(kicad_pcb (version 4) (host pcbnew 4.0.4+e1-6308~48~ubuntu16.04.1-stable)
  (general
    (links 22)
    (no_connects 0)
    (area 141.399999 96.399999 164.350001 111.100001)
    (thickness 1.6)
    (drawings 12)
    (tracks 100)
    (zones 0)
    (modules 9)
    (nets 12)
  )
  (page A4)
  (layers
    (0 F.Cu signal)
    (31 B.Cu signal)
    (32 B.Adhes user)
    (33 F.Adhes user)
    (34 B.Paste user)
    (35 F.Paste user)
    (36 B.SilkS user)
    (37 F.SilkS user)
    (38 B.Mask user)
    (39 F.Mask user)
    (40 Dwgs.User user)
    (41 Cmts.User user)
    (42 Eco1.User user)
    (43 Eco2.User user)
    (44 Edge.Cuts user)
    (45 Margin user)
    (46 B.CrtYd user)
    (47 F.CrtYd user)
    (48 B.Fab user)
    (49 F.Fab user)
  )
  (setup
    (last_trace_width 0.25)
    (trace_clearance 0.2)
    (zone_clearance 0.508)
    (zone_45_only no)
    (trace_min 0.1524)
    (segment_width 0.2)
    (edge_width 0.2)
    (via_size 0.6858)
    (via_drill 0.3302)
    (via_min_size 0.6858)
    (via_min_drill 0.3)
    (uvia_size 0.3)
    (uvia_drill 0.1)
    (uvias_allowed no)
    (uvia_min_size 0)
    (uvia_min_drill 0)
    (pcb_text_width 0.3)
    (pcb_text_size 1.5 1.5)
    (mod_edge_width 0.15)
    (mod_text_size 1 1)
    (mod_text_width 0.15)
    (pad_size 1.524 1.524)
    (pad_drill 0.762)
    (pad_to_mask_clearance 0.2)
    (aux_axis_origin 0 0)
    (visible_elements FFFEEF7F)
    (pcbplotparams
      (layerselection 0x00030_80000001)
      (usegerberextensions false)
      (excludeedgelayer true)
      (linewidth 0.100000)
      (plotframeref false)
      (viasonmask false)
      (mode 1)
      (useauxorigin false)
      (hpglpennumber 1)
      (hpglpenspeed 20)
      (hpglpendiameter 15)
      (hpglpenoverlay 2)
      (psnegative false)
      (psa4output false)
      (plotreference true)
      (plotvalue true)
      (plotinvisibletext false)
      (padsonsilk false)
      (subtractmaskfromsilk false)
      (outputformat 1)
      (mirror false)
      (drillshape 1)
      (scaleselection 1)
      (outputdirectory ""))
  )
  (net 0 "")
  (net 1 GND)
  (net 2 +12V)
  (net 3 "Net-(R2-Pad2)")
  (net 4 "Net-(U1-Pad1)")
  (net 5 "Net-(U1-Pad2)")
  (net 6 "Net-(U1-Pad5)")
  (net 7 "Net-(P4-Pad2)")
  (net 8 "Net-(P4-Pad3)")
  (net 9 "Net-(D1-Pad1)")
  (net 10 "Net-(D2-Pad2)")
  (net 11 +3V3)
  (net_class Default "This is the default net class."
    (clearance 0.2)
    (trace_width 0.25)
    (via_dia 0.6858)
    (via_drill 0.3302)
    (uvia_dia 0.3)
    (uvia_drill 0.1)
    (add_net +12V)
    (add_net +3V3)
    (add_net GND)
    (add_net "Net-(D1-Pad1)")
    (add_net "Net-(D2-Pad2)")
    (add_net "Net-(P4-Pad2)")
    (add_net "Net-(P4-Pad3)")
    (add_net "Net-(R2-Pad2)")
    (add_net "Net-(U1-Pad1)")
    (add_net "Net-(U1-Pad2)")
    (add_net "Net-(U1-Pad5)")
  )
  (module Wire_Pads:SolderWirePad_single_1-2mmDrill (layer F.Cu) (tedit 58086663)
    (at 144 99)
    (fp_text reference P3 (at -1.5 2) (layer F.SilkS) hide)
    (fp_text value CONN_01X01 (at -1.905 3.175) (layer F.Fab))
    (pad 1 thru_hole circle (at 0 0) (size 3.50012 3.50012) (drill 1.19888) (layers *.Cu *.Mask F.SilkS)
      (net 10 "Net-(D2-Pad2)"))
  )
  (module footprints:BL652-SA (layer F.Cu) (tedit 580709F4)
    (at 157.5 102.5 270)
    (fp_text reference U2 (at 0 -3 270) (layer F.SilkS))
    (fp_text value BL652 (at -0.65 -3.3 270) (layer F.Fab))
    (pad 1 smd rect (at 4.9 -4.5 270) (size 1.2 0.5) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 2 smd rect (at 4.9 -3.75 270) (size 1.2 0.5) (layers F.Cu F.Paste F.Mask))
    (pad 3 smd rect (at 4.9 -3 270) (size 1.2 0.5) (layers F.Cu F.Paste F.Mask))
    (pad 4 smd rect (at 4.9 -2.25 270) (size 1.2 0.5) (layers F.Cu F.Paste F.Mask))
    (pad 5 smd rect (at 4.9 -1.5 270) (size 1.2 0.5) (layers F.Cu F.Paste F.Mask)
      (net 7 "Net-(P4-Pad2)"))
    (pad 6 smd rect (at 4.9 -0.75 270) (size 1.2 0.5) (layers F.Cu F.Paste F.Mask)
      (net 8 "Net-(P4-Pad3)"))
    (pad 7 smd rect (at 4.9 0 270) (size 1.2 0.5) (layers F.Cu F.Paste F.Mask))
    (pad 8 smd rect (at 4.9 0.75 270) (size 1.2 0.5) (layers F.Cu F.Paste F.Mask))
    (pad 9 smd rect (at 4.9 1.5 270) (size 1.2 0.5) (layers F.Cu F.Paste F.Mask))
    (pad 10 smd rect (at 4.9 2.25 270) (size 1.2 0.5) (layers F.Cu F.Paste F.Mask))
    (pad 11 smd rect (at 4.9 3 270) (size 1.2 0.5) (layers F.Cu F.Paste F.Mask))
    (pad 12 smd rect (at 4.9 3.75 270) (size 1.2 0.5) (layers F.Cu F.Paste F.Mask))
    (pad 13 smd rect (at 4.9 4.5 270) (size 1.2 0.5) (layers F.Cu F.Paste F.Mask))
    (pad 14 smd rect (at 4.9 5.25 270) (size 1.2 0.5) (layers F.Cu F.Paste F.Mask))
    (pad 15 smd rect (at 4.9 6 270) (size 1.2 0.5) (layers F.Cu F.Paste F.Mask))
    (pad 16 smd rect (at 4.9 6.75 270) (size 1.2 0.5) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 17 smd rect (at 3.75 7.2 180) (size 1.2 0.5) (layers F.Cu F.Paste F.Mask))
    (pad 18 smd rect (at 3 7.2 180) (size 1.2 0.5) (layers F.Cu F.Paste F.Mask))
    (pad 19 smd rect (at 2.25 7.2 180) (size 1.2 0.5) (layers F.Cu F.Paste F.Mask))
    (pad 20 smd rect (at 1.5 7.2 180) (size 1.2 0.5) (layers F.Cu F.Paste F.Mask)
      (net 3 "Net-(R2-Pad2)"))
    (pad 21 smd rect (at 0.75 7.2 180) (size 1.2 0.5) (layers F.Cu F.Paste F.Mask))
    (pad 22 smd rect (at 0 7.2 180) (size 1.2 0.5) (layers F.Cu F.Paste F.Mask))
    (pad 23 smd rect (at -0.75 7.2 180) (size 1.2 0.5) (layers F.Cu F.Paste F.Mask)
      (net 4 "Net-(U1-Pad1)"))
    (pad 24 smd rect (at -1.5 7.2 180) (size 1.2 0.5) (layers F.Cu F.Paste F.Mask))
    (pad 25 smd rect (at -2.25 7.2 180) (size 1.2 0.5) (layers F.Cu F.Paste F.Mask))
    (pad 26 smd rect (at -3 7.2 180) (size 1.2 0.5) (layers F.Cu F.Paste F.Mask)
      (net 11 +3V3))
    (pad 27 smd rect (at -3.75 7.2 180) (size 1.2 0.5) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 28 smd rect (at -4.9 6.75 270) (size 1.2 0.5) (layers F.Cu F.Paste F.Mask))
    (pad 29 smd rect (at -4.9 6 270) (size 1.2 0.5) (layers F.Cu F.Paste F.Mask))
    (pad 30 smd rect (at -4.9 5.25 270) (size 1.2 0.5) (layers F.Cu F.Paste F.Mask)
      (net 5 "Net-(U1-Pad2)"))
    (pad 31 smd rect (at -4.9 4.5 270) (size 1.2 0.5) (layers F.Cu F.Paste F.Mask))
    (pad 32 smd rect (at -4.9 3.75 270) (size 1.2 0.5) (layers F.Cu F.Paste F.Mask))
    (pad 33 smd rect (at -4.9 3 270) (size 1.2 0.5) (layers F.Cu F.Paste F.Mask))
    (pad 34 smd rect (at -4.9 2.25 270) (size 1.2 0.5) (layers F.Cu F.Paste F.Mask))
    (pad 35 smd rect (at -4.9 1.5 270) (size 1.2 0.5) (layers F.Cu F.Paste F.Mask)
      (net 6 "Net-(U1-Pad5)"))
    (pad 36 smd rect (at -4.9 0.75 270) (size 1.2 0.5) (layers F.Cu F.Paste F.Mask))
    (pad 37 smd rect (at -4.9 0 270) (size 1.2 0.5) (layers F.Cu F.Paste F.Mask))
    (pad 38 smd rect (at -4.9 -0.75 270) (size 1.2 0.5) (layers F.Cu F.Paste F.Mask))
    (pad 39 smd rect (at -4.9 -1.5 270) (size 1.2 0.5) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
  )
  (module Resistors_SMD:R_0603_HandSoldering (layer B.Cu) (tedit 5418A00F)
    (at 147.25 99 270)
    (descr "Resistor SMD 0603, hand soldering")
    (tags "resistor 0603")
    (attr smd)
    (fp_text reference R2 (at 0 -1.75 270) (layer B.SilkS))
    (fp_text value 10k (at 0 -1.9 270) (layer B.Fab))
    (pad 1 smd rect (at -1.1 0 270) (size 1.2 0.9) (layers B.Cu B.Paste B.Mask)
      (net 11 +3V3))
    (pad 2 smd rect (at 1.1 0 270) (size 1.2 0.9) (layers B.Cu B.Paste B.Mask)
      (net 3 "Net-(R2-Pad2)"))
    (model Resistors_SMD.3dshapes/R_0603_HandSoldering.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Housings_SOIC:SOIC-14_3.9x8.7mm_Pitch1.27mm (layer B.Cu) (tedit 574D9791)
    (at 155 102.5 270)
    (descr "14-Lead Plastic Small Outline (SL) - Narrow, 3.90 mm Body [SOIC] (see Microchip Packaging Specification 00000049BS.pdf)")
    (tags "SOIC 1.27")
    (attr smd)
    (fp_text reference U1 (at 0 -5.5 270) (layer B.SilkS))
    (fp_text value MCP2050 (at 0 -5.375 270) (layer B.Fab))
    (pad 1 smd rect (at -2.7 3.81 270) (size 1.5 0.6) (layers B.Cu B.Paste B.Mask)
      (net 4 "Net-(U1-Pad1)"))
    (pad 2 smd rect (at -2.7 2.54 270) (size 1.5 0.6) (layers B.Cu B.Paste B.Mask)
      (net 5 "Net-(U1-Pad2)"))
    (pad 3 smd rect (at -2.7 1.27 270) (size 1.5 0.6) (layers B.Cu B.Paste B.Mask)
      (net 2 +12V))
    (pad 4 smd rect (at -2.7 0 270) (size 1.5 0.6) (layers B.Cu B.Paste B.Mask)
      (net 11 +3V3))
    (pad 5 smd rect (at -2.7 -1.27 270) (size 1.5 0.6) (layers B.Cu B.Paste B.Mask)
      (net 6 "Net-(U1-Pad5)"))
    (pad 6 smd rect (at -2.7 -2.54 270) (size 1.5 0.6) (layers B.Cu B.Paste B.Mask))
    (pad 7 smd rect (at -2.7 -3.81 270) (size 1.5 0.6) (layers B.Cu B.Paste B.Mask))
    (pad 8 smd rect (at 2.7 -3.81 270) (size 1.5 0.6) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (pad 9 smd rect (at 2.7 -2.54 270) (size 1.5 0.6) (layers B.Cu B.Paste B.Mask)
      (net 9 "Net-(D1-Pad1)"))
    (pad 10 smd rect (at 2.7 -1.27 270) (size 1.5 0.6) (layers B.Cu B.Paste B.Mask)
      (net 2 +12V))
    (pad 11 smd rect (at 2.7 0 270) (size 1.5 0.6) (layers B.Cu B.Paste B.Mask)
      (net 3 "Net-(R2-Pad2)"))
    (pad 12 smd rect (at 2.7 1.27 270) (size 1.5 0.6) (layers B.Cu B.Paste B.Mask))
    (pad 13 smd rect (at 2.7 2.54 270) (size 1.5 0.6) (layers B.Cu B.Paste B.Mask))
    (pad 14 smd rect (at 2.7 3.81 270) (size 1.5 0.6) (layers B.Cu B.Paste B.Mask))
    (model Housings_SOIC.3dshapes/SOIC-14_3.9x8.7mm_Pitch1.27mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Wire_Pads:SolderWirePad_single_1-2mmDrill (layer F.Cu) (tedit 58086669)
    (at 144 108.5)
    (fp_text reference P1 (at -1.5 1.75) (layer F.SilkS) hide)
    (fp_text value CONN_01X01 (at -1.905 3.175) (layer F.Fab))
    (pad 1 thru_hole circle (at 0 0) (size 3.50012 3.50012) (drill 1.19888) (layers *.Cu *.Mask F.SilkS)
      (net 1 GND))
  )
  (module Wire_Pads:SolderWirePad_single_1-2mmDrill (layer F.Cu) (tedit 58086667)
    (at 144 103.75)
    (fp_text reference P2 (at -1.5 2) (layer F.SilkS) hide)
    (fp_text value CONN_01X01 (at -1.905 3.175) (layer F.Fab))
    (pad 1 thru_hole circle (at 0 0) (size 3.50012 3.50012) (drill 1.19888) (layers *.Cu *.Mask F.SilkS)
      (net 9 "Net-(D1-Pad1)"))
  )
  (module Diodes_SMD:SOD-323_HandSoldering (layer B.Cu) (tedit 57A875DC)
    (at 147.25 108 270)
    (descr SOD-323)
    (tags SOD-323)
    (attr smd)
    (fp_text reference D1 (at 0 -1.75 270) (layer B.SilkS))
    (fp_text value RSB36V (at 0.1 -1.9 270) (layer B.Fab))
    (pad 1 smd rect (at -1.25 0 270) (size 1 1) (layers B.Cu B.Paste B.Mask)
      (net 9 "Net-(D1-Pad1)"))
    (pad 2 smd rect (at 1.25 0 270) (size 1 1) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (model Diodes_SMD.3dshapes/SOD-323.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 180))
    )
  )
  (module Diodes_SMD:SOD-123 (layer B.Cu) (tedit 5753A53E)
    (at 147.25 103.5 90)
    (descr SOD-123)
    (tags SOD-123)
    (attr smd)
    (fp_text reference D2 (at 0 1.75 90) (layer B.SilkS))
    (fp_text value D (at 0 -2.1 90) (layer B.Fab))
    (pad 1 smd rect (at -1.635 0 90) (size 0.91 1.22) (layers B.Cu B.Paste B.Mask)
      (net 2 +12V))
    (pad 2 smd rect (at 1.635 0 90) (size 0.91 1.22) (layers B.Cu B.Paste B.Mask)
      (net 10 "Net-(D2-Pad2)"))
    (model ${KISYS3DMOD}/Diodes_SMD.3dshapes/SOD-123.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Pin_Headers:Pin_Header_Straight_1x04_Pitch2.00mm (layer F.Cu) (tedit 56FA75DA)
    (at 162 109.5 270)
    (descr "Through hole pin header, 1x04, 2.00mm pitch, single row")
    (tags "pin header single row")
    (fp_text reference P4 (at 0 8.5 270) (layer F.SilkS))
    (fp_text value CONN_01X03 (at 0 -3 270) (layer F.Fab))
    (pad 1 thru_hole rect (at 0 0 270) (size 1.35 1.35) (drill 0.8) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 2 thru_hole circle (at 0 2 270) (size 1.35 1.35) (drill 0.8) (layers *.Cu *.Mask)
      (net 7 "Net-(P4-Pad2)"))
    (pad 3 thru_hole circle (at 0 4 270) (size 1.35 1.35) (drill 0.8) (layers *.Cu *.Mask)
      (net 8 "Net-(P4-Pad3)"))
    (pad 4 thru_hole circle (at 0 6 270) (size 1.35 1.35) (drill 0.8) (layers *.Cu *.Mask)
      (net 11 +3V3))
    (model Pin_Headers.3dshapes/Pin_Header_Straight_1x04_Pitch2.00mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (gr_text "LIN<->BLE Gateway" (at 157 97.5 180) (layer B.SilkS))
  (gr_text 12V (at 147.75 99) (layer F.SilkS))
  (gr_text GND (at 148 108.5) (layer F.SilkS))
  (gr_text LIN (at 147.5 103.75) (layer F.SilkS))
  (gr_text 3V (at 156 107.75 90) (layer B.SilkS))
  (gr_text CK (at 158 107.75 90) (layer B.SilkS))
  (gr_text GD (at 162 107.75 90) (layer B.SilkS))
  (gr_text IO (at 160 107.75 90) (layer B.SilkS))
  (gr_line (start 141.5 96.5) (end 164.25 96.5) (layer Edge.Cuts) (width 0.2))
  (gr_line (start 141.5 111) (end 141.5 96.5) (layer Edge.Cuts) (width 0.2))
  (gr_line (start 164.25 111) (end 141.5 111) (layer Edge.Cuts) (width 0.2))
  (gr_line (start 164.25 96.5) (end 164.25 111) (layer Edge.Cuts) (width 0.2))
  (zone (net 1) (net_name GND) (layer B.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.508))
    (min_thickness 0.254)
    (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 141.5 96.5) (xy 159.5 96.5) (xy 159.5 106.25) (xy 162.5 106.25) (xy 162.5 111)
        (xy 141.5 111)
      )
    )
  )
  (zone (net 1) (net_name GND) (layer F.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.508))
    (min_thickness 0.254)
    (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 141.5 96.5) (xy 159.5 96.5) (xy 159.5 106.25) (xy 162.5 106.25) (xy 162.5 111)
        (xy 141.5 111)
      )
    )
  )
)
