(kicad_pcb (version 20171130) (host pcbnew 5.1.4-e60b266~84~ubuntu18.04.1)
  (general
    (thickness 1.6)
    (drawings 12)
    (tracks 1961)
    (zones 0)
    (modules 137)
    (nets 111)
  )
  (page A4)
  (layers
    (0 F.Cu signal hide)
    (31 B.Cu signal hide)
    (32 B.Adhes user hide)
    (33 F.Adhes user hide)
    (34 B.Paste user hide)
    (35 F.Paste user hide)
    (36 B.SilkS user hide)
    (37 F.SilkS user hide)
    (38 B.Mask user hide)
    (39 F.Mask user hide)
    (40 Dwgs.User user hide)
    (41 Cmts.User user hide)
    (42 Eco1.User user hide)
    (43 Eco2.User user hide)
    (44 Edge.Cuts user)
    (45 Margin user hide)
    (46 B.CrtYd user hide)
    (47 F.CrtYd user hide)
    (48 B.Fab user hide)
    (49 F.Fab user hide)
  )
  (setup
    (last_trace_width 0.25)
    (user_trace_width 0.2032)
    (user_trace_width 0.254)
    (user_trace_width 0.381)
    (user_trace_width 0.635)
    (user_trace_width 0.762)
    (user_trace_width 1.016)
    (trace_clearance 0.2)
    (zone_clearance 0)
    (zone_45_only yes)
    (trace_min 0.2)
    (via_size 0.8)
    (via_drill 0.4)
    (via_min_size 0.4)
    (via_min_drill 0.3)
    (user_via 0.508 0.381)
    (uvia_size 0.3)
    (uvia_drill 0.1)
    (uvias_allowed no)
    (uvia_min_size 0.2)
    (uvia_min_drill 0.1)
    (edge_width 0.05)
    (segment_width 0.2)
    (pcb_text_width 0.3)
    (pcb_text_size 1.5 1.5)
    (mod_edge_width 0.12)
    (mod_text_size 1 1)
    (mod_text_width 0.15)
    (pad_size 1.55 0.6)
    (pad_drill 0)
    (pad_to_mask_clearance 0.051)
    (solder_mask_min_width 0.25)
    (aux_axis_origin 0 0)
    (grid_origin 118.9 64.325)
    (visible_elements FFFFFFFF)
    (pcbplotparams
      (layerselection 0x010fc_ffffffff)
      (usegerberextensions false)
      (usegerberattributes false)
      (usegerberadvancedattributes false)
      (creategerberjobfile false)
      (excludeedgelayer true)
      (linewidth 0.100000)
      (plotframeref false)
      (viasonmask false)
      (mode 1)
      (useauxorigin false)
      (hpglpennumber 1)
      (hpglpenspeed 20)
      (hpglpendiameter 15.000000)
      (psnegative false)
      (psa4output false)
      (plotreference true)
      (plotvalue true)
      (plotinvisibletext false)
      (padsonsilk false)
      (subtractmaskfromsilk false)
      (outputformat 1)
      (mirror false)
      (drillshape 1)
      (scaleselection 1)
      (outputdirectory ""))
  )
  (net 0 "")
  (net 1 "Net-(C1-Pad1)")
  (net 2 GND)
  (net 3 /Microhard_Main.sch/BTN_CONFIG_BUF)
  (net 4 +3V3)
  (net 5 VDD)
  (net 6 "Net-(C6-Pad2)")
  (net 7 "Net-(C10-Pad1)")
  (net 8 "Net-(C10-Pad2)")
  (net 9 "Net-(C11-Pad1)")
  (net 10 "Net-(C12-Pad1)")
  (net 11 "Net-(C15-Pad1)")
  (net 12 "Net-(C16-Pad2)")
  (net 13 VBUS)
  (net 14 "Net-(C24-Pad2)")
  (net 15 "/Microhard Power/B+")
  (net 16 "Net-(C28-Pad2)")
  (net 17 "Net-(C30-Pad2)")
  (net 18 "Net-(C31-Pad1)")
  (net 19 "Net-(C36-Pad1)")
  (net 20 "Net-(C42-Pad1)")
  (net 21 "Net-(C43-Pad1)")
  (net 22 "Net-(C51-Pad1)")
  (net 23 "Net-(C53-Pad1)")
  (net 24 "Net-(D1-Pad2)")
  (net 25 "Net-(D2-Pad2)")
  (net 26 "Net-(D3-Pad2)")
  (net 27 "Net-(D4-Pad2)")
  (net 28 "Net-(D5-Pad2)")
  (net 29 "/Microhard Power/STAT2")
  (net 30 "Net-(D7-Pad2)")
  (net 31 "Net-(D7-Pad4)")
  (net 32 "/Microhard Power/STAT1")
  (net 33 "/Microhard Power/~USBPG")
  (net 34 "Net-(D9-Pad2)")
  (net 35 "Net-(D10-Pad2)")
  (net 36 "/Microhard Power/~ACPG")
  (net 37 "Net-(D11-Pad1)")
  (net 38 "Net-(F1-Pad1)")
  (net 39 "Net-(J1-Pad2)")
  (net 40 "Net-(J1-Pad3)")
  (net 41 "/Microhard IO/TEL_5V")
  (net 42 "/Microhard IO/TEL_RX_BUF")
  (net 43 "/Microhard IO/TEL_TX_BUF")
  (net 44 "/Microhard IO/TEL_RTS_BUF")
  (net 45 "/Microhard IO/TEL_CTS_BUF")
  (net 46 "/Microhard Power/TS")
  (net 47 "/Microhard IO/uHard_Control_TX_BUF")
  (net 48 "/Microhard IO/USB_Serial_2_RX")
  (net 49 "/Microhard IO/BT_TX")
  (net 50 "/Microhard IO/USB_Serial_2_RTS")
  (net 51 "/Microhard IO/BT_CTS")
  (net 52 "/Microhard IO/BT_RX")
  (net 53 "/Microhard IO/USB_Serial_2_TX")
  (net 54 "/Microhard IO/uHard_Control_RX_BUF")
  (net 55 "/Microhard IO/BT_RTS")
  (net 56 "/Microhard IO/USB_Serial_2_CTS")
  (net 57 /Microhard_Main.sch/uHard_Serial_TX)
  (net 58 /Microhard_Main.sch/uHard_Serial_RX)
  (net 59 "Net-(R8-Pad1)")
  (net 60 "Net-(R10-Pad2)")
  (net 61 "Net-(R14-Pad1)")
  (net 62 "/Microhard Power/VBat")
  (net 63 "/Microhard IO/TEL_TX")
  (net 64 "/Microhard IO/MUX_A")
  (net 65 "Net-(R24-Pad2)")
  (net 66 "Net-(R28-Pad2)")
  (net 67 "Net-(R29-Pad2)")
  (net 68 "Net-(R30-Pad2)")
  (net 69 "Net-(R31-Pad2)")
  (net 70 "Net-(R33-Pad2)")
  (net 71 "Net-(R33-Pad1)")
  (net 72 "Net-(R34-Pad2)")
  (net 73 "Net-(R34-Pad1)")
  (net 74 "Net-(R36-Pad2)")
  (net 75 "/Microhard IO/MUX_B")
  (net 76 MAIN_RST)
  (net 77 "Net-(SW1-Pad2)")
  (net 78 "Net-(SW3-Pad2)")
  (net 79 "/Microhard IO/uHard_RX_BUF")
  (net 80 "/Microhard IO/uHard_CTS_BUF")
  (net 81 /Microhard_Main.sch/uHard_Serial_RTS)
  (net 82 /Microhard_Main.sch/BTN_CONFIG)
  (net 83 "/Microhard IO/uHard_RTS_BUF")
  (net 84 /Microhard_Main.sch/uHard_Serial_CTS)
  (net 85 "/Microhard IO/uHard_TX_BUF")
  (net 86 "/Microhard Power/PWR_EN")
  (net 87 "/Microhard IO/BT_STATUS1_ND")
  (net 88 "Net-(U12-Pad48)")
  (net 89 "Net-(U12-Pad1)")
  (net 90 "/Microhard IO/SER_LOCKOUT")
  (net 91 "Net-(U10-Pad4)")
  (net 92 "/Microhard IO/FT2232_PWREN")
  (net 93 "/Microhard IO/USB_Serial_CTS")
  (net 94 "/Microhard IO/USB_Serial_RTS")
  (net 95 "/Microhard IO/USB_Serial_RX")
  (net 96 "/Microhard IO/USB_Serial_TX")
  (net 97 "/Microhard IO/TEL_CTS")
  (net 98 "/Microhard IO/TEL_RTS")
  (net 99 "/Microhard IO/TEL_RX")
  (net 100 +5V)
  (net 101 "Net-(C17-Pad1)")
  (net 102 "/Microhard IO/D-")
  (net 103 "/Microhard IO/2-D+")
  (net 104 "/Microhard IO/2-D-")
  (net 105 "/Microhard IO/D+")
  (net 106 /Microhard_Main.sch/RSSI1)
  (net 107 /Microhard_Main.sch/RSSI2)
  (net 108 /Microhard_Main.sch/RSSI3)
  (net 109 /Microhard_Main.sch/LED_RX)
  (net 110 /Microhard_Main.sch/LED_TX)
  (net_class Default "This is the default net class."
    (clearance 0.2)
    (trace_width 0.25)
    (via_dia 0.8)
    (via_drill 0.4)
    (uvia_dia 0.3)
    (uvia_drill 0.1)
    (add_net +3V3)
    (add_net +5V)
    (add_net "/Microhard IO/2-D+")
    (add_net "/Microhard IO/2-D-")
    (add_net "/Microhard IO/BT_CTS")
    (add_net "/Microhard IO/BT_RTS")
    (add_net "/Microhard IO/BT_RX")
    (add_net "/Microhard IO/BT_STATUS1_ND")
    (add_net "/Microhard IO/BT_TX")
    (add_net "/Microhard IO/D+")
    (add_net "/Microhard IO/D-")
    (add_net "/Microhard IO/FT2232_PWREN")
    (add_net "/Microhard IO/MUX_A")
    (add_net "/Microhard IO/MUX_B")
    (add_net "/Microhard IO/SER_LOCKOUT")
    (add_net "/Microhard IO/TEL_5V")
    (add_net "/Microhard IO/TEL_CTS")
    (add_net "/Microhard IO/TEL_CTS_BUF")
    (add_net "/Microhard IO/TEL_RTS")
    (add_net "/Microhard IO/TEL_RTS_BUF")
    (add_net "/Microhard IO/TEL_RX")
    (add_net "/Microhard IO/TEL_RX_BUF")
    (add_net "/Microhard IO/TEL_TX")
    (add_net "/Microhard IO/TEL_TX_BUF")
    (add_net "/Microhard IO/USB_Serial_2_CTS")
    (add_net "/Microhard IO/USB_Serial_2_RTS")
    (add_net "/Microhard IO/USB_Serial_2_RX")
    (add_net "/Microhard IO/USB_Serial_2_TX")
    (add_net "/Microhard IO/USB_Serial_CTS")
    (add_net "/Microhard IO/USB_Serial_RTS")
    (add_net "/Microhard IO/USB_Serial_RX")
    (add_net "/Microhard IO/USB_Serial_TX")
    (add_net "/Microhard IO/uHard_CTS_BUF")
    (add_net "/Microhard IO/uHard_Control_RX_BUF")
    (add_net "/Microhard IO/uHard_Control_TX_BUF")
    (add_net "/Microhard IO/uHard_RTS_BUF")
    (add_net "/Microhard IO/uHard_RX_BUF")
    (add_net "/Microhard IO/uHard_TX_BUF")
    (add_net "/Microhard Power/B+")
    (add_net "/Microhard Power/PWR_EN")
    (add_net "/Microhard Power/STAT1")
    (add_net "/Microhard Power/STAT2")
    (add_net "/Microhard Power/TS")
    (add_net "/Microhard Power/VBat")
    (add_net "/Microhard Power/~ACPG")
    (add_net "/Microhard Power/~USBPG")
    (add_net /Microhard_Main.sch/BTN_CONFIG)
    (add_net /Microhard_Main.sch/BTN_CONFIG_BUF)
    (add_net /Microhard_Main.sch/LED_RX)
    (add_net /Microhard_Main.sch/LED_TX)
    (add_net /Microhard_Main.sch/RSSI1)
    (add_net /Microhard_Main.sch/RSSI2)
    (add_net /Microhard_Main.sch/RSSI3)
    (add_net /Microhard_Main.sch/uHard_Serial_CTS)
    (add_net /Microhard_Main.sch/uHard_Serial_RTS)
    (add_net /Microhard_Main.sch/uHard_Serial_RX)
    (add_net /Microhard_Main.sch/uHard_Serial_TX)
    (add_net GND)
    (add_net MAIN_RST)
    (add_net "Net-(C1-Pad1)")
    (add_net "Net-(C10-Pad1)")
    (add_net "Net-(C10-Pad2)")
    (add_net "Net-(C11-Pad1)")
    (add_net "Net-(C12-Pad1)")
    (add_net "Net-(C15-Pad1)")
    (add_net "Net-(C16-Pad2)")
    (add_net "Net-(C17-Pad1)")
    (add_net "Net-(C24-Pad2)")
    (add_net "Net-(C28-Pad2)")
    (add_net "Net-(C30-Pad2)")
    (add_net "Net-(C31-Pad1)")
    (add_net "Net-(C36-Pad1)")
    (add_net "Net-(C42-Pad1)")
    (add_net "Net-(C43-Pad1)")
    (add_net "Net-(C51-Pad1)")
    (add_net "Net-(C53-Pad1)")
    (add_net "Net-(C6-Pad2)")
    (add_net "Net-(D1-Pad2)")
    (add_net "Net-(D10-Pad2)")
    (add_net "Net-(D11-Pad1)")
    (add_net "Net-(D2-Pad2)")
    (add_net "Net-(D3-Pad2)")
    (add_net "Net-(D4-Pad2)")
    (add_net "Net-(D5-Pad2)")
    (add_net "Net-(D7-Pad2)")
    (add_net "Net-(D7-Pad4)")
    (add_net "Net-(D9-Pad2)")
    (add_net "Net-(F1-Pad1)")
    (add_net "Net-(J1-Pad2)")
    (add_net "Net-(J1-Pad3)")
    (add_net "Net-(R10-Pad2)")
    (add_net "Net-(R14-Pad1)")
    (add_net "Net-(R24-Pad2)")
    (add_net "Net-(R28-Pad2)")
    (add_net "Net-(R29-Pad2)")
    (add_net "Net-(R30-Pad2)")
    (add_net "Net-(R31-Pad2)")
    (add_net "Net-(R33-Pad1)")
    (add_net "Net-(R33-Pad2)")
    (add_net "Net-(R34-Pad1)")
    (add_net "Net-(R34-Pad2)")
    (add_net "Net-(R36-Pad2)")
    (add_net "Net-(R8-Pad1)")
    (add_net "Net-(SW1-Pad2)")
    (add_net "Net-(SW3-Pad2)")
    (add_net "Net-(U10-Pad4)")
    (add_net "Net-(U12-Pad1)")
    (add_net "Net-(U12-Pad48)")
    (add_net VBUS)
    (add_net VDD)
  )
  (module Capacitor_SMD:C_1210_3225Metric_Pad1.42x2.65mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 140.833 108.09 270)
    (descr "Capacitor SMD 1210 (3225 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C17 (at 3.135 -0.042) (layer F.SilkS))
    (fp_text value 47u (at 0 2.28 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 1 smd roundrect (at -1.4875 0 270) (size 1.425 2.65) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 101 "Net-(C17-Pad1)"))
    (pad 2 smd roundrect (at 1.4875 0 270) (size 1.425 2.65) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 2 GND))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_1210_3225Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Inductor_SMD:L_Coilcraft_XAL5030 (layer F.Cu) (tedit 5990349C)
    (at 145.525 108.1 270)
    (descr L_Coilcraft_XAL5030)
    (tags "L Coilcraft XAL5030")
    (attr smd)
    (fp_text reference L1 (at 0 -3.81 90) (layer F.SilkS))
    (fp_text value 8.2uH (at 0 4.572 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 1 smd rect (at -1.655 0 270) (size 1.2 4.7) (layers F.Cu F.Paste F.Mask)
      (net 101 "Net-(C17-Pad1)"))
    (pad 2 smd rect (at 1.655 0 270) (size 1.2 4.7) (layers F.Cu F.Paste F.Mask)
      (net 7 "Net-(C10-Pad1)"))
    (model ${KISYS3DMOD}/Inductor_SMD.3dshapes/L_Coilcraft_XAL5030.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module kicad_footprints:D2PAK (layer F.Cu) (tedit 5D7C109B)
    (at 143.125 118.4 270)
    (fp_text reference D6 (at 0 -1.80086 90) (layer F.SilkS))
    (fp_text value 20A (at 0 0 90) (layer F.SilkS))
    (pad 3 smd rect (at 0 0 270) (size 12.7 9.75106) (layers F.Cu F.Paste F.Mask)
      (net 7 "Net-(C10-Pad1)"))
    (pad 1 smd rect (at -2.54 10 270) (size 1.1 3.8) (layers F.Cu F.Paste F.Mask)
      (net 2 GND))
    (pad 2 smd rect (at 2.54 10 270) (size 1.1 3.8) (layers F.Cu F.Paste F.Mask)
      (net 2 GND))
  )
  (module kicad_footprints:Resonator_SMD_muRata_CSTNRxxx-3Pin_2.6x1.1mm (layer F.Cu) (tedit 5D7BD2B8)
    (at 144.96 67.115 90)
    (descr "SMD Resomator/Filter Murata CSTCE, https://www.murata.com/en-eu/products/productdata/8801162264606/SPEC-CSTNE16M0VH3C000R0.pdf")
    (tags "SMD SMT ceramic resonator filter")
    (attr smd)
    (fp_text reference Y1 (at 0 -2.4 90) (layer F.SilkS))
    (fp_text value Resonator (at 0 1.8 90) (layer F.Fab))
    (fp_text user %R (at 0.1 -0.05 90) (layer F.Fab))
    (pad 3 smd rect (at 1.5 0 90) (size 0.4 2.6) (layers F.Cu F.Paste F.Mask)
      (net 70 "Net-(R33-Pad2)"))
    (pad 2 smd rect (at 0 0 90) (size 0.4 2.6) (layers F.Cu F.Paste F.Mask)
      (net 2 GND))
    (pad 1 smd rect (at -1.5 0 90) (size 0.4 2.6) (layers F.Cu F.Paste F.Mask)
      (net 71 "Net-(R33-Pad1)"))
    (model ${KISYS3DMOD}/Crystal.3dshapes/Resonator_SMD_muRata_CSTxExxV-3Pin_3.0x1.1mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Package_TO_SOT_SMD:SOT-23-6 (layer F.Cu) (tedit 5DA9F0F3)
    (at 135.925 52.625 90)
    (descr "6-pin SOT-23 package")
    (tags SOT-23-6)
    (attr smd)
    (fp_text reference U8 (at -0.19 -2.385 90) (layer F.SilkS))
    (fp_text value USBLC6-2SC6 (at 0 2.9 90) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 5 smd rect (at 1.1 0 90) (size 1.06 0.65) (layers F.Cu F.Paste F.Mask)
      (net 13 VBUS))
    (pad 6 smd rect (at 1.1 -0.95 90) (size 1.06 0.65) (layers F.Cu F.Paste F.Mask)
      (net 102 "/Microhard IO/D-"))
    (pad 4 smd rect (at 1.1 0.95 90) (size 1.06 0.65) (layers F.Cu F.Paste F.Mask)
      (net 105 "/Microhard IO/D+"))
    (pad 3 smd rect (at -1.1 0.95 90) (size 1.06 0.65) (layers F.Cu F.Paste F.Mask)
      (net 66 "Net-(R28-Pad2)"))
    (pad 2 smd rect (at -1.1 0 90) (size 1.06 0.65) (layers F.Cu F.Paste F.Mask)
      (net 2 GND))
    (pad 1 smd roundrect (at -1.1 -0.95 90) (size 1.06 0.65) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 67 "Net-(R29-Pad2)"))
    (model ${KISYS3DMOD}/Package_TO_SOT_SMD.3dshapes/SOT-23-6.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module kicad_footprints:P2400 (layer F.Cu) (tedit 5D7A7F8D)
    (at 76.74 83.56 90)
    (fp_text reference U2 (at 0 5.08 90) (layer F.SilkS))
    (fp_text value Microhard_P2400 (at 0 -5.08 90) (layer F.Fab))
    (fp_text user ANT (at 9.53 -12.27 90) (layer F.SilkS))
    (pad "" smd rect (at 8.24 -10.645 90) (size 1.03 2.55) (layers F.Paste))
    (pad "" smd rect (at 4.12 -10.645 90) (size 1.03 2.55) (layers F.Paste))
    (pad "" smd rect (at 0 -10.645 90) (size 1.03 2.55) (layers F.Paste))
    (pad "" smd rect (at -4.12 -10.645 90) (size 1.03 2.55) (layers F.Paste))
    (pad "" smd rect (at -8.24 -10.645 90) (size 1.03 2.55) (layers F.Paste))
    (pad "" smd rect (at 6.18 -7.095 90) (size 1.03 2.55) (layers F.Paste))
    (pad "" smd rect (at 2.06 -7.095 90) (size 1.03 2.55) (layers F.Paste))
    (pad "" smd rect (at -2.06 -7.095 90) (size 1.03 2.55) (layers F.Paste))
    (pad "" smd rect (at -6.18 -7.095 90) (size 1.03 2.55) (layers F.Paste))
    (pad "" smd rect (at 8.24 -3.545 90) (size 1.03 2.55) (layers F.Paste))
    (pad "" smd rect (at 4.12 -3.545 90) (size 1.03 2.55) (layers F.Paste))
    (pad "" smd rect (at 0 -3.545 90) (size 1.03 2.55) (layers F.Paste))
    (pad "" smd rect (at -4.12 -3.545 90) (size 1.03 2.55) (layers F.Paste))
    (pad "" smd rect (at -8.24 -3.545 90) (size 1.03 2.55) (layers F.Paste))
    (pad "" smd rect (at 6.18 0.005 90) (size 1.03 2.55) (layers F.Paste))
    (pad "" smd rect (at 2.06 0.005 90) (size 1.03 2.55) (layers F.Paste))
    (pad "" smd rect (at -2.06 0.005 90) (size 1.03 2.55) (layers F.Paste))
    (pad "" smd rect (at -6.18 0.005 90) (size 1.03 2.55) (layers F.Paste))
    (pad "" smd rect (at 8.24 3.555 90) (size 1.03 2.55) (layers F.Paste))
    (pad "" smd rect (at 4.12 3.555 90) (size 1.03 2.55) (layers F.Paste))
    (pad "" smd rect (at 0 3.555 90) (size 1.03 2.55) (layers F.Paste))
    (pad "" smd rect (at -4.12 3.555 90) (size 1.03 2.55) (layers F.Paste))
    (pad "" smd rect (at -8.24 3.555 90) (size 1.03 2.55) (layers F.Paste))
    (pad "" smd rect (at 6.18 7.105 90) (size 1.03 2.55) (layers F.Paste))
    (pad "" smd rect (at 2.06 7.105 90) (size 1.03 2.55) (layers F.Paste))
    (pad "" smd rect (at -2.06 7.105 90) (size 1.03 2.55) (layers F.Paste))
    (pad "" smd rect (at -6.18 7.105 90) (size 1.03 2.55) (layers F.Paste))
    (pad "" smd rect (at 8.24 10.655 90) (size 1.03 2.55) (layers F.Paste))
    (pad "" smd rect (at 4.12 10.655 90) (size 1.03 2.55) (layers F.Paste))
    (pad "" smd rect (at 0 10.655 90) (size 1.03 2.55) (layers F.Paste))
    (pad "" smd rect (at -4.12 10.655 90) (size 1.03 2.55) (layers F.Paste))
    (pad "" smd rect (at -8.24 10.655 90) (size 1.03 2.55) (layers F.Paste))
    (pad "" smd rect (at 9.525 -16.25 180) (size 1.88 0.86) (layers F.Paste))
    (pad "" smd rect (at 8.255 -16.25 180) (size 1.88 0.86) (layers F.Paste))
    (pad "" smd rect (at 6.985 -16.25 180) (size 1.88 0.86) (layers F.Paste))
    (pad "" smd rect (at 5.715 -16.25 180) (size 1.88 0.86) (layers F.Paste))
    (pad "" smd rect (at 4.445 -16.25 180) (size 1.88 0.86) (layers F.Paste))
    (pad "" smd rect (at 3.175 -16.25 180) (size 1.88 0.86) (layers F.Paste))
    (pad "" smd rect (at 1.905 -16.25 180) (size 1.88 0.86) (layers F.Paste))
    (pad "" smd rect (at 0.635 -16.25 180) (size 1.88 0.86) (layers F.Paste))
    (pad "" smd rect (at -0.635 -16.25 180) (size 1.88 0.86) (layers F.Paste))
    (pad "" smd rect (at -1.905 -16.25 180) (size 1.88 0.86) (layers F.Paste))
    (pad "" smd rect (at -3.175 -16.25 180) (size 1.88 0.86) (layers F.Paste))
    (pad "" smd rect (at -4.445 -16.25 180) (size 1.88 0.86) (layers F.Paste))
    (pad "" smd rect (at -5.715 -16.25 180) (size 1.88 0.86) (layers F.Paste))
    (pad "" smd rect (at -6.985 -16.25 180) (size 1.88 0.86) (layers F.Paste))
    (pad "" smd rect (at -8.255 -16.25 180) (size 1.88 0.86) (layers F.Paste))
    (pad "" smd rect (at -9.525 -16.25 180) (size 1.88 0.86) (layers F.Paste))
    (pad "" smd rect (at 13.08 -14.25 90) (size 1.88 0.86) (layers F.Paste))
    (pad "" smd rect (at 13.08 -12.98 90) (size 1.88 0.86) (layers F.Paste))
    (pad "" smd rect (at 13.08 -11.71 90) (size 1.88 0.86) (layers F.Paste))
    (pad "" smd rect (at 13.08 -10.44 90) (size 1.88 0.86) (layers F.Paste))
    (pad "" smd rect (at 13.08 -9.17 90) (size 1.88 0.86) (layers F.Paste))
    (pad "" smd rect (at 13.08 -7.9 90) (size 1.88 0.86) (layers F.Paste))
    (pad "" smd rect (at 13.08 -6.63 90) (size 1.88 0.86) (layers F.Paste))
    (pad "" smd rect (at 13.08 -5.36 90) (size 1.88 0.86) (layers F.Paste))
    (pad "" smd rect (at 13.08 -4.09 90) (size 1.88 0.86) (layers F.Paste))
    (pad "" smd rect (at 13.08 -2.82 90) (size 1.88 0.86) (layers F.Paste))
    (pad "" smd rect (at 13.08 -1.55 90) (size 1.88 0.86) (layers F.Paste))
    (pad "" smd rect (at 13.08 -0.28 90) (size 1.88 0.86) (layers F.Paste))
    (pad "" smd rect (at 13.08 0.99 90) (size 1.88 0.86) (layers F.Paste))
    (pad "" smd rect (at 13.08 2.26 90) (size 1.88 0.86) (layers F.Paste))
    (pad "" smd rect (at 13.08 3.53 90) (size 1.88 0.86) (layers F.Paste))
    (pad "" smd rect (at 13.08 4.8 90) (size 1.88 0.86) (layers F.Paste))
    (pad "" smd rect (at 13.08 6.07 90) (size 1.88 0.86) (layers F.Paste))
    (pad "" smd rect (at 13.08 7.34 90) (size 1.88 0.86) (layers F.Paste))
    (pad "" smd rect (at 13.08 8.61 90) (size 1.88 0.86) (layers F.Paste))
    (pad "" smd rect (at 13.08 9.88 90) (size 1.88 0.86) (layers F.Paste))
    (pad "" smd rect (at 13.08 11.15 90) (size 1.88 0.86) (layers F.Paste))
    (pad "" smd rect (at 13.08 12.42 90) (size 1.88 0.86) (layers F.Paste))
    (pad "" smd rect (at 13.08 13.69 90) (size 1.88 0.86) (layers F.Paste))
    (pad "" smd rect (at 13.08 14.96 90) (size 1.88 0.86) (layers F.Paste))
    (pad "" smd rect (at 9.525 16.25 180) (size 1.88 0.86) (layers F.Paste))
    (pad "" smd rect (at 8.255 16.25 180) (size 1.88 0.86) (layers F.Paste))
    (pad "" smd rect (at 6.985 16.25 180) (size 1.88 0.86) (layers F.Paste))
    (pad "" smd rect (at 5.715 16.25 180) (size 1.88 0.86) (layers F.Paste))
    (pad "" smd rect (at 4.445 16.25 180) (size 1.88 0.86) (layers F.Paste))
    (pad "" smd rect (at 3.175 16.25 180) (size 1.88 0.86) (layers F.Paste))
    (pad "" smd rect (at 1.905 16.25 180) (size 1.88 0.86) (layers F.Paste))
    (pad "" smd rect (at 0.635 16.25 180) (size 1.88 0.86) (layers F.Paste))
    (pad "" smd rect (at -0.635 16.25 180) (size 1.88 0.86) (layers F.Paste))
    (pad "" smd rect (at -1.905 16.25 180) (size 1.88 0.86) (layers F.Paste))
    (pad "" smd rect (at -3.175 16.25 180) (size 1.88 0.86) (layers F.Paste))
    (pad "" smd rect (at -4.445 16.25 180) (size 1.88 0.86) (layers F.Paste))
    (pad "" smd rect (at -5.715 16.25 180) (size 1.88 0.86) (layers F.Paste))
    (pad "" smd rect (at -6.985 16.25 180) (size 1.88 0.86) (layers F.Paste))
    (pad "" smd rect (at -8.255 16.25 180) (size 1.88 0.86) (layers F.Paste))
    (pad "" smd rect (at -13.08 14.96 90) (size 1.88 0.86) (layers F.Paste))
    (pad "" smd rect (at -13.08 13.69 90) (size 1.88 0.86) (layers F.Paste))
    (pad "" smd rect (at -13.08 12.42 90) (size 1.88 0.86) (layers F.Paste))
    (pad "" smd rect (at -13.08 11.15 90) (size 1.88 0.86) (layers F.Paste))
    (pad "" smd rect (at -13.08 9.88 90) (size 1.88 0.86) (layers F.Paste))
    (pad "" smd rect (at -13.08 8.61 90) (size 1.88 0.86) (layers F.Paste))
    (pad "" smd rect (at -13.08 7.34 90) (size 1.88 0.86) (layers F.Paste))
    (pad "" smd rect (at -13.08 6.07 90) (size 1.88 0.86) (layers F.Paste))
    (pad "" smd rect (at -13.08 4.8 90) (size 1.88 0.86) (layers F.Paste))
    (pad "" smd rect (at -13.08 3.53 90) (size 1.88 0.86) (layers F.Paste))
    (pad "" smd rect (at -13.08 2.26 90) (size 1.88 0.86) (layers F.Paste))
    (pad "" smd rect (at -13.08 0.99 90) (size 1.88 0.86) (layers F.Paste))
    (pad "" smd rect (at -13.08 -0.28 90) (size 1.88 0.86) (layers F.Paste))
    (pad "" smd rect (at -13.08 -1.55 90) (size 1.88 0.86) (layers F.Paste))
    (pad "" smd rect (at -13.08 -2.82 90) (size 1.88 0.86) (layers F.Paste))
    (pad "" smd rect (at -13.08 -4.09 90) (size 1.88 0.86) (layers F.Paste))
    (pad "" smd rect (at -13.08 -5.36 90) (size 1.88 0.86) (layers F.Paste))
    (pad "" smd rect (at -13.08 -6.63 90) (size 1.88 0.86) (layers F.Paste))
    (pad "" smd rect (at -13.08 -7.9 90) (size 1.88 0.86) (layers F.Paste))
    (pad "" smd rect (at -13.08 -9.17 90) (size 1.88 0.86) (layers F.Paste))
    (pad "" smd rect (at -13.08 -10.44 90) (size 1.88 0.86) (layers F.Paste))
    (pad "" smd rect (at -13.08 -11.71 90) (size 1.88 0.86) (layers F.Paste))
    (pad "" smd rect (at -13.08 -12.98 90) (size 1.88 0.86) (layers F.Paste))
    (pad "" smd rect (at -13.08 -14.25 90) (size 1.88 0.86) (layers F.Paste))
    (pad "" smd rect (at -9.525 16.25 180) (size 1.88 0.86) (layers F.Paste))
    (pad 80 smd rect (at -9.525 -16.25 180) (size 1.83 0.81) (layers F.Cu F.Mask)
      (net 2 GND))
    (pad 79 smd rect (at -8.255 -16.25 180) (size 1.83 0.81) (layers F.Cu F.Mask)
      (net 2 GND))
    (pad 78 smd rect (at -6.985 -16.25 180) (size 1.83 0.81) (layers F.Cu F.Mask)
      (net 2 GND))
    (pad 77 smd rect (at -5.715 -16.25 180) (size 1.83 0.81) (layers F.Cu F.Mask)
      (net 2 GND))
    (pad 76 smd rect (at -4.445 -16.25 180) (size 1.83 0.81) (layers F.Cu F.Mask)
      (net 2 GND))
    (pad 75 smd rect (at -3.175 -16.25 180) (size 1.83 0.81) (layers F.Cu F.Mask)
      (net 2 GND))
    (pad 74 smd rect (at -1.905 -16.25 180) (size 1.83 0.81) (layers F.Cu F.Mask))
    (pad 73 smd rect (at -0.635 -16.25 180) (size 1.83 0.81) (layers F.Cu F.Mask))
    (pad 72 smd rect (at 0.635 -16.25 180) (size 1.83 0.81) (layers F.Cu F.Mask))
    (pad 71 smd rect (at 1.905 -16.25 180) (size 1.83 0.81) (layers F.Cu F.Mask))
    (pad 70 smd rect (at 3.175 -16.25 180) (size 1.83 0.81) (layers F.Cu F.Mask))
    (pad 69 smd rect (at 4.445 -16.25 180) (size 1.83 0.81) (layers F.Cu F.Mask))
    (pad 68 smd rect (at 5.715 -16.25 180) (size 1.83 0.81) (layers F.Cu F.Mask))
    (pad 67 smd rect (at 6.985 -16.25 180) (size 1.83 0.81) (layers F.Cu F.Mask)
      (net 2 GND))
    (pad 66 smd rect (at 8.255 -16.25 180) (size 1.83 0.81) (layers F.Cu F.Mask)
      (net 2 GND))
    (pad 65 smd rect (at 9.525 -16.25 180) (size 1.83 0.81) (layers F.Cu F.Mask)
      (net 2 GND))
    (pad 40 smd rect (at 9.525 16.25 180) (size 1.83 0.81) (layers F.Cu F.Mask)
      (net 2 GND))
    (pad 39 smd rect (at 8.255 16.25 180) (size 1.83 0.81) (layers F.Cu F.Mask)
      (net 2 GND))
    (pad 38 smd rect (at 6.985 16.25 180) (size 1.83 0.81) (layers F.Cu F.Mask)
      (net 47 "/Microhard IO/uHard_Control_TX_BUF"))
    (pad 37 smd rect (at 5.715 16.25 180) (size 1.83 0.81) (layers F.Cu F.Mask)
      (net 54 "/Microhard IO/uHard_Control_RX_BUF"))
    (pad 36 smd rect (at 4.445 16.25 180) (size 1.83 0.81) (layers F.Cu F.Mask))
    (pad 35 smd rect (at 3.175 16.25 180) (size 1.83 0.81) (layers F.Cu F.Mask))
    (pad 34 smd rect (at 1.905 16.25 180) (size 1.83 0.81) (layers F.Cu F.Mask)
      (net 81 /Microhard_Main.sch/uHard_Serial_RTS))
    (pad 33 smd rect (at 0.635 16.25 180) (size 1.83 0.81) (layers F.Cu F.Mask))
    (pad 32 smd rect (at -0.635 16.25 180) (size 1.83 0.81) (layers F.Cu F.Mask))
    (pad 31 smd rect (at -1.905 16.25 180) (size 1.83 0.81) (layers F.Cu F.Mask)
      (net 84 /Microhard_Main.sch/uHard_Serial_CTS))
    (pad 30 smd rect (at -3.175 16.25 180) (size 1.83 0.81) (layers F.Cu F.Mask))
    (pad 29 smd rect (at -4.445 16.25 180) (size 1.83 0.81) (layers F.Cu F.Mask)
      (net 40 "Net-(J1-Pad3)"))
    (pad 28 smd rect (at -5.715 16.25 180) (size 1.83 0.81) (layers F.Cu F.Mask)
      (net 39 "Net-(J1-Pad2)"))
    (pad 27 smd rect (at -6.985 16.25 180) (size 1.83 0.81) (layers F.Cu F.Mask))
    (pad 26 smd rect (at -8.255 16.25 180) (size 1.83 0.81) (layers F.Cu F.Mask)
      (net 2 GND))
    (pad 25 smd rect (at -9.525 16.25 180) (size 1.83 0.81) (layers F.Cu F.Mask)
      (net 2 GND))
    (pad 64 smd rect (at 13.08 -14.25 90) (size 1.83 0.81) (layers F.Cu F.Mask)
      (net 5 VDD))
    (pad 63 smd rect (at 13.08 -12.98 90) (size 1.83 0.81) (layers F.Cu F.Mask)
      (net 5 VDD))
    (pad 62 smd rect (at 13.08 -11.71 90) (size 1.83 0.81) (layers F.Cu F.Mask)
      (net 5 VDD))
    (pad 61 smd rect (at 13.08 -10.44 90) (size 1.83 0.81) (layers F.Cu F.Mask))
    (pad 60 smd rect (at 13.08 -9.17 90) (size 1.83 0.81) (layers F.Cu F.Mask))
    (pad 59 smd rect (at 13.08 -7.9 90) (size 1.83 0.81) (layers F.Cu F.Mask))
    (pad 58 smd rect (at 13.08 -6.63 90) (size 1.83 0.81) (layers F.Cu F.Mask))
    (pad 57 smd rect (at 13.08 -5.36 90) (size 1.83 0.81) (layers F.Cu F.Mask))
    (pad 56 smd rect (at 13.08 -4.09 90) (size 1.83 0.81) (layers F.Cu F.Mask))
    (pad 55 smd rect (at 13.08 -2.82 90) (size 1.83 0.81) (layers F.Cu F.Mask))
    (pad 54 smd rect (at 13.08 -1.55 90) (size 1.83 0.81) (layers F.Cu F.Mask))
    (pad 53 smd rect (at 13.08 -0.28 90) (size 1.83 0.81) (layers F.Cu F.Mask))
    (pad 52 smd rect (at 13.08 0.99 90) (size 1.83 0.81) (layers F.Cu F.Mask))
    (pad 51 smd rect (at 13.08 2.26 90) (size 1.83 0.81) (layers F.Cu F.Mask))
    (pad 50 smd rect (at 13.08 3.53 90) (size 1.83 0.81) (layers F.Cu F.Mask))
    (pad 49 smd rect (at 13.08 4.8 90) (size 1.83 0.81) (layers F.Cu F.Mask))
    (pad 48 smd rect (at 13.08 6.07 90) (size 1.83 0.81) (layers F.Cu F.Mask))
    (pad 47 smd rect (at 13.08 7.34 90) (size 1.83 0.81) (layers F.Cu F.Mask))
    (pad 46 smd rect (at 13.08 8.61 90) (size 1.83 0.81) (layers F.Cu F.Mask)
      (net 82 /Microhard_Main.sch/BTN_CONFIG))
    (pad 45 smd rect (at 13.08 9.88 90) (size 1.83 0.81) (layers F.Cu F.Mask)
      (net 76 MAIN_RST))
    (pad 44 smd rect (at 13.08 11.15 90) (size 1.83 0.81) (layers F.Cu F.Mask))
    (pad 43 smd rect (at 13.08 12.42 90) (size 1.83 0.81) (layers F.Cu F.Mask))
    (pad 42 smd rect (at 13.08 13.69 90) (size 1.83 0.81) (layers F.Cu F.Mask)
      (net 62 "/Microhard Power/VBat"))
    (pad 41 smd rect (at 13.08 14.96 90) (size 1.83 0.81) (layers F.Cu F.Mask)
      (net 2 GND))
    (pad 81 smd rect (at 0 0 90) (size 22.35 28.7) (layers F.Cu F.Mask)
      (net 2 GND))
    (pad 1 smd rect (at -13.08 -14.25 90) (size 1.83 0.81) (layers F.Cu F.Mask)
      (net 2 GND))
    (pad 2 smd rect (at -13.08 -12.98 90) (size 1.83 0.81) (layers F.Cu F.Mask))
    (pad 3 smd rect (at -13.08 -11.71 90) (size 1.83 0.81) (layers F.Cu F.Mask))
    (pad 4 smd rect (at -13.08 -10.44 90) (size 1.83 0.81) (layers F.Cu F.Mask))
    (pad 5 smd rect (at -13.08 -9.17 90) (size 1.83 0.81) (layers F.Cu F.Mask))
    (pad 6 smd rect (at -13.08 -7.9 90) (size 1.83 0.81) (layers F.Cu F.Mask))
    (pad 7 smd rect (at -13.08 -6.63 90) (size 1.83 0.81) (layers F.Cu F.Mask))
    (pad 8 smd rect (at -13.08 -5.36 90) (size 1.83 0.81) (layers F.Cu F.Mask))
    (pad 9 smd rect (at -13.08 -4.09 90) (size 1.83 0.81) (layers F.Cu F.Mask))
    (pad 10 smd rect (at -13.08 -2.82 90) (size 1.83 0.81) (layers F.Cu F.Mask))
    (pad 11 smd rect (at -13.08 -1.55 90) (size 1.83 0.81) (layers F.Cu F.Mask))
    (pad 12 smd rect (at -13.08 -0.28 90) (size 1.83 0.81) (layers F.Cu F.Mask))
    (pad 13 smd rect (at -13.08 0.99 90) (size 1.83 0.81) (layers F.Cu F.Mask))
    (pad 14 smd rect (at -13.08 2.26 90) (size 1.83 0.81) (layers F.Cu F.Mask))
    (pad 15 smd rect (at -13.08 3.53 90) (size 1.83 0.81) (layers F.Cu F.Mask))
    (pad 16 smd rect (at -13.08 4.8 90) (size 1.83 0.81) (layers F.Cu F.Mask))
    (pad 17 smd rect (at -13.08 6.07 90) (size 1.83 0.81) (layers F.Cu F.Mask)
      (net 2 GND))
    (pad 18 smd rect (at -13.08 7.34 90) (size 1.83 0.81) (layers F.Cu F.Mask))
    (pad 19 smd rect (at -13.08 8.61 90) (size 1.83 0.81) (layers F.Cu F.Mask))
    (pad 20 smd rect (at -13.08 9.88 90) (size 1.83 0.81) (layers F.Cu F.Mask)
      (net 106 /Microhard_Main.sch/RSSI1))
    (pad 21 smd rect (at -13.08 11.15 90) (size 1.83 0.81) (layers F.Cu F.Mask)
      (net 107 /Microhard_Main.sch/RSSI2))
    (pad 22 smd rect (at -13.08 12.42 90) (size 1.83 0.81) (layers F.Cu F.Mask)
      (net 108 /Microhard_Main.sch/RSSI3))
    (pad 23 smd rect (at -13.08 13.69 90) (size 1.83 0.81) (layers F.Cu F.Mask)
      (net 109 /Microhard_Main.sch/LED_RX))
    (pad 24 smd rect (at -13.08 14.96 90) (size 1.83 0.81) (layers F.Cu F.Mask)
      (net 110 /Microhard_Main.sch/LED_TX))
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 91.475 68)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference R19 (at 0 -1.43) (layer F.SilkS))
    (fp_text value 0 (at 0 1.43) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd roundrect (at 0.875 0) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 15 "/Microhard Power/B+"))
    (pad 1 smd roundrect (at -0.875 0) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 62 "/Microhard Power/VBat"))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Connector_BarrelJack:BarrelJack_CUI_PJ-036AH-SMT_Horizontal (layer F.Cu) (tedit 5A1DBF38)
    (at 140.3 149.5)
    (descr "Surface-mount DC Barrel Jack, http://www.cui.com/product/resource/pj-036ah-smt.pdf")
    (tags "Power Jack SMT")
    (attr smd)
    (fp_text reference J2 (at 5.775 9.675 180) (layer F.SilkS))
    (fp_text value Barrel_Jack (at 0 11.25) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 1 smd rect (at 0.7 -5.8) (size 3.3 4.4) (layers F.Cu F.Paste F.Mask)
      (net 38 "Net-(F1-Pad1)"))
    (pad 2 smd rect (at -6.45 3.2) (size 3.9 6.2) (layers F.Cu F.Paste F.Mask)
      (net 2 GND))
    (pad 3 smd rect (at 6.45 3.2) (size 3.9 6.2) (layers F.Cu F.Paste F.Mask))
    (pad "" np_thru_hole circle (at 0 7) (size 2 2) (drill 2) (layers *.Cu *.Mask))
    (model ${KISYS3DMOD}/Connector_BarrelJack.3dshapes/BarrelJack_CUI_PJ-036AH-SMT_Horizontal.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_1210_3225Metric_Pad1.42x2.65mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 136.398 110.49 270)
    (descr "Capacitor SMD 1210 (3225 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C19 (at 3.21 -0.052 180) (layer F.SilkS))
    (fp_text value 47u (at 0 2.28 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd roundrect (at 1.4875 0 270) (size 1.425 2.65) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 2 GND))
    (pad 1 smd roundrect (at -1.4875 0 270) (size 1.425 2.65) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 101 "Net-(C17-Pad1)"))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_1210_3225Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Package_QFP:LQFP-48_7x7mm_P0.5mm (layer F.Cu) (tedit 5C18330E)
    (at 136.425 66.475 270)
    (descr "LQFP, 48 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/ltc2358-16.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py")
    (tags "LQFP QFP")
    (attr smd)
    (fp_text reference U12 (at 2.6 6.725 180) (layer F.SilkS))
    (fp_text value FT2232D (at 0 5.85 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 1 smd roundrect (at -4.1625 -2.75 270) (size 1.475 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 89 "Net-(U12-Pad1)"))
    (pad 2 smd roundrect (at -4.1625 -2.25 270) (size 1.475 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 73 "Net-(R34-Pad1)"))
    (pad 3 smd roundrect (at -4.1625 -1.75 270) (size 1.475 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 100 +5V))
    (pad 4 smd roundrect (at -4.1625 -1.25 270) (size 1.475 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 69 "Net-(R31-Pad2)"))
    (pad 5 smd roundrect (at -4.1625 -0.75 270) (size 1.475 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 74 "Net-(R36-Pad2)"))
    (pad 6 smd roundrect (at -4.1625 -0.25 270) (size 1.475 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 20 "Net-(C42-Pad1)"))
    (pad 7 smd roundrect (at -4.1625 0.25 270) (size 1.475 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 103 "/Microhard IO/2-D+"))
    (pad 8 smd roundrect (at -4.1625 0.75 270) (size 1.475 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 104 "/Microhard IO/2-D-"))
    (pad 9 smd roundrect (at -4.1625 1.25 270) (size 1.475 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 2 GND))
    (pad 10 smd roundrect (at -4.1625 1.75 270) (size 1.475 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
    (pad 11 smd roundrect (at -4.1625 2.25 270) (size 1.475 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
    (pad 12 smd roundrect (at -4.1625 2.75 270) (size 1.475 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
    (pad 13 smd roundrect (at -2.75 4.1625 270) (size 0.3 1.475) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
    (pad 14 smd roundrect (at -2.25 4.1625 270) (size 0.3 1.475) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 4 +3V3))
    (pad 15 smd roundrect (at -1.75 4.1625 270) (size 0.3 1.475) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
    (pad 16 smd roundrect (at -1.25 4.1625 270) (size 0.3 1.475) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
    (pad 17 smd roundrect (at -0.75 4.1625 270) (size 0.3 1.475) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
    (pad 18 smd roundrect (at -0.25 4.1625 270) (size 0.3 1.475) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 2 GND))
    (pad 19 smd roundrect (at 0.25 4.1625 270) (size 0.3 1.475) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
    (pad 20 smd roundrect (at 0.75 4.1625 270) (size 0.3 1.475) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
    (pad 21 smd roundrect (at 1.25 4.1625 270) (size 0.3 1.475) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 93 "/Microhard IO/USB_Serial_CTS"))
    (pad 22 smd roundrect (at 1.75 4.1625 270) (size 0.3 1.475) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 94 "/Microhard IO/USB_Serial_RTS"))
    (pad 23 smd roundrect (at 2.25 4.1625 270) (size 0.3 1.475) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 95 "/Microhard IO/USB_Serial_RX"))
    (pad 24 smd roundrect (at 2.75 4.1625 270) (size 0.3 1.475) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 96 "/Microhard IO/USB_Serial_TX"))
    (pad 25 smd roundrect (at 4.1625 2.75 270) (size 1.475 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 2 GND))
    (pad 26 smd roundrect (at 4.1625 2.25 270) (size 1.475 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
    (pad 27 smd roundrect (at 4.1625 1.75 270) (size 1.475 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
    (pad 28 smd roundrect (at 4.1625 1.25 270) (size 1.475 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
    (pad 29 smd roundrect (at 4.1625 0.75 270) (size 1.475 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
    (pad 30 smd roundrect (at 4.1625 0.25 270) (size 1.475 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
    (pad 31 smd roundrect (at 4.1625 -0.25 270) (size 1.475 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 5 VDD))
    (pad 32 smd roundrect (at 4.1625 -0.75 270) (size 1.475 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
    (pad 33 smd roundrect (at 4.1625 -1.25 270) (size 1.475 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
    (pad 34 smd roundrect (at 4.1625 -1.75 270) (size 1.475 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 2 GND))
    (pad 35 smd roundrect (at 4.1625 -2.25 270) (size 1.475 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
    (pad 36 smd roundrect (at 4.1625 -2.75 270) (size 1.475 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
    (pad 37 smd roundrect (at 2.75 -4.1625 270) (size 0.3 1.475) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 56 "/Microhard IO/USB_Serial_2_CTS"))
    (pad 38 smd roundrect (at 2.25 -4.1625 270) (size 0.3 1.475) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 50 "/Microhard IO/USB_Serial_2_RTS"))
    (pad 39 smd roundrect (at 1.75 -4.1625 270) (size 0.3 1.475) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 48 "/Microhard IO/USB_Serial_2_RX"))
    (pad 40 smd roundrect (at 1.25 -4.1625 270) (size 0.3 1.475) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 53 "/Microhard IO/USB_Serial_2_TX"))
    (pad 41 smd roundrect (at 0.75 -4.1625 270) (size 0.3 1.475) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 92 "/Microhard IO/FT2232_PWREN"))
    (pad 42 smd roundrect (at 0.25 -4.1625 270) (size 0.3 1.475) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 100 +5V))
    (pad 43 smd roundrect (at -0.25 -4.1625 270) (size 0.3 1.475) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 71 "Net-(R33-Pad1)"))
    (pad 44 smd roundrect (at -0.75 -4.1625 270) (size 0.3 1.475) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 70 "Net-(R33-Pad2)"))
    (pad 45 smd roundrect (at -1.25 -4.1625 270) (size 0.3 1.475) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 2 GND))
    (pad 46 smd roundrect (at -1.75 -4.1625 270) (size 0.3 1.475) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 21 "Net-(C43-Pad1)"))
    (pad 47 smd roundrect (at -2.25 -4.1625 270) (size 0.3 1.475) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
    (pad 48 smd roundrect (at -2.75 -4.1625 270) (size 0.3 1.475) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 88 "Net-(U12-Pad48)"))
    (model ${KISYS3DMOD}/Package_QFP.3dshapes/LQFP-48_7x7mm_P0.5mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Package_SO:TSSOP-16_4.4x5mm_P0.65mm (layer F.Cu) (tedit 5DA9F129)
    (at 112.254 67.634)
    (descr "16-Lead Plastic Thin Shrink Small Outline (ST)-4.4 mm Body [TSSOP] (see Microchip Packaging Specification 00000049BS.pdf)")
    (tags "SSOP 0.65")
    (attr smd)
    (fp_text reference U16 (at 0 -3.55) (layer F.SilkS))
    (fp_text value CD4052B (at 0 3.55) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 16 smd rect (at 2.95 -2.275) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask)
      (net 4 +3V3))
    (pad 15 smd rect (at 2.95 -1.625) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask)
      (net 95 "/Microhard IO/USB_Serial_RX"))
    (pad 14 smd rect (at 2.95 -0.975) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask)
      (net 52 "/Microhard IO/BT_RX"))
    (pad 13 smd rect (at 2.95 -0.325) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask)
      (net 85 "/Microhard IO/uHard_TX_BUF"))
    (pad 12 smd rect (at 2.95 0.325) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask)
      (net 63 "/Microhard IO/TEL_TX"))
    (pad 11 smd rect (at 2.95 0.975) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask)
      (net 95 "/Microhard IO/USB_Serial_RX"))
    (pad 10 smd rect (at 2.95 1.625) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask)
      (net 64 "/Microhard IO/MUX_A"))
    (pad 9 smd rect (at 2.95 2.275) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask)
      (net 75 "/Microhard IO/MUX_B"))
    (pad 8 smd rect (at -2.95 2.275) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask)
      (net 2 GND))
    (pad 7 smd rect (at -2.95 1.625) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask)
      (net 2 GND))
    (pad 6 smd rect (at -2.95 0.975) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask)
      (net 2 GND))
    (pad 5 smd rect (at -2.95 0.325) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask)
      (net 49 "/Microhard IO/BT_TX"))
    (pad 4 smd rect (at -2.95 -0.325) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask)
      (net 96 "/Microhard IO/USB_Serial_TX"))
    (pad 3 smd rect (at -2.95 -0.975) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask)
      (net 79 "/Microhard IO/uHard_RX_BUF"))
    (pad 2 smd rect (at -2.95 -1.625) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask)
      (net 96 "/Microhard IO/USB_Serial_TX"))
    (pad 1 smd roundrect (at -2.95 -2.275) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 99 "/Microhard IO/TEL_RX"))
    (model ${KISYS3DMOD}/Package_SO.3dshapes/TSSOP-16_4.4x5mm_P0.65mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 72.858 48.768 90)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C31 (at -3.047 0.162 90) (layer F.SilkS))
    (fp_text value 1u (at 0 1.43 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd roundrect (at 0.875 0 90) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 2 GND))
    (pad 1 smd roundrect (at -0.875 0 90) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 18 "Net-(C31-Pad1)"))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Connector_PinHeader_1.27mm:PinHeader_1x04_P1.27mm_Vertical (layer F.Cu) (tedit 59FED6E3)
    (at 96.988 90.424 180)
    (descr "Through hole straight pin header, 1x04, 1.27mm pitch, single row")
    (tags "Through hole pin header THT 1x04 1.27mm single row")
    (fp_text reference J1 (at 0 -1.695) (layer F.SilkS))
    (fp_text value "Debug Serial" (at 0 5.505) (layer F.Fab))
    (fp_text user %R (at 0 1.905 90) (layer F.Fab))
    (pad 1 thru_hole rect (at 0 0 180) (size 1 1) (drill 0.65) (layers *.Cu *.Mask)
      (net 5 VDD))
    (pad 2 thru_hole oval (at 0 1.27 180) (size 1 1) (drill 0.65) (layers *.Cu *.Mask)
      (net 39 "Net-(J1-Pad2)"))
    (pad 3 thru_hole oval (at 0 2.54 180) (size 1 1) (drill 0.65) (layers *.Cu *.Mask)
      (net 40 "Net-(J1-Pad3)"))
    (pad 4 thru_hole oval (at 0 3.81 180) (size 1 1) (drill 0.65) (layers *.Cu *.Mask)
      (net 2 GND))
    (model ${KISYS3DMOD}/Connector_PinHeader_1.27mm.3dshapes/PinHeader_1x04_P1.27mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 108.204 61.976 180)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C3 (at 2.734 -0.069) (layer F.SilkS))
    (fp_text value .1u (at 0 1.43) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd roundrect (at 0.875 0 180) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 2 GND))
    (pad 1 smd roundrect (at -0.875 0 180) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 4 +3V3))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Package_SO:TSSOP-20_4.4x6.5mm_P0.65mm (layer F.Cu) (tedit 5DA9F11B)
    (at 112.268 57.658 180)
    (descr "20-Lead Plastic Thin Shrink Small Outline (ST)-4.4 mm Body [TSSOP] (see Microchip Packaging Specification 00000049BS.pdf)")
    (tags "SSOP 0.65")
    (attr smd)
    (fp_text reference U1 (at 3.098 4.223) (layer F.SilkS))
    (fp_text value 74VC245A-AJV (at 0 4.3) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 1 smd roundrect (at -2.95 -2.925 180) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 2 GND))
    (pad 2 smd rect (at -2.95 -2.275 180) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 58 /Microhard_Main.sch/uHard_Serial_RX))
    (pad 3 smd rect (at -2.95 -1.625 180) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 85 "/Microhard IO/uHard_TX_BUF"))
    (pad 4 smd rect (at -2.95 -0.975 180) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 84 /Microhard_Main.sch/uHard_Serial_CTS))
    (pad 5 smd rect (at -2.95 -0.325 180) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 83 "/Microhard IO/uHard_RTS_BUF"))
    (pad 6 smd rect (at -2.95 0.325 180) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask))
    (pad 7 smd rect (at -2.95 0.975 180) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask))
    (pad 8 smd rect (at -2.95 1.625 180) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask))
    (pad 9 smd rect (at -2.95 2.275 180) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 82 /Microhard_Main.sch/BTN_CONFIG))
    (pad 10 smd rect (at -2.95 2.925 180) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 2 GND))
    (pad 11 smd rect (at 2.95 2.925 180) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 3 /Microhard_Main.sch/BTN_CONFIG_BUF))
    (pad 12 smd rect (at 2.95 2.275 180) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 2 GND))
    (pad 13 smd rect (at 2.95 1.625 180) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 2 GND))
    (pad 14 smd rect (at 2.95 0.975 180) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 2 GND))
    (pad 15 smd rect (at 2.95 0.325 180) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 81 /Microhard_Main.sch/uHard_Serial_RTS))
    (pad 16 smd rect (at 2.95 -0.325 180) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 80 "/Microhard IO/uHard_CTS_BUF"))
    (pad 17 smd rect (at 2.95 -0.975 180) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 57 /Microhard_Main.sch/uHard_Serial_TX))
    (pad 18 smd rect (at 2.95 -1.625 180) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 79 "/Microhard IO/uHard_RX_BUF"))
    (pad 19 smd rect (at 2.95 -2.275 180) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 2 GND))
    (pad 20 smd rect (at 2.95 -2.925 180) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 4 +3V3))
    (model ${KISYS3DMOD}/Package_SO.3dshapes/TSSOP-20_4.4x6.5mm_P0.65mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 121.92 53.848 180)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C1 (at 0 -1.43) (layer F.SilkS))
    (fp_text value 1u (at 0 1.43) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 1 smd roundrect (at -0.875 0 180) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 1 "Net-(C1-Pad1)"))
    (pad 2 smd roundrect (at 0.875 0 180) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 2 GND))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 107.01 48.52)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C2 (at -0.01 1.555) (layer F.SilkS))
    (fp_text value .1u (at 0 1.43) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd roundrect (at 0.875 0) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 2 GND))
    (pad 1 smd roundrect (at -0.875 0) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 3 /Microhard_Main.sch/BTN_CONFIG_BUF))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 62.772 67.736 180)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C4 (at -2.708 0.041) (layer F.SilkS))
    (fp_text value 1u (at 0 1.43) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd roundrect (at 0.875 0 180) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 2 GND))
    (pad 1 smd roundrect (at -0.875 0 180) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 5 VDD))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 62.772 66.136 180)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C5 (at -2.728 -0.009) (layer F.SilkS))
    (fp_text value .1u (at 0 1.43) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 1 smd roundrect (at -0.875 0 180) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 5 VDD))
    (pad 2 smd roundrect (at 0.875 0 180) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 2 GND))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_1210_3225Metric_Pad1.42x2.65mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 129.794 125.73 270)
    (descr "Capacitor SMD 1210 (3225 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C6 (at -0.005 2.344 90) (layer F.SilkS))
    (fp_text value "10u 50V" (at 0 2.28 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 1 smd roundrect (at -1.4875 0 270) (size 1.425 2.65) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 2 GND))
    (pad 2 smd roundrect (at 1.4875 0 270) (size 1.425 2.65) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 6 "Net-(C6-Pad2)"))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_1210_3225Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_1210_3225Metric_Pad1.42x2.65mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 129.794 130.81 90)
    (descr "Capacitor SMD 1210 (3225 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C7 (at 0 -2.28 90) (layer F.SilkS))
    (fp_text value "10u 50V" (at 0 2.28 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 1 smd roundrect (at -1.4875 0 90) (size 1.425 2.65) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 2 GND))
    (pad 2 smd roundrect (at 1.4875 0 90) (size 1.425 2.65) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 6 "Net-(C6-Pad2)"))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_1210_3225Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 132.96 89.39 90)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C8 (at -2.385 0.04 180) (layer F.SilkS))
    (fp_text value .1u (at 0 1.43 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd roundrect (at 0.875 0 90) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 2 GND))
    (pad 1 smd roundrect (at -0.875 0 90) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 100 +5V))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 133.604 126.238)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C10 (at 0.046 -1.463) (layer F.SilkS))
    (fp_text value .1u (at 0 1.43) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 1 smd roundrect (at -0.875 0) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 7 "Net-(C10-Pad1)"))
    (pad 2 smd roundrect (at 0.875 0) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 8 "Net-(C10-Pad2)"))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 127.21 86.49 270)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C11 (at 0.11 1.485 90) (layer F.SilkS))
    (fp_text value .1u (at 0 1.43 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd roundrect (at 0.875 0 270) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 2 GND))
    (pad 1 smd roundrect (at -0.875 0 270) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 9 "Net-(C11-Pad1)"))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 127.21 89.94 90)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C14 (at 0 -1.43 90) (layer F.SilkS))
    (fp_text value 10u (at 0 1.43 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 1 smd roundrect (at -0.875 0 90) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 4 +3V3))
    (pad 2 smd roundrect (at 0.875 0 90) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 2 GND))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 144.272 128.016 90)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C15 (at 2.316 0.153 180) (layer F.SilkS))
    (fp_text value 6.8p (at 0 1.43 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 1 smd roundrect (at -0.875 0 90) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 11 "Net-(C15-Pad1)"))
    (pad 2 smd roundrect (at 0.875 0 90) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 2 GND))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_1206_3216Metric_Pad1.42x1.75mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 146.062 97.624)
    (descr "Capacitor SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C16 (at 3.238 -0.224 90) (layer F.SilkS))
    (fp_text value 0.036uF (at 0 1.82) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 1 smd roundrect (at -1.4875 0) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 5 VDD))
    (pad 2 smd roundrect (at 1.4875 0) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 12 "Net-(C16-Pad2)"))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_1206_3216Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_1210_3225Metric_Pad1.42x2.65mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 141.862 98.974 270)
    (descr "Capacitor SMD 1210 (3225 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C18 (at 3.326 -0.138 180) (layer F.SilkS))
    (fp_text value "10u T" (at 0 2.28 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd roundrect (at 1.4875 0 270) (size 1.425 2.65) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 2 GND))
    (pad 1 smd roundrect (at -1.4875 0 270) (size 1.425 2.65) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 5 VDD))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_1210_3225Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 133.125 112.7)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C20 (at -3.175 0.075) (layer F.SilkS))
    (fp_text value .1u (at 0 1.43) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd roundrect (at 0.875 0) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 2 GND))
    (pad 1 smd roundrect (at -0.875 0) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 101 "Net-(C17-Pad1)"))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 133.858 98.806 270)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C21 (at 0 -1.43 90) (layer F.SilkS))
    (fp_text value .1u (at 0 1.43 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 1 smd roundrect (at -0.875 0 270) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 13 VBUS))
    (pad 2 smd roundrect (at 0.875 0 270) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 2 GND))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 125.984 101.854 90)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C22 (at 0 -1.43 90) (layer F.SilkS))
    (fp_text value 10u (at 0 1.43 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd roundrect (at 0.875 0 90) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 2 GND))
    (pad 1 smd roundrect (at -0.875 0 90) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 101 "Net-(C17-Pad1)"))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 132.08 98.806 270)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C23 (at -2.281 0.505 180) (layer F.SilkS))
    (fp_text value 10u (at 0 1.43 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 1 smd roundrect (at -0.875 0 270) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 13 VBUS))
    (pad 2 smd roundrect (at 0.875 0 270) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 2 GND))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 127.762 98.806 270)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C24 (at -0.281 1.437 90) (layer F.SilkS))
    (fp_text value .1u (at 0 1.43 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd roundrect (at 0.875 0 270) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 14 "Net-(C24-Pad2)"))
    (pad 1 smd roundrect (at -0.875 0 270) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 2 GND))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 124.968 104.902 180)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C25 (at 3.318 -0.023) (layer F.SilkS))
    (fp_text value 10u (at 0 1.43) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd roundrect (at 0.875 0 180) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 2 GND))
    (pad 1 smd roundrect (at -0.875 0 180) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 15 "/Microhard Power/B+"))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5B36C52B)
    (at 124.968 106.68 180)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C26 (at 3.318 -0.12) (layer F.SilkS))
    (fp_text value 33u (at 0 1.65) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 2 GND))
    (pad 1 smd roundrect (at -1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 15 "/Microhard Power/B+"))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_1206_3216Metric_Pad1.42x1.75mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 131.572 107.95)
    (descr "Capacitor SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C28 (at 3.928 -0.8) (layer F.SilkS))
    (fp_text value 50n (at 0 1.82) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd roundrect (at 1.4875 0) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 16 "Net-(C28-Pad2)"))
    (pad 1 smd roundrect (at -1.4875 0) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 2 GND))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_1206_3216Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 137.922 104.394 270)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C29 (at 0 -1.43 90) (layer F.SilkS))
    (fp_text value .1u (at 0 1.43 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 1 smd roundrect (at -0.875 0 270) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 100 +5V))
    (pad 2 smd roundrect (at 0.875 0 270) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 2 GND))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 125.476 108.712)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C30 (at -3.801 0.013) (layer F.SilkS))
    (fp_text value .22u (at 0 1.43) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd roundrect (at 0.875 0) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 17 "Net-(C30-Pad2)"))
    (pad 1 smd roundrect (at -0.875 0) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 15 "/Microhard Power/B+"))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 145.08 73.735)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C32 (at 3.07 0.04) (layer F.SilkS))
    (fp_text value .1u (at 0 1.43) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 1 smd roundrect (at -0.875 0) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 100 +5V))
    (pad 2 smd roundrect (at 0.875 0) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 2 GND))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 145.08 72.135)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C33 (at 3.12 0.04) (layer F.SilkS))
    (fp_text value .1u (at 0 1.43) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd roundrect (at 0.875 0) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 2 GND))
    (pad 1 smd roundrect (at -0.875 0) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 100 +5V))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 145.08 70.535)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C34 (at 3.12 0.09) (layer F.SilkS))
    (fp_text value 10u (at 0 1.43) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 1 smd roundrect (at -0.875 0) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 100 +5V))
    (pad 2 smd roundrect (at 0.875 0) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 2 GND))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 141.68 52.53 180)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C35 (at 0.09 1.425) (layer F.SilkS))
    (fp_text value 1u (at 0 1.43) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 1 smd roundrect (at -0.875 0 180) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 100 +5V))
    (pad 2 smd roundrect (at 0.875 0 180) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 2 GND))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 70.068 47.9)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C36 (at -0.028 4.615) (layer F.SilkS))
    (fp_text value 1u (at 0 1.43) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd roundrect (at 0.875 0) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 2 GND))
    (pad 1 smd roundrect (at -0.875 0) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 19 "Net-(C36-Pad1)"))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 145.5 59.7)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C37 (at 0 -1.43) (layer F.SilkS))
    (fp_text value .1u (at 0 1.43) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd roundrect (at 0.875 0) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 2 GND))
    (pad 1 smd roundrect (at -0.875 0) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 100 +5V))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 135.64 74.055 180)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C38 (at 0 -1.43) (layer F.SilkS))
    (fp_text value .1u (at 0 1.43) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 1 smd roundrect (at -0.875 0 180) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 5 VDD))
    (pad 2 smd roundrect (at 0.875 0 180) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 2 GND))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 70.064 46.228)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C39 (at -0.024 4.917) (layer F.SilkS))
    (fp_text value .1u (at 0 1.43) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 1 smd roundrect (at -0.875 0) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 19 "Net-(C36-Pad1)"))
    (pad 2 smd roundrect (at 0.875 0) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 2 GND))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 137.4 72.485)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C40 (at 3.125 0.115) (layer F.SilkS))
    (fp_text value .1u (at 0 1.43) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd roundrect (at 0.875 0) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 2 GND))
    (pad 1 smd roundrect (at -0.875 0) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 5 VDD))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 133.98 72.505 180)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C41 (at 3.105 -0.12) (layer F.SilkS))
    (fp_text value 10u (at 0 1.43) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 1 smd roundrect (at -0.875 0 180) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 5 VDD))
    (pad 2 smd roundrect (at 0.875 0 180) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 2 GND))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 137.97 60.365)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C42 (at -3.12 0.11) (layer F.SilkS))
    (fp_text value 33n (at 0 1.43) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 1 smd roundrect (at -0.875 0) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 20 "Net-(C42-Pad1)"))
    (pad 2 smd roundrect (at 0.875 0) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 2 GND))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 143.4 64.125)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C43 (at 3.45 0.1) (layer F.SilkS))
    (fp_text value .1u (at 0 1.43) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd roundrect (at 0.875 0) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 2 GND))
    (pad 1 smd roundrect (at -0.875 0) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 21 "Net-(C43-Pad1)"))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 108.725 90.925 180)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C44 (at 3.175 -0.175) (layer F.SilkS))
    (fp_text value 1u (at 0 1.43) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 1 smd roundrect (at -0.875 0 180) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 4 +3V3))
    (pad 2 smd roundrect (at 0.875 0 180) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 2 GND))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 108.712 89.408 180)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C45 (at 3.187 -0.017) (layer F.SilkS))
    (fp_text value .1u (at 0 1.43) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd roundrect (at 0.875 0 180) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 2 GND))
    (pad 1 smd roundrect (at -0.875 0 180) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 4 +3V3))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 119.05 71.09)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C46 (at 3.21 0.065) (layer F.SilkS))
    (fp_text value 1u (at 0 1.43) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 1 smd roundrect (at -0.875 0) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 4 +3V3))
    (pad 2 smd roundrect (at 0.875 0) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 2 GND))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 119.07 72.63)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C47 (at 3.22 0.005) (layer F.SilkS))
    (fp_text value .1u (at 0 1.43) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 1 smd roundrect (at -0.875 0) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 4 +3V3))
    (pad 2 smd roundrect (at 0.875 0) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 2 GND))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 123.368 144.61 180)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C48 (at -0.107 1.51) (layer F.SilkS))
    (fp_text value .1u (at 0 1.43) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 1 smd roundrect (at -0.875 0 180) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 4 +3V3))
    (pad 2 smd roundrect (at 0.875 0 180) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 2 GND))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 116.875 63.925)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C49 (at 3.155 0.02) (layer F.SilkS))
    (fp_text value 1u (at 0 1.43) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 1 smd roundrect (at -0.875 0) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 4 +3V3))
    (pad 2 smd roundrect (at 0.875 0) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 2 GND))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 116.85 62.3)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C50 (at 3.14 0.025) (layer F.SilkS))
    (fp_text value .1u (at 0 1.43) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd roundrect (at 0.875 0) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 2 GND))
    (pad 1 smd roundrect (at -0.875 0) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 4 +3V3))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 116.078 92.202)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C51 (at 3.222 -0.027) (layer F.SilkS))
    (fp_text value .1u (at 0 1.43) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 1 smd roundrect (at -0.875 0) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 22 "Net-(C51-Pad1)"))
    (pad 2 smd roundrect (at 0.875 0) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 2 GND))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 125.73 49.784)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C52 (at 0 -1.299) (layer F.SilkS))
    (fp_text value .1u (at 0 1.43) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 1 smd roundrect (at -0.875 0) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 100 +5V))
    (pad 2 smd roundrect (at 0.875 0) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 2 GND))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 121.92 52.07 180)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C53 (at -0.02 1.445) (layer F.SilkS))
    (fp_text value 1u (at 0 1.43) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd roundrect (at 0.875 0 180) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 2 GND))
    (pad 1 smd roundrect (at -0.875 0 180) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 23 "Net-(C53-Pad1)"))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Connector_PinHeader_2.54mm:PinHeader_1x02_P2.54mm_Vertical locked (layer F.Cu) (tedit 59FED5CC)
    (at 91 46.86 90)
    (descr "Through hole straight pin header, 1x02, 2.54mm pitch, single row")
    (tags "Through hole pin header THT 1x02 2.54mm single row")
    (fp_text reference D1 (at 3.655 1.31 180) (layer F.SilkS))
    (fp_text value LED (at 0 4.87 90) (layer F.Fab))
    (fp_text user %R (at 0 1.27) (layer F.Fab))
    (pad 2 thru_hole oval (at 0 2.54 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 24 "Net-(D1-Pad2)"))
    (pad 1 thru_hole rect (at 0 0 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 2 GND))
    (model ${KISYS3DMOD}/Connector_PinHeader_2.54mm.3dshapes/PinHeader_1x02_P2.54mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Connector_PinHeader_2.54mm:PinHeader_1x02_P2.54mm_Vertical locked (layer F.Cu) (tedit 59FED5CC)
    (at 91 49.4 90)
    (descr "Through hole straight pin header, 1x02, 2.54mm pitch, single row")
    (tags "Through hole pin header THT 1x02 2.54mm single row")
    (fp_text reference D2 (at 4.945 1.28 180) (layer F.SilkS))
    (fp_text value LED (at 0 4.87 90) (layer F.Fab))
    (fp_text user %R (at 0 1.27) (layer F.Fab))
    (pad 1 thru_hole rect (at 0 0 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 2 GND))
    (pad 2 thru_hole oval (at 0 2.54 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 25 "Net-(D2-Pad2)"))
    (model ${KISYS3DMOD}/Connector_PinHeader_2.54mm.3dshapes/PinHeader_1x02_P2.54mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Connector_PinHeader_2.54mm:PinHeader_1x02_P2.54mm_Vertical locked (layer F.Cu) (tedit 59FED5CC)
    (at 91 51.94 90)
    (descr "Through hole straight pin header, 1x02, 2.54mm pitch, single row")
    (tags "Through hole pin header THT 1x02 2.54mm single row")
    (fp_text reference D3 (at 0 -2.33 90) (layer F.SilkS))
    (fp_text value LED (at 0 4.87 90) (layer F.Fab))
    (fp_text user %R (at 0 1.27) (layer F.Fab))
    (pad 1 thru_hole rect (at 0 0 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 2 GND))
    (pad 2 thru_hole oval (at 0 2.54 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 26 "Net-(D3-Pad2)"))
    (model ${KISYS3DMOD}/Connector_PinHeader_2.54mm.3dshapes/PinHeader_1x02_P2.54mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Connector_PinHeader_2.54mm:PinHeader_1x02_P2.54mm_Vertical locked (layer F.Cu) (tedit 59FED5CC)
    (at 84 44.44 90)
    (descr "Through hole straight pin header, 1x02, 2.54mm pitch, single row")
    (tags "Through hole pin header THT 1x02 2.54mm single row")
    (fp_text reference D4 (at 2.475 5.34 180) (layer F.SilkS))
    (fp_text value ORNG (at 0 4.87 90) (layer F.Fab))
    (fp_text user %R (at 0 1.27) (layer F.Fab))
    (pad 1 thru_hole rect (at 0 0 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 2 GND))
    (pad 2 thru_hole oval (at 0 2.54 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 27 "Net-(D4-Pad2)"))
    (model ${KISYS3DMOD}/Connector_PinHeader_2.54mm.3dshapes/PinHeader_1x02_P2.54mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Connector_PinHeader_2.54mm:PinHeader_1x02_P2.54mm_Vertical locked (layer F.Cu) (tedit 59FED5CC)
    (at 84 46.98 90)
    (descr "Through hole straight pin header, 1x02, 2.54mm pitch, single row")
    (tags "Through hole pin header THT 1x02 2.54mm single row")
    (fp_text reference D5 (at 3.735 5.29 180) (layer F.SilkS))
    (fp_text value RED (at 0 4.87 90) (layer F.Fab))
    (fp_text user %R (at 0 1.27) (layer F.Fab))
    (pad 2 thru_hole oval (at 0 2.54 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 28 "Net-(D5-Pad2)"))
    (pad 1 thru_hole rect (at 0 0 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 2 GND))
    (model ${KISYS3DMOD}/Connector_PinHeader_2.54mm.3dshapes/PinHeader_1x02_P2.54mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module kicad_footprints:LED_D3.0mm_Horizontal_O8.13mm_Z9.65mm_RedGreen locked (layer F.Cu) (tedit 5D727734)
    (at 99.938 47 180)
    (descr "LED, diameter 3.0mm z-position of LED center 2.0mm, 2 pins, diameter 3.0mm z-position of LED center 2.0mm, 2 pins, diameter 3.0mm z-position of LED center 2.0mm, 2 pins, diameter 3.0mm z-position of LED center 6.0mm, 2 pins, diameter 3.0mm z-position of LED center 6.0mm, 2 pins, diameter 3.0mm z-position of LED center 6.0mm, 2 pins, diameter 3.0mm z-position of LED center 10.0mm, 2 pins, diameter 3.0mm z-position of LED center 10.0mm, 2 pins, diameter 3.0mm z-position of LED center 10.0mm, 2 pins")
    (tags "LED diameter 3.0mm z-position of LED center 2.0mm 2 pins diameter 3.0mm z-position of LED center 2.0mm 2 pins diameter 3.0mm z-position of LED center 2.0mm 2 pins diameter 3.0mm z-position of LED center 6.0mm 2 pins diameter 3.0mm z-position of LED center 6.0mm 2 pins diameter 3.0mm z-position of LED center 6.0mm 2 pins diameter 3.0mm z-position of LED center 10.0mm 2 pins diameter 3.0mm z-position of LED center 10.0mm 2 pins diameter 3.0mm z-position of LED center 10.0mm 2 pins")
    (fp_text reference D7 (at 4.808 6.025) (layer F.SilkS))
    (fp_text value "LED Status" (at 1.27 12.71) (layer F.Fab))
    (pad 1 thru_hole rect (at 2.54 2.55 180) (size 1.8 1.8) (drill 0.9) (layers *.Cu *.Mask)
      (net 29 "/Microhard Power/STAT2"))
    (pad 2 thru_hole circle (at 0 2.54 180) (size 1.8 1.8) (drill 0.9) (layers *.Cu *.Mask)
      (net 30 "Net-(D7-Pad2)"))
    (pad 4 thru_hole circle (at 0 0 180) (size 1.8 1.8) (drill 0.9) (layers *.Cu *.Mask)
      (net 31 "Net-(D7-Pad4)"))
    (pad 3 thru_hole circle (at 2.54 0 180) (size 1.8 1.8) (drill 0.9) (layers *.Cu *.Mask)
      (net 32 "/Microhard Power/STAT1"))
    (model ${KISYS3DMOD}/LED_THT.3dshapes/LED_D3.0mm_Horizontal_O6.35mm_Z10.0mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module LED_THT:LED_D3.0mm_Horizontal_O6.35mm_Z6.0mm locked (layer F.Cu) (tedit 5880A862)
    (at 147.32 52.05 180)
    (descr "LED, diameter 3.0mm z-position of LED center 2.0mm, 2 pins, diameter 3.0mm z-position of LED center 2.0mm, 2 pins, diameter 3.0mm z-position of LED center 2.0mm, 2 pins, diameter 3.0mm z-position of LED center 6.0mm, 2 pins, diameter 3.0mm z-position of LED center 6.0mm, 2 pins, diameter 3.0mm z-position of LED center 6.0mm, 2 pins")
    (tags "LED diameter 3.0mm z-position of LED center 2.0mm 2 pins diameter 3.0mm z-position of LED center 2.0mm 2 pins diameter 3.0mm z-position of LED center 2.0mm 2 pins diameter 3.0mm z-position of LED center 6.0mm 2 pins diameter 3.0mm z-position of LED center 6.0mm 2 pins diameter 3.0mm z-position of LED center 6.0mm 2 pins")
    (fp_text reference D9 (at -1.97 11.025 90) (layer F.SilkS))
    (fp_text value LED (at 1.27 12.71) (layer F.Fab))
    (pad 1 thru_hole rect (at 0 0 180) (size 1.8 1.8) (drill 0.9) (layers *.Cu *.Mask)
      (net 33 "/Microhard Power/~USBPG"))
    (pad 2 thru_hole circle (at 2.54 0 180) (size 1.8 1.8) (drill 0.9) (layers *.Cu *.Mask)
      (net 34 "Net-(D9-Pad2)"))
    (model ${KISYS3DMOD}/LED_THT.3dshapes/LED_D3.0mm_Horizontal_O6.35mm_Z6.0mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module LED_THT:LED_D3.0mm_Horizontal_O6.35mm_Z6.0mm (layer F.Cu) (tedit 5880A862)
    (at 127.6 148)
    (descr "LED, diameter 3.0mm z-position of LED center 2.0mm, 2 pins, diameter 3.0mm z-position of LED center 2.0mm, 2 pins, diameter 3.0mm z-position of LED center 2.0mm, 2 pins, diameter 3.0mm z-position of LED center 6.0mm, 2 pins, diameter 3.0mm z-position of LED center 6.0mm, 2 pins, diameter 3.0mm z-position of LED center 6.0mm, 2 pins")
    (tags "LED diameter 3.0mm z-position of LED center 2.0mm 2 pins diameter 3.0mm z-position of LED center 2.0mm 2 pins diameter 3.0mm z-position of LED center 2.0mm 2 pins diameter 3.0mm z-position of LED center 6.0mm 2 pins diameter 3.0mm z-position of LED center 6.0mm 2 pins diameter 3.0mm z-position of LED center 6.0mm 2 pins")
    (fp_text reference D10 (at 5.275 11.2 180) (layer F.SilkS))
    (fp_text value LED (at 1.27 12.71) (layer F.Fab))
    (pad 2 thru_hole circle (at 2.54 0) (size 1.8 1.8) (drill 0.9) (layers *.Cu *.Mask)
      (net 35 "Net-(D10-Pad2)"))
    (pad 1 thru_hole rect (at 0 0) (size 1.8 1.8) (drill 0.9) (layers *.Cu *.Mask)
      (net 36 "/Microhard Power/~ACPG"))
    (model ${KISYS3DMOD}/LED_THT.3dshapes/LED_D3.0mm_Horizontal_O6.35mm_Z6.0mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module LED_THT:LED_D3.0mm_Horizontal_O6.35mm_Z10.0mm locked (layer F.Cu) (tedit 5880A862)
    (at 80.814 44.45 180)
    (descr "LED, diameter 3.0mm z-position of LED center 2.0mm, 2 pins, diameter 3.0mm z-position of LED center 2.0mm, 2 pins, diameter 3.0mm z-position of LED center 2.0mm, 2 pins, diameter 3.0mm z-position of LED center 6.0mm, 2 pins, diameter 3.0mm z-position of LED center 6.0mm, 2 pins, diameter 3.0mm z-position of LED center 6.0mm, 2 pins, diameter 3.0mm z-position of LED center 10.0mm, 2 pins, diameter 3.0mm z-position of LED center 10.0mm, 2 pins, diameter 3.0mm z-position of LED center 10.0mm, 2 pins")
    (tags "LED diameter 3.0mm z-position of LED center 2.0mm 2 pins diameter 3.0mm z-position of LED center 2.0mm 2 pins diameter 3.0mm z-position of LED center 2.0mm 2 pins diameter 3.0mm z-position of LED center 6.0mm 2 pins diameter 3.0mm z-position of LED center 6.0mm 2 pins diameter 3.0mm z-position of LED center 6.0mm 2 pins diameter 3.0mm z-position of LED center 10.0mm 2 pins diameter 3.0mm z-position of LED center 10.0mm 2 pins diameter 3.0mm z-position of LED center 10.0mm 2 pins")
    (fp_text reference D11 (at -2.696 3.775) (layer F.SilkS))
    (fp_text value SSF-LXHM140USBD (at 1.27 12.71) (layer F.Fab))
    (pad 1 thru_hole rect (at 0 0 180) (size 1.8 1.8) (drill 0.9) (layers *.Cu *.Mask)
      (net 37 "Net-(D11-Pad1)"))
    (pad 2 thru_hole circle (at 2.54 0 180) (size 1.8 1.8) (drill 0.9) (layers *.Cu *.Mask)
      (net 100 +5V))
    (model ${KISYS3DMOD}/LED_THT.3dshapes/LED_D3.0mm_Horizontal_O6.35mm_Z10.0mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Fuse:Fuse_Bourns_MF-SM_9.5x6.71mm (layer F.Cu) (tedit 5ABAF588)
    (at 143.256 137.16 180)
    (descr https://www.bourns.com/docs/Product-Datasheets/mfsm.pdf)
    (tags "bourns ptc resettable fuse polyfuse MF-SM MF-SMHT")
    (attr smd)
    (fp_text reference F1 (at 6.831 -3.04) (layer F.SilkS))
    (fp_text value PTC (at 0 4.5) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd rect (at 4.2 0 180) (size 2.3 4.6) (layers F.Cu F.Paste F.Mask)
      (net 6 "Net-(C6-Pad2)"))
    (pad 1 smd rect (at -4.2 0 180) (size 2.3 4.6) (layers F.Cu F.Paste F.Mask)
      (net 38 "Net-(F1-Pad1)"))
    (model ${KISYS3DMOD}/Fuse.3dshapes/Fuse_Bourns_MF-SM_9.5x6.71mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Connector_JST:JST_GH_SM06B-GHS-TB_1x06-1MP_P1.25mm_Horizontal (layer F.Cu) (tedit 5B78AD87)
    (at 119.948 156.78)
    (descr "JST GH series connector, SM06B-GHS-TB (http://www.jst-mfg.com/product/pdf/eng/eGH.pdf), generated with kicad-footprint-generator")
    (tags "connector JST GH top entry")
    (attr smd)
    (fp_text reference J4 (at -7.273 2.37) (layer F.SilkS))
    (fp_text value "Pixhawk Telemetry Connector" (at 0 3.9) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 1 smd roundrect (at -3.125 -1.85) (size 0.6 1.7) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 41 "/Microhard IO/TEL_5V"))
    (pad 2 smd roundrect (at -1.875 -1.85) (size 0.6 1.7) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 42 "/Microhard IO/TEL_RX_BUF"))
    (pad 3 smd roundrect (at -0.625 -1.85) (size 0.6 1.7) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 43 "/Microhard IO/TEL_TX_BUF"))
    (pad 4 smd roundrect (at 0.625 -1.85) (size 0.6 1.7) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 44 "/Microhard IO/TEL_RTS_BUF"))
    (pad 5 smd roundrect (at 1.875 -1.85) (size 0.6 1.7) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 45 "/Microhard IO/TEL_CTS_BUF"))
    (pad 6 smd roundrect (at 3.125 -1.85) (size 0.6 1.7) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 2 GND))
    (pad MP smd roundrect (at -4.975 1.35) (size 1 2.7) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
    (pad MP smd roundrect (at 4.975 1.35) (size 1 2.7) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
    (model ${KISYS3DMOD}/Connector_JST.3dshapes/JST_GH_SM06B-GHS-TB_1x06-1MP_P1.25mm_Horizontal.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Connector_JST:JST_EH_B3B-EH-A_1x03_P2.50mm_Vertical (layer F.Cu) (tedit 5C28142C)
    (at 121.412 119.126 90)
    (descr "JST EH series connector, B3B-EH-A (http://www.jst-mfg.com/product/pdf/eng/eEH.pdf), generated with kicad-footprint-generator")
    (tags "connector JST EH vertical")
    (fp_text reference J5 (at -3.999 0.163) (layer F.SilkS))
    (fp_text value Battery (at 2.5 3.4 90) (layer F.Fab))
    (fp_text user %R (at 2.5 1.5 90) (layer F.Fab))
    (pad 1 thru_hole roundrect (at 0 0 90) (size 1.7 1.95) (drill 0.95) (layers *.Cu *.Mask) (roundrect_rratio 0.147059)
      (net 15 "/Microhard Power/B+"))
    (pad 2 thru_hole oval (at 2.5 0 90) (size 1.7 1.95) (drill 0.95) (layers *.Cu *.Mask)
      (net 46 "/Microhard Power/TS"))
    (pad 3 thru_hole oval (at 5 0 90) (size 1.7 1.95) (drill 0.95) (layers *.Cu *.Mask)
      (net 2 GND))
    (model ${KISYS3DMOD}/Connector_JST.3dshapes/JST_EH_B3B-EH-A_1x03_P2.50mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Connector_PinHeader_1.27mm:PinHeader_1x02_P1.27mm_Vertical (layer F.Cu) (tedit 59FED6E3)
    (at 117.602 116.84 180)
    (descr "Through hole straight pin header, 1x02, 1.27mm pitch, single row")
    (tags "Through hole pin header THT 1x02 1.27mm single row")
    (fp_text reference J6 (at 0 -1.695) (layer F.SilkS))
    (fp_text value Thermistor (at 0 2.965) (layer F.Fab))
    (fp_text user %R (at 0 0.635 90) (layer F.Fab))
    (pad 1 thru_hole rect (at 0 0 180) (size 1 1) (drill 0.65) (layers *.Cu *.Mask)
      (net 46 "/Microhard Power/TS"))
    (pad 2 thru_hole oval (at 0 1.27 180) (size 1 1) (drill 0.65) (layers *.Cu *.Mask)
      (net 2 GND))
    (model ${KISYS3DMOD}/Connector_PinHeader_1.27mm.3dshapes/PinHeader_1x02_P1.27mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Connector_PinHeader_2.54mm:PinHeader_1x03_P2.54mm_Vertical (layer F.Cu) (tedit 59FED5CC)
    (at 99.822 79.3 180)
    (descr "Through hole straight pin header, 1x03, 2.54mm pitch, single row")
    (tags "Through hole pin header THT 1x03 2.54mm single row")
    (fp_text reference JP2 (at 0.047 7.825) (layer F.SilkS))
    (fp_text value "Serial Config Jumper TX" (at 0 7.41) (layer F.Fab))
    (fp_text user %R (at 0 2.54 90) (layer F.Fab))
    (pad 1 thru_hole rect (at 0 0 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 47 "/Microhard IO/uHard_Control_TX_BUF"))
    (pad 2 thru_hole oval (at 0 2.54 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 48 "/Microhard IO/USB_Serial_2_RX"))
    (pad 3 thru_hole oval (at 0 5.08 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 49 "/Microhard IO/BT_TX"))
    (model ${KISYS3DMOD}/Connector_PinHeader_2.54mm.3dshapes/PinHeader_1x03_P2.54mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Connector_PinHeader_2.54mm:PinHeader_1x03_P2.54mm_Vertical (layer F.Cu) (tedit 59FED5CC)
    (at 103.57 79.3 180)
    (descr "Through hole straight pin header, 1x03, 2.54mm pitch, single row")
    (tags "Through hole pin header THT 1x03 2.54mm single row")
    (fp_text reference JP4 (at 0.07 7.775) (layer F.SilkS))
    (fp_text value "Serial Config Jumper Rx" (at 0 7.41) (layer F.Fab))
    (fp_text user %R (at 0 2.54 90) (layer F.Fab))
    (pad 3 thru_hole oval (at 0 5.08 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 52 "/Microhard IO/BT_RX"))
    (pad 2 thru_hole oval (at 0 2.54 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 53 "/Microhard IO/USB_Serial_2_TX"))
    (pad 1 thru_hole rect (at 0 0 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 54 "/Microhard IO/uHard_Control_RX_BUF"))
    (model ${KISYS3DMOD}/Connector_PinHeader_2.54mm.3dshapes/PinHeader_1x03_P2.54mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 95.972 83.566 270)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference R1 (at -2.441 -0.103 180) (layer F.SilkS))
    (fp_text value 0 (at 0 1.43 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 1 smd roundrect (at -0.875 0 270) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 57 /Microhard_Main.sch/uHard_Serial_TX))
    (pad 2 smd roundrect (at 0.875 0 270) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 40 "Net-(J1-Pad3)"))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 98.512 83.566 270)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference R2 (at 0 -1.43 90) (layer F.SilkS))
    (fp_text value 0 (at 0 1.43 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd roundrect (at 0.875 0 270) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 39 "Net-(J1-Pad2)"))
    (pad 1 smd roundrect (at -0.875 0 270) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 58 /Microhard_Main.sch/uHard_Serial_RX))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBD)
    (at 94.742 56.134 180)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R3 (at 0 -1.43) (layer F.SilkS))
    (fp_text value 261 (at 0 1.43) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd roundrect (at 0.875 0 180) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 24 "Net-(D1-Pad2)"))
    (pad 1 smd roundrect (at -0.875 0 180) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 106 /Microhard_Main.sch/RSSI1))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBD)
    (at 95.734 54.61)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R4 (at 2.656 0.025) (layer F.SilkS))
    (fp_text value 261 (at 0 1.43) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd roundrect (at 0.875 0) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 25 "Net-(D2-Pad2)"))
    (pad 1 smd roundrect (at -0.875 0) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 107 /Microhard_Main.sch/RSSI2))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBD)
    (at 91.924 54.61)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R5 (at -2.734 0.045) (layer F.SilkS))
    (fp_text value 261 (at 0 1.43) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 1 smd roundrect (at -0.875 0) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 108 /Microhard_Main.sch/RSSI3))
    (pad 2 smd roundrect (at 0.875 0) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 26 "Net-(D3-Pad2)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBD)
    (at 85.312 51.562)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R6 (at 0.038 2.973) (layer F.SilkS))
    (fp_text value 261 (at 0 1.43) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd roundrect (at 0.875 0) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 27 "Net-(D4-Pad2)"))
    (pad 1 smd roundrect (at -0.875 0) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 109 /Microhard_Main.sch/LED_RX))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBD)
    (at 85.312 49.784)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R7 (at -0.002 3.351) (layer F.SilkS))
    (fp_text value 261 (at 0 1.43) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 1 smd roundrect (at -0.875 0) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 110 /Microhard_Main.sch/LED_TX))
    (pad 2 smd roundrect (at 0.875 0) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 28 "Net-(D5-Pad2)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBD)
    (at 132.588 129.032 90)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R8 (at 0.332 1.587 90) (layer F.SilkS))
    (fp_text value 523k (at 0 1.43 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 1 smd roundrect (at -0.875 0 90) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 59 "Net-(R8-Pad1)"))
    (pad 2 smd roundrect (at 0.875 0 90) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 6 "Net-(C6-Pad2)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBD)
    (at 132.588 132.334 90)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R9 (at -2.541 0.112 180) (layer F.SilkS))
    (fp_text value 84.5 (at 0 1.43 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd roundrect (at 0.875 0 90) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 59 "Net-(R8-Pad1)"))
    (pad 1 smd roundrect (at -0.875 0 90) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 2 GND))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBD)
    (at 137.224 131.856 180)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R10 (at 0.174 -1.389) (layer F.SilkS))
    (fp_text value 174k (at 0 1.43) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 1 smd roundrect (at -0.875 0 180) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 2 GND))
    (pad 2 smd roundrect (at 0.875 0 180) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 60 "Net-(R10-Pad2)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBD)
    (at 145.3 130.8 180)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R11 (at -3.05 -0.1) (layer F.SilkS))
    (fp_text value 28.7k (at 0 1.43) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 1 smd roundrect (at -0.875 0 180) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 10 "Net-(C12-Pad1)"))
    (pad 2 smd roundrect (at 0.875 0 180) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 11 "Net-(C15-Pad1)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBD)
    (at 146.062 99.574 180)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R12 (at -3.013 -0.101) (layer F.SilkS))
    (fp_text value 100k (at 0 1.43) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd roundrect (at 0.875 0 180) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 5 VDD))
    (pad 1 smd roundrect (at -0.875 0 180) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 12 "Net-(C16-Pad2)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBD)
    (at 146.062 101.174)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R13 (at 0.013 1.626) (layer F.SilkS))
    (fp_text value 51k (at 0 1.43) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd roundrect (at 0.875 0) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 12 "Net-(C16-Pad2)"))
    (pad 1 smd roundrect (at -0.875 0) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 2 GND))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBD)
    (at 145.7 132.45)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R14 (at 3 0.25) (layer F.SilkS))
    (fp_text value 49.9k (at 0 1.43) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd roundrect (at 0.875 0) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 101 "Net-(C17-Pad1)"))
    (pad 1 smd roundrect (at -0.875 0) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 61 "Net-(R14-Pad1)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBD)
    (at 141.3 131.95)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R15 (at -0.03 1.265) (layer F.SilkS))
    (fp_text value 10.5k (at 0 1.43) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd roundrect (at 0.875 0) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 61 "Net-(R14-Pad1)"))
    (pad 1 smd roundrect (at -0.875 0) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 2 GND))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 116.078 88.646)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference R21 (at 3.272 0.029) (layer F.SilkS))
    (fp_text value 0 (at 0 1.43) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd roundrect (at 0.875 0) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 63 "/Microhard IO/TEL_TX"))
    (pad 1 smd roundrect (at -0.875 0) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 22 "Net-(C51-Pad1)"))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 116.078 90.424 180)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference R22 (at -3.222 -0.051) (layer F.SilkS))
    (fp_text value 0 (at 0 1.43) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd roundrect (at 0.875 0 180) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 22 "Net-(C51-Pad1)"))
    (pad 1 smd roundrect (at -0.875 0 180) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 41 "/Microhard IO/TEL_5V"))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBD)
    (at 118.12 81.45)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R23 (at 0 -1.43) (layer F.SilkS))
    (fp_text value 100k (at 0 1.43) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd roundrect (at 0.875 0) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 2 GND))
    (pad 1 smd roundrect (at -0.875 0) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 64 "/Microhard IO/MUX_A"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBD)
    (at 132.842 104.902 90)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R24 (at 2.652 0.208 180) (layer F.SilkS))
    (fp_text value 40.2k (at 0 1.43 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 1 smd roundrect (at -0.875 0 90) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 2 GND))
    (pad 2 smd roundrect (at 0.875 0 90) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 65 "Net-(R24-Pad2)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBD)
    (at 128.016 108.712 90)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R25 (at -2.413 -0.041 180) (layer F.SilkS))
    (fp_text value 1.05k (at 0 1.43 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd roundrect (at 0.875 0 90) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 17 "Net-(C30-Pad2)"))
    (pad 1 smd roundrect (at -0.875 0 90) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 2 GND))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBD)
    (at 132.08 109.982)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R26 (at -0.005 1.518) (layer F.SilkS))
    (fp_text value 34.8k (at 0 1.43) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 1 smd roundrect (at -0.875 0) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 2 GND))
    (pad 2 smd roundrect (at 0.875 0) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 16 "Net-(C28-Pad2)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBD)
    (at 70.064 49.53)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R27 (at -0.024 4.405) (layer F.SilkS))
    (fp_text value 4.7k (at 0 1.43) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd roundrect (at 0.875 0) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 18 "Net-(C31-Pad1)"))
    (pad 1 smd roundrect (at -0.875 0) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 19 "Net-(C36-Pad1)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBD)
    (at 137 56.25 90)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R28 (at 3.245 1.41 90) (layer F.SilkS))
    (fp_text value 27 (at 0 1.43 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 1 smd roundrect (at -0.875 0 90) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 103 "/Microhard IO/2-D+"))
    (pad 2 smd roundrect (at 0.875 0 90) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 66 "Net-(R28-Pad2)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBD)
    (at 134.9 56.25 90)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R29 (at 0 -1.43 90) (layer F.SilkS))
    (fp_text value 27 (at 0 1.43 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd roundrect (at 0.875 0 90) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 67 "Net-(R29-Pad2)"))
    (pad 1 smd roundrect (at -0.875 0 90) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 104 "/Microhard IO/2-D-"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBD)
    (at 80.772 49.022 270)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R30 (at 2.453 0.012 180) (layer F.SilkS))
    (fp_text value 261 (at 0 1.43 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 1 smd roundrect (at -0.875 0 270) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 37 "Net-(D11-Pad1)"))
    (pad 2 smd roundrect (at 0.875 0 270) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 68 "Net-(R30-Pad2)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBD)
    (at 130.86 60.845)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R31 (at -3.21 -0.07) (layer F.SilkS))
    (fp_text value 4.7k (at 0 1.43) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 1 smd roundrect (at -0.875 0) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 13 VBUS))
    (pad 2 smd roundrect (at 0.875 0) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 69 "Net-(R31-Pad2)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBD)
    (at 130.86 62.395 180)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R32 (at 3.21 -0.08) (layer F.SilkS))
    (fp_text value 10k (at 0 1.43) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 1 smd roundrect (at -0.875 0 180) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 69 "Net-(R31-Pad2)"))
    (pad 2 smd roundrect (at 0.875 0 180) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 2 GND))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBD)
    (at 147.35 67.2 90)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R33 (at -0.15 1.525 90) (layer F.SilkS))
    (fp_text value 1M (at 0 1.43 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd roundrect (at 0.875 0 90) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 70 "Net-(R33-Pad2)"))
    (pad 1 smd roundrect (at -0.875 0 90) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 71 "Net-(R33-Pad1)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBD)
    (at 138.74 56.045 90)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R34 (at 3.04 0.91 90) (layer F.SilkS))
    (fp_text value 2.2k (at 0 1.43 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd roundrect (at 0.875 0 90) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 72 "Net-(R34-Pad2)"))
    (pad 1 smd roundrect (at -0.875 0 90) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 73 "Net-(R34-Pad1)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBD)
    (at 141.62 55.925)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R35 (at 0 -1.43) (layer F.SilkS))
    (fp_text value 10k (at 0 1.43) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 1 smd roundrect (at -0.875 0) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 72 "Net-(R34-Pad2)"))
    (pad 2 smd roundrect (at 0.875 0) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 100 +5V))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBD)
    (at 137.48 58.695)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R36 (at -3.055 0.13) (layer F.SilkS))
    (fp_text value 1.5k (at 0 1.43) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 1 smd roundrect (at -0.875 0) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 103 "/Microhard IO/2-D+"))
    (pad 2 smd roundrect (at 0.875 0) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 74 "Net-(R36-Pad2)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBD)
    (at 144.7 62.575 180)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R37 (at -3.15 0.025) (layer F.SilkS))
    (fp_text value 470 (at 0 1.43) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 1 smd roundrect (at -0.875 0 180) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 100 +5V))
    (pad 2 smd roundrect (at 0.875 0 180) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 21 "Net-(C43-Pad1)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBD)
    (at 108.65 82.25 270)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R38 (at 0.075 1.425 90) (layer F.SilkS))
    (fp_text value 100k (at 0 1.43 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 1 smd roundrect (at -0.875 0 270) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 75 "/Microhard IO/MUX_B"))
    (pad 2 smd roundrect (at 0.875 0 270) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 2 GND))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBD)
    (at 128.82 52.256 90)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R39 (at -0.069 1.57 90) (layer F.SilkS))
    (fp_text value 4.7k (at 0 1.43 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd roundrect (at 0.875 0 90) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 76 MAIN_RST))
    (pad 1 smd roundrect (at -0.875 0 90) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 4 +3V3))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBD)
    (at 103.43 48.52)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R40 (at 0.1 1.535) (layer F.SilkS))
    (fp_text value 10k (at 0 1.43) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 1 smd roundrect (at -0.875 0) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 4 +3V3))
    (pad 2 smd roundrect (at 0.875 0) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 3 /Microhard_Main.sch/BTN_CONFIG_BUF))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 74.422 48.768 270)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference R41 (at 3.077 -0.078 90) (layer F.SilkS))
    (fp_text value 0 (at 0 1.43 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 1 smd roundrect (at -0.875 0 270) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 76 MAIN_RST))
    (pad 2 smd roundrect (at 0.875 0 270) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 18 "Net-(C31-Pad1)"))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Button_Switch_THT:SW_Tactile_SPST_Angled_PTS645Vx58-2LFS locked (layer F.Cu) (tedit 5A02FE31)
    (at 113.792 42.8)
    (descr "tactile switch SPST right angle, PTS645VL58-2 LFS")
    (tags "tactile switch SPST angled PTS645VL58-2 LFS C&K Button")
    (fp_text reference SW1 (at 5.828 5.385) (layer F.SilkS))
    (fp_text value BTN_RESET (at 2.25 5.38988) (layer F.Fab))
    (fp_text user %R (at 2.25 1.68) (layer F.Fab))
    (pad "" thru_hole circle (at -1.25 2.49) (size 2.1 2.1) (drill 1.3) (layers *.Cu *.Mask))
    (pad 1 thru_hole circle (at 0 0) (size 1.75 1.75) (drill 0.99) (layers *.Cu *.Mask)
      (net 2 GND))
    (pad 2 thru_hole circle (at 4.5 0) (size 1.75 1.75) (drill 0.99) (layers *.Cu *.Mask)
      (net 77 "Net-(SW1-Pad2)"))
    (pad "" thru_hole circle (at 5.76 2.49) (size 2.1 2.1) (drill 1.3) (layers *.Cu *.Mask))
    (model ${KISYS3DMOD}/Button_Switch_THT.3dshapes/SW_Tactile_SPST_Angled_PTS645Vx58-2LFS.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Button_Switch_THT:SW_Tactile_SPST_Angled_PTS645Vx58-2LFS locked (layer F.Cu) (tedit 5A02FE31)
    (at 103.886 42.8)
    (descr "tactile switch SPST right angle, PTS645VL58-2 LFS")
    (tags "tactile switch SPST angled PTS645VL58-2 LFS C&K Button")
    (fp_text reference SW2 (at 6.254 5.235) (layer F.SilkS))
    (fp_text value BTN_CONFIG (at 2.25 5.38988) (layer F.Fab))
    (fp_text user %R (at 2.25 1.68) (layer F.Fab))
    (pad "" thru_hole circle (at 5.76 2.49) (size 2.1 2.1) (drill 1.3) (layers *.Cu *.Mask))
    (pad 2 thru_hole circle (at 4.5 0) (size 1.75 1.75) (drill 0.99) (layers *.Cu *.Mask)
      (net 3 /Microhard_Main.sch/BTN_CONFIG_BUF))
    (pad 1 thru_hole circle (at 0 0) (size 1.75 1.75) (drill 0.99) (layers *.Cu *.Mask)
      (net 2 GND))
    (pad "" thru_hole circle (at -1.25 2.49) (size 2.1 2.1) (drill 1.3) (layers *.Cu *.Mask))
    (model ${KISYS3DMOD}/Button_Switch_THT.3dshapes/SW_Tactile_SPST_Angled_PTS645Vx58-2LFS.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Button_Switch_THT:SW_Tactile_SPST_Angled_PTS645Vx58-2LFS locked (layer F.Cu) (tedit 5A02FE31)
    (at 123.65 42.8)
    (descr "tactile switch SPST right angle, PTS645VL58-2 LFS")
    (tags "tactile switch SPST angled PTS645VL58-2 LFS C&K Button")
    (fp_text reference SW3 (at 5.55 5.195) (layer F.SilkS))
    (fp_text value BTN_PWR (at 2.25 5.38988) (layer F.Fab))
    (fp_text user %R (at 2.25 1.68) (layer F.Fab))
    (pad "" thru_hole circle (at 5.76 2.49) (size 2.1 2.1) (drill 1.3) (layers *.Cu *.Mask))
    (pad 2 thru_hole circle (at 4.5 0) (size 1.75 1.75) (drill 0.99) (layers *.Cu *.Mask)
      (net 78 "Net-(SW3-Pad2)"))
    (pad 1 thru_hole circle (at 0 0) (size 1.75 1.75) (drill 0.99) (layers *.Cu *.Mask)
      (net 2 GND))
    (pad "" thru_hole circle (at -1.25 2.49) (size 2.1 2.1) (drill 1.3) (layers *.Cu *.Mask))
    (model ${KISYS3DMOD}/Button_Switch_THT.3dshapes/SW_Tactile_SPST_Angled_PTS645Vx58-2LFS.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Button_Switch_SMD:SW_SPDT_PCM12 locked (layer F.Cu) (tedit 5A02FC95)
    (at 72.458 42.1 180)
    (descr "Ultraminiature Surface Mount Slide Switch, right-angle, https://www.ckswitches.com/media/1424/pcm.pdf")
    (attr smd)
    (fp_text reference SW4 (at -2.832 -3.235) (layer F.SilkS))
    (fp_text value SW_SPDT (at 0 4.25) (layer F.Fab))
    (fp_text user %R (at 0 -3.2) (layer F.Fab))
    (pad "" np_thru_hole circle (at -1.5 0.33 180) (size 0.9 0.9) (drill 0.9) (layers *.Cu *.Mask))
    (pad "" np_thru_hole circle (at 1.5 0.33 180) (size 0.9 0.9) (drill 0.9) (layers *.Cu *.Mask))
    (pad 1 smd rect (at -2.25 -1.43 180) (size 0.7 1.5) (layers F.Cu F.Paste F.Mask))
    (pad 2 smd rect (at 0.75 -1.43 180) (size 0.7 1.5) (layers F.Cu F.Paste F.Mask)
      (net 4 +3V3))
    (pad 3 smd rect (at 2.25 -1.43 180) (size 0.7 1.5) (layers F.Cu F.Paste F.Mask)
      (net 19 "Net-(C36-Pad1)"))
    (pad "" smd rect (at -3.65 1.43 180) (size 1 0.8) (layers F.Cu F.Paste F.Mask))
    (pad "" smd rect (at 3.65 1.43 180) (size 1 0.8) (layers F.Cu F.Paste F.Mask))
    (pad "" smd rect (at 3.65 -0.78 180) (size 1 0.8) (layers F.Cu F.Paste F.Mask))
    (pad "" smd rect (at -3.65 -0.78 180) (size 1 0.8) (layers F.Cu F.Paste F.Mask))
    (model ${KISYS3DMOD}/Button_Switch_SMD.3dshapes/SW_SPDT_PCM12.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Package_SO:TI_SO-PowerPAD-8_ThermalVias (layer F.Cu) (tedit 5DA9F1E7)
    (at 139.224 127.856)
    (descr "8-pin HTSOP package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm² body, exposed pad, thermal vias with large copper area, as proposed in http://www.ti.com/lit/ds/symlink/tps5430.pdf")
    (tags "HTSOP 1.27")
    (attr smd)
    (fp_text reference U3 (at -2.899 -3.406) (layer F.SilkS))
    (fp_text value "TPS54360BQDDAR " (at 0 3.5) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 9 smd rect (at 0 0) (size 2.6 3.1) (layers F.Cu F.Paste F.Mask)
      (net 2 GND))
    (pad 9 smd rect (at 0 0) (size 2.95 4.5) (layers F.Cu)
      (net 2 GND))
    (pad 1 smd roundrect (at -2.7 -1.905) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 8 "Net-(C10-Pad2)"))
    (pad 2 smd rect (at -2.7 -0.635) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 6 "Net-(C6-Pad2)"))
    (pad 3 smd rect (at -2.7 0.635) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 59 "Net-(R8-Pad1)"))
    (pad 4 smd rect (at -2.7 1.905) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 60 "Net-(R10-Pad2)"))
    (pad 5 smd rect (at 2.7 1.905) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 61 "Net-(R14-Pad1)"))
    (pad 6 smd rect (at 2.7 0.635) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 11 "Net-(C15-Pad1)"))
    (pad 7 smd rect (at 2.7 -0.635) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 2 GND))
    (pad 8 smd rect (at 2.7 -1.905) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 7 "Net-(C10-Pad1)"))
    (pad 9 smd rect (at 0 0) (size 2.95 4.5) (layers B.Cu)
      (net 2 GND))
    (pad 9 thru_hole circle (at -0.6 -1.8) (size 0.6 0.6) (drill 0.3) (layers *.Cu)
      (net 2 GND))
    (pad 9 thru_hole circle (at -0.6 -0.6) (size 0.6 0.6) (drill 0.3) (layers *.Cu)
      (net 2 GND))
    (pad 9 thru_hole circle (at 0.6 -0.6) (size 0.6 0.6) (drill 0.3) (layers *.Cu)
      (net 2 GND))
    (pad 9 thru_hole circle (at 0.6 -1.8) (size 0.6 0.6) (drill 0.3) (layers *.Cu)
      (net 2 GND))
    (pad 9 thru_hole circle (at -0.6 1.8) (size 0.6 0.6) (drill 0.3) (layers *.Cu)
      (net 2 GND))
    (pad 9 thru_hole circle (at -0.6 0.7) (size 0.6 0.6) (drill 0.3) (layers *.Cu)
      (net 2 GND))
    (pad 9 thru_hole circle (at 0.6 0.7) (size 0.6 0.6) (drill 0.3) (layers *.Cu)
      (net 2 GND))
    (pad 9 thru_hole circle (at 0.6 1.8) (size 0.6 0.6) (drill 0.3) (layers *.Cu)
      (net 2 GND))
    (model ${KISYS3DMOD}/Package_SO.3dshapes/HTSOP-8-1EP_3.9x4.9mm_Pitch1.27mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Package_TO_SOT_SMD:SOT-23-5 (layer F.Cu) (tedit 5A02FF57)
    (at 130.06 88.29 180)
    (descr "5-pin SOT23 package")
    (tags SOT-23-5)
    (attr smd)
    (fp_text reference U5 (at 0 -2.9) (layer F.SilkS))
    (fp_text value TPS79333-EP (at 0 2.9) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 1 smd rect (at -1.1 -0.95 180) (size 1.06 0.65) (layers F.Cu F.Paste F.Mask)
      (net 100 +5V))
    (pad 2 smd rect (at -1.1 0 180) (size 1.06 0.65) (layers F.Cu F.Paste F.Mask)
      (net 2 GND))
    (pad 3 smd rect (at -1.1 0.95 180) (size 1.06 0.65) (layers F.Cu F.Paste F.Mask)
      (net 5 VDD))
    (pad 4 smd rect (at 1.1 0.95 180) (size 1.06 0.65) (layers F.Cu F.Paste F.Mask)
      (net 9 "Net-(C11-Pad1)"))
    (pad 5 smd rect (at 1.1 -0.95 180) (size 1.06 0.65) (layers F.Cu F.Paste F.Mask)
      (net 4 +3V3))
    (model ${KISYS3DMOD}/Package_TO_SOT_SMD.3dshapes/SOT-23-5.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Package_DFN_QFN:Texas_VQFN-RHL-20 (layer F.Cu) (tedit 5B833432)
    (at 129.582 103.614)
    (descr http://www.ti.com/lit/ds/symlink/bq51050b.pdf)
    (tags RHL0020A)
    (attr smd)
    (fp_text reference U6 (at 0.698 -3.329) (layer F.SilkS))
    (fp_text value BQ2403x (at 0 3.7) (layer F.Fab))
    (fp_text user %R (at 0 -3.5) (layer F.Fab))
    (pad "" smd rect (at 0 1.8) (size 0.75 0.25) (layers F.Paste))
    (pad "" smd rect (at 0 -1.8) (size 0.75 0.25) (layers F.Paste))
    (pad "" smd rect (at 0.56 1.05) (size 0.92 0.85) (layers F.Paste))
    (pad "" smd rect (at -0.56 1.05) (size 0.92 0.85) (layers F.Paste))
    (pad "" smd rect (at 0.56 0) (size 0.92 0.85) (layers F.Paste))
    (pad "" smd rect (at -0.56 0) (size 0.92 0.85) (layers F.Paste))
    (pad "" smd rect (at 0.56 -1.05) (size 0.92 0.85) (layers F.Paste))
    (pad "" smd rect (at -0.56 -1.05) (size 0.92 0.85) (layers F.Paste))
    (pad 21 smd roundrect (at 0.275 2.15) (size 0.2 0.6) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 2 GND))
    (pad 21 smd roundrect (at -0.275 2.15) (size 0.2 0.6) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 2 GND))
    (pad 21 smd roundrect (at 0.275 -2.15) (size 0.2 0.6) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 2 GND))
    (pad 21 smd roundrect (at -0.275 -2.15) (size 0.2 0.6) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 2 GND))
    (pad 20 smd roundrect (at 0.75 -2.15) (size 0.24 0.6) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.21)
      (net 13 VBUS))
    (pad 19 smd roundrect (at 1.65 -1.75) (size 0.6 0.24) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.21)
      (net 33 "/Microhard Power/~USBPG"))
    (pad 18 smd roundrect (at 1.65 -1.25) (size 0.6 0.24) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.21)
      (net 36 "/Microhard Power/~ACPG"))
    (pad 17 smd roundrect (at 1.65 -0.75) (size 0.6 0.24) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.21)
      (net 100 +5V))
    (pad 16 smd roundrect (at 1.65 -0.25) (size 0.6 0.24) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.21)
      (net 100 +5V))
    (pad 15 smd roundrect (at 1.65 0.25) (size 0.6 0.24) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.21)
      (net 100 +5V))
    (pad 14 smd roundrect (at 1.65 0.75) (size 0.6 0.24) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.21)
      (net 65 "Net-(R24-Pad2)"))
    (pad 13 smd roundrect (at 1.65 1.25) (size 0.6 0.24) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.21)
      (net 16 "Net-(C28-Pad2)"))
    (pad 12 smd roundrect (at 1.65 1.75) (size 0.6 0.24) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.21)
      (net 46 "/Microhard Power/TS"))
    (pad 11 smd roundrect (at 0.75 2.15) (size 0.24 0.6) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.21)
      (net 2 GND))
    (pad 10 smd roundrect (at -0.75 2.15) (size 0.24 0.6) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.21)
      (net 17 "Net-(C30-Pad2)"))
    (pad 9 smd roundrect (at -1.65 1.75) (size 0.6 0.24) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.21)
      (net 100 +5V))
    (pad 8 smd roundrect (at -1.65 1.25) (size 0.6 0.24) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.21)
      (net 100 +5V))
    (pad 7 smd roundrect (at -1.65 0.75) (size 0.6 0.24) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.21)
      (net 100 +5V))
    (pad 6 smd roundrect (at -1.65 0.25) (size 0.6 0.24) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.21)
      (net 15 "/Microhard Power/B+"))
    (pad 5 smd roundrect (at -1.65 -0.25) (size 0.6 0.24) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.21)
      (net 15 "/Microhard Power/B+"))
    (pad 4 smd roundrect (at -1.65 -0.75) (size 0.6 0.24) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.21)
      (net 101 "Net-(C17-Pad1)"))
    (pad 3 smd roundrect (at -1.65 -1.25) (size 0.6 0.24) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.21)
      (net 29 "/Microhard Power/STAT2"))
    (pad 2 smd roundrect (at -1.65 -1.75) (size 0.6 0.24) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.21)
      (net 32 "/Microhard Power/STAT1"))
    (pad 1 smd roundrect (at -0.75 -2.15) (size 0.24 0.6) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.21)
      (net 14 "Net-(C24-Pad2)"))
    (pad 21 smd custom (at 0 0) (size 1.524 1.524) (layers F.Cu F.Mask)
      (net 2 GND) (zone_connect 0)
      (options (clearance outline) (anchor rect))
      (primitives
        (gr_poly (pts
           (xy 1.025 1.525) (xy 1.025 -1.525) (xy 0.375 -1.525) (xy 0.375 -1.925) (xy -0.375 -1.925)
           (xy -0.375 -1.525) (xy -1.025 -1.525) (xy -1.025 1.525) (xy -0.375 1.525) (xy -0.375 1.925)
           (xy 0.375 1.925) (xy 0.375 1.525)) (width 0))
      ))
    (model ${KISYS3DMOD}/Package_DFN_QFN.3dshapes/Texas_VQFN-RHL-20_ThermalVias.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module RF_Module:Microchip_RN4871 locked (layer F.Cu) (tedit 5A0FEF3D)
    (at 62.484 48.6)
    (descr "Microchip RN4871 footprint")
    (tags "RN4871 BLE")
    (attr smd)
    (fp_text reference U7 (at -4.514 5.245) (layer F.SilkS))
    (fp_text value RN4871 (at 0 4.8) (layer F.Fab))
    (fp_text user "On any layer" (at 0 -5.7) (layer Cmts.User))
    (fp_text user "No Metal, No Traces, Components" (at 0 -6.2) (layer Cmts.User))
    (fp_text user "KEEP-OUT ZONE" (at 1.825 -0.825 90) (layer Cmts.User))
    (fp_text user "KEEP-OUT ZONE" (at -2.575 -2.5 90) (layer Cmts.User))
    (fp_text user "KEEP-OUT ZONE" (at 0 -7.3) (layer Cmts.User))
    (fp_text user %R (at 0 -2.5) (layer F.Fab))
    (pad 6 smd rect (at -3 3.05) (size 0.7 1.5) (layers F.Cu F.Paste F.Mask))
    (pad 7 smd rect (at -1.8 3.05) (size 0.7 1.5) (layers F.Cu F.Paste F.Mask)
      (net 52 "/Microhard IO/BT_RX"))
    (pad 8 smd rect (at -0.6 3.05) (size 0.7 1.5) (layers F.Cu F.Paste F.Mask)
      (net 49 "/Microhard IO/BT_TX"))
    (pad 9 smd rect (at 0.6 3.05) (size 0.7 1.5) (layers F.Cu F.Paste F.Mask)
      (net 55 "/Microhard IO/BT_RTS"))
    (pad 10 smd rect (at 1.8 3.05) (size 0.7 1.5) (layers F.Cu F.Paste F.Mask)
      (net 18 "Net-(C31-Pad1)"))
    (pad 11 smd rect (at 3 3.05) (size 0.7 1.5) (layers F.Cu F.Paste F.Mask)
      (net 51 "/Microhard IO/BT_CTS"))
    (pad 5 smd rect (at -4.35 1.35 90) (size 0.7 1.5) (layers F.Cu F.Paste F.Mask))
    (pad 4 smd rect (at -4.35 0.15 90) (size 0.7 1.5) (layers F.Cu F.Paste F.Mask))
    (pad 3 smd rect (at -4.35 -1.05 90) (size 0.7 1.5) (layers F.Cu F.Paste F.Mask)
      (net 87 "/Microhard IO/BT_STATUS1_ND"))
    (pad 2 smd rect (at -4.35 -2.25 90) (size 0.7 1.5) (layers F.Cu F.Paste F.Mask)
      (net 2 GND))
    (pad 1 smd rect (at -4.35 -3.45 90) (size 0.7 1.5) (layers F.Cu F.Paste F.Mask))
    (pad 12 smd rect (at 4.35 1.35 90) (size 0.7 1.5) (layers F.Cu F.Paste F.Mask)
      (net 68 "Net-(R30-Pad2)"))
    (pad 13 smd rect (at 4.35 0.15 90) (size 0.7 1.5) (layers F.Cu F.Paste F.Mask)
      (net 2 GND))
    (pad 14 smd rect (at 4.35 -1.05 90) (size 0.7 1.5) (layers F.Cu F.Paste F.Mask)
      (net 19 "Net-(C36-Pad1)"))
    (pad 15 smd rect (at 4.35 -2.3 90) (size 0.7 1.5) (layers F.Cu F.Paste F.Mask))
    (pad 16 smd rect (at 4.35 -3.45 90) (size 0.7 1.5) (layers F.Cu F.Paste F.Mask))
    (model ${KISYS3DMOD}/RF_Module.3dshapes/Microchip_RN4871.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Package_TO_SOT_SMD:SOT-363_SC-70-6 (layer F.Cu) (tedit 5DA9F185)
    (at 112.522 89.408 180)
    (descr "SOT-363, SC-70-6")
    (tags "SOT-363 SC-70-6")
    (attr smd)
    (fp_text reference U10 (at 0 -2.467) (layer F.SilkS))
    (fp_text value 74LVC1G373 (at 0 2 180) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 1 smd roundrect (at -0.95 -0.65 180) (size 0.65 0.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 90 "/Microhard IO/SER_LOCKOUT"))
    (pad 3 smd rect (at -0.95 0.65 180) (size 0.65 0.4) (layers F.Cu F.Paste F.Mask)
      (net 22 "Net-(C51-Pad1)"))
    (pad 5 smd rect (at 0.95 0 180) (size 0.65 0.4) (layers F.Cu F.Paste F.Mask)
      (net 4 +3V3))
    (pad 2 smd rect (at -0.95 0 180) (size 0.65 0.4) (layers F.Cu F.Paste F.Mask)
      (net 2 GND))
    (pad 4 smd rect (at 0.95 0.65 180) (size 0.65 0.4) (layers F.Cu F.Paste F.Mask)
      (net 91 "Net-(U10-Pad4)"))
    (pad 6 smd rect (at 0.95 -0.65 180) (size 0.65 0.4) (layers F.Cu F.Paste F.Mask)
      (net 2 GND))
    (model ${KISYS3DMOD}/Package_TO_SOT_SMD.3dshapes/SOT-363_SC-70-6.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Package_SO:TSSOP-8_3x3mm_P0.65mm (layer F.Cu) (tedit 5DA9F172)
    (at 112.522 81.534)
    (descr "TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot505-1_po.pdf)")
    (tags "SSOP 0.65")
    (attr smd)
    (fp_text reference U11 (at 0 -2.55) (layer F.SilkS))
    (fp_text value 74LVC2G240 (at 0 2.55) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 8 smd rect (at 2.15 -0.975) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask)
      (net 4 +3V3))
    (pad 7 smd rect (at 2.15 -0.325) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask)
      (net 90 "/Microhard IO/SER_LOCKOUT"))
    (pad 6 smd rect (at 2.15 0.325) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask)
      (net 64 "/Microhard IO/MUX_A"))
    (pad 5 smd rect (at 2.15 0.975) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask)
      (net 92 "/Microhard IO/FT2232_PWREN"))
    (pad 4 smd rect (at -2.15 0.975) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask)
      (net 2 GND))
    (pad 3 smd rect (at -2.15 0.325) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask)
      (net 75 "/Microhard IO/MUX_B"))
    (pad 2 smd rect (at -2.15 -0.325) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask)
      (net 87 "/Microhard IO/BT_STATUS1_ND"))
    (pad 1 smd roundrect (at -2.15 -0.975) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 90 "/Microhard IO/SER_LOCKOUT"))
    (model ${KISYS3DMOD}/Package_SO.3dshapes/TSSOP-8_3x3mm_P0.65mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Package_SO:TSSOP-8_3x3mm_P0.65mm (layer F.Cu) (tedit 5DA9F17A)
    (at 112.792 85.452)
    (descr "TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot505-1_po.pdf)")
    (tags "SSOP 0.65")
    (attr smd)
    (fp_text reference U13 (at 4.508 -0.702) (layer F.SilkS))
    (fp_text value 74LVC2G240 (at 0 2.55) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 1 smd roundrect (at -2.15 -0.975) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 2 GND))
    (pad 2 smd rect (at -2.15 -0.325) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask)
      (net 91 "Net-(U10-Pad4)"))
    (pad 3 smd rect (at -2.15 0.325) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask))
    (pad 4 smd rect (at -2.15 0.975) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask)
      (net 2 GND))
    (pad 5 smd rect (at 2.15 0.975) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask)
      (net 4 +3V3))
    (pad 6 smd rect (at 2.15 0.325) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask)
      (net 90 "/Microhard IO/SER_LOCKOUT"))
    (pad 7 smd rect (at 2.15 -0.325) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask)
      (net 4 +3V3))
    (pad 8 smd rect (at 2.15 -0.975) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask)
      (net 4 +3V3))
    (model ${KISYS3DMOD}/Package_SO.3dshapes/TSSOP-8_3x3mm_P0.65mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Package_SO:TSSOP-16_4.4x5mm_P0.65mm (layer F.Cu) (tedit 5DA9F132)
    (at 112.254 74.84)
    (descr "16-Lead Plastic Thin Shrink Small Outline (ST)-4.4 mm Body [TSSOP] (see Microchip Packaging Specification 00000049BS.pdf)")
    (tags "SSOP 0.65")
    (attr smd)
    (fp_text reference U14 (at 0 -3.55) (layer F.SilkS))
    (fp_text value CD4052B (at 0 3.55) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 1 smd roundrect (at -2.95 -2.275) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 97 "/Microhard IO/TEL_CTS"))
    (pad 2 smd rect (at -2.95 -1.625) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask)
      (net 94 "/Microhard IO/USB_Serial_RTS"))
    (pad 3 smd rect (at -2.95 -0.975) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask)
      (net 80 "/Microhard IO/uHard_CTS_BUF"))
    (pad 4 smd rect (at -2.95 -0.325) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask)
      (net 94 "/Microhard IO/USB_Serial_RTS"))
    (pad 5 smd rect (at -2.95 0.325) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask)
      (net 55 "/Microhard IO/BT_RTS"))
    (pad 6 smd rect (at -2.95 0.975) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask)
      (net 2 GND))
    (pad 7 smd rect (at -2.95 1.625) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask)
      (net 2 GND))
    (pad 8 smd rect (at -2.95 2.275) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask)
      (net 2 GND))
    (pad 9 smd rect (at 2.95 2.275) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask)
      (net 75 "/Microhard IO/MUX_B"))
    (pad 10 smd rect (at 2.95 1.625) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask)
      (net 64 "/Microhard IO/MUX_A"))
    (pad 11 smd rect (at 2.95 0.975) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask)
      (net 93 "/Microhard IO/USB_Serial_CTS"))
    (pad 12 smd rect (at 2.95 0.325) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask)
      (net 98 "/Microhard IO/TEL_RTS"))
    (pad 13 smd rect (at 2.95 -0.325) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask)
      (net 83 "/Microhard IO/uHard_RTS_BUF"))
    (pad 14 smd rect (at 2.95 -0.975) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask)
      (net 51 "/Microhard IO/BT_CTS"))
    (pad 15 smd rect (at 2.95 -1.625) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask)
      (net 93 "/Microhard IO/USB_Serial_CTS"))
    (pad 16 smd rect (at 2.95 -2.275) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask)
      (net 4 +3V3))
    (model ${KISYS3DMOD}/Package_SO.3dshapes/TSSOP-16_4.4x5mm_P0.65mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Package_DFN_QFN:TDFN-12_2x3mm_P0.5mm (layer F.Cu) (tedit 5DA9F0D8)
    (at 125.73 52.832)
    (descr "TDFN, 12 Pads, No exposed, http://www.st.com/resource/en/datasheet/stm6600.pdf")
    (tags DFN)
    (attr smd)
    (fp_text reference U17 (at 0.07 2.643) (layer F.SilkS))
    (fp_text value STM6600 (at 0 3) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 1 smd roundrect (at -0.8 -1.25) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 100 +5V))
    (pad 2 smd rect (at -0.8 -0.75) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask)
      (net 77 "Net-(SW1-Pad2)"))
    (pad 3 smd rect (at -0.8 -0.25) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask)
      (net 23 "Net-(C53-Pad1)"))
    (pad 4 smd rect (at -0.8 0.25) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask)
      (net 5 VDD))
    (pad 5 smd rect (at -0.8 0.75) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask)
      (net 1 "Net-(C1-Pad1)"))
    (pad 6 smd rect (at -0.8 1.25) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask)
      (net 78 "Net-(SW3-Pad2)"))
    (pad 7 smd rect (at 0.8 1.25) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask))
    (pad 8 smd rect (at 0.8 0.75) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask))
    (pad 9 smd rect (at 0.8 0.25) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask)
      (net 86 "/Microhard Power/PWR_EN"))
    (pad 10 smd rect (at 0.8 -0.25) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask)
      (net 76 MAIN_RST))
    (pad 11 smd rect (at 0.8 -0.75) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask))
    (pad 12 smd rect (at 0.8 -1.25) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask)
      (net 2 GND))
    (model ${KISYS3DMOD}/Package_DFN_QFN.3dshapes/TDFN-12_2x3mm_P0.5mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Package_TO_SOT_SMD:SOT-23-6 (layer F.Cu) (tedit 5DA9F101)
    (at 141.63 58.555)
    (descr "6-pin SOT-23 package")
    (tags SOT-23-6)
    (attr smd)
    (fp_text reference U9 (at 0.12 2.64) (layer F.SilkS))
    (fp_text value 93LCxxBxxOT (at 0 2.9) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 1 smd roundrect (at -1.1 -0.95) (size 1.06 0.65) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 72 "Net-(R34-Pad2)"))
    (pad 2 smd rect (at -1.1 0) (size 1.06 0.65) (layers F.Cu F.Paste F.Mask)
      (net 2 GND))
    (pad 3 smd rect (at -1.1 0.95) (size 1.06 0.65) (layers F.Cu F.Paste F.Mask)
      (net 73 "Net-(R34-Pad1)"))
    (pad 4 smd rect (at 1.1 0.95) (size 1.06 0.65) (layers F.Cu F.Paste F.Mask)
      (net 89 "Net-(U12-Pad1)"))
    (pad 6 smd rect (at 1.1 -0.95) (size 1.06 0.65) (layers F.Cu F.Paste F.Mask)
      (net 100 +5V))
    (pad 5 smd rect (at 1.1 0) (size 1.06 0.65) (layers F.Cu F.Paste F.Mask)
      (net 88 "Net-(U12-Pad48)"))
    (model ${KISYS3DMOD}/Package_TO_SOT_SMD.3dshapes/SOT-23-6.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Package_SO:TSSOP-20_4.4x6.5mm_P0.65mm (layer F.Cu) (tedit 5DA9F1DB)
    (at 121.398 149.13)
    (descr "20-Lead Plastic Thin Shrink Small Outline (ST)-4.4 mm Body [TSSOP] (see Microchip Packaging Specification 00000049BS.pdf)")
    (tags "SSOP 0.65")
    (attr smd)
    (fp_text reference U15 (at -2.648 -4.38) (layer F.SilkS))
    (fp_text value 74VC245A-AJV (at 0 4.3) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 20 smd rect (at 2.95 -2.925) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 4 +3V3))
    (pad 19 smd rect (at 2.95 -2.275) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 2 GND))
    (pad 18 smd rect (at 2.95 -1.625) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 63 "/Microhard IO/TEL_TX"))
    (pad 17 smd rect (at 2.95 -0.975) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 42 "/Microhard IO/TEL_RX_BUF"))
    (pad 16 smd rect (at 2.95 -0.325) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 45 "/Microhard IO/TEL_CTS_BUF"))
    (pad 15 smd rect (at 2.95 0.325) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 98 "/Microhard IO/TEL_RTS"))
    (pad 14 smd rect (at 2.95 0.975) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 2 GND))
    (pad 13 smd rect (at 2.95 1.625) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 2 GND))
    (pad 12 smd rect (at 2.95 2.275) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 2 GND))
    (pad 11 smd rect (at 2.95 2.925) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 2 GND))
    (pad 10 smd rect (at -2.95 2.925) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 2 GND))
    (pad 9 smd rect (at -2.95 2.275) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask))
    (pad 8 smd rect (at -2.95 1.625) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask))
    (pad 7 smd rect (at -2.95 0.975) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask))
    (pad 6 smd rect (at -2.95 0.325) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask))
    (pad 5 smd rect (at -2.95 -0.325) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 44 "/Microhard IO/TEL_RTS_BUF"))
    (pad 4 smd rect (at -2.95 -0.975) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 97 "/Microhard IO/TEL_CTS"))
    (pad 3 smd rect (at -2.95 -1.625) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 99 "/Microhard IO/TEL_RX"))
    (pad 2 smd rect (at -2.95 -2.275) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 43 "/Microhard IO/TEL_TX_BUF"))
    (pad 1 smd roundrect (at -2.95 -2.925) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 2 GND))
    (model ${KISYS3DMOD}/Package_SO.3dshapes/TSSOP-20_4.4x6.5mm_P0.65mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Connector_PinHeader_2.54mm:PinHeader_1x02_P2.54mm_Vertical (layer F.Cu) (tedit 59FED5CC)
    (at 126.275 79.175)
    (descr "Through hole straight pin header, 1x02, 2.54mm pitch, single row")
    (tags "Through hole pin header THT 1x02 2.54mm single row")
    (fp_text reference JP3 (at 0 -2.33) (layer F.SilkS))
    (fp_text value "Serial Config Jumper CTS" (at 0 4.87) (layer F.Fab))
    (fp_text user %R (at 0 1.27 90) (layer F.Fab))
    (pad 1 thru_hole rect (at 0 0) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 50 "/Microhard IO/USB_Serial_2_RTS"))
    (pad 2 thru_hole oval (at 0 2.54) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 51 "/Microhard IO/BT_CTS"))
    (model ${KISYS3DMOD}/Connector_PinHeader_2.54mm.3dshapes/PinHeader_1x02_P2.54mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Connector_PinHeader_2.54mm:PinHeader_1x02_P2.54mm_Vertical (layer F.Cu) (tedit 59FED5CC)
    (at 130.075 79.225)
    (descr "Through hole straight pin header, 1x02, 2.54mm pitch, single row")
    (tags "Through hole pin header THT 1x02 2.54mm single row")
    (fp_text reference JP5 (at 0 -2.33) (layer F.SilkS))
    (fp_text value "Serial Config Jumper RTS" (at 0 4.87) (layer F.Fab))
    (fp_text user %R (at 0 1.27 90) (layer F.Fab))
    (pad 2 thru_hole oval (at 0 2.54) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 55 "/Microhard IO/BT_RTS"))
    (pad 1 thru_hole rect (at 0 0) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 56 "/Microhard IO/USB_Serial_2_CTS"))
    (model ${KISYS3DMOD}/Connector_PinHeader_2.54mm.3dshapes/PinHeader_1x02_P2.54mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 138.612 98.974 270)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C9 (at 2.476 -0.013 180) (layer F.SilkS))
    (fp_text value 10u (at 0 1.43 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd roundrect (at 0.875 0 270) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 2 GND))
    (pad 1 smd roundrect (at -0.875 0 270) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 100 +5V))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 135.382 104.14 90)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C27 (at 2.515 0.718 180) (layer F.SilkS))
    (fp_text value 10u (at 0 1.43 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 1 smd roundrect (at -0.875 0 90) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 2 GND))
    (pad 2 smd roundrect (at 0.875 0 90) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 100 +5V))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Connector_USB:USB_C_Receptacle_Amphenol_12401610E4-2A_CircularHoles (layer F.Cu) (tedit 5A142044)
    (at 137.1 44.25 180)
    (descr "USB TYPE C, RA RCPT PCB, SMT, https://www.amphenolcanada.com/StockAvailabilityPrice.aspx?From=&PartNum=12401610E4%7e2A")
    (tags "USB C Type-C Receptacle SMD")
    (attr smd)
    (fp_text reference J3 (at 6.65 -5.345) (layer F.SilkS))
    (fp_text value USB_C_Receptacle_USB2.0 (at 0 6.14) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad S1 thru_hole circle (at -4.13 -3.11 180) (size 1.4 1.4) (drill 1.1) (layers *.Cu *.Mask)
      (net 2 GND))
    (pad A1 smd rect (at -2.75 -5.02 180) (size 0.3 0.7) (layers F.Cu F.Paste F.Mask)
      (net 2 GND))
    (pad A2 smd rect (at -2.25 -5.02 180) (size 0.3 0.7) (layers F.Cu F.Paste F.Mask))
    (pad A3 smd rect (at -1.75 -5.02 180) (size 0.3 0.7) (layers F.Cu F.Paste F.Mask))
    (pad A4 smd rect (at -1.25 -5.02 180) (size 0.3 0.7) (layers F.Cu F.Paste F.Mask)
      (net 13 VBUS))
    (pad A5 smd rect (at -0.75 -5.02 180) (size 0.3 0.7) (layers F.Cu F.Paste F.Mask))
    (pad A6 smd rect (at -0.25 -5.02 180) (size 0.3 0.7) (layers F.Cu F.Paste F.Mask)
      (net 105 "/Microhard IO/D+"))
    (pad A7 smd rect (at 0.25 -5.02 180) (size 0.3 0.7) (layers F.Cu F.Paste F.Mask)
      (net 102 "/Microhard IO/D-"))
    (pad A12 smd rect (at 2.75 -5.02 180) (size 0.3 0.7) (layers F.Cu F.Paste F.Mask)
      (net 2 GND))
    (pad A10 smd rect (at 1.75 -5.02 180) (size 0.3 0.7) (layers F.Cu F.Paste F.Mask))
    (pad A9 smd rect (at 1.25 -5.02 180) (size 0.3 0.7) (layers F.Cu F.Paste F.Mask)
      (net 13 VBUS))
    (pad A8 smd rect (at 0.75 -5.02 180) (size 0.3 0.7) (layers F.Cu F.Paste F.Mask))
    (pad A11 smd rect (at 2.25 -5.02 180) (size 0.3 0.7) (layers F.Cu F.Paste F.Mask))
    (pad B1 smd rect (at 2.5 -3.32 180) (size 0.3 0.7) (layers F.Cu F.Paste F.Mask)
      (net 2 GND))
    (pad S1 thru_hole circle (at 4.13 -3.11 180) (size 1.4 1.4) (drill 1.1) (layers *.Cu *.Mask)
      (net 2 GND))
    (pad S1 thru_hole circle (at 4.49 2.84 180) (size 1.4 1.4) (drill 1.1) (layers *.Cu *.Mask)
      (net 2 GND))
    (pad S1 thru_hole circle (at -4.49 2.84 180) (size 1.4 1.4) (drill 1.1) (layers *.Cu *.Mask)
      (net 2 GND))
    (pad "" np_thru_hole circle (at 3.6 -4.36 180) (size 0.95 0.95) (drill 0.95) (layers *.Cu *.Mask))
    (pad "" np_thru_hole circle (at -3.6 -4.36 180) (size 0.65 0.65) (drill 0.65) (layers *.Cu *.Mask))
    (pad B2 smd rect (at 2 -3.32 180) (size 0.3 0.7) (layers F.Cu F.Paste F.Mask))
    (pad B3 smd rect (at 1.5 -3.32 180) (size 0.3 0.7) (layers F.Cu F.Paste F.Mask))
    (pad B4 smd rect (at 1 -3.32 180) (size 0.3 0.7) (layers F.Cu F.Paste F.Mask)
      (net 13 VBUS))
    (pad B5 smd rect (at 0.5 -3.32 180) (size 0.3 0.7) (layers F.Cu F.Paste F.Mask))
    (pad B6 smd rect (at 0 -3.32 180) (size 0.3 0.7) (layers F.Cu F.Paste F.Mask)
      (net 105 "/Microhard IO/D+"))
    (pad B7 smd rect (at -0.5 -3.32 180) (size 0.3 0.7) (layers F.Cu F.Paste F.Mask)
      (net 102 "/Microhard IO/D-"))
    (pad B8 smd rect (at -1 -3.32 180) (size 0.3 0.7) (layers F.Cu F.Paste F.Mask))
    (pad B9 smd rect (at -1.5 -3.32 180) (size 0.3 0.7) (layers F.Cu F.Paste F.Mask)
      (net 13 VBUS))
    (pad B10 smd rect (at -2 -3.32 180) (size 0.3 0.7) (layers F.Cu F.Paste F.Mask))
    (pad B11 smd rect (at -2.5 -3.32 180) (size 0.3 0.7) (layers F.Cu F.Paste F.Mask))
    (pad B12 smd rect (at -3 -3.32 180) (size 0.3 0.7) (layers F.Cu F.Paste F.Mask)
      (net 2 GND))
    (model ${KISYS3DMOD}/Connector_USB.3dshapes/USB_C_Receptacle_Amphenol_12401610E4-2A.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Package_TO_SOT_SMD:TO-263-5_TabPin3 (layer F.Cu) (tedit 5A70FBB6)
    (at 141.925 87.9 90)
    (descr "TO-263 / D2PAK / DDPAK SMD package, http://www.infineon.com/cms/en/product/packages/PG-TO263/PG-TO263-5-1/")
    (tags "D2PAK DDPAK TO-263 D2PAK-5 TO-263-5 SOT-426")
    (attr smd)
    (fp_text reference U4 (at 9 4.6) (layer F.SilkS))
    (fp_text value LP3876-ADJ (at 0 6.65 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 1 smd rect (at -5.775 -3.4 90) (size 4.6 1.1) (layers F.Cu F.Paste F.Mask)
      (net 86 "/Microhard Power/PWR_EN"))
    (pad 2 smd rect (at -5.775 -1.7 90) (size 4.6 1.1) (layers F.Cu F.Paste F.Mask)
      (net 100 +5V))
    (pad 3 smd rect (at -5.775 0 90) (size 4.6 1.1) (layers F.Cu F.Paste F.Mask)
      (net 2 GND))
    (pad 4 smd rect (at -5.775 1.7 90) (size 4.6 1.1) (layers F.Cu F.Paste F.Mask)
      (net 5 VDD))
    (pad 5 smd rect (at -5.775 3.4 90) (size 4.6 1.1) (layers F.Cu F.Paste F.Mask)
      (net 12 "Net-(C16-Pad2)"))
    (pad 3 smd rect (at 3.375 0 90) (size 9.4 10.8) (layers F.Cu F.Mask)
      (net 2 GND))
    (pad "" smd rect (at 5.8 2.775 90) (size 4.55 5.25) (layers F.Paste))
    (pad "" smd rect (at 0.95 -2.775 90) (size 4.55 5.25) (layers F.Paste))
    (pad "" smd rect (at 5.8 -2.775 90) (size 4.55 5.25) (layers F.Paste))
    (pad "" smd rect (at 0.95 2.775 90) (size 4.55 5.25) (layers F.Paste))
    (model ${KISYS3DMOD}/Package_TO_SOT_SMD.3dshapes/TO-263-5_TabPin3.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 146.558 128.016 90)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C12 (at 2.316 1.142 180) (layer F.SilkS))
    (fp_text value 3900pF (at 0 1.43 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 1 smd roundrect (at -0.875 0 90) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 10 "Net-(C12-Pad1)"))
    (pad 2 smd roundrect (at 0.875 0 90) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 2 GND))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBD)
    (at 98.738 49.45)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R16 (at 3.392 2.035) (layer F.SilkS))
    (fp_text value 549 (at 0 1.43) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 1 smd roundrect (at -0.875 0) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 100 +5V))
    (pad 2 smd roundrect (at 0.875 0) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 30 "Net-(D7-Pad2)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBD)
    (at 146.6 54.25 180)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R17 (at 0 -1.43) (layer F.SilkS))
    (fp_text value 549 (at 0 1.43) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd roundrect (at 0.875 0 180) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 34 "Net-(D9-Pad2)"))
    (pad 1 smd roundrect (at -0.875 0 180) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 100 +5V))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBD)
    (at 128.9 145.8)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R18 (at 0 -1.43) (layer F.SilkS))
    (fp_text value 549 (at 0 1.43) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 1 smd roundrect (at -0.875 0) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 100 +5V))
    (pad 2 smd roundrect (at 0.875 0) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 35 "Net-(D10-Pad2)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBD)
    (at 98.738 51.05)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R20 (at 0.082 1.605) (layer F.SilkS))
    (fp_text value 549 (at 0 1.43) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd roundrect (at 0.875 0) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 31 "Net-(D7-Pad4)"))
    (pad 1 smd roundrect (at -0.875 0) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 100 +5V))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (gr_text "Microhard Telemetry Modem R1\nSimpleUnmanned, LLC\nDesigned by: Andy Vaselaar" (at 72.62 59.945) (layer B.SilkS))
  (gr_text 1 (at 140 61.705) (layer F.SilkS))
  (gr_text 1 (at 128.47 100.695) (layer F.SilkS))
  (gr_line (start 111 100.51) (end 111 160.005) (layer Edge.Cuts) (width 0.05))
  (gr_line (start 111 160.005) (end 153 160.005) (layer Edge.Cuts) (width 0.05))
  (dimension 100 (width 0.15) (layer Dwgs.User)
    (gr_text "100.000 mm" (at 103 164.114) (layer Dwgs.User))
    (feature1 (pts (xy 153 160) (xy 153 163.400421)))
    (feature2 (pts (xy 53 160) (xy 53 163.400421)))
    (crossbar (pts (xy 53 162.814) (xy 153 162.814)))
    (arrow1a (pts (xy 153 162.814) (xy 151.873496 163.400421)))
    (arrow1b (pts (xy 153 162.814) (xy 151.873496 162.227579)))
    (arrow2a (pts (xy 53 162.814) (xy 54.126504 163.400421)))
    (arrow2b (pts (xy 53 162.814) (xy 54.126504 162.227579)))
  )
  (gr_line (start 60 100.51) (end 60 160) (layer Edge.Cuts) (width 0.05))
  (gr_line (start 60 100.51) (end 111 100.51) (layer Edge.Cuts) (width 0.05))
  (gr_line (start 153 40) (end 153 160) (layer Edge.Cuts) (width 0.05))
  (gr_line (start 53 160) (end 60 160) (layer Edge.Cuts) (width 0.05))
  (gr_line (start 53 40) (end 53 160) (layer Edge.Cuts) (width 0.05))
  (gr_line (start 53 40) (end 153 40) (layer Edge.Cuts) (width 0.05))
  (zone (net 2) (net_name GND) (layer B.Cu) (hatch edge 0.508)
    (connect_pads yes (clearance 0))
    (min_thickness 0.254)
    (fill yes (arc_segments 32) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 57.15 52.69) (xy 67.81 52.73) (xy 67.87 40.03) (xy 153 40.02) (xy 153.01 159.99)
        (xy 52.99 160.005) (xy 53 39.99) (xy 57.085 40.02)
      )
    )
  )
  (zone (net 0) (net_name "") (layer B.Mask) (hatch full 0.508)
    (connect_pads yes (clearance 0.508))
    (min_thickness 0.254)
    (fill yes (arc_segments 32) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 150.004168 40.035) (xy 152.97 40.035) (xy 152.97 159.965) (xy 149.99 159.965)
      )
    )
  )
  (zone (net 0) (net_name "") (layer B.Mask) (hatch full 0.508)
    (connect_pads yes (clearance 0.508))
    (min_thickness 0.254)
    (fill yes (arc_segments 32) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 53.03 40.035) (xy 56 40.035) (xy 56 159.965) (xy 53.04 159.965)
      )
    )
  )
)
