(kicad_pcb (version 20171130) (host pcbnew "(6.0.0-rc1-dev-1419-gaec6e86c4)")
  (general
    (thickness 1.6)
    (drawings 20)
    (tracks 86)
    (zones 0)
    (modules 7)
    (nets 14)
  )
  (page A)
  (title_block
    (title "Shaft Encoder")
    (date 2018-12-12)
    (rev n/c)
    (company DMFE)
    (comment 1 "AS5047D based Shaft Angle Encode")
  )
  (layers
    (0 F.Cu signal)
    (31 B.Cu signal)
    (32 B.Adhes user)
    (33 F.Adhes user)
    (34 B.Paste user hide)
    (35 F.Paste user hide)
    (36 B.SilkS user)
    (37 F.SilkS user)
    (38 B.Mask user hide)
    (39 F.Mask user hide)
    (40 Dwgs.User user hide)
    (41 Cmts.User user hide)
    (42 Eco1.User user hide)
    (43 Eco2.User user hide)
    (44 Edge.Cuts user)
    (45 Margin user)
    (46 B.CrtYd user)
    (47 F.CrtYd user)
    (48 B.Fab user hide)
    (49 F.Fab user hide)
  )
  (setup
    (last_trace_width 0.254)
    (user_trace_width 0.254)
    (user_trace_width 0.3048)
    (user_trace_width 0.508)
    (trace_clearance 0.2)
    (zone_clearance 0.508)
    (zone_45_only no)
    (trace_min 0.2)
    (via_size 0.8)
    (via_drill 0.4)
    (via_min_size 0.4)
    (via_min_drill 0.3)
    (user_via 0.635 0.381)
    (uvia_size 0.3)
    (uvia_drill 0.1)
    (uvias_allowed no)
    (uvia_min_size 0.2)
    (uvia_min_drill 0.1)
    (edge_width 0.05)
    (segment_width 0.2)
    (pcb_text_width 0.3)
    (pcb_text_size 1.5 1.5)
    (mod_edge_width 0.12)
    (mod_text_size 1 1)
    (mod_text_width 0.15)
    (pad_size 1.524 1.524)
    (pad_drill 0.762)
    (pad_to_mask_clearance 0.051)
    (solder_mask_min_width 0.25)
    (aux_axis_origin 0 0)
    (visible_elements FFFFFF7F)
    (pcbplotparams
      (layerselection 0x010fc_ffffffff)
      (usegerberextensions false)
      (usegerberattributes false)
      (usegerberadvancedattributes false)
      (creategerberjobfile false)
      (excludeedgelayer true)
      (linewidth 0.100000)
      (plotframeref false)
      (viasonmask false)
      (mode 1)
      (useauxorigin false)
      (hpglpennumber 1)
      (hpglpenspeed 20)
      (hpglpendiameter 15.000000)
      (psnegative false)
      (psa4output false)
      (plotreference true)
      (plotvalue true)
      (plotinvisibletext false)
      (padsonsilk false)
      (subtractmaskfromsilk false)
      (outputformat 1)
      (mirror false)
      (drillshape 1)
      (scaleselection 1)
      (outputdirectory ""))
  )
  (net 0 "")
  (net 1 "Net-(C1-Pad1)")
  (net 2 GND)
  (net 3 +5V)
  (net 4 /CSn)
  (net 5 /CLK)
  (net 6 /MISO)
  (net 7 /MOSI)
  (net 8 /A)
  (net 9 /U)
  (net 10 /B)
  (net 11 /V)
  (net 12 /I)
  (net 13 /W)
  (net_class Default "This is the default net class."
    (clearance 0.2)
    (trace_width 0.25)
    (via_dia 0.8)
    (via_drill 0.4)
    (uvia_dia 0.3)
    (uvia_drill 0.1)
    (add_net +5V)
    (add_net /A)
    (add_net /B)
    (add_net /CLK)
    (add_net /CSn)
    (add_net /I)
    (add_net /MISO)
    (add_net /MOSI)
    (add_net /U)
    (add_net /V)
    (add_net /W)
    (add_net GND)
    (add_net "Net-(C1-Pad1)")
  )
  (module Capacitor_SMD:C_0805_2012Metric (layer F.Cu) (tedit 5B36C52B)
    (at 158.75 109.22)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags capacitor)
    (attr smd)
    (fp_text reference C1 (at 0 1.905) (layer F.SilkS))
    (fp_text value 1uF (at 0 1.65) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 1 smd roundrect (at -0.9375 0) (size 0.975 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 1 "Net-(C1-Pad1)"))
    (pad 2 smd roundrect (at 0.9375 0) (size 0.975 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 2 GND))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric (layer F.Cu) (tedit 5B36C52B)
    (at 158.75 107.315)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags capacitor)
    (attr smd)
    (fp_text reference C2 (at 0 -1.65) (layer F.SilkS))
    (fp_text value .1uF (at 0 1.65) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd roundrect (at 0.9375 0) (size 0.975 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 2 GND))
    (pad 1 smd roundrect (at -0.9375 0) (size 0.975 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 3 +5V))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Package_SO:TSSOP-14_4.4x5mm_P0.65mm (layer B.Cu) (tedit 5A02F25C)
    (at 158.75 107.95 180)
    (descr "14-Lead Plastic Thin Shrink Small Outline (ST)-4.4 mm Body [TSSOP] (see Microchip Packaging Specification 00000049BS.pdf)")
    (tags "SSOP 0.65")
    (attr smd)
    (fp_text reference U1 (at 0 3.55 180) (layer B.SilkS))
    (fp_text value AS5047D (at 0 -3.55 180) (layer F.Fab))
    (fp_text user %R (at 0 0 180) (layer F.Fab))
    (pad 1 smd rect (at -2.95 1.95 180) (size 1.45 0.45) (layers B.Cu B.Paste B.Mask)
      (net 4 /CSn))
    (pad 2 smd rect (at -2.95 1.3 180) (size 1.45 0.45) (layers B.Cu B.Paste B.Mask)
      (net 5 /CLK))
    (pad 3 smd rect (at -2.95 0.65 180) (size 1.45 0.45) (layers B.Cu B.Paste B.Mask)
      (net 6 /MISO))
    (pad 4 smd rect (at -2.95 0 180) (size 1.45 0.45) (layers B.Cu B.Paste B.Mask)
      (net 7 /MOSI))
    (pad 5 smd rect (at -2.95 -0.65 180) (size 1.45 0.45) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (pad 6 smd rect (at -2.95 -1.3 180) (size 1.45 0.45) (layers B.Cu B.Paste B.Mask)
      (net 10 /B))
    (pad 7 smd rect (at -2.95 -1.95 180) (size 1.45 0.45) (layers B.Cu B.Paste B.Mask)
      (net 8 /A))
    (pad 8 smd rect (at 2.95 -1.95 180) (size 1.45 0.45) (layers B.Cu B.Paste B.Mask)
      (net 13 /W))
    (pad 9 smd rect (at 2.95 -1.3 180) (size 1.45 0.45) (layers B.Cu B.Paste B.Mask)
      (net 11 /V))
    (pad 10 smd rect (at 2.95 -0.65 180) (size 1.45 0.45) (layers B.Cu B.Paste B.Mask)
      (net 9 /U))
    (pad 11 smd rect (at 2.95 0 180) (size 1.45 0.45) (layers B.Cu B.Paste B.Mask)
      (net 3 +5V))
    (pad 12 smd rect (at 2.95 0.65 180) (size 1.45 0.45) (layers B.Cu B.Paste B.Mask)
      (net 1 "Net-(C1-Pad1)"))
    (pad 13 smd rect (at 2.95 1.3 180) (size 1.45 0.45) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (pad 14 smd rect (at 2.95 1.95 180) (size 1.45 0.45) (layers B.Cu B.Paste B.Mask)
      (net 12 /I))
    (model ${KISYS3DMOD}/Package_SO.3dshapes/TSSOP-14_4.4x5mm_P0.65mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module MountingHole:MountingHole_2.1mm (layer F.Cu) (tedit 5B924765)
    (at 158.75 101.6)
    (descr "Mounting Hole 2.1mm, no annular")
    (tags "mounting hole 2.1mm no annular")
    (attr virtual)
    (fp_text reference H1 (at 0 -3.2) (layer F.SilkS) hide)
    (fp_text value MountingHole_2.1mm (at 0 3.2) (layer F.Fab))
    (fp_text user %R (at 0.3 0) (layer F.Fab))
    (pad "" np_thru_hole circle (at 0 0) (size 2.1 2.1) (drill 2.1) (layers *.Cu *.Mask))
  )
  (module MountingHole:MountingHole_2.1mm (layer F.Cu) (tedit 5B924765)
    (at 158.75 114.3)
    (descr "Mounting Hole 2.1mm, no annular")
    (tags "mounting hole 2.1mm no annular")
    (attr virtual)
    (fp_text reference H2 (at 0 -3.2) (layer F.SilkS) hide)
    (fp_text value MountingHole_2.1mm (at 0 3.2) (layer F.Fab))
    (fp_text user %R (at 0.3 0) (layer F.Fab))
    (pad "" np_thru_hole circle (at 0 0) (size 2.1 2.1) (drill 2.1) (layers *.Cu *.Mask))
  )
  (module Connector_Molex:Molex_KK-254_AE-6410-06A_1x06_P2.54mm_Vertical (layer F.Cu) (tedit 5B78013E)
    (at 165.1 100.965 270)
    (descr "Molex KK-254 Interconnect System, old/engineering part number: AE-6410-06A example for new part number: 22-27-2061, 6 Pins (http://www.molex.com/pdm_docs/sd/022272021_sd.pdf), generated with kicad-footprint-generator")
    (tags "connector Molex KK-254 side entry")
    (fp_text reference J1 (at -0.254 4.318) (layer F.SilkS))
    (fp_text value Conn_01x06 (at 6.35 4.08 270) (layer F.Fab))
    (fp_text user %R (at 6.35 -2.22 270) (layer F.Fab))
    (pad 1 thru_hole roundrect (at 0 0 270) (size 1.74 2.2) (drill 1.2) (layers *.Cu *.Mask) (roundrect_rratio 0.143678)
      (net 3 +5V))
    (pad 2 thru_hole oval (at 2.54 0 270) (size 1.74 2.2) (drill 1.2) (layers *.Cu *.Mask)
      (net 2 GND))
    (pad 3 thru_hole oval (at 5.08 0 270) (size 1.74 2.2) (drill 1.2) (layers *.Cu *.Mask)
      (net 4 /CSn))
    (pad 4 thru_hole oval (at 7.62 0 270) (size 1.74 2.2) (drill 1.2) (layers *.Cu *.Mask)
      (net 5 /CLK))
    (pad 5 thru_hole oval (at 10.16 0 270) (size 1.74 2.2) (drill 1.2) (layers *.Cu *.Mask)
      (net 6 /MISO))
    (pad 6 thru_hole oval (at 12.7 0 270) (size 1.74 2.2) (drill 1.2) (layers *.Cu *.Mask)
      (net 7 /MOSI))
    (model ${KISYS3DMOD}/Connector_Molex.3dshapes/Molex_KK-254_AE-6410-06A_1x06_P2.54mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Connector_PinHeader_2.54mm:PinHeader_2x04_P2.54mm_Vertical (layer F.Cu) (tedit 59FED5CC)
    (at 149.86 104.14)
    (descr "Through hole straight pin header, 2x04, 2.54mm pitch, double rows")
    (tags "Through hole pin header THT 2x04 2.54mm double row")
    (fp_text reference J2 (at 1.27 -2.33) (layer F.SilkS))
    (fp_text value Conn_02x04_Odd_Even (at 1.27 9.95) (layer F.Fab))
    (fp_text user %R (at 1.27 3.81 90) (layer F.Fab))
    (pad 1 thru_hole rect (at 0 0) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 3 +5V))
    (pad 2 thru_hole oval (at 2.54 0) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 2 GND))
    (pad 3 thru_hole oval (at 0 2.54) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 8 /A))
    (pad 4 thru_hole oval (at 2.54 2.54) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 9 /U))
    (pad 5 thru_hole oval (at 0 5.08) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 10 /B))
    (pad 6 thru_hole oval (at 2.54 5.08) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 11 /V))
    (pad 7 thru_hole oval (at 0 7.62) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 12 /I))
    (pad 8 thru_hole oval (at 2.54 7.62) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 13 /W))
    (model ${KISYS3DMOD}/Connector_PinHeader_2.54mm.3dshapes/PinHeader_2x04_P2.54mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (gr_text MOSI (at 161.798 114.173) (layer B.SilkS))
  (gr_text MISO (at 161.671 111.633) (layer B.SilkS))
  (gr_text CK (at 167.132 109.982) (layer B.SilkS))
  (gr_text CS (at 167.132 107.315) (layer B.SilkS))
  (gr_text GND (at 162.179 103.505) (layer B.SilkS))
  (gr_text +5V (at 162.306 100.965) (layer B.SilkS))
  (gr_text +5V (at 150.114 102.362) (layer B.SilkS))
  (gr_text GND (at 154.94 104.14) (layer B.SilkS))
  (gr_text W (at 154.051 112.141) (layer B.SilkS))
  (gr_text V (at 153.924 109.728) (layer B.SilkS))
  (gr_text U (at 153.797 107.696) (layer B.SilkS))
  (gr_text I (at 148.463 112.522) (layer B.SilkS))
  (gr_text B (at 148.59 110.363) (layer B.SilkS))
  (gr_text A (at 148.463 107.442) (layer B.SilkS))
  (gr_text ENC1 (at 150.876 115.062) (layer F.SilkS))
  (gr_text "DMFE 2018" (at 152.527 99.441) (layer F.SilkS))
  (gr_line (start 147.955 116.205) (end 147.955 98.425) (layer Edge.Cuts) (width 0.05))
  (gr_line (start 168.275 116.205) (end 147.955 116.205) (layer Edge.Cuts) (width 0.05))
  (gr_line (start 168.275 98.425) (end 168.275 116.205) (layer Edge.Cuts) (width 0.05))
  (gr_line (start 147.955 98.425) (end 168.275 98.425) (layer Edge.Cuts) (width 0.05))
  (zone (net 2) (net_name GND) (layer F.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.3048))
    (min_thickness 0.1524)
    (fill yes (arc_segments 16) (thermal_gap 0.3048) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 148.209 98.679) (xy 168.021 98.679) (xy 168.021 115.951) (xy 148.209 115.951)
      )
    )
  )
  (zone (net 2) (net_name GND) (layer B.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.3048))
    (min_thickness 0.1524)
    (fill yes (arc_segments 16) (thermal_gap 0.3048) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 148.209 98.679) (xy 168.021 98.679) (xy 168.021 115.951) (xy 148.209 115.951)
      )
    )
  )
)
