(kicad_pcb (version 20171130) (host pcbnew "(5.1.0)-1")
  (general
    (thickness 1.6)
    (drawings 52)
    (tracks 333)
    (zones 0)
    (modules 23)
    (nets 47)
  )
  (page USLetter)
  (layers
    (0 F.Cu signal)
    (31 B.Cu signal)
    (32 B.Adhes user)
    (33 F.Adhes user)
    (34 B.Paste user)
    (35 F.Paste user)
    (36 B.SilkS user)
    (37 F.SilkS user)
    (38 B.Mask user)
    (39 F.Mask user)
    (40 Dwgs.User user)
    (41 Cmts.User user)
    (42 Eco1.User user)
    (43 Eco2.User user)
    (44 Edge.Cuts user)
    (45 Margin user)
    (46 B.CrtYd user)
    (47 F.CrtYd user)
    (48 B.Fab user)
    (49 F.Fab user)
  )
  (setup
    (last_trace_width 0.25)
    (user_trace_width 0.25)
    (trace_clearance 0.2)
    (zone_clearance 0.3048)
    (zone_45_only no)
    (trace_min 0.2)
    (via_size 0.8)
    (via_drill 0.4)
    (via_min_size 0.4)
    (via_min_drill 0.3)
    (uvia_size 0.3)
    (uvia_drill 0.1)
    (uvias_allowed no)
    (uvia_min_size 0.2)
    (uvia_min_drill 0.1)
    (edge_width 0.05)
    (segment_width 0.2)
    (pcb_text_width 0.3)
    (pcb_text_size 1.5 1.5)
    (mod_edge_width 0.12)
    (mod_text_size 1 1)
    (mod_text_width 0.15)
    (pad_size 1.524 1.524)
    (pad_drill 0.762)
    (pad_to_mask_clearance 0.051)
    (solder_mask_min_width 0.25)
    (aux_axis_origin 0 0)
    (visible_elements FFFFFF7F)
    (pcbplotparams
      (layerselection 0x010fc_ffffffff)
      (usegerberextensions false)
      (usegerberattributes false)
      (usegerberadvancedattributes false)
      (creategerberjobfile false)
      (excludeedgelayer true)
      (linewidth 0.100000)
      (plotframeref false)
      (viasonmask false)
      (mode 1)
      (useauxorigin false)
      (hpglpennumber 1)
      (hpglpenspeed 20)
      (hpglpendiameter 15.000000)
      (psnegative false)
      (psa4output false)
      (plotreference true)
      (plotvalue true)
      (plotinvisibletext false)
      (padsonsilk false)
      (subtractmaskfromsilk false)
      (outputformat 1)
      (mirror false)
      (drillshape 0)
      (scaleselection 1)
      (outputdirectory "gerber"))
  )
  (net 0 "")
  (net 1 GND)
  (net 2 VCC)
  (net 3 +3V3)
  (net 4 "Net-(D1-Pad2)")
  (net 5 /PIN22)
  (net 6 /PIN21)
  (net 7 /PIN20)
  (net 8 /PIN19)
  (net 9 /PIN18)
  (net 10 /PIN15)
  (net 11 /PIN14)
  (net 12 /PIN13)
  (net 13 /PIN12)
  (net 14 /PIN11)
  (net 15 /PIN10)
  (net 16 /PIN8)
  (net 17 /PIN7_TMS)
  (net 18 /PIN6)
  (net 19 /PIN5)
  (net 20 /PIN3)
  (net 21 /PIN2)
  (net 22 /PIN1_TDI)
  (net 23 /PIN23)
  (net 24 /PIN25)
  (net 25 /PIN26_TCK)
  (net 26 /PIN27)
  (net 27 /PIN28)
  (net 28 /PIN30)
  (net 29 /PIN31)
  (net 30 /PIN32_TDO)
  (net 31 /PIN33)
  (net 32 /PIN34)
  (net 33 /PIN35)
  (net 34 /PIN37)
  (net 35 /PIN38)
  (net 36 /PIN39)
  (net 37 /PIN40)
  (net 38 /PIN42)
  (net 39 /PIN43)
  (net 40 /PIN44)
  (net 41 "Net-(J3-Pad7)")
  (net 42 "Net-(J3-Pad8)")
  (net 43 "Net-(JP2-Pad1)")
  (net 44 "Net-(X1-Pad1)")
  (net 45 /NR)
  (net 46 "Net-(J3-Pad6)")
  (net_class Default "This is the default net class."
    (clearance 0.2)
    (trace_width 0.25)
    (via_dia 0.8)
    (via_drill 0.4)
    (uvia_dia 0.3)
    (uvia_drill 0.1)
    (add_net /PIN10)
    (add_net /PIN11)
    (add_net /PIN12)
    (add_net /PIN13)
    (add_net /PIN14)
    (add_net /PIN15)
    (add_net /PIN18)
    (add_net /PIN19)
    (add_net /PIN1_TDI)
    (add_net /PIN2)
    (add_net /PIN20)
    (add_net /PIN21)
    (add_net /PIN22)
    (add_net /PIN23)
    (add_net /PIN25)
    (add_net /PIN26_TCK)
    (add_net /PIN27)
    (add_net /PIN28)
    (add_net /PIN3)
    (add_net /PIN30)
    (add_net /PIN31)
    (add_net /PIN32_TDO)
    (add_net /PIN33)
    (add_net /PIN34)
    (add_net /PIN35)
    (add_net /PIN37)
    (add_net /PIN38)
    (add_net /PIN39)
    (add_net /PIN40)
    (add_net /PIN42)
    (add_net /PIN43)
    (add_net /PIN44)
    (add_net /PIN5)
    (add_net /PIN6)
    (add_net /PIN7_TMS)
    (add_net /PIN8)
    (add_net "Net-(D1-Pad2)")
    (add_net "Net-(J3-Pad6)")
    (add_net "Net-(J3-Pad7)")
    (add_net "Net-(J3-Pad8)")
    (add_net "Net-(JP2-Pad1)")
    (add_net "Net-(X1-Pad1)")
  )
  (net_class Power ""
    (clearance 0.2)
    (trace_width 0.5)
    (via_dia 0.8)
    (via_drill 0.4)
    (uvia_dia 0.3)
    (uvia_drill 0.1)
    (add_net +3V3)
    (add_net /NR)
    (add_net GND)
    (add_net VCC)
  )
  (module Oscillator:Oscillator_DIP-8 (layer F.Cu) (tedit 58CD3344)
    (at 133.35 88.9)
    (descr "Oscillator, DIP8,http://cdn-reichelt.de/documents/datenblatt/B400/OSZI.pdf")
    (tags oscillator)
    (fp_text reference X1 (at 3.81 -11.43) (layer F.SilkS))
    (fp_text value CXO_DIP8 (at 3.81 -13.6525) (layer F.Fab))
    (fp_text user %R (at 3.81 -3.81) (layer F.Fab))
    (pad 1 thru_hole rect (at 0 0) (size 1.6 1.6) (drill 0.8) (layers *.Cu *.Mask)
      (net 44 "Net-(X1-Pad1)"))
    (pad 8 thru_hole circle (at 0 -7.62) (size 1.6 1.6) (drill 0.8) (layers *.Cu *.Mask)
      (net 2 VCC))
    (pad 5 thru_hole circle (at 7.62 -7.62) (size 1.6 1.6) (drill 0.8) (layers *.Cu *.Mask)
      (net 43 "Net-(JP2-Pad1)"))
    (pad 4 thru_hole circle (at 7.62 0) (size 1.6 1.6) (drill 0.8) (layers *.Cu *.Mask)
      (net 1 GND))
    (model ${KISYS3DMOD}/Oscillator.3dshapes/Oscillator_DIP-8.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Connector_PinHeader_2.54mm:PinHeader_1x20_P2.54mm_Vertical (layer F.Cu) (tedit 59FED5CC)
    (at 128.27 77.47)
    (descr "Through hole straight pin header, 1x20, 2.54mm pitch, single row")
    (tags "Through hole pin header THT 1x20 2.54mm single row")
    (fp_text reference J1 (at 0 -3.81) (layer F.Fab))
    (fp_text value Pins_1 (at 0 -2.54) (layer F.Fab))
    (fp_text user %R (at 0 24.13 90) (layer F.Fab))
    (pad 20 thru_hole oval (at 0 48.26) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 19 thru_hole oval (at 0 45.72) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 5 /PIN22))
    (pad 18 thru_hole oval (at 0 43.18) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 6 /PIN21))
    (pad 17 thru_hole oval (at 0 40.64) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 7 /PIN20))
    (pad 16 thru_hole oval (at 0 38.1) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 8 /PIN19))
    (pad 15 thru_hole oval (at 0 35.56) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 9 /PIN18))
    (pad 14 thru_hole oval (at 0 33.02) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 10 /PIN15))
    (pad 13 thru_hole oval (at 0 30.48) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 11 /PIN14))
    (pad 12 thru_hole oval (at 0 27.94) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 12 /PIN13))
    (pad 11 thru_hole oval (at 0 25.4) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 13 /PIN12))
    (pad 10 thru_hole oval (at 0 22.86) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 14 /PIN11))
    (pad 9 thru_hole oval (at 0 20.32) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 15 /PIN10))
    (pad 8 thru_hole oval (at 0 17.78) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 16 /PIN8))
    (pad 7 thru_hole oval (at 0 15.24) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 17 /PIN7_TMS))
    (pad 6 thru_hole oval (at 0 12.7) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 18 /PIN6))
    (pad 5 thru_hole oval (at 0 10.16) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 19 /PIN5))
    (pad 4 thru_hole oval (at 0 7.62) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 20 /PIN3))
    (pad 3 thru_hole oval (at 0 5.08) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 21 /PIN2))
    (pad 2 thru_hole oval (at 0 2.54) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 22 /PIN1_TDI))
    (pad 1 thru_hole rect (at 0 0) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 2 VCC))
    (model ${KISYS3DMOD}/Connector_PinHeader_2.54mm.3dshapes/PinHeader_1x20_P2.54mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Connector_IDC:IDC-Header_2x05_P2.54mm_Vertical (layer F.Cu) (tedit 59DE0611)
    (at 135.89 116.84)
    (descr "Through hole straight IDC box header, 2x05, 2.54mm pitch, double rows")
    (tags "Through hole IDC box header THT 2x05 2.54mm double row")
    (fp_text reference J3 (at -2.54 -6.6675 180) (layer F.SilkS))
    (fp_text value JTAG (at 4.445 -6.6675) (layer F.SilkS))
    (fp_text user %R (at 1.27 5.08) (layer F.Fab))
    (pad 1 thru_hole rect (at 0 0) (size 1.7272 1.7272) (drill 1.016) (layers *.Cu *.Mask)
      (net 25 /PIN26_TCK))
    (pad 2 thru_hole oval (at 2.54 0) (size 1.7272 1.7272) (drill 1.016) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 3 thru_hole oval (at 0 2.54) (size 1.7272 1.7272) (drill 1.016) (layers *.Cu *.Mask)
      (net 30 /PIN32_TDO))
    (pad 4 thru_hole oval (at 2.54 2.54) (size 1.7272 1.7272) (drill 1.016) (layers *.Cu *.Mask)
      (net 3 +3V3))
    (pad 5 thru_hole oval (at 0 5.08) (size 1.7272 1.7272) (drill 1.016) (layers *.Cu *.Mask)
      (net 17 /PIN7_TMS))
    (pad 6 thru_hole oval (at 2.54 5.08) (size 1.7272 1.7272) (drill 1.016) (layers *.Cu *.Mask)
      (net 46 "Net-(J3-Pad6)"))
    (pad 7 thru_hole oval (at 0 7.62) (size 1.7272 1.7272) (drill 1.016) (layers *.Cu *.Mask)
      (net 41 "Net-(J3-Pad7)"))
    (pad 8 thru_hole oval (at 2.54 7.62) (size 1.7272 1.7272) (drill 1.016) (layers *.Cu *.Mask)
      (net 42 "Net-(J3-Pad8)"))
    (pad 9 thru_hole oval (at 0 10.16) (size 1.7272 1.7272) (drill 1.016) (layers *.Cu *.Mask)
      (net 22 /PIN1_TDI))
    (pad 10 thru_hole oval (at 2.54 10.16) (size 1.7272 1.7272) (drill 1.016) (layers *.Cu *.Mask)
      (net 1 GND))
    (model ${KISYS3DMOD}/Connector_IDC.3dshapes/IDC-Header_2x05_P2.54mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer B.Cu) (tedit 5B301BBE)
    (at 137.16 97.79 180)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C6 (at 0 1.43 180) (layer B.SilkS))
    (fp_text value 100nF (at 0 -1.5875 180) (layer B.SilkS))
    (fp_text user %R (at 0 0 180) (layer B.Fab))
    (pad 2 smd roundrect (at 0.875 0 180) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 1 GND))
    (pad 1 smd roundrect (at -0.875 0 180) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 3 +3V3))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer B.Cu) (tedit 5B301BBE)
    (at 140.97 101.6 90)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C5 (at 0 -1.5875 90) (layer B.SilkS))
    (fp_text value 100nF (at 0 1.5875 90) (layer B.SilkS))
    (fp_text user %R (at 0 0 90) (layer B.Fab))
    (pad 1 smd roundrect (at -0.875 0 90) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 3 +3V3))
    (pad 2 smd roundrect (at 0.875 0 90) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 1 GND))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Connector_PinHeader_2.54mm:PinHeader_1x20_P2.54mm_Vertical (layer F.Cu) (tedit 59FED5CC)
    (at 146.05 77.47)
    (descr "Through hole straight pin header, 1x20, 2.54mm pitch, single row")
    (tags "Through hole pin header THT 1x20 2.54mm single row")
    (fp_text reference J2 (at 0 -3.81) (layer F.Fab))
    (fp_text value Pins_2 (at 0 -2.54) (layer F.Fab))
    (fp_text user %R (at 0 24.13 90) (layer F.Fab))
    (pad 1 thru_hole rect (at 0 0) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 2 VCC))
    (pad 2 thru_hole oval (at 0 2.54) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 40 /PIN44))
    (pad 3 thru_hole oval (at 0 5.08) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 39 /PIN43))
    (pad 4 thru_hole oval (at 0 7.62) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 38 /PIN42))
    (pad 5 thru_hole oval (at 0 10.16) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 37 /PIN40))
    (pad 6 thru_hole oval (at 0 12.7) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 36 /PIN39))
    (pad 7 thru_hole oval (at 0 15.24) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 35 /PIN38))
    (pad 8 thru_hole oval (at 0 17.78) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 34 /PIN37))
    (pad 9 thru_hole oval (at 0 20.32) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 33 /PIN35))
    (pad 10 thru_hole oval (at 0 22.86) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 32 /PIN34))
    (pad 11 thru_hole oval (at 0 25.4) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 31 /PIN33))
    (pad 12 thru_hole oval (at 0 27.94) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 30 /PIN32_TDO))
    (pad 13 thru_hole oval (at 0 30.48) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 29 /PIN31))
    (pad 14 thru_hole oval (at 0 33.02) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 28 /PIN30))
    (pad 15 thru_hole oval (at 0 35.56) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 27 /PIN28))
    (pad 16 thru_hole oval (at 0 38.1) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 26 /PIN27))
    (pad 17 thru_hole oval (at 0 40.64) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 25 /PIN26_TCK))
    (pad 18 thru_hole oval (at 0 43.18) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 24 /PIN25))
    (pad 19 thru_hole oval (at 0 45.72) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 23 /PIN23))
    (pad 20 thru_hole oval (at 0 48.26) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 1 GND))
    (model ${KISYS3DMOD}/Connector_PinHeader_2.54mm.3dshapes/PinHeader_1x20_P2.54mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer B.Cu) (tedit 5B301BBE)
    (at 138.43 81.28 90)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C1 (at 3.81 1.27 180) (layer B.SilkS))
    (fp_text value 10nF (at 2.2225 1.27 180) (layer B.SilkS))
    (fp_text user %R (at 0 0 90) (layer B.Fab))
    (pad 2 smd roundrect (at 0.875 0 90) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 1 GND))
    (pad 1 smd roundrect (at -0.875 0 90) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 45 /NR))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer B.Cu) (tedit 5B301BBE)
    (at 132.08 83.82 180)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C2 (at 2.2225 2.54 270) (layer B.SilkS))
    (fp_text value 100nF (at 0.9525 3.4925 270) (layer B.SilkS))
    (fp_text user %R (at 0 0 180) (layer B.Fab))
    (pad 1 smd roundrect (at -0.875 0 180) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 2 VCC))
    (pad 2 smd roundrect (at 0.875 0 180) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 1 GND))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer B.Cu) (tedit 5B301BBE)
    (at 133.35 101.6 270)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C3 (at 0 1.43 90) (layer B.SilkS))
    (fp_text value 100nF (at 0.635 -1.43 270) (layer B.SilkS))
    (fp_text user %R (at 0 0 270) (layer B.Fab))
    (pad 1 smd roundrect (at -0.875 0 270) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 3 +3V3))
    (pad 2 smd roundrect (at 0.875 0 270) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 1 GND))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer B.Cu) (tedit 5B301BBE)
    (at 137.16 105.41)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C4 (at 0 -1.5875) (layer B.SilkS))
    (fp_text value 100nF (at 0 1.5875) (layer B.SilkS))
    (fp_text user %R (at 0 0) (layer B.Fab))
    (pad 2 smd roundrect (at 0.875 0) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 1 GND))
    (pad 1 smd roundrect (at -0.875 0) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 3 +3V3))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer B.Cu) (tedit 5B301BBE)
    (at 135.89 81.28 90)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C7 (at 3.4925 -0.9525 180) (layer B.SilkS))
    (fp_text value 100nF (at 2.2225 -0.9525 180) (layer B.SilkS))
    (fp_text user %R (at 0 0 90) (layer B.Fab))
    (pad 1 smd roundrect (at -0.875 0 90) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 2 VCC))
    (pad 2 smd roundrect (at 0.875 0 90) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 1 GND))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_Tantalum_SMD:CP_EIA-3216-10_Kemet-I_Pad1.58x1.35mm_HandSolder (layer B.Cu) (tedit 5B301BBE)
    (at 131.9125 86.36 180)
    (descr "Tantalum Capacitor SMD Kemet-I (3216-10 Metric), IPC_7351 nominal, (Body size from: http://www.kemet.com/Lists/ProductCatalog/Attachments/253/KEM_TC101_STD.pdf), generated with kicad-footprint-generator")
    (tags "capacitor tantalum")
    (attr smd)
    (fp_text reference C8 (at 1.1025 -1.905 180) (layer B.SilkS))
    (fp_text value 10uF (at 1.1025 -3.175) (layer B.SilkS))
    (fp_text user %R (at -0.1675 0 180) (layer B.Fab))
    (pad 1 smd roundrect (at -1.4375 0 180) (size 1.575 1.35) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.185185)
      (net 2 VCC))
    (pad 2 smd roundrect (at 1.4375 0 180) (size 1.575 1.35) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.185185)
      (net 1 GND))
    (model ${KISYS3DMOD}/Capacitor_Tantalum_SMD.3dshapes/CP_EIA-3216-10_Kemet-I.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_Tantalum_SMD:CP_EIA-3216-10_Kemet-I_Pad1.58x1.35mm_HandSolder (layer B.Cu) (tedit 5B301BBE)
    (at 140.97 85.09 90)
    (descr "Tantalum Capacitor SMD Kemet-I (3216-10 Metric), IPC_7351 nominal, (Body size from: http://www.kemet.com/Lists/ProductCatalog/Attachments/253/KEM_TC101_STD.pdf), generated with kicad-footprint-generator")
    (tags "capacitor tantalum")
    (attr smd)
    (fp_text reference C9 (at 1.905 1.905 90) (layer B.SilkS))
    (fp_text value 10uF (at -1.27 1.905 270) (layer B.SilkS))
    (fp_text user %R (at 0 0 90) (layer B.Fab))
    (pad 2 smd roundrect (at 1.4375 0 90) (size 1.575 1.35) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.185185)
      (net 1 GND))
    (pad 1 smd roundrect (at -1.4375 0 90) (size 1.575 1.35) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.185185)
      (net 3 +3V3))
    (model ${KISYS3DMOD}/Capacitor_Tantalum_SMD.3dshapes/CP_EIA-3216-10_Kemet-I.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module LED_SMD:LED_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B4B45C9)
    (at 134.62 77.47)
    (descr "LED SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "LED handsolder")
    (attr smd)
    (fp_text reference D1 (at -2.8575 0) (layer F.SilkS))
    (fp_text value Power (at 0 1.905) (layer F.SilkS))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 1 smd roundrect (at -0.875 0) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 1 GND))
    (pad 2 smd roundrect (at 0.875 0) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 4 "Net-(D1-Pad2)"))
    (model ${KISYS3DMOD}/LED_SMD.3dshapes/LED_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Jumper:SolderJumper-2_P1.3mm_Open_RoundedPad1.0x1.5mm (layer B.Cu) (tedit 5B391E66)
    (at 137.16 88.9)
    (descr "SMD Solder Jumper, 1x1.5mm, rounded Pads, 0.3mm gap, open")
    (tags "solder jumper open")
    (attr virtual)
    (fp_text reference JP1 (at 4.7625 2.2225) (layer B.SilkS))
    (fp_text value LDO_BYPASS (at -1.905 2.2225) (layer B.SilkS))
    (pad 2 smd custom (at 0.65 0) (size 1 0.5) (layers B.Cu B.Mask)
      (net 3 +3V3) (zone_connect 2)
      (options (clearance outline) (anchor rect))
      (primitives
        (gr_circle (center 0 -0.25) (end 0.5 -0.25) (width 0))
        (gr_circle (center 0 0.25) (end 0.5 0.25) (width 0))
        (gr_poly (pts
           (xy 0 0.75) (xy -0.5 0.75) (xy -0.5 -0.75) (xy 0 -0.75)) (width 0))
      ))
    (pad 1 smd custom (at -0.65 0) (size 1 0.5) (layers B.Cu B.Mask)
      (net 2 VCC) (zone_connect 2)
      (options (clearance outline) (anchor rect))
      (primitives
        (gr_circle (center 0 -0.25) (end 0.5 -0.25) (width 0))
        (gr_circle (center 0 0.25) (end 0.5 0.25) (width 0))
        (gr_poly (pts
           (xy 0 0.75) (xy 0.5 0.75) (xy 0.5 -0.75) (xy 0 -0.75)) (width 0))
      ))
  )
  (module Jumper:SolderJumper-2_P1.3mm_Open_RoundedPad1.0x1.5mm (layer B.Cu) (tedit 5B391E66)
    (at 142.89 95.25)
    (descr "SMD Solder Jumper, 1x1.5mm, rounded Pads, 0.3mm gap, open")
    (tags "solder jumper open")
    (attr virtual)
    (fp_text reference JP2 (at -0.015 -2.2225) (layer B.SilkS))
    (fp_text value CLK (at -0.015 2.2225) (layer B.SilkS))
    (pad 1 smd custom (at -0.65 0) (size 1 0.5) (layers B.Cu B.Mask)
      (net 43 "Net-(JP2-Pad1)") (zone_connect 2)
      (options (clearance outline) (anchor rect))
      (primitives
        (gr_circle (center 0 -0.25) (end 0.5 -0.25) (width 0))
        (gr_circle (center 0 0.25) (end 0.5 0.25) (width 0))
        (gr_poly (pts
           (xy 0 0.75) (xy 0.5 0.75) (xy 0.5 -0.75) (xy 0 -0.75)) (width 0))
      ))
    (pad 2 smd custom (at 0.65 0) (size 1 0.5) (layers B.Cu B.Mask)
      (net 34 /PIN37) (zone_connect 2)
      (options (clearance outline) (anchor rect))
      (primitives
        (gr_circle (center 0 -0.25) (end 0.5 -0.25) (width 0))
        (gr_circle (center 0 0.25) (end 0.5 0.25) (width 0))
        (gr_poly (pts
           (xy 0 0.75) (xy -0.5 0.75) (xy -0.5 -0.75) (xy 0 -0.75)) (width 0))
      ))
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBD)
    (at 139.7 77.47)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R1 (at 2.54 0 180) (layer F.SilkS))
    (fp_text value 1k (at 0 1.905 180) (layer F.SilkS))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd roundrect (at 0.875 0) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 3 +3V3))
    (pad 1 smd roundrect (at -0.875 0) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 4 "Net-(D1-Pad2)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer B.Cu) (tedit 5B301BBD)
    (at 142.24 116.84)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R2 (at 1.5875 1.5875) (layer B.SilkS))
    (fp_text value 10k (at -1.27 1.5875) (layer B.SilkS))
    (fp_text user %R (at 0 0) (layer B.Fab))
    (pad 1 smd roundrect (at -0.875 0) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 1 GND))
    (pad 2 smd roundrect (at 0.875 0) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 25 /PIN26_TCK))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer B.Cu) (tedit 5B301BBD)
    (at 142.24 114.3)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R3 (at 1.5875 -1.5875) (layer B.SilkS))
    (fp_text value 10k (at -1.5875 -1.5875) (layer B.SilkS))
    (fp_text user %R (at 0 0) (layer B.Fab))
    (pad 1 smd roundrect (at -0.875 0) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 3 +3V3))
    (pad 2 smd roundrect (at 0.875 0) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 30 /PIN32_TDO))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer B.Cu) (tedit 5B301BBD)
    (at 132.08 114.3 180)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R4 (at -1.5875 1.5875 180) (layer B.SilkS))
    (fp_text value 10k (at 1.27 1.5875 180) (layer B.SilkS))
    (fp_text user %R (at 0 0 180) (layer B.Fab))
    (pad 2 smd roundrect (at 0.875 0 180) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 17 /PIN7_TMS))
    (pad 1 smd roundrect (at -0.875 0 180) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 3 +3V3))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer B.Cu) (tedit 5B301BBD)
    (at 132.08 116.84 180)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R5 (at -1.5875 -1.5875) (layer B.SilkS))
    (fp_text value 10k (at 1.27 -1.5875) (layer B.SilkS))
    (fp_text user %R (at 0 0 180) (layer B.Fab))
    (pad 1 smd roundrect (at -0.875 0 180) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 3 +3V3))
    (pad 2 smd roundrect (at 0.875 0 180) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 22 /PIN1_TDI))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Package_QFP:TQFP-44_10x10mm_P0.8mm (layer F.Cu) (tedit 5A02F146)
    (at 137.16 101.6 315)
    (descr "44-Lead Plastic Thin Quad Flatpack (PT) - 10x10x1.0 mm Body [TQFP] (see Microchip Packaging Specification 00000049BS.pdf)")
    (tags "QFP 0.8")
    (attr smd)
    (fp_text reference U1 (at -10.551801 -1.571545) (layer F.SilkS))
    (fp_text value EPM7064AETC44 (at -5.163647 -6.959698) (layer F.SilkS))
    (fp_text user %R (at 0 0 315) (layer F.Fab))
    (pad 1 smd rect (at -5.7 -4 315) (size 1.5 0.55) (layers F.Cu F.Paste F.Mask)
      (net 22 /PIN1_TDI))
    (pad 2 smd rect (at -5.7 -3.2 315) (size 1.5 0.55) (layers F.Cu F.Paste F.Mask)
      (net 21 /PIN2))
    (pad 3 smd rect (at -5.7 -2.4 315) (size 1.5 0.55) (layers F.Cu F.Paste F.Mask)
      (net 20 /PIN3))
    (pad 4 smd rect (at -5.7 -1.6 315) (size 1.5 0.55) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 5 smd rect (at -5.7 -0.8 315) (size 1.5 0.55) (layers F.Cu F.Paste F.Mask)
      (net 19 /PIN5))
    (pad 6 smd rect (at -5.7 0 315) (size 1.5 0.55) (layers F.Cu F.Paste F.Mask)
      (net 18 /PIN6))
    (pad 7 smd rect (at -5.7 0.8 315) (size 1.5 0.55) (layers F.Cu F.Paste F.Mask)
      (net 17 /PIN7_TMS))
    (pad 8 smd rect (at -5.7 1.6 315) (size 1.5 0.55) (layers F.Cu F.Paste F.Mask)
      (net 16 /PIN8))
    (pad 9 smd rect (at -5.7 2.4 315) (size 1.5 0.55) (layers F.Cu F.Paste F.Mask)
      (net 3 +3V3))
    (pad 10 smd rect (at -5.7 3.2 315) (size 1.5 0.55) (layers F.Cu F.Paste F.Mask)
      (net 15 /PIN10))
    (pad 11 smd rect (at -5.7 4 315) (size 1.5 0.55) (layers F.Cu F.Paste F.Mask)
      (net 14 /PIN11))
    (pad 12 smd rect (at -4 5.7 45) (size 1.5 0.55) (layers F.Cu F.Paste F.Mask)
      (net 13 /PIN12))
    (pad 13 smd rect (at -3.2 5.7 45) (size 1.5 0.55) (layers F.Cu F.Paste F.Mask)
      (net 12 /PIN13))
    (pad 14 smd rect (at -2.4 5.7 45) (size 1.5 0.55) (layers F.Cu F.Paste F.Mask)
      (net 11 /PIN14))
    (pad 15 smd rect (at -1.6 5.7 45) (size 1.5 0.55) (layers F.Cu F.Paste F.Mask)
      (net 10 /PIN15))
    (pad 16 smd rect (at -0.8 5.7 45) (size 1.5 0.55) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 17 smd rect (at 0 5.7 45) (size 1.5 0.55) (layers F.Cu F.Paste F.Mask)
      (net 3 +3V3))
    (pad 18 smd rect (at 0.8 5.7 45) (size 1.5 0.55) (layers F.Cu F.Paste F.Mask)
      (net 9 /PIN18))
    (pad 19 smd rect (at 1.6 5.7 45) (size 1.5 0.55) (layers F.Cu F.Paste F.Mask)
      (net 8 /PIN19))
    (pad 20 smd rect (at 2.4 5.7 45) (size 1.5 0.55) (layers F.Cu F.Paste F.Mask)
      (net 7 /PIN20))
    (pad 21 smd rect (at 3.2 5.7 45) (size 1.5 0.55) (layers F.Cu F.Paste F.Mask)
      (net 6 /PIN21))
    (pad 22 smd rect (at 4 5.7 45) (size 1.5 0.55) (layers F.Cu F.Paste F.Mask)
      (net 5 /PIN22))
    (pad 23 smd rect (at 5.7 4 315) (size 1.5 0.55) (layers F.Cu F.Paste F.Mask)
      (net 23 /PIN23))
    (pad 24 smd rect (at 5.7 3.2 315) (size 1.5 0.55) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 25 smd rect (at 5.7 2.4 315) (size 1.5 0.55) (layers F.Cu F.Paste F.Mask)
      (net 24 /PIN25))
    (pad 26 smd rect (at 5.7 1.6 315) (size 1.5 0.55) (layers F.Cu F.Paste F.Mask)
      (net 25 /PIN26_TCK))
    (pad 27 smd rect (at 5.7 0.8 315) (size 1.5 0.55) (layers F.Cu F.Paste F.Mask)
      (net 26 /PIN27))
    (pad 28 smd rect (at 5.7 0 315) (size 1.5 0.55) (layers F.Cu F.Paste F.Mask)
      (net 27 /PIN28))
    (pad 29 smd rect (at 5.7 -0.8 315) (size 1.5 0.55) (layers F.Cu F.Paste F.Mask)
      (net 3 +3V3))
    (pad 30 smd rect (at 5.7 -1.6 315) (size 1.5 0.55) (layers F.Cu F.Paste F.Mask)
      (net 28 /PIN30))
    (pad 31 smd rect (at 5.7 -2.4 315) (size 1.5 0.55) (layers F.Cu F.Paste F.Mask)
      (net 29 /PIN31))
    (pad 32 smd rect (at 5.7 -3.2 315) (size 1.5 0.55) (layers F.Cu F.Paste F.Mask)
      (net 30 /PIN32_TDO))
    (pad 33 smd rect (at 5.7 -4 315) (size 1.5 0.55) (layers F.Cu F.Paste F.Mask)
      (net 31 /PIN33))
    (pad 34 smd rect (at 4 -5.7 45) (size 1.5 0.55) (layers F.Cu F.Paste F.Mask)
      (net 32 /PIN34))
    (pad 35 smd rect (at 3.2 -5.7 45) (size 1.5 0.55) (layers F.Cu F.Paste F.Mask)
      (net 33 /PIN35))
    (pad 36 smd rect (at 2.4 -5.7 45) (size 1.5 0.55) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 37 smd rect (at 1.6 -5.7 45) (size 1.5 0.55) (layers F.Cu F.Paste F.Mask)
      (net 34 /PIN37))
    (pad 38 smd rect (at 0.8 -5.7 45) (size 1.5 0.55) (layers F.Cu F.Paste F.Mask)
      (net 35 /PIN38))
    (pad 39 smd rect (at 0 -5.7 45) (size 1.5 0.55) (layers F.Cu F.Paste F.Mask)
      (net 36 /PIN39))
    (pad 40 smd rect (at -0.8 -5.7 45) (size 1.5 0.55) (layers F.Cu F.Paste F.Mask)
      (net 37 /PIN40))
    (pad 41 smd rect (at -1.6 -5.7 45) (size 1.5 0.55) (layers F.Cu F.Paste F.Mask)
      (net 3 +3V3))
    (pad 42 smd rect (at -2.4 -5.7 45) (size 1.5 0.55) (layers F.Cu F.Paste F.Mask)
      (net 38 /PIN42))
    (pad 43 smd rect (at -3.2 -5.7 45) (size 1.5 0.55) (layers F.Cu F.Paste F.Mask)
      (net 39 /PIN43))
    (pad 44 smd rect (at -4 -5.7 45) (size 1.5 0.55) (layers F.Cu F.Paste F.Mask)
      (net 40 /PIN44))
    (model ${KISYS3DMOD}/Package_QFP.3dshapes/TQFP-44_10x10mm_P0.8mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Package_TO_SOT_SMD:SOT-23-5_HandSoldering (layer B.Cu) (tedit 5A0AB76C)
    (at 137.16 85.09)
    (descr "5-pin SOT23 package")
    (tags "SOT-23-5 hand-soldering")
    (attr smd)
    (fp_text reference U2 (at 7.3025 -6.6675 270) (layer B.SilkS))
    (fp_text value TPS79333-EP (at 7.3025 0.3175 90) (layer B.SilkS))
    (fp_text user %R (at 0 0 -90) (layer B.Fab))
    (pad 1 smd rect (at -1.35 0.95) (size 1.56 0.65) (layers B.Cu B.Paste B.Mask)
      (net 2 VCC))
    (pad 2 smd rect (at -1.35 0) (size 1.56 0.65) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (pad 3 smd rect (at -1.35 -0.95) (size 1.56 0.65) (layers B.Cu B.Paste B.Mask)
      (net 2 VCC))
    (pad 4 smd rect (at 1.35 -0.95) (size 1.56 0.65) (layers B.Cu B.Paste B.Mask)
      (net 45 /NR))
    (pad 5 smd rect (at 1.35 0.95) (size 1.56 0.65) (layers B.Cu B.Paste B.Mask)
      (net 3 +3V3))
    (model ${KISYS3DMOD}/Package_TO_SOT_SMD.3dshapes/SOT-23-5.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (gr_text PIN44 (at 146.05 81.28) (layer F.SilkS))
  (gr_text PIN43 (at 146.05 83.82) (layer F.SilkS))
  (gr_text PIN42 (at 146.05 86.36) (layer F.SilkS))
  (gr_text PIN40 (at 146.05 88.9) (layer F.SilkS))
  (gr_text PIN39 (at 146.05 91.44) (layer F.SilkS))
  (gr_text PIN38 (at 146.05 93.98) (layer F.SilkS))
  (gr_text PIN37 (at 146.05 96.52) (layer F.SilkS))
  (gr_text PIN35 (at 146.05 99.06) (layer F.SilkS))
  (gr_text PIN34 (at 146.05 101.6) (layer F.SilkS))
  (gr_text PIN33 (at 146.05 104.14) (layer F.SilkS))
  (gr_text PIN32 (at 146.05 106.68) (layer F.SilkS))
  (gr_text PIN31 (at 146.05 109.22) (layer F.SilkS))
  (gr_text PIN30 (at 146.05 111.76) (layer F.SilkS))
  (gr_text PIN28 (at 146.05 114.3) (layer F.SilkS))
  (gr_text PIN27 (at 146.05 116.84) (layer F.SilkS))
  (gr_text PIN26 (at 146.05 119.38) (layer F.SilkS))
  (gr_text PIN25 (at 146.05 121.92) (layer F.SilkS))
  (gr_text PIN23 (at 146.05 124.46) (layer F.SilkS))
  (gr_text PIN22 (at 128.27 124.46) (layer F.SilkS))
  (gr_text PIN21 (at 128.27 121.92) (layer F.SilkS))
  (gr_text PIN20 (at 128.27 119.38) (layer F.SilkS))
  (gr_text PIN19 (at 128.27 116.84) (layer F.SilkS))
  (gr_text PIN18 (at 128.27 114.3) (layer F.SilkS))
  (gr_text PIN15 (at 128.27 111.76) (layer F.SilkS))
  (gr_text PIN14 (at 128.27 109.22) (layer F.SilkS))
  (gr_text PIN13 (at 128.27 106.68) (layer F.SilkS))
  (gr_text PIN12 (at 128.27 104.14) (layer F.SilkS))
  (gr_text PIN11 (at 128.27 101.6) (layer F.SilkS))
  (gr_text PIN10 (at 128.27 99.06) (layer F.SilkS))
  (gr_text PIN8 (at 128.27 96.52) (layer F.SilkS))
  (gr_text PIN7 (at 128.27 93.98) (layer F.SilkS))
  (gr_text PIN6 (at 128.27 91.44) (layer F.SilkS))
  (gr_text PIN5 (at 128.27 88.9) (layer F.SilkS))
  (gr_text PIN3 (at 128.27 86.36) (layer F.SilkS))
  (gr_text PIN2 (at 128.27 83.82) (layer F.SilkS))
  (gr_text PIN1 (at 128.27 81.28) (layer F.SilkS))
  (gr_text GND (at 146.05 127.635) (layer F.SilkS))
  (gr_text GND (at 128.27 127.635) (layer F.SilkS))
  (gr_text VCC (at 144.145 77.47 90) (layer F.SilkS))
  (gr_text VCC (at 129.8575 77.47 90) (layer F.SilkS))
  (gr_line (start 147.32 76.2) (end 147.32 128.27) (layer Edge.Cuts) (width 0.05))
  (gr_line (start 127 128.27) (end 127 76.2) (layer Edge.Cuts) (width 0.05))
  (gr_line (start 147.32 76.2) (end 127 76.2) (layer Edge.Cuts) (width 0.05))
  (gr_line (start 127 128.27) (end 147.32 128.27) (layer Edge.Cuts) (width 0.05))
  (zone (net 1) (net_name GND) (layer F.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.381))
    (min_thickness 0.254)
    (fill yes (arc_segments 32) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 127 76.2) (xy 147.32 76.2) (xy 147.32 128.27) (xy 127 128.27)
      )
    )
  )
  (zone (net 3) (net_name +3V3) (layer B.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.3048))
    (min_thickness 0.254)
    (fill yes (arc_segments 32) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 131.445 114.935) (xy 142.24 114.935) (xy 142.24 107.95) (xy 144.145 106.045) (xy 144.145 97.155)
        (xy 142.24 95.25) (xy 142.24 85.725) (xy 137.795 85.725) (xy 137.795 90.805) (xy 131.445 90.805)
      )
    )
  )
  (zone (net 2) (net_name VCC) (layer B.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.3048))
    (min_thickness 0.254)
    (fill yes (arc_segments 32) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 127 76.2) (xy 147.32 76.2) (xy 147.32 79.375) (xy 136.525 79.375) (xy 136.525 90.17)
        (xy 130.175 90.17) (xy 130.175 79.375) (xy 127 79.375)
      )
    )
  )
)
