MOSI
VCC
GND
RST
SCK
MISO
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SMD practice
>NAME
1
>NAME
>VALUE
<b>Linear Technology Devices</b><p>
http://www.linear-tech.com<p>
<author>Created by librarian@cadsoft.de</author>
<b>DD Package 8-Lead Plastic DFN (3mm × 3mm)</b><p>
Source: http://cds.linear.com/docs/Datasheet/623012fb.pdf
>NAME
>VALUE
DD Package 8-Lead Plastic DFN (3mm × 3mm)
Source: http://cds.linear.com/docs/Datasheet/623012fb.pdf
<b>AVR Devices</b><p>
Configurable logic, microcontrollers, nonvolatile memories<p>
Based on the following sources:<p>
<ul>
<li>www.atmel.com
<li>CD-ROM : Configurable Logic Microcontroller Nonvolatile Memory
<li>CadSoft download site, www.cadsoft.de or www.cadsoftusa.com , file at90smcu_v400.zip
<li>avr.lbr
</ul>
<author>Revised by librarian@cadsoft.de</author>
<b>HP-VFQFP-N20</b> QFN 20 -5 x 5 mm Micro Lead Frame package (MLF)<p>
Source: http://www.atmel.com/dyn/resources/prod_documents/doc4533.pdf
>NAME
>VALUE
HP-VFQFP-N20 QFN 20 -5 x 5 mm Micro Lead Frame package (MLF)
Source: http://www.atmel.com/dyn/resources/prod_documents/doc4533.pdf
<b>Maxim Components</b><p>
<author>Created by librarian@cadsoft.de</author>
<b>THIN QFN 20</b> 5x5x0.75mm<p>
Source: http://pdfserv.maxim-ic.com/package_dwgs/21-0140.PDF
>NAME
>VALUE
THIN QFN 20 5x5x0.75mm
Source: http://pdfserv.maxim-ic.com/package_dwgs/21-0140.PDF
<b>OSH Park Design Rules</b>
<p>
Please make sure your boards conform to these design rules.
</p>
<p>
Note, that not all DRC settings must be set by the manufacturer. Several can be adjusted for the design, including those listed on our docs page here.
<a href="http://docs.oshpark.com/design-tools/eagle/design-rules-files/">Adjustable Settings</a>
</p>
Since Version 6.2.2 text objects can contain more than one line,
which will not be processed correctly with this version.
Since Version 8.2, EAGLE supports online libraries. The ids
of those online libraries will not be understood (or retained)
with this version.
Since Version 8.3, EAGLE supports URNs for individual library
assets (packages, symbols, and devices). The URNs of those assets
will not be understood (or retained) with this version.
Since Version 8.3, EAGLE supports the association of 3D packages
with devices in libraries, schematics, and board files. Those 3D
packages will not be understood (or retained) with this version.