(kicad_pcb (version 4) (host pcbnew 4.0.2-stable)
  (general
    (links 23)
    (no_connects 0)
    (area 133.369267 106.8526 161.270734 125.805001)
    (thickness 1.6)
    (drawings 4)
    (tracks 45)
    (zones 0)
    (modules 12)
    (nets 12)
  )
  (page A4)
  (title_block
    (title "ADS1015 Breakout Board")
    (date 2016-08-07)
    (rev 1)
  )
  (layers
    (0 F.Cu signal)
    (31 B.Cu signal)
    (34 B.Paste user)
    (35 F.Paste user)
    (36 B.SilkS user)
    (37 F.SilkS user)
    (38 B.Mask user)
    (39 F.Mask user)
    (44 Edge.Cuts user)
  )
  (setup
    (last_trace_width 0.1524)
    (user_trace_width 0.254)
    (user_trace_width 0.508)
    (trace_clearance 0.1524)
    (zone_clearance 0.1524)
    (zone_45_only no)
    (trace_min 0.1524)
    (segment_width 0.2)
    (edge_width 0.15)
    (via_size 0.6858)
    (via_drill 0.3302)
    (via_min_size 0.6858)
    (via_min_drill 0.3302)
    (uvia_size 0.6858)
    (uvia_drill 0.3302)
    (uvias_allowed no)
    (uvia_min_size 0)
    (uvia_min_drill 0)
    (pcb_text_width 0.3)
    (pcb_text_size 1.5 1.5)
    (mod_edge_width 0.15)
    (mod_text_size 1 1)
    (mod_text_width 0.15)
    (pad_size 0.6858 0.6858)
    (pad_drill 0.3302)
    (pad_to_mask_clearance 0.2)
    (aux_axis_origin 0 0)
    (visible_elements 7FFCFFFF)
    (pcbplotparams
      (layerselection 0x010fc_80000001)
      (usegerberextensions true)
      (excludeedgelayer true)
      (linewidth 0.100000)
      (plotframeref false)
      (viasonmask false)
      (mode 1)
      (useauxorigin false)
      (hpglpennumber 1)
      (hpglpenspeed 20)
      (hpglpendiameter 15)
      (hpglpenoverlay 2)
      (psnegative false)
      (psa4output false)
      (plotreference true)
      (plotvalue true)
      (plotinvisibletext false)
      (padsonsilk false)
      (subtractmaskfromsilk false)
      (outputformat 1)
      (mirror false)
      (drillshape 0)
      (scaleselection 1)
      (outputdirectory gerbers))
  )
  (net 0 "")
  (net 1 VDD)
  (net 2 GND)
  (net 3 /ADDR)
  (net 4 /ALERT)
  (net 5 /AIN0)
  (net 6 /AIN1)
  (net 7 /SCL)
  (net 8 /SDA)
  (net 9 /AIN3)
  (net 10 /AIN2)
  (net 11 "Net-(R1-Pad2)")
  (net_class Default "This is the default net class."
    (clearance 0.1524)
    (trace_width 0.1524)
    (via_dia 0.6858)
    (via_drill 0.3302)
    (uvia_dia 0.6858)
    (uvia_drill 0.3302)
    (add_net /ADDR)
    (add_net /AIN0)
    (add_net /AIN1)
    (add_net /AIN2)
    (add_net /AIN3)
    (add_net /ALERT)
    (add_net /SCL)
    (add_net /SDA)
    (add_net GND)
    (add_net "Net-(R1-Pad2)")
    (add_net VDD)
  )
  (module ADS1015_breakout:Via-27mil (layer F.Cu) (tedit 57A7D745)
    (at 152.146 119.126)
    (fp_text reference REF** (at 0 1.27) (layer F.SilkS) hide)
    (fp_text value Via-27mil (at 0 -1.27) (layer F.Fab) hide)
    (pad 1 thru_hole circle (at 0 0) (size 0.6858 0.6858) (drill 0.3302) (layers *.Cu)
      (net 2 GND) (zone_connect 2))
  )
  (module Capacitors_SMD:C_0603 (layer F.Cu) (tedit 57A7C7A4)
    (at 152.4 118.11)
    (descr "Capacitor SMD 0603, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0603")
    (attr smd)
    (fp_text reference C1 (at 0 1.524) (layer F.SilkS))
    (fp_text value 0.1u (at 0 1.9) (layer F.Fab))
    (pad 1 smd rect (at -0.75 0) (size 0.8 0.75) (layers F.Cu F.Paste F.Mask)
      (net 1 VDD))
    (pad 2 smd rect (at 0.75 0) (size 0.8 0.75) (layers F.Cu F.Paste F.Mask)
      (net 2 GND))
    (model Capacitors_SMD.3dshapes/C_0603.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Pin_Headers:Pin_Header_Straight_1x05 (layer B.Cu) (tedit 57A7BD29)
    (at 138.43 113.03 180)
    (descr "Through hole pin header")
    (tags "pin header")
    (fp_text reference P1 (at 0 5.1 180) (layer B.SilkS) hide)
    (fp_text value CONN_01X05 (at 0 3.1 180) (layer B.Fab) hide)
    (pad 1 thru_hole rect (at 0 0 180) (size 2.032 1.7272) (drill 1.016) (layers *.Cu *.Mask B.SilkS)
      (net 3 /ADDR))
    (pad 2 thru_hole oval (at 0 -2.54 180) (size 2.032 1.7272) (drill 1.016) (layers *.Cu *.Mask B.SilkS)
      (net 4 /ALERT))
    (pad 3 thru_hole oval (at 0 -5.08 180) (size 2.032 1.7272) (drill 1.016) (layers *.Cu *.Mask B.SilkS)
      (net 2 GND))
    (pad 4 thru_hole oval (at 0 -7.62 180) (size 2.032 1.7272) (drill 1.016) (layers *.Cu *.Mask B.SilkS)
      (net 5 /AIN0))
    (pad 5 thru_hole oval (at 0 -10.16 180) (size 2.032 1.7272) (drill 1.016) (layers *.Cu *.Mask B.SilkS)
      (net 6 /AIN1))
    (model Pin_Headers.3dshapes/Pin_Header_Straight_1x05.wrl
      (at (xyz 0 -0.2 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 90))
    )
  )
  (module Pin_Headers:Pin_Header_Straight_1x05 (layer B.Cu) (tedit 57A7BD2B)
    (at 156.21 113.03 180)
    (descr "Through hole pin header")
    (tags "pin header")
    (fp_text reference P2 (at 0 5.1 180) (layer B.SilkS) hide)
    (fp_text value CONN_01X05 (at 0 3.1 180) (layer B.Fab) hide)
    (pad 1 thru_hole rect (at 0 0 180) (size 2.032 1.7272) (drill 1.016) (layers *.Cu *.Mask B.SilkS)
      (net 7 /SCL))
    (pad 2 thru_hole oval (at 0 -2.54 180) (size 2.032 1.7272) (drill 1.016) (layers *.Cu *.Mask B.SilkS)
      (net 8 /SDA))
    (pad 3 thru_hole oval (at 0 -5.08 180) (size 2.032 1.7272) (drill 1.016) (layers *.Cu *.Mask B.SilkS)
      (net 1 VDD))
    (pad 4 thru_hole oval (at 0 -7.62 180) (size 2.032 1.7272) (drill 1.016) (layers *.Cu *.Mask B.SilkS)
      (net 9 /AIN3))
    (pad 5 thru_hole oval (at 0 -10.16 180) (size 2.032 1.7272) (drill 1.016) (layers *.Cu *.Mask B.SilkS)
      (net 10 /AIN2))
    (model Pin_Headers.3dshapes/Pin_Header_Straight_1x05.wrl
      (at (xyz 0 -0.2 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 90))
    )
  )
  (module Resistors_SMD:R_0603 (layer F.Cu) (tedit 57A7C74D)
    (at 142.24 115.57)
    (descr "Resistor SMD 0603, reflow soldering, Vishay (see dcrcw.pdf)")
    (tags "resistor 0603")
    (attr smd)
    (fp_text reference R1 (at 0 -1.524) (layer F.SilkS))
    (fp_text value 1k (at 0 1.9) (layer F.Fab))
    (pad 1 smd rect (at -0.75 0) (size 0.5 0.9) (layers F.Cu F.Paste F.Mask)
      (net 3 /ADDR))
    (pad 2 smd rect (at 0.75 0) (size 0.5 0.9) (layers F.Cu F.Paste F.Mask)
      (net 11 "Net-(R1-Pad2)"))
    (model Resistors_SMD.3dshapes/R_0603.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistors_SMD:R_0603 (layer F.Cu) (tedit 57A7C7B0)
    (at 142.24 118.11)
    (descr "Resistor SMD 0603, reflow soldering, Vishay (see dcrcw.pdf)")
    (tags "resistor 0603")
    (attr smd)
    (fp_text reference R2 (at 0 1.524) (layer F.SilkS))
    (fp_text value 1k (at 0 1.9) (layer F.Fab))
    (pad 1 smd rect (at -0.75 0) (size 0.5 0.9) (layers F.Cu F.Paste F.Mask)
      (net 1 VDD))
    (pad 2 smd rect (at 0.75 0) (size 0.5 0.9) (layers F.Cu F.Paste F.Mask)
      (net 4 /ALERT))
    (model Resistors_SMD.3dshapes/R_0603.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistors_SMD:R_0603 (layer F.Cu) (tedit 57A7C7AA)
    (at 152.4 113.792)
    (descr "Resistor SMD 0603, reflow soldering, Vishay (see dcrcw.pdf)")
    (tags "resistor 0603")
    (attr smd)
    (fp_text reference R3 (at 0 -1.524) (layer F.SilkS))
    (fp_text value 1k (at 0 1.9) (layer F.Fab))
    (pad 1 smd rect (at -0.75 0) (size 0.5 0.9) (layers F.Cu F.Paste F.Mask)
      (net 7 /SCL))
    (pad 2 smd rect (at 0.75 0) (size 0.5 0.9) (layers F.Cu F.Paste F.Mask)
      (net 1 VDD))
    (model Resistors_SMD.3dshapes/R_0603.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistors_SMD:R_0603 (layer F.Cu) (tedit 57A7C792)
    (at 152.4 116.84)
    (descr "Resistor SMD 0603, reflow soldering, Vishay (see dcrcw.pdf)")
    (tags "resistor 0603")
    (attr smd)
    (fp_text reference R4 (at 0 -1.524) (layer F.SilkS))
    (fp_text value 1k (at 0 1.9) (layer F.Fab))
    (pad 1 smd rect (at -0.75 0) (size 0.5 0.9) (layers F.Cu F.Paste F.Mask)
      (net 8 /SDA))
    (pad 2 smd rect (at 0.75 0) (size 0.5 0.9) (layers F.Cu F.Paste F.Mask)
      (net 1 VDD))
    (model Resistors_SMD.3dshapes/R_0603.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Housings_SSOP:MSOP-10_3x3mm_Pitch0.5mm (layer F.Cu) (tedit 54130A77)
    (at 147.32 118.11)
    (descr "10-Lead Plastic Micro Small Outline Package (MS) [MSOP] (see Microchip Packaging Specification 00000049BS.pdf)")
    (tags "SSOP 0.5")
    (attr smd)
    (fp_text reference U1 (at 0 -2.6) (layer F.SilkS))
    (fp_text value ADS1015 (at 0 2.6) (layer F.Fab))
    (pad 1 smd rect (at -2.2 -1) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask)
      (net 11 "Net-(R1-Pad2)"))
    (pad 2 smd rect (at -2.2 -0.5) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask)
      (net 4 /ALERT))
    (pad 3 smd rect (at -2.2 0) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask)
      (net 2 GND))
    (pad 4 smd rect (at -2.2 0.5) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask)
      (net 5 /AIN0))
    (pad 5 smd rect (at -2.2 1) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask)
      (net 6 /AIN1))
    (pad 6 smd rect (at 2.2 1) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask)
      (net 10 /AIN2))
    (pad 7 smd rect (at 2.2 0.5) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask)
      (net 9 /AIN3))
    (pad 8 smd rect (at 2.2 0) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask)
      (net 1 VDD))
    (pad 9 smd rect (at 2.2 -0.5) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask)
      (net 8 /SDA))
    (pad 10 smd rect (at 2.2 -1) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask)
      (net 7 /SCL))
    (model Housings_SSOP.3dshapes/MSOP-10_3x3mm_Pitch0.5mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module ADS1015_breakout:Via-27mil (layer F.Cu) (tedit 57A7D755)
    (at 154.178 119.126)
    (fp_text reference REF** (at 0 1.27) (layer F.SilkS) hide)
    (fp_text value Via-27mil (at 0 -1.27) (layer F.Fab) hide)
    (pad 1 thru_hole circle (at 0 0) (size 0.6858 0.6858) (drill 0.3302) (layers *.Cu)
      (net 2 GND) (zone_connect 2))
  )
  (module ADS1015_breakout:Via-27mil (layer F.Cu) (tedit 57A7D75B)
    (at 154.178 118.11)
    (fp_text reference REF** (at 0 1.27) (layer F.SilkS) hide)
    (fp_text value Via-27mil (at 0 -1.27) (layer F.Fab) hide)
    (pad 1 thru_hole circle (at 0 0) (size 0.6858 0.6858) (drill 0.3302) (layers *.Cu)
      (net 2 GND) (zone_connect 2))
  )
  (module ADS1015_breakout:Via-27mil (layer F.Cu) (tedit 57A7D745)
    (at 153.162 119.126)
    (fp_text reference REF** (at 0 1.27) (layer F.SilkS) hide)
    (fp_text value Via-27mil (at 0 -1.27) (layer F.Fab) hide)
    (pad 1 thru_hole circle (at 0 0) (size 0.6858 0.6858) (drill 0.3302) (layers *.Cu)
      (net 2 GND) (zone_connect 2))
  )
  (gr_line (start 135.89 125.73) (end 135.89 110.49) (angle 90) (layer Edge.Cuts) (width 0.15))
  (gr_line (start 158.75 125.73) (end 135.89 125.73) (angle 90) (layer Edge.Cuts) (width 0.15))
  (gr_line (start 158.75 110.49) (end 158.75 125.73) (angle 90) (layer Edge.Cuts) (width 0.15))
  (gr_line (start 135.89 110.49) (end 158.75 110.49) (angle 90) (layer Edge.Cuts) (width 0.15))
  (zone (net 2) (net_name GND) (layer F.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.1524))
    (min_thickness 0.1524)
    (fill yes (arc_segments 16) (thermal_gap 0.1524) (thermal_bridge_width 0.254) (smoothing fillet))
    (polygon
      (pts
        (xy 158.75 125.73) (xy 135.89 125.73) (xy 135.89 110.49) (xy 158.75 110.49) (xy 158.75 125.73)
      )
    )
  )
  (zone (net 2) (net_name GND) (layer B.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.1524))
    (min_thickness 0.1524)
    (fill yes (arc_segments 16) (thermal_gap 0.1524) (thermal_bridge_width 0.254) (smoothing fillet))
    (polygon
      (pts
        (xy 158.75 125.73) (xy 135.89 125.73) (xy 135.89 110.49) (xy 158.75 110.49) (xy 158.75 125.73)
      )
    )
  )
)
