(kicad_pcb (version 20211014) (generator pcbnew)
  (general
    (thickness 1.5672)
  )
  (paper "A4")
  (layers
    (0 "F.Cu" signal)
    (1 "In1.Cu" signal)
    (2 "In2.Cu" signal)
    (31 "B.Cu" signal)
    (32 "B.Adhes" user "B.Adhesive")
    (33 "F.Adhes" user "F.Adhesive")
    (34 "B.Paste" user)
    (35 "F.Paste" user)
    (36 "B.SilkS" user "B.Silkscreen")
    (37 "F.SilkS" user "F.Silkscreen")
    (38 "B.Mask" user)
    (39 "F.Mask" user)
    (40 "Dwgs.User" user "User.Drawings")
    (41 "Cmts.User" user "User.Comments")
    (42 "Eco1.User" user "User.Eco1")
    (43 "Eco2.User" user "User.Eco2")
    (44 "Edge.Cuts" user)
    (45 "Margin" user)
    (46 "B.CrtYd" user "B.Courtyard")
    (47 "F.CrtYd" user "F.Courtyard")
    (48 "B.Fab" user)
    (49 "F.Fab" user)
    (50 "User.1" user)
    (51 "User.2" user)
    (52 "User.3" user)
    (53 "User.4" user)
    (54 "User.5" user)
    (55 "User.6" user)
    (56 "User.7" user)
    (57 "User.8" user)
    (58 "User.9" user)
  )
  (setup
    (stackup
      (layer "F.SilkS" (type "Top Silk Screen") (color "White"))
      (layer "F.Paste" (type "Top Solder Paste"))
      (layer "F.Mask" (type "Top Solder Mask") (color "Purple") (thickness 0.0254))
      (layer "F.Cu" (type "copper") (thickness 0.0432))
      (layer "dielectric 1" (type "prepreg") (thickness 0.202) (material "FR408-HR") (epsilon_r 3.69) (loss_tangent 0.0091))
      (layer "In1.Cu" (type "copper") (thickness 0.0175))
      (layer "dielectric 2" (type "core") (thickness 0.991) (material "FR408-HR") (epsilon_r 3.69) (loss_tangent 0.0091))
      (layer "In2.Cu" (type "copper") (thickness 0.0175))
      (layer "dielectric 3" (type "prepreg") (thickness 0.202) (material "FR408-HR") (epsilon_r 3.69) (loss_tangent 0.0091))
      (layer "B.Cu" (type "copper") (thickness 0.0432))
      (layer "B.Mask" (type "Bottom Solder Mask") (color "Purple") (thickness 0.0254))
      (layer "B.Paste" (type "Bottom Solder Paste"))
      (layer "B.SilkS" (type "Bottom Silk Screen") (color "White"))
      (copper_finish "ENIG")
      (dielectric_constraints no)
    )
    (pad_to_mask_clearance 0.0762)
    (solder_mask_min_width 0.1016)
    (pcbplotparams
      (layerselection 0x00010fc_ffffffff)
      (disableapertmacros false)
      (usegerberextensions false)
      (usegerberattributes true)
      (usegerberadvancedattributes true)
      (creategerberjobfile true)
      (svguseinch false)
      (svgprecision 6)
      (excludeedgelayer true)
      (plotframeref false)
      (viasonmask false)
      (mode 1)
      (useauxorigin false)
      (hpglpennumber 1)
      (hpglpenspeed 20)
      (hpglpendiameter 15.000000)
      (dxfpolygonmode true)
      (dxfimperialunits true)
      (dxfusepcbnewfont true)
      (psnegative false)
      (psa4output false)
      (plotreference true)
      (plotvalue true)
      (plotinvisibletext false)
      (sketchpadsonfab false)
      (subtractmaskfromsilk false)
      (outputformat 1)
      (mirror false)
      (drillshape 1)
      (scaleselection 1)
      (outputdirectory "")
    )
  )
  (net 0 "")
  (net 1 "GND")
  (net 2 "+5V")
  (net 3 "unconnected-(IC11-Pad1)")
  (net 4 "unconnected-(IC12-Pad7)")
  (net 5 "+12V")
  (net 6 "-12V")
  (net 7 "/TIA1/VSUM")
  (net 8 "/TIA1/VPDB")
  (net 9 "/TIA1/VLOG")
  (net 10 "/TIA1/STAGE_2_IN-")
  (net 11 "CH1-")
  (net 12 "CH1+")
  (net 13 "/TIA2/VSUM")
  (net 14 "/TIA2/VPDB")
  (net 15 "/TIA2/VLOG")
  (net 16 "/TIA2/STAGE_2_IN-")
  (net 17 "CH2-")
  (net 18 "CH2+")
  (net 19 "/TIA3/VSUM")
  (net 20 "/TIA3/VPDB")
  (net 21 "/TIA3/VLOG")
  (net 22 "/TIA3/STAGE_2_IN-")
  (net 23 "CH3-")
  (net 24 "CH3+")
  (net 25 "/TIA4/VSUM")
  (net 26 "/TIA4/VPDB")
  (net 27 "/TIA4/VLOG")
  (net 28 "/TIA4/STAGE_2_IN-")
  (net 29 "CH4-")
  (net 30 "CH4+")
  (net 31 "/TIA5/VSUM")
  (net 32 "/TIA5/VPDB")
  (net 33 "/TIA5/VLOG")
  (net 34 "/TIA5/STAGE_2_IN-")
  (net 35 "CH5-")
  (net 36 "CH5+")
  (net 37 "/TIA6/VSUM")
  (net 38 "/TIA6/VPDB")
  (net 39 "/TIA6/VLOG")
  (net 40 "/TIA6/STAGE_2_IN-")
  (net 41 "CH6-")
  (net 42 "CH6+")
  (net 43 "/TIA7/VSUM")
  (net 44 "/TIA7/VPDB")
  (net 45 "/TIA7/VLOG")
  (net 46 "/TIA7/STAGE_2_IN-")
  (net 47 "CH7-")
  (net 48 "CH7+")
  (net 49 "/TIA8/VSUM")
  (net 50 "/TIA8/VPDB")
  (net 51 "/TIA8/VLOG")
  (net 52 "/TIA8/STAGE_2_IN-")
  (net 53 "CH8-")
  (net 54 "CH8+")
  (net 55 "/TIA1/PD_A")
  (net 56 "/TIA1/VREF")
  (net 57 "/TIA1/BF_NG")
  (net 58 "unconnected-(IC21-Pad1)")
  (net 59 "/TIA2/PD_A")
  (net 60 "/TIA2/VREF")
  (net 61 "/TIA2/BF_NG")
  (net 62 "unconnected-(IC22-Pad7)")
  (net 63 "unconnected-(IC31-Pad1)")
  (net 64 "/TIA3/PD_A")
  (net 65 "/TIA3/VREF")
  (net 66 "/TIA3/BF_NG")
  (net 67 "unconnected-(IC32-Pad7)")
  (net 68 "unconnected-(IC41-Pad1)")
  (net 69 "/TIA4/PD_A")
  (net 70 "/TIA4/VREF")
  (net 71 "/TIA4/BF_NG")
  (net 72 "unconnected-(IC42-Pad7)")
  (net 73 "unconnected-(IC51-Pad1)")
  (net 74 "/TIA5/PD_A")
  (net 75 "/TIA5/VREF")
  (net 76 "/TIA5/BF_NG")
  (net 77 "unconnected-(IC52-Pad7)")
  (net 78 "unconnected-(IC61-Pad1)")
  (net 79 "/TIA6/PD_A")
  (net 80 "/TIA6/VREF")
  (net 81 "/TIA6/BF_NG")
  (net 82 "unconnected-(IC62-Pad7)")
  (net 83 "unconnected-(IC71-Pad1)")
  (net 84 "/TIA7/PD_A")
  (net 85 "/TIA7/VREF")
  (net 86 "/TIA7/BF_NG")
  (net 87 "unconnected-(IC72-Pad7)")
  (net 88 "unconnected-(IC81-Pad1)")
  (net 89 "/TIA8/PD_A")
  (net 90 "/TIA8/VREF")
  (net 91 "/TIA8/BF_NG")
  (net 92 "unconnected-(IC82-Pad7)")
  (net 93 "/TIA1/PD_K")
  (net 94 "/TIA2/PD_K")
  (net 95 "/TIA3/PD_K")
  (net 96 "/TIA4/PD_K")
  (net 97 "/TIA5/PD_K")
  (net 98 "/TIA6/PD_K")
  (net 99 "/TIA7/PD_K")
  (net 100 "/TIA8/PD_K")
  (net 101 "+15V")
  (net 102 "-15V")
  (net 103 "/TIA1/BF_OUT")
  (net 104 "/TIA2/BF_OUT")
  (net 105 "/TIA3/BF_OUT")
  (net 106 "/TIA4/BF_OUT")
  (net 107 "/TIA5/BF_OUT")
  (net 108 "/TIA6/BF_OUT")
  (net 109 "/TIA7/BF_OUT")
  (net 110 "/TIA8/BF_OUT")
  (net 111 "/TIA1/STAGE_2_IN+")
  (net 112 "/TIA2/STAGE_2_IN+")
  (net 113 "/TIA3/STAGE_2_IN+")
  (net 114 "/TIA4/STAGE_2_IN+")
  (net 115 "/TIA5/STAGE_2_IN+")
  (net 116 "/TIA6/STAGE_2_IN+")
  (net 117 "/TIA7/STAGE_2_IN+")
  (net 118 "/TIA8/STAGE_2_IN+")
  (footprint "Connector_Molex:Molex_PicoBlade_53047-0310_1x03_P1.25mm_Vertical" (layer "F.Cu")
    (tedit 5B783167)
    (at 128.2485 75.454 -90)
    (descr "Molex PicoBlade Connector System, 53047-0310, 3 Pins per row (http://www.molex.com/pdm_docs/sd/530470610_sd.pdf), generated with kicad-footprint-generator")
    (tags "connector Molex PicoBlade side entry")
    (property "Sheetfile" "ADL5303_AnalogPCB.kicad_sch")
    (property "Sheetname" "")
    (attr through_hole)
    (fp_text reference "J7" (at 1.25 -3.25 90) (layer "F.SilkS") hide)
    (fp_text value "Conn_01x03_Female" (at 1.25 2.35 90) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 1.25 -1.35 90) (layer "F.Fab"))
    (pad "1" thru_hole roundrect (at 0 0 270) (size 0.8 1.3) (drill 0.5) (layers *.Cu *.Mask) (roundrect_rratio 0.25)
      (net 99 "/TIA7/PD_K") (pinfunction "Pin_1") (pintype "passive"))
    (pad "2" thru_hole oval (at 1.25 0 270) (size 0.8 1.3) (drill 0.5) (layers *.Cu *.Mask)
      (net 43 "/TIA7/VSUM") (pinfunction "Pin_2") (pintype "passive"))
    (pad "3" thru_hole oval (at 2.5 0 270) (size 0.8 1.3) (drill 0.5) (layers *.Cu *.Mask)
      (net 84 "/TIA7/PD_A") (pinfunction "Pin_3") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Connector_Molex.3dshapes/Molex_PicoBlade_53047-0310_1x03_P1.25mm_Vertical.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "MountingHole:MountingHole_3.2mm_M3_DIN965_Pad" (layer "F.Cu")
    (tedit 56D1B4CB)
    (at 101.6 116.84)
    (descr "Mounting Hole 3.2mm, M3, DIN965")
    (tags "mounting hole 3.2mm m3 din965")
    (attr exclude_from_pos_files exclude_from_bom)
    (fp_text reference "REF**" (at 0 -3.8) (layer "F.SilkS") hide)
    (fp_text value "MountingHole_3.2mm_M3_DIN965_Pad" (at 0 3.8) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab"))
    (pad "1" thru_hole circle locked (at 0 0) (size 5.6 5.6) (drill 3.2) (layers *.Cu *.Mask)
      (net 1 "GND"))
  )
  (footprint "Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEF)
    (at 161.5225 92.9081 180)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "Sheetfile" "tia_adl5303.kicad_sch")
    (property "Sheetname" "TIA4")
    (attr smd)
    (fp_text reference "C45" (at -3.0695 -0.0559 180) (layer "F.SilkS"))
    (fp_text value "2.2p" (at 0 1.68) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab"))
    (pad "1" smd roundrect (at -1.0375 0 180) (size 1.175 1.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.212766)
      (net 29 "CH4-") (pintype "passive"))
    (pad "2" smd roundrect (at 1.0375 0 180) (size 1.175 1.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.212766)
      (net 114 "/TIA4/STAGE_2_IN+") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Resistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEE)
    (at 139.4245 104.595448)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (property "Sheetfile" "tia_adl5303.kicad_sch")
    (property "Sheetname" "TIA6")
    (attr smd)
    (fp_text reference "R67" (at 3.048 0) (layer "F.SilkS"))
    (fp_text value "54.9k" (at 0 1.65) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab"))
    (pad "1" smd roundrect (at -1 0) (size 1.2 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.208333)
      (net 40 "/TIA6/STAGE_2_IN-") (pintype "passive"))
    (pad "2" smd roundrect (at 1 0) (size 1.2 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.208333)
      (net 42 "CH6+") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Resistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEE)
    (at 160.5065 87.3201 -90)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (property "Sheetfile" "tia_adl5303.kicad_sch")
    (property "Sheetname" "TIA4")
    (attr smd)
    (fp_text reference "R43" (at 3.048 0 90) (layer "F.SilkS"))
    (fp_text value "6.8k" (at 0 1.65 90) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab"))
    (pad "1" smd roundrect (at -1 0 270) (size 1.2 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.208333)
      (net 106 "/TIA4/BF_OUT") (pintype "passive"))
    (pad "2" smd roundrect (at 1 0 270) (size 1.2 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.208333)
      (net 114 "/TIA4/STAGE_2_IN+") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Jumper:SolderJumper-2_P1.3mm_Open_RoundedPad1.0x1.5mm" (layer "F.Cu")
    (tedit 5B391E66)
    (at 155.6805 77.1601 -90)
    (descr "SMD Solder Jumper, 1x1.5mm, rounded Pads, 0.3mm gap, open")
    (tags "solder jumper open")
    (property "Sheetfile" "tia_adl5303.kicad_sch")
    (property "Sheetname" "TIA4")
    (attr exclude_from_pos_files)
    (fp_text reference "JP42" (at 0 2.032 90) (layer "F.SilkS") hide)
    (fp_text value "SolderJumper_2_Open" (at 0 1.9 90) (layer "F.Fab"))
    (pad "1" smd custom (at -0.65 0 270) (size 1 0.5) (layers "F.Cu" "F.Mask")
      (net 96 "/TIA4/PD_K") (pinfunction "A") (pintype "passive") (zone_connect 2)
      (options (clearance outline) (anchor rect))
      (primitives
        (gr_circle (center 0 0.25) (end 0.5 0.25) (width 0) (fill yes))
        (gr_circle (center 0 -0.25) (end 0.5 -0.25) (width 0) (fill yes))
        (gr_poly (pts
            (xy 0.5 0.75)
            (xy 0 0.75)
            (xy 0 -0.75)
            (xy 0.5 -0.75)
          ) (width 0) (fill yes))
      ))
    (pad "2" smd custom (at 0.65 0 270) (size 1 0.5) (layers "F.Cu" "F.Mask")
      (net 26 "/TIA4/VPDB") (pinfunction "B") (pintype "passive") (zone_connect 2)
      (options (clearance outline) (anchor rect))
      (primitives
        (gr_circle (center 0 0.25) (end 0.5 0.25) (width 0) (fill yes))
        (gr_circle (center 0 -0.25) (end 0.5 -0.25) (width 0) (fill yes))
        (gr_poly (pts
            (xy 0 0.75)
            (xy -0.5 0.75)
            (xy -0.5 -0.75)
            (xy 0 -0.75)
          ) (width 0) (fill yes))
      ))
  )
  (footprint "Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEF)
    (at 192.0025 92.911448 180)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "Sheetfile" "tia_adl5303.kicad_sch")
    (property "Sheetname" "TIA1")
    (attr smd)
    (fp_text reference "C15" (at -3.0695 -0.052552 180) (layer "F.SilkS"))
    (fp_text value "2.2p" (at 0 1.68) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab"))
    (pad "1" smd roundrect (at -1.0375 0 180) (size 1.175 1.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.212766)
      (net 11 "CH1-") (pintype "passive"))
    (pad "2" smd roundrect (at 1.0375 0 180) (size 1.175 1.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.212766)
      (net 111 "/TIA1/STAGE_2_IN+") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Resistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEE)
    (at 150.3465 87.122 -90)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (property "Sheetfile" "tia_adl5303.kicad_sch")
    (property "Sheetname" "TIA5")
    (attr smd)
    (fp_text reference "R53" (at 3.048 0 90) (layer "F.SilkS"))
    (fp_text value "6.8k" (at 0 1.65 90) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab"))
    (pad "1" smd roundrect (at -1 0 270) (size 1.2 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.208333)
      (net 107 "/TIA5/BF_OUT") (pintype "passive"))
    (pad "2" smd roundrect (at 1 0 270) (size 1.2 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.208333)
      (net 115 "/TIA5/STAGE_2_IN+") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Rob_Lib:AFSI_LOGO_2_color" (layer "F.Cu")
    (tedit 0)
    (at 171.45 112.014)
    (attr board_only exclude_from_pos_files exclude_from_bom)
    (fp_text reference "" (at 0 0) (layer "F.SilkS"))
    (fp_text value "" (at 0 0) (layer "F.SilkS"))
  )
  (footprint "Resistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEE)
    (at 186.9225 87.323448 -90)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (property "Sheetfile" "tia_adl5303.kicad_sch")
    (property "Sheetname" "TIA1")
    (attr smd)
    (fp_text reference "R14" (at 3.048 0 90) (layer "F.SilkS"))
    (fp_text value "8.2k" (at 0 1.65 90) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab"))
    (pad "1" smd roundrect (at -1 0 270) (size 1.2 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.208333)
      (net 56 "/TIA1/VREF") (pintype "passive"))
    (pad "2" smd roundrect (at 1 0 270) (size 1.2 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.208333)
      (net 10 "/TIA1/STAGE_2_IN-") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl"
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      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
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  (footprint "Resistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEE)
    (at 146.2825 87.122 -90)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (property "Sheetfile" "tia_adl5303.kicad_sch")
    (property "Sheetname" "TIA5")
    (attr smd)
    (fp_text reference "R54" (at 3.048 0 90) (layer "F.SilkS"))
    (fp_text value "8.2k" (at 0 1.65 90) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab"))
    (pad "1" smd roundrect (at -1 0 270) (size 1.2 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.208333)
      (net 75 "/TIA5/VREF") (pintype "passive"))
    (pad "2" smd roundrect (at 1 0 270) (size 1.2 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.208333)
      (net 34 "/TIA5/STAGE_2_IN-") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Package_SO:SOIC-8_3.9x4.9mm_P1.27mm" (layer "F.Cu")
    (tedit 5D9F72B1)
    (at 160.5065 99.7661 90)
    (descr "SOIC, 8 Pin (JEDEC MS-012AA, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/soic_narrow-r/r_8.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py")
    (tags "SOIC SO")
    (property "Description" "160MHz, Fully Differential Input/Output High Slew Rate Amplifier")
    (property "Height" "1.75")
    (property "Manufacturer_Name" "Texas Instruments")
    (property "Manufacturer_Part_Number" "THS4141CD")
    (property "Mouser Part Number" "595-THS4141CD")
    (property "Mouser Price/Stock" "https://www.mouser.com/Search/Refine.aspx?Keyword=595-THS4141CD")
    (property "Sheetfile" "tia_adl5303.kicad_sch")
    (property "Sheetname" "TIA4")
    (attr smd)
    (fp_text reference "IC42" (at 0 -3.4 90) (layer "F.SilkS"))
    (fp_text value "THS4141CD" (at 0 3.4 90) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab"))
    (pad "1" smd roundrect (at -2.475 -1.905 90) (size 1.95 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 28 "/TIA4/STAGE_2_IN-") (pinfunction "VIN-") (pintype "passive"))
    (pad "2" smd roundrect (at -2.475 -0.635 90) (size 1.95 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 1 "GND") (pinfunction "VOCM") (pintype "passive"))
    (pad "3" smd roundrect (at -2.475 0.635 90) (size 1.95 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 6 "-12V") (pinfunction "VCC+") (pintype "passive"))
    (pad "4" smd roundrect (at -2.475 1.905 90) (size 1.95 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 30 "CH4+") (pinfunction "VOUT+") (pintype "passive"))
    (pad "5" smd roundrect (at 2.475 1.905 90) (size 1.95 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 29 "CH4-") (pinfunction "VOUT-") (pintype "passive"))
    (pad "6" smd roundrect (at 2.475 0.635 90) (size 1.95 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 5 "+12V") (pinfunction "VCC-") (pintype "passive"))
    (pad "7" smd roundrect (at 2.475 -0.635 90) (size 1.95 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 72 "unconnected-(IC42-Pad7)") (pinfunction "NC") (pintype "no_connect"))
    (pad "8" smd roundrect (at 2.475 -1.905 90) (size 1.95 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 114 "/TIA4/STAGE_2_IN+") (pinfunction "VIN+") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Package_SO.3dshapes/SOIC-8_3.9x4.9mm_P1.27mm.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Package_DFN_QFN:QFN-16-1EP_3x3mm_P0.5mm_EP1.45x1.45mm" (layer "F.Cu")
    (tedit 5DC5F6A3)
    (at 169.1425 82.497448 -90)
    (descr "QFN, 16 Pin (http://cds.linear.com/docs/en/datasheet/37551fd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py")
    (tags "QFN NoLead")
    (property "Description" "SP Amp LOG Amp Single R-R O/P 5.5V 16-Pin LFCSP EP T/R")
    (property "Height" "0.8")
    (property "Manufacturer_Name" "Analog Devices")
    (property "Manufacturer_Part_Number" "ADL5303ACPZ-R7")
    (property "Mouser Part Number" "584-ADL5303ACPZ-R7")
    (property "Mouser Price/Stock" "https://www.mouser.co.uk/ProductDetail/Analog-Devices/ADL5303ACPZ-R7?qs=BpaRKvA4VqHSm6pnud57YQ%3D%3D")
    (property "Sheetfile" "tia_adl5303.kicad_sch")
    (property "Sheetname" "TIA3")
    (attr smd)
    (fp_text reference "IC31" (at 0 2.54 90) (layer "F.SilkS"))
    (fp_text value "ADL5303ACPZ-R7" (at 0 2.82 90) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab"))
    (pad "" smd roundrect (at 0.36 -0.36 270) (size 0.58 0.58) (layers "F.Paste") (roundrect_rratio 0.25))
    (pad "" smd roundrect (at -0.36 0.36 270) (size 0.58 0.58) (layers "F.Paste") (roundrect_rratio 0.25))
    (pad "" smd roundrect (at -0.36 -0.36 270) (size 0.58 0.58) (layers "F.Paste") (roundrect_rratio 0.25))
    (pad "" smd roundrect (at 0.36 0.36 270) (size 0.58 0.58) (layers "F.Paste") (roundrect_rratio 0.25))
    (pad "1" smd roundrect (at -1.4375 -0.75 270) (size 0.875 0.25) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 63 "unconnected-(IC31-Pad1)") (pinfunction "NC") (pintype "no_connect"))
    (pad "2" smd roundrect (at -1.4375 -0.25 270) (size 0.875 0.25) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 19 "/TIA3/VSUM") (pinfunction "VSUM_1") (pintype "passive"))
    (pad "3" smd roundrect (at -1.4375 0.25 270) (size 0.875 0.25) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 64 "/TIA3/PD_A") (pinfunction "INPT") (pintype "passive"))
    (pad "4" smd roundrect (at -1.4375 0.75 270) (size 0.875 0.25) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 19 "/TIA3/VSUM") (pinfunction "VSUM_2") (pintype "passive"))
    (pad "5" smd roundrect (at -0.75 1.4375 270) (size 0.25 0.875) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 20 "/TIA3/VPDB") (pinfunction "VPDB") (pintype "passive"))
    (pad "6" smd roundrect (at -0.25 1.4375 270) (size 0.25 0.875) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 65 "/TIA3/VREF") (pinfunction "VREF") (pintype "passive"))
    (pad "7" smd roundrect (at 0.25 1.4375 270) (size 0.25 0.875) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 1 "GND") (pinfunction "ACOM") (pintype "passive"))
    (pad "8" smd roundrect (at 0.75 1.4375 270) (size 0.25 0.875) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 21 "/TIA3/VLOG") (pinfunction "VLOG") (pintype "passive"))
    (pad "9" smd roundrect (at 1.4375 0.75 270) (size 0.875 0.25) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 21 "/TIA3/VLOG") (pinfunction "BFIN") (pintype "passive"))
    (pad "10" smd roundrect (at 1.4375 0.25 270) (size 0.875 0.25) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 2 "+5V") (pinfunction "VPS2") (pintype "passive"))
    (pad "11" smd roundrect (at 1.4375 -0.25 270) (size 0.875 0.25) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 105 "/TIA3/BF_OUT") (pinfunction "VOUT") (pintype "passive"))
    (pad "12" smd roundrect (at 1.4375 -0.75 270) (size 0.875 0.25) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 2 "+5V") (pinfunction "VPS1") (pintype "passive"))
    (pad "13" smd roundrect (at 0.75 -1.4375 270) (size 0.25 0.875) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 66 "/TIA3/BF_NG") (pinfunction "BFNG") (pintype "passive"))
    (pad "14" smd roundrect (at 0.25 -1.4375 270) (size 0.25 0.875) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 1 "GND") (pinfunction "GND_1") (pintype "passive"))
    (pad "15" smd roundrect (at -0.25 -1.4375 270) (size 0.25 0.875) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 1 "GND") (pinfunction "GND_2") (pintype "passive"))
    (pad "16" smd roundrect (at -0.75 -1.4375 270) (size 0.25 0.875) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 1 "GND") (pinfunction "PWDN") (pintype "passive"))
    (pad "17" smd rect (at 0 0 270) (size 1.45 1.45) (layers "F.Cu" "F.Mask")
      (net 19 "/TIA3/VSUM") (pinfunction "EP") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Package_DFN_QFN.3dshapes/QFN-16-1EP_3x3mm_P0.5mm_EP1.45x1.45mm.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEF)
    (at 177.7785 92.657448)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "Sheetfile" "tia_adl5303.kicad_sch")
    (property "Sheetname" "TIA2")
    (attr smd)
    (fp_text reference "C24" (at 0.2755 1.524) (layer "F.SilkS"))
    (fp_text value "220p" (at 0 1.68) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab"))
    (pad "1" smd roundrect (at -1.0375 0) (size 1.175 1.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.212766)
      (net 16 "/TIA2/STAGE_2_IN-") (pintype "passive"))
    (pad "2" smd roundrect (at 1.0375 0) (size 1.175 1.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.212766)
      (net 112 "/TIA2/STAGE_2_IN+") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Jumper:SolderJumper-2_P1.3mm_Open_RoundedPad1.0x1.5mm" (layer "F.Cu")
    (tedit 5B391E66)
    (at 114.9975 77.097448 -90)
    (descr "SMD Solder Jumper, 1x1.5mm, rounded Pads, 0.3mm gap, open")
    (tags "solder jumper open")
    (property "Sheetfile" "tia_adl5303.kicad_sch")
    (property "Sheetname" "TIA8")
    (attr exclude_from_pos_files)
    (fp_text reference "JP82" (at 0 2.032 90) (layer "F.SilkS") hide)
    (fp_text value "SolderJumper_2_Open" (at 0 1.9 90) (layer "F.Fab"))
    (pad "1" smd custom (at -0.65 0 270) (size 1 0.5) (layers "F.Cu" "F.Mask")
      (net 100 "/TIA8/PD_K") (pinfunction "A") (pintype "passive") (zone_connect 2)
      (options (clearance outline) (anchor rect))
      (primitives
        (gr_circle (center 0 0.25) (end 0.5 0.25) (width 0) (fill yes))
        (gr_circle (center 0 -0.25) (end 0.5 -0.25) (width 0) (fill yes))
        (gr_poly (pts
            (xy 0.5 0.75)
            (xy 0 0.75)
            (xy 0 -0.75)
            (xy 0.5 -0.75)
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      ))
    (pad "2" smd custom (at 0.65 0 270) (size 1 0.5) (layers "F.Cu" "F.Mask")
      (net 50 "/TIA8/VPDB") (pinfunction "B") (pintype "passive") (zone_connect 2)
      (options (clearance outline) (anchor rect))
      (primitives
        (gr_circle (center 0 0.25) (end 0.5 0.25) (width 0) (fill yes))
        (gr_circle (center 0 -0.25) (end 0.5 -0.25) (width 0) (fill yes))
        (gr_poly (pts
            (xy 0 0.75)
            (xy -0.5 0.75)
            (xy -0.5 -0.75)
            (xy 0 -0.75)
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  (footprint "Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEF)
    (at 190.2245 106.627448)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "Sheetfile" "tia_adl5303.kicad_sch")
    (property "Sheetname" "TIA1")
    (attr smd)
    (fp_text reference "C16" (at 3.048 0) (layer "F.SilkS"))
    (fp_text value "2.2p" (at 0 1.68) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab"))
    (pad "1" smd roundrect (at -1.0375 0) (size 1.175 1.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.212766)
      (net 10 "/TIA1/STAGE_2_IN-") (pintype "passive"))
    (pad "2" smd roundrect (at 1.0375 0) (size 1.175 1.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.212766)
      (net 12 "CH1+") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEF)
    (at 180.0645 106.627448)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "Sheetfile" "tia_adl5303.kicad_sch")
    (property "Sheetname" "TIA2")
    (attr smd)
    (fp_text reference "C26" (at 3.048 0) (layer "F.SilkS"))
    (fp_text value "2.2p" (at 0 1.68) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab"))
    (pad "1" smd roundrect (at -1.0375 0) (size 1.175 1.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.212766)
      (net 16 "/TIA2/STAGE_2_IN-") (pintype "passive"))
    (pad "2" smd roundrect (at 1.0375 0) (size 1.175 1.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.212766)
      (net 18 "CH2+") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
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  )
  (footprint "Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEF)
    (at 167.6185 92.657448)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "Sheetfile" "tia_adl5303.kicad_sch")
    (property "Sheetname" "TIA3")
    (attr smd)
    (fp_text reference "C34" (at 0.2755 1.576552) (layer "F.SilkS"))
    (fp_text value "220p" (at 0 1.68) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab"))
    (pad "1" smd roundrect (at -1.0375 0) (size 1.175 1.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.212766)
      (net 22 "/TIA3/STAGE_2_IN-") (pintype "passive"))
    (pad "2" smd roundrect (at 1.0375 0) (size 1.175 1.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.212766)
      (net 113 "/TIA3/STAGE_2_IN+") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
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  )
  (footprint "Resistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEE)
    (at 170.6665 87.323448 -90)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (property "Sheetfile" "tia_adl5303.kicad_sch")
    (property "Sheetname" "TIA3")
    (attr smd)
    (fp_text reference "R33" (at 3.048 0 90) (layer "F.SilkS"))
    (fp_text value "6.8k" (at 0 1.65 90) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab"))
    (pad "1" smd roundrect (at -1 0 270) (size 1.2 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.208333)
      (net 105 "/TIA3/BF_OUT") (pintype "passive"))
    (pad "2" smd roundrect (at 1 0 270) (size 1.2 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.208333)
      (net 113 "/TIA3/STAGE_2_IN+") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
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  (footprint "Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEF)
    (at 159.7445 106.6241)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "Sheetfile" "tia_adl5303.kicad_sch")
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    (attr smd)
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    (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab"))
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      (net 28 "/TIA4/STAGE_2_IN-") (pintype "passive"))
    (pad "2" smd roundrect (at 1.0375 0) (size 1.175 1.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.212766)
      (net 30 "CH4+") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl"
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    (tedit 5F68FEEE)
    (at 125.9505 87.339448 -90)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (property "Sheetfile" "tia_adl5303.kicad_sch")
    (property "Sheetname" "TIA7")
    (attr smd)
    (fp_text reference "R74" (at 3.048 0 90) (layer "F.SilkS"))
    (fp_text value "8.2k" (at 0 1.65 90) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab"))
    (pad "1" smd roundrect (at -1 0 270) (size 1.2 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.208333)
      (net 85 "/TIA7/VREF") (pintype "passive"))
    (pad "2" smd roundrect (at 1 0 270) (size 1.2 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.208333)
      (net 46 "/TIA7/STAGE_2_IN-") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl"
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      (rotate (xyz 0 0 0))
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  (footprint "Resistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEE)
    (at 159.7445 104.5921)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (property "Sheetfile" "tia_adl5303.kicad_sch")
    (property "Sheetname" "TIA4")
    (attr smd)
    (fp_text reference "R47" (at 3.048 0) (layer "F.SilkS"))
    (fp_text value "54.9k" (at 0 1.65) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab"))
    (pad "1" smd roundrect (at -1 0) (size 1.2 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.208333)
      (net 28 "/TIA4/STAGE_2_IN-") (pintype "passive"))
    (pad "2" smd roundrect (at 1 0) (size 1.2 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.208333)
      (net 30 "CH4+") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl"
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  (footprint "Resistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEE)
    (at 132.0465 87.339448 90)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (property "Sheetfile" "tia_adl5303.kicad_sch")
    (property "Sheetname" "TIA7")
    (attr smd)
    (fp_text reference "R71" (at -3.048 0 90) (layer "F.SilkS"))
    (fp_text value "10k" (at 0 1.65 90) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab"))
    (pad "1" smd roundrect (at -1 0 90) (size 1.2 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.208333)
      (net 109 "/TIA7/BF_OUT") (pintype "passive"))
    (pad "2" smd roundrect (at 1 0 90) (size 1.2 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.208333)
      (net 86 "/TIA7/BF_NG") (pintype "passive"))
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  (footprint "Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEF)
    (at 157.4585 92.6541)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "Sheetfile" "tia_adl5303.kicad_sch")
    (property "Sheetname" "TIA4")
    (attr smd)
    (fp_text reference "C44" (at 0.2755 1.5799) (layer "F.SilkS"))
    (fp_text value "220p" (at 0 1.68) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab"))
    (pad "1" smd roundrect (at -1.0375 0) (size 1.175 1.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.212766)
      (net 28 "/TIA4/STAGE_2_IN-") (pintype "passive"))
    (pad "2" smd roundrect (at 1.0375 0) (size 1.175 1.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.212766)
      (net 114 "/TIA4/STAGE_2_IN+") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
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  (footprint "Package_DFN_QFN:QFN-16-1EP_3x3mm_P0.5mm_EP1.45x1.45mm" (layer "F.Cu")
    (tedit 5DC5F6A3)
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    (descr "QFN, 16 Pin (http://cds.linear.com/docs/en/datasheet/37551fd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py")
    (tags "QFN NoLead")
    (property "Description" "SP Amp LOG Amp Single R-R O/P 5.5V 16-Pin LFCSP EP T/R")
    (property "Height" "0.8")
    (property "Manufacturer_Name" "Analog Devices")
    (property "Manufacturer_Part_Number" "ADL5303ACPZ-R7")
    (property "Mouser Part Number" "584-ADL5303ACPZ-R7")
    (property "Mouser Price/Stock" "https://www.mouser.co.uk/ProductDetail/Analog-Devices/ADL5303ACPZ-R7?qs=BpaRKvA4VqHSm6pnud57YQ%3D%3D")
    (property "Sheetfile" "tia_adl5303.kicad_sch")
    (property "Sheetname" "TIA7")
    (attr smd)
    (fp_text reference "IC71" (at 0 2.54 90) (layer "F.SilkS"))
    (fp_text value "ADL5303ACPZ-R7" (at 0 2.82 90) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab"))
    (pad "" smd roundrect (at -0.36 0.36 270) (size 0.58 0.58) (layers "F.Paste") (roundrect_rratio 0.25))
    (pad "" smd roundrect (at 0.36 -0.36 270) (size 0.58 0.58) (layers "F.Paste") (roundrect_rratio 0.25))
    (pad "" smd roundrect (at -0.36 -0.36 270) (size 0.58 0.58) (layers "F.Paste") (roundrect_rratio 0.25))
    (pad "" smd roundrect (at 0.36 0.36 270) (size 0.58 0.58) (layers "F.Paste") (roundrect_rratio 0.25))
    (pad "1" smd roundrect (at -1.4375 -0.75 270) (size 0.875 0.25) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 83 "unconnected-(IC71-Pad1)") (pinfunction "NC") (pintype "no_connect"))
    (pad "2" smd roundrect (at -1.4375 -0.25 270) (size 0.875 0.25) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 43 "/TIA7/VSUM") (pinfunction "VSUM_1") (pintype "passive"))
    (pad "3" smd roundrect (at -1.4375 0.25 270) (size 0.875 0.25) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 84 "/TIA7/PD_A") (pinfunction "INPT") (pintype "passive"))
    (pad "4" smd roundrect (at -1.4375 0.75 270) (size 0.875 0.25) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 43 "/TIA7/VSUM") (pinfunction "VSUM_2") (pintype "passive"))
    (pad "5" smd roundrect (at -0.75 1.4375 270) (size 0.25 0.875) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 44 "/TIA7/VPDB") (pinfunction "VPDB") (pintype "passive"))
    (pad "6" smd roundrect (at -0.25 1.4375 270) (size 0.25 0.875) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 85 "/TIA7/VREF") (pinfunction "VREF") (pintype "passive"))
    (pad "7" smd roundrect (at 0.25 1.4375 270) (size 0.25 0.875) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 1 "GND") (pinfunction "ACOM") (pintype "passive"))
    (pad "8" smd roundrect (at 0.75 1.4375 270) (size 0.25 0.875) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 45 "/TIA7/VLOG") (pinfunction "VLOG") (pintype "passive"))
    (pad "9" smd roundrect (at 1.4375 0.75 270) (size 0.875 0.25) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 45 "/TIA7/VLOG") (pinfunction "BFIN") (pintype "passive"))
    (pad "10" smd roundrect (at 1.4375 0.25 270) (size 0.875 0.25) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 2 "+5V") (pinfunction "VPS2") (pintype "passive"))
    (pad "11" smd roundrect (at 1.4375 -0.25 270) (size 0.875 0.25) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 109 "/TIA7/BF_OUT") (pinfunction "VOUT") (pintype "passive"))
    (pad "12" smd roundrect (at 1.4375 -0.75 270) (size 0.875 0.25) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 2 "+5V") (pinfunction "VPS1") (pintype "passive"))
    (pad "13" smd roundrect (at 0.75 -1.4375 270) (size 0.25 0.875) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 86 "/TIA7/BF_NG") (pinfunction "BFNG") (pintype "passive"))
    (pad "14" smd roundrect (at 0.25 -1.4375 270) (size 0.25 0.875) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 1 "GND") (pinfunction "GND_1") (pintype "passive"))
    (pad "15" smd roundrect (at -0.25 -1.4375 270) (size 0.25 0.875) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 1 "GND") (pinfunction "GND_2") (pintype "passive"))
    (pad "16" smd roundrect (at -0.75 -1.4375 270) (size 0.25 0.875) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 1 "GND") (pinfunction "PWDN") (pintype "passive"))
    (pad "17" smd rect (at 0 0 270) (size 1.45 1.45) (layers "F.Cu" "F.Mask")
      (net 43 "/TIA7/VSUM") (pinfunction "EP") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Package_DFN_QFN.3dshapes/QFN-16-1EP_3x3mm_P0.5mm_EP1.45x1.45mm.wrl"
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      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
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  (footprint "Resistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEE)
    (at 138.1545 87.323448 90)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (property "Sheetfile" "tia_adl5303.kicad_sch")
    (property "Sheetname" "TIA6")
    (attr smd)
    (fp_text reference "R65" (at -3.048 0 90) (layer "F.SilkS"))
    (fp_text value "33k" (at 0 1.65 90) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab"))
    (pad "1" smd roundrect (at -1 0 90) (size 1.2 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.208333)
      (net 40 "/TIA6/STAGE_2_IN-") (pintype "passive"))
    (pad "2" smd roundrect (at 1 0 90) (size 1.2 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.208333)
      (net 1 "GND") (pintype "passive"))
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      (scale (xyz 1 1 1))
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  (footprint "Package_TO_SOT_THT:TO-220-3_Vertical" (layer "F.Cu")
    (tedit 5AC8BA0D)
    (at 106.792 87.376 90)
    (descr "TO-220-3, Vertical, RM 2.54mm, see https://www.vishay.com/docs/66542/to-220-1.pdf")
    (tags "TO-220-3 Vertical RM 2.54mm")
    (property "Sheetfile" "ADL5303_AnalogPCB.kicad_sch")
    (property "Sheetname" "")
    (attr through_hole)
    (fp_text reference "U1" (at 2.54 2.357 90) (layer "F.SilkS"))
    (fp_text value "LM7805_TO220" (at 2.54 2.5 90) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 2.54 -4.27 90) (layer "F.Fab"))
    (pad "1" thru_hole rect (at 0 0 90) (size 1.905 2) (drill 1.1) (layers *.Cu *.Mask)
      (net 101 "+15V") (pinfunction "VI") (pintype "power_in"))
    (pad "2" thru_hole oval (at 2.54 0 90) (size 1.905 2) (drill 1.1) (layers *.Cu *.Mask)
      (net 1 "GND") (pinfunction "GND") (pintype "power_in"))
    (pad "3" thru_hole oval (at 5.08 0 90) (size 1.905 2) (drill 1.1) (layers *.Cu *.Mask)
      (net 2 "+5V") (pinfunction "VO") (pintype "power_out"))
    (model "${KICAD6_3DMODEL_DIR}/Package_TO_SOT_THT.3dshapes/TO-220-3_Vertical.wrl"
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  (footprint "Resistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEE)
    (at 119.8235 87.257448 -90)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (property "Sheetfile" "tia_adl5303.kicad_sch")
    (property "Sheetname" "TIA8")
    (attr smd)
    (fp_text reference "R83" (at 3.048 0 90) (layer "F.SilkS"))
    (fp_text value "6.8k" (at 0 1.65 90) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab"))
    (pad "1" smd roundrect (at -1 0 270) (size 1.2 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.208333)
      (net 110 "/TIA8/BF_OUT") (pintype "passive"))
    (pad "2" smd roundrect (at 1 0 270) (size 1.2 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.208333)
      (net 118 "/TIA8/STAGE_2_IN+") (pintype "passive"))
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      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
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  (footprint "Package_SO:SOIC-8_3.9x4.9mm_P1.27mm" (layer "F.Cu")
    (tedit 5D9F72B1)
    (at 170.6665 99.769448 90)
    (descr "SOIC, 8 Pin (JEDEC MS-012AA, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/soic_narrow-r/r_8.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py")
    (tags "SOIC SO")
    (property "Description" "160MHz, Fully Differential Input/Output High Slew Rate Amplifier")
    (property "Height" "1.75")
    (property "Manufacturer_Name" "Texas Instruments")
    (property "Manufacturer_Part_Number" "THS4141CD")
    (property "Mouser Part Number" "595-THS4141CD")
    (property "Mouser Price/Stock" "https://www.mouser.com/Search/Refine.aspx?Keyword=595-THS4141CD")
    (property "Sheetfile" "tia_adl5303.kicad_sch")
    (property "Sheetname" "TIA3")
    (attr smd)
    (fp_text reference "IC32" (at 0 -3.4 90) (layer "F.SilkS"))
    (fp_text value "THS4141CD" (at 0 3.4 90) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab"))
    (pad "1" smd roundrect (at -2.475 -1.905 90) (size 1.95 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 22 "/TIA3/STAGE_2_IN-") (pinfunction "VIN-") (pintype "passive"))
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      (net 1 "GND") (pinfunction "VOCM") (pintype "passive"))
    (pad "3" smd roundrect (at -2.475 0.635 90) (size 1.95 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 6 "-12V") (pinfunction "VCC+") (pintype "passive"))
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      (net 24 "CH3+") (pinfunction "VOUT+") (pintype "passive"))
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      (net 23 "CH3-") (pinfunction "VOUT-") (pintype "passive"))
    (pad "6" smd roundrect (at 2.475 0.635 90) (size 1.95 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 5 "+12V") (pinfunction "VCC-") (pintype "passive"))
    (pad "7" smd roundrect (at 2.475 -0.635 90) (size 1.95 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 67 "unconnected-(IC32-Pad7)") (pinfunction "NC") (pintype "no_connect"))
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      (net 113 "/TIA3/STAGE_2_IN+") (pinfunction "VIN+") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Package_SO.3dshapes/SOIC-8_3.9x4.9mm_P1.27mm.wrl"
      (offset (xyz 0 0 0))
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      (rotate (xyz 0 0 0))
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  (footprint "Connector_Molex:Molex_PicoBlade_53047-0310_1x03_P1.25mm_Vertical" (layer "F.Cu")
    (tedit 5B783167)
    (at 158.7865 75.454 -90)
    (descr "Molex PicoBlade Connector System, 53047-0310, 3 Pins per row (http://www.molex.com/pdm_docs/sd/530470610_sd.pdf), generated with kicad-footprint-generator")
    (tags "connector Molex PicoBlade side entry")
    (property "Sheetfile" "ADL5303_AnalogPCB.kicad_sch")
    (property "Sheetname" "")
    (attr through_hole)
    (fp_text reference "J4" (at 1.25 -3.25 90) (layer "F.SilkS") hide)
    (fp_text value "Conn_01x03_Female" (at 1.25 2.35 90) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 1.25 -1.35 90) (layer "F.Fab"))
    (pad "1" thru_hole roundrect (at 0 0 270) (size 0.8 1.3) (drill 0.5) (layers *.Cu *.Mask) (roundrect_rratio 0.25)
      (net 96 "/TIA4/PD_K") (pinfunction "Pin_1") (pintype "passive"))
    (pad "2" thru_hole oval (at 1.25 0 270) (size 0.8 1.3) (drill 0.5) (layers *.Cu *.Mask)
      (net 25 "/TIA4/VSUM") (pinfunction "Pin_2") (pintype "passive"))
    (pad "3" thru_hole oval (at 2.5 0 270) (size 0.8 1.3) (drill 0.5) (layers *.Cu *.Mask)
      (net 69 "/TIA4/PD_A") (pinfunction "Pin_3") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Connector_Molex.3dshapes/Molex_PicoBlade_53047-0310_1x03_P1.25mm_Vertical.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Package_DFN_QFN:QFN-16-1EP_3x3mm_P0.5mm_EP1.45x1.45mm" (layer "F.Cu")
    (tedit 5DC5F6A3)
    (at 118.2995 82.431448 -90)
    (descr "QFN, 16 Pin (http://cds.linear.com/docs/en/datasheet/37551fd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py")
    (tags "QFN NoLead")
    (property "Description" "SP Amp LOG Amp Single R-R O/P 5.5V 16-Pin LFCSP EP T/R")
    (property "Height" "0.8")
    (property "Manufacturer_Name" "Analog Devices")
    (property "Manufacturer_Part_Number" "ADL5303ACPZ-R7")
    (property "Mouser Part Number" "584-ADL5303ACPZ-R7")
    (property "Mouser Price/Stock" "https://www.mouser.co.uk/ProductDetail/Analog-Devices/ADL5303ACPZ-R7?qs=BpaRKvA4VqHSm6pnud57YQ%3D%3D")
    (property "Sheetfile" "tia_adl5303.kicad_sch")
    (property "Sheetname" "TIA8")
    (attr smd)
    (fp_text reference "IC81" (at 0 2.54 90) (layer "F.SilkS"))
    (fp_text value "ADL5303ACPZ-R7" (at 0 2.82 90) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab"))
    (pad "" smd roundrect (at -0.36 0.36 270) (size 0.58 0.58) (layers "F.Paste") (roundrect_rratio 0.25))
    (pad "" smd roundrect (at 0.36 0.36 270) (size 0.58 0.58) (layers "F.Paste") (roundrect_rratio 0.25))
    (pad "" smd roundrect (at -0.36 -0.36 270) (size 0.58 0.58) (layers "F.Paste") (roundrect_rratio 0.25))
    (pad "" smd roundrect (at 0.36 -0.36 270) (size 0.58 0.58) (layers "F.Paste") (roundrect_rratio 0.25))
    (pad "1" smd roundrect (at -1.4375 -0.75 270) (size 0.875 0.25) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 88 "unconnected-(IC81-Pad1)") (pinfunction "NC") (pintype "no_connect"))
    (pad "2" smd roundrect (at -1.4375 -0.25 270) (size 0.875 0.25) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 49 "/TIA8/VSUM") (pinfunction "VSUM_1") (pintype "passive"))
    (pad "3" smd roundrect (at -1.4375 0.25 270) (size 0.875 0.25) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 89 "/TIA8/PD_A") (pinfunction "INPT") (pintype "passive"))
    (pad "4" smd roundrect (at -1.4375 0.75 270) (size 0.875 0.25) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 49 "/TIA8/VSUM") (pinfunction "VSUM_2") (pintype "passive"))
    (pad "5" smd roundrect (at -0.75 1.4375 270) (size 0.25 0.875) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 50 "/TIA8/VPDB") (pinfunction "VPDB") (pintype "passive"))
    (pad "6" smd roundrect (at -0.25 1.4375 270) (size 0.25 0.875) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 90 "/TIA8/VREF") (pinfunction "VREF") (pintype "passive"))
    (pad "7" smd roundrect (at 0.25 1.4375 270) (size 0.25 0.875) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 1 "GND") (pinfunction "ACOM") (pintype "passive"))
    (pad "8" smd roundrect (at 0.75 1.4375 270) (size 0.25 0.875) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 51 "/TIA8/VLOG") (pinfunction "VLOG") (pintype "passive"))
    (pad "9" smd roundrect (at 1.4375 0.75 270) (size 0.875 0.25) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 51 "/TIA8/VLOG") (pinfunction "BFIN") (pintype "passive"))
    (pad "10" smd roundrect (at 1.4375 0.25 270) (size 0.875 0.25) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 2 "+5V") (pinfunction "VPS2") (pintype "passive"))
    (pad "11" smd roundrect (at 1.4375 -0.25 270) (size 0.875 0.25) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 110 "/TIA8/BF_OUT") (pinfunction "VOUT") (pintype "passive"))
    (pad "12" smd roundrect (at 1.4375 -0.75 270) (size 0.875 0.25) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 2 "+5V") (pinfunction "VPS1") (pintype "passive"))
    (pad "13" smd roundrect (at 0.75 -1.4375 270) (size 0.25 0.875) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 91 "/TIA8/BF_NG") (pinfunction "BFNG") (pintype "passive"))
    (pad "14" smd roundrect (at 0.25 -1.4375 270) (size 0.25 0.875) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 1 "GND") (pinfunction "GND_1") (pintype "passive"))
    (pad "15" smd roundrect (at -0.25 -1.4375 270) (size 0.25 0.875) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 1 "GND") (pinfunction "GND_2") (pintype "passive"))
    (pad "16" smd roundrect (at -0.75 -1.4375 270) (size 0.25 0.875) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 1 "GND") (pinfunction "PWDN") (pintype "passive"))
    (pad "17" smd rect (at 0 0 270) (size 1.45 1.45) (layers "F.Cu" "F.Mask")
      (net 49 "/TIA8/VSUM") (pinfunction "EP") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Package_DFN_QFN.3dshapes/QFN-16-1EP_3x3mm_P0.5mm_EP1.45x1.45mm.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Jumper:SolderJumper-2_P1.3mm_Open_RoundedPad1.0x1.5mm" (layer "F.Cu")
    (tedit 5B391E66)
    (at 186.1605 77.163448 -90)
    (descr "SMD Solder Jumper, 1x1.5mm, rounded Pads, 0.3mm gap, open")
    (tags "solder jumper open")
    (property "Sheetfile" "tia_adl5303.kicad_sch")
    (property "Sheetname" "TIA1")
    (attr exclude_from_pos_files)
    (fp_text reference "JP12" (at 0 2.032 90) (layer "F.SilkS") hide)
    (fp_text value "SolderJumper_2_Open" (at 0 1.9 90) (layer "F.Fab"))
    (pad "1" smd custom (at -0.65 0 270) (size 1 0.5) (layers "F.Cu" "F.Mask")
      (net 93 "/TIA1/PD_K") (pinfunction "A") (pintype "passive") (zone_connect 2)
      (options (clearance outline) (anchor rect))
      (primitives
        (gr_circle (center 0 0.25) (end 0.5 0.25) (width 0) (fill yes))
        (gr_circle (center 0 -0.25) (end 0.5 -0.25) (width 0) (fill yes))
        (gr_poly (pts
            (xy 0.5 0.75)
            (xy 0 0.75)
            (xy 0 -0.75)
            (xy 0.5 -0.75)
          ) (width 0) (fill yes))
      ))
    (pad "2" smd custom (at 0.65 0 270) (size 1 0.5) (layers "F.Cu" "F.Mask")
      (net 8 "/TIA1/VPDB") (pinfunction "B") (pintype "passive") (zone_connect 2)
      (options (clearance outline) (anchor rect))
      (primitives
        (gr_circle (center 0 0.25) (end 0.5 0.25) (width 0) (fill yes))
        (gr_circle (center 0 -0.25) (end 0.5 -0.25) (width 0) (fill yes))
        (gr_poly (pts
            (xy 0 0.75)
            (xy -0.5 0.75)
            (xy -0.5 -0.75)
            (xy 0 -0.75)
          ) (width 0) (fill yes))
      ))
  )
  (footprint "Resistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEE)
    (at 181.8585 94.943448 180)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (property "Sheetfile" "tia_adl5303.kicad_sch")
    (property "Sheetname" "TIA2")
    (attr smd)
    (fp_text reference "R26" (at -3.0535 -0.052552 180) (layer "F.SilkS"))
    (fp_text value "54.9k" (at 0 1.65) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab"))
    (pad "1" smd roundrect (at -1 0 180) (size 1.2 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.208333)
      (net 17 "CH2-") (pintype "passive"))
    (pad "2" smd roundrect (at 1 0 180) (size 1.2 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.208333)
      (net 112 "/TIA2/STAGE_2_IN+") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Resistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEE)
    (at 166.6025 87.323448 -90)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (property "Sheetfile" "tia_adl5303.kicad_sch")
    (property "Sheetname" "TIA3")
    (attr smd)
    (fp_text reference "R34" (at 3.048 0 90) (layer "F.SilkS"))
    (fp_text value "8.2k" (at 0 1.65 90) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab"))
    (pad "1" smd roundrect (at -1 0 270) (size 1.2 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.208333)
      (net 65 "/TIA3/VREF") (pintype "passive"))
    (pad "2" smd roundrect (at 1 0 270) (size 1.2 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.208333)
      (net 22 "/TIA3/STAGE_2_IN-") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEF)
    (at 116.7755 92.591448)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "Sheetfile" "tia_adl5303.kicad_sch")
    (property "Sheetname" "TIA8")
    (attr smd)
    (fp_text reference "C84" (at 0.3185 1.524) (layer "F.SilkS"))
    (fp_text value "220p" (at 0 1.68) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab"))
    (pad "1" smd roundrect (at -1.0375 0) (size 1.175 1.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.212766)
      (net 52 "/TIA8/STAGE_2_IN-") (pintype "passive"))
    (pad "2" smd roundrect (at 1.0375 0) (size 1.175 1.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.212766)
      (net 118 "/TIA8/STAGE_2_IN+") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEF)
    (at 147.2985 92.456)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "Sheetfile" "tia_adl5303.kicad_sch")
    (property "Sheetname" "TIA5")
    (attr smd)
    (fp_text reference "C54" (at 0.2755 1.524) (layer "F.SilkS"))
    (fp_text value "220p" (at 0 1.68) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab"))
    (pad "1" smd roundrect (at -1.0375 0) (size 1.175 1.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.212766)
      (net 34 "/TIA5/STAGE_2_IN-") (pintype "passive"))
    (pad "2" smd roundrect (at 1.0375 0) (size 1.175 1.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.212766)
      (net 115 "/TIA5/STAGE_2_IN+") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Resistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEE)
    (at 119.0615 104.529448)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (property "Sheetfile" "tia_adl5303.kicad_sch")
    (property "Sheetname" "TIA8")
    (attr smd)
    (fp_text reference "R87" (at 3.048 0) (layer "F.SilkS"))
    (fp_text value "54.9k" (at 0 1.65) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab"))
    (pad "1" smd roundrect (at -1 0) (size 1.2 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.208333)
      (net 52 "/TIA8/STAGE_2_IN-") (pintype "passive"))
    (pad "2" smd roundrect (at 1 0) (size 1.2 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.208333)
      (net 54 "CH8+") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Package_DFN_QFN:QFN-16-1EP_3x3mm_P0.5mm_EP1.45x1.45mm" (layer "F.Cu")
    (tedit 5DC5F6A3)
    (at 158.9825 82.4941 -90)
    (descr "QFN, 16 Pin (http://cds.linear.com/docs/en/datasheet/37551fd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py")
    (tags "QFN NoLead")
    (property "Description" "SP Amp LOG Amp Single R-R O/P 5.5V 16-Pin LFCSP EP T/R")
    (property "Height" "0.8")
    (property "Manufacturer_Name" "Analog Devices")
    (property "Manufacturer_Part_Number" "ADL5303ACPZ-R7")
    (property "Mouser Part Number" "584-ADL5303ACPZ-R7")
    (property "Mouser Price/Stock" "https://www.mouser.co.uk/ProductDetail/Analog-Devices/ADL5303ACPZ-R7?qs=BpaRKvA4VqHSm6pnud57YQ%3D%3D")
    (property "Sheetfile" "tia_adl5303.kicad_sch")
    (property "Sheetname" "TIA4")
    (attr smd)
    (fp_text reference "IC41" (at 0 2.54 90) (layer "F.SilkS"))
    (fp_text value "ADL5303ACPZ-R7" (at 0 2.82 90) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab"))
    (pad "" smd roundrect (at 0.36 -0.36 270) (size 0.58 0.58) (layers "F.Paste") (roundrect_rratio 0.25))
    (pad "" smd roundrect (at -0.36 0.36 270) (size 0.58 0.58) (layers "F.Paste") (roundrect_rratio 0.25))
    (pad "" smd roundrect (at -0.36 -0.36 270) (size 0.58 0.58) (layers "F.Paste") (roundrect_rratio 0.25))
    (pad "" smd roundrect (at 0.36 0.36 270) (size 0.58 0.58) (layers "F.Paste") (roundrect_rratio 0.25))
    (pad "1" smd roundrect (at -1.4375 -0.75 270) (size 0.875 0.25) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 68 "unconnected-(IC41-Pad1)") (pinfunction "NC") (pintype "no_connect"))
    (pad "2" smd roundrect (at -1.4375 -0.25 270) (size 0.875 0.25) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 25 "/TIA4/VSUM") (pinfunction "VSUM_1") (pintype "passive"))
    (pad "3" smd roundrect (at -1.4375 0.25 270) (size 0.875 0.25) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 69 "/TIA4/PD_A") (pinfunction "INPT") (pintype "passive"))
    (pad "4" smd roundrect (at -1.4375 0.75 270) (size 0.875 0.25) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 25 "/TIA4/VSUM") (pinfunction "VSUM_2") (pintype "passive"))
    (pad "5" smd roundrect (at -0.75 1.4375 270) (size 0.25 0.875) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 26 "/TIA4/VPDB") (pinfunction "VPDB") (pintype "passive"))
    (pad "6" smd roundrect (at -0.25 1.4375 270) (size 0.25 0.875) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 70 "/TIA4/VREF") (pinfunction "VREF") (pintype "passive"))
    (pad "7" smd roundrect (at 0.25 1.4375 270) (size 0.25 0.875) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 1 "GND") (pinfunction "ACOM") (pintype "passive"))
    (pad "8" smd roundrect (at 0.75 1.4375 270) (size 0.25 0.875) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 27 "/TIA4/VLOG") (pinfunction "VLOG") (pintype "passive"))
    (pad "9" smd roundrect (at 1.4375 0.75 270) (size 0.875 0.25) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 27 "/TIA4/VLOG") (pinfunction "BFIN") (pintype "passive"))
    (pad "10" smd roundrect (at 1.4375 0.25 270) (size 0.875 0.25) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 2 "+5V") (pinfunction "VPS2") (pintype "passive"))
    (pad "11" smd roundrect (at 1.4375 -0.25 270) (size 0.875 0.25) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 106 "/TIA4/BF_OUT") (pinfunction "VOUT") (pintype "passive"))
    (pad "12" smd roundrect (at 1.4375 -0.75 270) (size 0.875 0.25) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 2 "+5V") (pinfunction "VPS1") (pintype "passive"))
    (pad "13" smd roundrect (at 0.75 -1.4375 270) (size 0.25 0.875) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 71 "/TIA4/BF_NG") (pinfunction "BFNG") (pintype "passive"))
    (pad "14" smd roundrect (at 0.25 -1.4375 270) (size 0.25 0.875) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 1 "GND") (pinfunction "GND_1") (pintype "passive"))
    (pad "15" smd roundrect (at -0.25 -1.4375 270) (size 0.25 0.875) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 1 "GND") (pinfunction "GND_2") (pintype "passive"))
    (pad "16" smd roundrect (at -0.75 -1.4375 270) (size 0.25 0.875) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 1 "GND") (pinfunction "PWDN") (pintype "passive"))
    (pad "17" smd rect (at 0 0 270) (size 1.45 1.45) (layers "F.Cu" "F.Mask")
      (net 25 "/TIA4/VSUM") (pinfunction "EP") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Package_DFN_QFN.3dshapes/QFN-16-1EP_3x3mm_P0.5mm_EP1.45x1.45mm.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Resistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEE)
    (at 168.6345 87.323448 90)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (property "Sheetfile" "tia_adl5303.kicad_sch")
    (property "Sheetname" "TIA3")
    (attr smd)
    (fp_text reference "R35" (at -3.048 0 90) (layer "F.SilkS"))
    (fp_text value "33k" (at 0 1.65 90) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab"))
    (pad "1" smd roundrect (at -1 0 90) (size 1.2 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.208333)
      (net 22 "/TIA3/STAGE_2_IN-") (pintype "passive"))
    (pad "2" smd roundrect (at 1 0 90) (size 1.2 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.208333)
      (net 1 "GND") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Resistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEE)
    (at 171.6985 94.943448 180)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (property "Sheetfile" "tia_adl5303.kicad_sch")
    (property "Sheetname" "TIA3")
    (attr smd)
    (fp_text reference "R36" (at -3.0535 -0.052552 180) (layer "F.SilkS"))
    (fp_text value "54.9k" (at 0 1.65) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab"))
    (pad "1" smd roundrect (at -1 0 180) (size 1.2 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.208333)
      (net 23 "CH3-") (pintype "passive"))
    (pad "2" smd roundrect (at 1 0 180) (size 1.2 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.208333)
      (net 113 "/TIA3/STAGE_2_IN+") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Package_DFN_QFN:QFN-16-1EP_3x3mm_P0.5mm_EP1.45x1.45mm" (layer "F.Cu")
    (tedit 5DC5F6A3)
    (at 189.4625 82.497448 -90)
    (descr "QFN, 16 Pin (http://cds.linear.com/docs/en/datasheet/37551fd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py")
    (tags "QFN NoLead")
    (property "Description" "SP Amp LOG Amp Single R-R O/P 5.5V 16-Pin LFCSP EP T/R")
    (property "Height" "0.8")
    (property "Manufacturer_Name" "Analog Devices")
    (property "Manufacturer_Part_Number" "ADL5303ACPZ-R7")
    (property "Mouser Part Number" "584-ADL5303ACPZ-R7")
    (property "Mouser Price/Stock" "https://www.mouser.co.uk/ProductDetail/Analog-Devices/ADL5303ACPZ-R7?qs=BpaRKvA4VqHSm6pnud57YQ%3D%3D")
    (property "Sheetfile" "tia_adl5303.kicad_sch")
    (property "Sheetname" "TIA1")
    (attr smd)
    (fp_text reference "IC11" (at 0 2.54 90) (layer "F.SilkS"))
    (fp_text value "ADL5303ACPZ-R7" (at 0 2.82 90) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab"))
    (pad "" smd roundrect (at -0.36 -0.36 270) (size 0.58 0.58) (layers "F.Paste") (roundrect_rratio 0.25))
    (pad "" smd roundrect (at -0.36 0.36 270) (size 0.58 0.58) (layers "F.Paste") (roundrect_rratio 0.25))
    (pad "" smd roundrect (at 0.36 0.36 270) (size 0.58 0.58) (layers "F.Paste") (roundrect_rratio 0.25))
    (pad "" smd roundrect (at 0.36 -0.36 270) (size 0.58 0.58) (layers "F.Paste") (roundrect_rratio 0.25))
    (pad "1" smd roundrect (at -1.4375 -0.75 270) (size 0.875 0.25) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 3 "unconnected-(IC11-Pad1)") (pinfunction "NC") (pintype "no_connect"))
    (pad "2" smd roundrect (at -1.4375 -0.25 270) (size 0.875 0.25) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 7 "/TIA1/VSUM") (pinfunction "VSUM_1") (pintype "passive"))
    (pad "3" smd roundrect (at -1.4375 0.25 270) (size 0.875 0.25) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 55 "/TIA1/PD_A") (pinfunction "INPT") (pintype "passive"))
    (pad "4" smd roundrect (at -1.4375 0.75 270) (size 0.875 0.25) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 7 "/TIA1/VSUM") (pinfunction "VSUM_2") (pintype "passive"))
    (pad "5" smd roundrect (at -0.75 1.4375 270) (size 0.25 0.875) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 8 "/TIA1/VPDB") (pinfunction "VPDB") (pintype "passive"))
    (pad "6" smd roundrect (at -0.25 1.4375 270) (size 0.25 0.875) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 56 "/TIA1/VREF") (pinfunction "VREF") (pintype "passive"))
    (pad "7" smd roundrect (at 0.25 1.4375 270) (size 0.25 0.875) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 1 "GND") (pinfunction "ACOM") (pintype "passive"))
    (pad "8" smd roundrect (at 0.75 1.4375 270) (size 0.25 0.875) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 9 "/TIA1/VLOG") (pinfunction "VLOG") (pintype "passive"))
    (pad "9" smd roundrect (at 1.4375 0.75 270) (size 0.875 0.25) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 9 "/TIA1/VLOG") (pinfunction "BFIN") (pintype "passive"))
    (pad "10" smd roundrect (at 1.4375 0.25 270) (size 0.875 0.25) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 2 "+5V") (pinfunction "VPS2") (pintype "passive"))
    (pad "11" smd roundrect (at 1.4375 -0.25 270) (size 0.875 0.25) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 103 "/TIA1/BF_OUT") (pinfunction "VOUT") (pintype "passive"))
    (pad "12" smd roundrect (at 1.4375 -0.75 270) (size 0.875 0.25) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 2 "+5V") (pinfunction "VPS1") (pintype "passive"))
    (pad "13" smd roundrect (at 0.75 -1.4375 270) (size 0.25 0.875) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 57 "/TIA1/BF_NG") (pinfunction "BFNG") (pintype "passive"))
    (pad "14" smd roundrect (at 0.25 -1.4375 270) (size 0.25 0.875) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 1 "GND") (pinfunction "GND_1") (pintype "passive"))
    (pad "15" smd roundrect (at -0.25 -1.4375 270) (size 0.25 0.875) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 1 "GND") (pinfunction "GND_2") (pintype "passive"))
    (pad "16" smd roundrect (at -0.75 -1.4375 270) (size 0.25 0.875) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 1 "GND") (pinfunction "PWDN") (pintype "passive"))
    (pad "17" smd rect (at 0 0 270) (size 1.45 1.45) (layers "F.Cu" "F.Mask")
      (net 7 "/TIA1/VSUM") (pinfunction "EP") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Package_DFN_QFN.3dshapes/QFN-16-1EP_3x3mm_P0.5mm_EP1.45x1.45mm.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Jumper:SolderJumper-2_P1.3mm_Open_RoundedPad1.0x1.5mm" (layer "F.Cu")
    (tedit 5B391E66)
    (at 125.1885 77.179448 -90)
    (descr "SMD Solder Jumper, 1x1.5mm, rounded Pads, 0.3mm gap, open")
    (tags "solder jumper open")
    (property "Sheetfile" "tia_adl5303.kicad_sch")
    (property "Sheetname" "TIA7")
    (attr exclude_from_pos_files)
    (fp_text reference "JP72" (at 0 2.032 90) (layer "F.SilkS") hide)
    (fp_text value "SolderJumper_2_Open" (at 0 1.9 90) (layer "F.Fab"))
    (pad "1" smd custom (at -0.65 0 270) (size 1 0.5) (layers "F.Cu" "F.Mask")
      (net 99 "/TIA7/PD_K") (pinfunction "A") (pintype "passive") (zone_connect 2)
      (options (clearance outline) (anchor rect))
      (primitives
        (gr_circle (center 0 0.25) (end 0.5 0.25) (width 0) (fill yes))
        (gr_circle (center 0 -0.25) (end 0.5 -0.25) (width 0) (fill yes))
        (gr_poly (pts
            (xy 0.5 0.75)
            (xy 0 0.75)
            (xy 0 -0.75)
            (xy 0.5 -0.75)
          ) (width 0) (fill yes))
      ))
    (pad "2" smd custom (at 0.65 0 270) (size 1 0.5) (layers "F.Cu" "F.Mask")
      (net 44 "/TIA7/VPDB") (pinfunction "B") (pintype "passive") (zone_connect 2)
      (options (clearance outline) (anchor rect))
      (primitives
        (gr_circle (center 0 0.25) (end 0.5 0.25) (width 0) (fill yes))
        (gr_circle (center 0 -0.25) (end 0.5 -0.25) (width 0) (fill yes))
        (gr_poly (pts
            (xy 0 0.75)
            (xy -0.5 0.75)
            (xy -0.5 -0.75)
            (xy 0 -0.75)
          ) (width 0) (fill yes))
      ))
  )
  (footprint "Rob_Lib:utd_round" (layer "F.Cu")
    (tedit 0)
    (at 130.048 115.062)
    (attr board_only exclude_from_pos_files exclude_from_bom)
    (fp_text reference "" (at 0 0) (layer "F.SilkS"))
    (fp_text value "" (at 0 0) (layer "F.SilkS"))
  )
  (footprint "Resistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEE)
    (at 136.1225 87.323448 -90)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (property "Sheetfile" "tia_adl5303.kicad_sch")
    (property "Sheetname" "TIA6")
    (attr smd)
    (fp_text reference "R64" (at 3.048 0 90) (layer "F.SilkS"))
    (fp_text value "8.2k" (at 0 1.65 90) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab"))
    (pad "1" smd roundrect (at -1 0 270) (size 1.2 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.208333)
      (net 80 "/TIA6/VREF") (pintype "passive"))
    (pad "2" smd roundrect (at 1 0 270) (size 1.2 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.208333)
      (net 40 "/TIA6/STAGE_2_IN-") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Connector_Molex:Molex_PicoBlade_53047-0310_1x03_P1.25mm_Vertical" (layer "F.Cu")
    (tedit 5B783167)
    (at 148.6265 75.22 -90)
    (descr "Molex PicoBlade Connector System, 53047-0310, 3 Pins per row (http://www.molex.com/pdm_docs/sd/530470610_sd.pdf), generated with kicad-footprint-generator")
    (tags "connector Molex PicoBlade side entry")
    (property "Sheetfile" "ADL5303_AnalogPCB.kicad_sch")
    (property "Sheetname" "")
    (attr through_hole)
    (fp_text reference "J5" (at 1.25 -3.25 90) (layer "F.SilkS") hide)
    (fp_text value "Conn_01x03_Female" (at 1.25 2.35 90) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 1.25 -1.35 90) (layer "F.Fab"))
    (pad "1" thru_hole roundrect (at 0 0 270) (size 0.8 1.3) (drill 0.5) (layers *.Cu *.Mask) (roundrect_rratio 0.25)
      (net 97 "/TIA5/PD_K") (pinfunction "Pin_1") (pintype "passive"))
    (pad "2" thru_hole oval (at 1.25 0 270) (size 0.8 1.3) (drill 0.5) (layers *.Cu *.Mask)
      (net 31 "/TIA5/VSUM") (pinfunction "Pin_2") (pintype "passive"))
    (pad "3" thru_hole oval (at 2.5 0 270) (size 0.8 1.3) (drill 0.5) (layers *.Cu *.Mask)
      (net 74 "/TIA5/PD_A") (pinfunction "Pin_3") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Connector_Molex.3dshapes/Molex_PicoBlade_53047-0310_1x03_P1.25mm_Vertical.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Resistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEE)
    (at 148.3145 87.122 90)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (property "Sheetfile" "tia_adl5303.kicad_sch")
    (property "Sheetname" "TIA5")
    (attr smd)
    (fp_text reference "R55" (at -3.048 0 90) (layer "F.SilkS"))
    (fp_text value "33k" (at 0 1.65 90) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab"))
    (pad "1" smd roundrect (at -1 0 90) (size 1.2 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.208333)
      (net 34 "/TIA5/STAGE_2_IN-") (pintype "passive"))
    (pad "2" smd roundrect (at 1 0 90) (size 1.2 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.208333)
      (net 1 "GND") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEF)
    (at 126.9665 92.673448)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "Sheetfile" "tia_adl5303.kicad_sch")
    (property "Sheetname" "TIA7")
    (attr smd)
    (fp_text reference "C74" (at 0.2875 1.560552) (layer "F.SilkS"))
    (fp_text value "220p" (at 0 1.68) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab"))
    (pad "1" smd roundrect (at -1.0375 0) (size 1.175 1.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.212766)
      (net 46 "/TIA7/STAGE_2_IN-") (pintype "passive"))
    (pad "2" smd roundrect (at 1.0375 0) (size 1.175 1.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.212766)
      (net 117 "/TIA7/STAGE_2_IN+") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "MountingHole:MountingHole_3.2mm_M3_DIN965_Pad" (layer "F.Cu")
    (tedit 56D1B4CB)
    (at 198.12 116.84)
    (descr "Mounting Hole 3.2mm, M3, DIN965")
    (tags "mounting hole 3.2mm m3 din965")
    (attr exclude_from_pos_files exclude_from_bom)
    (fp_text reference "REF**" (at 0 -3.8) (layer "F.SilkS") hide)
    (fp_text value "MountingHole_3.2mm_M3_DIN965_Pad" (at 0 3.8) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab"))
    (pad "1" thru_hole circle locked (at 0 0) (size 5.6 5.6) (drill 3.2) (layers *.Cu *.Mask)
      (net 1 "GND"))
  )
  (footprint "Resistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEE)
    (at 115.7595 87.257448 -90)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (property "Sheetfile" "tia_adl5303.kicad_sch")
    (property "Sheetname" "TIA8")
    (attr smd)
    (fp_text reference "R84" (at 3.048 0 90) (layer "F.SilkS"))
    (fp_text value "8.2k" (at 0 1.65 90) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab"))
    (pad "1" smd roundrect (at -1 0 270) (size 1.2 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.208333)
      (net 90 "/TIA8/VREF") (pintype "passive"))
    (pad "2" smd roundrect (at 1 0 270) (size 1.2 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.208333)
      (net 52 "/TIA8/STAGE_2_IN-") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Resistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEE)
    (at 172.6985 87.323448 90)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (property "Sheetfile" "tia_adl5303.kicad_sch")
    (property "Sheetname" "TIA3")
    (attr smd)
    (fp_text reference "R31" (at -3.048 0 90) (layer "F.SilkS"))
    (fp_text value "10k" (at 0 1.65 90) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab"))
    (pad "1" smd roundrect (at -1 0 90) (size 1.2 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.208333)
      (net 105 "/TIA3/BF_OUT") (pintype "passive"))
    (pad "2" smd roundrect (at 1 0 90) (size 1.2 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.208333)
      (net 66 "/TIA3/BF_NG") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Resistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEE)
    (at 162.5385 87.3201 90)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (property "Sheetfile" "tia_adl5303.kicad_sch")
    (property "Sheetname" "TIA4")
    (attr smd)
    (fp_text reference "R41" (at -3.048 0 90) (layer "F.SilkS"))
    (fp_text value "10k" (at 0 1.65 90) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab"))
    (pad "1" smd roundrect (at -1 0 90) (size 1.2 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.208333)
      (net 106 "/TIA4/BF_OUT") (pintype "passive"))
    (pad "2" smd roundrect (at 1 0 90) (size 1.2 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.208333)
      (net 71 "/TIA4/BF_NG") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Package_DFN_QFN:QFN-16-1EP_3x3mm_P0.5mm_EP1.45x1.45mm" (layer "F.Cu")
    (tedit 5DC5F6A3)
    (at 148.8225 82.296 -90)
    (descr "QFN, 16 Pin (http://cds.linear.com/docs/en/datasheet/37551fd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py")
    (tags "QFN NoLead")
    (property "Description" "SP Amp LOG Amp Single R-R O/P 5.5V 16-Pin LFCSP EP T/R")
    (property "Height" "0.8")
    (property "Manufacturer_Name" "Analog Devices")
    (property "Manufacturer_Part_Number" "ADL5303ACPZ-R7")
    (property "Mouser Part Number" "584-ADL5303ACPZ-R7")
    (property "Mouser Price/Stock" "https://www.mouser.co.uk/ProductDetail/Analog-Devices/ADL5303ACPZ-R7?qs=BpaRKvA4VqHSm6pnud57YQ%3D%3D")
    (property "Sheetfile" "tia_adl5303.kicad_sch")
    (property "Sheetname" "TIA5")
    (attr smd)
    (fp_text reference "IC51" (at 0 2.54 90) (layer "F.SilkS"))
    (fp_text value "ADL5303ACPZ-R7" (at 0 2.82 90) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab"))
    (pad "" smd roundrect (at -0.36 0.36 270) (size 0.58 0.58) (layers "F.Paste") (roundrect_rratio 0.25))
    (pad "" smd roundrect (at 0.36 0.36 270) (size 0.58 0.58) (layers "F.Paste") (roundrect_rratio 0.25))
    (pad "" smd roundrect (at -0.36 -0.36 270) (size 0.58 0.58) (layers "F.Paste") (roundrect_rratio 0.25))
    (pad "" smd roundrect (at 0.36 -0.36 270) (size 0.58 0.58) (layers "F.Paste") (roundrect_rratio 0.25))
    (pad "1" smd roundrect (at -1.4375 -0.75 270) (size 0.875 0.25) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 73 "unconnected-(IC51-Pad1)") (pinfunction "NC") (pintype "no_connect"))
    (pad "2" smd roundrect (at -1.4375 -0.25 270) (size 0.875 0.25) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 31 "/TIA5/VSUM") (pinfunction "VSUM_1") (pintype "passive"))
    (pad "3" smd roundrect (at -1.4375 0.25 270) (size 0.875 0.25) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 74 "/TIA5/PD_A") (pinfunction "INPT") (pintype "passive"))
    (pad "4" smd roundrect (at -1.4375 0.75 270) (size 0.875 0.25) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 31 "/TIA5/VSUM") (pinfunction "VSUM_2") (pintype "passive"))
    (pad "5" smd roundrect (at -0.75 1.4375 270) (size 0.25 0.875) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 32 "/TIA5/VPDB") (pinfunction "VPDB") (pintype "passive"))
    (pad "6" smd roundrect (at -0.25 1.4375 270) (size 0.25 0.875) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 75 "/TIA5/VREF") (pinfunction "VREF") (pintype "passive"))
    (pad "7" smd roundrect (at 0.25 1.4375 270) (size 0.25 0.875) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 1 "GND") (pinfunction "ACOM") (pintype "passive"))
    (pad "8" smd roundrect (at 0.75 1.4375 270) (size 0.25 0.875) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 33 "/TIA5/VLOG") (pinfunction "VLOG") (pintype "passive"))
    (pad "9" smd roundrect (at 1.4375 0.75 270) (size 0.875 0.25) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 33 "/TIA5/VLOG") (pinfunction "BFIN") (pintype "passive"))
    (pad "10" smd roundrect (at 1.4375 0.25 270) (size 0.875 0.25) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 2 "+5V") (pinfunction "VPS2") (pintype "passive"))
    (pad "11" smd roundrect (at 1.4375 -0.25 270) (size 0.875 0.25) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 107 "/TIA5/BF_OUT") (pinfunction "VOUT") (pintype "passive"))
    (pad "12" smd roundrect (at 1.4375 -0.75 270) (size 0.875 0.25) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 2 "+5V") (pinfunction "VPS1") (pintype "passive"))
    (pad "13" smd roundrect (at 0.75 -1.4375 270) (size 0.25 0.875) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 76 "/TIA5/BF_NG") (pinfunction "BFNG") (pintype "passive"))
    (pad "14" smd roundrect (at 0.25 -1.4375 270) (size 0.25 0.875) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 1 "GND") (pinfunction "GND_1") (pintype "passive"))
    (pad "15" smd roundrect (at -0.25 -1.4375 270) (size 0.25 0.875) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 1 "GND") (pinfunction "GND_2") (pintype "passive"))
    (pad "16" smd roundrect (at -0.75 -1.4375 270) (size 0.25 0.875) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 1 "GND") (pinfunction "PWDN") (pintype "passive"))
    (pad "17" smd rect (at 0 0 270) (size 1.45 1.45) (layers "F.Cu" "F.Mask")
      (net 31 "/TIA5/VSUM") (pinfunction "EP") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Package_DFN_QFN.3dshapes/QFN-16-1EP_3x3mm_P0.5mm_EP1.45x1.45mm.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEF)
    (at 171.6825 92.911448 180)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "Sheetfile" "tia_adl5303.kicad_sch")
    (property "Sheetname" "TIA3")
    (attr smd)
    (fp_text reference "C35" (at -3.0695 -0.052552 180) (layer "F.SilkS"))
    (fp_text value "2.2p" (at 0 1.68) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab"))
    (pad "1" smd roundrect (at -1.0375 0 180) (size 1.175 1.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.212766)
      (net 23 "CH3-") (pintype "passive"))
    (pad "2" smd roundrect (at 1.0375 0 180) (size 1.175 1.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.212766)
      (net 113 "/TIA3/STAGE_2_IN+") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Jumper:SolderJumper-2_P1.3mm_Open_RoundedPad1.0x1.5mm" (layer "F.Cu")
    (tedit 5B391E66)
    (at 165.8405 77.163448 -90)
    (descr "SMD Solder Jumper, 1x1.5mm, rounded Pads, 0.3mm gap, open")
    (tags "solder jumper open")
    (property "Sheetfile" "tia_adl5303.kicad_sch")
    (property "Sheetname" "TIA3")
    (attr exclude_from_pos_files)
    (fp_text reference "JP32" (at 0 2.032 90) (layer "F.SilkS") hide)
    (fp_text value "SolderJumper_2_Open" (at 0 1.9 90) (layer "F.Fab"))
    (pad "1" smd custom (at -0.65 0 270) (size 1 0.5) (layers "F.Cu" "F.Mask")
      (net 95 "/TIA3/PD_K") (pinfunction "A") (pintype "passive") (zone_connect 2)
      (options (clearance outline) (anchor rect))
      (primitives
        (gr_circle (center 0 0.25) (end 0.5 0.25) (width 0) (fill yes))
        (gr_circle (center 0 -0.25) (end 0.5 -0.25) (width 0) (fill yes))
        (gr_poly (pts
            (xy 0.5 0.75)
            (xy 0 0.75)
            (xy 0 -0.75)
            (xy 0.5 -0.75)
          ) (width 0) (fill yes))
      ))
    (pad "2" smd custom (at 0.65 0 270) (size 1 0.5) (layers "F.Cu" "F.Mask")
      (net 20 "/TIA3/VPDB") (pinfunction "B") (pintype "passive") (zone_connect 2)
      (options (clearance outline) (anchor rect))
      (primitives
        (gr_circle (center 0 0.25) (end 0.5 0.25) (width 0) (fill yes))
        (gr_circle (center 0 -0.25) (end 0.5 -0.25) (width 0) (fill yes))
        (gr_poly (pts
            (xy 0 0.75)
            (xy -0.5 0.75)
            (xy -0.5 -0.75)
            (xy 0 -0.75)
          ) (width 0) (fill yes))
      ))
  )
  (footprint "Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEF)
    (at 181.8425 92.911448 180)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "Sheetfile" "tia_adl5303.kicad_sch")
    (property "Sheetname" "TIA2")
    (attr smd)
    (fp_text reference "C25" (at -3.0695 -0.052552 180) (layer "F.SilkS"))
    (fp_text value "2.2p" (at 0 1.68) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab"))
    (pad "1" smd roundrect (at -1.0375 0 180) (size 1.175 1.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.212766)
      (net 17 "CH2-") (pintype "passive"))
    (pad "2" smd roundrect (at 1.0375 0 180) (size 1.175 1.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.212766)
      (net 112 "/TIA2/STAGE_2_IN+") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Resistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEE)
    (at 161.5385 94.9401 180)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (property "Sheetfile" "tia_adl5303.kicad_sch")
    (property "Sheetname" "TIA4")
    (attr smd)
    (fp_text reference "R46" (at -3.0535 -0.0559 180) (layer "F.SilkS"))
    (fp_text value "54.9k" (at 0 1.65) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab"))
    (pad "1" smd roundrect (at -1 0 180) (size 1.2 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.208333)
      (net 29 "CH4-") (pintype "passive"))
    (pad "2" smd roundrect (at 1 0 180) (size 1.2 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.208333)
      (net 114 "/TIA4/STAGE_2_IN+") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEF)
    (at 187.9385 92.657448)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "Sheetfile" "tia_adl5303.kicad_sch")
    (property "Sheetname" "TIA1")
    (attr smd)
    (fp_text reference "C14" (at 0.0215 1.524) (layer "F.SilkS"))
    (fp_text value "220p" (at 0 1.68) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab"))
    (pad "1" smd roundrect (at -1.0375 0) (size 1.175 1.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.212766)
      (net 10 "/TIA1/STAGE_2_IN-") (pintype "passive"))
    (pad "2" smd roundrect (at 1.0375 0) (size 1.175 1.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.212766)
      (net 111 "/TIA1/STAGE_2_IN+") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEF)
    (at 137.1385 92.657448)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "Sheetfile" "tia_adl5303.kicad_sch")
    (property "Sheetname" "TIA6")
    (attr smd)
    (fp_text reference "C64" (at 0.2755 1.524) (layer "F.SilkS"))
    (fp_text value "220p" (at 0 1.68) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab"))
    (pad "1" smd roundrect (at -1.0375 0) (size 1.175 1.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.212766)
      (net 40 "/TIA6/STAGE_2_IN-") (pintype "passive"))
    (pad "2" smd roundrect (at 1.0375 0) (size 1.175 1.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.212766)
      (net 116 "/TIA6/STAGE_2_IN+") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEF)
    (at 119.0615 106.561448)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "Sheetfile" "tia_adl5303.kicad_sch")
    (property "Sheetname" "TIA8")
    (attr smd)
    (fp_text reference "C86" (at 3.048 0) (layer "F.SilkS"))
    (fp_text value "2.2p" (at 0 1.68) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab"))
    (pad "1" smd roundrect (at -1.0375 0) (size 1.175 1.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.212766)
      (net 52 "/TIA8/STAGE_2_IN-") (pintype "passive"))
    (pad "2" smd roundrect (at 1.0375 0) (size 1.175 1.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.212766)
      (net 54 "CH8+") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEF)
    (at 120.8395 92.845448 180)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "Sheetfile" "tia_adl5303.kicad_sch")
    (property "Sheetname" "TIA8")
    (attr smd)
    (fp_text reference "C85" (at -3.1125 -0.118552 180) (layer "F.SilkS"))
    (fp_text value "2.2p" (at 0 1.68) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab"))
    (pad "1" smd roundrect (at -1.0375 0 180) (size 1.175 1.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.212766)
      (net 53 "CH8-") (pintype "passive"))
    (pad "2" smd roundrect (at 1.0375 0 180) (size 1.175 1.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.212766)
      (net 118 "/TIA8/STAGE_2_IN+") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Jumper:SolderJumper-2_P1.3mm_Open_RoundedPad1.0x1.5mm" (layer "F.Cu")
    (tedit 5B391E66)
    (at 145.5205 76.962 -90)
    (descr "SMD Solder Jumper, 1x1.5mm, rounded Pads, 0.3mm gap, open")
    (tags "solder jumper open")
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      (net 32 "/TIA5/VPDB") (pinfunction "B") (pintype "passive") (zone_connect 2)
      (options (clearance outline) (anchor rect))
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  (footprint "Resistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEE)
    (at 121.8555 87.257448 90)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (property "Sheetfile" "tia_adl5303.kicad_sch")
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    (attr smd)
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    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab"))
    (pad "1" smd roundrect (at -1 0 90) (size 1.2 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.208333)
      (net 110 "/TIA8/BF_OUT") (pintype "passive"))
    (pad "2" smd roundrect (at 1 0 90) (size 1.2 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.208333)
      (net 91 "/TIA8/BF_NG") (pintype "passive"))
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  (footprint "Resistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEE)
    (at 142.2185 87.323448 90)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (property "Sheetfile" "tia_adl5303.kicad_sch")
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    (fp_text reference "R61" (at -3.048 0 90) (layer "F.SilkS"))
    (fp_text value "10k" (at 0 1.65 90) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab"))
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      (net 108 "/TIA6/BF_OUT") (pintype "passive"))
    (pad "2" smd roundrect (at 1 0 90) (size 1.2 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.208333)
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  (footprint "Jumper:SolderJumper-2_P1.3mm_Open_RoundedPad1.0x1.5mm" (layer "F.Cu")
    (tedit 5B391E66)
    (at 176.0005 77.163448 -90)
    (descr "SMD Solder Jumper, 1x1.5mm, rounded Pads, 0.3mm gap, open")
    (tags "solder jumper open")
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    (fp_text value "SolderJumper_2_Open" (at 0 1.9 90) (layer "F.Fab"))
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  (footprint "Resistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEE)
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    (tags "resistor handsolder")
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    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab"))
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      (net 1 "GND") (pintype "passive"))
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      (net 91 "/TIA8/BF_NG") (pintype "passive"))
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      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
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  (footprint "Package_SO:SOIC-8_3.9x4.9mm_P1.27mm" (layer "F.Cu")
    (tedit 5D9F72B1)
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    (descr "SOIC, 8 Pin (JEDEC MS-012AA, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/soic_narrow-r/r_8.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py")
    (tags "SOIC SO")
    (property "Description" "160MHz, Fully Differential Input/Output High Slew Rate Amplifier")
    (property "Height" "1.75")
    (property "Manufacturer_Name" "Texas Instruments")
    (property "Manufacturer_Part_Number" "THS4141CD")
    (property "Mouser Part Number" "595-THS4141CD")
    (property "Mouser Price/Stock" "https://www.mouser.com/Search/Refine.aspx?Keyword=595-THS4141CD")
    (property "Sheetfile" "tia_adl5303.kicad_sch")
    (property "Sheetname" "TIA5")
    (attr smd)
    (fp_text reference "IC52" (at 0 -3.4 90) (layer "F.SilkS"))
    (fp_text value "THS4141CD" (at 0 3.4 90) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab"))
    (pad "1" smd roundrect (at -2.475 -1.905 90) (size 1.95 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 34 "/TIA5/STAGE_2_IN-") (pinfunction "VIN-") (pintype "passive"))
    (pad "2" smd roundrect (at -2.475 -0.635 90) (size 1.95 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
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    (pad "3" smd roundrect (at -2.475 0.635 90) (size 1.95 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 6 "-12V") (pinfunction "VCC+") (pintype "passive"))
    (pad "4" smd roundrect (at -2.475 1.905 90) (size 1.95 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 36 "CH5+") (pinfunction "VOUT+") (pintype "passive"))
    (pad "5" smd roundrect (at 2.475 1.905 90) (size 1.95 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 35 "CH5-") (pinfunction "VOUT-") (pintype "passive"))
    (pad "6" smd roundrect (at 2.475 0.635 90) (size 1.95 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 5 "+12V") (pinfunction "VCC-") (pintype "passive"))
    (pad "7" smd roundrect (at 2.475 -0.635 90) (size 1.95 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 77 "unconnected-(IC52-Pad7)") (pinfunction "NC") (pintype "no_connect"))
    (pad "8" smd roundrect (at 2.475 -1.905 90) (size 1.95 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 115 "/TIA5/STAGE_2_IN+") (pinfunction "VIN+") (pintype "passive"))
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  (footprint "Connector_Molex:Molex_PicoBlade_53047-0310_1x03_P1.25mm_Vertical" (layer "F.Cu")
    (tedit 5B783167)
    (at 138.4665 75.474 -90)
    (descr "Molex PicoBlade Connector System, 53047-0310, 3 Pins per row (http://www.molex.com/pdm_docs/sd/530470610_sd.pdf), generated with kicad-footprint-generator")
    (tags "connector Molex PicoBlade side entry")
    (property "Sheetfile" "ADL5303_AnalogPCB.kicad_sch")
    (property "Sheetname" "")
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      (net 98 "/TIA6/PD_K") (pinfunction "Pin_1") (pintype "passive"))
    (pad "2" thru_hole oval (at 1.25 0 270) (size 0.8 1.3) (drill 0.5) (layers *.Cu *.Mask)
      (net 37 "/TIA6/VSUM") (pinfunction "Pin_2") (pintype "passive"))
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      (net 79 "/TIA6/PD_A") (pinfunction "Pin_3") (pintype "passive"))
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      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
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  (footprint "Resistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEE)
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    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (property "Sheetfile" "tia_adl5303.kicad_sch")
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    (attr smd)
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    (fp_text value "54.9k" (at 0 1.65) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab"))
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      (net 53 "CH8-") (pintype "passive"))
    (pad "2" smd roundrect (at 1 0 180) (size 1.2 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.208333)
      (net 118 "/TIA8/STAGE_2_IN+") (pintype "passive"))
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      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
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  (footprint "Jumper:SolderJumper-2_P1.3mm_Open_RoundedPad1.0x1.5mm" (layer "F.Cu")
    (tedit 5B391E66)
    (at 135.3605 77.163448 -90)
    (descr "SMD Solder Jumper, 1x1.5mm, rounded Pads, 0.3mm gap, open")
    (tags "solder jumper open")
    (property "Sheetfile" "tia_adl5303.kicad_sch")
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    (attr exclude_from_pos_files)
    (fp_text reference "JP62" (at 0 2.032 90) (layer "F.SilkS") hide)
    (fp_text value "SolderJumper_2_Open" (at 0 1.9 90) (layer "F.Fab"))
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      (net 98 "/TIA6/PD_K") (pinfunction "A") (pintype "passive") (zone_connect 2)
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        (gr_circle (center 0 -0.25) (end 0.5 -0.25) (width 0) (fill yes))
        (gr_poly (pts
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    (pad "2" smd custom (at 0.65 0 270) (size 1 0.5) (layers "F.Cu" "F.Mask")
      (net 38 "/TIA6/VPDB") (pinfunction "B") (pintype "passive") (zone_connect 2)
      (options (clearance outline) (anchor rect))
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        (gr_circle (center 0 0.25) (end 0.5 0.25) (width 0) (fill yes))
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  (footprint "Package_TO_SOT_THT:TO-220-3_Vertical" (layer "F.Cu")
    (tedit 5AC8BA0D)
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    (descr "TO-220-3, Vertical, RM 2.54mm, see https://www.vishay.com/docs/66542/to-220-1.pdf")
    (tags "TO-220-3 Vertical RM 2.54mm")
    (property "Sheetfile" "ADL5303_AnalogPCB.kicad_sch")
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    (fp_text reference "U2" (at 2.794 2.103 90) (layer "F.SilkS"))
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    (fp_text user "${REFERENCE}" (at 2.54 -4.27 90) (layer "F.Fab"))
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      (net 101 "+15V") (pinfunction "VI") (pintype "power_in"))
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      (net 1 "GND") (pinfunction "GND") (pintype "power_in"))
    (pad "3" thru_hole oval (at 5.08 0 90) (size 1.905 2) (drill 1.1) (layers *.Cu *.Mask)
      (net 5 "+12V") (pinfunction "VO") (pintype "power_out"))
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  (footprint "Resistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEE)
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    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
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      (net 104 "/TIA2/BF_OUT") (pintype "passive"))
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      (net 112 "/TIA2/STAGE_2_IN+") (pintype "passive"))
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  (footprint "Resistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder" (layer "F.Cu")
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    (tags "resistor handsolder")
    (property "Sheetfile" "tia_adl5303.kicad_sch")
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    (attr smd)
    (fp_text reference "R75" (at -3.048 0 90) (layer "F.SilkS"))
    (fp_text value "33k" (at 0 1.65 90) (layer "F.Fab"))
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      (net 46 "/TIA7/STAGE_2_IN-") (pintype "passive"))
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      (net 1 "GND") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
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  (footprint "Package_SO:SOIC-8_3.9x4.9mm_P1.27mm" (layer "F.Cu")
    (tedit 5D9F72B1)
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    (descr "SOIC, 8 Pin (JEDEC MS-012AA, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/soic_narrow-r/r_8.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py")
    (tags "SOIC SO")
    (property "Description" "160MHz, Fully Differential Input/Output High Slew Rate Amplifier")
    (property "Height" "1.75")
    (property "Manufacturer_Name" "Texas Instruments")
    (property "Manufacturer_Part_Number" "THS4141CD")
    (property "Mouser Part Number" "595-THS4141CD")
    (property "Mouser Price/Stock" "https://www.mouser.com/Search/Refine.aspx?Keyword=595-THS4141CD")
    (property "Sheetfile" "tia_adl5303.kicad_sch")
    (property "Sheetname" "TIA2")
    (attr smd)
    (fp_text reference "IC22" (at 0 -3.4 90) (layer "F.SilkS"))
    (fp_text value "THS4141CD" (at 0 3.4 90) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab"))
    (pad "1" smd roundrect (at -2.475 -1.905 90) (size 1.95 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 16 "/TIA2/STAGE_2_IN-") (pinfunction "VIN-") (pintype "passive"))
    (pad "2" smd roundrect (at -2.475 -0.635 90) (size 1.95 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 1 "GND") (pinfunction "VOCM") (pintype "passive"))
    (pad "3" smd roundrect (at -2.475 0.635 90) (size 1.95 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 6 "-12V") (pinfunction "VCC+") (pintype "passive"))
    (pad "4" smd roundrect (at -2.475 1.905 90) (size 1.95 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 18 "CH2+") (pinfunction "VOUT+") (pintype "passive"))
    (pad "5" smd roundrect (at 2.475 1.905 90) (size 1.95 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 17 "CH2-") (pinfunction "VOUT-") (pintype "passive"))
    (pad "6" smd roundrect (at 2.475 0.635 90) (size 1.95 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 5 "+12V") (pinfunction "VCC-") (pintype "passive"))
    (pad "7" smd roundrect (at 2.475 -0.635 90) (size 1.95 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 62 "unconnected-(IC22-Pad7)") (pinfunction "NC") (pintype "no_connect"))
    (pad "8" smd roundrect (at 2.475 -1.905 90) (size 1.95 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 112 "/TIA2/STAGE_2_IN+") (pinfunction "VIN+") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Package_SO.3dshapes/SOIC-8_3.9x4.9mm_P1.27mm.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Resistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEE)
    (at 132.0465 82.767448 -90)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (property "Sheetfile" "tia_adl5303.kicad_sch")
    (property "Sheetname" "TIA7")
    (attr smd)
    (fp_text reference "R72" (at 0.036552 -1.5575 90) (layer "F.SilkS"))
    (fp_text value "10k" (at 0 1.65 90) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab"))
    (pad "1" smd roundrect (at -1 0 270) (size 1.2 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.208333)
      (net 1 "GND") (pintype "passive"))
    (pad "2" smd roundrect (at 1 0 270) (size 1.2 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.208333)
      (net 86 "/TIA7/BF_NG") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEF)
    (at 131.0305 92.927448 180)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "Sheetfile" "tia_adl5303.kicad_sch")
    (property "Sheetname" "TIA7")
    (attr smd)
    (fp_text reference "C75" (at -3.0815 -0.036552 180) (layer "F.SilkS"))
    (fp_text value "2.2p" (at 0 1.68) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab"))
    (pad "1" smd roundrect (at -1.0375 0 180) (size 1.175 1.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.212766)
      (net 47 "CH7-") (pintype "passive"))
    (pad "2" smd roundrect (at 1.0375 0 180) (size 1.175 1.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.212766)
      (net 117 "/TIA7/STAGE_2_IN+") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Connector_Molex:Molex_KK-396_5273-03A_1x03_P3.96mm_Vertical" (layer "F.Cu")
    (tedit 61F08468)
    (at 119.53 114.075 180)
    (descr "Molex KK 396 Interconnect System, old/engineering part number: 5273-03A example for new part number: 09-65-2038, 3 Pins (https://www.molex.com/pdm_docs/sd/009652028_sd.pdf), generated with kicad-footprint-generator")
    (tags "connector Molex KK-396 vertical")
    (property "Sheetfile" "ADL5303_AnalogPCB.kicad_sch")
    (property "Sheetname" "")
    (attr through_hole)
    (fp_text reference "J10" (at 8.278 6.379) (layer "F.SilkS") hide)
    (fp_text value "Conn_01x03_Female" (at 3.96 6.35) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 3.96 -4.9) (layer "F.Fab"))
    (pad "1" thru_hole roundrect (at 0 0 180) (size 3.16 4.2) (drill 1.8) (layers *.Cu *.Mask) (roundrect_rratio 0.079114)
      (net 101 "+15V") (pinfunction "Pin_1") (pintype "passive"))
    (pad "2" thru_hole oval (at 3.96 0 180) (size 3.16 4.2) (drill 1.8) (layers *.Cu *.Mask)
      (net 1 "GND") (pinfunction "Pin_2") (pintype "passive"))
    (pad "3" thru_hole oval (at 7.92 0 180) (size 3.16 4.2) (drill 1.8) (layers *.Cu *.Mask)
      (net 102 "-15V") (pinfunction "Pin_3") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Connector_Molex.3dshapes/Molex_KK-396_5273-03A_1x03_P3.96mm_Vertical.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Package_DFN_QFN:QFN-16-1EP_3x3mm_P0.5mm_EP1.45x1.45mm" (layer "F.Cu")
    (tedit 5DC5F6A3)
    (at 179.3025 82.497448 -90)
    (descr "QFN, 16 Pin (http://cds.linear.com/docs/en/datasheet/37551fd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py")
    (tags "QFN NoLead")
    (property "Description" "SP Amp LOG Amp Single R-R O/P 5.5V 16-Pin LFCSP EP T/R")
    (property "Height" "0.8")
    (property "Manufacturer_Name" "Analog Devices")
    (property "Manufacturer_Part_Number" "ADL5303ACPZ-R7")
    (property "Mouser Part Number" "584-ADL5303ACPZ-R7")
    (property "Mouser Price/Stock" "https://www.mouser.co.uk/ProductDetail/Analog-Devices/ADL5303ACPZ-R7?qs=BpaRKvA4VqHSm6pnud57YQ%3D%3D")
    (property "Sheetfile" "tia_adl5303.kicad_sch")
    (property "Sheetname" "TIA2")
    (attr smd)
    (fp_text reference "IC21" (at 0 2.54 90) (layer "F.SilkS"))
    (fp_text value "ADL5303ACPZ-R7" (at 0 2.82 90) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab"))
    (pad "" smd roundrect (at -0.36 0.36 270) (size 0.58 0.58) (layers "F.Paste") (roundrect_rratio 0.25))
    (pad "" smd roundrect (at 0.36 -0.36 270) (size 0.58 0.58) (layers "F.Paste") (roundrect_rratio 0.25))
    (pad "" smd roundrect (at -0.36 -0.36 270) (size 0.58 0.58) (layers "F.Paste") (roundrect_rratio 0.25))
    (pad "" smd roundrect (at 0.36 0.36 270) (size 0.58 0.58) (layers "F.Paste") (roundrect_rratio 0.25))
    (pad "1" smd roundrect (at -1.4375 -0.75 270) (size 0.875 0.25) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 58 "unconnected-(IC21-Pad1)") (pinfunction "NC") (pintype "no_connect"))
    (pad "2" smd roundrect (at -1.4375 -0.25 270) (size 0.875 0.25) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 13 "/TIA2/VSUM") (pinfunction "VSUM_1") (pintype "passive"))
    (pad "3" smd roundrect (at -1.4375 0.25 270) (size 0.875 0.25) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 59 "/TIA2/PD_A") (pinfunction "INPT") (pintype "passive"))
    (pad "4" smd roundrect (at -1.4375 0.75 270) (size 0.875 0.25) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 13 "/TIA2/VSUM") (pinfunction "VSUM_2") (pintype "passive"))
    (pad "5" smd roundrect (at -0.75 1.4375 270) (size 0.25 0.875) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 14 "/TIA2/VPDB") (pinfunction "VPDB") (pintype "passive"))
    (pad "6" smd roundrect (at -0.25 1.4375 270) (size 0.25 0.875) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 60 "/TIA2/VREF") (pinfunction "VREF") (pintype "passive"))
    (pad "7" smd roundrect (at 0.25 1.4375 270) (size 0.25 0.875) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 1 "GND") (pinfunction "ACOM") (pintype "passive"))
    (pad "8" smd roundrect (at 0.75 1.4375 270) (size 0.25 0.875) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 15 "/TIA2/VLOG") (pinfunction "VLOG") (pintype "passive"))
    (pad "9" smd roundrect (at 1.4375 0.75 270) (size 0.875 0.25) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 15 "/TIA2/VLOG") (pinfunction "BFIN") (pintype "passive"))
    (pad "10" smd roundrect (at 1.4375 0.25 270) (size 0.875 0.25) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 2 "+5V") (pinfunction "VPS2") (pintype "passive"))
    (pad "11" smd roundrect (at 1.4375 -0.25 270) (size 0.875 0.25) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 104 "/TIA2/BF_OUT") (pinfunction "VOUT") (pintype "passive"))
    (pad "12" smd roundrect (at 1.4375 -0.75 270) (size 0.875 0.25) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 2 "+5V") (pinfunction "VPS1") (pintype "passive"))
    (pad "13" smd roundrect (at 0.75 -1.4375 270) (size 0.25 0.875) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 61 "/TIA2/BF_NG") (pinfunction "BFNG") (pintype "passive"))
    (pad "14" smd roundrect (at 0.25 -1.4375 270) (size 0.25 0.875) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 1 "GND") (pinfunction "GND_1") (pintype "passive"))
    (pad "15" smd roundrect (at -0.25 -1.4375 270) (size 0.25 0.875) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 1 "GND") (pinfunction "GND_2") (pintype "passive"))
    (pad "16" smd roundrect (at -0.75 -1.4375 270) (size 0.25 0.875) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 1 "GND") (pinfunction "PWDN") (pintype "passive"))
    (pad "17" smd rect (at 0 0 270) (size 1.45 1.45) (layers "F.Cu" "F.Mask")
      (net 13 "/TIA2/VSUM") (pinfunction "EP") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Package_DFN_QFN.3dshapes/QFN-16-1EP_3x3mm_P0.5mm_EP1.45x1.45mm.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Connector_Molex:Molex_PicoBlade_53047-0310_1x03_P1.25mm_Vertical" (layer "F.Cu")
    (tedit 5B783167)
    (at 189.2665 75.405448 -90)
    (descr "Molex PicoBlade Connector System, 53047-0310, 3 Pins per row (http://www.molex.com/pdm_docs/sd/530470610_sd.pdf), generated with kicad-footprint-generator")
    (tags "connector Molex PicoBlade side entry")
    (property "Sheetfile" "ADL5303_AnalogPCB.kicad_sch")
    (property "Sheetname" "")
    (attr through_hole)
    (fp_text reference "J1" (at 1.25 -3.25 90) (layer "F.SilkS") hide)
    (fp_text value "Conn_01x03_Female" (at 1.25 2.35 90) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 1.25 -1.35 90) (layer "F.Fab"))
    (pad "1" thru_hole roundrect (at 0 0 270) (size 0.8 1.3) (drill 0.5) (layers *.Cu *.Mask) (roundrect_rratio 0.25)
      (net 93 "/TIA1/PD_K") (pinfunction "Pin_1") (pintype "passive"))
    (pad "2" thru_hole oval (at 1.25 0 270) (size 0.8 1.3) (drill 0.5) (layers *.Cu *.Mask)
      (net 7 "/TIA1/VSUM") (pinfunction "Pin_2") (pintype "passive"))
    (pad "3" thru_hole oval (at 2.5 0 270) (size 0.8 1.3) (drill 0.5) (layers *.Cu *.Mask)
      (net 55 "/TIA1/PD_A") (pinfunction "Pin_3") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Connector_Molex.3dshapes/Molex_PicoBlade_53047-0310_1x03_P1.25mm_Vertical.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Resistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEE)
    (at 130.0145 87.339448 -90)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (property "Sheetfile" "tia_adl5303.kicad_sch")
    (property "Sheetname" "TIA7")
    (attr smd)
    (fp_text reference "R73" (at 3.048 0 90) (layer "F.SilkS"))
    (fp_text value "6.8k" (at 0 1.65 90) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab"))
    (pad "1" smd roundrect (at -1 0 270) (size 1.2 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.208333)
      (net 109 "/TIA7/BF_OUT") (pintype "passive"))
    (pad "2" smd roundrect (at 1 0 270) (size 1.2 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.208333)
      (net 117 "/TIA7/STAGE_2_IN+") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Resistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEE)
    (at 188.9545 87.323448 90)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (property "Sheetfile" "tia_adl5303.kicad_sch")
    (property "Sheetname" "TIA1")
    (attr smd)
    (fp_text reference "R15" (at -3.048 0 90) (layer "F.SilkS"))
    (fp_text value "33k" (at 0 1.65 90) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab"))
    (pad "1" smd roundrect (at -1 0 90) (size 1.2 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.208333)
      (net 10 "/TIA1/STAGE_2_IN-") (pintype "passive"))
    (pad "2" smd roundrect (at 1 0 90) (size 1.2 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.208333)
      (net 1 "GND") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Resistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEE)
    (at 152.3785 82.55 -90)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (property "Sheetfile" "tia_adl5303.kicad_sch")
    (property "Sheetname" "TIA5")
    (attr smd)
    (fp_text reference "R52" (at 0 -1.5455 90) (layer "F.SilkS"))
    (fp_text value "10k" (at 0 1.65 90) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab"))
    (pad "1" smd roundrect (at -1 0 270) (size 1.2 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.208333)
      (net 1 "GND") (pintype "passive"))
    (pad "2" smd roundrect (at 1 0 270) (size 1.2 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.208333)
      (net 76 "/TIA5/BF_NG") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Resistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEE)
    (at 182.8585 82.751448 -90)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (property "Sheetfile" "tia_adl5303.kicad_sch")
    (property "Sheetname" "TIA2")
    (attr smd)
    (fp_text reference "R22" (at 0.052552 -1.5455 90) (layer "F.SilkS"))
    (fp_text value "10k" (at 0 1.65 90) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab"))
    (pad "1" smd roundrect (at -1 0 270) (size 1.2 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.208333)
      (net 1 "GND") (pintype "passive"))
    (pad "2" smd roundrect (at 1 0 270) (size 1.2 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.208333)
      (net 61 "/TIA2/BF_NG") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Resistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEE)
    (at 131.0465 94.959448 180)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (property "Sheetfile" "tia_adl5303.kicad_sch")
    (property "Sheetname" "TIA7")
    (attr smd)
    (fp_text reference "R76" (at -3.0655 -0.036552 180) (layer "F.SilkS"))
    (fp_text value "54.9k" (at 0 1.65) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab"))
    (pad "1" smd roundrect (at -1 0 180) (size 1.2 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.208333)
      (net 47 "CH7-") (pintype "passive"))
    (pad "2" smd roundrect (at 1 0 180) (size 1.2 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.208333)
      (net 117 "/TIA7/STAGE_2_IN+") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl"
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  (footprint "Resistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEE)
    (at 129.2525 104.611448)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (property "Sheetfile" "tia_adl5303.kicad_sch")
    (property "Sheetname" "TIA7")
    (attr smd)
    (fp_text reference "R77" (at 3.048 0) (layer "F.SilkS"))
    (fp_text value "54.9k" (at 0 1.65) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab"))
    (pad "1" smd roundrect (at -1 0) (size 1.2 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.208333)
      (net 46 "/TIA7/STAGE_2_IN-") (pintype "passive"))
    (pad "2" smd roundrect (at 1 0) (size 1.2 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.208333)
      (net 48 "CH7+") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Package_SO:SOIC-8_3.9x4.9mm_P1.27mm" (layer "F.Cu")
    (tedit 5D9F72B1)
    (at 140.1865 99.769448 90)
    (descr "SOIC, 8 Pin (JEDEC MS-012AA, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/soic_narrow-r/r_8.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py")
    (tags "SOIC SO")
    (property "Description" "160MHz, Fully Differential Input/Output High Slew Rate Amplifier")
    (property "Height" "1.75")
    (property "Manufacturer_Name" "Texas Instruments")
    (property "Manufacturer_Part_Number" "THS4141CD")
    (property "Mouser Part Number" "595-THS4141CD")
    (property "Mouser Price/Stock" "https://www.mouser.com/Search/Refine.aspx?Keyword=595-THS4141CD")
    (property "Sheetfile" "tia_adl5303.kicad_sch")
    (property "Sheetname" "TIA6")
    (attr smd)
    (fp_text reference "IC62" (at 0 -3.4 90) (layer "F.SilkS"))
    (fp_text value "THS4141CD" (at 0 3.4 90) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab"))
    (pad "1" smd roundrect (at -2.475 -1.905 90) (size 1.95 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 40 "/TIA6/STAGE_2_IN-") (pinfunction "VIN-") (pintype "passive"))
    (pad "2" smd roundrect (at -2.475 -0.635 90) (size 1.95 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 1 "GND") (pinfunction "VOCM") (pintype "passive"))
    (pad "3" smd roundrect (at -2.475 0.635 90) (size 1.95 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 6 "-12V") (pinfunction "VCC+") (pintype "passive"))
    (pad "4" smd roundrect (at -2.475 1.905 90) (size 1.95 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 42 "CH6+") (pinfunction "VOUT+") (pintype "passive"))
    (pad "5" smd roundrect (at 2.475 1.905 90) (size 1.95 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 41 "CH6-") (pinfunction "VOUT-") (pintype "passive"))
    (pad "6" smd roundrect (at 2.475 0.635 90) (size 1.95 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 5 "+12V") (pinfunction "VCC-") (pintype "passive"))
    (pad "7" smd roundrect (at 2.475 -0.635 90) (size 1.95 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 82 "unconnected-(IC62-Pad7)") (pinfunction "NC") (pintype "no_connect"))
    (pad "8" smd roundrect (at 2.475 -1.905 90) (size 1.95 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 116 "/TIA6/STAGE_2_IN+") (pinfunction "VIN+") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Package_SO.3dshapes/SOIC-8_3.9x4.9mm_P1.27mm.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Resistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEE)
    (at 190.2245 104.595448)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (property "Sheetfile" "tia_adl5303.kicad_sch")
    (property "Sheetname" "TIA1")
    (attr smd)
    (fp_text reference "R17" (at 3.048 0) (layer "F.SilkS"))
    (fp_text value "54.9k" (at 0 1.65) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab"))
    (pad "1" smd roundrect (at -1 0) (size 1.2 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.208333)
      (net 10 "/TIA1/STAGE_2_IN-") (pintype "passive"))
    (pad "2" smd roundrect (at 1 0) (size 1.2 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.208333)
      (net 12 "CH1+") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
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  (footprint "Resistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEE)
    (at 152.3785 87.122 90)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (property "Sheetfile" "tia_adl5303.kicad_sch")
    (property "Sheetname" "TIA5")
    (attr smd)
    (fp_text reference "R51" (at -3.048 0 90) (layer "F.SilkS"))
    (fp_text value "10k" (at 0 1.65 90) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab"))
    (pad "1" smd roundrect (at -1 0 90) (size 1.2 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.208333)
      (net 107 "/TIA5/BF_OUT") (pintype "passive"))
    (pad "2" smd roundrect (at 1 0 90) (size 1.2 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.208333)
      (net 76 "/TIA5/BF_NG") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEF)
    (at 139.4245 106.627448)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "Sheetfile" "tia_adl5303.kicad_sch")
    (property "Sheetname" "TIA6")
    (attr smd)
    (fp_text reference "C66" (at 3.048 0) (layer "F.SilkS"))
    (fp_text value "2.2p" (at 0 1.68) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab"))
    (pad "1" smd roundrect (at -1.0375 0) (size 1.175 1.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.212766)
      (net 40 "/TIA6/STAGE_2_IN-") (pintype "passive"))
    (pad "2" smd roundrect (at 1.0375 0) (size 1.175 1.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.212766)
      (net 42 "CH6+") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Resistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEE)
    (at 151.3785 94.742 180)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (property "Sheetfile" "tia_adl5303.kicad_sch")
    (property "Sheetname" "TIA5")
    (attr smd)
    (fp_text reference "R56" (at -3.0535 0 180) (layer "F.SilkS"))
    (fp_text value "54.9k" (at 0 1.65) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab"))
    (pad "1" smd roundrect (at -1 0 180) (size 1.2 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.208333)
      (net 35 "CH5-") (pintype "passive"))
    (pad "2" smd roundrect (at 1 0 180) (size 1.2 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.208333)
      (net 115 "/TIA5/STAGE_2_IN+") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
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  )
  (footprint "Connector_Molex:Molex_PicoBlade_53047-0310_1x03_P1.25mm_Vertical" (layer "F.Cu")
    (tedit 5B783167)
    (at 118.0885 75.454 -90)
    (descr "Molex PicoBlade Connector System, 53047-0310, 3 Pins per row (http://www.molex.com/pdm_docs/sd/530470610_sd.pdf), generated with kicad-footprint-generator")
    (tags "connector Molex PicoBlade side entry")
    (property "Sheetfile" "ADL5303_AnalogPCB.kicad_sch")
    (property "Sheetname" "")
    (attr through_hole)
    (fp_text reference "J8" (at 1.25 -3.25 90) (layer "F.SilkS") hide)
    (fp_text value "Conn_01x03_Female" (at 1.25 2.35 90) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 1.25 -1.35 90) (layer "F.Fab"))
    (pad "1" thru_hole roundrect (at 0 0 270) (size 0.8 1.3) (drill 0.5) (layers *.Cu *.Mask) (roundrect_rratio 0.25)
      (net 100 "/TIA8/PD_K") (pinfunction "Pin_1") (pintype "passive"))
    (pad "2" thru_hole oval (at 1.25 0 270) (size 0.8 1.3) (drill 0.5) (layers *.Cu *.Mask)
      (net 49 "/TIA8/VSUM") (pinfunction "Pin_2") (pintype "passive"))
    (pad "3" thru_hole oval (at 2.5 0 270) (size 0.8 1.3) (drill 0.5) (layers *.Cu *.Mask)
      (net 89 "/TIA8/PD_A") (pinfunction "Pin_3") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Connector_Molex.3dshapes/Molex_PicoBlade_53047-0310_1x03_P1.25mm_Vertical.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
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  )
  (footprint "Resistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEE)
    (at 117.7915 87.257448 90)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (property "Sheetfile" "tia_adl5303.kicad_sch")
    (property "Sheetname" "TIA8")
    (attr smd)
    (fp_text reference "R85" (at -3.048 0 90) (layer "F.SilkS"))
    (fp_text value "33k" (at 0 1.65 90) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab"))
    (pad "1" smd roundrect (at -1 0 90) (size 1.2 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.208333)
      (net 52 "/TIA8/STAGE_2_IN-") (pintype "passive"))
    (pad "2" smd roundrect (at 1 0 90) (size 1.2 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.208333)
      (net 1 "GND") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Resistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEE)
    (at 141.2185 94.943448 180)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (property "Sheetfile" "tia_adl5303.kicad_sch")
    (property "Sheetname" "TIA6")
    (attr smd)
    (fp_text reference "R66" (at -3.0535 -0.052552 180) (layer "F.SilkS"))
    (fp_text value "54.9k" (at 0 1.65) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab"))
    (pad "1" smd roundrect (at -1 0 180) (size 1.2 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.208333)
      (net 41 "CH6-") (pintype "passive"))
    (pad "2" smd roundrect (at 1 0 180) (size 1.2 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.208333)
      (net 116 "/TIA6/STAGE_2_IN+") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
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  (footprint "Resistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEE)
    (at 193.0185 87.323448 90)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (property "Sheetfile" "tia_adl5303.kicad_sch")
    (property "Sheetname" "TIA1")
    (attr smd)
    (fp_text reference "R11" (at -3.048 0 90) (layer "F.SilkS"))
    (fp_text value "10k" (at 0 1.65 90) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab"))
    (pad "1" smd roundrect (at -1 0 90) (size 1.2 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.208333)
      (net 103 "/TIA1/BF_OUT") (pintype "passive"))
    (pad "2" smd roundrect (at 1 0 90) (size 1.2 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.208333)
      (net 57 "/TIA1/BF_NG") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Package_TO_SOT_THT:TO-220-3_Vertical" (layer "F.Cu")
    (tedit 5AC8BA0D)
    (at 106.792 108.712 90)
    (descr "TO-220-3, Vertical, RM 2.54mm, see https://www.vishay.com/docs/66542/to-220-1.pdf")
    (tags "TO-220-3 Vertical RM 2.54mm")
    (property "Sheetfile" "ADL5303_AnalogPCB.kicad_sch")
    (property "Sheetname" "")
    (attr through_hole)
    (fp_text reference "U3" (at 2.794 2.103 90) (layer "F.SilkS"))
    (fp_text value "MC79M12_TO220" (at 2.54 2.5 90) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 2.54 -4.27 90) (layer "F.Fab"))
    (pad "1" thru_hole rect (at 0 0 90) (size 1.905 2) (drill 1.1) (layers *.Cu *.Mask)
      (net 1 "GND") (pinfunction "GND") (pintype "power_in"))
    (pad "2" thru_hole oval (at 2.54 0 90) (size 1.905 2) (drill 1.1) (layers *.Cu *.Mask)
      (net 102 "-15V") (pinfunction "VI") (pintype "power_in"))
    (pad "3" thru_hole oval (at 5.08 0 90) (size 1.905 2) (drill 1.1) (layers *.Cu *.Mask)
      (net 6 "-12V") (pinfunction "VO") (pintype "power_out"))
    (model "${KICAD6_3DMODEL_DIR}/Package_TO_SOT_THT.3dshapes/TO-220-3_Vertical.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
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  (footprint "Resistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEE)
    (at 156.4425 87.3201 -90)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (property "Sheetfile" "tia_adl5303.kicad_sch")
    (property "Sheetname" "TIA4")
    (attr smd)
    (fp_text reference "R44" (at 3.048 0 90) (layer "F.SilkS"))
    (fp_text value "8.2k" (at 0 1.65 90) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab"))
    (pad "1" smd roundrect (at -1 0 270) (size 1.2 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.208333)
      (net 70 "/TIA4/VREF") (pintype "passive"))
    (pad "2" smd roundrect (at 1 0 270) (size 1.2 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.208333)
      (net 28 "/TIA4/STAGE_2_IN-") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Package_DFN_QFN:QFN-16-1EP_3x3mm_P0.5mm_EP1.45x1.45mm" (layer "F.Cu")
    (tedit 5DC5F6A3)
    (at 138.6625 82.497448 -90)
    (descr "QFN, 16 Pin (http://cds.linear.com/docs/en/datasheet/37551fd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py")
    (tags "QFN NoLead")
    (property "Description" "SP Amp LOG Amp Single R-R O/P 5.5V 16-Pin LFCSP EP T/R")
    (property "Height" "0.8")
    (property "Manufacturer_Name" "Analog Devices")
    (property "Manufacturer_Part_Number" "ADL5303ACPZ-R7")
    (property "Mouser Part Number" "584-ADL5303ACPZ-R7")
    (property "Mouser Price/Stock" "https://www.mouser.co.uk/ProductDetail/Analog-Devices/ADL5303ACPZ-R7?qs=BpaRKvA4VqHSm6pnud57YQ%3D%3D")
    (property "Sheetfile" "tia_adl5303.kicad_sch")
    (property "Sheetname" "TIA6")
    (attr smd)
    (fp_text reference "IC61" (at 0 2.54 90) (layer "F.SilkS"))
    (fp_text value "ADL5303ACPZ-R7" (at 0 2.82 90) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab"))
    (pad "" smd roundrect (at -0.36 -0.36 270) (size 0.58 0.58) (layers "F.Paste") (roundrect_rratio 0.25))
    (pad "" smd roundrect (at 0.36 0.36 270) (size 0.58 0.58) (layers "F.Paste") (roundrect_rratio 0.25))
    (pad "" smd roundrect (at 0.36 -0.36 270) (size 0.58 0.58) (layers "F.Paste") (roundrect_rratio 0.25))
    (pad "" smd roundrect (at -0.36 0.36 270) (size 0.58 0.58) (layers "F.Paste") (roundrect_rratio 0.25))
    (pad "1" smd roundrect (at -1.4375 -0.75 270) (size 0.875 0.25) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 78 "unconnected-(IC61-Pad1)") (pinfunction "NC") (pintype "no_connect"))
    (pad "2" smd roundrect (at -1.4375 -0.25 270) (size 0.875 0.25) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 37 "/TIA6/VSUM") (pinfunction "VSUM_1") (pintype "passive"))
    (pad "3" smd roundrect (at -1.4375 0.25 270) (size 0.875 0.25) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 79 "/TIA6/PD_A") (pinfunction "INPT") (pintype "passive"))
    (pad "4" smd roundrect (at -1.4375 0.75 270) (size 0.875 0.25) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 37 "/TIA6/VSUM") (pinfunction "VSUM_2") (pintype "passive"))
    (pad "5" smd roundrect (at -0.75 1.4375 270) (size 0.25 0.875) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 38 "/TIA6/VPDB") (pinfunction "VPDB") (pintype "passive"))
    (pad "6" smd roundrect (at -0.25 1.4375 270) (size 0.25 0.875) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 80 "/TIA6/VREF") (pinfunction "VREF") (pintype "passive"))
    (pad "7" smd roundrect (at 0.25 1.4375 270) (size 0.25 0.875) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 1 "GND") (pinfunction "ACOM") (pintype "passive"))
    (pad "8" smd roundrect (at 0.75 1.4375 270) (size 0.25 0.875) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 39 "/TIA6/VLOG") (pinfunction "VLOG") (pintype "passive"))
    (pad "9" smd roundrect (at 1.4375 0.75 270) (size 0.875 0.25) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 39 "/TIA6/VLOG") (pinfunction "BFIN") (pintype "passive"))
    (pad "10" smd roundrect (at 1.4375 0.25 270) (size 0.875 0.25) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 2 "+5V") (pinfunction "VPS2") (pintype "passive"))
    (pad "11" smd roundrect (at 1.4375 -0.25 270) (size 0.875 0.25) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 108 "/TIA6/BF_OUT") (pinfunction "VOUT") (pintype "passive"))
    (pad "12" smd roundrect (at 1.4375 -0.75 270) (size 0.875 0.25) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 2 "+5V") (pinfunction "VPS1") (pintype "passive"))
    (pad "13" smd roundrect (at 0.75 -1.4375 270) (size 0.25 0.875) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 81 "/TIA6/BF_NG") (pinfunction "BFNG") (pintype "passive"))
    (pad "14" smd roundrect (at 0.25 -1.4375 270) (size 0.25 0.875) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 1 "GND") (pinfunction "GND_1") (pintype "passive"))
    (pad "15" smd roundrect (at -0.25 -1.4375 270) (size 0.25 0.875) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 1 "GND") (pinfunction "GND_2") (pintype "passive"))
    (pad "16" smd roundrect (at -0.75 -1.4375 270) (size 0.25 0.875) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 1 "GND") (pinfunction "PWDN") (pintype "passive"))
    (pad "17" smd rect (at 0 0 270) (size 1.45 1.45) (layers "F.Cu" "F.Mask")
      (net 37 "/TIA6/VSUM") (pinfunction "EP") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Package_DFN_QFN.3dshapes/QFN-16-1EP_3x3mm_P0.5mm_EP1.45x1.45mm.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEF)
    (at 129.2525 106.643448)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "Sheetfile" "tia_adl5303.kicad_sch")
    (property "Sheetname" "TIA7")
    (attr smd)
    (fp_text reference "C76" (at 3.048 0) (layer "F.SilkS"))
    (fp_text value "2.2p" (at 0 1.68) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab"))
    (pad "1" smd roundrect (at -1.0375 0) (size 1.175 1.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.212766)
      (net 46 "/TIA7/STAGE_2_IN-") (pintype "passive"))
    (pad "2" smd roundrect (at 1.0375 0) (size 1.175 1.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.212766)
      (net 48 "CH7+") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Connector_Molex:Molex_PicoBlade_53047-0310_1x03_P1.25mm_Vertical" (layer "F.Cu")
    (tedit 5B783167)
    (at 179.0485 75.454 -90)
    (descr "Molex PicoBlade Connector System, 53047-0310, 3 Pins per row (http://www.molex.com/pdm_docs/sd/530470610_sd.pdf), generated with kicad-footprint-generator")
    (tags "connector Molex PicoBlade side entry")
    (property "Sheetfile" "ADL5303_AnalogPCB.kicad_sch")
    (property "Sheetname" "")
    (attr through_hole)
    (fp_text reference "J2" (at 1.25 -3.25 90) (layer "F.SilkS") hide)
    (fp_text value "Conn_01x03_Female" (at 1.25 2.35 90) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 1.25 -1.35 90) (layer "F.Fab"))
    (pad "1" thru_hole roundrect (at 0 0 270) (size 0.8 1.3) (drill 0.5) (layers *.Cu *.Mask) (roundrect_rratio 0.25)
      (net 94 "/TIA2/PD_K") (pinfunction "Pin_1") (pintype "passive"))
    (pad "2" thru_hole oval (at 1.25 0 270) (size 0.8 1.3) (drill 0.5) (layers *.Cu *.Mask)
      (net 13 "/TIA2/VSUM") (pinfunction "Pin_2") (pintype "passive"))
    (pad "3" thru_hole oval (at 2.5 0 270) (size 0.8 1.3) (drill 0.5) (layers *.Cu *.Mask)
      (net 59 "/TIA2/PD_A") (pinfunction "Pin_3") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Connector_Molex.3dshapes/Molex_PicoBlade_53047-0310_1x03_P1.25mm_Vertical.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEF)
    (at 169.9045 106.627448)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "Sheetfile" "tia_adl5303.kicad_sch")
    (property "Sheetname" "TIA3")
    (attr smd)
    (fp_text reference "C36" (at 3.048 0) (layer "F.SilkS"))
    (fp_text value "2.2p" (at 0 1.68) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab"))
    (pad "1" smd roundrect (at -1.0375 0) (size 1.175 1.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.212766)
      (net 22 "/TIA3/STAGE_2_IN-") (pintype "passive"))
    (pad "2" smd roundrect (at 1.0375 0) (size 1.175 1.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.212766)
      (net 24 "CH3+") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Resistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEE)
    (at 169.9045 104.595448)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (property "Sheetfile" "tia_adl5303.kicad_sch")
    (property "Sheetname" "TIA3")
    (attr smd)
    (fp_text reference "R37" (at 3.048 0) (layer "F.SilkS"))
    (fp_text value "54.9k" (at 0 1.65) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab"))
    (pad "1" smd roundrect (at -1 0) (size 1.2 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.208333)
      (net 22 "/TIA3/STAGE_2_IN-") (pintype "passive"))
    (pad "2" smd roundrect (at 1 0) (size 1.2 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.208333)
      (net 24 "CH3+") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Resistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEE)
    (at 172.6985 82.751448 -90)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (property "Sheetfile" "tia_adl5303.kicad_sch")
    (property "Sheetname" "TIA3")
    (attr smd)
    (fp_text reference "R32" (at 0.052552 -1.5455 90) (layer "F.SilkS"))
    (fp_text value "10k" (at 0 1.65 90) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab"))
    (pad "1" smd roundrect (at -1 0 270) (size 1.2 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.208333)
      (net 1 "GND") (pintype "passive"))
    (pad "2" smd roundrect (at 1 0 270) (size 1.2 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.208333)
      (net 66 "/TIA3/BF_NG") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Resistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEE)
    (at 140.1865 87.323448 -90)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (property "Sheetfile" "tia_adl5303.kicad_sch")
    (property "Sheetname" "TIA6")
    (attr smd)
    (fp_text reference "R63" (at 3.048 0 90) (layer "F.SilkS"))
    (fp_text value "6.8k" (at 0 1.65 90) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab"))
    (pad "1" smd roundrect (at -1 0 270) (size 1.2 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.208333)
      (net 108 "/TIA6/BF_OUT") (pintype "passive"))
    (pad "2" smd roundrect (at 1 0 270) (size 1.2 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.208333)
      (net 116 "/TIA6/STAGE_2_IN+") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "MountingHole:MountingHole_3.2mm_M3_DIN965_Pad" (layer "F.Cu")
    (tedit 56D1B4CB)
    (at 198.12 76.2)
    (descr "Mounting Hole 3.2mm, M3, DIN965")
    (tags "mounting hole 3.2mm m3 din965")
    (attr exclude_from_pos_files exclude_from_bom)
    (fp_text reference "REF**" (at 0 -3.8) (layer "F.SilkS") hide)
    (fp_text value "MountingHole_3.2mm_M3_DIN965_Pad" (at 0 3.8) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab"))
    (pad "1" thru_hole circle locked (at 0 0) (size 5.6 5.6) (drill 3.2) (layers *.Cu *.Mask)
      (net 1 "GND"))
  )
  (footprint "Resistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEE)
    (at 158.4745 87.3201 90)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (property "Sheetfile" "tia_adl5303.kicad_sch")
    (property "Sheetname" "TIA4")
    (attr smd)
    (fp_text reference "R45" (at -3.048 0 90) (layer "F.SilkS"))
    (fp_text value "33k" (at 0 1.65 90) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab"))
    (pad "1" smd roundrect (at -1 0 90) (size 1.2 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.208333)
      (net 28 "/TIA4/STAGE_2_IN-") (pintype "passive"))
    (pad "2" smd roundrect (at 1 0 90) (size 1.2 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.208333)
      (net 1 "GND") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Resistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEE)
    (at 142.2185 82.751448 -90)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (property "Sheetfile" "tia_adl5303.kicad_sch")
    (property "Sheetname" "TIA6")
    (attr smd)
    (fp_text reference "R62" (at 0.052552 -1.5455 90) (layer "F.SilkS"))
    (fp_text value "10k" (at 0 1.65 90) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab"))
    (pad "1" smd roundrect (at -1 0 270) (size 1.2 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.208333)
      (net 1 "GND") (pintype "passive"))
    (pad "2" smd roundrect (at 1 0 270) (size 1.2 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.208333)
      (net 81 "/TIA6/BF_NG") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEF)
    (at 151.3625 92.71 180)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "Sheetfile" "tia_adl5303.kicad_sch")
    (property "Sheetname" "TIA5")
    (attr smd)
    (fp_text reference "C55" (at -3.0695 0 180) (layer "F.SilkS"))
    (fp_text value "2.2p" (at 0 1.68) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab"))
    (pad "1" smd roundrect (at -1.0375 0 180) (size 1.175 1.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.212766)
      (net 35 "CH5-") (pintype "passive"))
    (pad "2" smd roundrect (at 1.0375 0 180) (size 1.175 1.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.212766)
      (net 115 "/TIA5/STAGE_2_IN+") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "MountingHole:MountingHole_3.2mm_M3_DIN965_Pad" (layer "F.Cu")
    (tedit 56D1B4CB)
    (at 101.6 76.2)
    (descr "Mounting Hole 3.2mm, M3, DIN965")
    (tags "mounting hole 3.2mm m3 din965")
    (attr exclude_from_pos_files exclude_from_bom)
    (fp_text reference "REF**" (at 0 -3.8) (layer "F.SilkS") hide)
    (fp_text value "MountingHole_3.2mm_M3_DIN965_Pad" (at 0 3.8) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab"))
    (pad "1" thru_hole circle locked (at 0 0) (size 5.6 5.6) (drill 3.2) (layers *.Cu *.Mask)
      (net 1 "GND"))
  )
  (footprint "Connector_Molex:Molex_PicoBlade_53047-0310_1x03_P1.25mm_Vertical" (layer "F.Cu")
    (tedit 5B783167)
    (at 168.9465 75.474 -90)
    (descr "Molex PicoBlade Connector System, 53047-0310, 3 Pins per row (http://www.molex.com/pdm_docs/sd/530470610_sd.pdf), generated with kicad-footprint-generator")
    (tags "connector Molex PicoBlade side entry")
    (property "Sheetfile" "ADL5303_AnalogPCB.kicad_sch")
    (property "Sheetname" "")
    (attr through_hole)
    (fp_text reference "J3" (at 1.25 -3.25 90) (layer "F.SilkS") hide)
    (fp_text value "Conn_01x03_Female" (at 1.25 2.35 90) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 1.25 -1.35 90) (layer "F.Fab"))
    (pad "1" thru_hole roundrect (at 0 0 270) (size 0.8 1.3) (drill 0.5) (layers *.Cu *.Mask) (roundrect_rratio 0.25)
      (net 95 "/TIA3/PD_K") (pinfunction "Pin_1") (pintype "passive"))
    (pad "2" thru_hole oval (at 1.25 0 270) (size 0.8 1.3) (drill 0.5) (layers *.Cu *.Mask)
      (net 19 "/TIA3/VSUM") (pinfunction "Pin_2") (pintype "passive"))
    (pad "3" thru_hole oval (at 2.5 0 270) (size 0.8 1.3) (drill 0.5) (layers *.Cu *.Mask)
      (net 64 "/TIA3/PD_A") (pinfunction "Pin_3") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Connector_Molex.3dshapes/Molex_PicoBlade_53047-0310_1x03_P1.25mm_Vertical.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Resistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEE)
    (at 193.0185 82.751448 -90)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (property "Sheetfile" "tia_adl5303.kicad_sch")
    (property "Sheetname" "TIA1")
    (attr smd)
    (fp_text reference "R12" (at 0.052552 -1.5455 90) (layer "F.SilkS"))
    (fp_text value "10k" (at 0 1.65 90) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab"))
    (pad "1" smd roundrect (at -1 0 270) (size 1.2 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.208333)
      (net 1 "GND") (pintype "passive"))
    (pad "2" smd roundrect (at 1 0 270) (size 1.2 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.208333)
      (net 57 "/TIA1/BF_NG") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Resistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEE)
    (at 178.7945 87.323448 90)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (property "Sheetfile" "tia_adl5303.kicad_sch")
    (property "Sheetname" "TIA2")
    (attr smd)
    (fp_text reference "R25" (at -3.048 0 90) (layer "F.SilkS"))
    (fp_text value "33k" (at 0 1.65 90) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab"))
    (pad "1" smd roundrect (at -1 0 90) (size 1.2 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.208333)
      (net 16 "/TIA2/STAGE_2_IN-") (pintype "passive"))
    (pad "2" smd roundrect (at 1 0 90) (size 1.2 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.208333)
      (net 1 "GND") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Package_SO:SOIC-8_3.9x4.9mm_P1.27mm" (layer "F.Cu")
    (tedit 5D9F72B1)
    (at 130.0145 99.785448 90)
    (descr "SOIC, 8 Pin (JEDEC MS-012AA, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/soic_narrow-r/r_8.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py")
    (tags "SOIC SO")
    (property "Description" "160MHz, Fully Differential Input/Output High Slew Rate Amplifier")
    (property "Height" "1.75")
    (property "Manufacturer_Name" "Texas Instruments")
    (property "Manufacturer_Part_Number" "THS4141CD")
    (property "Mouser Part Number" "595-THS4141CD")
    (property "Mouser Price/Stock" "https://www.mouser.com/Search/Refine.aspx?Keyword=595-THS4141CD")
    (property "Sheetfile" "tia_adl5303.kicad_sch")
    (property "Sheetname" "TIA7")
    (attr smd)
    (fp_text reference "IC72" (at 0 -3.4 90) (layer "F.SilkS"))
    (fp_text value "THS4141CD" (at 0 3.4 90) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab"))
    (pad "1" smd roundrect (at -2.475 -1.905 90) (size 1.95 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 46 "/TIA7/STAGE_2_IN-") (pinfunction "VIN-") (pintype "passive"))
    (pad "2" smd roundrect (at -2.475 -0.635 90) (size 1.95 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 1 "GND") (pinfunction "VOCM") (pintype "passive"))
    (pad "3" smd roundrect (at -2.475 0.635 90) (size 1.95 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 6 "-12V") (pinfunction "VCC+") (pintype "passive"))
    (pad "4" smd roundrect (at -2.475 1.905 90) (size 1.95 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 48 "CH7+") (pinfunction "VOUT+") (pintype "passive"))
    (pad "5" smd roundrect (at 2.475 1.905 90) (size 1.95 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 47 "CH7-") (pinfunction "VOUT-") (pintype "passive"))
    (pad "6" smd roundrect (at 2.475 0.635 90) (size 1.95 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 5 "+12V") (pinfunction "VCC-") (pintype "passive"))
    (pad "7" smd roundrect (at 2.475 -0.635 90) (size 1.95 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 87 "unconnected-(IC72-Pad7)") (pinfunction "NC") (pintype "no_connect"))
    (pad "8" smd roundrect (at 2.475 -1.905 90) (size 1.95 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 117 "/TIA7/STAGE_2_IN+") (pinfunction "VIN+") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Package_SO.3dshapes/SOIC-8_3.9x4.9mm_P1.27mm.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Package_SO:SOIC-8_3.9x4.9mm_P1.27mm" (layer "F.Cu")
    (tedit 5D9F72B1)
    (at 190.9865 99.769448 90)
    (descr "SOIC, 8 Pin (JEDEC MS-012AA, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/soic_narrow-r/r_8.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py")
    (tags "SOIC SO")
    (property "Description" "160MHz, Fully Differential Input/Output High Slew Rate Amplifier")
    (property "Height" "1.75")
    (property "Manufacturer_Name" "Texas Instruments")
    (property "Manufacturer_Part_Number" "THS4141CD")
    (property "Mouser Part Number" "595-THS4141CD")
    (property "Mouser Price/Stock" "https://www.mouser.com/Search/Refine.aspx?Keyword=595-THS4141CD")
    (property "Sheetfile" "tia_adl5303.kicad_sch")
    (property "Sheetname" "TIA1")
    (attr smd)
    (fp_text reference "IC12" (at 0 -3.4 90) (layer "F.SilkS"))
    (fp_text value "THS4141CD" (at 0 3.4 90) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab"))
    (pad "1" smd roundrect (at -2.475 -1.905 90) (size 1.95 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 10 "/TIA1/STAGE_2_IN-") (pinfunction "VIN-") (pintype "passive"))
    (pad "2" smd roundrect (at -2.475 -0.635 90) (size 1.95 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 1 "GND") (pinfunction "VOCM") (pintype "passive"))
    (pad "3" smd roundrect (at -2.475 0.635 90) (size 1.95 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 6 "-12V") (pinfunction "VCC+") (pintype "passive"))
    (pad "4" smd roundrect (at -2.475 1.905 90) (size 1.95 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 12 "CH1+") (pinfunction "VOUT+") (pintype "passive"))
    (pad "5" smd roundrect (at 2.475 1.905 90) (size 1.95 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 11 "CH1-") (pinfunction "VOUT-") (pintype "passive"))
    (pad "6" smd roundrect (at 2.475 0.635 90) (size 1.95 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 5 "+12V") (pinfunction "VCC-") (pintype "passive"))
    (pad "7" smd roundrect (at 2.475 -0.635 90) (size 1.95 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 4 "unconnected-(IC12-Pad7)") (pinfunction "NC") (pintype "no_connect"))
    (pad "8" smd roundrect (at 2.475 -1.905 90) (size 1.95 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 111 "/TIA1/STAGE_2_IN+") (pinfunction "VIN+") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Package_SO.3dshapes/SOIC-8_3.9x4.9mm_P1.27mm.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Resistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEE)
    (at 149.5845 104.394)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (property "Sheetfile" "tia_adl5303.kicad_sch")
    (property "Sheetname" "TIA5")
    (attr smd)
    (fp_text reference "R57" (at 3.048 0) (layer "F.SilkS"))
    (fp_text value "54.9k" (at 0 1.65) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab"))
    (pad "1" smd roundrect (at -1 0) (size 1.2 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.208333)
      (net 34 "/TIA5/STAGE_2_IN-") (pintype "passive"))
    (pad "2" smd roundrect (at 1 0) (size 1.2 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.208333)
      (net 36 "CH5+") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Package_SO:SOIC-8_3.9x4.9mm_P1.27mm" (layer "F.Cu")
    (tedit 5D9F72B1)
    (at 119.8235 99.703448 90)
    (descr "SOIC, 8 Pin (JEDEC MS-012AA, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/soic_narrow-r/r_8.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py")
    (tags "SOIC SO")
    (property "Description" "160MHz, Fully Differential Input/Output High Slew Rate Amplifier")
    (property "Height" "1.75")
    (property "Manufacturer_Name" "Texas Instruments")
    (property "Manufacturer_Part_Number" "THS4141CD")
    (property "Mouser Part Number" "595-THS4141CD")
    (property "Mouser Price/Stock" "https://www.mouser.com/Search/Refine.aspx?Keyword=595-THS4141CD")
    (property "Sheetfile" "tia_adl5303.kicad_sch")
    (property "Sheetname" "TIA8")
    (attr smd)
    (fp_text reference "IC82" (at 0 -3.4 90) (layer "F.SilkS"))
    (fp_text value "THS4141CD" (at 0 3.4 90) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab"))
    (pad "1" smd roundrect (at -2.475 -1.905 90) (size 1.95 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 52 "/TIA8/STAGE_2_IN-") (pinfunction "VIN-") (pintype "passive"))
    (pad "2" smd roundrect (at -2.475 -0.635 90) (size 1.95 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 1 "GND") (pinfunction "VOCM") (pintype "passive"))
    (pad "3" smd roundrect (at -2.475 0.635 90) (size 1.95 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 6 "-12V") (pinfunction "VCC+") (pintype "passive"))
    (pad "4" smd roundrect (at -2.475 1.905 90) (size 1.95 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 54 "CH8+") (pinfunction "VOUT+") (pintype "passive"))
    (pad "5" smd roundrect (at 2.475 1.905 90) (size 1.95 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 53 "CH8-") (pinfunction "VOUT-") (pintype "passive"))
    (pad "6" smd roundrect (at 2.475 0.635 90) (size 1.95 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 5 "+12V") (pinfunction "VCC-") (pintype "passive"))
    (pad "7" smd roundrect (at 2.475 -0.635 90) (size 1.95 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 92 "unconnected-(IC82-Pad7)") (pinfunction "NC") (pintype "no_connect"))
    (pad "8" smd roundrect (at 2.475 -1.905 90) (size 1.95 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 118 "/TIA8/STAGE_2_IN+") (pinfunction "VIN+") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Package_SO.3dshapes/SOIC-8_3.9x4.9mm_P1.27mm.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Resistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEE)
    (at 176.7625 87.323448 -90)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (property "Sheetfile" "tia_adl5303.kicad_sch")
    (property "Sheetname" "TIA2")
    (attr smd)
    (fp_text reference "R24" (at 3.048 0 90) (layer "F.SilkS"))
    (fp_text value "8.2k" (at 0 1.65 90) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab"))
    (pad "1" smd roundrect (at -1 0 270) (size 1.2 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.208333)
      (net 60 "/TIA2/VREF") (pintype "passive"))
    (pad "2" smd roundrect (at 1 0 270) (size 1.2 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.208333)
      (net 16 "/TIA2/STAGE_2_IN-") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Connector_PinHeader_2.54mm:PinHeader_2x08_P2.54mm_Vertical" (layer "F.Cu")
    (tedit 59FED5CC)
    (at 169.403 116.581 -90)
    (descr "Through hole straight pin header, 2x08, 2.54mm pitch, double rows")
    (tags "Through hole pin header THT 2x08 2.54mm double row")
    (property "Sheetfile" "ADL5303_AnalogPCB.kicad_sch")
    (property "Sheetname" "")
    (attr through_hole)
    (fp_text reference "J9" (at 1.27 -2.33 90) (layer "F.SilkS") hide)
    (fp_text value "Conn_02x08_Odd_Even" (at 1.27 20.11 90) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 1.27 8.89) (layer "F.Fab"))
    (pad "1" thru_hole rect (at 0 0 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 12 "CH1+") (pinfunction "Pin_1") (pintype "passive"))
    (pad "2" thru_hole oval (at 2.54 0 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 11 "CH1-") (pinfunction "Pin_2") (pintype "passive"))
    (pad "3" thru_hole oval (at 0 2.54 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 18 "CH2+") (pinfunction "Pin_3") (pintype "passive"))
    (pad "4" thru_hole oval (at 2.54 2.54 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 17 "CH2-") (pinfunction "Pin_4") (pintype "passive"))
    (pad "5" thru_hole oval (at 0 5.08 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 24 "CH3+") (pinfunction "Pin_5") (pintype "passive"))
    (pad "6" thru_hole oval (at 2.54 5.08 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 23 "CH3-") (pinfunction "Pin_6") (pintype "passive"))
    (pad "7" thru_hole oval (at 0 7.62 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 30 "CH4+") (pinfunction "Pin_7") (pintype "passive"))
    (pad "8" thru_hole oval (at 2.54 7.62 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 29 "CH4-") (pinfunction "Pin_8") (pintype "passive"))
    (pad "9" thru_hole oval (at 0 10.16 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 36 "CH5+") (pinfunction "Pin_9") (pintype "passive"))
    (pad "10" thru_hole oval (at 2.54 10.16 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 35 "CH5-") (pinfunction "Pin_10") (pintype "passive"))
    (pad "11" thru_hole oval (at 0 12.7 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 42 "CH6+") (pinfunction "Pin_11") (pintype "passive"))
    (pad "12" thru_hole oval (at 2.54 12.7 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 41 "CH6-") (pinfunction "Pin_12") (pintype "passive"))
    (pad "13" thru_hole oval (at 0 15.24 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 48 "CH7+") (pinfunction "Pin_13") (pintype "passive"))
    (pad "14" thru_hole oval (at 2.54 15.24 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 47 "CH7-") (pinfunction "Pin_14") (pintype "passive"))
    (pad "15" thru_hole oval (at 0 17.78 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 54 "CH8+") (pinfunction "Pin_15") (pintype "passive"))
    (pad "16" thru_hole oval (at 2.54 17.78 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 53 "CH8-") (pinfunction "Pin_16") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Connector_PinHeader_2.54mm.3dshapes/PinHeader_2x08_P2.54mm_Vertical.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Resistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEE)
    (at 162.5385 82.7481 -90)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (property "Sheetfile" "tia_adl5303.kicad_sch")
    (property "Sheetname" "TIA4")
    (attr smd)
    (fp_text reference "R42" (at -0.1981 -1.5455 90) (layer "F.SilkS"))
    (fp_text value "10k" (at 0 1.65 90) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab"))
    (pad "1" smd roundrect (at -1 0 270) (size 1.2 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.208333)
      (net 1 "GND") (pintype "passive"))
    (pad "2" smd roundrect (at 1 0 270) (size 1.2 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.208333)
      (net 71 "/TIA4/BF_NG") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Resistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEE)
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  (footprint "Resistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder" (layer "F.Cu")
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    (tags "capacitor handsolder")
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    (tags "solder jumper open")
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    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
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    (pad "2" smd roundrect (at 1.0375 0 270) (size 1.175 1.45) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.212766)
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  (footprint "Jumper:SolderJumper-2_P1.3mm_Open_RoundedPad1.0x1.5mm" (layer "B.Cu")
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    (at 155.6805 76.358 -90)
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    (tags "solder jumper open")
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    (pad "1" smd custom (at -0.65 0 270) (size 1 0.5) (layers "B.Cu" "B.Mask")
      (net 96 "/TIA4/PD_K") (pinfunction "A") (pintype "passive") (zone_connect 2)
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        (gr_poly (pts
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    (pad "2" smd custom (at 0.65 0 270) (size 1 0.5) (layers "B.Cu" "B.Mask")
      (net 2 "+5V") (pinfunction "B") (pintype "passive") (zone_connect 2)
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  (footprint "Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder" (layer "B.Cu")
    (tedit 5F68FEEF)
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    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "Sheetfile" "tia_adl5303.kicad_sch")
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    (fp_text user "${REFERENCE}" (at 0 0) (layer "B.Fab"))
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    (pad "2" smd roundrect (at 1.0375 0) (size 1.175 1.45) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.212766)
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    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl"
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  (footprint "Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder" (layer "B.Cu")
    (tedit 5F68FEEF)
    (at 146.0285 84.836 -90)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "Sheetfile" "tia_adl5303.kicad_sch")
    (property "Sheetname" "TIA5")
    (attr smd)
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    (fp_text value "18p" (at 0 -1.68 90) (layer "B.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "B.Fab"))
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    (pad "2" smd roundrect (at 1.0375 0 270) (size 1.175 1.45) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.212766)
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    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl"
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      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
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  (footprint "Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder" (layer "B.Cu")
    (tedit 5F68FEEF)
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    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "Sheetfile" "tia_adl5303.kicad_sch")
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  (footprint "Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder" (layer "B.Cu")
    (tedit 5F68FEEF)
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    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "Sheetfile" "tia_adl5303.kicad_sch")
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  (footprint "Jumper:SolderJumper-2_P1.3mm_Open_RoundedPad1.0x1.5mm" (layer "B.Cu")
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    (at 125.2005 76.358 -90)
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    (tags "solder jumper open")
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    (tedit 5F68FEEF)
    (at 156.1885 85.0341 -90)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
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  (footprint "Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder" (layer "B.Cu")
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    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
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  (footprint "Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder" (layer "B.Cu")
    (tedit 5F68FEEF)
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    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "Sheetfile" "tia_adl5303.kicad_sch")
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    (fp_text reference "C81" (at 0 -1.5885 90) (layer "B.SilkS"))
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    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "B.Fab"))
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    (pad "2" smd roundrect (at 1.0375 0 270) (size 1.175 1.45) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.212766)
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      (scale (xyz 1 1 1))
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  (footprint "Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder" (layer "B.Cu")
    (tedit 5F68FEEF)
    (at 127.7285 79.756)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "Sheetfile" "tia_adl5303.kicad_sch")
    (property "Sheetname" "TIA7")
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    (fp_text reference "C72" (at -3.2685 0.036552) (layer "B.SilkS"))
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    (fp_text user "${REFERENCE}" (at 0 0) (layer "B.Fab"))
    (pad "1" smd roundrect (at -1.0375 0) (size 1.175 1.45) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.212766)
      (net 44 "/TIA7/VPDB") (pintype "passive"))
    (pad "2" smd roundrect (at 1.0375 0) (size 1.175 1.45) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.212766)
      (net 1 "GND") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl"
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      (scale (xyz 1 1 1))
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  (footprint "Jumper:SolderJumper-2_P1.3mm_Open_RoundedPad1.0x1.5mm" (layer "B.Cu")
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    (at 114.9975 76.358 -90)
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    (tags "solder jumper open")
    (property "Sheetfile" "tia_adl5303.kicad_sch")
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    (pad "1" smd custom (at -0.65 0 270) (size 1 0.5) (layers "B.Cu" "B.Mask")
      (net 100 "/TIA8/PD_K") (pinfunction "A") (pintype "passive") (zone_connect 2)
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        (gr_circle (center 0 0.25) (end 0.5 0.25) (width 0) (fill yes))
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    (pad "2" smd custom (at 0.65 0 270) (size 1 0.5) (layers "B.Cu" "B.Mask")
      (net 2 "+5V") (pinfunction "B") (pintype "passive") (zone_connect 2)
      (options (clearance outline) (anchor rect))
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  (footprint "Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder" (layer "B.Cu")
    (tedit 5F68FEEF)
    (at 121.6015 99.703448 90)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "Sheetfile" "tia_adl5303.kicad_sch")
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    (fp_text reference "C88" (at 0 1.68 90) (layer "B.SilkS"))
    (fp_text value "100n" (at 0 -1.68 90) (layer "B.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "B.Fab"))
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      (net 6 "-12V") (pintype "passive"))
    (pad "2" smd roundrect (at 1.0375 0 90) (size 1.175 1.45) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.212766)
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    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl"
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      (scale (xyz 1 1 1))
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  (footprint "Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder" (layer "B.Cu")
    (tedit 5F68FEEF)
    (at 181.61 78.687448 -90)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "Sheetfile" "tia_adl5303.kicad_sch")
    (property "Sheetname" "TIA2")
    (attr smd)
    (fp_text reference "C21" (at 0 -1.5455 90) (layer "B.SilkS"))
    (fp_text value "100n" (at 0 -1.68 90) (layer "B.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "B.Fab"))
    (pad "1" smd roundrect (at -1.0375 0 270) (size 1.175 1.45) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.212766)
      (net 13 "/TIA2/VSUM") (pintype "passive"))
    (pad "2" smd roundrect (at 1.0375 0 270) (size 1.175 1.45) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.212766)
      (net 1 "GND") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder" (layer "B.Cu")
    (tedit 5F68FEEF)
    (at 168.3805 79.756)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "Sheetfile" "tia_adl5303.kicad_sch")
    (property "Sheetname" "TIA3")
    (attr smd)
    (fp_text reference "C32" (at -3.0265 0.052552) (layer "B.SilkS"))
    (fp_text value "100n" (at 0 -1.68) (layer "B.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0) (layer "B.Fab"))
    (pad "1" smd roundrect (at -1.0375 0) (size 1.175 1.45) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.212766)
      (net 20 "/TIA3/VPDB") (pintype "passive"))
    (pad "2" smd roundrect (at 1.0375 0) (size 1.175 1.45) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.212766)
      (net 1 "GND") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder" (layer "B.Cu")
    (tedit 5F68FEEF)
    (at 158.2205 79.756)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "Sheetfile" "tia_adl5303.kicad_sch")
    (property "Sheetname" "TIA4")
    (attr smd)
    (fp_text reference "C42" (at -3.0265 0.0559) (layer "B.SilkS"))
    (fp_text value "100n" (at 0 -1.68) (layer "B.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0) (layer "B.Fab"))
    (pad "1" smd roundrect (at -1.0375 0) (size 1.175 1.45) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.212766)
      (net 26 "/TIA4/VPDB") (pintype "passive"))
    (pad "2" smd roundrect (at 1.0375 0) (size 1.175 1.45) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.212766)
      (net 1 "GND") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Capacitor_SMD:C_1210_3225Metric_Pad1.33x2.70mm_HandSolder" (layer "B.Cu")
    (tedit 5F68FEEF)
    (at 116.078 106.68 90)
    (descr "Capacitor SMD 1210 (3225 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "Sheetfile" "ADL5303_AnalogPCB.kicad_sch")
    (property "Sheetname" "")
    (attr smd)
    (fp_text reference "C5" (at 0 -2.032 90) (layer "B.SilkS"))
    (fp_text value "22u" (at 0 -2.3 90) (layer "B.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "B.Fab"))
    (pad "1" smd roundrect (at -1.5625 0 90) (size 1.325 2.7) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.188679)
      (net 1 "GND") (pintype "passive"))
    (pad "2" smd roundrect (at 1.5625 0 90) (size 1.325 2.7) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.188679)
      (net 6 "-12V") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_1210_3225Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder" (layer "B.Cu")
    (tedit 5F68FEEF)
    (at 140.97 78.687448 -90)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "Sheetfile" "tia_adl5303.kicad_sch")
    (property "Sheetname" "TIA6")
    (attr smd)
    (fp_text reference "C61" (at 0.261252 -1.5455 90) (layer "B.SilkS"))
    (fp_text value "100n" (at 0 -1.68 90) (layer "B.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "B.Fab"))
    (pad "1" smd roundrect (at -1.0375 0 270) (size 1.175 1.45) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.212766)
      (net 37 "/TIA6/VSUM") (pintype "passive"))
    (pad "2" smd roundrect (at 1.0375 0 270) (size 1.175 1.45) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.212766)
      (net 1 "GND") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Rob_Lib:utd_tx" (layer "B.Cu")
    (tedit 0)
    (at 174.244 110.744 180)
    (attr board_only exclude_from_pos_files exclude_from_bom)
    (fp_text reference "G***" (at 0 0) (layer "B.SilkS") hide)
    (fp_text value "LOGO" (at 0.75 0) (layer "B.SilkS") hide)
  )
  (footprint "Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder" (layer "B.Cu")
    (tedit 5F68FEEF)
    (at 162.2845 99.7661 90)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "Sheetfile" "tia_adl5303.kicad_sch")
    (property "Sheetname" "TIA4")
    (attr smd)
    (fp_text reference "C48" (at 0 1.68 90) (layer "B.SilkS"))
    (fp_text value "100n" (at 0 -1.68 90) (layer "B.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "B.Fab"))
    (pad "1" smd roundrect (at -1.0375 0 90) (size 1.175 1.45) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.212766)
      (net 6 "-12V") (pintype "passive"))
    (pad "2" smd roundrect (at 1.0375 0 90) (size 1.175 1.45) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.212766)
      (net 5 "+12V") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Capacitor_SMD:C_1210_3225Metric_Pad1.33x2.70mm_HandSolder" (layer "B.Cu")
    (tedit 5F68FEEF)
    (at 111.252 96.774 -90)
    (descr "Capacitor SMD 1210 (3225 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "Sheetfile" "ADL5303_AnalogPCB.kicad_sch")
    (property "Sheetname" "")
    (attr smd)
    (fp_text reference "C4" (at 0 -2.286 90) (layer "B.SilkS"))
    (fp_text value "22u" (at 0 -2.3 90) (layer "B.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "B.Fab"))
    (pad "1" smd roundrect (at -1.5625 0 270) (size 1.325 2.7) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.188679)
      (net 5 "+12V") (pintype "passive"))
    (pad "2" smd roundrect (at 1.5625 0 270) (size 1.325 2.7) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.188679)
      (net 1 "GND") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_1210_3225Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder" (layer "B.Cu")
    (tedit 5F68FEEF)
    (at 130.81 78.703448 -90)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "Sheetfile" "tia_adl5303.kicad_sch")
    (property "Sheetname" "TIA7")
    (attr smd)
    (fp_text reference "C71" (at 0 -1.5575 90) (layer "B.SilkS"))
    (fp_text value "100n" (at 0 -1.68 90) (layer "B.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "B.Fab"))
    (pad "1" smd roundrect (at -1.0375 0 270) (size 1.175 1.45) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.212766)
      (net 43 "/TIA7/VSUM") (pintype "passive"))
    (pad "2" smd roundrect (at 1.0375 0 270) (size 1.175 1.45) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.212766)
      (net 1 "GND") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder" (layer "B.Cu")
    (tedit 5F68FEEF)
    (at 141.9645 99.769448 90)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "Sheetfile" "tia_adl5303.kicad_sch")
    (property "Sheetname" "TIA6")
    (attr smd)
    (fp_text reference "C68" (at 0 1.68 90) (layer "B.SilkS"))
    (fp_text value "100n" (at 0 -1.68 90) (layer "B.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "B.Fab"))
    (pad "1" smd roundrect (at -1.0375 0 90) (size 1.175 1.45) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.212766)
      (net 6 "-12V") (pintype "passive"))
    (pad "2" smd roundrect (at 1.0375 0 90) (size 1.175 1.45) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.212766)
      (net 5 "+12V") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder" (layer "B.Cu")
    (tedit 5F68FEEF)
    (at 128.7445 82.767448 -90)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "Sheetfile" "tia_adl5303.kicad_sch")
    (property "Sheetname" "TIA7")
    (attr smd)
    (fp_text reference "C77" (at 3.338552 -0.2875 90) (layer "B.SilkS"))
    (fp_text value "100n" (at 0 -1.68 90) (layer "B.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "B.Fab"))
    (pad "1" smd roundrect (at -1.0375 0 270) (size 1.175 1.45) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.212766)
      (net 1 "GND") (pintype "passive"))
    (pad "2" smd roundrect (at 1.0375 0 270) (size 1.175 1.45) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.212766)
      (net 2 "+5V") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Jumper:SolderJumper-2_P1.3mm_Open_RoundedPad1.0x1.5mm" (layer "B.Cu")
    (tedit 5B391E66)
    (at 165.8405 76.358 -90)
    (descr "SMD Solder Jumper, 1x1.5mm, rounded Pads, 0.3mm gap, open")
    (tags "solder jumper open")
    (property "Sheetfile" "tia_adl5303.kicad_sch")
    (property "Sheetname" "TIA3")
    (attr exclude_from_pos_files)
    (fp_text reference "JP31" (at 0 1.8 90) (layer "B.SilkS") hide)
    (fp_text value "SolderJumper_2_Open" (at 0 -1.9 90) (layer "B.Fab"))
    (pad "1" smd custom (at -0.65 0 270) (size 1 0.5) (layers "B.Cu" "B.Mask")
      (net 95 "/TIA3/PD_K") (pinfunction "A") (pintype "passive") (zone_connect 2)
      (options (clearance outline) (anchor rect))
      (primitives
        (gr_circle (center 0 -0.25) (end 0.5 -0.25) (width 0) (fill yes))
        (gr_circle (center 0 0.25) (end 0.5 0.25) (width 0) (fill yes))
        (gr_poly (pts
            (xy 0.5 -0.75)
            (xy 0 -0.75)
            (xy 0 0.75)
            (xy 0.5 0.75)
          ) (width 0) (fill yes))
      ))
    (pad "2" smd custom (at 0.65 0 270) (size 1 0.5) (layers "B.Cu" "B.Mask")
      (net 2 "+5V") (pinfunction "B") (pintype "passive") (zone_connect 2)
      (options (clearance outline) (anchor rect))
      (primitives
        (gr_circle (center 0 -0.25) (end 0.5 -0.25) (width 0) (fill yes))
        (gr_circle (center 0 0.25) (end 0.5 0.25) (width 0) (fill yes))
        (gr_poly (pts
            (xy 0 -0.75)
            (xy -0.5 -0.75)
            (xy -0.5 0.75)
            (xy 0 0.75)
          ) (width 0) (fill yes))
      ))
  )
  (footprint "Capacitor_SMD:C_1210_3225Metric_Pad1.33x2.70mm_HandSolder" (layer "B.Cu")
    (tedit 5F68FEEF)
    (at 103.378 94.234 90)
    (descr "Capacitor SMD 1210 (3225 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "Sheetfile" "ADL5303_AnalogPCB.kicad_sch")
    (property "Sheetname" "")
    (attr smd)
    (fp_text reference "C1" (at 0 -2.286 90) (layer "B.SilkS"))
    (fp_text value "22u" (at 0 -2.3 90) (layer "B.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "B.Fab"))
    (pad "1" smd roundrect (at -1.5625 0 90) (size 1.325 2.7) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.188679)
      (net 101 "+15V") (pintype "passive"))
    (pad "2" smd roundrect (at 1.5625 0 90) (size 1.325 2.7) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.188679)
      (net 1 "GND") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_1210_3225Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Jumper:SolderJumper-2_P1.3mm_Open_RoundedPad1.0x1.5mm" (layer "B.Cu")
    (tedit 5B391E66)
    (at 186.1605 76.358 -90)
    (descr "SMD Solder Jumper, 1x1.5mm, rounded Pads, 0.3mm gap, open")
    (tags "solder jumper open")
    (property "Sheetfile" "tia_adl5303.kicad_sch")
    (property "Sheetname" "TIA1")
    (attr exclude_from_pos_files)
    (fp_text reference "JP11" (at 0 1.8 90) (layer "B.SilkS") hide)
    (fp_text value "SolderJumper_2_Open" (at 0 -1.9 90) (layer "B.Fab"))
    (pad "1" smd custom (at -0.65 0 270) (size 1 0.5) (layers "B.Cu" "B.Mask")
      (net 93 "/TIA1/PD_K") (pinfunction "A") (pintype "passive") (zone_connect 2)
      (options (clearance outline) (anchor rect))
      (primitives
        (gr_circle (center 0 -0.25) (end 0.5 -0.25) (width 0) (fill yes))
        (gr_circle (center 0 0.25) (end 0.5 0.25) (width 0) (fill yes))
        (gr_poly (pts
            (xy 0.5 -0.75)
            (xy 0 -0.75)
            (xy 0 0.75)
            (xy 0.5 0.75)
          ) (width 0) (fill yes))
      ))
    (pad "2" smd custom (at 0.65 0 270) (size 1 0.5) (layers "B.Cu" "B.Mask")
      (net 2 "+5V") (pinfunction "B") (pintype "passive") (zone_connect 2)
      (options (clearance outline) (anchor rect))
      (primitives
        (gr_circle (center 0 -0.25) (end 0.5 -0.25) (width 0) (fill yes))
        (gr_circle (center 0 0.25) (end 0.5 0.25) (width 0) (fill yes))
        (gr_poly (pts
            (xy 0 -0.75)
            (xy -0.5 -0.75)
            (xy -0.5 0.75)
            (xy 0 0.75)
          ) (width 0) (fill yes))
      ))
  )
  (footprint "Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder" (layer "B.Cu")
    (tedit 5F68FEEF)
    (at 148.0605 79.502)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "Sheetfile" "tia_adl5303.kicad_sch")
    (property "Sheetname" "TIA5")
    (attr smd)
    (fp_text reference "C52" (at -3.0265 0) (layer "B.SilkS"))
    (fp_text value "100n" (at 0 -1.68) (layer "B.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0) (layer "B.Fab"))
    (pad "1" smd roundrect (at -1.0375 0) (size 1.175 1.45) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.212766)
      (net 32 "/TIA5/VPDB") (pintype "passive"))
    (pad "2" smd roundrect (at 1.0375 0) (size 1.175 1.45) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.212766)
      (net 1 "GND") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl"
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      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
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  (footprint "Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder" (layer "B.Cu")
    (tedit 5F68FEEF)
    (at 176.5085 85.037448 -90)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "Sheetfile" "tia_adl5303.kicad_sch")
    (property "Sheetname" "TIA2")
    (attr smd)
    (fp_text reference "C23" (at 0 1.68 90) (layer "B.SilkS"))
    (fp_text value "18p" (at 0 -1.68 90) (layer "B.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "B.Fab"))
    (pad "1" smd roundrect (at -1.0375 0 270) (size 1.175 1.45) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.212766)
      (net 15 "/TIA2/VLOG") (pintype "passive"))
    (pad "2" smd roundrect (at 1.0375 0 270) (size 1.175 1.45) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.212766)
      (net 1 "GND") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
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  (footprint "Capacitor_SMD:C_1210_3225Metric_Pad1.33x2.70mm_HandSolder" (layer "B.Cu")
    (tedit 5F68FEEF)
    (at 103.378 83.566 -90)
    (descr "Capacitor SMD 1210 (3225 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "Sheetfile" "ADL5303_AnalogPCB.kicad_sch")
    (property "Sheetname" "")
    (attr smd)
    (fp_text reference "C3" (at 0 2.3 90) (layer "B.SilkS"))
    (fp_text value "22u" (at 0 -2.3 90) (layer "B.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "B.Fab"))
    (pad "1" smd roundrect (at -1.5625 0 270) (size 1.325 2.7) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.188679)
      (net 2 "+5V") (pintype "passive"))
    (pad "2" smd roundrect (at 1.5625 0 270) (size 1.325 2.7) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.188679)
      (net 1 "GND") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_1210_3225Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
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  (footprint "Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder" (layer "B.Cu")
    (tedit 5F68FEEF)
    (at 151.13 78.486 -90)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "Sheetfile" "tia_adl5303.kicad_sch")
    (property "Sheetname" "TIA5")
    (attr smd)
    (fp_text reference "C51" (at 0.261252 -1.5455 90) (layer "B.SilkS"))
    (fp_text value "100n" (at 0 -1.68 90) (layer "B.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "B.Fab"))
    (pad "1" smd roundrect (at -1.0375 0 270) (size 1.175 1.45) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.212766)
      (net 31 "/TIA5/VSUM") (pintype "passive"))
    (pad "2" smd roundrect (at 1.0375 0 270) (size 1.175 1.45) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.212766)
      (net 1 "GND") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
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  (footprint "Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder" (layer "B.Cu")
    (tedit 5F68FEEF)
    (at 172.4445 99.769448 90)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "Sheetfile" "tia_adl5303.kicad_sch")
    (property "Sheetname" "TIA3")
    (attr smd)
    (fp_text reference "C38" (at 0 1.68 90) (layer "B.SilkS"))
    (fp_text value "100n" (at 0 -1.68 90) (layer "B.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "B.Fab"))
    (pad "1" smd roundrect (at -1.0375 0 90) (size 1.175 1.45) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.212766)
      (net 6 "-12V") (pintype "passive"))
    (pad "2" smd roundrect (at 1.0375 0 90) (size 1.175 1.45) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.212766)
      (net 5 "+12V") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
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  (footprint "Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder" (layer "B.Cu")
    (tedit 5F68FEEF)
    (at 135.8685 85.037448 -90)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "Sheetfile" "tia_adl5303.kicad_sch")
    (property "Sheetname" "TIA6")
    (attr smd)
    (fp_text reference "C63" (at 0 1.68 90) (layer "B.SilkS"))
    (fp_text value "18p" (at 0 -1.68 90) (layer "B.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "B.Fab"))
    (pad "1" smd roundrect (at -1.0375 0 270) (size 1.175 1.45) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.212766)
      (net 39 "/TIA6/VLOG") (pintype "passive"))
    (pad "2" smd roundrect (at 1.0375 0 270) (size 1.175 1.45) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.212766)
      (net 1 "GND") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Jumper:SolderJumper-2_P1.3mm_Open_RoundedPad1.0x1.5mm" (layer "B.Cu")
    (tedit 5B391E66)
    (at 145.5205 76.104 -90)
    (descr "SMD Solder Jumper, 1x1.5mm, rounded Pads, 0.3mm gap, open")
    (tags "solder jumper open")
    (property "Sheetfile" "tia_adl5303.kicad_sch")
    (property "Sheetname" "TIA5")
    (attr exclude_from_pos_files)
    (fp_text reference "JP51" (at 0 1.8 90) (layer "B.SilkS") hide)
    (fp_text value "SolderJumper_2_Open" (at 0 -1.9 90) (layer "B.Fab"))
    (pad "1" smd custom (at -0.65 0 270) (size 1 0.5) (layers "B.Cu" "B.Mask")
      (net 97 "/TIA5/PD_K") (pinfunction "A") (pintype "passive") (zone_connect 2)
      (options (clearance outline) (anchor rect))
      (primitives
        (gr_circle (center 0 -0.25) (end 0.5 -0.25) (width 0) (fill yes))
        (gr_circle (center 0 0.25) (end 0.5 0.25) (width 0) (fill yes))
        (gr_poly (pts
            (xy 0.5 -0.75)
            (xy 0 -0.75)
            (xy 0 0.75)
            (xy 0.5 0.75)
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    (pad "2" smd custom (at 0.65 0 270) (size 1 0.5) (layers "B.Cu" "B.Mask")
      (net 2 "+5V") (pinfunction "B") (pintype "passive") (zone_connect 2)
      (options (clearance outline) (anchor rect))
      (primitives
        (gr_circle (center 0 -0.25) (end 0.5 -0.25) (width 0) (fill yes))
        (gr_circle (center 0 0.25) (end 0.5 0.25) (width 0) (fill yes))
        (gr_poly (pts
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            (xy -0.5 -0.75)
            (xy -0.5 0.75)
            (xy 0 0.75)
          ) (width 0) (fill yes))
      ))
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  (footprint "Capacitor_SMD:C_1210_3225Metric_Pad1.33x2.70mm_HandSolder" (layer "B.Cu")
    (tedit 5F68FEEF)
    (at 111.252 108.7505 -90)
    (descr "Capacitor SMD 1210 (3225 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "Sheetfile" "ADL5303_AnalogPCB.kicad_sch")
    (property "Sheetname" "")
    (attr smd)
    (fp_text reference "C2" (at -0.0385 2.032 90) (layer "B.SilkS"))
    (fp_text value "22u" (at 0 -2.3 90) (layer "B.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "B.Fab"))
    (pad "1" smd roundrect (at -1.5625 0 270) (size 1.325 2.7) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.188679)
      (net 1 "GND") (pintype "passive"))
    (pad "2" smd roundrect (at 1.5625 0 270) (size 1.325 2.7) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.188679)
      (net 102 "-15V") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_1210_3225Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder" (layer "B.Cu")
    (tedit 5F68FEEF)
    (at 188.7005 79.756)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "Sheetfile" "tia_adl5303.kicad_sch")
    (property "Sheetname" "TIA1")
    (attr smd)
    (fp_text reference "C12" (at -3.2805 0.052552) (layer "B.SilkS"))
    (fp_text value "100n" (at 0 -1.68) (layer "B.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0) (layer "B.Fab"))
    (pad "1" smd roundrect (at -1.0375 0) (size 1.175 1.45) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.212766)
      (net 8 "/TIA1/VPDB") (pintype "passive"))
    (pad "2" smd roundrect (at 1.0375 0) (size 1.175 1.45) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.212766)
      (net 1 "GND") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
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  (footprint "Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder" (layer "B.Cu")
    (tedit 5F68FEEF)
    (at 179.5565 82.751448 -90)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "Sheetfile" "tia_adl5303.kicad_sch")
    (property "Sheetname" "TIA2")
    (attr smd)
    (fp_text reference "C27" (at 3.354552 -0.2755 90) (layer "B.SilkS"))
    (fp_text value "100n" (at 0 -1.68 90) (layer "B.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "B.Fab"))
    (pad "1" smd roundrect (at -1.0375 0 270) (size 1.175 1.45) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.212766)
      (net 1 "GND") (pintype "passive"))
    (pad "2" smd roundrect (at 1.0375 0 270) (size 1.175 1.45) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.212766)
      (net 2 "+5V") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
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  (footprint "Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder" (layer "B.Cu")
    (tedit 5F68FEEF)
    (at 152.1245 99.568 90)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "Sheetfile" "tia_adl5303.kicad_sch")
    (property "Sheetname" "TIA5")
    (attr smd)
    (fp_text reference "C58" (at 0 1.68 90) (layer "B.SilkS"))
    (fp_text value "100n" (at 0 -1.68 90) (layer "B.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "B.Fab"))
    (pad "1" smd roundrect (at -1.0375 0 90) (size 1.175 1.45) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.212766)
      (net 6 "-12V") (pintype "passive"))
    (pad "2" smd roundrect (at 1.0375 0 90) (size 1.175 1.45) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.212766)
      (net 5 "+12V") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
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  (footprint "Rob_Lib:AFSI_LOGO_2_color" (layer "B.Cu")
    (tedit 0)
    (at 175.26 95.758 180)
    (attr board_only exclude_from_pos_files exclude_from_bom)
    (fp_text reference "" (at 0 0) (layer "B.SilkS"))
    (fp_text value "" (at 0 0) (layer "B.SilkS"))
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  (footprint "Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder" (layer "B.Cu")
    (tedit 5F68FEEF)
    (at 118.5535 82.685448 -90)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "Sheetfile" "tia_adl5303.kicad_sch")
    (property "Sheetname" "TIA8")
    (attr smd)
    (fp_text reference "C87" (at 3.166552 -0.3185 90) (layer "B.SilkS"))
    (fp_text value "100n" (at 0 -1.68 90) (layer "B.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "B.Fab"))
    (pad "1" smd roundrect (at -1.0375 0 270) (size 1.175 1.45) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.212766)
      (net 1 "GND") (pintype "passive"))
    (pad "2" smd roundrect (at 1.0375 0 270) (size 1.175 1.45) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.212766)
      (net 2 "+5V") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
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  (footprint "Jumper:SolderJumper-2_P1.3mm_Open_RoundedPad1.0x1.5mm" (layer "B.Cu")
    (tedit 5B391E66)
    (at 176.0005 76.47 -90)
    (descr "SMD Solder Jumper, 1x1.5mm, rounded Pads, 0.3mm gap, open")
    (tags "solder jumper open")
    (property "Sheetfile" "tia_adl5303.kicad_sch")
    (property "Sheetname" "TIA2")
    (attr exclude_from_pos_files)
    (fp_text reference "JP21" (at 0 1.8 90) (layer "B.SilkS") hide)
    (fp_text value "SolderJumper_2_Open" (at 0 -1.9 90) (layer "B.Fab"))
    (pad "1" smd custom (at -0.65 0 270) (size 1 0.5) (layers "B.Cu" "B.Mask")
      (net 94 "/TIA2/PD_K") (pinfunction "A") (pintype "passive") (zone_connect 2)
      (options (clearance outline) (anchor rect))
      (primitives
        (gr_circle (center 0 -0.25) (end 0.5 -0.25) (width 0) (fill yes))
        (gr_circle (center 0 0.25) (end 0.5 0.25) (width 0) (fill yes))
        (gr_poly (pts
            (xy 0.5 -0.75)
            (xy 0 -0.75)
            (xy 0 0.75)
            (xy 0.5 0.75)
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    (pad "2" smd custom (at 0.65 0 270) (size 1 0.5) (layers "B.Cu" "B.Mask")
      (net 2 "+5V") (pinfunction "B") (pintype "passive") (zone_connect 2)
      (options (clearance outline) (anchor rect))
      (primitives
        (gr_circle (center 0 -0.25) (end 0.5 -0.25) (width 0) (fill yes))
        (gr_circle (center 0 0.25) (end 0.5 0.25) (width 0) (fill yes))
        (gr_poly (pts
            (xy 0 -0.75)
            (xy -0.5 -0.75)
            (xy -0.5 0.75)
            (xy 0 0.75)
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  (footprint "Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder" (layer "B.Cu")
    (tedit 5F68FEEF)
    (at 166.3485 85.037448 -90)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "Sheetfile" "tia_adl5303.kicad_sch")
    (property "Sheetname" "TIA3")
    (attr smd)
    (fp_text reference "C33" (at 0 1.68 90) (layer "B.SilkS"))
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