(kicad_pcb (version 20221018) (generator pcbnew)
  (general
    (thickness 1.6)
  )
  (paper "A4")
  (layers
    (0 "F.Cu" signal)
    (31 "B.Cu" signal)
    (32 "B.Adhes" user "B.Adhesive")
    (33 "F.Adhes" user "F.Adhesive")
    (34 "B.Paste" user)
    (35 "F.Paste" user)
    (36 "B.SilkS" user "B.Silkscreen")
    (37 "F.SilkS" user "F.Silkscreen")
    (38 "B.Mask" user)
    (39 "F.Mask" user)
    (40 "Dwgs.User" user "User.Drawings")
    (41 "Cmts.User" user "User.Comments")
    (42 "Eco1.User" user "User.Eco1")
    (43 "Eco2.User" user "User.Eco2")
    (44 "Edge.Cuts" user)
    (45 "Margin" user)
    (46 "B.CrtYd" user "B.Courtyard")
    (47 "F.CrtYd" user "F.Courtyard")
    (48 "B.Fab" user)
    (49 "F.Fab" user)
  )
  (setup
    (pad_to_mask_clearance 0.0508)
    (solder_mask_min_width 0.101)
    (pcbplotparams
      (layerselection 0x00010fc_ffffffff)
      (plot_on_all_layers_selection 0x0000000_00000000)
      (disableapertmacros false)
      (usegerberextensions true)
      (usegerberattributes true)
      (usegerberadvancedattributes true)
      (creategerberjobfile true)
      (dashed_line_dash_ratio 12.000000)
      (dashed_line_gap_ratio 3.000000)
      (svgprecision 6)
      (plotframeref false)
      (viasonmask false)
      (mode 1)
      (useauxorigin false)
      (hpglpennumber 1)
      (hpglpenspeed 20)
      (hpglpendiameter 15.000000)
      (dxfpolygonmode true)
      (dxfimperialunits true)
      (dxfusepcbnewfont true)
      (psnegative false)
      (psa4output false)
      (plotreference true)
      (plotvalue true)
      (plotinvisibletext false)
      (sketchpadsonfab false)
      (subtractmaskfromsilk false)
      (outputformat 1)
      (mirror false)
      (drillshape 0)
      (scaleselection 1)
      (outputdirectory "gerbers")
    )
  )
  (net 0 "")
  (net 1 "GNDREF")
  (net 2 "VCC")
  (net 3 "/scl")
  (net 4 "/sda")
  (net 5 "/nwc")
  (net 6 "Net-(A0-B)")
  (net 7 "Net-(A1-B)")
  (net 8 "Net-(A2-B)")
  (footprint "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder" (layer "F.Cu")
    (at 200.65 130.5)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "Sheetfile" "eeprombreakout.kicad_sch")
    (property "Sheetname" "")
    (property "ki_description" "Unpolarized capacitor")
    (property "ki_keywords" "cap capacitor")
    (attr smd)
    (fp_text reference "C1" (at 0 -1.43) (layer "F.SilkS") hide)
    (fp_text value "0.1" (at 0 1.43) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab"))
    (pad "1" smd roundrect (at -0.8625 0) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 2 "VCC") (pintype "passive"))
    (pad "2" smd roundrect (at 0.8625 0) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 1 "GNDREF") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder" (layer "F.Cu")
    (at 199.75 132.8875 90)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (property "Sheetfile" "eeprombreakout.kicad_sch")
    (property "Sheetname" "")
    (property "ki_description" "Resistor, US symbol")
    (property "ki_keywords" "R res resistor")
    (attr smd)
    (fp_text reference "R1" (at 0 -1.43 90) (layer "F.SilkS") hide)
    (fp_text value "4K7" (at 0 1.43 90) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab"))
    (pad "1" smd roundrect (at -0.9125 0 90) (size 0.975 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 3 "/scl") (pintype "passive"))
    (pad "2" smd roundrect (at 0.9125 0 90) (size 0.975 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 2 "VCC") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder" (layer "F.Cu")
    (at 201.425 132.8875 90)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (property "Sheetfile" "eeprombreakout.kicad_sch")
    (property "Sheetname" "")
    (property "ki_description" "Resistor, US symbol")
    (property "ki_keywords" "R res resistor")
    (attr smd)
    (fp_text reference "R2" (at 0 -1.43 90) (layer "F.SilkS") hide)
    (fp_text value "4K7" (at 0 1.43 90) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab"))
    (pad "1" smd roundrect (at -0.9125 0 90) (size 0.975 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 4 "/sda") (pintype "passive"))
    (pad "2" smd roundrect (at 0.9125 0 90) (size 0.975 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 2 "VCC") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Connector_PinHeader_2.54mm:PinHeader_1x04_P2.54mm_Vertical" (layer "F.Cu")
    (at 200.72 137.19 -90)
    (descr "Through hole straight pin header, 1x04, 2.54mm pitch, single row")
    (tags "Through hole pin header THT 1x04 2.54mm single row")
    (property "Sheetfile" "eeprombreakout.kicad_sch")
    (property "Sheetname" "")
    (property "ki_description" "Generic connector, single row, 01x04, script generated")
    (property "ki_keywords" "connector")
    (attr through_hole)
    (fp_text reference "J2" (at 0 -2.33 90) (layer "F.SilkS") hide)
    (fp_text value "Conn_01x04_Pin" (at 0 9.95 90) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 3.81) (layer "F.Fab"))
    (pad "1" thru_hole oval (at 0 0 270) (size 1.45 1.6) (drill 0.9) (layers "*.Cu" "*.Mask")
      (net 3 "/scl") (pinfunction "Pin_1") (pintype "passive"))
    (pad "2" thru_hole oval (at 0 2.54 270) (size 1.45 1.6) (drill 0.9) (layers "*.Cu" "*.Mask")
      (net 4 "/sda") (pinfunction "Pin_2") (pintype "passive"))
    (pad "3" thru_hole rect (at 0 5.08 270) (size 1.45 1.6) (drill 0.9) (layers "*.Cu" "*.Mask")
      (net 2 "VCC") (pinfunction "Pin_3") (pintype "passive"))
    (pad "4" thru_hole roundrect (at 0 7.62 270) (size 1.45 1.6) (drill 0.9) (layers "*.Cu" "*.Mask") (roundrect_rratio 0)
      (chamfer_ratio 0.2) (chamfer top_left top_right bottom_left bottom_right)
      (net 1 "GNDREF") (pinfunction "Pin_4") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Connector_PinHeader_2.54mm.3dshapes/PinHeader_1x04_P2.54mm_Vertical.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "attinyspeaker:D_SO-8_handsolder" (layer "F.Cu")
    (at 195.3 132.545)
    (descr "8-Lead Plastic SO, Exposed Die Pad (see https://www.diodes.com/assets/Package-Files/SO-8EP.pdf)")
    (tags "SO exposed pad")
    (property "Sheetfile" "eeprombreakout.kicad_sch")
    (property "Sheetname" "")
    (property "ki_description" "I2C Serial EEPROM, 1Kb (128x8) with Unique Serial Number, SO8")
    (property "ki_keywords" "I2C Serial EEPROM Nonvolatile Memory")
    (attr smd)
    (fp_text reference "U2" (at 0 -3.3) (layer "F.SilkS") hide)
    (fp_text value "AT24CS01-SSHM" (at 0 3.4) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab"))
    (pad "1" smd roundrect (at -2.43 -1.905) (size 2 0.802) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.1246882793)
      (net 6 "Net-(A0-B)") (pinfunction "A0") (pintype "input"))
    (pad "2" smd roundrect (at -2.43 -0.635) (size 2 0.802) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.1246882793)
      (net 7 "Net-(A1-B)") (pinfunction "A1") (pintype "input"))
    (pad "3" smd roundrect (at -2.43 0.635) (size 2 0.802) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.1246882793)
      (net 8 "Net-(A2-B)") (pinfunction "A2") (pintype "input"))
    (pad "4" smd roundrect (at -2.43 1.905) (size 2 0.802) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.1246882793)
      (net 1 "GNDREF") (pinfunction "GND") (pintype "power_in"))
    (pad "5" smd roundrect (at 2.43 1.905) (size 2 0.802) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.1253117207)
      (net 4 "/sda") (pinfunction "SDA") (pintype "bidirectional"))
    (pad "6" smd roundrect (at 2.43 0.635) (size 2 0.802) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.1246882793)
      (net 3 "/scl") (pinfunction "SCL") (pintype "input"))
    (pad "7" smd roundrect (at 2.43 -0.635) (size 2 0.802) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.1253117207)
      (net 5 "/nwc") (pinfunction "WP") (pintype "input"))
    (pad "8" smd roundrect (at 2.43 -1.905) (size 2 0.802) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.1246882793)
      (net 2 "VCC") (pinfunction "VCC") (pintype "power_in"))
    (model "${KICAD6_3DMODEL_DIR}/Package_SO.3dshapes/Diodes_SO-8EP.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "attinyspeaker:SolderJumper-2_P1.3mm_Open_NarrowPad1.0x1.5mm" (layer "B.Cu")
    (at 193.55 134.1)
    (descr "SMD Solder Jumper, 1x1.5mm, rounded Pads, 0.3mm gap, bridged with 1 copper strip")
    (tags "net tie solder jumper bridged")
    (property "Sheetfile" "eeprombreakout.kicad_sch")
    (property "Sheetname" "")
    (property "ki_description" "Solder Jumper, 2-pole, open")
    (property "ki_keywords" "solder jumper SPST")
    (attr exclude_from_pos_files)
    (net_tie_pad_groups "1, 2")
    (fp_text reference "A2" (at 1.95 -0.05 270 unlocked) (layer "B.SilkS"))
    (fp_text value "SolderJumper_2_Open" (at 0 -1.9) (layer "B.Fab"))
    (pad "1" smd roundrect (at -0.65 0) (size 1 1.1) (layers "B.Cu" "B.Mask") (roundrect_rratio 0.25)
      (chamfer_ratio 0) (chamfer top_right bottom_right)
      (net 2 "VCC") (pinfunction "A") (pintype "passive") (zone_connect 2))
    (pad "2" smd roundrect (at 0.65 0) (size 1 1.1) (layers "B.Cu" "B.Mask") (roundrect_rratio 0.25)
      (chamfer_ratio 0) (chamfer top_left bottom_left)
      (net 8 "Net-(A2-B)") (pinfunction "B") (pintype "passive") (zone_connect 2))
  )
  (footprint "attinyspeaker:SolderJumper-2_P1.3mm_Open_NarrowPad1.0x1.5mm" (layer "B.Cu")
    (at 197.975 131.625 90)
    (descr "SMD Solder Jumper, 1x1.5mm, rounded Pads, 0.3mm gap, bridged with 1 copper strip")
    (tags "net tie solder jumper bridged")
    (property "Sheetfile" "eeprombreakout.kicad_sch")
    (property "Sheetname" "")
    (property "ki_description" "Solder Jumper, 2-pole, open")
    (property "ki_keywords" "solder jumper SPST")
    (attr exclude_from_pos_files)
    (net_tie_pad_groups "1, 2")
    (fp_text reference "WP1" (at 0 1.8 270) (layer "B.SilkS") hide)
    (fp_text value "SolderJumper_2_Open" (at 0 -1.9 270) (layer "B.Fab"))
    (pad "1" smd roundrect (at -0.65 0 90) (size 1 1.1) (layers "B.Cu" "B.Mask") (roundrect_rratio 0.25)
      (chamfer_ratio 0) (chamfer top_right bottom_right)
      (net 5 "/nwc") (pinfunction "A") (pintype "passive") (zone_connect 2))
    (pad "2" smd roundrect (at 0.65 0 90) (size 1 1.1) (layers "B.Cu" "B.Mask") (roundrect_rratio 0.25)
      (chamfer_ratio 0) (chamfer top_left bottom_left)
      (net 2 "VCC") (pinfunction "B") (pintype "passive") (zone_connect 2))
  )
  (footprint "attinyspeaker:SolderJumper-2_P1.3mm_Open_NarrowPad1.0x1.5mm" (layer "B.Cu")
    (at 193.55 132.4)
    (descr "SMD Solder Jumper, 1x1.5mm, rounded Pads, 0.3mm gap, bridged with 1 copper strip")
    (tags "net tie solder jumper bridged")
    (property "Sheetfile" "eeprombreakout.kicad_sch")
    (property "Sheetname" "")
    (property "ki_description" "Solder Jumper, 2-pole, open")
    (property "ki_keywords" "solder jumper SPST")
    (attr exclude_from_pos_files)
    (net_tie_pad_groups "1, 2")
    (fp_text reference "A1" (at 2.05 -0.05 -90 unlocked) (layer "B.SilkS"))
    (fp_text value "SolderJumper_2_Open" (at 0 -1.9) (layer "B.Fab"))
    (pad "1" smd roundrect (at -0.65 0) (size 1 1.1) (layers "B.Cu" "B.Mask") (roundrect_rratio 0.25)
      (chamfer_ratio 0) (chamfer top_right bottom_right)
      (net 2 "VCC") (pinfunction "A") (pintype "passive") (zone_connect 2))
    (pad "2" smd roundrect (at 0.65 0) (size 1 1.1) (layers "B.Cu" "B.Mask") (roundrect_rratio 0.25)
      (chamfer_ratio 0) (chamfer top_left bottom_left)
      (net 7 "Net-(A1-B)") (pinfunction "B") (pintype "passive") (zone_connect 2))
  )
  (footprint "attinyspeaker:SolderJumper-2_P1.3mm_Open_NarrowPad1.0x1.5mm" (layer "B.Cu")
    (at 193.55 130.7)
    (descr "SMD Solder Jumper, 1x1.5mm, rounded Pads, 0.3mm gap, bridged with 1 copper strip")
    (tags "net tie solder jumper bridged")
    (property "Sheetfile" "eeprombreakout.kicad_sch")
    (property "Sheetname" "")
    (property "ki_description" "Solder Jumper, 2-pole, open")
    (property "ki_keywords" "solder jumper SPST")
    (attr exclude_from_pos_files)
    (net_tie_pad_groups "1, 2")
    (fp_text reference "A0" (at 2 -0.05 -90 unlocked) (layer "B.SilkS"))
    (fp_text value "SolderJumper_2_Open" (at 0 -1.9) (layer "B.Fab"))
    (pad "1" smd roundrect (at -0.65 0) (size 1 1.1) (layers "B.Cu" "B.Mask") (roundrect_rratio 0.25)
      (chamfer_ratio 0) (chamfer top_right bottom_right)
      (net 2 "VCC") (pinfunction "A") (pintype "passive") (zone_connect 2))
    (pad "2" smd roundrect (at 0.65 0) (size 1 1.1) (layers "B.Cu" "B.Mask") (roundrect_rratio 0.25)
      (chamfer_ratio 0) (chamfer top_left bottom_left)
      (net 6 "Net-(A0-B)") (pinfunction "B") (pintype "passive") (zone_connect 2))
  )
  (gr_rect (start 191.57 129.67) (end 202.345 138.29)
    (fill none) (layer "Edge.Cuts"))
  (gr_text "VCC" (at 196.86 136.29) (layer "B.SilkS"))
  (gr_text "GND" (at 194.4 136.25) (layer "B.SilkS"))
  (gr_text "WP" (at 198.85 134) (layer "B.SilkS"))
  (gr_text "SDA" (at 199.42 136.29) (layer "B.SilkS"))
  (gr_text "I2C \nEEPROM" (at 199.5 132.375 270) (layer "B.SilkS"))
  (gr_text "SCL" (at 201.98 136.3) (layer "B.SilkS"))
  (gr_text "VCC" (at 194.42 136.35) (layer "F.SilkS"))
  (gr_text "GND" (at 191.79 136.35) (layer "F.SilkS"))
  (gr_text "C" (at 200.262661 130.911099) (layer "F.SilkS"))
  (gr_text "SDA" (at 196.975 136.35) (layer "F.SilkS"))
  (gr_text "4K7\n" (at 199.525 135.3) (layer "F.SilkS"))
  (gr_text "eeprom" (at 195.5 130.25 270) (layer "F.SilkS"))
  (gr_text "SCL" (at 199.59 136.35) (layer "F.SilkS"))
  (zone (net 1) (net_name "GNDREF") (layers "F&B.Cu") (hatch edge 0.5)
    (connect_pads (clearance 0.2))
    (min_thickness 0.25) (filled_areas_thickness no)
    (fill yes (thermal_gap 0.3) (thermal_bridge_width 0.5))
    (polygon
      (pts
        (xy 192 129.9)
        (xy 202 129.9)
        (xy 201.95 138.05)
        (xy 192.05 138.05)
      )
    )
  )
)
