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  (general
    (links 49)
    (no_connects 2)
    (area -17.314835 -26.508 17.131 20.000001)
    (thickness 1.6)
    (drawings 21)
    (tracks 191)
    (zones 0)
    (modules 35)
    (nets 23)
  )
  (page A4)
  (layers
    (0 F.Cu signal)
    (31 B.Cu signal)
    (32 B.Adhes user hide)
    (33 F.Adhes user hide)
    (34 B.Paste user hide)
    (35 F.Paste user hide)
    (36 B.SilkS user)
    (37 F.SilkS user)
    (38 B.Mask user)
    (39 F.Mask user)
    (40 Dwgs.User user hide)
    (41 Cmts.User user)
    (42 Eco1.User user)
    (43 Eco2.User user)
    (44 Edge.Cuts user)
    (45 Margin user)
    (46 B.CrtYd user)
    (47 F.CrtYd user)
    (48 B.Fab user)
    (49 F.Fab user)
  )
  (setup
    (last_trace_width 0.254)
    (user_trace_width 0.1524)
    (user_trace_width 0.2)
    (user_trace_width 0.25)
    (user_trace_width 0.3)
    (user_trace_width 0.4)
    (user_trace_width 0.5)
    (user_trace_width 0.6)
    (user_trace_width 0.8)
    (trace_clearance 0.254)
    (zone_clearance 0.1524)
    (zone_45_only no)
    (trace_min 0.1524)
    (segment_width 0.127)
    (edge_width 0.127)
    (via_size 0.6858)
    (via_drill 0.3302)
    (via_min_size 0.6858)
    (via_min_drill 0.3302)
    (uvia_size 0.508)
    (uvia_drill 0.127)
    (uvias_allowed no)
    (uvia_min_size 0.508)
    (uvia_min_drill 0.127)
    (pcb_text_width 0.127)
    (pcb_text_size 0.6 0.6)
    (mod_edge_width 0.127)
    (mod_text_size 0.6 0.6)
    (mod_text_width 0.127)
    (pad_size 4.5 4.5)
    (pad_drill 3.5)
    (pad_to_mask_clearance 0.05)
    (pad_to_paste_clearance -0.04)
    (aux_axis_origin 0 0)
    (visible_elements FFFEFFFF)
    (pcbplotparams
      (layerselection 0x010f0_80000001)
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      (viasonmask false)
      (mode 1)
      (useauxorigin false)
      (hpglpennumber 1)
      (hpglpenspeed 20)
      (hpglpendiameter 15)
      (hpglpenoverlay 2)
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      (plotreference true)
      (plotvalue true)
      (plotinvisibletext false)
      (padsonsilk false)
      (subtractmaskfromsilk true)
      (outputformat 1)
      (mirror false)
      (drillshape 0)
      (scaleselection 1)
      (outputdirectory CAM/))
  )
  (net 0 "")
  (net 1 /BLUE)
  (net 2 "Net-(BZ1-Pad2)")
  (net 3 "Net-(BZ1-Pad1)")
  (net 4 /BUZZER)
  (net 5 VCC)
  (net 6 GND)
  (net 7 "Net-(D1-Pad2)")
  (net 8 /GREEN)
  (net 9 "Net-(J9-Pad1)")
  (net 10 /BLUE_MOS)
  (net 11 /GREEN_MOS)
  (net 12 /RED_MOS)
  (net 13 /RESET)
  (net 14 /RED)
  (net 15 /TOUCH)
  (net 16 "Net-(Q1-Pad1)")
  (net 17 "Net-(Q1-Pad3)")
  (net 18 "Net-(Q2-Pad1)")
  (net 19 "Net-(Q2-Pad3)")
  (net 20 "Net-(Q3-Pad1)")
  (net 21 "Net-(Q3-Pad3)")
  (net 22 "Net-(Q4-Pad1)")
  (net_class Default "Dit is de standaard class."
    (clearance 0.254)
    (trace_width 0.254)
    (via_dia 0.6858)
    (via_drill 0.3302)
    (uvia_dia 0.508)
    (uvia_drill 0.127)
    (add_net GND)
    (add_net VCC)
  )
  (net_class 0.2mm ""
    (clearance 0.2)
    (trace_width 0.2)
    (via_dia 0.6858)
    (via_drill 0.3302)
    (uvia_dia 0.508)
    (uvia_drill 0.127)
    (add_net /BLUE)
    (add_net /BLUE_MOS)
    (add_net /BUZZER)
    (add_net /GREEN)
    (add_net /GREEN_MOS)
    (add_net /RED)
    (add_net /RED_MOS)
    (add_net /RESET)
    (add_net /TOUCH)
    (add_net "Net-(BZ1-Pad1)")
    (add_net "Net-(BZ1-Pad2)")
    (add_net "Net-(D1-Pad2)")
    (add_net "Net-(J9-Pad1)")
    (add_net "Net-(Q1-Pad1)")
    (add_net "Net-(Q1-Pad3)")
    (add_net "Net-(Q2-Pad1)")
    (add_net "Net-(Q2-Pad3)")
    (add_net "Net-(Q3-Pad1)")
    (add_net "Net-(Q3-Pad3)")
    (add_net "Net-(Q4-Pad1)")
  )
  (net_class Minimal ""
    (clearance 0.1524)
    (trace_width 0.1524)
    (via_dia 0.6858)
    (via_drill 0.3302)
    (uvia_dia 0.508)
    (uvia_drill 0.127)
  )
  (module SMD_Packages:1Pin (layer B.Cu) (tedit 59FE30F7)
    (at 0 11.43 180)
    (descr "module 1 pin (ou trou mecanique de percage)")
    (tags DEV)
    (fp_text reference J9 (at 0.01 3.53 180) (layer B.SilkS) hide)
    (fp_text value TOUCH_PAD_COPPER (at 0.24892 -3.74904 180) (layer B.Fab))
    (pad 1 smd rect (at 0 0 180) (size 4.064 4.064) (layers B.Cu)
      (net 9 "Net-(J9-Pad1)"))
  )
  (module Diodes_SMD:D_SC-80_HandSoldering (layer B.Cu) (tedit 59FE3006)
    (at 5.715 -2.54 270)
    (descr "JEITA SC-80")
    (tags SC-80)
    (attr smd)
    (fp_text reference D1 (at -2.94 -0.005 360) (layer B.SilkS))
    (fp_text value D_Zener (at 0 -1.6 270) (layer B.Fab))
    (fp_text user %R (at 0 1.5 270) (layer B.Fab))
    (pad 2 smd rect (at 1.1 0 270) (size 1.1 0.6) (layers B.Cu B.Paste B.Mask)
      (net 7 "Net-(D1-Pad2)"))
    (pad 1 smd rect (at -1.1 0 270) (size 1.1 0.6) (layers B.Cu B.Paste B.Mask)
      (net 3 "Net-(BZ1-Pad1)"))
    (model ${KISYS3DMOD}/Diodes_SMD.3dshapes/D_SC-80.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Wire_Pads:SolderWirePad_single_1-2mmDrill (layer F.Cu) (tedit 59FE2E16)
    (at 12.827 3.81 90)
    (fp_text reference B0 (at 0.01 -2.447 90) (layer F.SilkS))
    (fp_text value TEST_1P (at -1.905 3.175 90) (layer F.Fab))
    (pad 1 thru_hole circle (at 0 0 90) (size 2.2 2.2) (drill 1.19888) (layers *.Cu *.Mask)
      (net 1 /BLUE))
  )
  (module bzel-t72-0505:t72-0505 (layer B.Cu) (tedit 59FE2FDB)
    (at 0 -5.715 180)
    (fp_text reference BZ1 (at 0.3 0 180) (layer B.SilkS))
    (fp_text value "Magnetic Buzzer" (at 0 3.9 180) (layer B.Fab))
    (pad 2 smd rect (at 2.8 -1.9 180) (size 2 0.7) (layers B.Cu B.Paste B.Mask)
      (net 2 "Net-(BZ1-Pad2)"))
    (pad 1 smd rect (at -2.8 -1.9 180) (size 2 0.7) (layers B.Cu B.Paste B.Mask)
      (net 3 "Net-(BZ1-Pad1)"))
    (pad "" smd rect (at -2.8 1.9 180) (size 2 0.7) (layers B.Cu B.Paste B.Mask))
  )
  (module Wire_Pads:SolderWirePad_single_1-2mmDrill (layer F.Cu) (tedit 59FE2C99)
    (at -12.827 -1.27 270)
    (fp_text reference bz3 (at 0.02 -2.287 270) (layer F.SilkS))
    (fp_text value TEST_1P (at -1.905 3.175 270) (layer F.Fab))
    (pad 1 thru_hole circle (at 0 0 270) (size 2.2 2.2) (drill 1.19888) (layers *.Cu *.Mask)
      (net 4 /BUZZER))
  )
  (module Capacitors_SMD:C_0805 (layer F.Cu) (tedit 59FE2C65)
    (at -7.62 2.54 60)
    (descr "Capacitor SMD 0805, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0805")
    (attr smd)
    (fp_text reference C1 (at 2.762121 -0.035866 150) (layer F.SilkS))
    (fp_text value 100nf (at 0 1.75 60) (layer F.Fab))
    (fp_text user %R (at 0 -1.5 60) (layer F.Fab))
    (pad 1 smd rect (at -1 0 60) (size 1 1.25) (layers F.Cu F.Paste F.Mask)
      (net 5 VCC))
    (pad 2 smd rect (at 1 0 60) (size 1 1.25) (layers F.Cu F.Paste F.Mask)
      (net 6 GND))
    (model Capacitors_SMD.3dshapes/C_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Wire_Pads:SolderWirePad_single_1-2mmDrill (layer F.Cu) (tedit 59FE2E04)
    (at 12.573 1.27 90)
    (fp_text reference G1 (at 0.02 -2.193 90) (layer F.SilkS))
    (fp_text value TEST_1P (at -1.905 3.175 90) (layer F.Fab))
    (pad 1 thru_hole circle (at 0 0 90) (size 2.2 2.2) (drill 1.19888) (layers *.Cu *.Mask)
      (net 8 /GREEN))
  )
  (module Wire_Pads:SolderWirePad_single_1-2mmDrill (layer F.Cu) (tedit 59FE2FB8)
    (at -12.827 3.81 270)
    (fp_text reference - (at 0.06 -1.967 270) (layer F.SilkS))
    (fp_text value TEST_1P (at -1.905 3.175 270) (layer F.Fab))
    (pad 1 thru_hole circle (at 0 0 270) (size 2.2 2.2) (drill 1.19888) (layers *.Cu *.Mask)
      (net 6 GND))
  )
  (module wrirepad:singlesolderpad (layer B.Cu) (tedit 59FE2F9F)
    (at -5.08 -10.16 300)
    (fp_text reference - (at -2.338032 -0.010411 390) (layer B.SilkS))
    (fp_text value TEST_1P (at 0 4 300) (layer B.Fab))
    (pad 1 smd rect (at 0 1.5 300) (size 2 2) (layers B.Cu B.Paste B.Mask)
      (net 6 GND))
    (pad 1 smd rect (at 0 -1.5 300) (size 2 2) (layers B.Cu B.Paste B.Mask)
      (net 6 GND))
  )
  (module ASMB-MTB0-0A3A2:ASMB-MTB0-0A3A2 (layer F.Cu) (tedit 59FE2CCC)
    (at 0 0)
    (fp_text reference L1 (at -3.4 -0.34) (layer F.SilkS))
    (fp_text value ASMB-MTB0-0A3A2 (at -4 0 270) (layer F.Fab))
    (pad 1 smd rect (at -0.75 1.5) (size 1.1 1.5) (layers F.Cu F.Paste F.Mask)
      (net 5 VCC))
    (pad 1 smd rect (at -1.3 1.5) (size 2.2 3) (layers F.Cu)
      (net 5 VCC))
    (pad 2 smd rect (at -0.75 -1.5) (size 1.1 1.5) (layers F.Cu F.Paste F.Mask)
      (net 10 /BLUE_MOS))
    (pad 3 smd rect (at 0.75 -1.5) (size 1.1 1.5) (layers F.Cu F.Paste F.Mask)
      (net 11 /GREEN_MOS))
    (pad 4 smd rect (at 0.75 1.5) (size 1.1 1.5) (layers F.Cu F.Paste F.Mask)
      (net 12 /RED_MOS))
  )
  (module ASMB-MTB0-0A3A2:ASMB-MTB0-0A3A2 (layer B.Cu) (tedit 59FE301B)
    (at 0 0 90)
    (fp_text reference L2 (at -0.01 -4.01 180) (layer B.SilkS))
    (fp_text value ASMB-MTB0-0A3A2 (at -4 0 180) (layer B.Fab))
    (pad 1 smd rect (at -0.75 -1.5 90) (size 1.1 1.5) (layers B.Cu B.Paste B.Mask)
      (net 5 VCC))
    (pad 1 smd rect (at -1.3 -1.5 90) (size 2.2 3) (layers B.Cu)
      (net 5 VCC))
    (pad 2 smd rect (at -0.75 1.5 90) (size 1.1 1.5) (layers B.Cu B.Paste B.Mask)
      (net 10 /BLUE_MOS))
    (pad 3 smd rect (at 0.75 1.5 90) (size 1.1 1.5) (layers B.Cu B.Paste B.Mask)
      (net 11 /GREEN_MOS))
    (pad 4 smd rect (at 0.75 -1.5 90) (size 1.1 1.5) (layers B.Cu B.Paste B.Mask)
      (net 12 /RED_MOS))
  )
  (module Housings_SOIC:SOIJ-8_5.3x5.3mm_Pitch1.27mm (layer F.Cu) (tedit 59FE2C2E)
    (at -5.08 7.62 60)
    (descr "8-Lead Plastic Small Outline (SM) - Medium, 5.28 mm Body [SOIC] (see Microchip Packaging Specification 00000049BS.pdf)")
    (tags "SOIC 1.27")
    (attr smd)
    (fp_text reference mcu1 (at 0.252769 -3.402192 60) (layer F.SilkS))
    (fp_text value ATTINY85V-10SU (at 0 3.68 60) (layer F.Fab))
    (fp_text user %R (at 0 0 60) (layer F.Fab))
    (pad 1 smd rect (at -3.65 -1.905 60) (size 1.7 0.65) (layers F.Cu F.Paste F.Mask)
      (net 13 /RESET))
    (pad 2 smd rect (at -3.65 -0.635 60) (size 1.7 0.65) (layers F.Cu F.Paste F.Mask)
      (net 4 /BUZZER))
    (pad 3 smd rect (at -3.65 0.635 60) (size 1.7 0.65) (layers F.Cu F.Paste F.Mask)
      (net 14 /RED))
    (pad 4 smd rect (at -3.65 1.905 60) (size 1.7 0.65) (layers F.Cu F.Paste F.Mask)
      (net 6 GND))
    (pad 5 smd rect (at 3.65 1.905 60) (size 1.7 0.65) (layers F.Cu F.Paste F.Mask)
      (net 1 /BLUE))
    (pad 6 smd rect (at 3.65 0.635 60) (size 1.7 0.65) (layers F.Cu F.Paste F.Mask)
      (net 8 /GREEN))
    (pad 7 smd rect (at 3.65 -0.635 60) (size 1.7 0.65) (layers F.Cu F.Paste F.Mask)
      (net 15 /TOUCH))
    (pad 8 smd rect (at 3.65 -1.905 60) (size 1.7 0.65) (layers F.Cu F.Paste F.Mask)
      (net 5 VCC))
    (model ${KISYS3DMOD}/Housings_SOIC.3dshapes/SOIJ-8_5.3x5.3mm_Pitch1.27mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module TO_SOT_Packages_SMD:SOT-23 (layer F.Cu) (tedit 59FE2DC9)
    (at 5.08 -5.08 180)
    (descr "SOT-23, Standard")
    (tags SOT-23)
    (attr smd)
    (fp_text reference Q1 (at -0.01 2.37 180) (layer F.SilkS))
    (fp_text value NTR4003NT3G (at 0 2.5 180) (layer F.Fab))
    (fp_text user %R (at 0 0 270) (layer F.Fab))
    (pad 1 smd rect (at -1 -0.95 180) (size 0.9 0.8) (layers F.Cu F.Paste F.Mask)
      (net 16 "Net-(Q1-Pad1)"))
    (pad 2 smd rect (at -1 0.95 180) (size 0.9 0.8) (layers F.Cu F.Paste F.Mask)
      (net 6 GND))
    (pad 3 smd rect (at 1 0 180) (size 0.9 0.8) (layers F.Cu F.Paste F.Mask)
      (net 17 "Net-(Q1-Pad3)"))
    (model ${KISYS3DMOD}/TO_SOT_Packages_SMD.3dshapes/SOT-23.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module TO_SOT_Packages_SMD:SOT-23 (layer F.Cu) (tedit 59FE2D52)
    (at 0 -7.62)
    (descr "SOT-23, Standard")
    (tags SOT-23)
    (attr smd)
    (fp_text reference Q2 (at -0.04 -2.29) (layer F.SilkS))
    (fp_text value NTR4003NT3G (at 0 2.5) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 1 smd rect (at -1 -0.95) (size 0.9 0.8) (layers F.Cu F.Paste F.Mask)
      (net 18 "Net-(Q2-Pad1)"))
    (pad 2 smd rect (at -1 0.95) (size 0.9 0.8) (layers F.Cu F.Paste F.Mask)
      (net 6 GND))
    (pad 3 smd rect (at 1 0) (size 0.9 0.8) (layers F.Cu F.Paste F.Mask)
      (net 19 "Net-(Q2-Pad3)"))
    (model ${KISYS3DMOD}/TO_SOT_Packages_SMD.3dshapes/SOT-23.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module TO_SOT_Packages_SMD:SOT-23 (layer F.Cu) (tedit 59FE2E35)
    (at 6.99 3.81)
    (descr "SOT-23, Standard")
    (tags SOT-23)
    (attr smd)
    (fp_text reference Q3 (at 0 2.44) (layer F.SilkS))
    (fp_text value NTR4003NT3G (at 0 2.5) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 1 smd rect (at -1 -0.95) (size 0.9 0.8) (layers F.Cu F.Paste F.Mask)
      (net 20 "Net-(Q3-Pad1)"))
    (pad 2 smd rect (at -1 0.95) (size 0.9 0.8) (layers F.Cu F.Paste F.Mask)
      (net 6 GND))
    (pad 3 smd rect (at 1 0) (size 0.9 0.8) (layers F.Cu F.Paste F.Mask)
      (net 21 "Net-(Q3-Pad3)"))
    (model ${KISYS3DMOD}/TO_SOT_Packages_SMD.3dshapes/SOT-23.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module TO_SOT_Packages_SMD:SOT-23 (layer B.Cu) (tedit 59FE302E)
    (at 6.985 3.175 90)
    (descr "SOT-23, Standard")
    (tags SOT-23)
    (attr smd)
    (fp_text reference Q4 (at 2.415 0.025 180) (layer B.SilkS))
    (fp_text value NTR4003NT3G (at 0 -2.5 90) (layer B.Fab))
    (fp_text user %R (at 0 0 360) (layer B.Fab))
    (pad 1 smd rect (at -1 0.95 90) (size 0.9 0.8) (layers B.Cu B.Paste B.Mask)
      (net 22 "Net-(Q4-Pad1)"))
    (pad 2 smd rect (at -1 -0.95 90) (size 0.9 0.8) (layers B.Cu B.Paste B.Mask)
      (net 6 GND))
    (pad 3 smd rect (at 1 0 90) (size 0.9 0.8) (layers B.Cu B.Paste B.Mask)
      (net 7 "Net-(D1-Pad2)"))
    (model ${KISYS3DMOD}/TO_SOT_Packages_SMD.3dshapes/SOT-23.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistors_SMD:R_0805 (layer F.Cu) (tedit 59FE2D9F)
    (at 8.255 -5.08 90)
    (descr "Resistor SMD 0805, reflow soldering, Vishay (see dcrcw.pdf)")
    (tags "resistor 0805")
    (attr smd)
    (fp_text reference R1 (at 1.09 2.035 180) (layer F.SilkS))
    (fp_text value 82R (at 0 1.75 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 1 smd rect (at -0.95 0 90) (size 0.7 1.3) (layers F.Cu F.Paste F.Mask)
      (net 16 "Net-(Q1-Pad1)"))
    (pad 2 smd rect (at 0.95 0 90) (size 0.7 1.3) (layers F.Cu F.Paste F.Mask)
      (net 14 /RED))
    (model ${KISYS3DMOD}/Resistors_SMD.3dshapes/R_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistors_SMD:R_0805 (layer F.Cu) (tedit 59FE2D48)
    (at -3.175 -7.62 270)
    (descr "Resistor SMD 0805, reflow soldering, Vishay (see dcrcw.pdf)")
    (tags "resistor 0805")
    (attr smd)
    (fp_text reference R2 (at -0.01 1.965 360) (layer F.SilkS))
    (fp_text value 82R (at 0 1.75 270) (layer F.Fab))
    (fp_text user %R (at 0 0 270) (layer F.Fab))
    (pad 1 smd rect (at -0.95 0 270) (size 0.7 1.3) (layers F.Cu F.Paste F.Mask)
      (net 18 "Net-(Q2-Pad1)"))
    (pad 2 smd rect (at 0.95 0 270) (size 0.7 1.3) (layers F.Cu F.Paste F.Mask)
      (net 8 /GREEN))
    (model ${KISYS3DMOD}/Resistors_SMD.3dshapes/R_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistors_SMD:R_0805 (layer F.Cu) (tedit 59FE2E48)
    (at 3.81 3.81 270)
    (descr "Resistor SMD 0805, reflow soldering, Vishay (see dcrcw.pdf)")
    (tags "resistor 0805")
    (attr smd)
    (fp_text reference R3 (at 0.03 2.06 360) (layer F.SilkS))
    (fp_text value 82R (at 0 1.75 270) (layer F.Fab))
    (fp_text user %R (at 0 0 270) (layer F.Fab))
    (pad 1 smd rect (at -0.95 0 270) (size 0.7 1.3) (layers F.Cu F.Paste F.Mask)
      (net 20 "Net-(Q3-Pad1)"))
    (pad 2 smd rect (at 0.95 0 270) (size 0.7 1.3) (layers F.Cu F.Paste F.Mask)
      (net 1 /BLUE))
    (model ${KISYS3DMOD}/Resistors_SMD.3dshapes/R_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistors_SMD:R_0805 (layer F.Cu) (tedit 59FE2DB6)
    (at 5.08 -1.905)
    (descr "Resistor SMD 0805, reflow soldering, Vishay (see dcrcw.pdf)")
    (tags "resistor 0805")
    (attr smd)
    (fp_text reference R4 (at 2.43 -0.055) (layer F.SilkS))
    (fp_text value 33R (at 0 1.75) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 1 smd rect (at -0.95 0) (size 0.7 1.3) (layers F.Cu F.Paste F.Mask)
      (net 17 "Net-(Q1-Pad3)"))
    (pad 2 smd rect (at 0.95 0) (size 0.7 1.3) (layers F.Cu F.Paste F.Mask)
      (net 12 /RED_MOS))
    (model ${KISYS3DMOD}/Resistors_SMD.3dshapes/R_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistors_SMD:R_0805 (layer F.Cu) (tedit 59FE2D7E)
    (at 0 -4.445)
    (descr "Resistor SMD 0805, reflow soldering, Vishay (see dcrcw.pdf)")
    (tags "resistor 0805")
    (attr smd)
    (fp_text reference R5 (at -2.69 -0.045) (layer F.SilkS))
    (fp_text value 33R (at 0 1.75) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 1 smd rect (at -0.95 0) (size 0.7 1.3) (layers F.Cu F.Paste F.Mask)
      (net 19 "Net-(Q2-Pad3)"))
    (pad 2 smd rect (at 0.95 0) (size 0.7 1.3) (layers F.Cu F.Paste F.Mask)
      (net 11 /GREEN_MOS))
    (model ${KISYS3DMOD}/Resistors_SMD.3dshapes/R_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistors_SMD:R_0805 (layer F.Cu) (tedit 59FE2F59)
    (at 6.985 0.635 180)
    (descr "Resistor SMD 0805, reflow soldering, Vishay (see dcrcw.pdf)")
    (tags "resistor 0805")
    (attr smd)
    (fp_text reference R6 (at 2.635 0.045 180) (layer F.SilkS))
    (fp_text value 33R (at 0 1.75 180) (layer F.Fab))
    (fp_text user %R (at 0 0 180) (layer F.Fab))
    (pad 1 smd rect (at -0.95 0 180) (size 0.7 1.3) (layers F.Cu F.Paste F.Mask)
      (net 21 "Net-(Q3-Pad3)"))
    (pad 2 smd rect (at 0.95 0 180) (size 0.7 1.3) (layers F.Cu F.Paste F.Mask)
      (net 10 /BLUE_MOS))
    (model ${KISYS3DMOD}/Resistors_SMD.3dshapes/R_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistors_SMD:R_0805 (layer B.Cu) (tedit 59FE2FF1)
    (at 8.255 -4.445 270)
    (descr "Resistor SMD 0805, reflow soldering, Vishay (see dcrcw.pdf)")
    (tags "resistor 0805")
    (attr smd)
    (fp_text reference R7 (at -2.615 0.015 360) (layer B.SilkS))
    (fp_text value 10R (at 0 -1.75 270) (layer B.Fab))
    (fp_text user %R (at 0 0 270) (layer B.Fab))
    (pad 1 smd rect (at -0.95 0 270) (size 0.7 1.3) (layers B.Cu B.Paste B.Mask)
      (net 5 VCC))
    (pad 2 smd rect (at 0.95 0 270) (size 0.7 1.3) (layers B.Cu B.Paste B.Mask)
      (net 3 "Net-(BZ1-Pad1)"))
    (model ${KISYS3DMOD}/Resistors_SMD.3dshapes/R_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistors_SMD:R_0805 (layer B.Cu) (tedit 59FE3054)
    (at 6.985 6.35 180)
    (descr "Resistor SMD 0805, reflow soldering, Vishay (see dcrcw.pdf)")
    (tags "resistor 0805")
    (attr smd)
    (fp_text reference R8 (at -2.735 0.04 180) (layer B.SilkS))
    (fp_text value 82R (at 0 -1.75 180) (layer B.Fab))
    (fp_text user %R (at 0 0 180) (layer B.Fab))
    (pad 1 smd rect (at -0.95 0 180) (size 0.7 1.3) (layers B.Cu B.Paste B.Mask)
      (net 22 "Net-(Q4-Pad1)"))
    (pad 2 smd rect (at 0.95 0 180) (size 0.7 1.3) (layers B.Cu B.Paste B.Mask)
      (net 4 /BUZZER))
    (model ${KISYS3DMOD}/Resistors_SMD.3dshapes/R_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistors_SMD:R_0805 (layer B.Cu) (tedit 59FE3065)
    (at 0 6.05 270)
    (descr "Resistor SMD 0805, reflow soldering, Vishay (see dcrcw.pdf)")
    (tags "resistor 0805")
    (attr smd)
    (fp_text reference R9 (at -0.83 -1.95 360) (layer B.SilkS))
    (fp_text value 20K (at 0 -1.75 270) (layer B.Fab))
    (fp_text user %R (at 0 0 270) (layer B.Fab))
    (pad 1 smd rect (at -0.95 0 270) (size 0.7 1.3) (layers B.Cu B.Paste B.Mask)
      (net 15 /TOUCH))
    (pad 2 smd rect (at 0.95 0 270) (size 0.7 1.3) (layers B.Cu B.Paste B.Mask)
      (net 9 "Net-(J9-Pad1)"))
    (model ${KISYS3DMOD}/Resistors_SMD.3dshapes/R_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistors_SMD:R_0805 (layer B.Cu) (tedit 59FE2FCF)
    (at -5.715 -2.54 90)
    (descr "Resistor SMD 0805, reflow soldering, Vishay (see dcrcw.pdf)")
    (tags "resistor 0805")
    (attr smd)
    (fp_text reference R10 (at 2.54 -0.005 180) (layer B.SilkS))
    (fp_text value 33R (at 0 -1.75 90) (layer B.Fab))
    (fp_text user %R (at 0 0 90) (layer B.Fab))
    (pad 1 smd rect (at -0.95 0 90) (size 0.7 1.3) (layers B.Cu B.Paste B.Mask)
      (net 7 "Net-(D1-Pad2)"))
    (pad 2 smd rect (at 0.95 0 90) (size 0.7 1.3) (layers B.Cu B.Paste B.Mask)
      (net 2 "Net-(BZ1-Pad2)"))
    (model ${KISYS3DMOD}/Resistors_SMD.3dshapes/R_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistors_SMD:R_0805 (layer F.Cu) (tedit 59FE2C3C)
    (at -9.525 5.715 60)
    (descr "Resistor SMD 0805, reflow soldering, Vishay (see dcrcw.pdf)")
    (tags "resistor 0805")
    (attr smd)
    (fp_text reference R11 (at -2.479766 0.07492 150) (layer F.SilkS))
    (fp_text value 20K (at 0 1.75 60) (layer F.Fab))
    (fp_text user %R (at 0 0 60) (layer F.Fab))
    (pad 1 smd rect (at -0.95 0 60) (size 0.7 1.3) (layers F.Cu F.Paste F.Mask)
      (net 13 /RESET))
    (pad 2 smd rect (at 0.95 0 60) (size 0.7 1.3) (layers F.Cu F.Paste F.Mask)
      (net 5 VCC))
    (model ${KISYS3DMOD}/Resistors_SMD.3dshapes/R_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Wire_Pads:SolderWirePad_single_1-2mmDrill (layer F.Cu) (tedit 59FE2C7A)
    (at -12.573 1.27 270)
    (fp_text reference R4 (at 0 -2.103 270) (layer F.SilkS))
    (fp_text value TEST_1P (at -1.905 3.175 270) (layer F.Fab))
    (pad 1 thru_hole circle (at 0 0 270) (size 2.2 2.2) (drill 1.19888) (layers *.Cu *.Mask)
      (net 14 /RED))
  )
  (module Wire_Pads:SolderWirePad_single_1-2mmDrill (layer F.Cu) (tedit 59FE2CA8)
    (at -12.573 -3.81 270)
    (fp_text reference rst5 (at 0.01 -1.983 270) (layer F.SilkS))
    (fp_text value TEST_1P (at -1.905 3.175 270) (layer F.Fab))
    (pad 1 thru_hole circle (at 0 0 270) (size 2.2 2.2) (drill 1.19888) (layers *.Cu *.Mask)
      (net 13 /RESET))
  )
  (module Wire_Pads:SolderWirePad_single_1-2mmDrill (layer F.Cu) (tedit 59FE2DF0)
    (at 12.827 -1.27 90)
    (fp_text reference t2 (at -0.02 -2.417 90) (layer F.SilkS))
    (fp_text value TEST_1P (at -1.905 3.175 90) (layer F.Fab))
    (pad 1 thru_hole circle (at 0 0 90) (size 2.2 2.2) (drill 1.19888) (layers *.Cu *.Mask)
      (net 15 /TOUCH))
  )
  (module Wire_Pads:SolderWirePad_single_1-2mmDrill (layer F.Cu) (tedit 59FE2DDE)
    (at 12.573 -3.81 90)
    (fp_text reference + (at -0.04 -2.183 90) (layer F.SilkS))
    (fp_text value TEST_1P (at -1.905 3.175 90) (layer F.Fab))
    (pad 1 thru_hole circle (at 0 0 90) (size 2.2 2.2) (drill 1.19888) (layers *.Cu *.Mask)
      (net 5 VCC))
  )
  (module wrirepad:singlesolderpad (layer B.Cu) (tedit 59FE2FAA)
    (at 5.08 -10.16 60)
    (fp_text reference + (at 2.168487 0.075929 150) (layer B.SilkS))
    (fp_text value TEST_1P (at 0 4 60) (layer B.Fab))
    (pad 1 smd rect (at 0 1.5 60) (size 2 2) (layers B.Cu B.Paste B.Mask)
      (net 5 VCC))
    (pad 1 smd rect (at 0 -1.5 60) (size 2 2) (layers B.Cu B.Paste B.Mask)
      (net 5 VCC))
  )
  (module blinker_attiny85:testfoto (layer F.Cu) (tedit 0)
    (at 0 13)
    (fp_text reference G*** (at 0 0) (layer F.SilkS) hide)
    (fp_text value LOGO (at 0.75 0) (layer F.SilkS) hide)
  )
  (module blinker_attiny85:italia (layer B.Cu) (tedit 0)
    (at -11 7 180)
    (fp_text reference G*** (at 0 0 180) (layer B.SilkS) hide)
    (fp_text value LOGO (at 0.75 0 180) (layer B.SilkS) hide)
  )
  (module Wire_Pads:SolderWirePad_single_2mmDrill (layer F.Cu) (tedit 59FE4C41)
    (at 0 -12.75)
    (fp_text reference REF** (at 0 -3.81) (layer F.SilkS) hide)
    (fp_text value SolderWirePad_single_2mmDrill (at -0.635 3.81) (layer F.Fab))
    (pad "" np_thru_hole circle (at 0 0) (size 4.5 4.5) (drill 3.5) (layers *.Cu *.Mask)
      (solder_mask_margin 0.01) (zone_connect 0))
  )
  (gr_arc (start -11.691 6.75) (end -13.432 9.75) (angle 60) (layer Edge.Cuts) (width 0.127))
  (gr_arc (start 0 13.5) (end 1.732 16.5) (angle 60) (layer Edge.Cuts) (width 0.127))
  (gr_arc (start 11.691 6.75) (end 15.155 6.75) (angle 60) (layer Edge.Cuts) (width 0.127))
  (gr_arc (start 11.691 -6.75) (end 13.432 -9.75) (angle 60) (layer Edge.Cuts) (width 0.127))
  (gr_arc (start 0 -13.5) (end -1.732 -16.5) (angle 60) (layer Edge.Cuts) (width 0.127))
  (gr_arc (start -11.691 -6.75) (end -15.155 -6.75) (angle 60) (layer Edge.Cuts) (width 0.127))
  (gr_line (start -13.432 -9.75) (end -1.732 -16.5) (layer Edge.Cuts) (width 0.127))
  (gr_line (start -15.155 6.75) (end -15.155 -6.75) (layer Edge.Cuts) (width 0.127))
  (gr_line (start -1.732 16.5) (end -13.432 9.75) (layer Edge.Cuts) (width 0.127))
  (gr_line (start 13.432 9.75) (end 1.732 16.5) (layer Edge.Cuts) (width 0.127))
  (gr_line (start 15.155 -6.75) (end 15.155 6.75) (layer Edge.Cuts) (width 0.127))
  (gr_line (start 1.732 -16.5) (end 13.432 -9.75) (layer Edge.Cuts) (width 0.127))
  (gr_text click (at 0 12.8) (layer B.SilkS))
  (dimension 22.86 (width 0.127) (layer Dwgs.User)
    (gr_text "22,860 mm" (at 0 -25.954) (layer Dwgs.User))
    (feature1 (pts (xy 11.43 0) (xy 11.43 -26.508)))
    (feature2 (pts (xy -11.43 0) (xy -11.43 -26.508)))
    (crossbar (pts (xy -11.43 -25.4) (xy 11.43 -25.4)))
    (arrow1a (pts (xy 11.43 -25.4) (xy 10.303496 -24.813579)))
    (arrow1b (pts (xy 11.43 -25.4) (xy 10.303496 -25.986421)))
    (arrow2a (pts (xy -11.43 -25.4) (xy -10.303496 -24.813579)))
    (arrow2b (pts (xy -11.43 -25.4) (xy -10.303496 -25.986421)))
  )
  (zone (net 6) (net_name GND) (layer F.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.1524))
    (min_thickness 0.254)
    (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy -9 15) (xy 16 15) (xy 17 -18) (xy -16 -18) (xy -16 15)
        (xy -8 15)
      )
    )
  )
  (zone (net 6) (net_name GND) (layer B.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.1524))
    (min_thickness 0.254)
    (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 8.685165 15) (xy -16.314835 15) (xy -17.314835 -18) (xy 15.685165 -18) (xy 15.685165 15)
        (xy 7.685165 15)
      )
    )
  )
  (zone (net 9) (net_name "Net-(J9-Pad1)") (layer B.Cu) (hatch edge 0.508)
    (priority 2)
    (connect_pads yes (clearance 0.1524))
    (min_thickness 0.254)
    (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 0 20) (xy 8 16) (xy 3 10) (xy 2 9) (xy -2 9)
        (xy -3 10) (xy -8 16)
      )
    )
  )
  (zone (net 9) (net_name "Net-(J9-Pad1)") (layer F.Cu) (hatch edge 0.508)
    (priority 2)
    (connect_pads no (clearance 0.1524))
    (min_thickness 0.254)
    (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 0 20) (xy -8 16) (xy -3 10) (xy -2 9) (xy 2 9)
        (xy 3 10) (xy 8 16)
      )
    )
  )
)
