5)")
  )
  (module Capacitors_SMD:CP_Elec_5x5.7 (layer F.Cu) (tedit 5BAA78C8)
    (at 130.94 106.12)
    (descr "SMT capacitor, aluminium electrolytic, 5x5.7")
    (attr smd)
    (fp_text reference C1 (at 5.5 0) (layer F.SilkS))
    (fp_text value CP1_Small (at 0 -3.92) (layer F.Fab))
    (fp_text user + (at -1.4 -0.06) (layer F.Fab))
    (fp_text user + (at -3.38 2.36) (layer F.SilkS))
    (fp_text user %R (at 0 3.92) (layer F.Fab))
    (pad 1 smd rect (at -2.2 0 180) (size 3 1.6) (layers F.Cu F.Paste F.Mask)
      (net 1 "Net-(C1-Pad1)"))
    (pad 2 smd rect (at 2.2 0 180) (size 3 1.6) (layers F.Cu F.Paste F.Mask)
      (net 2 GND))
    (model Capacitors_SMD.3dshapes/CP_Elec_5x5.7.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 180))
    )
  )
  (module Capacitors_SMD:C_1206 (layer F.Cu) (tedit 5BA94E3E)
    (at 125.2 102.9 90)
    (descr "Capacitor SMD 1206, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 1206")
    (attr smd)
    (fp_text reference C2 (at 0 -2.2 180) (layer F.SilkS))
    (fp_text value C_Small (at 0 2 90) (layer F.Fab))
    (fp_text user %R (at 0 -1.75 90) (layer F.Fab))
    (pad 1 smd rect (at -1.5 0 90) (size 1 1.6) (layers F.Cu F.Paste F.Mask)
      (net 1 "Net-(C1-Pad1)"))
    (pad 2 smd rect (at 1.5 0 90) (size 1 1.6) (layers F.Cu F.Paste F.Mask)
      (net 2 GND))
    (model Capacitors_SMD.3dshapes/C_1206.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Pin_Headers:Pin_Header_Angled_1x03_Pitch2.54mm (layer F.Cu) (tedit 5BAD1DE0)
    (at 132.44 111.98 270)
    (descr "Through hole angled pin header, 1x03, 2.54mm pitch, 6mm pin length, single row")
    (tags "Through hole angled pin header THT 1x03 2.54mm single row")
    (fp_text reference J1 (at 1.29 -3.07 360) (layer F.SilkS))
    (fp_text value Conn_01x03 (at 4.385 7.35 270) (layer F.Fab))
    (fp_text user %R (at 2.77 2.54 360) (layer F.Fab))
    (pad 1 thru_hole rect (at 0 0 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 2 GND))
    (pad 2 thru_hole oval (at 0 2.54 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 1 "Net-(C1-Pad1)"))
    (pad 3 thru_hole oval (at 0 5.08 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 5 "Net-(C6-Pad2)"))
    (model ${KISYS3DMOD}/Pin_Headers.3dshapes/Pin_Header_Angled_1x03_Pitch2.54mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_SMD:C_0805 (layer F.Cu) (tedit 5BABA153)
    (at 123.6 89.4 270)
    (descr "Capacitor SMD 0805, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0805")
    (attr smd)
    (fp_text reference C3 (at 2.63 -0.01 360) (layer F.SilkS))
    (fp_text value C_Small (at 0 1.75 270) (layer F.Fab))
    (fp_text user %R (at 0 -1.5 270) (layer F.Fab))
    (pad 1 smd rect (at -1 0 270) (size 1 1.25) (layers F.Cu F.Paste F.Mask)
      (net 1 "Net-(C1-Pad1)"))
    (pad 2 smd rect (at 1 0 270) (size 1 1.25) (layers F.Cu F.Paste F.Mask)
      (net 8 "Net-(C3-Pad2)"))
    (model Capacitors_SMD.3dshapes/C_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_SMD:C_1206 (layer F.Cu) (tedit 5BABA162)
    (at 133.74 89.93 270)
    (descr "Capacitor SMD 1206, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 1206")
    (attr smd)
    (fp_text reference C4 (at -2.95 0.11 360) (layer F.SilkS))
    (fp_text value C_Small (at 0 2 270) (layer F.Fab))
    (fp_text user %R (at -3.4 -2.7 360) (layer F.Fab))
    (pad 1 smd rect (at -1.5 0 270) (size 1 1.6) (layers F.Cu F.Paste F.Mask)
      (net 3 "Net-(C4-Pad1)"))
    (pad 2 smd rect (at 1.5 0 270) (size 1 1.6) (layers F.Cu F.Paste F.Mask)
      (net 8 "Net-(C3-Pad2)"))
    (model Capacitors_SMD.3dshapes/C_1206.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_SMD:C_1206 (layer F.Cu) (tedit 5BA94E51)
    (at 129.8 93.4 180)
    (descr "Capacitor SMD 1206, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 1206")
    (attr smd)
    (fp_text reference C5 (at 3.4 -0.1 180) (layer F.SilkS))
    (fp_text value C_Small (at 0 2 180) (layer F.Fab))
    (fp_text user %R (at 0 -1.75 180) (layer F.Fab))
    (pad 1 smd rect (at -1.5 0 180) (size 1 1.6) (layers F.Cu F.Paste F.Mask)
      (net 4 "Net-(C5-Pad1)"))
    (pad 2 smd rect (at 1.5 0 180) (size 1 1.6) (layers F.Cu F.Paste F.Mask)
      (net 8 "Net-(C3-Pad2)"))
    (model Capacitors_SMD.3dshapes/C_1206.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module MyFootprints:C_1206_split (layer F.Cu) (tedit 5BA94D90)
    (at 125.1 97.1 270)
    (descr "Capacitor SMD 1206, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 1206")
    (attr smd)
    (fp_text reference C6 (at -0.1 2.2 360) (layer F.SilkS))
    (fp_text value c_small_split (at 0 2 270) (layer F.Fab))
    (fp_text user %R (at 0 -1.75 270) (layer F.Fab))
    (pad 3 smd rect (at 1.6 0.47 270) (size 1.2 0.65) (layers F.Cu F.Paste F.Mask)
      (net 8 "Net-(C3-Pad2)"))
    (pad 2 smd rect (at -1.6 0.47 270) (size 1.2 0.65) (layers F.Cu F.Paste F.Mask)
      (net 5 "Net-(C6-Pad2)"))
    (pad 1 smd rect (at -1.6 -0.48 270) (size 1.2 0.65) (layers F.Cu F.Paste F.Mask)
      (net 6 "Net-(C6-Pad1)"))
    (pad 4 smd rect (at 1.6 -0.48 270) (size 1.2 0.65) (layers F.Cu F.Paste F.Mask)
      (net 2 GND))
    (model Capacitors_SMD.3dshapes/C_1206.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistors_SMD:R_0805 (layer F.Cu) (tedit 5BABA150)
    (at 136.5 89.1 90)
    (descr "Resistor SMD 0805, reflow soldering, Vishay (see dcrcw.pdf)")
    (tags "resistor 0805")
    (attr smd)
    (fp_text reference R1 (at 2.18 -0.01 180) (layer F.SilkS))
    (fp_text value R_Small (at 0 1.75 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 1 smd rect (at -0.95 0 90) (size 0.7 1.3) (layers F.Cu F.Paste F.Mask)
      (net 4 "Net-(C5-Pad1)"))
    (pad 2 smd rect (at 0.95 0 90) (size 0.7 1.3) (layers F.Cu F.Paste F.Mask)
      (net 3 "Net-(C4-Pad1)"))
    (model ${KISYS3DMOD}/Resistors_SMD.3dshapes/R_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistors_SMD:R_0805 (layer F.Cu) (tedit 5BABA14C)
    (at 136.5 92.6 270)
    (descr "Resistor SMD 0805, reflow soldering, Vishay (see dcrcw.pdf)")
    (tags "resistor 0805")
    (attr smd)
    (fp_text reference R2 (at 2.7 -0.04 360) (layer F.SilkS))
    (fp_text value R_Small (at 0 1.75 270) (layer F.Fab))
    (fp_text user %R (at 0 0 270) (layer F.Fab))
    (pad 1 smd rect (at -0.95 0 270) (size 0.7 1.3) (layers F.Cu F.Paste F.Mask)
      (net 8 "Net-(C3-Pad2)"))
    (pad 2 smd rect (at 0.95 0 270) (size 0.7 1.3) (layers F.Cu F.Paste F.Mask)
      (net 4 "Net-(C5-Pad1)"))
    (model ${KISYS3DMOD}/Resistors_SMD.3dshapes/R_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Housings_SSOP:MSOP-8_3x3mm_Pitch0.65mm (layer F.Cu) (tedit 54130A77)
    (at 128.6 89.4)
    (descr "8-Lead Plastic Micro Small Outline Package (MS) [MSOP] (see Microchip Packaging Specification 00000049BS.pdf)")
    (tags "SSOP 0.65")
    (attr smd)
    (fp_text reference U1 (at 0 -2.6) (layer F.SilkS))
    (fp_text value LTC6655 (at 0 2.6) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 1 smd rect (at -2.2 -0.975) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 1 "Net-(C1-Pad1)"))
    (pad 2 smd rect (at -2.2 -0.325) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 1 "Net-(C1-Pad1)"))
    (pad 3 smd rect (at -2.2 0.325) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 8 "Net-(C3-Pad2)"))
    (pad 4 smd rect (at -2.2 0.975) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 8 "Net-(C3-Pad2)"))
    (pad 5 smd rect (at 2.2 0.975) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 8 "Net-(C3-Pad2)"))
    (pad 6 smd rect (at 2.2 0.325) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 3 "Net-(C4-Pad1)"))
    (pad 7 smd rect (at 2.2 -0.325) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 3 "Net-(C4-Pad1)"))
    (pad 8 smd rect (at 2.2 -0.975) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 8 "Net-(C3-Pad2)"))
    (model ${KISYS3DMOD}/Housings_SSOP.3dshapes/MSOP-8_3x3mm_Pitch0.65mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Housings_SSOP:MSOP-12-1EP_3x4mm_Pitch0.65mm (layer F.Cu) (tedit 5BAD1DEB)
    (at 130.4 98.7 90)
    (descr "MSE Package; 12-Lead Plastic MSOP, Exposed Die Pad; (see Linear Technology 05081666_G_MSE12.pdf)")
    (tags "SSOP 0.65")
    (attr smd)
    (fp_text reference U2 (at -3.63 -2.26 180) (layer F.SilkS))
    (fp_text value LT3045EMSE (at 0 3.05 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 1 smd rect (at -2.105 -1.625 90) (size 0.89 0.42) (layers F.Cu F.Paste F.Mask)
      (net 1 "Net-(C1-Pad1)"))
    (pad 2 smd rect (at -2.105 -0.975 90) (size 0.89 0.42) (layers F.Cu F.Paste F.Mask)
      (net 1 "Net-(C1-Pad1)"))
    (pad 3 smd rect (at -2.105 -0.325 90) (size 0.89 0.42) (layers F.Cu F.Paste F.Mask)
      (net 1 "Net-(C1-Pad1)"))
    (pad 4 smd rect (at -2.105 0.325 90) (size 0.89 0.42) (layers F.Cu F.Paste F.Mask)
      (net 1 "Net-(C1-Pad1)"))
    (pad 5 smd rect (at -2.105 0.975 90) (size 0.89 0.42) (layers F.Cu F.Paste F.Mask)
      (net 7 "Net-(U2-Pad5)"))
    (pad 6 smd rect (at -2.105 1.625 90) (size 0.89 0.42) (layers F.Cu F.Paste F.Mask)
      (net 2 GND))
    (pad 7 smd rect (at 2.105 1.625 90) (size 0.89 0.42) (layers F.Cu F.Paste F.Mask)
      (net 1 "Net-(C1-Pad1)"))
    (pad 8 smd rect (at 2.105 0.975 90) (size 0.89 0.42) (layers F.Cu F.Paste F.Mask)
      (net 4 "Net-(C5-Pad1)"))
    (pad 9 smd rect (at 2.105 0.325 90) (size 0.89 0.42) (layers F.Cu F.Paste F.Mask)
      (net 2 GND))
    (pad 10 smd rect (at 2.105 -0.325 90) (size 0.89 0.42) (layers F.Cu F.Paste F.Mask)
      (net 6 "Net-(C6-Pad1)"))
    (pad 11 smd rect (at 2.105 -0.975 90) (size 0.89 0.42) (layers F.Cu F.Paste F.Mask)
      (net 5 "Net-(C6-Pad2)"))
    (pad 12 smd rect (at 2.105 -1.625 90) (size 0.89 0.42) (layers F.Cu F.Paste F.Mask)
      (net 5 "Net-(C6-Pad2)"))
    (pad 13 smd rect (at 0.4125 1.06875 90) (size 0.825 0.7125) (layers F.Cu F.Paste F.Mask)
      (net 2 GND) (solder_paste_margin_ratio -0.2))
    (pad 13 smd rect (at 0.4125 0.35625 90) (size 0.825 0.7125) (layers F.Cu F.Paste F.Mask)
      (net 2 GND) (solder_paste_margin_ratio -0.2))
    (pad 13 smd rect (at 0.4125 -0.35625 90) (size 0.825 0.7125) (layers F.Cu F.Paste F.Mask)
      (net 2 GND) (solder_paste_margin_ratio -0.2))
    (pad 13 smd rect (at 0.4125 -1.06875 90) (size 0.825 0.7125) (layers F.Cu F.Paste F.Mask)
      (net 2 GND) (solder_paste_margin_ratio -0.2))
    (pad 13 smd rect (at -0.4125 1.06875 90) (size 0.825 0.7125) (layers F.Cu F.Paste F.Mask)
      (net 2 GND) (solder_paste_margin_ratio -0.2))
    (pad 13 smd rect (at -0.4125 0.35625 90) (size 0.825 0.7125) (layers F.Cu F.Paste F.Mask)
      (net 2 GND) (solder_paste_margin_ratio -0.2))
    (pad 13 smd rect (at -0.4125 -0.35625 90) (size 0.825 0.7125) (layers F.Cu F.Paste F.Mask)
      (net 2 GND) (solder_paste_margin_ratio -0.2))
    (pad 13 smd rect (at -0.4125 -1.06875 90) (size 0.825 0.7125) (layers F.Cu F.Paste F.Mask)
      (net 2 GND) (solder_paste_margin_ratio -0.2))
    (model ${KISYS3DMOD}/Housings_SSOP.3dshapes/MSOP-12-1EP_3x4mm_Pitch0.65mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (gr_line (start 121 115) (end 139 115) (angle 90) (layer Edge.Cuts) (width 0.15))
  (gr_line (start 139 115) (end 139 111) (angle 90) (layer Edge.Cuts) (width 0.15))
  (gr_line (start 121 115) (end 121 111) (angle 90) (layer Edge.Cuts) (width 0.15))
  (gr_line (start 139 86) (end 121 86) (angle 90) (layer Edge.Cuts) (width 0.15))
  (gr_line (start 139 111) (end 139 86) (angle 90) (layer Edge.Cuts) (width 0.15))
  (gr_line (start 121 86) (end 121 111) (angle 90) (layer Edge.Cuts) (width 0.15))
  (zone (net 2) (net_name GND) (layer In1.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.5))
    (min_thickness 0.35)
    (fill yes (arc_segments 16) (thermal_gap 0.4) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 138.6 114.6) (xy 121.4 114.6) (xy 121.4 86.4) (xy 138.6 86.4)
      )
    )
  )
  (zone (net 2) (net_name GND) (layer B.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.5))
    (min_thickness 0.35)
    (fill yes (arc_segments 16) (thermal_gap 0.4) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 138.6 114.6) (xy 121.4 114.6) (xy 121.4 86.4) (xy 138.6 86.4)
      )
    )
  )
  (zone (net 8) (net_name "Net-(C3-Pad2)") (layer F.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.5))
    (min_thickness 0.35)
    (fill yes (arc_segments 16) (thermal_gap 0.4) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 125.5 87.7) (xy 137.4 87.7) (xy 137.4 92.3) (xy 129.8 92.3) (xy 129.8 94.7)
        (xy 124 94.7) (xy 124 97.7) (xy 122.7 97.7) (xy 122.7 87.7)
      )
    )
  )
  (zone (net 2) (net_name GND) (layer F.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.5))
    (min_thickness 0.35)
    (fill yes (arc_segments 16) (thermal_gap 0.4) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 138.5 114.5) (xy 121.5 114.5) (xy 121.5 86.5) (xy 138.5 86.5)
      )
    )
  )
)
