(kicad_pcb (version 20171130) (host pcbnew "(5.1.5-0)")
  (general
    (thickness 1.6)
    (drawings 7)
    (tracks 1223)
    (zones 0)
    (modules 17)
    (nets 87)
  )
  (page A4)
  (title_block
    (date 2020-02-05)
    (rev 1.6)
  )
  (layers
    (0 F.Cu signal)
    (31 B.Cu signal)
    (32 B.Adhes user)
    (33 F.Adhes user)
    (34 B.Paste user)
    (35 F.Paste user)
    (36 B.SilkS user)
    (37 F.SilkS user)
    (38 B.Mask user)
    (39 F.Mask user)
    (40 Dwgs.User user)
    (41 Cmts.User user)
    (42 Eco1.User user)
    (43 Eco2.User user)
    (44 Edge.Cuts user)
    (45 Margin user)
    (46 B.CrtYd user)
    (47 F.CrtYd user)
    (48 B.Fab user)
    (49 F.Fab user)
  )
  (setup
    (last_trace_width 0.3048)
    (user_trace_width 0.2032)
    (user_trace_width 0.254)
    (user_trace_width 0.3556)
    (user_trace_width 0.6096)
    (trace_clearance 0.1524)
    (zone_clearance 0.508)
    (zone_45_only no)
    (trace_min 0.1524)
    (via_size 0.8)
    (via_drill 0.4)
    (via_min_size 0.4572)
    (via_min_drill 0.2032)
    (uvia_size 0.3)
    (uvia_drill 0.1)
    (uvias_allowed no)
    (uvia_min_size 0.0254)
    (uvia_min_drill 0.0254)
    (edge_width 0.05)
    (segment_width 0.2)
    (pcb_text_width 0.3)
    (pcb_text_size 1.5 1.5)
    (mod_edge_width 0.12)
    (mod_text_size 1 1)
    (mod_text_width 0.15)
    (pad_size 1.524 1.524)
    (pad_drill 0.762)
    (pad_to_mask_clearance 0.2032)
    (solder_mask_min_width 0.2032)
    (aux_axis_origin 0 0)
    (visible_elements FFFFFFFF)
    (pcbplotparams
      (layerselection 0x010fc_ffffffff)
      (usegerberextensions false)
      (usegerberattributes false)
      (usegerberadvancedattributes false)
      (creategerberjobfile false)
      (excludeedgelayer true)
      (linewidth 0.100000)
      (plotframeref false)
      (viasonmask false)
      (mode 1)
      (useauxorigin false)
      (hpglpennumber 1)
      (hpglpenspeed 20)
      (hpglpendiameter 15.000000)
      (psnegative false)
      (psa4output false)
      (plotreference true)
      (plotvalue true)
      (plotinvisibletext false)
      (padsonsilk false)
      (subtractmaskfromsilk false)
      (outputformat 1)
      (mirror false)
      (drillshape 0)
      (scaleselection 1)
      (outputdirectory "manufacturing/"))
  )
  (net 0 "")
  (net 1 /VIN)
  (net 2 /GND)
  (net 3 /5VDC)
  (net 4 /12VDC)
  (net 5 /B2_DAC)
  (net 6 /B1_DAC)
  (net 7 /B2_DA)
  (net 8 /B1_DA)
  (net 9 /B2_DB)
  (net 10 /B1_DB)
  (net 11 /B6_DA)
  (net 12 /B5_DA)
  (net 13 /B4_DA)
  (net 14 /B6_DB)
  (net 15 /B5_DB)
  (net 16 /B4_DB)
  (net 17 /RST)
  (net 18 /USR)
  (net 19 /T3_PA)
  (net 20 /T2_PA)
  (net 21 /T1_PA)
  (net 22 /T1_COMA)
  (net 23 /T3_COMA)
  (net 24 /T2_COMA)
  (net 25 /T1_COMB)
  (net 26 /B1_COMA)
  (net 27 /B2_COMB)
  (net 28 /T2_COMB)
  (net 29 /B2_COMA)
  (net 30 /B1_COMB)
  (net 31 /B2_PB)
  (net 32 /T2_PB)
  (net 33 /B2_PA)
  (net 34 /B1_PB)
  (net 35 /T1_PB)
  (net 36 /B1_PA)
  (net 37 /B3_PA)
  (net 38 /T3_PB)
  (net 39 /B3_PB)
  (net 40 /B3_COMB)
  (net 41 /T3_COMB)
  (net 42 /B3_COMA)
  (net 43 /T6_PA)
  (net 44 /T5_PA)
  (net 45 /T4_PA)
  (net 46 /B4_PA)
  (net 47 /T4_PB)
  (net 48 /B4_PB)
  (net 49 /B4_COMB)
  (net 50 /B4_COMA)
  (net 51 /T4_COMA)
  (net 52 /T4_COMB)
  (net 53 /B5_PB)
  (net 54 /T5_PB)
  (net 55 /B5_PA)
  (net 56 /T6_PB)
  (net 57 /B6_PB)
  (net 58 /B6_PA)
  (net 59 /T6_COMA)
  (net 60 /T6_COMB)
  (net 61 /B6_COMB)
  (net 62 /B5_COMB)
  (net 63 /T5_COMA)
  (net 64 /B6_COMA)
  (net 65 /B5_COMA)
  (net 66 /T5_COMB)
  (net 67 /T6_DA)
  (net 68 /T5_DA)
  (net 69 /T4_DA)
  (net 70 /T3_DA)
  (net 71 /T2_DA)
  (net 72 /T1_DA)
  (net 73 /T6_DB)
  (net 74 /T5_DB)
  (net 75 /T4_DB)
  (net 76 /T3_DB)
  (net 77 /T2_DB)
  (net 78 /T1_DB)
  (net 79 /T1_DC)
  (net 80 /T2_DC)
  (net 81 /B3_DA)
  (net 82 /B3_DB)
  (net 83 /T4_DC)
  (net 84 /T3_DC)
  (net 85 "Net-(J1-PadP3)")
  (net 86 "Net-(J1-PadP2)")
  (net_class Default "This is the default net class."
    (clearance 0.1524)
    (trace_width 0.3048)
    (via_dia 0.8)
    (via_drill 0.4)
    (uvia_dia 0.3)
    (uvia_drill 0.1)
    (add_net /B1_COMA)
    (add_net /B1_COMB)
    (add_net /B1_DA)
    (add_net /B1_DAC)
    (add_net /B1_DB)
    (add_net /B1_PA)
    (add_net /B1_PB)
    (add_net /B2_COMA)
    (add_net /B2_COMB)
    (add_net /B2_DA)
    (add_net /B2_DAC)
    (add_net /B2_DB)
    (add_net /B2_PA)
    (add_net /B2_PB)
    (add_net /B3_COMA)
    (add_net /B3_COMB)
    (add_net /B3_DA)
    (add_net /B3_DB)
    (add_net /B3_PA)
    (add_net /B3_PB)
    (add_net /B4_COMA)
    (add_net /B4_COMB)
    (add_net /B4_DA)
    (add_net /B4_DB)
    (add_net /B4_PA)
    (add_net /B4_PB)
    (add_net /B5_COMA)
    (add_net /B5_COMB)
    (add_net /B5_DA)
    (add_net /B5_DB)
    (add_net /B5_PA)
    (add_net /B5_PB)
    (add_net /B6_COMA)
    (add_net /B6_COMB)
    (add_net /B6_DA)
    (add_net /B6_DB)
    (add_net /B6_PA)
    (add_net /B6_PB)
    (add_net /GND)
    (add_net /RST)
    (add_net /T1_COMA)
    (add_net /T1_COMB)
    (add_net /T1_DA)
    (add_net /T1_DB)
    (add_net /T1_DC)
    (add_net /T1_PA)
    (add_net /T1_PB)
    (add_net /T2_COMA)
    (add_net /T2_COMB)
    (add_net /T2_DA)
    (add_net /T2_DB)
    (add_net /T2_DC)
    (add_net /T2_PA)
    (add_net /T2_PB)
    (add_net /T3_COMA)
    (add_net /T3_COMB)
    (add_net /T3_DA)
    (add_net /T3_DB)
    (add_net /T3_DC)
    (add_net /T3_PA)
    (add_net /T3_PB)
    (add_net /T4_COMA)
    (add_net /T4_COMB)
    (add_net /T4_DA)
    (add_net /T4_DB)
    (add_net /T4_DC)
    (add_net /T4_PA)
    (add_net /T4_PB)
    (add_net /T5_COMA)
    (add_net /T5_COMB)
    (add_net /T5_DA)
    (add_net /T5_DB)
    (add_net /T5_PA)
    (add_net /T5_PB)
    (add_net /T6_COMA)
    (add_net /T6_COMB)
    (add_net /T6_DA)
    (add_net /T6_DB)
    (add_net /T6_PA)
    (add_net /T6_PB)
    (add_net /USR)
    (add_net "Net-(J1-PadP2)")
    (add_net "Net-(J1-PadP3)")
  )
  (net_class POWER ""
    (clearance 0.1524)
    (trace_width 0.4064)
    (via_dia 0.8)
    (via_drill 0.4)
    (uvia_dia 0.3)
    (uvia_drill 0.1)
    (add_net /12VDC)
    (add_net /5VDC)
    (add_net /VIN)
  )
  (module asl_footprints:DC_Jack (layer F.Cu) (tedit 5E21F2FD)
    (at 180.594 101.092)
    (tags "dc barrel jack 2 pin")
    (fp_text reference J3 (at 5.842 -5.842 180) (layer F.SilkS))
    (fp_text value PJ-037A (at 2.488 5.78193) (layer F.SilkS) hide)
    (pad 1 thru_hole oval (at 0 0 90) (size 5 2.5) (drill oval 3.5 1) (layers *.Cu *.Mask)
      (net 4 /12VDC))
    (pad 2 thru_hole oval (at 6 0 90) (size 4.5 2.25) (drill oval 3 1) (layers *.Cu *.Mask)
      (net 2 /GND))
    (model ${KIPRJMOD}/libs/3d/PJ-037A.step
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module asl_footprints:RJ45_12Port (layer F.Cu) (tedit 5E21D1F6)
    (at 148.844 122.682)
    (fp_text reference J2 (at -44.704 -14.732) (layer F.SilkS))
    (fp_text value 5569263-1 (at 26.45 12.17) (layer F.Fab) hide)
    (pad "" np_thru_hole circle (at 40.513 4.3816) (size 3.2 3.2) (drill 3.2) (layers *.Cu *.Mask))
    (pad "" np_thru_hole circle (at -40.767 4.3816) (size 3.2 3.2) (drill 3.2) (layers *.Cu *.Mask))
    (pad T6-5 thru_hole circle (at 34.163 -11.1084 180) (size 1.4 1.4) (drill 0.9) (layers *.Cu *.Mask)
      (solder_mask_margin 0.1016))
    (pad B6-5 thru_hole circle (at 35.433 -1.9684 180) (size 1.4 1.4) (drill 0.9) (layers *.Cu *.Mask)
      (solder_mask_margin 0.1016))
    (pad T5-5 thru_hole circle (at 20.193 -11.1084 180) (size 1.4 1.4) (drill 0.9) (layers *.Cu *.Mask)
      (solder_mask_margin 0.1016))
    (pad B5-5 thru_hole circle (at 21.463 -1.9684 180) (size 1.4 1.4) (drill 0.9) (layers *.Cu *.Mask)
      (solder_mask_margin 0.1016))
    (pad T4-5 thru_hole circle (at 6.223 -11.1084 180) (size 1.4 1.4) (drill 0.9) (layers *.Cu *.Mask)
      (net 83 /T4_DC) (solder_mask_margin 0.1016))
    (pad B4-5 thru_hole circle (at 7.493 -1.9684 180) (size 1.4 1.4) (drill 0.9) (layers *.Cu *.Mask)
      (solder_mask_margin 0.1016))
    (pad T3-5 thru_hole circle (at -7.747 -11.1084 180) (size 1.4 1.4) (drill 0.9) (layers *.Cu *.Mask)
      (net 84 /T3_DC) (solder_mask_margin 0.1016))
    (pad B3-5 thru_hole circle (at -6.477 -1.9684 180) (size 1.4 1.4) (drill 0.9) (layers *.Cu *.Mask)
      (solder_mask_margin 0.1016))
    (pad T2-5 thru_hole circle (at -21.717 -11.1084 180) (size 1.4 1.4) (drill 0.9) (layers *.Cu *.Mask)
      (net 80 /T2_DC) (solder_mask_margin 0.1016))
    (pad B2-5 thru_hole circle (at -20.447 -1.9684 180) (size 1.4 1.4) (drill 0.9) (layers *.Cu *.Mask)
      (net 5 /B2_DAC) (solder_mask_margin 0.1016))
    (pad T1-5 thru_hole circle (at -35.687 -11.1084 180) (size 1.4 1.4) (drill 0.9) (layers *.Cu *.Mask)
      (net 79 /T1_DC) (solder_mask_margin 0.1016))
    (pad B1-5 thru_hole circle (at -34.417 -1.9684 180) (size 1.4 1.4) (drill 0.9) (layers *.Cu *.Mask)
      (net 6 /B1_DAC) (solder_mask_margin 0.1016))
    (pad S6 thru_hole circle (at 43.307 8.9566) (size 1.9304 1.9304) (drill 1.6) (layers *.Cu *.Mask)
      (solder_mask_margin 0.1016))
    (pad S5 thru_hole circle (at 42.545 -1.4574) (size 1.9304 1.9304) (drill 1.6) (layers *.Cu *.Mask)
      (solder_mask_margin 0.1016))
    (pad S4 thru_hole circle (at 43.307 -7.0454) (size 1.9304 1.9304) (drill 1.6) (layers *.Cu *.Mask)
      (solder_mask_margin 0.1016))
    (pad S1 thru_hole circle (at -43.561 -11.1094) (size 1.9304 1.9304) (drill 1.6) (layers *.Cu *.Mask)
      (solder_mask_margin 0.1016))
    (pad S2 thru_hole circle (at -42.799 -4.7594) (size 1.9304 1.9304) (drill 1.6) (layers *.Cu *.Mask)
      (solder_mask_margin 0.1016))
    (pad S3 thru_hole circle (at -43.561 8.9566) (size 1.9304 1.9304) (drill 1.6) (layers *.Cu *.Mask)
      (solder_mask_margin 0.1016))
    (pad T6-8 thru_hole circle (at 30.353 -8.5684 180) (size 1.4 1.4) (drill 0.9) (layers *.Cu *.Mask)
      (net 4 /12VDC) (solder_mask_margin 0.1016))
    (pad B6-8 thru_hole circle (at 39.243 -4.5084 180) (size 1.4 1.4) (drill 0.9) (layers *.Cu *.Mask)
      (net 4 /12VDC) (solder_mask_margin 0.1016))
    (pad T5-8 thru_hole circle (at 16.383 -8.5684 180) (size 1.4 1.4) (drill 0.9) (layers *.Cu *.Mask)
      (net 4 /12VDC) (solder_mask_margin 0.1016))
    (pad B5-8 thru_hole circle (at 25.273 -4.5084 180) (size 1.4 1.4) (drill 0.9) (layers *.Cu *.Mask)
      (net 4 /12VDC) (solder_mask_margin 0.1016))
    (pad T4-8 thru_hole circle (at 2.413 -8.5684 180) (size 1.4 1.4) (drill 0.9) (layers *.Cu *.Mask)
      (net 4 /12VDC) (solder_mask_margin 0.1016))
    (pad B4-8 thru_hole circle (at 11.303 -4.5084 180) (size 1.4 1.4) (drill 0.9) (layers *.Cu *.Mask)
      (net 4 /12VDC) (solder_mask_margin 0.1016))
    (pad T3-8 thru_hole circle (at -11.557 -8.5684 180) (size 1.4 1.4) (drill 0.9) (layers *.Cu *.Mask)
      (net 4 /12VDC) (solder_mask_margin 0.1016))
    (pad B3-8 thru_hole circle (at -2.667 -4.5084 180) (size 1.4 1.4) (drill 0.9) (layers *.Cu *.Mask)
      (net 4 /12VDC) (solder_mask_margin 0.1016))
    (pad T2-8 thru_hole circle (at -25.527 -8.5684 180) (size 1.4 1.4) (drill 0.9) (layers *.Cu *.Mask)
      (net 4 /12VDC) (solder_mask_margin 0.1016))
    (pad B2-8 thru_hole circle (at -16.637 -4.5084 180) (size 1.4 1.4) (drill 0.9) (layers *.Cu *.Mask)
      (net 4 /12VDC) (solder_mask_margin 0.1016))
    (pad T1-8 thru_hole circle (at -39.497 -8.5684 180) (size 1.4 1.4) (drill 0.9) (layers *.Cu *.Mask)
      (net 4 /12VDC) (solder_mask_margin 0.1016))
    (pad B1-8 thru_hole circle (at -30.607 -4.5084 180) (size 1.4 1.4) (drill 0.9) (layers *.Cu *.Mask)
      (net 4 /12VDC) (solder_mask_margin 0.1016))
    (pad T6-2 thru_hole circle (at 37.973 -8.5684 180) (size 1.4 1.4) (drill 0.9) (layers *.Cu *.Mask)
      (net 2 /GND) (solder_mask_margin 0.1016))
    (pad B6-2 thru_hole circle (at 31.623 -4.5084 180) (size 1.4 1.4) (drill 0.9) (layers *.Cu *.Mask)
      (net 2 /GND) (solder_mask_margin 0.1016))
    (pad T5-2 thru_hole circle (at 24.003 -8.5684 180) (size 1.4 1.4) (drill 0.9) (layers *.Cu *.Mask)
      (net 2 /GND) (solder_mask_margin 0.1016))
    (pad B5-2 thru_hole circle (at 17.653 -4.5084 180) (size 1.4 1.4) (drill 0.9) (layers *.Cu *.Mask)
      (net 2 /GND) (solder_mask_margin 0.1016))
    (pad T4-2 thru_hole circle (at 10.033 -8.5684 180) (size 1.4 1.4) (drill 0.9) (layers *.Cu *.Mask)
      (net 2 /GND) (solder_mask_margin 0.1016))
    (pad B4-2 thru_hole circle (at 3.683 -4.5084 180) (size 1.4 1.4) (drill 0.9) (layers *.Cu *.Mask)
      (net 2 /GND) (solder_mask_margin 0.1016))
    (pad T3-2 thru_hole circle (at -3.937 -8.5684 180) (size 1.4 1.4) (drill 0.9) (layers *.Cu *.Mask)
      (net 2 /GND) (solder_mask_margin 0.1016))
    (pad B3-2 thru_hole circle (at -10.287 -4.5084 180) (size 1.4 1.4) (drill 0.9) (layers *.Cu *.Mask)
      (net 2 /GND) (solder_mask_margin 0.1016))
    (pad T2-2 thru_hole circle (at -17.907 -8.5684 180) (size 1.4 1.4) (drill 0.9) (layers *.Cu *.Mask)
      (net 2 /GND) (solder_mask_margin 0.1016))
    (pad B2-2 thru_hole circle (at -24.257 -4.5084 180) (size 1.4 1.4) (drill 0.9) (layers *.Cu *.Mask)
      (net 2 /GND) (solder_mask_margin 0.1016))
    (pad T1-2 thru_hole circle (at -31.877 -8.5684 180) (size 1.4 1.4) (drill 0.9) (layers *.Cu *.Mask)
      (net 2 /GND) (solder_mask_margin 0.1016))
    (pad B1-2 thru_hole circle (at -38.227 -4.5084 180) (size 1.4 1.4) (drill 0.9) (layers *.Cu *.Mask)
      (net 2 /GND) (solder_mask_margin 0.1016))
    (pad T6-1 thru_hole circle (at 39.243 -11.1084 180) (size 1.4 1.4) (drill 0.9) (layers *.Cu *.Mask)
      (net 67 /T6_DA) (solder_mask_margin 0.1016))
    (pad B6-1 thru_hole circle (at 30.353 -1.9684 180) (size 1.4 1.4) (drill 0.9) (layers *.Cu *.Mask)
      (net 11 /B6_DA) (solder_mask_margin 0.1016))
    (pad T5-1 thru_hole circle (at 25.273 -11.1084 180) (size 1.4 1.4) (drill 0.9) (layers *.Cu *.Mask)
      (net 68 /T5_DA) (solder_mask_margin 0.1016))
    (pad B5-1 thru_hole circle (at 16.383 -1.9684 180) (size 1.4 1.4) (drill 0.9) (layers *.Cu *.Mask)
      (net 12 /B5_DA) (solder_mask_margin 0.1016))
    (pad T4-1 thru_hole circle (at 11.303 -11.1084 180) (size 1.4 1.4) (drill 0.9) (layers *.Cu *.Mask)
      (net 69 /T4_DA) (solder_mask_margin 0.1016))
    (pad B4-1 thru_hole circle (at 2.413 -1.9684 180) (size 1.4 1.4) (drill 0.9) (layers *.Cu *.Mask)
      (net 13 /B4_DA) (solder_mask_margin 0.1016))
    (pad T3-1 thru_hole circle (at -2.667 -11.1084 180) (size 1.4 1.4) (drill 0.9) (layers *.Cu *.Mask)
      (net 70 /T3_DA) (solder_mask_margin 0.1016))
    (pad B3-1 thru_hole circle (at -11.557 -1.9684 180) (size 1.4 1.4) (drill 0.9) (layers *.Cu *.Mask)
      (net 81 /B3_DA) (solder_mask_margin 0.1016))
    (pad T2-1 thru_hole circle (at -16.637 -11.1084 180) (size 1.4 1.4) (drill 0.9) (layers *.Cu *.Mask)
      (net 71 /T2_DA) (solder_mask_margin 0.1016))
    (pad B2-1 thru_hole circle (at -25.527 -1.9684 180) (size 1.4 1.4) (drill 0.9) (layers *.Cu *.Mask)
      (net 7 /B2_DA) (solder_mask_margin 0.1016))
    (pad T1-1 thru_hole circle (at -30.607 -11.1084 180) (size 1.4 1.4) (drill 0.9) (layers *.Cu *.Mask)
      (net 72 /T1_DA) (solder_mask_margin 0.1016))
    (pad B1-1 thru_hole circle (at -39.497 -1.9684 180) (size 1.4 1.4) (drill 0.9) (layers *.Cu *.Mask)
      (net 8 /B1_DA) (solder_mask_margin 0.1016))
    (pad T6-3 thru_hole circle (at 36.703 -11.1084 180) (size 1.4 1.4) (drill 0.9) (layers *.Cu *.Mask)
      (net 43 /T6_PA) (solder_mask_margin 0.1016))
    (pad B6-3 thru_hole circle (at 32.893 -1.9684 180) (size 1.4 1.4) (drill 0.9) (layers *.Cu *.Mask)
      (net 58 /B6_PA) (solder_mask_margin 0.1016))
    (pad T5-3 thru_hole circle (at 22.733 -11.1084 180) (size 1.4 1.4) (drill 0.9) (layers *.Cu *.Mask)
      (net 44 /T5_PA) (solder_mask_margin 0.1016))
    (pad B5-3 thru_hole circle (at 18.923 -1.9684 180) (size 1.4 1.4) (drill 0.9) (layers *.Cu *.Mask)
      (net 55 /B5_PA) (solder_mask_margin 0.1016))
    (pad T4-3 thru_hole circle (at 8.763 -11.1084 180) (size 1.4 1.4) (drill 0.9) (layers *.Cu *.Mask)
      (net 45 /T4_PA) (solder_mask_margin 0.1016))
    (pad B4-3 thru_hole circle (at 4.953 -1.9684 180) (size 1.4 1.4) (drill 0.9) (layers *.Cu *.Mask)
      (net 46 /B4_PA) (solder_mask_margin 0.1016))
    (pad T3-3 thru_hole circle (at -5.207 -11.1084 180) (size 1.4 1.4) (drill 0.9) (layers *.Cu *.Mask)
      (net 19 /T3_PA) (solder_mask_margin 0.1016))
    (pad B3-3 thru_hole circle (at -9.017 -1.9684 180) (size 1.4 1.4) (drill 0.9) (layers *.Cu *.Mask)
      (net 37 /B3_PA) (solder_mask_margin 0.1016))
    (pad T2-3 thru_hole circle (at -19.177 -11.1084 180) (size 1.4 1.4) (drill 0.9) (layers *.Cu *.Mask)
      (net 20 /T2_PA) (solder_mask_margin 0.1016))
    (pad B2-3 thru_hole circle (at -22.987 -1.9684 180) (size 1.4 1.4) (drill 0.9) (layers *.Cu *.Mask)
      (net 33 /B2_PA) (solder_mask_margin 0.1016))
    (pad T1-3 thru_hole circle (at -33.147 -11.1084 180) (size 1.4 1.4) (drill 0.9) (layers *.Cu *.Mask)
      (net 21 /T1_PA) (solder_mask_margin 0.1016))
    (pad B1-3 thru_hole circle (at -36.957 -1.9684 180) (size 1.4 1.4) (drill 0.9) (layers *.Cu *.Mask)
      (net 36 /B1_PA) (solder_mask_margin 0.1016))
    (pad T6-6 thru_hole circle (at 32.893 -8.5684 180) (size 1.4 1.4) (drill 0.9) (layers *.Cu *.Mask)
      (net 3 /5VDC) (solder_mask_margin 0.1016))
    (pad B6-6 thru_hole circle (at 36.703 -4.5084 180) (size 1.4 1.4) (drill 0.9) (layers *.Cu *.Mask)
      (net 3 /5VDC) (solder_mask_margin 0.1016))
    (pad T5-6 thru_hole circle (at 18.923 -8.5684 180) (size 1.4 1.4) (drill 0.9) (layers *.Cu *.Mask)
      (net 3 /5VDC) (solder_mask_margin 0.1016))
    (pad B5-6 thru_hole circle (at 22.733 -4.5084 180) (size 1.4 1.4) (drill 0.9) (layers *.Cu *.Mask)
      (net 3 /5VDC) (solder_mask_margin 0.1016))
    (pad T4-6 thru_hole circle (at 4.953 -8.5684 180) (size 1.4 1.4) (drill 0.9) (layers *.Cu *.Mask)
      (net 3 /5VDC) (solder_mask_margin 0.1016))
    (pad B4-6 thru_hole circle (at 8.763 -4.5084 180) (size 1.4 1.4) (drill 0.9) (layers *.Cu *.Mask)
      (net 3 /5VDC) (solder_mask_margin 0.1016))
    (pad T3-6 thru_hole circle (at -9.017 -8.5684 180) (size 1.4 1.4) (drill 0.9) (layers *.Cu *.Mask)
      (net 3 /5VDC) (solder_mask_margin 0.1016))
    (pad B3-6 thru_hole circle (at -5.207 -4.5084 180) (size 1.4 1.4) (drill 0.9) (layers *.Cu *.Mask)
      (net 3 /5VDC) (solder_mask_margin 0.1016))
    (pad T2-6 thru_hole circle (at -22.987 -8.5684 180) (size 1.4 1.4) (drill 0.9) (layers *.Cu *.Mask)
      (net 3 /5VDC) (solder_mask_margin 0.1016))
    (pad B2-6 thru_hole circle (at -19.177 -4.5084 180) (size 1.4 1.4) (drill 0.9) (layers *.Cu *.Mask)
      (net 3 /5VDC) (solder_mask_margin 0.1016))
    (pad T1-6 thru_hole circle (at -36.957 -8.5684 180) (size 1.4 1.4) (drill 0.9) (layers *.Cu *.Mask)
      (net 3 /5VDC) (solder_mask_margin 0.1016))
    (pad B1-6 thru_hole circle (at -33.147 -4.5084 180) (size 1.4 1.4) (drill 0.9) (layers *.Cu *.Mask)
      (net 3 /5VDC) (solder_mask_margin 0.1016))
    (pad T6-4 thru_hole circle (at 35.433 -8.5684 180) (size 1.4 1.4) (drill 0.9) (layers *.Cu *.Mask)
      (net 73 /T6_DB) (solder_mask_margin 0.1016))
    (pad B6-4 thru_hole circle (at 34.163 -4.5084 180) (size 1.4 1.4) (drill 0.9) (layers *.Cu *.Mask)
      (net 14 /B6_DB) (solder_mask_margin 0.1016))
    (pad T5-4 thru_hole circle (at 21.463 -8.5684 180) (size 1.4 1.4) (drill 0.9) (layers *.Cu *.Mask)
      (net 74 /T5_DB) (solder_mask_margin 0.1016))
    (pad B5-4 thru_hole circle (at 20.193 -4.5084 180) (size 1.4 1.4) (drill 0.9) (layers *.Cu *.Mask)
      (net 15 /B5_DB) (solder_mask_margin 0.1016))
    (pad T4-4 thru_hole circle (at 7.493 -8.5684 180) (size 1.4 1.4) (drill 0.9) (layers *.Cu *.Mask)
      (net 75 /T4_DB) (solder_mask_margin 0.1016))
    (pad B4-4 thru_hole circle (at 6.223 -4.5084 180) (size 1.4 1.4) (drill 0.9) (layers *.Cu *.Mask)
      (net 16 /B4_DB) (solder_mask_margin 0.1016))
    (pad T3-4 thru_hole circle (at -6.477 -8.5684 180) (size 1.4 1.4) (drill 0.9) (layers *.Cu *.Mask)
      (net 76 /T3_DB) (solder_mask_margin 0.1016))
    (pad B3-4 thru_hole circle (at -7.747 -4.5084 180) (size 1.4 1.4) (drill 0.9) (layers *.Cu *.Mask)
      (net 82 /B3_DB) (solder_mask_margin 0.1016))
    (pad T2-4 thru_hole circle (at -20.447 -8.5684 180) (size 1.4 1.4) (drill 0.9) (layers *.Cu *.Mask)
      (net 77 /T2_DB) (solder_mask_margin 0.1016))
    (pad B2-4 thru_hole circle (at -21.717 -4.5084 180) (size 1.4 1.4) (drill 0.9) (layers *.Cu *.Mask)
      (net 9 /B2_DB) (solder_mask_margin 0.1016))
    (pad T1-4 thru_hole circle (at -34.417 -8.5684 180) (size 1.4 1.4) (drill 0.9) (layers *.Cu *.Mask)
      (net 78 /T1_DB) (solder_mask_margin 0.1016))
    (pad B1-4 thru_hole circle (at -35.687 -4.5084 180) (size 1.4 1.4) (drill 0.9) (layers *.Cu *.Mask)
      (net 10 /B1_DB) (solder_mask_margin 0.1016))
    (pad T6-7 thru_hole circle (at 31.623 -11.1084 180) (size 1.4 1.4) (drill 0.9) (layers *.Cu *.Mask)
      (net 56 /T6_PB) (solder_mask_margin 0.1016))
    (pad B6-7 thru_hole circle (at 37.973 -1.9684 180) (size 1.4 1.4) (drill 0.9) (layers *.Cu *.Mask)
      (net 57 /B6_PB) (solder_mask_margin 0.1016))
    (pad T5-7 thru_hole circle (at 17.653 -11.1084 180) (size 1.4 1.4) (drill 0.9) (layers *.Cu *.Mask)
      (net 54 /T5_PB) (solder_mask_margin 0.1016))
    (pad B5-7 thru_hole circle (at 24.003 -1.9684 180) (size 1.4 1.4) (drill 0.9) (layers *.Cu *.Mask)
      (net 53 /B5_PB) (solder_mask_margin 0.1016))
    (pad T4-7 thru_hole circle (at 3.683 -11.1084 180) (size 1.4 1.4) (drill 0.9) (layers *.Cu *.Mask)
      (net 47 /T4_PB) (solder_mask_margin 0.1016))
    (pad B4-7 thru_hole circle (at 10.033 -1.9684 180) (size 1.4 1.4) (drill 0.9) (layers *.Cu *.Mask)
      (net 48 /B4_PB) (solder_mask_margin 0.1016))
    (pad T3-7 thru_hole circle (at -10.287 -11.1084 180) (size 1.4 1.4) (drill 0.9) (layers *.Cu *.Mask)
      (net 38 /T3_PB) (solder_mask_margin 0.1016))
    (pad B3-7 thru_hole circle (at -3.937 -1.9684 180) (size 1.4 1.4) (drill 0.9) (layers *.Cu *.Mask)
      (net 39 /B3_PB) (solder_mask_margin 0.1016))
    (pad T2-7 thru_hole circle (at -24.257 -11.1084 180) (size 1.4 1.4) (drill 0.9) (layers *.Cu *.Mask)
      (net 32 /T2_PB) (solder_mask_margin 0.1016))
    (pad B2-7 thru_hole circle (at -17.907 -1.9684 180) (size 1.4 1.4) (drill 0.9) (layers *.Cu *.Mask)
      (net 31 /B2_PB) (solder_mask_margin 0.1016))
    (pad T1-7 thru_hole circle (at -38.227 -11.1084 180) (size 1.4 1.4) (drill 0.9) (layers *.Cu *.Mask)
      (net 35 /T1_PB) (solder_mask_margin 0.1016))
    (pad B1-7 thru_hole circle (at -31.877 -1.9684 180) (size 1.4 1.4) (drill 0.9) (layers *.Cu *.Mask)
      (net 34 /B1_PB) (solder_mask_margin 0.1016))
    (model ${KIPRJMOD}/libs/3d/RJ45_12port.step
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module asl_footprints:Hirose_40_pin (layer F.Cu) (tedit 5D3772A9)
    (at 168.91 85.725)
    (fp_text reference X1U1 (at 0.46 5.92) (layer F.SilkS))
    (fp_text value "DF40HC(4.0)-40DS-0.4V(70)" (at 0.31 -6.02) (layer F.Fab))
  )
  (module asl_footprints:12mm_tactile_smd (layer F.Cu) (tedit 5E20F526)
    (at 120.015 78.74)
    (descr "Surface Mount Tactile Switch for High-Density Packaging")
    (tags "Tactile Switch")
    (attr smd)
    (fp_text reference S1 (at -6.858 0) (layer F.SilkS))
    (fp_text value TL3300DF160Q (at 0.1 6.81) (layer F.Fab))
    (fp_text user %R (at 0.07 -6.67) (layer F.Fab))
    (pad 1 smd rect (at 6.975 2.5) (size 1.55 1.6) (layers F.Cu F.Paste F.Mask)
      (net 2 /GND))
    (pad 2 smd rect (at -6.975 2.5) (size 1.55 1.6) (layers F.Cu F.Paste F.Mask)
      (net 2 /GND))
    (pad 3 smd rect (at 6.975 -2.5) (size 1.55 1.6) (layers F.Cu F.Paste F.Mask)
      (net 18 /USR))
    (pad 4 smd rect (at -6.975 -2.5) (size 1.55 1.6) (layers F.Cu F.Paste F.Mask))
    (model ${KIPRJMOD}/libs/3d/12mm_tactile_smd.step
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module asl_footprints:Hirose_40_pin (layer F.Cu) (tedit 5D3772A9)
    (at 181.61 85.725)
    (fp_text reference X2U1 (at 0.127 5.92) (layer F.SilkS))
    (fp_text value "DF40HC(4.0)-40DS-0.4V(70)" (at 0.31 -6.02) (layer F.Fab))
  )
  (module asl_footprints:microUSB_horizontal_socket (layer F.Cu) (tedit 5E21F6BE)
    (at 191.168 75.311 90)
    (descr "Micro usb reinforced horizontal socket")
    (tags "usb socket micro reinforced ")
    (fp_text reference J1 (at 0 -3.589 90) (layer F.SilkS))
    (fp_text value 10118194-0001LF (at 0 -3.81 90) (layer F.Fab))
    (pad P4 smd rect (at 0.65 -1.43 180) (size 1.35 0.4) (layers F.Cu F.Paste F.Mask)
      (solder_mask_margin 0.1016))
    (pad P3 smd rect (at 0 -1.43 180) (size 1.35 0.4) (layers F.Cu F.Paste F.Mask)
      (net 85 "Net-(J1-PadP3)") (solder_mask_margin 0.1016))
    (pad P5 smd rect (at 1.3 -1.43 180) (size 1.35 0.4) (layers F.Cu F.Paste F.Mask)
      (net 2 /GND) (solder_mask_margin 0.1016))
    (pad G1 thru_hole circle (at -3.4996 1.27 90) (size 1.5 1.5) (drill 1) (layers *.Cu *.Mask)
      (net 2 /GND) (solder_mask_margin 0.1016))
    (pad G2 thru_hole circle (at 3.4996 1.27 90) (size 1.5 1.5) (drill 1) (layers *.Cu *.Mask)
      (net 2 /GND) (solder_mask_margin 0.1016))
    (pad G3 thru_hole circle (at 2.5 -1.43 90) (size 1.0556 1.0556) (drill 0.7) (layers *.Cu *.Mask)
      (net 2 /GND) (solder_mask_margin 0.1016))
    (pad P2 smd rect (at -0.65 -1.43 180) (size 1.35 0.4) (layers F.Cu F.Paste F.Mask)
      (net 86 "Net-(J1-PadP2)") (solder_mask_margin 0.1016))
    (pad P1 smd rect (at -1.3 -1.43 180) (size 1.35 0.4) (layers F.Cu F.Paste F.Mask)
      (net 3 /5VDC) (solder_mask_margin 0.1016))
    (pad G4 thru_hole circle (at -2.5 -1.43 90) (size 1.0556 1.0556) (drill 0.7) (layers *.Cu *.Mask)
      (net 2 /GND) (solder_mask_margin 0.1016))
    (model ${KISYS3DMOD}/Connector_USB.3dshapes/USB_Micro-B_Molex_47346-0001.step
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module asl_footprints:PyBoard_D-Series (layer F.Cu) (tedit 5D42F878)
    (at 175.26 85.725)
    (fp_text reference U1 (at -0.254 -0.254 90) (layer F.SilkS))
    (fp_text value pyboard-D-series (at 0.508 -8.636) (layer F.Fab))
    (pad 13 smd rect (at -4.995 -1.4 90) (size 0.23 0.66) (layers F.Cu F.Paste F.Mask))
    (pad 12 smd rect (at -7.705 -1.8 270) (size 0.23 0.66) (layers F.Cu F.Paste F.Mask)
      (net 7 /B2_DA))
    (pad 11 smd rect (at -4.995 -1.8 90) (size 0.23 0.66) (layers F.Cu F.Paste F.Mask)
      (net 15 /B5_DB))
    (pad 10 smd rect (at -7.705 -2.2 270) (size 0.23 0.66) (layers F.Cu F.Paste F.Mask)
      (net 69 /T4_DA))
    (pad 40 smd rect (at -7.705 3.8 270) (size 0.23 0.66) (layers F.Cu F.Paste F.Mask)
      (net 1 /VIN))
    (pad 39 smd rect (at -4.995 3.8 90) (size 0.23 0.66) (layers F.Cu F.Paste F.Mask)
      (net 2 /GND))
    (pad 38 smd rect (at -7.705 3.4 270) (size 0.23 0.66) (layers F.Cu F.Paste F.Mask)
      (net 1 /VIN))
    (pad 37 smd rect (at -4.995 3.4 90) (size 0.23 0.66) (layers F.Cu F.Paste F.Mask)
      (net 2 /GND))
    (pad 36 smd rect (at -7.705 3 270) (size 0.23 0.66) (layers F.Cu F.Paste F.Mask)
      (net 1 /VIN))
    (pad 35 smd rect (at -4.995 3 90) (size 0.23 0.66) (layers F.Cu F.Paste F.Mask)
      (net 2 /GND))
    (pad 34 smd rect (at -7.705 2.6 270) (size 0.23 0.66) (layers F.Cu F.Paste F.Mask)
      (net 40 /B3_COMB))
    (pad 33 smd rect (at -4.995 2.6 90) (size 0.23 0.66) (layers F.Cu F.Paste F.Mask)
      (net 61 /B6_COMB))
    (pad 32 smd rect (at -7.705 2.2 270) (size 0.23 0.66) (layers F.Cu F.Paste F.Mask)
      (net 23 /T3_COMA))
    (pad 31 smd rect (at -4.995 2.2 90) (size 0.23 0.66) (layers F.Cu F.Paste F.Mask))
    (pad 30 smd rect (at -7.705 1.8 270) (size 0.23 0.66) (layers F.Cu F.Paste F.Mask)
      (net 41 /T3_COMB))
    (pad 29 smd rect (at -4.995 1.8 90) (size 0.23 0.66) (layers F.Cu F.Paste F.Mask)
      (net 60 /T6_COMB))
    (pad 28 smd rect (at -7.705 1.4 270) (size 0.23 0.66) (layers F.Cu F.Paste F.Mask)
      (net 42 /B3_COMA))
    (pad 27 smd rect (at -4.995 1.4 90) (size 0.23 0.66) (layers F.Cu F.Paste F.Mask)
      (net 59 /T6_COMA))
    (pad 26 smd rect (at -7.705 1 270) (size 0.23 0.66) (layers F.Cu F.Paste F.Mask)
      (net 27 /B2_COMB))
    (pad 25 smd rect (at -4.995 1 90) (size 0.23 0.66) (layers F.Cu F.Paste F.Mask)
      (net 51 /T4_COMA))
    (pad 24 smd rect (at -7.705 0.6 270) (size 0.23 0.66) (layers F.Cu F.Paste F.Mask)
      (net 84 /T3_DC))
    (pad 23 smd rect (at -4.995 0.6 90) (size 0.23 0.66) (layers F.Cu F.Paste F.Mask)
      (net 52 /T4_COMB))
    (pad 22 smd rect (at -7.705 0.2 270) (size 0.23 0.66) (layers F.Cu F.Paste F.Mask)
      (net 28 /T2_COMB))
    (pad 21 smd rect (at -4.995 0.2 90) (size 0.23 0.66) (layers F.Cu F.Paste F.Mask))
    (pad 20 smd rect (at -7.705 -0.2 270) (size 0.23 0.66) (layers F.Cu F.Paste F.Mask)
      (net 29 /B2_COMA))
    (pad 19 smd rect (at -4.995 -0.2 90) (size 0.23 0.66) (layers F.Cu F.Paste F.Mask)
      (net 13 /B4_DA))
    (pad 18 smd rect (at -7.705 -0.6 270) (size 0.23 0.66) (layers F.Cu F.Paste F.Mask)
      (net 30 /B1_COMB))
    (pad 17 smd rect (at -4.995 -0.6 90) (size 0.23 0.66) (layers F.Cu F.Paste F.Mask)
      (net 16 /B4_DB))
    (pad 16 smd rect (at -7.705 -1 270) (size 0.23 0.66) (layers F.Cu F.Paste F.Mask)
      (net 22 /T1_COMA))
    (pad 15 smd rect (at -4.995 -1 90) (size 0.23 0.66) (layers F.Cu F.Paste F.Mask)
      (net 12 /B5_DA))
    (pad 14 smd rect (at -7.705 -1.4 270) (size 0.23 0.66) (layers F.Cu F.Paste F.Mask)
      (net 82 /B3_DB))
    (pad 9 smd rect (at -4.995 -2.2 90) (size 0.23 0.66) (layers F.Cu F.Paste F.Mask)
      (net 50 /B4_COMA))
    (pad 8 smd rect (at -7.705 -2.6 270) (size 0.23 0.66) (layers F.Cu F.Paste F.Mask)
      (net 9 /B2_DB))
    (pad 7 smd rect (at -4.995 -2.6 90) (size 0.23 0.66) (layers F.Cu F.Paste F.Mask)
      (net 6 /B1_DAC))
    (pad 6 smd rect (at -7.705 -3 270) (size 0.23 0.66) (layers F.Cu F.Paste F.Mask)
      (net 5 /B2_DAC))
    (pad 5 smd rect (at -4.995 -3 90) (size 0.23 0.66) (layers F.Cu F.Paste F.Mask)
      (net 62 /B5_COMB))
    (pad 4 smd rect (at -7.705 -3.4 270) (size 0.23 0.66) (layers F.Cu F.Paste F.Mask))
    (pad 3 smd rect (at -4.995 -3.4 90) (size 0.23 0.66) (layers F.Cu F.Paste F.Mask)
      (net 49 /B4_COMB))
    (pad 2 smd rect (at -7.705 -3.8 270) (size 0.23 0.66) (layers F.Cu F.Paste F.Mask))
    (pad 1 smd rect (at -4.995 -3.8 90) (size 0.23 0.66) (layers F.Cu F.Paste F.Mask))
    (pad 80 smd rect (at 7.705 -3.8 90) (size 0.23 0.66) (layers F.Cu F.Paste F.Mask)
      (net 1 /VIN))
    (pad 53 smd rect (at 4.995 1.4 270) (size 0.23 0.66) (layers F.Cu F.Paste F.Mask)
      (net 72 /T1_DA))
    (pad 52 smd rect (at 7.705 1.8 90) (size 0.23 0.66) (layers F.Cu F.Paste F.Mask)
      (net 14 /B6_DB))
    (pad 51 smd rect (at 4.995 1.8 270) (size 0.23 0.66) (layers F.Cu F.Paste F.Mask)
      (net 77 /T2_DB))
    (pad 50 smd rect (at 7.705 2.2 90) (size 0.23 0.66) (layers F.Cu F.Paste F.Mask)
      (net 25 /T1_COMB))
    (pad 49 smd rect (at 4.995 2.2 270) (size 0.23 0.66) (layers F.Cu F.Paste F.Mask)
      (net 80 /T2_DC))
    (pad 48 smd rect (at 7.705 2.6 90) (size 0.23 0.66) (layers F.Cu F.Paste F.Mask)
      (net 17 /RST))
    (pad 47 smd rect (at 4.995 2.6 270) (size 0.23 0.66) (layers F.Cu F.Paste F.Mask)
      (net 71 /T2_DA))
    (pad 46 smd rect (at 7.705 3 90) (size 0.23 0.66) (layers F.Cu F.Paste F.Mask)
      (net 26 /B1_COMA))
    (pad 45 smd rect (at 4.995 3 270) (size 0.23 0.66) (layers F.Cu F.Paste F.Mask)
      (net 70 /T3_DA))
    (pad 44 smd rect (at 7.705 3.4 90) (size 0.23 0.66) (layers F.Cu F.Paste F.Mask))
    (pad 43 smd rect (at 4.995 3.4 270) (size 0.23 0.66) (layers F.Cu F.Paste F.Mask)
      (net 76 /T3_DB))
    (pad 42 smd rect (at 7.705 3.8 90) (size 0.23 0.66) (layers F.Cu F.Paste F.Mask))
    (pad 41 smd rect (at 4.995 3.8 270) (size 0.23 0.66) (layers F.Cu F.Paste F.Mask))
    (pad 69 smd rect (at 4.995 -1.8 270) (size 0.23 0.66) (layers F.Cu F.Paste F.Mask))
    (pad 68 smd rect (at 7.705 -1.4 90) (size 0.23 0.66) (layers F.Cu F.Paste F.Mask)
      (net 75 /T4_DB))
    (pad 72 smd rect (at 7.705 -2.2 90) (size 0.23 0.66) (layers F.Cu F.Paste F.Mask)
      (net 85 "Net-(J1-PadP3)"))
    (pad 67 smd rect (at 4.995 -1.4 270) (size 0.23 0.66) (layers F.Cu F.Paste F.Mask)
      (net 18 /USR))
    (pad 66 smd rect (at 7.705 -1 90) (size 0.23 0.66) (layers F.Cu F.Paste F.Mask)
      (net 83 /T4_DC))
    (pad 65 smd rect (at 4.995 -1 270) (size 0.23 0.66) (layers F.Cu F.Paste F.Mask)
      (net 67 /T6_DA))
    (pad 64 smd rect (at 7.705 -0.6 90) (size 0.23 0.66) (layers F.Cu F.Paste F.Mask)
      (net 63 /T5_COMA))
    (pad 63 smd rect (at 4.995 -0.6 270) (size 0.23 0.66) (layers F.Cu F.Paste F.Mask)
      (net 81 /B3_DA))
    (pad 62 smd rect (at 7.705 -0.2 90) (size 0.23 0.66) (layers F.Cu F.Paste F.Mask)
      (net 66 /T5_COMB))
    (pad 61 smd rect (at 4.995 -0.2 270) (size 0.23 0.66) (layers F.Cu F.Paste F.Mask)
      (net 79 /T1_DC))
    (pad 60 smd rect (at 7.705 0.2 90) (size 0.23 0.66) (layers F.Cu F.Paste F.Mask)
      (net 24 /T2_COMA))
    (pad 59 smd rect (at 4.995 0.2 270) (size 0.23 0.66) (layers F.Cu F.Paste F.Mask)
      (net 8 /B1_DA))
    (pad 58 smd rect (at 7.705 0.6 90) (size 0.23 0.66) (layers F.Cu F.Paste F.Mask)
      (net 68 /T5_DA))
    (pad 57 smd rect (at 4.995 0.6 270) (size 0.23 0.66) (layers F.Cu F.Paste F.Mask)
      (net 78 /T1_DB))
    (pad 56 smd rect (at 7.705 1 90) (size 0.23 0.66) (layers F.Cu F.Paste F.Mask)
      (net 74 /T5_DB))
    (pad 55 smd rect (at 4.995 1 270) (size 0.23 0.66) (layers F.Cu F.Paste F.Mask)
      (net 10 /B1_DB))
    (pad 54 smd rect (at 7.705 1.4 90) (size 0.23 0.66) (layers F.Cu F.Paste F.Mask)
      (net 11 /B6_DA))
    (pad 79 smd rect (at 4.995 -3.8 270) (size 0.23 0.66) (layers F.Cu F.Paste F.Mask)
      (net 2 /GND))
    (pad 78 smd rect (at 7.705 -3.4 90) (size 0.23 0.66) (layers F.Cu F.Paste F.Mask)
      (net 1 /VIN))
    (pad 77 smd rect (at 4.995 -3.4 270) (size 0.23 0.66) (layers F.Cu F.Paste F.Mask)
      (net 2 /GND))
    (pad 76 smd rect (at 7.705 -3 90) (size 0.23 0.66) (layers F.Cu F.Paste F.Mask)
      (net 1 /VIN))
    (pad 75 smd rect (at 4.995 -3 270) (size 0.23 0.66) (layers F.Cu F.Paste F.Mask)
      (net 2 /GND))
    (pad 74 smd rect (at 7.705 -2.6 90) (size 0.23 0.66) (layers F.Cu F.Paste F.Mask)
      (net 64 /B6_COMA))
    (pad 73 smd rect (at 4.995 -2.6 270) (size 0.23 0.66) (layers F.Cu F.Paste F.Mask)
      (net 65 /B5_COMA))
    (pad 71 smd rect (at 4.995 -2.2 270) (size 0.23 0.66) (layers F.Cu F.Paste F.Mask)
      (net 73 /T6_DB))
    (pad 70 smd rect (at 7.705 -1.8 90) (size 0.23 0.66) (layers F.Cu F.Paste F.Mask)
      (net 86 "Net-(J1-PadP2)"))
    (model "/Users/lustiga/Dropbox (Personal)/kicad_library/3d/DF40HC_4.0_-40DS.stp"
      (offset (xyz -6.35 -0.125 2.52))
      (scale (xyz 1 1 1))
      (rotate (xyz -90 0 0))
    )
    (model "/Users/lustiga/Dropbox (Personal)/kicad_library/3d/DF40HC_4.0_-40DS.stp"
      (offset (xyz 6.35 -0.125 2.52))
      (scale (xyz 1 1 1))
      (rotate (xyz -90 0 0))
    )
    (model "/Users/lustiga/Dropbox (Personal)/kicad_library/3d/PYBD.stp"
      (offset (xyz 15.85 9.5 4))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 180))
    )
  )
  (module asl_footprints:Converter_DCDC_RECOM_R-78E-0.5_THT (layer F.Cu) (tedit 5CD45440)
    (at 169.291 99.314 270)
    (descr "DCDC-Converter, RECOM, RECOM_R-78E-0.5, SIP-3, pitch 2.54mm, package size 11.6x8.5x10.4mm^3, https://www.recom-power.com/pdf/Innoline/R-78Exx-0.5.pdf")
    (tags "dc-dc recom buck sip-3 pitch 2.54mm")
    (fp_text reference U2 (at -4.483 -2.342129 180) (layer F.SilkS))
    (fp_text value R-78E5.0-1.0 (at 2.54 3 90) (layer F.Fab))
    (fp_text user %R (at 2.54 -2.25 90) (layer F.Fab))
    (pad 3 thru_hole oval (at 5.08 0 270) (size 1.5 2.3) (drill 0.8) (layers *.Cu *.Mask)
      (net 3 /5VDC))
    (pad 2 thru_hole oval (at 2.54 0 270) (size 1.5 2.3) (drill 0.8) (layers *.Cu *.Mask)
      (net 2 /GND))
    (pad 1 thru_hole rect (at 0 0 270) (size 1.5 2.3) (drill 0.8) (layers *.Cu *.Mask)
      (net 4 /12VDC))
    (model ${KISYS3DMOD}/Converter_DCDC.3dshapes/Converter_DCDC_RECOM_R-78E-0.5_THT.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module asl_footprints:SSOP-18_4.4x6.5mm_P0.65mm (layer F.Cu) (tedit 5CBDFC99)
    (at 151.765 87.63 270)
    (descr "SSOP18: plastic shrink small outline package; 18 leads; body width 4.4 mm (http://toshiba.semicon-storage.com/info/docget.jsp?did=30523&prodName=TBD62783APG)")
    (tags "SSOP 0.65")
    (attr smd)
    (fp_text reference U5 (at 0 -4.2 90) (layer F.SilkS))
    (fp_text value TBD62083A (at 0 4.2 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 1 smd rect (at -2.7 -2.6 270) (size 1 0.4) (layers F.Cu F.Paste F.Mask)
      (net 59 /T6_COMA))
    (pad 2 smd rect (at -2.7 -1.95 270) (size 1 0.4) (layers F.Cu F.Paste F.Mask)
      (net 60 /T6_COMB))
    (pad 3 smd rect (at -2.7 -1.3 270) (size 1 0.4) (layers F.Cu F.Paste F.Mask)
      (net 61 /B6_COMB))
    (pad 4 smd rect (at -2.7 -0.65 270) (size 1 0.4) (layers F.Cu F.Paste F.Mask)
      (net 64 /B6_COMA))
    (pad 5 smd rect (at -2.7 0 270) (size 1 0.4) (layers F.Cu F.Paste F.Mask)
      (net 63 /T5_COMA))
    (pad 6 smd rect (at -2.7 0.65 270) (size 1 0.4) (layers F.Cu F.Paste F.Mask)
      (net 62 /B5_COMB))
    (pad 7 smd rect (at -2.7 1.3 270) (size 1 0.4) (layers F.Cu F.Paste F.Mask)
      (net 66 /T5_COMB))
    (pad 8 smd rect (at -2.7 1.95 270) (size 1 0.4) (layers F.Cu F.Paste F.Mask)
      (net 65 /B5_COMA))
    (pad 9 smd rect (at -2.7 2.6 270) (size 1 0.4) (layers F.Cu F.Paste F.Mask)
      (net 2 /GND))
    (pad 18 smd rect (at 2.7 -2.6 270) (size 1 0.4) (layers F.Cu F.Paste F.Mask)
      (net 43 /T6_PA))
    (pad 17 smd rect (at 2.7 -1.95 270) (size 1 0.4) (layers F.Cu F.Paste F.Mask)
      (net 56 /T6_PB))
    (pad 16 smd rect (at 2.7 -1.3 270) (size 1 0.4) (layers F.Cu F.Paste F.Mask)
      (net 57 /B6_PB))
    (pad 15 smd rect (at 2.7 -0.65 270) (size 1 0.4) (layers F.Cu F.Paste F.Mask)
      (net 58 /B6_PA))
    (pad 14 smd rect (at 2.7 0 270) (size 1 0.4) (layers F.Cu F.Paste F.Mask)
      (net 44 /T5_PA))
    (pad 13 smd rect (at 2.7 0.65 270) (size 1 0.4) (layers F.Cu F.Paste F.Mask)
      (net 53 /B5_PB))
    (pad 12 smd rect (at 2.7 1.3 270) (size 1 0.4) (layers F.Cu F.Paste F.Mask)
      (net 54 /T5_PB))
    (pad 11 smd rect (at 2.7 1.95 270) (size 1 0.4) (layers F.Cu F.Paste F.Mask)
      (net 55 /B5_PA))
    (pad 10 smd rect (at 2.7 2.6 270) (size 1 0.4) (layers F.Cu F.Paste F.Mask)
      (net 4 /12VDC))
    (model ${KISYS3DMOD}/Package_SO.3dshapes/SSOP-18_4.4x6.5mm_P0.65mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module asl_footprints:SSOP-18_4.4x6.5mm_P0.65mm (layer F.Cu) (tedit 5CBDFC99)
    (at 142.113 84.455 270)
    (descr "SSOP18: plastic shrink small outline package; 18 leads; body width 4.4 mm (http://toshiba.semicon-storage.com/info/docget.jsp?did=30523&prodName=TBD62783APG)")
    (tags "SSOP 0.65")
    (attr smd)
    (fp_text reference U4 (at 0 -4.2 90) (layer F.SilkS))
    (fp_text value TBD62083A (at 0 4.2 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 1 smd rect (at -2.7 -2.6 270) (size 1 0.4) (layers F.Cu F.Paste F.Mask)
      (net 51 /T4_COMA))
    (pad 2 smd rect (at -2.7 -1.95 270) (size 1 0.4) (layers F.Cu F.Paste F.Mask)
      (net 52 /T4_COMB))
    (pad 3 smd rect (at -2.7 -1.3 270) (size 1 0.4) (layers F.Cu F.Paste F.Mask)
      (net 49 /B4_COMB))
    (pad 4 smd rect (at -2.7 -0.65 270) (size 1 0.4) (layers F.Cu F.Paste F.Mask)
      (net 50 /B4_COMA))
    (pad 5 smd rect (at -2.7 0 270) (size 1 0.4) (layers F.Cu F.Paste F.Mask)
      (net 40 /B3_COMB))
    (pad 6 smd rect (at -2.7 0.65 270) (size 1 0.4) (layers F.Cu F.Paste F.Mask)
      (net 23 /T3_COMA))
    (pad 7 smd rect (at -2.7 1.3 270) (size 1 0.4) (layers F.Cu F.Paste F.Mask)
      (net 41 /T3_COMB))
    (pad 8 smd rect (at -2.7 1.95 270) (size 1 0.4) (layers F.Cu F.Paste F.Mask)
      (net 42 /B3_COMA))
    (pad 9 smd rect (at -2.7 2.6 270) (size 1 0.4) (layers F.Cu F.Paste F.Mask)
      (net 2 /GND))
    (pad 18 smd rect (at 2.7 -2.6 270) (size 1 0.4) (layers F.Cu F.Paste F.Mask)
      (net 45 /T4_PA))
    (pad 17 smd rect (at 2.7 -1.95 270) (size 1 0.4) (layers F.Cu F.Paste F.Mask)
      (net 47 /T4_PB))
    (pad 16 smd rect (at 2.7 -1.3 270) (size 1 0.4) (layers F.Cu F.Paste F.Mask)
      (net 48 /B4_PB))
    (pad 15 smd rect (at 2.7 -0.65 270) (size 1 0.4) (layers F.Cu F.Paste F.Mask)
      (net 46 /B4_PA))
    (pad 14 smd rect (at 2.7 0 270) (size 1 0.4) (layers F.Cu F.Paste F.Mask)
      (net 39 /B3_PB))
    (pad 13 smd rect (at 2.7 0.65 270) (size 1 0.4) (layers F.Cu F.Paste F.Mask)
      (net 19 /T3_PA))
    (pad 12 smd rect (at 2.7 1.3 270) (size 1 0.4) (layers F.Cu F.Paste F.Mask)
      (net 38 /T3_PB))
    (pad 11 smd rect (at 2.7 1.95 270) (size 1 0.4) (layers F.Cu F.Paste F.Mask)
      (net 37 /B3_PA))
    (pad 10 smd rect (at 2.7 2.6 270) (size 1 0.4) (layers F.Cu F.Paste F.Mask)
      (net 4 /12VDC))
    (model ${KISYS3DMOD}/Package_SO.3dshapes/SSOP-18_4.4x6.5mm_P0.65mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module asl_footprints:SSOP-18_4.4x6.5mm_P0.65mm (layer F.Cu) (tedit 5CBDFC99)
    (at 132.461 81.28 270)
    (descr "SSOP18: plastic shrink small outline package; 18 leads; body width 4.4 mm (http://toshiba.semicon-storage.com/info/docget.jsp?did=30523&prodName=TBD62783APG)")
    (tags "SSOP 0.65")
    (attr smd)
    (fp_text reference U3 (at 0 -4.2 90) (layer F.SilkS))
    (fp_text value TBD62083A (at 0 4.2 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 1 smd rect (at -2.7 -2.6 270) (size 1 0.4) (layers F.Cu F.Paste F.Mask)
      (net 27 /B2_COMB))
    (pad 2 smd rect (at -2.7 -1.95 270) (size 1 0.4) (layers F.Cu F.Paste F.Mask)
      (net 24 /T2_COMA))
    (pad 3 smd rect (at -2.7 -1.3 270) (size 1 0.4) (layers F.Cu F.Paste F.Mask)
      (net 28 /T2_COMB))
    (pad 4 smd rect (at -2.7 -0.65 270) (size 1 0.4) (layers F.Cu F.Paste F.Mask)
      (net 29 /B2_COMA))
    (pad 5 smd rect (at -2.7 0 270) (size 1 0.4) (layers F.Cu F.Paste F.Mask)
      (net 30 /B1_COMB))
    (pad 6 smd rect (at -2.7 0.65 270) (size 1 0.4) (layers F.Cu F.Paste F.Mask)
      (net 22 /T1_COMA))
    (pad 7 smd rect (at -2.7 1.3 270) (size 1 0.4) (layers F.Cu F.Paste F.Mask)
      (net 25 /T1_COMB))
    (pad 8 smd rect (at -2.7 1.95 270) (size 1 0.4) (layers F.Cu F.Paste F.Mask)
      (net 26 /B1_COMA))
    (pad 9 smd rect (at -2.7 2.6 270) (size 1 0.4) (layers F.Cu F.Paste F.Mask)
      (net 2 /GND))
    (pad 18 smd rect (at 2.7 -2.6 270) (size 1 0.4) (layers F.Cu F.Paste F.Mask)
      (net 31 /B2_PB))
    (pad 17 smd rect (at 2.7 -1.95 270) (size 1 0.4) (layers F.Cu F.Paste F.Mask)
      (net 20 /T2_PA))
    (pad 16 smd rect (at 2.7 -1.3 270) (size 1 0.4) (layers F.Cu F.Paste F.Mask)
      (net 32 /T2_PB))
    (pad 15 smd rect (at 2.7 -0.65 270) (size 1 0.4) (layers F.Cu F.Paste F.Mask)
      (net 33 /B2_PA))
    (pad 14 smd rect (at 2.7 0 270) (size 1 0.4) (layers F.Cu F.Paste F.Mask)
      (net 34 /B1_PB))
    (pad 13 smd rect (at 2.7 0.65 270) (size 1 0.4) (layers F.Cu F.Paste F.Mask)
      (net 21 /T1_PA))
    (pad 12 smd rect (at 2.7 1.3 270) (size 1 0.4) (layers F.Cu F.Paste F.Mask)
      (net 35 /T1_PB))
    (pad 11 smd rect (at 2.7 1.95 270) (size 1 0.4) (layers F.Cu F.Paste F.Mask)
      (net 36 /B1_PA))
    (pad 10 smd rect (at 2.7 2.6 270) (size 1 0.4) (layers F.Cu F.Paste F.Mask)
      (net 4 /12VDC))
    (model ${KISYS3DMOD}/Package_SO.3dshapes/SSOP-18_4.4x6.5mm_P0.65mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module asl_footprints:6mm_tactile_smd (layer F.Cu) (tedit 5E20F1CD)
    (at 120.015 95.885)
    (descr "Surface Mount Tactile Switch for High-Density Packaging")
    (tags "Tactile Switch")
    (attr smd)
    (fp_text reference S2 (at -4.326 -0.079) (layer F.SilkS))
    (fp_text value B3FS-1010P (at 0 4.5) (layer F.Fab))
    (fp_text user %R (at 0 -4.5) (layer F.Fab))
    (pad 1 smd rect (at 4 2.25) (size 1.4 1.6) (layers F.Cu F.Paste F.Mask)
      (net 2 /GND))
    (pad 2 smd rect (at -4 2.25) (size 1.4 1.6) (layers F.Cu F.Paste F.Mask)
      (net 2 /GND))
    (pad 3 smd rect (at 4 -2.25) (size 1.4 1.6) (layers F.Cu F.Paste F.Mask))
    (pad 4 smd rect (at -4 -2.25) (size 1.4 1.6) (layers F.Cu F.Paste F.Mask)
      (net 17 /RST))
    (model ${KIPRJMOD}/libs/3d/B3FS_1000.step
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module asl_footprints:DIN_Clip (layer F.Cu) (tedit 5DC58284)
    (at 162.941 91.64)
    (fp_text reference DRA2 (at 0 0.5) (layer F.SilkS) hide)
    (fp_text value DIN_Rail_Adapter (at 0 -0.5) (layer F.Fab) hide)
    (pad "" np_thru_hole circle (at 0 12.5) (size 3 3) (drill 3) (layers *.Cu *.Mask))
    (pad "" np_thru_hole circle (at 0 -12.5) (size 3 3) (drill 3) (layers *.Cu *.Mask))
  )
  (module asl_footprints:DIN_Clip (layer F.Cu) (tedit 5DC58284)
    (at 109.093 91.694)
    (fp_text reference DRA1 (at 0 0.5) (layer F.SilkS) hide)
    (fp_text value DIN_Rail_Adapter (at 0 -0.5) (layer F.Fab) hide)
    (pad "" np_thru_hole circle (at 0 12.5) (size 3 3) (drill 3) (layers *.Cu *.Mask))
    (pad "" np_thru_hole circle (at 0 -12.5) (size 3 3) (drill 3) (layers *.Cu *.Mask))
  )
  (module asl_footprints:D_SOD-123F (layer F.Cu) (tedit 5CBDFECB)
    (at 162.433 98.682 270)
    (descr D_SOD-123F)
    (tags D_SOD-123F)
    (attr smd)
    (fp_text reference D1 (at -0.13 -2.032 270) (layer F.SilkS))
    (fp_text value MBR120VLSFT3G (at 0 2.1 90) (layer F.Fab))
    (fp_text user %R (at -0.127 -1.905 90) (layer F.Fab))
    (pad 2 smd rect (at 1.4 0 270) (size 1.1 1.1) (layers F.Cu F.Paste F.Mask)
      (net 3 /5VDC))
    (pad 1 smd rect (at -1.4 0 270) (size 1.1 1.1) (layers F.Cu F.Paste F.Mask)
      (net 1 /VIN))
    (model ${KISYS3DMOD}/Diode_SMD.3dshapes/D_SOD-123F.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_1206_3216Metric (layer F.Cu) (tedit 5B301BBE)
    (at 177.439 105.153 90)
    (descr "Capacitor SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags capacitor)
    (attr smd)
    (fp_text reference C2 (at 3.172 -0.147 180) (layer F.SilkS))
    (fp_text value 10µF (at 0 1.82 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd roundrect (at 1.4 0 90) (size 1.25 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.2)
      (net 2 /GND))
    (pad 1 smd roundrect (at -1.4 0 90) (size 1.25 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.2)
      (net 4 /12VDC))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_1206_3216Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_1206_3216Metric (layer F.Cu) (tedit 5B301BBE)
    (at 159.512 98.682 90)
    (descr "Capacitor SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags capacitor)
    (attr smd)
    (fp_text reference C1 (at 0 -1.82 90) (layer F.SilkS))
    (fp_text value 10µF (at 0 1.82 90) (layer F.Fab))
    (fp_text user %R (at 0 -0.127 90) (layer F.Fab))
    (pad 2 smd roundrect (at 1.4 0 90) (size 1.25 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.2)
      (net 2 /GND))
    (pad 1 smd roundrect (at -1.4 0 90) (size 1.25 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.2)
      (net 3 /5VDC))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_1206_3216Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (gr_text "pyControl D-series\nBreakout 1.6" (at 144.78 74.041) (layer F.SilkS))
  (gr_text Reset (at 120.142 100.838) (layer F.SilkS))
  (gr_text USER (at 119.761 86.36) (layer F.SilkS))
  (gr_line (start 103.759 70.104) (end 103.759 136.652) (layer Edge.Cuts) (width 0.05))
  (gr_line (start 193.929 70.104) (end 103.759 70.104) (layer Edge.Cuts) (width 0.05))
  (gr_line (start 193.929 136.652) (end 193.929 70.104) (layer Edge.Cuts) (width 0.05))
  (gr_line (start 103.759 136.652) (end 193.929 136.652) (layer Edge.Cuts) (width 0.05))
  (zone (net 2) (net_name /GND) (layer F.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.508))
    (min_thickness 0.254)
    (fill yes (arc_segments 32) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 99.187 66.04) (xy 198.12 66.04) (xy 198.008875 141.6685) (xy 99.06 141.732)
      )
    )
  )
  (zone (net 2) (net_name /GND) (layer B.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.508))
    (min_thickness 0.254)
    (fill yes (arc_segments 32) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 100.203 67.31) (xy 196.723 67.31) (xy 196.85 139.7) (xy 100.33 139.7)
      )
    )
  )
)
