(kicad_pcb (version 20171130) (host pcbnew "(5.1.5)-3")
  (general
    (thickness 1.6)
    (drawings 7)
    (tracks 491)
    (zones 0)
    (modules 19)
    (nets 13)
  )
  (page A4)
  (layers
    (0 F.Cu signal)
    (31 B.Cu signal)
    (32 B.Adhes user)
    (33 F.Adhes user)
    (34 B.Paste user)
    (35 F.Paste user)
    (36 B.SilkS user)
    (37 F.SilkS user)
    (38 B.Mask user)
    (39 F.Mask user)
    (40 Dwgs.User user)
    (41 Cmts.User user)
    (42 Eco1.User user)
    (43 Eco2.User user)
    (44 Edge.Cuts user)
    (45 Margin user)
    (46 B.CrtYd user)
    (47 F.CrtYd user)
    (48 B.Fab user hide)
    (49 F.Fab user hide)
  )
  (setup
    (last_trace_width 0.25)
    (user_trace_width 0.254)
    (user_trace_width 0.762)
    (trace_clearance 0.2032)
    (zone_clearance 0.508)
    (zone_45_only no)
    (trace_min 0.2)
    (via_size 0.8)
    (via_drill 0.4)
    (via_min_size 0.4)
    (via_min_drill 0.3)
    (uvia_size 0.3)
    (uvia_drill 0.1)
    (uvias_allowed no)
    (uvia_min_size 0.2)
    (uvia_min_drill 0.1)
    (edge_width 0.05)
    (segment_width 0.2)
    (pcb_text_width 0.3)
    (pcb_text_size 1.5 1.5)
    (mod_edge_width 0.12)
    (mod_text_size 1 1)
    (mod_text_width 0.15)
    (pad_size 1.524 1.524)
    (pad_drill 0.762)
    (pad_to_mask_clearance 0.051)
    (solder_mask_min_width 0.25)
    (aux_axis_origin 0 0)
    (visible_elements 7FFFFFFF)
    (pcbplotparams
      (layerselection 0x010fc_ffffffff)
      (usegerberextensions false)
      (usegerberattributes false)
      (usegerberadvancedattributes false)
      (creategerberjobfile false)
      (excludeedgelayer true)
      (linewidth 0.100000)
      (plotframeref false)
      (viasonmask false)
      (mode 1)
      (useauxorigin false)
      (hpglpennumber 1)
      (hpglpenspeed 20)
      (hpglpendiameter 15.000000)
      (psnegative false)
      (psa4output false)
      (plotreference true)
      (plotvalue true)
      (plotinvisibletext false)
      (padsonsilk false)
      (subtractmaskfromsilk false)
      (outputformat 1)
      (mirror false)
      (drillshape 1)
      (scaleselection 1)
      (outputdirectory ""))
  )
  (net 0 "")
  (net 1 GND)
  (net 2 "Net-(C1-Pad1)")
  (net 3 "Net-(J1-Pad2)")
  (net 4 +12V)
  (net 5 "Net-(Q1-Pad4)")
  (net 6 "Net-(Q2-Pad4)")
  (net 7 "Net-(Q3-Pad4)")
  (net 8 "Net-(Q4-Pad4)")
  (net 9 "Net-(Q5-Pad4)")
  (net 10 "Net-(Q6-Pad4)")
  (net 11 "Net-(R1-Pad1)")
  (net 12 "Net-(U1-Pad3)")
  (net_class Default "This is the default net class."
    (clearance 0.2032)
    (trace_width 0.25)
    (via_dia 0.8)
    (via_drill 0.4)
    (uvia_dia 0.3)
    (uvia_drill 0.1)
    (add_net +12V)
    (add_net GND)
    (add_net "Net-(C1-Pad1)")
    (add_net "Net-(J1-Pad2)")
    (add_net "Net-(Q1-Pad4)")
    (add_net "Net-(Q2-Pad4)")
    (add_net "Net-(Q3-Pad4)")
    (add_net "Net-(Q4-Pad4)")
    (add_net "Net-(Q5-Pad4)")
    (add_net "Net-(Q6-Pad4)")
    (add_net "Net-(R1-Pad1)")
    (add_net "Net-(U1-Pad3)")
  )
  (module Capacitors_SMD:C_0603_HandSoldering (layer F.Cu) (tedit 58AA848B)
    (at 123.063 69.596 180)
    (descr "Capacitor SMD 0603, hand soldering")
    (tags "capacitor 0603")
    (attr smd)
    (fp_text reference C1 (at 0 -1.25) (layer F.SilkS) hide)
    (fp_text value C (at 0 1.5) (layer F.Fab))
    (fp_text user %R (at 0 -1.25) (layer F.Fab))
    (pad 2 smd rect (at 0.95 0 180) (size 1.2 0.75) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 1 smd rect (at -0.95 0 180) (size 1.2 0.75) (layers F.Cu F.Paste F.Mask)
      (net 2 "Net-(C1-Pad1)"))
    (model Capacitors_SMD.3dshapes/C_0603.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_SMD:C_0805_HandSoldering (layer F.Cu) (tedit 58AA84A8)
    (at 123.063 67.564 180)
    (descr "Capacitor SMD 0805, hand soldering")
    (tags "capacitor 0805")
    (attr smd)
    (fp_text reference C2 (at 0 -1.75) (layer F.SilkS) hide)
    (fp_text value C (at 0 1.75) (layer F.Fab))
    (fp_text user %R (at 0 -1.75) (layer F.Fab))
    (pad 2 smd rect (at 1.25 0 180) (size 1.5 1.25) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 1 smd rect (at -1.25 0 180) (size 1.5 1.25) (layers F.Cu F.Paste F.Mask)
      (net 2 "Net-(C1-Pad1)"))
    (model Capacitors_SMD.3dshapes/C_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Pin_Headers:Pin_Header_Straight_1x03_Pitch2.54mm (layer F.Cu) (tedit 59650532)
    (at 116.332 70.358)
    (descr "Through hole straight pin header, 1x03, 2.54mm pitch, single row")
    (tags "Through hole pin header THT 1x03 2.54mm single row")
    (fp_text reference J1 (at 0 -2.33) (layer F.SilkS) hide)
    (fp_text value Conn_01x03 (at 0 7.41) (layer F.Fab))
    (fp_text user %R (at 0 2.54 90) (layer F.Fab))
    (pad 3 thru_hole oval (at 0 5.08) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 2 thru_hole oval (at 0 2.54) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 3 "Net-(J1-Pad2)"))
    (pad 1 thru_hole rect (at 0 0) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 2 "Net-(C1-Pad1)"))
    (model ${KISYS3DMOD}/Pin_Headers.3dshapes/Pin_Header_Straight_1x03_Pitch2.54mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module TO_SOT_Packages_SMD:SOT-669_LFPAK (layer F.Cu) (tedit 5919D982)
    (at 132.08 71.755 90)
    (descr "LFPAK www.nxp.com/documents/leaflet/939775016838_LR.pdf")
    (tags "LFPAK SOT-669 Power-SO8")
    (solder_mask_margin 0.07)
    (solder_paste_margin -0.05)
    (attr smd)
    (fp_text reference Q1 (at -0.245 -3.48 90) (layer F.SilkS) hide)
    (fp_text value PSMN5R2-60YL (at -0.245 3.52 90) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 5 smd rect (at 0.185 -1.15 90) (size 0.6 0.9) (layers F.Cu F.Paste F.Mask)
      (net 4 +12V))
    (pad 5 smd rect (at -0.665 -1.15 90) (size 0.6 0.9) (layers F.Cu F.Paste F.Mask)
      (net 4 +12V))
    (pad 5 smd rect (at 1.035 -1.15 90) (size 0.6 0.9) (layers F.Cu F.Paste F.Mask)
      (net 4 +12V))
    (pad 5 smd rect (at 0.185 1.15 90) (size 0.6 0.9) (layers F.Cu F.Paste F.Mask)
      (net 4 +12V))
    (pad 5 smd rect (at -0.665 1.15 90) (size 0.6 0.9) (layers F.Cu F.Paste F.Mask)
      (net 4 +12V))
    (pad 5 smd rect (at 1.035 1.15 90) (size 0.6 0.9) (layers F.Cu F.Paste F.Mask)
      (net 4 +12V))
    (pad 5 smd rect (at 1.035 0 90) (size 0.6 0.9) (layers F.Cu F.Paste F.Mask)
      (net 4 +12V))
    (pad 5 smd rect (at -0.665 0 90) (size 0.6 0.9) (layers F.Cu F.Paste F.Mask)
      (net 4 +12V))
    (pad 5 smd rect (at 2.885 -1.88) (size 0.6 0.9) (layers F.Cu F.Paste F.Mask)
      (net 4 +12V))
    (pad 5 smd rect (at 2.885 1.88) (size 0.6 0.9) (layers F.Cu F.Paste F.Mask)
      (net 4 +12V))
    (pad 5 smd rect (at 2.885 -0.6) (size 0.6 0.9) (layers F.Cu F.Paste F.Mask)
      (net 4 +12V))
    (pad 2 smd rect (at -2.835 -0.64) (size 0.7 1.15) (layers F.Cu F.Paste F.Mask)
      (net 1 GND) (solder_mask_margin 0.07) (solder_paste_margin -0.05))
    (pad 1 smd rect (at -2.835 -1.91) (size 0.7 1.15) (layers F.Cu F.Paste F.Mask)
      (net 1 GND) (solder_mask_margin 0.07) (solder_paste_margin -0.05))
    (pad 3 smd rect (at -2.835 0.64) (size 0.7 1.15) (layers F.Cu F.Paste F.Mask)
      (net 1 GND) (solder_mask_margin 0.07) (solder_paste_margin -0.05))
    (pad 5 smd rect (at 2.635 0) (size 4.7 1.55) (layers F.Cu F.Paste F.Mask)
      (net 4 +12V) (solder_mask_margin 0.07))
    (pad 5 smd rect (at 0.435 0) (size 4.2 3.3) (layers F.Cu F.Paste F.Mask)
      (net 4 +12V) (solder_mask_margin 0.07))
    (pad 4 smd rect (at -2.835 1.91) (size 0.7 1.15) (layers F.Cu F.Paste F.Mask)
      (net 5 "Net-(Q1-Pad4)") (solder_mask_margin 0.07) (solder_paste_margin -0.05))
    (pad 5 smd rect (at 2.885 0.6) (size 0.6 0.9) (layers F.Cu F.Paste F.Mask)
      (net 4 +12V))
    (pad 5 smd rect (at 0.185 0 90) (size 0.6 0.9) (layers F.Cu F.Paste F.Mask)
      (net 4 +12V))
    (model ${KISYS3DMOD}/TO_SOT_Packages_SMD.3dshapes/SOT-669_LFPAK.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module TO_SOT_Packages_SMD:SOT-669_LFPAK (layer F.Cu) (tedit 5919D982)
    (at 139.446 71.755 90)
    (descr "LFPAK www.nxp.com/documents/leaflet/939775016838_LR.pdf")
    (tags "LFPAK SOT-669 Power-SO8")
    (solder_mask_margin 0.07)
    (solder_paste_margin -0.05)
    (attr smd)
    (fp_text reference Q2 (at -0.245 -3.48 90) (layer F.SilkS) hide)
    (fp_text value PSMN5R2-60YL (at -0.245 3.52 90) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 5 smd rect (at 0.185 0 90) (size 0.6 0.9) (layers F.Cu F.Paste F.Mask)
      (net 4 +12V))
    (pad 5 smd rect (at 2.885 0.6) (size 0.6 0.9) (layers F.Cu F.Paste F.Mask)
      (net 4 +12V))
    (pad 4 smd rect (at -2.835 1.91) (size 0.7 1.15) (layers F.Cu F.Paste F.Mask)
      (net 6 "Net-(Q2-Pad4)") (solder_mask_margin 0.07) (solder_paste_margin -0.05))
    (pad 5 smd rect (at 0.435 0) (size 4.2 3.3) (layers F.Cu F.Paste F.Mask)
      (net 4 +12V) (solder_mask_margin 0.07))
    (pad 5 smd rect (at 2.635 0) (size 4.7 1.55) (layers F.Cu F.Paste F.Mask)
      (net 4 +12V) (solder_mask_margin 0.07))
    (pad 3 smd rect (at -2.835 0.64) (size 0.7 1.15) (layers F.Cu F.Paste F.Mask)
      (net 1 GND) (solder_mask_margin 0.07) (solder_paste_margin -0.05))
    (pad 1 smd rect (at -2.835 -1.91) (size 0.7 1.15) (layers F.Cu F.Paste F.Mask)
      (net 1 GND) (solder_mask_margin 0.07) (solder_paste_margin -0.05))
    (pad 2 smd rect (at -2.835 -0.64) (size 0.7 1.15) (layers F.Cu F.Paste F.Mask)
      (net 1 GND) (solder_mask_margin 0.07) (solder_paste_margin -0.05))
    (pad 5 smd rect (at 2.885 -0.6) (size 0.6 0.9) (layers F.Cu F.Paste F.Mask)
      (net 4 +12V))
    (pad 5 smd rect (at 2.885 1.88) (size 0.6 0.9) (layers F.Cu F.Paste F.Mask)
      (net 4 +12V))
    (pad 5 smd rect (at 2.885 -1.88) (size 0.6 0.9) (layers F.Cu F.Paste F.Mask)
      (net 4 +12V))
    (pad 5 smd rect (at -0.665 0 90) (size 0.6 0.9) (layers F.Cu F.Paste F.Mask)
      (net 4 +12V))
    (pad 5 smd rect (at 1.035 0 90) (size 0.6 0.9) (layers F.Cu F.Paste F.Mask)
      (net 4 +12V))
    (pad 5 smd rect (at 1.035 1.15 90) (size 0.6 0.9) (layers F.Cu F.Paste F.Mask)
      (net 4 +12V))
    (pad 5 smd rect (at -0.665 1.15 90) (size 0.6 0.9) (layers F.Cu F.Paste F.Mask)
      (net 4 +12V))
    (pad 5 smd rect (at 0.185 1.15 90) (size 0.6 0.9) (layers F.Cu F.Paste F.Mask)
      (net 4 +12V))
    (pad 5 smd rect (at 1.035 -1.15 90) (size 0.6 0.9) (layers F.Cu F.Paste F.Mask)
      (net 4 +12V))
    (pad 5 smd rect (at -0.665 -1.15 90) (size 0.6 0.9) (layers F.Cu F.Paste F.Mask)
      (net 4 +12V))
    (pad 5 smd rect (at 0.185 -1.15 90) (size 0.6 0.9) (layers F.Cu F.Paste F.Mask)
      (net 4 +12V))
    (model ${KISYS3DMOD}/TO_SOT_Packages_SMD.3dshapes/SOT-669_LFPAK.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module TO_SOT_Packages_SMD:SOT-669_LFPAK (layer F.Cu) (tedit 5919D982)
    (at 146.812 71.755 90)
    (descr "LFPAK www.nxp.com/documents/leaflet/939775016838_LR.pdf")
    (tags "LFPAK SOT-669 Power-SO8")
    (solder_mask_margin 0.07)
    (solder_paste_margin -0.05)
    (attr smd)
    (fp_text reference Q3 (at -0.245 -3.48 90) (layer F.SilkS) hide)
    (fp_text value PSMN5R2-60YL (at -0.245 3.52 90) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 5 smd rect (at 0.185 -1.15 90) (size 0.6 0.9) (layers F.Cu F.Paste F.Mask)
      (net 4 +12V))
    (pad 5 smd rect (at -0.665 -1.15 90) (size 0.6 0.9) (layers F.Cu F.Paste F.Mask)
      (net 4 +12V))
    (pad 5 smd rect (at 1.035 -1.15 90) (size 0.6 0.9) (layers F.Cu F.Paste F.Mask)
      (net 4 +12V))
    (pad 5 smd rect (at 0.185 1.15 90) (size 0.6 0.9) (layers F.Cu F.Paste F.Mask)
      (net 4 +12V))
    (pad 5 smd rect (at -0.665 1.15 90) (size 0.6 0.9) (layers F.Cu F.Paste F.Mask)
      (net 4 +12V))
    (pad 5 smd rect (at 1.035 1.15 90) (size 0.6 0.9) (layers F.Cu F.Paste F.Mask)
      (net 4 +12V))
    (pad 5 smd rect (at 1.035 0 90) (size 0.6 0.9) (layers F.Cu F.Paste F.Mask)
      (net 4 +12V))
    (pad 5 smd rect (at -0.665 0 90) (size 0.6 0.9) (layers F.Cu F.Paste F.Mask)
      (net 4 +12V))
    (pad 5 smd rect (at 2.885 -1.88) (size 0.6 0.9) (layers F.Cu F.Paste F.Mask)
      (net 4 +12V))
    (pad 5 smd rect (at 2.885 1.88) (size 0.6 0.9) (layers F.Cu F.Paste F.Mask)
      (net 4 +12V))
    (pad 5 smd rect (at 2.885 -0.6) (size 0.6 0.9) (layers F.Cu F.Paste F.Mask)
      (net 4 +12V))
    (pad 2 smd rect (at -2.835 -0.64) (size 0.7 1.15) (layers F.Cu F.Paste F.Mask)
      (net 1 GND) (solder_mask_margin 0.07) (solder_paste_margin -0.05))
    (pad 1 smd rect (at -2.835 -1.91) (size 0.7 1.15) (layers F.Cu F.Paste F.Mask)
      (net 1 GND) (solder_mask_margin 0.07) (solder_paste_margin -0.05))
    (pad 3 smd rect (at -2.835 0.64) (size 0.7 1.15) (layers F.Cu F.Paste F.Mask)
      (net 1 GND) (solder_mask_margin 0.07) (solder_paste_margin -0.05))
    (pad 5 smd rect (at 2.635 0) (size 4.7 1.55) (layers F.Cu F.Paste F.Mask)
      (net 4 +12V) (solder_mask_margin 0.07))
    (pad 5 smd rect (at 0.435 0) (size 4.2 3.3) (layers F.Cu F.Paste F.Mask)
      (net 4 +12V) (solder_mask_margin 0.07))
    (pad 4 smd rect (at -2.835 1.91) (size 0.7 1.15) (layers F.Cu F.Paste F.Mask)
      (net 7 "Net-(Q3-Pad4)") (solder_mask_margin 0.07) (solder_paste_margin -0.05))
    (pad 5 smd rect (at 2.885 0.6) (size 0.6 0.9) (layers F.Cu F.Paste F.Mask)
      (net 4 +12V))
    (pad 5 smd rect (at 0.185 0 90) (size 0.6 0.9) (layers F.Cu F.Paste F.Mask)
      (net 4 +12V))
    (model ${KISYS3DMOD}/TO_SOT_Packages_SMD.3dshapes/SOT-669_LFPAK.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module TO_SOT_Packages_SMD:SOT-669_LFPAK (layer B.Cu) (tedit 5919D982)
    (at 132.08 71.755 90)
    (descr "LFPAK www.nxp.com/documents/leaflet/939775016838_LR.pdf")
    (tags "LFPAK SOT-669 Power-SO8")
    (solder_mask_margin 0.07)
    (solder_paste_margin -0.05)
    (attr smd)
    (fp_text reference Q4 (at -0.245 3.48 270) (layer B.SilkS) hide)
    (fp_text value PSMN5R2-60YL (at -0.245 -3.52 270) (layer B.Fab))
    (fp_text user %R (at 0 0) (layer B.Fab))
    (pad 5 smd rect (at 0.185 0 90) (size 0.6 0.9) (layers B.Cu B.Paste B.Mask)
      (net 4 +12V))
    (pad 5 smd rect (at 2.885 -0.6 180) (size 0.6 0.9) (layers B.Cu B.Paste B.Mask)
      (net 4 +12V))
    (pad 4 smd rect (at -2.835 -1.91 180) (size 0.7 1.15) (layers B.Cu B.Paste B.Mask)
      (net 8 "Net-(Q4-Pad4)") (solder_mask_margin 0.07) (solder_paste_margin -0.05))
    (pad 5 smd rect (at 0.435 0 180) (size 4.2 3.3) (layers B.Cu B.Paste B.Mask)
      (net 4 +12V) (solder_mask_margin 0.07))
    (pad 5 smd rect (at 2.635 0 180) (size 4.7 1.55) (layers B.Cu B.Paste B.Mask)
      (net 4 +12V) (solder_mask_margin 0.07))
    (pad 3 smd rect (at -2.835 -0.64 180) (size 0.7 1.15) (layers B.Cu B.Paste B.Mask)
      (net 1 GND) (solder_mask_margin 0.07) (solder_paste_margin -0.05))
    (pad 1 smd rect (at -2.835 1.91 180) (size 0.7 1.15) (layers B.Cu B.Paste B.Mask)
      (net 1 GND) (solder_mask_margin 0.07) (solder_paste_margin -0.05))
    (pad 2 smd rect (at -2.835 0.64 180) (size 0.7 1.15) (layers B.Cu B.Paste B.Mask)
      (net 1 GND) (solder_mask_margin 0.07) (solder_paste_margin -0.05))
    (pad 5 smd rect (at 2.885 0.6 180) (size 0.6 0.9) (layers B.Cu B.Paste B.Mask)
      (net 4 +12V))
    (pad 5 smd rect (at 2.885 -1.88 180) (size 0.6 0.9) (layers B.Cu B.Paste B.Mask)
      (net 4 +12V))
    (pad 5 smd rect (at 2.885 1.88 180) (size 0.6 0.9) (layers B.Cu B.Paste B.Mask)
      (net 4 +12V))
    (pad 5 smd rect (at -0.665 0 90) (size 0.6 0.9) (layers B.Cu B.Paste B.Mask)
      (net 4 +12V))
    (pad 5 smd rect (at 1.035 0 90) (size 0.6 0.9) (layers B.Cu B.Paste B.Mask)
      (net 4 +12V))
    (pad 5 smd rect (at 1.035 -1.15 90) (size 0.6 0.9) (layers B.Cu B.Paste B.Mask)
      (net 4 +12V))
    (pad 5 smd rect (at -0.665 -1.15 90) (size 0.6 0.9) (layers B.Cu B.Paste B.Mask)
      (net 4 +12V))
    (pad 5 smd rect (at 0.185 -1.15 90) (size 0.6 0.9) (layers B.Cu B.Paste B.Mask)
      (net 4 +12V))
    (pad 5 smd rect (at 1.035 1.15 90) (size 0.6 0.9) (layers B.Cu B.Paste B.Mask)
      (net 4 +12V))
    (pad 5 smd rect (at -0.665 1.15 90) (size 0.6 0.9) (layers B.Cu B.Paste B.Mask)
      (net 4 +12V))
    (pad 5 smd rect (at 0.185 1.15 90) (size 0.6 0.9) (layers B.Cu B.Paste B.Mask)
      (net 4 +12V))
    (model ${KISYS3DMOD}/TO_SOT_Packages_SMD.3dshapes/SOT-669_LFPAK.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module TO_SOT_Packages_SMD:SOT-669_LFPAK (layer B.Cu) (tedit 5919D982)
    (at 139.446 71.755 90)
    (descr "LFPAK www.nxp.com/documents/leaflet/939775016838_LR.pdf")
    (tags "LFPAK SOT-669 Power-SO8")
    (solder_mask_margin 0.07)
    (solder_paste_margin -0.05)
    (attr smd)
    (fp_text reference Q5 (at -0.245 3.48 90) (layer B.SilkS) hide)
    (fp_text value PSMN5R2-60YL (at -0.245 -3.52 90) (layer B.Fab))
    (fp_text user %R (at 0 0 180) (layer B.Fab))
    (pad 5 smd rect (at 0.185 1.15 90) (size 0.6 0.9) (layers B.Cu B.Paste B.Mask)
      (net 4 +12V))
    (pad 5 smd rect (at -0.665 1.15 90) (size 0.6 0.9) (layers B.Cu B.Paste B.Mask)
      (net 4 +12V))
    (pad 5 smd rect (at 1.035 1.15 90) (size 0.6 0.9) (layers B.Cu B.Paste B.Mask)
      (net 4 +12V))
    (pad 5 smd rect (at 0.185 -1.15 90) (size 0.6 0.9) (layers B.Cu B.Paste B.Mask)
      (net 4 +12V))
    (pad 5 smd rect (at -0.665 -1.15 90) (size 0.6 0.9) (layers B.Cu B.Paste B.Mask)
      (net 4 +12V))
    (pad 5 smd rect (at 1.035 -1.15 90) (size 0.6 0.9) (layers B.Cu B.Paste B.Mask)
      (net 4 +12V))
    (pad 5 smd rect (at 1.035 0 90) (size 0.6 0.9) (layers B.Cu B.Paste B.Mask)
      (net 4 +12V))
    (pad 5 smd rect (at -0.665 0 90) (size 0.6 0.9) (layers B.Cu B.Paste B.Mask)
      (net 4 +12V))
    (pad 5 smd rect (at 2.885 1.88 180) (size 0.6 0.9) (layers B.Cu B.Paste B.Mask)
      (net 4 +12V))
    (pad 5 smd rect (at 2.885 -1.88 180) (size 0.6 0.9) (layers B.Cu B.Paste B.Mask)
      (net 4 +12V))
    (pad 5 smd rect (at 2.885 0.6 180) (size 0.6 0.9) (layers B.Cu B.Paste B.Mask)
      (net 4 +12V))
    (pad 2 smd rect (at -2.835 0.64 180) (size 0.7 1.15) (layers B.Cu B.Paste B.Mask)
      (net 1 GND) (solder_mask_margin 0.07) (solder_paste_margin -0.05))
    (pad 1 smd rect (at -2.835 1.91 180) (size 0.7 1.15) (layers B.Cu B.Paste B.Mask)
      (net 1 GND) (solder_mask_margin 0.07) (solder_paste_margin -0.05))
    (pad 3 smd rect (at -2.835 -0.64 180) (size 0.7 1.15) (layers B.Cu B.Paste B.Mask)
      (net 1 GND) (solder_mask_margin 0.07) (solder_paste_margin -0.05))
    (pad 5 smd rect (at 2.635 0 180) (size 4.7 1.55) (layers B.Cu B.Paste B.Mask)
      (net 4 +12V) (solder_mask_margin 0.07))
    (pad 5 smd rect (at 0.435 0 180) (size 4.2 3.3) (layers B.Cu B.Paste B.Mask)
      (net 4 +12V) (solder_mask_margin 0.07))
    (pad 4 smd rect (at -2.835 -1.91 180) (size 0.7 1.15) (layers B.Cu B.Paste B.Mask)
      (net 9 "Net-(Q5-Pad4)") (solder_mask_margin 0.07) (solder_paste_margin -0.05))
    (pad 5 smd rect (at 2.885 -0.6 180) (size 0.6 0.9) (layers B.Cu B.Paste B.Mask)
      (net 4 +12V))
    (pad 5 smd rect (at 0.185 0 90) (size 0.6 0.9) (layers B.Cu B.Paste B.Mask)
      (net 4 +12V))
    (model ${KISYS3DMOD}/TO_SOT_Packages_SMD.3dshapes/SOT-669_LFPAK.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module TO_SOT_Packages_SMD:SOT-669_LFPAK (layer B.Cu) (tedit 5919D982)
    (at 146.812 71.755 90)
    (descr "LFPAK www.nxp.com/documents/leaflet/939775016838_LR.pdf")
    (tags "LFPAK SOT-669 Power-SO8")
    (solder_mask_margin 0.07)
    (solder_paste_margin -0.05)
    (attr smd)
    (fp_text reference Q6 (at -0.245 3.48 270) (layer B.SilkS) hide)
    (fp_text value PSMN5R2-60YL (at -0.245 -3.52 270) (layer B.Fab))
    (fp_text user %R (at 0 0) (layer B.Fab))
    (pad 5 smd rect (at 0.185 0 90) (size 0.6 0.9) (layers B.Cu B.Paste B.Mask)
      (net 4 +12V))
    (pad 5 smd rect (at 2.885 -0.6 180) (size 0.6 0.9) (layers B.Cu B.Paste B.Mask)
      (net 4 +12V))
    (pad 4 smd rect (at -2.835 -1.91 180) (size 0.7 1.15) (layers B.Cu B.Paste B.Mask)
      (net 10 "Net-(Q6-Pad4)") (solder_mask_margin 0.07) (solder_paste_margin -0.05))
    (pad 5 smd rect (at 0.435 0 180) (size 4.2 3.3) (layers B.Cu B.Paste B.Mask)
      (net 4 +12V) (solder_mask_margin 0.07))
    (pad 5 smd rect (at 2.635 0 180) (size 4.7 1.55) (layers B.Cu B.Paste B.Mask)
      (net 4 +12V) (solder_mask_margin 0.07))
    (pad 3 smd rect (at -2.835 -0.64 180) (size 0.7 1.15) (layers B.Cu B.Paste B.Mask)
      (net 1 GND) (solder_mask_margin 0.07) (solder_paste_margin -0.05))
    (pad 1 smd rect (at -2.835 1.91 180) (size 0.7 1.15) (layers B.Cu B.Paste B.Mask)
      (net 1 GND) (solder_mask_margin 0.07) (solder_paste_margin -0.05))
    (pad 2 smd rect (at -2.835 0.64 180) (size 0.7 1.15) (layers B.Cu B.Paste B.Mask)
      (net 1 GND) (solder_mask_margin 0.07) (solder_paste_margin -0.05))
    (pad 5 smd rect (at 2.885 0.6 180) (size 0.6 0.9) (layers B.Cu B.Paste B.Mask)
      (net 4 +12V))
    (pad 5 smd rect (at 2.885 -1.88 180) (size 0.6 0.9) (layers B.Cu B.Paste B.Mask)
      (net 4 +12V))
    (pad 5 smd rect (at 2.885 1.88 180) (size 0.6 0.9) (layers B.Cu B.Paste B.Mask)
      (net 4 +12V))
    (pad 5 smd rect (at -0.665 0 90) (size 0.6 0.9) (layers B.Cu B.Paste B.Mask)
      (net 4 +12V))
    (pad 5 smd rect (at 1.035 0 90) (size 0.6 0.9) (layers B.Cu B.Paste B.Mask)
      (net 4 +12V))
    (pad 5 smd rect (at 1.035 -1.15 90) (size 0.6 0.9) (layers B.Cu B.Paste B.Mask)
      (net 4 +12V))
    (pad 5 smd rect (at -0.665 -1.15 90) (size 0.6 0.9) (layers B.Cu B.Paste B.Mask)
      (net 4 +12V))
    (pad 5 smd rect (at 0.185 -1.15 90) (size 0.6 0.9) (layers B.Cu B.Paste B.Mask)
      (net 4 +12V))
    (pad 5 smd rect (at 1.035 1.15 90) (size 0.6 0.9) (layers B.Cu B.Paste B.Mask)
      (net 4 +12V))
    (pad 5 smd rect (at -0.665 1.15 90) (size 0.6 0.9) (layers B.Cu B.Paste B.Mask)
      (net 4 +12V))
    (pad 5 smd rect (at 0.185 1.15 90) (size 0.6 0.9) (layers B.Cu B.Paste B.Mask)
      (net 4 +12V))
    (model ${KISYS3DMOD}/TO_SOT_Packages_SMD.3dshapes/SOT-669_LFPAK.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistors_SMD:R_0603_HandSoldering (layer F.Cu) (tedit 58E0A804)
    (at 135.763 74.803 270)
    (descr "Resistor SMD 0603, hand soldering")
    (tags "resistor 0603")
    (attr smd)
    (fp_text reference R1 (at 0 -1.45 90) (layer F.SilkS) hide)
    (fp_text value R (at 0 1.55 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd rect (at 1.1 0 270) (size 1.2 0.9) (layers F.Cu F.Paste F.Mask)
      (net 5 "Net-(Q1-Pad4)"))
    (pad 1 smd rect (at -1.1 0 270) (size 1.2 0.9) (layers F.Cu F.Paste F.Mask)
      (net 11 "Net-(R1-Pad1)"))
    (model ${KISYS3DMOD}/Resistors_SMD.3dshapes/R_0603.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistors_SMD:R_0603_HandSoldering (layer F.Cu) (tedit 58E0A804)
    (at 143.129 74.803 270)
    (descr "Resistor SMD 0603, hand soldering")
    (tags "resistor 0603")
    (attr smd)
    (fp_text reference R2 (at 0 -1.45 90) (layer F.SilkS) hide)
    (fp_text value R (at 0 1.55 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 1 smd rect (at -1.1 0 270) (size 1.2 0.9) (layers F.Cu F.Paste F.Mask)
      (net 11 "Net-(R1-Pad1)"))
    (pad 2 smd rect (at 1.1 0 270) (size 1.2 0.9) (layers F.Cu F.Paste F.Mask)
      (net 6 "Net-(Q2-Pad4)"))
    (model ${KISYS3DMOD}/Resistors_SMD.3dshapes/R_0603.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistors_SMD:R_0603_HandSoldering (layer F.Cu) (tedit 58E0A804)
    (at 150.622 72.644 90)
    (descr "Resistor SMD 0603, hand soldering")
    (tags "resistor 0603")
    (attr smd)
    (fp_text reference R3 (at 0 -1.45 90) (layer F.SilkS) hide)
    (fp_text value R (at 0 1.55 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd rect (at 1.1 0 90) (size 1.2 0.9) (layers F.Cu F.Paste F.Mask)
      (net 7 "Net-(Q3-Pad4)"))
    (pad 1 smd rect (at -1.1 0 90) (size 1.2 0.9) (layers F.Cu F.Paste F.Mask)
      (net 11 "Net-(R1-Pad1)"))
    (model ${KISYS3DMOD}/Resistors_SMD.3dshapes/R_0603.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistors_SMD:R_0603_HandSoldering (layer B.Cu) (tedit 58E0A804)
    (at 128.397 74.676 270)
    (descr "Resistor SMD 0603, hand soldering")
    (tags "resistor 0603")
    (attr smd)
    (fp_text reference R4 (at 0 1.45 270) (layer B.SilkS) hide)
    (fp_text value R (at 0 -1.55 270) (layer B.Fab))
    (fp_text user %R (at 0 0 270) (layer B.Fab))
    (pad 2 smd rect (at 1.1 0 270) (size 1.2 0.9) (layers B.Cu B.Paste B.Mask)
      (net 8 "Net-(Q4-Pad4)"))
    (pad 1 smd rect (at -1.1 0 270) (size 1.2 0.9) (layers B.Cu B.Paste B.Mask)
      (net 11 "Net-(R1-Pad1)"))
    (model ${KISYS3DMOD}/Resistors_SMD.3dshapes/R_0603.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistors_SMD:R_0603_HandSoldering (layer B.Cu) (tedit 58E0A804)
    (at 135.763 74.803 270)
    (descr "Resistor SMD 0603, hand soldering")
    (tags "resistor 0603")
    (attr smd)
    (fp_text reference R5 (at 0 1.45 270) (layer B.SilkS) hide)
    (fp_text value R (at 0 -1.55 270) (layer B.Fab))
    (fp_text user %R (at 0 0 270) (layer B.Fab))
    (pad 1 smd rect (at -1.1 0 270) (size 1.2 0.9) (layers B.Cu B.Paste B.Mask)
      (net 11 "Net-(R1-Pad1)"))
    (pad 2 smd rect (at 1.1 0 270) (size 1.2 0.9) (layers B.Cu B.Paste B.Mask)
      (net 9 "Net-(Q5-Pad4)"))
    (model ${KISYS3DMOD}/Resistors_SMD.3dshapes/R_0603.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistors_SMD:R_0603_HandSoldering (layer B.Cu) (tedit 58E0A804)
    (at 143.129 74.803 270)
    (descr "Resistor SMD 0603, hand soldering")
    (tags "resistor 0603")
    (attr smd)
    (fp_text reference R6 (at 0 1.45 270) (layer B.SilkS) hide)
    (fp_text value R (at 0 -1.55 270) (layer B.Fab))
    (fp_text user %R (at 0 0 270) (layer B.Fab))
    (pad 2 smd rect (at 1.1 0 270) (size 1.2 0.9) (layers B.Cu B.Paste B.Mask)
      (net 10 "Net-(Q6-Pad4)"))
    (pad 1 smd rect (at -1.1 0 270) (size 1.2 0.9) (layers B.Cu B.Paste B.Mask)
      (net 11 "Net-(R1-Pad1)"))
    (model ${KISYS3DMOD}/Resistors_SMD.3dshapes/R_0603.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistors_SMD:R_0603_HandSoldering (layer F.Cu) (tedit 58E0A804)
    (at 127.762 69.215 270)
    (descr "Resistor SMD 0603, hand soldering")
    (tags "resistor 0603")
    (attr smd)
    (fp_text reference R7 (at 0 -1.45 90) (layer F.SilkS) hide)
    (fp_text value R (at 0 1.55 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 1 smd rect (at -1.1 0 270) (size 1.2 0.9) (layers F.Cu F.Paste F.Mask)
      (net 4 +12V))
    (pad 2 smd rect (at 1.1 0 270) (size 1.2 0.9) (layers F.Cu F.Paste F.Mask)
      (net 2 "Net-(C1-Pad1)"))
    (model ${KISYS3DMOD}/Resistors_SMD.3dshapes/R_0603.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Housings_SOIC:SOIC-8_3.9x4.9mm_Pitch1.27mm (layer F.Cu) (tedit 58CD0CDA)
    (at 122.936 73.406)
    (descr "8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [SOIC] (see Microchip Packaging Specification 00000049BS.pdf)")
    (tags "SOIC 1.27")
    (attr smd)
    (fp_text reference U1 (at 0 -3.5) (layer F.SilkS) hide)
    (fp_text value MCP1407 (at 0 3.5) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 8 smd rect (at 2.7 -1.905) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 2 "Net-(C1-Pad1)"))
    (pad 7 smd rect (at 2.7 -0.635) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 11 "Net-(R1-Pad1)"))
    (pad 6 smd rect (at 2.7 0.635) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 11 "Net-(R1-Pad1)"))
    (pad 5 smd rect (at 2.7 1.905) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 4 smd rect (at -2.7 1.905) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 3 smd rect (at -2.7 0.635) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 12 "Net-(U1-Pad3)"))
    (pad 2 smd rect (at -2.7 -0.635) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 3 "Net-(J1-Pad2)"))
    (pad 1 smd rect (at -2.7 -1.905) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 2 "Net-(C1-Pad1)"))
    (model ${KISYS3DMOD}/Housings_SOIC.3dshapes/SOIC-8_3.9x4.9mm_Pitch1.27mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module MountingHole:MountingHole_3.2mm_M3 (layer F.Cu) (tedit 56D1B4CB)
    (at 123.19 61.595)
    (descr "Mounting Hole 3.2mm, no annular, M3")
    (tags "mounting hole 3.2mm no annular m3")
    (attr virtual)
    (fp_text reference H1 (at -3.175 0) (layer F.SilkS) hide)
    (fp_text value MountingHole (at 0 4.2) (layer F.Fab))
    (fp_text user %R (at 0.3 0) (layer F.Fab))
    (pad 1 np_thru_hole circle (at 0 0) (size 3.2 3.2) (drill 3.2) (layers *.Cu *.Mask))
  )
  (module MountingHole:MountingHole_3.2mm_M3 (layer F.Cu) (tedit 56D1B4CB)
    (at 123.19 80.645)
    (descr "Mounting Hole 3.2mm, no annular, M3")
    (tags "mounting hole 3.2mm no annular m3")
    (attr virtual)
    (fp_text reference H2 (at -3.175 0) (layer F.SilkS) hide)
    (fp_text value MountingHole (at 0 4.2) (layer F.Fab))
    (fp_text user %R (at 0.3 0) (layer F.Fab))
    (pad 1 np_thru_hole circle (at 0 0) (size 3.2 3.2) (drill 3.2) (layers *.Cu *.Mask))
  )
  (gr_line (start 114.3 57.658) (end 120.65 57.658) (layer Edge.Cuts) (width 0.05))
  (gr_line (start 114.3 84.582) (end 114.3 57.658) (layer Edge.Cuts) (width 0.05))
  (gr_line (start 162.052 84.582) (end 114.3 84.582) (layer Edge.Cuts) (width 0.05))
  (gr_line (start 162.052 57.658) (end 162.052 84.582) (layer Edge.Cuts) (width 0.05))
  (gr_line (start 120.65 57.658) (end 162.052 57.658) (layer Edge.Cuts) (width 0.05))
  (zone (net 4) (net_name +12V) (layer B.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.508))
    (min_thickness 0.254)
    (fill yes (arc_segments 32) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 161.925 70.485) (xy 128.905 70.485) (xy 128.905 65.405) (xy 128.905 57.785) (xy 161.925 57.785)
      )
    )
  )
  (zone (net 4) (net_name +12V) (layer F.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.508))
    (min_thickness 0.254)
    (fill yes (arc_segments 32) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 161.925 70.485) (xy 128.905 70.485) (xy 128.905 65.405) (xy 128.905 57.785) (xy 161.925 57.785)
      )
    )
  )
  (zone (net 1) (net_name GND) (layer F.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.508))
    (min_thickness 0.254)
    (fill yes (arc_segments 32) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 162.052 84.582) (xy 129.54 84.582) (xy 129.54 73.914) (xy 151.892 73.914) (xy 151.892 71.882)
        (xy 162.052 71.882)
      )
    )
  )
  (zone (net 1) (net_name GND) (layer B.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.508))
    (min_thickness 0.254)
    (fill yes (arc_segments 32) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 162.052 84.582) (xy 129.54 84.582) (xy 129.54 73.914) (xy 151.892 73.914) (xy 151.892 71.882)
        (xy 162.052 71.882)
      )
    )
  )
)
