(kicad_pcb (version 20171130) (host pcbnew "(5.1.4)-1")
  (general
    (thickness 1.6)
    (drawings 28)
    (tracks 604)
    (zones 0)
    (modules 46)
    (nets 75)
  )
  (page A4)
  (layers
    (0 F.Cu mixed)
    (1 In1.Cu mixed hide)
    (2 In2.Cu mixed hide)
    (31 B.Cu mixed)
    (32 B.Adhes user hide)
    (33 F.Adhes user)
    (34 B.Paste user)
    (35 F.Paste user)
    (36 B.SilkS user)
    (37 F.SilkS user)
    (38 B.Mask user hide)
    (39 F.Mask user hide)
    (40 Dwgs.User user)
    (41 Cmts.User user)
    (42 Eco1.User user)
    (43 Eco2.User user)
    (44 Edge.Cuts user)
    (45 Margin user hide)
    (46 B.CrtYd user hide)
    (47 F.CrtYd user hide)
    (48 B.Fab user hide)
    (49 F.Fab user hide)
  )
  (setup
    (last_trace_width 0.2032)
    (user_trace_width 0.1524)
    (user_trace_width 0.2032)
    (user_trace_width 0.254)
    (user_trace_width 0.3048)
    (user_trace_width 0.381)
    (user_trace_width 0.508)
    (user_trace_width 0.635)
    (trace_clearance 0.1524)
    (zone_clearance 0.4064)
    (zone_45_only yes)
    (trace_min 0.1524)
    (via_size 0.6858)
    (via_drill 0.3302)
    (via_min_size 0.508)
    (via_min_drill 0.3048)
    (user_via 0.6858 0.3302)
    (user_via 0.8128 0.4064)
    (user_via 1.2192 0.6096)
    (user_via 1.4224 0.8128)
    (blind_buried_vias_allowed yes)
    (uvia_size 0.3302)
    (uvia_drill 0.2032)
    (uvias_allowed yes)
    (uvia_min_size 0.2032)
    (uvia_min_drill 0.1016)
    (edge_width 0.15)
    (segment_width 0.2)
    (pcb_text_width 0.3)
    (pcb_text_size 1.5 1.5)
    (mod_edge_width 0.15)
    (mod_text_size 1 1)
    (mod_text_width 0.15)
    (pad_size 3.8 3.8)
    (pad_drill 2.2)
    (pad_to_mask_clearance 0.2)
    (solder_mask_min_width 0.25)
    (aux_axis_origin 0 0)
    (visible_elements 7FFFFEE9)
    (pcbplotparams
      (layerselection 0x010fc_ffffffff)
      (usegerberextensions false)
      (usegerberattributes false)
      (usegerberadvancedattributes false)
      (creategerberjobfile false)
      (excludeedgelayer true)
      (linewidth 0.100000)
      (plotframeref false)
      (viasonmask false)
      (mode 1)
      (useauxorigin false)
      (hpglpennumber 1)
      (hpglpenspeed 20)
      (hpglpendiameter 15.000000)
      (psnegative false)
      (psa4output false)
      (plotreference true)
      (plotvalue true)
      (plotinvisibletext false)
      (padsonsilk false)
      (subtractmaskfromsilk false)
      (outputformat 3)
      (mirror false)
      (drillshape 0)
      (scaleselection 1)
      (outputdirectory "./gerbers"))
  )
  (net 0 "")
  (net 1 GND)
  (net 2 /SCL)
  (net 3 /SDA)
  (net 4 /FD12)
  (net 5 /FD11)
  (net 6 /FD10)
  (net 7 /FD9)
  (net 8 /FD8)
  (net 9 /PA7)
  (net 10 /PA6)
  (net 11 /PA5)
  (net 12 /PA4)
  (net 13 /PA3)
  (net 14 /PA2)
  (net 15 /PA1)
  (net 16 /PA0)
  (net 17 /CTL2)
  (net 18 /CTL1)
  (net 19 /FD7)
  (net 20 /FD6)
  (net 21 /FD5)
  (net 22 /FD4)
  (net 23 /FD12r)
  (net 24 /FD9r)
  (net 25 /FD10r)
  (net 26 /FD11r)
  (net 27 /FD8r)
  (net 28 /PA5r)
  (net 29 /PA6r)
  (net 30 /PA7r)
  (net 31 /PA4r)
  (net 32 /PA1r)
  (net 33 /PA2r)
  (net 34 /PA3r)
  (net 35 /PA0r)
  (net 36 /CMD_DATA)
  (net 37 /CMD_DATAr)
  (net 38 /REnr)
  (net 39 /WEnr)
  (net 40 /FD7r)
  (net 41 /FD4r)
  (net 42 /FD5r)
  (net 43 /FD6r)
  (net 44 /FD3)
  (net 45 /FD3r)
  (net 46 /FD2)
  (net 47 /FD1)
  (net 48 /FD0)
  (net 49 /FD0r)
  (net 50 /FD1r)
  (net 51 /FD2r)
  (net 52 /CY_CLK)
  (net 53 /CY_CLKr)
  (net 54 /FD13)
  (net 55 /FD14)
  (net 56 /FD15r)
  (net 57 /FD14r)
  (net 58 /FD13r)
  (net 59 /IFCLKr)
  (net 60 /WR_FULLnr)
  (net 61 /RD_EMPTYnr)
  (net 62 /IFCLK)
  (net 63 /RD_EMPTYn)
  (net 64 /WR_FULLn)
  (net 65 /DMINUS)
  (net 66 /DPLUS)
  (net 67 /XTALOUT)
  (net 68 /XTALIN)
  (net 69 /RESET_N)
  (net 70 "Net-(SW1-Pad3)")
  (net 71 /FD15)
  (net 72 /FPGA_3.3V)
  (net 73 +3.3V)
  (net 74 "Net-(D1-Pad2)")
  (net_class Default "This is the default net class."
    (clearance 0.1524)
    (trace_width 0.1524)
    (via_dia 0.6858)
    (via_drill 0.3302)
    (uvia_dia 0.3302)
    (uvia_drill 0.2032)
    (add_net +3.3V)
    (add_net /CMD_DATA)
    (add_net /CMD_DATAr)
    (add_net /CTL1)
    (add_net /CTL2)
    (add_net /CY_CLK)
    (add_net /CY_CLKr)
    (add_net /DMINUS)
    (add_net /DPLUS)
    (add_net /FD0)
    (add_net /FD0r)
    (add_net /FD1)
    (add_net /FD10)
    (add_net /FD10r)
    (add_net /FD11)
    (add_net /FD11r)
    (add_net /FD12)
    (add_net /FD12r)
    (add_net /FD13)
    (add_net /FD13r)
    (add_net /FD14)
    (add_net /FD14r)
    (add_net /FD15)
    (add_net /FD15r)
    (add_net /FD1r)
    (add_net /FD2)
    (add_net /FD2r)
    (add_net /FD3)
    (add_net /FD3r)
    (add_net /FD4)
    (add_net /FD4r)
    (add_net /FD5)
    (add_net /FD5r)
    (add_net /FD6)
    (add_net /FD6r)
    (add_net /FD7)
    (add_net /FD7r)
    (add_net /FD8)
    (add_net /FD8r)
    (add_net /FD9)
    (add_net /FD9r)
    (add_net /FPGA_3.3V)
    (add_net /IFCLK)
    (add_net /IFCLKr)
    (add_net /PA0)
    (add_net /PA0r)
    (add_net /PA1)
    (add_net /PA1r)
    (add_net /PA2)
    (add_net /PA2r)
    (add_net /PA3)
    (add_net /PA3r)
    (add_net /PA4)
    (add_net /PA4r)
    (add_net /PA5)
    (add_net /PA5r)
    (add_net /PA6)
    (add_net /PA6r)
    (add_net /PA7)
    (add_net /PA7r)
    (add_net /RD_EMPTYn)
    (add_net /RD_EMPTYnr)
    (add_net /RESET_N)
    (add_net /REnr)
    (add_net /SCL)
    (add_net /SDA)
    (add_net /WEnr)
    (add_net /WR_FULLn)
    (add_net /WR_FULLnr)
    (add_net /XTALIN)
    (add_net /XTALOUT)
    (add_net GND)
    (add_net "Net-(D1-Pad2)")
    (add_net "Net-(SW1-Pad3)")
  )
  (net_class 10mil ""
    (clearance 0.1524)
    (trace_width 0.1524)
    (via_dia 0.8128)
    (via_drill 0.4064)
    (uvia_dia 0.3048)
    (uvia_drill 0.2032)
  )
  (net_class 15mil ""
    (clearance 0.1524)
    (trace_width 0.381)
    (via_dia 0.8128)
    (via_drill 0.4064)
    (uvia_dia 0.3048)
    (uvia_drill 0.2032)
  )
  (net_class 20mil ""
    (clearance 0.1524)
    (trace_width 0.508)
    (via_dia 1.2192)
    (via_drill 0.6096)
    (uvia_dia 0.3302)
    (uvia_drill 0.2032)
  )
  (net_class 25mil ""
    (clearance 0.1524)
    (trace_width 0.1524)
    (via_dia 1.4224)
    (via_drill 0.8128)
    (uvia_dia 0.3302)
    (uvia_drill 0.2032)
  )
  (net_class 6mil ""
    (clearance 0.1524)
    (trace_width 0.1524)
    (via_dia 0.6858)
    (via_drill 0.3302)
    (uvia_dia 0.3302)
    (uvia_drill 0.2032)
  )
  (net_class 8mil ""
    (clearance 0.1524)
    (trace_width 0.2032)
    (via_dia 0.6858)
    (via_drill 0.3302)
    (uvia_dia 0.3302)
    (uvia_drill 0.2032)
  )
  (module MSAG_Misc:Header_2x20_2.54mm_male (layer B.Cu) (tedit 5C02EEB4)
    (at 189.6491 94.8055 180)
    (descr "Through hole straight pin header, 2x20, 2.54mm pitch, double rows")
    (tags "Through hole pin header THT 2x20 2.54mm double row")
    (fp_text reference J3 (at 1.27 2.33 180) (layer B.SilkS))
    (fp_text value Conn_02x20_Odd_Even (at 1.27 -50.59 180) (layer B.Fab))
    (fp_text user %R (at 1.27 -24.13 90) (layer B.Fab))
    (pad 40 thru_hole oval (at 2.54 -48.26 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 39 thru_hole oval (at 0 -48.26 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 72 /FPGA_3.3V))
    (pad 38 thru_hole oval (at 2.54 -45.72 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 61 /RD_EMPTYnr))
    (pad 37 thru_hole oval (at 0 -45.72 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask))
    (pad 36 thru_hole oval (at 2.54 -43.18 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 59 /IFCLKr))
    (pad 35 thru_hole oval (at 0 -43.18 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 60 /WR_FULLnr))
    (pad 34 thru_hole oval (at 2.54 -40.64 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 50 /FD1r))
    (pad 33 thru_hole oval (at 0 -40.64 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 49 /FD0r))
    (pad 32 thru_hole oval (at 2.54 -38.1 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 45 /FD3r))
    (pad 31 thru_hole oval (at 0 -38.1 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 51 /FD2r))
    (pad 30 thru_hole oval (at 2.54 -35.56 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 29 thru_hole oval (at 0 -35.56 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask))
    (pad 28 thru_hole oval (at 2.54 -33.02 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 42 /FD5r))
    (pad 27 thru_hole oval (at 0 -33.02 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 41 /FD4r))
    (pad 26 thru_hole oval (at 2.54 -30.48 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 40 /FD7r))
    (pad 25 thru_hole oval (at 0 -30.48 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 43 /FD6r))
    (pad 24 thru_hole oval (at 2.54 -27.94 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 38 /REnr))
    (pad 23 thru_hole oval (at 0 -27.94 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 37 /CMD_DATAr))
    (pad 22 thru_hole oval (at 2.54 -25.4 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 35 /PA0r))
    (pad 21 thru_hole oval (at 0 -25.4 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 39 /WEnr))
    (pad 20 thru_hole oval (at 2.54 -22.86 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 33 /PA2r))
    (pad 19 thru_hole oval (at 0 -22.86 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 32 /PA1r))
    (pad 18 thru_hole oval (at 2.54 -20.32 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 31 /PA4r))
    (pad 17 thru_hole oval (at 0 -20.32 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 34 /PA3r))
    (pad 16 thru_hole oval (at 2.54 -17.78 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 29 /PA6r))
    (pad 15 thru_hole oval (at 0 -17.78 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 28 /PA5r))
    (pad 14 thru_hole oval (at 2.54 -15.24 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 27 /FD8r))
    (pad 13 thru_hole oval (at 0 -15.24 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 30 /PA7r))
    (pad 12 thru_hole oval (at 2.54 -12.7 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 11 thru_hole oval (at 0 -12.7 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask))
    (pad 10 thru_hole oval (at 2.54 -10.16 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 25 /FD10r))
    (pad 9 thru_hole oval (at 0 -10.16 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 24 /FD9r))
    (pad 8 thru_hole oval (at 2.54 -7.62 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 23 /FD12r))
    (pad 7 thru_hole oval (at 0 -7.62 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 26 /FD11r))
    (pad 6 thru_hole oval (at 2.54 -5.08 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 57 /FD14r))
    (pad 5 thru_hole oval (at 0 -5.08 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 58 /FD13r))
    (pad 4 thru_hole oval (at 2.54 -2.54 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 53 /CY_CLKr))
    (pad 3 thru_hole oval (at 0 -2.54 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 56 /FD15r))
    (pad 2 thru_hole oval (at 2.54 0 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 1 thru_hole rect (at 0 0 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 72 /FPGA_3.3V))
    (model ${MSAG}/MSAG_KiCad3d/ESQ-120-12-G-D.step
      (offset (xyz 1.269999980926514 -24.12999963760376 1.904999971389771))
      (scale (xyz 1 1 1))
      (rotate (xyz -90 0 90))
    )
  )
  (module MSAG_Misc:nasa_logo_0.3inB (layer F.Cu) (tedit 0)
    (at 158.242 134.366)
    (fp_text reference G*** (at 0 0) (layer F.SilkS) hide)
    (fp_text value LOGO (at 0.75 0) (layer F.SilkS) hide)
  )
  (module MSAG_Misc:LED_0603_HandSoldering (layer F.Cu) (tedit 595FC9C0)
    (at 154.501701 142.83717 270)
    (descr "LED SMD 0603, hand soldering")
    (tags "LED 0603")
    (attr smd)
    (fp_text reference D1 (at -2.78157 0.679301 270) (layer F.SilkS))
    (fp_text value LED_Small_ALT (at 0 1.55 270) (layer F.Fab))
    (pad 2 smd rect (at 1.1 0 270) (size 1.2 0.9) (layers F.Cu F.Paste F.Mask)
      (net 74 "Net-(D1-Pad2)"))
    (pad 1 smd rect (at -1.1 0 270) (size 1.2 0.9) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (model ${MSAG3D}/LEDs.3dshapes/LED_0603.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 180))
    )
  )
  (module MSAG_Misc:R_0603_HandSoldering (layer F.Cu) (tedit 5BBB67BA)
    (at 155.966701 142.83717 270)
    (descr "Resistor SMD 0603, hand soldering")
    (tags "resistor 0603")
    (attr smd)
    (fp_text reference R4 (at -2.75617 -0.471899 90) (layer F.SilkS))
    (fp_text value 240 (at 0 1.55 270) (layer F.Fab))
    (fp_text user %R (at 0 0 270) (layer F.Fab))
    (pad 2 smd rect (at 1.1 0 270) (size 1.2 0.9) (layers F.Cu F.Paste F.Mask)
      (net 74 "Net-(D1-Pad2)"))
    (pad 1 smd rect (at -1.1 0 270) (size 1.2 0.9) (layers F.Cu F.Paste F.Mask)
      (net 73 +3.3V))
    (model ${MSAG3D}/Resistors_SMD.3dshapes/R_0603.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module MSAG_Misc:Pin_Header_Straight_1x02_Pitch2.54mm (layer F.Cu) (tedit 5BBB6713)
    (at 159.4358 141.1986)
    (descr "Through hole straight pin header, 1x02, 2.54mm pitch, single row")
    (tags "Through hole pin header THT 1x02 2.54mm single row")
    (fp_text reference JPWR1 (at 0 -2.33) (layer F.SilkS))
    (fp_text value Conn_02x01 (at 0 4.87) (layer F.Fab))
    (fp_text user %R (at 0 1.27 90) (layer F.Fab))
    (pad 1 thru_hole rect (at 0 0) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 73 +3.3V))
    (pad 2 thru_hole oval (at 0 2.54) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 1 GND))
    (model ${MSAG3D}/Connector_PinHeader_2.54mm.3dshapes/PinHeader_1x02_P2.54mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module MSAG_Misc:Crystal_SMD_2016-4pin_2.0x1.6mm (layer F.Cu) (tedit 5BB7E0A1)
    (at 145.542 107.442 270)
    (descr "SMD Crystal SERIES SMD2016/4 http://www.q-crystal.com/upload/5/2015552223166229.pdf, 2.0x1.6mm^2 package")
    (tags "SMD SMT crystal")
    (attr smd)
    (fp_text reference U5 (at 0.254 1.905 270) (layer F.SilkS))
    (fp_text value Crystal_GND24 (at 0 2 270) (layer F.Fab))
    (fp_text user %R (at 0 0 270) (layer F.Fab))
    (pad 1 smd rect (at -0.7 0.55 270) (size 0.9 0.8) (layers F.Cu F.Paste F.Mask)
      (net 68 /XTALIN))
    (pad 2 smd rect (at 0.7 0.55 270) (size 0.9 0.8) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 3 smd rect (at 0.7 -0.55 270) (size 0.9 0.8) (layers F.Cu F.Paste F.Mask)
      (net 67 /XTALOUT))
    (pad 4 smd rect (at -0.7 -0.55 270) (size 0.9 0.8) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (model ${MSAG3D}/Crystals.3dshapes/Crystal_SMD_2520-4pin_2.5x2.0mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module MSAG_Misc:Crystal_SMD_HC49-SD_HandSoldering (layer F.Cu) (tedit 5BB7E2FC)
    (at 151.765 101.854 180)
    (descr "SMD Crystal HC-49-SD http://cdn-reichelt.de/documents/datenblatt/B400/xxx-HC49-SMD.pdf, hand-soldering, 11.4x4.7mm^2 package")
    (tags "SMD SMT crystal hand-soldering")
    (attr smd)
    (fp_text reference U3 (at 11.43 0 270) (layer F.SilkS))
    (fp_text value Crystal (at 0 3.55 180) (layer F.Fab))
    (fp_text user %R (at 0 0 180) (layer F.Fab))
    (pad 2 smd rect (at 5.9375 0 180) (size 7.875 2) (layers F.Cu F.Paste F.Mask)
      (net 67 /XTALOUT))
    (pad 1 smd rect (at -5.9375 0 180) (size 7.875 2) (layers F.Cu F.Paste F.Mask)
      (net 68 /XTALIN))
    (model C:/Users/gsuarezm/Documents/kicad/MSAG_KiCad/MSAG_KiCad3d/Crystals.3dshapes/Crystal_SMD_HC49-SD-2pin.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
    (model ${MSAG}/MSAG_KiCad3d/Crystals.3dshapes/Crystal_SMD_HC49-SD-2pin.STEP
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module MSAG_Misc:MountingHole_2.2mm_M2_ISO14580_Pad (layer F.Cu) (tedit 56D1B4CB)
    (at 174.371 94.234 270)
    (descr "Mounting Hole 2.2mm, M2, ISO14580")
    (tags "mounting hole 2.2mm m2 iso14580")
    (attr virtual)
    (fp_text reference MH3 (at 0 -2.9 270) (layer F.SilkS) hide)
    (fp_text value MountingHole (at 0 2.9 270) (layer F.Fab))
    (fp_text user %R (at 0.3 0 270) (layer F.Fab))
    (pad 1 thru_hole circle (at 0 0 270) (size 3.8 3.8) (drill 2.2) (layers *.Cu *.Mask)
      (net 1 GND))
  )
  (module MSAG_Misc:MountingHole_2.2mm_M2_ISO14580_Pad (layer F.Cu) (tedit 56D1B4CB)
    (at 141.605 94.234 180)
    (descr "Mounting Hole 2.2mm, M2, ISO14580")
    (tags "mounting hole 2.2mm m2 iso14580")
    (attr virtual)
    (fp_text reference MH4 (at 0 -2.9 180) (layer F.SilkS) hide)
    (fp_text value MountingHole (at 0 2.9 180) (layer F.Fab))
    (fp_text user %R (at 0.3 0 180) (layer F.Fab))
    (pad 1 thru_hole circle (at 0 0 180) (size 3.8 3.8) (drill 2.2) (layers *.Cu *.Mask)
      (net 1 GND))
  )
  (module MSAG_Misc:MountingHole_2.2mm_M2_ISO14580_Pad (layer F.Cu) (tedit 56D1B4CB)
    (at 141.478 144.526)
    (descr "Mounting Hole 2.2mm, M2, ISO14580")
    (tags "mounting hole 2.2mm m2 iso14580")
    (attr virtual)
    (fp_text reference MH1 (at 0 -2.9) (layer F.SilkS) hide)
    (fp_text value MountingHole (at 0 2.9) (layer F.Fab))
    (fp_text user %R (at 0.3 0) (layer F.Fab))
    (pad 1 thru_hole circle (at 0 0) (size 3.8 3.8) (drill 2.2) (layers *.Cu *.Mask)
      (net 1 GND))
  )
  (module MSAG_Misc:MountingHole_2.2mm_M2_ISO14580_Pad (layer F.Cu) (tedit 56D1B4CB)
    (at 174.371 144.526 270)
    (descr "Mounting Hole 2.2mm, M2, ISO14580")
    (tags "mounting hole 2.2mm m2 iso14580")
    (attr virtual)
    (fp_text reference MH2 (at 0 -2.9 270) (layer F.SilkS) hide)
    (fp_text value MountingHole (at 0 2.9 270) (layer F.Fab))
    (fp_text user %R (at 0.3 0 270) (layer F.Fab))
    (pad 1 thru_hole circle (at 0 0 270) (size 3.8 3.8) (drill 2.2) (layers *.Cu *.Mask)
      (net 1 GND))
  )
  (module MSAG_Misc:Pin_Header_Straight_1x02_Pitch2.54mm (layer F.Cu) (tedit 5BBB6713)
    (at 179.705 93.472 90)
    (descr "Through hole straight pin header, 1x02, 2.54mm pitch, single row")
    (tags "Through hole pin header THT 1x02 2.54mm single row")
    (fp_text reference J2 (at 0 -2.33 90) (layer F.SilkS))
    (fp_text value Conn_02x01 (at 0 4.87 90) (layer F.Fab))
    (fp_text user %R (at 0 1.27 180) (layer F.Fab))
    (pad 1 thru_hole rect (at 0 0 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 73 +3.3V))
    (pad 2 thru_hole oval (at 0 2.54 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 72 /FPGA_3.3V))
    (model ${MSAG3D}/Connector_PinHeader_2.54mm.3dshapes/PinHeader_1x02_P2.54mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module MSAG_Misc:R_0603_HandSoldering (layer F.Cu) (tedit 5BBB67BA)
    (at 149.03774 131.34848)
    (descr "Resistor SMD 0603, hand soldering")
    (tags "resistor 0603")
    (attr smd)
    (fp_text reference R1 (at -3.048 -0.053) (layer F.SilkS))
    (fp_text value 2.2k (at 0 1.55) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 1 smd rect (at -1.1 0) (size 1.2 0.9) (layers F.Cu F.Paste F.Mask)
      (net 73 +3.3V))
    (pad 2 smd rect (at 1.1 0) (size 1.2 0.9) (layers F.Cu F.Paste F.Mask)
      (net 2 /SCL))
    (model ${MSAG3D}/Resistors_SMD.3dshapes/R_0603.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module MSAG_Misc:R_0603_HandSoldering (layer F.Cu) (tedit 5BBB67BA)
    (at 149.01926 129.1971)
    (descr "Resistor SMD 0603, hand soldering")
    (tags "resistor 0603")
    (attr smd)
    (fp_text reference R2 (at -3.048 -0.053) (layer F.SilkS))
    (fp_text value 2.2k (at 0 1.55) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 1 smd rect (at -1.1 0) (size 1.2 0.9) (layers F.Cu F.Paste F.Mask)
      (net 73 +3.3V))
    (pad 2 smd rect (at 1.1 0) (size 1.2 0.9) (layers F.Cu F.Paste F.Mask)
      (net 3 /SDA))
    (model ${MSAG3D}/Resistors_SMD.3dshapes/R_0603.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module MSAG_Misc:R_0603_HandSoldering (layer F.Cu) (tedit 5BBB67BA)
    (at 161.06718 94.31528 180)
    (descr "Resistor SMD 0603, hand soldering")
    (tags "resistor 0603")
    (attr smd)
    (fp_text reference R3 (at 0 1.85928 180) (layer F.SilkS))
    (fp_text value 10k (at 0 1.55 180) (layer F.Fab))
    (fp_text user %R (at 0 0 180) (layer F.Fab))
    (pad 1 smd rect (at -1.1 0 180) (size 1.2 0.9) (layers F.Cu F.Paste F.Mask)
      (net 73 +3.3V))
    (pad 2 smd rect (at 1.1 0 180) (size 1.2 0.9) (layers F.Cu F.Paste F.Mask)
      (net 69 /RESET_N))
    (model ${MSAG3D}/Resistors_SMD.3dshapes/R_0603.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module MSAG_Misc:R_Array_Convex_4x1206 (layer F.Cu) (tedit 5BBB685C)
    (at 179.88026 133.35)
    (descr "Chip Resistor Network, ROHM MNR34 (see mnr_g.pdf)")
    (tags "resistor array")
    (attr smd)
    (fp_text reference RN6 (at 0 -3.5) (layer F.SilkS))
    (fp_text value 22 (at 0 3.5) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 1 smd rect (at -1.5 -2) (size 0.9 0.9) (layers F.Cu F.Paste F.Mask)
      (net 44 /FD3))
    (pad 4 smd rect (at -1.5 2) (size 0.9 0.9) (layers F.Cu F.Paste F.Mask)
      (net 48 /FD0))
    (pad 2 smd rect (at -1.5 -0.66) (size 0.9 0.9) (layers F.Cu F.Paste F.Mask)
      (net 46 /FD2))
    (pad 3 smd rect (at -1.5 0.66) (size 0.9 0.9) (layers F.Cu F.Paste F.Mask)
      (net 47 /FD1))
    (pad 7 smd rect (at 1.5 -0.66) (size 0.9 0.9) (layers F.Cu F.Paste F.Mask)
      (net 51 /FD2r))
    (pad 8 smd rect (at 1.5 -2) (size 0.9 0.9) (layers F.Cu F.Paste F.Mask)
      (net 45 /FD3r))
    (pad 5 smd rect (at 1.5 2) (size 0.9 0.9) (layers F.Cu F.Paste F.Mask)
      (net 49 /FD0r))
    (pad 6 smd rect (at 1.5 0.66) (size 0.9 0.9) (layers F.Cu F.Paste F.Mask)
      (net 50 /FD1r))
    (model ${MSAG3D}/Resistors_SMD.3dshapes/R_Array_Convex_4x1206.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module MSAG_Misc:R_Array_Convex_4x1206 (layer F.Cu) (tedit 5BBB685C)
    (at 174.36478 139.065)
    (descr "Chip Resistor Network, ROHM MNR34 (see mnr_g.pdf)")
    (tags "resistor array")
    (attr smd)
    (fp_text reference RN9 (at 0 -3.5) (layer F.SilkS))
    (fp_text value 22 (at 0 3.5) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 1 smd rect (at -1.5 -2) (size 0.9 0.9) (layers F.Cu F.Paste F.Mask)
      (net 62 /IFCLK))
    (pad 4 smd rect (at -1.5 2) (size 0.9 0.9) (layers F.Cu F.Paste F.Mask))
    (pad 2 smd rect (at -1.5 -0.66) (size 0.9 0.9) (layers F.Cu F.Paste F.Mask)
      (net 64 /WR_FULLn))
    (pad 3 smd rect (at -1.5 0.66) (size 0.9 0.9) (layers F.Cu F.Paste F.Mask)
      (net 63 /RD_EMPTYn))
    (pad 7 smd rect (at 1.5 -0.66) (size 0.9 0.9) (layers F.Cu F.Paste F.Mask)
      (net 60 /WR_FULLnr))
    (pad 8 smd rect (at 1.5 -2) (size 0.9 0.9) (layers F.Cu F.Paste F.Mask)
      (net 59 /IFCLKr))
    (pad 5 smd rect (at 1.5 2) (size 0.9 0.9) (layers F.Cu F.Paste F.Mask))
    (pad 6 smd rect (at 1.5 0.66) (size 0.9 0.9) (layers F.Cu F.Paste F.Mask)
      (net 61 /RD_EMPTYnr))
    (model ${MSAG3D}/Resistors_SMD.3dshapes/R_Array_Convex_4x1206.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module MSAG_Misc:R_Array_Convex_4x1206 (layer F.Cu) (tedit 5BBB685C)
    (at 179.9336 99.06)
    (descr "Chip Resistor Network, ROHM MNR34 (see mnr_g.pdf)")
    (tags "resistor array")
    (attr smd)
    (fp_text reference RN8 (at 0 -3.5) (layer F.SilkS))
    (fp_text value 22 (at 0 3.5) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 1 smd rect (at -1.5 -2) (size 0.9 0.9) (layers F.Cu F.Paste F.Mask)
      (net 52 /CY_CLK))
    (pad 4 smd rect (at -1.5 2) (size 0.9 0.9) (layers F.Cu F.Paste F.Mask)
      (net 54 /FD13))
    (pad 2 smd rect (at -1.5 -0.66) (size 0.9 0.9) (layers F.Cu F.Paste F.Mask)
      (net 71 /FD15))
    (pad 3 smd rect (at -1.5 0.66) (size 0.9 0.9) (layers F.Cu F.Paste F.Mask)
      (net 55 /FD14))
    (pad 7 smd rect (at 1.5 -0.66) (size 0.9 0.9) (layers F.Cu F.Paste F.Mask)
      (net 56 /FD15r))
    (pad 8 smd rect (at 1.5 -2) (size 0.9 0.9) (layers F.Cu F.Paste F.Mask)
      (net 53 /CY_CLKr))
    (pad 5 smd rect (at 1.5 2) (size 0.9 0.9) (layers F.Cu F.Paste F.Mask)
      (net 58 /FD13r))
    (pad 6 smd rect (at 1.5 0.66) (size 0.9 0.9) (layers F.Cu F.Paste F.Mask)
      (net 57 /FD14r))
    (model ${MSAG3D}/Resistors_SMD.3dshapes/R_Array_Convex_4x1206.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module MSAG_Misc:R_Array_Convex_4x1206 (layer F.Cu) (tedit 5BBB685C)
    (at 174.36478 127.635)
    (descr "Chip Resistor Network, ROHM MNR34 (see mnr_g.pdf)")
    (tags "resistor array")
    (attr smd)
    (fp_text reference RN5 (at 0 -3.5) (layer F.SilkS))
    (fp_text value 22 (at 0 3.5) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 1 smd rect (at -1.5 -2) (size 0.9 0.9) (layers F.Cu F.Paste F.Mask)
      (net 19 /FD7))
    (pad 4 smd rect (at -1.5 2) (size 0.9 0.9) (layers F.Cu F.Paste F.Mask)
      (net 22 /FD4))
    (pad 2 smd rect (at -1.5 -0.66) (size 0.9 0.9) (layers F.Cu F.Paste F.Mask)
      (net 20 /FD6))
    (pad 3 smd rect (at -1.5 0.66) (size 0.9 0.9) (layers F.Cu F.Paste F.Mask)
      (net 21 /FD5))
    (pad 7 smd rect (at 1.5 -0.66) (size 0.9 0.9) (layers F.Cu F.Paste F.Mask)
      (net 43 /FD6r))
    (pad 8 smd rect (at 1.5 -2) (size 0.9 0.9) (layers F.Cu F.Paste F.Mask)
      (net 40 /FD7r))
    (pad 5 smd rect (at 1.5 2) (size 0.9 0.9) (layers F.Cu F.Paste F.Mask)
      (net 41 /FD4r))
    (pad 6 smd rect (at 1.5 0.66) (size 0.9 0.9) (layers F.Cu F.Paste F.Mask)
      (net 42 /FD5r))
    (model ${MSAG3D}/Resistors_SMD.3dshapes/R_Array_Convex_4x1206.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module MSAG_Misc:R_Array_Convex_4x1206 (layer F.Cu) (tedit 5BBB685C)
    (at 179.88026 121.92)
    (descr "Chip Resistor Network, ROHM MNR34 (see mnr_g.pdf)")
    (tags "resistor array")
    (attr smd)
    (fp_text reference RN4 (at 0 -3.5) (layer F.SilkS))
    (fp_text value 22 (at 0 3.5) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 1 smd rect (at -1.5 -2) (size 0.9 0.9) (layers F.Cu F.Paste F.Mask)
      (net 16 /PA0))
    (pad 4 smd rect (at -1.5 2) (size 0.9 0.9) (layers F.Cu F.Paste F.Mask)
      (net 36 /CMD_DATA))
    (pad 2 smd rect (at -1.5 -0.66) (size 0.9 0.9) (layers F.Cu F.Paste F.Mask)
      (net 17 /CTL2))
    (pad 3 smd rect (at -1.5 0.66) (size 0.9 0.9) (layers F.Cu F.Paste F.Mask)
      (net 18 /CTL1))
    (pad 7 smd rect (at 1.5 -0.66) (size 0.9 0.9) (layers F.Cu F.Paste F.Mask)
      (net 39 /WEnr))
    (pad 8 smd rect (at 1.5 -2) (size 0.9 0.9) (layers F.Cu F.Paste F.Mask)
      (net 35 /PA0r))
    (pad 5 smd rect (at 1.5 2) (size 0.9 0.9) (layers F.Cu F.Paste F.Mask)
      (net 37 /CMD_DATAr))
    (pad 6 smd rect (at 1.5 0.66) (size 0.9 0.9) (layers F.Cu F.Paste F.Mask)
      (net 38 /REnr))
    (model ${MSAG3D}/Resistors_SMD.3dshapes/R_Array_Convex_4x1206.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module MSAG_Misc:R_Array_Convex_4x1206 (layer F.Cu) (tedit 5BBB685C)
    (at 174.41812 104.775)
    (descr "Chip Resistor Network, ROHM MNR34 (see mnr_g.pdf)")
    (tags "resistor array")
    (attr smd)
    (fp_text reference RN1 (at 0 -3.5) (layer F.SilkS))
    (fp_text value 22 (at 0 3.5) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 1 smd rect (at -1.5 -2) (size 0.9 0.9) (layers F.Cu F.Paste F.Mask)
      (net 4 /FD12))
    (pad 4 smd rect (at -1.5 2) (size 0.9 0.9) (layers F.Cu F.Paste F.Mask)
      (net 7 /FD9))
    (pad 2 smd rect (at -1.5 -0.66) (size 0.9 0.9) (layers F.Cu F.Paste F.Mask)
      (net 5 /FD11))
    (pad 3 smd rect (at -1.5 0.66) (size 0.9 0.9) (layers F.Cu F.Paste F.Mask)
      (net 6 /FD10))
    (pad 7 smd rect (at 1.5 -0.66) (size 0.9 0.9) (layers F.Cu F.Paste F.Mask)
      (net 26 /FD11r))
    (pad 8 smd rect (at 1.5 -2) (size 0.9 0.9) (layers F.Cu F.Paste F.Mask)
      (net 23 /FD12r))
    (pad 5 smd rect (at 1.5 2) (size 0.9 0.9) (layers F.Cu F.Paste F.Mask)
      (net 24 /FD9r))
    (pad 6 smd rect (at 1.5 0.66) (size 0.9 0.9) (layers F.Cu F.Paste F.Mask)
      (net 25 /FD10r))
    (model ${MSAG3D}/Resistors_SMD.3dshapes/R_Array_Convex_4x1206.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module MSAG_Misc:R_Array_Convex_4x1206 (layer F.Cu) (tedit 5BBB685C)
    (at 179.88026 110.49)
    (descr "Chip Resistor Network, ROHM MNR34 (see mnr_g.pdf)")
    (tags "resistor array")
    (attr smd)
    (fp_text reference RN2 (at 0 -3.5) (layer F.SilkS))
    (fp_text value 22 (at 0 3.5) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 1 smd rect (at -1.5 -2) (size 0.9 0.9) (layers F.Cu F.Paste F.Mask)
      (net 8 /FD8))
    (pad 4 smd rect (at -1.5 2) (size 0.9 0.9) (layers F.Cu F.Paste F.Mask)
      (net 11 /PA5))
    (pad 2 smd rect (at -1.5 -0.66) (size 0.9 0.9) (layers F.Cu F.Paste F.Mask)
      (net 9 /PA7))
    (pad 3 smd rect (at -1.5 0.66) (size 0.9 0.9) (layers F.Cu F.Paste F.Mask)
      (net 10 /PA6))
    (pad 7 smd rect (at 1.5 -0.66) (size 0.9 0.9) (layers F.Cu F.Paste F.Mask)
      (net 30 /PA7r))
    (pad 8 smd rect (at 1.5 -2) (size 0.9 0.9) (layers F.Cu F.Paste F.Mask)
      (net 27 /FD8r))
    (pad 5 smd rect (at 1.5 2) (size 0.9 0.9) (layers F.Cu F.Paste F.Mask)
      (net 28 /PA5r))
    (pad 6 smd rect (at 1.5 0.66) (size 0.9 0.9) (layers F.Cu F.Paste F.Mask)
      (net 29 /PA6r))
    (model ${MSAG3D}/Resistors_SMD.3dshapes/R_Array_Convex_4x1206.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module MSAG_Misc:R_Array_Convex_4x1206 (layer F.Cu) (tedit 5BBB685C)
    (at 174.36478 116.205)
    (descr "Chip Resistor Network, ROHM MNR34 (see mnr_g.pdf)")
    (tags "resistor array")
    (attr smd)
    (fp_text reference RN3 (at 0 -3.5) (layer F.SilkS))
    (fp_text value 22 (at 0 3.5) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 1 smd rect (at -1.5 -2) (size 0.9 0.9) (layers F.Cu F.Paste F.Mask)
      (net 12 /PA4))
    (pad 4 smd rect (at -1.5 2) (size 0.9 0.9) (layers F.Cu F.Paste F.Mask)
      (net 15 /PA1))
    (pad 2 smd rect (at -1.5 -0.66) (size 0.9 0.9) (layers F.Cu F.Paste F.Mask)
      (net 13 /PA3))
    (pad 3 smd rect (at -1.5 0.66) (size 0.9 0.9) (layers F.Cu F.Paste F.Mask)
      (net 14 /PA2))
    (pad 7 smd rect (at 1.5 -0.66) (size 0.9 0.9) (layers F.Cu F.Paste F.Mask)
      (net 34 /PA3r))
    (pad 8 smd rect (at 1.5 -2) (size 0.9 0.9) (layers F.Cu F.Paste F.Mask)
      (net 31 /PA4r))
    (pad 5 smd rect (at 1.5 2) (size 0.9 0.9) (layers F.Cu F.Paste F.Mask)
      (net 32 /PA1r))
    (pad 6 smd rect (at 1.5 0.66) (size 0.9 0.9) (layers F.Cu F.Paste F.Mask)
      (net 33 /PA2r))
    (model ${MSAG3D}/Resistors_SMD.3dshapes/R_Array_Convex_4x1206.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module MSAG_Misc:SOIC-8_3.9x4.9mm_Pitch1.27mm (layer F.Cu) (tedit 5BBB68FA)
    (at 149.77872 136.45388 90)
    (descr "8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [SOIC] (see Microchip Packaging Specification 00000049BS.pdf)")
    (tags "SOIC 1.27")
    (attr smd)
    (fp_text reference U2 (at 0 -3.5 90) (layer F.SilkS))
    (fp_text value 24LC128 (at 0 3.5 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 1 smd rect (at -2.7 -1.905 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 73 +3.3V))
    (pad 2 smd rect (at -2.7 -0.635 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 3 smd rect (at -2.7 0.635 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 4 smd rect (at -2.7 1.905 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 5 smd rect (at 2.7 1.905 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 3 /SDA))
    (pad 6 smd rect (at 2.7 0.635 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 2 /SCL))
    (pad 7 smd rect (at 2.7 -0.635 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 8 smd rect (at 2.7 -1.905 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 73 +3.3V))
    (model ${MSAG3D}/Housings_SOIC.3dshapes/SOIC-8_3.9x4.9mm_Pitch1.27mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module MSAG_Misc:SOT-23-5_HandSoldering (layer F.Cu) (tedit 5BBB6937)
    (at 161.67988 97.44964)
    (descr "5-pin SOT23 package")
    (tags "SOT-23-5 hand-soldering")
    (attr smd)
    (fp_text reference U4 (at -3.56488 -2.32664) (layer F.SilkS))
    (fp_text value ADM8320 (at 0 2.9) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 1 smd rect (at -1.35 -0.95) (size 1.56 0.65) (layers F.Cu F.Paste F.Mask)
      (net 69 /RESET_N))
    (pad 2 smd rect (at -1.35 0) (size 1.56 0.65) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 3 smd rect (at -1.35 0.95) (size 1.56 0.65) (layers F.Cu F.Paste F.Mask)
      (net 70 "Net-(SW1-Pad3)"))
    (pad 4 smd rect (at 1.35 0.95) (size 1.56 0.65) (layers F.Cu F.Paste F.Mask))
    (pad 5 smd rect (at 1.35 -0.95) (size 1.56 0.65) (layers F.Cu F.Paste F.Mask)
      (net 73 +3.3V))
    (model ${MSAG3D}/TO_SOT_Packages_SMD.3dshapes/SOT-23-5.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module MSAG_Misc:SSOP-56_7.5x18.5mm_Pitch0.635mm (layer F.Cu) (tedit 5BBB69BC)
    (at 161.670701 118.553701)
    (descr "SSOP56: plastic shrink small outline package; 56 leads; body width 7.5 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot371-1_po.pdf)")
    (tags "SSOP 0.635")
    (attr smd)
    (fp_text reference U1 (at 0 -10.275) (layer F.SilkS))
    (fp_text value CY7C68013A-56PVXI (at 0 10.275) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 1 smd rect (at -4.7 -8.5725) (size 1.2 0.4) (layers F.Cu F.Paste F.Mask)
      (net 54 /FD13))
    (pad 2 smd rect (at -4.7 -7.9375) (size 1.2 0.4) (layers F.Cu F.Paste F.Mask)
      (net 55 /FD14))
    (pad 3 smd rect (at -4.7 -7.3025) (size 1.2 0.4) (layers F.Cu F.Paste F.Mask)
      (net 71 /FD15))
    (pad 4 smd rect (at -4.7 -6.6675) (size 1.2 0.4) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 5 smd rect (at -4.7 -6.0325) (size 1.2 0.4) (layers F.Cu F.Paste F.Mask)
      (net 52 /CY_CLK))
    (pad 6 smd rect (at -4.7 -5.3975) (size 1.2 0.4) (layers F.Cu F.Paste F.Mask)
      (net 73 +3.3V))
    (pad 7 smd rect (at -4.7 -4.7625) (size 1.2 0.4) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 8 smd rect (at -4.7 -4.1275) (size 1.2 0.4) (layers F.Cu F.Paste F.Mask)
      (net 63 /RD_EMPTYn))
    (pad 9 smd rect (at -4.7 -3.4925) (size 1.2 0.4) (layers F.Cu F.Paste F.Mask)
      (net 64 /WR_FULLn))
    (pad 10 smd rect (at -4.7 -2.8575) (size 1.2 0.4) (layers F.Cu F.Paste F.Mask)
      (net 73 +3.3V))
    (pad 11 smd rect (at -4.7 -2.2225) (size 1.2 0.4) (layers F.Cu F.Paste F.Mask)
      (net 67 /XTALOUT))
    (pad 12 smd rect (at -4.7 -1.5875) (size 1.2 0.4) (layers F.Cu F.Paste F.Mask)
      (net 68 /XTALIN))
    (pad 13 smd rect (at -4.7 -0.9525) (size 1.2 0.4) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 14 smd rect (at -4.7 -0.3175) (size 1.2 0.4) (layers F.Cu F.Paste F.Mask)
      (net 73 +3.3V))
    (pad 15 smd rect (at -4.7 0.3175) (size 1.2 0.4) (layers F.Cu F.Paste F.Mask)
      (net 66 /DPLUS))
    (pad 16 smd rect (at -4.7 0.9525) (size 1.2 0.4) (layers F.Cu F.Paste F.Mask)
      (net 65 /DMINUS))
    (pad 17 smd rect (at -4.7 1.5875) (size 1.2 0.4) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 18 smd rect (at -4.7 2.2225) (size 1.2 0.4) (layers F.Cu F.Paste F.Mask)
      (net 73 +3.3V))
    (pad 19 smd rect (at -4.7 2.8575) (size 1.2 0.4) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 20 smd rect (at -4.7 3.4925) (size 1.2 0.4) (layers F.Cu F.Paste F.Mask)
      (net 62 /IFCLK))
    (pad 21 smd rect (at -4.7 4.1275) (size 1.2 0.4) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 22 smd rect (at -4.7 4.7625) (size 1.2 0.4) (layers F.Cu F.Paste F.Mask)
      (net 2 /SCL))
    (pad 23 smd rect (at -4.7 5.3975) (size 1.2 0.4) (layers F.Cu F.Paste F.Mask)
      (net 3 /SDA))
    (pad 24 smd rect (at -4.7 6.0325) (size 1.2 0.4) (layers F.Cu F.Paste F.Mask)
      (net 73 +3.3V))
    (pad 25 smd rect (at -4.7 6.6675) (size 1.2 0.4) (layers F.Cu F.Paste F.Mask)
      (net 48 /FD0))
    (pad 26 smd rect (at -4.7 7.3025) (size 1.2 0.4) (layers F.Cu F.Paste F.Mask)
      (net 47 /FD1))
    (pad 27 smd rect (at -4.7 7.9375) (size 1.2 0.4) (layers F.Cu F.Paste F.Mask)
      (net 46 /FD2))
    (pad 28 smd rect (at -4.7 8.5725) (size 1.2 0.4) (layers F.Cu F.Paste F.Mask)
      (net 44 /FD3))
    (pad 29 smd rect (at 4.7 8.5725) (size 1.2 0.4) (layers F.Cu F.Paste F.Mask)
      (net 22 /FD4))
    (pad 30 smd rect (at 4.7 7.9375) (size 1.2 0.4) (layers F.Cu F.Paste F.Mask)
      (net 21 /FD5))
    (pad 31 smd rect (at 4.7 7.3025) (size 1.2 0.4) (layers F.Cu F.Paste F.Mask)
      (net 20 /FD6))
    (pad 32 smd rect (at 4.7 6.6675) (size 1.2 0.4) (layers F.Cu F.Paste F.Mask)
      (net 19 /FD7))
    (pad 33 smd rect (at 4.7 6.0325) (size 1.2 0.4) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 34 smd rect (at 4.7 5.3975) (size 1.2 0.4) (layers F.Cu F.Paste F.Mask)
      (net 73 +3.3V))
    (pad 35 smd rect (at 4.7 4.7625) (size 1.2 0.4) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 36 smd rect (at 4.7 4.1275) (size 1.2 0.4) (layers F.Cu F.Paste F.Mask)
      (net 36 /CMD_DATA))
    (pad 37 smd rect (at 4.7 3.4925) (size 1.2 0.4) (layers F.Cu F.Paste F.Mask)
      (net 18 /CTL1))
    (pad 38 smd rect (at 4.7 2.8575) (size 1.2 0.4) (layers F.Cu F.Paste F.Mask)
      (net 17 /CTL2))
    (pad 39 smd rect (at 4.7 2.2225) (size 1.2 0.4) (layers F.Cu F.Paste F.Mask)
      (net 73 +3.3V))
    (pad 40 smd rect (at 4.7 1.5875) (size 1.2 0.4) (layers F.Cu F.Paste F.Mask)
      (net 16 /PA0))
    (pad 41 smd rect (at 4.7 0.9525) (size 1.2 0.4) (layers F.Cu F.Paste F.Mask)
      (net 15 /PA1))
    (pad 42 smd rect (at 4.7 0.3175) (size 1.2 0.4) (layers F.Cu F.Paste F.Mask)
      (net 14 /PA2))
    (pad 43 smd rect (at 4.7 -0.3175) (size 1.2 0.4) (layers F.Cu F.Paste F.Mask)
      (net 13 /PA3))
    (pad 44 smd rect (at 4.7 -0.9525) (size 1.2 0.4) (layers F.Cu F.Paste F.Mask)
      (net 12 /PA4))
    (pad 45 smd rect (at 4.7 -1.5875) (size 1.2 0.4) (layers F.Cu F.Paste F.Mask)
      (net 11 /PA5))
    (pad 46 smd rect (at 4.7 -2.2225) (size 1.2 0.4) (layers F.Cu F.Paste F.Mask)
      (net 10 /PA6))
    (pad 47 smd rect (at 4.7 -2.8575) (size 1.2 0.4) (layers F.Cu F.Paste F.Mask)
      (net 9 /PA7))
    (pad 48 smd rect (at 4.7 -3.4925) (size 1.2 0.4) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 49 smd rect (at 4.7 -4.1275) (size 1.2 0.4) (layers F.Cu F.Paste F.Mask)
      (net 69 /RESET_N))
    (pad 50 smd rect (at 4.7 -4.7625) (size 1.2 0.4) (layers F.Cu F.Paste F.Mask)
      (net 73 +3.3V))
    (pad 51 smd rect (at 4.7 -5.3975) (size 1.2 0.4) (layers F.Cu F.Paste F.Mask)
      (net 73 +3.3V))
    (pad 52 smd rect (at 4.7 -6.0325) (size 1.2 0.4) (layers F.Cu F.Paste F.Mask)
      (net 8 /FD8))
    (pad 53 smd rect (at 4.7 -6.6675) (size 1.2 0.4) (layers F.Cu F.Paste F.Mask)
      (net 7 /FD9))
    (pad 54 smd rect (at 4.7 -7.3025) (size 1.2 0.4) (layers F.Cu F.Paste F.Mask)
      (net 6 /FD10))
    (pad 55 smd rect (at 4.7 -7.9375) (size 1.2 0.4) (layers F.Cu F.Paste F.Mask)
      (net 5 /FD11))
    (pad 56 smd rect (at 4.7 -8.5725) (size 1.2 0.4) (layers F.Cu F.Paste F.Mask)
      (net 4 /FD12))
    (model ${MSAG3D}/Housings_SSOP.3dshapes/SSOP-56_7.5x18.5mm_Pitch0.635mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module MSAG_Misc:C_0805_HandSoldering (layer B.Cu) (tedit 5BB7E3D6)
    (at 167.2336 142.4994 270)
    (descr "Capacitor SMD 0805, hand soldering")
    (tags "capacitor 0805")
    (attr smd)
    (fp_text reference C15 (at -4.064 -0.028 270) (layer B.SilkS))
    (fp_text value 0.1uF (at 0 -1.75 270) (layer B.Fab))
    (fp_text user %R (at 0 1.75 270) (layer B.Fab))
    (pad 1 smd rect (at -1.25 0 270) (size 1.5 1.25) (layers B.Cu B.Paste B.Mask)
      (net 73 +3.3V))
    (pad 2 smd rect (at 1.25 0 270) (size 1.5 1.25) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (model ${MSAG3D}/Capacitors_SMD.3dshapes/C_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module MSAG_Misc:C_0805_HandSoldering (layer B.Cu) (tedit 5BB7E3D6)
    (at 165.0492 142.5194 270)
    (descr "Capacitor SMD 0805, hand soldering")
    (tags "capacitor 0805")
    (attr smd)
    (fp_text reference C14 (at -4.064 -0.028 270) (layer B.SilkS))
    (fp_text value 1uF (at 0 -1.75 270) (layer B.Fab))
    (fp_text user %R (at 0 1.75 270) (layer B.Fab))
    (pad 1 smd rect (at -1.25 0 270) (size 1.5 1.25) (layers B.Cu B.Paste B.Mask)
      (net 73 +3.3V))
    (pad 2 smd rect (at 1.25 0 270) (size 1.5 1.25) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (model ${MSAG3D}/Capacitors_SMD.3dshapes/C_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module MSAG_Misc:C_0805_HandSoldering (layer B.Cu) (tedit 5BB7E3D6)
    (at 162.7124 142.474 270)
    (descr "Capacitor SMD 0805, hand soldering")
    (tags "capacitor 0805")
    (attr smd)
    (fp_text reference C13 (at -4.064 -0.028 270) (layer B.SilkS))
    (fp_text value 10uF (at 0 -1.75 270) (layer B.Fab))
    (fp_text user %R (at 0 1.75 270) (layer B.Fab))
    (pad 1 smd rect (at -1.25 0 270) (size 1.5 1.25) (layers B.Cu B.Paste B.Mask)
      (net 73 +3.3V))
    (pad 2 smd rect (at 1.25 0 270) (size 1.5 1.25) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (model ${MSAG3D}/Capacitors_SMD.3dshapes/C_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module MSAG_Misc:C_0805_HandSoldering (layer B.Cu) (tedit 5BB7E3D6)
    (at 161.798 124.841 180)
    (descr "Capacitor SMD 0805, hand soldering")
    (tags "capacitor 0805")
    (attr smd)
    (fp_text reference C12 (at -3.7465 -0.381 180) (layer B.SilkS))
    (fp_text value 0.1uF (at 0 -1.75 180) (layer B.Fab))
    (fp_text user %R (at 0 1.75 180) (layer B.Fab))
    (pad 1 smd rect (at -1.25 0 180) (size 1.5 1.25) (layers B.Cu B.Paste B.Mask)
      (net 73 +3.3V))
    (pad 2 smd rect (at 1.25 0 180) (size 1.5 1.25) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (model ${MSAG3D}/Capacitors_SMD.3dshapes/C_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module MSAG_Misc:C_0805_HandSoldering (layer F.Cu) (tedit 5BB7E3D6)
    (at 167.0812 94.2086)
    (descr "Capacitor SMD 0805, hand soldering")
    (tags "capacitor 0805")
    (attr smd)
    (fp_text reference C11 (at 0 -1.75) (layer F.SilkS))
    (fp_text value 0.1uF (at 0 1.75) (layer F.Fab))
    (fp_text user %R (at 0 -1.75) (layer F.Fab))
    (pad 1 smd rect (at -1.25 0) (size 1.5 1.25) (layers F.Cu F.Paste F.Mask)
      (net 73 +3.3V))
    (pad 2 smd rect (at 1.25 0) (size 1.5 1.25) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (model ${MSAG3D}/Capacitors_SMD.3dshapes/C_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module MSAG_Misc:C_0805_HandSoldering (layer B.Cu) (tedit 5BB7E3D6)
    (at 161.77292 122.795443 180)
    (descr "Capacitor SMD 0805, hand soldering")
    (tags "capacitor 0805")
    (attr smd)
    (fp_text reference C10 (at -3.70808 0.113443 180) (layer B.SilkS))
    (fp_text value 0.1uF (at 0 -1.75 180) (layer B.Fab))
    (fp_text user %R (at 0 1.75 180) (layer B.Fab))
    (pad 1 smd rect (at -1.25 0 180) (size 1.5 1.25) (layers B.Cu B.Paste B.Mask)
      (net 73 +3.3V))
    (pad 2 smd rect (at 1.25 0 180) (size 1.5 1.25) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (model ${MSAG3D}/Capacitors_SMD.3dshapes/C_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module MSAG_Misc:C_0805_HandSoldering (layer B.Cu) (tedit 5BB7E3D6)
    (at 161.77292 120.68696 180)
    (descr "Capacitor SMD 0805, hand soldering")
    (tags "capacitor 0805")
    (attr smd)
    (fp_text reference C9 (at -3.39058 -0.02654 180) (layer B.SilkS))
    (fp_text value 0.1uF (at 0 -1.75 180) (layer B.Fab))
    (fp_text user %R (at 0 1.75 180) (layer B.Fab))
    (pad 1 smd rect (at -1.25 0 180) (size 1.5 1.25) (layers B.Cu B.Paste B.Mask)
      (net 73 +3.3V))
    (pad 2 smd rect (at 1.25 0 180) (size 1.5 1.25) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (model ${MSAG3D}/Capacitors_SMD.3dshapes/C_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module MSAG_Misc:C_0805_HandSoldering (layer F.Cu) (tedit 5BB7E3D6)
    (at 151.2 109.2 270)
    (descr "Capacitor SMD 0805, hand soldering")
    (tags "capacitor 0805")
    (attr smd)
    (fp_text reference C8 (at -0.0102 2.06248 270) (layer F.SilkS))
    (fp_text value 10pF (at 0 1.75 270) (layer F.Fab))
    (fp_text user %R (at 0 -1.75 270) (layer F.Fab))
    (pad 1 smd rect (at -1.25 0 270) (size 1.5 1.25) (layers F.Cu F.Paste F.Mask)
      (net 67 /XTALOUT))
    (pad 2 smd rect (at 1.25 0 270) (size 1.5 1.25) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (model ${MSAG3D}/Capacitors_SMD.3dshapes/C_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module MSAG_Misc:C_0805_HandSoldering (layer F.Cu) (tedit 5BB7E3D6)
    (at 153.2 109.2 270)
    (descr "Capacitor SMD 0805, hand soldering")
    (tags "capacitor 0805")
    (attr smd)
    (fp_text reference C7 (at -0.00258 -2.02438 270) (layer F.SilkS))
    (fp_text value 10pF (at 0 1.75 270) (layer F.Fab))
    (fp_text user %R (at 0 -1.75 270) (layer F.Fab))
    (pad 1 smd rect (at -1.25 0 270) (size 1.5 1.25) (layers F.Cu F.Paste F.Mask)
      (net 68 /XTALIN))
    (pad 2 smd rect (at 1.25 0 270) (size 1.5 1.25) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (model ${MSAG3D}/Capacitors_SMD.3dshapes/C_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module MSAG_Misc:C_0805_HandSoldering (layer B.Cu) (tedit 5BB7E3D6)
    (at 161.77292 118.57848 180)
    (descr "Capacitor SMD 0805, hand soldering")
    (tags "capacitor 0805")
    (attr smd)
    (fp_text reference C6 (at -3.32708 0.02398 180) (layer B.SilkS))
    (fp_text value 0.1uF (at 0 -1.75 180) (layer B.Fab))
    (fp_text user %R (at 0 1.75 180) (layer B.Fab))
    (pad 1 smd rect (at -1.25 0 180) (size 1.5 1.25) (layers B.Cu B.Paste B.Mask)
      (net 73 +3.3V))
    (pad 2 smd rect (at 1.25 0 180) (size 1.5 1.25) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (model ${MSAG3D}/Capacitors_SMD.3dshapes/C_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module MSAG_Misc:C_0805_HandSoldering (layer B.Cu) (tedit 5BB7E3D6)
    (at 161.77292 116.47 180)
    (descr "Capacitor SMD 0805, hand soldering")
    (tags "capacitor 0805")
    (attr smd)
    (fp_text reference C5 (at -3.32708 -0.0525 180) (layer B.SilkS))
    (fp_text value 0.1uF (at 0 -1.75 180) (layer B.Fab))
    (fp_text user %R (at 0 1.75 180) (layer B.Fab))
    (pad 1 smd rect (at -1.25 0 180) (size 1.5 1.25) (layers B.Cu B.Paste B.Mask)
      (net 73 +3.3V))
    (pad 2 smd rect (at 1.25 0 180) (size 1.5 1.25) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (model ${MSAG3D}/Capacitors_SMD.3dshapes/C_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module MSAG_Misc:C_0805_HandSoldering (layer B.Cu) (tedit 5BB7E3D6)
    (at 161.77292 114.36152 180)
    (descr "Capacitor SMD 0805, hand soldering")
    (tags "capacitor 0805")
    (attr smd)
    (fp_text reference C4 (at -3.20008 0.50602 180) (layer B.SilkS))
    (fp_text value 0.1uF (at 0 -1.75 180) (layer B.Fab))
    (fp_text user %R (at 0 1.75 180) (layer B.Fab))
    (pad 1 smd rect (at -1.25 0 180) (size 1.5 1.25) (layers B.Cu B.Paste B.Mask)
      (net 73 +3.3V))
    (pad 2 smd rect (at 1.25 0 180) (size 1.5 1.25) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (model ${MSAG3D}/Capacitors_SMD.3dshapes/C_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module MSAG_Misc:C_0805_HandSoldering (layer B.Cu) (tedit 5BB7E3D6)
    (at 161.77292 112.25304 180)
    (descr "Capacitor SMD 0805, hand soldering")
    (tags "capacitor 0805")
    (attr smd)
    (fp_text reference C3 (at -3.32708 0.11204 180) (layer B.SilkS))
    (fp_text value 1uF (at 0 -1.75 180) (layer B.Fab))
    (fp_text user %R (at 0 1.75 180) (layer B.Fab))
    (pad 1 smd rect (at -1.25 0 180) (size 1.5 1.25) (layers B.Cu B.Paste B.Mask)
      (net 73 +3.3V))
    (pad 2 smd rect (at 1.25 0 180) (size 1.5 1.25) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (model ${MSAG3D}/Capacitors_SMD.3dshapes/C_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module MSAG_Misc:C_0805_HandSoldering (layer F.Cu) (tedit 5BB7E3D6)
    (at 149.25262 141.76756)
    (descr "Capacitor SMD 0805, hand soldering")
    (tags "capacitor 0805")
    (attr smd)
    (fp_text reference C1 (at -3.10102 0.09144) (layer F.SilkS))
    (fp_text value 0.1uF (at 0 1.75) (layer F.Fab))
    (fp_text user %R (at 0 -1.75) (layer F.Fab))
    (pad 1 smd rect (at -1.25 0) (size 1.5 1.25) (layers F.Cu F.Paste F.Mask)
      (net 73 +3.3V))
    (pad 2 smd rect (at 1.25 0) (size 1.5 1.25) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (model ${MSAG3D}/Capacitors_SMD.3dshapes/C_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
    (model ${MSAG}/MSAG_KiCad3d/Capacitors_SMD.3dshapes/C_0805.step
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module MSAG_Misc:C_0805_HandSoldering (layer B.Cu) (tedit 5BB7E3D6)
    (at 161.77292 110.14456 180)
    (descr "Capacitor SMD 0805, hand soldering")
    (tags "capacitor 0805")
    (attr smd)
    (fp_text reference C2 (at -3.32708 0.03556 180) (layer B.SilkS))
    (fp_text value 10uF (at 0 -1.75 180) (layer B.Fab))
    (fp_text user %R (at 0 1.75 180) (layer B.Fab))
    (pad 1 smd rect (at -1.25 0 180) (size 1.5 1.25) (layers B.Cu B.Paste B.Mask)
      (net 73 +3.3V))
    (pad 2 smd rect (at 1.25 0 180) (size 1.5 1.25) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (model ${MSAG3D}/Capacitors_SMD.3dshapes/C_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module MSAG_Misc:C_0805_HandSoldering (layer B.Cu) (tedit 5BB7E3D6)
    (at 169.6212 142.5194 270)
    (descr "Capacitor SMD 0805, hand soldering")
    (tags "capacitor 0805")
    (attr smd)
    (fp_text reference C16 (at -4.064 -0.028 270) (layer B.SilkS))
    (fp_text value 0.1uF (at 0 -1.75 270) (layer B.Fab))
    (fp_text user %R (at 0 1.75 270) (layer B.Fab))
    (pad 1 smd rect (at -1.25 0 270) (size 1.5 1.25) (layers B.Cu B.Paste B.Mask)
      (net 73 +3.3V))
    (pad 2 smd rect (at 1.25 0 270) (size 1.5 1.25) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (model ${MSAG3D}/Capacitors_SMD.3dshapes/C_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module MSAG_Misc:SW_EVQ-Q2K03W (layer F.Cu) (tedit 5BBB6A27)
    (at 151.765 95.758 180)
    (descr "Light Touch Switch, https://industrial.panasonic.com/cdbs/www-data/pdf/ATK0000/ATK0000CE28.pdf")
    (attr smd)
    (fp_text reference SW1 (at 6.223 0.127 270) (layer F.SilkS))
    (fp_text value EVQ-Q2K03W (at 0 4.25 180) (layer F.Fab))
    (fp_text user %R (at 0.05 -3.95 180) (layer F.Fab))
    (pad 3 smd rect (at 3.4 -2 180) (size 3.2 1) (layers F.Cu F.Paste F.Mask)
      (net 70 "Net-(SW1-Pad3)"))
    (pad 1 smd rect (at -3.4 -2 180) (size 3.2 1) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 2 smd rect (at -3.4 2 180) (size 3.2 1) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 4 smd rect (at 3.4 2 180) (size 3.2 1) (layers F.Cu F.Paste F.Mask)
      (net 70 "Net-(SW1-Pad3)"))
    (model ${MSAG3D}/Buttons_Switches_SMD.3dshapes/SW_SPST_EVQQ2_02W.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module MSAG_Misc:Hirose_UX60-MB-5ST_USB_Mini-B (layer F.Cu) (tedit 5BB7F7BC)
    (at 145.45818 119.28094)
    (descr "Hirose UX60-MB-5ST USB Mini-B 5-pin SMD connector")
    (tags "USB USB_B USB_Mini connector")
    (attr smd)
    (fp_text reference J1 (at -0.65 6.9) (layer F.SilkS))
    (fp_text value USB_B_Mini (at -0.65 -7.1) (layer F.Fab))
    (pad 1 smd rect (at 3.65 -1.6) (size 2.5 0.5) (layers F.Cu F.Paste F.Mask))
    (pad 2 smd rect (at 3.65 -0.8) (size 2.5 0.5) (layers F.Cu F.Paste F.Mask)
      (net 65 /DMINUS))
    (pad 3 smd rect (at 3.65 0) (size 2.5 0.5) (layers F.Cu F.Paste F.Mask)
      (net 66 /DPLUS))
    (pad 4 smd rect (at 3.65 0.8) (size 2.5 0.5) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 5 smd rect (at 3.65 1.6) (size 2.5 0.5) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 6 smd rect (at 2.65 -4.2) (size 2.2 2.5) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 6 smd rect (at -2.65 -4.2) (size 2.2 2.5) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 6 smd rect (at 2.65 4.2) (size 2.2 2.5) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 6 smd rect (at -2.65 4.2) (size 2.2 2.5) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad "" np_thru_hole circle (at 0.65 -1.75) (size 0.9 0.9) (drill 0.9) (layers *.Cu *.Mask))
    (pad "" np_thru_hole circle (at 0.65 1.75) (size 0.9 0.9) (drill 0.9) (layers *.Cu *.Mask))
    (model ${MSAG3D}/MUSB-05-F-B-SM-A.stp
      (offset (xyz -3.8 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz -90 0 90))
    )
  )
  (module MSAG_Misc:goddard_rocket_0.3inA (layer F.Cu) (tedit 0)
    (at 166.878 139.6746)
    (fp_text reference G*** (at 0 0) (layer F.SilkS) hide)
    (fp_text value LOGO (at 0.75 0) (layer F.SilkS) hide)
  )
  (module MSAG_Misc:msag_logo_0.5in (layer F.Cu) (tedit 0)
    (at 168.8846 132.8166)
    (fp_text reference G*** (at 0 0) (layer F.SilkS) hide)
    (fp_text value LOGO (at 0.75 0) (layer F.SilkS) hide)
  )
  (gr_text "pin 8 gnd" (at 153.4 122.65) (layer F.SilkS))
  (gr_text "pin 8 gnd" (at 153.4 122.7) (layer F.SilkS))
  (gr_text 29 (at 191.516 130.429) (layer F.SilkS))
  (gr_text 30 (at 185.039 130.429) (layer F.SilkS))
  (gr_text 20 (at 185.039 117.729) (layer F.SilkS))
  (gr_text 19 (at 191.516 117.729) (layer F.SilkS))
  (gr_text 10 (at 185.039 105.029) (layer F.SilkS))
  (gr_text 9 (at 191.516 105.029) (layer F.SilkS))
  (gr_text 40 (at 185.039 143.129) (layer F.SilkS))
  (gr_text 39 (at 191.516 143.129) (layer F.SilkS))
  (gr_text 1 (at 191.516 94.742) (layer F.SilkS))
  (gr_text 2 (at 185.039 94.742) (layer F.SilkS))
  (gr_text "*PINS FLIPPED" (at 187.96 92.329) (layer F.SilkS))
  (gr_text "QuickUSB Rev1A" (at 184.658 145.8722) (layer F.SilkS))
  (gr_text "NASA GSFC Code 564 MSAG" (at 157.8356 145.9992) (layer F.SilkS))
  (gr_text GND (at 152.7048 126.5936) (layer F.SilkS))
  (gr_text SCL (at 153.416 134.112 270) (layer F.SilkS))
  (gr_text SDA (at 153.924 129.032 270) (layer F.SilkS))
  (gr_text GND (at 152.1206 143.002 90) (layer F.SilkS))
  (gr_text GND (at 170.434 92.583) (layer F.SilkS))
  (gr_line (start 138.557 147.32) (end 138.557 91.44) (layer Edge.Cuts) (width 0.15))
  (gr_line (start 192.278 147.32) (end 138.557 147.32) (layer Edge.Cuts) (width 0.15))
  (gr_line (start 192.278 91.44) (end 192.278 147.32) (layer Edge.Cuts) (width 0.15))
  (gr_line (start 138.557 91.44) (end 192.278 91.44) (layer Edge.Cuts) (width 0.15))
  (zone (net 1) (net_name GND) (layer In2.Cu) (hatch edge 0.508)
    (connect_pads thru_hole_only (clearance 0.4064))
    (min_thickness 0.254)
    (fill yes (arc_segments 32) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 138.557 147.32) (xy 192.278 147.32) (xy 192.278 91.44) (xy 138.557 91.44)
      )
    )
  )
  (zone (net 72) (net_name /FPGA_3.3V) (layer In1.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.4064))
    (min_thickness 0.254)
    (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 192.278 91.44) (xy 181.229 91.44) (xy 181.229 95.123) (xy 183.261 95.123) (xy 183.261 147.32)
        (xy 192.278 147.32)
      )
    )
  )
  (zone (net 73) (net_name +3.3V) (layer In1.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.4064))
    (min_thickness 0.254)
    (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 180.721 91.44) (xy 138.557 91.44) (xy 138.557 147.32) (xy 182.753 147.32) (xy 182.753 95.631)
        (xy 180.721 95.631)
      )
    )
  )
  (zone (net 72) (net_name /FPGA_3.3V) (layer F.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.4064))
    (min_thickness 0.254)
    (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 192.278 91.44) (xy 192.278 147.32) (xy 188.341 147.32) (xy 188.341 141.732) (xy 191.008 141.732)
        (xy 191.008 96.012) (xy 188.341 96.012) (xy 188.341 93.472) (xy 185.801 93.472) (xy 185.801 94.869)
        (xy 180.975 94.869) (xy 180.975 91.44)
      )
    )
  )
)
