(kicad_pcb (version 20171130) (host pcbnew "(5.1.8)-1")
  (general
    (thickness 1.6)
    (drawings 7)
    (tracks 827)
    (zones 0)
    (modules 83)
    (nets 97)
  )
  (page A4)
  (layers
    (0 F.Cu signal)
    (31 B.Cu signal)
    (32 B.Adhes user hide)
    (33 F.Adhes user hide)
    (34 B.Paste user hide)
    (35 F.Paste user hide)
    (36 B.SilkS user)
    (37 F.SilkS user)
    (38 B.Mask user hide)
    (39 F.Mask user hide)
    (40 Dwgs.User user hide)
    (41 Cmts.User user hide)
    (42 Eco1.User user hide)
    (43 Eco2.User user hide)
    (44 Edge.Cuts user)
    (45 Margin user hide)
    (46 B.CrtYd user hide)
    (47 F.CrtYd user hide)
    (48 B.Fab user hide)
    (49 F.Fab user hide)
  )
  (setup
    (last_trace_width 0.254)
    (user_trace_width 0.254)
    (user_trace_width 0.508)
    (user_trace_width 0.762)
    (trace_clearance 0.1524)
    (zone_clearance 0.1524)
    (zone_45_only no)
    (trace_min 0.1524)
    (via_size 0.6858)
    (via_drill 0.3302)
    (via_min_size 0.508)
    (via_min_drill 0.254)
    (uvia_size 0.6858)
    (uvia_drill 0.3302)
    (uvias_allowed no)
    (uvia_min_size 0.508)
    (uvia_min_drill 0.254)
    (edge_width 0.05)
    (segment_width 0.2)
    (pcb_text_width 0.3)
    (pcb_text_size 1.5 1.5)
    (mod_edge_width 0.12)
    (mod_text_size 1 1)
    (mod_text_width 0.15)
    (pad_size 1.308 1.308)
    (pad_drill 0.8)
    (pad_to_mask_clearance 0.0508)
    (aux_axis_origin 0 0)
    (visible_elements 7FFFFFFF)
    (pcbplotparams
      (layerselection 0x010fc_ffffffff)
      (usegerberextensions false)
      (usegerberattributes true)
      (usegerberadvancedattributes true)
      (creategerberjobfile true)
      (excludeedgelayer true)
      (linewidth 0.100000)
      (plotframeref false)
      (viasonmask false)
      (mode 1)
      (useauxorigin false)
      (hpglpennumber 1)
      (hpglpenspeed 20)
      (hpglpendiameter 15.000000)
      (psnegative false)
      (psa4output false)
      (plotreference true)
      (plotvalue true)
      (plotinvisibletext false)
      (padsonsilk false)
      (subtractmaskfromsilk false)
      (outputformat 1)
      (mirror false)
      (drillshape 1)
      (scaleselection 1)
      (outputdirectory ""))
  )
  (net 0 "")
  (net 1 +BATT)
  (net 2 -BATT)
  (net 3 +5V)
  (net 4 +3V3)
  (net 5 "Net-(MCU1-PadD31)")
  (net 6 "Net-(MCU1-PadD27/A13)")
  (net 7 "Net-(MCU1-PadD26/A12)")
  (net 8 "Net-(MCU1-PadD24/A10)")
  (net 9 "Net-(MCU1-Pad3.3V)")
  (net 10 "Net-(MCU1-Pad3.3V@1)")
  (net 11 "Net-(MCU1-PadD6)")
  (net 12 "Net-(MCU1-PadD5)")
  (net 13 "Net-(MCU1-PadD4)")
  (net 14 "Net-(MCU1-PadD3)")
  (net 15 "Net-(MCU1-PadD2)")
  (net 16 "Net-(MCU1-PadD1)")
  (net 17 "Net-(MCU1-PadD0)")
  (net 18 "Net-(XBEE1-Pad20)")
  (net 19 "Net-(XBEE1-Pad19)")
  (net 20 "Net-(XBEE1-Pad18)")
  (net 21 "Net-(XBEE1-Pad17)")
  (net 22 "Net-(XBEE1-Pad16)")
  (net 23 "Net-(XBEE1-Pad15)")
  (net 24 "Net-(XBEE1-Pad14)")
  (net 25 "Net-(XBEE1-Pad13)")
  (net 26 "Net-(XBEE1-Pad12)")
  (net 27 "Net-(XBEE1-Pad11)")
  (net 28 "Net-(XBEE1-Pad9)")
  (net 29 "Net-(XBEE1-Pad7)")
  (net 30 "Net-(XBEE1-Pad6)")
  (net 31 "Net-(XBEE1-Pad4)")
  (net 32 "Net-(L1-Pad1)")
  (net 33 "Net-(Cff1-Pad2)")
  (net 34 "Net-(R7-Pad2)")
  (net 35 "Net-(L2-Pad1)")
  (net 36 "Net-(Cff2-Pad2)")
  (net 37 "Net-(R9-Pad2)")
  (net 38 "Net-(R8-Pad2)")
  (net 39 "Net-(R6-Pad2)")
  (net 40 SPI_SCLK)
  (net 41 SPI_MOSI)
  (net 42 SPI_MISO)
  (net 43 BMP_INT)
  (net 44 IMU_~RESET)
  (net 45 IMU_INT)
  (net 46 IMU_ADDR_SEL)
  (net 47 I2C_SCL)
  (net 48 I2C_SDA)
  (net 49 XBEE_UART_MISO)
  (net 50 XBEE_UART_MOSI)
  (net 51 XBEE_~RESET)
  (net 52 CAM1_SS)
  (net 53 BMP_ADDR_SEL)
  (net 54 BATT_ADC)
  (net 55 THERM_ADC)
  (net 56 CAM2_SS)
  (net 57 CAM3_SS)
  (net 58 "Net-(R2-Pad2)")
  (net 59 "Net-(R4-Pad2)")
  (net 60 LEVEL1_~SLEEP)
  (net 61 LEVEL1_DIR)
  (net 62 LEVEL1_PWM)
  (net 63 LEVEL2_PWM)
  (net 64 LEVEL2_DIR)
  (net 65 LEVEL2_~SLEEP)
  (net 66 LEVEL3_~SLEEP)
  (net 67 LEVEL3_DIR)
  (net 68 LEVEL3_PWM)
  (net 69 "Net-(CAM1-Pad5)")
  (net 70 "Net-(D1-Pad1)")
  (net 71 "Net-(D1-Pad2)")
  (net 72 "Net-(D2-Pad2)")
  (net 73 USB_PWR)
  (net 74 "Net-(D4-Pad2)")
  (net 75 GPS_UART_MISO)
  (net 76 CAM_PWR)
  (net 77 GYRO_RELEASE)
  (net 78 "Net-(Q3-Pad1)")
  (net 79 "Net-(Q4-Pad1)")
  (net 80 "Net-(BATT1-Pad1)")
  (net 81 "Net-(BMP1-Pad4)")
  (net 82 "Net-(BMP1-Pad9)")
  (net 83 "Net-(BMP1-Pad10)")
  (net 84 "Net-(BMP1-Pad15)")
  (net 85 "Net-(BMP1-Pad16)")
  (net 86 "Net-(BMP1-Pad26)")
  (net 87 "Net-(BMP1-Pad27)")
  (net 88 "Net-(MOTOR1-Pad1)")
  (net 89 "Net-(MOTOR1-Pad2)")
  (net 90 "Net-(MOTOR2-Pad1)")
  (net 91 "Net-(MOTOR2-Pad2)")
  (net 92 "Net-(MOTOR3-Pad1)")
  (net 93 "Net-(MOTOR3-Pad2)")
  (net 94 HOTWIRE)
  (net 95 "Net-(Q5-Pad1)")
  (net 96 "Net-(HOTWIRE1-Pad2)")
  (net_class Default "This is the default net class."
    (clearance 0.1524)
    (trace_width 0.1524)
    (via_dia 0.6858)
    (via_drill 0.3302)
    (uvia_dia 0.6858)
    (uvia_drill 0.3302)
    (diff_pair_width 0.1524)
    (diff_pair_gap 0.1524)
    (add_net +3V3)
    (add_net +5V)
    (add_net +BATT)
    (add_net -BATT)
    (add_net BATT_ADC)
    (add_net BMP_ADDR_SEL)
    (add_net BMP_INT)
    (add_net CAM1_SS)
    (add_net CAM2_SS)
    (add_net CAM3_SS)
    (add_net CAM_PWR)
    (add_net GPS_UART_MISO)
    (add_net GYRO_RELEASE)
    (add_net HOTWIRE)
    (add_net I2C_SCL)
    (add_net I2C_SDA)
    (add_net IMU_ADDR_SEL)
    (add_net IMU_INT)
    (add_net IMU_~RESET)
    (add_net LEVEL1_DIR)
    (add_net LEVEL1_PWM)
    (add_net LEVEL1_~SLEEP)
    (add_net LEVEL2_DIR)
    (add_net LEVEL2_PWM)
    (add_net LEVEL2_~SLEEP)
    (add_net LEVEL3_DIR)
    (add_net LEVEL3_PWM)
    (add_net LEVEL3_~SLEEP)
    (add_net "Net-(BATT1-Pad1)")
    (add_net "Net-(BMP1-Pad10)")
    (add_net "Net-(BMP1-Pad15)")
    (add_net "Net-(BMP1-Pad16)")
    (add_net "Net-(BMP1-Pad26)")
    (add_net "Net-(BMP1-Pad27)")
    (add_net "Net-(BMP1-Pad4)")
    (add_net "Net-(BMP1-Pad9)")
    (add_net "Net-(CAM1-Pad5)")
    (add_net "Net-(Cff1-Pad2)")
    (add_net "Net-(Cff2-Pad2)")
    (add_net "Net-(D1-Pad1)")
    (add_net "Net-(D1-Pad2)")
    (add_net "Net-(D2-Pad2)")
    (add_net "Net-(D4-Pad2)")
    (add_net "Net-(HOTWIRE1-Pad2)")
    (add_net "Net-(L1-Pad1)")
    (add_net "Net-(L2-Pad1)")
    (add_net "Net-(MCU1-Pad3.3V)")
    (add_net "Net-(MCU1-Pad3.3V@1)")
    (add_net "Net-(MCU1-PadD0)")
    (add_net "Net-(MCU1-PadD1)")
    (add_net "Net-(MCU1-PadD2)")
    (add_net "Net-(MCU1-PadD24/A10)")
    (add_net "Net-(MCU1-PadD26/A12)")
    (add_net "Net-(MCU1-PadD27/A13)")
    (add_net "Net-(MCU1-PadD3)")
    (add_net "Net-(MCU1-PadD31)")
    (add_net "Net-(MCU1-PadD4)")
    (add_net "Net-(MCU1-PadD5)")
    (add_net "Net-(MCU1-PadD6)")
    (add_net "Net-(MOTOR1-Pad1)")
    (add_net "Net-(MOTOR1-Pad2)")
    (add_net "Net-(MOTOR2-Pad1)")
    (add_net "Net-(MOTOR2-Pad2)")
    (add_net "Net-(MOTOR3-Pad1)")
    (add_net "Net-(MOTOR3-Pad2)")
    (add_net "Net-(Q3-Pad1)")
    (add_net "Net-(Q4-Pad1)")
    (add_net "Net-(Q5-Pad1)")
    (add_net "Net-(R2-Pad2)")
    (add_net "Net-(R4-Pad2)")
    (add_net "Net-(R6-Pad2)")
    (add_net "Net-(R7-Pad2)")
    (add_net "Net-(R8-Pad2)")
    (add_net "Net-(R9-Pad2)")
    (add_net "Net-(XBEE1-Pad11)")
    (add_net "Net-(XBEE1-Pad12)")
    (add_net "Net-(XBEE1-Pad13)")
    (add_net "Net-(XBEE1-Pad14)")
    (add_net "Net-(XBEE1-Pad15)")
    (add_net "Net-(XBEE1-Pad16)")
    (add_net "Net-(XBEE1-Pad17)")
    (add_net "Net-(XBEE1-Pad18)")
    (add_net "Net-(XBEE1-Pad19)")
    (add_net "Net-(XBEE1-Pad20)")
    (add_net "Net-(XBEE1-Pad4)")
    (add_net "Net-(XBEE1-Pad6)")
    (add_net "Net-(XBEE1-Pad7)")
    (add_net "Net-(XBEE1-Pad9)")
    (add_net SPI_MISO)
    (add_net SPI_MOSI)
    (add_net SPI_SCLK)
    (add_net THERM_ADC)
    (add_net USB_PWR)
    (add_net XBEE_UART_MISO)
    (add_net XBEE_UART_MOSI)
    (add_net XBEE_~RESET)
  )
  (net_class 1A ""
    (clearance 0.1524)
    (trace_width 0.254)
    (via_dia 0.6858)
    (via_drill 0.3302)
    (uvia_dia 0.6858)
    (uvia_drill 0.3302)
    (diff_pair_width 0.1524)
    (diff_pair_gap 0.1524)
  )
  (module Connector_JST:JST_PH_B2B-PH-K_1x02_P2.00mm_Vertical (layer F.Cu) (tedit 5B7745C2)
    (at 108.49204 59.71286 180)
    (descr "JST PH series connector, B2B-PH-K (http://www.jst-mfg.com/product/pdf/eng/ePH.pdf), generated with kicad-footprint-generator")
    (tags "connector JST PH side entry")
    (fp_text reference HOTWIRE (at 1 -2.9) (layer F.SilkS))
    (fp_text value HOTWIRE (at 1 4) (layer F.Fab))
    (fp_text user %R (at 1 1.5) (layer F.Fab))
    (pad 2 thru_hole oval (at 2 0 180) (size 1.2 1.75) (drill 0.75) (layers *.Cu *.Mask)
      (net 96 "Net-(HOTWIRE1-Pad2)"))
    (pad 1 thru_hole roundrect (at 0 0 180) (size 1.2 1.75) (drill 0.75) (layers *.Cu *.Mask) (roundrect_rratio 0.208333)
      (net 1 +BATT))
    (model ${KISYS3DMOD}/Connector_JST.3dshapes/JST_PH_B2B-PH-K_1x02_P2.00mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0402_1005Metric_Pad0.72x0.64mm_HandSolder (layer F.Cu) (tedit 5F6BB9E0)
    (at 112.79064 61.23686)
    (descr "Resistor SMD 0402 (1005 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R34 (at 0.0006 1.23698) (layer F.SilkS))
    (fp_text value 10k (at 0 1.17) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd roundrect (at 0.5975 0) (size 0.715 0.64) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 2 -BATT))
    (pad 1 smd roundrect (at -0.5975 0) (size 0.715 0.64) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 95 "Net-(Q5-Pad1)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0402_1005Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder (layer F.Cu) (tedit 5F68FEEE)
    (at 102.1353 61.1632 180)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R33 (at -0.0489 -1.3843) (layer F.SilkS))
    (fp_text value 220 (at 0 1.43) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd roundrect (at 0.9125 0 180) (size 0.975 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 94 HOTWIRE))
    (pad 1 smd roundrect (at -0.9125 0 180) (size 0.975 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 95 "Net-(Q5-Pad1)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Package_TO_SOT_SMD:SC-59_Handsoldering (layer F.Cu) (tedit 5A0AB732)
    (at 111.34598 54.10708 180)
    (descr "SC-59, hand-soldering varaint, https://lib.chipdip.ru/images/import_diod/original/SOT-23_SC-59.jpg")
    (tags "SC-59 hand-soldering")
    (attr smd)
    (fp_text reference Q5 (at -0.83566 2.52984) (layer F.SilkS))
    (fp_text value Q_NMOS_GSD (at 0 2.5) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 3 smd rect (at 1.65 0 180) (size 1.8 0.8) (layers F.Cu F.Paste F.Mask)
      (net 96 "Net-(HOTWIRE1-Pad2)"))
    (pad 2 smd rect (at -1.65 0.95 180) (size 1.8 0.8) (layers F.Cu F.Paste F.Mask)
      (net 2 -BATT))
    (pad 1 smd rect (at -1.65 -0.95 180) (size 1.8 0.8) (layers F.Cu F.Paste F.Mask)
      (net 95 "Net-(Q5-Pad1)"))
    (model ${KISYS3DMOD}/Package_TO_SOT_SMD.3dshapes/SC-59.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder (layer F.Cu) (tedit 5F68FEEE)
    (at 106.44632 27.70442 90)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R15 (at 0 -1.43 90) (layer F.SilkS))
    (fp_text value 220 (at 0 1.43 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd roundrect (at 0.9125 0 90) (size 0.975 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 77 GYRO_RELEASE))
    (pad 1 smd roundrect (at -0.9125 0 90) (size 0.975 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 78 "Net-(Q3-Pad1)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0402_1005Metric_Pad0.72x0.64mm_HandSolder (layer F.Cu) (tedit 5F6BB9E0)
    (at 96.63684 61.05204 270)
    (descr "Resistor SMD 0402 (1005 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R28 (at 0 -1.17 90) (layer F.SilkS))
    (fp_text value 4.7k (at 0 1.17 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd roundrect (at 0.5975 0 270) (size 0.715 0.64) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 48 I2C_SDA))
    (pad 1 smd roundrect (at -0.5975 0 270) (size 0.715 0.64) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 4 +3V3))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0402_1005Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Connector_JST:JST_PH_B2B-PH-K_1x02_P2.00mm_Vertical (layer F.Cu) (tedit 5B7745C2)
    (at 111.50092 29.25318)
    (descr "JST PH series connector, B2B-PH-K (http://www.jst-mfg.com/product/pdf/eng/ePH.pdf), generated with kicad-footprint-generator")
    (tags "connector JST PH side entry")
    (fp_text reference RELEASE (at 1 -2.9) (layer F.SilkS))
    (fp_text value AUTOGYRO_RELEASE (at 1 4) (layer F.Fab))
    (fp_text user %R (at 1 1.5) (layer F.Fab))
    (pad 2 thru_hole oval (at 2 0) (size 1.2 1.75) (drill 0.75) (layers *.Cu *.Mask)
      (net 74 "Net-(D4-Pad2)"))
    (pad 1 thru_hole roundrect (at 0 0) (size 1.2 1.75) (drill 0.75) (layers *.Cu *.Mask) (roundrect_rratio 0.208333)
      (net 1 +BATT))
    (model ${KISYS3DMOD}/Connector_JST.3dshapes/JST_PH_B2B-PH-K_1x02_P2.00mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Connector_JST:JST_PH_B2B-PH-K_1x02_P2.00mm_Vertical (layer F.Cu) (tedit 5B7745C2)
    (at 45.10786 29.01188)
    (descr "JST PH series connector, B2B-PH-K (http://www.jst-mfg.com/product/pdf/eng/ePH.pdf), generated with kicad-footprint-generator")
    (tags "connector JST PH side entry")
    (fp_text reference BATT (at 1.22936 -2.63652) (layer F.SilkS))
    (fp_text value BATTERIES (at 1 4) (layer F.Fab))
    (fp_text user %R (at 1 1.5) (layer F.Fab))
    (pad 2 thru_hole oval (at 2 0) (size 1.2 1.75) (drill 0.75) (layers *.Cu *.Mask)
      (net 2 -BATT))
    (pad 1 thru_hole roundrect (at 0 0) (size 1.2 1.75) (drill 0.75) (layers *.Cu *.Mask) (roundrect_rratio 0.208333)
      (net 80 "Net-(BATT1-Pad1)"))
    (model ${KISYS3DMOD}/Connector_JST.3dshapes/JST_PH_B2B-PH-K_1x02_P2.00mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module BMP388:PQFN50P200X200X80-10N (layer F.Cu) (tedit 5FE55A1B)
    (at 105.8418 48.89246 180)
    (fp_text reference BNO (at -0.00254 2.23774) (layer F.SilkS))
    (fp_text value BMP388 (at 0 1.775) (layer F.Fab))
    (pad 10 smd rect (at -0.5 -1.025 180) (size 0.3 0.85) (layers F.Cu F.Paste F.Mask)
      (net 4 +3V3))
    (pad 9 smd rect (at 0 -1.025 180) (size 0.3 0.85) (layers F.Cu F.Paste F.Mask)
      (net 2 -BATT))
    (pad 8 smd rect (at 0.5 -1.025 180) (size 0.3 0.85) (layers F.Cu F.Paste F.Mask)
      (net 2 -BATT))
    (pad 7 smd rect (at 1.025 -0.25 180) (size 0.85 0.3) (layers F.Cu F.Paste F.Mask)
      (net 43 BMP_INT))
    (pad 6 smd rect (at 1.025 0.25 180) (size 0.85 0.3) (layers F.Cu F.Paste F.Mask)
      (net 4 +3V3))
    (pad 5 smd rect (at 0.5 1.025 180) (size 0.3 0.85) (layers F.Cu F.Paste F.Mask)
      (net 53 BMP_ADDR_SEL))
    (pad 4 smd rect (at 0 1.025 180) (size 0.3 0.85) (layers F.Cu F.Paste F.Mask)
      (net 48 I2C_SDA))
    (pad 3 smd rect (at -0.5 1.025 180) (size 0.3 0.85) (layers F.Cu F.Paste F.Mask)
      (net 2 -BATT))
    (pad 2 smd rect (at -1.025 0.25 180) (size 0.85 0.3) (layers F.Cu F.Paste F.Mask)
      (net 47 I2C_SCL))
    (pad 1 smd rect (at -1.025 -0.25 180) (size 0.85 0.3) (layers F.Cu F.Paste F.Mask)
      (net 4 +3V3))
  )
  (module Connector_JST:JST_SH_BM03B-SRSS-TB_1x03-1MP_P1.00mm_Vertical (layer F.Cu) (tedit 5B78AD87)
    (at 80.47098 59.61522 180)
    (descr "JST SH series connector, BM03B-SRSS-TB (http://www.jst-mfg.com/product/pdf/eng/eSH.pdf), generated with kicad-footprint-generator")
    (tags "connector JST SH side entry")
    (attr smd)
    (fp_text reference GPS (at 0.0368 -2.87132) (layer F.SilkS))
    (fp_text value GPS_Connector (at 0 3.3) (layer F.Fab))
    (fp_text user %R (at 0 -0.25) (layer F.Fab))
    (pad 1 smd roundrect (at -1 1.325 180) (size 0.6 1.55) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 75 GPS_UART_MISO))
    (pad 2 smd roundrect (at 0 1.325 180) (size 0.6 1.55) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 2 -BATT))
    (pad 3 smd roundrect (at 1 1.325 180) (size 0.6 1.55) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 4 +3V3))
    (pad MP smd roundrect (at -2.3 -1.2 180) (size 1.2 1.8) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.208333))
    (pad MP smd roundrect (at 2.3 -1.2 180) (size 1.2 1.8) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.208333))
    (model ${KISYS3DMOD}/Connector_JST.3dshapes/JST_SH_BM03B-SRSS-TB_1x03-1MP_P1.00mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Connector_JST:JST_SH_BM04B-SRSS-TB_1x04-1MP_P1.00mm_Vertical (layer F.Cu) (tedit 5B78AD87)
    (at 88.9949 59.68634 180)
    (descr "JST SH series connector, BM04B-SRSS-TB (http://www.jst-mfg.com/product/pdf/eng/eSH.pdf), generated with kicad-footprint-generator")
    (tags "connector JST SH side entry")
    (attr smd)
    (fp_text reference RANGE (at 0.00346 -2.83322) (layer F.SilkS))
    (fp_text value QWIIC_Connector (at 0 3.3) (layer F.Fab))
    (fp_text user %R (at 0 -0.25) (layer F.Fab))
    (pad 1 smd roundrect (at -1.5 1.325 180) (size 0.6 1.55) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 2 -BATT))
    (pad 2 smd roundrect (at -0.5 1.325 180) (size 0.6 1.55) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 4 +3V3))
    (pad 3 smd roundrect (at 0.5 1.325 180) (size 0.6 1.55) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 48 I2C_SDA))
    (pad 4 smd roundrect (at 1.5 1.325 180) (size 0.6 1.55) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 47 I2C_SCL))
    (pad MP smd roundrect (at -2.8 -1.2 180) (size 1.2 1.8) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.208333))
    (pad MP smd roundrect (at 2.8 -1.2 180) (size 1.2 1.8) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.208333))
    (model ${KISYS3DMOD}/Connector_JST.3dshapes/JST_SH_BM04B-SRSS-TB_1x04-1MP_P1.00mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module BNO055:LGA28R50P4X10_380X520X100 (layer F.Cu) (tedit 5FE18921)
    (at 99.21748 49.28108)
    (fp_text reference BMP (at -3.9497 -1.0668 90) (layer F.SilkS))
    (fp_text value BNO055 (at 0 3.45) (layer F.Fab))
    (pad 1 smd rect (at -2.25 -1.8) (size 0.3 1) (layers F.Cu F.Paste F.Mask))
    (pad 2 smd rect (at -2.6 -0.75) (size 1 0.3) (layers F.Cu F.Paste F.Mask)
      (net 2 -BATT))
    (pad 3 smd rect (at -2.6 -0.25) (size 1 0.3) (layers F.Cu F.Paste F.Mask)
      (net 4 +3V3))
    (pad 4 smd rect (at -2.6 0.25) (size 1 0.3) (layers F.Cu F.Paste F.Mask)
      (net 81 "Net-(BMP1-Pad4)"))
    (pad 5 smd rect (at -2.6 0.75) (size 1 0.3) (layers F.Cu F.Paste F.Mask)
      (net 2 -BATT))
    (pad 6 smd rect (at -2.25 1.8) (size 0.3 1) (layers F.Cu F.Paste F.Mask)
      (net 2 -BATT))
    (pad 7 smd rect (at -1.75 1.8) (size 0.3 1) (layers F.Cu F.Paste F.Mask))
    (pad 8 smd rect (at -1.25 1.8) (size 0.3 1) (layers F.Cu F.Paste F.Mask))
    (pad 9 smd rect (at -0.75 1.8) (size 0.3 1) (layers F.Cu F.Paste F.Mask)
      (net 82 "Net-(BMP1-Pad9)"))
    (pad 10 smd rect (at -0.25 1.8) (size 0.3 1) (layers F.Cu F.Paste F.Mask)
      (net 83 "Net-(BMP1-Pad10)"))
    (pad 11 smd rect (at 0.25 1.8) (size 0.3 1) (layers F.Cu F.Paste F.Mask)
      (net 44 IMU_~RESET))
    (pad 12 smd rect (at 0.75 1.8) (size 0.3 1) (layers F.Cu F.Paste F.Mask))
    (pad 13 smd rect (at 1.25 1.8) (size 0.3 1) (layers F.Cu F.Paste F.Mask))
    (pad 14 smd rect (at 1.75 1.8) (size 0.3 1) (layers F.Cu F.Paste F.Mask)
      (net 45 IMU_INT))
    (pad 15 smd rect (at 2.25 1.8) (size 0.3 1) (layers F.Cu F.Paste F.Mask)
      (net 84 "Net-(BMP1-Pad15)"))
    (pad 16 smd rect (at 2.6 0.75) (size 1 0.3) (layers F.Cu F.Paste F.Mask)
      (net 85 "Net-(BMP1-Pad16)"))
    (pad 17 smd rect (at 2.6 0.25) (size 1 0.3) (layers F.Cu F.Paste F.Mask)
      (net 46 IMU_ADDR_SEL))
    (pad 18 smd rect (at 2.6 -0.25) (size 1 0.3) (layers F.Cu F.Paste F.Mask)
      (net 2 -BATT))
    (pad 19 smd rect (at 2.6 -0.75) (size 1 0.3) (layers F.Cu F.Paste F.Mask)
      (net 47 I2C_SCL))
    (pad 20 smd rect (at 2.25 -1.8) (size 0.3 1) (layers F.Cu F.Paste F.Mask)
      (net 48 I2C_SDA))
    (pad 21 smd rect (at 1.75 -1.8) (size 0.3 1) (layers F.Cu F.Paste F.Mask))
    (pad 22 smd rect (at 1.25 -1.8) (size 0.3 1) (layers F.Cu F.Paste F.Mask))
    (pad 23 smd rect (at 0.75 -1.8) (size 0.3 1) (layers F.Cu F.Paste F.Mask))
    (pad 24 smd rect (at 0.25 -1.8) (size 0.3 1) (layers F.Cu F.Paste F.Mask))
    (pad 25 smd rect (at -0.25 -1.8) (size 0.3 1) (layers F.Cu F.Paste F.Mask)
      (net 2 -BATT))
    (pad 26 smd rect (at -0.75 -1.8) (size 0.3 1) (layers F.Cu F.Paste F.Mask)
      (net 86 "Net-(BMP1-Pad26)"))
    (pad 27 smd rect (at -1.25 -1.8) (size 0.3 1) (layers F.Cu F.Paste F.Mask)
      (net 87 "Net-(BMP1-Pad27)"))
    (pad 28 smd rect (at -1.75 -1.8) (size 0.3 1) (layers F.Cu F.Paste F.Mask)
      (net 4 +3V3))
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder (layer F.Cu) (tedit 5F68FEEF)
    (at 72.771 27.57306 90)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference Ci1 (at 0.99196 2.19202 180) (layer F.SilkS))
    (fp_text value 10uF (at 0 1.68 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 1 smd roundrect (at -1.0375 0 90) (size 1.175 1.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.212766)
      (net 1 +BATT))
    (pad 2 smd roundrect (at 1.0375 0 90) (size 1.175 1.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.212766)
      (net 2 -BATT))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module CRW_PCB_v1:DRV8838DSGR (layer F.Cu) (tedit 5FE395AD)
    (at 90.12428 34.00806 270)
    (fp_text reference U4 (at 2.56032 0.00762 180) (layer F.SilkS))
    (fp_text value DRV8838DSGR (at 0 2.3 90) (layer F.Fab))
    (pad 1 smd rect (at -1 -0.75 270) (size 0.6 0.25) (layers F.Cu F.Paste F.Mask)
      (net 1 +BATT))
    (pad 2 smd rect (at -1 -0.25 270) (size 0.6 0.25) (layers F.Cu F.Paste F.Mask)
      (net 91 "Net-(MOTOR2-Pad2)"))
    (pad 3 smd rect (at -1 0.25 270) (size 0.6 0.25) (layers F.Cu F.Paste F.Mask)
      (net 90 "Net-(MOTOR2-Pad1)"))
    (pad 4 smd rect (at -1 0.75 270) (size 0.6 0.25) (layers F.Cu F.Paste F.Mask)
      (net 2 -BATT))
    (pad 8 smd rect (at 1 -0.75 270) (size 0.6 0.25) (layers F.Cu F.Paste F.Mask)
      (net 4 +3V3))
    (pad 7 smd rect (at 1 -0.25 270) (size 0.6 0.25) (layers F.Cu F.Paste F.Mask)
      (net 65 LEVEL2_~SLEEP))
    (pad 6 smd rect (at 1 0.25 270) (size 0.6 0.25) (layers F.Cu F.Paste F.Mask)
      (net 64 LEVEL2_DIR))
    (pad 5 smd rect (at 1 0.75 270) (size 0.6 0.25) (layers F.Cu F.Paste F.Mask)
      (net 63 LEVEL2_PWM))
    (pad 9 smd rect (at 0 0 270) (size 0.9 2.6) (layers F.Cu F.Paste F.Mask)
      (net 2 -BATT))
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder (layer F.Cu) (tedit 5F68FEEF)
    (at 101.17328 34.28856 270)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C1 (at 2.30378 0.04064 180) (layer F.SilkS))
    (fp_text value 0.1uF (at 0 1.43 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 1 smd roundrect (at -0.8625 0 270) (size 1.075 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 1 +BATT))
    (pad 2 smd roundrect (at 0.8625 0 270) (size 1.075 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 2 -BATT))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Inductor_SMD:L_Taiyo-Yuden_NR-60xx (layer F.Cu) (tedit 5990349D)
    (at 59.60618 33.14142 270)
    (descr "Inductor, Taiyo Yuden, NR series, Taiyo-Yuden_NR-60xx, 6.0mmx6.0mm")
    (tags "inductor taiyo-yuden nr smd")
    (attr smd)
    (fp_text reference L2 (at 0.03098 -3.97764 270) (layer F.SilkS))
    (fp_text value 10uH (at 0 4.5 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd rect (at 2.35 0 270) (size 1.6 5.9) (layers F.Cu F.Paste F.Mask)
      (net 3 +5V))
    (pad 1 smd rect (at -2.35 0 270) (size 1.6 5.9) (layers F.Cu F.Paste F.Mask)
      (net 35 "Net-(L2-Pad1)"))
    (model ${KISYS3DMOD}/Inductor_SMD.3dshapes/L_Taiyo-Yuden_NR-60xx.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Inductor_SMD:L_Taiyo-Yuden_NR-60xx (layer F.Cu) (tedit 5990349D)
    (at 74.7268 32.97124 270)
    (descr "Inductor, Taiyo Yuden, NR series, Taiyo-Yuden_NR-60xx, 6.0mmx6.0mm")
    (tags "inductor taiyo-yuden nr smd")
    (attr smd)
    (fp_text reference L1 (at -2.1204 -4.19608 90) (layer F.SilkS))
    (fp_text value 10uH (at 0 4.5 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd rect (at 2.35 0 270) (size 1.6 5.9) (layers F.Cu F.Paste F.Mask)
      (net 4 +3V3))
    (pad 1 smd rect (at -2.35 0 270) (size 1.6 5.9) (layers F.Cu F.Paste F.Mask)
      (net 32 "Net-(L1-Pad1)"))
    (model ${KISYS3DMOD}/Inductor_SMD.3dshapes/L_Taiyo-Yuden_NR-60xx.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Diode_SMD:D_SMC (layer F.Cu) (tedit 5864295D)
    (at 108.67538 40.8305)
    (descr "Diode SMC (DO-214AB)")
    (tags "Diode SMC (DO-214AB)")
    (attr smd)
    (fp_text reference D4 (at -6.01112 0.18542) (layer F.SilkS))
    (fp_text value FLYBACK (at 0 4.2) (layer F.Fab))
    (fp_text user %R (at 0 -1.9) (layer F.Fab))
    (pad 2 smd rect (at 3.4 0 90) (size 3.3 2.5) (layers F.Cu F.Paste F.Mask)
      (net 74 "Net-(D4-Pad2)"))
    (pad 1 smd rect (at -3.4 0 90) (size 3.3 2.5) (layers F.Cu F.Paste F.Mask)
      (net 1 +BATT))
    (model ${KISYS3DMOD}/Diode_SMD.3dshapes/D_SMC.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Diode_SMD:D_SMB (layer F.Cu) (tedit 58645DF3)
    (at 31.09098 32.26308 180)
    (descr "Diode SMB (DO-214AA)")
    (tags "Diode SMB (DO-214AA)")
    (attr smd)
    (fp_text reference D3 (at -3.15076 3.24612) (layer F.SilkS))
    (fp_text value D_Schottky (at 0 3.1) (layer F.Fab))
    (fp_text user %R (at 0 -3) (layer F.Fab))
    (pad 2 smd rect (at 2.15 0 180) (size 2.5 2.3) (layers F.Cu F.Paste F.Mask)
      (net 73 USB_PWR))
    (pad 1 smd rect (at -2.15 0 180) (size 2.5 2.3) (layers F.Cu F.Paste F.Mask)
      (net 1 +BATT))
    (model ${KISYS3DMOD}/Diode_SMD.3dshapes/D_SMB.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Diode_SMD:D_SMB (layer F.Cu) (tedit 58645DF3)
    (at 38.83776 28.17622 180)
    (descr "Diode SMB (DO-214AA)")
    (tags "Diode SMB (DO-214AA)")
    (attr smd)
    (fp_text reference D2 (at 4.63412 1.59766) (layer F.SilkS))
    (fp_text value D_Schottky (at 0 3.1) (layer F.Fab))
    (fp_text user %R (at 0 -3) (layer F.Fab))
    (pad 2 smd rect (at 2.15 0 180) (size 2.5 2.3) (layers F.Cu F.Paste F.Mask)
      (net 72 "Net-(D2-Pad2)"))
    (pad 1 smd rect (at -2.15 0 180) (size 2.5 2.3) (layers F.Cu F.Paste F.Mask)
      (net 1 +BATT))
    (model ${KISYS3DMOD}/Diode_SMD.3dshapes/D_SMB.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder (layer F.Cu) (tedit 5F68FEEF)
    (at 103.16464 34.2784 90)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C2 (at -2.323 0.09906 180) (layer F.SilkS))
    (fp_text value 0.1uF (at 0 1.43 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 1 smd roundrect (at -0.8625 0 90) (size 1.075 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 4 +3V3))
    (pad 2 smd roundrect (at 0.8625 0 90) (size 1.075 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 2 -BATT))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder (layer F.Cu) (tedit 5F68FEEF)
    (at 93.22308 34.20728 270)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C3 (at 2.37854 0.16764 180) (layer F.SilkS))
    (fp_text value 0.1uF (at 0 1.43 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd roundrect (at 0.8625 0 270) (size 1.075 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 2 -BATT))
    (pad 1 smd roundrect (at -0.8625 0 270) (size 1.075 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 1 +BATT))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder (layer F.Cu) (tedit 5F68FEEF)
    (at 95.14078 34.20618 90)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C4 (at -2.3865 0.08128 180) (layer F.SilkS))
    (fp_text value 0.1uF (at 0 1.43 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 1 smd roundrect (at -0.8625 0 90) (size 1.075 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 4 +3V3))
    (pad 2 smd roundrect (at 0.8625 0 90) (size 1.075 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 2 -BATT))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder (layer F.Cu) (tedit 5F68FEEF)
    (at 85.27542 34.2022 270)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C5 (at 2.323 0.1651 180) (layer F.SilkS))
    (fp_text value 0.1uF (at 0 1.43 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 1 smd roundrect (at -0.8625 0 270) (size 1.075 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 1 +BATT))
    (pad 2 smd roundrect (at 0.8625 0 270) (size 1.075 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 2 -BATT))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder (layer F.Cu) (tedit 5F68FEEF)
    (at 87.14994 34.16156 90)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C6 (at -2.31284 0.06858 180) (layer F.SilkS))
    (fp_text value 0.1uF (at 0 1.43 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd roundrect (at 0.8625 0 90) (size 1.075 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 2 -BATT))
    (pad 1 smd roundrect (at -0.8625 0 90) (size 1.075 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 4 +3V3))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder (layer F.Cu) (tedit 5F68FEEF)
    (at 109.47654 48.78578 270)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C7 (at 0 -1.43 90) (layer F.SilkS))
    (fp_text value 0.1uF (at 0 1.43 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 1 smd roundrect (at -0.8625 0 270) (size 1.075 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 2 -BATT))
    (pad 2 smd roundrect (at 0.8625 0 270) (size 1.075 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 4 +3V3))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder (layer F.Cu) (tedit 5F68FEEF)
    (at 97.60568 53.1114 180)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C8 (at 0 -1.43) (layer F.SilkS))
    (fp_text value 1uF (at 0 1.43) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 1 smd roundrect (at -0.8625 0 180) (size 1.075 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 82 "Net-(BMP1-Pad9)"))
    (pad 2 smd roundrect (at 0.8625 0 180) (size 1.075 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 2 -BATT))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder (layer F.Cu) (tedit 5F68FEEF)
    (at 105.89006 52.44846 180)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C9 (at 0 -1.43) (layer F.SilkS))
    (fp_text value 0.1uF (at 0 1.43) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd roundrect (at 0.8625 0 180) (size 1.075 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 2 -BATT))
    (pad 1 smd roundrect (at -0.8625 0 180) (size 1.075 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 4 +3V3))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder (layer F.Cu) (tedit 5F68FEEF)
    (at 98.20766 45.4406)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C10 (at 0 -1.43) (layer F.SilkS))
    (fp_text value 120nF (at 0 1.43) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd roundrect (at 0.8625 0) (size 1.075 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 2 -BATT))
    (pad 1 smd roundrect (at -0.8625 0) (size 1.075 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 4 +3V3))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder (layer F.Cu) (tedit 5F68FEEF)
    (at 93.69552 48.18778 90)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C11 (at 0 -1.43 90) (layer F.SilkS))
    (fp_text value 0.1uF (at 0 1.43 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd roundrect (at 0.8625 0 90) (size 1.075 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 2 -BATT))
    (pad 1 smd roundrect (at -0.8625 0 90) (size 1.075 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 4 +3V3))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Connector_JST:JST_SH_BM06B-SRSS-TB_1x06-1MP_P1.00mm_Vertical (layer F.Cu) (tedit 5B78AD87)
    (at 43.6499 59.55284 180)
    (descr "JST SH series connector, BM06B-SRSS-TB (http://www.jst-mfg.com/product/pdf/eng/eSH.pdf), generated with kicad-footprint-generator")
    (tags "connector JST SH side entry")
    (attr smd)
    (fp_text reference CAM1 (at -0.03556 -2.7686) (layer F.SilkS))
    (fp_text value CAMERA (at 0 3.3) (layer F.Fab))
    (fp_text user %R (at 0 -0.25) (layer F.Fab))
    (pad 1 smd roundrect (at -2.5 1.325 180) (size 0.6 1.55) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 52 CAM1_SS))
    (pad 2 smd roundrect (at -1.5 1.325 180) (size 0.6 1.55) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 41 SPI_MOSI))
    (pad 3 smd roundrect (at -0.5 1.325 180) (size 0.6 1.55) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 42 SPI_MISO))
    (pad 4 smd roundrect (at 0.5 1.325 180) (size 0.6 1.55) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 40 SPI_SCLK))
    (pad 5 smd roundrect (at 1.5 1.325 180) (size 0.6 1.55) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 69 "Net-(CAM1-Pad5)"))
    (pad 6 smd roundrect (at 2.5 1.325 180) (size 0.6 1.55) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 3 +5V))
    (pad MP smd roundrect (at -3.8 -1.2 180) (size 1.2 1.8) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.208333))
    (pad MP smd roundrect (at 3.8 -1.2 180) (size 1.2 1.8) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.208333))
    (model ${KISYS3DMOD}/Connector_JST.3dshapes/JST_SH_BM06B-SRSS-TB_1x06-1MP_P1.00mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Connector_JST:JST_SH_BM06B-SRSS-TB_1x06-1MP_P1.00mm_Vertical (layer F.Cu) (tedit 5B78AD87)
    (at 56.3499 59.55284 180)
    (descr "JST SH series connector, BM06B-SRSS-TB (http://www.jst-mfg.com/product/pdf/eng/eSH.pdf), generated with kicad-footprint-generator")
    (tags "connector JST SH side entry")
    (attr smd)
    (fp_text reference CAM2 (at -0.13208 -2.7305) (layer F.SilkS))
    (fp_text value CAMERA (at 0 3.3) (layer F.Fab))
    (fp_text user %R (at 0 -0.25) (layer F.Fab))
    (pad MP smd roundrect (at 3.8 -1.2 180) (size 1.2 1.8) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.208333))
    (pad MP smd roundrect (at -3.8 -1.2 180) (size 1.2 1.8) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.208333))
    (pad 6 smd roundrect (at 2.5 1.325 180) (size 0.6 1.55) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 3 +5V))
    (pad 5 smd roundrect (at 1.5 1.325 180) (size 0.6 1.55) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 69 "Net-(CAM1-Pad5)"))
    (pad 4 smd roundrect (at 0.5 1.325 180) (size 0.6 1.55) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 40 SPI_SCLK))
    (pad 3 smd roundrect (at -0.5 1.325 180) (size 0.6 1.55) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 42 SPI_MISO))
    (pad 2 smd roundrect (at -1.5 1.325 180) (size 0.6 1.55) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 41 SPI_MOSI))
    (pad 1 smd roundrect (at -2.5 1.325 180) (size 0.6 1.55) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 56 CAM2_SS))
    (model ${KISYS3DMOD}/Connector_JST.3dshapes/JST_SH_BM06B-SRSS-TB_1x06-1MP_P1.00mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Connector_JST:JST_SH_BM06B-SRSS-TB_1x06-1MP_P1.00mm_Vertical (layer F.Cu) (tedit 5B78AD87)
    (at 69.0499 59.55284 180)
    (descr "JST SH series connector, BM06B-SRSS-TB (http://www.jst-mfg.com/product/pdf/eng/eSH.pdf), generated with kicad-footprint-generator")
    (tags "connector JST SH side entry")
    (attr smd)
    (fp_text reference CAM3 (at 0.1397 -2.7432) (layer F.SilkS))
    (fp_text value CAMERA (at 0 3.3) (layer F.Fab))
    (fp_text user %R (at 0 -0.25) (layer F.Fab))
    (pad 1 smd roundrect (at -2.5 1.325 180) (size 0.6 1.55) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 57 CAM3_SS))
    (pad 2 smd roundrect (at -1.5 1.325 180) (size 0.6 1.55) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 41 SPI_MOSI))
    (pad 3 smd roundrect (at -0.5 1.325 180) (size 0.6 1.55) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 42 SPI_MISO))
    (pad 4 smd roundrect (at 0.5 1.325 180) (size 0.6 1.55) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 40 SPI_SCLK))
    (pad 5 smd roundrect (at 1.5 1.325 180) (size 0.6 1.55) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 69 "Net-(CAM1-Pad5)"))
    (pad 6 smd roundrect (at 2.5 1.325 180) (size 0.6 1.55) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 3 +5V))
    (pad MP smd roundrect (at -3.8 -1.2 180) (size 1.2 1.8) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.208333))
    (pad MP smd roundrect (at 3.8 -1.2 180) (size 1.2 1.8) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.208333))
    (model ${KISYS3DMOD}/Connector_JST.3dshapes/JST_SH_BM06B-SRSS-TB_1x06-1MP_P1.00mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0402_1005Metric_Pad0.74x0.62mm_HandSolder (layer F.Cu) (tedit 5F6BB22C)
    (at 65.45834 32.66332 90)
    (descr "Capacitor SMD 0402 (1005 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference Cff1 (at -2.5273 0.03048 90) (layer F.SilkS))
    (fp_text value 6.8pF (at 0 1.16 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd roundrect (at 0.5675 0 90) (size 0.735 0.62) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 33 "Net-(Cff1-Pad2)"))
    (pad 1 smd roundrect (at -0.5675 0 90) (size 0.735 0.62) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 4 +3V3))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0402_1005Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0402_1005Metric_Pad0.74x0.62mm_HandSolder (layer F.Cu) (tedit 5F6BB22C)
    (at 50.11674 32.92494 90)
    (descr "Capacitor SMD 0402 (1005 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference Cff2 (at -2.83318 -0.00508 90) (layer F.SilkS))
    (fp_text value 6.8pF (at 0 1.16 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd roundrect (at 0.5675 0 90) (size 0.735 0.62) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 36 "Net-(Cff2-Pad2)"))
    (pad 1 smd roundrect (at -0.5675 0 90) (size 0.735 0.62) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 3 +5V))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0402_1005Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder (layer F.Cu) (tedit 5F68FEEF)
    (at 57.33542 27.7407 90)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference Ci2 (at 1.04276 2.23012 180) (layer F.SilkS))
    (fp_text value 10uF (at 0 1.68 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd roundrect (at 1.0375 0 90) (size 1.175 1.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.212766)
      (net 2 -BATT))
    (pad 1 smd roundrect (at -1.0375 0 90) (size 1.175 1.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.212766)
      (net 1 +BATT))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder (layer F.Cu) (tedit 5F68FEEF)
    (at 76.99756 27.59846 90)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference Co1 (at -0.88764 -2.24536 180) (layer F.SilkS))
    (fp_text value 22uF (at 0 1.68 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd roundrect (at 1.0375 0 90) (size 1.175 1.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.212766)
      (net 2 -BATT))
    (pad 1 smd roundrect (at -1.0375 0 90) (size 1.175 1.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.212766)
      (net 4 +3V3))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder (layer F.Cu) (tedit 5F68FEEF)
    (at 61.86678 27.7407 90)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference Co2 (at -1.02226 -2.27076 180) (layer F.SilkS))
    (fp_text value 22uF (at 0 1.68 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd roundrect (at 1.0375 0 90) (size 1.175 1.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.212766)
      (net 2 -BATT))
    (pad 1 smd roundrect (at -1.0375 0 90) (size 1.175 1.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.212766)
      (net 3 +5V))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Diode_SMD:D_SOD-123 (layer F.Cu) (tedit 58645DC7)
    (at 36.25342 34.64914 90)
    (descr SOD-123)
    (tags SOD-123)
    (attr smd)
    (fp_text reference D1 (at 3.19378 0.11684 180) (layer F.SilkS))
    (fp_text value D_Zener (at 0 2.1 90) (layer F.Fab))
    (fp_text user %R (at 0 -2 90) (layer F.Fab))
    (pad 1 smd rect (at -1.65 0 90) (size 0.9 1.2) (layers F.Cu F.Paste F.Mask)
      (net 70 "Net-(D1-Pad1)"))
    (pad 2 smd rect (at 1.65 0 90) (size 0.9 1.2) (layers F.Cu F.Paste F.Mask)
      (net 71 "Net-(D1-Pad2)"))
    (model ${KISYS3DMOD}/Diode_SMD.3dshapes/D_SOD-123.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Connector_JST:JST_SH_BM02B-SRSS-TB_1x02-1MP_P1.00mm_Vertical (layer F.Cu) (tedit 5B78AD87)
    (at 100.29866 29.521)
    (descr "JST SH series connector, BM02B-SRSS-TB (http://www.jst-mfg.com/product/pdf/eng/eSH.pdf), generated with kicad-footprint-generator")
    (tags "connector JST SH side entry")
    (attr smd)
    (fp_text reference MOTOR1 (at -0.00168 -2.89672) (layer F.SilkS))
    (fp_text value LEVEL1 (at 0 3.3) (layer F.Fab))
    (fp_text user %R (at 0 -0.25) (layer F.Fab))
    (pad 1 smd roundrect (at -0.5 1.325) (size 0.6 1.55) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 88 "Net-(MOTOR1-Pad1)"))
    (pad 2 smd roundrect (at 0.5 1.325) (size 0.6 1.55) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 89 "Net-(MOTOR1-Pad2)"))
    (pad MP smd roundrect (at -1.8 -1.2) (size 1.2 1.8) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.208333))
    (pad MP smd roundrect (at 1.8 -1.2) (size 1.2 1.8) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.208333))
    (model ${KISYS3DMOD}/Connector_JST.3dshapes/JST_SH_BM02B-SRSS-TB_1x02-1MP_P1.00mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Connector_JST:JST_SH_BM02B-SRSS-TB_1x02-1MP_P1.00mm_Vertical (layer F.Cu) (tedit 5B78AD87)
    (at 92.37472 29.46908)
    (descr "JST SH series connector, BM02B-SRSS-TB (http://www.jst-mfg.com/product/pdf/eng/eSH.pdf), generated with kicad-footprint-generator")
    (tags "connector JST SH side entry")
    (attr smd)
    (fp_text reference MOTOR2 (at -0.00254 -2.8448) (layer F.SilkS))
    (fp_text value LEVEL2 (at 0 3.3) (layer F.Fab))
    (fp_text user %R (at 0 -0.25) (layer F.Fab))
    (pad 1 smd roundrect (at -0.5 1.325) (size 0.6 1.55) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 90 "Net-(MOTOR2-Pad1)"))
    (pad 2 smd roundrect (at 0.5 1.325) (size 0.6 1.55) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 91 "Net-(MOTOR2-Pad2)"))
    (pad MP smd roundrect (at -1.8 -1.2) (size 1.2 1.8) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.208333))
    (pad MP smd roundrect (at 1.8 -1.2) (size 1.2 1.8) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.208333))
    (model ${KISYS3DMOD}/Connector_JST.3dshapes/JST_SH_BM02B-SRSS-TB_1x02-1MP_P1.00mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Connector_JST:JST_SH_BM02B-SRSS-TB_1x02-1MP_P1.00mm_Vertical (layer F.Cu) (tedit 5B78AD87)
    (at 84.27974 29.42082)
    (descr "JST SH series connector, BM02B-SRSS-TB (http://www.jst-mfg.com/product/pdf/eng/eSH.pdf), generated with kicad-footprint-generator")
    (tags "connector JST SH side entry")
    (attr smd)
    (fp_text reference MOTOR3 (at 0.08382 -2.91592) (layer F.SilkS))
    (fp_text value LEVEL3 (at 0 3.3) (layer F.Fab))
    (fp_text user %R (at 0 -0.25) (layer F.Fab))
    (pad 1 smd roundrect (at -0.5 1.325) (size 0.6 1.55) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 92 "Net-(MOTOR3-Pad1)"))
    (pad 2 smd roundrect (at 0.5 1.325) (size 0.6 1.55) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 93 "Net-(MOTOR3-Pad2)"))
    (pad MP smd roundrect (at -1.8 -1.2) (size 1.2 1.8) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.208333))
    (pad MP smd roundrect (at 1.8 -1.2) (size 1.2 1.8) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.208333))
    (model ${KISYS3DMOD}/Connector_JST.3dshapes/JST_SH_BM02B-SRSS-TB_1x02-1MP_P1.00mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Package_TO_SOT_SMD:SC-59_Handsoldering (layer F.Cu) (tedit 5A0AB732)
    (at 40.76192 34.6583)
    (descr "SC-59, hand-soldering varaint, https://lib.chipdip.ru/images/import_diod/original/SOT-23_SC-59.jpg")
    (tags "SC-59 hand-soldering")
    (attr smd)
    (fp_text reference Q1 (at 3.8735 0.127) (layer F.SilkS))
    (fp_text value Q_PMOS_GSD (at 0 2.5) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 3 smd rect (at 1.65 0) (size 1.8 0.8) (layers F.Cu F.Paste F.Mask)
      (net 80 "Net-(BATT1-Pad1)"))
    (pad 2 smd rect (at -1.65 0.95) (size 1.8 0.8) (layers F.Cu F.Paste F.Mask)
      (net 70 "Net-(D1-Pad1)"))
    (pad 1 smd rect (at -1.65 -0.95) (size 1.8 0.8) (layers F.Cu F.Paste F.Mask)
      (net 71 "Net-(D1-Pad2)"))
    (model ${KISYS3DMOD}/Package_TO_SOT_SMD.3dshapes/SC-59.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Package_TO_SOT_SMD:SC-59_Handsoldering (layer F.Cu) (tedit 5A0AB732)
    (at 30.31236 27.92476 180)
    (descr "SC-59, hand-soldering varaint, https://lib.chipdip.ru/images/import_diod/original/SOT-23_SC-59.jpg")
    (tags "SC-59 hand-soldering")
    (attr smd)
    (fp_text reference Q2 (at 2.02946 -1.28016) (layer F.SilkS))
    (fp_text value Q_PMOS_GSD (at 0 2.5) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 1 smd rect (at -1.65 -0.95 180) (size 1.8 0.8) (layers F.Cu F.Paste F.Mask)
      (net 73 USB_PWR))
    (pad 2 smd rect (at -1.65 0.95 180) (size 1.8 0.8) (layers F.Cu F.Paste F.Mask)
      (net 70 "Net-(D1-Pad1)"))
    (pad 3 smd rect (at 1.65 0 180) (size 1.8 0.8) (layers F.Cu F.Paste F.Mask)
      (net 72 "Net-(D2-Pad2)"))
    (model ${KISYS3DMOD}/Package_TO_SOT_SMD.3dshapes/SC-59.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Package_TO_SOT_SMD:SC-59_Handsoldering (layer F.Cu) (tedit 5A0AB732)
    (at 110.56012 34.4145)
    (descr "SC-59, hand-soldering varaint, https://lib.chipdip.ru/images/import_diod/original/SOT-23_SC-59.jpg")
    (tags "SC-59 hand-soldering")
    (attr smd)
    (fp_text reference Q3 (at -4.14428 -0.20578) (layer F.SilkS))
    (fp_text value Q_NMOS_GSD (at 0 2.5) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 3 smd rect (at 1.65 0) (size 1.8 0.8) (layers F.Cu F.Paste F.Mask)
      (net 74 "Net-(D4-Pad2)"))
    (pad 2 smd rect (at -1.65 0.95) (size 1.8 0.8) (layers F.Cu F.Paste F.Mask)
      (net 2 -BATT))
    (pad 1 smd rect (at -1.65 -0.95) (size 1.8 0.8) (layers F.Cu F.Paste F.Mask)
      (net 78 "Net-(Q3-Pad1)"))
    (model ${KISYS3DMOD}/Package_TO_SOT_SMD.3dshapes/SC-59.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Package_TO_SOT_SMD:SC-59_Handsoldering (layer F.Cu) (tedit 5A0AB732)
    (at 36.11626 59.24196 90)
    (descr "SC-59, hand-soldering varaint, https://lib.chipdip.ru/images/import_diod/original/SOT-23_SC-59.jpg")
    (tags "SC-59 hand-soldering")
    (attr smd)
    (fp_text reference Q4 (at 1.80494 1.6256 180) (layer F.SilkS))
    (fp_text value Q_NMOS_GSD (at 0 2.5 90) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 1 smd rect (at -1.65 -0.95 90) (size 1.8 0.8) (layers F.Cu F.Paste F.Mask)
      (net 79 "Net-(Q4-Pad1)"))
    (pad 2 smd rect (at -1.65 0.95 90) (size 1.8 0.8) (layers F.Cu F.Paste F.Mask)
      (net 2 -BATT))
    (pad 3 smd rect (at 1.65 0 90) (size 1.8 0.8) (layers F.Cu F.Paste F.Mask)
      (net 69 "Net-(CAM1-Pad5)"))
    (model ${KISYS3DMOD}/Package_TO_SOT_SMD.3dshapes/SC-59.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0402_1005Metric_Pad0.72x0.64mm_HandSolder (layer F.Cu) (tedit 5F6BB9E0)
    (at 39.91042 31.62046 180)
    (descr "Resistor SMD 0402 (1005 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R1 (at -2.25358 -0.0254) (layer F.SilkS))
    (fp_text value 10k (at 0 1.17) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 1 smd roundrect (at -0.5975 0 180) (size 0.715 0.64) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 2 -BATT))
    (pad 2 smd roundrect (at 0.5975 0 180) (size 0.715 0.64) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 71 "Net-(D1-Pad2)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0402_1005Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0402_1005Metric_Pad0.72x0.64mm_HandSolder (layer F.Cu) (tedit 5F6BB9E0)
    (at 67.5767 27.31262)
    (descr "Resistor SMD 0402 (1005 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R2 (at 0.00762 -1.0414) (layer F.SilkS))
    (fp_text value 130k (at 0 1.17) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 1 smd roundrect (at -0.5975 0) (size 0.715 0.64) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 1 +BATT))
    (pad 2 smd roundrect (at 0.5975 0) (size 0.715 0.64) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 58 "Net-(R2-Pad2)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0402_1005Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0402_1005Metric_Pad0.72x0.64mm_HandSolder (layer F.Cu) (tedit 5F6BB9E0)
    (at 69.9776 27.31262)
    (descr "Resistor SMD 0402 (1005 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R3 (at -0.00314 -1.02616) (layer F.SilkS))
    (fp_text value 100k (at 0 1.17) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd roundrect (at 0.5975 0) (size 0.715 0.64) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 2 -BATT))
    (pad 1 smd roundrect (at -0.5975 0) (size 0.715 0.64) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 58 "Net-(R2-Pad2)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0402_1005Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0402_1005Metric_Pad0.72x0.64mm_HandSolder (layer F.Cu) (tedit 5F6BB9E0)
    (at 52.55962 27.52598)
    (descr "Resistor SMD 0402 (1005 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R4 (at 0 -1.17) (layer F.SilkS))
    (fp_text value 130k (at 0 1.17) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 1 smd roundrect (at -0.5975 0) (size 0.715 0.64) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 1 +BATT))
    (pad 2 smd roundrect (at 0.5975 0) (size 0.715 0.64) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 59 "Net-(R4-Pad2)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0402_1005Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0402_1005Metric_Pad0.72x0.64mm_HandSolder (layer F.Cu) (tedit 5F6BB9E0)
    (at 54.97128 27.55138)
    (descr "Resistor SMD 0402 (1005 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R5 (at 0 -1.17) (layer F.SilkS))
    (fp_text value 100k (at 0 1.17) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd roundrect (at 0.5975 0) (size 0.715 0.64) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 2 -BATT))
    (pad 1 smd roundrect (at -0.5975 0) (size 0.715 0.64) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 59 "Net-(R4-Pad2)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0402_1005Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0402_1005Metric_Pad0.72x0.64mm_HandSolder (layer F.Cu) (tedit 5F6BB9E0)
    (at 69.31152 32.67396 90)
    (descr "Resistor SMD 0402 (1005 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R6 (at -2.2612 -0.03302 90) (layer F.SilkS))
    (fp_text value 1M (at 0 1.17 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 1 smd roundrect (at -0.5975 0 90) (size 0.715 0.64) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 4 +3V3))
    (pad 2 smd roundrect (at 0.5975 0 90) (size 0.715 0.64) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 39 "Net-(R6-Pad2)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0402_1005Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0402_1005Metric_Pad0.72x0.64mm_HandSolder (layer F.Cu) (tedit 5F6BB9E0)
    (at 53.79974 32.94126 90)
    (descr "Resistor SMD 0402 (1005 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R7 (at -2.34248 0.127 90) (layer F.SilkS))
    (fp_text value 1M (at 0 1.17 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd roundrect (at 0.5975 0 90) (size 0.715 0.64) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 34 "Net-(R7-Pad2)"))
    (pad 1 smd roundrect (at -0.5975 0 90) (size 0.715 0.64) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 3 +5V))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0402_1005Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0402_1005Metric_Pad0.72x0.64mm_HandSolder (layer F.Cu) (tedit 5F6BB9E0)
    (at 70.64756 32.66126 90)
    (descr "Resistor SMD 0402 (1005 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R8 (at -2.35772 0 90) (layer F.SilkS))
    (fp_text value 1M (at 0 1.17 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd roundrect (at 0.5975 0 90) (size 0.715 0.64) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 38 "Net-(R8-Pad2)"))
    (pad 1 smd roundrect (at -0.5975 0 90) (size 0.715 0.64) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 4 +3V3))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0402_1005Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0402_1005Metric_Pad0.72x0.64mm_HandSolder (layer F.Cu) (tedit 5F6BB9E0)
    (at 55.05958 32.94574 90)
    (descr "Resistor SMD 0402 (1005 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R9 (at -2.33232 0.07366 90) (layer F.SilkS))
    (fp_text value 1M (at 0 1.17 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 1 smd roundrect (at -0.5975 0 90) (size 0.715 0.64) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 3 +5V))
    (pad 2 smd roundrect (at 0.5975 0 90) (size 0.715 0.64) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 37 "Net-(R9-Pad2)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0402_1005Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0402_1005Metric_Pad0.72x0.64mm_HandSolder (layer F.Cu) (tedit 5F6BB9E0)
    (at 26.44648 31.9145 90)
    (descr "Resistor SMD 0402 (1005 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R10 (at -2.67148 0.02286 90) (layer F.SilkS))
    (fp_text value 10k (at 0 1.17 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd roundrect (at 0.5975 0 90) (size 0.715 0.64) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 2 -BATT))
    (pad 1 smd roundrect (at -0.5975 0 90) (size 0.715 0.64) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 73 USB_PWR))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0402_1005Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0402_1005Metric_Pad0.72x0.64mm_HandSolder (layer F.Cu) (tedit 5F6BB9E0)
    (at 66.75628 32.67396 90)
    (descr "Resistor SMD 0402 (1005 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R11 (at -2.54 0 90) (layer F.SilkS))
    (fp_text value 560k (at 0 1.17 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 1 smd roundrect (at -0.5975 0 90) (size 0.715 0.64) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 4 +3V3))
    (pad 2 smd roundrect (at 0.5975 0 90) (size 0.715 0.64) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 33 "Net-(Cff1-Pad2)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0402_1005Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0402_1005Metric_Pad0.72x0.64mm_HandSolder (layer F.Cu) (tedit 5F6BB9E0)
    (at 68.01358 32.66126 270)
    (descr "Resistor SMD 0402 (1005 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R12 (at 2.66252 0.03556 90) (layer F.SilkS))
    (fp_text value 100k (at 0 1.17 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd roundrect (at 0.5975 0 270) (size 0.715 0.64) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 2 -BATT))
    (pad 1 smd roundrect (at -0.5975 0 270) (size 0.715 0.64) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 33 "Net-(Cff1-Pad2)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0402_1005Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0402_1005Metric_Pad0.72x0.64mm_HandSolder (layer F.Cu) (tedit 5F6BB9E0)
    (at 51.3588 32.91018 90)
    (descr "Resistor SMD 0402 (1005 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R13 (at -2.75904 -0.00508 90) (layer F.SilkS))
    (fp_text value 820k (at 0 1.17 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd roundrect (at 0.5975 0 90) (size 0.715 0.64) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 36 "Net-(Cff2-Pad2)"))
    (pad 1 smd roundrect (at -0.5975 0 90) (size 0.715 0.64) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 3 +5V))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0402_1005Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0402_1005Metric_Pad0.72x0.64mm_HandSolder (layer F.Cu) (tedit 5F6BB9E0)
    (at 52.57292 32.91018 270)
    (descr "Resistor SMD 0402 (1005 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R14 (at 2.7807 -0.07112 90) (layer F.SilkS))
    (fp_text value 91k (at 0 1.17 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 1 smd roundrect (at -0.5975 0 270) (size 0.715 0.64) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 36 "Net-(Cff2-Pad2)"))
    (pad 2 smd roundrect (at 0.5975 0 270) (size 0.715 0.64) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 2 -BATT))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0402_1005Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0402_1005Metric_Pad0.72x0.64mm_HandSolder (layer F.Cu) (tedit 5F6BB9E0)
    (at 106.4895 30.8616 270)
    (descr "Resistor SMD 0402 (1005 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R16 (at -0.05394 1.14046 90) (layer F.SilkS))
    (fp_text value 10k (at 0 1.17 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 1 smd roundrect (at -0.5975 0 270) (size 0.715 0.64) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 78 "Net-(Q3-Pad1)"))
    (pad 2 smd roundrect (at 0.5975 0 270) (size 0.715 0.64) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 2 -BATT))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0402_1005Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0402_1005Metric_Pad0.72x0.64mm_HandSolder (layer F.Cu) (tedit 5F6BB9E0)
    (at 90.88822 39.27856)
    (descr "Resistor SMD 0402 (1005 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R17 (at 2.81118 0.04826) (layer F.SilkS))
    (fp_text value 10k (at 0 1.17) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd roundrect (at 0.5975 0) (size 0.715 0.64) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 4 +3V3))
    (pad 1 smd roundrect (at -0.5975 0) (size 0.715 0.64) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 60 LEVEL1_~SLEEP))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0402_1005Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0402_1005Metric_Pad0.72x0.64mm_HandSolder (layer F.Cu) (tedit 5F6BB9E0)
    (at 90.91362 40.6527)
    (descr "Resistor SMD 0402 (1005 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R18 (at 2.80864 0.00254) (layer F.SilkS))
    (fp_text value 10k (at 0 1.17) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 1 smd roundrect (at -0.5975 0) (size 0.715 0.64) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 65 LEVEL2_~SLEEP))
    (pad 2 smd roundrect (at 0.5975 0) (size 0.715 0.64) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 4 +3V3))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0402_1005Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0402_1005Metric_Pad0.72x0.64mm_HandSolder (layer F.Cu) (tedit 5F6BB9E0)
    (at 49.1998 59.46588 270)
    (descr "Resistor SMD 0402 (1005 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R19 (at 0 -1.17 90) (layer F.SilkS))
    (fp_text value 4.7k (at 0 1.17 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd roundrect (at 0.5975 0 270) (size 0.715 0.64) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 4 +3V3))
    (pad 1 smd roundrect (at -0.5975 0 270) (size 0.715 0.64) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 52 CAM1_SS))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0402_1005Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0402_1005Metric_Pad0.72x0.64mm_HandSolder (layer F.Cu) (tedit 5F6BB9E0)
    (at 62.07252 59.7414 270)
    (descr "Resistor SMD 0402 (1005 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R20 (at 0 -1.17 90) (layer F.SilkS))
    (fp_text value 4.7k (at 0 1.17 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd roundrect (at 0.5975 0 270) (size 0.715 0.64) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 4 +3V3))
    (pad 1 smd roundrect (at -0.5975 0 270) (size 0.715 0.64) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 56 CAM2_SS))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0402_1005Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0402_1005Metric_Pad0.72x0.64mm_HandSolder (layer F.Cu) (tedit 5F6BB9E0)
    (at 74.72426 59.79354 270)
    (descr "Resistor SMD 0402 (1005 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R21 (at 0 -1.17 90) (layer F.SilkS))
    (fp_text value 4.7k (at 0 1.17 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 1 smd roundrect (at -0.5975 0 270) (size 0.715 0.64) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 57 CAM3_SS))
    (pad 2 smd roundrect (at 0.5975 0 270) (size 0.715 0.64) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 4 +3V3))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0402_1005Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0402_1005Metric_Pad0.72x0.64mm_HandSolder (layer F.Cu) (tedit 5F6BB9E0)
    (at 90.95426 41.92778)
    (descr "Resistor SMD 0402 (1005 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R22 (at 2.73752 0.01016) (layer F.SilkS))
    (fp_text value 10k (at 0 1.17) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 1 smd roundrect (at -0.5975 0) (size 0.715 0.64) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 66 LEVEL3_~SLEEP))
    (pad 2 smd roundrect (at 0.5975 0) (size 0.715 0.64) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 4 +3V3))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0402_1005Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder (layer F.Cu) (tedit 5F68FEEE)
    (at 33.36798 57.7069 90)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R23 (at 0 -1.43 90) (layer F.SilkS))
    (fp_text value 220 (at 0 1.43 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 1 smd roundrect (at -0.9125 0 90) (size 0.975 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 79 "Net-(Q4-Pad1)"))
    (pad 2 smd roundrect (at 0.9125 0 90) (size 0.975 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 76 CAM_PWR))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0402_1005Metric_Pad0.72x0.64mm_HandSolder (layer F.Cu) (tedit 5F6BB9E0)
    (at 94.09684 61.03306 270)
    (descr "Resistor SMD 0402 (1005 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R24 (at 0 -1.17 90) (layer F.SilkS))
    (fp_text value 4.7k (at 0 1.17 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 1 smd roundrect (at -0.5975 0 270) (size 0.715 0.64) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 4 +3V3))
    (pad 2 smd roundrect (at 0.5975 0 270) (size 0.715 0.64) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 47 I2C_SCL))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0402_1005Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0402_1005Metric_Pad0.72x0.64mm_HandSolder (layer F.Cu) (tedit 5F6BB9E0)
    (at 29.53004 58.09936 270)
    (descr "Resistor SMD 0402 (1005 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R25 (at 2.53686 -0.0381 90) (layer F.SilkS))
    (fp_text value 47k (at 0 1.17 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 1 smd roundrect (at -0.5975 0 270) (size 0.715 0.64) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 4 +3V3))
    (pad 2 smd roundrect (at 0.5975 0 270) (size 0.715 0.64) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 55 THERM_ADC))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0402_1005Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0402_1005Metric_Pad0.72x0.64mm_HandSolder (layer F.Cu) (tedit 5F6BB9E0)
    (at 33.3629 61.02036 270)
    (descr "Resistor SMD 0402 (1005 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R26 (at 0.03616 1.41986 90) (layer F.SilkS))
    (fp_text value 10k (at -0.07814 -1.2065 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 1 smd roundrect (at -0.5975 0 270) (size 0.715 0.64) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 79 "Net-(Q4-Pad1)"))
    (pad 2 smd roundrect (at 0.5975 0 270) (size 0.715 0.64) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 2 -BATT))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0402_1005Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0402_1005Metric_Pad0.72x0.64mm_HandSolder (layer F.Cu) (tedit 5F6BB9E0)
    (at 93.62948 51.41782 270)
    (descr "Resistor SMD 0402 (1005 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R29 (at 0 -1.17 90) (layer F.SilkS))
    (fp_text value 10k (at 0 1.17 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 1 smd roundrect (at -0.5975 0 270) (size 0.715 0.64) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 4 +3V3))
    (pad 2 smd roundrect (at 0.5975 0 270) (size 0.715 0.64) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 81 "Net-(BMP1-Pad4)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0402_1005Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0402_1005Metric_Pad0.72x0.64mm_HandSolder (layer F.Cu) (tedit 5F6BB9E0)
    (at 32.02492 36.57092 180)
    (descr "Resistor SMD 0402 (1005 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R30 (at -0.08188 1.2827) (layer F.SilkS))
    (fp_text value 100k (at 0 1.17) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd roundrect (at 0.5975 0 180) (size 0.715 0.64) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 54 BATT_ADC))
    (pad 1 smd roundrect (at -0.5975 0 180) (size 0.715 0.64) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 1 +BATT))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0402_1005Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0402_1005Metric_Pad0.72x0.64mm_HandSolder (layer F.Cu) (tedit 5F6BB9E0)
    (at 28.67974 36.58616 180)
    (descr "Resistor SMD 0402 (1005 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R31 (at 0.02226 1.3081) (layer F.SilkS))
    (fp_text value 47k (at 0 1.17) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd roundrect (at 0.5975 0 180) (size 0.715 0.64) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 2 -BATT))
    (pad 1 smd roundrect (at -0.5975 0 180) (size 0.715 0.64) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 54 BATT_ADC))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0402_1005Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0402_1005Metric_Pad0.72x0.64mm_HandSolder (layer F.Cu) (tedit 5F6BB9E0)
    (at 100.94916 53.86832)
    (descr "Resistor SMD 0402 (1005 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R32 (at 0 -1.17) (layer F.SilkS))
    (fp_text value 10k (at 0 1.17) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd roundrect (at 0.5975 0) (size 0.715 0.64) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 44 IMU_~RESET))
    (pad 1 smd roundrect (at -0.5975 0) (size 0.715 0.64) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 4 +3V3))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0402_1005Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_THT:R_Axial_DIN0204_L3.6mm_D1.6mm_P2.54mm_Vertical (layer F.Cu) (tedit 5AE5139B)
    (at 27.35072 56.96204 270)
    (descr "Resistor, Axial_DIN0204 series, Axial, Vertical, pin pitch=2.54mm, 0.167W, length*diameter=3.6*1.6mm^2, http://cdn-reichelt.de/documents/datenblatt/B400/1_4W%23YAG.pdf")
    (tags "Resistor Axial_DIN0204 series Axial Vertical pin pitch 2.54mm 0.167W length 3.6mm diameter 1.6mm")
    (fp_text reference TH1 (at 4.5466 0.00508 90) (layer F.SilkS))
    (fp_text value Thermistor (at 1.27 1.92 90) (layer F.Fab))
    (fp_text user %R (at 1.27 -1.92 90) (layer F.Fab))
    (pad 1 thru_hole circle (at 0 0 270) (size 1.4 1.4) (drill 0.7) (layers *.Cu *.Mask)
      (net 2 -BATT))
    (pad 2 thru_hole oval (at 2.54 0 270) (size 1.4 1.4) (drill 0.7) (layers *.Cu *.Mask)
      (net 55 THERM_ADC))
    (model ${KISYS3DMOD}/Resistor_THT.3dshapes/R_Axial_DIN0204_L3.6mm_D1.6mm_P2.54mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module CRW_PCB_v1:TPS62051DGS_VSSOP (layer F.Cu) (tedit 5FE0099B)
    (at 68.09994 29.66466)
    (fp_text reference U1 (at -2.81178 -2.58572) (layer F.SilkS))
    (fp_text value TPS62051DGS (at -0.05 2.6) (layer F.Fab))
    (pad 6 smd rect (at 2.2 1) (size 1.45 0.3) (layers F.Cu F.Paste F.Mask)
      (net 58 "Net-(R2-Pad2)"))
    (pad 10 smd rect (at 2.2 -1) (size 1.45 0.3) (layers F.Cu F.Paste F.Mask)
      (net 2 -BATT))
    (pad 9 smd rect (at 2.2 -0.5) (size 1.45 0.3) (layers F.Cu F.Paste F.Mask)
      (net 32 "Net-(L1-Pad1)"))
    (pad 8 smd rect (at 2.2 0) (size 1.45 0.3) (layers F.Cu F.Paste F.Mask)
      (net 1 +BATT))
    (pad 7 smd rect (at 2.2 0.5) (size 1.45 0.3) (layers F.Cu F.Paste F.Mask)
      (net 2 -BATT))
    (pad 5 smd rect (at -2.2 1) (size 1.45 0.3) (layers F.Cu F.Paste F.Mask)
      (net 33 "Net-(Cff1-Pad2)"))
    (pad 4 smd rect (at -2.2 0.5) (size 1.45 0.3) (layers F.Cu F.Paste F.Mask)
      (net 39 "Net-(R6-Pad2)"))
    (pad 2 smd rect (at -2.2 -0.5) (size 1.45 0.3) (layers F.Cu F.Paste F.Mask)
      (net 38 "Net-(R8-Pad2)"))
    (pad 3 smd rect (at -2.2 0) (size 1.45 0.3) (layers F.Cu F.Paste F.Mask)
      (net 2 -BATT))
    (pad 1 smd rect (at -2.2 -1) (size 1.45 0.3) (layers F.Cu F.Paste F.Mask)
      (net 1 +BATT))
  )
  (module CRW_PCB_v1:TPS62051DGS_VSSOP (layer F.Cu) (tedit 5FE0099B)
    (at 52.8193 29.93136)
    (fp_text reference U2 (at -2.41808 -2.37998) (layer F.SilkS))
    (fp_text value TPS62051DGS (at -0.05 2.6) (layer F.Fab))
    (pad 1 smd rect (at -2.2 -1) (size 1.45 0.3) (layers F.Cu F.Paste F.Mask)
      (net 1 +BATT))
    (pad 3 smd rect (at -2.2 0) (size 1.45 0.3) (layers F.Cu F.Paste F.Mask)
      (net 2 -BATT))
    (pad 2 smd rect (at -2.2 -0.5) (size 1.45 0.3) (layers F.Cu F.Paste F.Mask)
      (net 37 "Net-(R9-Pad2)"))
    (pad 4 smd rect (at -2.2 0.5) (size 1.45 0.3) (layers F.Cu F.Paste F.Mask)
      (net 34 "Net-(R7-Pad2)"))
    (pad 5 smd rect (at -2.2 1) (size 1.45 0.3) (layers F.Cu F.Paste F.Mask)
      (net 36 "Net-(Cff2-Pad2)"))
    (pad 7 smd rect (at 2.2 0.5) (size 1.45 0.3) (layers F.Cu F.Paste F.Mask)
      (net 2 -BATT))
    (pad 8 smd rect (at 2.2 0) (size 1.45 0.3) (layers F.Cu F.Paste F.Mask)
      (net 1 +BATT))
    (pad 9 smd rect (at 2.2 -0.5) (size 1.45 0.3) (layers F.Cu F.Paste F.Mask)
      (net 35 "Net-(L2-Pad1)"))
    (pad 10 smd rect (at 2.2 -1) (size 1.45 0.3) (layers F.Cu F.Paste F.Mask)
      (net 2 -BATT))
    (pad 6 smd rect (at 2.2 1) (size 1.45 0.3) (layers F.Cu F.Paste F.Mask)
      (net 59 "Net-(R4-Pad2)"))
  )
  (module CRW_PCB_v1:DRV8838DSGR (layer F.Cu) (tedit 5FE395AD)
    (at 98.11512 34.05632 270)
    (fp_text reference U3 (at 2.5019 0.0254 180) (layer F.SilkS))
    (fp_text value DRV8838DSGR (at 0 2.3 90) (layer F.Fab))
    (pad 9 smd rect (at 0 0 270) (size 0.9 2.6) (layers F.Cu F.Paste F.Mask)
      (net 2 -BATT))
    (pad 5 smd rect (at 1 0.75 270) (size 0.6 0.25) (layers F.Cu F.Paste F.Mask)
      (net 62 LEVEL1_PWM))
    (pad 6 smd rect (at 1 0.25 270) (size 0.6 0.25) (layers F.Cu F.Paste F.Mask)
      (net 61 LEVEL1_DIR))
    (pad 7 smd rect (at 1 -0.25 270) (size 0.6 0.25) (layers F.Cu F.Paste F.Mask)
      (net 60 LEVEL1_~SLEEP))
    (pad 8 smd rect (at 1 -0.75 270) (size 0.6 0.25) (layers F.Cu F.Paste F.Mask)
      (net 4 +3V3))
    (pad 4 smd rect (at -1 0.75 270) (size 0.6 0.25) (layers F.Cu F.Paste F.Mask)
      (net 2 -BATT))
    (pad 3 smd rect (at -1 0.25 270) (size 0.6 0.25) (layers F.Cu F.Paste F.Mask)
      (net 88 "Net-(MOTOR1-Pad1)"))
    (pad 2 smd rect (at -1 -0.25 270) (size 0.6 0.25) (layers F.Cu F.Paste F.Mask)
      (net 89 "Net-(MOTOR1-Pad2)"))
    (pad 1 smd rect (at -1 -0.75 270) (size 0.6 0.25) (layers F.Cu F.Paste F.Mask)
      (net 1 +BATT))
  )
  (module CRW_PCB_v1:DRV8838DSGR (layer F.Cu) (tedit 5FE395AD)
    (at 82.08772 33.97504 270)
    (fp_text reference U5 (at 2.48158 0.0254) (layer F.SilkS))
    (fp_text value DRV8838DSGR (at 0 2.3 90) (layer F.Fab))
    (pad 1 smd rect (at -1 -0.75 270) (size 0.6 0.25) (layers F.Cu F.Paste F.Mask)
      (net 1 +BATT))
    (pad 2 smd rect (at -1 -0.25 270) (size 0.6 0.25) (layers F.Cu F.Paste F.Mask)
      (net 93 "Net-(MOTOR3-Pad2)"))
    (pad 3 smd rect (at -1 0.25 270) (size 0.6 0.25) (layers F.Cu F.Paste F.Mask)
      (net 92 "Net-(MOTOR3-Pad1)"))
    (pad 4 smd rect (at -1 0.75 270) (size 0.6 0.25) (layers F.Cu F.Paste F.Mask)
      (net 2 -BATT))
    (pad 8 smd rect (at 1 -0.75 270) (size 0.6 0.25) (layers F.Cu F.Paste F.Mask)
      (net 4 +3V3))
    (pad 7 smd rect (at 1 -0.25 270) (size 0.6 0.25) (layers F.Cu F.Paste F.Mask)
      (net 66 LEVEL3_~SLEEP))
    (pad 6 smd rect (at 1 0.25 270) (size 0.6 0.25) (layers F.Cu F.Paste F.Mask)
      (net 67 LEVEL3_DIR))
    (pad 5 smd rect (at 1 0.75 270) (size 0.6 0.25) (layers F.Cu F.Paste F.Mask)
      (net 68 LEVEL3_PWM))
    (pad 9 smd rect (at 0 0 270) (size 0.9 2.6) (layers F.Cu F.Paste F.Mask)
      (net 2 -BATT))
  )
  (module Teensy4_1:DEV-16771 (layer F.Cu) (tedit 5FE51C56)
    (at 58.1914 46.3423)
    (fp_text reference MCU (at 31.7246 0.0889 90) (layer F.SilkS))
    (fp_text value "TEENSY 4.1" (at 22.479 -11.049) (layer F.Fab))
    (fp_text user Teensy~4.1 (at 0 11) (layer F.Fab))
    (pad D13/LED thru_hole circle (at 3.81 -7.62) (size 1.308 1.308) (drill 0.8) (layers *.Cu *.Mask)
      (net 40 SPI_SCLK))
    (pad GND@1 thru_hole circle (at 6.35 -7.62) (size 1.308 1.308) (drill 0.8) (layers *.Cu *.Mask)
      (net 2 -BATT))
    (pad D41/A17 thru_hole circle (at 8.89 -7.62) (size 1.308 1.308) (drill 0.8) (layers *.Cu *.Mask)
      (net 44 IMU_~RESET))
    (pad D40/A16 thru_hole circle (at 11.43 -7.62) (size 1.308 1.308) (drill 0.8) (layers *.Cu *.Mask)
      (net 46 IMU_ADDR_SEL))
    (pad D39/A15 thru_hole circle (at 13.97 -7.62) (size 1.308 1.308) (drill 0.8) (layers *.Cu *.Mask)
      (net 45 IMU_INT))
    (pad D37 thru_hole circle (at 19.05 -7.62) (size 1.308 1.308) (drill 0.8) (layers *.Cu *.Mask)
      (net 43 BMP_INT))
    (pad D36 thru_hole circle (at 21.59 -7.62) (size 1.308 1.308) (drill 0.8) (layers *.Cu *.Mask)
      (net 77 GYRO_RELEASE))
    (pad D35 thru_hole circle (at 24.13 -7.62) (size 1.308 1.308) (drill 0.8) (layers *.Cu *.Mask)
      (net 66 LEVEL3_~SLEEP))
    (pad D34 thru_hole circle (at 26.67 -7.62) (size 1.308 1.308) (drill 0.8) (layers *.Cu *.Mask)
      (net 65 LEVEL2_~SLEEP))
    (pad D33 thru_hole circle (at 29.21 -7.62) (size 1.308 1.308) (drill 0.8) (layers *.Cu *.Mask)
      (net 60 LEVEL1_~SLEEP))
    (pad D32 thru_hole circle (at 29.21 7.62) (size 1.308 1.308) (drill 0.8) (layers *.Cu *.Mask)
      (net 94 HOTWIRE))
    (pad D31 thru_hole circle (at 26.67 7.62) (size 1.308 1.308) (drill 0.8) (layers *.Cu *.Mask)
      (net 5 "Net-(MCU1-PadD31)"))
    (pad D30 thru_hole circle (at 24.13 7.62) (size 1.308 1.308) (drill 0.8) (layers *.Cu *.Mask)
      (net 51 XBEE_~RESET))
    (pad D29 thru_hole circle (at 21.59 7.62) (size 1.308 1.308) (drill 0.8) (layers *.Cu *.Mask)
      (net 50 XBEE_UART_MOSI))
    (pad D28 thru_hole circle (at 19.05 7.62) (size 1.308 1.308) (drill 0.8) (layers *.Cu *.Mask)
      (net 49 XBEE_UART_MISO))
    (pad D27/A13 thru_hole circle (at 16.51 7.62) (size 1.308 1.308) (drill 0.8) (layers *.Cu *.Mask)
      (net 6 "Net-(MCU1-PadD27/A13)"))
    (pad D26/A12 thru_hole circle (at 13.97 7.62) (size 1.308 1.308) (drill 0.8) (layers *.Cu *.Mask)
      (net 7 "Net-(MCU1-PadD26/A12)"))
    (pad D25/A11 thru_hole circle (at 11.43 7.62) (size 1.308 1.308) (drill 0.8) (layers *.Cu *.Mask)
      (net 75 GPS_UART_MISO))
    (pad D24/A10 thru_hole circle (at 8.89 7.62) (size 1.308 1.308) (drill 0.8) (layers *.Cu *.Mask)
      (net 8 "Net-(MCU1-PadD24/A10)"))
    (pad 3.3V thru_hole circle (at 6.35 7.62) (size 1.308 1.308) (drill 0.8) (layers *.Cu *.Mask)
      (net 9 "Net-(MCU1-Pad3.3V)"))
    (pad VUSB thru_hole circle (at -26.67 -5.08) (size 1.308 1.308) (drill 0.8) (layers *.Cu *.Mask)
      (net 73 USB_PWR))
    (pad VIN thru_hole circle (at -29.21 -7.62) (size 1.308 1.308) (drill 0.8) (layers *.Cu *.Mask)
      (net 3 +5V))
    (pad AGND thru_hole circle (at -26.67 -7.62) (size 1.308 1.308) (drill 0.8) (layers *.Cu *.Mask)
      (net 2 -BATT))
    (pad 3.3V@1 thru_hole circle (at -24.13 -7.62) (size 1.308 1.308) (drill 0.8) (layers *.Cu *.Mask)
      (net 10 "Net-(MCU1-Pad3.3V@1)"))
    (pad D23/A9 thru_hole circle (at -21.59 -7.62) (size 1.308 1.308) (drill 0.8) (layers *.Cu *.Mask)
      (net 55 THERM_ADC))
    (pad D22/A8 thru_hole circle (at -19.05 -7.62) (size 1.308 1.308) (drill 0.8) (layers *.Cu *.Mask)
      (net 54 BATT_ADC))
    (pad D21/A7 thru_hole circle (at -16.51 -7.62) (size 1.308 1.308) (drill 0.8) (layers *.Cu *.Mask)
      (net 67 LEVEL3_DIR))
    (pad D20/A6 thru_hole circle (at -13.97 -7.62) (size 1.308 1.308) (drill 0.8) (layers *.Cu *.Mask)
      (net 64 LEVEL2_DIR))
    (pad D19/A5 thru_hole circle (at -11.43 -7.62) (size 1.308 1.308) (drill 0.8) (layers *.Cu *.Mask)
      (net 61 LEVEL1_DIR))
    (pad D18/A4 thru_hole circle (at -8.89 -7.62) (size 1.308 1.308) (drill 0.8) (layers *.Cu *.Mask)
      (net 68 LEVEL3_PWM))
    (pad D17/A3 thru_hole circle (at -6.35 -7.62) (size 1.308 1.308) (drill 0.8) (layers *.Cu *.Mask)
      (net 47 I2C_SCL))
    (pad D16/A2 thru_hole circle (at -3.81 -7.62) (size 1.308 1.308) (drill 0.8) (layers *.Cu *.Mask)
      (net 48 I2C_SDA))
    (pad D15/A1 thru_hole circle (at -1.27 -7.62) (size 1.308 1.308) (drill 0.8) (layers *.Cu *.Mask)
      (net 63 LEVEL2_PWM))
    (pad D14/A0 thru_hole circle (at 1.27 -7.62) (size 1.308 1.308) (drill 0.8) (layers *.Cu *.Mask)
      (net 62 LEVEL1_PWM))
    (pad D38/A14 thru_hole circle (at 16.51 -7.62) (size 1.308 1.308) (drill 0.8) (layers *.Cu *.Mask)
      (net 53 BMP_ADDR_SEL))
    (pad D12 thru_hole circle (at 3.81 7.62) (size 1.308 1.308) (drill 0.8) (layers *.Cu *.Mask)
      (net 42 SPI_MISO))
    (pad D11 thru_hole circle (at 1.27 7.62) (size 1.308 1.308) (drill 0.8) (layers *.Cu *.Mask)
      (net 41 SPI_MOSI))
    (pad D10 thru_hole circle (at -1.27 7.62) (size 1.308 1.308) (drill 0.8) (layers *.Cu *.Mask)
      (net 52 CAM1_SS))
    (pad D9 thru_hole circle (at -3.81 7.62) (size 1.308 1.308) (drill 0.8) (layers *.Cu *.Mask)
      (net 56 CAM2_SS))
    (pad D8 thru_hole circle (at -6.35 7.62) (size 1.308 1.308) (drill 0.8) (layers *.Cu *.Mask)
      (net 57 CAM3_SS))
    (pad D7 thru_hole circle (at -8.89 7.62) (size 1.308 1.308) (drill 0.8) (layers *.Cu *.Mask)
      (net 76 CAM_PWR))
    (pad D6 thru_hole circle (at -11.43 7.62) (size 1.308 1.308) (drill 0.8) (layers *.Cu *.Mask)
      (net 11 "Net-(MCU1-PadD6)"))
    (pad D5 thru_hole circle (at -13.97 7.62) (size 1.308 1.308) (drill 0.8) (layers *.Cu *.Mask)
      (net 12 "Net-(MCU1-PadD5)"))
    (pad D4 thru_hole circle (at -16.51 7.62) (size 1.308 1.308) (drill 0.8) (layers *.Cu *.Mask)
      (net 13 "Net-(MCU1-PadD4)"))
    (pad D3 thru_hole circle (at -19.05 7.62) (size 1.308 1.308) (drill 0.8) (layers *.Cu *.Mask)
      (net 14 "Net-(MCU1-PadD3)"))
    (pad D2 thru_hole circle (at -21.59 7.62) (size 1.308 1.308) (drill 0.8) (layers *.Cu *.Mask)
      (net 15 "Net-(MCU1-PadD2)"))
    (pad D1 thru_hole circle (at -24.13 7.62) (size 1.308 1.308) (drill 0.8) (layers *.Cu *.Mask)
      (net 16 "Net-(MCU1-PadD1)"))
    (pad D0 thru_hole circle (at -26.67 7.62) (size 1.308 1.308) (drill 0.8) (layers *.Cu *.Mask)
      (net 17 "Net-(MCU1-PadD0)"))
    (pad GND thru_hole circle (at -29.21 7.62) (size 1.308 1.308) (drill 0.8) (layers *.Cu *.Mask)
      (net 2 -BATT))
  )
  (module XBEE:DIP2200W51P200L3294H279Q20P (layer F.Cu) (tedit 5FDD1ED8)
    (at 126.65202 45.8724)
    (fp_text reference XBEE (at 10.1727 -14.4399) (layer F.SilkS))
    (fp_text value "XBEE Wire" (at 13.631625 -4.150025 180) (layer F.Fab))
    (pad 1 thru_hole rect (at -11 -8.75) (size 1.4 1.4) (drill 0.8) (layers *.Cu *.Mask)
      (net 4 +3V3))
    (pad 2 thru_hole circle (at -11 -6.75) (size 1.4 1.4) (drill 0.8) (layers *.Cu *.Mask)
      (net 49 XBEE_UART_MISO))
    (pad 3 thru_hole circle (at -11 -4.75) (size 1.4 1.4) (drill 0.8) (layers *.Cu *.Mask)
      (net 50 XBEE_UART_MOSI))
    (pad 4 thru_hole circle (at -11 -2.75) (size 1.4 1.4) (drill 0.8) (layers *.Cu *.Mask)
      (net 31 "Net-(XBEE1-Pad4)"))
    (pad 5 thru_hole circle (at -11 -0.75) (size 1.4 1.4) (drill 0.8) (layers *.Cu *.Mask)
      (net 51 XBEE_~RESET))
    (pad 6 thru_hole circle (at -11 1.25) (size 1.4 1.4) (drill 0.8) (layers *.Cu *.Mask)
      (net 30 "Net-(XBEE1-Pad6)"))
    (pad 7 thru_hole circle (at -11 3.25) (size 1.4 1.4) (drill 0.8) (layers *.Cu *.Mask)
      (net 29 "Net-(XBEE1-Pad7)"))
    (pad 8 thru_hole circle (at -11 5.25) (size 1.4 1.4) (drill 0.8) (layers *.Cu *.Mask))
    (pad 9 thru_hole circle (at -11 7.25) (size 1.4 1.4) (drill 0.8) (layers *.Cu *.Mask)
      (net 28 "Net-(XBEE1-Pad9)"))
    (pad 10 thru_hole circle (at -11 9.25) (size 1.4 1.4) (drill 0.8) (layers *.Cu *.Mask)
      (net 2 -BATT))
    (pad 11 thru_hole circle (at 11 9.25) (size 1.4 1.4) (drill 0.8) (layers *.Cu *.Mask)
      (net 27 "Net-(XBEE1-Pad11)"))
    (pad 12 thru_hole circle (at 11 7.25) (size 1.4 1.4) (drill 0.8) (layers *.Cu *.Mask)
      (net 26 "Net-(XBEE1-Pad12)"))
    (pad 13 thru_hole circle (at 11 5.25) (size 1.4 1.4) (drill 0.8) (layers *.Cu *.Mask)
      (net 25 "Net-(XBEE1-Pad13)"))
    (pad 14 thru_hole circle (at 11 3.25) (size 1.4 1.4) (drill 0.8) (layers *.Cu *.Mask)
      (net 24 "Net-(XBEE1-Pad14)"))
    (pad 15 thru_hole circle (at 11 1.25) (size 1.4 1.4) (drill 0.8) (layers *.Cu *.Mask)
      (net 23 "Net-(XBEE1-Pad15)"))
    (pad 16 thru_hole circle (at 11 -0.75) (size 1.4 1.4) (drill 0.8) (layers *.Cu *.Mask)
      (net 22 "Net-(XBEE1-Pad16)"))
    (pad 17 thru_hole circle (at 11 -2.75) (size 1.4 1.4) (drill 0.8) (layers *.Cu *.Mask)
      (net 21 "Net-(XBEE1-Pad17)"))
    (pad 18 thru_hole circle (at 11 -4.75) (size 1.4 1.4) (drill 0.8) (layers *.Cu *.Mask)
      (net 20 "Net-(XBEE1-Pad18)"))
    (pad 19 thru_hole circle (at 11 -6.75) (size 1.4 1.4) (drill 0.8) (layers *.Cu *.Mask)
      (net 19 "Net-(XBEE1-Pad19)"))
    (pad 20 thru_hole circle (at 11 -8.75) (size 1.4 1.4) (drill 0.8) (layers *.Cu *.Mask)
      (net 18 "Net-(XBEE1-Pad20)"))
  )
  (module Resistor_SMD:R_0402_1005Metric_Pad0.72x0.64mm_HandSolder (layer F.Cu) (tedit 5F6BB9E0)
    (at 94.7414 58.06948)
    (descr "Resistor SMD 0402 (1005 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R27 (at 2.78324 0.07112) (layer F.SilkS))
    (fp_text value 10k (at 0 1.17) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd roundrect (at 0.5975 0) (size 0.715 0.64) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 51 XBEE_~RESET))
    (pad 1 smd roundrect (at -0.5975 0) (size 0.715 0.64) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 4 +3V3))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0402_1005Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (gr_text "UAH CRW NASA USLI PCB" (at 127.1397 27.27198) (layer F.SilkS))
  (gr_text "Design: v2" (at 126.28626 45.5676 90) (layer B.SilkS))
  (gr_text "NASA USLI PCB\nUAH CRW" (at 123.47956 45.3517 90) (layer B.SilkS))
  (gr_line (start 25.4 63.5) (end 25.4 25.4) (layer Edge.Cuts) (width 0.0254))
  (gr_line (start 139.7 63.5) (end 25.4 63.5) (layer Edge.Cuts) (width 0.0254))
  (gr_line (start 139.7 25.4) (end 139.7 63.5) (layer Edge.Cuts) (width 0.0254))
  (gr_line (start 25.4 25.4) (end 139.7 25.4) (layer Edge.Cuts) (width 0.0254))
  (zone (net 2) (net_name -BATT) (layer B.Cu) (hatch edge 0.508)
    (connect_pads yes (clearance 0.1524))
    (min_thickness 0.1524)
    (fill yes (arc_segments 32) (thermal_gap 0.1524) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 147.36318 20.21078) (xy 148.56206 69.27088) (xy 19.389428 67.224406) (xy 19.05254 19.86788)
      )
    )
    (polygon
      (pts
        (xy 19.389428 67.224406) (xy 19.39544 68.06946) (xy 18.53946 67.21094)
      )
    )
  )
  (zone (net 2) (net_name -BATT) (layer F.Cu) (hatch edge 0.508)
    (connect_pads yes (clearance 0.1524))
    (min_thickness 0.1524)
    (fill yes (arc_segments 32) (thermal_gap 0.1524) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 143.71066 64.63792) (xy 22.0472 64.58712) (xy 22.36978 23.59914) (xy 142.8496 23.04796)
      )
    )
    (polygon
      (pts
        (xy 22.30224 63.777767) (xy 22.3012 64.39662) (xy 22.87016 64.51092)
      )
    )
  )
)
