(kicad_pcb (version 20171130) (host pcbnew 5.0.2+dfsg1-1)
  (general
    (thickness 1.6)
    (drawings 11)
    (tracks 109)
    (zones 0)
    (modules 12)
    (nets 8)
  )
  (page A4)
  (layers
    (0 F.Cu signal hide)
    (31 B.Cu signal hide)
    (32 B.Adhes user)
    (33 F.Adhes user)
    (34 B.Paste user)
    (35 F.Paste user)
    (36 B.SilkS user)
    (37 F.SilkS user)
    (38 B.Mask user)
    (39 F.Mask user)
    (40 Dwgs.User user)
    (41 Cmts.User user)
    (42 Eco1.User user)
    (43 Eco2.User user)
    (44 Edge.Cuts user)
    (45 Margin user)
    (46 B.CrtYd user)
    (47 F.CrtYd user)
    (48 B.Fab user)
    (49 F.Fab user)
  )
  (setup
    (last_trace_width 0.25)
    (user_trace_width 0.5)
    (user_trace_width 0.75)
    (user_trace_width 1)
    (trace_clearance 0.2)
    (zone_clearance 0.508)
    (zone_45_only no)
    (trace_min 0.2)
    (segment_width 0.2)
    (edge_width 0.15)
    (via_size 0.8)
    (via_drill 0.4)
    (via_min_size 0.4)
    (via_min_drill 0.3)
    (user_via 0.6 0.3)
    (uvia_size 0.3)
    (uvia_drill 0.1)
    (uvias_allowed no)
    (uvia_min_size 0.2)
    (uvia_min_drill 0.1)
    (pcb_text_width 0.3)
    (pcb_text_size 1.5 1.5)
    (mod_edge_width 0.15)
    (mod_text_size 1 1)
    (mod_text_width 0.15)
    (pad_size 1.524 1.524)
    (pad_drill 0.762)
    (pad_to_mask_clearance 0.051)
    (solder_mask_min_width 0.25)
    (aux_axis_origin 0 0)
    (visible_elements 7FFFFFFF)
    (pcbplotparams
      (layerselection 0x010fc_ffffffff)
      (usegerberextensions false)
      (usegerberattributes true)
      (usegerberadvancedattributes true)
      (creategerberjobfile false)
      (excludeedgelayer true)
      (linewidth 0.100000)
      (plotframeref false)
      (viasonmask false)
      (mode 1)
      (useauxorigin false)
      (hpglpennumber 1)
      (hpglpenspeed 20)
      (hpglpendiameter 15.000000)
      (psnegative false)
      (psa4output false)
      (plotreference true)
      (plotvalue true)
      (plotinvisibletext false)
      (padsonsilk false)
      (subtractmaskfromsilk false)
      (outputformat 1)
      (mirror false)
      (drillshape 0)
      (scaleselection 1)
      (outputdirectory "Gerber/"))
  )
  (net 0 "")
  (net 1 3V3)
  (net 2 GND)
  (net 3 DOUT)
  (net 4 DOUT_MIC)
  (net 5 CLK_IN)
  (net 6 SELECT_L)
  (net 7 SELECT_R)
  (net_class Default "This is the default net class."
    (clearance 0.2)
    (trace_width 0.25)
    (via_dia 0.8)
    (via_drill 0.4)
    (uvia_dia 0.3)
    (uvia_drill 0.1)
    (add_net 3V3)
    (add_net CLK_IN)
    (add_net DOUT)
    (add_net DOUT_MIC)
    (add_net GND)
    (add_net SELECT_L)
    (add_net SELECT_R)
  )
  (module parts:OSH_5x5 (layer F.Cu) (tedit 0)
    (at 162.433 86.487 270)
    (fp_text reference G*** (at 0 0 270) (layer F.SilkS) hide)
    (fp_text value LOGO (at 0.75 0 270) (layer F.SilkS) hide)
  )
  (module parts:radiona-10mm (layer B.Cu) (tedit 0)
    (at 165.481 80.645 180)
    (fp_text reference G*** (at 0 0) (layer B.SilkS) hide)
    (fp_text value LOGO (at 0.75 0) (layer B.SilkS) hide)
  )
  (module parts:OSH_5x5 (layer B.Cu) (tedit 0)
    (at 162.433 86.487 90)
    (fp_text reference G*** (at 0 0 90) (layer B.SilkS) hide)
    (fp_text value LOGO (at 0.75 0 90) (layer B.SilkS) hide)
  )
  (module parts:shutleworth-12mm (layer B.Cu) (tedit 0)
    (at 164.592 92.837 180)
    (fp_text reference G*** (at 0 0) (layer B.SilkS) hide)
    (fp_text value LOGO (at 0.75 0) (layer B.SilkS) hide)
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 167.259 79.756)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C1 (at 2.625 0 180) (layer F.SilkS))
    (fp_text value 100nF (at -0.275 0 180) (layer F.Fab))
    (fp_text user %R (at 0 0 180) (layer F.Fab))
    (pad 1 smd roundrect (at -0.875 0) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 1 3V3))
    (pad 2 smd roundrect (at 0.875 0) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 2 GND))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 167.259 90.17)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C2 (at 2.525 -0.1 180) (layer F.SilkS))
    (fp_text value 220pF (at -0.075 -0.1 180) (layer F.Fab))
    (fp_text user %R (at 0 0 180) (layer F.Fab))
    (pad 2 smd roundrect (at 0.875 0) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 2 GND))
    (pad 1 smd roundrect (at -0.875 0) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 1 3V3))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBD)
    (at 162.687 82.169 180)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R1 (at 2.54 0) (layer F.SilkS))
    (fp_text value 1K (at 0 0.15) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd roundrect (at 0.875 0 180) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 2 GND))
    (pad 1 smd roundrect (at -0.875 0 180) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 6 SELECT_L))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.step
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBD)
    (at 162.56 90.805 180)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R2 (at 2.525 -0.1 180) (layer F.SilkS))
    (fp_text value 68R (at 0.025 0 180) (layer F.Fab))
    (fp_text user %R (at 0 0 180) (layer F.Fab))
    (pad 1 smd roundrect (at -0.875 0 180) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 4 DOUT_MIC))
    (pad 2 smd roundrect (at 0.875 0 180) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 3 DOUT))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.step
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Connector_PinHeader_2.54mm:PinHeader_1x06_P2.54mm_Horizontal (layer F.Cu) (tedit 59FED5CB)
    (at 156.4 93.05 180)
    (descr "Through hole angled pin header, 1x06, 2.54mm pitch, 6mm pin length, single row")
    (tags "Through hole angled pin header THT 1x06 2.54mm single row")
    (fp_text reference J1 (at 1.8 6.3 270) (layer F.SilkS))
    (fp_text value I2S_PMOD (at 4.385 14.97 180) (layer F.Fab))
    (fp_text user %R (at 2.77 6.35 270) (layer F.Fab))
    (pad 1 thru_hole rect (at 0 0 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 1 3V3))
    (pad 2 thru_hole oval (at 0 2.54 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 2 GND))
    (pad 3 thru_hole oval (at 0 5.08 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 3 DOUT))
    (pad 4 thru_hole oval (at 0 7.62 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 5 CLK_IN))
    (pad 5 thru_hole oval (at 0 10.16 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 6 SELECT_L))
    (pad 6 thru_hole oval (at 0 12.7 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 7 SELECT_R))
    (model ${KISYS3DMOD}/Connector_PinHeader_2.54mm.3dshapes/PinHeader_1x06_P2.54mm_Horizontal.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
    (model ${KISYS3DMOD}/Connector_PinHeader_1.00mm.3dshapes/PinHeader_1x06_P1.00mm_Horizontal.step
      (at (xyz 0 0 0))
      (scale (xyz 2.6 2.6 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module SPH0645LM4H-B:MIC_SPH0645LM4H-B (layer F.Cu) (tedit 0)
    (at 168.402 82.296 90)
    (attr smd)
    (fp_text reference MK1 (at -0.104 1.778 90) (layer F.SilkS))
    (fp_text value SPH0641LU4H (at 0.889 -3.175 90) (layer F.SilkS))
    (pad 2 smd rect (at -0.9 -1.252 90) (size 0.6 0.522) (layers F.Cu F.Paste F.Mask)
      (net 6 SELECT_L))
    (pad 1 smd rect (at -0.9 -2.074 90) (size 0.6 0.522) (layers F.Cu F.Paste F.Mask)
      (net 4 DOUT_MIC))
    (pad 6 smd rect (at 0 -2.074 90) (size 0.6 0.522) (layers F.Cu F.Paste F.Mask))
    (pad 5 smd rect (at 0.9 -2.074 90) (size 0.6 0.522) (layers F.Cu F.Paste F.Mask)
      (net 1 3V3))
    (pad 4 smd rect (at 0.9 -1.252 90) (size 0.6 0.522) (layers F.Cu F.Paste F.Mask)
      (net 5 CLK_IN))
    (pad 3 smd rect (at 0.65 -0.02 90) (size 0.1 0.1) (layers F.Cu F.Paste F.Mask)
      (net 2 GND))
    (pad Hole np_thru_hole circle (at 0 0 90) (size 0.5 0.5) (drill 0.5) (layers *.Cu *.Mask F.SilkS))
    (model /media/internal/FPGA/ulx3s-PMOD/parts/SPH0645LM4H/SPH0645LM4H-B--3DModel-STEP-56544.STEP
      (offset (xyz 0 0.7 0))
      (scale (xyz 1 1 1))
      (rotate (xyz -90 0 180))
    )
  )
  (module SPH0645LM4H-B:MIC_SPH0645LM4H-B (layer F.Cu) (tedit 0)
    (at 168.402 92.71 90)
    (attr smd)
    (fp_text reference MK2 (at -0.09 1.798 90) (layer F.SilkS))
    (fp_text value SPH0641LU4H (at 0.889 -3.175 90) (layer F.SilkS))
    (pad Hole np_thru_hole circle (at 0 0 90) (size 0.5 0.5) (drill 0.5) (layers *.Cu *.Mask F.SilkS))
    (pad 3 smd rect (at 0.65 -0.02 90) (size 0.1 0.1) (layers F.Cu F.Paste F.Mask)
      (net 2 GND))
    (pad 4 smd rect (at 0.9 -1.252 90) (size 0.6 0.522) (layers F.Cu F.Paste F.Mask)
      (net 5 CLK_IN))
    (pad 5 smd rect (at 0.9 -2.074 90) (size 0.6 0.522) (layers F.Cu F.Paste F.Mask)
      (net 1 3V3))
    (pad 6 smd rect (at 0 -2.074 90) (size 0.6 0.522) (layers F.Cu F.Paste F.Mask))
    (pad 1 smd rect (at -0.9 -2.074 90) (size 0.6 0.522) (layers F.Cu F.Paste F.Mask)
      (net 4 DOUT_MIC))
    (pad 2 smd rect (at -0.9 -1.252 90) (size 0.6 0.522) (layers F.Cu F.Paste F.Mask)
      (net 7 SELECT_R))
    (model /media/internal/FPGA/ulx3s-PMOD/parts/SPH0645LM4H/SPH0645LM4H-B--3DModel-STEP-56544.STEP
      (offset (xyz 0 0.7 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 90 180 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBD)
    (at 162.56 92.837 180)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R3 (at 2.54 -0.127) (layer F.SilkS))
    (fp_text value 1K (at 0 0) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 1 smd roundrect (at -0.875 0 180) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 7 SELECT_R))
    (pad 2 smd roundrect (at 0.875 0 180) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 1 3V3))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (gr_circle (center 167.767 86.487) (end 169.164 87.376) (layer Edge.Cuts) (width 0.15))
  (gr_text S_R (at 158.115 80.391 90) (layer B.SilkS))
  (gr_text S_L (at 154.559 82.931 90) (layer B.SilkS))
  (gr_text CLK (at 158.115 85.471 270) (layer B.SilkS))
  (gr_text DOUT (at 154.686 88.138 90) (layer B.SilkS))
  (gr_text GND (at 158.115 90.551 270) (layer B.SilkS))
  (gr_text 3V3 (at 154.559 93.218 90) (layer B.SilkS))
  (gr_line (start 153.67 94.986) (end 153.67 78.5) (layer Edge.Cuts) (width 0.15))
  (gr_line (start 171 95) (end 153.67 94.986) (layer Edge.Cuts) (width 0.15))
  (gr_line (start 171 78.5) (end 171 95) (layer Edge.Cuts) (width 0.15))
  (gr_line (start 153.67 78.5) (end 171 78.5) (layer Edge.Cuts) (width 0.15))
  (zone (net 2) (net_name GND) (layer F.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.508))
    (min_thickness 0.254)
    (fill yes (arc_segments 32) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 153.67 78.486) (xy 170.942 78.486) (xy 170.942 94.996) (xy 153.67 94.996)
      )
    )
  )
  (zone (net 2) (net_name GND) (layer B.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.508))
    (min_thickness 0.254)
    (fill yes (arc_segments 32) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 153.67 78.486) (xy 170.942 78.486) (xy 170.942 94.996) (xy 153.67 94.996)
      )
    )
  )
)
