(kicad_pcb (version 20171130) (host pcbnew "(5.1.9)-1")
  (general
    (thickness 1.6)
    (drawings 43)
    (tracks 507)
    (zones 0)
    (modules 40)
    (nets 36)
  )
  (page A)
  (layers
    (0 Top signal)
    (31 Bottom signal)
    (34 B.Paste user hide)
    (35 F.Paste user)
    (36 B.SilkS user)
    (37 F.SilkS user)
    (38 B.Mask user hide)
    (39 F.Mask user hide)
    (40 Dwgs.User user hide)
    (41 Cmts.User user hide)
    (44 Edge.Cuts user hide)
    (45 Margin user hide)
    (46 B.CrtYd user hide)
    (47 F.CrtYd user hide)
    (48 B.Fab user hide)
    (49 F.Fab user hide)
  )
  (setup
    (last_trace_width 0.25)
    (trace_clearance 0.1524)
    (zone_clearance 0.508)
    (zone_45_only no)
    (trace_min 0.2)
    (via_size 0.8)
    (via_drill 0.4)
    (via_min_size 0.4)
    (via_min_drill 0.3)
    (uvia_size 0.3)
    (uvia_drill 0.1)
    (uvias_allowed no)
    (uvia_min_size 0.2)
    (uvia_min_drill 0.1)
    (edge_width 0.05)
    (segment_width 0.2)
    (pcb_text_width 0.3)
    (pcb_text_size 1.5 1.5)
    (mod_edge_width 0.12)
    (mod_text_size 1 1)
    (mod_text_width 0.15)
    (pad_size 1.7526 2.6924)
    (pad_drill 0)
    (pad_to_mask_clearance 0)
    (pad_to_paste_clearance -0.0508)
    (aux_axis_origin 126.5681 117.6986)
    (grid_origin 127.8381 112.3646)
    (visible_elements 7FFFFF3F)
    (pcbplotparams
      (layerselection 0x010f8_ffffffff)
      (usegerberextensions true)
      (usegerberattributes true)
      (usegerberadvancedattributes true)
      (creategerberjobfile true)
      (excludeedgelayer true)
      (linewidth 0.100000)
      (plotframeref false)
      (viasonmask false)
      (mode 1)
      (useauxorigin false)
      (hpglpennumber 1)
      (hpglpenspeed 20)
      (hpglpendiameter 15.000000)
      (psnegative false)
      (psa4output false)
      (plotreference true)
      (plotvalue true)
      (plotinvisibletext false)
      (padsonsilk false)
      (subtractmaskfromsilk false)
      (outputformat 1)
      (mirror false)
      (drillshape 0)
      (scaleselection 1)
      (outputdirectory "gerber/"))
  )
  (net 0 "")
  (net 1 GND)
  (net 2 /12V)
  (net 3 /A+)
  (net 4 /B-)
  (net 5 "Net-(J4-Pad18)")
  (net 6 "Net-(J4-Pad14)")
  (net 7 "Net-(J4-Pad12)")
  (net 8 "Net-(J4-Pad10)")
  (net 9 "Net-(J4-Pad9)")
  (net 10 "Net-(J4-Pad8)")
  (net 11 "Net-(J4-Pad7)")
  (net 12 "Net-(J4-Pad5)")
  (net 13 /Vbstin)
  (net 14 /Vbat)
  (net 15 /SDA)
  (net 16 /SCL)
  (net 17 "Net-(U3-Pad6)")
  (net 18 /5Vsw)
  (net 19 /3Von)
  (net 20 +3V0)
  (net 21 /RXp)
  (net 22 /TXp)
  (net 23 /TXb)
  (net 24 /RXb)
  (net 25 /D4_AL)
  (net 26 "Net-(J10-Pad2)")
  (net 27 /LEDB)
  (net 28 "Net-(J4-Pad17)")
  (net 29 "Net-(J4-Pad13)")
  (net 30 "Net-(LED1-Pad2)")
  (net 31 "Net-(LED1-Pad4)")
  (net 32 "Net-(JP1-Pad1)")
  (net 33 /VbatGnd)
  (net 34 "Net-(R9-Pad2)")
  (net 35 "Net-(TP1-Pad1)")
  (net_class Default "This is the default net class."
    (clearance 0.1524)
    (trace_width 0.25)
    (via_dia 0.8)
    (via_drill 0.4)
    (uvia_dia 0.3)
    (uvia_drill 0.1)
    (add_net /3Von)
    (add_net /A+)
    (add_net /B-)
    (add_net /D4_AL)
    (add_net /LEDB)
    (add_net /RXb)
    (add_net /RXp)
    (add_net /SCL)
    (add_net /SDA)
    (add_net /TXb)
    (add_net /TXp)
    (add_net /VbatGnd)
    (add_net "Net-(J10-Pad2)")
    (add_net "Net-(J4-Pad10)")
    (add_net "Net-(J4-Pad12)")
    (add_net "Net-(J4-Pad13)")
    (add_net "Net-(J4-Pad14)")
    (add_net "Net-(J4-Pad17)")
    (add_net "Net-(J4-Pad18)")
    (add_net "Net-(J4-Pad5)")
    (add_net "Net-(J4-Pad7)")
    (add_net "Net-(J4-Pad8)")
    (add_net "Net-(J4-Pad9)")
    (add_net "Net-(JP1-Pad1)")
    (add_net "Net-(LED1-Pad2)")
    (add_net "Net-(LED1-Pad4)")
    (add_net "Net-(R9-Pad2)")
    (add_net "Net-(TP1-Pad1)")
    (add_net "Net-(U3-Pad6)")
  )
  (net_class Power ""
    (clearance 0.1524)
    (trace_width 1)
    (via_dia 0.8)
    (via_drill 0.4)
    (uvia_dia 0.3)
    (uvia_drill 0.1)
    (add_net +3V0)
    (add_net /12V)
    (add_net /5Vsw)
    (add_net /Vbat)
    (add_net /Vbstin)
    (add_net GND)
  )
  (net_class PwrMin ""
    (clearance 0.1524)
    (trace_width 0.5)
    (via_dia 0.8)
    (via_drill 0.4)
    (uvia_dia 0.3)
    (uvia_drill 0.1)
  )
  (module Fiducial:Fiducial_0.75mm_Mask1.5mm (layer Top) (tedit 60429118)
    (at 135.2041 114.6506)
    (descr "Circular Fiducial, 0.75mm bare copper, 1.5mm soldermask opening (Level B)")
    (tags fiducial)
    (attr smd)
    (fp_text reference REF** (at 0 -2) (layer F.SilkS) hide)
    (fp_text value Fiducial_0.75mm_Mask1.5mm (at 0 2) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad "" smd circle (at 0 0) (size 0.75 0.75) (layers Top F.Paste F.Mask)
      (solder_mask_margin 0.375) (clearance 0.375))
  )
  (module Fiducial:Fiducial_0.75mm_Mask1.5mm (layer Top) (tedit 604290D3)
    (at 166.1921 93.3146)
    (descr "Circular Fiducial, 0.75mm bare copper, 1.5mm soldermask opening (Level B)")
    (tags fiducial)
    (attr smd)
    (fp_text reference REF** (at 0 -2) (layer F.SilkS) hide)
    (fp_text value Fiducial_0.75mm_Mask1.5mm (at 0 2) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad "" smd circle (at 0 0) (size 0.75 0.75) (layers Top F.Paste F.Mask)
      (solder_mask_margin 0.375) (clearance 0.375))
  )
  (module Fiducial:Fiducial_0.75mm_Mask1.5mm (layer Top) (tedit 60429124)
    (at 161.8741 116.9366)
    (descr "Circular Fiducial, 0.75mm bare copper, 1.5mm soldermask opening (Level B)")
    (tags fiducial)
    (attr smd)
    (fp_text reference REF** (at 0 -2) (layer F.SilkS) hide)
    (fp_text value Fiducial_0.75mm_Mask1.5mm (at 0 2) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad "" smd circle (at 0 0) (size 0.75 0.75) (layers Top F.Paste F.Mask)
      (solder_mask_margin 0.375) (clearance 0.375))
  )
  (module Fiducial:Fiducial_0.75mm_Mask1.5mm (layer Top) (tedit 604290E6)
    (at 131.1401 93.5686)
    (descr "Circular Fiducial, 0.75mm bare copper, 1.5mm soldermask opening (Level B)")
    (tags fiducial)
    (attr smd)
    (fp_text reference REF** (at 0 -2.032) (layer F.SilkS) hide)
    (fp_text value Fiducial_0.75mm_Mask1.5mm (at 0 2) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad "" smd circle (at 0 0) (size 0.75 0.75) (layers Top F.Paste F.Mask)
      (solder_mask_margin 0.375) (clearance 0.375))
  )
  (module TestPoint:TestPoint_THTPad_1.0x1.0mm_Drill0.5mm (layer Bottom) (tedit 5A0F774F)
    (at 129.1081 109.0626 90)
    (descr "THT rectangular pad as test Point, square 1.0mm side length, hole diameter 0.5mm")
    (tags "test point THT pad rectangle square")
    (attr virtual)
    (fp_text reference TP1 (at 0 1.448 90) (layer B.SilkS))
    (fp_text value TestPoint (at 0 -1.55 90) (layer B.Fab) hide)
    (fp_text user %R (at 0 1.45 90) (layer B.Fab) hide)
    (pad 1 thru_hole rect (at 0 0 90) (size 1 1) (drill 0.5) (layers *.Cu *.Mask)
      (net 35 "Net-(TP1-Pad1)"))
  )
  (module RS485_Mayfly:LED_Kingbright_APBD3224SURKCGKC-F01 (layer Top) (tedit 603E917A)
    (at 156.5909 110.231 180)
    (descr "Kingbright, dual LED, 3.2 x 2.4 mm SMD")
    (tags "dual led smd")
    (attr smd)
    (fp_text reference LED1 (at 0.584 2.3256 180) (layer F.SilkS))
    (fp_text value APBD3224SURKCGKC-F01 (at 0 2.5 180) (layer F.Fab))
    (fp_text user * (at 2.54 0.254 180) (layer F.SilkS))
    (fp_text user %R (at 0 0 180) (layer F.Fab))
    (pad 4 smd rect (at 1.6 -0.7 180) (size 1.6 0.8) (layers Top F.Paste F.Mask)
      (net 31 "Net-(LED1-Pad4)"))
    (pad 1 smd rect (at -1.6 0.7 180) (size 1.6 0.8) (layers Top F.Paste F.Mask)
      (net 20 +3V0))
    (pad 2 smd rect (at 1.6 0.7 180) (size 1.6 0.8) (layers Top F.Paste F.Mask)
      (net 30 "Net-(LED1-Pad2)"))
    (pad 3 smd rect (at -1.6 -0.7 180) (size 1.6 0.8) (layers Top F.Paste F.Mask)
      (net 20 +3V0))
    (model ${KISYS3DMOD}/LED_SMD.3dshapes/LED_Kingbright_AAA3528ESGCT.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder (layer Top) (tedit 5F68FEEE)
    (at 128.7506 110.3326)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R9 (at -0.4045 1.524) (layer F.SilkS))
    (fp_text value 649R (at 0 1.43) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd roundrect (at 0.9125 0) (size 0.975 0.95) (layers Top F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 34 "Net-(R9-Pad2)"))
    (pad 1 smd roundrect (at -0.9125 0) (size 0.975 0.95) (layers Top F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 1 GND))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module RS485_Mayfly:DFN8_3X3X1_STM (layer Top) (tedit 605004EA)
    (at 130.8353 107.2846 90)
    (attr smd)
    (fp_text reference U5 (at -0.0762 2.667 180) (layer F.SilkS))
    (fp_text value STC3100IQT (at 0 0 90) (layer F.SilkS) hide)
    (fp_text user 0.069in/1.753mm (at 0 4.6228 90) (layer Dwgs.User) hide)
    (fp_text user 0.106in/2.692mm (at 3.9878 0 90) (layer Dwgs.User) hide)
    (fp_text user 0.032in/0.813mm (at -1.4732 3.3528 90) (layer Dwgs.User) hide)
    (fp_text user 0.116in/2.946mm (at 0 -3.9878 90) (layer Dwgs.User) hide)
    (fp_text user 0.01in/0.254mm (at 4.5212 -0.75 90) (layer Dwgs.User) hide)
    (fp_text user 0.02in/0.5mm (at -4.5212 -0.5 90) (layer Dwgs.User) hide)
    (fp_text user * (at 0 0 90) (layer F.Fab) hide)
    (fp_text user * (at 0 0 90) (layer F.SilkS) hide)
    (fp_text user "Copyright 2016 Accelerated Designs. All rights reserved." (at 0 0 90) (layer Cmts.User) hide)
    (pad 9 smd rect (at 0 0 90) (size 1.7526 2.6924) (layers Top F.Paste F.Mask)
      (solder_paste_margin_ratio -0.25))
    (pad 8 smd rect (at 1.4732 -0.750001 90) (size 0.8128 0.254) (layers Top F.Paste F.Mask)
      (net 14 /Vbat))
    (pad 7 smd rect (at 1.4732 -0.25 90) (size 0.8128 0.254) (layers Top F.Paste F.Mask)
      (net 14 /Vbat))
    (pad 6 smd rect (at 1.4732 0.25 90) (size 0.8128 0.254) (layers Top F.Paste F.Mask)
      (net 33 /VbatGnd))
    (pad 5 smd rect (at 1.4732 0.750001 90) (size 0.8128 0.254) (layers Top F.Paste F.Mask)
      (net 1 GND))
    (pad 4 smd rect (at -1.4732 0.750001 90) (size 0.8128 0.254) (layers Top F.Paste F.Mask)
      (net 16 /SCL))
    (pad 3 smd rect (at -1.4732 0.25 90) (size 0.8128 0.254) (layers Top F.Paste F.Mask)
      (net 15 /SDA))
    (pad 2 smd rect (at -1.4732 -0.25 90) (size 0.8128 0.254) (layers Top F.Paste F.Mask)
      (net 34 "Net-(R9-Pad2)"))
    (pad 1 smd rect (at -1.4732 -0.750001 90) (size 0.8128 0.254) (layers Top F.Paste F.Mask)
      (net 35 "Net-(TP1-Pad1)"))
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder (layer Top) (tedit 5F68FEEE)
    (at 127.8381 107.8961 90)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R5 (at 1.6275 0) (layer F.SilkS))
    (fp_text value 30mOhm (at 0 1.43 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd roundrect (at 0.9125 0 90) (size 0.975 0.95) (layers Top F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 33 /VbatGnd))
    (pad 1 smd roundrect (at -0.9125 0 90) (size 0.975 0.95) (layers Top F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 1 GND))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder (layer Top) (tedit 5F68FEEE)
    (at 148.2616 110.6374)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R8 (at -0.5607 -1.2192) (layer F.SilkS))
    (fp_text value "Fuse 100/250mA" (at 0 1.43) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd roundrect (at 0.9125 0) (size 0.975 0.95) (layers Top F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 32 "Net-(JP1-Pad1)"))
    (pad 1 smd roundrect (at -0.9125 0) (size 0.975 0.95) (layers Top F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 2 /12V))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module RS485_Mayfly:POLOLU_REG (layer Bottom) (tedit 0)
    (at 149.3265 106.2178 90)
    (fp_text reference U2 (at 0 0 270) (layer B.SilkS) hide)
    (fp_text value "12v Boost" (at 0 0 270) (layer B.SilkS) hide)
    (fp_text user "Pololu\nVReg" (at 0 6.35 270) (layer B.SilkS))
    (pad VOUT thru_hole circle (at -2.54 0 90) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask)
      (net 32 "Net-(JP1-Pad1)") (solder_mask_margin 0.1016))
    (pad GND thru_hole circle (at 0 0 90) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask)
      (net 1 GND) (solder_mask_margin 0.1016))
    (pad VIN thru_hole circle (at 2.54 0 90) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask)
      (net 13 /Vbstin) (solder_mask_margin 0.1016))
  )
  (module RS485_Mayfly:2.0_1X4 (layer Top) (tedit 0)
    (at 136.6011 98.7756 180)
    (fp_text reference J1 (at -5.3214 -0.7924) (layer F.Mask))
    (fp_text value TWIG-2.0-DIP (at -1.7019 -1.9354 180) (layer F.Fab) hide)
    (pad 4 thru_hole circle (at 3 0 180) (size 1.27 1.27) (drill 0.8) (layers *.Cu *.Mask)
      (net 1 GND) (solder_mask_margin 0.1016))
    (pad 3 thru_hole circle (at 1 0 180) (size 1.27 1.27) (drill 0.8) (layers *.Cu *.Mask)
      (net 2 /12V) (solder_mask_margin 0.1016))
    (pad 2 thru_hole circle (at -1 0 180) (size 1.27 1.27) (drill 0.8) (layers *.Cu *.Mask)
      (net 4 /B-) (solder_mask_margin 0.1016))
    (pad 1 thru_hole rect (at -3 0 180) (size 1.27 1.27) (drill 0.8) (layers *.Cu *.Mask)
      (net 3 /A+) (solder_mask_margin 0.1016))
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder (layer Top) (tedit 5F68FEEE)
    (at 152.0697 108.199)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R7 (at -0.2051 -1.27) (layer F.SilkS))
    (fp_text value 62R (at 0 1.43) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd roundrect (at 0.9125 0) (size 0.975 0.95) (layers Top F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 31 "Net-(LED1-Pad4)"))
    (pad 1 smd roundrect (at -0.9125 0) (size 0.975 0.95) (layers Top F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 24 /RXb))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder (layer Top) (tedit 5F68FEEE)
    (at 151.6652 110.8914)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R6 (at -0.1543 -1.4224) (layer F.SilkS))
    (fp_text value 120R (at 0 1.43) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd roundrect (at 0.9125 0) (size 0.975 0.95) (layers Top F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 30 "Net-(LED1-Pad2)"))
    (pad 1 smd roundrect (at -0.9125 0) (size 0.975 0.95) (layers Top F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 23 /TXb))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Connector_PinHeader_2.00mm:PinHeader_1x02_P2.00mm_Vertical (layer Top) (tedit 5FC4524B)
    (at 168.275 115.5065 270)
    (descr "Through hole straight pin header, 1x02, 2.00mm pitch, single row")
    (tags "Through hole pin header THT 1x02 2.00mm single row")
    (fp_text reference J10 (at 1.524 -0.127 180) (layer F.SilkS))
    (fp_text value "2mm jumper" (at 0 4.06 90) (layer F.Fab))
    (fp_text user %R (at 0 1) (layer F.Fab))
    (pad 2 thru_hole oval (at 0 2 270) (size 1.35 1.35) (drill 0.8) (layers *.Cu *.Mask)
      (net 26 "Net-(J10-Pad2)"))
    (pad 1 thru_hole rect (at 0 0 270) (size 1.35 1.35) (drill 0.8) (layers *.Cu *.Mask)
      (net 4 /B-))
    (model ${KISYS3DMOD}/Connector_PinHeader_2.00mm.3dshapes/PinHeader_1x02_P2.00mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric (layer Top) (tedit 5F68FEEE)
    (at 145.415 108.966 180)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags capacitor)
    (attr smd)
    (fp_text reference C7 (at -0.889 1.524) (layer F.SilkS))
    (fp_text value u1F/0603 (at 0 1.43) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd roundrect (at 0.775 0 180) (size 0.9 0.95) (layers Top F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 20 +3V0))
    (pad 1 smd roundrect (at -0.775 0 180) (size 0.9 0.95) (layers Top F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 1 GND))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module "RS485_Mayfly:SC-70-6_DCK(R-PDSO-G6)" (layer Top) (tedit 0)
    (at 141.876998 108.9025)
    (attr smd)
    (fp_text reference U4 (at -2.748498 0.0635) (layer F.SilkS))
    (fp_text value SN74LVC2G34DCK3 (at 0 0) (layer F.SilkS) hide)
    (fp_text user Designator9 (at -1.651 -2.3876) (layer F.SilkS) hide)
    (fp_text user .Designator (at -0.0508 -0.6604 270) (layer Dwgs.User) hide)
    (fp_text user .Designator (at -0.0508 -0.6604 270) (layer F.Fab) hide)
    (fp_text user * (at 0 0) (layer F.Fab) hide)
    (fp_text user * (at 0 0) (layer F.SilkS) hide)
    (fp_text user "Copyright 2016 Accelerated Designs. All rights reserved." (at 0 0) (layer Cmts.User) hide)
    (pad 6 smd rect (at 1.125002 -0.650001 90) (size 0.399999 0.850001) (layers Top F.Paste F.Mask)
      (net 23 /TXb))
    (pad 5 smd rect (at 1.125002 0 90) (size 0.399999 0.850001) (layers Top F.Paste F.Mask)
      (net 20 +3V0))
    (pad 4 smd rect (at 1.125002 0.649999 90) (size 0.399999 0.850001) (layers Top F.Paste F.Mask)
      (net 21 /RXp))
    (pad 3 smd rect (at -1.124999 0.649999 90) (size 0.399999 0.850001) (layers Top F.Paste F.Mask)
      (net 24 /RXb))
    (pad 2 smd rect (at -1.124999 0 90) (size 0.399999 0.850001) (layers Top F.Paste F.Mask)
      (net 1 GND))
    (pad 1 smd rect (at -1.124999 -0.650001 90) (size 0.399999 0.850001) (layers Top F.Paste F.Mask)
      (net 22 /TXp))
  )
  (module Capacitor_SMD:C_0603_1608Metric (layer Top) (tedit 5F68FEEE)
    (at 129.8571 103.4746)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags capacitor)
    (attr smd)
    (fp_text reference C6 (at 2.045 0.254) (layer F.SilkS))
    (fp_text value u1F/0603 (at 0 1.43) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd roundrect (at 0.775 0) (size 0.9 0.95) (layers Top F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 14 /Vbat))
    (pad 1 smd roundrect (at -0.775 0) (size 0.9 0.95) (layers Top F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 1 GND))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric (layer Top) (tedit 5F68FEEE)
    (at 167.132 101.46 270)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags capacitor)
    (attr smd)
    (fp_text reference C5 (at -0.368 -1.524 90) (layer F.SilkS))
    (fp_text value u1F/0603 (at 0 1.43 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd roundrect (at 0.775 0 270) (size 0.9 0.95) (layers Top F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 18 /5Vsw))
    (pad 1 smd roundrect (at -0.775 0 270) (size 0.9 0.95) (layers Top F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 1 GND))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric (layer Top) (tedit 5F68FEEE)
    (at 163.6391 110.3834)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags capacitor)
    (attr smd)
    (fp_text reference C4 (at -0.3934 1.3716) (layer F.SilkS))
    (fp_text value u1F/0603 (at 0 1.43) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd roundrect (at 0.775 0) (size 0.9 0.95) (layers Top F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 1 GND))
    (pad 1 smd roundrect (at -0.775 0) (size 0.9 0.95) (layers Top F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 20 +3V0))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric (layer Top) (tedit 5F68FEEE)
    (at 137.554 106.299 180)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags capacitor)
    (attr smd)
    (fp_text reference C3 (at 0 -1.43) (layer F.SilkS))
    (fp_text value 1uF/0603 (at 0 1.43) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd roundrect (at 0.775 0 180) (size 0.9 0.95) (layers Top F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 1 GND))
    (pad 1 smd roundrect (at -0.775 0 180) (size 0.9 0.95) (layers Top F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 13 /Vbstin))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric (layer Top) (tedit 5F68FEEE)
    (at 135.0517 104.5544 270)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags capacitor)
    (attr smd)
    (fp_text reference C2 (at 0.0505 1.27 90) (layer F.SilkS))
    (fp_text value u1F/0603 (at 0 1.43 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd roundrect (at 0.775 0 270) (size 0.9 0.95) (layers Top F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 1 GND))
    (pad 1 smd roundrect (at -0.775 0 270) (size 0.9 0.95) (layers Top F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 14 /Vbat))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder (layer Top) (tedit 5F68FEEE)
    (at 163.7665 115.0855 270)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R4 (at 0.04 1.5875 270) (layer F.SilkS))
    (fp_text value 120R (at 0 1.43 270) (layer F.Fab) hide)
    (fp_text user %R (at 0 0 270) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 0.9125 0 270) (size 0.975 0.95) (layers Top F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 26 "Net-(J10-Pad2)"))
    (pad 1 smd roundrect (at -0.9125 0 270) (size 0.975 0.95) (layers Top F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 3 /A+))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder (layer Top) (tedit 5F68FEEE)
    (at 167.3371 113.2078)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R3 (at -2.5546 -0.0508) (layer F.SilkS))
    (fp_text value 649R (at 0 1.43) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd roundrect (at 0.9125 0) (size 0.975 0.95) (layers Top F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 3 /A+))
    (pad 1 smd roundrect (at -0.9125 0) (size 0.975 0.95) (layers Top F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 18 /5Vsw))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder (layer Top) (tedit 5F68FEEE)
    (at 167.386 111.0361)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R2 (at 1.7525 -1.2115) (layer F.SilkS))
    (fp_text value 649R (at 0 1.43) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd roundrect (at 0.9125 0) (size 0.975 0.95) (layers Top F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 4 /B-))
    (pad 1 smd roundrect (at -0.9125 0) (size 0.975 0.95) (layers Top F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 1 GND))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Connector_Pin:Pin_D1.0mm_L10.0mm_LooseFit (layer Top) (tedit 5A1DC085)
    (at 168.8337 93.9242)
    (descr "solder Pin_ diameter 1.0mm, hole diameter 1.2mm (loose fit), length 10.0mm")
    (tags "solder Pin_ loose fit")
    (fp_text reference J11 (at -0.3556 2.6416) (layer F.SilkS))
    (fp_text value "GND Wire" (at 0 -2.05) (layer F.Fab))
    (fp_text user %R (at 0 2.25) (layer F.Fab))
    (pad 1 thru_hole circle (at 0 0) (size 2.4 2.4) (drill 1.2) (layers *.Cu *.Mask)
      (net 1 GND))
    (model ${KISYS3DMOD}/Connector_Pin.3dshapes/Pin_D1.0mm_L10.0mm_LooseFit.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module RS485_Mayfly:B2B-PH-K-SLFSN (layer Top) (tedit 0)
    (at 131.1401 115.380601 270)
    (fp_text reference J9 (at -5.0165 -2.54 180) (layer F.SilkS))
    (fp_text value Conn_01x02 (at -1 0 90) (layer F.SilkS) hide)
    (fp_text user * (at 0 0 90) (layer F.Fab) hide)
    (fp_text user * (at 0 0 90) (layer F.SilkS) hide)
    (fp_text user "Copyright 2016 Accelerated Designs. All rights reserved." (at 0 0 90) (layer Cmts.User) hide)
    (pad 2 thru_hole circle (at -2.000001 0 270) (size 1.3208 1.3208) (drill 0.8128) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 1 thru_hole circle (at 0.000001 0 270) (size 1.3208 1.3208) (drill 0.8128) (layers *.Cu *.Mask)
      (net 14 /Vbat))
  )
  (module RS485_Mayfly:E2,5-6E (layer Bottom) (tedit 0)
    (at 143.0781 104.9986 270)
    (descr "<b>ELECTROLYTIC CAPACITOR</b><p>\ngrid 2.54 mm, diameter 6 mm")
    (fp_text reference C1 (at 2.667 1.524 90) (layer B.SilkS))
    (fp_text value CPOL-EUE2,5-6E (at 2.667 -2.54 90) (layer B.Fab) hide)
    (pad + thru_hole circle (at -1.27 0 270) (size 1.5748 1.5748) (drill 0.8128) (layers *.Cu *.Mask)
      (net 13 /Vbstin) (solder_mask_margin 0.1016))
    (pad - thru_hole circle (at 1.27 0 270) (size 1.5748 1.5748) (drill 0.8128) (layers *.Cu *.Mask)
      (net 1 GND) (solder_mask_margin 0.1016))
  )
  (module RS485_Mayfly:B2B-PH-K-SLFSN (layer Top) (tedit 0)
    (at 128.6001 99.9186 270)
    (fp_text reference J8 (at -4.953 -2.2352) (layer F.SilkS))
    (fp_text value Conn_01x02 (at -1 0 90) (layer F.SilkS) hide)
    (fp_text user * (at 0 0 90) (layer F.Fab))
    (fp_text user * (at 0 0 90) (layer F.SilkS))
    (fp_text user "Copyright 2016 Accelerated Designs. All rights reserved." (at 0 0 90) (layer Cmts.User))
    (pad 2 thru_hole circle (at -2.000001 0 270) (size 1.3208 1.3208) (drill 0.8128) (layers *.Cu *.Mask)
      (net 33 /VbatGnd))
    (pad 1 thru_hole circle (at 0.000001 0 270) (size 1.3208 1.3208) (drill 0.8128) (layers *.Cu *.Mask)
      (net 14 /Vbat))
  )
  (module RS485_Mayfly:MAX22025AWA&plus_ (layer Top) (tedit 5FA1A8BF)
    (at 162.8394 106.045)
    (fp_text reference U1 (at -5.4865 -0.894) (layer F.SilkS))
    (fp_text value MAX22025AWA+ (at 0 0) (layer F.SilkS) hide)
    (fp_text user * (at -2.3241 -2.6543) (layer F.Fab))
    (fp_text user * (at -5.1308 -1.6256) (layer F.SilkS))
    (fp_text user 0.058in/1.473mm (at -3.6576 5.1435) (layer Dwgs.User) hide)
    (fp_text user 0.288in/7.315mm (at 0 -5.1435) (layer Dwgs.User) hide)
    (fp_text user 0.022in/0.559mm (at 6.7056 -1.905) (layer Dwgs.User) hide)
    (fp_text user 0.05in/1.27mm (at -6.7056 -1.27) (layer Dwgs.User) hide)
    (fp_text user * (at -2.3241 -2.6543) (layer F.Fab))
    (fp_text user "Copyright 2016 Accelerated Designs. All rights reserved." (at 0 0) (layer Cmts.User))
    (pad 8 smd rect (at 3.6576 -1.905) (size 1.4732 0.5588) (layers Top F.Paste F.Mask)
      (net 18 /5Vsw))
    (pad 7 smd rect (at 3.6576 -0.635) (size 1.4732 0.5588) (layers Top F.Paste F.Mask)
      (net 4 /B-))
    (pad 6 smd rect (at 3.6576 0.635) (size 1.4732 0.5588) (layers Top F.Paste F.Mask)
      (net 3 /A+))
    (pad 5 smd rect (at 3.6576 1.905) (size 1.4732 0.5588) (layers Top F.Paste F.Mask)
      (net 1 GND))
    (pad 4 smd rect (at -3.6576 1.905) (size 1.4732 0.5588) (layers Top F.Paste F.Mask)
      (net 1 GND))
    (pad 3 smd rect (at -3.6576 0.635) (size 1.4732 0.5588) (layers Top F.Paste F.Mask)
      (net 20 +3V0))
    (pad 2 smd rect (at -3.6576 -0.635) (size 1.4732 0.5588) (layers Top F.Paste F.Mask)
      (net 23 /TXb))
    (pad 1 smd rect (at -3.6576 -1.905) (size 1.4732 0.5588) (layers Top F.Paste F.Mask)
      (net 24 /RXb))
  )
  (module Package_TO_SOT_SMD:SOT-363_SC-70-6 (layer Top) (tedit 5FA1E9D3)
    (at 137.668 104.013 180)
    (descr "SOT-363, SC-70-6")
    (tags "SOT-363 SC-70-6")
    (attr smd)
    (fp_text reference U3 (at -3.175 -0.127) (layer F.SilkS))
    (fp_text value "SiP32431DR3 0.1mS TurnOn" (at -0.32 2.286 180) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab) hide)
    (pad 6 smd rect (at 0.95 -0.65 180) (size 0.65 0.4) (layers Top F.Paste F.Mask)
      (net 17 "Net-(U3-Pad6)"))
    (pad 4 smd rect (at 0.95 0.65 180) (size 0.65 0.4) (layers Top F.Paste F.Mask)
      (net 14 /Vbat))
    (pad 2 smd rect (at -0.95 0 180) (size 0.65 0.4) (layers Top F.Paste F.Mask)
      (net 1 GND))
    (pad 5 smd rect (at 0.95 0 180) (size 0.65 0.4) (layers Top F.Paste F.Mask)
      (net 1 GND))
    (pad 3 smd rect (at -0.95 0.65 180) (size 0.65 0.4) (layers Top F.Paste F.Mask)
      (net 20 +3V0))
    (pad 1 smd rect (at -0.95 -0.65 180) (size 0.65 0.4) (layers Top F.Paste F.Mask)
      (net 13 /Vbstin))
    (model ${KISYS3DMOD}/Package_TO_SOT_SMD.3dshapes/SOT-363_SC-70-6.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module RS485_Mayfly:2.0_1X4 (layer Top) (tedit 0)
    (at 148.5391 98.7756 180)
    (fp_text reference J2 (at -5.1944 -0.7924) (layer F.Mask))
    (fp_text value TWIG-2.0-DIP (at -5.08 -3.81 180) (layer F.Fab) hide)
    (pad 4 thru_hole circle (at 3 0 180) (size 1.27 1.27) (drill 0.8) (layers *.Cu *.Mask)
      (net 1 GND) (solder_mask_margin 0.1016))
    (pad 3 thru_hole circle (at 1 0 180) (size 1.27 1.27) (drill 0.8) (layers *.Cu *.Mask)
      (net 2 /12V) (solder_mask_margin 0.1016))
    (pad 2 thru_hole circle (at -1 0 180) (size 1.27 1.27) (drill 0.8) (layers *.Cu *.Mask)
      (net 4 /B-) (solder_mask_margin 0.1016))
    (pad 1 thru_hole rect (at -3 0 180) (size 1.27 1.27) (drill 0.8) (layers *.Cu *.Mask)
      (net 3 /A+) (solder_mask_margin 0.1016))
  )
  (module RS485_Mayfly:2X10 locked (layer Bottom) (tedit 0)
    (at 136.9821 113.1266)
    (descr "<h3>Plated Through Hole - 2x10</h3>\n<p>Specifications:\n<ul><li>Pin count:20</li>\n<li>Pin pitch:0.1\"</li>\n</ul></p>\n<p>Example device(s):\n<ul><li>CONN_10x2</li>\n</ul></p>")
    (solder_paste_margin -0.5)
    (fp_text reference J4 (at -2.413 3.302) (layer B.SilkS))
    (fp_text value CONN_10X2 (at -1.27 -2.413) (layer B.Fab))
    (pad 20 thru_hole circle (at 22.86 2.54) (size 1.8796 1.8796) (drill 1.016) (layers *.Cu *.Mask)
      (net 20 +3V0) (solder_mask_margin 0.1016))
    (pad 19 thru_hole circle (at 22.86 0) (size 1.8796 1.8796) (drill 1.016) (layers *.Cu *.Mask)
      (net 18 /5Vsw) (solder_mask_margin 0.1016))
    (pad 18 thru_hole circle (at 20.32 2.54) (size 1.8796 1.8796) (drill 1.016) (layers *.Cu *.Mask)
      (net 5 "Net-(J4-Pad18)") (solder_mask_margin 0.1016))
    (pad 17 thru_hole circle (at 20.32 0) (size 1.8796 1.8796) (drill 1.016) (layers *.Cu *.Mask)
      (net 28 "Net-(J4-Pad17)") (solder_mask_margin 0.1016))
    (pad 16 thru_hole circle (at 17.78 2.54) (size 1.8796 1.8796) (drill 1.016) (layers *.Cu *.Mask)
      (net 15 /SDA) (solder_mask_margin 0.1016))
    (pad 15 thru_hole circle (at 17.78 0) (size 1.8796 1.8796) (drill 1.016) (layers *.Cu *.Mask)
      (net 16 /SCL) (solder_mask_margin 0.1016))
    (pad 14 thru_hole circle (at 15.24 2.54) (size 1.8796 1.8796) (drill 1.016) (layers *.Cu *.Mask)
      (net 6 "Net-(J4-Pad14)") (solder_mask_margin 0.1016))
    (pad 13 thru_hole circle (at 15.24 0) (size 1.8796 1.8796) (drill 1.016) (layers *.Cu *.Mask)
      (net 29 "Net-(J4-Pad13)") (solder_mask_margin 0.1016))
    (pad 12 thru_hole circle (at 12.7 2.54) (size 1.8796 1.8796) (drill 1.016) (layers *.Cu *.Mask)
      (net 7 "Net-(J4-Pad12)") (solder_mask_margin 0.1016))
    (pad 11 thru_hole circle (at 12.7 0) (size 1.8796 1.8796) (drill 1.016) (layers *.Cu *.Mask)
      (net 27 /LEDB) (solder_mask_margin 0.1016))
    (pad 10 thru_hole circle (at 10.16 2.54) (size 1.8796 1.8796) (drill 1.016) (layers *.Cu *.Mask)
      (net 8 "Net-(J4-Pad10)") (solder_mask_margin 0.1016))
    (pad 9 thru_hole circle (at 10.16 0) (size 1.8796 1.8796) (drill 1.016) (layers *.Cu *.Mask)
      (net 9 "Net-(J4-Pad9)") (solder_mask_margin 0.1016))
    (pad 8 thru_hole circle (at 7.62 2.54) (size 1.8796 1.8796) (drill 1.016) (layers *.Cu *.Mask)
      (net 10 "Net-(J4-Pad8)") (solder_mask_margin 0.1016))
    (pad 7 thru_hole circle (at 7.62 0) (size 1.8796 1.8796) (drill 1.016) (layers *.Cu *.Mask)
      (net 11 "Net-(J4-Pad7)") (solder_mask_margin 0.1016))
    (pad 6 thru_hole circle (at 5.08 2.54) (size 1.8796 1.8796) (drill 1.016) (layers *.Cu *.Mask)
      (net 21 /RXp) (solder_mask_margin 0.1016))
    (pad 5 thru_hole circle (at 5.08 0) (size 1.8796 1.8796) (drill 1.016) (layers *.Cu *.Mask)
      (net 12 "Net-(J4-Pad5)") (solder_mask_margin 0.1016))
    (pad 4 thru_hole circle (at 2.54 2.54) (size 1.8796 1.8796) (drill 1.016) (layers *.Cu *.Mask)
      (net 25 /D4_AL) (solder_mask_margin 0.1016))
    (pad 3 thru_hole circle (at 2.54 0) (size 1.8796 1.8796) (drill 1.016) (layers *.Cu *.Mask)
      (net 22 /TXp) (solder_mask_margin 0.1016))
    (pad 2 thru_hole circle (at 0 2.54) (size 1.8796 1.8796) (drill 1.016) (layers *.Cu *.Mask)
      (net 19 /3Von) (solder_mask_margin 0.1016))
    (pad 1 thru_hole circle (at 0 0) (size 1.8796 1.8796) (drill 1.016) (layers *.Cu *.Mask)
      (net 1 GND) (solder_mask_margin 0.1016))
  )
  (module RS485_Mayfly:2.0_1X4 (layer Top) (tedit 0)
    (at 160.4771 98.7756 180)
    (fp_text reference J3 (at -5.5754 -0.2844) (layer F.Mask))
    (fp_text value TWIG-2.0-DIP (at -5.08 -3.81 180) (layer F.Fab) hide)
    (pad 4 thru_hole circle (at 3 0 180) (size 1.27 1.27) (drill 0.8) (layers *.Cu *.Mask)
      (net 1 GND) (solder_mask_margin 0.1016))
    (pad 3 thru_hole circle (at 1 0 180) (size 1.27 1.27) (drill 0.8) (layers *.Cu *.Mask)
      (net 2 /12V) (solder_mask_margin 0.1016))
    (pad 2 thru_hole circle (at -1 0 180) (size 1.27 1.27) (drill 0.8) (layers *.Cu *.Mask)
      (net 4 /B-) (solder_mask_margin 0.1016))
    (pad 1 thru_hole rect (at -3 0 180) (size 1.27 1.27) (drill 0.8) (layers *.Cu *.Mask)
      (net 3 /A+) (solder_mask_margin 0.1016))
  )
  (module RS485_Mayfly:1X04_NOSILK (layer Top) (tedit 0)
    (at 136.6011 95.8546 180)
    (descr "<h3>Plated Through Hole - 4 Pin</h3>\n<p>Specifications:\n<ul><li>Pin count:4</li>\n<li>Pin pitch:0.1\"</li>\n</ul></p>\n<p>Example device(s):\n<ul><li>CONN_04</li>\n</ul></p>")
    (fp_text reference J5 (at -1.27 -1.397 180) (layer F.SilkS) hide)
    (fp_text value CONN_42.54_NOSILK (at -1.27 2.032 180) (layer F.Fab) hide)
    (pad 4 thru_hole circle (at 3.81 0 270) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask)
      (net 1 GND) (solder_mask_margin 0.1016))
    (pad 3 thru_hole circle (at 1.27 0 270) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask)
      (net 2 /12V) (solder_mask_margin 0.1016))
    (pad 2 thru_hole circle (at -1.27 0 270) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask)
      (net 4 /B-) (solder_mask_margin 0.1016))
    (pad 1 thru_hole circle (at -3.81 0 270) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask)
      (net 3 /A+) (solder_mask_margin 0.1016))
  )
  (module RS485_Mayfly:1X04_NOSILK (layer Top) (tedit 0)
    (at 148.5391 95.8546 180)
    (descr "<h3>Plated Through Hole - 4 Pin</h3>\n<p>Specifications:\n<ul><li>Pin count:4</li>\n<li>Pin pitch:0.1\"</li>\n</ul></p>\n<p>Example device(s):\n<ul><li>CONN_04</li>\n</ul></p>")
    (fp_text reference J6 (at -1.27 -1.397 180) (layer F.SilkS) hide)
    (fp_text value CONN_42.54_NOSILK (at -1.27 2.032 180) (layer F.Fab) hide)
    (pad 4 thru_hole circle (at 3.81 0 270) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask)
      (net 1 GND) (solder_mask_margin 0.1016))
    (pad 3 thru_hole circle (at 1.27 0 270) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask)
      (net 2 /12V) (solder_mask_margin 0.1016))
    (pad 2 thru_hole circle (at -1.27 0 270) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask)
      (net 4 /B-) (solder_mask_margin 0.1016))
    (pad 1 thru_hole circle (at -3.81 0 270) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask)
      (net 3 /A+) (solder_mask_margin 0.1016))
  )
  (module RS485_Mayfly:1X04_NOSILK (layer Top) (tedit 0)
    (at 160.4771 95.8546 180)
    (descr "<h3>Plated Through Hole - 4 Pin</h3>\n<p>Specifications:\n<ul><li>Pin count:4</li>\n<li>Pin pitch:0.1\"</li>\n</ul></p>\n<p>Example device(s):\n<ul><li>CONN_04</li>\n</ul></p>")
    (fp_text reference J7 (at -1.27 -1.397 180) (layer F.SilkS) hide)
    (fp_text value CONN_42.54_NOSILK (at -1.27 2.032 180) (layer F.Fab) hide)
    (pad 4 thru_hole circle (at 3.81 0 270) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask)
      (net 1 GND) (solder_mask_margin 0.1016))
    (pad 3 thru_hole circle (at 1.27 0 270) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask)
      (net 2 /12V) (solder_mask_margin 0.1016))
    (pad 2 thru_hole circle (at -1.27 0 270) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask)
      (net 4 /B-) (solder_mask_margin 0.1016))
    (pad 1 thru_hole circle (at -3.81 0 270) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask)
      (net 3 /A+) (solder_mask_margin 0.1016))
  )
  (module RS485_Mayfly:SMT-JUMPER_2_NO_SILK (layer Bottom) (tedit 0)
    (at 152.2221 106.2686 90)
    (fp_text reference JP1 (at -2.159 0 180) (layer B.SilkS))
    (fp_text value JUMPER-SMT_2_NO_SILK (at 0 -1.143 90) (layer B.Fab) hide)
    (pad 2 smd rect (at 0.4064 0 90) (size 0.635 1.27) (layers Bottom B.Mask)
      (net 18 /5Vsw) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.4064 0 90) (size 0.635 1.27) (layers Bottom B.Mask)
      (net 32 "Net-(JP1-Pad1)") (solder_mask_margin 0.1016))
  )
  (module RS485_Mayfly:OSHW-LOGO-MINI (layer Top) (tedit 0)
    (at 136.652 109.855)
    (descr "<h3>Open-Source Hardware (OSHW) Logo - Mini - Silkscreen</h3>\n<p>Silkscreen logo for open-source hardware designs.</p>\n<p>Devices using:\n<ul><li>OSHW_LOGO</li></ul></p>")
    (fp_text reference LOGO1 (at 0 0) (layer F.SilkS) hide)
    (fp_text value OSHW-LOGOMINI (at 0 0) (layer F.SilkS) hide)
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder (layer Top) (tedit 5F68FEEE)
    (at 152.1695 104.013 180)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R1 (at -2.6435 0.889) (layer F.SilkS))
    (fp_text value zero (at 0 1.43) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 1 smd roundrect (at -0.9125 0 180) (size 0.975 0.95) (layers Top F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 18 /5Vsw))
    (pad 2 smd roundrect (at 0.9125 0 180) (size 0.975 0.95) (layers Top F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 13 /Vbstin))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (gr_text May (at 128.0921 114.9046 -90) (layer F.SilkS))
  (gr_text + (at 132.2577 116.4794 270) (layer B.SilkS))
  (gr_text + (at 135.2041 116.6826 270) (layer F.SilkS))
  (gr_text + (at 127.2285 101.2902 270) (layer B.SilkS))
  (gr_text + (at 129.3621 104.4906 270) (layer F.SilkS))
  (gr_text * (at 153.5937 110.7898) (layer F.SilkS))
  (gr_text Battery (at 131.1401 97.3786 270) (layer B.SilkS))
  (gr_text Bat (at 127.5841 103.7286 270) (layer F.SilkS))
  (gr_text Mayfly (at 128.6001 113.3806 270) (layer B.SilkS))
  (gr_text * (at 140.335 107.696) (layer F.SilkS))
  (gr_text "KNH002r6\nMayfly RS485" (at 166.8145 106.426 90) (layer B.SilkS))
  (gr_text "G V B A" (at 136.4741 101.1886 180) (layer B.SilkS))
  (gr_text "G V B A" (at 160.1978 101.092 180) (layer B.SilkS))
  (gr_text "G V B A" (at 160.4899 93.6498 180) (layer B.SilkS))
  (gr_text "G V B A" (at 136.3853 93.5228 180) (layer B.SilkS))
  (gr_text "G V B A" (at 148.3487 93.3958 180) (layer B.SilkS))
  (gr_text "G V B A" (at 148.4122 100.9904 180) (layer B.SilkS))
  (gr_text * (at 139.7 106.045) (layer F.SilkS))
  (gr_text KNH002r6 (at 142.0113 110.739) (layer F.SilkS))
  (gr_text "G V B A" (at 148.9075 102.108) (layer F.SilkS))
  (gr_text * (at 160.528 104.2035) (layer F.SilkS))
  (gr_text "G V B A" (at 161.036 102.362) (layer F.SilkS))
  (gr_text "G V B A" (at 160.4645 93.7895) (layer F.SilkS))
  (gr_text "G V B A" (at 148.2725 93.472) (layer F.SilkS))
  (gr_text "G V B A" (at 135.89 102.1715) (layer F.SilkS))
  (gr_text "G V B A" (at 136.017 93.5355) (layer F.SilkS))
  (gr_line (start 126.5681 117.6986) (end 170.4341 117.6986) (layer Edge.Cuts) (width 0.05))
  (gr_line (start 170.4341 117.6986) (end 170.434 92.3086) (layer Edge.Cuts) (width 0.05))
  (gr_line (start 170.434 92.3086) (end 131.5681 92.3086) (layer Edge.Cuts) (width 0.05))
  (gr_line (start 131.5681 92.3086) (end 126.5681 97.3086) (layer Edge.Cuts) (width 0.05))
  (gr_line (start 126.5681 97.3086) (end 126.5681 117.6986) (layer Edge.Cuts) (width 0.05))
  (gr_text Mayfly (at 170.0021 100.6806 90) (layer F.Fab))
  (gr_text "SMC\nRS-485" (at 145.8721 109.8246) (layer F.Fab))
  (gr_text " gnd +V  B  A  gnd +V  B  A   gnd +V  B  A" (at 147.32 93.98) (layer F.Fab))
  (zone (net 1) (net_name GND) (layer Bottom) (hatch edge 0.508)
    (connect_pads (clearance 0.508))
    (min_thickness 0.254)
    (fill yes (arc_segments 32) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 170.0021 116.7842) (xy 170.0021 117.5462) (xy 126.7713 117.597) (xy 126.7713 97.531) (xy 127.7873 96.4134)
        (xy 170.1545 96.1594)
      )
    )
  )
)
