(kicad_pcb (version 20221018) (generator pcbnew)
  (general
    (thickness 1.6)
  )
  (paper "USLetter")
  (title_block
    (title "reQUAD")
    (date "2023-11-04")
    (rev "024")
    (company "Brian K. White - b.kenyon.w@gmail.com")
    (comment 1 "Original design by Steve Adolph")
  )
  (layers
    (0 "F.Cu" signal)
    (31 "B.Cu" signal)
    (32 "B.Adhes" user "B.Adhesive")
    (33 "F.Adhes" user "F.Adhesive")
    (34 "B.Paste" user)
    (35 "F.Paste" user)
    (36 "B.SilkS" user "B.Silkscreen")
    (37 "F.SilkS" user "F.Silkscreen")
    (38 "B.Mask" user)
    (39 "F.Mask" user)
    (40 "Dwgs.User" user "User.Drawings")
    (41 "Cmts.User" user "User.Comments")
    (42 "Eco1.User" user "User.Eco1")
    (43 "Eco2.User" user "User.Eco2")
    (44 "Edge.Cuts" user)
    (45 "Margin" user)
    (46 "B.CrtYd" user "B.Courtyard")
    (47 "F.CrtYd" user "F.Courtyard")
    (48 "B.Fab" user)
    (49 "F.Fab" user)
  )
  (setup
    (stackup
      (layer "F.SilkS" (type "Top Silk Screen"))
      (layer "F.Paste" (type "Top Solder Paste"))
      (layer "F.Mask" (type "Top Solder Mask") (thickness 0.01))
      (layer "F.Cu" (type "copper") (thickness 0.035))
      (layer "dielectric 1" (type "core") (thickness 1.51) (material "FR4") (epsilon_r 4.5) (loss_tangent 0.02))
      (layer "B.Cu" (type "copper") (thickness 0.035))
      (layer "B.Mask" (type "Bottom Solder Mask") (thickness 0.01))
      (layer "B.Paste" (type "Bottom Solder Paste"))
      (layer "B.SilkS" (type "Bottom Silk Screen"))
      (copper_finish "None")
      (dielectric_constraints no)
    )
    (pad_to_mask_clearance 0)
    (solder_mask_min_width 0.22)
    (allow_soldermask_bridges_in_footprints yes)
    (grid_origin 150 100)
    (pcbplotparams
      (layerselection 0x00010fc_ffffffff)
      (plot_on_all_layers_selection 0x0000000_00000000)
      (disableapertmacros false)
      (usegerberextensions true)
      (usegerberattributes false)
      (usegerberadvancedattributes true)
      (creategerberjobfile true)
      (dashed_line_dash_ratio 12.000000)
      (dashed_line_gap_ratio 3.000000)
      (svgprecision 6)
      (plotframeref false)
      (viasonmask false)
      (mode 1)
      (useauxorigin false)
      (hpglpennumber 1)
      (hpglpenspeed 20)
      (hpglpendiameter 15.000000)
      (dxfpolygonmode true)
      (dxfimperialunits true)
      (dxfusepcbnewfont true)
      (psnegative false)
      (psa4output false)
      (plotreference true)
      (plotvalue true)
      (plotinvisibletext false)
      (sketchpadsonfab false)
      (subtractmaskfromsilk false)
      (outputformat 1)
      (mirror false)
      (drillshape 0)
      (scaleselection 1)
      (outputdirectory "GERBER_${TITLE}_${REVISION}")
    )
  )
  (net 0 "")
  (net 1 "GND")
  (net 2 "/AD1")
  (net 3 "/AD3")
  (net 4 "/AD5")
  (net 5 "/AD7")
  (net 6 "/A9")
  (net 7 "/A11")
  (net 8 "/A13")
  (net 9 "/A15")
  (net 10 "/A14")
  (net 11 "/A12")
  (net 12 "/A10")
  (net 13 "/A8")
  (net 14 "/~{Y0}")
  (net 15 "/AD6")
  (net 16 "/AD4")
  (net 17 "/AD2")
  (net 18 "/AD0")
  (net 19 "VBUS")
  (net 20 "unconnected-(J1-CLK-Pad15)")
  (net 21 "unconnected-(J1-INTR-Pad17)")
  (net 22 "/A1")
  (net 23 "/A3")
  (net 24 "/A2")
  (net 25 "/A0")
  (net 26 "/A4")
  (net 27 "/A5")
  (net 28 "/A6")
  (net 29 "/A7")
  (net 30 "VMEM")
  (net 31 "unconnected-(J1-NC-Pad20)")
  (net 32 "unconnected-(J1-NC-Pad21)")
  (net 33 "unconnected-(J1-NC-Pad22)")
  (net 34 "unconnected-(J1-~{INTA}-Pad24)")
  (net 35 "unconnected-(J1-S1-Pad27)")
  (net 36 "unconnected-(J1-S0-Pad28)")
  (net 37 "/BUS_A15")
  (net 38 "/~{RD}")
  (net 39 "/A16")
  (net 40 "/RAM_RST")
  (net 41 "/IO{slash}~{M}")
  (net 42 "/ALE")
  (net 43 "unconnected-(J1-(A)-Pad16)")
  (net 44 "/RESET")
  (net 45 "/~{WR}")
  (net 46 "/RAM_CE2")
  (net 47 "/BANK_LATCH")
  (net 48 "/BATT+")
  (net 49 "Net-(U4-Pad2)")
  (net 50 "Net-(U4-Pad13)")
  (net 51 "Net-(C4-Pad1)")
  (net 52 "unconnected-(U1-NC-Pad9)")
  (footprint "000_LOCAL:TSSOP-20_4.4x6.5mm_P0.65mm" (layer "B.Cu")
    (at 128.4 98.05 -90)
    (descr "TSSOP, 20 Pin (JEDEC MO-153 Var AC https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator ipc_gullwing_generator.py")
    (tags "TSSOP SO")
    (property "Sheetfile" "reQUAD.kicad_sch")
    (property "Sheetname" "")
    (property "ki_description" "8-bit Latch 3-state outputs")
    (property "ki_keywords" "TTL DFF DFF8 LATCH 3State")
    (attr smd)
    (fp_text reference "U2" (at -0.9 0 -180) (layer "B.SilkS"))
    (fp_text value "74x573" (at 0.5 0 -180) (layer "B.SilkS"))
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "B.Fab"))
    (pad "1" smd roundrect (at -2.8625 2.925 270) (size 1.475 0.4) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
      (net 1 "GND") (pinfunction "~{OE}") (pintype "input"))
    (pad "2" smd roundrect (at -2.8625 2.275 270) (size 1.475 0.4) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
      (net 18 "/AD0") (pinfunction "D0") (pintype "input"))
    (pad "3" smd roundrect (at -2.8625 1.625 270) (size 1.475 0.4) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
      (net 2 "/AD1") (pinfunction "D1") (pintype "input"))
    (pad "4" smd roundrect (at -2.8625 0.975 270) (size 1.475 0.4) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
      (net 17 "/AD2") (pinfunction "D2") (pintype "input"))
    (pad "5" smd roundrect (at -2.8625 0.325 270) (size 1.475 0.4) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
      (net 3 "/AD3") (pinfunction "D3") (pintype "input"))
    (pad "6" smd roundrect (at -2.8625 -0.325 270) (size 1.475 0.4) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
      (net 16 "/AD4") (pinfunction "D4") (pintype "input"))
    (pad "7" smd roundrect (at -2.8625 -0.975 270) (size 1.475 0.4) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
      (net 4 "/AD5") (pinfunction "D5") (pintype "input"))
    (pad "8" smd roundrect (at -2.8625 -1.625 270) (size 1.475 0.4) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
      (net 15 "/AD6") (pinfunction "D6") (pintype "input"))
    (pad "9" smd roundrect (at -2.8625 -2.275 270) (size 1.475 0.4) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
      (net 5 "/AD7") (pinfunction "D7") (pintype "input"))
    (pad "10" smd roundrect (at -2.8625 -2.925 270) (size 1.475 0.4) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
      (net 1 "GND") (pinfunction "GND") (pintype "power_in"))
    (pad "11" smd roundrect (at 2.8625 -2.925 270) (size 1.475 0.4) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
      (net 42 "/ALE") (pinfunction "LE") (pintype "input"))
    (pad "12" smd roundrect (at 2.8625 -2.275 270) (size 1.475 0.4) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
      (net 29 "/A7") (pinfunction "Q7") (pintype "tri_state"))
    (pad "13" smd roundrect (at 2.8625 -1.625 270) (size 1.475 0.4) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
      (net 28 "/A6") (pinfunction "Q6") (pintype "tri_state"))
    (pad "14" smd roundrect (at 2.8625 -0.975 270) (size 1.475 0.4) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
      (net 27 "/A5") (pinfunction "Q5") (pintype "tri_state"))
    (pad "15" smd roundrect (at 2.8625 -0.325 270) (size 1.475 0.4) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
      (net 26 "/A4") (pinfunction "Q4") (pintype "tri_state"))
    (pad "16" smd roundrect (at 2.8625 0.325 270) (size 1.475 0.4) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
      (net 23 "/A3") (pinfunction "Q3") (pintype "tri_state"))
    (pad "17" smd roundrect (at 2.8625 0.975 270) (size 1.475 0.4) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
      (net 24 "/A2") (pinfunction "Q2") (pintype "tri_state"))
    (pad "18" smd roundrect (at 2.8625 1.625 270) (size 1.475 0.4) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
      (net 22 "/A1") (pinfunction "Q1") (pintype "tri_state"))
    (pad "19" smd roundrect (at 2.8625 2.275 270) (size 1.475 0.4) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
      (net 25 "/A0") (pinfunction "Q0") (pintype "tri_state"))
    (pad "20" smd roundrect (at 2.8625 2.925 270) (size 1.475 0.4) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
      (net 19 "VBUS") (pinfunction "VCC") (pintype "power_in"))
    (model "${KIPRJMOD}/000_LOCAL.pretty/000_3d/TSSOP-20_4.4x6.5mm_P0.65mm.step"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "000_LOCAL:TSSOP-14_4.4x5mm_P0.65mm" (layer "B.Cu")
    (at 161.125 97.75 -90)
    (descr "TSSOP, 14 Pin (JEDEC MO-153 Var AB-1 https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator ipc_gullwing_generator.py")
    (tags "TSSOP SO")
    (property "Sheetfile" "reQUAD.kicad_sch")
    (property "Sheetname" "")
    (property "ki_description" "quad 2-input NOR gate")
    (property "ki_keywords" "Nor2")
    (attr smd)
    (fp_text reference "U4" (at -0.575 -0.025 -180) (layer "B.SilkS"))
    (fp_text value "74x02" (at 1.025 0.025 -180) (layer "B.SilkS"))
    (fp_text user "${REFERENCE}" (at 0 0 -270) (layer "B.Fab"))
    (pad "1" smd roundrect (at -2.8625 1.95 270) (size 1.475 0.4) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
      (net 47 "/BANK_LATCH") (pintype "output"))
    (pad "2" smd roundrect (at -2.8625 1.3 270) (size 1.475 0.4) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
      (net 49 "Net-(U4-Pad2)") (pintype "input"))
    (pad "3" smd roundrect (at -2.8625 0.65 270) (size 1.475 0.4) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
      (net 49 "Net-(U4-Pad2)") (pintype "input"))
    (pad "4" smd roundrect (at -2.8625 0 270) (size 1.475 0.4) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
      (net 49 "Net-(U4-Pad2)") (pintype "output"))
    (pad "5" smd roundrect (at -2.8625 -0.65 270) (size 1.475 0.4) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
      (net 45 "/~{WR}") (pintype "input"))
    (pad "6" smd roundrect (at -2.8625 -1.3 270) (size 1.475 0.4) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
      (net 14 "/~{Y0}") (pintype "input"))
    (pad "7" smd roundrect (at -2.8625 -1.95 270) (size 1.475 0.4) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
      (net 1 "GND") (pinfunction "GND") (pintype "power_in"))
    (pad "8" smd roundrect (at 2.8625 -1.95 270) (size 1.475 0.4) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
      (net 44 "/RESET") (pintype "input"))
    (pad "9" smd roundrect (at 2.8625 -1.3 270) (size 1.475 0.4) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
      (net 50 "Net-(U4-Pad13)") (pintype "input"))
    (pad "10" smd roundrect (at 2.8625 -0.65 270) (size 1.475 0.4) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
      (net 46 "/RAM_CE2") (pintype "output"))
    (pad "11" smd roundrect (at 2.8625 0 270) (size 1.475 0.4) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
      (net 37 "/BUS_A15") (pintype "input"))
    (pad "12" smd roundrect (at 2.8625 0.65 270) (size 1.475 0.4) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
      (net 37 "/BUS_A15") (pintype "input"))
    (pad "13" smd roundrect (at 2.8625 1.3 270) (size 1.475 0.4) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
      (net 50 "Net-(U4-Pad13)") (pintype "output"))
    (pad "14" smd roundrect (at 2.8625 1.95 270) (size 1.475 0.4) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
      (net 19 "VBUS") (pinfunction "VCC") (pintype "power_in"))
    (model "${KIPRJMOD}/000_LOCAL.pretty/000_3d/TSSOP-14_4.4x5mm_P0.65mm.step"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "000_LOCAL:DIP-40_PCB" (layer "B.Cu")
    (at 149.999293 100.000707)
    (descr "40-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils)")
    (tags "THT DIP DIL PDIP 2.54mm 15.24mm 600mil")
    (property "Sheetfile" "reQUAD.kicad_sch")
    (property "Sheetname" "")
    (attr through_hole)
    (fp_text reference "J1" (at 0 1.524 180) (layer "B.SilkS") hide)
    (fp_text value "Model_100_System_BUS" (at -25.1206 5.3848 180 unlocked) (layer "B.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0 180) (layer "B.Fab"))
    (fp_line (start -25.654 -8.636) (end -25.654 2.159)
      (layer "Edge.Cuts"))
    (fp_line (start -25.654 5.207) (end -25.654 8.636)
      (layer "Edge.Cuts"))
    (fp_line (start -25.146 9.144) (end 25.146 9.144)
      (layer "Edge.Cuts"))
    (fp_line (start 25.146 -9.144) (end -25.146 -9.144)
      (layer "Edge.Cuts"))
    (fp_line (start 25.654 8.636) (end 25.654 -8.636)
      (layer "Edge.Cuts"))
    (fp_arc (start -25.654 -8.636) (mid -25.50521 -8.99521) (end -25.146 -9.144)
      (layer "Edge.Cuts"))
    (fp_arc (start -25.654 5.207) (mid -25.61997 5.080003) (end -25.527 4.987036)
      (layer "Edge.Cuts"))
    (fp_arc (start -25.527 2.378964) (mid -25.61997 2.285997) (end -25.654 2.159)
      (layer "Edge.Cuts"))
    (fp_arc (start -25.527 2.378964) (mid -24.774114 3.683) (end -25.527 4.987036)
      (layer "Edge.Cuts"))
    (fp_arc (start -25.146 9.144) (mid -25.50521 8.99521) (end -25.654 8.636)
      (layer "Edge.Cuts"))
    (fp_arc (start 25.146 -9.144) (mid 25.50521 -8.99521) (end 25.654 -8.636)
      (layer "Edge.Cuts"))
    (fp_arc (start 25.654 8.636) (mid 25.50521 8.99521) (end 25.146 9.144)
      (layer "Edge.Cuts"))
    (pad "1" thru_hole roundrect (at -24.13 7.62 270) (size 1.524 1.524) (drill 0.7112) (layers "*.Cu" "*.Mask") (roundrect_rratio 0.25)
      (net 19 "VBUS") (pinfunction "VCC") (pintype "power_out"))
    (pad "2" thru_hole circle (at -21.59 7.62 270) (size 1.524 1.524) (drill 0.7112) (layers "*.Cu" "*.Mask")
      (net 1 "GND") (pinfunction "GND") (pintype "power_out") (zone_connect 1) (thermal_bridge_width 0.4) (thermal_gap 0.2))
    (pad "3" thru_hole circle (at -19.05 7.62 270) (size 1.524 1.524) (drill 0.7112) (layers "*.Cu" "*.Mask")
      (net 18 "/AD0") (pinfunction "AD0") (pintype "bidirectional"))
    (pad "4" thru_hole circle (at -16.51 7.62 270) (size 1.524 1.524) (drill 0.7112) (layers "*.Cu" "*.Mask")
      (net 17 "/AD2") (pinfunction "AD2") (pintype "bidirectional"))
    (pad "5" thru_hole circle (at -13.97 7.62 270) (size 1.524 1.524) (drill 0.7112) (layers "*.Cu" "*.Mask")
      (net 16 "/AD4") (pinfunction "AD4") (pintype "bidirectional"))
    (pad "6" thru_hole circle (at -11.43 7.62 270) (size 1.524 1.524) (drill 0.7112) (layers "*.Cu" "*.Mask")
      (net 15 "/AD6") (pinfunction "AD6") (pintype "bidirectional"))
    (pad "7" thru_hole circle (at -8.89 7.62 270) (size 1.524 1.524) (drill 0.7112) (layers "*.Cu" "*.Mask")
      (net 13 "/A8") (pinfunction "A8") (pintype "output"))
    (pad "8" thru_hole circle (at -6.35 7.62 270) (size 1.524 1.524) (drill 0.7112) (layers "*.Cu" "*.Mask")
      (net 12 "/A10") (pinfunction "A10") (pintype "output"))
    (pad "9" thru_hole circle (at -3.81 7.62 270) (size 1.524 1.524) (drill 0.7112) (layers "*.Cu" "*.Mask")
      (net 11 "/A12") (pinfunction "A12") (pintype "output"))
    (pad "10" thru_hole circle (at -1.27 7.62 270) (size 1.524 1.524) (drill 0.7112) (layers "*.Cu" "*.Mask")
      (net 10 "/A14") (pinfunction "A14") (pintype "output"))
    (pad "11" thru_hole circle (at 1.27 7.62 270) (size 1.524 1.524) (drill 0.7112) (layers "*.Cu" "*.Mask")
      (net 1 "GND") (pinfunction "GND") (pintype "passive") (zone_connect 1) (thermal_bridge_width 0.4) (thermal_gap 0.2))
    (pad "12" thru_hole circle (at 3.81 7.62 270) (size 1.524 1.524) (drill 0.7112) (layers "*.Cu" "*.Mask")
      (net 38 "/~{RD}") (pinfunction "~{RD}") (pintype "output"))
    (pad "13" thru_hole circle (at 6.35 7.62 270) (size 1.524 1.524) (drill 0.7112) (layers "*.Cu" "*.Mask")
      (net 41 "/IO{slash}~{M}") (pinfunction "IO/~{M}") (pintype "output"))
    (pad "14" thru_hole circle (at 8.89 7.62 270) (size 1.524 1.524) (drill 0.7112) (layers "*.Cu" "*.Mask")
      (net 42 "/ALE") (pinfunction "ALE") (pintype "output"))
    (pad "15" thru_hole circle (at 11.43 7.62 270) (size 1.524 1.524) (drill 0.7112) (layers "*.Cu" "*.Mask")
      (net 20 "unconnected-(J1-CLK-Pad15)") (pinfunction "CLK") (pintype "output+no_connect"))
    (pad "16" thru_hole circle (at 13.97 7.62 270) (size 1.524 1.524) (drill 0.7112) (layers "*.Cu" "*.Mask")
      (net 43 "unconnected-(J1-(A)-Pad16)") (pinfunction "(A)") (pintype "output+no_connect"))
    (pad "17" thru_hole circle (at 16.51 7.62 270) (size 1.524 1.524) (drill 0.7112) (layers "*.Cu" "*.Mask")
      (net 21 "unconnected-(J1-INTR-Pad17)") (pinfunction "INTR") (pintype "input+no_connect"))
    (pad "18" thru_hole circle (at 19.05 7.62 270) (size 1.524 1.524) (drill 0.7112) (layers "*.Cu" "*.Mask")
      (net 1 "GND") (pinfunction "GND") (pintype "passive") (zone_connect 1) (thermal_bridge_width 0.4) (thermal_gap 0.2))
    (pad "19" thru_hole circle (at 21.59 7.62 270) (size 1.524 1.524) (drill 0.7112) (layers "*.Cu" "*.Mask")
      (net 40 "/RAM_RST") (pinfunction "RAM_RST") (pintype "output"))
    (pad "20" thru_hole circle (at 24.13 7.62 270) (size 1.524 1.524) (drill 0.7112) (layers "*.Cu" "*.Mask")
      (net 31 "unconnected-(J1-NC-Pad20)") (pinfunction "NC") (pintype "no_connect"))
    (pad "21" thru_hole circle (at 24.13 -7.62 270) (size 1.524 1.524) (drill 0.7112) (layers "*.Cu" "*.Mask")
      (net 32 "unconnected-(J1-NC-Pad21)") (pinfunction "NC") (pintype "no_connect"))
    (pad "22" thru_hole circle (at 21.59 -7.62 270) (size 1.524 1.524) (drill 0.7112) (layers "*.Cu" "*.Mask")
      (net 33 "unconnected-(J1-NC-Pad22)") (pinfunction "NC") (pintype "no_connect"))
    (pad "23" thru_hole circle (at 19.05 -7.62 270) (size 1.524 1.524) (drill 0.7112) (layers "*.Cu" "*.Mask")
      (net 1 "GND") (pinfunction "GND") (pintype "passive") (zone_connect 1) (thermal_bridge_width 0.4) (thermal_gap 0.2))
    (pad "24" thru_hole circle (at 16.51 -7.62 270) (size 1.524 1.524) (drill 0.7112) (layers "*.Cu" "*.Mask")
      (net 34 "unconnected-(J1-~{INTA}-Pad24)") (pinfunction "~{INTA}") (pintype "output+no_connect"))
    (pad "25" thru_hole circle (at 13.97 -7.62 270) (size 1.524 1.524) (drill 0.7112) (layers "*.Cu" "*.Mask")
      (net 44 "/RESET") (pinfunction "RESET") (pintype "output"))
    (pad "26" thru_hole circle (at 11.43 -7.62 270) (size 1.524 1.524) (drill 0.7112) (layers "*.Cu" "*.Mask")
      (net 14 "/~{Y0}") (pinfunction "~{Y0}") (pintype "output"))
    (pad "27" thru_hole circle (at 8.89 -7.62 270) (size 1.524 1.524) (drill 0.7112) (layers "*.Cu" "*.Mask")
      (net 35 "unconnected-(J1-S1-Pad27)") (pinfunction "S1") (pintype "output+no_connect"))
    (pad "28" thru_hole circle (at 6.35 -7.62 270) (size 1.524 1.524) (drill 0.7112) (layers "*.Cu" "*.Mask")
      (net 36 "unconnected-(J1-S0-Pad28)") (pinfunction "S0") (pintype "output+no_connect"))
    (pad "29" thru_hole circle (at 3.81 -7.62 270) (size 1.524 1.524) (drill 0.7112) (layers "*.Cu" "*.Mask")
      (net 45 "/~{WR}") (pinfunction "~{WR}") (pintype "output"))
    (pad "30" thru_hole circle (at 1.27 -7.62 270) (size 1.524 1.524) (drill 0.7112) (layers "*.Cu" "*.Mask")
      (net 1 "GND") (pinfunction "GND") (pintype "passive") (zone_connect 1) (thermal_bridge_width 0.4) (thermal_gap 0.2))
    (pad "31" thru_hole circle (at -1.27 -7.62 270) (size 1.524 1.524) (drill 0.7112) (layers "*.Cu" "*.Mask")
      (net 37 "/BUS_A15") (pinfunction "A15") (pintype "output"))
    (pad "32" thru_hole circle (at -3.81 -7.62 270) (size 1.524 1.524) (drill 0.7112) (layers "*.Cu" "*.Mask")
      (net 8 "/A13") (pinfunction "A13") (pintype "output"))
    (pad "33" thru_hole circle (at -6.35 -7.62 270) (size 1.524 1.524) (drill 0.7112) (layers "*.Cu" "*.Mask")
      (net 7 "/A11") (pinfunction "A11") (pintype "output"))
    (pad "34" thru_hole circle (at -8.89 -7.62 270) (size 1.524 1.524) (drill 0.7112) (layers "*.Cu" "*.Mask")
      (net 6 "/A9") (pinfunction "A9") (pintype "output"))
    (pad "35" thru_hole circle (at -11.43 -7.62 270) (size 1.524 1.524) (drill 0.7112) (layers "*.Cu" "*.Mask")
      (net 5 "/AD7") (pinfunction "AD7") (pintype "bidirectional"))
    (pad "36" thru_hole circle (at -13.97 -7.62 270) (size 1.524 1.524) (drill 0.7112) (layers "*.Cu" "*.Mask")
      (net 4 "/AD5") (pinfunction "AD5") (pintype "bidirectional"))
    (pad "37" thru_hole circle (at -16.51 -7.62 270) (size 1.524 1.524) (drill 0.7112) (layers "*.Cu" "*.Mask")
      (net 3 "/AD3") (pinfunction "AD3") (pintype "bidirectional"))
    (pad "38" thru_hole circle (at -19.05 -7.62 270) (size 1.524 1.524) (drill 0.7112) (layers "*.Cu" "*.Mask")
      (net 2 "/AD1") (pinfunction "AD1") (pintype "bidirectional"))
    (pad "39" thru_hole circle (at -21.59 -7.62 270) (size 1.524 1.524) (drill 0.7112) (layers "*.Cu" "*.Mask")
      (net 1 "GND") (pinfunction "GND") (pintype "passive") (zone_connect 1) (thermal_bridge_width 0.4) (thermal_gap 0.2))
    (pad "40" thru_hole circle (at -24.13 -7.62 270) (size 1.524 1.524) (drill 0.7112) (layers "*.Cu" "*.Mask")
      (net 19 "VBUS") (pinfunction "VCC") (pintype "passive"))
    (model "${KIPRJMOD}/000_LOCAL.pretty/000_3d/pin_header_round_cut_DIP-40.step"
      (offset (xyz -24.13 -7.62 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
    (model "${KIPRJMOD}/000_LOCAL.pretty/000_3d/solder_domes_DIP-40.step"
      (offset (xyz -24.13 -7.62 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "000_LOCAL:C_0805" (layer "B.Cu")
    (at 154.9 99.55 -90)
    (descr "Capacitor SMD 0805, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0805")
    (property "Sheetfile" "reQUAD.kicad_sch")
    (property "Sheetname" "")
    (property "ki_description" "Unpolarized capacitor, small symbol")
    (property "ki_keywords" "capacitor cap")
    (attr smd)
    (fp_text reference "C2" (at 2.075 0.05 unlocked) (layer "B.SilkS"))
    (fp_text value "1u" (at 2.25 0.65 90 unlocked) (layer "B.Fab"))
    (fp_text user "${REFERENCE}" (at 0 1.5 90) (layer "B.Fab"))
    (pad "1" smd roundrect (at -1 0 270) (size 1 1.25) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.1)
      (net 30 "VMEM") (pintype "passive"))
    (pad "2" smd roundrect (at 1 0 270) (size 1 1.25) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.1)
      (net 1 "GND") (pintype "passive"))
    (model "${KIPRJMOD}/000_LOCAL.pretty/000_3d/C_0805.step"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "000_LOCAL:VSSOP-8_2.3x2mm_P0.5mm" (layer "B.Cu")
    (at 150 104.95 180)
    (descr "VSSOP-8 2.3x2mm Pitch 0.5mm")
    (tags "VSSOP-8 2.3x2mm Pitch 0.5mm")
    (property "Sheetfile" "reQUAD.kicad_sch")
    (property "Sheetname" "")
    (property "ki_description" "Dual D Flip-Flop, Low-Voltage CMOS")
    (property "ki_keywords" "Dual D Flip-Flop D CMOS")
    (attr smd)
    (fp_text reference "U3" (at 2.2 0.632 unlocked) (layer "B.SilkS"))
    (fp_text value "74x2G79" (at 2.25 -0.65 unlocked) (layer "B.SilkS"))
    (fp_text user "${REFERENCE}" (at 0 0) (layer "B.Fab"))
    (pad "1" smd roundrect (at -1.55 0.75 270) (size 0.3 0.8) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.18)
      (net 47 "/BANK_LATCH") (pinfunction "C") (pintype "input"))
    (pad "2" smd roundrect (at -1.55 0.25 270) (size 0.3 0.8) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.18)
      (net 18 "/AD0") (pinfunction "D") (pintype "input"))
    (pad "3" smd roundrect (at -1.55 -0.25 270) (size 0.3 0.8) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.18)
      (net 39 "/A16") (pinfunction "Q") (pintype "output"))
    (pad "4" smd roundrect (at -1.55 -0.75 270) (size 0.3 0.8) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.18)
      (net 1 "GND") (pinfunction "GND") (pintype "power_in"))
    (pad "5" smd roundrect (at 1.55 -0.75 270) (size 0.3 0.8) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.18)
      (net 47 "/BANK_LATCH") (pinfunction "C") (pintype "input"))
    (pad "6" smd roundrect (at 1.55 -0.25 270) (size 0.3 0.8) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.18)
      (net 2 "/AD1") (pinfunction "D") (pintype "input"))
    (pad "7" smd roundrect (at 1.55 0.25 270) (size 0.3 0.8) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.18)
      (net 9 "/A15") (pinfunction "Q") (pintype "output"))
    (pad "8" smd roundrect (at 1.55 0.75 270) (size 0.3 0.8) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.18)
      (net 19 "VBUS") (pinfunction "VCC") (pintype "power_in"))
    (model "${KIPRJMOD}/000_LOCAL.pretty/000_3d/VSSOP-8_2.3x2mm_P0.5mm.step"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "000_LOCAL:Keystone_3031" (layer "B.Cu")
    (at 170.32 100 -90)
    (property "Sheetfile" "reQUAD.kicad_sch")
    (property "Sheetname" "")
    (property "ki_description" "Single-cell battery")
    (property "ki_keywords" "battery cell")
    (attr through_hole)
    (fp_text reference "BT1" (at -6.2992 4.5212 90 unlocked) (layer "B.SilkS"))
    (fp_text value "BAT_3031" (at -6.2992 5.7912 90 unlocked) (layer "B.SilkS"))
    (pad "1" thru_hole oval (at -5.3 0 270) (size 1.4 4) (drill oval 0.8 1.8) (layers "*.Cu" "*.Mask")
      (net 48 "/BATT+") (pinfunction "+") (pintype "passive"))
    (pad "1" thru_hole oval (at 5.3 0 270) (size 1.4 4) (drill oval 0.8 1.8) (layers "*.Cu" "*.Mask")
      (net 48 "/BATT+") (pinfunction "+") (pintype "passive"))
    (pad "2" smd circle (at 0 0 270) (size 8 8) (layers "B.Cu" "B.Mask")
      (net 1 "GND") (pinfunction "-") (pintype "passive") (solder_mask_margin 0.2) (zone_connect 2))
    (model "${KIPRJMOD}/000_LOCAL.pretty/000_3d/Keystone_3031.step"
      (offset (xyz 0 -4 2.8))
      (scale (xyz 1 1 1))
      (rotate (xyz -90 0 180))
    )
    (model "${KIPRJMOD}/000_LOCAL.pretty/000_3d/CR1025_blank.step"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "000_LOCAL:R_0805" (layer "B.Cu")
    (at 155 95.875 90)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor")
    (property "Sheetfile" "reQUAD.kicad_sch")
    (property "Sheetname" "")
    (property "ki_description" "Resistor, small symbol")
    (property "ki_keywords" "R resistor")
    (attr smd)
    (fp_text reference "R2" (at 0.475 1.225 90 unlocked) (layer "B.SilkS"))
    (fp_text value "470k" (at -2 -0.075 unlocked) (layer "B.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "B.Fab"))
    (pad "1" smd roundrect (at -0.9125 0 90) (size 1.025 1.4) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.243902439)
      (net 46 "/RAM_CE2") (pintype "passive"))
    (pad "2" smd roundrect (at 0.9125 0 90) (size 1.025 1.4) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.243902439)
      (net 1 "GND") (pintype "passive"))
    (model "${KIPRJMOD}/000_LOCAL.pretty/000_3d/R_0805.step"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "000_LOCAL:Fiducial_0.5_1.0" (layer "B.Cu")
    (at 125.75 105.5)
    (descr "Circular Fiducial, 0.5mm bare copper, 1mm soldermask opening (Level C)")
    (tags "fiducial")
    (attr smd board_only exclude_from_bom allow_missing_courtyard)
    (fp_text reference "F1" (at 0 1.5 180) (layer "B.SilkS") hide)
    (fp_text value "Fiducial_0.5_1.0" (at 0 -1.5 180) (layer "B.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0 180) (layer "B.Fab"))
    (pad "" smd circle (at 0 0) (size 0.5 0.5) (layers "B.Cu" "B.Mask")
      (solder_mask_margin 0.25) (clearance 0.25))
  )
  (footprint "000_LOCAL:TSOP32-dual" (layer "B.Cu")
    (at 143.25 98.45 180)
    (descr "Module CMS TSOP 32 pins")
    (tags "CMS TSOP")
    (property "Sheetfile" "reQUAD.kicad_sch")
    (property "Sheetname" "")
    (property "ki_description" "128K x 8 High-Speed CMOS Static RAM, 55/70ns, TSOP-I-32")
    (property "ki_keywords" "RAM SRAM CMOS MEMORY")
    (attr smd)
    (fp_text reference "U1" (at -3 1.5 unlocked) (layer "B.SilkS"))
    (fp_text value "AS6C1008" (at -3 -1.5 unlocked) (layer "B.SilkS"))
    (pad "1" smd roundrect (at -9.85 3.75 270) (size 0.3 0.9) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
      (net 8 "/A13") (pinfunction "A11") (pintype "input"))
    (pad "2" smd roundrect (at -9.85 3.25 270) (size 0.3 0.9) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
      (net 7 "/A11") (pinfunction "A9") (pintype "input"))
    (pad "3" smd roundrect (at -9.85 2.75 270) (size 0.3 0.9) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
      (net 6 "/A9") (pinfunction "A8") (pintype "input"))
    (pad "4" smd roundrect (at -9.85 2.25 270) (size 0.3 0.9) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
      (net 13 "/A8") (pinfunction "A13") (pintype "input"))
    (pad "5" smd roundrect (at -9.85 1.75 270) (size 0.3 0.9) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
      (net 45 "/~{WR}") (pinfunction "~{WE}") (pintype "input"))
    (pad "6" smd roundrect (at -9.85 1.25 270) (size 0.3 0.9) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
      (net 46 "/RAM_CE2") (pinfunction "CS2") (pintype "input"))
    (pad "7" smd roundrect (at -9.85 0.75 270) (size 0.3 0.9) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
      (net 9 "/A15") (pinfunction "A15") (pintype "input"))
    (pad "8" smd roundrect (at -9.85 0.25 270) (size 0.3 0.9) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
      (net 30 "VMEM") (pinfunction "VCC") (pintype "power_in"))
    (pad "9" smd roundrect (at -9.85 -0.25 270) (size 0.3 0.9) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
      (net 52 "unconnected-(U1-NC-Pad9)") (pinfunction "NC") (pintype "no_connect"))
    (pad "10" smd roundrect (at -9.85 -0.75 270) (size 0.3 0.9) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
      (net 39 "/A16") (pinfunction "A16") (pintype "input"))
    (pad "11" smd roundrect (at -9.85 -1.25 270) (size 0.3 0.9) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
      (net 11 "/A12") (pinfunction "A14") (pintype "input"))
    (pad "12" smd roundrect (at -9.85 -1.75 270) (size 0.3 0.9) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
      (net 10 "/A14") (pinfunction "A12") (pintype "input"))
    (pad "13" smd roundrect (at -9.85 -2.25 270) (size 0.3 0.9) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
      (net 23 "/A3") (pinfunction "A7") (pintype "input"))
    (pad "14" smd roundrect (at -9.85 -2.75 270) (size 0.3 0.9) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
      (net 24 "/A2") (pinfunction "A6") (pintype "input"))
    (pad "15" smd roundrect (at -9.85 -3.25 270) (size 0.3 0.9) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
      (net 22 "/A1") (pinfunction "A5") (pintype "input"))
    (pad "16" smd roundrect (at -9.85 -3.75 270) (size 0.3 0.9) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
      (net 25 "/A0") (pinfunction "A4") (pintype "input"))
    (pad "17" smd roundrect (at 3.65 -3.75 270) (size 0.3 0.9) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
      (net 26 "/A4") (pinfunction "A3") (pintype "input"))
    (pad "17" smd roundrect (at 9.85 -3.75 270) (size 0.3 0.9) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
      (net 26 "/A4") (pinfunction "A3") (pintype "input"))
    (pad "18" smd roundrect (at 3.65 -3.25 270) (size 0.3 0.9) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
      (net 27 "/A5") (pinfunction "A2") (pintype "input"))
    (pad "18" smd roundrect (at 9.85 -3.25 270) (size 0.3 0.9) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
      (net 27 "/A5") (pinfunction "A2") (pintype "input"))
    (pad "19" smd roundrect (at 3.65 -2.75 270) (size 0.3 0.9) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
      (net 28 "/A6") (pinfunction "A1") (pintype "input"))
    (pad "19" smd roundrect (at 9.85 -2.75 270) (size 0.3 0.9) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
      (net 28 "/A6") (pinfunction "A1") (pintype "input"))
    (pad "20" smd roundrect (at 3.65 -2.25 270) (size 0.3 0.9) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
      (net 29 "/A7") (pinfunction "A0") (pintype "input"))
    (pad "20" smd roundrect (at 9.85 -2.25 270) (size 0.3 0.9) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
      (net 29 "/A7") (pinfunction "A0") (pintype "input"))
    (pad "21" smd roundrect (at 3.65 -1.75 270) (size 0.3 0.9) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
      (net 18 "/AD0") (pinfunction "Q0") (pintype "tri_state"))
    (pad "21" smd roundrect (at 9.85 -1.75 270) (size 0.3 0.9) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
      (net 18 "/AD0") (pinfunction "Q0") (pintype "tri_state"))
    (pad "22" smd roundrect (at 3.65 -1.25 270) (size 0.3 0.9) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
      (net 2 "/AD1") (pinfunction "Q1") (pintype "tri_state"))
    (pad "22" smd roundrect (at 9.85 -1.25 270) (size 0.3 0.9) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
      (net 2 "/AD1") (pinfunction "Q1") (pintype "tri_state"))
    (pad "23" smd roundrect (at 3.65 -0.75 270) (size 0.3 0.9) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
      (net 17 "/AD2") (pinfunction "Q2") (pintype "tri_state"))
    (pad "23" smd roundrect (at 9.85 -0.75 270) (size 0.3 0.9) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
      (net 17 "/AD2") (pinfunction "Q2") (pintype "tri_state"))
    (pad "24" smd roundrect (at 3.65 -0.25 270) (size 0.3 0.9) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
      (net 1 "GND") (pinfunction "GND") (pintype "power_in"))
    (pad "24" smd roundrect (at 9.85 -0.25 270) (size 0.3 0.9) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
      (net 1 "GND") (pinfunction "GND") (pintype "power_in"))
    (pad "25" smd roundrect (at 3.65 0.25 270) (size 0.3 0.9) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
      (net 3 "/AD3") (pinfunction "Q3") (pintype "tri_state"))
    (pad "25" smd roundrect (at 9.85 0.25 270) (size 0.3 0.9) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
      (net 3 "/AD3") (pinfunction "Q3") (pintype "tri_state"))
    (pad "26" smd roundrect (at 3.65 0.75 270) (size 0.3 0.9) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
      (net 16 "/AD4") (pinfunction "Q4") (pintype "tri_state"))
    (pad "26" smd roundrect (at 9.85 0.75 270) (size 0.3 0.9) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
      (net 16 "/AD4") (pinfunction "Q4") (pintype "tri_state"))
    (pad "27" smd roundrect (at 3.65 1.25 270) (size 0.3 0.9) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
      (net 4 "/AD5") (pinfunction "Q5") (pintype "tri_state"))
    (pad "27" smd roundrect (at 9.85 1.25 270) (size 0.3 0.9) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
      (net 4 "/AD5") (pinfunction "Q5") (pintype "tri_state"))
    (pad "28" smd roundrect (at 3.65 1.75 270) (size 0.3 0.9) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
      (net 15 "/AD6") (pinfunction "Q6") (pintype "tri_state"))
    (pad "28" smd roundrect (at 9.85 1.75 270) (size 0.3 0.9) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
      (net 15 "/AD6") (pinfunction "Q6") (pintype "tri_state"))
    (pad "29" smd roundrect (at 3.65 2.25 270) (size 0.3 0.9) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
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