(kicad_pcb (version 20211014) (generator pcbnew)
  (general
    (thickness 0.158)
  )
  (paper "A4")
  (layers
    (0 "F.Cu" signal)
    (31 "B.Cu" signal)
    (32 "B.Adhes" user "B.Adhesive")
    (33 "F.Adhes" user "F.Adhesive")
    (34 "B.Paste" user)
    (35 "F.Paste" user)
    (36 "B.SilkS" user "B.Silkscreen")
    (37 "F.SilkS" user "F.Silkscreen")
    (38 "B.Mask" user)
    (39 "F.Mask" user)
    (40 "Dwgs.User" user "User.Drawings")
    (41 "Cmts.User" user "User.Comments")
    (42 "Eco1.User" user "User.Eco1")
    (43 "Eco2.User" user "User.Eco2")
    (44 "Edge.Cuts" user)
    (45 "Margin" user)
    (46 "B.CrtYd" user "B.Courtyard")
    (47 "F.CrtYd" user "F.Courtyard")
    (48 "B.Fab" user)
    (49 "F.Fab" user)
    (50 "User.1" user)
    (51 "User.2" user)
    (52 "User.3" user)
    (53 "User.4" user)
    (54 "User.5" user)
    (55 "User.6" user)
    (56 "User.7" user)
    (57 "User.8" user)
    (58 "User.9" user)
  )
  (setup
    (stackup
      (layer "F.SilkS" (type "Top Silk Screen"))
      (layer "F.Paste" (type "Top Solder Paste"))
      (layer "F.Mask" (type "Top Solder Mask") (thickness 0.01))
      (layer "F.Cu" (type "copper") (thickness 0.035))
      (layer "dielectric 1" (type "core") (thickness 0.068) (material "FR4") (epsilon_r 4.5) (loss_tangent 0.02))
      (layer "B.Cu" (type "copper") (thickness 0.035))
      (layer "B.Mask" (type "Bottom Solder Mask") (thickness 0.01))
      (layer "B.Paste" (type "Bottom Solder Paste"))
      (layer "B.SilkS" (type "Bottom Silk Screen"))
      (copper_finish "None")
      (dielectric_constraints no)
    )
    (pad_to_mask_clearance 0)
    (pcbplotparams
      (layerselection 0x00010fc_ffffffff)
      (disableapertmacros false)
      (usegerberextensions false)
      (usegerberattributes true)
      (usegerberadvancedattributes true)
      (creategerberjobfile true)
      (svguseinch false)
      (svgprecision 6)
      (excludeedgelayer true)
      (plotframeref false)
      (viasonmask false)
      (mode 1)
      (useauxorigin false)
      (hpglpennumber 1)
      (hpglpenspeed 20)
      (hpglpendiameter 15.000000)
      (dxfpolygonmode true)
      (dxfimperialunits true)
      (dxfusepcbnewfont true)
      (psnegative false)
      (psa4output false)
      (plotreference true)
      (plotvalue true)
      (plotinvisibletext false)
      (sketchpadsonfab false)
      (subtractmaskfromsilk false)
      (outputformat 1)
      (mirror false)
      (drillshape 1)
      (scaleselection 1)
      (outputdirectory "")
    )
  )
  (net 0 "")
  (net 1 "S$1")
  (net 2 "N$2")
  (footprint "WetSensorV3:1X02" (layer "F.Cu")
    (tedit 0)
    (at 147.280382 119.2861)
    (descr "<h3>Plated Through Hole</h3>\n<p>Specifications:\n<ul><li>Pin count:2</li>\n<li>Pin pitch:0.1\"</li>\n</ul></p>\n<p>Example device(s):\n<ul><li>CONN_02</li>\n</ul></p>")
    (fp_text reference "J1" (at -1.27 -1.397) (layer "F.SilkS"))
    (fp_text value "" (at -1.27 2.032) (layer "F.Fab"))
    (pad "1" thru_hole circle (at 0 0 90) (size 1.8796 1.8796) (drill 1.016) (layers *.Cu *.Mask)
      (net 2 "N$2") (solder_mask_margin 0.1016))
    (pad "2" thru_hole circle (at 2.54 0 90) (size 1.8796 1.8796) (drill 1.016) (layers *.Cu *.Mask)
      (net 1 "S$1") (solder_mask_margin 0.1016))
  )
  (footprint "WetSensorV3:1X02" (layer "F.Cu")
    (tedit 0)
    (at 147.32 121.92)
    (descr "<h3>Plated Through Hole</h3>\n<p>Specifications:\n<ul><li>Pin count:2</li>\n<li>Pin pitch:0.1\"</li>\n</ul></p>\n<p>Example device(s):\n<ul><li>CONN_02</li>\n</ul></p>")
    (fp_text reference "J1" (at -1.27 -1.397) (layer "F.SilkS"))
    (fp_text value "" (at -1.27 2.032) (layer "F.Fab"))
    (pad "1" thru_hole circle (at 0 0 90) (size 1.8796 1.8796) (drill 1.016) (layers *.Mask "F.Cu" "In1.Cu" "In2.Cu" "In3.Cu" "In4.Cu" "In5.Cu" "In6.Cu" "In7.Cu" "In8.Cu" "In9.Cu" "In10.Cu" "In11.Cu" "In12.Cu" "In13.Cu" "In14.Cu" "B.Cu")
      (net 2 "N$2") (solder_mask_margin 0.1016))
    (pad "2" thru_hole circle (at 2.54 0 90) (size 1.8796 1.8796) (drill 1.016) (layers *.Mask "F.Cu" "In1.Cu" "In2.Cu" "In3.Cu" "In4.Cu" "In5.Cu" "In6.Cu" "In7.Cu" "In8.Cu" "In9.Cu" "In10.Cu" "In11.Cu" "In12.Cu" "In13.Cu" "In14.Cu" "B.Cu")
      (net 2 "N$2") (solder_mask_margin 0.1016))
  )
  (footprint "WetSensorV3:M0805" (layer "F.Cu")
    (tedit 0)
    (at 148.550382 114.2061 180)
    (descr "<b>RESISTOR</b><p>\nMELF 0.10 W")
    (fp_text reference "R1" (at -3.048 -1.524) (layer "F.SilkS"))
    (fp_text value "" (at -3.1306 2.775) (layer "F.Fab"))
    (pad "1" smd rect (at -0.95 0 180) (size 1.3 1.6) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 1 "S$1") (solder_mask_margin 0.1016))
    (pad "2" smd rect (at 0.95 0 180) (size 1.3 1.6) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "N$2") (solder_mask_margin 0.1016))
  )
  (gr_line (start 142.454382 124.3661) (end 154.570382 124.3661) (layer "Edge.Cuts") (width 0.05))
  (gr_line (start 156.475382 122.4611) (end 156.475382 86.9111) (layer "Edge.Cuts") (width 0.05))
  (gr_arc (start 156.475382 122.4611) (mid 155.91742 123.808138) (end 154.570382 124.3661) (layer "Edge.Cuts") (width 0.05))
  (gr_arc (start 155.205382 85.6411) (mid 156.103408 86.013074) (end 156.475382 86.9111) (layer "Edge.Cuts") (width 0.05))
  (gr_arc (start 142.454382 124.3661) (mid 140.975831 123.490638) (end 140.549382 121.8261) (layer "Edge.Cuts") (width 0.05))
  (gr_arc (start 140.549382 86.9111) (mid 140.921356 86.013074) (end 141.819382 85.6411) (layer "Edge.Cuts") (width 0.05))
  (gr_line (start 155.205382 85.6411) (end 141.819382 85.6411) (layer "Edge.Cuts") (width 0.05))
  (gr_line (start 140.549382 86.9111) (end 140.549382 121.8261) (layer "Edge.Cuts") (width 0.05))
  (zone (net 0) (net_name "") (layer "F.Mask") (hatch edge 0.508)
    (connect_pads (clearance 0.508))
    (min_thickness 0.254) (filled_areas_thickness no)
    (fill yes (thermal_gap 0.508) (thermal_bridge_width 0.508) (smoothing fillet) (radius 1))
    (polygon
      (pts
        (xy 155.575 112.395)
        (xy 141.605 112.395)
        (xy 141.605 86.995)
        (xy 155.575 86.995)
      )
    )
  )
)
