(kicad_pcb (version 20171130) (host pcbnew "(5.1.8-0-10_14)")
  (general
    (thickness 1.6)
    (drawings 16)
    (tracks 182)
    (zones 0)
    (modules 37)
    (nets 27)
  )
  (page USLedger)
  (title_block
    (date 2019-12-29)
  )
  (layers
    (0 F.Cu signal)
    (31 B.Cu signal)
    (32 B.Adhes user hide)
    (33 F.Adhes user hide)
    (34 B.Paste user hide)
    (35 F.Paste user hide)
    (36 B.SilkS user hide)
    (37 F.SilkS user)
    (38 B.Mask user hide)
    (39 F.Mask user hide)
    (40 Dwgs.User user hide)
    (41 Cmts.User user hide)
    (42 Eco1.User user hide)
    (43 Eco2.User user hide)
    (44 Edge.Cuts user)
    (45 Margin user hide)
    (46 B.CrtYd user hide)
    (47 F.CrtYd user)
    (48 B.Fab user hide)
    (49 F.Fab user hide)
  )
  (setup
    (last_trace_width 0.2032)
    (trace_clearance 0.1778)
    (zone_clearance 0.381)
    (zone_45_only no)
    (trace_min 0.1778)
    (via_size 0.6604)
    (via_drill 0.4064)
    (via_min_size 0.4064)
    (via_min_drill 0.3556)
    (uvia_size 0.3)
    (uvia_drill 0.1)
    (uvias_allowed no)
    (uvia_min_size 0.2)
    (uvia_min_drill 0.1)
    (edge_width 0.05)
    (segment_width 0.2)
    (pcb_text_width 0.3)
    (pcb_text_size 1.5 1.5)
    (mod_edge_width 0.12)
    (mod_text_size 0.5 0.5)
    (mod_text_width 0.07)
    (pad_size 5.842 5.842)
    (pad_drill 3.200001)
    (pad_to_mask_clearance 0.0254)
    (solder_mask_min_width 0.0254)
    (aux_axis_origin 0 0)
    (visible_elements FEFDBF7F)
    (pcbplotparams
      (layerselection 0x010fc_ffffffff)
      (usegerberextensions false)
      (usegerberattributes false)
      (usegerberadvancedattributes false)
      (creategerberjobfile false)
      (excludeedgelayer true)
      (linewidth 0.100000)
      (plotframeref false)
      (viasonmask false)
      (mode 1)
      (useauxorigin false)
      (hpglpennumber 1)
      (hpglpenspeed 20)
      (hpglpendiameter 15.000000)
      (psnegative false)
      (psa4output false)
      (plotreference true)
      (plotvalue true)
      (plotinvisibletext false)
      (padsonsilk false)
      (subtractmaskfromsilk false)
      (outputformat 4)
      (mirror false)
      (drillshape 0)
      (scaleselection 1)
      (outputdirectory ""))
  )
  (net 0 "")
  (net 1 GND)
  (net 2 "Net-(CPCC1-Pad2)")
  (net 3 "Net-(CPCC1-Pad1)")
  (net 4 /PV3)
  (net 5 "Net-(CPFIL1-Pad1)")
  (net 6 GNDREF)
  (net 7 /VPORTP)
  (net 8 /VPORTN)
  (net 9 /PVCC)
  (net 10 /RUN)
  (net 11 /PLUS)
  (net 12 /NGATE)
  (net 13 /RCLASS)
  (net 14 /SENSE)
  (net 15 /SEN)
  (net 16 "Net-(PA1133-coil1-Pad4)")
  (net 17 "Net-(PA1133-coil1-Pad2)")
  (net 18 "Net-(PA1133-coil1-Pad1)")
  (net 19 "Net-(PS2911-Pad1)")
  (net 20 "Net-(D_PBAS1-Pad1)")
  (net 21 "Net-(D_PDS1040-Pad2)")
  (net 22 "Net-(U_LTC4267-Pad11)")
  (net 23 "Net-(U_LTC4267-Pad6)")
  (net 24 +3V0)
  (net 25 "Net-(J_3MON1-Pad1)")
  (net 26 "Net-(L_PLED1-Pad1)")
  (net_class Default "This is the default net class."
    (clearance 0.1778)
    (trace_width 0.2032)
    (via_dia 0.6604)
    (via_drill 0.4064)
    (uvia_dia 0.3)
    (uvia_drill 0.1)
    (diff_pair_width 0.2032)
    (diff_pair_gap 0.25)
    (add_net +3V0)
    (add_net /NGATE)
    (add_net /PLUS)
    (add_net /PV3)
    (add_net /PVCC)
    (add_net /RCLASS)
    (add_net /RUN)
    (add_net /SEN)
    (add_net /SENSE)
    (add_net /VPORTN)
    (add_net /VPORTP)
    (add_net GND)
    (add_net GNDREF)
    (add_net "Net-(CPCC1-Pad1)")
    (add_net "Net-(CPCC1-Pad2)")
    (add_net "Net-(CPFIL1-Pad1)")
    (add_net "Net-(D_PBAS1-Pad1)")
    (add_net "Net-(D_PDS1040-Pad2)")
    (add_net "Net-(J_3MON1-Pad1)")
    (add_net "Net-(L_PLED1-Pad1)")
    (add_net "Net-(PA1133-coil1-Pad1)")
    (add_net "Net-(PA1133-coil1-Pad2)")
    (add_net "Net-(PA1133-coil1-Pad4)")
    (add_net "Net-(PS2911-Pad1)")
    (add_net "Net-(U_LTC4267-Pad11)")
    (add_net "Net-(U_LTC4267-Pad6)")
  )
  (module MiniPoeCard:D_Powermite2_AK (layer F.Cu) (tedit 60559BFE)
    (at 45.12564 3.66268 180)
    (descr "Microsemi Powermite 2 SMD power package (https://www.microsemi.com/packaging-information/partpackage/details?pid=5341)")
    (tags PowerMite2)
    (attr smd)
    (fp_text reference D_PDS1040 (at -0.08636 -3.05054) (layer F.SilkS))
    (fp_text value PDS1040-13 (at -0.2286 2.9464) (layer F.Fab) hide)
    (fp_text user %R (at -0.3 -1) (layer F.Fab))
    (pad 1 thru_hole circle (at -3.12928 -0.7112 180) (size 0.8 0.8) (drill 0.4) (layers *.Cu *.Mask)
      (net 4 /PV3))
    (pad 1 thru_hole circle (at -1.75006 -0.70104 180) (size 0.8 0.8) (drill 0.4) (layers *.Cu *.Mask)
      (net 4 /PV3))
    (pad 1 thru_hole circle (at -0.2794 -0.74168 180) (size 0.8 0.8) (drill 0.4) (layers *.Cu *.Mask)
      (net 4 /PV3))
    (pad 1 thru_hole circle (at -3.13944 0.75184 180) (size 0.8 0.8) (drill 0.4) (layers *.Cu *.Mask)
      (net 4 /PV3))
    (pad 1 thru_hole circle (at 1.11506 -0.7493 180) (size 0.8 0.8) (drill 0.4) (layers *.Cu *.Mask)
      (net 4 /PV3))
    (pad 1 thru_hole circle (at -1.75006 0.77724 180) (size 0.8 0.8) (drill 0.4) (layers *.Cu *.Mask)
      (net 4 /PV3))
    (pad 1 thru_hole circle (at -0.2794 0.76962 180) (size 0.8 0.8) (drill 0.4) (layers *.Cu *.Mask)
      (net 4 /PV3))
    (pad 1 thru_hole circle (at 1.14554 0.75438 180) (size 0.8 0.8) (drill 0.4) (layers *.Cu *.Mask)
      (net 4 /PV3))
    (pad 1 smd rect (at -0.7 0 180) (size 9 6.6) (layers B.Cu B.Paste B.Mask)
      (net 4 /PV3))
    (pad 1 smd rect (at -0.94996 0.00762 180) (size 5.3 5) (layers F.Cu F.Paste F.Mask)
      (net 4 /PV3))
    (pad 2 smd rect (at 3.1 0 180) (size 0.762 2.8) (layers F.Cu F.Paste F.Mask)
      (net 21 "Net-(D_PDS1040-Pad2)"))
    (model ${KISYS3DMOD}/Diode_SMD.3dshapes/D_Powermite2_AK.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module MiniPoeCard:TSSOP-16_4.4x5mm_P0.65mm_special (layer F.Cu) (tedit 5FA86E94)
    (at 14.28242 19.09318 180)
    (descr "TSSOP, 16 Pin (JEDEC MO-153 Var AB https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator ipc_gullwing_generator.py")
    (tags "TSSOP SO")
    (attr smd)
    (fp_text reference U_LTC4267 (at -0.0762 -3.2766) (layer F.SilkS))
    (fp_text value LTC4267IGN-1#PBF (at 0 3.1242) (layer F.Fab) hide)
    (fp_text user %R (at -0.0254 0.2286) (layer F.Fab) hide)
    (pad 1 smd roundrect (at -2.8625 -2.2225 180) (size 1.475 0.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 6 GNDREF))
    (pad 2 smd roundrect (at -2.8625 -1.5875 180) (size 1.475 0.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 10 /RUN))
    (pad 3 smd roundrect (at -2.8625 -0.9525 180) (size 1.475 0.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 12 /NGATE))
    (pad 4 smd roundrect (at -2.8625 -0.3175 180) (size 1.475 0.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 9 /PVCC))
    (pad 5 smd roundrect (at -2.8625 0.3175 180) (size 1.475 0.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 13 /RCLASS))
    (pad 6 smd roundrect (at -2.8625 0.9525 180) (size 1.475 0.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 23 "Net-(U_LTC4267-Pad6)"))
    (pad 7 smd roundrect (at -2.8625 1.5875 180) (size 1.475 0.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 8 /VPORTN))
    (pad 8 smd roundrect (at -2.8625 2.2225 180) (size 1.475 0.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 6 GNDREF))
    (pad 9 smd roundrect (at 2.8625 2.2225 180) (size 1.475 0.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 6 GNDREF))
    (pad 10 smd roundrect (at 2.8625 1.5875 180) (size 1.475 0.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 6 GNDREF))
    (pad 11 smd roundrect (at 2.8625 0.9525 180) (size 1.475 0.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 22 "Net-(U_LTC4267-Pad11)"))
    (pad 12 smd roundrect (at 2.8625 0.3175 180) (size 1.475 0.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 8 /VPORTN))
    (pad 13 smd roundrect (at 2.8625 -0.3175 180) (size 1.475 0.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 7 /VPORTP))
    (pad 14 smd roundrect (at 2.8625 -0.9525 180) (size 1.475 0.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 14 /SENSE))
    (pad 15 smd roundrect (at 2.8625 -1.5875 180) (size 1.475 0.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 6 GNDREF))
    (pad 16 smd roundrect (at 2.8625 -2.2225 180) (size 1.475 0.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 6 GNDREF))
    (model ${KISYS3DMOD}/Package_SO.3dshapes/TSSOP-16_4.4x5mm_P0.65mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module MiniPoeCard:BAS_SOD_HandSoldering (layer F.Cu) (tedit 5FD5307D)
    (at 16.39824 24.13762 180)
    (descr BAS_SOD)
    (tags BAS_SOD)
    (attr smd)
    (fp_text reference D_PBAS1 (at 0.03556 -1.42494) (layer F.SilkS))
    (fp_text value BASX16.135 (at 0.0762 1.25476) (layer F.Fab) hide)
    (fp_text user %R (at 2.37998 0.1651 90) (layer F.Fab) hide)
    (pad 1 smd rect (at -1.05 0 180) (size 1.4 1) (layers F.Cu F.Paste F.Mask)
      (net 20 "Net-(D_PBAS1-Pad1)"))
    (pad 2 smd rect (at 1.05 0 180) (size 1.4 1) (layers F.Cu F.Paste F.Mask)
      (net 10 /RUN))
    (model ${KISYS3DMOD}/Diode_SMD.3dshapes/D_SOD-323.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module MiniPoeCard:PS2911 (layer F.Cu) (tedit 5E24117A)
    (at 29.5021 24.40178 90)
    (fp_text reference PS2911 (at -1.75006 0.04572) (layer F.SilkS))
    (fp_text value PS2911-1-F3-AX (at 0.6096 3.6068 90) (layer F.Fab) hide)
    (pad 2 smd rect (at 0.54 2.35 90) (size 0.8 1) (layers F.Cu F.Paste F.Mask)
      (net 3 "Net-(CPCC1-Pad1)"))
    (pad 1 smd rect (at -0.64 2.35 90) (size 0.8 1) (layers F.Cu F.Paste F.Mask)
      (net 19 "Net-(PS2911-Pad1)"))
    (pad 3 smd rect (at 0.64 -2.35 90) (size 0.8 1) (layers F.Cu F.Paste F.Mask)
      (net 6 GNDREF))
    (pad 4 smd rect (at -0.64 -2.35 90) (size 0.8 1) (layers F.Cu F.Paste F.Mask)
      (net 20 "Net-(D_PBAS1-Pad1)"))
  )
  (module MiniPoeCard:PA1133 (layer F.Cu) (tedit 5FA5E2DD)
    (at 30.86608 8.38708)
    (fp_text reference PA1133-coil1 (at 5.43052 0.41148 -270) (layer F.SilkS))
    (fp_text value PA1133NLT (at -5.5118 -1.905 -270) (layer F.Fab))
    (pad 5 smd rect (at -3.75 -6.6) (size 1.27 2.54) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 6 smd rect (at -1.25 -6.6) (size 1.27 2.54) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 7 smd rect (at 1.25 -6.6) (size 1.27 2.54) (layers F.Cu F.Paste F.Mask)
      (net 21 "Net-(D_PDS1040-Pad2)"))
    (pad 8 smd rect (at 3.75 -6.6) (size 1.27 2.54) (layers F.Cu F.Paste F.Mask)
      (net 21 "Net-(D_PDS1040-Pad2)"))
    (pad 4 smd rect (at -3.75 6.6) (size 1.27 2.54) (layers F.Cu F.Paste F.Mask)
      (net 16 "Net-(PA1133-coil1-Pad4)"))
    (pad 3 smd rect (at -1.25 6.6) (size 1.27 2.54) (layers F.Cu F.Paste F.Mask)
      (net 7 /VPORTP))
    (pad 2 smd rect (at 1.25 6.6) (size 1.27 2.54) (layers F.Cu F.Paste F.Mask)
      (net 17 "Net-(PA1133-coil1-Pad2)"))
    (pad 1 smd rect (at 3.75 6.6) (size 1.27 2.54) (layers F.Cu F.Paste F.Mask)
      (net 18 "Net-(PA1133-coil1-Pad1)"))
  )
  (module Package_TO_SOT_SMD:SOT-23_Handsoldering (layer F.Cu) (tedit 5FA84E32)
    (at 39.33698 23.9522)
    (descr "SOT-23, Handsoldering")
    (tags SOT-23)
    (attr smd)
    (fp_text reference U_TLV431 (at -0.34036 2.27076) (layer F.SilkS))
    (fp_text value TLV431 (at 0 2.5) (layer F.Fab) hide)
    (fp_text user %R (at 0 0 -270) (layer F.Fab) hide)
    (pad 3 smd rect (at 1.5 0) (size 1.9 0.8) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 2 smd rect (at -1.5 0.95) (size 1.9 0.8) (layers F.Cu F.Paste F.Mask)
      (net 3 "Net-(CPCC1-Pad1)"))
    (pad 1 smd rect (at -1.5 -0.95) (size 1.9 0.8) (layers F.Cu F.Paste F.Mask)
      (net 2 "Net-(CPCC1-Pad2)"))
    (model ${KISYS3DMOD}/Package_TO_SOT_SMD.3dshapes/SOT-23.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Package_SO:TSOP-6_1.65x3.05mm_P0.95mm (layer F.Cu) (tedit 5FBB72D2)
    (at 22.4155 17.50822 270)
    (descr "TSOP-6 package (comparable to TSOT-23), https://www.vishay.com/docs/71200/71200.pdf")
    (tags "Jedec MO-193C TSOP-6L")
    (attr smd)
    (fp_text reference U_Si3440 (at 0.10922 -2.37236 90) (layer F.SilkS))
    (fp_text value Si3440 (at -0.0508 2.0828 90) (layer F.Fab) hide)
    (fp_text user %R (at 0 0) (layer F.Fab) hide)
    (pad 6 smd rect (at 1.16 -0.95 270) (size 1.2 0.56) (layers F.Cu F.Paste F.Mask)
      (net 16 "Net-(PA1133-coil1-Pad4)"))
    (pad 5 smd rect (at 1.16 0 270) (size 1.2 0.56) (layers F.Cu F.Paste F.Mask)
      (net 16 "Net-(PA1133-coil1-Pad4)"))
    (pad 4 smd rect (at 1.16 0.95 270) (size 1.2 0.56) (layers F.Cu F.Paste F.Mask)
      (net 15 /SEN))
    (pad 3 smd rect (at -1.16 0.95 270) (size 1.2 0.56) (layers F.Cu F.Paste F.Mask)
      (net 12 /NGATE))
    (pad 2 smd rect (at -1.16 0 270) (size 1.2 0.56) (layers F.Cu F.Paste F.Mask)
      (net 16 "Net-(PA1133-coil1-Pad4)"))
    (pad 1 smd rect (at -1.16 -0.95 270) (size 1.2 0.56) (layers F.Cu F.Paste F.Mask)
      (net 16 "Net-(PA1133-coil1-Pad4)"))
    (model ${KISYS3DMOD}/Package_SO.3dshapes/TSOP-6_1.65x3.05mm_P0.95mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Diode_SMD:D_SMA (layer F.Cu) (tedit 5FA84D7D)
    (at 4.53644 13.50264 270)
    (descr "Diode SMA (DO-214AC)")
    (tags "Diode SMA (DO-214AC)")
    (attr smd)
    (fp_text reference D_SMAJ58 (at 0.0381 2.21234 90) (layer F.SilkS))
    (fp_text value SMAJ58A-13-F (at -0.0254 2.0828 90) (layer F.Fab) hide)
    (fp_text user %R (at 0.127 -2.032 90) (layer F.Fab) hide)
    (pad 2 smd rect (at 2 0 270) (size 2.5 1.8) (layers F.Cu F.Paste F.Mask)
      (net 8 /VPORTN))
    (pad 1 smd rect (at -2 0 270) (size 2.5 1.8) (layers F.Cu F.Paste F.Mask)
      (net 11 /PLUS))
    (model ${KISYS3DMOD}/Diode_SMD.3dshapes/D_SMA.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:CP_Elec_6.3x7.7 (layer F.Cu) (tedit 5FA84CD3)
    (at 47.07382 22.42312 180)
    (descr "SMD capacitor, aluminum electrolytic, Nichicon, 6.3x7.7mm")
    (tags "capacitor electrolytic")
    (attr smd)
    (fp_text reference CPCOS-CON1 (at -0.1016 -4.0132) (layer F.SilkS))
    (fp_text value "330uf 6.3V" (at 0 4.35) (layer F.Fab) hide)
    (fp_text user %R (at 0 0) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 2.7 0 180) (size 3.5 1.6) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.15625)
      (net 1 GND))
    (pad 1 smd roundrect (at -2.7 0 180) (size 3.5 1.6) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.15625)
      (net 4 /PV3))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/CP_Elec_6.3x7.7.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:CP_Elec_8x10 (layer F.Cu) (tedit 5FA84F75)
    (at 12.64666 4.56946 180)
    (descr "SMD capacitor, aluminum electrolytic, Nichicon, 8.0x10mm")
    (tags "capacitor electrolytic")
    (attr smd)
    (fp_text reference CPLDB1 (at 5.78358 0.05842 90) (layer F.SilkS))
    (fp_text value "4.7uf 100V" (at -0.0254 4.7244) (layer F.Fab) hide)
    (fp_text user %R (at 0.0508 1.7526) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 3.25 0 180) (size 3.5 2.5) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.1)
      (net 6 GNDREF))
    (pad 1 smd roundrect (at -3.25 0 180) (size 3.5 2.5) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.1)
      (net 7 /VPORTP))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/CP_Elec_8x10.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_Tantalum_SMD:CP_EIA-6032-15_Kemet-U_Pad2.25x2.35mm_HandSolder (layer F.Cu) (tedit 5FA84FE2)
    (at 15.28826 13.42136 180)
    (descr "Tantalum Capacitor SMD Kemet-U (6032-15 Metric), IPC_7351 nominal, (Body size from: http://www.kemet.com/Lists/ProductCatalog/Attachments/253/KEM_TC101_STD.pdf), generated with kicad-footprint-generator")
    (tags "capacitor tantalum")
    (attr smd)
    (fp_text reference CPVCC1 (at 2.1336 2.35712 180) (layer F.SilkS))
    (fp_text value "4.7uf 50V TANT" (at -0.0254 2.2606) (layer F.Fab) hide)
    (fp_text user %R (at 0 0) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 2.55 0 180) (size 2.25 2.35) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.111111)
      (net 6 GNDREF))
    (pad 1 smd roundrect (at -2.55 0 180) (size 2.25 2.35) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.111111)
      (net 9 /PVCC))
    (model ${KISYS3DMOD}/Capacitor_Tantalum_SMD.3dshapes/CP_EIA-6032-15_Kemet-U.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder (layer F.Cu) (tedit 5FA7A271)
    (at 8.74776 16.10868 90)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RPCLA1 (at 0 -1.3716 90) (layer F.SilkS))
    (fp_text value "124 0.1%" (at 0 1.27 90) (layer F.Fab) hide)
    (fp_text user %R (at 0 0.2032 90) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1 0 90) (size 1.2 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.208333)
      (net 13 /RCLASS))
    (pad 1 smd roundrect (at -1 0 90) (size 1.2 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.208333)
      (net 8 /VPORTN))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder (layer F.Cu) (tedit 5FA7A271)
    (at 39.03218 4.17068 180)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RPFIL1 (at 0.0254 -1.55956) (layer F.SilkS))
    (fp_text value "10 OHM" (at 0 1.27) (layer F.Fab) hide)
    (fp_text user %R (at 0 0.2032) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1 0 180) (size 1.2 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.208333)
      (net 5 "Net-(CPFIL1-Pad1)"))
    (pad 1 smd roundrect (at -1 0 180) (size 1.2 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.208333)
      (net 21 "Net-(D_PDS1040-Pad2)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder (layer F.Cu) (tedit 5FA7A271)
    (at 31.3055 20.70608)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RPLIM1 (at 0 -1.3716) (layer F.SilkS))
    (fp_text value "470 0.1%" (at 0 1.27) (layer F.Fab) hide)
    (fp_text user %R (at 0 0.2032) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1 0) (size 1.2 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.208333)
      (net 4 /PV3))
    (pad 1 smd roundrect (at -1 0) (size 1.2 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.208333)
      (net 19 "Net-(PS2911-Pad1)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder (layer F.Cu) (tedit 5FA7A271)
    (at 40.27424 20.62226)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RPOE1 (at 0 -1.3716) (layer F.SilkS))
    (fp_text value "60.4K 1%" (at 0 1.27) (layer F.Fab) hide)
    (fp_text user %R (at 0 0.2032) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1 0) (size 1.2 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.208333)
      (net 1 GND))
    (pad 1 smd roundrect (at -1 0) (size 1.2 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.208333)
      (net 2 "Net-(CPCC1-Pad2)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder (layer F.Cu) (tedit 5FA7A271)
    (at 36.07562 20.58162)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RPOE2 (at 0 -1.3716) (layer F.SilkS))
    (fp_text value "100K 1%" (at 0 1.27) (layer F.Fab) hide)
    (fp_text user %R (at 0 0.2032) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1 0) (size 1.2 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.208333)
      (net 2 "Net-(CPCC1-Pad2)"))
    (pad 1 smd roundrect (at -1 0) (size 1.2 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.208333)
      (net 4 /PV3))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_1206_3216Metric_Pad1.30x1.75mm_HandSolder (layer F.Cu) (tedit 5FA84F34)
    (at 8.82904 11.60018 270)
    (descr "Resistor SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RPOE4 (at -0.3556 1.6637 90) (layer F.SilkS))
    (fp_text value "10 OHM 1%" (at 0.0254 1.4224 90) (layer F.Fab) hide)
    (fp_text user %R (at 0 0 90) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.55 0 270) (size 1.3 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.192308)
      (net 7 /VPORTP))
    (pad 1 smd roundrect (at -1.55 0 270) (size 1.3 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.192308)
      (net 11 /PLUS))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_1206_3216Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder (layer F.Cu) (tedit 5FA7A271)
    (at 17.56664 10.20826)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RPOR1 (at 1.00838 -1.45796) (layer F.SilkS))
    (fp_text value "10K 1%" (at 0 1.27) (layer F.Fab) hide)
    (fp_text user %R (at 0 0.2032) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1 0) (size 1.2 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.208333)
      (net 9 /PVCC))
    (pad 1 smd roundrect (at -1 0) (size 1.2 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.208333)
      (net 7 /VPORTP))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder (layer F.Cu) (tedit 5FA7A271)
    (at 22.17166 24.63546)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RPPVC1 (at 0.22352 1.42494) (layer F.SilkS))
    (fp_text value "6.8K 1%" (at 0 1.27) (layer F.Fab) hide)
    (fp_text user %R (at 0 0.2032) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1 0) (size 1.2 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.208333)
      (net 20 "Net-(D_PBAS1-Pad1)"))
    (pad 1 smd roundrect (at -1 0) (size 1.2 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.208333)
      (net 9 /PVCC))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder (layer F.Cu) (tedit 5FA7A271)
    (at 11.557 23.99538 180)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RPRSL1 (at 0.38354 -1.44526) (layer F.SilkS))
    (fp_text value "10K 1%" (at 0 1.27) (layer F.Fab) hide)
    (fp_text user %R (at 0 0.2032) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1 0 180) (size 1.2 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.208333)
      (net 14 /SENSE))
    (pad 1 smd roundrect (at -1 0 180) (size 1.2 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.208333)
      (net 15 /SEN))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_1206_3216Metric_Pad1.30x1.75mm_HandSolder (layer F.Cu) (tedit 5FA84F34)
    (at 22.20976 21.35378 180)
    (descr "Resistor SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RPSEN1 (at -0.0254 -1.5494) (layer F.SilkS))
    (fp_text value "0.1 OHM 1%" (at 0.0254 1.4224) (layer F.Fab) hide)
    (fp_text user %R (at 0 0) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.55 0 180) (size 1.3 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.192308)
      (net 15 /SEN))
    (pad 1 smd roundrect (at -1.55 0 180) (size 1.3 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.192308)
      (net 6 GNDREF))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_1206_3216Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder (layer F.Cu) (tedit 5FA7A380)
    (at 39.11092 2.01422)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference CPFIL1 (at 0.08382 -1.44018) (layer F.SilkS))
    (fp_text value "470pf 50V" (at -0.0508 1.1684) (layer F.Fab) hide)
    (fp_text user %R (at 0 0) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.0375 0) (size 1.175 1.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.212766)
      (net 4 /PV3))
    (pad 1 smd roundrect (at -1.0375 0) (size 1.175 1.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.212766)
      (net 5 "Net-(CPFIL1-Pad1)"))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_1210_3225Metric_Pad1.33x2.70mm_HandSolder (layer F.Cu) (tedit 5FBB070D)
    (at 43.30954 9.01446 180)
    (descr "Capacitor SMD 1210 (3225 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference CPOUT1 (at 3.04546 0.56642 270) (layer F.SilkS))
    (fp_text value "100uf 10V " (at 0 1.8796) (layer F.Fab) hide)
    (fp_text user %R (at 0 0) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.5625 0 180) (size 1.325 2.7) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.188679)
      (net 1 GND))
    (pad 1 smd roundrect (at -1.5625 0 180) (size 1.325 2.7) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.188679)
      (net 4 /PV3))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_1210_3225Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_1210_3225Metric_Pad1.33x2.70mm_HandSolder (layer F.Cu) (tedit 5FBB070D)
    (at 43.27652 12.5476 180)
    (descr "Capacitor SMD 1210 (3225 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference CPOUT2 (at 3.10134 0.01778 270) (layer F.SilkS))
    (fp_text value "100uf 10V " (at 0 1.8796) (layer F.Fab) hide)
    (fp_text user %R (at 0 0) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.5625 0 180) (size 1.325 2.7) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.188679)
      (net 1 GND))
    (pad 1 smd roundrect (at -1.5625 0 180) (size 1.325 2.7) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.188679)
      (net 4 /PV3))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_1210_3225Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_1210_3225Metric_Pad1.33x2.70mm_HandSolder (layer F.Cu) (tedit 5FBB070D)
    (at 43.24096 16.04772 180)
    (descr "Capacitor SMD 1210 (3225 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference CPOUT3 (at 3.04292 -0.63246 270) (layer F.SilkS))
    (fp_text value "100uf 10V " (at 0 1.8796) (layer F.Fab) hide)
    (fp_text user %R (at 0 0) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.5625 0 180) (size 1.325 2.7) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.188679)
      (net 1 GND))
    (pad 1 smd roundrect (at -1.5625 0 180) (size 1.325 2.7) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.188679)
      (net 4 /PV3))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_1210_3225Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder (layer F.Cu) (tedit 5FA7A380)
    (at 35.1663 23.96744 90)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference CPCC1 (at 0.0508 -1.3716 90) (layer F.SilkS))
    (fp_text value 22nf (at -0.0508 1.1684 90) (layer F.Fab) hide)
    (fp_text user %R (at 0 0 90) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.0375 0 90) (size 1.175 1.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.212766)
      (net 2 "Net-(CPCC1-Pad2)"))
    (pad 1 smd roundrect (at -1.0375 0 90) (size 1.175 1.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.212766)
      (net 3 "Net-(CPCC1-Pad1)"))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_1812_4532Metric_Pad1.57x3.40mm_HandSolder (layer F.Cu) (tedit 5FA84D0A)
    (at 21.44522 2.32156 180)
    (descr "Capacitor SMD 1812 (4532 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference CPISO1 (at -0.05588 -2.50444) (layer F.SilkS))
    (fp_text value "22nf 250V" (at 0 2.3368) (layer F.Fab) hide)
    (fp_text user %R (at 0 0) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 2.1375 0 180) (size 1.575 3.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.15873)
      (net 6 GNDREF))
    (pad 1 smd roundrect (at -2.1375 0 180) (size 1.575 3.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.15873)
      (net 1 GND))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_1812_4532Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_1210_3225Metric_Pad1.33x2.70mm_HandSolder (layer F.Cu) (tedit 5FBB070D)
    (at 22.06752 11.97864 90)
    (descr "Capacitor SMD 1210 (3225 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference CPLDA1 (at -0.03048 2.159 90) (layer F.SilkS))
    (fp_text value "1uf 100V" (at 0 1.8796 90) (layer F.Fab) hide)
    (fp_text user %R (at 0 0 90) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.5625 0 90) (size 1.325 2.7) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.188679)
      (net 7 /VPORTP))
    (pad 1 smd roundrect (at -1.5625 0 90) (size 1.325 2.7) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.188679)
      (net 6 GNDREF))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_1210_3225Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_1206_3216Metric_Pad1.33x1.80mm_HandSolder (layer F.Cu) (tedit 5FA7B3F3)
    (at 8.36422 20.79752 90)
    (descr "Capacitor SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference CPOE1 (at -0.0254 -1.6002 90) (layer F.SilkS))
    (fp_text value "0.1uf 100V" (at 0.0254 1.4986 90) (layer F.Fab) hide)
    (fp_text user %R (at 0 0 90) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.5625 0 90) (size 1.325 1.8) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.188679)
      (net 7 /VPORTP))
    (pad 1 smd roundrect (at -1.5625 0 90) (size 1.325 1.8) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.188679)
      (net 8 /VPORTN))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_1206_3216Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder (layer F.Cu) (tedit 5FA7A271)
    (at 48.84166 15.61846 90)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference F_PB1 (at -0.0381 -1.5748 90) (layer F.SilkS))
    (fp_text value "120 ohm Ferrite" (at 0 1.27 90) (layer F.Fab) hide)
    (fp_text user %R (at 0 0.2032 90) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1 0 90) (size 1.2 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.208333)
      (net 24 +3V0))
    (pad 1 smd roundrect (at -1 0 90) (size 1.2 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.208333)
      (net 4 /PV3))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Connector_PinHeader_2.54mm:PinHeader_1x02_P2.54mm_Vertical (layer B.Cu) (tedit 5FA7AF16)
    (at 53.34 3.302 180)
    (descr "Through hole straight pin header, 1x02, 2.54mm pitch, single row")
    (tags "Through hole pin header THT 1x02 2.54mm single row")
    (fp_text reference J_3V1 (at -1.72212 -1.12268 270) (layer B.SilkS))
    (fp_text value Conn_01x02 (at 2.0574 -1.0414 270) (layer B.Fab) hide)
    (fp_text user %R (at 0 -1.27 270) (layer B.Fab) hide)
    (pad 2 thru_hole oval (at 0 -2.54 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 25 "Net-(J_3MON1-Pad1)"))
    (pad 1 thru_hole rect (at 0 0 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 25 "Net-(J_3MON1-Pad1)"))
    (model ${KISYS3DMOD}/Connector_PinHeader_2.54mm.3dshapes/PinHeader_1x02_P2.54mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Connector_PinHeader_2.54mm:PinHeader_1x02_P2.54mm_Vertical (layer B.Cu) (tedit 5FA7AF16)
    (at 53.34 23.622)
    (descr "Through hole straight pin header, 1x02, 2.54mm pitch, single row")
    (tags "Through hole pin header THT 1x02 2.54mm single row")
    (fp_text reference J_GND1 (at 1.72212 -1.31064 270) (layer B.SilkS))
    (fp_text value Conn_01x02 (at 2.0574 -1.0414 270) (layer B.Fab) hide)
    (fp_text user %R (at 0 -1.27 270) (layer B.Fab) hide)
    (pad 2 thru_hole oval (at 0 -2.54) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 1 thru_hole rect (at 0 0) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 1 GND))
    (model ${KISYS3DMOD}/Connector_PinHeader_2.54mm.3dshapes/PinHeader_1x02_P2.54mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Connector_PinHeader_2.54mm:PinHeader_1x02_P2.54mm_Vertical (layer B.Cu) (tedit 5FA7AF16)
    (at 2.54 24.892 270)
    (descr "Through hole straight pin header, 1x02, 2.54mm pitch, single row")
    (tags "Through hole pin header THT 1x02 2.54mm single row")
    (fp_text reference J_POEN1 (at -1.93294 -1.46558) (layer B.SilkS))
    (fp_text value Conn_01x02 (at 2.0574 -1.0414) (layer B.Fab) hide)
    (fp_text user %R (at 0 -1.27) (layer B.Fab) hide)
    (pad 2 thru_hole oval (at 0 -2.54 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 8 /VPORTN))
    (pad 1 thru_hole rect (at 0 0 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 8 /VPORTN))
    (model ${KISYS3DMOD}/Connector_PinHeader_2.54mm.3dshapes/PinHeader_1x02_P2.54mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Connector_PinHeader_2.54mm:PinHeader_1x02_P2.54mm_Vertical (layer B.Cu) (tedit 5FA7AF16)
    (at 2.54 2.032 270)
    (descr "Through hole straight pin header, 1x02, 2.54mm pitch, single row")
    (tags "Through hole pin header THT 1x02 2.54mm single row")
    (fp_text reference J_POEP1 (at 2.04724 -1.19634) (layer B.SilkS))
    (fp_text value Conn_01x02 (at 2.0574 -1.0414) (layer B.Fab) hide)
    (fp_text user %R (at 0 -1.27) (layer B.Fab) hide)
    (pad 2 thru_hole oval (at 0 -2.54 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 11 /PLUS))
    (pad 1 thru_hole rect (at 0 0 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 11 /PLUS))
    (model ${KISYS3DMOD}/Connector_PinHeader_2.54mm.3dshapes/PinHeader_1x02_P2.54mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module LED_SMD:LED_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5FA7A02C)
    (at 48.84928 11.0871 270)
    (descr "LED SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "LED handsolder")
    (attr smd)
    (fp_text reference L_PLED1 (at -0.19304 1.82118 90) (layer F.SilkS))
    (fp_text value Green (at 0 1.27 90) (layer F.Fab) hide)
    (fp_text user %R (at 0 0 90) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 24 +3V0))
    (pad 1 smd roundrect (at -1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 26 "Net-(L_PLED1-Pad1)"))
    (model ${KISYS3DMOD}/LED_SMD.3dshapes/LED_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder (layer F.Cu) (tedit 5FA7A271)
    (at 50.47742 4.84632 90)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RPLED1 (at -2.3368 0.02032 180) (layer F.SilkS))
    (fp_text value 330 (at 0 1.27 90) (layer F.Fab) hide)
    (fp_text user %R (at 0 0.2032 90) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1 0 90) (size 1.2 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.208333)
      (net 1 GND))
    (pad 1 smd roundrect (at -1 0 90) (size 1.2 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.208333)
      (net 26 "Net-(L_PLED1-Pad1)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Connector_PinHeader_2.54mm:PinHeader_1x02_P2.54mm_Vertical (layer F.Cu) (tedit 5FA7AF16)
    (at 52.324 12.192)
    (descr "Through hole straight pin header, 1x02, 2.54mm pitch, single row")
    (tags "Through hole pin header THT 1x02 2.54mm single row")
    (fp_text reference J_3MON1 (at 2.2987 1.41732 90) (layer F.SilkS))
    (fp_text value Conn_01x02 (at 2.0574 1.0414 90) (layer F.Fab) hide)
    (fp_text user %R (at 0 1.27 90) (layer F.Fab) hide)
    (pad 2 thru_hole oval (at 0 2.54) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 24 +3V0))
    (pad 1 thru_hole rect (at 0 0) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 25 "Net-(J_3MON1-Pad1)"))
    (model ${KISYS3DMOD}/Connector_PinHeader_2.54mm.3dshapes/PinHeader_1x02_P2.54mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (gr_text "Class 1 PoE" (at 30.65018 17.35836) (layer F.SilkS))
  (gr_text "https://www.analog.com/en/products/ltc4267-1.html\nhttps://www.analog.com/media/en/technical-documentation/data-sheets/42671fa.pdf" (at 27.02052 19.33194) (layer B.SilkS))
  (gr_text "PoE Diodes in\nRJ45 Socket" (at 1.87706 12.7 90) (layer B.SilkS))
  (gr_text "MiniPoeCard\nVersion 4c\n24 Mar 2021" (at 28.61564 6.15188) (layer B.SilkS))
  (gr_text "Copyright S. Cooper 2021.\nYou may redistribute and modify this documentation under the terms of the CERN OHL v.1.2.\nThis documentation is distributed WITHOUT ANY EXPRESS OR IMPLIED WARRANTY, \nINCLUDING OF MERCHANTABILITY, SATISFACTORY QUALITY AND FITNESS FOR A PARTICULAR PURPOSE.\nPlease see the CERN OHL v.1.2 for applicable conditions. (http://ohwr.org/cernohl)." (at 26.97734 13.1445) (layer B.SilkS))
  (gr_text "RJ45\nNEG" (at 3.7846 22.50186) (layer F.SilkS))
  (gr_text "RJ45\nPOS" (at 3.67284 4.50596) (layer F.SilkS))
  (gr_text GND (at 53.46954 25.77338) (layer F.SilkS))
  (gr_text 3.3V (at 53.37556 1.09728) (layer F.SilkS))
  (gr_text L (at 51.4858 9.73074 90) (layer F.SilkS))
  (gr_text H (at 51.84394 17.35328 90) (layer F.SilkS))
  (gr_text "NOTE: Unplug CPU 3V Reg." (at 0.73406 13.53058 90) (layer F.SilkS))
  (gr_line (start 0 0) (end 55.626 0) (layer Edge.Cuts) (width 0.05))
  (gr_line (start 55.626 26.924) (end 0 26.924) (layer Edge.Cuts) (width 0.05))
  (gr_line (start 55.626 0) (end 55.626 26.924) (layer Edge.Cuts) (width 0.05))
  (gr_line (start 0 26.924) (end 0 0) (layer Edge.Cuts) (width 0.05))
  (zone (net 0) (net_name "") (layer B.Mask) (hatch edge 0.508)
    (connect_pads (clearance 0.2032))
    (min_thickness 0.254)
    (fill yes (arc_segments 32) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 88.824027 32.810977) (xy 91.395777 32.799547) (xy 91.401175 37.17057) (xy 88.81863 37.162315)
      )
    )
  )
  (zone (net 6) (net_name GNDREF) (layer B.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.381))
    (min_thickness 0.254)
    (fill yes (arc_segments 32) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 25.6794 27.20086) (xy -0.43688 27.17292) (xy -0.43688 -0.51308) (xy 25.6794 -0.48514)
      )
    )
  )
  (zone (net 1) (net_name GND) (layer B.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.381))
    (min_thickness 0.254)
    (fill yes (arc_segments 32) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 55.88 27.178) (xy 31.75 27.178) (xy 31.75 17.526) (xy 37.338 17.526) (xy 37.338 9.144)
        (xy 55.88 9.144)
      )
    )
  )
  (zone (net 1) (net_name GND) (layer F.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.381))
    (min_thickness 0.254)
    (fill yes (arc_segments 32) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 55.88 27.178) (xy 31.75 27.178) (xy 31.72206 18.29308) (xy 37.338 17.526) (xy 37.338 9.144)
        (xy 55.88 9.144)
      )
    )
  )
  (zone (net 6) (net_name GNDREF) (layer F.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.381))
    (min_thickness 0.254)
    (fill yes (arc_segments 32) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 21.336 5.334) (xy 25.45969 8.67156) (xy 28.82011 8.67156) (xy 31.06674 11.14806) (xy 31.06674 16.81226)
        (xy 28.448 18.796) (xy 28.448 27.178) (xy -0.254 27.178) (xy -0.254 -0.254) (xy 21.336 -0.254)
      )
    )
  )
)
