(kicad_pcb (version 4) (host pcbnew 4.0.4-stable)
  (general
    (links 36)
    (no_connects 0)
    (area 194.094714 78.524714 221.195286 105.625286)
    (thickness 1.6)
    (drawings 18)
    (tracks 117)
    (zones 0)
    (modules 25)
    (nets 14)
  )
  (page USLetter)
  (layers
    (0 F.Cu signal)
    (31 B.Cu signal hide)
    (34 B.Paste user)
    (35 F.Paste user)
    (36 B.SilkS user hide)
    (37 F.SilkS user hide)
    (38 B.Mask user)
    (39 F.Mask user)
    (40 Dwgs.User user hide)
    (44 Edge.Cuts user)
  )
  (setup
    (last_trace_width 0.3048)
    (user_trace_width 0.254)
    (user_trace_width 0.3048)
    (user_trace_width 0.4064)
    (user_trace_width 0.6096)
    (user_trace_width 2.032)
    (trace_clearance 0.1524)
    (zone_clearance 0.508)
    (zone_45_only no)
    (trace_min 0.1524)
    (segment_width 0.254)
    (edge_width 0.1)
    (via_size 0.6858)
    (via_drill 0.3302)
    (via_min_size 0.6858)
    (via_min_drill 0.3302)
    (user_via 1 0.5)
    (uvia_size 0.762)
    (uvia_drill 0.508)
    (uvias_allowed no)
    (uvia_min_size 0.508)
    (uvia_min_drill 0.127)
    (pcb_text_width 0.3)
    (pcb_text_size 1.5 1.5)
    (mod_edge_width 0.15)
    (mod_text_size 1 1)
    (mod_text_width 0.15)
    (pad_size 3 3)
    (pad_drill 2)
    (pad_to_mask_clearance 0)
    (aux_axis_origin 0 0)
    (grid_origin 210.82 95.25)
    (visible_elements 7FFEFFFF)
    (pcbplotparams
      (layerselection 0x010f0_80000000)
      (usegerberextensions true)
      (excludeedgelayer true)
      (linewidth 0.100000)
      (plotframeref false)
      (viasonmask false)
      (mode 1)
      (useauxorigin false)
      (hpglpennumber 1)
      (hpglpenspeed 20)
      (hpglpendiameter 15)
      (hpglpenoverlay 2)
      (psnegative false)
      (psa4output false)
      (plotreference true)
      (plotvalue true)
      (plotinvisibletext false)
      (padsonsilk false)
      (subtractmaskfromsilk false)
      (outputformat 1)
      (mirror false)
      (drillshape 0)
      (scaleselection 1)
      (outputdirectory gerbers/))
  )
  (net 0 "")
  (net 1 GND)
  (net 2 +BATT)
  (net 3 "Net-(CON1-Pad1)")
  (net 4 "Net-(CON1-Pad3)")
  (net 5 "Net-(CON1-Pad4)")
  (net 6 "Net-(CON1-Pad5)")
  (net 7 "Net-(D1-Pad1)")
  (net 8 "Net-(D2-Pad1)")
  (net 9 "Net-(D3-Pad1)")
  (net 10 "Net-(D0-Pad1)")
  (net 11 "Net-(D3-Pad2)")
  (net 12 "Net-(D4-Pad2)")
  (net 13 "Net-(D4-Pad1)")
  (net_class Default "This is the default net class."
    (clearance 0.1524)
    (trace_width 0.1524)
    (via_dia 0.6858)
    (via_drill 0.3302)
    (uvia_dia 0.762)
    (uvia_drill 0.508)
    (add_net +BATT)
    (add_net GND)
    (add_net "Net-(CON1-Pad1)")
    (add_net "Net-(CON1-Pad3)")
    (add_net "Net-(CON1-Pad4)")
    (add_net "Net-(CON1-Pad5)")
    (add_net "Net-(D0-Pad1)")
    (add_net "Net-(D1-Pad1)")
    (add_net "Net-(D2-Pad1)")
    (add_net "Net-(D3-Pad1)")
    (add_net "Net-(D3-Pad2)")
    (add_net "Net-(D4-Pad1)")
    (add_net "Net-(D4-Pad2)")
  )
  (module LED_0201 (layer F.Cu) (tedit 5A4BE065)
    (at 208.28 103.505)
    (descr "Resistor SMD 0201, reflow soldering, Vishay (see crcw0201e3.pdf)")
    (tags "resistor 0201")
    (attr smd)
    (fp_text reference D4 (at 1.016 0.889) (layer F.SilkS))
    (fp_text value LED (at 0 1.7) (layer F.Fab))
    (pad 1 smd rect (at -0.3 0) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask)
      (net 13 "Net-(D4-Pad1)"))
    (pad 2 smd rect (at 0.3 0) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask)
      (net 12 "Net-(D4-Pad2)"))
    (model Resistors_SMD.3dshapes/R_0201.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module LED_0402 (layer F.Cu) (tedit 5A4BDEED)
    (at 208.28 101.6)
    (descr "Resistor SMD 0402, reflow soldering, Vishay (see dcrcw.pdf)")
    (tags "resistor 0402")
    (attr smd)
    (fp_text reference D3 (at 1.3 1) (layer F.SilkS))
    (fp_text value LED (at 0 1.8) (layer F.Fab))
    (pad 1 smd rect (at -0.5 0) (size 0.7 0.6) (layers F.Cu F.Paste F.Mask)
      (net 9 "Net-(D3-Pad1)"))
    (pad 2 smd rect (at 0.5 0) (size 0.7 0.6) (layers F.Cu F.Paste F.Mask)
      (net 11 "Net-(D3-Pad2)"))
    (model Resistors_SMD.3dshapes/R_0402.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module footprints:BATT_CR2032_SMD (layer B.Cu) (tedit 56CFB5D2)
    (at 207.645 93.345 180)
    (tags battery)
    (fp_text reference BT1 (at 0 -5.08 180) (layer B.SilkS) hide)
    (fp_text value Battery (at 0 2.54 180) (layer B.SilkS) hide)
    (pad 2 smd circle (at 0 0 180) (size 17.78 17.78) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (pad 1 smd rect (at -11.43 0 180) (size 2.54 5.08) (layers B.Cu B.Paste B.Mask)
      (net 2 +BATT))
    (pad 1 smd rect (at 11.43 0 180) (size 2.54 5.08) (layers B.Cu B.Paste B.Mask)
      (net 2 +BATT))
  )
  (module footprints:C_1206_HandSoldering (layer F.Cu) (tedit 5902BDF4)
    (at 215.392 100.838 225)
    (descr "Capacitor SMD 1206, hand soldering")
    (tags "capacitor 1206")
    (attr smd)
    (fp_text reference C1 (at 0 0 225) (layer F.SilkS))
    (fp_text value "0.1 uF" (at 0 2.3 225) (layer F.Fab))
    (pad 1 smd rect (at -1.778 0 225) (size 1.6 1.6) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 2 smd rect (at 1.778 0 225) (size 1.6 1.6) (layers F.Cu F.Paste F.Mask)
      (net 2 +BATT))
    (model Capacitors_SMD.3dshapes/C_1206_HandSoldering.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module footprints:AVR-ISP-6 (layer F.Cu) (tedit 5860A6AE)
    (at 214.757 83.82 270)
    (descr "6-lead dip package, row spacing 7.62 mm (300 mils)")
    (tags "dil dip 2.54 300")
    (fp_text reference CON1 (at 0 -2.54 270) (layer F.SilkS) hide)
    (fp_text value AVR-ISP-6 (at 0 -3.72 270) (layer F.Fab) hide)
    (pad 1 smd oval (at 0 0 270) (size 1.6 1.6) (layers F.Cu F.Paste F.Mask)
      (net 3 "Net-(CON1-Pad1)"))
    (pad 2 smd rect (at 2.54 0 270) (size 1.6 1.6) (layers F.Cu F.Paste F.Mask)
      (net 2 +BATT))
    (pad 3 smd oval (at 0 2.54 270) (size 1.6 1.6) (layers F.Cu F.Paste F.Mask)
      (net 4 "Net-(CON1-Pad3)"))
    (pad 4 smd oval (at 2.54 2.54 270) (size 1.6 1.6) (layers F.Cu F.Paste F.Mask)
      (net 5 "Net-(CON1-Pad4)"))
    (pad 5 smd oval (at 0 5.08 270) (size 1.6 1.6) (layers F.Cu F.Paste F.Mask)
      (net 6 "Net-(CON1-Pad5)"))
    (pad 6 smd oval (at 2.54 5.08 270) (size 1.6 1.6) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
  )
  (module footprints:LED-1206 (layer F.Cu) (tedit 5902C0FC)
    (at 208.28 92.075)
    (descr "LED 1206 smd package")
    (tags "LED1206 SMD")
    (attr smd)
    (fp_text reference D0 (at 2.667 1.778) (layer F.SilkS))
    (fp_text value LED (at 0 2) (layer F.Fab))
    (pad 2 smd rect (at 1.524 0 180) (size 1.7 1.80086) (layers F.Cu F.Paste F.Mask)
      (net 5 "Net-(CON1-Pad4)"))
    (pad 1 smd rect (at -1.651 0 180) (size 1.7 1.80086) (layers F.Cu F.Paste F.Mask)
      (net 10 "Net-(D0-Pad1)"))
    (model LEDs.3dshapes/LED_1206.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module footprints:LED-0805 (layer F.Cu) (tedit 5902C116)
    (at 208.28 95.885)
    (descr "LED 0805 smd package")
    (tags "LED 0805 SMD")
    (attr smd)
    (fp_text reference D1 (at 2.2225 1.4605) (layer F.SilkS))
    (fp_text value LED (at 0 1.75) (layer F.Fab))
    (pad 2 smd rect (at 1.143 0 180) (size 1.3 1.19888) (layers F.Cu F.Paste F.Mask)
      (net 3 "Net-(CON1-Pad1)"))
    (pad 1 smd rect (at -1.27 0 180) (size 1.3 1.19888) (layers F.Cu F.Paste F.Mask)
      (net 7 "Net-(D1-Pad1)"))
    (model LEDs.3dshapes/LED-0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
    (model LEDs.3dshapes/LED_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module footprints:LED-0603 (layer F.Cu) (tedit 5902C124)
    (at 208.28 99.06)
    (descr "LED 0603 smd package")
    (tags "LED led 0603 SMD smd SMT smt smdled SMDLED smtled SMTLED")
    (attr smd)
    (fp_text reference D2 (at 1.778 1.0795) (layer F.SilkS))
    (fp_text value LED (at 0 1.5) (layer F.Fab))
    (pad 2 smd rect (at 0.889 0 180) (size 1 0.79756) (layers F.Cu F.Paste F.Mask)
      (net 4 "Net-(CON1-Pad3)"))
    (pad 1 smd rect (at -0.889 0 180) (size 1 0.79756) (layers F.Cu F.Paste F.Mask)
      (net 8 "Net-(D2-Pad1)"))
    (model LEDs.3dshapes/LED_0603.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module footprints:SOIJ-8_5.3x5.3mm_Pitch1.27mm (layer F.Cu) (tedit 5902B706)
    (at 216.916 92.71 90)
    (descr "8-Lead Plastic Small Outline (SM) - Medium, 5.28 mm Body [SOIC] (see Microchip Packaging Specification 00000049BS.pdf)")
    (tags "SOIC 1.27")
    (attr smd)
    (fp_text reference IC1 (at -1.27 2.159 90) (layer F.SilkS) hide)
    (fp_text value IC1 (at 0 3.68 90) (layer F.Fab))
    (pad 1 smd rect (at -3.65 -1.905 90) (size 1.7 0.65) (layers F.Cu F.Paste F.Mask)
      (net 6 "Net-(CON1-Pad5)"))
    (pad 2 smd rect (at -3.65 -0.635 90) (size 1.7 0.65) (layers F.Cu F.Paste F.Mask)
      (net 11 "Net-(D3-Pad2)"))
    (pad 3 smd rect (at -3.65 0.635 90) (size 1.7 0.65) (layers F.Cu F.Paste F.Mask)
      (net 12 "Net-(D4-Pad2)"))
    (pad 4 smd rect (at -3.65 1.905 90) (size 1.7 0.65) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 5 smd rect (at 3.65 1.905 90) (size 1.7 0.65) (layers F.Cu F.Paste F.Mask)
      (net 5 "Net-(CON1-Pad4)"))
    (pad 6 smd rect (at 3.65 0.635 90) (size 1.7 0.65) (layers F.Cu F.Paste F.Mask)
      (net 3 "Net-(CON1-Pad1)"))
    (pad 7 smd rect (at 3.65 -0.635 90) (size 1.7 0.65) (layers F.Cu F.Paste F.Mask)
      (net 4 "Net-(CON1-Pad3)"))
    (pad 8 smd rect (at 3.65 -1.905 90) (size 1.7 0.65) (layers F.Cu F.Paste F.Mask)
      (net 2 +BATT))
    (model Housings_SOIC.3dshapes/SOIJ-8_5.3x5.3mm_Pitch1.27mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module footprints:testPad (layer F.Cu) (tedit 5902BD57)
    (at 212.09 92.075)
    (descr "module 1 pin (ou trou mecanique de percage)")
    (tags DEV)
    (fp_text reference P0 (at -0.0635 0) (layer F.SilkS) hide)
    (fp_text value CONN_01X01 (at 0 0) (layer F.Fab))
    (pad 1 smd oval (at 0 0) (size 0.508 0.762) (layers F.Cu F.Paste F.Mask)
      (net 5 "Net-(CON1-Pad4)"))
  )
  (module footprints:testPad (layer F.Cu) (tedit 5902BD57)
    (at 211.582 95.885)
    (descr "module 1 pin (ou trou mecanique de percage)")
    (tags DEV)
    (fp_text reference P1 (at -0.0635 0) (layer F.SilkS) hide)
    (fp_text value CONN_01X01 (at 0 0) (layer F.Fab))
    (pad 1 smd oval (at 0 0) (size 0.508 0.762) (layers F.Cu F.Paste F.Mask)
      (net 3 "Net-(CON1-Pad1)"))
  )
  (module footprints:testPad (layer F.Cu) (tedit 5902BD57)
    (at 211.201 99.06)
    (descr "module 1 pin (ou trou mecanique de percage)")
    (tags DEV)
    (fp_text reference P2 (at -0.0635 0) (layer F.SilkS) hide)
    (fp_text value CONN_01X01 (at 0 0) (layer F.Fab))
    (pad 1 smd oval (at 0 0) (size 0.508 0.762) (layers F.Cu F.Paste F.Mask)
      (net 4 "Net-(CON1-Pad3)"))
  )
  (module footprints:testPad (layer F.Cu) (tedit 5902BD57)
    (at 210.82 101.6)
    (descr "module 1 pin (ou trou mecanique de percage)")
    (tags DEV)
    (fp_text reference P3 (at -0.0635 0) (layer F.SilkS) hide)
    (fp_text value CONN_01X01 (at 0 0) (layer F.Fab))
    (pad 1 smd oval (at 0 0) (size 0.508 0.762) (layers F.Cu F.Paste F.Mask)
      (net 11 "Net-(D3-Pad2)"))
  )
  (module footprints:testPad (layer F.Cu) (tedit 5902BD57)
    (at 210.566 103.505)
    (descr "module 1 pin (ou trou mecanique de percage)")
    (tags DEV)
    (fp_text reference P4 (at -0.0635 0) (layer F.SilkS) hide)
    (fp_text value CONN_01X01 (at 0 0) (layer F.Fab))
    (pad 1 smd oval (at 0 0) (size 0.508 0.762) (layers F.Cu F.Paste F.Mask)
      (net 12 "Net-(D4-Pad2)"))
  )
  (module footprints:testPad (layer F.Cu) (tedit 5902BD57)
    (at 198.247 92.075)
    (descr "module 1 pin (ou trou mecanique de percage)")
    (tags DEV)
    (fp_text reference PG0 (at -0.0635 0) (layer F.SilkS) hide)
    (fp_text value CONN_01X01 (at 0 0) (layer F.Fab))
    (pad 1 smd oval (at 0 0) (size 0.508 0.762) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
  )
  (module footprints:testPad (layer F.Cu) (tedit 5902BD57)
    (at 198.6915 95.885)
    (descr "module 1 pin (ou trou mecanique de percage)")
    (tags DEV)
    (fp_text reference PG1 (at -0.0635 0) (layer F.SilkS) hide)
    (fp_text value CONN_01X01 (at 0 0) (layer F.Fab))
    (pad 1 smd oval (at 0 0) (size 0.508 0.762) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
  )
  (module footprints:testPad (layer F.Cu) (tedit 5902BD57)
    (at 199.898 99.06)
    (descr "module 1 pin (ou trou mecanique de percage)")
    (tags DEV)
    (fp_text reference PG2 (at -0.0635 0) (layer F.SilkS) hide)
    (fp_text value CONN_01X01 (at 0 0) (layer F.Fab))
    (pad 1 smd oval (at 0 0) (size 0.508 0.762) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
  )
  (module footprints:testPad (layer F.Cu) (tedit 5902BD57)
    (at 201.7395 101.6)
    (descr "module 1 pin (ou trou mecanique de percage)")
    (tags DEV)
    (fp_text reference PG3 (at -0.0635 0) (layer F.SilkS) hide)
    (fp_text value CONN_01X01 (at 0 0) (layer F.Fab))
    (pad 1 smd oval (at 0 0) (size 0.508 0.762) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
  )
  (module footprints:testPad (layer F.Cu) (tedit 5902BD57)
    (at 204.1525 103.505)
    (descr "module 1 pin (ou trou mecanique de percage)")
    (tags DEV)
    (fp_text reference PG4 (at -0.0635 0) (layer F.SilkS) hide)
    (fp_text value CONN_01X01 (at 0 0) (layer F.Fab))
    (pad 1 smd oval (at 0 0) (size 0.508 0.762) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
  )
  (module footprints:R_1206 (layer F.Cu) (tedit 5902A5E4)
    (at 202.565 92.075 180)
    (descr "Resistor SMD 1206, reflow soldering, Vishay (see dcrcw.pdf)")
    (tags "resistor 1206")
    (attr smd)
    (fp_text reference R0 (at 0 0 180) (layer F.SilkS) hide)
    (fp_text value 330 (at 0 2.3 180) (layer F.Fab))
    (pad 1 smd rect (at -1.778 0 180) (size 1.1 1.7) (layers F.Cu F.Paste F.Mask)
      (net 10 "Net-(D0-Pad1)"))
    (pad 2 smd rect (at 1.651 0 180) (size 1.1 1.7) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (model Resistors_SMD.3dshapes/R_1206.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module footprints:R_0805 (layer F.Cu) (tedit 58DFDC5C)
    (at 203.2 95.885 180)
    (descr "Resistor SMD 0805, reflow soldering, Vishay (see dcrcw.pdf)")
    (tags "resistor 0805")
    (attr smd)
    (fp_text reference R1 (at 0 0 180) (layer F.SilkS) hide)
    (fp_text value 330 (at 0 2.1 180) (layer F.Fab))
    (pad 1 smd rect (at -1.143 0 180) (size 0.9 1.3) (layers F.Cu F.Paste F.Mask)
      (net 7 "Net-(D1-Pad1)"))
    (pad 2 smd rect (at 1.143 0 180) (size 0.9 1.3) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (model Resistors_SMD.3dshapes/R_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module footprints:R_0603 (layer F.Cu) (tedit 5902A5F6)
    (at 203.835 99.06 180)
    (descr "Resistor SMD 0603, reflow soldering, Vishay (see dcrcw.pdf)")
    (tags "resistor 0603")
    (attr smd)
    (fp_text reference R2 (at 0 0 180) (layer F.SilkS) hide)
    (fp_text value 330 (at 0 1.9 180) (layer F.Fab))
    (pad 1 smd rect (at -0.889 0 180) (size 0.7 0.9) (layers F.Cu F.Paste F.Mask)
      (net 8 "Net-(D2-Pad1)"))
    (pad 2 smd rect (at 1.016 0 180) (size 0.7 0.9) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (model Resistors_SMD.3dshapes/R_0603.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module footprints:R_0402 (layer F.Cu) (tedit 58DFDC4A)
    (at 204.47 101.6 180)
    (descr "Resistor SMD 0402, reflow soldering, Vishay (see dcrcw.pdf)")
    (tags "resistor 0402")
    (attr smd)
    (fp_text reference R3 (at 0 0 180) (layer Dwgs.User) hide)
    (fp_text value 330 (at 0 1.8 180) (layer F.Fab))
    (pad 1 smd rect (at -0.4 0 180) (size 0.6 0.6) (layers F.Cu F.Paste F.Mask)
      (net 9 "Net-(D3-Pad1)"))
    (pad 2 smd rect (at 0.5 0 180) (size 0.6 0.6) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (model Resistors_SMD.3dshapes/R_0402.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module footprints:R_0201 (layer F.Cu) (tedit 5A2C7C82)
    (at 205.74 103.505 180)
    (descr "Resistor SMD 0201, reflow soldering, Vishay (see crcw0201e3.pdf)")
    (tags "resistor 0201")
    (attr smd)
    (fp_text reference R4 (at 1.397 0.762 180) (layer F.SilkS) hide)
    (fp_text value 330 (at 0 1.7 180) (layer F.Fab))
    (pad 1 smd rect (at -0.4 0 180) (size 0.45 0.43) (layers F.Cu F.Paste F.Mask)
      (net 13 "Net-(D4-Pad1)"))
    (pad 2 smd rect (at 0.4 0 180) (size 0.45 0.43) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (model Resistors_SMD.3dshapes/R_0201.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module footprints:Pin_Header_Straight_1x01 (layer F.Cu) (tedit 5A2CB1FD)
    (at 207.645 81.28)
    (descr "Through hole pin header")
    (tags "pin header")
    (fp_text reference P5 (at -0.6 -0.5) (layer F.SilkS) hide)
    (fp_text value CONN_01X01 (at 0 0.9) (layer F.Fab))
    (pad 1 thru_hole circle (at 0 0) (size 3 3) (drill 2) (layers *.Cu *.Mask))
  )
  (gr_text R1 (at 219.202 89.408) (layer B.SilkS))
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