(kicad_pcb (version 20171130) (host pcbnew "(5.1.8-0-10_14)")
  (general
    (thickness 1.6)
    (drawings 109)
    (tracks 655)
    (zones 0)
    (modules 64)
    (nets 83)
  )
  (page USLedger)
  (title_block
    (date 2019-12-29)
  )
  (layers
    (0 F.Cu signal)
    (31 B.Cu signal)
    (32 B.Adhes user hide)
    (33 F.Adhes user hide)
    (34 B.Paste user hide)
    (35 F.Paste user hide)
    (36 B.SilkS user)
    (37 F.SilkS user)
    (38 B.Mask user hide)
    (39 F.Mask user hide)
    (40 Dwgs.User user hide)
    (41 Cmts.User user hide)
    (42 Eco1.User user hide)
    (43 Eco2.User user hide)
    (44 Edge.Cuts user)
    (45 Margin user hide)
    (46 B.CrtYd user hide)
    (47 F.CrtYd user)
    (48 B.Fab user hide)
    (49 F.Fab user hide)
  )
  (setup
    (last_trace_width 0.2032)
    (trace_clearance 0.1778)
    (zone_clearance 0.381)
    (zone_45_only no)
    (trace_min 0.1778)
    (via_size 0.6604)
    (via_drill 0.4064)
    (via_min_size 0.4064)
    (via_min_drill 0.3556)
    (uvia_size 0.3)
    (uvia_drill 0.1)
    (uvias_allowed no)
    (uvia_min_size 0.2)
    (uvia_min_drill 0.1)
    (edge_width 0.05)
    (segment_width 0.2)
    (pcb_text_width 0.3)
    (pcb_text_size 1.5 1.5)
    (mod_edge_width 0.12)
    (mod_text_size 0.5 0.5)
    (mod_text_width 0.07)
    (pad_size 2.2 2.2)
    (pad_drill 2.2)
    (pad_to_mask_clearance 0.0254)
    (solder_mask_min_width 0.0254)
    (aux_axis_origin 0 0)
    (visible_elements FEFDFF7F)
    (pcbplotparams
      (layerselection 0x010fc_ffffffff)
      (usegerberextensions false)
      (usegerberattributes false)
      (usegerberadvancedattributes false)
      (creategerberjobfile false)
      (excludeedgelayer true)
      (linewidth 0.100000)
      (plotframeref false)
      (viasonmask false)
      (mode 1)
      (useauxorigin false)
      (hpglpennumber 1)
      (hpglpenspeed 20)
      (hpglpendiameter 15.000000)
      (psnegative false)
      (psa4output false)
      (plotreference true)
      (plotvalue true)
      (plotinvisibletext false)
      (padsonsilk false)
      (subtractmaskfromsilk false)
      (outputformat 4)
      (mirror false)
      (drillshape 0)
      (scaleselection 1)
      (outputdirectory ""))
  )
  (net 0 "")
  (net 1 GND)
  (net 2 +3V3)
  (net 3 PA12-MISO)
  (net 4 ~RESET~)
  (net 5 "Net-(H1-Pad1)")
  (net 6 "Net-(H2-Pad1)")
  (net 7 "Net-(L_DEF1-Pad1)")
  (net 8 "Net-(L_PWR1-Pad1)")
  (net 9 PB11-SCK)
  (net 10 PB10-MOSI)
  (net 11 "Net-(CUFG1-Pad1)")
  (net 12 PA23-SCL)
  (net 13 PA22-SDA)
  (net 14 "Net-(FUSE1-Pad2)")
  (net 15 "Net-(J_USB1-Pad4)")
  (net 16 "Net-(L_RX1-Pad1)")
  (net 17 "Net-(L_TX1-Pad1)")
  (net 18 "Net-(RLED1-Pad1)")
  (net 19 PWR_JACK)
  (net 20 PWR_USB)
  (net 21 PA25-USBD+)
  (net 22 PA24-USBD-)
  (net 23 GP0)
  (net 24 GP7)
  (net 25 GP6)
  (net 26 GP5)
  (net 27 GP4)
  (net 28 GP1)
  (net 29 GP2)
  (net 30 GP3)
  (net 31 /3REG)
  (net 32 "Net-(J_SWD1-Pad10)")
  (net 33 "Net-(J_SWD1-Pad9)")
  (net 34 "Net-(J_SWD1-Pad8)")
  (net 35 "Net-(J_SWD1-Pad7)")
  (net 36 "Net-(J_SWD1-Pad6)")
  (net 37 "Net-(CQ1-Pad1)")
  (net 38 "Net-(CQ2-Pad2)")
  (net 39 "Net-(CV1-Pad1)")
  (net 40 "Net-(CVDD1-Pad2)")
  (net 41 "Net-(U_MCP23008-Pad7)")
  (net 42 "Net-(U_MCP23008-Pad8)")
  (net 43 "Net-(U_MCP23008-Pad10)")
  (net 44 "Net-(U_MCP23008-Pad11)")
  (net 45 "Net-(RA0-Pad1)")
  (net 46 "Net-(RGLED1-Pad1)")
  (net 47 PA03-D42-AREF)
  (net 48 PA07-D09-I2S)
  (net 49 PA06-D08)
  (net 50 PA05-D18-A4)
  (net 51 PA04-D17-A3)
  (net 52 PB09-D16-A2)
  (net 53 PB08-D15-A1)
  (net 54 PA02-D14-A0)
  (net 55 PA27-D26-LTX)
  (net 56 PB03-D25-LRX)
  (net 57 PB02-D19-A5)
  (net 58 PA28-D27-USBENA)
  (net 59 PB23-D31)
  (net 60 PB22-D30)
  (net 61 PA11-D00-RX1)
  (net 62 PA10-D01-TX1)
  (net 63 PA08-D04-NMI)
  (net 64 PA09-D03)
  (net 65 PA13-D38)
  (net 66 PA14-D02)
  (net 67 PA15-D05)
  (net 68 PA17-D13-DEFLED)
  (net 69 PA19-D12)
  (net 70 PA20-D06)
  (net 71 PA16-D11-TX2)
  (net 72 PA18-D10-RX2)
  (net 73 PA21-D07)
  (net 74 /PA31-SWDIO)
  (net 75 /PA30-SWDCLK)
  (net 76 "Net-(RDMRST1-Pad1)")
  (net 77 "Net-(U_LMR33630-Pad4)")
  (net 78 /BOOT)
  (net 79 /SW)
  (net 80 /VIN)
  (net 81 /VCC)
  (net 82 /FB)
  (net_class Default "This is the default net class."
    (clearance 0.1778)
    (trace_width 0.2032)
    (via_dia 0.6604)
    (via_drill 0.4064)
    (uvia_dia 0.3)
    (uvia_drill 0.1)
    (diff_pair_width 0.2032)
    (diff_pair_gap 0.25)
    (add_net +3V3)
    (add_net /3REG)
    (add_net /BOOT)
    (add_net /FB)
    (add_net /PA30-SWDCLK)
    (add_net /PA31-SWDIO)
    (add_net /SW)
    (add_net /VCC)
    (add_net /VIN)
    (add_net GND)
    (add_net GP0)
    (add_net GP1)
    (add_net GP2)
    (add_net GP3)
    (add_net GP4)
    (add_net GP5)
    (add_net GP6)
    (add_net GP7)
    (add_net "Net-(CQ1-Pad1)")
    (add_net "Net-(CQ2-Pad2)")
    (add_net "Net-(CUFG1-Pad1)")
    (add_net "Net-(CV1-Pad1)")
    (add_net "Net-(CVDD1-Pad2)")
    (add_net "Net-(FUSE1-Pad2)")
    (add_net "Net-(H1-Pad1)")
    (add_net "Net-(H2-Pad1)")
    (add_net "Net-(J_SWD1-Pad10)")
    (add_net "Net-(J_SWD1-Pad6)")
    (add_net "Net-(J_SWD1-Pad7)")
    (add_net "Net-(J_SWD1-Pad8)")
    (add_net "Net-(J_SWD1-Pad9)")
    (add_net "Net-(J_USB1-Pad4)")
    (add_net "Net-(L_DEF1-Pad1)")
    (add_net "Net-(L_PWR1-Pad1)")
    (add_net "Net-(L_RX1-Pad1)")
    (add_net "Net-(L_TX1-Pad1)")
    (add_net "Net-(RA0-Pad1)")
    (add_net "Net-(RDMRST1-Pad1)")
    (add_net "Net-(RGLED1-Pad1)")
    (add_net "Net-(RLED1-Pad1)")
    (add_net "Net-(U_LMR33630-Pad4)")
    (add_net "Net-(U_MCP23008-Pad10)")
    (add_net "Net-(U_MCP23008-Pad11)")
    (add_net "Net-(U_MCP23008-Pad7)")
    (add_net "Net-(U_MCP23008-Pad8)")
    (add_net PA02-D14-A0)
    (add_net PA03-D42-AREF)
    (add_net PA04-D17-A3)
    (add_net PA05-D18-A4)
    (add_net PA06-D08)
    (add_net PA07-D09-I2S)
    (add_net PA08-D04-NMI)
    (add_net PA09-D03)
    (add_net PA10-D01-TX1)
    (add_net PA11-D00-RX1)
    (add_net PA12-MISO)
    (add_net PA13-D38)
    (add_net PA14-D02)
    (add_net PA15-D05)
    (add_net PA16-D11-TX2)
    (add_net PA17-D13-DEFLED)
    (add_net PA18-D10-RX2)
    (add_net PA19-D12)
    (add_net PA20-D06)
    (add_net PA21-D07)
    (add_net PA22-SDA)
    (add_net PA23-SCL)
    (add_net PA24-USBD-)
    (add_net PA25-USBD+)
    (add_net PA27-D26-LTX)
    (add_net PA28-D27-USBENA)
    (add_net PB02-D19-A5)
    (add_net PB03-D25-LRX)
    (add_net PB08-D15-A1)
    (add_net PB09-D16-A2)
    (add_net PB10-MOSI)
    (add_net PB11-SCK)
    (add_net PB22-D30)
    (add_net PB23-D31)
    (add_net PWR_JACK)
    (add_net PWR_USB)
    (add_net ~RESET~)
  )
  (module Capacitor_SMD:C_1206_3216Metric (layer F.Cu) (tedit 6031F347)
    (at 22.79904 17.70126 180)
    (descr "Capacitor SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags capacitor)
    (attr smd)
    (fp_text reference CHF1 (at 2.80924 0.06096 90) (layer F.SilkS))
    (fp_text value "0.22uf 50V X7R" (at -0.0508 1.1684) (layer F.Fab) hide)
    (fp_text user %R (at 0 0) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.475 0 180) (size 1.15 1.8) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 80 /VIN))
    (pad 1 smd roundrect (at -1.475 0 180) (size 1.15 1.8) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 1 GND))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_1206_3216Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Package_SO:Texas_HSOP-8-1EP_3.9x4.9mm_P1.27mm_ThermalVias (layer F.Cu) (tedit 604FEF28)
    (at 22.76348 23.5458 270)
    (descr "Texas Instruments HSOP 9, 1.27mm pitch, 3.9x4.9mm body, exposed pad, thermal vias, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf)")
    (tags "HSOP 1.27")
    (attr smd)
    (fp_text reference U_LMR33630 (at -4.1148 0.18034) (layer F.SilkS))
    (fp_text value LMR33630CDDA (at 0 2.99 90) (layer F.Fab) hide)
    (fp_text user %R (at 0 0 90) (layer F.Fab) hide)
    (pad 9 thru_hole circle (at 0.65 1.95 270) (size 0.6 0.6) (drill 0.3) (layers *.Cu)
      (net 1 GND))
    (pad 9 thru_hole circle (at 0.65 0.65 270) (size 0.6 0.6) (drill 0.3) (layers *.Cu)
      (net 1 GND))
    (pad 9 thru_hole circle (at -0.65 0.65 270) (size 0.6 0.6) (drill 0.3) (layers *.Cu)
      (net 1 GND))
    (pad 9 thru_hole circle (at -0.65 1.95 270) (size 0.6 0.6) (drill 0.3) (layers *.Cu)
      (net 1 GND))
    (pad 9 thru_hole circle (at 0.65 -1.95 270) (size 0.6 0.6) (drill 0.3) (layers *.Cu)
      (net 1 GND))
    (pad 9 thru_hole circle (at 0.65 -0.65 270) (size 0.6 0.6) (drill 0.3) (layers *.Cu)
      (net 1 GND))
    (pad 9 thru_hole circle (at -0.65 -0.65 270) (size 0.6 0.6) (drill 0.3) (layers *.Cu)
      (net 1 GND))
    (pad 9 thru_hole circle (at -0.65 -1.95 270) (size 0.6 0.6) (drill 0.3) (layers *.Cu)
      (net 1 GND))
    (pad "" smd rect (at 0 0 270) (size 2.6 3.1) (layers F.Mask))
    (pad "" smd rect (at 0 0 270) (size 2.6 3.1) (layers F.Paste))
    (pad 8 smd rect (at 2.7 -1.905 270) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 79 /SW))
    (pad 7 smd rect (at 2.7 -0.635 270) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 78 /BOOT))
    (pad 6 smd rect (at 2.7 0.635 270) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 81 /VCC))
    (pad 5 smd rect (at 2.7 1.905 270) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 82 /FB))
    (pad 4 smd rect (at -2.7 1.905 270) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 77 "Net-(U_LMR33630-Pad4)"))
    (pad 3 smd rect (at -2.7 0.635 270) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 80 /VIN))
    (pad 2 smd rect (at -2.7 -0.635 270) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 80 /VIN))
    (pad 1 smd rect (at -2.7 -1.905 270) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 9 smd rect (at 0 0 270) (size 2.95 4.9) (layers B.Cu)
      (net 1 GND))
    (pad 9 smd rect (at 0 0 270) (size 2.95 4.9) (layers F.Cu)
      (net 1 GND))
    (model ${KISYS3DMOD}/Package_SO.3dshapes/HTSOP-8-1EP_3.9x4.9mm_Pitch1.27mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module z21g:L_Coil5030 (layer F.Cu) (tedit 604FEC67)
    (at 29.3751 24.68372 90)
    (descr "Shielded 5030")
    (tags inductor)
    (attr smd)
    (fp_text reference LT1 (at -3.57124 0.95758 180) (layer F.SilkS))
    (fp_text value 1.2uH (at 0.01 3.27 90) (layer F.Fab) hide)
    (fp_text user %R (at 0.0635 -0.39116 90) (layer F.Fab) hide)
    (pad 1 smd custom (at -2.032 0 90) (size 1.055 3.4) (layers F.Cu F.Paste F.Mask)
      (net 79 /SW) (zone_connect 2)
      (options (clearance outline) (anchor rect))
      (primitives
        (gr_poly (pts
           (xy 1.4675 -1.7) (xy 0.5275 -0.8445) (xy 0.5275 0.8445) (xy 1.4675 1.7) (xy 1.4675 2.755)
           (xy 0.5275 2.755) (xy -0.5275 1.7) (xy -0.5275 -1.7) (xy 0.5275 -2.755) (xy 1.4675 -2.755)
) (width 0))
      ))
    (pad 2 smd custom (at 2.03962 0 90) (size 1.055 3.4) (layers F.Cu F.Paste F.Mask)
      (net 31 /3REG) (zone_connect 2)
      (options (clearance outline) (anchor rect))
      (primitives
        (gr_poly (pts
           (xy -1.4675 -1.7) (xy -0.5275 -0.8445) (xy -0.5275 0.8445) (xy -1.4675 1.7) (xy -1.4675 2.755)
           (xy -0.5275 2.755) (xy 0.5275 1.7) (xy 0.5275 -1.7) (xy -0.5275 -2.755) (xy -1.4675 -2.755)
) (width 0))
      ))
    (model ${KISYS3DMOD}/Inductor_SMD.3dshapes/L_Coilcraft_LPS5030.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module z21g:ARM_JTAG_2x05_P1.27mm_Vertical (layer F.Cu) (tedit 600DE77A)
    (at 34.798 18.542)
    (descr "Through hole straight pin header, 2x05, 1.27mm pitch, double rows")
    (tags "Through hole pin header THT 2x05 1.27mm double row")
    (fp_text reference J_SWD1 (at 3.81 2.794 90) (layer F.SilkS))
    (fp_text value Conn_ARM_JTAG_SWD_10 (at 2.794 2.54 90) (layer F.Fab) hide)
    (fp_text user %R (at 0.635 2.54 90) (layer F.Fab) hide)
    (pad 1 thru_hole rect (at 0 0) (size 1 1) (drill 0.65) (layers *.Cu *.Mask)
      (net 2 +3V3))
    (pad 2 thru_hole oval (at 1.27 0) (size 1 1) (drill 0.65) (layers *.Cu *.Mask)
      (net 74 /PA31-SWDIO))
    (pad 3 thru_hole oval (at 0 1.27) (size 1 1) (drill 0.65) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 4 thru_hole oval (at 1.27 1.27) (size 1 1) (drill 0.65) (layers *.Cu *.Mask)
      (net 75 /PA30-SWDCLK))
    (pad 5 thru_hole oval (at 0 2.54) (size 1 1) (drill 0.65) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 6 thru_hole oval (at 1.27 2.54) (size 1 1) (drill 0.65) (layers *.Cu *.Mask)
      (net 36 "Net-(J_SWD1-Pad6)"))
    (pad 7 thru_hole oval (at 0 3.81) (size 1 1) (drill 0.65) (layers *.Cu *.Mask)
      (net 35 "Net-(J_SWD1-Pad7)"))
    (pad 8 thru_hole oval (at 1.27 3.81) (size 1 1) (drill 0.65) (layers *.Cu *.Mask)
      (net 34 "Net-(J_SWD1-Pad8)"))
    (pad 9 thru_hole oval (at 0 5.08) (size 1 1) (drill 0.65) (layers *.Cu *.Mask)
      (net 33 "Net-(J_SWD1-Pad9)"))
    (pad 10 thru_hole oval (at 1.27 5.08) (size 1 1) (drill 0.65) (layers *.Cu *.Mask)
      (net 32 "Net-(J_SWD1-Pad10)"))
    (model ${KISYS3DMOD}/Connector_PinHeader_1.27mm.3dshapes/PinHeader_2x05_P1.27mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Jumper:SolderJumper-2_P1.3mm_Open_Pad1.0x1.5mm (layer B.Cu) (tedit 5FA7A88B)
    (at 60.11418 25.02408)
    (descr "SMD Solder Jumper, 1x1.5mm Pads, 0.3mm gap, open")
    (tags "solder jumper open")
    (attr virtual)
    (fp_text reference SP_AREF1 (at -0.24638 -1.56972) (layer B.SilkS))
    (fp_text value S_AREF (at 0.0508 -1.6256) (layer B.Fab) hide)
    (pad 1 smd rect (at -0.65 0) (size 1 1.5) (layers B.Cu B.Mask)
      (net 47 PA03-D42-AREF))
    (pad 2 smd rect (at 0.65 0) (size 1 1.5) (layers B.Cu B.Mask)
      (net 2 +3V3))
  )
  (module Connector_PinHeader_2.54mm:PinHeader_1x24_P2.54mm_Vertical (layer B.Cu) (tedit 59FED5CC)
    (at 12.7 35.56 270)
    (descr "Through hole straight pin header, 1x24, 2.54mm pitch, single row")
    (tags "Through hole pin header THT 1x24 2.54mm single row")
    (fp_text reference J_1 (at 0 2.33 90) (layer B.SilkS))
    (fp_text value Conn_01x24 (at 0 -60.75 90) (layer B.Fab))
    (fp_text user %R (at 0 -29.21 180) (layer B.Fab))
    (pad 24 thru_hole oval (at 0 -58.42 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 48 PA07-D09-I2S))
    (pad 23 thru_hole oval (at 0 -55.88 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 49 PA06-D08))
    (pad 22 thru_hole oval (at 0 -53.34 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 50 PA05-D18-A4))
    (pad 21 thru_hole oval (at 0 -50.8 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 51 PA04-D17-A3))
    (pad 20 thru_hole oval (at 0 -48.26 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 52 PB09-D16-A2))
    (pad 19 thru_hole oval (at 0 -45.72 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 53 PB08-D15-A1))
    (pad 18 thru_hole oval (at 0 -43.18 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 47 PA03-D42-AREF))
    (pad 17 thru_hole oval (at 0 -40.64 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 54 PA02-D14-A0))
    (pad 16 thru_hole oval (at 0 -38.1 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 24 GP7))
    (pad 15 thru_hole oval (at 0 -35.56 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 25 GP6))
    (pad 14 thru_hole oval (at 0 -33.02 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 26 GP5))
    (pad 13 thru_hole oval (at 0 -30.48 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 27 GP4))
    (pad 12 thru_hole oval (at 0 -27.94 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 55 PA27-D26-LTX))
    (pad 11 thru_hole oval (at 0 -25.4 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 56 PB03-D25-LRX))
    (pad 10 thru_hole oval (at 0 -22.86 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 57 PB02-D19-A5))
    (pad 9 thru_hole oval (at 0 -20.32 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 58 PA28-D27-USBENA))
    (pad 8 thru_hole oval (at 0 -17.78 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 62 PA10-D01-TX1))
    (pad 7 thru_hole oval (at 0 -15.24 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 61 PA11-D00-RX1))
    (pad 6 thru_hole oval (at 0 -12.7 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 59 PB23-D31))
    (pad 5 thru_hole oval (at 0 -10.16 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 60 PB22-D30))
    (pad 4 thru_hole oval (at 0 -7.62 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 4 ~RESET~))
    (pad 3 thru_hole oval (at 0 -5.08 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 20 PWR_USB))
    (pad 2 thru_hole oval (at 0 -2.54 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 19 PWR_JACK))
    (pad 1 thru_hole rect (at 0 0 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 1 GND))
    (model ${KISYS3DMOD}/Connector_PinHeader_2.54mm.3dshapes/PinHeader_1x24_P2.54mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder (layer F.Cu) (tedit 5FA7A271)
    (at 75.85964 24.765 270)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RSCL1 (at 0.0635 -1.40208 90) (layer F.SilkS))
    (fp_text value 4.7K (at 0 1.27 90) (layer F.Fab) hide)
    (fp_text user %R (at 0 0.2032 90) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1 0 270) (size 1.2 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.208333)
      (net 2 +3V3))
    (pad 1 smd roundrect (at -1 0 270) (size 1.2 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.208333)
      (net 12 PA23-SCL))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Package_TO_SOT_SMD:SOT-323_SC-70_Handsoldering (layer F.Cu) (tedit 5FC5E9DF)
    (at 66.1543 11.25474 90)
    (descr "SOT-323, SC-70 Handsoldering")
    (tags "SOT-323 SC-70 Handsoldering")
    (attr smd)
    (fp_text reference U_NMOS2 (at 0.05842 1.74752 90) (layer F.SilkS))
    (fp_text value 2N7002PW.115 (at 0 1.6256 90) (layer F.Fab) hide)
    (fp_text user %R (at 0 0) (layer F.Fab) hide)
    (pad 3 smd rect (at 1.23 0) (size 0.75 1.7) (layers F.Cu F.Paste F.Mask)
      (net 18 "Net-(RLED1-Pad1)"))
    (pad 2 smd rect (at -1.23 0.75) (size 0.65 1.7) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 1 smd rect (at -1.23 -0.75) (size 0.65 1.7) (layers F.Cu F.Paste F.Mask)
      (net 46 "Net-(RGLED1-Pad1)"))
    (model ${KISYS3DMOD}/Package_TO_SOT_SMD.3dshapes/SOT-323_SC-70.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Button_Switch_SMD:SW_Push_1P1T_NO_CK_KMR2 (layer F.Cu) (tedit 5FB39A3E)
    (at 2.89306 36.22802 180)
    (descr "CK components KMR2 tactile switch http://www.ckswitches.com/media/1479/kmr2.pdf")
    (tags "tactile switch kmr2")
    (attr smd)
    (fp_text reference SW_RST1 (at -0.04826 2.16662) (layer F.SilkS))
    (fp_text value SW_SPST (at 0.0254 2.0574) (layer F.Fab))
    (fp_text user %R (at 0.5334 -2.413) (layer F.Fab) hide)
    (pad 2 smd rect (at 2.05 0.8 180) (size 0.9 1) (layers F.Cu F.Paste F.Mask)
      (net 76 "Net-(RDMRST1-Pad1)"))
    (pad 1 smd rect (at 2.05 -0.8 180) (size 0.9 1) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 2 smd rect (at -2.05 0.8 180) (size 0.9 1) (layers F.Cu F.Paste F.Mask)
      (net 76 "Net-(RDMRST1-Pad1)"))
    (pad 1 smd rect (at -2.05 -0.8 180) (size 0.9 1) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (model ${KISYS3DMOD}/Button_Switch_SMD.3dshapes/SW_Push_1P1T_NO_CK_KMR2.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_1206_3216Metric_Pad1.33x1.80mm_HandSolder (layer F.Cu) (tedit 5FA7B3F3)
    (at 12.07262 13.462 90)
    (descr "Capacitor SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference CUFG1 (at -2.98196 -0.20066 180) (layer F.SilkS))
    (fp_text value "4.7pf 1K" (at 0.0254 1.4986 90) (layer F.Fab) hide)
    (fp_text user %R (at 0 0 90) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.5625 0 90) (size 1.325 1.8) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.188679)
      (net 1 GND))
    (pad 1 smd roundrect (at -1.5625 0 90) (size 1.325 1.8) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.188679)
      (net 11 "Net-(CUFG1-Pad1)"))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_1206_3216Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Fuse:Fuse_1812_4532Metric_Pad1.30x3.40mm_HandSolder (layer F.Cu) (tedit 5FA7A796)
    (at 4.35102 2.24536 180)
    (descr "Fuse SMD 1812 (4532 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://www.nikhef.nl/pub/departments/mt/projects/detectorR_D/dtddice/ERJ2G.pdf), generated with kicad-footprint-generator")
    (tags "fuse handsolder")
    (attr smd)
    (fp_text reference FUSE1 (at -3.70332 0.13716 90) (layer F.SilkS))
    (fp_text value MF-MSMF050-2 (at -0.0508 2.1844) (layer F.Fab) hide)
    (fp_text user %R (at 0 0.5588) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 2.225 0 180) (size 1.3 3.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.192308)
      (net 14 "Net-(FUSE1-Pad2)"))
    (pad 1 smd roundrect (at -2.225 0 180) (size 1.3 3.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.192308)
      (net 20 PWR_USB))
    (model ${KISYS3DMOD}/Fuse.3dshapes/Fuse_1812_4532Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder (layer F.Cu) (tedit 5FA7A380)
    (at 7.1501 35.8394 270)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference CRST1 (at -2.3368 -0.12446 180) (layer F.SilkS))
    (fp_text value 0.1uf (at -0.0508 1.1684 90) (layer F.Fab) hide)
    (fp_text user %R (at 0 0 90) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.0375 0 270) (size 1.175 1.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.212766)
      (net 1 GND))
    (pad 1 smd roundrect (at -1.0375 0 270) (size 1.175 1.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.212766)
      (net 4 ~RESET~))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder (layer F.Cu) (tedit 5FA7A271)
    (at 10.11682 31.35122 90)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RRST1 (at -0.08636 1.49352 90) (layer F.SilkS))
    (fp_text value 10K (at 0 1.27 90) (layer F.Fab) hide)
    (fp_text user %R (at 0 0.2032 90) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1 0 90) (size 1.2 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.208333)
      (net 4 ~RESET~))
    (pad 1 smd roundrect (at -1 0 90) (size 1.2 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.208333)
      (net 2 +3V3))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder (layer F.Cu) (tedit 5FA7A271)
    (at 9.22528 12.05738 270)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RUFG1 (at 2.27838 -0.1016) (layer F.SilkS))
    (fp_text value 1Meg (at 0 1.27 90) (layer F.Fab) hide)
    (fp_text user %R (at 0 0.2032 90) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1 0 270) (size 1.2 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.208333)
      (net 11 "Net-(CUFG1-Pad1)"))
    (pad 1 smd roundrect (at -1 0 270) (size 1.2 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.208333)
      (net 1 GND))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder (layer F.Cu) (tedit 5FA7A271)
    (at 15.37716 16.29664 90)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RPWR1 (at -2.24536 0.1778) (layer F.SilkS))
    (fp_text value 330 (at 0 1.27 90) (layer F.Fab) hide)
    (fp_text user %R (at 0 0.2032 90) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1 0 90) (size 1.2 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.208333)
      (net 8 "Net-(L_PWR1-Pad1)"))
    (pad 1 smd roundrect (at -1 0 90) (size 1.2 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.208333)
      (net 1 GND))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder (layer F.Cu) (tedit 5FA7A271)
    (at 73.57618 24.77008 90)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RSDA1 (at -0.09652 -1.49606 90) (layer F.SilkS))
    (fp_text value 4.7K (at 0 1.27 90) (layer F.Fab) hide)
    (fp_text user %R (at 0 0.2032 90) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1 0 90) (size 1.2 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.208333)
      (net 13 PA22-SDA))
    (pad 1 smd roundrect (at -1 0 90) (size 1.2 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.208333)
      (net 2 +3V3))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder (layer F.Cu) (tedit 5FA7A271)
    (at 70.96252 30.38856)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RTX1 (at -3.04038 -0.10414) (layer F.SilkS))
    (fp_text value 820 (at 0 1.27) (layer F.Fab) hide)
    (fp_text user %R (at 0 0.2032) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1 0) (size 1.2 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.208333)
      (net 17 "Net-(L_TX1-Pad1)"))
    (pad 1 smd roundrect (at -1 0) (size 1.2 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.208333)
      (net 55 PA27-D26-LTX))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder (layer F.Cu) (tedit 5FA7A271)
    (at 70.93458 28.21686)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RRX1 (at -3.10896 0.10922) (layer F.SilkS))
    (fp_text value 820 (at 0 1.27) (layer F.Fab) hide)
    (fp_text user %R (at 0 0.2032) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1 0) (size 1.2 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.208333)
      (net 16 "Net-(L_RX1-Pad1)"))
    (pad 1 smd roundrect (at -1 0) (size 1.2 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.208333)
      (net 56 PB03-D25-LRX))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder (layer F.Cu) (tedit 5FA7A380)
    (at 53.68036 27.18562 180)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference CQ1 (at 0.0508 -1.3716) (layer F.SilkS))
    (fp_text value 20pf (at -0.0508 1.1684) (layer F.Fab) hide)
    (fp_text user %R (at 0 0) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.0375 0 180) (size 1.175 1.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.212766)
      (net 1 GND))
    (pad 1 smd roundrect (at -1.0375 0 180) (size 1.175 1.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.212766)
      (net 37 "Net-(CQ1-Pad1)"))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder (layer F.Cu) (tedit 5FA7A380)
    (at 49.15916 27.18562 180)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference CQ2 (at 0.0508 -1.3716) (layer F.SilkS))
    (fp_text value 20pf (at -0.0508 1.1684) (layer F.Fab) hide)
    (fp_text user %R (at 0 0) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.0375 0 180) (size 1.175 1.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.212766)
      (net 38 "Net-(CQ2-Pad2)"))
    (pad 1 smd roundrect (at -1.0375 0 180) (size 1.175 1.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.212766)
      (net 1 GND))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder (layer F.Cu) (tedit 5FA7A380)
    (at 58.92292 26.46426 135)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference CA2 (at 0.0508 -1.3716 135) (layer F.SilkS))
    (fp_text value 4.7uf (at -0.0508 1.168401 135) (layer F.Fab) hide)
    (fp_text user %R (at 0 0 135) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.0375 0 135) (size 1.175 1.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.212766)
      (net 47 PA03-D42-AREF))
    (pad 1 smd roundrect (at -1.0375 0 135) (size 1.175 1.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.212766)
      (net 1 GND))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder (layer F.Cu) (tedit 5FA7A380)
    (at 60.73648 23.79726 225)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference CV2 (at 0.0508 -1.3716 45) (layer F.SilkS))
    (fp_text value 10uf (at -0.0508 1.168401 45) (layer F.Fab) hide)
    (fp_text user %R (at 0 0 45) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.0375 0 225) (size 1.175 1.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.212766)
      (net 1 GND))
    (pad 1 smd roundrect (at -1.0375 0 225) (size 1.175 1.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.212766)
      (net 39 "Net-(CV1-Pad1)"))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder (layer F.Cu) (tedit 5FA7A380)
    (at 57.912 22.01418 315)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference CV1 (at 0.0508 -1.3716 135) (layer F.SilkS))
    (fp_text value 0.1uf (at -0.0508 1.168401 135) (layer F.Fab) hide)
    (fp_text user %R (at 0 0 135) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.0375 0 315) (size 1.175 1.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.212766)
      (net 1 GND))
    (pad 1 smd roundrect (at -1.0375 0 315) (size 1.175 1.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.212766)
      (net 39 "Net-(CV1-Pad1)"))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder (layer F.Cu) (tedit 5FA7A380)
    (at 56.19242 23.63978 135)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference CA1 (at 0.0508 -1.3716 135) (layer F.SilkS))
    (fp_text value 0.1uf (at -0.0508 1.168401 135) (layer F.Fab) hide)
    (fp_text user %R (at 0 0 135) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.0375 0 135) (size 1.175 1.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.212766)
      (net 47 PA03-D42-AREF))
    (pad 1 smd roundrect (at -1.0375 0 135) (size 1.175 1.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.212766)
      (net 1 GND))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder (layer F.Cu) (tedit 5FA7A271)
    (at 34.90468 13.29182)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RSWCLK1 (at 0 -1.3716) (layer F.SilkS))
    (fp_text value 1K (at 0 1.27) (layer F.Fab) hide)
    (fp_text user %R (at 0 0.2032) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1 0) (size 1.2 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.208333)
      (net 75 /PA30-SWDCLK))
    (pad 1 smd roundrect (at -1 0) (size 1.2 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.208333)
      (net 2 +3V3))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder (layer F.Cu) (tedit 5FA7A271)
    (at 35.26028 28.92552)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RSWRST1 (at -0.07112 1.3589) (layer F.SilkS))
    (fp_text value "39 1%" (at 0 1.27) (layer F.Fab) hide)
    (fp_text user %R (at 0 0.2032) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1 0) (size 1.2 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.208333)
      (net 4 ~RESET~))
    (pad 1 smd roundrect (at -1 0) (size 1.2 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.208333)
      (net 32 "Net-(J_SWD1-Pad10)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder (layer F.Cu) (tedit 5FA7A271)
    (at 60.25896 15.66418 270)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference F_VDD1 (at 0 -1.3716 90) (layer F.SilkS))
    (fp_text value "220 ohm Ferrite" (at 0 1.27 90) (layer F.Fab) hide)
    (fp_text user %R (at 0 0.2032 90) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1 0 270) (size 1.2 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.208333)
      (net 39 "Net-(CV1-Pad1)"))
    (pad 1 smd roundrect (at -1 0 270) (size 1.2 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.208333)
      (net 2 +3V3))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder (layer F.Cu) (tedit 5FA7A380)
    (at 58.13044 11.19378 45)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference CF21 (at 0.005388 1.532032 45) (layer F.SilkS))
    (fp_text value 0.1uf (at -0.0508 1.168401 45) (layer F.Fab) hide)
    (fp_text user %R (at 0 0 45) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.0375 0 45) (size 1.175 1.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.212766)
      (net 1 GND))
    (pad 1 smd roundrect (at -1.0375 0 45) (size 1.175 1.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.212766)
      (net 2 +3V3))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder (layer F.Cu) (tedit 5FA7A380)
    (at 44.26458 23.18512 225)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference CF48 (at 0.0508 -1.3716 45) (layer F.SilkS))
    (fp_text value 0.1uf (at -0.0508 1.168401 45) (layer F.Fab) hide)
    (fp_text user %R (at 0 0 45) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.0375 0 225) (size 1.175 1.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.212766)
      (net 1 GND))
    (pad 1 smd roundrect (at -1.0375 0 225) (size 1.175 1.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.212766)
      (net 2 +3V3))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder (layer F.Cu) (tedit 5FA7A380)
    (at 42.52214 22.02434 45)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference CVDD1 (at -0.296348 -1.413492 45) (layer F.SilkS))
    (fp_text value 1uf (at -0.0508 1.168401 45) (layer F.Fab) hide)
    (fp_text user %R (at 0 0 45) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.0375 0 45) (size 1.175 1.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.212766)
      (net 40 "Net-(CVDD1-Pad2)"))
    (pad 1 smd roundrect (at -1.0375 0 45) (size 1.175 1.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.212766)
      (net 1 GND))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder (layer F.Cu) (tedit 5FA7A380)
    (at 41.27754 13.34008 135)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference CF34 (at 0.0508 -1.3716 135) (layer F.SilkS))
    (fp_text value 0.1uf (at -0.0508 1.168401 135) (layer F.Fab) hide)
    (fp_text user %R (at 0 0 135) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.0375 0 135) (size 1.175 1.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.212766)
      (net 1 GND))
    (pad 1 smd roundrect (at -1.0375 0 135) (size 1.175 1.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.212766)
      (net 2 +3V3))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder (layer F.Cu) (tedit 5FA7A271)
    (at 65.27038 14.79042 180)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RPDLED1 (at -0.4191 -1.6129) (layer F.SilkS))
    (fp_text value 10K (at 0 1.27) (layer F.Fab) hide)
    (fp_text user %R (at 0 0.2032) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1 0 180) (size 1.2 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.208333)
      (net 46 "Net-(RGLED1-Pad1)"))
    (pad 1 smd roundrect (at -1 0 180) (size 1.2 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.208333)
      (net 1 GND))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder (layer F.Cu) (tedit 5FA7A271)
    (at 67.0687 7.78002)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RLED1 (at -3.37566 0.10414) (layer F.SilkS))
    (fp_text value 330 (at 0 1.27) (layer F.Fab) hide)
    (fp_text user %R (at 0 0.2032) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1 0) (size 1.2 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.208333)
      (net 7 "Net-(L_DEF1-Pad1)"))
    (pad 1 smd roundrect (at -1 0) (size 1.2 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.208333)
      (net 18 "Net-(RLED1-Pad1)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Crystal:Crystal_SMD_MicroCrystal_CC7V-T1A-2Pin_3.2x1.5mm (layer F.Cu) (tedit 5FB39B61)
    (at 51.45278 24.93772)
    (descr "SMD Crystal MicroCrystal CC7V-T1A/CM7V-T1A series https://www.microcrystal.com/fileadmin/Media/Products/32kHz/Datasheet/CC7V-T1A.pdf, 3.2x1.5mm^2 package")
    (tags "SMD SMT crystal")
    (attr smd)
    (fp_text reference Q32 (at -2.58826 -0.1905 90) (layer F.SilkS))
    (fp_text value "32.768KHz 12.5pf" (at 0.0508 1.524) (layer F.Fab) hide)
    (fp_text user %R (at 0 0) (layer F.Fab) hide)
    (pad 2 smd rect (at 1.25 0) (size 1 1.8) (layers F.Cu F.Paste F.Mask)
      (net 37 "Net-(CQ1-Pad1)"))
    (pad 1 smd rect (at -1.25 0) (size 1 1.8) (layers F.Cu F.Paste F.Mask)
      (net 38 "Net-(CQ2-Pad2)"))
    (model ${KISYS3DMOD}/Crystal.3dshapes/Crystal_SMD_MicroCrystal_CC7V-T1A-2Pin_3.2x1.5mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Package_QFP:TQFP-48_7x7mm_P0.5mm (layer F.Cu) (tedit 5FA7B566)
    (at 50.6857 16.1544 135)
    (descr "48 LEAD TQFP 7x7mm (see MICREL TQFP7x7-48LD-PL-1.pdf)")
    (tags "QFP 0.5")
    (attr smd)
    (fp_text reference U_ATSAMD21G18 (at 5.786877 0.057474 225) (layer F.SilkS))
    (fp_text value ATSAMD21G18A-AUT (at 0 5.588 135) (layer F.Fab) hide)
    (fp_text user %R (at 0 0 135) (layer F.Fab) hide)
    (pad 48 smd rect (at -2.75 -4.35 225) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 56 PB03-D25-LRX))
    (pad 47 smd rect (at -2.25 -4.35 225) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 57 PB02-D19-A5))
    (pad 46 smd rect (at -1.75 -4.35 225) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 74 /PA31-SWDIO))
    (pad 45 smd rect (at -1.25 -4.35 225) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 75 /PA30-SWDCLK))
    (pad 44 smd rect (at -0.75 -4.35 225) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 2 +3V3))
    (pad 43 smd rect (at -0.25 -4.35 225) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 40 "Net-(CVDD1-Pad2)"))
    (pad 42 smd rect (at 0.25 -4.35 225) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 41 smd rect (at 0.75 -4.35 225) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 58 PA28-D27-USBENA))
    (pad 40 smd rect (at 1.25 -4.35 225) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 4 ~RESET~))
    (pad 39 smd rect (at 1.75 -4.35 225) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 55 PA27-D26-LTX))
    (pad 38 smd rect (at 2.25 -4.35 225) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 59 PB23-D31))
    (pad 37 smd rect (at 2.75 -4.35 225) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 60 PB22-D30))
    (pad 36 smd rect (at 4.35 -2.75 135) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 2 +3V3))
    (pad 35 smd rect (at 4.35 -2.25 135) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 34 smd rect (at 4.35 -1.75 135) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 21 PA25-USBD+))
    (pad 33 smd rect (at 4.35 -1.25 135) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 22 PA24-USBD-))
    (pad 32 smd rect (at 4.35 -0.75 135) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 12 PA23-SCL))
    (pad 31 smd rect (at 4.35 -0.25 135) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 13 PA22-SDA))
    (pad 30 smd rect (at 4.35 0.25 135) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 73 PA21-D07))
    (pad 29 smd rect (at 4.35 0.75 135) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 70 PA20-D06))
    (pad 28 smd rect (at 4.35 1.25 135) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 69 PA19-D12))
    (pad 27 smd rect (at 4.35 1.75 135) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 72 PA18-D10-RX2))
    (pad 26 smd rect (at 4.35 2.25 135) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 68 PA17-D13-DEFLED))
    (pad 25 smd rect (at 4.35 2.75 135) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 71 PA16-D11-TX2))
    (pad 24 smd rect (at 2.75 4.35 225) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 67 PA15-D05))
    (pad 23 smd rect (at 2.25 4.35 225) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 66 PA14-D02))
    (pad 22 smd rect (at 1.75 4.35 225) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 65 PA13-D38))
    (pad 21 smd rect (at 1.25 4.35 225) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 3 PA12-MISO))
    (pad 20 smd rect (at 0.75 4.35 225) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 9 PB11-SCK))
    (pad 19 smd rect (at 0.25 4.35 225) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 10 PB10-MOSI))
    (pad 18 smd rect (at -0.25 4.35 225) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 17 smd rect (at -0.75 4.35 225) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 2 +3V3))
    (pad 16 smd rect (at -1.25 4.35 225) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 61 PA11-D00-RX1))
    (pad 15 smd rect (at -1.75 4.35 225) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 62 PA10-D01-TX1))
    (pad 14 smd rect (at -2.25 4.35 225) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 64 PA09-D03))
    (pad 13 smd rect (at -2.75 4.35 225) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 63 PA08-D04-NMI))
    (pad 12 smd rect (at -4.35 2.75 135) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 48 PA07-D09-I2S))
    (pad 11 smd rect (at -4.35 2.25 135) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 49 PA06-D08))
    (pad 10 smd rect (at -4.35 1.75 135) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 50 PA05-D18-A4))
    (pad 9 smd rect (at -4.35 1.25 135) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 51 PA04-D17-A3))
    (pad 8 smd rect (at -4.35 0.75 135) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 52 PB09-D16-A2))
    (pad 7 smd rect (at -4.35 0.25 135) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 53 PB08-D15-A1))
    (pad 6 smd rect (at -4.35 -0.25 135) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 39 "Net-(CV1-Pad1)"))
    (pad 5 smd rect (at -4.35 -0.75 135) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 4 smd rect (at -4.35 -1.25 135) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 47 PA03-D42-AREF))
    (pad 3 smd rect (at -4.35 -1.75 135) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 54 PA02-D14-A0))
    (pad 2 smd rect (at -4.35 -2.25 135) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 37 "Net-(CQ1-Pad1)"))
    (pad 1 smd rect (at -4.35 -2.75 135) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)
      (net 38 "Net-(CQ2-Pad2)"))
    (model ${KISYS3DMOD}/Package_QFP.3dshapes/TQFP-48_7x7mm_P0.5mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module LED_SMD:LED_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5FA7A02C)
    (at 75.692 29.464)
    (descr "LED SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "LED handsolder")
    (attr smd)
    (fp_text reference L_RX1 (at 0 -1.4732) (layer F.SilkS))
    (fp_text value Green (at 0 1.27) (layer F.Fab) hide)
    (fp_text user %R (at 0 0) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 2 +3V3))
    (pad 1 smd roundrect (at -1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 16 "Net-(L_RX1-Pad1)"))
    (model ${KISYS3DMOD}/LED_SMD.3dshapes/LED_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Connector_USB:USB_Micro-B_Molex-105017-0001 (layer F.Cu) (tedit 5FD9C0CA)
    (at 2.794 8.89 270)
    (descr http://www.molex.com/pdm_docs/sd/1050170001_sd.pdf)
    (tags "Micro-USB SMD Typ-B")
    (attr smd)
    (fp_text reference J_USB1 (at 1.53416 -2.98704 90) (layer F.SilkS))
    (fp_text value USB_B_Micro (at -0.0508 3.9116 90) (layer F.Fab) hide)
    (fp_text user %R (at 0 0.8875 90) (layer F.Fab) hide)
    (fp_text user "PCB Edge" (at 0 2.6875 90) (layer Dwgs.User) hide)
    (pad 6 smd rect (at -2.9 1.2375 270) (size 1.2 1.9) (layers F.Cu F.Mask)
      (net 11 "Net-(CUFG1-Pad1)"))
    (pad 6 smd rect (at 2.9 1.2375 270) (size 1.2 1.9) (layers F.Cu F.Mask)
      (net 11 "Net-(CUFG1-Pad1)"))
    (pad 6 thru_hole oval (at 3.5 1.2375 270) (size 1.2 1.9) (drill oval 0.6 1.3) (layers *.Cu *.Mask)
      (net 11 "Net-(CUFG1-Pad1)"))
    (pad 6 thru_hole oval (at -3.5 1.2375 90) (size 1.2 1.9) (drill oval 0.6 1.3) (layers *.Cu *.Mask)
      (net 11 "Net-(CUFG1-Pad1)"))
    (pad 6 smd rect (at -1 1.2375 270) (size 1.5 1.9) (layers F.Cu F.Paste F.Mask)
      (net 11 "Net-(CUFG1-Pad1)"))
    (pad 6 thru_hole circle (at 2.5 -1.4625 270) (size 1.45 1.45) (drill 0.85) (layers *.Cu *.Mask)
      (net 11 "Net-(CUFG1-Pad1)"))
    (pad 3 smd rect (at 0 -1.4625 270) (size 0.4 1.35) (layers F.Cu F.Paste F.Mask)
      (net 21 PA25-USBD+))
    (pad 4 smd rect (at 0.65 -1.4625 270) (size 0.4 1.35) (layers F.Cu F.Paste F.Mask)
      (net 15 "Net-(J_USB1-Pad4)"))
    (pad 5 smd rect (at 1.3 -1.4625 270) (size 0.4 1.35) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 1 smd rect (at -1.3 -1.4625 270) (size 0.4 1.35) (layers F.Cu F.Paste F.Mask)
      (net 14 "Net-(FUSE1-Pad2)"))
    (pad 2 smd rect (at -0.65 -1.4625 270) (size 0.4 1.35) (layers F.Cu F.Paste F.Mask)
      (net 22 PA24-USBD-))
    (pad 6 thru_hole circle (at -2.5 -1.4625 270) (size 1.45 1.45) (drill 0.85) (layers *.Cu *.Mask)
      (net 11 "Net-(CUFG1-Pad1)"))
    (pad 6 smd rect (at 1 1.2375 270) (size 1.5 1.9) (layers F.Cu F.Paste F.Mask)
      (net 11 "Net-(CUFG1-Pad1)"))
    (model ${KISYS3DMOD}/Connector_USB.3dshapes/USB_Micro-B_Molex-105017-0001.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module MountingHole:MountingHole_3.2mm_M3_Pad (layer F.Cu) (tedit 5FA7A923)
    (at 3.556 30.48)
    (descr "Mounting Hole 3.2mm, M3")
    (tags "mounting hole 3.2mm m3")
    (attr virtual)
    (fp_text reference H1 (at -0.0508 -0.6096) (layer F.SilkS))
    (fp_text value MO1 (at 0.1016 3.7084) (layer F.Fab) hide)
    (fp_text user %R (at 0.3 0) (layer F.Fab))
    (pad 1 thru_hole circle (at 0 0) (size 6.4 6.4) (drill 3.2) (layers *.Cu *.Mask)
      (net 5 "Net-(H1-Pad1)"))
  )
  (module MountingHole:MountingHole_3.2mm_M3_Pad (layer F.Cu) (tedit 5FA7A923)
    (at 74.676 8.89)
    (descr "Mounting Hole 3.2mm, M3")
    (tags "mounting hole 3.2mm m3")
    (attr virtual)
    (fp_text reference H2 (at -0.0508 -0.6096) (layer F.SilkS))
    (fp_text value MO2 (at 0.1016 3.7084) (layer F.Fab) hide)
    (fp_text user %R (at 0.3 0) (layer F.Fab))
    (pad 1 thru_hole circle (at 0 0) (size 6.4 6.4) (drill 3.2) (layers *.Cu *.Mask)
      (net 6 "Net-(H2-Pad1)"))
  )
  (module Diode_SMD:D_SOD-123F (layer F.Cu) (tedit 5FDEE847)
    (at 15.41018 27.88158 90)
    (descr D_SOD-123F)
    (tags D_SOD-123F)
    (attr smd)
    (fp_text reference D_JA1 (at -0.06604 -1.74498 90) (layer F.SilkS))
    (fp_text value MBR230LSFT1G (at -0.0508 1.4732 90) (layer F.Fab) hide)
    (fp_text user %R (at 0.3556 -1.524 90) (layer F.Fab) hide)
    (pad 2 smd rect (at 1.5 0 90) (size 1.4 1.1) (layers F.Cu F.Paste F.Mask)
      (net 19 PWR_JACK))
    (pad 1 smd rect (at -1.5 0 90) (size 1.4 1.1) (layers F.Cu F.Paste F.Mask)
      (net 80 /VIN))
    (model ${KISYS3DMOD}/Diode_SMD.3dshapes/D_SOD-123F.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Diode_SMD:D_SOD-123F (layer F.Cu) (tedit 5FDEE847)
    (at 15.30604 22.2504 90)
    (descr D_SOD-123F)
    (tags D_SOD-123F)
    (attr smd)
    (fp_text reference D_US1 (at 0.04064 -1.7018 90) (layer F.SilkS))
    (fp_text value MBR230LSFT1G (at -0.0508 1.4732 90) (layer F.Fab) hide)
    (fp_text user %R (at 0.3556 -1.524 90) (layer F.Fab) hide)
    (pad 2 smd rect (at 1.5 0 90) (size 1.4 1.1) (layers F.Cu F.Paste F.Mask)
      (net 20 PWR_USB))
    (pad 1 smd rect (at -1.5 0 90) (size 1.4 1.1) (layers F.Cu F.Paste F.Mask)
      (net 80 /VIN))
    (model ${KISYS3DMOD}/Diode_SMD.3dshapes/D_SOD-123F.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module LED_SMD:LED_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5FA7A02C)
    (at 75.692 32.004)
    (descr "LED SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "LED handsolder")
    (attr smd)
    (fp_text reference L_TX1 (at -0.12446 1.5367) (layer F.SilkS))
    (fp_text value Red (at 0 1.27) (layer F.Fab) hide)
    (fp_text user %R (at 0 0) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 2 +3V3))
    (pad 1 smd roundrect (at -1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 17 "Net-(L_TX1-Pad1)"))
    (model ${KISYS3DMOD}/LED_SMD.3dshapes/LED_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Package_TO_SOT_SMD:SOT-143 (layer F.Cu) (tedit 5FA7A7D1)
    (at 9.89584 7.0739 90)
    (descr SOT-143)
    (tags SOT-143)
    (attr smd)
    (fp_text reference U_PRTR5 (at -2.49936 -0.55118 180) (layer F.SilkS))
    (fp_text value PRTR5V0U2X (at -0.1016 2.032 90) (layer F.Fab) hide)
    (fp_text user %R (at 0 0) (layer F.Fab) hide)
    (pad 4 smd rect (at 1.1 -0.95) (size 1 1.4) (layers F.Cu F.Paste F.Mask)
      (net 20 PWR_USB))
    (pad 3 smd rect (at 1.1 0.95) (size 1 1.4) (layers F.Cu F.Paste F.Mask)
      (net 22 PA24-USBD-))
    (pad 2 smd rect (at -1.1 0.95) (size 1 1.4) (layers F.Cu F.Paste F.Mask)
      (net 21 PA25-USBD+))
    (pad 1 smd rect (at -1.1 -0.77) (size 1.2 1.4) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (model ${KISYS3DMOD}/Package_TO_SOT_SMD.3dshapes/SOT-143.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Jumper:SolderJumper-2_P1.3mm_Open_Pad1.0x1.5mm (layer B.Cu) (tedit 5FA7A88B)
    (at 9.14654 32.0421)
    (descr "SMD Solder Jumper, 1x1.5mm Pads, 0.3mm gap, open")
    (tags "solder jumper open")
    (attr virtual)
    (fp_text reference SP_H1 (at 0.0889 -1.50876) (layer B.SilkS))
    (fp_text value S_H1 (at 0.0508 -1.6256) (layer B.Fab) hide)
    (pad 1 smd rect (at -0.65 0) (size 1 1.5) (layers B.Cu B.Mask)
      (net 5 "Net-(H1-Pad1)"))
    (pad 2 smd rect (at 0.65 0) (size 1 1.5) (layers B.Cu B.Mask)
      (net 1 GND))
  )
  (module Jumper:SolderJumper-2_P1.3mm_Open_Pad1.0x1.5mm (layer B.Cu) (tedit 5FA7A88B)
    (at 69.42074 6.80212 180)
    (descr "SMD Solder Jumper, 1x1.5mm Pads, 0.3mm gap, open")
    (tags "solder jumper open")
    (attr virtual)
    (fp_text reference SP_H2 (at 0 1.6764) (layer B.SilkS))
    (fp_text value S_H2 (at 0.0508 -1.6256) (layer B.Fab) hide)
    (pad 1 smd rect (at -0.65 0 180) (size 1 1.5) (layers B.Cu B.Mask)
      (net 6 "Net-(H2-Pad1)"))
    (pad 2 smd rect (at 0.65 0 180) (size 1 1.5) (layers B.Cu B.Mask)
      (net 1 GND))
  )
  (module Connector_PinHeader_2.54mm:PinHeader_1x24_P2.54mm_Vertical (layer B.Cu) (tedit 59FED5CC)
    (at 12.7 2.54 270)
    (descr "Through hole straight pin header, 1x24, 2.54mm pitch, single row")
    (tags "Through hole pin header THT 1x24 2.54mm single row")
    (fp_text reference J_2 (at 0 2.33 90) (layer B.SilkS))
    (fp_text value Conn_01x24 (at 0 -60.75 90) (layer B.Fab))
    (fp_text user %R (at 0 -29.21 180) (layer B.Fab))
    (pad 24 thru_hole oval (at 0 -58.42 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 63 PA08-D04-NMI))
    (pad 23 thru_hole oval (at 0 -55.88 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 10 PB10-MOSI))
    (pad 22 thru_hole oval (at 0 -53.34 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 9 PB11-SCK))
    (pad 21 thru_hole oval (at 0 -50.8 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 3 PA12-MISO))
    (pad 20 thru_hole oval (at 0 -48.26 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 64 PA09-D03))
    (pad 19 thru_hole oval (at 0 -45.72 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 23 GP0))
    (pad 18 thru_hole oval (at 0 -43.18 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 28 GP1))
    (pad 17 thru_hole oval (at 0 -40.64 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 29 GP2))
    (pad 16 thru_hole oval (at 0 -38.1 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 30 GP3))
    (pad 15 thru_hole oval (at 0 -35.56 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 65 PA13-D38))
    (pad 14 thru_hole oval (at 0 -33.02 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 72 PA18-D10-RX2))
    (pad 13 thru_hole oval (at 0 -30.48 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 71 PA16-D11-TX2))
    (pad 12 thru_hole oval (at 0 -27.94 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 68 PA17-D13-DEFLED))
    (pad 11 thru_hole oval (at 0 -25.4 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 13 PA22-SDA))
    (pad 10 thru_hole oval (at 0 -22.86 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 12 PA23-SCL))
    (pad 9 thru_hole oval (at 0 -20.32 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 69 PA19-D12))
    (pad 8 thru_hole oval (at 0 -17.78 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 70 PA20-D06))
    (pad 7 thru_hole oval (at 0 -15.24 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 73 PA21-D07))
    (pad 6 thru_hole oval (at 0 -12.7 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 66 PA14-D02))
    (pad 5 thru_hole oval (at 0 -10.16 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 67 PA15-D05))
    (pad 4 thru_hole oval (at 0 -7.62 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 22 PA24-USBD-))
    (pad 3 thru_hole oval (at 0 -5.08 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 21 PA25-USBD+))
    (pad 2 thru_hole oval (at 0 -2.54 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 2 +3V3))
    (pad 1 thru_hole rect (at 0 0 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 1 GND))
    (model ${KISYS3DMOD}/Connector_PinHeader_2.54mm.3dshapes/PinHeader_1x24_P2.54mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module LED_SMD:LED_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5FA7A02C)
    (at 76.56322 2.25298)
    (descr "LED SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "LED handsolder")
    (attr smd)
    (fp_text reference L_DEF1 (at -0.55626 -1.50368) (layer F.SilkS))
    (fp_text value Blue (at 0 1.27) (layer F.Fab) hide)
    (fp_text user %R (at 0 0) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 2 +3V3))
    (pad 1 smd roundrect (at -1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 7 "Net-(L_DEF1-Pad1)"))
    (model ${KISYS3DMOD}/LED_SMD.3dshapes/LED_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module LED_SMD:LED_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5FA7A02C)
    (at 15.35684 11.24458 90)
    (descr "LED SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "LED handsolder")
    (attr smd)
    (fp_text reference L_PWR1 (at 2.57048 -0.12192) (layer F.SilkS))
    (fp_text value Yellow (at 0 1.27 90) (layer F.Fab) hide)
    (fp_text user %R (at 0 0 90) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.025 0 90) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 2 +3V3))
    (pad 1 smd roundrect (at -1.025 0 90) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 8 "Net-(L_PWR1-Pad1)"))
    (model ${KISYS3DMOD}/LED_SMD.3dshapes/LED_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Connector_PinHeader_2.54mm:PinHeader_1x02_P2.54mm_Vertical (layer F.Cu) (tedit 5FA7AF16)
    (at 22.77618 11.21918 270)
    (descr "Through hole straight pin header, 1x02, 2.54mm pitch, single row")
    (tags "Through hole pin header THT 1x02 2.54mm single row")
    (fp_text reference J_PWR1 (at -2.36728 1.13284 180) (layer F.SilkS))
    (fp_text value Conn_01x02 (at 2.0574 1.0414) (layer F.Fab) hide)
    (fp_text user %R (at 0 1.27) (layer F.Fab) hide)
    (pad 2 thru_hole oval (at 0 2.54 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 2 +3V3))
    (pad 1 thru_hole rect (at 0 0 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 31 /3REG))
    (model ${KISYS3DMOD}/Connector_PinHeader_2.54mm.3dshapes/PinHeader_1x02_P2.54mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module z21g:BarrelJack_CUI_PJ-102AH_Horiz_4pin (layer F.Cu) (tedit 5EFBBC62)
    (at 8.89 19.812 270)
    (descr "Thin-pin DC Barrel Jack, https://cdn-shop.adafruit.com/datasheets/21mmdcjackDatasheet.pdf")
    (tags "Power Jack")
    (fp_text reference J_POW1 (at -5.58546 6.81228) (layer F.SilkS))
    (fp_text value Barrel_Jack_sw_4pin (at -2.032 -0.254 180) (layer F.Fab) hide)
    (fp_text user 3.5mm (at 2.9718 2.667) (layer F.SilkS))
    (fp_text user %R (at -3.175 3.4036) (layer F.Fab) hide)
    (pad 1 thru_hole circle (at 1.2 3 270) (size 2.6 2.6) (drill 1.6) (layers *.Cu *.Mask)
      (net 19 PWR_JACK))
    (pad 1 thru_hole rect (at 0 0 270) (size 2.6 2.6) (drill 1.6) (layers *.Cu *.Mask)
      (net 19 PWR_JACK))
    (pad 2 thru_hole circle (at 0 6 270) (size 2.6 2.6) (drill 1.6) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 2 thru_hole circle (at 4.7 3 270) (size 2.6 2.6) (drill 1.6) (layers *.Cu *.Mask)
      (net 1 GND))
    (model ${KISYS3DMOD}/Connector_BarrelJack.3dshapes/BarrelJack_CUI_PJ-102AH_Horizontal.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder (layer F.Cu) (tedit 5FA7A271)
    (at 63.46952 11.19124 90)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RGLED1 (at 0 -1.3716 90) (layer F.SilkS))
    (fp_text value 22 (at 0 1.27 90) (layer F.Fab) hide)
    (fp_text user %R (at 0 0.2032 90) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1 0 90) (size 1.2 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.208333)
      (net 68 PA17-D13-DEFLED))
    (pad 1 smd roundrect (at -1 0 90) (size 1.2 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.208333)
      (net 46 "Net-(RGLED1-Pad1)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder (layer F.Cu) (tedit 5FA7A380)
    (at 70.15988 24.9174 270)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference CMCP1 (at 0.04064 1.4732 270) (layer F.SilkS))
    (fp_text value 0.1uf (at -0.0508 1.1684 90) (layer F.Fab) hide)
    (fp_text user %R (at 0 0 90) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.0375 0 270) (size 1.175 1.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.212766)
      (net 1 GND))
    (pad 1 smd roundrect (at -1.0375 0 270) (size 1.175 1.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.212766)
      (net 2 +3V3))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder (layer F.Cu) (tedit 5FA7A271)
    (at 70.14464 12.57046 180)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RA0 (at -0.06096 1.40208) (layer F.SilkS))
    (fp_text value 10K (at 0 1.27) (layer F.Fab) hide)
    (fp_text user %R (at 0 0.2032) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1 0 180) (size 1.2 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.208333)
      (net 2 +3V3))
    (pad 1 smd roundrect (at -1 0 180) (size 1.2 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.208333)
      (net 45 "Net-(RA0-Pad1)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Jumper:SolderJumper-2_P1.3mm_Open_Pad1.0x1.5mm (layer B.Cu) (tedit 5FA7A88B)
    (at 73.85812 15.52448 180)
    (descr "SMD Solder Jumper, 1x1.5mm Pads, 0.3mm gap, open")
    (tags "solder jumper open")
    (attr virtual)
    (fp_text reference SP_A0 (at 0 1.6764) (layer B.SilkS))
    (fp_text value S_A0 (at 0.0508 -1.6256) (layer B.Fab) hide)
    (pad 1 smd rect (at -0.65 0 180) (size 1 1.5) (layers B.Cu B.Mask)
      (net 45 "Net-(RA0-Pad1)"))
    (pad 2 smd rect (at 0.65 0 180) (size 1 1.5) (layers B.Cu B.Mask)
      (net 1 GND))
  )
  (module z21g:SSOP-20_5.3x7.2mm_P0.65mm_fix (layer F.Cu) (tedit 5FF54FBC)
    (at 73.56348 17.99844 180)
    (descr "SSOP, 20 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/40001800C.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py")
    (tags "SSOP SO")
    (attr smd)
    (fp_text reference U_MCP23008 (at 0.18796 -4.31038) (layer F.SilkS))
    (fp_text value MCP23008 (at 0 4.55) (layer F.Fab) hide)
    (fp_text user %R (at 0 0) (layer F.Fab) hide)
    (pad 20 smd roundrect (at 3.5 -2.925 180) (size 1.9 0.43) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 2 +3V3))
    (pad 19 smd roundrect (at 3.5 -2.275 180) (size 1.9 0.43) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 24 GP7))
    (pad 18 smd roundrect (at 3.5 -1.625 180) (size 1.9 0.43) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 25 GP6))
    (pad 17 smd roundrect (at 3.5 -0.975 180) (size 1.9 0.43) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 26 GP5))
    (pad 16 smd roundrect (at 3.5 -0.325 180) (size 1.9 0.43) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 27 GP4))
    (pad 15 smd roundrect (at 3.5 0.325 180) (size 1.9 0.43) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 30 GP3))
    (pad 14 smd roundrect (at 3.5 0.975 180) (size 1.9 0.43) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 29 GP2))
    (pad 13 smd roundrect (at 3.5 1.625 180) (size 1.9 0.43) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 28 GP1))
    (pad 12 smd roundrect (at 3.5 2.275 180) (size 1.9 0.43) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 23 GP0))
    (pad 11 smd roundrect (at 3.5 2.925 180) (size 1.9 0.43) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 44 "Net-(U_MCP23008-Pad11)"))
    (pad 10 smd roundrect (at -3.5 2.925 180) (size 1.9 0.43) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 43 "Net-(U_MCP23008-Pad10)"))
    (pad 9 smd roundrect (at -3.5 2.275 180) (size 1.9 0.43) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 1 GND))
    (pad 8 smd roundrect (at -3.5 1.625 180) (size 1.9 0.43) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 42 "Net-(U_MCP23008-Pad8)"))
    (pad 7 smd roundrect (at -3.5 0.975 180) (size 1.9 0.43) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 41 "Net-(U_MCP23008-Pad7)"))
    (pad 6 smd roundrect (at -3.5 0.325 180) (size 1.9 0.43) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 4 ~RESET~))
    (pad 5 smd roundrect (at -3.5 -0.325 180) (size 1.9 0.43) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 45 "Net-(RA0-Pad1)"))
    (pad 4 smd roundrect (at -3.5 -0.975 180) (size 1.9 0.43) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 1 GND))
    (pad 3 smd roundrect (at -3.5 -1.625 180) (size 1.9 0.43) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 1 GND))
    (pad 2 smd roundrect (at -3.5 -2.275 180) (size 1.9 0.43) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 13 PA22-SDA))
    (pad 1 smd roundrect (at -3.5 -2.925 180) (size 1.9 0.43) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 12 PA23-SCL))
    (model ${KISYS3DMOD}/Package_SO.3dshapes/SSOP-20_5.3x7.2mm_P0.65mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder (layer F.Cu) (tedit 5FA7A271)
    (at 10.13968 27.19832 270)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RDMRST1 (at -0.34544 -1.51384 90) (layer F.SilkS))
    (fp_text value 330 (at 0 1.27 90) (layer F.Fab) hide)
    (fp_text user %R (at 0 0.2032 90) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1 0 270) (size 1.2 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.208333)
      (net 4 ~RESET~))
    (pad 1 smd roundrect (at -1 0 270) (size 1.2 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.208333)
      (net 76 "Net-(RDMRST1-Pad1)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder (layer F.Cu) (tedit 5FA7A380)
    (at 25.80894 28.77312)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference CBOOT1 (at 0.16002 1.4097) (layer F.SilkS))
    (fp_text value "0.1uf 50V" (at -0.0508 1.1684) (layer F.Fab) hide)
    (fp_text user %R (at 0 0) (layer F.Fab) hide)
    (pad 1 smd roundrect (at -1.0375 0) (size 1.175 1.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.212766)
      (net 78 /BOOT))
    (pad 2 smd roundrect (at 1.0375 0) (size 1.175 1.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.212766)
      (net 79 /SW))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder (layer F.Cu) (tedit 5FA7A380)
    (at 28.35656 20.50288 180)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference CFIL1 (at -3.15722 -0.12192) (layer F.SilkS))
    (fp_text value 0.1uf (at -0.0508 1.1684) (layer F.Fab) hide)
    (fp_text user %R (at 0 0) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.0375 0 180) (size 1.175 1.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.212766)
      (net 1 GND))
    (pad 1 smd roundrect (at -1.0375 0 180) (size 1.175 1.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.212766)
      (net 31 /3REG))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_1210_3225Metric_Pad1.33x2.70mm_HandSolder (layer F.Cu) (tedit 5FBB070D)
    (at 22.66696 14.78534)
    (descr "Capacitor SMD 1210 (3225 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference CIN1 (at -2.95402 -0.32512 90) (layer F.SilkS))
    (fp_text value "10uf 50V" (at 0 1.8796) (layer F.Fab) hide)
    (fp_text user %R (at 0 0) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.5625 0) (size 1.325 2.7) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.188679)
      (net 1 GND))
    (pad 1 smd roundrect (at -1.5625 0) (size 1.325 2.7) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.188679)
      (net 80 /VIN))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_1210_3225Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_1210_3225Metric_Pad1.33x2.70mm_HandSolder (layer F.Cu) (tedit 5FBB070D)
    (at 27.84094 17.72158 180)
    (descr "Capacitor SMD 1210 (3225 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference COUT1 (at -3.08102 -0.02032 90) (layer F.SilkS))
    (fp_text value 22uf (at 0 1.8796) (layer F.Fab) hide)
    (fp_text user %R (at 0 0) (layer F.Fab) hide)
    (pad 1 smd roundrect (at -1.5625 0 180) (size 1.325 2.7) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.188679)
      (net 31 /3REG))
    (pad 2 smd roundrect (at 1.5625 0 180) (size 1.325 2.7) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.188679)
      (net 1 GND))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_1210_3225Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_1210_3225Metric_Pad1.33x2.70mm_HandSolder (layer F.Cu) (tedit 5FBB070D)
    (at 27.84094 14.39418 180)
    (descr "Capacitor SMD 1210 (3225 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference COUT2 (at -3.04546 -0.02032 90) (layer F.SilkS))
    (fp_text value 22uf (at 0 1.8796) (layer F.Fab) hide)
    (fp_text user %R (at 0 0) (layer F.Fab) hide)
    (pad 1 smd roundrect (at -1.5625 0 180) (size 1.325 2.7) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.188679)
      (net 31 /3REG))
    (pad 2 smd roundrect (at 1.5625 0 180) (size 1.325 2.7) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.188679)
      (net 1 GND))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_1210_3225Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder (layer F.Cu) (tedit 5FA7A380)
    (at 21.80844 28.65882)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference CVCC1 (at -0.02286 1.31826) (layer F.SilkS))
    (fp_text value "1uf 16V min" (at -0.0508 1.1684) (layer F.Fab) hide)
    (fp_text user %R (at 0 0) (layer F.Fab) hide)
    (pad 1 smd roundrect (at -1.0375 0) (size 1.175 1.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.212766)
      (net 1 GND))
    (pad 2 smd roundrect (at 1.0375 0) (size 1.175 1.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.212766)
      (net 81 /VCC))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder (layer F.Cu) (tedit 5FA7A271)
    (at 18.76298 23.82774 90)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RFBT1 (at -0.00508 -1.43764 90) (layer F.SilkS))
    (fp_text value "100K 1%" (at 0 1.27 90) (layer F.Fab) hide)
    (fp_text user %R (at 0 0.2032 90) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1 0 90) (size 1.2 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.208333)
      (net 31 /3REG))
    (pad 1 smd roundrect (at -1 0 90) (size 1.2 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.208333)
      (net 82 /FB))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder (layer F.Cu) (tedit 5FA7A271)
    (at 18.76298 27.7876 90)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RRBB1 (at -0.10668 -1.41986 90) (layer F.SilkS))
    (fp_text value "43.2K 1%" (at 0 1.27 90) (layer F.Fab) hide)
    (fp_text user %R (at 0 0.2032 90) (layer F.Fab) hide)
    (pad 1 smd roundrect (at -1 0 90) (size 1.2 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.208333)
      (net 1 GND))
    (pad 2 smd roundrect (at 1 0 90) (size 1.2 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.208333)
      (net 82 /FB))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
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  (gr_text "Copyright S. Cooper 2021.\nYou may redistribute and modify this documentation under the terms of the CERN OHL v.1.2.\nThis documentation is distributed WITHOUT ANY EXPRESS OR IMPLIED WARRANTY, \nINCLUDING OF MERCHANTABILITY, SATISFACTORY QUALITY AND FITNESS FOR A PARTICULAR PURPOSE.\nPlease see the CERN OHL v.1.2 for applicable conditions. (http://ohwr.org/cernohl)." (at 38.11524 30.8483) (layer B.SilkS))
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